CN107078395B - Antenna assembly - Google Patents

Abstract

An antenna assembly. Exemplary embodiments of an antenna assembly or module are disclosed. Exemplary embodiments may generally include satellite navigation antennas (e.g., GPS patch antennas, GLONASS patch antennas, other satellite navigation antennas, etc.). One or more intermediate components are disposed between the satellite navigation antenna and a Printed Circuit Board (PCB) such that the satellite navigation antenna is not disposed directly on the PCB.

Description

Antenna assembly

Cross Reference to Related Applications

This application is PCT international application for provisional patent application No. us 62/018451 filed on 27/6/2014. The entire disclosure of the above application is incorporated herein by reference.

Technical Field

The present disclosure relates to satellite navigation antenna assemblies.

Background

This section provides background information related to the present disclosure that is not necessarily prior art.

Different types of satellite navigation antennas may be used in car navigation systems. Example operating satellite navigation systems include the Global Positioning System (GPS), global navigation satellite system (GLONASS), doppler quadrature and radio positioning integrated satellites (DORIS), and the beidou navigation satellite system (BDS). Example satellite navigation systems under development include compass navigation systems and galileo positioning systems.

The automotive satellite navigation antenna may be mounted inside or outside the vehicle. For example, a satellite navigation antenna may be mounted on an external vehicle surface, such as the roof, trunk, or hood of a vehicle, to help ensure that the antenna has an unobstructed view overhead or toward the zenith. As another example, the satellite navigation antenna may be mounted inside the dashboard of the vehicle. The satellite navigation antenna may be connected to one or more electronic devices (e.g., a built-in touch screen display, etc.) inside the passenger compartment of the vehicle.

Fig. 1 illustrates a conventional GPS antenna assembly 100, the conventional GPS antenna assembly 100 including a GPS patch antenna 104, a Printed Circuit Board Assembly (PCBA)108, and an electromagnetic interference (EMI) shield 112. GPS antenna assembly 100 also includes a connector 116 for electrically connecting printed circuit board assembly 108 to a communication link, which in turn may be connected to an electronic device (e.g., an in-built touch screen display, etc.) inside the passenger compartment of the vehicle. The GPS antenna assembly 100 includes a two-piece housing for the components of the GPS antenna assembly 100. The housing includes a top housing member 120, which top housing member 120 can be coupled to a bottom housing member 124 (e.g., snap, latch to the bottom housing member along with the bottom housing member, etc.). A buffer 128 is disposed between the PCB assembly 108 and the top housing member 120.

Disclosure of Invention

This section provides a brief summary of the disclosure, and is not an extensive disclosure of its full scope or all of its features.

Exemplary embodiments of an antenna assembly or module are disclosed. Exemplary embodiments may generally include satellite navigation antennas (e.g., GPS patch antennas, GLONASS patch antennas, other satellite navigation antennas, etc.). One or more intermediate (interfacing) components are disposed between the satellite navigation antenna and a Printed Circuit Board (PCB) such that the satellite navigation antenna is not disposed directly on the PCB.

Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

FIG. 1 is an exploded perspective view of a conventional GPS antenna assembly;

FIG. 2 is an exploded perspective view of a GPS antenna assembly according to an exemplary embodiment;

FIG. 3 is an exploded perspective view of a GPS antenna assembly according to another exemplary embodiment;

FIG. 4 is an exploded perspective view of a GPS antenna assembly according to another exemplary embodiment;

figure 5 is a line graph of antenna gain (in decibels) versus frequency (in megahertz) (MHz) for the GPS antenna assembly shown in figures 1-4 with reference to a circularly polarized, theoretical isotropic radiator at 90 degrees from horizontal;

FIG. 6 is a plot of antenna gain in decibels of 79 degrees from the horizontal versus frequency (in MHz) for the GPS antenna assembly shown in FIGS. 1-4;

FIG. 7 is an exploded perspective view of an antenna assembly having dual resonance and/or operable at GPS frequencies and one or more other frequencies (e.g., Dedicated Short Range Communications (DSRC) frequencies, etc.) in accordance with another exemplary embodiment;

FIG. 8 is a perspective view of the antenna assembly shown in FIG. 7, after assembly, but shown without the top housing portion;

fig. 9 is a partial perspective view showing the antenna assembly shown in fig. 8, showing the interior of the antenna assembly;

FIG. 10 is a cross-sectional side view of the antenna assembly shown in FIG. 7 including a top housing portion;

FIG. 11 shows an antenna resonance for the GPS antenna assembly shown in FIG. 1, and illustrates a single antenna resonance at a GPS antenna frequency of 1.575 gigahertz (GHz);

FIG. 12 shows an antenna resonance for the antenna assembly shown in FIGS. 7-10, and illustrates a dual antenna resonance at a GPS frequency of 1.575GHz and another frequency of 2.9 GHz;

fig. 13 is an exploded perspective view of an antenna assembly in which a 3-layer reflector (e.g., a metal layer, a PCB layer, a metal layer, etc.) and a dielectric spacer are between a patch antenna and a PCBA, according to another exemplary embodiment;

FIG. 14 is a perspective view of the antenna assembly shown in FIG. 13, after assembly, but with the top housing portion not shown for clarity;

FIG. 15 is a partial perspective view of the antenna assembly shown in FIG. 14, but shown without the EMI shield and bottom housing portion;

FIG. 16 is a top view of the antenna assembly shown in FIG. 14;

FIG. 17 is a perspective view of the antenna assembly shown in FIG. 14;

FIG. 18 is an end view of the antenna assembly shown in FIG. 14;

FIG. 19 is an end view of the antenna assembly shown in FIG. 14;

FIG. 20 is a perspective view of the antenna assembly shown in FIG. 14, with the top housing portion shown transparent or translucent to show the underlying components;

fig. 21 is a side view of an antenna assembly in which a 3-layer reflector (e.g., a metal layer, a PCB layer, a metal layer, etc.) and a dielectric spacer are between a patch antenna and a PCBA, and in which connections (e.g., pins, etc.) from the patch antenna do not pass directly through the PCB layer of the 3-layer reflector, but rather the connections extend around the PCB layer (e.g., "turn around" to the sides of the PCB layer, etc.) and then pass down to the PCBA, according to another example embodiment;

FIG. 22 is a partial perspective view of the antenna assembly shown in FIG. 21;

FIG. 23 is a perspective view of the antenna assembly shown in FIG. 21 without the top housing portion;

FIG. 24 is a cross-sectional side view of the antenna assembly shown in FIG. 23, showing the interior of the antenna assembly;

fig. 25, 26, 27, and 28 are top, perspective, end, and side views, respectively, of the antenna assembly shown in fig. 23, with the top housing portion shown transparent or translucent to show the lower components; and

fig. 29, 30, 31, and 31 are top, perspective, and side views, respectively, of the antenna assembly shown in fig. 21, with the top housing portion shown transparent or translucent to show the underlying components.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings.

