JP5448253B2 - LED lamp - Google Patents

Description

  The present invention relates to an LED lamp.

  In general, lighting lamps have been developed and put into practical use as incandescent bulbs, fluorescent lamps, HID lamps, and LED lamps. An LED lamp is a lamp that uses a light emitting diode element as a light source, and the development of a blue LED element enables white light emission, and recently, the use thereof is expanding as an illumination lamp.

  FIG. 1 is a diagram showing an example of such LED lamps that are currently widely sold. These LED lamps 100 are generally lamps having an output of 10 W or less (typically about 7 W). As shown in FIGS. 1A to 1C, although there are various lamp shapes, the lamp basically includes a base 102, a heat radiating portion 104, and a globe 106. The heat dissipating part 104 is formed from aluminum die-casting, and is often formed in the shape of a heat dissipating fin on the outer peripheral surface. The globe 106 is made of a translucent resin. Some glass gloves are also seen. The aluminum die cast part 104 and the globe 106 are fixed with an appropriate adhesive. Therefore, the internal space formed by the aluminum die cast part 104 and the globe 106 is not hermetically sealed with the outside of the lamp.

  The present inventors are aware that the following prior patent documents exist.

Japanese Patent Application Laid-Open No. 2003-016805 “Light and Light Manufacturing Method”, Applicant: Junichi Imai (Release Date: 2003/01/17) JP 2004-296245 "LED lamp", Applicant: Matsushita Electric Works Co., Ltd. (Released date: 2004/10/21) JP 2009-259813 "Method of preventing or reducing helium leakage from the outer periphery of a metal halide lamp", Applicant: General Electric Company (Date of publication: 2009/11/05) JP 2010-135181 “Illumination Device”, Applicant: Sharp Corporation (Publication Date: 2010/06/17) Compared with the LED lamp of the present application described below, the lamp of the above prior patent document is different in the following points To do. First, in the LED lamp of the present application, an LED element is covered with a glass sealed container, and a low molecular weight gas is sealed as a cooling / heat dissipating means in the glass sealed container.

  Patent Document 1 exemplifies resin and glass as a case member. When glass is used, an internal light-emitting diode is protected from the external environment, and further, a gas that does not contain moisture (nitrogen gas in the embodiment) is contained in the glass container. Disclosed is the effect that when encapsulated, no moisture remains and the glass is not fogged. However, there is no description or suggestion regarding a low molecular weight gas as a cooling / dissipating means.

  In Patent Document 2, the bulb for housing the LED lamp is formed of a resin material, and there is no description or suggestion regarding the hermetic sealing described in relation to FIG.

  Patent Document 3 is an invention related to a metal halide lamp, and there is no description or suggestion regarding an LED element.

  In Patent Document 4, the translucent cover is made of polycarbonate resin, and the heat dissipation part is made of metal such as aluminum. This corresponds to the LED lamp illustrated in FIG. 1 and there is no description or suggestion regarding hermetic sealing.

  An LED element is made of a semiconductor, and the temperature of the junction of the semiconductor and the element lifetime are closely related. That is, when the temperature of the joint at the time of use is relatively low, the device lifetime becomes long, but as the temperature increases, the device lifetime decreases rapidly. Therefore, in the LED lamp, when the temperature of the LED element is high, the lamp life is shortened and the lamp illuminance is also deteriorated.

  In an electronic device using a semiconductor element, the cooling / heat dissipating means is an important matter in the LED lamp as well as the cooling / heat dissipating means.

  In view of the above problems, an object of the present invention is to provide an LED lamp provided with a novel cooling / dissipating means.

  The LED lamp according to the present invention includes a plurality of LED elements and a glass sealed container surrounding the LED elements, and a low molecular weight gas is sealed inside the glass sealed container.

  Furthermore, in the LED lamp, the low molecular weight gas may include any one of helium gas, hydrogen gas, neon gas, or a mixed gas of any combination thereof.

  Further, in the LED lamp, a base may be formed at an end of the glass sealed container, and an airtight state may be maintained between the inside and the outside of the container.

  Furthermore, the LED lamp further includes a rod-shaped light source support having a through hole along the axial direction, and the plurality of LED elements are fixed to a side surface of the light source support, The opening may form a gas flow path through which the low molecular weight gas flows.

  Furthermore, in the LED lamp, the light source support may have a polygonal cross-sectional shape.

