WO2015178358A1

WO2015178358A1 - Panel manufacturing method

Info

Publication number: WO2015178358A1
Application number: PCT/JP2015/064257
Authority: WO
Inventors: 直彦八木; 尚利稲山
Original assignee: 日本電気硝子株式会社
Priority date: 2014-05-23
Filing date: 2015-05-19
Publication date: 2015-11-26
Also published as: TWI633963B; JP6512221B2; KR20170010743A; KR102246031B1; JPWO2015178358A1; CN106029591B; CN106029591A; TW201607661A

Abstract

Provided is a panel manufacturing method that includes a cutting step for cutting a liquid crystal panel substrate (1) along an intended cutting line (2), wherein provided is an initial crack forming step in which in a first glass substrate plate (3) and a second glass substrate plate (4), initial cracks (8, 9) are formed respectively at end parts (3a, 4a) which are located at one end (2a) of the intended cutting line (2). The cutting step is performed by carrying out, on the liquid crystal panel substrate (1) from the upper-surface side of the liquid crystal panel substrate (1), heating by radiating a laser along the intended cutting line (2) and cooling using a coolant following the heating, and in conjunction with the foregoing, causing the initial cracks (8, 9) to develop together.

Description

Panel manufacturing method

The present invention relates to a method for manufacturing a liquid crystal panel, an organic EL panel or the like.

As is well known, a liquid crystal panel includes two glass substrates facing each other, a color filter substrate on which BM, RGB, and photo spacers are patterned, and a TFT substrate on which thin film transistors and transparent electrodes are patterned. Yes. Both substrates are bonded to each other with a sealing material applied along their peripheral portions, and a liquid crystal material is sealed in a space surrounded by the sealing material between the two substrates.

By the way, when manufacturing LCD panels for LCD TVs and mobile devices, rather than manufacturing individual LCD panels one by one, a plurality of LCD panels can be manufactured using the following method. Sometimes manufactured together.

In this method, first, a first glass mother substrate (color filter mother substrate) formed by patterning BM, RGB, and photo spacers for a plurality of liquid crystal panels on a single glass plate, and a single glass plate. A second glass mother substrate (TFT mother substrate) formed by patterning thin film transistors and transparent electrodes for a plurality of surfaces is produced. Next, the two base substrates are bonded together with a plurality of sealing materials, and a liquid crystal material is sealed in each of the spaces surrounded by the sealing materials, so that a liquid crystal panel base material including a plurality of liquid crystal panels is obtained. Make it. Finally, the liquid crystal panel base material is cut to obtain individual liquid crystal panels from the base material.

Here, Patent Document 1 discloses a method for cutting a liquid crystal panel base material when a liquid crystal panel is manufactured by the above-described technique.

In this document, as shown in FIG. 6, along the boundary Y between adjacent liquid crystal panels 101 and 102 (between the seal materials 201 and 202), the laser L1, A method of cutting the base material 100 by irradiating the laser L2 from the back side is disclosed. In this method, in each of the first glass mother substrate 100a existing on the front surface side of the liquid crystal panel base material 100 and the second glass mother substrate 100b existing on the rear surface side, on the back surface of the portion irradiated with the lasers L1 and L2,

Films

301 and 302 having higher thermal conductivity than both

mother substrates

100a and 100b are formed in advance. Thereby, when the liquid crystal panel base material 100 is cut, heat by laser irradiation is concentrated on the boundary Y through the

films

301 and 302, and the base material 100 (both

base substrates

100a and 100b) is cut.

JP 2002-224870 A

However, the method disclosed in Patent Document 1 has the following problems to be solved. That is, in the method disclosed in the document, in order to cut the liquid crystal panel base material, in each of the first glass base substrate and the second glass base substrate, in all the portions that are the boundary of the adjacent liquid crystal panels, It is necessary to perform a film forming process in advance. Therefore, especially when there are a large number of liquid crystal panels to be cut out from the liquid crystal panel base material, the film forming process becomes complicated and the manufacturing efficiency is deteriorated, and an inherently unnecessary film is formed on the product. This also increases the manufacturing cost.

