WO2015196963A1 - Rapid heat dissipation luminous decay-proof mixed gas and integrated heat dissipation led lamp - Google Patents

Abstract

A rapid heat dissipation luminous decay-proof mixed gas and integrated heat dissipation LED lamp comprising the gas. The mixed gas is a mixture of helium and oxygen, and the volume ratio of helium to oxygen at normal temperature is 99.5: 0.5 to 85: 15; or the mixed gas is a mixture of inert heat conducting gas and oxygen, the inert heat conducting gas is a mixture of helium and other heat conducting gases which do not react with oxygen at room temperature, and the volume ratio of the inert heat conducting gas to oxygen at normal temperature is 99.5: 0.5 to 85: 15. When the enclosed cavity of the LED lamp is filled with an oxygen-containing mixed gas instead of helium, hydrogen or helium-hydrogen mixed gas in the prior art, and when the LED lamp is energized and emits light, the blackening phenomenon of an LED chip disappears, and luminous decay disappears accordingly, prolonging the service life of the LED lamp.

Description

Fast heat dissipation anti-lighting mixed gas and integrated heat dissipation LED lamp Technical field

The invention belongs to the technical field of LED energy-saving lamps, and is particularly related to the heat-dissipating and anti-light-mixing gas components charged in the closed cavity of the LED lamp, and is related to the integrated heat-dissipating structure of the LED lamp.

technical background

In the prior art, there is an LED lamp comprising a light-transmitting bulb, a lamp cap, a driving circuit and an LED light source, wherein the driving circuit is installed in the lamp cap or the light-transmitting bulb; the light-transmitting bulb cover is arranged on the lamp cap, and the light-transmitting bulb is An erected core column is arranged in the shell, and the light-transmissive bulb and the core column are sealed at the bottom to form a closed cavity, and the closed cavity is filled with a heat-conducting gas (such as helium gas, hydrogen gas or hydrogen-hydrogen mixed gas, etc.); the LED light source is fixed on the core column The series LED chip on the LED illumination source is electrically connected to the driving circuit and the lamp cap. When the LED lamp is energized and illuminated, the heat generated by the LED chip is dissipated through the core column, the heat conducting gas and the light transmitting bulb, and the heat dissipation effect is improved.

However, after the LED lamp of this structure is used for a period of time, blackening occurs on the LED chip, causing severe light decay, which directly affects the service life of the LED lamp. In this regard, the inventors conducted a careful analysis and found that changing the heat-conducting gas charged in the LED lamp can solve the phenomenon of blackening and light decay of the LED chip, and in-depth study on the composition of the heat-conducting gas.

In addition, the LED light source is composed of a high thermal conductivity transparent tube and an LED chip, and the high thermal conductivity transparent tube is fixedly mounted on the outer surface of the core column with a transparent glue, and the LED chip is directly fixed on the outer surface of the high thermal conductivity transparent tube with a solid glue. The planar portion is then electrically connected to the driving circuit and the lamp cap, and then covered with a fluorescent layer.

Because the high thermal conductivity transparent tube has a large contact surface with low viscosity and high thermal conductivity gas, the LED bulb reduces the thermal resistance between the LED chip and the low viscosity and high thermal conductivity gas, so when the light is emitted, the LED chip is generated. The heat is dissipated through a large area of high thermal conductivity transparent tube, low viscosity high thermal conductivity gas and light transmissive bulb, and the heat dissipation effect is improved.

However, this LED bulb has the following disadvantages:

1. The high thermal conductivity transparent tube is made of high thermal conductivity transparent ceramic, glass or plastic. In view of the fact that the thermal conductivity of transparent ceramic, glass or plastic is far less than that of metal, the heat dissipation effect of the LED bulb still needs to be improved;

Second, the high thermal conductivity transparent tube only has upper and lower openings, can only increase the heat dissipation area, can not form heat convection in the tube, the heat dissipation effect is not ideal;

3. Once the high thermal conductivity transparent tube is formed, the shape is fixed, so that the size of the LED light source cannot be changed arbitrarily according to the power change of the LED bulb, and the processing and manufacturing cost is high.

Summary of the invention

An object of the present invention is to provide a rapid heat dissipation anti-lighting mixed gas to avoid blackening and light decay of the LED chip and prolong the service life of the LED lamp.

Another object of the present invention is to provide an integrated heat dissipation type LED lamp to greatly improve heat dissipation efficiency.

In order to achieve the above object, the technical solution of the present invention is:

A rapid heat dissipation anti-light decay mixed gas, which is formed by mixing helium (He) and oxygen (O ₂ ), wherein: according to the volume ratio at normal temperature (25 ° C), helium: oxygen is 99.5: 0.5 to 85: 15.