  Further, the LED lamp may further include a gas flow acceleration fan in the vicinity of the upper end, the lower end, or both of the through hole of the light source support.

  Furthermore, in the LED lamp, the light source support may be made of a member having good thermal conductivity including at least aluminum, copper, or a heat conductive resin.

  Furthermore, in the LED lamp, a mounting substrate on which the plurality of LEDs are mounted may be fixed to the light source support.

  Furthermore, in the LED lamp, the mounting substrate may be a metal base substrate or a metal core substrate.

  Further, the LED lamp further includes a plurality of rectangular substrates, the substrates are interconnected at side ends so as to form a gas flow path as a whole, and the plurality of LED elements are the plurality of the LED elements. Each may be mounted on the surface of a rectangular substrate.

  Furthermore, the LED lamp further includes a heat exchanger made of a heat conductive resin fixed to the light source support on the inside of the top portion of the glass sealed container that is opposite to the base. The light source support may have a hole through which the gas flow flowing through the opening can enter and exit.

  Further, the LED lamp may further include an additional heat radiator that is in a heat conduction relationship with the glass sealed container sandwiched between the heat transfer devices on the outer side of the top portion of the glass sealed container.

  ADVANTAGE OF THE INVENTION According to this invention, the LED lamp provided with the novel cooling and heat dissipation means can be provided.

FIG. 1 is a diagram showing an example of an LED lamp that is currently widely sold. FIG. 2 is a diagram illustrating the LED lamp according to the first embodiment of the present invention. FIG. 3 is a diagram illustrating two examples of the light source support and the mounting substrate of the LED lamp of FIG. FIG. 4 is a flowchart of the manufacturing method of the LED lamp shown in FIG. 2A, and a simple lamp diagram of the stage is shown on the right side of each step. FIG. 5 is a diagram for explaining the heat transfer device according to the third embodiment of the present invention and the additional heat radiator according to the fourth embodiment. FIG. 6 is a graph of measurement results of “LED element power—LED element temperature” in a prototype in which helium gas is used as the sealing gas in the LED lamp shown in FIG. 2A and copper is used as the light source support. . As a comparative example, measurement results using air instead of helium gas are shown.

  Hereinafter, embodiments of an LED lamp according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. In addition, it should be understood that the embodiments described below are examples and do not limit the scope of the present invention.

[First Embodiment]
(Configuration of LED lamp)
FIG. 2 is a diagram illustrating the LED lamp 10 according to the present embodiment. This LED lamp 10 is mainly intended for a high-power LED lamp of about 20 W instead of the low-power LED lamp of about 7 W currently widely advertised and sold as described in FIG. For this reason, cooling and heat dissipation means become a further important consideration.

  In the LED lamp 10 shown in FIG. 2A, a plurality of LED elements 18 are arranged inside an outer sphere 6 whose one end is hermetically sealed with a base 2. The plurality of LED elements 18 are mounted on the mounting substrate 16 at appropriate intervals, and the mounting substrate is fixed to the light source support 14.

  Further, the light source support 14 is positioned and supported at an appropriate location inside the outer sphere 6 by a column 20 extending from a stem 8 fixed to one end of the outer sphere 6. The portion of the column 20 adjacent to the light source support 14 is covered with an insulating tube 12 to ensure electrical insulation between the light source support 14 and the column 20. The light source support 14 and the mounting substrate 16 will be described later with reference to FIG.

  Further, a heat shielding member 24 is provided inside the outer sphere 6 near the base 2. As shown in FIG. 2B, the heat shielding member 24 is a generally disk-shaped member that conforms to the inner shape of the outer sphere 6, and openings 24 a, 24 b, 24 c through which the electric lead wires and the support columns 20 pass are formed. Has been. The heat shielding member 24 is formed of, for example, a ceramic, a metal plate, a mica plate, or the like. The function of the heat shielding member 24 will be described later in relation to the manufacturing method of FIG.

  A low molecular weight gas is sealed in the internal space 22 of the outer sphere 6. In the present application document, the “low molecular weight gas” is a gas having a large specific heat and good thermal conductivity, typically helium gas. Further, neon gas, hydrogen gas, or a mixed gas thereof may be used. In particular, since hydrogen gas has high reactivity, it may be a mixed gas of hydrogen gas and helium gas that suppresses this.