Further, in this method, the laser irradiated from the front surface side of the liquid crystal panel base material can cut only the first glass mother substrate, and the laser irradiated from the back surface side can only cut the second glass mother substrate. Can be cut. Therefore, in cutting the liquid crystal panel base material, it is essential to irradiate the laser from both the front surface side and the back surface side of the base material. And the glass cutting method using a laser tends to be expensive as compared with other glass cutting methods (for example, folding). For this reason, there is a concern about further increase in manufacturing cost due to the laser irradiation from both the front surface side and the back surface side.

Such a problem is a problem that may occur not only when the liquid crystal panel base material is cut but also when other panel base materials such as a base material of an organic EL panel are cut. The present invention made in view of such circumstances is to enable cutting of a panel base material at a low cost and in a simple manner when cutting and manufacturing individual panels by cutting the panel base material. As an objective.

The present invention, which was created to solve the above problems, includes a first glass mother substrate provided with a first glass substrate in each region partitioned by a planned cutting line, and a first glass substrate facing each region. By having a second glass mother substrate provided with two glass substrates and a built-in member incorporated so as to be interposed between the first glass substrate and the second glass substrate in each region, the first in each region A panel base material including a glass substrate, a second glass substrate, and a panel including a built-in member as a component, and a panel manufacturing method including a cutting step of cutting the panel base material along a planned cutting line. Including an initial crack forming step for forming an initial crack at an end located on one end side of the planned cutting line in each of the first glass mother substrate and the second glass mother substrate, and to be cut into a panel base material Le along the line Heating by Heather irradiation, and, with the cooling by refrigerant to follow this to perform the one side of the panel base material, by progress together both initial crack, characterized in performing the cutting step.

According to such a method, at the time of performing the cutting step, heating by laser irradiation along the planned cutting line to the panel base material, and cooling by the refrigerant that follows this are performed from one side of the panel base material. Do. Therefore, among the first glass mother substrate and the second glass mother substrate, the mother substrate located on the laser irradiation source side (hereinafter referred to as the irradiation source side mother substrate) has a temperature gradient and thermal stress is generated. appear. Then, the initial crack propagates along the planned cutting line due to the thermal stress. At this time, not only the irradiation source side mother substrate but also the mother substrate located on the laser irradiation destination side (hereinafter referred to as the irradiation destination side mother substrate) can propagate the initial crack along the planned cutting line. Is possible. It is assumed that such an effect is obtained for the following reason. That is, the built-in member is interposed between the irradiation source side mother board and the irradiation destination side mother board. Due to the interposition of this built-in member, the thermal stress generated in the irradiation-source side mother board propagates to the irradiation-destination-side mother board through the built-in member, and this propagated stress propagates the initial crack in the irradiation-destination-side mother board. It is assumed that As a result, both base substrates are cut by both initial cracks that propagate together, and the panel base material is cut. As described above, in this method, if heating by laser irradiation along the planned cutting line and cooling by the refrigerant that follows this are performed from one side, a panel base material (first glass base substrate) is attached accordingly. , And the second glass mother substrate). Therefore, it becomes possible to cut the panel base material easily at low cost.

In the above method, the initial crack forming step may be performed by rolling a scribe wheel.

In this way, the initial crack formation process can be performed easily and quickly.

In the above method, an end portion (hereinafter, referred to as a first end portion) located on one end side of the planned cutting line in the first glass mother substrate and a first end side of the planned cutting line in the second glass mother substrate It is preferable that the end portion (hereinafter referred to as the second end portion) positioned is shifted and positioned in the direction in which the planned cutting line extends.

In this way, one of the first end and the second end is in a state of protruding from the other. Thus, in the initial crack formation process, both initial cracks can be obtained by rolling a single scribe wheel only once from one end side of the planned cutting line to the other end side or from the other end side to the one end side. Can be formed continuously.

In the above method, it is preferable that the length of deviation between the first end and the second end is 0.2 mm to 5 mm.

Of the first end portion and the second end portion, for the end portion that protrudes, if the length that protrudes is 0.2 mm or more, scribe on the end portion that protrudes It is possible to ensure a sufficient length for the wheel to roll. Therefore, it is possible to suitably form an initial crack with respect to the end portion on the protruding side. In addition, if the protruding length is 5 mm or less, it is possible to prevent as much as possible an increase in the number of parts that are inherently unnecessary in the panel base material (parts provided to form initial cracks). It is possible to avoid an unreasonable increase in manufacturing costs. From these facts, if the length of the first end portion and the second end portion is shifted to 0.2 mm to 5 mm, initial cracks can be suitably formed, and an unreasonable increase in manufacturing cost can be avoided. Is possible.