A rapid heat-dissipating anti-light-mixing gas mixture is formed by mixing a heat-conductive gas and oxygen gas. The inert heat-conducting gas is formed by mixing helium (He) and other heat-conducting gases that do not react with oxygen at normal temperature, wherein: According to the volume ratio at normal temperature (25 ° C), the inert heat conduction gas: oxygen is 99.5: 0.5 ~ 85:15.

An integrated heat-dissipating LED lamp comprises a glass bulb, a lamp cap, a driving circuit, an LED chip and an aluminum substrate, wherein the driving circuit is installed in the lamp cap or the glass bulb; the glass bulb cover is arranged on the lamp cap, and the glass bulb is provided in the glass bulb The erected glass stem, the glass bulb and the glass stem are sealed at the bottom to form a closed cavity, and the closed cavity is filled with the above-mentioned rapid heat dissipation anti-lighting mixed gas; the aluminum substrate is fixed on the glass stem, and the LED chip is soldered and mounted on the aluminum substrate The LED chip is electrically connected to the driving circuit and the lamp cap.

The upper end and the lower end of the glass stem are mounted with a bracket and a lower bracket. The two ends of the aluminum substrate are erected on the upper bracket and the lower bracket, and the aluminum substrate is provided with a heat dissipation hole, and the aluminum substrate is vertically bent around the glass core. The column forms a light column.

The upper end and the lower end of the glass core column are mounted with a lower bracket and a lower bracket. The two ends of the aluminum substrate are fixedly mounted on the upper bracket and the lower bracket, and the aluminum substrate is formed by spirally surrounding the glass core column to form a light column.

The aluminum substrate is erected around the glass stem to form a light column, and the aluminum substrate is provided with a heat dissipation hole, and the inner side of the aluminum substrate is also bent toward the glass core to form a fin.

The glass core post is also fixedly arranged with a honeycomb metal heat sink, a honeycomb structure is formed in the wall of the honeycomb metal heat sink, and a heat dissipation hole is further formed in the wall of the honeycomb metal heat sink, and the aluminum substrate is bent by a vertical A light column is formed by straight or spirally surrounding the wall of the honeycomb metal heat sink.

A honeycomb metal heat sink is fixedly disposed on the glass stem, a honeycomb structure is formed in the wall of the honeycomb metal heat sink, and a heat dissipation hole is further formed in the wall of the honeycomb metal heat sink, and the aluminum substrate is fixed on the honeycomb metal The top of the heat sink.

In the honeycomb structure, the inner side of the cylindrical wall of the honeycomb metal heat sink extends toward the glass core to form a radial piece, and the radial piece further forms a curved piece along the circumference.

The glass stem is also fixedly covered with foam metal, and the aluminum substrate is vertically or rounded around the foam metal by bending to form a light column.

The glass stem is also fixedly covered with foam metal, and the aluminum substrate is fixed on the top end of the honeycomb metal heat sink.

A fan is also mounted below the aluminum substrate, below the aluminum substrate and the honeycomb metal heat sink, or below the aluminum substrate and the metal foam.

The surface of the glass bulb partially protrudes outward to form a heat dissipation expansion surface.

The driving circuit is mounted in a glass bulb, and the element of the driving circuit is directly soldered to the inner side of the aluminum substrate.

After adopting the above scheme, the present invention has the following advantages compared with the prior art:

1. Filling the enclosed cavity of the LED lamp with the mixed gas containing oxygen of the present invention, instead of the helium, hydrogen or helium-hydrogen mixed gas in the prior art, when the LED lamp is energized and illuminated, the blackening phenomenon of the LED chip disappears, and the light decays. The phenomenon is eliminated, and the service life of the LED lamp is greatly extended;

Second, the aluminum substrate replaces the high thermal conductivity transparent tube, and the high thermal conductivity of the metal makes the heat dissipation effect of the LED bulb greatly improved;

Third, the aluminum substrate or further cooperate with the honeycomb metal heat sink, foam metal and fan, etc., can not only increase the heat dissipation area, but also form heat convection inside, and the heat dissipation effect is better;

Fourth, the aluminum substrate can be bent according to the power design requirements of the LED bulb, and is used for mounting different numbers of LED chips to form a corresponding LED illumination source, which is convenient for processing and low in cost.

The key of the invention is to integrate the heat conduction of the aluminum substrate, the heat conduction of the heat conduction gas and the heat dissipation of the glass bulb, and the heat of the working of the LED chip is fully diffused through the aluminum substrate, fully contacted with the mixed gas, and then fully emitted by the glass bulb to achieve rapid realization. Effectively integrate heat dissipation. The invention is particularly suitable for making high-power LED bulbs, such as bulbs, mercury lamps, candle lamps, downlights, spotlights, BR lamps, MR lamps, and the like.