  A gas flow acceleration fan 32 may be provided below the light source support 14 as desired. The gas flow acceleration fan 32 may be provided above the light source support 14 or may be provided both below and above. The low molecular weight gas and the gas flow accelerating fan 32 will be described later with reference to FIG.

(Description of each component)
Each element of the LED lamp 10 shown in FIG.

  The base 2 may be a screw-in type or a plug-in type used in incandescent bulbs or HID lamps. The outer sphere 6 is a BT tube made of translucent hard glass such as borosilicate glass, for example. However, the shape of the outer sphere 6 is not limited to this, and may be any shape. The outer sphere 6 may be either a transparent type or a diffusion type (a type of frosted glass in which the inner surface of the outer sphere is processed into a satin finish). Similar to known incandescent bulbs and HID lamps, the space between the base 2 and the outer sphere 6 is hermetically sealed, and the space between the outer sphere and the outside is hermetically sealed.

  3A and 3B, two examples of the light source support 14 and the mounting substrate 16 are shown and described. The light source support 14 is made of a material having good heat conductivity, and is made of, for example, copper, aluminum, heat conductive resin, or the like. The heat conductive resin is obtained by mixing a metal powder / metal piece into the resin to increase the heat conduction coefficient.

  As shown in FIGS. 3A and 3B, the outer shape of the light source support 14 is a rod-like body, and through holes 15a and 15b are formed along the axial direction. The cross-sectional shape orthogonal to the axis of the light source support 14 shown in the figure is a quadrangle, but is not limited to this. However, in order to fix the mounting substrate 16 to the light source support 14 in a surface contact state, the cross-sectional shape is preferably a polygon. That is, it may be an arbitrary polygon such as a triangle, a pentagon,. In the case where the cross-sectional shape is circular, elliptical, or the like, it is preferable to provide an appropriate inclusion with good thermal conductivity between the light source support 14 and the mounting substrate 16.

  A circular through hole 15a along the axis may be formed in the square bar 14a having good heat conductivity to serve as a light source support (see FIG. 3A), and a square through hole 15b is formed in the square bar 14b. It is also possible (see FIG. 3B). Alternatively, instead of forming a through-hole in a square member, a plate-like body may be formed by bending it three times by 90 degrees and connecting both ends, and preparing a four-piece rectangular plate-like body, They may be connected to each other by an appropriate method to have a shape as shown in FIG.

  A mounting substrate 16 is fixed to the outer peripheral side surface of the light source support 14. If desired, a heat conductive sheet 21 may be interposed between the outer peripheral side surface of the light source support 14 and the mounting substrate 16. If the cross-sectional shape of the light source support 14 is an n-gon, the mounting substrate 16 is fixed to all of the n outer peripheral sides.

  A plurality of LED elements (for example, 18-1 to 18-4) are mounted on each mounting substrate 16. The mounting substrate 16 is made of a printed wiring board, and a necessary circuit pattern for supplying power to the LED element is formed. In order to enhance the heat dissipation / cooling effect of the LED element 18, it is preferable that the mounting substrate 16 has a relatively thin plate thickness, or is formed as a metal base substrate or a metal core substrate. In the technical field of printed wiring boards, the metal base substrate or the metal core substrate itself is a known technique. Whereas a normal printed wiring board has a copper circuit pattern formed on a glass epoxy resin core substrate, one side of the metal base substrate is a metal plate (copper, aluminum, etc.) and the other side Is covered with an insulating resin. The metal core substrate is formed with openings in the metal plate as desired, and the front and back surfaces and the inside of the openings are covered with an insulating resin. A circuit pattern is formed on the insulating resin layer of any substrate. Due to the good thermal conductivity of the metal, significant heat dissipation and cooling effects can be expected.

  The LED element 18 is mounted on the mounting substrate 16 by a known method such as soldering. The plurality of LED elements are all connected in series, and both ends thereof are connected to the base 2 via lead wires. The base 2 is screwed or inserted into a socket (not shown), and is connected to a predetermined voltage source (not shown) so that a predetermined voltage is applied to each LED element. When the gas flow acceleration fan 32 is used, it is driven by the same voltage source.

(LED lamp manufacturing method)
FIG. 4 is a flow of a manufacturing method of the LED lamp 10 shown in FIG. 2A, and a simple lamp diagram of the stage is shown on the right side of each step.

  In the mount assembling step of step S1, the LED element 18 is mounted on the mounting substrate 16, this is fixed to the light source support 14, the light source support is attached to the column 20, the mount is formed, and the stem 8 is attached to the lower end.