In the above method, it is preferable to perform the initial crack formation step by rolling the scribe wheel in a direction from the other end side to the one end side of the planned cutting line.

In this way, in the initial crack formation step, the scribe wheel rolls from the inner side of the panel base material toward the outer peripheral end. Thereby, in forming both initial cracks, a situation in which the rolling scribe wheel rides on the first end and the second end cannot occur. Therefore, it is possible to avoid the first end portion and the second end portion from being unduly damaged by an impact at the time of riding.

In the above method, the initial crack formation step may be performed by irradiating a pulse laser.

Usually, the gap formed between the first glass mother substrate and the second glass mother substrate is extremely narrow. For this reason, when the first end portion and the second end portion are not shifted and positioned in the direction in which the planned cutting line extends (when the panel base material is viewed in a plan view, the first end portion and the second end portion Even if an attempt is made to form an initial crack by inserting a scribe wheel between the two mother substrates in a case where the portion overlaps the portion, it may be difficult to execute. However, according to the pulse laser, it is possible to form an initial crack at a spot where the laser is condensed regardless of whether the first end and the second end are shifted from each other. . Thereby, both initial cracks can be reliably formed in a desired location.

In the above method, the laser irradiation conditions in the cutting step are the heating by laser irradiation on a glass plate having a thickness equal to or greater than the thickness of the first glass mother substrate and the second glass mother substrate, and this It is preferable that the initial crack formed at the end portion of the glass plate is advanced to be cut and cut by cooling with a refrigerant that follows.

In this way, the panel base material can be suitably cut.

In the above method, the thickness of the first glass mother substrate and the second glass mother substrate is preferably 10 μm to 300 μm.

In this way, the thickness of the first glass base substrate and the second glass base substrate is sufficiently thin, so that both glass base substrates can be prevented from being damaged when the panel base material is cut, and the panel base material is cut. It becomes easy to do.

In the above method, the width of the gap formed between the first glass mother substrate and the second glass mother substrate is preferably 0.1 μm to 20 μm.

This makes it easier to cut the panel base material. It is assumed that this is because the thermal stress generated in the irradiation source side mother board is easily propagated to the irradiation destination side mother board through the built-in member because the thickness of the built-in member is reduced.

As described above, according to the present invention, by cutting the panel base material, it is possible to cut the panel base material at low cost and easily when individual panels are cut out and manufactured.

It is a perspective view which shows a liquid crystal panel base material. It is a perspective view which shows the state which removed the 1st glass base substrate virtually from the liquid crystal panel base material shown to FIG. It is a top view which shows the initial stage crack formation process in the manufacturing method of the panel which concerns on 1st embodiment of this invention. It is a top view which shows the initial stage crack formation process in the manufacturing method of the panel which concerns on 1st embodiment of this invention. It is a top view which shows the cutting process in the manufacturing method of the panel which concerns on 1st embodiment of this invention. It is a top view which shows the cutting process in the manufacturing method of the panel which concerns on 1st embodiment of this invention. It is a top view which shows the state which removed the 1st glass mother board | substrate virtually from the liquid crystal panel base material shown to FIG. 4a. It is a vertical front view which shows the initial stage crack formation process in the manufacturing method of the panel which concerns on 2nd embodiment of this invention. It is a vertical front view which shows the initial stage crack formation process in the manufacturing method of the panel which concerns on 2nd embodiment of this invention. It is a vertical front view which shows the manufacturing method of the panel in the past.

Hereinafter, a panel manufacturing method according to an embodiment of the present invention will be described with reference to the accompanying drawings. In the embodiment described below, a case where individual liquid crystal panels are cut out by cutting a liquid crystal panel base material as a panel base material will be described as an example.

<First embodiment>
First, a liquid crystal panel base material to be cut in the panel manufacturing method according to the first embodiment of the present invention will be described.

