WO2015178333A1 - Surface-mounted crystal resonator, manufacturing method therefor, and oscillator - Google Patents

Surface-mounted crystal resonator, manufacturing method therefor, and oscillator Download PDF

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Publication number
WO2015178333A1
WO2015178333A1 PCT/JP2015/064152 JP2015064152W WO2015178333A1 WO 2015178333 A1 WO2015178333 A1 WO 2015178333A1 JP 2015064152 W JP2015064152 W JP 2015064152W WO 2015178333 A1 WO2015178333 A1 WO 2015178333A1
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WO
WIPO (PCT)
Prior art keywords
connection terminal
terminal
pattern
support electrode
crystal
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PCT/JP2015/064152
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French (fr)
Japanese (ja)
Inventor
平野展弘
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日本電波工業株式会社
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Publication of WO2015178333A1 publication Critical patent/WO2015178333A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a surface-mount crystal resonator, and more particularly to a surface-mount crystal resonator that is easy to manufacture, has good quality, and can reduce the influence of external noise, a method for manufacturing the same, and an oscillator.
  • the surface-mounted crystal unit Since the surface-mounted crystal unit is small and light, it is built in as a frequency and time reference source, especially in portable electronic devices. Some conventional surface-mount crystal units have a crystal piece mounted on a ceramic substrate, and are covered with a concave cover upside down and hermetically sealed. In recent years, the frequency deviation ⁇ f / f is relatively loose, and there is an inexpensive consumer use of, for example, ⁇ 150 to ⁇ 250 ppm.
  • a general configuration of a conventional surface-mount crystal unit is such that a metal electrode pattern of, for example, AgPd (silver / palladium) is formed on a ceramic substrate, and a support electrode of AgPd is provided on a portion that supports the crystal piece. The crystal pieces are lifted by the supporting electrodes.
  • a metal electrode pattern of, for example, AgPd silver / palladium
  • a support electrode of AgPd is provided on a portion that supports the crystal piece. The crystal pieces are lifted by the supporting electrodes.
  • the metal electrode and the support electrode are made of AgPd because it is difficult to oxidize and sulfide.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2013-070357 “Surface Mounted Crystal Resonator and Method for Manufacturing the Same” (Nippon Denpa Kogyo Co., Ltd.)
  • Patent Document 2 Japanese Unexamined Patent Application Publication No. 2014-030082, “Surface Mounted Crystal. There are “Oscillator” (Nippon Denpa Kogyo Co., Ltd.)
  • Patent Document 2 Japanese Utility Model Publication No. 05-085121, “Surface Mounted Retainer and Surface Mount Device” (Meidensha Corporation) [Patent Document 3].
  • Patent Document 1 in a surface-mount crystal oscillator, a support electrode lower layer portion supporting a crystal piece is connected to a through terminal formed at a corner portion of a substrate, and the support electrode lower layer portion is formed of AgPd and supported thereon.
  • An electrode is formed of Ag, an insulating film is formed on the inner periphery of the substrate, and a cover on the insulating film is mounted.
  • Patent Document 2 discloses a configuration in which a glass layer is formed on a substrate portion in contact with a cover and the cover is glass-sealed in a surface-mounted crystal resonator.
  • Patent Document 3 discloses a metal film that is connected to a metal cover on a long side surface of a substrate in which a power supply electrode terminal and a ground electrode terminal are formed on the back surface of the substrate and the ground electrode terminal is in contact with the surface mount device. The configuration that forms is shown.
  • Patent Document 1 the metal cover is sealed with resin, and in Patent Document 2, the metal cover is sealed with glass, but the metal cover is not connected to the ground level.
  • the metal cover is configured to be sealed with glass, but since the substrate and the metal cover are connected to each other by a metal film on the side surface, the metal cover must be grounded only after being divided into individual devices. The level cannot be achieved, and the production cannot be performed efficiently.
  • Patent Document 3 since a metal film is formed on the metal cover on the side surface of the terminal to be soldered, the silver (Ag) contained in the metal film is melted (developed) by the soldering and connected. could become defective.
  • the present invention has been made in view of the above circumstances, and is a surface that facilitates manufacturing, improves productivity, improves quality, and reduces the influence of external noise by bringing the metal cover to the ground level. It is an object of the present invention to provide a mounted crystal resonator, a manufacturing method thereof, and an oscillator.
  • the present invention for solving the problems of the above conventional example is a surface-mounted crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate, and includes first and second support electrodes that hold the crystal piece, A through terminal formed on the wall surface of the through-hole formed in the corner of the substrate, an end of the first support electrode or an end of the second support electrode, and a through terminal of the shortest corner from the end A first connection terminal that connects to the first support electrode, a second connection terminal that connects to the through terminal at the corner portion that is not connected to the first support electrode and the second support electrode, covers the crystal piece, and hermetically seals the inside A metal cover, and an insulating film formed on a portion where the metal cover is mounted on the substrate, wherein the second connection terminal and the metal cover are connected to each other with a conductive adhesive. An open portion where no insulating film is provided is formed.
  • the present invention is characterized in that, in the above-described surface-mounted crystal resonator, the pattern of the second connection terminal is formed toward the substantially central direction of the substrate.
  • connection pattern of the second connection terminal extends along the long side of the substrate in the surface mount crystal resonator.
  • the present invention is characterized in that, in the above-described surface-mounted crystal resonator, the pattern of the second connection terminal extends along the short side of the substrate.
  • a temperature sensor is mounted on a substrate, one second connection terminal is connected to one terminal of the temperature sensor, and the other second terminal is connected to the other terminal of the temperature sensor.
  • an open portion is formed on the other second connection terminal without providing an insulating film. It is characterized by.
  • the present invention relates to a method of manufacturing a surface-mounted crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate, wherein through terminals are formed on the wall surface of a through-hole formed in a corner portion of the substrate, and A first connection terminal connecting the end of the first support electrode or the second support electrode holding the crystal piece to the surface and a through terminal at the shortest corner from the end; and the first support electrode And a second connection terminal connected to a corner through terminal not connected to the second support electrode is formed of a metal film, and the second connection terminal and the metal cover to be mounted are connected with a conductive adhesive.
  • an insulating film is formed on the adhesion surface of the metal cover so as to provide an open part on the second connection terminal, and a metal cover that covers the crystal piece and hermetically seals the inside through the insulating film is mounted. It is characterized by doing.
  • the present invention is an oscillator in which a crystal piece is mounted on a rectangular ceramic substrate, and a space for storing an oscillation circuit is formed on the front or back surface of the substrate below the crystal piece, and the oscillation circuit is stored in the space.
  • the first and second support electrodes that hold the crystal piece, the through terminals formed on the wall surfaces of the through holes formed in the corners of the substrate, the end portions of the first support electrodes or the first A first connection terminal that connects the end portion of the support electrode 2 and the through terminal at the shortest corner from the end portion; and a through terminal at the corner portion that is not connected to the first support electrode and the second support electrode.
  • the present invention is characterized in that, in the oscillator described above, the pattern of the second connection terminal is formed so as to be directed substantially toward the center of the substrate.
  • the present invention is characterized in that, in the oscillator described above, the pattern of the second connection terminal extends along the long side of the substrate.
  • the present invention is characterized in that, in the oscillator described above, the pattern of the second connection terminal is formed to extend along the short side of the substrate.
  • the present invention is a surface-mount crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate, and includes first and second support electrodes that hold the crystal piece, and a through-hole formed in a corner portion of the substrate.
  • a through terminal formed on the wall surface, an end of the first support electrode or an end of the second support electrode, and a first connection terminal connecting the through terminal at the shortest corner from the end;
  • a second connection terminal connected to the through terminal at the corner not connected to the first support electrode and the second support electrode, a metal cover that covers the crystal piece and hermetically seals the inside, and a metal cover is mounted on the substrate
  • a second connection terminal is formed in a rectangular shape extending along one side of the substrate, and the first connection terminal is a rectangle having the same shape as the second connection terminal.
  • connection pattern for connecting the rectangular pattern and the first support electrode And a down, in a portion for connecting the metal cover second connection terminals with a conductive adhesive, and wherein the forming the opening portion on the second connection terminal is not provided with an insulating film.
  • the present invention is characterized in that, in the surface-mounted crystal resonator, the pattern of the second connection terminal extends along the long side of the substrate.
  • the present invention is characterized in that, in the above surface-mounted crystal resonator, the pattern of the second connection terminal extends along the short side of the substrate.
  • connection pattern of the first connection terminal is formed in a substantially triangular shape with one side connected to the long side of the rectangular pattern.
  • a method of manufacturing a surface-mounted crystal resonator in which a plurality of rectangular regions are arranged in a matrix on a sheet-like ceramic substrate, and a crystal piece is mounted on each rectangular region, and a through-hole formed at a corner of the rectangular region A through terminal is formed on the wall surface of the hole, and a first support electrode and a second support electrode for holding a crystal piece are formed on the surface of the rectangular region, and the end of the first support electrode or the second support electrode is formed.
  • the second connection terminal and the metal cover to be mounted are electrically conductive Metal that forms an insulating film on the adhesive surface of the metal cover so as to provide an open portion on the second connection terminal in the portion to be connected with the adhesive, covers the crystal piece, and hermetically seals the inside through the insulating film It is equipped with a cover.
  • the second connecting terminal connected to the through terminal at the corner portion that is not connected to the first supporting electrode and the second supporting electrode is connected to the metal cover with the conductive adhesive. Since the surface mount crystal resonator is formed with an open portion on which no insulating film is provided on the connection terminal, the metal cover is separated with a conductive adhesive before separation into individual crystal resonators, and the second connection terminal, through It can be connected to the terminal, facilitating manufacturing, and the distance from the through terminal to be soldered does not melt the conductive adhesive, improving the quality, and by setting the metal cover to the ground level, noise from the outside can be improved. There is an effect that the influence can be reduced.
  • the second connection terminal is formed in a rectangle extending along one side of the substrate
  • the first connection terminal is a rectangular pattern having the same shape as the second connection terminal
  • a connection pattern connecting the rectangular pattern and the first support electrode, and an insulating film is formed on the second connection terminal in a portion where the second connection terminal and the metal cover are connected by a conductive adhesive. Since it is a surface-mount crystal resonator with an open part that is not provided, it is possible to simplify the pattern of the electrode centering on the through terminal on the sheet-like ceramic substrate, and to facilitate patterning. Since the agent can be applied at a position away from the through terminal, melting can be prevented, and the effect of noise from the outside can be reduced by using the metal cover as a ground level.
  • FIG. 16 is a cross-sectional explanatory view taken along the line AA ′ in a state where the cover is mounted in FIG. 16 (FIG. 17). It is a plane explanatory view showing an electrode pattern of the fifth crystal unit. It is a plane explanatory view showing an insulating film pattern in the 5th crystal oscillator. It is a plane explanatory view showing an electrode pattern of the 6th crystal oscillator.
  • an AgPd through terminal is formed on a wall surface of a through hole formed in a corner portion of a rectangular ceramic substrate, and is supported by connecting to the through terminal on the surface of the substrate.
  • a first connection terminal of AgPd that forms the lower layer of the electrode is formed, a support electrode of Ag that holds a crystal piece is formed on the metal terminal of the AgPd, and is not connected to the support electrode but is connected to the through terminal.
  • a second connection terminal of AgPd to be connected is formed, and the metal cover is mounted and hermetically sealed via an insulating film that prevents the metal cover from short-circuiting with the first connection terminal.
  • an open part that does not form an insulating film on the second connection terminal is formed, facilitating manufacturing, improving productivity, and reducing noise. Small impact One in which the.
  • FIG. 1 is an explanatory plan view of an electrode pattern in the first crystal unit. As shown in FIG. 1, the electrode pattern of the metal electrode in the first crystal unit is formed on the ceramic substrate (base) 1, the pattern of the support electrode lower layer portion 3 a serving as the lower layer of the support electrode, and the four corners of the base 1.
  • the through terminal 2c formed in the through hole, the pattern of the connection terminal 2a that connects the support electrode lower layer 3a and the through terminal 2c, and the connection terminal 2b that connects to the through terminal 2c but does not connect to the support electrode lower layer 3a It basically has the pattern of
  • the through terminal 2c is in a ceramic sheet state before being separated into a base, and through holes (through holes) are formed at the intersections of break lines that define the areas of the individual crystal resonators, and a metal film is formed on the wall surface of the through hole It is an electrode that connects the front and back of the base.
  • connection terminal 2a is linearly connected to the through terminal 2c at the corner closest to the end of the support electrode lower layer 3a, and has a rectangular pattern except for the through hole at the corner of the base 1. Further, the connection terminals 2a are connected to through terminals 2c that are positioned diagonally. In FIG. 1, one connection terminal 2a is connected to the lower left through terminal 2c, and the other connection terminal 2a is connected to the upper right through terminal 2c. By connecting the connection terminal 2a diagonally, even if the cover is displaced in the vertical direction in FIG. , Can improve the quality.
  • the support electrode lower layer portion 3a has a shorter end portion to which the connection terminal 2a is not connected than an end portion to which the connection terminal 2a is connected. That is, the distance (A) to the long side of the base 1 close to the end of the support electrode lower layer 3a to which the connection terminal 2a is connected and the base 1 close to the end of the support electrode lower layer 3a to which the connection terminal 2a is not connected. Compared with the distance (B) to the long side, the distance (B) is longer than the distance (A).
  • the cover to be mounted thereafter is enlarged by widening the space to the long side close to the end of the support electrode lower layer 3 a (the end to which the connection terminal 2 a is not connected). Even if it is slightly deviated in the up-and-down direction of 1, the end portion is not contacted, and the quality can be improved.
  • connection terminal 2b is not connected to the support electrode lower layer part 3a but is connected to the through terminal 2c, and has a rectangular pattern except for the through hole at the corner of the base 1. Specifically, since the connection terminal 2b is a rectangular pattern, the connection terminal 2b is a pattern protruding toward the substantially central direction of the base 1. In the pattern of the connection terminal 2b, the metal cover is connected by a conductive adhesive as a feature of the first crystal unit. Although the pattern of the connection terminal 2b is a square shape, the shape is not limited by the shape as long as a metal cover is mounted and there is a space for connecting with a conductive adhesive.
  • FIG. 2 shows a cross-sectional explanatory diagram in a state where the electrode pattern is formed on the base 1.
  • FIG. 2 is a cross-sectional explanatory view showing a state in which an electrode pattern in the first crystal unit is formed.
  • the cross section of FIG. 2 shows the cross section of the AA ′ portion of FIG.
  • a connection terminal 2b is formed of AgPd on the surface of the base 1, and a through terminal 2c for connecting the front and back of the base 1 is formed at the same time.
  • the support electrode lower layer portion 3a and the connection terminal 2a are formed simultaneously with the connection terminal 2b.
  • an electrode pattern of the mounting terminal 4 connected to each through terminal 2c is formed of AgPd.