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

DRAWINGS

1 is a first embodiment of a mixed gas, a luminous flux maintenance curve of a non-sealed gas-filled conventional LED lamp;

2 is a second embodiment of a mixed gas, a luminous flux maintenance curve of a sealed inflated (pure xenon) LED lamp;

Figure 3 is a second embodiment of the mixed gas, the color of the surface of the LED chip is darkened;

Figure 4 is a mixed gas embodiment 2, the black surface of the phosphor silica gel surface;

Figure 5 is a photograph of the surface of a normally unused LED chip;

Figure 6 is a photograph of the surface of a normally unused phosphor silica gel;

Figure 7 is a graph showing the luminous flux maintenance of the LED lamp after sealing and inflating (after filling the pure xenon lighting 312h, and then re-vacuating into the normal volume ratio of the mixed gas of the present invention: helium: oxygen = 97%: 3%);

Figure 8 is a mixed gas embodiment 3, LED chip surface color recovery photos;

Figure 9 is a third embodiment of a mixed gas, a photo recovery surface of a phosphor silica gel;

Figure 10 is a mixed gas embodiment 4, sealing gas (normal gas ratio of mixed gas of the present invention: helium: oxygen = 97%: 3%) LED lamp luminous flux maintenance curve;

Figure 11 is a mixed gas embodiment 5, sealing gas (the mixture gas of the present invention is not normal volume ratio: helium: oxygen = 99.9%: 0.1%) LED lamp luminous flux maintenance curve;

Figure 12 is a mixed gas embodiment 6, a sealed gas (inventive mixture gas abnormal volume ratio: helium: oxygen = 80%: 20%) LED lamp luminous flux maintenance curve;

Figure 13 is a cross-sectional view of the first embodiment of the LED lamp;

Figure 14 is a schematic view showing the internal structure of the first embodiment of the LED lamp;

Figure 15 is a plan view showing the internal structure of the first embodiment of the LED lamp;

Figure 16 is a cross-sectional view of the second embodiment of the LED lamp;

17 is a schematic view showing the internal structure of the second embodiment of the LED lamp;

Figure 18 is a plan view showing the internal structure of the second embodiment of the LED lamp;

Figure 19 is an overall cross-sectional view showing a third embodiment of the LED lamp;

Figure 20 is a schematic view showing the internal structure of the third embodiment of the LED lamp;

Figure 21 is a plan view showing the internal structure of the third embodiment of the LED lamp;

Figure 22 is a perspective view showing the internal structure of the third embodiment of the LED lamp;

Figure 23 is an overall cross-sectional view showing the fourth embodiment of the LED lamp;

Figure 24 is a schematic view showing the internal structure of the fourth embodiment of the LED lamp;

Figure 25 is a perspective bottom view of the internal structure of the fourth embodiment of the LED lamp;

Figure 26 is a plan view showing the internal structure of the fourth embodiment of the LED lamp;

Figure 27 is a perspective view of a honeycomb metal heat sink of the fourth embodiment of the LED lamp;

Figure 28 is an overall cross-sectional view showing the fifth embodiment of the LED lamp;

Figure 29 is a schematic view showing the internal structure of the fifth embodiment of the LED lamp;

Figure 30 is an overall cross-sectional view showing the sixth embodiment of the LED lamp;

Figure 31 is a schematic view showing the internal structure of the sixth embodiment of the LED lamp;

Figure 32 is an overall cross-sectional view showing the seventh embodiment of the LED lamp;

Figure 33 is a schematic view showing the internal structure of the seventh embodiment of the LED lamp;

Figure 34 is an overall cross-sectional view showing an eighth embodiment of the LED lamp;

Figure 35 is an overall cross-sectional view showing a ninth embodiment of the LED lamp;

Figure 36 is an overall cross-sectional view showing the tenth embodiment of the LED lamp;

Figure 37 is an overall appearance view of the tenth embodiment of the LED lamp;

Figure 38 is a general cross-sectional view showing the eleventh embodiment of the LED lamp.