  In the sealing step of step S2, the mount is inserted into the outer sphere 6, and the stem 8 and the outer sphere 6 at the bottom of the mount are heated with a burner and sealed.

  In the exhaust stroke of step S3, the sealed outer sphere is once exhausted to a vacuum state through the exhaust pipe. Thereafter, low molecular weight gas is sealed and the chip is turned off (the exhaust pipe is melted and sealed with a burner).

  The top part and the side part of the base 2 are soldered in the base attaching step of step S4.

  The LED lamp 10 is completed through the lighting test and inspection in step S5.

  Here, in steps S2 to S4, the base, the outer sphere mounting portion, the stem and the like are heated to a high temperature close to 1000 ° C. by the burner. In order to prevent this heat from being transferred to the LED element inside the outer sphere and being damaged, a heat shielding member 24 (see FIG. 2B) is provided between the base mounting portion of the outer sphere and the LED element. Yes.

[Second Embodiment]
The second embodiment differs from the first embodiment in that a light source support / mounting substrate (14, 16) is employed. That is, in the first embodiment, the light source support 14 and the mounting substrate 16 are separate. Here, the mounting substrate 16 is preferably a metal base substrate or a metal core substrate. Therefore, the light source support 14 can be used as a metal member of the mounting substrate 16, and the light source support 14 can be a part of the mounting substrate 16.

  Although not shown, specifically, four rectangular metal base substrates or metal core substrates on which circuit patterns are formed are prepared in advance. The ends of the metal members are connected to each other by an appropriate method so as to form a gas flow path as a whole, and the light source support / mounting substrates (14, 16) are formed. If the cross-sectional shape is an n-gon, n mounting substrates are interconnected to form a light source support / mounting substrate (14, 16). The LED element 18 may be mounted on the light source support / mounting board either before or after the interconnection.

  Alternatively, a rod-shaped body (for example, copper, aluminum, or heat conductive resin) having a good thermal conductivity having a polygonal cross-sectional shape and a through hole formed in the axial direction is prepared. If desired, an opening may be provided on the side surface. An insulating layer is formed by an appropriate method on the outer peripheral surface of this rod-shaped body (and the inner peripheral surface of the opening if necessary), and a conductor layer is formed thereon by applying chemical copper plating, electrolytic copper plating, etc. The light source support and mounting substrate (14, 16) may be formed by patterning the conductor layer to form a circuit pattern. Thereafter, the LED element is soldered to a predetermined location.

  As described above, the light source support / mounting substrate (14, 16) can be realized.

[Third Embodiment]
The third embodiment is different from the first and second embodiments in that a heat transfer device is employed. That is, in the third embodiment, as shown in FIG. 5 (A), the cooling and heat dissipation performance is further improved by forming the heat transfer device 28 inside the outer sphere.

  Specifically, a heat conductive resin is poured into the outer sphere and cured to form the heat transfer device 28. As described in the lamp manufacturing method, the vicinity of the base 2 of the outer sphere 6 is heated and exposed to a high temperature, but the outer sphere top portion is not exposed to such heat. Therefore, the pre-formed heat transfer device 28 is not affected by heat in the subsequent manufacturing process.

  In the trial production stage, the heat transfer device 28 was made using a heat conductive resin in which carbon fiber was mixed into silicon. However, other heat conductive resins (resins mixed with metal powder / metal pieces) may be used. The end of the light source support 14 is directly fixed to the heat exchanger 28. In this case, in order to ensure the flow of the gas flowing through the through holes 15a and 15b of the light source support 14, for example, a cutout, a hole or the like is provided at the end of the light source support, or the end is formed of a plurality of leg portions. Or an opening (not shown) through which the gas flow flowing through the through hole can enter and exit is formed. By directly fixing the end portion of the light source support 14 to the heat transfer device 28, the heat generated by the LED element is thermally transferred from the light source support 14 to the heat transfer device 28 with high efficiency, thereby improving the cooling and heat dissipation effect. To do.

[Fourth Embodiment]
The fourth embodiment differs from the third embodiment in that the adoption of the additional radiator 30 is adopted. As shown in FIG. 4 (B), an additional radiator 30 is formed outside the outer sphere in the fourth embodiment with respect to the heat exchanger 28 of the third embodiment. The additional heat radiator 30 is formed so as to match the outer shape of the outer sphere top portion, and is press-fitted into the outer sphere top portion or fixed with an appropriate adhesive.