  • the mounting terminal 4 connected to the connection terminal 2a via the through terminal 2c serves as an electrode to which a voltage is applied
  • the mounting terminal 4 connected to the connection terminal 2b via the through terminal 2c is a ground level. It becomes a GND (ground) electrode connected to.
  • FIG. 3 is an explanatory plan view of an insulating film pattern in the first crystal unit.
  • the insulating film 10 is provided so that the metal cover does not directly adhere to the base 1, and prevents a short circuit with the connection terminal 2 a on the base 1. It is formed of glass or the like in a belt shape so as to circulate inside, and crosses the connection terminal 2 a on the base 1.
  • the contact surface of the metal cover comes into contact and is hermetically sealed.
  • the contact surface of the metal cover is the opening end surface of the cover (the lower surface of the flange portion).
  • the insulating film 10 is formed on the inner side away from the outer peripheral end of the base 1 and covers a part of the connection terminal 2a connected to the through terminal 2c and does not cover the rectangular shape of the connection terminal 2b.
  • An open portion where 10 is not formed is formed. That is, in the pattern of the connection terminal 2b, the insulating film 10 having an open portion is formed so as not to cover the portion where the metal cover is connected with the conductive adhesive. That is, the metal cover connection / connection portion of the connection terminal 2b is exposed.
  • FIG. 4 shows a cross-sectional explanatory diagram in a state where an insulating film is formed.
  • FIG. 4 is a cross-sectional explanatory view showing a state in which an insulating film is formed in the first crystal resonator.
  • the cross section of FIG. 4 shows the cross section of the BB ′ portion of FIG.
  • an insulating film 10 is formed on the surface of the base 1 so as to go inside the outer periphery.
  • the insulating film 10 is also formed on the connection terminal 2a.
  • the insulating film 10 does not cover the connection terminal 2a.
  • FIG. 5 is an explanatory plan view of a support electrode pattern in the first crystal unit.
  • the support electrode 3 b is laminated on the support electrode lower layer portion 3 a and is formed of Ag (silver).
  • the support electrode 3b uses Ag, the viscosity is high, and a thick metal film can be formed by a single application using a metal mask.
  • the thickness of the support electrode 3b formed by one application corresponds to three layers of a metal film (low viscosity) using conventional AgPd. That is, in order to form the support electrode 3b having the same thickness, it is only necessary to apply the Ag film once in the present embodiment. However, the conventional AgPd film needs to be applied three times, and a lot of Pd is used. It is expensive and the work process is complicated.
  • the support electrode 3b uses Ag having a high viscosity, the support electrode 3b does not leak out from the support electrode lower layer portion 3a, and the possibility of short-circuiting can be reduced even when the metal cover is shifted and mounted.
  • FIG. 6 shows a cross-sectional explanatory diagram in a state where the support electrode pattern is formed.
  • FIG. 6 is a cross-sectional explanatory view showing a state in which a support electrode pattern is formed in the first crystal unit.
  • the cross section of FIG. 6 shows a cross section of the CC ′ portion of FIG.
  • the support electrode 3b is formed on the support electrode lower layer 3a to be thicker than the support electrode lower layer 3a.
  • FIG. 7 is an explanatory plan view of the mounting of the crystal piece in the first crystal resonator.
  • the crystal piece 5 is AT-cut, and opposing excitation electrodes 5a are formed on both main surfaces.
  • the crystal piece 5 is formed with an extraction electrode 5b that extends from the excitation electrode 5a to both ends in opposite directions and is folded over the entire width in the width direction.
  • a pair of diagonal portions (end portions) extending from the extraction electrode 5b are fixed to the support electrode 3b by the conductive adhesive 7 as a conductive material, and the extraction electrode 5b and the support electrode 3b are electrically connected. Mechanically connected.
  • FIGS. 8 and 9 The first crystal resonator cover mounting will be described with reference to FIGS.
  • FIG. 8 is an explanatory plan view of a cover mounted on the first crystal unit
  • FIG. 9 is an explanatory cross-sectional view of a state in which the cover is mounted on the first crystal unit.
  • a section corresponding to CC ′ in FIG. 5 is a cross section cut in FIG.
  • the crystal piece 5 is mounted on the support electrode 3 b via the conductive adhesive 7, and the resin layer 8 as an insulating sealing material is further formed on the insulating film 10.
  • a metal cover 6 is mounted via
  • the cover 6 has a concave shape, the opening end surface is bent in an L shape, the concave shape is turned upside down, and the L-shaped portion (flange portion) is the resin layer 8 of the sealant. It is joined on the insulating film 10 via In the case of sealing with the cover 6, since it is hermetically sealed by N2 purge, the support electrode 3b formed of Ag is not oxidized, and there is no problem in quality.
  • connection terminal 2b since the open part is formed so that the insulating film 10 is not formed in the upper part of the part to which the cover 6 is connected, the cover 6 can be contacted.
  • the connection terminal 2b and a part of the cover 6 are connected by the conductive adhesive 11 in order to bring the metal cover 6 to the ground level.
  • the connection terminal 2b is connected to the mounting terminal 4 on the back surface of the base 1 through the through terminal 2c.
  • the mounting terminal 4 is grounded.
  • the conductive adhesive 11 may be adhered to the base 1 at two diagonal connection terminals 2b, or may be adhered only to one connection terminal 2b. If the connection terminal 2b and the cover 6 are connected to the base 1 with the conductive adhesive 11 at one place, it is not necessary to provide an open portion (open area) in contact with the cover 6 on the other connection terminal 2b. That is, the other connection terminal 2b and the cover 6 are insulated by the insulating film 10.
  • the first crystal unit is sealed with a cover 6 and then cut and separated by a break line.
  • the mounting terminal 4 on the back surface of the base 1 is It will be soldered. If the solder crawls up from the through terminal 2c, there is a possibility that Ag contained in the conductive adhesive 11 is eaten and becomes non-conductive.
  • connection terminal 2b is formed from the through terminal 2c to the inside of the base 1, and the connection terminal 2b is connected to the cover 6 by the conductive adhesive 11.
  • the connection terminal 2b is connected to the cover 6 by the conductive adhesive 11.
  • First step / Sintered ceramic fabric First, a sheet-shaped ceramic cloth that is the basis of the sheet-shaped ceramic base is formed. In the sheet-like ceramic fabric, break lines that divide adjacent regions corresponding to individual ceramic bases 1 are formed, and through holes (through holes) are formed at the four corners (corners). And the sheet-like ceramic material
  • an AgPd alloy metal paste having a thickness of about 10 ⁇ m is formed in a region corresponding to the circuit pattern of the sheet-like ceramic base by printing using a screen mask.
  • the circuit pattern has a metal pattern formed on one main surface (front surface), a pattern of mounting terminals 4 formed on the other main surface (back surface), and a wall surface of the through hole.
  • a through terminal 2c is formed.
  • the metal paste made into AgPd alloy is baked at about 850 degreeC, the binder in a metal paste is evaporated, and AgPd alloy is fuse
  • a glass paste is formed by printing as an insulating film 10 inside each rectangular area (corresponding to each base 1) of the sheet-like ceramic base on which a metal pattern or the like is formed. Then, it is fired at a temperature of about 850 ° C. to solidify the glass.
  • the support electrode 3b is formed of an Ag metal film on the support electrode lower layer 3a of AgPd using a nickel (Ni) metal mask. Since the support electrode 3b is an Ag metal film, the support electrode 3b has a high viscosity, and a thick film can be formed by a single film formation. Therefore, the support electrode 3b does not protrude from the support electrode lower layer portion 3a.
  • the vibration frequency of each crystal piece 5 as a crystal resonator mounted (fixed) on the sheet-like ceramic base is adjusted by the mass load effect.
  • the measurement terminal (probe) from the measuring instrument is brought into contact with the mounting terminal 4 electrically connected to each crystal piece 5 on the back surface of the sheet-like ceramic base.
  • the excitation electrode 5a on the surface side of the crystal piece 5 with the plate surface exposed is irradiated with gas ions to scrape the surface, and the mass of the excitation electrode 5a is reduced to adjust the vibration frequency from the lower to the higher.
  • it is also possible to adjust the vibration frequency from higher to lower by adding a metal film on the excitation electrode 5a by vapor deposition or sputtering, for example.
  • a conductive adhesive 11 that is connected to the cover 6 is applied to an open portion of the connection terminal 2b where the insulating film 10 is not formed, and the metal cover 6 is connected via the connection terminal 2b.
  • the insulating film 10 is not formed, but the cover 6 is mounted on the connection terminal 2b via the resin layer 8 of the sealing material and hermetically sealed, and the conductive adhesive 11 is covered in the open portion. And connecting terminal 2b. If the mounting terminal 4 is connected to the ground level, the potential of the cover 6 becomes the ground level, and the influence of noise from the outside of the cover 6 can be reduced.
  • the mounting terminals 4 on the back surface of the ceramic base 1 are four terminals that are electrically independent from each other.
  • the mounting terminals 4 (four pieces) at the four corners of the adjacent rectangular regions are electrically connected in common through the through terminals 2c. Accordingly, even when the mounting terminals 4 at the four corners are connected in common, the measurement terminal is brought into contact with the pair of diagonal mounting terminals 4 connected to the support electrodes 3b of the ceramic bases 1 so as to obtain the vibration frequency. This has the effect of measuring and adjusting the vibration frequency for each crystal piece 5.
  • the insulating film 10 is made of glass, for example, a resin can be applied as long as it has heat resistance as compared with the resin layer 8 of the sealing material.
  • the metal pattern is an AgPd alloy, but may be, for example, an AgPt (silver / platinum) alloy mainly composed of Ag having relatively good adhesion to the ceramic, and any Ag-based thick film material can be applied.
  • a pattern is formed in a substantially central direction of the base 1 at the square connection terminal 2b that is not connected to the crystal piece 5, and an open portion where the insulating film 10 is not formed is formed in the pattern. Since it is configured to be connected to the cover 6 by the conductive adhesive 11 at the open portion, even if the solder crawls up from the through terminal 2c, the conductive adhesive is placed at a place away from the through terminal 2c to the center side of the base 1. 11 is formed, there is an effect that it is possible to prevent the conductive adhesive 11 from being eaten and causing poor conduction.
  • FIGS. 10 and 11 A second crystal resonator (second crystal resonator) according to an embodiment of the present invention will be described with reference to FIGS.
  • FIG. 10 is an explanatory plan view showing a wiring pattern of the second crystal unit
  • FIG. 11 is an explanatory plan view showing a state in which a cover is mounted on the second crystal unit.
  • the second crystal resonator is formed with a connection pattern 2b1 along the long side of the base 1 on a connection terminal 2b that is not connected to the crystal piece 5, and covers the connection pattern 2b1. 6 is connected to the conductive adhesive 11.
  • the length of the connection pattern 2b1 is arbitrary, and the position where the conductive adhesive 11 is formed is also arbitrary.
  • the conductive adhesive 11 is formed in the vicinity of the end opposite to the corner in the connection pattern 2b1.
  • connection pattern 2b1 is shorter than the long side of the base 1 by half or less and is formed along the long side.
  • the connection pattern 2b1 is formed on each of the two long sides, and there are two portions connected by the conductive adhesive 11. However, if the connection portion is one location, the connection pattern 2b1 is provided. Also, one pattern may be formed for the base 1.
  • the second crystal resonator is the same as the first crystal resonator.
  • FIGS. 12 and 13 A third crystal resonator (third crystal resonator) according to an embodiment of the present invention will be described with reference to FIGS.
  • FIG. 12 is an explanatory plan view showing a wiring pattern of the third crystal unit
  • FIG. 13 is an explanatory plan view showing a state in which a cover is mounted on the third crystal unit.
  • the third crystal resonator is formed with a connection pattern 2b2 along the short side of the base 1 on the connection terminal 2b that is not connected to the crystal piece 5, and covers the connection pattern 2b2. 6 is connected to the conductive adhesive 11.
  • the length of the connection pattern 2b2 is arbitrary, and the position where the conductive adhesive 11 is formed is also arbitrary.
  • the conductive adhesive 11 is formed in the vicinity of the end opposite to the corner in the connection pattern 2b2.
  • an open portion where the insulating film 10 is not formed is provided in the portion where the conductive adhesive 11 is formed.
  • the open part is determined according to the application range of the conductive adhesive 11.
  • the connection pattern 2 b 2 is shorter than half of the short side of the base 1 and is formed along the short side.
  • the connection pattern 2b2 is formed on each of the two short sides, and there are two portions connected by the conductive adhesive 11. However, if the connection portion is one location, the connection pattern 2b2 is provided. Also, one pattern may be formed for the base 1.
  • the third crystal unit is the same as the first crystal unit except for the features such as the shape of the connection pattern 2 b 2, the position where the insulating film 10 is formed, the position where the conductive adhesive 11 is formed, and the like.
  • the third crystal unit is diced along the short side of the base 1 from the ceramic sheet in which the cover 6 is sealed, and the long side is connected in the long side (strip state).
  • Application of the conductive adhesive 11 in the connection pattern 2b2 can be easily performed.
  • the present invention may be applied to an oscillator in which a cavity (space) is formed below a crystal piece and an oscillation circuit IC is accommodated in the cavity. Further, the oscillation circuit IC may be configured such that a cavity is formed on the back surface of the substrate and is housed in the cavity, and is electrically connected to the crystal piece on the surface through a through hole formed in the substrate.
  • a crystal resonator has a thermistor-integrated structure in which a crystal piece and a temperature sensor (thermistor) are mounted on a base in a cover. Specifically, one end of the thermistor is connected to one terminal of the connection terminal 2b not connected to the support electrode lower layer 3a, the other end of the thermistor is connected to the other terminal of the connection terminal 2b, and one of the connection terminals 2b is connected. A power supply voltage is applied to the terminal, the other terminal of the connection terminal 2b is connected to the ground level, and the cover 6 is connected by the conductive adhesive 11 on the connection terminal 2b at the ground level.
  • FIGS. 14 to 16 a fourth crystal resonator (fourth crystal resonator) according to an embodiment of the present invention will be described with reference to FIGS.
  • FIG. 14 is an explanatory plan view showing a wiring pattern of the fourth crystal resonator.
  • the fourth crystal unit is an application example of the second crystal unit shown in FIG. 10, and as shown in FIG. 14, the shape of the connection terminals 2a and 2b1 of the second crystal unit is changed, The connection terminals are 2a4 and 2b4, respectively.
  • the connection terminals 2a4 and 2b4 are made of AgPd.
  • connection terminal 2b4 not connected to the support electrode lower layer portion 3a is formed on one diagonal line of the base 1 and connected to the through terminal 2c. Except for the corners, the pattern is rectangular.
  • the connection terminal 2b4 is formed in a shape in which the direction along the long side of the base 1 is long and the direction along the short side is short.
  • the connection terminal 2b4 may be formed in a long shape in the direction along the short side of the base 1.
  • the connection terminal 2b4 corresponds to the second connection terminal described in the claims.
  • connection terminal 2a4 connected to the support electrode lower layer portion 3a is formed on a diagonal line different from the connection terminal 2b4 of the base 1, is connected to the through terminal 2c, and has a rectangular pattern 2a41 having the same shape as the connection terminal 2b4.