Disclosed herein are exemplary embodiments of antenna assemblies or modules (e.g., 200, 300, 400, 500, 600, 700, etc.) that can provide significant antenna gain improvements and/or system performance improvements in dense plants and in urban or urban areas. These exemplary embodiments include satellite navigation antennas (e.g., GPS patch antennas, GLONASS patch antennas, other satellite navigation antennas, etc.). One or more intermediate components are disposed between the satellite navigation antenna and a Printed Circuit Board (PCB) such that the satellite navigation antenna is not disposed directly on the PCB. Examples of such intermediate components include one or more conductive reflectors or ground planes, one or more radiators, radiating structures or antennas (e.g., antennas operable at DSRC frequencies, etc.), one or more dielectrics or dielectric materials, one or more dielectric spacers or electrical insulators, one or more conductive spacers or electrical conductors, combinations thereof, and the like. In some example embodiments, the antenna assembly may include, in addition to a satellite navigation antenna, one or more other antennas, radiators, or radiating structures such that the antenna assembly has dual resonance within and/or operates with multiple frequency ranges, such as satellite navigation frequencies (e.g., GPS, GLONASS, etc.) and DSRC frequencies, etc.

For example, exemplary embodiments include a patch antenna (e.g., GPS patch antenna, GLONASS patch antenna, etc.) disposed (e.g., directly, etc.) on or against a conductive reflector or ground plane (e.g., a 0.2 millimeter (mm) thick metal ground plane, etc.). In turn, a conductive reflector or ground plane is disposed (e.g., directly, etc.) on or against the PCB. Thus, a conductive reflector or ground plane is provided between the patch antenna and the PCB. The conductive reflector or ground plane may also be referred to as an intermediate component that prevents or inhibits direct physical contact between the patch antenna and the PCB. During operation of the antenna assembly, surface currents are induced on and re-radiated by the conductive reflector or ground plane, thereby enhancing the radiation pattern. Thus, the conductive reflector or ground plane below the patch antenna is also referred to as the radiator or radiating structure.

In this first example, the surface area or footprint (footprint) of the conductive reflector or ground plane may be greater than the surface area or footprint of the patch antenna. The surface area or footprint of the conductive reflector or ground plane may be about the same as or less than the surface area or footprint of the PCB, such that the addition of the conductive ground plane or reflector does not increase the overall footprint of the antenna assembly.

The patch antenna may be electrically connected or coupled to the PCB via a connection such as an uninsulated pin or an insulated pin (e.g., a metal conductor with an EMI shield around it, etc.). The pin may be a semi-rigid pin and extends from the patch antenna through an opening in the conductive reflector or ground plane to the PCB.

As a second example, another exemplary embodiment includes a patch antenna (e.g., a GPS patch antenna, a GLONASS patch antenna, etc.) disposed (e.g., directly, etc.) on or against a dielectric spacer or an electrical insulator (e.g., a 1mm thick plastic washer, a ring, a hollow member, etc.). In turn, the dielectric spacer is disposed (e.g., directly, etc.) on or against the PCB. Thus, the dielectric spacer is disposed between the patch antenna and the PCB. The dielectric spacer may also be referred to as an intermediate component that prevents or inhibits direct physical contact between the patch antenna and the PCB. Due to the thickness of the dielectric spacer (e.g., 1mm, etc.), the dielectric spacer raises the patch antenna and creates an air gap (air gap) (e.g., 1mm air gap, 1mm apart, etc.) that changes the radiation pattern (or directivity) of the patch antenna to point to high elevation angles if needed.

In this second example, the dielectric spacer may have length and/or width dimensions that are equal to, greater than, or less than corresponding dimensions of the patch antenna. For example, the dielectric spacer may comprise a plastic circular washer having an outer diameter equal to the length and width of the patch antenna.

Also in this second example, the patch antenna may be electrically connected or coupled to the PCB via a connection such as an uninsulated pin or an insulated pin (e.g., a metal conductor with an EMI shield around it, etc.). The pin may be a semi-rigid pin and extends from the patch antenna through an opening in the dielectric spacer to the PCB. For larger dielectric spacers, it may be preferable to use insulated pins as connectors.

As a third example, another exemplary embodiment includes a patch antenna (e.g., a GPS patch antenna, a GLONASS patch antenna, etc.) disposed (e.g., directly, etc.) on or against an electrically conductive spacer or electrical conductor (e.g., 1mm) thick metal washer, annular or hollow member, etc.). The conductive spacer is disposed over and on (e.g., directly, etc.) or against a conductive reflector or ground plane (e.g., a 0.2 millimeter (mm) thick metal ground plane, etc.). In turn, a conductive reflector or ground plane is disposed (e.g., directly, etc.) on or against the PCB. Thus, the conductive spacer is disposed between the patch antenna and the conductive reflector or ground plane. A conductive reflector or ground plane is disposed between the conductive spacer and the PCB. Both the conductive spacer and the conductive reflector or ground plane may be referred to as intermediate components that prevent or inhibit direct physical contact between the patch antenna and the PCB.

Due to the thickness of the conductive spacer (e.g., 1mm, etc.), the conductive spacer raises the patch antenna and creates an air gap (e.g., 1mm air gap, 1mm apart, etc.) between the patch antenna and the conductive reflector or ground plane, which changes the radiation pattern (or directivity) of the patch antenna to point to high elevation angles if desired. During operation of the antenna assembly, surface currents are induced on and re-radiated by the conductive reflector or ground plane, thereby enhancing the radiation pattern. The conductive reflector or ground plane below the patch antenna may also be referred to as a radiator or radiating structure.

In this third example, the conductive spacer may have length and/or width dimensions that are equal to, greater than, or less than corresponding dimensions of the patch antenna. For example, the conductive spacer may include a metal circular washer having an outer diameter equal to the length and width of the patch antenna. The surface area or footprint of the conductive reflector or ground plane may be greater than the surface area or footprint of the patch antenna. The surface area or footprint of the conductive reflector or ground plane may be about the same as or less than the surface area or footprint of the PCB, such that the addition of the conductive ground plane or reflector does not increase the overall footprint of the antenna assembly.

Also, in this third example, the patch antenna may be electrically connected or coupled to the PCB via a connection (e.g., a metal conductor with an EMI shield around it, etc.) such as an uninsulated pin or an insulated pin. The pin may be a semi-rigid pin and extends from the patch antenna through the conductive spacer and the opening in the conductive reflector or ground plane to the PCB.

In the third example described above, the conductive spacer is disposed between the patch antenna and the conductive reflector or ground plane, and the conductive reflector or ground plane is disposed between the conductive spacer and the PCB. In other exemplary embodiments, one or more conductive spacers and/or one or more dielectric spacers may be disposed above and/or below the conductive reflector or ground plane.

As a fourth example, a first conductive spacer or electrical conductor and a second conductive spacer or electrical conductor are disposed above and below the conductive reflector or ground plane, respectively, such that the conductive reflector or ground plane is between the first conductive spacer and the second conductive spacer. A first conductive spacer is disposed between a patch antenna (e.g., GPS patch antenna, GLONASS patch antenna, etc.) and a conductive reflector or ground plane, while a second conductive spacer is disposed between the conductive reflector or ground plane and the PCB. The first and second conductive spacers and the conductive reflector or ground plane may all be referred to as an intermediate component that prevents or inhibits direct physical contact between the patch antenna and the PCB.

In this fourth example, the first conductive spacer creates a first air gap (e.g., a 1mm air gap, 1mm apart, etc.) between the patch antenna and the conductive reflector or ground plane, while the second conductive spacer creates a second air gap (e.g., a 1mm air gap, 1mm apart, etc.) between the PCB and the conductive reflector or ground plane. The first and second air gaps change the radiation pattern (or directivity) of the patch antenna to point to high elevation angles if needed. During operation of the antenna assembly, surface currents are induced on and re-radiated by the conductive reflector or ground plane, thereby enhancing the radiation pattern.

