WO2015188491A1 - Panneau d'affichage électroluminescent organique et son procédé d'encapsulation, et dispositif d'affichage - Google Patents

Panneau d'affichage électroluminescent organique et son procédé d'encapsulation, et dispositif d'affichage Download PDF

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Publication number
WO2015188491A1
WO2015188491A1 PCT/CN2014/086810 CN2014086810W WO2015188491A1 WO 2015188491 A1 WO2015188491 A1 WO 2015188491A1 CN 2014086810 W CN2014086810 W CN 2014086810W WO 2015188491 A1 WO2015188491 A1 WO 2015188491A1
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WIPO (PCT)
Prior art keywords
layer
display panel
device substrate
functional
package cover
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PCT/CN2014/086810
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English (en)
Chinese (zh)
Inventor
宋文峰
罗程远
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京东方科技集团股份有限公司
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Publication of WO2015188491A1 publication Critical patent/WO2015188491A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • At least one embodiment of the present invention is directed to an organic electroluminescence display panel, a packaging method thereof, and a display device.
  • OLED Organic Light-Emitting Diode
  • the organic luminescent materials and cathode materials used in OLED devices are particularly sensitive to water and oxygen.
  • the presence of trace amounts of water and oxygen tends to cause device failure.
  • a large amount of heat is generated during the luminescence process and heat is often concentrated in specific parts.
  • the rapid transfer of heat also affects the lifetime of OLED devices.
  • At least one embodiment of the present invention provides an organic electroluminescence display panel, a packaging method thereof, and a display device, to avoid OLED device in an OLED device package structure being affected by water and oxygen erosion, without increasing packaging cost and packaging the complexity.
  • At least one embodiment of the present invention provides an organic electroluminescence display panel including a device substrate and a package cover, and a package protection structure is formed between the device substrate and the package cover; the package protection structure includes a vertical In the multi-layer functional layer of the device substrate and the package cover, the functional layer comprises a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, and the outermost layer of the functional layer is a water blocking layer.
  • At least one embodiment of the present invention further provides a display device including the above-described organic electroluminescence display panel.
  • At least one embodiment of the present invention also provides a method of packaging an organic electroluminescent display panel.
  • the organic electroluminescent display panel includes a device substrate and a package cover, and a package protection structure is disposed between the device substrate and the package cover;
  • the packaging method includes: on the device substrate and the package A functional layer perpendicular to the device substrate and the package cover is formed between the cover plates as a package protection structure, the functional layer includes a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, and the outermost layer of the functional layer is blocked Water layer.
  • FIG. 1 is a cross-sectional view showing a package structure of an OLED device in an embodiment of the present invention
  • FIG. 2 is a top plan view of a package structure of the OLED device of FIG. 1;
  • a to c are schematic diagrams of forming an organic light emitting diode, a accommodating cavity and a water blocking layer on the device substrate;
  • 4 to a is a schematic view showing the formation of a buffer layer, a heat dissipation layer and a moisture absorbing layer on the package cover;
  • 5 to 7 are top views of package structures of other OLED devices in the embodiment of the present invention.
  • 1 device substrate; 2: package cover; 3: organic light emitting diode; 4: accommodating cavity; 5: water blocking layer; 6: moisture absorbing layer; 7: heat dissipation layer; 8: buffer layer.
  • the package structure of the OLED device is such that a functional layer such as a heat dissipation layer, a water blocking layer, and a dry layer (also called a moisture absorption layer) is sequentially stacked on the OLED device from bottom to top in a certain order, which correspondingly The spacing between the package cover and the TFT (Thin Film Transistor) substrate is increased, so that the OLED device is more susceptible to water and oxygen erosion on a horizontal level.
  • a functional layer such as a heat dissipation layer, a water blocking layer, and a dry layer (also called a moisture absorption layer) is sequentially stacked on the OLED device from bottom to top in a certain order, which correspondingly The spacing between the package cover and the TFT (Thin Film Transistor) substrate is increased, so that the OLED device is more susceptible to water and oxygen erosion on a horizontal level.