Label description

Glass bulb 1, closed chamber 11, mixed gas 12, heat dissipation expansion surface 13, lamp holder 2, drive circuit 3, LED chip 4, aluminum substrate 5, heat dissipation hole 51, fin 52, glass stem 6, upper bracket 61, The lower bracket 62, the honeycomb metal heat sink 7, the radial piece 71, the arc piece 72, the heat dissipation hole 73, and the fan 8.

detailed description

The invention discloses a heat-dissipating anti-light-mixing mixed gas in an LED lamp, which is prepared by mixing helium (He) and oxygen (O ₂ ), wherein: according to a volume ratio of 25 ° C at normal temperature, helium gas: oxygen is 99.5: 0.5～85:15, or a mixture of inert heat-conducting gas and oxygen. The inert heat-conducting gas is made up of helium and other heat-conducting gases that do not react with oxygen at normal temperature. Among them: at normal temperature (25°C) Under the volume ratio, the inert heat transfer gas: oxygen is 99.5: 0.5 ~ 85: 15, the other heat transfer gas that does not react with oxygen at normal temperature can be nitrogen (N ₂ ) and carbon dioxide (CO ₂ ), etc. The amount of oxygen is converted by the amount of oxygen, and air is added instead of oxygen, and the effect is similar.

Embodiment 1

Luminous flux maintenance data for unsealed inflatable conventional LED lamps (see Figure 1)

Time (hours)	twenty four	48	72	96	120	144	168	192
Luminous maintenance rate	99.87%	100.24%	100.19%	100.02%	100.14%	99.99%	100.02%	99.94%
Time (hours)	216	240	264	288	312	336	360	384
Luminous maintenance rate	99.96%	99.89%	99.91%	99.86%	99.85%	99.87%	99.83%	99.81%
Time (hours)	408	432	456	480	504	552	600	648
Luminous maintenance rate	99.79%	99.79%	99.81%	99.83%	99.76%	99.73%	99.81%	99.73%
Time (hours)	696	744	792	840	888	936	984
Luminous maintenance rate	99.68%	99.71%	99.69%	99.72%	99.71%	99.67%	99.65%

Embodiment 2

Luminous flux maintenance data for sealed aerated (pure xenon) LED lamps (see Figure 2)

Time (hours)	twenty four	48	72	96	120	144	168	192
Luminous maintenance rate	99.20%	98.88%	97.14%	96.96%	94.81%	93.77%	91.84%	88.71%
Time (hours)	216	240	264	288	312	336	360	384
Luminous maintenance rate	85.88%	83.94%	81.76%	79.68%	77.94%	75.26%	74.01%	72.15%
Time (hours)	408	432	456	480	504	552	600	648
Luminous maintenance rate	70.69%	68.75%	67.03%	64.99%	62.59%	61.09%	59.64%	57.86%
Time (hours)	696	744	792	840	888	936	984
Luminous maintenance rate	56.14%	54.29%	52.38%	50.89%	51.12%	50.64%	50.47%

The reason for the low luminous flux maintenance rate is that blackening occurs between the surface of the LED chip and the phosphor silica gel. See Figures 3 and 4, and the color of the normal unused LED chip surface and the surface of the phosphor silica gel is shown in Figure 5. And Figure 6 shows.

Embodiment 3

Sealed and inflated (filled with pure xenon lighting 312h, then re-vacuum to fill the normal volume ratio of the patented gas mixture: helium: oxygen = 97%: 3%) LED lamp luminous flux maintenance data (see Figure 7)

Time (hours)	twenty four	48	72	96	120	144	168	192
Luminous maintenance rate	98.96%	97.85%	96.05%	94.53%	92.28%	90.89%	89.59%	88.24%
Time (hours)	216	240	264	288	312	336	360	384
Luminous maintenance rate	86.59%	84.17%	82.34%	79.95%	76.89%	97.81%	100.09%	100.12%
Time (hours)	408	432	456	480	504	552	600	648
Luminous maintenance rate	100.09%	100.13%	99.97%	100.06%	99.98%	100.03%	100.08%	99.99%
Time (hours)	696	744	792	840	888	936	984
Luminous maintenance rate	100.03%	99.95%	99.92%	99.97%	99.98%	99.94%	100.01%

Remarks: After re-vacuum filling into the normal volume ratio of the mixed gas of the present invention: helium: oxygen = 97%: 3%, the blackening phenomenon between the surface of the LED chip and the phosphor silica gel disappears, see Figures 8 and 9 Therefore, the luminous flux of the LED lamp maintains the data back to normal.

Embodiment 4

Sealing charge (normal volume ratio of mixed gas of the present invention: helium: oxygen = 97%: 3%) luminous flux maintenance data of LED lamps (see Fig. 10)

Time (hours)	twenty four	48	72	96	120	144	168	192
Luminous maintenance rate	100.74%	100.39%	100.06%	100.77%	100.68%	100.47%	100.37%	100.61%
Time (hours)	216	240	264	288	312	336	360	384
Luminous maintenance rate	100.57%	100.48%	100.56%	100.69%	100.65%	100.77%	100.64%	100.48%
Time (hours)	408	432	456	480	504	552	600	648
Luminous maintenance rate	100.32%	100.41%	100.38%	100.34%	100.29%	100.31%	100.27%	100.21%
Time (hours)	696	744	792	840	888	936	984
Luminous maintenance rate	100.29%	100.23%	100.24%	100.19%	100.24%	100.19%	100.23%

Remarks: The oxygen-containing mixed gas of the present invention is charged into the closed cavity of the LED lamp, and the luminous flux of the LED lamp maintains the data normal.

