WO2015190235A1 - Adhesive tape, article, motor, and method for producing article - Google Patents

Adhesive tape, article, motor, and method for producing article Download PDF

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Publication number
WO2015190235A1
WO2015190235A1 PCT/JP2015/064267 JP2015064267W WO2015190235A1 WO 2015190235 A1 WO2015190235 A1 WO 2015190235A1 JP 2015064267 W JP2015064267 W JP 2015064267W WO 2015190235 A1 WO2015190235 A1 WO 2015190235A1
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WO
WIPO (PCT)
Prior art keywords
adhesive layer
adhesive
adhesive tape
layer
thickness
Prior art date
Application number
PCT/JP2015/064267
Other languages
French (fr)
Japanese (ja)
Inventor
誠二 秋山
森野　彰規
Original Assignee
Dic株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dic株式会社 filed Critical Dic株式会社
Priority to JP2016524615A priority Critical patent/JP6041178B2/en
Priority to CN201580028500.9A priority patent/CN106459679B/en
Publication of WO2015190235A1 publication Critical patent/WO2015190235A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets

Definitions

  • the present invention relates to an adhesive tape having a configuration in which a volume is expanded by applying a stimulus such as heating.
  • the adhesive tape can be suitably used for fixing two or more adherends, it is widely used in the production scenes of various products such as automobiles and electric devices.
  • the adhesive tape is required to be used when, for example, the other adherend is fixed in the gap of one adherend.
  • a motor mounted on a hybrid vehicle or the like a motor having a configuration in which a gap is generally provided at a predetermined position of a core (rotor core) and a magnet is embedded in the gap is known. Yes.
  • the use of an adhesive tape is being studied when fixing the magnet in the gap of the core portion.
  • the adhesive tape that can be used in the above application is formed on the first surface of the base material having a first surface and a second surface on the opposite side of the first surface and having a communication port, for example.
  • a first adhesive layer containing a thermosetting thermally expandable epoxy adhesive, and the thermosetting thermally expandable epoxy adhesive passes through the communication port of the substrate when heated, and
  • a thermosetting thermally expandable adhesive sheet that forms a second adhesive layer on the second surface is known (see, for example, Patent Document 1).
  • thermosetting thermally expandable adhesive sheet Since it is considered that the first adhesive layer constituting the thermosetting thermally expandable adhesive sheet is previously attached to an adherend such as a magnet, it has a good adhesive force even after the thermal expansion. It can be maintained.
  • fine irregularities may be formed on the surface of the second adhesive layer due to the thermal expansion.
  • the second adhesive layer having the surface on which the fine irregularities are formed cannot exhibit a sufficient adhesive force to the adherend.
  • the problem to be solved by the present invention is to provide an adhesive tape that can maintain excellent adhesive strength even after the expansion, among adhesive tapes that can expand by stimulation such as heating.
  • the inventors of the present invention provide an adhesive tape having an adhesive layer (B) on one side of the adhesive layer (A) directly or via another layer, and the adhesive tape is placed in an environment at 130 ° C.
  • Expansion rate in the thickness direction of the adhesive layer (A) after being left for a time [thickness of the adhesive layer (A) after being left / thickness of the adhesive layer (A) before being left] ⁇ 100 is 200% or more, and the expansion rate in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the adhesive layer (B) before being left)
  • the above problem can be solved by an adhesive tape characterized in that the [thickness] ⁇ 100 is 120% or less.
  • the adhesive tape of the present invention can maintain an excellent adhesive strength even after being expanded, it can be used for fixing two or more adherends, and in addition, the other adherend can be placed in the gap of one adherend. It can be suitably used for applications such as fixing the adherend and filling the voids of the adherend with the adhesive tape.
  • the adhesive tape of the present invention can follow the fine irregularities due to the expansion even when the adherend has minute irregularities and gaps, and as a result, exhibits excellent adhesive strength. Can do.
  • the adhesive tape of the present invention can expand or fix other adherends at predetermined positions in the voids of the adherends by expanding, the production efficiency of final products including motors can be increased. Can be improved.
  • the adhesive tape of the present invention is less likely to cause variations in the adhesive strength even when the expansion coefficient is appropriately changed.
  • the adhesive tape of the present invention is an adhesive tape having an adhesive layer (B) on one side of the adhesive layer (A) directly or via another layer, and the adhesive tape is placed in an environment of 130 ° C.
  • Expansion coefficient in the thickness direction of the adhesive layer (A) after being left for 1 hour [thickness of the adhesive layer (A) after being left / thickness of the adhesive layer (A) before being left] X100 is 200% or more, and the expansion coefficient in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the adhesive layer (B) before being left) The thickness] ⁇ 100 is 120% or less.
  • the adhesive layer (A) constituting the adhesive tape is a layer that can be expanded by applying a stimulus such as heat or light.
  • the expansion rate in the thickness direction of the adhesive layer (A) [the adhesive layer after being left ( Thickness of A) / thickness of adhesive layer (A) before leaving] ⁇ 100 is 200% or more.
  • the expansion coefficient is preferably 250% or more, and more preferably 250% to 1000%. If the adhesive tape has the adhesive layer (A) having the expansion coefficient, for example, even when the height (thickness) of the gap of one adherend is large, the other adherend is placed in the gap.
  • the body can be suitably fixed, or the space can be filled with the adhesive tape.
  • the expansion coefficient indicates that the adhesive layer (A) after being left with respect to the thickness of the adhesive layer (A) before being left standing when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of thickness ((thickness of the adhesive layer (A ′) formed by expansion). Specifically, the expansion coefficient refers to a value calculated by the following method.
  • the thickness of the adhesive layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
  • the adhesive tape after being left standing is taken out in an environment of 23 ° C., and the thickness of the adhesive layer (A ′) formed by immediately expanding the adhesive layer (A) is measured.
  • the expansion coefficient is calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (A) constituting the adhesive tape after standing] [The thickness of the adhesive layer (A ') formed by swelling] / of the adhesive layer (A) constituting the adhesive tape before standing Thickness] ⁇ 100
  • the adhesive layer (A) is previously attached to the adherend before the expansion. preferable. preferable.
  • the thickness of the adhesive layer (A) constituting the adhesive tape is preferably 1 ⁇ m or more, more preferably in the range of 10 ⁇ m to 250 ⁇ m, further preferably in the range of 20 ⁇ m to 150 ⁇ m, and 30 ⁇ m. A range of ⁇ 70 ⁇ m is particularly preferable in order to obtain a further excellent adhesive strength.
  • the thickness of the adhesive layer (A ′) formed by expanding the adhesive layer (A) is preferably in the range of 20 ⁇ m to 2500 ⁇ m, and preferably in the range of 40 ⁇ m to 1500 ⁇ m. It is preferable for obtaining even better adhesive strength.
  • the adhesive layer (A ′) preferably has a porous structure.
  • the thickness of the said adhesive bond layer (A) is 10% or more with respect to the total thickness of the said adhesive tape, and what is 30% or more It is more preferable to use it because, for example, it is easy to fix the other adherend in the gap of one adherend or to fill the gap with the adhesive tape.
  • the adhesive layer (A) As the adhesive layer (A), as described above, a layer that can be expanded by applying a stimulus such as heat or light can be used. Specifically, a layer containing various resins and an expansion agent is used. be able to.
  • the adhesive layer (A) can be formed, for example, by applying an adhesive composition (a) containing the resin and an expanding agent to a release liner or the like and drying it.
  • the adhesive composition (a) that can be used for forming the adhesive layer (A), as described above a composition containing a resin, an expansion agent, and a solvent as necessary can be used.
  • an epoxy resin, a urethane resin, a silicone resin, a phenol resin, a urea resin, a fluororesin, an acrylonitrile resin, an acrylic resin, a styrene resin, a vinyl resin such as a butadiene resin, or the like is used alone or in combination of two or more. be able to.
  • thermosetting resin As the resin, it is preferable to use an epoxy resin, which has excellent heat resistance after expansion, and the expanded adhesive layer (A ′) is remarkably over time. It is more preferable for obtaining an adhesive tape capable of preventing shrinkage.
  • the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hindered-in type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, triphenylmethane type epoxy resin, and phenol novolac.
  • Type epoxy resin, cresol novolak type epoxy resin, naphthol novolak type epoxy resin, dicyclopentadiene / phenol epoxy resin, alicyclic amine epoxy resin, aliphatic amine epoxy resin, and CTBN modification (carboxy-terminated butadiene nitrile modification) Halogen-modified epoxy resins or the like can be used alone or in combination of two or more, and the use of a cresol novolac type epoxy resin can be caused by the stimulation. Expansion easy, and preferable because it can hold the adhesive strength is excellent even after expansion.
  • thermosetting resin such as the epoxy resin is preferably contained in an amount of 10% by mass to 99% by mass with respect to the entire adhesive layer (A).
  • the adhesive composition (a) it is preferable to use an adhesive composition containing an expansion agent in forming the adhesive layer (A) that can expand by the stimulus.
  • the expansion agent is preferably one that can form a porous structure as the adhesive layer (A ′) after expansion, such as ammonium carbonate, ammonium hydrogen carbonate, ammonium nitrite, ammonium borohydride, azide, and the like.
  • Inorganic compounds fluorinated alkanes such as trichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, hydrazine compounds such as paratoluenesulfonyl hydrazide, semicarbazide compounds such as p-toluenesulfonyl semicarbazide, 5-morpholyl-1,2 Triazole compounds such as 1,3,4-thiatriazole and N-nitroso compounds such as N, N′-dinitrosotephthalamide can be used.
  • azo compounds such as azobisisobutyronitrile
  • hydrazine compounds such as paratoluenesulfonyl hydrazide
  • semicarbazide compounds such as p-toluenesulfonyl semicarbazide
  • 5-morpholyl-1,2 Triazole compounds such as 1,3,4-thiatriazole and N-nitroso compounds such as N
  • an expandable capsule such as a thermally expandable capsule in which a hydrocarbon solvent is microencapsulated can be used.
  • the expansion agent it is preferable to use a material capable of generating gas and expanding at a temperature around the softening point of the resin.
  • expansion agent use of a thermally expandable capsule in which a hydrocarbon solvent is microencapsulated among the above is used, for example, to inhibit the curing of the epoxy resin, or to form an adhesive layer (A ) Is preferable for preventing deterioration and the like.
  • thermally expandable capsule it is preferable to use a capsule having a volume after expansion (volume expansion coefficient) of 8 to 60 times with respect to the volume of the capsule before expansion.
  • thermal expandable capsule examples include EXPANSEL (manufactured by Nippon Philite Co., Ltd.), Matsumoto Microsphere (manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), and Microsphere (manufactured by Kureha Co., Ltd.).
  • the amount of the expansion agent used is preferably in the range of 0.3% by mass to 40% by mass with respect to the total amount of the adhesive layer (A). More preferably, the content is in the range of 0.0% by mass to 30% by mass, and the range of 3.0% by mass to 20% by mass expands to a sufficient volume for filling the voids of the adherend. It is preferable for obtaining an adhesive tape that can be maintained and can maintain an even better adhesive strength.
  • the adhesive composition (a) those containing a curing agent, a curing accelerator and the like can be used as necessary in addition to the above-described ones.
  • curing agent examples include bisphenol A, bisphenol F, bisphenol AD, hydroquinone, resorcin, methyl resorcin, biphenol, tetramethylbiphenol, dihydroxynaphthalene, dihydroxydiphenyl ether, phenol novolac resin, bisphenol A novolac resin, dicyclopentadiene phenol resin.
  • phenol resins such as terpene phenol resin, naphthol novolac resin, biphenyl phenol resin, polyhydric phenol resins obtained by condensation reaction of various phenols with various aldehydes such as hydroxybenzaldehyde, crotonaldehyde, glyoxal, And modified phenols obtained by polycondensation of heavy oil or pitch, phenol and formaldehyde compounds
  • phenolic resins such as methyl resin, acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride and methylnadic acid, amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and dicyandiamide Etc.
  • amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, dia
  • curing accelerator examples include imidazoles such as 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole; 1,8-diazabicyclo [5.4.0] undecene-7, triethylenediamine, benzyl Tertiary amines such as dimethylamine; organic phosphines such as tributylphosphine and triphenylphosphine can be used alone or in combination of two or more.
  • imidazoles such as 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole
  • 1,8-diazabicyclo [5.4.0] undecene-7 triethylenediamine
  • benzyl Tertiary amines such as dimethylamine
  • organic phosphines such as tributylphosphine and triphenylphosphine can be used alone or in combination of two or more.