  • TFT Thin Film Transistor
  • a common and effective packaging method is to use the method of "dry material + encapsulant + groove cover" for OLED packaging, the method includes: The cover is fastened on the OLED device, and the groove cover and the device substrate are sealed and sealed by a sealant.
  • the inner cover of the groove cover is provided with a dry material, and the dry material is directly above the device substrate.
  • the groove cover is processed by an etching method, which increases the production cost of the product.
  • each package functional layer such as a water-blocking layer, a heat-dissipating layer, a moisture-absorbing layer, and the like
  • the layer structure of each package functional layer is easily stacked to form an OLED device which is susceptible to water and oxygen attack. , thereby affecting the display quality of the display device.
  • an organic electroluminescence display panel including: a device substrate and a package cover, and a package protection structure is formed between the device substrate and the package cover;
  • the structure includes a plurality of functional layers perpendicular to the device substrate and the package cover, the functional layer including a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, the outermost layer of the functional layer being a water blocking layer.
  • the functional layer formed by the combination of the water blocking layer, the heat dissipation layer and/or the moisture absorbing layer is alternately distributed perpendicular to the device substrate and the package cover plate, so that the functional layers are alternately arranged in the same layer, that is, the heat dissipation adhesive material,
  • the three kinds of adhesive materials of the moisture absorbing layer rubber and/or the water blocking rubber material are interspersed and arranged.
  • the embodiment of the invention can effectively reduce the distance between the device substrate and the package cover plate, reduce the lateral water oxygen erosion area, and effectively dissipate the heat generated by the OLED device uniformly and rapidly, and
  • the structure is simple, the package is simple, and the package cost and package complexity are not increased.
  • the organic electroluminescent display panel of the present embodiment includes a device substrate 1 and a package cover 2 , and a package protection structure is formed between the device substrate 1 and the package cover 2 ;
  • the package protection structure includes a device substrate perpendicular to the device 1 and a plurality of functional layers of the package cover 2, each functional layer being a water blocking layer 5, and a moisture absorbing layer 6 and/or a heat dissipation layer 7, respectively, and the outermost layer of the packaging protection structure is a water blocking layer.
  • an organic light emitting diode 3 may be formed on the device substrate 1, and an accommodating cavity 4 is disposed outside the organic light emitting diode 3, and the accommodating cavity 4 is located between the device substrate 1 and each functional layer.
  • the accommodating cavity 4 may be made of a waterproof material to protect the OLED 3 from water vapor, and to prevent the water vapor from eroding the organic light emitting diode 3 during the formation of other structures later.
  • the outermost layer in the embodiment of the present invention means that it is closer to the outer side in the direction parallel to the device substrate.
  • the embodiment of the present invention does not limit the manner of disposing the moisture absorbing layer and the heat dissipating layer, and may include the moisture absorbing layer and the heat dissipating layer, and may also include one of the moisture absorbing layer and the heat dissipating layer.
  • the display panel may include a moisture absorbing layer and a heat dissipation layer, which can The function of the moisture absorbing layer and the heat dissipating layer has a good moisture absorption effect and also contributes to the heat dissipation of the panel.
  • a buffer layer 8 may be formed on the surface of the encapsulation cover 2, the buffer layer 8 being located above each functional layer inside the outermost water blocking layer.
  • the water blocking layer 5 functions to prevent water from invading the water; the moisture absorbing layer 6 absorbs water vapor to prevent moisture from intruding into the interior of the OLED device; the heat dissipation layer 7 absorbs heat and dissipates heat, and rapidly absorbs and diffuses heat generated by the OLED device, thereby dissipating heat.
  • the buffer layer 8 can be a heat dissipation function layer or a moisture absorption function layer to further function as heat dissipation and moisture absorption, and can effectively buffer the heat dissipation property of the heat dissipation adhesive and the moisture absorption of the moisture absorption adhesive material.