As shown in FIGS. 1a and 1b, the liquid crystal panel base material 1 includes a first glass base substrate provided with a first glass substrate 31 in each region (two regions in the present embodiment) defined by the planned cutting line 2. 3 and a second glass substrate 4 provided with a second glass substrate 41 facing the first glass substrate 31 in each region, and interposed between the first glass substrate 31 and the second glass substrate 41 in each region. And a sealing material 5 as a built-in member. Thus, the liquid crystal panel base material 1 includes the liquid crystal panel 11 that is a panel including the first glass substrate 31, the second glass substrate 41, and the sealing material 5 as components in each region. That is, the liquid crystal panel base material 1 includes two surfaces of liquid crystal panels 11. The first glass mother substrate 3 (first glass substrate 31) and the second glass mother substrate 4 (second glass substrate 41) are made of, for example, non-alkali glass.

Each of the first glass mother substrate 3 and the second glass mother substrate 4 has a rectangular shape and a thickness of 10 μm to 300 μm. The width of the gap (cell gap) formed between the

mother substrates

3 and 4 is 0.1 μm to 20 μm. Each first glass substrate 31 included in the first glass mother substrate 3 is a color filter substrate on which BM, RGB, and photo spacers (all of which are not shown) are patterned. On the other hand, each second glass substrate 41 included in the second glass mother substrate 4 is a TFT substrate on which a thin film transistor and a transparent electrode (both not shown) are patterned. The sealing material 5 is interposed between the first glass substrate 31 and the second glass substrate 41 to bond the

substrates

31 and 41 together, and is formed along the peripheral edge of the

substrates

31 and 41. A liquid crystal material (not shown) is sealed in the space 6 surrounded by the sealing material 5. A gap having a predetermined width is formed between the sealing materials 5 adjacent to each other with the planned cutting line 2 interposed therebetween. The sealing material 5 is made of, for example, an ultraviolet curable resin.

An end 3a (hereinafter referred to as a first end 3a) located on one end 2a side of the planned cutting line 2 in the first glass mother substrate 3, and one end of the planned cutting line 2 in the second glass mother substrate 4 The end 4a located on the 2a side (hereinafter referred to as the second end 4a) is shifted in the direction in which the planned cutting line 2 extends. The length Z in which the first end portion 3a and the second end portion 4a are displaced is set to 0.2 mm to 5 mm. Thereby, the second end 4a protrudes from the first end 3a.

Here, the thicknesses of the first glass mother substrate 3 and the second glass mother substrate 4 are more preferably 10 μm to 100 μm. Further, the width of the gap formed between the

mother substrates

3 and 4 is more preferably 0.1 μm to 10 μm, and most preferably 0.1 μm to 5 μm. Furthermore, the length Z in which the first end portion 3a and the second end portion 4a are displaced is more preferably 0.5 mm to 3 mm. In addition, the width of the gap formed between the adjacent sealing materials 5 is preferably 1 mm to 5 mm. If it does in this way, it will become easy to behave as the liquid crystal panel base material 1 is integrated.

Hereinafter, a mode in which the liquid crystal panel base material 1 is cut and the individual liquid crystal panels 11 are cut out by the panel manufacturing method according to the first embodiment will be described.

As shown in FIGS. 2a to 4b, the method for manufacturing this panel is performed by the scribe wheel 7 on the first end 3a of the first glass mother substrate 3 and the second end 4a of the second glass mother substrate 4. An initial crack forming step (FIGS. 2a and 2b) for forming

initial cracks

8 and 9, respectively, heating by laser irradiation along the planned cutting line 2 to the liquid crystal panel base material 1, and cooling by a refrigerant following this Is performed from the upper surface side of the liquid crystal panel base material 1, and both the

initial cracks

8 and 9 are developed to cut the liquid crystal panel base material 1 (FIGS. 3, 4a, and 4b); Is included.

In the initial crack formation step, as shown by the white arrow in FIG. 2a, the single scribe wheel 7 is rolled only once in the direction from the other end 2b side of the planned cutting line 2 to the one end 2a side. That is, the single scribe wheel 7 is rolled only once from the inner side of the liquid crystal panel base material 1 toward the outer peripheral end. Here, the distance for rolling the scribe wheel 7 is preferably 1 mm to 10 mm. At this time, the scribe wheel 7 rolls on the first end portion 3a to form the initial crack 8, and then descends from the first end portion 3a to the second end portion 4a, and on the second end portion 4a. Roll to form an initial crack 9. In addition, it is suitable when forming both the

initial cracks

8 and 9 if the pressure which presses the scribe wheel 7 against the 1st end part 3a and the 2nd end part 4a is kept constant. Thereby, as shown in FIG. 2b, the formation of the initial crack 8 in the first end portion 3a and the formation of the initial crack 9 in the second end portion 4a are continuously performed. In the present embodiment, both

initial cracks

8 and 9 are formed on the upper surface side of the first end portion 3a and the second end portion 4a.