As a fifth example, the conductive spacer is disposed below the conductive reflector or ground plane rather than above it. The conductive spacer is disposed between the conductive reflector or ground plane and the PCB. A conductive reflector or ground plane is disposed between the conductive spacer and a patch antenna (e.g., GPS patch antenna, GLONASS patch antenna, etc.). Both the conductive spacer and the conductive reflector or ground plane may be referred to as intermediate components that prevent or inhibit direct physical contact between the patch antenna and the PCB.

In this fifth example, the conductive spacer creates an air gap (e.g., a 1mm air gap, 1mm apart, etc.) between the PCB and the conductive reflector or ground plane that changes the radiation pattern (or directivity) of the patch antenna to point to high elevation angles if needed. During operation of the antenna assembly, surface currents are induced on and re-radiated by the conductive reflector or ground plane, thereby enhancing the radiation pattern.

As a sixth example, the dielectric spacer is disposed below the conductive reflector or ground plane rather than above it. A dielectric spacer is disposed between the conductive reflector or ground plane and the PCB. A conductive reflector or ground plane is disposed between the conductive spacer and a patch antenna (e.g., GPS patch antenna, GLONASS patch antenna, etc.). The conductive reflector or ground plane and the dielectric spacer may both be referred to as an intermediate component that prevents or inhibits direct physical contact between the patch antenna and the PCB.

In this sixth example, the dielectric spacer creates an air gap (e.g., a 1mm air gap, 1mm apart, etc.) between the PCB and the conductive reflector or ground plane that changes the radiation pattern (or directivity) of the conductive reflector or ground plane and/or patch antenna if needed to point to high elevation angles. During operation of the antenna assembly, surface currents are induced on and re-radiated by the conductive reflector or ground plane, thereby enhancing the radiation pattern.

As a seventh example, another exemplary embodiment of an antenna assembly (e.g., a dual GPS-DSRC smart antenna, etc.) has dual resonance and/or is operable at satellite navigation frequencies (e.g., GPS frequencies, GLONASS frequencies, etc.) and one or more other frequencies (e.g., DSRC frequencies of 2.9GHz, 5.9 GHz). In this seventh example, a patch antenna (e.g., GPS patch antenna, GLONASS patch antenna, etc.) is disposed (e.g., directly, etc.) on or against a radiator, radiating structure, or antenna (e.g., a 0.2mm thick sheet metal DSRC antenna, etc.). A dielectric (e.g., a 5mm thick double-sided dielectric tape or other dielectric material, etc.) is disposed between the radiating antenna and the printed circuit board. Thus, the radiating antenna is disposed between the patch antenna and the dielectric. A dielectric is disposed between the radiating antenna and the PCB. Both the radiating antenna and the dielectric may be referred to as intermediate components that prevent or inhibit direct physical contact between the patch antenna and the PCB.

In this seventh example, the radiating antenna may include a sheet of metal (e.g., having a thickness of 0.2mm, etc.) having one or more slits (e.g., right angle slits, etc., opposite one another) that cause the sheet of metal to radiate such that the antenna assembly has a second resonance (e.g., 5.9GHz DSRC band, etc.) in addition to the first resonance at the satellite navigation frequency. For example, the antenna assembly may include a dual GPS-DSRC smart antenna in some embodiments.

The sheet metal may be supported (backed) by a dielectric material (e.g., a double-sided dielectric tape having a thickness of 0.5mm, etc.), with the dielectric between the sheet metal and the PCB. The sheet metal and dielectric material may have length and/or width dimensions that are equal to, greater than, or less than corresponding dimensions of the PCB. For example, the sheet metal and dielectric material may have length and/or width dimensions that are about the same as or less than corresponding dimensions of the PCB, such that the addition of the sheet metal and dielectric material does not increase the overall footprint of the antenna assembly.

Also, in this seventh example, the patch antenna may be electrically connected or coupled to the PCB via a connection (e.g., a metal conductor with an EMI shield around it, etc.) such as an uninsulated pin or an insulated pin. The pin may be a semi-rigid pin and extends from the patch antenna through the radiating antenna and the opening in the dielectric material to the PCB.

As an eighth example, another exemplary embodiment of an antenna assembly (e.g., a dual PCB GPS antenna, etc.) includes a patch antenna (e.g., a GPS patch antenna, a GLONASS patch antenna, etc.) disposed (e.g., directly, etc.) on or against an upper surface of a multilayer reflector. For example, the multilayer reflector may be a 3-layer reflector, the 3-layer reflector including an upper conductive (e.g., metal, etc.) layer, a PCB layer, and a lower conductive (e.g., metal, etc.) layer. A dielectric spacer or electrical insulator is between the 3-layer reflector and the second PCB. Thus, a 3-layer reflector is disposed between the patch antenna and the dielectric spacer. The dielectric spacer is between the 3-layer reflector and the second PCB. Both the 3-layer reflector and the dielectric spacer may be referred to as intermediate components that prevent or inhibit direct physical contact between the patch antenna and the second PCB.

The second PCB is not soldered, affixed, mounted or attached to the 3-layer reflector. The 3-layer reflector is secured via the guide holes of the 3-layer reflector through which the protrusions of the EMI shield extend and via pressure applied to the stack as a result of the housing or shell and the silicon pad and/or buffer. The tabs and vias provide a shield solder connection as the 3-layer reflector is soldered to the tabs of the EMI shield. The dielectric spacers comprise rods or studs extending through guide holes in the 3-layer reflector.

Also, in this eighth example, the patch antenna may be electrically connected or coupled to the second PCB via a connection (e.g., a metal conductor with an EMI shield around it, etc.) such as an uninsulated pin or an insulated pin. The pins may be semi-rigid pins. The pins may extend from the patch antenna through openings in the 3-layer reflector and the dielectric spacer. Alternatively, for example, connections (e.g., pins, etc.) from the patch antenna may not pass directly through the first PCB of the 3-layer reflector. Instead, the connector may extend around the first PCB (e.g., "turn around" to the side of the first PCB, etc.) and then pass down to the second PCB.

Referring to the drawings, fig. 2 illustrates an exemplary embodiment of a satellite navigation antenna assembly or module 200 embodying one or more aspects of the present disclosure. As shown in fig. 2, the antenna assembly 200 includes a patch antenna 204, a Printed Circuit Board Assembly (PCBA)208, and an electromagnetic interference (EMI) shield 212. A conductive ground plane or reflector 232 is positioned between the patch antenna 204 and the upper surface or side of the PCBA 208. In some implementations, double-sided conductive tape and/or conductive glue may be used between the conductive ground plane or reflector 232 and the patch antenna 204 and/or the PCBA 208.

In this example, patch antenna 204 is a GPS patch antenna. PCBA208 comprises a dielectric substrate or board comprising FR4 composite material comprising a woven glass fibre fabric with a fire resistant epoxy resin binder. The EMI shield 212 comprises stamped sheet metal including resilient spring fingers 213 along the sidewalls. The EMI shield 212 also includes protrusions 214 that extend through the guide holes in the PCBA 208. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g., GLONASS patch antennas, etc.), other EMI shields, and/or other PCBA's.