  • the functional layer shown in FIG. 1 is combined into a structure in which three functional layers of the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 are combined.
  • the functional layer combinations may also be Add a moisture absorbing layer to the water blocking layer, or add a heat dissipation layer to the water blocking layer.
  • the water-blocking layer is a functional layer that must be possessed to prevent the external water vapor from eroding the OLED device.
  • the outermost water blocking layer 5 has a ring shape in a section parallel to the direction of the device substrate, such as a rectangular ring.
  • the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 located inside the outermost water blocking layer 5 are parallel to the cross section of the device substrate (the cross sections described below are all parallel to the direction of the device substrate). It is a long strip rectangle, which is also a plate shape.
  • the block-shaped water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 are alternately arranged to form a water blocking layer 5 arranged at intervals, and the moisture absorbing layer 6 is alternately disposed between the adjacent water blocking layers 5 and
  • the heat dissipation layer 7, each side of the water blocking layer 5 is a moisture absorbing layer 6 and a heat dissipation layer 7, respectively, each layer of the moisture absorbing layer 6 is a water blocking layer 5, and each layer of the heat dissipation layer 7 is also a water blocking layer. 5.
  • the arrangement of the water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 is not limited to the structure shown in FIG. 2, and the sectional shape of each functional layer may be from a rectangle, a rectangular ring, a circle, a ring, an ellipse.
  • the geometric shapes such as L-shaped, U-shaped, V-shaped, or triangular are randomly selected, and the functional layer structures are alternately interposed and arranged alternately, as shown in the structures of FIGS. 5 to 7.
  • the outermost water blocking layer 5 is annular, and its cross section is a rectangular ring.
  • the innermost water blocking layer 5 is internally nested from the outside to the inside, and a hygroscopic layer having a rectangular ring shape is sequentially arranged.
  • the water blocking layer 5, the rectangular ring is a rectangular moisture absorbing layer 6, and the rectangular annular heat absorbing layer 6 and the water blocking layer 5 are respectively provided with a heat dissipation layer 7 having a rectangular strip shape, which makes the water blocking layer 5
  • the moisture absorbing layer 6 and the heat dissipation layer 7 can be arranged in each direction and distributed relatively uniformly, so that the water and oxygen barrier ability in all directions can be enhanced.
  • each functional layer structure is equivalent to dividing the upper and lower two regions on the entire block-shaped water blocking layer 5, and the moisture absorbing layer 6 and the heat dissipation layer 7 are disposed in the same manner in each region, and each region is provided.
  • a plurality of moisture absorbing layers 6 having a rectangular strip shape are disposed at intervals, and two spaced apart heat dissipation layers 7 having a circular cross section are disposed between the adjacent two moisture absorbing layers 6, which makes the water blocking layer 5 and moisture absorbing.
  • the layer 6 and the heat dissipation layer 7 can be arranged in each direction and distributed relatively uniformly.
  • each functional layer structure is equivalent to forming a plurality of columns of moisture absorbing layers 6 on the entire block-shaped water blocking layer 5, and the moisture absorbing layer 6 has a rectangular strip shape in section, and each column of moisture absorbing layers 6 is divided into intervals.
  • a row of heat dissipation layers 7 is disposed between the adjacent two columns of moisture absorbing layers 6.
  • the heat dissipation layer 7 is also in the form of a rectangular strip.
  • the heat dissipation layer 7 is located at a gap between the two moisture absorption layers 6 in the longitudinal direction. This enables the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 to be disposed in each direction and distributed relatively uniformly.
  • the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 may be respectively attached on the device substrate 1 and the package cover 2, that is, the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 respectively
  • the device substrate 1 and the package cover 2 are in contact, so that a better sealing effect can be achieved, which is advantageous for blocking water oxygen and heat dissipation.
  • the buffer layer 8 may be a heat dissipation functional layer that may be formed of a fluorocarbon, or an organic polymer doped with carbon nanotubes or graphene, or doped with iron, or copper, or nitrided.