  • a substantially triangular connection pattern 2a42 connected to the electrode lower layer portion 3a is formed in a connected shape.
  • the rectangular pattern 2a41 corresponds to the rectangular pattern recited in the claims.
  • connection pattern 2a42 is connected to the long side of the rectangular pattern 2a41.
  • a broken line is shown between the rectangular pattern 2a41 and the connection pattern 2a42 of the connection terminal 2a4.
  • the connection terminal 2a4 corresponds to the first connection terminal recited in the claims.
  • connection terminal 2b4 When the shape of the connection terminal 2b4 is a rectangle that is long in the direction along the short side of the base 1, the rectangular pattern 2a41 of the connection terminal 2a4 is similarly formed long in the direction along the short side of the base 1.
  • the connection pattern 2a42 has a shape in which one side is connected to the long side of the rectangular pattern 2a41.
  • connection terminal 2a4 includes the rectangular pattern 2a41 having the same shape as the connection terminal 2b4, thereby simplifying the wiring pattern around the through hole at the corner of the base 1 and facilitating patterning. Is.
  • FIG. 15 is an explanatory plan view showing a wiring pattern around a through hole in the fourth crystal unit.
  • FIG. 15 shows a corner portion of a rectangular region (corresponding to the base 1) in a sheet state before cutting.
  • a through hole is formed at a portion where the break lines 101 and 102 intersect, and a through terminal 2c is formed on the wall surface of the through hole. Is formed.
  • connection terminal 2b4 is formed in the upper left rectangular area and the lower right rectangular area.
  • connection terminals 2a4 are formed in the upper right and lower left rectangular areas.
  • the fourth crystal resonator is characterized in that the pattern shape around the through terminal 2c is made as close to a rectangle as possible, and the unevenness of the pattern is reduced as much as possible to obtain a simple shape. That is, for the four rectangular regions sharing the through terminal 2c, the pattern shape around the through terminal is made the same so that the outline of the pattern does not become complicated and easy to manufacture.
  • the pattern around the through-hole 2c of the fourth crystal unit was formed on a diagonal line with a large rectangular pattern formed across four rectangular regions centered on the through-hole 2c. It is formed by two triangular connection patterns 2a42.
  • the square pattern centered on the through hole 2c is composed of two connection terminals 2b4 and two rectangular patterns 2a41 of the connection terminal 2a4.
  • a connection pattern 2a42 is formed in connection with the pattern.
  • connection pattern 2a42 of the connection terminal 2a4 connected to the support electrode lower layer portion 3a is also formed in a straight line following the side of the square pattern.
  • connection terminals 2a4 and 2b4 have such shapes, thereby simplifying the pattern shape around the through terminals 2c compared to the pattern of FIG. Thus, the yield can be improved.
  • connection pattern 2a42 is triangular to make it difficult to disconnect.
  • connection pattern 2a42 of the connection terminal 2a4 may be formed in a line shape that connects the rectangular pattern 2a41 and the support electrode lower layer portion 3a as shown in FIG. 1 instead of a triangle. Even in this case, since the rectangular pattern 2a41 has the same shape as that of the connection terminal 2b4, the periphery of the through terminal 2c becomes a square pattern with little unevenness, and the patterning can be facilitated. Since the fourth crystal unit is formed by the same manufacturing process as the first crystal unit described above, detailed description thereof is omitted.
  • FIG. 16 is an explanatory plan view of a fourth crystal resonator.
  • FIG. 16 shows a state before the cover is mounted, and the insulating film 10 is formed on the wiring pattern of FIG. Further, the crystal piece 5 is mounted on the laminated support electrode lower layer 3 a and the support electrode 3 b and fixed by the conductive adhesive 7.
  • the shape of the insulating film 10 is different from that of the second crystal resonator shown in FIG. 11, and there is no open portion, and the ring is formed slightly inside the base 1 along the outer periphery. Has been. Further, an arc-shaped insulating film is formed around the through terminal 2c at the corner portion of the base 1 so as to be connected to the annular pattern.
  • connection terminal 2b4 connected to the ground level mounting terminal 4 is formed long along the long side of the base 1, so that the gap between the pattern of the insulating film 10 and the long side of the base 1 is increased. Since the connection terminal 2b4 is exposed from the gap, the exposed portion (exposed portion) and the cover 6 are electrically connected by a conductive adhesive. Thereby, the distance of a conductive adhesive and the through terminal 2c can be taken long.
  • the exposed portion is an open portion of the insulating film 10.
  • connection terminal 2b4 is formed long along the short side of the base 1, an exposed portion is formed on the short side and is connected to the cover 6 with a conductive adhesive.
  • the insulating film 10 is not formed in a ring shape, but a portion where the pattern of the insulating film 10 is cut is provided in a portion where the conductive adhesive is applied, and the exposed portion where the connection terminal 2b is not covered with the insulating film 10 And the cover 6 and the connection terminal 2b may be connected at that position. Further, in FIG. 16, an exposed portion that is not covered with the insulating film 10 is formed along the long side of the base 1 also in the connection terminal 2 a 4 connected to the support electrode lower layer portion 3 a. The insulating film 10 may be formed so as to cover the exposed portion of 2a4.
  • FIG. 17 is an explanatory plan view showing the fourth crystal resonator after the cover is mounted.
  • the cover 6 is mounted on the insulating film 10 of FIG. 16 via a resin layer (not shown) so as to cover the crystal piece 5, and the insulating film 10 and the cover 6 are covered by the resin layer. And are joined.
  • connection terminal 2b4 and the cover 6 are electrically and physically bonded by the conductive adhesive 11 to bring the cover 6 to the ground level.
  • the conductive adhesive 11 by applying the conductive adhesive 11 at a position away from the through terminal 2c, even if the solder crawls up from the through terminal 2c, the Ag of the conductive adhesive 11 is eaten, resulting in poor conduction. Can be prevented.
  • connection terminal 2 a 4 is connected to the cover 6 because of the thickness of the insulating film 10 and the resin layer even if a positional shift occurs. There is no.
  • FIG. 18 A cross section of the fourth crystal resonator will be described with reference to FIG. 18 is a cross-sectional explanatory view taken along the line AA ′ of FIG. 16 with the cover mounted (FIG. 17).
  • AA ′ is shown in FIG.
  • the support electrode 3 b is formed on the support electrode lower layer portion 3 a, and the crystal piece 5 is mounted on the support electrode 3 via the conductive adhesive 7.
  • a cover 6 is mounted on the insulating film 10 via a resin layer 8, and the connection electrode 2 b 4 connected to the ground terminal 4 on the back surface and the cover 6 are connected by the conductive adhesive 11.
  • connection terminal 2b4 is a rectangular pattern having a long long side of the base 1, and the connection terminal 2a4 is connected to the rectangular pattern 2a41 having the same shape as the connection terminal 2b4 and the support electrode lower layer 3a. Since the pattern is connected to the pattern 2a42, the electrode pattern around the through terminal 2c can be made substantially rectangular to eliminate the unevenness, and the patterning can be facilitated. Even if the solder is scooped up from the through terminal 2c after mounting the crystal resonator, the application position of the conductive adhesive 11 that connects the connection terminal 2b4 and the cover 6 is set away from the through terminal 2c. There is an effect of preventing the Ag of the conductive adhesive 11 from melting and becoming defective.
  • FIG. 19 is an explanatory plan view showing an electrode pattern of the fifth crystal resonator.
  • the electrode pattern of the fifth crystal unit is a cantilevered version of the electrode pattern of the first crystal unit shown in FIG.
  • the through terminal 2c and the connection terminal 2b not connected to the support electrode lower layer 3a are formed in the same shape as in FIG.
  • the connection terminal 2 b is formed as a rectangular pattern so as to protrude toward the center of the base 1.
  • the fifth crystal unit is a cantilever type
  • the two support electrode lower layer portions 3 a that hold one short side of the crystal piece are provided near one short side of the base 1. And, on the short side opposite to the short side, a lower layer portion (supporting lower layer portion) 3a ′ of the support portion that supports the crystal piece with the other short side of the crystal piece is formed.
  • the connection terminals connecting the support electrode lower layer portion 3a and the through terminals 2c have patterns of connection terminals 2a51, 2a52, and 2a53.
  • connection terminal 2a51 is straight to the through terminal 2c (the lower left through terminal 2c in FIG. 1) at the corner closest to the end of one support electrode lower layer 3a (the lower support electrode lower layer 3a in FIG. 1). It is formed so that it may connect. Particularly, the connection terminal 2a51 is led out to the through terminal 2c from the end on the long side of the base 1 which is closer to the end of the support electrode lower layer 3a.
  • connection terminal 2a52 is drawn out in parallel to the long side of the base 1 from the end of the other support electrode lower layer 3a (the upper support electrode lower layer 3a in FIG. 1), and then connected to one end of the connection terminal 2a53.
  • the other end of the connection terminal 2a53 is connected to the through terminal 2c (the upper right side through terminal 2c in FIG. 1).
  • the connection terminal 2a53 is formed obliquely from the through terminal 2c in the substantially central direction of the base 1.
  • connection terminal 2a52 is drawn from the end of the base 1 near the center of the end of the support electrode lower layer 3a. Normally, the connection terminal connected to the through terminal is drawn out from the end of the support electrode lower layer 3a that is closer to the long side of the base 1, but here the center side by a specific distance d from the end of the long side.
  • the connection terminal 2a52 is formed. This is because the connection terminal 2a52 is hidden behind the crystal piece when the crystal piece is mounted and the excitation electrode is cut by Ar ions for frequency adjustment in the subsequent process. This is to prevent it.
  • FIG. 20 is an explanatory plan view showing an insulating film pattern in the fifth crystal unit.
  • the support electrode 3b is formed on the support electrode lower layer portion 3a, and the support portion is formed on the support lower layer portion 3a ′. 3b 'is formed.
  • the support electrode 3b and the support portion 3b ' are made of Ag.
  • the insulating film 10 for mounting a cover is formed. Similar to the shape of the insulating film 10 shown in FIG. 3, the shape of the insulating film 10 covers the connection terminals 2a51 and 2a53 so as to cover the upper portion of the connection terminals 2a51 and 2a53, and has an open portion so as not to cover the rectangular shape of the connection terminals 2b. ing.
  • a cantilever crystal piece 5 ′ on which an excitation electrode 5 a ′ is formed is mounted on the support electrode 3 b via a conductive adhesive 7. Then, a cover that covers the crystal piece 5 'is mounted on the insulating film 10 via a resin layer, and the insulating film 10 and the cover are joined.
  • connection terminal 2b connected to the ground terminal and the cover are bonded with a conductive adhesive at an open portion of the insulating film 10. Since the connection terminal 2b has a quadrangular shape with corners protruding in the center direction of the base 1, a conductive adhesive can be applied and adhered to a position closer to the center side from the through terminal 2c. Even if the solder crawls up, it is possible to prevent Ag from being eaten. An insulating film 10 is formed on the connection terminals 2a51 and 2a53 to prevent these terminals from coming into contact with the cover.
  • the crystal unit is a cantilever type crystal unit
  • the connection terminal 2b has a rectangular pattern with corners protruding toward the center of the base 1, and an insulating film is formed in the vicinity of the connection terminal 2b. Since the connection terminal 2b and the cover are connected to each other by a conductive adhesive at the open part, the solder rises in order to provide the conductive adhesive at a position away from the through terminal 2c. However, there is an effect that Ag is prevented from being eaten and conduction failure can be prevented.
  • FIG. 21 is an explanatory plan view showing an electrode pattern of a sixth crystal resonator.
  • the sixth crystal unit is obtained by deforming the fourth crystal unit shown in FIG. 14 into a cantilever type.
  • two support electrode lower layer portions 3a are formed near one short side of the base 1, similarly to the fifth crystal resonator of FIG.
  • a supporting lower layer 3a ′ is formed near the other short side.
  • connection terminal 2b6 The shape of the connection terminal 2b6 that is not connected to the through terminal 2c and the crystal piece is the same as that of the dual-support type shown in FIG. 14, and the connection terminal 2b6 has a rectangular pattern that is long in the short side direction of the base 1.
  • connection terminal connected to the crystal piece has a pattern of connection terminals 2a61, 2a62, and 2a63.
  • the connection terminal 2a61 has the same rectangular pattern as the connection terminal 2b6 and a substantially triangular pattern connected to the long side of the rectangular pattern, and the tip of the triangular pattern is one (here, lower left) lower layer of the support electrode 3a is connected.
  • connection terminal 2a62 One end of the connection terminal 2a62 is connected to the end of the other (here, upper left) supporting electrode lower layer 3a far from the long side of the base 1, and is parallel to the long side along the long side of the base 1. The other end is bent toward the upper right through terminal 2c.
  • connection terminal 2a63 is formed such that a rectangular pattern having a long side on the short side of the base 1 is connected to the through terminal 2c, and a triangular pattern is connected to the connection terminal 2a62.
  • the pattern around the through terminal 2c is composed of a large square pattern formed over four rectangular areas and a substantially triangular pattern connected to the large rectangular pattern. Is something that can be done. Further, by forming the rectangular pattern of the connection terminal 2b6 and the connection terminals 2a61, 2a63 into a rectangle that is long in the short side direction of the base 1, the distance between the connection terminals 2b6, 2a61 and the support electrode lower layer 3a is increased. It is possible to prevent short circuit. Depending on the arrangement of the electrodes and the like, the connection terminals 2b6 and the like can be formed in a rectangular pattern that is long in the long side direction of the base 1.
  • the insulating film on which the cover is mounted is formed in the same shape as the insulating film 10 of the fourth crystal unit shown in FIG. 16, and the connection terminal 2b6 formed along the short side of the base 1.
  • the exposed portion and the cover are connected by a conductive adhesive.
  • the exposed portion of the connection terminal 2b6 is an open portion of the insulating film 10.
  • connection terminal 2b6 and the cover with a conductive adhesive at the same position as in FIG. 17, the conductive adhesive can be applied away from the through terminal 2c, and Ag is eaten. It is possible to prevent poor conduction due to this.
  • the sixth crystal resonator of the present invention is a cantilever crystal resonator, and the connection terminals 2a61, 2b6, and 2a63 are formed in a substantially rectangular pattern having the same shape around the through hole 2c. Therefore, patterning of the electrode can be facilitated, and even if the conductive adhesive connecting the connection terminal 2b6 and the cover is applied to a position away from the through terminal 2c and the solder rises, There is an effect that the Ag of the conductive adhesive 11 can be prevented from melting and becoming defective.
  • the present invention provides a surface-mount crystal resonator that can be easily manufactured to improve productivity, improve quality, and reduce the influence of external noise by setting the metal cover to the ground level, and a method for manufacturing the surface-mounted crystal resonator. It is suitable for.