The antenna assembly 200 also includes a connection 216 for electrically connecting the PCBA208 to a communication link, which in turn may be connected to electronics (e.g., a built-in touch screen display, etc.) inside the passenger compartment of the vehicle. The antenna assembly 200 includes a housing for the components of the antenna assembly 200. The housing includes a top housing member 220, which top housing member 220 may be coupled to a bottom housing member 224 (e.g., snap, latch to the bottom housing member along with the bottom housing member, etc.). The housing may be formed of a dielectric material such as plastic.

A resiliently compressible (e.g., silicone, etc.) bumper 228 is positioned between the PCB assembly 208 and the top housing member 220. The bumper 228 is generally sandwiched in compression between the PCBA208 and the top housing member 220 when the top and bottom housing members 220, 224 are coupled together. The compression of the bumper 228 generates a compressive force that generally urges the PCBA208 toward the EMI shield 212, which contributes to the electrical grounding of the PACBA 208 and the shield 212.

A wide range of materials may be used for the conductive ground plane or reflector 232, such as metals, metal alloys, metallic materials, conductive composites, and the like. In this exemplary embodiment, the conductive ground plane or reflector 232 is a metal ground (e.g., sheet metal) having a thickness of 0.2 millimeters. The thinness of the ground plane or reflector 232 may allow existing housings (e.g., the top housing member 120 in fig. 1) to be used with the antenna assembly 200 without requiring tool replacement (although the ground plane or reflector 232 is added between the patch antenna 204 and the PCBA 208).

With continued reference to fig. 2, a conductive ground plane or reflector 232 is disposed on an upper surface or side of the PCBA208 in the final assembled form of the antenna assembly 200. Thus, a conductive reflector or ground plane 232 is disposed between the patch antenna 204 and the PCBA 208. The conductive reflector or ground plane 232 may also be referred to as an intermediate component that prevents or inhibits direct physical contact between the patch antenna 204 and the PCBA 208. During operation of the antenna assembly 200, surface currents are induced on the conductive reflector or ground plane 232 and re-radiated by the conductive reflector or ground plane 232, thereby enhancing the radiation pattern. Thus, the conductive reflector or ground plane 232 is also referred to as a radiator or radiating structure. Thus, the patch antenna 204 is not disposed directly on the PCBA 208.

The surface area or footprint of the conductive reflector or ground plane 232 may be greater than, less than, or equal to the surface area or footprint of the patch antenna 204. In this example, the conductive reflector or ground plane 232 has about the same surface area or footprint as the PCBA208, such that the addition of the conductive ground plane or reflector 232 does not increase the overall footprint of the antenna assembly 200.

The patch antenna 204 may be electrically connected or coupled to the PCBA208 via a connection. The connectors may include uninsulated pins or insulated pins (e.g., metal conductors with an EMI shield around them, etc.). The pin may be a semi-rigid pin and extends from the patch antenna 204 through an opening 236 in the conductive reflector or ground plane 232 to the PCBA 208.

The antenna assembly 200 may be mounted inside or outside the vehicle. For example, the antenna assembly 200 may be mounted on an external vehicle surface (such as the roof, trunk, or hood of a vehicle) to help ensure that the antenna has an unobstructed view overhead or toward the zenith. As another example, the antenna assembly 200 may be mounted inside the dashboard of a vehicle. Advantageously, the antenna assembly 200 has good or sufficiently high gain of 50 degrees above horizontal that allows the antenna assembly 200 to be mounted inside the vehicle dashboard. Gain of 50 degrees above the horizontal is most important for IP installation locations

Fig. 3 illustrates another exemplary embodiment of a satellite navigation antenna assembly or module 300 embodying one or more aspects of the present disclosure. As shown in fig. 3, the antenna assembly 300 includes a patch antenna 304, a PCBA308, and an EMI shield 312. A dielectric spacer or electrical insulator 340 is positioned between the patch antenna 304 and the upper surface or side of the PCBA 308. In some implementations, double-sided dielectric tape and/or glue may be used between the dielectric spacer 340 and the patch antenna 304 and/or the PCBA 308.

In this example, patch antenna 304 is a GPS patch antenna. The PCBA308 comprises a dielectric substrate or board comprising FR4 composite material comprising a woven glass fibre fabric with a fire resistant epoxy resin binder. The EMI shield 312 comprises stamped sheet metal including resilient spring fingers along the sidewalls. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g., GLONASS patch antennas, etc.), other EMI shields, and/or other PCBA's.

The antenna assembly 300 also includes a connection 316 for electrically connecting the PCBA308 to a communication link, which in turn may be connected to electronics (e.g., a built-in touch screen display, etc.) inside the passenger compartment of the vehicle. The antenna assembly 300 includes a housing for the components of the antenna assembly 300. The housing includes a top housing member 320, which top housing member 120 can be coupled to a bottom housing member 324 (e.g., snapped together with, latched to, etc.). The housing may be formed of a dielectric material (e.g., plastic, etc.).

A resiliently compressible (e.g., silicone rubber, etc.) bumper 328 is positioned between the PCBA308 and the top housing member 320. The bumper 328 is generally sandwiched in compression between the PCBA308 and the top housing member 320 when the top and bottom housing members 320, 324 are coupled together. The compression of the bumper 328 generates a compressive force that generally urges the PCBA308 toward the EMI shield 312, which contributes to the electrical grounding of the PCBA308 with the shield 312.

A wide range of dielectric materials may be used for the dielectric spacer or electrical insulator 340, such as plastics, dielectric conductive materials. In this exemplary embodiment, the dielectric spacer 340 is a plastic circular washer having a thickness of 1 mm.

With continued reference to fig. 3, the dielectric spacer 340 is disposed on an upper surface or side of the PCBA308 in the final assembled form of the antenna assembly 300. Thus, the dielectric spacer 340 is disposed between the patch antenna 304 and the PCBA 308. The dielectric spacer 340 may also be referred to as an intermediate component that prevents or inhibits direct physical contact between the patch antenna 304 and the PCBA 308. Due to the thickness of the dielectric spacer (e.g., 1mm, etc.), the dielectric spacer 340 raises the patch antenna 304 such that the lower surface of the patch antenna 304 is spaced from the upper surface of the PCBA 308. Dielectric spacer 340 creates an air gap (e.g., a 1mm air gap, etc.) between patch antenna 304 and PCBA308 that changes the radiation pattern (or directivity) of patch antenna 304 to point to high elevation angles if desired. Thus, the patch antenna 304 is not disposed (e.g., directly, etc.) on the PCBA 308.

The dielectric spacer 340 may have length and/or width dimensions that are equal to, greater than, or less than corresponding dimensions of the patch antenna 304. For example, dielectric spacer 340 may comprise a plastic circular washer having an outer diameter equal to the length and width of patch antenna 304.

The patch antenna 304 may be electrically connected or coupled to the PCBA308 via a connection. The connectors may include uninsulated pins or insulated pins (e.g., metal conductors with an EMI shield around them, etc.). The pin may be a semi-rigid pin and extends from the patch antenna 304 through an opening 344 in the dielectric spacer 340 to the PCBA 308.

The antenna assembly 300 may be mounted inside or outside the vehicle. For example, the antenna assembly 300 may be mounted on an external vehicle surface (such as the roof, trunk, or hood of a vehicle) to help ensure that the antenna has an unobstructed view overhead or toward the zenith. As another example, the antenna assembly 300 may be mounted inside the dashboard of a vehicle. Advantageously, the antenna assembly 300 has good or sufficiently high gain of 50 degrees above horizontal that allows the antenna assembly 300 to be mounted inside the vehicle dashboard. A gain of 50 degrees above the horizontal line is most important for IP installation locations.