  • the detailed reaction equation is as follows:
  • the buffer layer 8 is capable of absorbing a small amount of moisture remaining in the OLED device and invading from the edge; and the elastic properties of the polymer layer can effectively buffer the axial deformation of the moisture absorption region.
  • the water blocking layer 5 may be formed of any one or a combination of several of SiNx, SiOx, a hydrophobic epoxy resin.
  • the moisture absorbing layer 6 may be formed of an organic substance that reacts with water.
  • the heat dissipation layer 7 may be formed of an organic polymer doped with a metal having good thermal conductivity such as iron, or copper, or aluminum nitride, or aluminum oxide, and may also be made of a fluorocarbon or doped with carbon.
  • a metal having good thermal conductivity such as iron, or copper, or aluminum nitride, or aluminum oxide
  • An organic polymer of a thermally conductive inorganic substance such as a nanotube or graphene is formed.
  • At least one embodiment of the present invention further provides a display device, which may be: a television, an OLED display, a digital photo frame, a mobile phone, a tablet computer, etc., having any display function. Product or part.
  • the packaging method comprises: first preparing a device substrate and a package cover, the device substrate comprises an organic light emitting diode; then forming a package protection structure between the device substrate and the package cover, the package protection structure comprises a plurality of functional layers, a multi-layer functional layer As the water blocking layer, and the moisture absorbing layer and/or the heat dissipation layer, the outermost layer of the functional layer is a water blocking layer.
  • each functional layer has multiple layers, with different functional layers interspersed alternately.
  • a part of the functional layer is first formed on the device substrate, and the remaining functional layers are formed on the package cover; then the device substrate and the package cover are pressed together, and the device substrate is The upper functional layer and the functional layer on the package cover are nested.
  • each functional layer is first formed on a device substrate, and then the package cover is pressed onto the device substrate.
  • each functional layer is first formed on a package cover and then the device substrate is pressed onto the package cover.
  • a buffer layer parallel to the package cover and attached to the surface of the package cover is formed, and the buffer layer is located inside the outermost water barrier layer.
  • the buffer layer is a heat dissipation functional layer or a moisture absorption functional layer.
  • the buffer layer when the buffer layer is a heat dissipation functional layer, it may be composed of a fluorocarbon or a carbon doped An organic polymer of nanotubes or graphene is formed; for example, when the buffer layer is a hygroscopic functional layer, it may be formed of an alkenyl group-containing monomer organic having two electron withdrawing groups of -CN and -COOR.
  • the heat dissipation function layer and the moisture absorption function layer respectively function to dissipate heat or absorb moisture.
  • an OLED device 3 (shown in FIG. 3a), a moisture-proof accommodating cavity 4 (shown in FIG. 3b), and a device substrate perpendicular to the OLED device 3 are sequentially formed on the device substrate 1.
  • a buffer layer 8 (shown in FIG. 4a), and a second functional layer (shown in FIG. 4b) and a third functional layer perpendicular to the package cover 2 are sequentially formed on the package cover 2 (FIG. 4c). Shown).
  • the second functional layer may be the heat dissipation layer 7
  • the third functional layer may be the moisture absorption layer 6.
  • the device substrate and the package cover are pressed together, the moisture absorbing layer 6 and the heat dissipation layer 7 are embedded in the gap between the plurality of water blocking layers 5, and the water blocking layer 5 is embedded in the gap between the moisture absorbing layer 6 and the heat dissipation layer 7,
  • the water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 are arranged at intervals, and the outermost layer of each functional layer structure is a water blocking layer 5.
  • the buffer layer 8 is a heat dissipation functional layer or a moisture absorption functional layer.
  • the buffer layer may be integrally formed with the same rubber material as the heat dissipation layer 7, for example, it may be formed of a fluorocarbon compound or an organic polymer doped with carbon nanotubes or graphene;
  • the buffer layer is a moisture absorbing functional layer, it may be integrally formed with the same moisture-absorbing layer 6 as a moisture-absorbing layer 6, for example, it may be formed of an organic group-containing monomer having two electron-withdrawing groups of -CN and -COOR.