  • the adhesive tape one having an adhesive layer (B) on one side of the adhesive layer (A) is used.
  • the adhesive layer (B) may be directly laminated on one surface side of the adhesive layer (A), or may be laminated via another layer such as a so-called base material. .
  • the expansion rate in the thickness direction of the adhesive layer (B) [the adhesive layer after being left ( B) thickness / thickness of adhesive layer (B) before standing] ⁇ 100 is 120% or less.
  • the expansion rate of the adhesive layer (B) is preferably 115% or less, and more preferably 100% to 115%.
  • the adhesive tape has the adhesive layer (B) having the expansion coefficient, it is possible to maintain excellent adhesive strength to the adherend even after the adhesive layer (A) has expanded.
  • the expansion rate of the adhesive layer (B) is such that, when the adhesive tape is left in an environment of 130 ° C. for 1 hour, the thickness of the adhesive layer (B) before being left is not changed. It refers to the ratio of the thickness of the adhesive layer.
  • the expansion rate of the adhesive layer (B) is the ratio of the adhesive layer (B) after being left with respect to the thickness of the adhesive layer (B) before being left when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of the thickness of the adhesive layer (B ′).
  • the expansion coefficient indicates a value calculated by the following method.
  • the thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
  • the adhesive tape after being left is taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) is immediately measured.
  • the expansion coefficient is calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] ⁇ 100
  • the thickness of the adhesive layer (B) is preferably in the range of 5 ⁇ m to 150 ⁇ m, and more preferably in the range of 10 ⁇ m to 100 ⁇ m, in order to express even better adhesive strength.
  • the thickness of the adhesive layer (B ′) after being left for 1 hour in the environment of 130 ° C. varies within the above expansion coefficient range as compared with the thickness of the adhesive layer (B) before being left standing. May be.
  • the thickness of the adhesive layer (B ′) is preferably in the range of 1 ⁇ m to 150 ⁇ m, and more preferably in the range of 5 ⁇ m to 100 ⁇ m, in order to express even better adhesive strength.
  • examples of the adhesive layer (B) include a layer having tackiness or adhesiveness, and examples thereof include a thermosetting adhesive layer and a pressure-sensitive adhesive layer.
  • the adhesive layer (B) can be formed using, for example, an adhesive composition (b) capable of forming a sticky or adhesive layer.
  • the adhesive composition (b) for example, an adhesive resin and, if necessary, a hardener can be used.
  • the adhesive bond layer (B) formed using the said adhesive composition (b) has a low expansion coefficient as above-mentioned, it can be used when forming the said adhesive bond layer (A). It is preferable that the swelling agent illustrated as a thing does not contain substantially.
  • the adhesive resin that can be used for the adhesive composition (b) a conventionally known resin can be selected and used.
  • a thermosetting resin or a pressure-sensitive adhesive resin can be used.
  • said adhesive resin when improving the production efficiency of the adhesive tape of this invention, it illustrates as adhesive resin (a) containing resin which can be used for formation of the said adhesive bond layer (A), for example The same ones can be used.
  • the adhesive resin even after the adhesive layer (A) is expanded, it can maintain excellent adhesive strength to the adherend, and particularly has excellent adhesive strength regardless of the influence of heat.
  • a thermosetting resin is preferably used, and an epoxy resin is more preferably used.
  • the epoxy resin it is possible to use the same resin as exemplified for the adhesive composition (a), even after the adhesive layer (A) is expanded. It is preferable for obtaining an adhesive tape having an adhesive layer (B) that can maintain excellent adhesive strength with respect to the adherend and can maintain excellent adhesive strength regardless of the influence of heat.
  • the adhesive composition (b) in addition to those described above, those containing a curing agent, a curing accelerator and the like can be used as necessary.
  • curing agent and hardening accelerator the thing similar to what was illustrated as a hardening
  • a coupling agent in addition to those described above, a coupling agent, a tackifier, an antifoaming agent, a pigment, an antioxidant, a core-shell type reinforcing agent, a thixotropic agent, You may use what contains a heat conductive filler, an insulating filler, etc.
  • the adhesive tape of the present invention for example, the step [1] of forming the adhesive layer (A) by applying the adhesive composition (a) to a release liner and drying it, separately from the step [1], Step [2] of forming the adhesive layer (B) by applying the adhesive composition (b) to a release liner and drying, etc., and the adhesive layer on one side of the adhesive layer (A) It can manufacture by passing (B) and passing through the process [3] of crimping them.
  • the adhesive layer (A) may be partially cured in the process of manufacturing the adhesive tape, but is preferably not substantially expanded or cured.
  • a part of the adhesive layer (B) may also be cured in the process of producing the adhesive tape, but it is preferable that the adhesive layer (B) is not substantially cured.
  • the adhesive tape of the present invention if necessary, a tape having a resin film layer or a metal layer (Z) between the adhesive layer (A) and the adhesive layer (B) is used. Can do. Since such an adhesive tape has good rigidity, it is excellent in sticking workability.
  • the layer (Z) examples include a resin film layer formed using a plastic film such as a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyimide film, and a polyethylene terephthalate film, and a metal such as aluminum and copper. Layer.
  • a plastic film such as a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyimide film, and a polyethylene terephthalate film, and a metal such as aluminum and copper.
  • the layer (Z) it is preferable to use a layer having a thickness of 1 ⁇ m to 200 ⁇ m, and it is more preferable to use a layer having a thickness of 12 ⁇ m to 50 ⁇ m.
  • the adhesive tape of the present invention can be expanded by applying a stimulus to the adhesive layer (A) or the entire adhesive tape.
  • a stimulus include heat and light as described above.
  • Examples of the method for giving the stimulus include methods such as heating and light irradiation, and it is preferable to employ a heating method.
  • the heating temperature is preferably a temperature corresponding to, for example, a temperature at which the expansion agent expands (expansion start temperature), specifically 80 ° C. to 300 ° C., preferably 100 ° C. to 200 ° C. Preferably there is.
  • the adhesive tape of the present invention expands in the thickness direction after the stimulus such as heating is given.
  • the adhesive tape of the present invention does not substantially expand in the flow direction or the width direction after the stimulation such as heating is given.
  • one adherend and the adhesive layer (A) constituting the adhesive tape are pasted in advance.
  • the adhesive layer (B) and another adherend are brought into contact with each other by placing the product obtained in a predetermined position and causing the adhesive layer (A) to stimulate and expand at least the adhesive layer (A).
  • attach is mentioned.
  • the said stimulus may be given to the said adhesive bond layer (A) which comprises the said adhesive tape, and may be given to the said adhesive tape whole.
  • the adhesive tape of the present invention includes, for example, a part (c1-1) constituting the adherend (C1), another part (c1-2) constituting the adherend (C1), or another adherend ( It can be suitably used for the manufacture of an article having a configuration in which C2) is bonded.
  • the article includes a step [1] of previously bonding the adhesive layer (A) constituting the adhesive tape and a portion (c1-1) constituting the adherend (C1), and at least the adhesive By stimulating and expanding the layer (A), the adhesive layer (B) constituting the adhesive tape and the part (c1-2) constituting the adherend (C1) or the adherend (C2) ) And the process [2] for bonding.
  • Examples of the article include a motor mounted on a hybrid vehicle.
  • an adhesive layer (A) that constitutes the adhesive tape and a part of a part such as a magnet are preliminarily bonded to a gap included in a core member that constitutes the motor. After placing, it can be produced by stimulating and expanding at least the adhesive layer (A).
  • the adhesive tape can be used for the purpose of filling the voids of the adherend.
  • at least the adhesive layer A Can be used to form a structure in which two or more locations in the gap are bonded by the adhesive tape.
  • EXPANSEL 051-40 manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 110 ° C., 3.2 parts by mass of a volume expansion coefficient at 130 ° C. of 7 times
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator
  • EXPANSEL 051-40 manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 110 ° C., 3.2 parts by mass of a volume expansion coefficient at 130 ° C. of 7 times
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator
  • Example 1 The thickness of the adhesive composition (a-1) after drying on the surface of a release film obtained by peeling one side of a 75 ⁇ m thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator The adhesive layer (A-1) was prepared by applying the coating solution so that the thickness of the adhesive layer became 50 ⁇ m and drying it with a dryer set at 75 ° C. for 10 minutes.
  • the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator.
  • the adhesive layer (B-1) was prepared by applying the coating to a thickness of 100 ⁇ m and drying for 10 minutes with a dryer set at 75 ° C.
  • the adhesive layer (B-1) is attached to the adhesive layer (A-1) obtained above, and the adhesive layer is moved back and forth once using a 2 kg hand roller. An adhesive tape in which the adhesive layer (B-1) was laminated on one side of (A-1) was obtained.
  • Example 2 Except that the adhesive composition (a-2) was used in place of the adhesive composition (a-1) and the adhesive layer (A-2) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
  • Example 3 Except that the adhesive composition (a-3) was used in place of the adhesive composition (a-1) and an adhesive layer (A-3) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
  • Example 4 Except that the adhesive composition (a-4) was used in place of the adhesive composition (a-1) and the adhesive layer (A-4) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
  • Example 5 An adhesive layer (A-5) is formed by using the adhesive composition (a-5) instead of the adhesive composition (a-1), and the adhesive composition (b- An adhesive tape was produced in the same manner as in Example 1 except that the adhesive composition (b-2) was used instead of 1) to form the adhesive layer (B-2).
  • Example 6 The thickness of the adhesive composition (a-1) after drying on the surface of a release film obtained by peeling one side of a 75 ⁇ m thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator
  • the layer (A-1) was prepared by coating the film so as to be 50 ⁇ m and drying it with a dryer set at 75 ° C. for 10 minutes.
  • the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator.
  • the adhesive layer (B-1) was prepared by applying the coating to a thickness of 50 ⁇ m and drying for 10 minutes with a dryer set at 75 ° C.
  • the adhesive layer (B-1) is affixed to the polyethylene terephthalate film, and the adhesive layer (A- An adhesive tape in which a polyethylene terephthalate film was laminated on one side of 1) and an adhesive layer (B-1) was laminated on the surface was obtained.
  • the adhesive tape was expanded by leaving it in an environment of 130 ° C. for 1 hour.
  • the thickness of the expanded adhesive tape and the thickness of the adhesive layer constituting it were measured using a thickness meter.
  • the expansion coefficient of the pressure-sensitive adhesive layer (A) was calculated by the following method.
  • the thickness of the adhesive layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after the standing was taken out in a 23 ° C. environment, and the thickness of the adhesive layer (A ′) formed by immediately expanding the adhesive layer (A) was measured.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (A) constituting the adhesive tape after standing] [The thickness of the adhesive layer (A ') formed by swelling] / of the adhesive layer (A) constituting the adhesive tape before standing Thickness] ⁇ 100
  • the expansion coefficient of the pressure-sensitive adhesive layer (B) was calculated by the following method.
  • the thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after the standing was taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) was immediately measured.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] ⁇ 100 The expansion coefficient of the adhesive tape was calculated by the following method.
  • the thickness of the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after standing was taken out in a 23 ° C. environment and immediately measured for its thickness.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [Thickness of the adhesive tape after being left / thickness of the adhesive tape before being left] ⁇ 100
  • the above fixed one was heated at 130 ° C. for 1 hour and then left to stand in a 23 ° C. environment for 30 minutes to cool.
  • the sample with the clip removed is used as a test piece, the ends of the two aluminum plates are chucked, and a tensile test is performed in a 180 ° direction at a tensile speed of 5 mm / min.
  • the adhesive strength of the adhesive tape was determined.
  • the other aluminum plate (C2) (2 in FIG. 1) was placed on the spacer and fixed with a clip. This was heated at 130 ° C. for 1 hour, and the adhesive tape was expanded to thermally bond the two aluminum plates.
  • the adhesive strength of the material from which the clip was removed was chucked at each end of the aluminum plate using a tensile tester, and the direction of 180 ° It was measured by carrying out a tensile test at a tensile speed of 5 mm / min (in the shear direction).
  • the shear adhesive strength 2 was evaluated is preferably approximately 120 N / cm 2 or more, and more preferably 300N / cm 2 or more, and still more preferably 450 N / cm 2 or more.
  • the surface corresponding to the expandable adhesive layer (A) constituting the adhesive tape is attached to the upper surface (C1-1) of the aluminum plate.
  • the above test was conducted. Further, the above-mentioned test was performed on the adhesive tape obtained in Comparative Example 2 so that the surface corresponding to the adhesive layer (B) was attached to one surface (C1-1) of the aluminum plate.