Fig. 4 illustrates another exemplary embodiment of a satellite navigation antenna assembly or module 400 embodying one or more aspects of the present disclosure. As shown in fig. 4, the antenna assembly 400 includes a patch antenna 404, a PCBA408, and an EMI shield 412. A conductive spacer or electrical conductor 440 and a conductive ground plane or reflector 432 are positioned between the patch antenna 404 and the PCBA 408. In some implementations, double-sided conductive tape and/or conductive glue can be used between the conductive spacer 440 and the patch antenna 404 and/or the conductive ground plane or reflector 432. Double-sided conductive tape and/or conductive glue may also or instead be used between the conductive ground plane or reflective member 432 and the PCBA 408.

In this example, patch antenna 404 is a GPS patch antenna. PCBA408 comprises a dielectric substrate or board comprising FR4 composite material comprising a woven glass fibre fabric with a fire resistant epoxy resin binder. The EMI shield 412 comprises stamped sheet metal including resilient spring fingers along the sidewalls. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g., GLONASS patch antennas, etc.), other EMI shields, and/or other PCBA's.

The antenna assembly 400 also includes a connection 416 for electrically connecting the PCBA408 to a communication link, which in turn may be connected to electronics (e.g., a built-in touch screen display, etc.) inside the passenger compartment of the vehicle. The antenna assembly 400 includes a housing for the components of the antenna assembly 400. The housing includes a top housing member 420, which top housing member 420 may be coupled to a bottom housing member 424 (e.g., snap, latch to the bottom housing member along with the bottom housing member, etc.). The housing may be formed of a dielectric material (e.g., plastic, etc.).

A resiliently compressible (e.g., silicone rubber, etc.) bumper 428 is positioned between the PCBA408 and the top housing member 420. The bumper 428 is generally sandwiched in compression between the PCBA408 and the top housing member 420 when the top and bottom housing members 420, 424 are coupled together. The compression of the bumper 428 generates a compressive force that generally urges the PCBA408 toward the EMI shield 412, which contributes to the electrical grounding of the PACBA 408 with the shield 412.

A wide range of materials may be used for the conductive ground plane or reflector 432 and the conductive spacer 440, such as metals, metal alloys, metallic materials, conductive composites, and the like. In this exemplary embodiment, the conductive ground plane or reflector 432 is a metal ground (e.g., sheet metal) having a thickness of 0.2 millimeters. Conductive spacer 440 is a metal circular washer having a thickness of 1 mm.

With continued reference to fig. 4, the patch antenna 404 is disposed on an upper surface or side of the conductive spacer 440. A conductive spacer 440 is disposed on an upper surface or side of the conductive reflector or ground plane 432. A conductive reflector or ground plane 432 is provided on an upper surface or side of the PCBA 408. Thus, the conductive spacer 440 is disposed between the patch antenna 404 and the conductive reflector or ground plane 432. A conductive reflector or ground plane 432 is disposed between the conductive spacer 440 and the PCBA 408. The conductive spacer 440 and the conductive reflector or ground plane 432 may both be referred to as intermediate components that prevent or inhibit direct physical contact between the patch antenna 404 and the PCBA 408.

Due to the thickness of the conductive spacer (e.g., 1mm, etc.), the conductive spacer 440 raises the patch antenna 404 such that the lower surface of the patch antenna 404 is spaced from the upper surface of the conductive reflector or ground plane 432. The conductive spacer 440 creates an air gap (e.g., a 1mm air gap, etc.) between the patch antenna 404 and the conductive reflector or ground plane 432 that changes the radiation pattern (or directivity) of the patch antenna 404 to point to high elevation angles if desired. During operation of the antenna assembly 400, surface currents are induced on the conductive reflector or ground plane 432 and re-radiated by the conductive reflector or ground plane 432, thereby enhancing the radiation pattern. The conductive reflector or ground plane 432 is also referred to as a radiator or radiating structure.

The conductive spacer 440 may have length and/or width dimensions that are equal to, greater than, or less than corresponding dimensions of the patch antenna 404. For example, the conductive spacer 440 may comprise a metal circular washer having an outer diameter equal to the length and width of the patch antenna 404. The surface area or footprint of the conductive reflector or ground plane 432 may be greater than, less than, or equal to the surface area or footprint of the patch antenna 404. In this example, the conductive reflective or ground plane 432 has about the same surface area or footprint as the PCBA408, such that the addition of the conductive ground plane or reflective member 432 does not increase the overall footprint of the antenna assembly 400.

The patch antenna 404 may be electrically connected or coupled to the PCBA408 via a connection. The connectors may include uninsulated pins or insulated pins (e.g., metal conductors with an EMI shield around them, etc.). The pin may be a semi-rigid pin and extends from the patch antenna 404 through an opening 444 in the conductive spacer 440 and through an opening 436 in the conductive reflector or ground plane 432 to the PCBA 408.

The antenna assembly 400 may be mounted inside or outside the vehicle. For example, the antenna assembly 400 may be mounted on an external vehicle surface (such as the roof, trunk, or hood of a vehicle) to help ensure that the antenna has an unobstructed view overhead or toward the zenith. As another example, the antenna assembly 400 may be mounted inside the dashboard of a vehicle. Advantageously, the antenna assembly 400 has a good or sufficiently high gain of 50 degrees above horizontal that allows the antenna assembly 400 to be mounted inside the vehicle instrument panel. A gain of 50 degrees above the horizontal line is most important for IP installation locations.

Fig. 5 and 6 include plots of antenna gain (dBic) versus frequency (in megahertz) for the GPS antenna assemblies 100, 200, 300, and 400 shown in fig. 1-4, respectively, with reference to a circularly polarized, theoretical isotropic radiator. Generally, these graphs illustrate better performance in terms of antenna gain that may be achieved by the GPS antenna assembly 200, 300, 400 as compared to the conventional GPS antenna assembly 100 shown in fig. 1.

More specifically, fig. 5 includes a line graph of antenna gain (in dBic) 90 degrees from the horizontal line (line of sight) for a physical prototype of GPS antenna assembly 200 (fig. 2) and for computer simulation models of GPS antenna assemblies 100 (fig. 1), 300 (fig. 3), and 400 (fig. 4) over a frequency range from 1550MHz to 1600 MHz. As shown in fig. 5, each of the GPS antenna assemblies 200, 300, 400 has a higher boresight gain than the conventional GPS antenna assembly 100 for the frequency range from 1550MHz to 1575.5 MHz. Also shown in FIG. 5, GPS antenna assemblies 200, 300, and 400 have maximum boresight gains of 3.8dBi, 3.77dBi, and 3.91dBi, respectively. By comparison, the conventional GPS antenna assembly 100 has a maximum boresight gain of only 2.88 dBi. Appendix a is a table including antenna gain (in dBic) and frequency (in MHz) used to generate the plot shown in fig. 5.

Fig. 6 includes a plot of antenna gain (in dBic) at 79 degrees from horizontal for a physical prototype of GPS antenna assembly 200 (fig. 2) and for computer simulation models of GPS antenna assemblies 100 (fig. 1), 300 (fig. 3), and 400 (fig. 4) over a frequency range from 1550MHz to 1600 MHz. As shown in fig. 6, each of the GPS antenna assemblies 200, 300, 400 has a higher gain than the conventional GPS antenna assembly 100 for the frequency range from 1550MHz to 1575 MHz. Also shown in FIG. 6, GPS antenna assemblies 200, 300, and 400 have maximum gains of 3.3dBi ic, 3.32dBi ic, and 3.37dBi ic, respectively. By comparison, the conventional GPS antenna assembly 100 has a maximum gain of only 2.75dBi c. Appendix B is a table including antenna gain (in dBic) and frequency (in MHz) used to generate the plot shown in fig. 6.