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Abstract

[Problem] To provide a surface-mounted crystal resonator, a manufacturing method therefor, and an oscillator which enable improved productivity by facilitating manufacturing, better quality, and smaller influence of noise from outside by placing a metal cover at a ground level. [Solution] The present invention provides a configuration in which in a connection terminal (2b) not connected to a crystal piece (5), a pattern is formed to protrude approximately toward the center of a base (1), an open portion in which an insulating film (10) is not formed on the connection terminal (2b) is formed for connection with a cover (6) by a conductive adhesive (11) in the pattern, and the cover (6) and the connection terminal (2b) are connected by the conductive adhesive (11) in the open portion. Even if solder creeps up from a through terminal (2c), the conductive adhesive (11) can be prevented from being melted by the solder and causing a conduction failure since the conductive adhesive (11) is formed in a place at a distance from the through terminal (2c) toward the center of the base (1).

Description

表面実装水晶振動子及びその製造方法、発振器Surface mount crystal resonator, method for manufacturing the same, and oscillator
　本発明は、表面実装用の水晶振動子に係り、特に、製造が容易で、品質を良好にし、外部からのノイズの影響を小さくできる表面実装水晶振動子及びその製造方法、発振器に関する。 The present invention relates to a surface-mount crystal resonator, and more particularly to a surface-mount crystal resonator that is easy to manufacture, has good quality, and can reduce the influence of external noise, a method for manufacturing the same, and an oscillator.
［従来の技術］
　表面実装水晶振動子は小型・軽量であることから、特に携帯型の電子機器に周波数や時間の基準源として内蔵される。
　従来の表面実装水晶振動子は、セラミック基板上に水晶片を搭載し、凹状のカバーを逆さまにして被せて密閉封入したものがある。近年では、周波数偏差Δｆ／ｆが比較的緩く、例えば±１５０～±２５０ｐｐｍの安価な民生用がある。 [Conventional technology]
Since the surface-mounted crystal unit is small and light, it is built in as a frequency and time reference source, especially in portable electronic devices.
Some conventional surface-mount crystal units have a crystal piece mounted on a ceramic substrate, and are covered with a concave cover upside down and hermetically sealed. In recent years, the frequency deviation Δf / f is relatively loose, and there is an inexpensive consumer use of, for example, ± 150 to ± 250 ppm.
　特に、従来の表面実装水晶振動子の一般的な構成は、セラミック基板上に例えばＡｇＰｄ（銀・パラジウム）の金属電極のパターンが形成され、更に、水晶片を支持する部分にＡｇＰｄの支持電極が積層され、その支持電極で水晶片を持ち上げているようになっている。 In particular, a general configuration of a conventional surface-mount crystal unit is such that a metal electrode pattern of, for example, AgPd (silver / palladium) is formed on a ceramic substrate, and a support electrode of AgPd is provided on a portion that supports the crystal piece. The crystal pieces are lifted by the supporting electrodes.
　これは、水晶片の中央部がセラミック基板（ベース）の面に接触すると、振動を妨げ、等価抵抗値の劣化を招くため、水晶片を搭載する支持電極はベース面からある程度嵩上げする必要がある。
　尚、金属電極及び支持電極をＡｇＰｄで形成しているのは、酸化及び硫化しづらいからである。 This is because if the center part of the crystal piece comes into contact with the surface of the ceramic substrate (base), the vibration is hindered and the equivalent resistance value is deteriorated. Therefore, the support electrode on which the crystal piece is mounted needs to be raised to some extent from the base surface. .
The metal electrode and the support electrode are made of AgPd because it is difficult to oxidize and sulfide.
［関連技術］
　尚、関連する先行技術として、特開２０１３－０７０３５７号公報「表面実装水晶振動子及びその製造方法」（日本電波工業株式会社）［特許文献１］、特開２０１４－０３００８２号公報「表面実装水晶振動子」（日本電波工業株式会社）［特許文献２］、実開平０５－０８５１２１号公報「表面実装用保持器及び表面実装デバイス」（株式会社明電舎）［特許文献３］がある。 [Related technologies]
As related prior art, Japanese Unexamined Patent Application Publication No. 2013-070357 “Surface Mounted Crystal Resonator and Method for Manufacturing the Same” (Nippon Denpa Kogyo Co., Ltd.) [Patent Document 1], Japanese Unexamined Patent Application Publication No. 2014-030082, “Surface Mounted Crystal. There are “Oscillator” (Nippon Denpa Kogyo Co., Ltd.) [Patent Document 2], Japanese Utility Model Publication No. 05-085121, “Surface Mounted Retainer and Surface Mount Device” (Meidensha Corporation) [Patent Document 3].
　特許文献１には、表面実装水晶発振器において、基板の角部に形成したスルー端子に水晶片を支持する支持電極下層部が接続し、その支持電極下層部がＡｇＰｄで形成され、その上に支持電極がＡｇで形成され、基板の周囲内側に絶縁膜が形成され、その絶縁膜上のカバーが搭載される構成が示されている。 In Patent Document 1, in a surface-mount crystal oscillator, a support electrode lower layer portion supporting a crystal piece is connected to a through terminal formed at a corner portion of a substrate, and the support electrode lower layer portion is formed of AgPd and supported thereon. An electrode is formed of Ag, an insulating film is formed on the inner periphery of the substrate, and a cover on the insulating film is mounted.
　また、特許文献２には、表面実装水晶振動子において、カバーが接触する基板部分にガラス層を形成し、カバーをガラス封止する構成が示されている。
　また、特許文献３には、表面実装デバイスにおいて、基板の裏面に給電用電極端子と接地用電極端子が形成され、接地用電極端子が接する基板の長辺の側面で金属カバーに接続する金属膜を形成する構成が示されている。 Patent Document 2 discloses a configuration in which a glass layer is formed on a substrate portion in contact with a cover and the cover is glass-sealed in a surface-mounted crystal resonator.
Patent Document 3 discloses a metal film that is connected to a metal cover on a long side surface of a substrate in which a power supply electrode terminal and a ground electrode terminal are formed on the back surface of the substrate and the ground electrode terminal is in contact with the surface mount device. The configuration that forms is shown.
特開２０１３－０７０３５７号公報JP 2013-070357 A 特開２０１４－０３００８２号公報JP 2014-030082 A 実開平０５－０８５１２１号公報Japanese Utility Model Publication No. 05-085121
　しかしながら、従来の表面実装水晶振動子では、セラミックシートに水晶片、金属カバーが搭載され、個々に分割される前の状態で、金属カバーをグランドレベルに接続する構成を実現できる構成とはなっておらず、製造を容易にして、カバーの外部からのノイズの影響を小さくできるものとはなっていないという問題点があった。 However, in the conventional surface-mount crystal resonator, a crystal piece and a metal cover are mounted on a ceramic sheet, and it is possible to realize a configuration in which the metal cover is connected to the ground level before being individually divided. In other words, there is a problem in that it is not easy to manufacture and the influence of noise from the outside of the cover cannot be reduced.
　特許文献１では、金属カバーを樹脂封止するものであり、特許文献２では、金属カバーをガラス封止するものであるが、金属カバーをグランドレベルに接続する構成とはなっていない。 In Patent Document 1, the metal cover is sealed with resin, and in Patent Document 2, the metal cover is sealed with glass, but the metal cover is not connected to the ground level.
　また、特許文献３では、金属カバーをガラス封止する構成ではあるが、基板と金属カバーを側面で金属膜により接続する構成であるため、個々のデバイスに分割してからでないと金属カバーをグランドレベルにすることができず、製造を効率的に行うことができないものとなっていた。 Further, in Patent Document 3, the metal cover is configured to be sealed with glass, but since the substrate and the metal cover are connected to each other by a metal film on the side surface, the metal cover must be grounded only after being divided into individual devices. The level cannot be achieved, and the production cannot be performed efficiently.
　また、特許文献３では、半田付けが行われる端子の側面で金属カバーに金属膜を形成するものであるため、半田付けによって金属膜に含まれる銀（Ａｇ）が溶融し（食われ）、接続が不良になるおそれがあった。 Further, in Patent Document 3, since a metal film is formed on the metal cover on the side surface of the terminal to be soldered, the silver (Ag) contained in the metal film is melted (developed) by the soldering and connected. Could become defective.
　本発明は上記実情に鑑みて為されたもので、製造を容易にして生産性を向上させ、品質を良好にして、金属カバーをグランドレベルにすることにより外部からのノイズの影響を小さくできる表面実装水晶振動子及びその製造方法、発振器を提供することを目的とする。 The present invention has been made in view of the above circumstances, and is a surface that facilitates manufacturing, improves productivity, improves quality, and reduces the influence of external noise by bringing the metal cover to the ground level. It is an object of the present invention to provide a mounted crystal resonator, a manufacturing method thereof, and an oscillator.
　上記従来例の問題点を解決するための本発明は、矩形のセラミック基板上に水晶片が搭載される表面実装水晶振動子であって、水晶片を保持する第１及び第２の支持電極と、基板の角部に形成された貫通孔の壁面に形成されたスルー端子と、第１の支持電極の端部又は第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子と、水晶片を覆い、内部を気密封止する金属カバーと、金属カバーが基板に搭載される部分に形成される絶縁膜とを備え、第２の接続端子と金属カバーとを導電性接着剤で接続する部分において、第２の接続端子上に絶縁膜を設けない開放部分を形成したことを特徴とする。 The present invention for solving the problems of the above conventional example is a surface-mounted crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate, and includes first and second support electrodes that hold the crystal piece, A through terminal formed on the wall surface of the through-hole formed in the corner of the substrate, an end of the first support electrode or an end of the second support electrode, and a through terminal of the shortest corner from the end A first connection terminal that connects to the first support electrode, a second connection terminal that connects to the through terminal at the corner portion that is not connected to the first support electrode and the second support electrode, covers the crystal piece, and hermetically seals the inside A metal cover, and an insulating film formed on a portion where the metal cover is mounted on the substrate, wherein the second connection terminal and the metal cover are connected to each other with a conductive adhesive. An open portion where no insulating film is provided is formed.
　本発明は、上記表面実装水晶振動子において、第２の接続端子のパターンが、基板の略中心方向に向けて形成されていることを特徴とする。 The present invention is characterized in that, in the above-described surface-mounted crystal resonator, the pattern of the second connection terminal is formed toward the substantially central direction of the substrate.
　本発明は、上記表面実装水晶振動子において、第２の接続端子の接続パターンが、基板の長辺に沿って延びて形成されていることを特徴とする。 The present invention is characterized in that the connection pattern of the second connection terminal extends along the long side of the substrate in the surface mount crystal resonator.
　本発明は、上記表面実装水晶振動子において、第２の接続端子のパターンが、基板の短辺に沿って延びて形成されていることを特徴とする。 The present invention is characterized in that, in the above-described surface-mounted crystal resonator, the pattern of the second connection terminal extends along the short side of the substrate.
　本発明は、上記表面実装水晶振動子において、基板上に温度センサを搭載し、温度センサの一方の端子に一方の第２の接続端子が接続され、温度センサの他方の端子に他方の第２の接続端子が接続され、他方の第２の接続端子と金属カバーとを導電性接着剤で接続する部分において、当該他方の第２の接続端子上に絶縁膜を設けない開放部分を形成したことを特徴とする。 According to the present invention, in the surface-mounted crystal resonator, a temperature sensor is mounted on a substrate, one second connection terminal is connected to one terminal of the temperature sensor, and the other second terminal is connected to the other terminal of the temperature sensor. In the portion where the other connection terminal is connected and the other second connection terminal and the metal cover are connected by the conductive adhesive, an open portion is formed on the other second connection terminal without providing an insulating film. It is characterized by.
　本発明は、矩形のセラミック基板上に水晶片が搭載される表面実装水晶振動子の製造方法であって、基板の角部に形成された貫通孔の壁面にスルー端子を形成すると共に、基板の表面には水晶片を保持する第１の支持電極又は第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子とを、金属膜で形成し、第２の接続端子と搭載される金属カバーとを導電性接着剤で接続する部分において、第２の接続端子上に開放部分を設けるよう、前記金属カバーの接着面に絶縁膜を形成し、水晶片を覆い、絶縁膜を介して内部を気密封止する金属カバーを搭載することを特徴とする。 The present invention relates to a method of manufacturing a surface-mounted crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate, wherein through terminals are formed on the wall surface of a through-hole formed in a corner portion of the substrate, and A first connection terminal connecting the end of the first support electrode or the second support electrode holding the crystal piece to the surface and a through terminal at the shortest corner from the end; and the first support electrode And a second connection terminal connected to a corner through terminal not connected to the second support electrode is formed of a metal film, and the second connection terminal and the metal cover to be mounted are connected with a conductive adhesive. In the part to be mounted, an insulating film is formed on the adhesion surface of the metal cover so as to provide an open part on the second connection terminal, and a metal cover that covers the crystal piece and hermetically seals the inside through the insulating film is mounted. It is characterized by doing.
　本発明は、矩形のセラミック基板上に水晶片が搭載される発振器であって、水晶片の下側で基板の表面又は裏面に発振回路を収納する空間を形成し、当該空間に発振回路を収納したものであり、水晶片を保持する第１及び第２の支持電極と、基板の角部に形成された貫通孔の壁面に形成されたスルー端子と、第１の支持電極の端部又は第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子と、水晶片を覆い、絶縁膜を介して内部を気密封止する金属カバーと、金属カバーが基板に搭載される部分に形成される絶縁膜とを備え、第２の接続端子と金属カバーとを導電性接着剤で接続する部分において、第２の接続端子上に絶縁膜を設けない開放部分を形成したことを特徴とする。 The present invention is an oscillator in which a crystal piece is mounted on a rectangular ceramic substrate, and a space for storing an oscillation circuit is formed on the front or back surface of the substrate below the crystal piece, and the oscillation circuit is stored in the space. The first and second support electrodes that hold the crystal piece, the through terminals formed on the wall surfaces of the through holes formed in the corners of the substrate, the end portions of the first support electrodes or the first A first connection terminal that connects the end portion of the support electrode 2 and the through terminal at the shortest corner from the end portion; and a through terminal at the corner portion that is not connected to the first support electrode and the second support electrode. A second connecting terminal to be connected; a metal cover that covers the crystal piece and hermetically seals the inside through the insulating film; and an insulating film formed on a portion where the metal cover is mounted on the substrate, In the portion where the connection terminal and the metal cover are connected with the conductive adhesive, the second Characterized in that the formation of the opening portion on the connection terminal without the insulating film.
　本発明は、上記発振器において、第２の接続端子のパターンは、基板の略中心方向に向けて形成されていることを特徴とする。 The present invention is characterized in that, in the oscillator described above, the pattern of the second connection terminal is formed so as to be directed substantially toward the center of the substrate.
　本発明は、上記発振器において、第２の接続端子のパターンは、基板の長辺に沿って延びて形成されていることを特徴とする。 The present invention is characterized in that, in the oscillator described above, the pattern of the second connection terminal extends along the long side of the substrate.