  • the surface corresponding to the adhesive layer (B) constituting the adhesive tape obtained in Examples 1 to 5 is previously pasted on the upper surface (C1-1) of the aluminum plate.
  • the adhesive layer (A) that can expand by stimulation is the same as the above [Method for measuring shearing adhesive force 2] except that it is arranged so as to come into contact with the aluminum plate (C2) after expansion. Shear adhesion was measured.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Permanent Field Magnets Of Synchronous Machinery (AREA)

Abstract

The present invention addresses the problem of providing an adhesive tape capable of expansion due to stimulation such as heating, said adhesive tape exhibiting excellent adhesive strength even after expansion. The present invention relates to an adhesive tape having an adhesive layer (B) on one surface of an adhesive layer (A), said adhesive layer (B) being in direct contact with the adhesive layer (A) or having another layer interposed therebetween, wherein the adhesive tape is characterized in that, after being left to stand in a 130 °C environment for one hour, the expansion ratio (thickness of the adhesive layer (A) after being left to stand/thickness of the adhesive layer (A) before being left to stand) in the thickness direction of the adhesive layer (A) multiplied by 100 is 200% or more, and the expansion ratio (thickness of the adhesive layer (B) after being left to stand/thickness of the adhesive layer (B) before being left to stand) in the thickness direction of the adhesive layer (B) multiplied by 100 is 120% or less.

Description

接着テープ、物品、モーター及び物品の製造方法Adhesive tape, article, motor and method for producing article
　本発明は、加熱等の刺激を与えることによって体積を膨張させる構成を備えた接着テープに関するものに関する。 The present invention relates to an adhesive tape having a configuration in which a volume is expanded by applying a stimulus such as heating.
　前記接着テープは、２以上の被着体を固定する際に好適に使用できることから、例えば自動車や電気機器等の様々な製品の製造場面で広く使用されている。 Since the adhesive tape can be suitably used for fixing two or more adherends, it is widely used in the production scenes of various products such as automobiles and electric devices.
　一方、接着テープの使用範囲がさらに拡大するなかで、前記接着テープとしては、例えば一方の被着体が有する空隙に、他方の被着体を固定する際に使用できることが求められている。具体的には、ハイブリッド自動車等に搭載されるモーターとしては、一般に、コア部（ローターコア）の所定の位置に空隙が設けられ、その空隙に磁石が埋め込まれた構成を有するものが知られている。前記コア部が有する空隙に前記磁石を固定する際、接着テープを使用することが検討されている。 On the other hand, as the range of use of the adhesive tape further expands, the adhesive tape is required to be used when, for example, the other adherend is fixed in the gap of one adherend. Specifically, as a motor mounted on a hybrid vehicle or the like, a motor having a configuration in which a gap is generally provided at a predetermined position of a core (rotor core) and a magnet is embedded in the gap is known. Yes. The use of an adhesive tape is being studied when fixing the magnet in the gap of the core portion.
　前記用途で使用可能な接着テープとしては、例えば第１面および前記第１面の反対側に第２面を有し、連通口を有する基材と、前記基材の第１面に形成された、熱硬化性熱膨張性エポキシ接着剤を含む第１接着層とを有し、前記熱硬化性熱膨張性エポキシ接着剤が、加熱時に前記基材の前記連通口を通過して前記基材の第２面上に第２接着層を形成する熱硬化性熱膨張性接着シートが知られている（例えば特許文献１参照。）。 The adhesive tape that can be used in the above application is formed on the first surface of the base material having a first surface and a second surface on the opposite side of the first surface and having a communication port, for example. A first adhesive layer containing a thermosetting thermally expandable epoxy adhesive, and the thermosetting thermally expandable epoxy adhesive passes through the communication port of the substrate when heated, and A thermosetting thermally expandable adhesive sheet that forms a second adhesive layer on the second surface is known (see, for example, Patent Document 1).
　前記熱硬化性熱膨張性接着シートを構成する前記第一接着層には、予め磁石等の被着体に貼付されていると考えられるため、前記熱膨張後であっても良好な接着力を維持できるものと考えられる。 Since it is considered that the first adhesive layer constituting the thermosetting thermally expandable adhesive sheet is previously attached to an adherend such as a magnet, it has a good adhesive force even after the thermal expansion. It can be maintained.
　しかし、前記第２接着層の表面には、前記熱膨張によって微細な凹凸が形成されてしまう場合がある。前記微細な凹凸が形成された表面を有する第２接着層は、被着体に対して十分な接着力を発現できない場合があった。 However, fine irregularities may be formed on the surface of the second adhesive layer due to the thermal expansion. In some cases, the second adhesive layer having the surface on which the fine irregularities are formed cannot exhibit a sufficient adhesive force to the adherend.
特開２０１３－０２３５５９号公報JP 2013-023559 A
　本発明が解決しようとする課題は、加熱等の刺激によって膨張しうる接着テープのうち、前記膨張後であっても優れた接着強度を保持することのできる接着テープを提供することである。 The problem to be solved by the present invention is to provide an adhesive tape that can maintain excellent adhesive strength even after the expansion, among adhesive tapes that can expand by stimulation such as heating.
　本発明者等は、接着剤層（Ａ）の片面に、直接または他の層を介して、接着剤層（Ｂ）を有する接着テープであって、前記接着テープを１３０℃の環境下に１時間放置した後の、前記接着剤層（Ａ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ａ）の厚さ／前記放置前の接着剤層（Ａ）の厚さ〕×１００が２００％以上であり、かつ、前記接着剤層（Ｂ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ｂ）の厚さ／前記放置前の接着剤層（Ｂ）の厚さ〕×１００が１２０％以下であることを特徴とする接着テープによって、前記課題を解決できることを見出した。 The inventors of the present invention provide an adhesive tape having an adhesive layer (B) on one side of the adhesive layer (A) directly or via another layer, and the adhesive tape is placed in an environment at 130 ° C. Expansion rate in the thickness direction of the adhesive layer (A) after being left for a time [thickness of the adhesive layer (A) after being left / thickness of the adhesive layer (A) before being left] × 100 is 200% or more, and the expansion rate in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the adhesive layer (B) before being left) It has been found that the above problem can be solved by an adhesive tape characterized in that the [thickness] × 100 is 120% or less.
　本発明の接着テープは、膨張した後であっても優れた接着強度を維持できることから、２以上の被着体の固定に使用できることはもとより、一方の被着体が有する空隙内に他方の被着体を固定する用途、被着体が有する空隙内を前記接着テープで充填する用途等で好適に使用することができる。 Since the adhesive tape of the present invention can maintain an excellent adhesive strength even after being expanded, it can be used for fixing two or more adherends, and in addition, the other adherend can be placed in the gap of one adherend. It can be suitably used for applications such as fixing the adherend and filling the voids of the adherend with the adhesive tape.
　また、本発明の接着テープは、被着体が微小な凹凸や隙間を有する場合であっても、前記膨張によって、前記微細な凹凸等に追従でき、その結果、優れた接着強度を発現することができる。また、本発明の接着テープは、膨張することによって被着体が有する空隙内の所定の位置に他の被着体を固定または充填することができるため、モーターをはじめとする最終製品の生産効率を向上させることができる。 In addition, the adhesive tape of the present invention can follow the fine irregularities due to the expansion even when the adherend has minute irregularities and gaps, and as a result, exhibits excellent adhesive strength. Can do. In addition, since the adhesive tape of the present invention can expand or fix other adherends at predetermined positions in the voids of the adherends by expanding, the production efficiency of final products including motors can be increased. Can be improved.
　また、本発明の接着テープは、その膨張率を適宜変更した場合であっても、前記接着強度のばらつきを生じさせにくい。 Further, the adhesive tape of the present invention is less likely to cause variations in the adhesive strength even when the expansion coefficient is appropriately changed.
接着テープのせん断接着力の測定方法を示す概念図である。It is a conceptual diagram which shows the measuring method of the shearing adhesive force of an adhesive tape.
　本発明の接着テープは、接着剤層（Ａ）の片面に、直接または他の層を介して、接着剤層（Ｂ）を有する接着テープであって、前記接着テープを１３０℃の環境下に１時間放置した後の、前記接着剤層（Ａ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ａ）の厚さ／前記放置前の接着剤層（Ａ）の厚さ〕×１００が２００％以上であり、かつ、前記接着剤層（Ｂ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ｂ）の厚さ／前記放置前の接着剤層（Ｂ）の厚さ〕×１００が１２０％以下であることを特徴とする。 The adhesive tape of the present invention is an adhesive tape having an adhesive layer (B) on one side of the adhesive layer (A) directly or via another layer, and the adhesive tape is placed in an environment of 130 ° C. Expansion coefficient in the thickness direction of the adhesive layer (A) after being left for 1 hour [thickness of the adhesive layer (A) after being left / thickness of the adhesive layer (A) before being left] X100 is 200% or more, and the expansion coefficient in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the adhesive layer (B) before being left) The thickness] × 100 is 120% or less.
　前記接着テープを構成する前記接着剤層（Ａ）は、例えば熱や光等の刺激を与えることによって膨張しうる層である。 The adhesive layer (A) constituting the adhesive tape is a layer that can be expanded by applying a stimulus such as heat or light.
　前記接着剤層（Ａ）としては、前記接着テープを１３０℃の環境下に１時間放置した場合に、前記接着剤層（Ａ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ａ）の厚さ／前記放置前の接着剤層（Ａ）の厚さ〕×１００が２００％以上となるものを使用する。 As the adhesive layer (A), when the adhesive tape is left in an environment of 130 ° C. for 1 hour, the expansion rate in the thickness direction of the adhesive layer (A) [the adhesive layer after being left ( Thickness of A) / thickness of adhesive layer (A) before leaving] × 100 is 200% or more.
　前記膨張率は、２５０％以上であることが好ましく、２５０％～１０００％であることがより好ましい。前記膨張率の接着剤層（Ａ）を有する接着テープであれば、例えば一方の被着体が有する空隙の高さ（厚さ）が大きい場合であっても、前記空隙内に他方の被着体を好適に固定したり、前記空隙内を前記接着テープで充填することができる。 The expansion coefficient is preferably 250% or more, and more preferably 250% to 1000%. If the adhesive tape has the adhesive layer (A) having the expansion coefficient, for example, even when the height (thickness) of the gap of one adherend is large, the other adherend is placed in the gap. The body can be suitably fixed, or the space can be filled with the adhesive tape.
　なお、前記膨張率は、前記接着テープを１３０℃の環境下に１時間放置した場合において、前記放置前の接着剤層（Ａ）の厚さに対する、前記放置後の接着剤層（Ａ）の厚さ（（膨張して形成された接着剤層（Ａ’）の厚さ）の割合を指す。具体的には、前記膨張率は、以下の方法で算出した値を指す。 In addition, the expansion coefficient indicates that the adhesive layer (A) after being left with respect to the thickness of the adhesive layer (A) before being left standing when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of thickness ((thickness of the adhesive layer (A ′) formed by expansion). Specifically, the expansion coefficient refers to a value calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープを構成する接着剤層（Ａ）の厚さを、２３℃環境下で測定する。 The thickness of the adhesive layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置する。 ¡Leave the adhesive tape in an environment of 130 ° C for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちに前記接着剤層（Ａ）が膨張して形成した接着剤層（Ａ’）の厚さを測定する。 The adhesive tape after being left standing is taken out in an environment of 23 ° C., and the thickness of the adhesive layer (A ′) formed by immediately expanding the adhesive layer (A) is measured.
　上記測定結果と下記式に基づいて、前記膨張率を算出する。
［前記放置後の接着テープを構成する接着剤層（Ａ）〔膨張し形成された接着剤層（Ａ’）〕の厚さ／前記放置前の接着テープを構成する接着剤層（Ａ）の厚さ］×１００ The expansion coefficient is calculated based on the measurement result and the following formula.
[The thickness of the adhesive layer (A) constituting the adhesive tape after standing] [The thickness of the adhesive layer (A ') formed by swelling] / of the adhesive layer (A) constituting the adhesive tape before standing Thickness] × 100
　前記接着剤層（Ａ）は、前記膨張前に予め被着体に貼付されることが、前記膨張後の前記接着剤層（Ａ）と被着体との優れた密着性を維持するうえで好ましい。
好ましい。 In order to maintain excellent adhesion between the adhesive layer (A) after the expansion and the adherend, the adhesive layer (A) is previously attached to the adherend before the expansion. preferable.
preferable.