  • the heat dissipation function layer and the moisture absorption function layer respectively function to dissipate heat or absorb moisture.
  • the specific functional layer corresponding to the first functional layer, the second functional layer and the third functional layer is not limited to the above-mentioned distribution mode.
  • the first functional layer may be a moisture absorption layer, the second functional layer and the third layer.
  • the functional layer is a water blocking layer and a heat dissipation layer, or the first functional layer is a heat dissipation layer, and the second functional layer and the third functional layer are a water blocking layer and a moisture absorbing layer, and only need to satisfy the cross arrangement of each functional layer structure and the outermost layer
  • the structure is a water blocking layer.
  • an inorganic water blocking layer (SiNx, SiOx, etc.) may be deposited on the device substrate as the moisture-proof accommodating cavity 4, for example, by enhanced chemical vapor deposition and atomic layer deposition. Etching is carried out in other ways.
  • the buffer layer 8 can be produced on the package cover by spin coating, ink jet printing or the like.
  • the buffer layer 8 may be a heat dissipation functional layer, and may be formed of a fluorocarbon compound or an organic polymer doped with carbon nanotubes or graphene, and can efficiently absorb heat transferred from the axial heat dissipation layer and timely dissipate heat.
  • These monomers are easily polymerized with nucleophilic materials such as H 2 O and RCH 2 OH to enable polymerization Absorbs a small amount of moisture remaining in the OLED device and invading from the edge, while the elastic properties of the polymer layer can effectively buffer the axial deformation of the moisture absorption zone.
  • the water blocking layer may be attached to the device substrate by a film coater or the like, and the water blocking layer may be formed of any one or a combination of a polymer of SiNx, SiOx, and a hydrophobic epoxy resin.
  • the heat dissipation layer formed on the package cover plate may be mainly formed of an organic polymer doped with a metal having good thermal conductivity such as iron or copper; or the heat dissipation layer may be made of a thermally conductive inorganic material doped with carbon nanotubes or graphene. The composition of the organic polymer.
  • the moisture absorbing layer may be attached to the package cover by a film coater or the like, and the hydrophilic material forming the moisture absorbing layer may be mainly a sheet-like rubber material doped with inorganic nanoparticles having high hygroscopicity such as CaO or MgO.
  • the packaging method is similar to that of the example 1, except that when the first package portion is prepared, the second functional layer and the third functional layer are formed perpendicular to the device substrate, and perpendicular to the package cover when the second package portion is prepared.
  • a first functional layer is formed.
  • the first functional layer, the second functional layer and the third functional layer can be arbitrarily distributed from the three functional layer structures of the water blocking layer, the moisture absorbing layer and the heat dissipation layer, and the different effects brought about by the different preparation processes are formed and formed.
  • the buffer layer can be integrally formed with the heat dissipation layer or the moisture absorption layer to simplify the manufacturing process.
  • an organic light-emitting diode is fabricated on the prepared device substrate, and then the moisture-receiving cavity is covered on the organic light-emitting diode. Then, a plurality of heat dissipation layers are alternately applied on a surface perpendicular to the accommodating cavity and the device substrate, and the device substrate structure is completed. Then, a buffer layer parallel to the surface of the package cover is attached to the surface of the prepared package cover.
  • the buffer layer functions as a moisture absorbing functional layer, so that an alternating moisture absorbing layer can be formed perpendicular to the surface of the buffer layer before the buffer layer is applied, so that a single covering operation can be realized, and both the buffer layer and the moisture absorbing layer are formed on the package cover.
  • the water blocking layer is alternately inserted between the formed moisture absorbing layers; then, the device substrate and the package cover are pressed together, and the heat dissipation layer on the device substrate and the moisture absorbing layer and the water blocking layer on the package cover plate are correspondingly Nesting, complete the packaging of the organic electroluminescent display panel.