  Since the heat exchanger 28 in the outer sphere and the additional heat radiator 30 outside the outer sphere are in a thermal conduction relationship through the glass of the outer sphere, the heat of the heat exchanger 28 is efficient through the additional heat radiator 30. It will be well released to the open air.

[Advantages and effects of this embodiment]
(Cooling and heat dissipation effect)
(1) The LED lamp 10 shown in FIG. 2A will be described from the viewpoint of cooling and heat dissipation. The LED element 18 which is a heat source is mounted on a thin printed wiring board or a metal base substrate or metal core substrate 16 having a good thermal conductivity if desired. The mounting substrate 16 is fixed to the light source support 14 with good thermal conductivity in a surface contact state. For this reason, the heat generated by the LED element is thermally conducted to the light source support 14 through the mounting substrate 16 with high efficiency.

  Since the through hole 15 is formed in the light source support 14 in the axial direction, the hot gas inside the through hole 15 moves upward through the through hole and is emitted from the light source support 14. Instead, the through hole New cold gas flows from below 15. For this reason, the circulation of the gas flow as shown by the arrow 23 in FIG. (Note that when the lamp 10 is turned upside down and the base 2 is turned down, the gas flow circulation is in the opposite direction to the arrow 23.) The inner peripheral surface of the hole 15, the mounting substrate 16, and the LED element 18 are cooled and radiated by the circulating gas flow 23. That is, the light source support 14 functions as a support for the LED element 18, a heat-generating conductor for the LED element, and a circulation gas flow path forming body.

  Since the outer sphere 6 is filled with a low molecular weight gas such as helium, the thermal conductivity is high, and the heat of the LED element 18, the light source support 14, etc. is highly efficient by the circulating gas flow 23 inside the outer sphere. Cooling and heat dissipation. Since the periphery of the outer sphere 6 is exposed to the outside air, the heat of the circulating gas flow 23 is finally radiated toward the outside air.

  FIG. 6 shows the “LED element power—in a prototype in which helium gas is used as the sealing gas in the LED lamp according to the first embodiment shown in FIG. 2A and the LED element 18 is attached to the light source support 14 made of copper. It is a graph of a measurement result of “LED element temperature” (● (black circle) in the figure). As a comparative example, the measurement results using air instead of helium gas are shown (▲ (black triangle) in the figure). From the graph, comparing the two at a typical power of 20 W, the LED element temperature when using air is about 128 ° C., whereas the LED element temperature when using helium gas is about 108 ° C. Stay on. Therefore, the cooling and heat dissipation effect by helium gas appears as a temperature drop of about 20 ° C. compared to air.

  Here, assuming that the ambient temperature is 20 ° C., the heat generation of the LED element when air is used is a difference (128−20 =) 108 ° C. from the ambient temperature and the LED element when helium gas is used. The exothermic component is (108-20 =) 88 ° C. The ratio of both becomes 88/108 = 81%, and by using helium gas instead of air, the temperature of the LED element can be suppressed by 19% as a cooling / heat dissipation effect.

  Due to the temperature drop of about 20 ° C., the lifetime of the LED element can be extended. Alternatively, when the lifetime of the LED element is set to the same level, a temperature increase of 20 ° C. is allowed, and the output can be further increased. Referring to FIG. 6, when the LED element temperature is 100 ° C., it is allowed to arrange the LED elements in the lamp up to 14 W when air is used and up to 18 W when helium gas is used. When each LED element is 1 W, when air is used, only up to 14 LED elements can be sealed, but by using helium gas, up to 18 LED elements can be sealed. Thereby, a brighter LED lamp can be realized.

  (2) The efficiency of heat conduction from the LED element 18 can be improved by forming the heat exchanger 28 inside the outer sphere and fixing and connecting the light source support 14.

  (3) The efficiency of heat conduction from the heat transfer device 28 can be improved by forming the additional heat radiator 30 outside the outer ball and making the heat transfer relationship with the heat transfer device 28 in the outer ball.

(Other effects)
(A) The space between the base 2 and the outer sphere 6 is hermetically sealed, and the space between the inside and outside of the outer sphere is airtight. Therefore, moisture, moisture from outside the outer sphere, corrosive gas in a chemical factory, etc. do not enter the outer sphere. Therefore, the LED element 18, related circuit patterns, and other components are not corroded.