　前記接着テープを構成する接着剤層（Ａ）の厚さは、１μｍ以上であることが好ましく、１０μｍ～２５０μｍの範囲であることがより好ましく、２０μｍ～１５０μｍの範囲であることがさらに好ましく、３０μｍ～７０μｍの範囲であることが、より一層優れた接着強度を得るうえで特に好ましい。 The thickness of the adhesive layer (A) constituting the adhesive tape is preferably 1 μm or more, more preferably in the range of 10 μm to 250 μm, further preferably in the range of 20 μm to 150 μm, and 30 μm. A range of ˜70 μm is particularly preferable in order to obtain a further excellent adhesive strength.
　一方、前記接着剤層（Ａ）が膨張することによって形成された接着剤層（Ａ’）の厚さは、２０μｍ～２５００μｍの範囲であることが好ましく、４０μｍ～１５００μｍの範囲であることが、より一層優れた接着強度を得るうえで好ましい。また、前記接着剤層（Ａ’）は、多孔構造を有するものであることが好ましい。 On the other hand, the thickness of the adhesive layer (A ′) formed by expanding the adhesive layer (A) is preferably in the range of 20 μm to 2500 μm, and preferably in the range of 40 μm to 1500 μm. It is preferable for obtaining even better adhesive strength. The adhesive layer (A ′) preferably has a porous structure.
　また、前記接着テープとしては、前記接着テープの総厚さに対して、前記接着剤層（Ａ）の厚さが１０％以上であるものを使用することが好ましく、３０％以上であるものを使用することが、例えば一方の被着体が有する空隙内に他方の被着体を固定したり、前記空隙内を前記接着テープで充填したりしやすいためより好ましい。 Moreover, as said adhesive tape, it is preferable to use what the thickness of the said adhesive bond layer (A) is 10% or more with respect to the total thickness of the said adhesive tape, and what is 30% or more It is more preferable to use it because, for example, it is easy to fix the other adherend in the gap of one adherend or to fill the gap with the adhesive tape.
　前記接着剤層（Ａ）としては、前記したとおり熱や光等の刺激を与えることによって膨張しうるものを使用することができ、具体的には各種樹脂及び膨張剤を含有する層を使用することができる。 As the adhesive layer (A), as described above, a layer that can be expanded by applying a stimulus such as heat or light can be used. Specifically, a layer containing various resins and an expansion agent is used. be able to.
　前記接着剤層（Ａ）としては、例えば前記樹脂及び膨張剤等を含有する接着剤組成物（ａ）を離型ライナー等に塗布し乾燥させることによって形成することができる。 The adhesive layer (A) can be formed, for example, by applying an adhesive composition (a) containing the resin and an expanding agent to a release liner or the like and drying it.
　前記接着剤層（Ａ）の形成に使用可能な接着剤組成物（ａ）としては、前記したとおり樹脂や膨張剤や必要に応じて溶媒等を含有する組成物を使用することができる。 As the adhesive composition (a) that can be used for forming the adhesive layer (A), as described above, a composition containing a resin, an expansion agent, and a solvent as necessary can be used.
　前記樹脂としては、エポキシ樹脂、ウレタン樹脂、シリコーン樹脂、フェノール樹脂、ユリア樹脂、フッ素樹脂、アクリルニトリル樹脂、アクリル樹脂、スチレン系樹脂、ブタジエン樹脂等のビニル樹脂等を、単独または２以上組み合わせ使用することができる。 As the resin, an epoxy resin, a urethane resin, a silicone resin, a phenol resin, a urea resin, a fluororesin, an acrylonitrile resin, an acrylic resin, a styrene resin, a vinyl resin such as a butadiene resin, or the like is used alone or in combination of two or more. be able to.
　なかでも、前記樹脂としては、熱硬化性樹脂を使用することが好ましく、エポキシ樹脂を使用することが、膨張後に耐熱性に優れ、かつ、膨張した接着剤層（Ａ’）が経時的に著しく収縮することを防止可能な接着テープを得るうえでより好ましい。 Among these, it is preferable to use a thermosetting resin as the resin, and it is preferable to use an epoxy resin, which has excellent heat resistance after expansion, and the expanded adhesive layer (A ′) is remarkably over time. It is more preferable for obtaining an adhesive tape capable of preventing shrinkage.
　前記エポキシ樹脂としては、例えばビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、ヒンダトイン型エポキシ樹脂、ビフェニル型エポキシ樹脂、脂環式エポキシ樹脂、トリフェニルメタン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ナフトールノボラック型エポキシ樹脂、ジシクロペンタジエン／フェノールエポキシ樹脂、脂環式アミンエポキシ樹脂、脂肪族アミンエポキシ樹脂、及び、ＣＴＢＮ変性（カルボキシターミネーティッドブタジエンニトリル変性）やハロゲン変性されたエポキシ樹脂等を、単独または２以上組み合わせ使用することができ、クレゾールノボラック型エポキシ樹脂を使用することが、前記刺激によって膨張しやすく、かつ、膨張後も優れた接着強度を保持できるため好ましい。 Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hindered-in type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, triphenylmethane type epoxy resin, and phenol novolac. Type epoxy resin, cresol novolak type epoxy resin, naphthol novolak type epoxy resin, dicyclopentadiene / phenol epoxy resin, alicyclic amine epoxy resin, aliphatic amine epoxy resin, and CTBN modification (carboxy-terminated butadiene nitrile modification) Halogen-modified epoxy resins or the like can be used alone or in combination of two or more, and the use of a cresol novolac type epoxy resin can be caused by the stimulation. Expansion easy, and preferable because it can hold the adhesive strength is excellent even after expansion.
　前記エポキシ樹脂等の熱硬化性樹脂は、前記接着剤層（Ａ）全体に対して１０質量％～９９質量％含まれることが好ましい。 The thermosetting resin such as the epoxy resin is preferably contained in an amount of 10% by mass to 99% by mass with respect to the entire adhesive layer (A).
　また、前記接着剤組成物（ａ）としては、前記刺激によって膨張しうる接着剤層（Ａ）を形成するうえで膨張剤を含有するものを使用することが好ましい。 Further, as the adhesive composition (a), it is preferable to use an adhesive composition containing an expansion agent in forming the adhesive layer (A) that can expand by the stimulus.
　前記膨張剤としては、前記膨張後の接着剤層（Ａ’）として多孔構造を形成できるものを使用することが好ましく、例えば炭酸アンモニウム、炭酸水素アンモニウム、亜硝酸アンモニウム、水素化ホウ素アンモニウム、アジド等の無機化合物、トリクロロモノフルオロメタン等のフッ化アルカン、アゾビスイソブチロニトリル等のアゾ化合物、パラトルエンスルホニルヒドラジド等のヒドラジン化合物、ｐ－トルエンスルホニルセミカルバジド等のセミカルバジド化合物、５－モルホリル－１，２，３，４－チアトリアゾール等のトリアゾール化合物、Ｎ，Ｎ’－ジニトロソテレフタルアミド等のＮ－ニトロソ化合物を使用することができる。 The expansion agent is preferably one that can form a porous structure as the adhesive layer (A ′) after expansion, such as ammonium carbonate, ammonium hydrogen carbonate, ammonium nitrite, ammonium borohydride, azide, and the like. Inorganic compounds, fluorinated alkanes such as trichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, hydrazine compounds such as paratoluenesulfonyl hydrazide, semicarbazide compounds such as p-toluenesulfonyl semicarbazide, 5-morpholyl-1,2 Triazole compounds such as 1,3,4-thiatriazole and N-nitroso compounds such as N, N′-dinitrosotephthalamide can be used.
　また、前記膨張剤としては、例えば炭化水素系溶剤をマイクロカプセル化した熱膨張性カプセル等の膨張性カプセルを使用することができる。前記膨張剤としては、前記樹脂の軟化点前後の温度で気体を発生し膨張し得るものを使用することが好ましい。 Further, as the expansion agent, for example, an expandable capsule such as a thermally expandable capsule in which a hydrocarbon solvent is microencapsulated can be used. As the expansion agent, it is preferable to use a material capable of generating gas and expanding at a temperature around the softening point of the resin.
　前記膨張剤としては、前記したなかでも炭化水素系溶剤をマイクロカプセル化した熱膨張性カプセルを使用することが、例えば前記エポキシ樹脂の硬化を阻害したり、熱等の影響による接着剤層（Ａ）の劣化等を防止するうえで好ましい。 As the expansion agent, use of a thermally expandable capsule in which a hydrocarbon solvent is microencapsulated among the above is used, for example, to inhibit the curing of the epoxy resin, or to form an adhesive layer (A ) Is preferable for preventing deterioration and the like.
　前記熱膨張性カプセルとしては、膨張前の前記カプセルの体積に対する膨張後の体積（体積膨張率）が８倍～６０倍であるものを使用することが好ましい。 As the thermally expandable capsule, it is preferable to use a capsule having a volume after expansion (volume expansion coefficient) of 8 to 60 times with respect to the volume of the capsule before expansion.
　前記熱膨張性カプセルの市販品としては、例えばエクスパンセル（日本フィライト株式会社製）、マツモトマイクロスフェアー（松本油脂製薬株式会社製）、マイクロスフェアー（株式会社クレハ製）等が挙げられる。 Examples of the commercially available thermal expandable capsule include EXPANSEL (manufactured by Nippon Philite Co., Ltd.), Matsumoto Microsphere (manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), and Microsphere (manufactured by Kureha Co., Ltd.).
　前記膨張剤の使用量、好ましくは前記熱膨張性カプセルの使用量は、前記接着剤層（Ａ）の全量に対して、０．３質量％～４０質量％の範囲であることが好ましく、１．０質量％～３０質量％の範囲であることがより好ましく、３．０質量％～２０質量％の範囲であることが被着体が有する空隙を充填等するうえで十分な体積にまで膨張することができ、かつ、より一層優れた接着強度を維持可能な接着テープを得るうえで好ましい。 The amount of the expansion agent used, preferably the amount of the thermally expandable capsule, is preferably in the range of 0.3% by mass to 40% by mass with respect to the total amount of the adhesive layer (A). More preferably, the content is in the range of 0.0% by mass to 30% by mass, and the range of 3.0% by mass to 20% by mass expands to a sufficient volume for filling the voids of the adherend. It is preferable for obtaining an adhesive tape that can be maintained and can maintain an even better adhesive strength.
　前記接着剤組成物（ａ）としては、前記したもののほかに必要に応じて、硬化剤、硬化促進剤等を含有するものを使用することができる。 As the adhesive composition (a), those containing a curing agent, a curing accelerator and the like can be used as necessary in addition to the above-described ones.
　前記硬化剤としては、例えば、ビスフェノールＡ、ビスフェノールＦ、ビスフェノールＡＤ、ハイドロキノン、レゾルシン、メチルレゾルシン、ビフェノール、テトラメチルビフェノール、ジヒドロキシナフタレン、ジヒドロキシジフェニルエーテル、フェノールノボラック樹脂、ビスフェノールＡノボラック樹脂、ジシクロペンタジエンフェノール樹脂、テルペンフェノール樹脂、ナフトールノボラック樹脂、ビフェニルフェノール樹脂等の種々の多価フェノール樹脂、種々のフェノールと、ヒドロキシベンズアルデヒド、クロトンアルデヒド、グリオキザール等の種々のアルデヒドとの縮合反応で得られる多価フェノール樹脂、および重質油またはピッチ、フェノールおよびホルムアルデヒド化合物を重縮合させて得られた変性フェノール樹脂等の各種のフェノール樹脂、メチルテトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、無水ピロメリット酸、メチルナジック酸等の酸無水物、ジエチレントリアミン、イソホロンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルホン、ジシアンジアミド等のアミン等を使用することができる。 Examples of the curing agent include bisphenol A, bisphenol F, bisphenol AD, hydroquinone, resorcin, methyl resorcin, biphenol, tetramethylbiphenol, dihydroxynaphthalene, dihydroxydiphenyl ether, phenol novolac resin, bisphenol A novolac resin, dicyclopentadiene phenol resin. Various polyphenol resins such as terpene phenol resin, naphthol novolac resin, biphenyl phenol resin, polyhydric phenol resins obtained by condensation reaction of various phenols with various aldehydes such as hydroxybenzaldehyde, crotonaldehyde, glyoxal, And modified phenols obtained by polycondensation of heavy oil or pitch, phenol and formaldehyde compounds Various phenolic resins such as methyl resin, acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride and methylnadic acid, amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and dicyandiamide Etc. can be used.