Embodiment 5

Sealed aeration (unusual volume ratio of the mixed gas of this patent: helium: oxygen = 99.9%: 0.1%) The luminous flux maintenance data of the LED lamp (see Figure 11)

Time (hours)	twenty four	48	72	96	120	144	168	192
Luminous maintenance rate	100.12%	100.14%	100.01%	99.97%	99.46%	98.88%	99.32%	98.83%
Time (hours)	216	240	264	288	312	336	360	384
Luminous maintenance rate	98.14%	98.75%	97.42%	96.59%	92.84%	84.95%	81.20%	79.9%
Time (hours)	408	432	456	480	504	552	600	648
Luminous maintenance rate	78.96%	77.86%	76.85%	75.84%	73.20%	72.40%	69.83%	67.91%
Time (hours)	696	744	792	840	888	936	984
Luminous maintenance rate	65.89%	66.12%	65.81%	65.79%	66.04%	65.16%	66.12%

Remarks: The reason why the luminous flux maintenance rate drops rapidly after the LED lamp is turned on for 300 hours is that after the amount of oxygen is too small, the working period is a period of time, the oxygen consumption is exhausted, and a phenomenon similar to pure purging is observed.

Embodiment 6

Sealing aeration (unusual volume ratio of mixed gas of the present invention: helium: oxygen = 80%: 20%) luminous flux maintenance data of LED lamps (see Fig. 12)

Time (hours)	twenty four	48	72	96	120	144	168	192
Luminous maintenance rate	100.56%	100.15%	100.06%	100.12%	99.95%	99.86%	99.91%	99.34%
Time (hours)	216	240	264	288	312	336	360	384
Luminous maintenance rate	99.27%	98.56%	98.12%	98.01%	97.64%	97.28%	96.91%	95.5%
Time (hours)	408	432	456	480	504	552	600	648
Luminous maintenance rate	95.12%	95.03%	94.26%	94.02%	93.89%	93.06%	92.58%	92.26%
Time (hours)	696	744	792	840	888	936	984
Luminous maintenance rate	91.12%	90.14%	89.06%	88.96%	88.04%	86.79%	85.92%

Remarks: The reason why the luminous flux maintenance rate drops rapidly after the LED lamp is turned on for 300 hours is that the operating temperature of the LED light source is too high after the oxygen is overcharged, and the Ts exceeds 120 degrees Celsius.

The LED lamp of the present invention will be described below with reference to the accompanying drawings.

As shown in FIG. 13 to FIG. 15 , a first embodiment of an integrated heat dissipation type LED lamp disclosed in the present invention is a bulb lamp comprising a glass bulb 1 , a lamp holder 2 , a driving circuit 3 , an LED chip 4 , and an aluminum substrate 5 . The drive circuit 3 is mounted on the base 2. The glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 . The glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the mixed gas. 12. The upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62. The aluminum substrate 5 is fixed on the glass stem 6 . Specifically, the two ends of the aluminum substrate 5 are vertically mounted on the upper bracket 61 and the lower bracket 62 . The aluminum substrate 5 defines a heat dissipation hole 51 , and the LED chip 4 is soldered and mounted on the aluminum substrate. 5, the LED chip 4 is electrically connected to the driving circuit 3 and the lamp cap 2, and the aluminum substrate 5 with the LED chip 4 forms a light column around the glass stem 6 in a vertical shape by bending. The heat generated during the operation of the LED chip 4 is sufficiently diffused through the large area of the aluminum substrate 5, and is sufficiently contacted with the mixed gas 12, and is sufficiently radiated from the large surface of the glass bulb 1, thereby achieving rapid and effective integrated heat dissipation.

As shown in FIG. 16 to FIG. 18, a second embodiment of an integrated heat dissipation type LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1, a lamp holder 2, a driving circuit 3, an LED chip 4, and an aluminum substrate 5. . The drive circuit 3 is mounted on the base 2. The glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 . The glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the mixed gas 12 . . The upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62. The aluminum substrate 5 is fixed to the glass stem 6, and the LED chip 4 is soldered to the aluminum substrate 5, and the LED chip 4 is electrically connected to the driving circuit 3 and the base 2. The difference between the second embodiment and the first embodiment is that the two ends of the aluminum substrate 5 are fixedly mounted on the upper bracket 61 and the lower bracket 62, and the aluminum substrate 5 with the LED chip 4 is spirally wrapped around the glass stem 6 by bending. Form a light column. The heat generated during the operation of the LED chip 4 is sufficiently diffused through the large area of the aluminum substrate 5, and is sufficiently contacted with the mixed gas 12, and is sufficiently radiated from the large surface of the glass bulb 1, thereby achieving rapid and effective integrated heat dissipation.