In the cutting step, as shown in FIG. 3, the liquid crystal panel base material 1 is heated by laser irradiation, and the cooling unit is cooled by jetting a coolant (for example, mist-like water). 12 are formed adjacent to each other. In the present embodiment, laser irradiation and refrigerant injection are performed only from the upper surface side of the liquid crystal panel base material 1. Here, the conditions of laser irradiation follow the heating by laser irradiation to a glass plate having a thickness equal to or more than the sum of the thickness of the first glass mother substrate 3 and the thickness of the second glass mother substrate 4, and follow this. By performing the cooling with the refrigerant, the initial crack formed at the end of the glass plate is caused to be a condition for cutting. That is, it is set as the conditions at the time of cut | disconnecting the glass plate which has the thickness more than the sum of the thickness of both mother board |

substrates

3 and 4 by laser cutting. The laser irradiation condition may be a condition for cutting a glass plate having a thickness 1.1 to 2.1 times the sum of the thicknesses of both

mother substrates

3 and 4 by laser cleaving. The laser irradiation condition may be a condition for cutting a glass plate having a thickness 1.4 to 2.0 times the sum of the thicknesses of both

mother substrates

3 and 4 by laser cutting.

And as shown by the white arrow in FIG. 3, the heating unit 10 and the cooling unit 12 are moved from the one end 2a side of the planned cutting line 2 toward the other end 2b side. The formation of the heating unit 10 and the cooling unit 12 is first performed only on the second end 4a protruding from the first end 3a. The temperature gradient generated by the heating unit 10 and the cooling unit 12 generates thermal stress, and the thermal stress propagates the initial crack 9 formed in the second end portion 4 a along the planned cutting line 2.

When the heating unit 10 and the cooling unit 12 have passed through the second end 4a, the heating unit 10 and the cooling unit 12 are the first glass mothers that are constituent elements of the liquid crystal panel base material 1, as shown in FIG. Of the substrate 3 and the second glass mother substrate 4, the first glass mother substrate 3 positioned on the upper surface side (laser irradiation source side) of the liquid crystal panel base material 1 is formed. Thereby, the initial stress 8 formed in the first end portion 3a by the thermal stress propagates along the planned cutting line 2, and the first glass mother substrate 3 is cut. At this time, as shown in FIG. 4 b, not only the first glass mother substrate 3 but also the second glass mother substrate 4 located on the lower surface side (laser irradiation side) of the liquid crystal panel base material 1, the initial crack 9 Advances along the planned cutting line 2, and the second glass mother substrate 4 is cut. That is, the initial crack 9 that has progressed through the second end 4a continues to progress.

It is assumed that such an action is obtained for the following reason. That is, the sealing material 5 is interposed between the first glass mother substrate 3 and the second glass mother substrate 4. The thermal stress generated in the first glass mother substrate 3 is propagated to the second glass mother substrate 4 through the sealing material 5 due to the intervention of the sealing material 5, and the propagated stress is initially generated in the second glass mother substrate 4. It is assumed that the crack 9 is developed. The propagation of thermal stress is assumed to become more prominent as the first glass mother substrate 3 and the second glass mother substrate 4 are thinner. Thereby, both

mother substrates

3 and 4 are cut, and the liquid crystal panel base material 1 is cut.

Hereinafter, the operation and effect when the panel manufacturing method according to the first embodiment is employed will be described.

According to this method for manufacturing a panel, if the liquid crystal panel base material 1 is heated by laser irradiation along the planned cutting line 2 and cooled by a refrigerant that follows this, from the upper surface side, along with this, The liquid crystal panel base material 1 (the first glass base substrate 3 and the second glass base substrate 4) can be cut. Therefore, the liquid crystal panel base material 1 can be cut easily at low cost. In addition, (1) The conditions of laser irradiation were set as the conditions at the time of cutting | disconnecting the glass plate which has the thickness more than the sum of the thickness of both

mother substrates

3 and 4 by laser cleaving, (2) Both

mother substrates

3 and 4 Is 3 μm or less, and (3) the width of the gap formed between the two

base substrates

3 and 4 is 20 μm or less, the liquid crystal panel base material 1 can be more easily cut.