The antenna gains shown in fig. 5 and 6 and their interiors are provided for illustrative purposes only and are not provided for limiting purposes. Alternative embodiments of the antenna assembly may be configured differently than shown in fig. 5 and 6 and have different operating or performance parameters than shown in fig. 5 and 6. For example, alternative embodiments of the antenna assembly may be configured to operate at frequencies other than the GPS carrier frequencies of 1227.6MHz and 1575.42MHz, such as GLONASS (global navigation satellite system) frequencies from 1240MHz to 1260MHz and 1602.5625MHz to 1615.5MHz, other satellite frequencies or frequency bands, and so forth.

The following table provides a comparison of the performance of a physical prototype of the GPS antenna assembly 200 (fig. 2) and a computer simulated model of the GPS antenna assembly 100 (fig. 1) under various conditions including chicago route-urban canyon driving tests (tables 1-6), detroit route-urban canyon driving tests (tables 7-12), and disco route-open sky driving tests (tables 13-18). In tables 1 to 18 below, PACC 3D provides the amount of rice error that the GPS device achieved in the GPS solution. The SV used refers to the number of satellites used in the GSP solution. SV C/N0 refers to the satellite received carrier-to-noise density ratio in decibel-Hertz (dBHz). PDOP (position accuracy factor) is a measure of satellite geometry, where a low PDOP indicates a higher probability of accuracy.

As shown by tables 1-18, GPS antenna assembly 200 has better 3D accuracy and better carrier-to-noise density ratio (C/N0) than conventional GPS antenna assembly 100. This is illustrated by the lower average PACC 3D and higher average SV C/N0 of GPS antenna assembly 200 compared to conventional GPS antenna assembly 100 in all 9 tests. The GPS antenna assembly 200 also had a lower average PDOP than the conventional GPS antenna assembly 100 in all six urban canyon driving tests (tables 1-12). In the open sky piloting test (tables 13-18), the GPS antenna assembly 200 had less average PDOP than the conventional GPS antenna assembly 100 in all six urban canyon piloting tests (tables 1-12). In the open sky driving test (tables 13-18), the GPS antenna assembly 200 had average PDOPs of 1.8, 2.6, and 2.5, all of which were very low and indicated a higher probability of accuracy. By virtue of the ground plane or reflector 232 (e.g., a 0.2 millimeter thick conductive metal member, etc.) between the GPS patch-antenna 204 and the PCBA208, the GPS antenna assembly 200 provides substantial system performance improvements in dense vegetation and in downtown or urban areas as compared to the conventional GPS antenna assembly 100. The GPS antenna assembly 200, 300, 400 may also provide substantial system performance improvements in dense plants and in urban centers or regions as compared to the conventional GPS antenna assembly 100.

Chicago route-urban canyon driving test 1

Chicago route-urban canyon driving test 2

Chicago route-urban canyon driving test 3

Detroit route-urban canyon driving test 1

Detroit route-urban canyonsDriving test 2

Detroit route-urban canyon driving test 3

Dilbenn route-open sky Driving test 1

Dilbenn route-open sky Driving test 2

Dilbern route-open sky Driving test 3

Fig. 7-10 illustrate another exemplary embodiment of an antenna assembly or module 500 embodying one or more aspects of the present disclosure. In the exemplary embodiment, antenna assembly 500 has dual resonance at and/or is operable at the satellite navigation frequency (e.g., GPS frequency, GLONASS frequency, etc.) and one or more other frequencies (e.g., DSRC frequencies of 2.9GHz, 5.9 GHz). For example, the antenna assembly 500 may include dual GPS-DSRC smart antennas.

As shown in fig. 7, the antenna assembly 500 includes a patch antenna 504, a PCBA 508, and an EMI shield 512. A radiator, radiating structure or antenna 532, and a dielectric 540 are positioned between the patch antenna 504 and the PCBA 508. More specifically, the patch antenna 504 is disposed on or against an upper surface of the radiation antenna 532. A dielectric 540 is disposed on an upper surface of the PCBA 508. Thus, the radiating antenna 532 is disposed between the patch antenna 504 and the dielectric 540. A dielectric 540 is disposed between the radiating antenna 532 and the PCBA 508. Both the radiating antenna 532 and the dielectric 540 may be referred to as intermediate components that prevent or inhibit direct physical contact between the patch antenna 504 and the PCBA 508.

A wide range of materials may be used for the radiating antenna 532, such as metals, metal alloys, metallic materials, conductive composites, and the like. In this exemplary embodiment, the radiating antenna 532 is a sheet metal having a thickness of 0.2 mm. The sheet metal includes a slit 548 (e.g., a right angle slit, other suitable shape, etc. opposite one another) that causes the sheet metal to radiate such that the antenna assembly 500 has a second resonance (e.g., DSRC bands of 2.9GHz, 5.9GHz, etc.). The slit 548 may be reconfigured or optimized for resonance at a particular frequency. For example, the length of the slit 548 may be increased in some embodiments because increased slit length results in lower resonance. Conversely, because the shortened slot length results in higher resonance (e.g., increases resonance to 5.9GHz, etc.), the length of the slot 548 may be shortened in other embodiments.

The sheet metal may be supported by a dielectric 540. As shown in fig. 8, dielectric 540 can be seen through a slit 548. A wide range of materials may be used for dielectric 540. In this example, dielectric 540 is a double-sided dielectric tape having a thickness of 0.5 mm. The sheet metal and double-sided dielectric tape may have length and width dimensions that are equal to, greater than, or less than corresponding dimensions of the PCBA 508. For example, the sheet metal and dielectric double-sided tape may have length and/or width dimensions that are about the same as the PCBA 508 or less than the PCBA 508, such that the addition of the sheet metal and dielectric double-sided tape does not increase the overall footprint of the antenna assembly 500.

In this example, patch antenna 504 is a GPS patch antenna. The PCBA 508 comprises a dielectric substrate or board comprising FR4 composite material comprising a woven fiberglass fabric with a fire resistant epoxy resin binder. Circuitry with ground metallization may be disposed on the top or upper surface of the PCBA 508. The EMI shield 512 comprises stamped sheet metal including resilient spring fingers 513 along the sidewalls. The EMI shield 512 also includes a protrusion 514 that extends through a via 509 in the PCBA 508, a via 541 in the dielectric 540, and a via 533 in the radiating antenna 532. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g., GLONASS patch antennas, etc.), other EMI shields, other radiating antennas, and/or other PCBA's.

The antenna assembly 500 also includes connections 516, the connections 516 for electrically connecting the PCBA 508 to a communication link, which in turn may be connected to electronics (e.g., a built-in touch screen display, etc.) inside the passenger compartment of the vehicle. The antenna assembly 500 includes a housing for the components of the antenna assembly 500. The housing includes a top housing member 520, which top housing member 120 may be coupled to a bottom housing member 524 (e.g., snap, latch to the bottom housing member along with the bottom housing member, etc.). The housing may be formed of a dielectric material (e.g., plastic, etc.). As shown in fig. 7 and 10, a tag 552 may be applied to the outer surface of the upper housing member 520, the tag 552 may include information relating to and/or identifying the particular antenna assembly 500.