　前記硬化促進剤としては、例えば２－メチルイミダゾール、２－メチル－４－エチルイミダゾール、２－フェニルイミダゾール等のイミダゾール；１，８－ジアザビシクロ［５．４．０］ウンデセン－７、トリエチレンジアミン、ベンジルジメチルアミン等の３級アミン；トリブチルポスフィン、トリフェニルホスフィン等の有機ホスフィン等を、単独または２以上組み合わせ使用することができる。 Examples of the curing accelerator include imidazoles such as 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole; 1,8-diazabicyclo [5.4.0] undecene-7, triethylenediamine, benzyl Tertiary amines such as dimethylamine; organic phosphines such as tributylphosphine and triphenylphosphine can be used alone or in combination of two or more.
　また、前記接着テープとしては、前記接着剤層（Ａ）の片面に接着剤層（Ｂ）を有するものを使用する。前記接着剤層（Ｂ）は、前記接着剤層（Ａ）の一方の面側に直接積層されていてもよく、いわゆる中芯といわれる基材等の他の層を介して積層されてもよい。 Moreover, as the adhesive tape, one having an adhesive layer (B) on one side of the adhesive layer (A) is used. The adhesive layer (B) may be directly laminated on one surface side of the adhesive layer (A), or may be laminated via another layer such as a so-called base material. .
　前記接着剤層（Ｂ）としては、前記接着テープを１３０℃の環境下に１時間放置した場合に、前記接着剤層（Ｂ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ｂ）の厚さ／前記放置前の接着剤層（Ｂ）の厚さ〕×１００が１２０％以下であるものを使用する。 As the adhesive layer (B), when the adhesive tape is allowed to stand in an environment of 130 ° C. for 1 hour, the expansion rate in the thickness direction of the adhesive layer (B) [the adhesive layer after being left ( B) thickness / thickness of adhesive layer (B) before standing] × 100 is 120% or less.
　前記接着剤層（Ｂ）の膨張率は、１１５％以下であることが好ましく、１００％～１１５％であることがより好ましい。 The expansion rate of the adhesive layer (B) is preferably 115% or less, and more preferably 100% to 115%.
　前記膨張率の接着剤層（Ｂ）を有する接着テープであれば、前記接着剤層（Ａ）が膨張した後であっても、被着体に対する優れた接着強度を維持することができる。 If the adhesive tape has the adhesive layer (B) having the expansion coefficient, it is possible to maintain excellent adhesive strength to the adherend even after the adhesive layer (A) has expanded.
　なお、前記接着剤層（Ｂ）の膨張率は、前記接着テープを１３０℃の環境下に１時間放置した場合において、前記放置前の前記接着剤層（Ｂ）の厚さに対する、前記放置後の接着剤層の厚さの割合を指す。 It should be noted that the expansion rate of the adhesive layer (B) is such that, when the adhesive tape is left in an environment of 130 ° C. for 1 hour, the thickness of the adhesive layer (B) before being left is not changed. It refers to the ratio of the thickness of the adhesive layer.
　なお、前記接着剤層（Ｂ）の膨張率は、前記接着テープを１３０℃の環境下に１時間放置した場合において、前記放置前の接着剤層（Ｂ）の厚さに対する、前記放置後の接着剤層（Ｂ’）の厚さの割合を指す。具体的には、前記膨張率は、以下の方法で算出した値を指す。 Note that the expansion rate of the adhesive layer (B) is the ratio of the adhesive layer (B) after being left with respect to the thickness of the adhesive layer (B) before being left when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of the thickness of the adhesive layer (B ′). Specifically, the expansion coefficient indicates a value calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープを構成する接着剤層（Ｂ）の厚さを、２３℃環境下で測定する。 The thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置する。 ¡Leave the adhesive tape in an environment of 130 ° C for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちに前記接着剤層（Ｂ）に相当する接着剤層（Ｂ’）の厚さを測定する。 The adhesive tape after being left is taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) is immediately measured.
　上記測定結果と下記式に基づいて、前記膨張率を算出する。
［前記放置後の接着テープを構成する接着剤層（Ｂ’）の厚さ／前記放置前の接着テープを構成する接着剤層（Ｂ）の厚さ］×１００ The expansion coefficient is calculated based on the measurement result and the following formula.
[The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] × 100
　前記接着剤層（Ｂ）の厚さは、５μｍ～１５０μｍの範囲であることが好ましく、１０μｍ～１００μｍの範囲であることが、より一層優れた接着強度を発現するうえでより好ましい。 The thickness of the adhesive layer (B) is preferably in the range of 5 μm to 150 μm, and more preferably in the range of 10 μm to 100 μm, in order to express even better adhesive strength.
　前記１３０℃の環境下に１時間放置した後の接着剤層（Ｂ’）の厚さは、前記放置前の接着剤層（Ｂ）の厚さと比較して、上記膨張率の範囲で変化してもよい。前記接着剤層（Ｂ’）の厚さは、１μｍ～１５０μｍの範囲であることが好ましく、５μｍ～１００μｍの範囲であることが、より一層優れた接着強度を発現するうえでより好ましい。 The thickness of the adhesive layer (B ′) after being left for 1 hour in the environment of 130 ° C. varies within the above expansion coefficient range as compared with the thickness of the adhesive layer (B) before being left standing. May be. The thickness of the adhesive layer (B ′) is preferably in the range of 1 μm to 150 μm, and more preferably in the range of 5 μm to 100 μm, in order to express even better adhesive strength.
　また、前記接着剤層（Ｂ）としては、粘着性または接着性を有する層が挙げられ、例えば熱硬化性接着剤層や感圧接着剤層等が挙げられる。 Also, examples of the adhesive layer (B) include a layer having tackiness or adhesiveness, and examples thereof include a thermosetting adhesive layer and a pressure-sensitive adhesive layer.
　前記接着剤層（Ｂ）は、例えば粘着性または接着性を有する層を形成可能な接着剤組成物（ｂ）を用いて形成することができる。 The adhesive layer (B) can be formed using, for example, an adhesive composition (b) capable of forming a sticky or adhesive layer.
　前記接着剤組成物（ｂ）としては、例えば接着樹脂と、必要に応じて硬化剤とを含有するものを使用することができる。なお、前記接着剤組成物（ｂ）を用いて形成される接着剤層（Ｂ）は、前記したとおり膨張率の低いことが好ましいため、前記接着剤層（Ａ）を形成する際に使用可能なものとして例示した膨張剤を実質的に含有しないものであることが好ましい。 As the adhesive composition (b), for example, an adhesive resin and, if necessary, a hardener can be used. In addition, since it is preferable that the adhesive bond layer (B) formed using the said adhesive composition (b) has a low expansion coefficient as above-mentioned, it can be used when forming the said adhesive bond layer (A). It is preferable that the swelling agent illustrated as a thing does not contain substantially.
　前記接着剤組成物（ｂ）に使用可能な接着樹脂としては、従来知られる樹脂を選択し使用することができ、例えば熱硬化性樹脂や感圧接着性樹脂等を使用することができる。 As the adhesive resin that can be used for the adhesive composition (b), a conventionally known resin can be selected and used. For example, a thermosetting resin or a pressure-sensitive adhesive resin can be used.
　なかでも、前記接着樹脂としては、本発明の接着テープの生産効率を向上させるうえで、例えば前記接着剤層（Ａ）の形成に使用可能な接着剤組成物（ａ）含有される樹脂として例示したものと、同様のものを使用することができる。 Especially, as said adhesive resin, when improving the production efficiency of the adhesive tape of this invention, it illustrates as adhesive resin (a) containing resin which can be used for formation of the said adhesive bond layer (A), for example The same ones can be used.
　また、前記接着樹脂としては、前記接着剤層（Ａ）が膨張した後であっても、被着体に対して優れた接着強度を維持でき、特に熱の影響によらず優れた接着強度を維持可能な接着剤層（Ｂ）を備えた接着テープを得るうえで、熱硬化性樹脂を使用することが好ましく、エポキシ樹脂を使用することがより好ましい。 In addition, as the adhesive resin, even after the adhesive layer (A) is expanded, it can maintain excellent adhesive strength to the adherend, and particularly has excellent adhesive strength regardless of the influence of heat. In obtaining an adhesive tape having a maintainable adhesive layer (B), a thermosetting resin is preferably used, and an epoxy resin is more preferably used.
　前記エポキシ樹脂としては、前記接着剤組成物（ａ）に使用可能な樹脂として例示したものと、同様のものを使用することが、前記接着剤層（Ａ）が膨張した後であっても、被着体に対して優れた接着強度を維持でき、特に熱の影響によらず優れた接着強度を維持可能な接着剤層（Ｂ）を備えた接着テープを得るうえで好ましい。 As the epoxy resin, it is possible to use the same resin as exemplified for the adhesive composition (a), even after the adhesive layer (A) is expanded. It is preferable for obtaining an adhesive tape having an adhesive layer (B) that can maintain excellent adhesive strength with respect to the adherend and can maintain excellent adhesive strength regardless of the influence of heat.
　前記接着剤組成物（ｂ）としては、前記したもののほかに必要に応じて、硬化剤、硬化促進剤等を含有するものを使用することができる。前記硬化剤及び硬化促進剤としては、前記接着剤組成物（ａ）に使用可能な硬化剤及び硬化促進剤として例示したものと、同様のものを使用することができる。 As the adhesive composition (b), in addition to those described above, those containing a curing agent, a curing accelerator and the like can be used as necessary. As said hardening | curing agent and hardening accelerator, the thing similar to what was illustrated as a hardening | curing agent and hardening accelerator which can be used for the said adhesive composition (a) can be used.
　前記接着剤組成物（ｂ）としては、前記したもののほかに必要に応じて、カップリング剤、粘着性付与剤、消泡剤、顔料、酸化防止剤、コア－シェル型強化剤、チキソトロピー剤、熱伝導性フィラー、絶縁性フィラー等を含有するものを使用してもよい。 As the adhesive composition (b), in addition to those described above, a coupling agent, a tackifier, an antifoaming agent, a pigment, an antioxidant, a core-shell type reinforcing agent, a thixotropic agent, You may use what contains a heat conductive filler, an insulating filler, etc.
　本発明の接着テープは、例えば前記接着剤組成物（ａ）を離型ライナーに塗布し乾燥することによって接着剤層（Ａ）を形成する工程［１］、前記工程［１］とは別に、前記接着剤組成物（ｂ）を離型ライナーに塗布し乾燥等することによって接着剤層（Ｂ）を形成する工程［２］、及び、前記接着剤層（Ａ）の片面に前記接着剤層（Ｂ）を転写し、それらを圧着等する工程［３］を経ることによって製造することができる。 The adhesive tape of the present invention, for example, the step [1] of forming the adhesive layer (A) by applying the adhesive composition (a) to a release liner and drying it, separately from the step [1], Step [2] of forming the adhesive layer (B) by applying the adhesive composition (b) to a release liner and drying, etc., and the adhesive layer on one side of the adhesive layer (A) It can manufacture by passing (B) and passing through the process [3] of crimping them.
　前記接着剤層（Ａ）は、前記接着テープを製造する過程で、その一部分が硬化してもよいが、実質的に膨張または硬化していないことが好ましい。前記接着剤層（Ｂ）もまた、前記接着テープを製造する過程で、その一部分が硬化してもよいが、実質的に硬化していないことが好ましい。 The adhesive layer (A) may be partially cured in the process of manufacturing the adhesive tape, but is preferably not substantially expanded or cured. A part of the adhesive layer (B) may also be cured in the process of producing the adhesive tape, but it is preferable that the adhesive layer (B) is not substantially cured.
　また、本発明の接着テープとしては、必要に応じ、前記接着剤層（Ａ）と接着剤層（Ｂ）との間に樹脂フィルム層または金属からなる層（Ｚ）を有するものを使用することができる。かかる接着テープは、良好な剛性を有するため、貼付作業性に優れる。 In addition, as the adhesive tape of the present invention, if necessary, a tape having a resin film layer or a metal layer (Z) between the adhesive layer (A) and the adhesive layer (B) is used. Can do. Since such an adhesive tape has good rigidity, it is excellent in sticking workability.
　前記層（Ｚ）としては、例えばポリエステルフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、ポリ塩化ビニルフィルム、ポリイミドフィルム、ポリエチレンテレフタレートフィルム等のプラスチックフィルム等を用いて形成される樹脂フィルム層、アルミニウム、銅等の金属層が挙げられる。 Examples of the layer (Z) include a resin film layer formed using a plastic film such as a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyimide film, and a polyethylene terephthalate film, and a metal such as aluminum and copper. Layer.