Further, in the liquid crystal panel base material 1, the first end portion 3a and the second end portion 4a are shifted from each other in the direction in which the planned cutting line 2 extends, and the second end portion 4a protrudes from the first end portion 3a. ing. Therefore, in the initial crack formation step, the initial scribe wheel 7 is continuously rolled by rolling the single scribe wheel 7 only once from the other end 2b side of the planned cutting line 2 to the one end 2a side. Can be formed.

Furthermore, the following effects can also be obtained by setting the length Z at which the first end portion 3a and the second end portion 4a are shifted to 0.2 mm to 5 mm. That is, it becomes possible to secure a sufficient length for the scribe wheel 7 to roll on the second end portion 4a, and an unnecessary portion (initial crack 9 is originally formed in the liquid crystal panel base material 1). It is possible to prevent as much as possible the number of parts to be formed to increase, and to avoid an unreasonable increase in manufacturing cost. These effects can be further enhanced by setting the length Z in which the first end portion 3a and the second end portion 4a are displaced within the range of 0.5 mm to 3 mm.

In addition, in this panel manufacturing method, the scribe wheel 7 is rolled in a direction from the other end 2b side of the planned cutting line 2 toward the one end 2a side. Thereby, the scribe wheel 7 rolls from the inner side of the liquid crystal panel base material 1 toward the outer peripheral end. Therefore, when forming both the

initial cracks

8 and 9, the rolling scribe wheel 7 cannot run up to the first end 3a or the second end 4a. For this reason, it is possible to avoid the first end portion 3a and the second end portion 4a from being unduly damaged by an impact at the time of riding.

Hereinafter, one specific example of the manufacturing method of the panel according to the first embodiment will be given.

First, two glass substrates (OA-10G) manufactured by Nippon Electric Glass Co., Ltd. were prepared. Next, a transparent glass or the like for two surfaces was formed on each of the two glass substrates to form a first glass mother substrate 3 and a second glass mother substrate 4, respectively. The thicknesses of both

mother substrates

3 and 4 are 100 μm. Next, the two

mother boards

3 and 4 are bonded together with the sealing material 5 for two surfaces interposed therebetween, and a liquid crystal material is sealed in each of the spaces 6 surrounded by the sealing material 5 to include the liquid crystal panel 11 for two surfaces. A liquid crystal panel base material 1 was prepared. At this time, the width of the gap (cell gap) formed between the

mother substrates

3 and 4 was set to 9 μm. In addition, as shown in Table 1 below, seven types of liquid crystal panel base materials 1 having different lengths Z from which the first end portion 3a and the second end portion 4a were shifted were produced.

Next, for each of the seven types of liquid crystal panel base material 1, the scribe wheel 7 (diamond chip) is rolled in the direction from the other end 2b side to the one end 2a side of the planned cutting line 2 to thereby form both initial cracks. 8, 9 were formed. Finally, each liquid crystal panel base material 1 is heated by laser irradiation and cooled by spraying mist water that follows the liquid crystal panel base material 1, so that one end 2 a side of the planned cutting line 2 is changed from the other end 2 b side. The cutting of each liquid crystal panel base material 1 was attempted. The conditions for laser irradiation, the conditions for jetting mist water, and the conditions for forming both

initial cracks

8 and 9 are common when cutting the liquid crystal panel base material 1, and are as follows. Laser type: CO2 laser, laser wavelength: 10.6 μm, laser scanning speed: 25 mm / s, laser output: 15 W, mist water injection pressure: 0.06 MPa, mist water flow rate: 0.4 ml / min The diameter of the scribe wheel 7 is 3 mm, and the rolling speed of the scribe wheel 7 is 10 mm / s.

When cutting each liquid crystal panel base material 1 under the above conditions, the results shown in Table 1 below were obtained. Here, with respect to the cutting properties shown in Table 1, “◎” represents that the liquid crystal panel base material 1 could be cut well, “◯” represents that the liquid crystal panel base material 1 could be cut, and “ "X" represents that the liquid crystal panel base material 1 could not be cut.