A resiliently compressible (e.g., silicone rubber, etc.) bumper 528 is positioned between the PCBA 508 and the top housing member 520. The bumper 528 is generally sandwiched in compression between the PCBA 508 and the top housing member 520 when the top and bottom housing members 520, 524 are coupled together. The compression of the bumper 528 generates a compressive force that generally urges the PCBA 508 toward the EMI shield 512, which contributes to the electrical grounding of the PACBA 508 and the shield 512.

The patch antenna 504 may be electrically connected or coupled to the PCBA 508 via a connection, in this example a pin 556 (fig. 8-10). The pins 556 may be uninsulated or insulated (e.g., metal conductors with an EMI shield around them, etc.). The pins 556 may be semi-rigid pins. The pins 556 extend from the patch antenna 504 through the openings 536, 544 in the radiating antenna 532, through the opening 544 in the dielectric material 540, and to the PCBA 508.

The antenna assembly 500 may be mounted inside or outside the vehicle, for example, by using a dielectric double-sided tape 560. For example, the antenna assembly 500 may be mounted on an external vehicle surface (such as the roof, trunk, or hood of a vehicle) to help ensure that the antenna has an unobstructed view overhead or toward the zenith. As another example, the antenna assembly 500 may be mounted inside the dashboard of a vehicle. Advantageously, the antenna assembly 500 has good or sufficiently high gain of 50 degrees above horizontal that allows the antenna assembly 500 to be mounted inside the vehicle instrument panel. A gain of 50 degrees above the horizontal line is most important for IP installation locations.

Fig. 11 illustrates the antenna resonance for the conventional GPS antenna assembly 100 shown in fig. 1. Fig. 12 illustrates an antenna resonance for the antenna assembly 500 shown in fig. 7-10. A comparison of fig. 11 and 12 reveals that conventional GPS antenna assembly 100 has a single antenna resonance at a GPS frequency of 1.575 gigahertz (GHz), while antenna assembly 500 has a dual resonance at a GPS frequency of 1.575GHz and another frequency of 2.9 GHz. These resonance values shown in fig. 12 are provided for illustrative purposes only, and are not provided for limiting purposes. As noted above, the slit 548 can be reconfigured or optimized for resonance at a particular frequency. For example, in other embodiments, the length of the slit 548 may be shortened to make the resonance higher than the 2.9GHz shown in fig. 12. For example, the slit 548 may be sized in size such that the antenna assembly has a second resonance at the DSRC frequency of 5.9GHz in addition to a first resonance at the satellite navigation frequency (e.g., GPS frequency of 1.575GHz, etc.). Alternatively, for example, the length of the slit 548 may be increased in other embodiments such that the antenna assembly has a second resonance below 2.9 GHz.

Fig. 13-20 illustrate another exemplary embodiment of an antenna assembly or module 600 embodying one or more aspects of the present disclosure. In the exemplary embodiment, antenna assembly 600 includes a patch antenna 604 (e.g., a GPS patch antenna, a GLONASS patch antenna, etc.) disposed (e.g., directly, etc.) on or against an upper surface of multilayer reflector 632. In this exemplary embodiment, the multilayer reflector 632 is a 3-layer reflector, the 3-layer reflector including an upper conductive layer, a PCB layer, and a lower conductive layer. The GPS patch 604 is disposed on the upper conductive layer of the 3-layer reflector 632. A dielectric spacer or electrical insulator 640 is between PCBA 608 and the lower conductive layer of the 3-layer reflector 632. The 3-layer reflector 632 is disposed between the patch antenna 604 and the dielectric spacer 640. Both the 3-layer reflector 632 and the dielectric spacer 640 may be referred to as intermediate components that prevent or inhibit direct physical contact between the patch antenna 604 and the second PCBA 608.

The PCBA 608 is not soldered, affixed, mounted, or attached to the 3-layer reflector 632. The 3-layer reflector 632 is secured via the guide holes 633 of the 3-layer reflector through which the protrusions 614 of the EMI shield extend and via the pressure applied to the stack as a result of the housing and the silicon pad and/or cushion 628. The tabs 614 and vias 633 provide a shield solder connection as the 3-layer reflector 632 is soldered to the tabs 614 of the EMI shield. The dielectric spacer 640 includes a post or peg 645 that extends through a via 635 in the 3-layer reflector 632.

A wide range of materials may be used for the upper and lower conductive layers of the 3-layer reflector 632, such as metals, metal alloys, metallic materials, conductive composites, and the like. In this exemplary embodiment, the upper and lower conductive layers of the 3-layer reflector 632 comprise sheet metal.

A wide range of materials may be used for the dielectric spacer 640. In this example, the dielectric spacer 640 comprises plastic.

The patch antenna 604 is a GPS patch antenna. The PCB layers of the PCBA 608 and 3-layer reflector 632 comprise a dielectric substrate or board comprising FR4 composite material comprising a woven fiberglass fabric with a fire resistant epoxy resin binder. Circuitry with ground metallization may be disposed on the top or upper surface of the PCBA 608. The EMI shield 612 comprises stamped sheet metal including resilient spring fingers 613 along the sidewalls. The EMI shield 612 also includes protrusions 614 that extend through vias 609 in the PCBA 608 and vias 633 in the 3-layer reflector 632. Alternative embodiments may include other satellite navigation and/or patch antennas (e.g., GLONASS patch antennas, etc.), other EMI shields, other reflectors, other radiating antennas, and/or other PCBA's.

The antenna assembly 600 also includes a connection 616, the connection 616 for electrically connecting the PCBA 608 to a communication link, which in turn may be connected to electronics (e.g., a built-in touch screen display, etc.) inside the passenger compartment of the vehicle. The antenna assembly 600 includes a housing for the components of the antenna assembly 600. The housing includes a top housing member 620, which top housing member 620 can be coupled to a bottom housing member 624 (e.g., snap together with, latch to, etc. the bottom housing member). The housing may be formed of a dielectric material (e.g., plastic, etc.). A tag 652 may be applied to the outer surface of the housing, which tag 652 may include information relating to and/or identifying the particular antenna assembly 600.

A resiliently compressible (e.g., silicone rubber, etc.) bumper 628 is positioned between the PCBA 608 and the top housing member 620. The dampener 628 is generally sandwiched in compression between the PCBA 608 and the top housing member 620 when the top and bottom housing members 620, 624 are coupled together. The compression of the bumper 628 generates a compressive force that generally urges the PCBA 608 toward the EMI shield 612, which contributes to the electrical grounding of the PACBA 608 and the shield 612. The pressure exerted on the stack as a result of the housing and the cushion 628 may help hold the components in place.

The patch antenna 604 may be electrically connected or coupled to the PCBA 608 via a connection, in this example a pin 656 (fig. 14 and 15). The pins 656 may be uninsulated or insulated (e.g., metal conductors with EMI shields around them, etc.). The pins 656 may be semi-rigid pins. The pins 656 extend from the patch antenna 604 through the openings 636 in the 3-layer reflector 632, through the openings 644 in the dielectric material 640, and to the PCBA 608.

In an alternative embodiment, the connections (e.g., pins, etc.) from the patch antenna may not pass directly through the PCB layer of the 3-layer reflector. Instead, the connector may extend around the PCB layer (e.g., "turn around" to the side of the PCB layer, etc.) and then descend all the way down to the PCBA.