As shown in FIG. 19 to FIG. 22, a third embodiment of an integrated heat dissipation type LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1, a lamp holder 2, a driving circuit 3, an LED chip 4, and an aluminum substrate 5. . The drive circuit 3 is mounted on the base 2. The glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 . The glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the mixed gas 12 . . The aluminum substrate 5 is fixed on the glass stem 6, and the aluminum substrate 5 is provided with a heat dissipation hole 51. The LED chip 4 is soldered and mounted on the aluminum substrate 5, and the LED chip 4 is electrically connected to the drive circuit 3 and the base 2. The third embodiment differs from the first embodiment in that the aluminum substrate 5 with the LED chip 4 is erected to form a light column around the glass stem 6, and the inner side of the aluminum substrate 5 is also bent toward the glass stem 6 to form the fin 52. The heat generated by the operation of the LED chip 4 is sufficiently diffused through the large area of the aluminum substrate 5, particularly the fins 52, and is sufficiently in contact with the mixed gas 12, and is sufficiently emitted from the large surface of the glass bulb 1 to achieve rapid and efficient integration. Cooling.

As shown in FIG. 23 to FIG. 27, a fourth embodiment of an integrated heat dissipation type LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1, a lamp holder 2, a driving circuit 3, an LED chip 4, and an aluminum substrate 5. . The drive circuit 3 is mounted on the base 2. The glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 . The glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the mixed gas 12 . . The upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62. The aluminum substrate 5 is fixed on the glass stem 6, and the aluminum substrate 5 is provided with a heat dissipation hole 51. The LED chip 4 is soldered and mounted on the aluminum substrate 5, and the LED chip 4 is electrically connected to the drive circuit 3 and the base 2. The difference between the fourth embodiment and the first embodiment is that the upper metal frame 6 and the lower bracket 62 of the glass stem 6 are further fixed with a honeycomb metal heat sink 7 , and a honeycomb structure is formed in the wall of the honeycomb metal heat sink 7 . The honeycomb structure can have many specific forms. The honeycomb structure shown in the figure is such that the inner side of the cylindrical wall of the honeycomb metal heat sink 7 extends toward the glass stem 6 to form a radial piece 71, and the radial piece 71 also forms a curved piece along the circumference. 72. A heat dissipation hole 73 is further formed in the wall of the honeycomb metal heat sink 7 for heat convection. The aluminum substrate 5 with the LED chip 4 is vertically fixed around the wall of the honeycomb metal heat sink 7 by bending. Form a light column. The heat generated by the operation of the LED chip 4 is sufficiently diffused through the large area of the aluminum substrate 5 and the honeycomb metal heat sink 7, and is sufficiently contacted with the mixed gas 12, and then fully emitted from the large surface of the glass bulb 1, thereby achieving rapid and effective operation. Integrated heat dissipation.

As shown in FIG. 28 to FIG. 29, a fifth embodiment of an integrated heat-dissipating LED lamp disclosed in the present invention is a mercury lamp (the outer shape is different from the first to fourth embodiments), and includes a glass bulb 1, a base 2, and a driving circuit 3. , LED chip 4 and aluminum substrate 5. The drive circuit 3 is mounted on the base 2. The glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 . The glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the mixed gas 12 . . The upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62. The aluminum substrate 5 is fixed on the glass stem 6, and the aluminum substrate 5 is provided with a heat dissipation hole 51. The LED chip 4 is soldered and mounted on the aluminum substrate 5, and the LED chip 4 is electrically connected to the drive circuit 3 and the base 2. The difference between the fifth embodiment and the first embodiment (the same as the fourth embodiment) is that the upper metal frame 6 and the lower bracket 62 of the glass stem 6 are also fixedly disposed with the honeycomb metal heat sink 7, and the honeycomb metal heat sink 7 The honeycomb structure is formed in the wall of the tube. The honeycomb structure can have many specific forms. The honeycomb structure can be as shown in FIG. 15 : the inner side of the wall of the honeycomb metal heat sink 7 extends toward the glass stem 6 to form a radial piece 71. A vane 72 is further formed on the sheet 71, and a heat dissipation hole 73 is formed in the wall of the honeycomb metal heat sink 7 for heat convection. The aluminum substrate 5 with the LED chip 4 is vertically fixed by bending. A light column is formed on the wall of the honeycomb metal heat sink 7. Further, in the fifth embodiment, unlike the first to fourth embodiments, the fan 8 is mounted below the aluminum substrate 5 and the honeycomb metal heat sink 7. The heat generated by the operation of the LED chip 4 is sufficiently diffused through the large area of the aluminum substrate 5 and the honeycomb metal heat sink 7, and is in full contact with the mixed gas 12, and the fan 8 is used to increase the heat convection, and then the glass bulb 1 is large. The surface is fully dissipated for fast and efficient integration of heat dissipation.