From the results shown in Table 1, when the length Z where the first end portion 3a and the second end portion 4a are shifted is 0.2 mm or more, the liquid crystal panel base material 1 can be cut, and the length When Z is 0.5 mm or more, it turns out that the liquid crystal panel base material 1 was cut | disconnected favorably. In addition, about the liquid crystal panel base material 1 of Z = 0.186mm which was impossible to cut | disconnect, the 2nd glass base substrate 4 was not able to be cut | disconnected. However, in the liquid crystal panel base material 1, in addition to the scribe wheel 7 described above, a separate initial crack is formed on the second glass base substrate 4 using sandpaper, so The two-glass base substrate 4 can be cut, and the liquid crystal panel base material 1 can be cut.

<Second embodiment>
Hereinafter, the manufacturing method of the panel which concerns on 2nd embodiment of this invention is demonstrated. In the description of the second embodiment, the same reference numerals are assigned to the same elements as those already described in the first embodiment in the drawings and the explanatory text for describing the second embodiment. Therefore, duplicate explanations are omitted. In the second embodiment, only differences from the first embodiment will be described.

The panel manufacturing method according to the second embodiment is different from the panel manufacturing method according to the first embodiment described above in the liquid crystal panel base material 1 to be cut in the first end 3a. The second end 4a is located at the same position in the direction in which the planned cutting line 2 extends, and the

points

3a and 4a are not shifted from each other (Z = 0 mm in the first embodiment), As shown in FIGS. 5a and 5b, in the initial crack formation step, both

initial cracks

8 and 9 are formed by irradiation with a picosecond laser 13 as a pulse laser.

In the present embodiment, when the initial crack 8 is formed on the first end portion 3a and when the initial crack 9 is formed on the second end portion 4a, the picosecond laser 13 is collected on the upper surfaces of the

end portions

3a and 4a. It is illuminated (the top surface is the focal point of the picosecond laser 13). The formation of both

initial cracks

8 and 9 may be performed by irradiating a femtosecond laser as a pulse laser instead of the picosecond laser 13. Here, the wavelength of the pulse laser may be appropriately selected from various wavelengths according to the absorption rate of the first glass mother substrate 3 and the second glass mother substrate 4 and the pulse width of the pulse laser.

Hereinafter, the operation and effect when the panel manufacturing method according to the second embodiment is employed will be described.

Usually, the gap (cell gap) formed between the first glass mother substrate 3 and the second glass mother substrate 4 is extremely narrow. For this reason, when the first end portion 3a and the second end portion 4a are not shifted in the direction in which the planned cutting line 2 extends, the scribe wheel 7 is caused to enter between both the

mother substrates

3 and 4. Even if the initial crack 9 is to be formed, the execution may be difficult. However, according to the picosecond laser 13, regardless of whether or not the first end portion 3a and the second end portion 4a are shifted from each other, the initial cracks are respectively generated at the locations where the picosecond laser 13 is condensed. 8, 9 can be formed. Thereby, both the

initial cracks

8 and 9 can be reliably formed in a desired location.

Here, the panel manufacturing method according to the present invention is not limited to the mode described in each of the above embodiments. For example, in each of the above-described embodiments, an individual liquid crystal panel is cut out by cutting a liquid crystal panel base material including liquid crystal panels for two surfaces. Of course, liquid crystal panels for three or more surfaces are included. Even when the liquid crystal panel base material is cut, the panel manufacturing method according to the present invention can be applied.

Moreover, in said 1st embodiment, although it becomes the aspect which forms both initial stage cracks by rolling a scribe wheel from the other end side of a planned cutting line to the one end side in an initial crack formation process. Alternatively, both initial cracks may be formed by rolling a scribe wheel from one end side to the other end side. That is, both initial cracks may be formed by rolling the scribe wheel inward from the outer peripheral end of the liquid crystal panel base material. Further, in the first embodiment, both initial cracks are continuously formed by rolling a single scribe wheel only once. However, individual initial cracks may be formed separately.

In the second embodiment described above, both initial cracks are formed by irradiating a pulse laser such as a picosecond laser or a femtosecond laser, but this is not restrictive. Instead of the pulse laser, both initial cracks may be formed by irradiating with a short wavelength laser such as a UV laser. In addition, it may replace with the scribe wheel in said 1st embodiment, and the pulse laser in 2nd embodiment, and may form both initial stage cracks using a sandpaper etc., for example.