  • the packaging process of the display panel of other different structures is not further described herein.
  • the functional layer formed by the water blocking layer, the heat dissipation layer and/or the moisture absorbing layer is perpendicularly distributed to the device substrate and the package cover plate, so that the functional layers are arranged in the same layer.
  • the three kinds of adhesive materials namely heat-dissipating adhesive material, moisture-absorbing adhesive material and water-resisting adhesive material, are inserted and arranged, which can effectively reduce the distance between the device substrate and the package cover plate and reduce lateral water oxygen.
  • the eroded area effectively dissipates the heat generated by the OLED device evenly and quickly, and has a simple structure and a simple package, which does not increase packaging cost and package complexity.

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Abstract

L'invention porte sur un panneau d'affichage électroluminescent organique et sur son procédé d'encapsulation, et sur un dispositif d'affichage. Le panneau d'affichage comprend un substrat de dispositif (1) et une plaque de couvercle d'encapsulation (2), une structure de protection d'encapsulation étant fabriquée entre le substrat de dispositif (1) et la plaque de couvercle d'encapsulation (2). La structure de protection d'encapsulation comprend une couche fonctionnelle qui est perpendiculaire au substrat de dispositif (1) et à la plaque de couvercle d'encapsulation (2), la couche fonctionnelle comprenant une couche résistant à l'eau (5), une couche d'absorption de l'humidité (6) et/ou une couche de dissipation de chaleur (7) ; et la couche la plus à l'extérieur de la couche fonctionnelle étant la couche résistant à l'eau (5). Le panneau d'affichage peut réduire une zone latérale d'érosion par l'oxygène et l'eau et émettre efficacement, uniformément et rapidement la chaleur produite par une diode électroluminescente organique (3).
PCT/CN2014/086810 2014-06-09 2014-09-18 Panneau d'affichage électroluminescent organique et son procédé d'encapsulation, et dispositif d'affichage WO2015188491A1 (fr)

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CN201410254148.8 2014-06-09
CN201410254148.8A CN104037337B (zh) 2014-06-09 2014-06-09 有机电致发光显示面板及其封装方法、显示装置

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CN104658990B (zh) * 2015-03-02 2017-05-17 京东方科技集团股份有限公司 一种封装件及其制备方法
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CN106784376A (zh) * 2016-12-27 2017-05-31 固安翌光科技有限公司 一种薄膜封装结构、包含其的oled屏体及其封装方法
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CN107221256B (zh) * 2017-07-25 2019-04-02 武汉华星光电半导体显示技术有限公司 柔性显示组件及显示屏
US10461275B2 (en) 2017-07-25 2019-10-29 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible display component and display screen
CN108615819B (zh) * 2018-04-25 2020-02-14 云谷（固安）科技有限公司 显示面板、显示面板制造方法及显示终端
WO2019205747A1 (fr) 2018-04-25 2019-10-31 云谷（固安）科技有限公司 Panneau d'affichage et dispositif d'affichage
CN109888121A (zh) * 2019-01-25 2019-06-14 深圳市华星光电半导体显示技术有限公司 发光面板、发光面板的制备方法及显示装置
CN110571354B (zh) * 2019-09-09 2022-03-01 云谷（固安）科技有限公司 封装结构、显示面板及显示装置
CN110931651A (zh) * 2019-11-22 2020-03-27 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制备方法
CN110767843B (zh) * 2019-11-29 2023-04-11 京东方科技集团股份有限公司 显示面板及制备方法、显示装置
CN111312920A (zh) * 2020-02-17 2020-06-19 合肥鑫晟光电科技有限公司 一种显示装置及其制作方法

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CN1484473A (zh) * 2002-08-08 2004-03-24 Lg.������Lcd���޹�˾ 有机电致发光器件及其制造方法
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CN104037337A (zh) * 2014-06-09 2014-09-10 京东方科技集团股份有限公司 有机电致发光显示面板及其封装方法、显示装置

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