　前記層（Ｚ）としては、１μｍ～２００μｍの厚さを有するものを使用することが好ましく、１２μｍ～５０μｍの厚さのを有するものを使用することがより好ましい。 As the layer (Z), it is preferable to use a layer having a thickness of 1 μm to 200 μm, and it is more preferable to use a layer having a thickness of 12 μm to 50 μm.
　前記層（Ｚ）を有する接着テープは、例えば前記接着剤組成物（ａ）を離型ライナーに塗布し乾燥することによって接着剤層（Ａ）を形成する工程［１］、前記工程［１］とは別に、前記接着剤（ｂ）を離型ライナーに塗布し乾燥等することによって接着剤層（Ｂ）を形成する工程［２］、前記層（Ａ）の片面に、前記層（Ｚ）を積層する工程［４］、及び、前記層（Ｚ）からなる面に、前記接着剤層（Ｂ）を転写しそれらを圧着する工程［５］を経ることによって製造することができる。 For the adhesive tape having the layer (Z), for example, the step [1] of forming the adhesive layer (A) by applying the adhesive composition (a) to a release liner and drying it [1], the step [1] Separately, the step (2) of forming the adhesive layer (B) by applying the adhesive (b) to a release liner and drying or the like, the layer (Z) on one side of the layer (A) And the step [5] of transferring the adhesive layer (B) onto the surface composed of the layer (Z) and press-bonding them to the surface comprising the layer (Z).
　本発明の接着テープは、前記接着剤層（Ａ）または前記接着テープ全体に刺激を与えることによって膨張させることができる。前記刺激としては、前記したとおり、熱や光等が挙げられる。刺激を与える方法としては、加熱または光照射等の方法が挙げられ、加熱する方法を採用することが好ましい。 The adhesive tape of the present invention can be expanded by applying a stimulus to the adhesive layer (A) or the entire adhesive tape. Examples of the stimulus include heat and light as described above. Examples of the method for giving the stimulus include methods such as heating and light irradiation, and it is preferable to employ a heating method.
　前記加熱温度は、例えば前記膨張剤が膨張する温度（膨張開始温度）に対応した温度であることが好ましく、具体的には、８０℃～３００℃であることが好ましく、１００℃～２００℃であることが好ましい。 The heating temperature is preferably a temperature corresponding to, for example, a temperature at which the expansion agent expands (expansion start temperature), specifically 80 ° C. to 300 ° C., preferably 100 ° C. to 200 ° C. Preferably there is.
　本発明の接着テープは、前記加熱等の刺激が与えられた後、その厚さ方向に膨張することが好ましい。一方、本発明の接着テープは、前記加熱等の刺激が与えられた後、その流れ方向または幅方向には実質的に膨張しないことが好ましい。 It is preferable that the adhesive tape of the present invention expands in the thickness direction after the stimulus such as heating is given. On the other hand, it is preferable that the adhesive tape of the present invention does not substantially expand in the flow direction or the width direction after the stimulation such as heating is given.
　本発明の接着テープを用いて２以上の被着体を固定等する方法としては、例えば、予め、一方の被着体と、前記接着テープを構成する前記接着剤層（Ａ）とを貼付して得たものを、所定の位置に載置し、少なくとも前記接着剤層（Ａ）に前記刺激を与え膨張させることによって、前記接着剤層（Ｂ）と、他の被着体とを接触させ接着させる方法が挙げられる。その際、前記刺激は、前記接着テープを構成する前記接着剤層（Ａ）に与えてもよく、前記接着テープ全体に与えてもよい。 As a method for fixing two or more adherends using the adhesive tape of the present invention, for example, one adherend and the adhesive layer (A) constituting the adhesive tape are pasted in advance. The adhesive layer (B) and another adherend are brought into contact with each other by placing the product obtained in a predetermined position and causing the adhesive layer (A) to stimulate and expand at least the adhesive layer (A). The method of making it adhere | attach is mentioned. In that case, the said stimulus may be given to the said adhesive bond layer (A) which comprises the said adhesive tape, and may be given to the said adhesive tape whole.
　本発明の接着テープは、例えば被着体（Ｃ１）を構成する部位（ｃ１－１）と、前記被着体（Ｃ１）を構成する他の部位（ｃ１－２）または他の被着体（Ｃ２）とが接着された構成を有する物品の製造に、好適に使用することができる。 The adhesive tape of the present invention includes, for example, a part (c1-1) constituting the adherend (C1), another part (c1-2) constituting the adherend (C1), or another adherend ( It can be suitably used for the manufacture of an article having a configuration in which C2) is bonded.
　前記物品は、前記接着テープを構成する前記接着剤層（Ａ）と、被着体（Ｃ１）を構成する部位（ｃ１－１）とを予め接着させる工程［１］、及び、少なくとも前記接着剤層（Ａ）を刺激し膨張させることによって、前記接着テープを構成する前記接着剤層（Ｂ）と、前記被着体（Ｃ１）を構成する部位（ｃ１－２）または前記被着体（Ｃ２）とを接着させる工程［２］を経ることによって製造することができる。 The article includes a step [1] of previously bonding the adhesive layer (A) constituting the adhesive tape and a portion (c1-1) constituting the adherend (C1), and at least the adhesive By stimulating and expanding the layer (A), the adhesive layer (B) constituting the adhesive tape and the part (c1-2) constituting the adherend (C1) or the adherend (C2) ) And the process [2] for bonding.
　前記物品としては、例えばハイブリッド自動車等に搭載されるモーターが挙げられる。前記モーターは、具体的には、前記接着テープを構成する接着剤層（Ａ）と、磁石等の部品の一部とを予め接着させたものを、モーターを構成するコア部材が有する空隙に載置した後、少なくとも前記接着剤層（Ａ）を刺激し膨張させることによって製造することができる。 Examples of the article include a motor mounted on a hybrid vehicle. Specifically, in the motor, an adhesive layer (A) that constitutes the adhesive tape and a part of a part such as a magnet are preliminarily bonded to a gap included in a core member that constitutes the motor. After placing, it can be produced by stimulating and expanding at least the adhesive layer (A).
　また、前記接着テープは、被着体が有する空隙内を充填する目的で使用することでき、例えば、被着体が有する空隙に、前記接着テープを載置した後、少なくとも前記接着剤層（Ａ）を刺激し膨張させることによって、前記空隙内の２以上の箇所が前記接着テープによって接着された構成を形成する際にも使用することができる。 The adhesive tape can be used for the purpose of filling the voids of the adherend. For example, after the adhesive tape is placed in the voids of the adherend, at least the adhesive layer (A Can be used to form a structure in which two or more locations in the gap are bonded by the adhesive tape.
　（調製例１）
　＜接着剤組成物（ａ－１）の調製＞
　エピクロンＮ－６８０（ＤＩＣ株式会社製のクレゾールノボラック型エポキシ樹脂溶液、エポキシ当量２１５ｇ／ｅｑ、不揮発分７５質量％）２１．４質量部と、「ＪＥＲ　ＹＬ－７８６２」（三菱化学株式会社製のビスフェノールA型エポキシ樹脂溶液、エポキシ当量３７４８ｇ／ｅｑ、不揮発分５０質量％）４８質量部とを混合した後、メチルエチルケトン３０．６質量部を混合することによって不揮発分４０質量％のエポキシ樹脂組成物（１）を得た。 (Preparation Example 1)
<Preparation of adhesive composition (a-1)>
Epicron N-680 (a cresol novolac epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75 mass%) 21.4 parts by mass, “JER YL-7862” (Mitsubishi Chemical Corporation bisphenol) After mixing 48 parts by mass of an A-type epoxy resin solution, epoxy equivalent 3748 g / eq, nonvolatile content 50% by mass), 30.6 parts by mass of methyl ethyl ketone is mixed to obtain an epoxy resin composition having a nonvolatile content of 40% by mass (1 )
　次に、前記エポキシ樹脂組成物（１）１００質量部に対し、膨張剤としてエクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）を３．２質量部と、硬化剤としてキュアゾール２ＭＡＯＫ－ＰＷ（四国化成株式会社製、イミダゾール系硬化促進剤）０．４質量部とを混合し、１０分間撹拌することによって、接着剤組成物（ａ－１）を得た。 Next, with respect to 100 parts by mass of the epoxy resin composition (1), EXPANSEL 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 110 ° C., 3.2 parts by mass of a volume expansion coefficient at 130 ° C. of 7 times) and 0.4 parts by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator) as a curing agent are mixed for 10 minutes. By stirring, an adhesive composition (a-1) was obtained.
　（調製例２）
　＜接着剤組成物（ａ－２）の調製＞
　前記エクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）の使用量を、３．２質量部から６．４質量部に変更したこと以外は、調製例１と同様の方法で接着剤組成物（ａ－２）を得た。 (Preparation Example 2)
<Preparation of adhesive composition (a-2)>
The amount used of EXPANSEL 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times) is 3.2 mass. An adhesive composition (a-2) was obtained in the same manner as in Preparation Example 1, except that the amount was changed to 6.4 parts by mass.
　（調製例３）
　＜接着剤組成物（ａ－３）の調製＞
　前記エクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）の使用量を、３．２質量部から９．６質量部に変更したこと以外は、調製例１と同様の方法で接着剤組成物（ａ－３）を得た。 (Preparation Example 3)
<Preparation of adhesive composition (a-3)>
The amount used of EXPANSEL 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times) is 3.2 mass. An adhesive composition (a-3) was obtained in the same manner as in Preparation Example 1, except that the amount was changed to 9.6 parts by mass.
　（調製例４）
　＜接着剤組成物（ａ－４）の調製＞
　前記エクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）３．２質量部の代わりに、エクスパンセル９２０－１２０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１２７℃、１３０℃における体積膨張率が４倍）を１．６質量部使用すること以外は、調製例１と同様の方法で接着剤組成物（ａ－４）を得た (Preparation Example 4)
<Preparation of adhesive composition (a-4)>
Instead of 3.2 parts by mass of the above Expandel 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle diameter 12 μm, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times) Other than using 1.6 parts by mass of EXPANSEL 920-120 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 127 ° C., volume expansion coefficient at 130 ° C. is 4 times) Obtained an adhesive composition (a-4) in the same manner as in Preparation Example 1.
　（調製例５）
　＜接着剤組成物（ａ－５）の調製＞
　エピクロンＮ－６８０（ＤＩＣ株式会社製のクレゾールノボラック型エポキシ樹脂溶液、エポキシ当量２１５ｇ／ｅｑ、不揮発分７５質量％）３７．３質量部と、「ＪＥＲ　ＹＬ－７８６２」（三菱化学株式会社製のビスフェノールA型エポキシ樹脂溶液、エポキシ当量３７４８ｇ／ｅｑ、不揮発分５０質量％）２４質量部とを混合し、次にメチルエチルケトン３８．７質量部を混合することによって不揮発分４０質量％のエポキシ樹脂組成物（２）を得た。 (Preparation Example 5)
<Preparation of adhesive composition (a-5)>
Epicron N-680 (a cresol novolac type epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75 mass%) 37.3 parts by mass, “JER YL-7862” (Mitsubishi Chemical Corporation bisphenol A type epoxy resin solution, epoxy equivalent 3748 g / eq, non-volatile content 50% by mass) 24 parts by mass, and then mixed with 38.7 parts by mass of methyl ethyl ketone, whereby an epoxy resin composition (non-volatile content 40% by mass) ( 2) was obtained.
　次に、前記エポキシ樹脂組成物（２）１００質量部に対し、膨張剤としてエクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）を３．２質量部と、硬化剤としてキュアゾール２ＭＡＯＫ－ＰＷ（四国化成株式会社製、イミダゾール系硬化促進剤）０．４質量部とを混合し、１０分間撹拌することによって、接着剤組成物（ａ－５）を得た。 Next, with respect to 100 parts by mass of the epoxy resin composition (2), EXPANSEL 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 110 ° C., 3.2 parts by mass of a volume expansion coefficient at 130 ° C. of 7 times) and 0.4 parts by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator) as a curing agent are mixed for 10 minutes. By stirring, an adhesive composition (a-5) was obtained.