As shown in FIG. 30 to FIG. 31, a sixth embodiment of an integrated heat-dissipating LED lamp disclosed in the present invention is a candle lamp (the outer shape is different from the first to fifth embodiments), and includes a glass bulb 1, a base 2, and a driving circuit 3. , LED chip 4 and aluminum substrate 5. The drive circuit 3 is mounted on the base 2. The glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 . The glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the mixed gas 12 . . The aluminum substrate 5 is fixed on the glass stem 6, the LED chip 4 is soldered and mounted on the aluminum substrate 5, the LED chip 4 is electrically connected to the driving circuit 3 and the base 2, and the aluminum substrate 5 with the LED chip 4 is vertically bent. A light column is formed around the glass stem 6 . The heat generated during the operation of the LED chip 4 is sufficiently diffused through the large area of the aluminum substrate 5, and is sufficiently contacted with the mixed gas 12, and is sufficiently radiated from the large surface of the glass bulb 1, thereby achieving rapid and effective integrated heat dissipation.

As shown in FIG. 32 to FIG. 33, the seventh embodiment of the integrated heat-dissipating LED lamp disclosed in the present invention is a PAR lamp (the outer shape is different from the first embodiment to the sixth embodiment), and includes a glass bulb 1, a base 2, and a driving circuit 3. , LED chip 4 and aluminum substrate 5. The drive circuit 3 is mounted on the base 2. The glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 . The glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the mixed gas 12 . . The aluminum substrate 5 is fixed on the glass stem 6, specifically, the aluminum substrate 5 is fixed on the top end of the honeycomb metal heat sink 7, and the honeycomb metal heat sink 7 is fixedly mounted on the glass stem 6, and the honeycomb metal heats up. A honeycomb structure is formed in the wall of the tube 7. The honeycomb structure can have many specific forms (as shown in FIG. 15), and a heat dissipation hole 73 is formed in the wall of the honeycomb metal heat sink 7 for heat convection. The LED chip 4 is soldered and mounted on the aluminum substrate 5, and the LED chip 4 is electrically connected to the drive circuit 3 and the base 2. The heat generated by the operation of the LED chip 4 is sufficiently diffused through the large area of the aluminum substrate 5 and the honeycomb metal heat sink 7, and is sufficiently contacted with the mixed gas 12, and then fully emitted from the large surface of the glass bulb 1, thereby achieving rapid and effective operation. Integrated heat dissipation.

As shown in FIG. 34, an eighth embodiment of an integrated heat-dissipating LED lamp disclosed in the present invention is a BR lamp. As shown in FIG. 35, an embodiment IX of an integrated heat-dissipating LED lamp disclosed in the present invention is an MR lamp. The eighth embodiment and the ninth embodiment are different from the seventh embodiment except for the same shape, and the other structures are the same as those of the seventh embodiment, and also include the glass bulb 1, the lamp cap (the embodiment 9 is a pin), the driving circuit 3, and the LED chip. 4, the aluminum substrate 5, the glass stem 6 and the honeycomb metal heat sink 7, the relationship between the components is the same as the seventh embodiment, and will not be described herein.

As shown in FIG. 36 to FIG. 37, a tenth embodiment of an integrated heat dissipation type LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1, a lamp holder 2, a driving circuit 3, an LED chip 4, and an aluminum substrate 5. The relationship between the components of the tenth embodiment and the glass stem 6 is the same as that of the first embodiment, and will not be described herein. The difference between this embodiment 10 and the first embodiment is that the surface of the glass bulb 1 partially protrudes outward to form a heat dissipation expansion surface 13 to further increase the heat dissipation area. The heat generated during the operation of the LED chip 4 is sufficiently diffused through the large area of the aluminum substrate 5, and is sufficiently contacted with the mixed gas 12, and then the large surface enlarged by the glass bulb 1 is sufficiently emitted to realize rapid and effective integrated heat dissipation.