Fig. 21-31 illustrate another exemplary embodiment of an antenna assembly 700 embodying one or more aspects of the present disclosure. The antenna assembly 700 includes a multilayer reflector 732 (e.g., a 3-layer reflector, etc.) between the patch antenna 704 and the PCBA 708. The antenna assembly 700 may include components similar to corresponding components of the antenna assembly 600.

However, in this exemplary embodiment, the antenna assembly 700 includes a connector or pin 756 from the patch antenna 704 that does not pass directly through the PCB layers of the multilayer reflector 732. Instead, the pins 756 may extend around the PCB layers as shown in fig. 21 (e.g., "turn around" to the side of the PCB layers, etc.) and then pass down to the PCBA 708.

Antenna assemblies 600 and/or 700 may be mounted inside or outside of a vehicle, for example, by using dielectric double-sided tape 760 (fig. 21). For example, the antenna assemblies 600 and/or 700 may be mounted on an external vehicle surface (such as a roof, trunk, or hood of a vehicle) to help ensure that the antenna has an unobstructed field of view overhead or toward the zenith. As another example, antenna assemblies 600 and/or 700 may be mounted inside an instrument panel of a vehicle. Advantageously, antenna assembly 600 and/or 700 has a good or sufficiently high gain of 50 degrees above horizontal that allows antenna assembly 600 to be mounted inside the vehicle instrument panel. A gain of 50 degrees above the horizontal line is most important for IP installation locations.

The exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that none should be construed to limit the scope of the present disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Additionally, the advantages and improvements that may be realized with one or more exemplary embodiments of the present invention are provided for purposes of illustration only and do not limit the scope of the present disclosure (as the exemplary embodiments disclosed herein may provide none, all, or one of the above-described advantages and improvements, and still fall within the scope of the present disclosure).

Specific dimensions, specific materials, and/or specific shapes disclosed herein are exemplary in nature and do not limit the scope of the disclosure. The disclosure herein of specific values and specific value ranges for a given parameter is not exhaustive of other values and value ranges that may be used in one or more of the examples disclosed herein. Moreover, it is contemplated that any two particular values for a particular parameter recited herein may define the endpoints of a range of values that may be suitable for the given parameter (i.e., the disclosure of a first value and a second value for a given parameter may be interpreted as disclosing that any value between the first and second values may also be employed for the given parameter). For example, if parameter X is illustrated herein as having a value a and is also illustrated as having a value Z, it is contemplated that parameter X may have a range of values from about a to about Z. Similarly, it is contemplated that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping, or distinct) encompasses all possible combinations of ranges of values for which endpoints of the disclosed ranges can be clamped. For example, if parameter X is exemplified herein as having a value in the range of 1-10 or 2-9 or 3-8, it is also contemplated that parameter X may have other ranges of values including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises" and "comprising" are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on," "engaged to," "connected to" or "coupled to" another element or layer, the element or layer may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in the same fashion (e.g., "between … …" versus "directly between … …", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The term "about" when applied to a value indicates that the calculation or measurement allows the value to be slightly imprecise (near exact in value; approximately or reasonably close in value; nearly). If, for some reason, the imprecision provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein indicates at least variations that may result from ordinary methods of measuring or using such parameters. For example, the terms "generally," "about," and "approximately" may be used herein to mean within manufacturing tolerances.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence unless clearly indicated by the context. Thus, a first element, component, region, layer or section could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms (such as "inner," "outer," "below," "lower," "above," "upper," and the like) may be used herein for convenience in describing the relationship of one element or feature to another element or feature as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The foregoing description of the embodiments has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements, contemplated or stated uses or features of a particular embodiment are generally not limited to that particular embodiment, but, where appropriate, are interchangeable and can be used in a selected embodiment (even if the embodiment is not specifically shown or described). The same can also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Claims (13)

1. An antenna assembly, comprising:

a patch antenna configured to be operable at one or more satellite navigation system frequencies;

a PCB; and

an intermediate component positioned between the patch antenna and the PCB such that the patch antenna is not disposed directly on the PCB, the intermediate component comprising:

a first conductive spacer; and

a conductive reflector or a ground plane,

wherein,

the first conductive spacer is between the patch antenna and the conductive reflector or ground plane, the conductive reflector or ground plane is between the first conductive spacer and the PCB, and the patch antenna is spaced from the conductive reflector or ground plane due to the thickness of the first conductive spacer, thereby changing the radiation pattern or directivity of the patch antenna to point to a higher elevation angle.

2. The antenna assembly of claim 1, wherein:

the intermediate component further comprises a second conductive spacer between the conductive reflector or ground plane and the PCB, and

the conductive reflector or ground plane is between the first conductive spacer and the second conductive spacer.

3. The antenna assembly of claim 1, wherein:

the patch antenna is configured to be operable at least one of GPS and GLONASS frequencies.

4. The antenna assembly of claim 1, wherein:

the patch antenna is electrically connected to the PCB via a connection extending from the patch antenna through the first conductive spacer and the opening in the conductive reflector or ground plane to the PCB.

5. The antenna assembly of claim 1 or 2, wherein during operation of the antenna assembly, a surface current is induced on and re-radiated by the conductive reflector or ground plane, thereby enhancing a radiation pattern.

6. An antenna assembly, comprising:

a patch antenna configured to be operable at one or more satellite navigation system frequencies;

a PCB; and

an intermediate component between the patch antenna and the PCB such that the patch antenna is not disposed directly on the PCB, the intermediate component comprising:

a conductive reflector or ground plane; and

a conductive spacer is provided on the substrate,

wherein the conductive spacer is between the conductive reflector or ground plane and the PCB, the conductive reflector or ground plane is between the conductive spacer and the patch antenna, and the conductive spacer creates an air gap between the PCB and the conductive reflector or ground plane, thereby changing a radiation pattern or directivity of the patch antenna to point to a higher elevation angle.

7. The antenna assembly of claim 6, wherein:

the patch antenna is configured to be operable at least one of GPS and GLONASS frequencies.

8. The antenna assembly of claim 6, wherein during operation of the antenna assembly, a surface current is induced on and re-radiated by the conductive reflector or ground plane, thereby enhancing a radiation pattern.

9. An antenna assembly, comprising:

a patch antenna configured to be operable at one or more satellite navigation system frequencies;

a PCB; and

an intermediate component between the patch antenna and the PCB such that the patch antenna is not disposed directly on the PCB, the intermediate component comprising: a multilayer reflector and a dielectric spacer,

wherein the patch antenna is on or against the multilayer reflector and the dielectric spacer is between the multilayer reflector and the PCB.

10. The antenna assembly of claim 9, wherein the multilayer reflector comprises a 3-layer reflector, the 3-layer reflector comprising an upper conductive layer, a PCB layer, and a lower conductive layer.

11. The antenna assembly of claim 9, wherein: the patch antenna is configured to be operable at least one of GPS and GLONASS frequencies.

12. The antenna assembly of claim 9, wherein:

the patch antenna is electrically connected to the PCB via a connection extending from the patch antenna through the openings in the multilayer reflector and the dielectric spacer to the PCB.

13. The antenna assembly of claim 10, wherein the patch antenna is electrically connected to the PCB via a connector that extends from the patch antenna around the PCB layer and then down to the PCB.

Images