　本発明は、上記発振器において、第２の接続端子のパターンは、基板の短辺に沿って延びて形成されていることを特徴とする。 The present invention is characterized in that, in the oscillator described above, the pattern of the second connection terminal is formed to extend along the short side of the substrate.
　本発明は、矩形のセラミック基板上に水晶片が搭載される表面実装水晶振動子であって、水晶片を保持する第１及び第２の支持電極と、基板の角部に形成された貫通孔の壁面に形成されたスルー端子と、第１の支持電極の端部又は第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子と、水晶片を覆い、内部を気密封止する金属カバーと、金属カバーが基板に搭載される部分に形成される絶縁膜とを備え、第２の接続端子が、基板の一辺に沿って延びた長方形に形成され、第１の接続端子が、第２の接続端子と同形状の長方形のパターンと、当該長方形のパターンと第１の支持電極とを接続する接続パターンとを備え、第２の接続端子と金属カバーとを導電性接着剤で接続する部分において、当該第２の接続端子上に絶縁膜を設けない開放部分を形成したことを特徴とする。 The present invention is a surface-mount crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate, and includes first and second support electrodes that hold the crystal piece, and a through-hole formed in a corner portion of the substrate. A through terminal formed on the wall surface, an end of the first support electrode or an end of the second support electrode, and a first connection terminal connecting the through terminal at the shortest corner from the end; A second connection terminal connected to the through terminal at the corner not connected to the first support electrode and the second support electrode, a metal cover that covers the crystal piece and hermetically seals the inside, and a metal cover is mounted on the substrate A second connection terminal is formed in a rectangular shape extending along one side of the substrate, and the first connection terminal is a rectangle having the same shape as the second connection terminal. And a connection pattern for connecting the rectangular pattern and the first support electrode And a down, in a portion for connecting the metal cover second connection terminals with a conductive adhesive, and wherein the forming the opening portion on the second connection terminal is not provided with an insulating film.
　本発明は、上記表面実装水晶振動子において、第２の接続端子のパターンは、基板の長辺に沿って延びて形成されていることを特徴とする。 The present invention is characterized in that, in the surface-mounted crystal resonator, the pattern of the second connection terminal extends along the long side of the substrate.
　本発明は、上記表面実装水晶振動子において、第２の接続端子のパターンは、基板の短辺に沿って延びて形成されていることを特徴とする。 The present invention is characterized in that, in the above surface-mounted crystal resonator, the pattern of the second connection terminal extends along the short side of the substrate.
　本発明は、上記表面実装水晶振動子において、第１の接続端子の接続パターンは、一辺が長方形のパターンの長辺と接続する略三角形に形成されていることを特徴とする。 The present invention is characterized in that, in the surface-mounted crystal resonator, the connection pattern of the first connection terminal is formed in a substantially triangular shape with one side connected to the long side of the rectangular pattern.
　シート状のセラミック基板上に複数の矩形領域がマトリクス状に配置され、各矩形領域に水晶片が搭載される表面実装水晶振動子の製造方法であって、矩形領域の角部に形成された貫通孔の壁面にスルー端子を形成すると共に、矩形領域の表面には水晶片を保持する第１の支持電極及び第２の支持電極を形成し、第１の支持電極又は第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子とを形成し、その際にスルー端子を共有する複数の矩形領域の第１の接続端子の一部及び第２の接続端子とが、貫通孔を中心とする矩形のパターンとなるよう形成し、第２の接続端子と搭載される金属カバーとを導電性接着剤で接続する部分において、第２の接続端子上に開放部分を設けるよう、金属カバーの接着面に絶縁膜を形成し、水晶片を覆い、絶縁膜を介して内部を気密封止する金属カバーを搭載することを特徴とする。 A method of manufacturing a surface-mounted crystal resonator in which a plurality of rectangular regions are arranged in a matrix on a sheet-like ceramic substrate, and a crystal piece is mounted on each rectangular region, and a through-hole formed at a corner of the rectangular region A through terminal is formed on the wall surface of the hole, and a first support electrode and a second support electrode for holding a crystal piece are formed on the surface of the rectangular region, and the end of the first support electrode or the second support electrode is formed. A first connection terminal that connects the first terminal and the through terminal at the shortest corner from the end, and a second connection that connects to the first support electrode and the through terminal at the corner that is not connected to the second support electrode And a part of the first connection terminal and the second connection terminal of the plurality of rectangular regions sharing the through terminal at that time are formed in a rectangular pattern centered on the through hole. The second connection terminal and the metal cover to be mounted are electrically conductive Metal that forms an insulating film on the adhesive surface of the metal cover so as to provide an open portion on the second connection terminal in the portion to be connected with the adhesive, covers the crystal piece, and hermetically seals the inside through the insulating film It is equipped with a cover.
　本発明によれば、第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子に、金属カバーと導電性接着剤で接続するために、第２の接続端子上に絶縁膜を設けない開放部分を形成した表面実装水晶振動子としているので、個々の水晶振動子に分離する前に金属カバーを導電性接着剤で、第２の接続端子、スルー端子に接続でき、製造を容易にし、半田付けされるスルー端子から距離を置くことで導電性接着剤が溶融せず、品質を向上でき、金属カバーをグランドレベルにすることにより外部からのノイズの影響を小さくできる効果がある。 According to the present invention, the second connecting terminal connected to the through terminal at the corner portion that is not connected to the first supporting electrode and the second supporting electrode is connected to the metal cover with the conductive adhesive. Since the surface mount crystal resonator is formed with an open portion on which no insulating film is provided on the connection terminal, the metal cover is separated with a conductive adhesive before separation into individual crystal resonators, and the second connection terminal, through It can be connected to the terminal, facilitating manufacturing, and the distance from the through terminal to be soldered does not melt the conductive adhesive, improving the quality, and by setting the metal cover to the ground level, noise from the outside can be improved. There is an effect that the influence can be reduced.
　また、本発明によれば、第２の接続端子が、基板の一辺に沿って延びた長方形に形成され、第１の接続端子が、第２の接続端子と同形状の長方形のパターンと、当該長方形のパターンと第１の支持電極とを接続する接続パターンとを備え、第２の接続端子と金属カバーとを導電性接着剤で接続する部分において、当該第２の接続端子上に絶縁膜を設けない開放部分を形成した表面実装水晶振動子としているので、シート状のセラミック基板上において、スルー端子を中心とする電極パターンを単純化してパターニングを容易にすることができ、また、導電性接着剤をスルー端子から離れた位置に塗布できるため、溶融を防ぐことができ、更に金属カバーをグランドレベルとして外部からのノイズの影響を小さくできる効果がある。 Further, according to the present invention, the second connection terminal is formed in a rectangle extending along one side of the substrate, the first connection terminal is a rectangular pattern having the same shape as the second connection terminal, and A connection pattern connecting the rectangular pattern and the first support electrode, and an insulating film is formed on the second connection terminal in a portion where the second connection terminal and the metal cover are connected by a conductive adhesive. Since it is a surface-mount crystal resonator with an open part that is not provided, it is possible to simplify the pattern of the electrode centering on the through terminal on the sheet-like ceramic substrate, and to facilitate patterning. Since the agent can be applied at a position away from the through terminal, melting can be prevented, and the effect of noise from the outside can be reduced by using the metal cover as a ground level.
第１の水晶振動子における電極パターンの平面説明図である。It is a plane explanatory view of the electrode pattern in the 1st crystal oscillator. 第１の水晶振動子における電極パターンが形成された状態の断面説明図である。It is a section explanatory view in the state where the electrode pattern in the 1st crystal oscillator was formed. 第１の水晶振動子における絶縁膜パターンの平面説明図である。It is a plane explanatory view of an insulating film pattern in the 1st crystal oscillator. 第１の水晶振動子における絶縁膜が形成された状態の断面説明図である。It is sectional explanatory drawing in the state in which the insulating film in the 1st crystal oscillator was formed. 第１の水晶振動子における支持電極パターンの平面説明図である。It is a plane explanatory view of a support electrode pattern in the 1st crystal oscillator. 第１の水晶振動子における支持電極パターンが形成された状態の断面説明図である。It is sectional explanatory drawing in the state in which the support electrode pattern in the 1st crystal oscillator was formed. 第１の水晶振動子における水晶片搭載の平面説明図である。It is a plane explanatory view of crystal piece mounting in the 1st crystal oscillator. 第１の水晶振動子におけるカバー搭載の平面説明図である。It is a plane explanatory view of cover mounting in the 1st crystal oscillator. 第１の水晶振動子にカバーが搭載された状態の断面説明図である。It is a section explanatory view in the state where the cover was mounted in the 1st crystal oscillator. 第２の水晶振動子の配線パターンを示す平面説明図である。It is a plane explanatory view showing the wiring pattern of the 2nd crystal oscillator. 第２の水晶振動子でカバーが搭載された状態の平面説明図である。It is a plane explanatory view in the state where the cover was mounted with the 2nd crystal oscillator. 第３の水晶振動子の配線パターンを示す平面説明図である。It is a plane explanatory view showing the wiring pattern of the 3rd crystal oscillator. 第３の水晶振動子でカバーが搭載された状態の平面説明図である。It is a plane explanatory view in the state where the cover was mounted with the 3rd crystal oscillator. 第４の水晶振動子の配線パターンを示す平面説明図である。It is a plane explanatory view showing the wiring pattern of the 4th crystal oscillator. 第４の水晶振動子におけるスルーホール周囲の配線パターンを示す平面説明図である。It is a plane explanatory view showing a wiring pattern around a through hole in the fourth crystal unit. 第４の水晶振動子の平面説明図である。It is a plane explanatory view of the 4th crystal oscillator. 第４の水晶振動子のカバー搭載後を示す平面説明図である。FIG. 10 is an explanatory plan view showing a fourth crystal resonator after the cover is mounted. 図１６にカバーを搭載した状態（図１７）のＡ－Ａ′断面説明図である。FIG. 16 is a cross-sectional explanatory view taken along the line AA ′ in a state where the cover is mounted in FIG. 16 (FIG. 17). 第５の水晶振動子の電極パターンを示す平面説明図である。It is a plane explanatory view showing an electrode pattern of the fifth crystal unit. 第５の水晶振動子における絶縁膜パターンを示す平面説明図である。It is a plane explanatory view showing an insulating film pattern in the 5th crystal oscillator. 第６の水晶振動子の電極パターンを示す平面説明図である。It is a plane explanatory view showing an electrode pattern of the 6th crystal oscillator.
　本発明の実施の形態について図面を参照しながら説明する。
［実施の形態の概要］
　本発明の実施の形態に係る表面実装水晶振動子は、矩形のセラミック基板の角部に形成された貫通孔の壁面にＡｇＰｄのスルー端子が形成され、基板の表面にスルー端子に接続して支持電極の下層を形成するＡｇＰｄの第１の接続端子が形成され、そのＡｇＰｄの金属端子の上に水晶片を保持するＡｇの支持電極が形成され、また、支持電極には接続しないがスルー端子に接続するＡｇＰｄの第２の接続端子を形成し、金属カバーが第１の接続端子とショートすることを防止する絶縁膜を介して金属カバーが搭載されて気密封止される構成とし、第２の接続端子で金属カバーと導電性接着剤で接続するために、第２の接続端子上の絶縁膜を形成しない開放部分を形成したものであり、製造を容易にし、生産性を向上させ、ノイズの影響を小さくしたものである。 Embodiments of the present invention will be described with reference to the drawings.
[Outline of the embodiment]
In the surface mount crystal resonator according to the embodiment of the present invention, an AgPd through terminal is formed on a wall surface of a through hole formed in a corner portion of a rectangular ceramic substrate, and is supported by connecting to the through terminal on the surface of the substrate. A first connection terminal of AgPd that forms the lower layer of the electrode is formed, a support electrode of Ag that holds a crystal piece is formed on the metal terminal of the AgPd, and is not connected to the support electrode but is connected to the through terminal. A second connection terminal of AgPd to be connected is formed, and the metal cover is mounted and hermetically sealed via an insulating film that prevents the metal cover from short-circuiting with the first connection terminal. In order to connect to the metal cover with the conductive adhesive at the connection terminal, an open part that does not form an insulating film on the second connection terminal is formed, facilitating manufacturing, improving productivity, and reducing noise. Small impact One in which the.
［第１の水晶振動子の電極パターン：図１］
　本発明の実施の形態に係る第１の表面実装水晶振動子（第１の水晶振動子）について図１を参照しながら説明する。図１は、第１の水晶振動子における電極パターンの平面説明図である。
　第１の水晶振動子における金属電極の電極パターンは、図１に示すように、セラミック基板（ベース）１上に、支持電極の下層となる支持電極下層部３ａのパターンと、ベース１の四隅のスルーホール内に形成されたスルー端子２ｃと、支持電極下層部３ａとスルー端子２ｃを接続する接続端子２ａのパターンと、スルー端子２ｃに接続するものの、支持電極下層部３ａに接続しない接続端子２ｂのパターンとを基本的に有している。 [Electrode pattern of first crystal resonator: FIG. 1]
A first surface-mount crystal resonator (first crystal resonator) according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is an explanatory plan view of an electrode pattern in the first crystal unit.
As shown in FIG. 1, the electrode pattern of the metal electrode in the first crystal unit is formed on the ceramic substrate (base) 1, the pattern of the support electrode lower layer portion 3 a serving as the lower layer of the support electrode, and the four corners of the base 1. The through terminal 2c formed in the through hole, the pattern of the connection terminal 2a that connects the support electrode lower layer 3a and the through terminal 2c, and the connection terminal 2b that connects to the through terminal 2c but does not connect to the support electrode lower layer 3a It basically has the pattern of
　ここで、電極パターンの各部について具体的に説明する。
　スルー端子２ｃは、ベースに分離する前のセラミックシート状態で、個々の水晶振動子の領域を定めるブレイクラインの交点にスルーホール（貫通孔）が形成され、そのスルーホールの壁面に金属膜が形成されてベースの表裏を接続する電極となっている。 Here, each part of an electrode pattern is demonstrated concretely.
The through terminal 2c is in a ceramic sheet state before being separated into a base, and through holes (through holes) are formed at the intersections of break lines that define the areas of the individual crystal resonators, and a metal film is formed on the wall surface of the through hole It is an electrode that connects the front and back of the base.
　接続端子２ａは、支持電極下層部３ａの端部から最も近い角部のスルー端子２ｃに直線的に接続し、ベース１の角部でスルーホールを除いて四角形のパターンとなっている。
　更に、接続端子２ａは、各々対角に位置するスルー端子２ｃに接続する。図１では、左下のスルー端子２ｃに一方の接続端子２ａが接続し、右上のスルー端子２ｃに他方の接続端子２ａが接続している。
　接続端子２ａを対角にすることで、カバーが図１の上下方向にずれたとしても、接続端子２ａが接続していない支持電極下層部３ａの端部に、カバーが接触することを防止でき、品質を向上させることができる。 The connection terminal 2a is linearly connected to the through terminal 2c at the corner closest to the end of the support electrode lower layer 3a, and has a rectangular pattern except for the through hole at the corner of the base 1.