　（調製例６）
　＜接着剤組成物（ｂ－１）の調製＞
　エピクロンＮ－６８０（ＤＩＣ株式会社製のクレゾールノボラック型エポキシ樹脂溶液、エポキシ当量２１５ｇ／ｅｑ、不揮発分７５質量％）２１．４質量部と、「ＹＬ－７８６２」（三菱化学株式会社製のビスフェノールA型エポキシ樹脂溶液、エポキシ当量３７４８ｇ／ｅｑ、不揮発分５０質量％）４８質量部とを混合した後、メチルエチルケトン３０．６質量部を混合することによって不揮発分４０質量％のエポキシ樹脂組成物（３）を得た。 (Preparation Example 6)
<Preparation of adhesive composition (b-1)>
Epiklone N-680 (a cresol novolac type epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75% by mass) 21.4 parts by mass, “YL-7862” (Bisphenol A manufactured by Mitsubishi Chemical Corporation) Type epoxy resin solution, epoxy equivalent 3748 g / eq, non-volatile content 50% by mass) 48 parts by mass, and then mixing 30.6 parts by mass of methyl ethyl ketone (40% by mass) epoxy resin composition (3) Got.
　次に、前記エポキシ樹脂組成物（３）１００質量部に対し、硬化剤としてキュアゾール２ＭＡＯＫ－ＰＷ（四国化成株式会社製、イミダゾール系硬化促進剤）０．４質量部を混合し、１０分間撹拌することによって、接着剤組成物（ｂ－１）を得た。 Next, 0.4 parts by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator) is mixed with 100 parts by mass of the epoxy resin composition (3) and stirred for 10 minutes. As a result, an adhesive composition (b-1) was obtained.
　（調製例７）
　＜接着剤組成物（ｂ－２）の調製＞
　エピクロンＮ－６８０（ＤＩＣ株式会社製のクレゾールノボラック型エポキシ樹脂溶液、エポキシ当量２１５ｇ／ｅｑ、不揮発分７５質量％）３７．３質量部と、「ＪＥＲ　ＹＬ－７８６２」（三菱化学株式会社製のビスフェノールA型エポキシ樹脂溶液、エポキシ当量３７４８ｇ／ｅｑ、不揮発分５０質量％）２４質量部とを混合し、次にメチルエチルケトン３８．７質量部を混合することによって不揮発分４０質量％のエポキシ樹脂組成物（４）を得た。 (Preparation Example 7)
<Preparation of adhesive composition (b-2)>
Epicron N-680 (a cresol novolac type epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75 mass%) 37.3 parts by mass, “JER YL-7862” (Mitsubishi Chemical Corporation bisphenol A type epoxy resin solution, epoxy equivalent 3748 g / eq, non-volatile content 50% by mass) 24 parts by mass, and then mixed with 38.7 parts by mass of methyl ethyl ketone, whereby an epoxy resin composition (non-volatile content 40% by mass) ( 4) was obtained.
　次に、前記エポキシ樹脂組成物（４）１００質量部に対し、硬化剤としてキュアゾール２ＭＡＯＫ－ＰＷ（四国化成株式会社製、イミダゾール系硬化促進剤）０．４質量部を混合し、１０分間撹拌することによって、接着剤組成物（ｂ－２）を得た。 Next, with respect to 100 parts by mass of the epoxy resin composition (4), 0.4 part by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator) is mixed as a curing agent and stirred for 10 minutes. As a result, an adhesive composition (b-2) was obtained.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　＜接着テープの作製＞
　（実施例１）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ａ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって接着剤層（Ａ－１）を作製した。 <Preparation of adhesive tape>
Example 1
The thickness of the adhesive composition (a-1) after drying on the surface of a release film obtained by peeling one side of a 75 μm thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator The adhesive layer (A-1) was prepared by applying the coating solution so that the thickness of the adhesive layer became 50 μm and drying it with a dryer set at 75 ° C. for 10 minutes.
　次に、厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ｂ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが１００μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって接着剤層（Ｂ－１）を作製した。 Next, the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 μm-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator. The adhesive layer (B-1) was prepared by applying the coating to a thickness of 100 μm and drying for 10 minutes with a dryer set at 75 ° C.
　前記で得た接着剤層（Ａ－１）に、前記接着剤層（Ｂ－１）を貼付し、２ｋｇのハンドローラーを用い、前記貼付物の上面を一往復させることによって、前記接着剤層（Ａ－１）の片面に接着剤層（Ｂ－１）が積層した接着テープを得た。 The adhesive layer (B-1) is attached to the adhesive layer (A-1) obtained above, and the adhesive layer is moved back and forth once using a 2 kg hand roller. An adhesive tape in which the adhesive layer (B-1) was laminated on one side of (A-1) was obtained.
　（実施例２）
　前記接着剤組成物（ａ－１）の代わりに前記接着剤組成物（ａ－２）を使用し、接着剤層（Ａ－２）を形成したこと以外は、実施例１と同様の方法で接着テープを作製した。 (Example 2)
Except that the adhesive composition (a-2) was used in place of the adhesive composition (a-1) and the adhesive layer (A-2) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
　（実施例３）
　前記接着剤組成物（ａ－１）の代わりに前記接着剤組成物（ａ－３）を使用し、接着剤層（Ａ－３）を形成したこと以外は、実施例１と同様の方法で接着テープを作製した。 Example 3
Except that the adhesive composition (a-3) was used in place of the adhesive composition (a-1) and an adhesive layer (A-3) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
　（実施例４）
　前記接着剤組成物（ａ－１）の代わりに前記接着剤組成物（ａ－４）を使用し、接着剤層（Ａ－４）を形成したこと以外は、実施例１と同様の方法で接着テープを作製した。 Example 4
Except that the adhesive composition (a-4) was used in place of the adhesive composition (a-1) and the adhesive layer (A-4) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
　（実施例５）
　前記接着剤組成物（ａ－１）の代わりに前記接着剤組成物（ａ－５）を使用することで接着剤層（Ａ－５）を形成し、かつ、前記接着剤組成物（ｂ－１）の代わりに前記接着剤組成物（ｂ－２）を使用することで接着剤層（Ｂ－２）形成すること以外は、実施例１と同様の方法で接着テープを作製した。 (Example 5)
An adhesive layer (A-5) is formed by using the adhesive composition (a-5) instead of the adhesive composition (a-1), and the adhesive composition (b- An adhesive tape was produced in the same manner as in Example 1 except that the adhesive composition (b-2) was used instead of 1) to form the adhesive layer (B-2).
　（実施例６）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ａ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって層（Ａ－１）を作製した。 (Example 6)
The thickness of the adhesive composition (a-1) after drying on the surface of a release film obtained by peeling one side of a 75 μm thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator The layer (A-1) was prepared by coating the film so as to be 50 μm and drying it with a dryer set at 75 ° C. for 10 minutes.
　次に、前記接着剤層（Ａ－１）の片面に、厚さ５０μｍのポリエチレンテレフタレートからなるフィルムを貼り合わせた。 Next, a film made of polyethylene terephthalate having a thickness of 50 μm was bonded to one side of the adhesive layer (A-1).
　次に、厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ｂ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって接着剤層（Ｂ－１）を作製した。 Next, the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 μm-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator. The adhesive layer (B-1) was prepared by applying the coating to a thickness of 50 μm and drying for 10 minutes with a dryer set at 75 ° C.
　次に、前記ポリエチレンテレフタレートからなるフィルムに、前記接着剤層（Ｂ－１）を貼付し、２ｋｇのハンドローラーを用い、前記貼付物の上面を一往復させることによって、前記接着剤層（Ａ－１）の片面にポリエチレンテレフタレートフィルムが積層し、その表面に接着剤層（Ｂ－１）が積層した接着テープを得た。 Next, the adhesive layer (B-1) is affixed to the polyethylene terephthalate film, and the adhesive layer (A- An adhesive tape in which a polyethylene terephthalate film was laminated on one side of 1) and an adhesive layer (B-1) was laminated on the surface was obtained.
　（比較例１）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ａ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが１５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって、前記接着剤層（Ａ－１）からなる接着テープを得た。 (Comparative Example 1)
The thickness of the adhesive composition (a-1) after drying on the surface of a release film obtained by peeling one side of a 75 μm thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator Was applied to a thickness of 150 μm and dried with a dryer set at 75 ° C. for 10 minutes to obtain an adhesive tape comprising the adhesive layer (A-1).
　（比較例２）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ｂ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが１５０μｍになるように塗工し乾燥することによって、前記接着剤層（Ｂ－１）からなる接着テープを得た。 (Comparative Example 2)
The thickness of the adhesive composition (b-1) after drying on the surface of a release film obtained by peeling one side of a 75 μm thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator Was applied to a thickness of 150 μm and dried to obtain an adhesive tape comprising the adhesive layer (B-1).
　［接着テープ、それを構成する各接着剤層の膨張率の測定方法］
　前記方法で作製した接着テープの厚さ、それを構成する各接着剤層の厚さを、厚み計を用いてそれぞれ測定した。 [Adhesive tape and method for measuring expansion coefficient of each adhesive layer constituting it]
The thickness of the adhesive tape produced by the above method and the thickness of each adhesive layer constituting it were measured using a thickness meter.
　また、前記接着テープを、１３０℃の環境下１時間放置することによって膨張させた。 Further, the adhesive tape was expanded by leaving it in an environment of 130 ° C. for 1 hour.
　次に、前記膨張後の接着テープの厚さ、それを構成する接着剤層の厚さを厚み計を用いてそれぞれ測定した。 Next, the thickness of the expanded adhesive tape and the thickness of the adhesive layer constituting it were measured using a thickness meter.
　前記粘着剤層（Ａ）の膨張率は、以下の方法で算出した。 The expansion coefficient of the pressure-sensitive adhesive layer (A) was calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープを構成する接着剤層（Ａ）の厚さを、２３℃環境下で測定した。 The thickness of the adhesive layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置した。 The adhesive tape was left in an environment at 130 ° C. for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちに前記接着剤層（Ａ）が膨張して形成した接着剤層（Ａ’）の厚さを測定した。 The adhesive tape after the standing was taken out in a 23 ° C. environment, and the thickness of the adhesive layer (A ′) formed by immediately expanding the adhesive layer (A) was measured.
　上記測定結果と下記式に基づいて、前記膨張率を算出した。
［前記放置後の接着テープを構成する接着剤層（Ａ）〔膨張し形成された接着剤層（Ａ’）〕の厚さ／前記放置前の接着テープを構成する接着剤層（Ａ）の厚さ］×１００
　前記粘着剤層（Ｂ）の膨張率は、以下の方法で算出した。 The expansion coefficient was calculated based on the measurement result and the following formula.
[The thickness of the adhesive layer (A) constituting the adhesive tape after standing] [The thickness of the adhesive layer (A ') formed by swelling] / of the adhesive layer (A) constituting the adhesive tape before standing Thickness] × 100
The expansion coefficient of the pressure-sensitive adhesive layer (B) was calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープを構成する接着剤層（Ｂ）の厚さを、２３℃環境下で測定した。 The thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置した。 The adhesive tape was left in an environment at 130 ° C. for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちに前記接着剤層（Ｂ）に相当する接着剤層（Ｂ’）の厚さを測定した。 The adhesive tape after the standing was taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) was immediately measured.
　上記測定結果と下記式に基づいて、前記膨張率を算出した。
［前記放置後の接着テープを構成する接着剤層（Ｂ’）の厚さ／前記放置前の接着テープを構成する接着剤層（Ｂ）の厚さ］×１００
　前記粘着テープの膨張率は、以下の方法で算出した。 The expansion coefficient was calculated based on the measurement result and the following formula.
[The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] × 100
The expansion coefficient of the adhesive tape was calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープの厚さを、２３℃環境下で測定した。 The thickness of the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置した。 The adhesive tape was left in an environment at 130 ° C. for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちにその厚さを測定した。 The adhesive tape after standing was taken out in a 23 ° C. environment and immediately measured for its thickness.
　上記測定結果と下記式に基づいて、前記膨張率を算出した。
［前記放置後の接着テープの厚さ／前記放置前の接着テープの厚さ］×１００ The expansion coefficient was calculated based on the measurement result and the following formula.
[Thickness of the adhesive tape after being left / thickness of the adhesive tape before being left] × 100
　［せん断接着力１の測定方法］
　脱脂処理した平滑な表面を有するアルミニウム板（幅１５ｍｍ×長さ７０ｍｍ×厚さ０．５ｍｍ）の表面に、１０ｍｍ×１０ｍｍの大きさに裁断した接着テープの前記接着剤層（Ａ）に相当する面を貼付し、２ｋｇのハンドローラーを用いて圧着した。 [Measurement method of shear adhesive strength 1]
Corresponds to the adhesive layer (A) of an adhesive tape cut to a size of 10 mm × 10 mm on the surface of a degreased smooth aluminum plate (width 15 mm × length 70 mm × thickness 0.5 mm) The surface was affixed and pressure-bonded using a 2 kg hand roller.