In each of the above embodiments, in the initial crack forming step, the initial crack is formed on the upper surface side of both the first end and the second end, but this is not restrictive. . In either the first end portion or the second end portion, an initial crack may be formed on either the upper surface side or the lower surface side. For example, an initial crack may be formed on the upper surface side at the first end portion, and an initial crack may be formed on the lower surface side at the second end portion. In addition, when forming an initial crack by irradiation of a pulse laser as in the second embodiment, the initial crack is formed on the first end portion and on the upper surface side and the lower surface side of the second end portion. Regardless, the laser may be irradiated from the upper surface side of the liquid crystal panel base material, or may be irradiated from the lower surface side (the same applies when irradiating a short wavelength laser such as a UV laser). Furthermore, as in the second embodiment, when the first end and the second end are at the same position in the direction in which the planned cutting line extends, the scribe wheel is disposed in the thickness direction of the liquid crystal panel base material. The initial crack may be formed at the first end portion and the second end portion by rolling along.

Further, in each of the above embodiments, in the cutting step, the liquid crystal panel base material is irradiated with laser only from the upper surface side and cooled by the refrigerant that follows this, but these are performed from the lower surface side. It is good also as an aspect performed only. Further, in each of the above-described embodiments, the laser irradiation condition is a condition for cutting a glass plate having a thickness equal to or larger than the sum of the thicknesses of both mother substrates by laser cleaving, but this is not necessarily required.

In each of the above embodiments, the individual liquid crystal panels are cut out by cutting the liquid crystal panel base material. The panel manufacturing method according to the present invention is, for example, an organic EL for a plurality of surfaces. The present invention can also be applied to a case where individual organic EL panels are cut out by cutting an organic EL panel base material including a panel.

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel base material 11 Liquid crystal panel 2 Planned cutting line 2a One end of the planned cutting line 3 First glass mother substrate 3a First end 31 First glass substrate 4 Second glass mother substrate 4a Second end 41 Second glass Substrate 5 Sealing material 7

Scribe wheel

8, 9 Initial crack 13 Picosecond laser

Claims

A first glass mother substrate provided with a first glass substrate in each region partitioned by a planned cutting line; a second glass mother substrate provided with a second glass substrate facing the first glass substrate in each region; The first glass substrate and the second glass substrate are provided in each region by including an assembly member incorporated so as to be interposed between the first glass substrate and the second glass substrate in each region. And a panel base material provided with a panel including the built-in member as a component, a panel manufacturing method including a cutting step of cutting the panel base material along the planned cutting line,
Including an initial crack forming step for forming an initial crack at an end located on one end side of the planned cutting line in each of the first glass mother substrate and the second glass mother substrate;
As the panel base material is heated from the laser irradiation along the planned cutting line and cooled by the cooling medium that follows this, both initial cracks are developed together. Then, the said cutting process is performed, The manufacturing method of the panel characterized by the above-mentioned.
2. The method for manufacturing a panel according to claim 1, wherein the initial crack forming step is performed by rolling a scribe wheel.
In the first glass mother substrate, an end portion located on one end side of the planned cutting line, and an end portion located on one end side of the planned cutting line in the second glass mother substrate, the planned cutting line is The panel manufacturing method according to claim 2, wherein the panel is shifted in the extending direction.
The length of the end portion located on one end side of the planned cutting line in the first glass mother substrate and the end portion located on one end side of the planned cutting line in the second glass mother substrate are shifted, The panel manufacturing method according to claim 3, wherein the thickness is 0.2 mm to 5 mm.
5. The initial crack forming step is performed by rolling the scribe wheel in a direction from the other end side to the one end side of the planned cutting line. The manufacturing method of the panel of description.
The method for manufacturing a panel according to claim 1, wherein the initial crack forming step is performed by irradiating a pulse laser.
Conditions for the laser irradiation in the cutting step,
A glass plate having a thickness equal to or greater than the sum of the thickness of the first glass mother substrate and the thickness of the second glass mother substrate is heated by laser irradiation, and cooled by a refrigerant that follows this, The method for producing a panel according to any one of claims 1 to 6, characterized in that the initial crack formed at the end of the glass plate is used as a condition for cutting.
The panel manufacturing method according to any one of claims 1 to 7, wherein the first glass mother substrate and the second glass mother substrate have a thickness of 10 袖 m to 300 袖 m.
9. The manufacturing of a panel according to claim 1, wherein a width of a gap formed between the first glass mother substrate and the second glass mother substrate is 0.1 μm to 20 μm. Method.