Further, the connection terminals 2a are connected to through terminals 2c that are positioned diagonally. In FIG. 1, one connection terminal 2a is connected to the lower left through terminal 2c, and the other connection terminal 2a is connected to the upper right through terminal 2c.
By connecting the connection terminal 2a diagonally, even if the cover is displaced in the vertical direction in FIG. , Can improve the quality.
　更に、支持電極下層部３ａは、接続端子２ａが接続する端部に比べて接続端子２ａが接続しない端部が短くなっている。
　つまり、接続端子２ａが接続する支持電極下層部３ａの端部と近接するベース１の長辺までの距離（Ａ）と接続端子２ａが接続しない支持電極下層部３ａの端部と近接するベース１の長辺までの距離（Ｂ）とを比較すると、距離（Ａ）に対して距離（Ｂ）が長くなっている。 Further, the support electrode lower layer portion 3a has a shorter end portion to which the connection terminal 2a is not connected than an end portion to which the connection terminal 2a is connected.
That is, the distance (A) to the long side of the base 1 close to the end of the support electrode lower layer 3a to which the connection terminal 2a is connected and the base 1 close to the end of the support electrode lower layer 3a to which the connection terminal 2a is not connected. Compared with the distance (B) to the long side, the distance (B) is longer than the distance (A).
　従って、図１の左上及び右下において、支持電極下層部３ａの端部（接続端子２ａが接続しない端部）と近接する長辺までのスペースを広くすることで、その後に搭載するカバーが図１の上下方向で多少ずれたとしても、その端部に接触することがなく、品質を向上させることができる。 Therefore, in the upper left and lower right of FIG. 1, the cover to be mounted thereafter is enlarged by widening the space to the long side close to the end of the support electrode lower layer 3 a (the end to which the connection terminal 2 a is not connected). Even if it is slightly deviated in the up-and-down direction of 1, the end portion is not contacted, and the quality can be improved.
　また、接続端子２ｂは、支持電極下層部３ａに接続しないがスルー端子２ｃに接続し、ベース１の角部でスルーホールを除いて四角形のパターンとなっている。
　具体的には、接続端子２ｂは、四角形のパターンであるため、ベース１の略中央方向に向けて突出したパターンとなっている。接続端子２ｂのパターンにおいて、第１の水晶振動子の特徴として、金属カバーが導電性接着剤により接続される。
　接続端子２ｂのパターンは、四角形状としたが、金属カバーが搭載されて導電性接着剤で接続するためのスペースがあれば形状にはとらわれない。 The connection terminal 2b is not connected to the support electrode lower layer part 3a but is connected to the through terminal 2c, and has a rectangular pattern except for the through hole at the corner of the base 1.
Specifically, since the connection terminal 2b is a rectangular pattern, the connection terminal 2b is a pattern protruding toward the substantially central direction of the base 1. In the pattern of the connection terminal 2b, the metal cover is connected by a conductive adhesive as a feature of the first crystal unit.
Although the pattern of the connection terminal 2b is a square shape, the shape is not limited by the shape as long as a metal cover is mounted and there is a space for connecting with a conductive adhesive.
［第１の水晶振動子における電極パターンの断面：図２］
　ベース１に電極パターンが形成された状態の断面説明図を図２に示す。図２は、第１の水晶振動子における電極パターンが形成された状態の断面説明図である。図２の断面は、図１のＡ－Ａ´部分の断面を示している。
　図２に示すように、ベース１の表面には、接続端子２ｂがＡｇＰｄにより形成されると共に、ベース１の表裏を接続するスルー端子２ｃも同時に形成される。尚、図２には示していないが、接続端子２ｂと共に、支持電極下層部３ａ、接続端子２ａも同時に形成されるものである。 [Cross section of electrode pattern in first crystal resonator: FIG. 2]
FIG. 2 shows a cross-sectional explanatory diagram in a state where the electrode pattern is formed on the base 1. FIG. 2 is a cross-sectional explanatory view showing a state in which an electrode pattern in the first crystal unit is formed. The cross section of FIG. 2 shows the cross section of the AA ′ portion of FIG.
As shown in FIG. 2, a connection terminal 2b is formed of AgPd on the surface of the base 1, and a through terminal 2c for connecting the front and back of the base 1 is formed at the same time. Although not shown in FIG. 2, the support electrode lower layer portion 3a and the connection terminal 2a are formed simultaneously with the connection terminal 2b.
　また、ベース１の裏面には、各スルー端子２ｃに接続する実装端子４の電極パターンがＡｇＰｄにより形成される。
　実装端子４の内、接続端子２ａにスルー端子２ｃを介して接続する実装端子４は、電圧が印加される電極となり、接続端子２ｂにスルー端子２ｃを介して接続する実装端子４は、グランドレベルに接続するＧＮＤ（グランド）電極となる。 On the back surface of the base 1, an electrode pattern of the mounting terminal 4 connected to each through terminal 2c is formed of AgPd.
Among the mounting terminals 4, the mounting terminal 4 connected to the connection terminal 2a via the through terminal 2c serves as an electrode to which a voltage is applied, and the mounting terminal 4 connected to the connection terminal 2b via the through terminal 2c is a ground level. It becomes a GND (ground) electrode connected to.
［第１の水晶振動子の絶縁膜形成：図３］
　次に、第１の水晶振動子の絶縁膜形成について図３を参照しながら説明する。図３は、第１の水晶振動子における絶縁膜パターンの平面説明図である。
　図３に示すように、絶縁膜１０は、金属カバーがベース１に直接接着しないように設けられ、ベース１上の接続端子２ａとのショートを防止するもので、ベース１の表面であって外周の内側を周回するよう帯状にガラス等で形成され、ベース１上の接続端子２ａを覆って横断している。
　絶縁膜１０上には、金属カバーの接触面が接触して気密封止される。ここで、金属カバーの接触面は、カバーがハット型である場合は、カバーの開口端面（フランジ部分の下側面）となる。 [Insulating film formation of first crystal resonator: FIG. 3]
Next, formation of the insulating film of the first crystal resonator will be described with reference to FIG. FIG. 3 is an explanatory plan view of an insulating film pattern in the first crystal unit.
As shown in FIG. 3, the insulating film 10 is provided so that the metal cover does not directly adhere to the base 1, and prevents a short circuit with the connection terminal 2 a on the base 1. It is formed of glass or the like in a belt shape so as to circulate inside, and crosses the connection terminal 2 a on the base 1.
On the insulating film 10, the contact surface of the metal cover comes into contact and is hermetically sealed. Here, when the cover is a hat type, the contact surface of the metal cover is the opening end surface of the cover (the lower surface of the flange portion).
　そして、絶縁膜１０は、ベース１の外周端からは離れて内側に形成され、スルー端子２ｃに接続する接続端子２ａの一部を覆い、接続端子２ｂの四角形状を覆わないように、絶縁膜１０が形成されない開放部分を形成している。
　つまり、接続端子２ｂのパターンでは、金属カバーが導電性接着剤で接続される部分を覆わないように、開放部分を備える絶縁膜１０が形成されている。即ち、接続端子２ｂの金属カバー接続接続部分は露出している。 The insulating film 10 is formed on the inner side away from the outer peripheral end of the base 1 and covers a part of the connection terminal 2a connected to the through terminal 2c and does not cover the rectangular shape of the connection terminal 2b. An open portion where 10 is not formed is formed.
That is, in the pattern of the connection terminal 2b, the insulating film 10 having an open portion is formed so as not to cover the portion where the metal cover is connected with the conductive adhesive. That is, the metal cover connection / connection portion of the connection terminal 2b is exposed.
［第１の水晶振動子における絶縁膜形成の断面：図４］
　絶縁膜が形成された状態の断面説明図を図４に示す。図４は、第１の水晶振動子における絶縁膜が形成された状態の断面説明図である。図４の断面は、図３のＢ－Ｂ´部分の断面を示している。
　図４に示すように、ベース１の表面において外周の内側を周回するよう絶縁膜１０が形成される。尚、接続端子２ａの上にも絶縁膜１０は形成される。図４では、Ｂ－Ｂ´の断面説明図であるため、絶縁膜１０が接続端子２ａを覆うものとはなっていない。 [Cross section of insulating film formation in first crystal resonator: FIG. 4]
FIG. 4 shows a cross-sectional explanatory diagram in a state where an insulating film is formed. FIG. 4 is a cross-sectional explanatory view showing a state in which an insulating film is formed in the first crystal resonator. The cross section of FIG. 4 shows the cross section of the BB ′ portion of FIG.
As shown in FIG. 4, an insulating film 10 is formed on the surface of the base 1 so as to go inside the outer periphery. The insulating film 10 is also formed on the connection terminal 2a. In FIG. 4, since the cross-sectional view is taken along the line BB ′, the insulating film 10 does not cover the connection terminal 2a.
［第１の水晶振動子の支持電極パターン：図５］
　次に、第１の水晶振動子の支持電極パターンについて図５を参照しながら説明する。図５は、第１の水晶振動子における支持電極パターンの平面説明図である。
　図５に示すように、支持電極３ｂは、支持電極下層部３ａの上に積層されてＡｇ（銀）により形成されるものである。 [Support electrode pattern of first crystal resonator: FIG. 5]
Next, the support electrode pattern of the first crystal resonator will be described with reference to FIG. FIG. 5 is an explanatory plan view of a support electrode pattern in the first crystal unit.
As shown in FIG. 5, the support electrode 3 b is laminated on the support electrode lower layer portion 3 a and is formed of Ag (silver).
　支持電極３ｂは、Ａｇを用いているため、粘度が高く、メタルマスクを用いて一度の塗布で厚みのある金属膜を形成できる。一度の塗布で形成される支持電極３ｂの厚さは、従来のＡｇＰｄを用いた金属膜（粘度が低い）の三層分に相当する。
　つまり、同じ厚みの支持電極３ｂを形成するのに、本実施の形態ではＡｇ膜を一度塗布すればよいが、従来のＡｇＰｄ膜では三度塗布する必要があり、多くのＰｄを使用してコスト高であり、作業工程も複雑になっている。
　また、支持電極３ｂは、粘度の高いＡｇを用いているため、だれて支持電極下層部３ａからはみ出すことがなく、金属製のカバーがずれて搭載されてもショートする可能性を少なくできる。 Since the support electrode 3b uses Ag, the viscosity is high, and a thick metal film can be formed by a single application using a metal mask. The thickness of the support electrode 3b formed by one application corresponds to three layers of a metal film (low viscosity) using conventional AgPd.
That is, in order to form the support electrode 3b having the same thickness, it is only necessary to apply the Ag film once in the present embodiment. However, the conventional AgPd film needs to be applied three times, and a lot of Pd is used. It is expensive and the work process is complicated.
In addition, since the support electrode 3b uses Ag having a high viscosity, the support electrode 3b does not leak out from the support electrode lower layer portion 3a, and the possibility of short-circuiting can be reduced even when the metal cover is shifted and mounted.
［第１の水晶振動子における支持電極パターンの断面：図６］
　支持電極パターンが形成された状態の断面説明図を図６に示す。図６は、第１の水晶振動子における支持電極パターンが形成された状態の断面説明図である。図６の断面は、図５のＣ－Ｃ´部分の断面を示している。
　図６に示すように、支持電極下層部３ａの上に支持電極３ｂが、支持電極下層部３ａより厚く形成されている。 [Cross section of support electrode pattern in first crystal resonator: FIG. 6]
FIG. 6 shows a cross-sectional explanatory diagram in a state where the support electrode pattern is formed. FIG. 6 is a cross-sectional explanatory view showing a state in which a support electrode pattern is formed in the first crystal unit. The cross section of FIG. 6 shows a cross section of the CC ′ portion of FIG.
As shown in FIG. 6, the support electrode 3b is formed on the support electrode lower layer 3a to be thicker than the support electrode lower layer 3a.
［第１の水晶振動子の水晶片搭載：図７］
　次に、第１の水晶振動子の水晶片搭載について図７を参照しながら説明する。図７は、第１の水晶振動子における水晶片搭載の平面説明図である。
　図７に示すように、水晶片５は、ＡＴカットとし、対向した励振電極５ａが両主面に形成されている。
　また、水晶片５は、励振電極５ａから互いに反対方向の両端部に延出して幅方向の全幅にわたって折り返された引出電極５ｂが形成されている。
　そして、引出電極５ｂの延出した一組の対角部（端部）が導電材としての導電性接着剤７によって支持電極３ｂに固着して、引出電極５ｂと支持電極３ｂとを電気的・機械的に接続している。 [First crystal unit mounted crystal piece: FIG. 7]
Next, the mounting of the crystal unit of the first crystal unit will be described with reference to FIG. FIG. 7 is an explanatory plan view of the mounting of the crystal piece in the first crystal resonator.
As shown in FIG. 7, the crystal piece 5 is AT-cut, and opposing excitation electrodes 5a are formed on both main surfaces.
Further, the crystal piece 5 is formed with an extraction electrode 5b that extends from the excitation electrode 5a to both ends in opposite directions and is folded over the entire width in the width direction.
Then, a pair of diagonal portions (end portions) extending from the extraction electrode 5b are fixed to the support electrode 3b by the conductive adhesive 7 as a conductive material, and the extraction electrode 5b and the support electrode 3b are electrically connected. Mechanically connected.
［第１の水晶振動子のカバー搭載：図８，図９］
　第１の水晶振動子のカバー搭載について図８，図９を参照しながら説明する。図８は、第１の水晶振動子におけるカバー搭載の平面説明図であり、図９は、第１の水晶振動子にカバーが搭載された状態の断面説明図である。図９では、図５のＣ－Ｃ´に相当する部分を図８で切断した断面となっている。
　図８，図９に示すように、支持電極３ｂの上に、導電性接着剤７を介して水晶片５が搭載され、更に、絶縁膜１０上に絶縁性の封止材としての樹脂層８を介して金属製のカバー６が搭載される。 [First crystal resonator cover mounted: FIGS. 8 and 9]
The first crystal resonator cover mounting will be described with reference to FIGS. FIG. 8 is an explanatory plan view of a cover mounted on the first crystal unit, and FIG. 9 is an explanatory cross-sectional view of a state in which the cover is mounted on the first crystal unit. In FIG. 9, a section corresponding to CC ′ in FIG. 5 is a cross section cut in FIG.
As shown in FIGS. 8 and 9, the crystal piece 5 is mounted on the support electrode 3 b via the conductive adhesive 7, and the resin layer 8 as an insulating sealing material is further formed on the insulating film 10. A metal cover 6 is mounted via
　カバー６は、凹状の形状をしており、開口端面がＬ字状に折曲し、その凹状の形状を逆さまにして、そのＬ字状の部分（フランジ部分）が封止剤の樹脂層８を介して絶縁膜１０上に接合される。
　カバー６で封止する場合には、Ｎ2パージにより気密封止するため、Ａｇで形成された支持電極３ｂが酸化することがなく、品質的には問題はない。 The cover 6 has a concave shape, the opening end surface is bent in an L shape, the concave shape is turned upside down, and the L-shaped portion (flange portion) is the resin layer 8 of the sealant. It is joined on the insulating film 10 via
In the case of sealing with the cover 6, since it is hermetically sealed by N2 purge, the support electrode 3b formed of Ag is not oxidized, and there is no problem in quality.