  (B) Since the inside of the outer sphere is filled with a low molecular weight gas, oxygen does not exist, and the LED element 18, related circuit patterns, and other components are not oxidized or corroded.

  (C) Forming the space between the base 2 and the outer sphere 6 in an airtight sealed structure can utilize the manufacturing technology cultivated by the present applicant for many years of incandescent bulbs, HID lamps and the like.

  (D) When the lamp 10 is used outdoors, the resin globe 106 as shown in FIG. 1 deteriorates due to ultraviolet rays, and is discolored or cracked. However, since the LED lamp according to the present embodiment uses hard glass for the outer sphere, there is no deterioration due to ultraviolet rays, and it can withstand long-term use outdoors.

  (E) When the lamp is used near the coast, the aluminum die cast 104 as shown in FIG. 1 is discolored and corroded due to salt damage. Therefore, it is necessary to cope with surface treatment such as painting. However, the hard glass of the outer bulb of the LED lamp according to the present embodiment is not affected by salt damage and can withstand long-term use near the coast.

[Summary]
As mentioned above, although it demonstrated about embodiment of the LED lamp which concerns on this invention, these are illustrations and do not limit this invention. Additions, deletions, modifications, improvements, and the like to the embodiments that can be easily made by those skilled in the art are within the scope of the present invention. The technical scope of the present invention is defined by the description of the appended claims.

  2: base, 6: outer bulb, 8: stem, 10: LED lamp, 12: insulating tube, 14: light source support, (14, 16): light source support / mounting board, 15a, 15b: through-hole, 16: mounting board, 18, 18-1, 18-2, 18-3, 18-4: LED element, 20: support, 21: heat conduction sheet, 22: internal space, 24: heat shielding member, 28: transmission 30: additional radiator, 32: fan for gas flow acceleration, 100: LED lamp, 102: base, 104: heat radiation part, aluminum die cast part, 106: globe,

Claims (10)

A plurality of LED elements;
A glass sealed container surrounding the LED element;
A low molecular weight gas is sealed inside the glass sealed container,
Furthermore, it comprises a rod-shaped light source support having a through hole along the axial direction,
The plurality of LED elements are fixed to a side surface of the light source support,
The light source support is positioned and supported along the lamp axis in the internal space of the glass sealed container by a column extending from an end of the glass sealed container.
The light source support is composed of a member having good thermal conductivity including at least aluminum, copper, or a heat conductive resin,
The through hole of the light source support is an LED lamp that forms a gas flow path through which the low molecular weight gas flows. The LED lamp according to claim 1, wherein
The low molecular weight gas may be any one of helium gas, hydrogen gas, neon gas, or a mixed gas of any combination thereof. The LED lamp according to claim 1 or 2,
An LED lamp, wherein a base is formed at an end of the glass sealed container, and an airtight state is maintained between the inside and the outside of the container. In the LED lamp as described in any one of Claims 1-3,
The light source support has a polygonal cross-sectional shape, and the plurality of LED elements are fixed to each side surface of the light source support. In the LED lamp as described in any one of Claims 1-4, Furthermore,
The LED lamp provided with the gas flow acceleration fan in the vicinity of the upper end of the through-hole of the said light source support body, a lower end, or both. In the LED lamp as described in any one of Claims 1-5,
An LED lamp in which a mounting substrate on which the plurality of LEDs are mounted is fixed to the light source support. The LED lamp according to claim 6,
The mounting substrate is an LED lamp, which is a metal base substrate or a metal core substrate. In the LED lamp as described in any one of Claims 1-7,
The light source support is generated from a plurality of rectangular substrates, and the substrates are interconnected at side ends so as to form a gas flow path as a whole,
The plurality of LED elements are LED lamps mounted on outer surfaces of the plurality of rectangular substrates, respectively. The LED lamp according to any one of claims 1 to 8, further comprising:
A heat exchanger made of a heat conductive resin fixed to the light source support is provided on the inner side of the top portion of the glass sealed container, which is opposite to the base formed at the end of the glass sealed container. ,
The LED lamp, wherein the light source support is formed with an opening through which the gas flowing through the through hole can enter and exit. The LED lamp according to claim 9, further comprising:
The LED lamp which is provided with the additional thermal radiator which has a heat conduction relation on the outside of the top part of the glass sealed container with the glass sealed container sandwiched between the heat exchangers.

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