　次に、前記接着テープの上面（前記接着剤層（Ｂ）に相当する面）に、脱脂処理した平滑な表面を有する他のアルミニウム板（幅１５ｍｍ×長さ７０ｍｍ×厚み０．５ｍｍ）を載置し、これらをクリップで固定した。 Next, another aluminum plate (width 15 mm × length 70 mm × thickness 0.5 mm) having a smooth surface subjected to degreasing is placed on the upper surface of the adhesive tape (the surface corresponding to the adhesive layer (B)). These were fixed with clips.
　上記固定したものを、１３０℃で１時間加熱した後、２３℃環境下に３０分間放置し冷却した。 The above fixed one was heated at 130 ° C. for 1 hour and then left to stand in a 23 ° C. environment for 30 minutes to cool.
　次に、前記クリップを外したものを試験片とし、前記２枚のアルミニウム板の端部をそれぞれチャッキングし、引張試験機を用いて１８０度方向に引張速度５ｍｍ／分で引張試験することによって、前記接着テープの接着強度を求めた。 Next, the sample with the clip removed is used as a test piece, the ends of the two aluminum plates are chucked, and a tensile test is performed in a 180 ° direction at a tensile speed of 5 mm / min. The adhesive strength of the adhesive tape was determined.
　［せん断接着力２の測定方法］
　幅１５ｍｍ×長さ７０ｍｍ×厚さ０．５ｍｍの２枚の表面平滑なアルミニウム板を脱脂処理し、一方のアルミニウム板（Ｃ１）（図１中の１）の上面（Ｃ１－１）の端部に、厚さ０．３ｍｍの２本のスペーサー（図１の３）を、１２ｍｍの間をあけて平行に並べ、接着剤を用いて接着した。 [Measurement method of shear adhesive strength 2]
Two surface smooth aluminum plates having a width of 15 mm, a length of 70 mm and a thickness of 0.5 mm are degreased, and the end of the upper surface (C1-1) of one aluminum plate (C1) (1 in FIG. 1) In addition, two spacers (3 in FIG. 1) having a thickness of 0.3 mm were arranged in parallel with a gap of 12 mm, and adhered using an adhesive.
　次に、前記アルミニウム板（Ｃ１）の上面（Ｃ１－１）側で、かつ、前記２本のスペーサーの間に、１０ｍｍ×１０ｍｍの接着テープ（図１の４）を貼付した。 Next, a 10 mm × 10 mm adhesive tape (4 in FIG. 1) was attached on the upper surface (C1-1) side of the aluminum plate (C1) and between the two spacers.
　次に、前記スペーサーの上部に、他方のアルミニウム板（Ｃ２）（図１中の２）を載置し、クリップで固定した。これを、１３０℃で１時間加熱し、前記接着テープを膨張させることによって、２枚の前記アルミニウム板を熱接着させた。 Next, the other aluminum plate (C2) (2 in FIG. 1) was placed on the spacer and fixed with a clip. This was heated at 130 ° C. for 1 hour, and the adhesive tape was expanded to thermally bond the two aluminum plates.
　前記熱接着させたものを、２３℃で３０分間冷却した後、前記クリップを除去したものの接着強度を、引張り試験機を用い、前記アルミニウム板の端部をそれぞれチャッキングして、その１８０度方向（せん断方向）に引張速度５ｍｍ／分での引張り試験することによって測定した。 After the heat-bonded material was cooled at 23 ° C. for 30 minutes, the adhesive strength of the material from which the clip was removed was chucked at each end of the aluminum plate using a tensile tester, and the direction of 180 ° It was measured by carrying out a tensile test at a tensile speed of 5 mm / min (in the shear direction).
　前記せん断接着力２は、おおむね１２０Ｎ／ｃｍ２以上であることが好ましく、３００Ｎ／ｃｍ２以上であることがより好ましく、４５０Ｎ／ｃｍ２以上であることがさらに好ましいものであると評価した。 The shear adhesive strength 2 was evaluated is preferably approximately 120 N / cm 2 or more, and more preferably 300N / cm 2 or more, and still more preferably 450 N / cm 2 or more.
　なお、実施例１～６及び比較例１で得た接着テープは、それを構成する膨張性の接着剤層（Ａ）に相当する面が前記アルミニウム板の上面（Ｃ１－１）に貼付されるようにして上記試験を行った。また、比較例２で得た接着テープは、接着剤層（Ｂ）に相当する面が前記アルミニウム板の片面（Ｃ１－１）に貼付されるようにして上記試験を行った。 In the adhesive tapes obtained in Examples 1 to 6 and Comparative Example 1, the surface corresponding to the expandable adhesive layer (A) constituting the adhesive tape is attached to the upper surface (C1-1) of the aluminum plate. Thus, the above test was conducted. Further, the above-mentioned test was performed on the adhesive tape obtained in Comparative Example 2 so that the surface corresponding to the adhesive layer (B) was attached to one surface (C1-1) of the aluminum plate.
　また、参考例１～５として、実施例１～５で得た粘着テープを構成する前記接着剤層（Ｂ）に相当する面を、前記アルミニウム板の上面（Ｃ１－１）に予め貼付することで、刺激により膨張し得る接着剤層（Ａ）は、膨張後にアルミニウム板（Ｃ２）と接触するように配置したこと以外は、上記［せん断接着力２の測定方法］と同様の方法で、そのせん断接着力を測定した。 Further, as Reference Examples 1 to 5, the surface corresponding to the adhesive layer (B) constituting the adhesive tape obtained in Examples 1 to 5 is previously pasted on the upper surface (C1-1) of the aluminum plate. The adhesive layer (A) that can expand by stimulation is the same as the above [Method for measuring shearing adhesive force 2] except that it is arranged so as to come into contact with the aluminum plate (C2) after expansion. Shear adhesion was measured.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
１　アルミニウム板（Ｃ１）
２　アルミニウム板（Ｃ２）
３　スペーサー
４　接着テープ
５　接着テープとアルミニウム板（Ｃ２）との間の空隙 1 Aluminum plate (C1)
2 Aluminum plate (C2)
3 Spacer 4 Adhesive tape 5 Gap between adhesive tape and aluminum plate (C2)

Claims (11)

  1. 接着剤層（Ａ）の片面に、直接または他の層を介して、接着剤層（Ｂ）を有する接着テープであって、前記接着テープを１３０℃の環境下に１時間放置した後の、前記接着剤層（Ａ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ａ）の厚さ／前記放置前の接着剤層（Ａ）の厚さ〕×１００が２００％以上であり、かつ、前記接着剤層（Ｂ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ｂ）の厚さ／前記放置前の接着剤層（Ｂ）の厚さ〕×１００が１２０％以下であることを特徴とする接着テープ。 An adhesive tape having an adhesive layer (B) on one side of the adhesive layer (A), either directly or via another layer, after the adhesive tape is left in an environment of 130 ° C. for 1 hour, Expansion rate in the thickness direction of the adhesive layer (A) [thickness of the adhesive layer (A) after standing / thickness of the adhesive layer (A) before standing] × 100 is 200% or more And expansion coefficient in the thickness direction of the adhesive layer (B) [thickness of the adhesive layer (B) after being left / thickness of the adhesive layer (B) before being left] × 100 An adhesive tape characterized by being 120% or less.
  2. 前記接着剤層（Ａ）は、刺激によってその厚さ方向に膨張しうる層であって、前記膨張前に、予め被着体に貼付される接着剤層である請求項１に記載の接着テープ。 2. The adhesive tape according to claim 1, wherein the adhesive layer (A) is a layer that can expand in the thickness direction by stimulation, and is an adhesive layer that is affixed to an adherend in advance before the expansion. .
  3. 前記接着剤層（Ａ）が、加熱または光照射によって膨張しうる層である請求項１または２に記載の接着テープ。 The adhesive tape according to claim 1 or 2, wherein the adhesive layer (A) is a layer that can expand by heating or light irradiation.
  4. 前記接着剤層（Ａ）が、熱硬化性樹脂及び膨張剤を含有する組成物を用いて形成された層である請求項１～３のいずれか１項に記載の接着テープ。 The adhesive tape according to any one of claims 1 to 3, wherein the adhesive layer (A) is a layer formed using a composition containing a thermosetting resin and an expansion agent.
  5. 前記接着剤層（Ｂ）が熱硬化性接着剤層または感圧接着剤層である請求項１～４のいずれか１項に記載の接着テープ。 The adhesive tape according to any one of claims 1 to 4, wherein the adhesive layer (B) is a thermosetting adhesive layer or a pressure-sensitive adhesive layer.
  6. 前記接着剤層（Ａ）が１μｍ以上の厚さを有するものであり、かつ、前記接着剤層（Ｂ）が５μｍ以上の厚さを有するものである請求項１～５のいずれか１項に記載の接着テープ。 The adhesive layer (A) has a thickness of 1 μm or more, and the adhesive layer (B) has a thickness of 5 μm or more. The adhesive tape described.
  7. 前記接着剤層（Ａ）の片面に、樹脂フィルムまたは金属からなる層（Ｚ）を介して前記接着剤層（Ｂ）が積層されたものである請求項１～６のいずれか１項に記載の接着テープ。 The adhesive layer (B) is laminated on one side of the adhesive layer (A) through a layer (Z) made of a resin film or metal. Adhesive tape.
  8. 被着体（Ｃ１）を構成する部位（ｃ１－１）と、前記被着体（Ｃ１）を構成する他の部位（ｃ１－２）または他の被着体（Ｃ２）とが、請求項１～７のいずれか１項に記載の接着テープで接着された物品。 The part (c1-1) constituting the adherend (C1) and the other part (c1-2) or the other adherend (C2) constituting the adherend (C1) are defined in claim 1. 8. An article bonded with the adhesive tape according to any one of 1 to 7.
  9. 前記接着剤層（Ａ）を膨張させることによって形成された接着剤層（Ａ’）が、多孔構造を有する層である請求項８に記載の物品。 The article according to claim 8, wherein the adhesive layer (A ') formed by expanding the adhesive layer (A) is a layer having a porous structure.
  10. 被着体（Ｃ１）を構成する部位（ｃ１－１）と、前記被着体（Ｃ１）を構成する他の部位（ｃ１－２）または他の被着体（Ｃ２）とが、請求項１～７のいずれか１項に記載の接着テープで接着された物品の製造方法であって、
    前記接着テープを構成する前記接着剤層（Ａ）と、被着体（Ｃ１）を構成する部位（ｃ１－１）とを予め接着させる工程［１］、ならびに、少なくとも前記接着剤層（Ａ）を刺激し膨張させることによって、前記接着テープを構成する前記接着剤層（Ｂ）と、前記被着体（Ｃ１）を構成する部位（ｃ１－２）または前記被着体（Ｃ２）とを接着させる工程［２］を有することを特徴とする物品の製造方法。     The part (c1-1) constituting the adherend (C1) and the other part (c1-2) or the other adherend (C2) constituting the adherend (C1) are defined in claim 1. A method for producing an article bonded with the adhesive tape according to any one of 1 to 7,
    The step [1] of previously bonding the adhesive layer (A) constituting the adhesive tape and the portion (c1-1) constituting the adherend (C1), and at least the adhesive layer (A) The adhesive layer (B) constituting the adhesive tape and the part (c1-2) constituting the adherend (C1) or the adherend (C2) are adhered by stimulating and expanding the adhesive tape. The manufacturing method of the articles | goods characterized by including the process [2] to make.
  11. 請求項１～７のいずれか１項に記載の接着テープを構成する接着剤層（Ａ）と、磁石の一部とを予め接着させたものを、モーターを構成するコア部材が有する空隙に載置した後、少なくとも前記接着剤層（Ａ）を刺激し膨張させることによって、前記磁石が前記空隙内で固定された構成を有することを特徴とするモーター。 The adhesive layer (A) constituting the adhesive tape according to any one of claims 1 to 7 and a part of the magnet are pre-adhered in a gap of the core member constituting the motor. A motor having a configuration in which the magnet is fixed in the gap by stimulating and expanding at least the adhesive layer (A) after being placed.
PCT/JP2015/064267 2014-06-11 2015-05-19 Adhesive tape, article, motor, and method for producing article WO2015190235A1 (en)

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JP6274540B2 (en) 2018-02-07
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CN106459679A (en) 2017-02-22
JPWO2015190235A1 (en) 2017-04-20

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