　ここで、接続端子２ｂのパターンにおいてカバー６が接続する部分の上部には、絶縁膜１０が形成されないように開放部分を形成しているため、カバー６とは接触可能となっている。
　第１の水晶振動子では、金属製のカバー６をグランドレベルにするために、導電性接着剤１１で接続端子２ｂとカバー６の一部を接続する。接続端子２ｂは、スルー端子２ｃを介してベース１の裏面の実装端子４に接続する。その実装端子４は、接地される。 Here, in the pattern of the connection terminal 2b, since the open part is formed so that the insulating film 10 is not formed in the upper part of the part to which the cover 6 is connected, the cover 6 can be contacted.
In the first crystal unit, the connection terminal 2b and a part of the cover 6 are connected by the conductive adhesive 11 in order to bring the metal cover 6 to the ground level. The connection terminal 2b is connected to the mounting terminal 4 on the back surface of the base 1 through the through terminal 2c. The mounting terminal 4 is grounded.
　導電性接着剤１１は、ベース１において対角の２箇所の接続端子２ｂでそれぞれ接着してもよいし、一方の接続端子２ｂのみで接着してもよい。
　ベース１で１箇所の導電性接着剤１１で接続端子２ｂとカバー６とを接続するのであれば、他の接続端子２ｂにはカバー６と接触する開放部分（開放領域）を設ける必要はない。つまり、他の接続端子２ｂとカバー６が絶縁膜１０で絶縁される構成とするものである。 The conductive adhesive 11 may be adhered to the base 1 at two diagonal connection terminals 2b, or may be adhered only to one connection terminal 2b.
If the connection terminal 2b and the cover 6 are connected to the base 1 with the conductive adhesive 11 at one place, it is not necessary to provide an open portion (open area) in contact with the cover 6 on the other connection terminal 2b. That is, the other connection terminal 2b and the cover 6 are insulated by the insulating film 10.
　第１の水晶振動子は、カバー６で封止された後に、ブレイクラインで切断されて分離され、出荷されて通信機器等の製品に実装される際に、ベース１の裏面の実装端子４が半田付けされることになる。
　その半田がスルー端子２ｃから這い上がってくると、導電性接着剤１１に含まれるＡｇが食われて導通しなくなるおそれがある。 The first crystal unit is sealed with a cover 6 and then cut and separated by a break line. When the first crystal unit is shipped and mounted on a product such as a communication device, the mounting terminal 4 on the back surface of the base 1 is It will be soldered.
If the solder crawls up from the through terminal 2c, there is a possibility that Ag contained in the conductive adhesive 11 is eaten and becomes non-conductive.
　そこで、第１の水晶振動子では、スルー端子２ｃからベース１の内側に接続端子２ｂを形成し、その接続端子２ｂでカバー６と導電性接着剤１１で接続するようにしているので、半田の這い上がりによって導電性接着剤１１のＡｇが食われることがなく、接触不良を防止できるものである。 Therefore, in the first crystal resonator, the connection terminal 2b is formed from the through terminal 2c to the inside of the base 1, and the connection terminal 2b is connected to the cover 6 by the conductive adhesive 11. As a result of scooping up, Ag of the conductive adhesive 11 is not eaten, and contact failure can be prevented.
［第１の水晶振動子の製造方法］
　次に、第１の水晶振動子の製造方法について説明する。
　［第１工程／シート状セラミック生地焼成］
　先ず、シート状セラミックベースの元となるシート状セラミック生地を形成する。
　シート状セラミック生地には、個々のセラミックベース１に対応して隣接する領域同士を区切るブレイクラインを形成すると共にその四隅部（角部）に貫通孔（スルーホール）を形成する。
　そして、貫通孔が形成されたシート状セラミック生地を焼成し、シート状セラミックベースを得る。 [Method for Manufacturing First Crystal Resonator]
Next, a method for manufacturing the first crystal resonator will be described.
[First step / Sintered ceramic fabric]
First, a sheet-shaped ceramic cloth that is the basis of the sheet-shaped ceramic base is formed.
In the sheet-like ceramic fabric, break lines that divide adjacent regions corresponding to individual ceramic bases 1 are formed, and through holes (through holes) are formed at the four corners (corners).
And the sheet-like ceramic material | fabric in which the through-hole was formed is baked, and a sheet-like ceramic base is obtained.
　［第２工程／回路パターン形成］
　次に、シート状セラミックベースの回路パターンに対応した領域に、ＡｇＰｄ合金の金属ペーストを厚み約１０μｍ程度で、スクリーンマスクを用いた印刷によって形成する。
　回路パターンは、一主面（表面）では、図１に示すように、金属パターンが形成され、他主面（裏面）では、実装端子４のパターンが形成され、更に、貫通孔の壁面にはスルー端子２ｃが形成される。 [Second step / circuit pattern formation]
Next, an AgPd alloy metal paste having a thickness of about 10 μm is formed in a region corresponding to the circuit pattern of the sheet-like ceramic base by printing using a screen mask.
As shown in FIG. 1, the circuit pattern has a metal pattern formed on one main surface (front surface), a pattern of mounting terminals 4 formed on the other main surface (back surface), and a wall surface of the through hole. A through terminal 2c is formed.
　そして、ＡｇＰｄ合金とした金属ペーストを約８５０℃で焼成し、金属ペースト中のバインダを蒸発させると共にＡｇＰｄ合金を溶融して固体化し、金属パターンの形成されたシート状セラミックベースを得る。
　尚、セラミックの焼成温度は約１５００～１６００℃、ＡｇＰｄ合金はこれ以下の８５０℃となることから、セラミックの焼成後にＡｇＰｄ合金ペーストを塗布して、セラミックとともにＡｇＰｄ合金ペーストを焼成する。
　これは、セラミック生地にＡｇＰｄ合金ペーストを塗布してセラミックの焼成温度で焼成すると、ＡｇＰｄ合金ペーストは高温過ぎて塊粒になって回路パターンを形成できないことに起因する。 And the metal paste made into AgPd alloy is baked at about 850 degreeC, the binder in a metal paste is evaporated, and AgPd alloy is fuse | melted and solidified, and the sheet-like ceramic base in which the metal pattern was formed is obtained.
Since the firing temperature of the ceramic is about 1500 to 1600 ° C. and the AgPd alloy is 850 ° C. below this, the AgPd alloy paste is applied after firing the ceramic, and the AgPd alloy paste is fired together with the ceramic.
This is due to the fact that when an AgPd alloy paste is applied to a ceramic fabric and fired at the firing temperature of the ceramic, the AgPd alloy paste becomes too hot and cannot form a circuit pattern.
　［第３工程／絶縁膜１０形成］
　次に、絶縁膜１０の形成について説明する。
　金属パターン等が形成されたシート状セラミックベースの各矩形領域（各ベース１に相当）の周囲の内側に絶縁膜１０としてガラスペーストを印刷によって形成する。
　そして、約８５０℃程度の温度で焼成してガラスを固体化する。 [Third Step / Insulating Film 10 Formation]
Next, formation of the insulating film 10 will be described.
A glass paste is formed by printing as an insulating film 10 inside each rectangular area (corresponding to each base 1) of the sheet-like ceramic base on which a metal pattern or the like is formed.
Then, it is fired at a temperature of about 850 ° C. to solidify the glass.
　［第４工程／支持電極３ｂ形成］
　次に、支持電極３ｂの形成について説明する。
　支持電極３ｂが、図５，６に示すように、ニッケル（Ｎｉ）のメタルマスクを用いて、ＡｇＰｄの支持電極下層部３ａの上にＡｇの金属膜により形成される。
　支持電極３ｂは、Ａｇの金属膜であるため、粘度が高く、一度の成膜で厚みのある膜を形成することができる。従って、支持電極３ｂは、だれて支持電極下層部３ａからはみ出すことがない。 [Fourth process / support electrode 3b formation]
Next, the formation of the support electrode 3b will be described.
As shown in FIGS. 5 and 6, the support electrode 3b is formed of an Ag metal film on the support electrode lower layer 3a of AgPd using a nickel (Ni) metal mask.
Since the support electrode 3b is an Ag metal film, the support electrode 3b has a high viscosity, and a thick film can be formed by a single film formation. Therefore, the support electrode 3b does not protrude from the support electrode lower layer portion 3a.
　［第５工程／水晶片５搭載］
　次に、金属パターン等の形成されたシート状セラミックベースの各支持電極３ｂに、励振電極５ａから引出電極５ｂの延出した水晶片５を導電性接着剤７によって固着して搭載し、電気的・機械的に接続する。
　導電性接着剤７は、接続端子２ａが接続する側の支持電極３ｂの端部に形成される。 [Fifth process / with crystal piece 5]
Next, the crystal piece 5 in which the extraction electrode 5b extends from the excitation electrode 5a is fixed and mounted on each support electrode 3b of the sheet-like ceramic base on which the metal pattern or the like is formed, and is electrically mounted. • Connect mechanically.
The conductive adhesive 7 is formed at the end of the support electrode 3b on the side to which the connection terminal 2a is connected.
　［第６工程／周波数調整］
　次に、シート状セラミックベースに搭載（固着）された水晶振動子としての各水晶片５の振動周波数を質量負荷効果によって調整する。
　具体的には、シート状セラミックベースの裏面において、各水晶片５と電気的に接続した実装端子４に測定器からの測定端子（プローブ）を接触させる。そして、板面が露出した水晶片５の表面側の励振電極５ａにガスイオンを照射して表面を削り取り、励振電極５ａの質量を減じて振動周波数を低い方から高い方に調整する。
　但し、例えば、蒸着やスパッタによって励振電極５ａ上に金属膜を付加して、振動周波数を高い方から低い方に調整することもできる。 [Sixth step / frequency adjustment]
Next, the vibration frequency of each crystal piece 5 as a crystal resonator mounted (fixed) on the sheet-like ceramic base is adjusted by the mass load effect.
Specifically, the measurement terminal (probe) from the measuring instrument is brought into contact with the mounting terminal 4 electrically connected to each crystal piece 5 on the back surface of the sheet-like ceramic base. Then, the excitation electrode 5a on the surface side of the crystal piece 5 with the plate surface exposed is irradiated with gas ions to scrape the surface, and the mass of the excitation electrode 5a is reduced to adjust the vibration frequency from the lower to the higher.
However, it is also possible to adjust the vibration frequency from higher to lower by adding a metal film on the excitation electrode 5a by vapor deposition or sputtering, for example.
　［第７工程／金属カバー接合（密閉封入）］
　次に、水晶片５が搭載されたシート状セラミックベースの個々のセラミックベース１に対応した矩形状領域の外周表面であって絶縁膜１０上に、凹状とした金属のカバー６の開口端面（フランジ下面）を、封止材の樹脂層８を介して接合する。
　ここでは、カバー６の開口端面に予め塗布又は転写された樹脂層８を封止材とし、加熱溶融して接合する。例えば、カバー６の開口端面をＬ字状として所謂シールパスを長くする。これにより、個々の水晶片５を密閉封入して集合化されたシート状の水晶振動子を形成する。 [Seventh step / Metal cover joining (sealing sealed)]
Next, the opening end face (flange) of the concave metal cover 6 on the insulating film 10 on the outer peripheral surface of the rectangular region corresponding to each ceramic base 1 of the sheet-like ceramic base on which the crystal piece 5 is mounted. The lower surface is bonded via the resin layer 8 of the sealing material.
Here, the resin layer 8 previously applied or transferred to the opening end face of the cover 6 is used as a sealing material, and is heated and melted to be joined. For example, the opening end surface of the cover 6 is L-shaped, and the so-called seal path is lengthened. As a result, individual crystal pieces 5 are hermetically sealed to form an aggregated sheet-like crystal resonator.
　［第８工程／導電性接着剤１１形成］
　次に、接続端子２ｂの部分で絶縁膜１０が形成されていない開放部分にカバー６と接続する導電性接着剤１１を塗布して形成し、金属製のカバー６を、接続端子２ｂを介してスルー端子２ｃに接続し、更にベース１の裏面の実装端子４に接続させる。
　上記開放部分では、絶縁膜１０は形成されていないが、カバー６が接続端子２ｂ上に封止材の樹脂層８を介して搭載されて密閉封入され、導電接着剤１１が開放部分でカバー６と接続端子２ｂを接続するものである。
　その実装端子４がグランドレベルに接続されれば、カバー６の電位がグランドレベルとなり、カバー６の外部からのノイズの影響を小さくできる。 [Eighth process / conductive adhesive 11 formation]
Next, a conductive adhesive 11 that is connected to the cover 6 is applied to an open portion of the connection terminal 2b where the insulating film 10 is not formed, and the metal cover 6 is connected via the connection terminal 2b. Connected to the through terminal 2 c and further connected to the mounting terminal 4 on the back surface of the base 1.
In the open portion, the insulating film 10 is not formed, but the cover 6 is mounted on the connection terminal 2b via the resin layer 8 of the sealing material and hermetically sealed, and the conductive adhesive 11 is covered in the open portion. And connecting terminal 2b.
If the mounting terminal 4 is connected to the ground level, the potential of the cover 6 becomes the ground level, and the influence of noise from the outside of the cover 6 can be reduced.
　［第９工程／分割］
　最後に、水晶振動子が集合化されたシート状セラミックベースをブレイクラインに従って縦横に分割して、個々の表面実装水晶振動子を得る。 [Ninth step / division]
Finally, the sheet-like ceramic base on which the crystal resonators are assembled is divided vertically and horizontally according to the break line to obtain individual surface mount crystal resonators.
　また、ここでは、金属パターン等の形成されたシート状セラミックベースの状態で、水晶片５の搭載（第５工程）、周波数調整（第６工程）、カバー６の接合（第７工程）及び導電性接着剤１１の形成（第８の工程）の工程を連続的に行えるので、生産性を向上させることができる効果がある。 Here, in the state of a sheet-like ceramic base on which a metal pattern or the like is formed, mounting of the crystal piece 5 (fifth step), frequency adjustment (sixth step), joining of the cover 6 (seventh step), and conductivity Since the process of forming the adhesive 11 (eighth process) can be performed continuously, the productivity can be improved.
　更に、本実施形態では、セラミックベース１の裏面の実装端子４は、それぞれが電気的に独立した４端子とする。一方、シート状セラミックベースの状態では、隣接する矩形状領域の４つの角部における各実装端子４（４個）はスルー端子２ｃを経て電気的に共通接続する。
　従って、４つの角部の各実装端子４が共通接続された状態でも、各セラミックベース１の支持電極３ｂに接続する一組の対角部の実装端子４に測定端子を接触させて振動周波数を測定し、水晶片５毎に振動周波数を調整できる効果がある。 Furthermore, in this embodiment, the mounting terminals 4 on the back surface of the ceramic base 1 are four terminals that are electrically independent from each other. On the other hand, in the state of the sheet-like ceramic base, the mounting terminals 4 (four pieces) at the four corners of the adjacent rectangular regions are electrically connected in common through the through terminals 2c.