As shown in FIG. 38, an eleventh embodiment of an integrated heat dissipating LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1, a lamp cap 2, a driving circuit 3, an LED chip 4, an aluminum substrate 5, and a glass. The relationship between the components of the core member 6 and the members of the eleventh embodiment is the same as that of the first embodiment, and will not be described herein. The eleventh embodiment differs from the first embodiment in that the driving circuit 3 is mounted in the glass bulb 1, specifically, the element of the driving circuit 3 is directly welded to the inner side of the aluminum substrate 5. The heat generated when the LED chip 4 and the driving circuit 3 are operated is sufficiently diffused through the large area of the aluminum substrate 5, and is sufficiently in contact with the mixed gas 12, and then the large surface enlarged by the glass bulb 1 is sufficiently emitted, thereby achieving rapid and effective operation. Integrated cooling. This embodiment 11 allows the glass bulb 1 to extend as far as possible to the base 2, increasing the light transmission area, and the illumination effect is better.

In addition, the honeycomb metal heat sink 7 of the present invention can also be replaced by a metal foam to improve the heat dissipation effect.

The above-mentioned embodiments and the drawings are not intended to limit the scope of the invention, and any suitable variations or modifications of the invention will be apparent to those skilled in the art.

Claims (11)

1. A fast heat-dissipating anti-light-mixing gas, characterized in that it is mixed with helium gas and oxygen gas, wherein: according to the volume ratio at a normal temperature of 25 ° C, helium gas: oxygen is 99.5: 0.5 to 85:15.

2. A fast heat-dissipating and anti-light-mixing gas, characterized in that: an inert heat-conducting gas is mixed with oxygen, and the inert heat-conducting gas is formed by mixing helium gas with other heat-conducting gases that do not react with oxygen at normal temperature. , wherein: according to the volume ratio of 25 ° C at room temperature, the inert heat conduction gas: oxygen is 99.5: 0.5 ~ 85:15.

3. An integrated heat-dissipating LED lamp, comprising: a glass bulb, a lamp cap, a driving circuit, an LED chip and an aluminum substrate, wherein the driving circuit is installed in the lamp cap or the glass bulb; the glass bulb cover is arranged on the lamp cap. An erected glass stem is disposed in the glass bulb, and the glass bulb and the glass stem are sealed at the bottom to form a closed cavity, and the closed cavity is filled with a rapid heat dissipation anti-lighting mixed gas according to claim 1 or 2; The substrate is fixed on the glass stem, and the LED chip is soldered and mounted on the aluminum substrate, and the LED chip is electrically connected to the driving circuit and the lamp cap.

4. The integrated heat dissipating LED lamp of claim 3, wherein the upper and lower ends of the glass stem are mounted with a bracket and a lower bracket; the two ends of the aluminum substrate are erected on the upper bracket and the lower bracket On the aluminum substrate, a heat dissipation hole is formed, and the aluminum substrate is formed by vertically bending a glass pillar to form a light column, or both ends of the aluminum substrate are fixedly mounted on the upper bracket and the lower bracket, and the aluminum substrate is spirally bent by bending. A light column is formed around the glass stem.

5. The integrated heat-dissipating LED lamp of claim 3, wherein the aluminum substrate is erected around the glass stem to form a light column, the aluminum substrate is provided with a heat dissipation hole, and the inner side of the aluminum substrate is also bent toward the glass core column. Form fins.

6. The integrated heat-dissipating LED lamp of claim 3, wherein the glass stem is further provided with a honeycomb metal heat sink, and the honeycomb metal heat sink has a honeycomb structure formed therein. A heat dissipation hole is further formed in the wall of the honeycomb metal heat sink; the aluminum substrate is vertically or rounded around the wall of the honeycomb metal heat sink to form a light column, or the aluminum substrate is fixed in the honeycomb shape The top of the metal heat sink.

7. The integrated heat-dissipating LED lamp of claim 6, wherein the honeycomb structure is such that the inner side of the wall of the honeycomb metal heat sink extends toward the glass core to form a radial piece, and the radial piece is further A curved piece is formed along the circumference.

8. The integrated heat dissipating LED lamp of claim 3, wherein the glass stem is further sleeved with a metal foam; the aluminum substrate is vertically surrounded or spirally fixed by bending. A light column is formed on the foam metal, or the aluminum substrate is fixed on the top end of the honeycomb metal heat sink.

9. An integrated heat dissipating LED lamp according to claim 3, wherein a fan is mounted below the aluminum substrate, below the aluminum substrate and the honeycomb metal heat sink, or below the aluminum substrate and the metal foam. .

10. The integrated heat dissipating LED lamp of claim 3, wherein the surface of the glass bulb partially protrudes outward to form a heat dissipation expansion surface.

11. An integrated heat dissipating LED lamp according to claim 3, wherein the driving circuit is mounted in a glass bulb, and the element of the driving circuit is directly soldered to the inner side of the aluminum substrate.