Accordingly, even when the mounting terminals 4 at the four corners are connected in common, the measurement terminal is brought into contact with the pair of diagonal mounting terminals 4 connected to the support electrodes 3b of the ceramic bases 1 so as to obtain the vibration frequency. This has the effect of measuring and adjusting the vibration frequency for each crystal piece 5.
　また、絶縁膜１０をガラスとしたが、例えば、封止材の樹脂層８よりも耐熱性があれば樹脂であっても適用できる。
　そして、金属パターンは、ＡｇＰｄ合金としたが、セラミックに対する付着力が比較的良好なＡｇを主とした例えばＡｇＰｔ（銀・白金）合金でもよく、Ａｇ系厚膜材料であれば適用できる。 Further, although the insulating film 10 is made of glass, for example, a resin can be applied as long as it has heat resistance as compared with the resin layer 8 of the sealing material.
The metal pattern is an AgPd alloy, but may be, for example, an AgPt (silver / platinum) alloy mainly composed of Ag having relatively good adhesion to the ceramic, and any Ag-based thick film material can be applied.
［第１の水晶振動子の効果］
　第１の水晶振動子によれば、水晶片５に接続しない四角形の接続端子２ｂにおいてベース１の略中心方向にパターンを形成し、当該パターンにおいて絶縁膜１０が形成されない開放部分を形成し、当該開放部分で導電性接着剤１１によりカバー６と接続する構成としているので、スルー端子２ｃから半田が這い上がっても、スルー端子２ｃからベース１の
中心側に距離を置いた場所に導電性接着剤１１が形成されているので、導電性接着剤１１のＡｇが食われて導通不良となることを防止できる効果がある。 [Effect of the first crystal unit]
According to the first crystal resonator, a pattern is formed in a substantially central direction of the base 1 at the square connection terminal 2b that is not connected to the crystal piece 5, and an open portion where the insulating film 10 is not formed is formed in the pattern. Since it is configured to be connected to the cover 6 by the conductive adhesive 11 at the open portion, even if the solder crawls up from the through terminal 2c, the conductive adhesive is placed at a place away from the through terminal 2c to the center side of the base 1. 11 is formed, there is an effect that it is possible to prevent the conductive adhesive 11 from being eaten and causing poor conduction.
［第２の水晶振動子：図１０，１１］
　本発明の実施の形態に係る第２の水晶振動子（第２の水晶振動子）について図１０，図１１を参照しながら説明する。図１０は、第２の水晶振動子の配線パターンを示す平面説明図であり、図１１は、第２の水晶振動子でカバーが搭載された状態の平面説明図である。
　第２の水晶振動子は、図１０，図１１に示すように、水晶片５に接続しない接続端子２ｂにベース１の長辺に沿って接続パターン２ｂ１を形成し、当該接続パターン２ｂ１上でカバー６と導電性接着剤１１で接続する構成である。
　接続パターン２ｂ１の長さは任意であり、導電性接着剤１１を形成する位置も任意である。
　尚、図１１では、導電性接着剤１１は、接続パターン２ｂ１において角部とは反対側の端部付近に形成される。 [Second crystal unit: FIGS. 10 and 11]
A second crystal resonator (second crystal resonator) according to an embodiment of the present invention will be described with reference to FIGS. FIG. 10 is an explanatory plan view showing a wiring pattern of the second crystal unit, and FIG. 11 is an explanatory plan view showing a state in which a cover is mounted on the second crystal unit.
As shown in FIGS. 10 and 11, the second crystal resonator is formed with a connection pattern 2b1 along the long side of the base 1 on a connection terminal 2b that is not connected to the crystal piece 5, and covers the connection pattern 2b1. 6 is connected to the conductive adhesive 11.
The length of the connection pattern 2b1 is arbitrary, and the position where the conductive adhesive 11 is formed is also arbitrary.
In FIG. 11, the conductive adhesive 11 is formed in the vicinity of the end opposite to the corner in the connection pattern 2b1.
　導電性接着剤１１が形成される部分では、絶縁膜１０が形成されていない開放部分を設ける。開放部分は、導電性接着剤１１の塗布範囲に応じて定められる。
　接続パターン２ｂ１は、図１０では、ベース１の長辺に対してその半分以下の短さで、長辺に沿って形成されている。
　また、図１０では、２つの長辺にそれぞれ接続パターン２ｂ１が形成され、導電性接着剤１１で接続する部分が２箇所となっているが、接続する部分が１箇所とすれば、接続パターン２ｂ１もベース１について１パターン形成すればよい。
　第２の水晶振動子における接続パターン２ｂ１の形状、絶縁膜１０の開放部分の形成位置、導電性接着剤１１の形成位置等の特徴部分以外は、第１の水晶振動子と同様である。 In the portion where the conductive adhesive 11 is formed, an open portion where the insulating film 10 is not formed is provided. The open part is determined according to the application range of the conductive adhesive 11.
In FIG. 10, the connection pattern 2b1 is shorter than the long side of the base 1 by half or less and is formed along the long side.
In FIG. 10, the connection pattern 2b1 is formed on each of the two long sides, and there are two portions connected by the conductive adhesive 11. However, if the connection portion is one location, the connection pattern 2b1 is provided. Also, one pattern may be formed for the base 1.
Except for the features such as the shape of the connection pattern 2b1 in the second crystal resonator, the position where the insulating film 10 is formed, the position where the conductive adhesive 11 is formed, and the like, the second crystal resonator is the same as the first crystal resonator.
［第２の水晶振動子の効果］
　第２の水晶振動子によれば、ベース１の長辺に沿って形成した接続パターン２ｂ１の上でカバー６と導電性接着剤１１で接続しているので、スルー端子２ｃから半田が這い上がっても、スルー端子２ｃから距離を置いた場所に導電性接着剤１１が形成されているので、導電性接着剤１１のＡｇが食われて導通不良となることを防止できる効果がある。 [Effect of second crystal unit]
According to the second crystal resonator, since the cover 6 and the conductive adhesive 11 are connected on the connection pattern 2b1 formed along the long side of the base 1, the solder crawls up from the through terminal 2c. In addition, since the conductive adhesive 11 is formed at a distance from the through terminal 2c, there is an effect that it is possible to prevent the conductive adhesive 11 from being eaten and causing poor conduction.
［第３の水晶振動子：図１２，１３］
　本発明の実施の形態に係る第３の水晶振動子（第３の水晶振動子）について図１２，図１３を参照しながら説明する。図１２は、第３の水晶振動子の配線パターンを示す平面説明図であり、図１３は、第３の水晶振動子でカバーが搭載された状態の平面説明図である。
　第３の水晶振動子は、図１２，図１３に示すように、水晶片５に接続しない接続端子２ｂにベース１の短辺に沿って接続パターン２ｂ２を形成し、当該接続パターン２ｂ２上でカバー６と導電性接着剤１１で接続する構成である。
　接続パターン２ｂ２の長さは任意であり、導電性接着剤１１を形成する位置も任意である。
　尚、図１３では、導電性接着剤１１は、接続パターン２ｂ２において角部とは反対側の端部付近に形成される。 [Third crystal resonator: FIGS. 12 and 13]
A third crystal resonator (third crystal resonator) according to an embodiment of the present invention will be described with reference to FIGS. FIG. 12 is an explanatory plan view showing a wiring pattern of the third crystal unit, and FIG. 13 is an explanatory plan view showing a state in which a cover is mounted on the third crystal unit.
As shown in FIGS. 12 and 13, the third crystal resonator is formed with a connection pattern 2b2 along the short side of the base 1 on the connection terminal 2b that is not connected to the crystal piece 5, and covers the connection pattern 2b2. 6 is connected to the conductive adhesive 11.
The length of the connection pattern 2b2 is arbitrary, and the position where the conductive adhesive 11 is formed is also arbitrary.
In FIG. 13, the conductive adhesive 11 is formed in the vicinity of the end opposite to the corner in the connection pattern 2b2.
　導電性接着剤１１が形成される部分では、絶縁膜１０が形成されていない開放部分を設ける。開放部分は、導電性接着剤１１の塗布範囲に応じて定められる。
　接続パターン２ｂ２は、図１２では、ベース１の短辺に対してその半分以下の短さで、短辺に沿って形成されている。
　また、図１２では、２つの短辺にそれぞれ接続パターン２ｂ２が形成され、導電性接着剤１１で接続する部分が２箇所となっているが、接続する部分が１箇所とすれば、接続パターン２ｂ２もベース１について１パターン形成すればよい。
　第３の水晶振動子における接続パターン２ｂ２の形状、絶縁膜１０の開放部分の形成位置、導電性接着剤１１の形成位置等の特徴部分以外は、第１の水晶振動子と同様である。 In the portion where the conductive adhesive 11 is formed, an open portion where the insulating film 10 is not formed is provided. The open part is determined according to the application range of the conductive adhesive 11.
In FIG. 12, the connection pattern 2 b 2 is shorter than half of the short side of the base 1 and is formed along the short side.
In FIG. 12, the connection pattern 2b2 is formed on each of the two short sides, and there are two portions connected by the conductive adhesive 11. However, if the connection portion is one location, the connection pattern 2b2 is provided. Also, one pattern may be formed for the base 1.
The third crystal unit is the same as the first crystal unit except for the features such as the shape of the connection pattern 2 b 2, the position where the insulating film 10 is formed, the position where the conductive adhesive 11 is formed, and the like.
［第３の水晶振動子の効果］
　第３の水晶振動子によれば、ベース１の短辺に沿って形成した接続パターン２ｂ２の上でカバー６と導電性接着剤１１で接続しているので、スルー端子２ｃから半田が這い上がっても、スルー端子２ｃから距離を置いた場所に導電性接着剤１１が形成されているので、導電性接着剤１１のＡｇが食われて導通不良となることを防止できる効果がある。 [Effect of third crystal unit]
According to the third crystal resonator, since the cover 6 and the conductive adhesive 11 are connected on the connection pattern 2b2 formed along the short side of the base 1, the solder crawls up from the through terminal 2c. In addition, since the conductive adhesive 11 is formed at a distance from the through terminal 2c, there is an effect that it is possible to prevent the conductive adhesive 11 from being eaten and causing poor conduction.
　また、第３の水晶振動子は、カバー６が封止されたセラミックシートからベース１の短辺に沿ってブレイクラインでダイシングされ、長辺が接続された状態（短冊状態）において、短辺の接続パターン２ｂ２での導電性接着剤１１の塗布を容易に行うことができる。 Further, the third crystal unit is diced along the short side of the base 1 from the ceramic sheet in which the cover 6 is sealed, and the long side is connected in the long side (strip state). Application of the conductive adhesive 11 in the connection pattern 2b2 can be easily performed.
［応用例１：ガラス封止］
　第１～３の水晶振動子において、絶縁膜１０の上にカバー６を樹脂層８により樹脂封止した例を説明したが、絶縁膜１０の代わりに、低融点ガラス層を印刷により形成して仮焼成しておき、カバー６を搭載して、そのガラス層を封止材として加熱溶融してカバー６を接合するガラス封止を行ってもよい。樹脂封止よりガラス封止の方が、気密性が高い。 [Application Example 1: Glass sealing]
In the first to third crystal resonators, the example in which the cover 6 is sealed with the resin layer 8 on the insulating film 10 has been described. However, instead of the insulating film 10, a low melting point glass layer is formed by printing. Temporary firing may be performed, and glass sealing may be performed in which the cover 6 is mounted and the cover 6 is joined by heating and melting the glass layer as a sealing material. Glass sealing is more airtight than resin sealing.
［応用例２：発振器］
　以上では、水晶振動子について説明したが、水晶片の下側にキャビティ（空間）を形成して、そのキャビティに発振回路ＩＣを収納して設けた発振器に適用してもよい。
　また、発振回路ＩＣは、基板の裏面にキャビティを形成し、そのキャビティに収納して設けるようにし、基板に形成したスルーホールを介して表面の水晶片と電気的に接続する構成としてもよい。 [Application Example 2: Oscillator]
Although the crystal resonator has been described above, the present invention may be applied to an oscillator in which a cavity (space) is formed below a crystal piece and an oscillation circuit IC is accommodated in the cavity.
Further, the oscillation circuit IC may be configured such that a cavity is formed on the back surface of the substrate and is housed in the cavity, and is electrically connected to the crystal piece on the surface through a through hole formed in the substrate.
［応用例３：サーミスタ付き振動子］
　水晶振動子には、カバー内でベース上に水晶片と温度センサ（サーミスタ）を搭載したサーミスタ一体型の構造がある。
　具体的には、支持電極下層部３ａに接続しない接続端子２ｂの一方の端子にサーミスタの一端を接続し、接続端子２ｂの他方の端子にサーミスタの他端を接続し、接続端子２ｂの一方の端子に電源電圧を印加し、接続端子２ｂの他方の端子をグランドレベルに接続するようにし、グランドレベルの接続端子２ｂ上でカバー６を導電性接着剤１１により接続するようにしたものである。 [Application example 3: Vibrator with thermistor]
A crystal resonator has a thermistor-integrated structure in which a crystal piece and a temperature sensor (thermistor) are mounted on a base in a cover.
Specifically, one end of the thermistor is connected to one terminal of the connection terminal 2b not connected to the support electrode lower layer 3a, the other end of the thermistor is connected to the other terminal of the connection terminal 2b, and one of the connection terminals 2b is connected. A power supply voltage is applied to the terminal, the other terminal of the connection terminal 2b is connected to the ground level, and the cover 6 is connected by the conductive adhesive 11 on the connection terminal 2b at the ground level.
［第４の水晶振動子：図１４～１６］
　次に、本発明の実施の形態に係る第４の水晶振動子（第４の水晶振動子）について図１４～１７を用いて説明する。
［第４の水晶振動子の配線パターン：図１４］
　まず、第４の水晶振動子の配線パターンについて図１４を用いて説明する。図１４は、第４の水晶振動子の配線パターンを示す平面説明図である。
　第４の水晶振動子は、図１０に示した第２の水晶振動子の応用例であり、図１４に示すように、第２の水晶振動子の接続端子２ａ，２ｂ１の形状を変えて、それぞれ接続端子２ａ４，２ｂ４としたものである。接続端子２ａ４，２ｂ４は、ＡｇＰｄで形成されている。 [Fourth crystal resonator: FIGS. 14 to 16]
Next, a fourth crystal resonator (fourth crystal resonator) according to an embodiment of the present invention will be described with reference to FIGS.
[Fourth Quartz Crystal Wiring Pattern: FIG. 14]
First, the wiring pattern of the fourth crystal resonator will be described with reference to FIG. FIG. 14 is an explanatory plan view showing a wiring pattern of the fourth crystal resonator.
The fourth crystal unit is an application example of the second crystal unit shown in FIG. 10, and as shown in FIG. 14, the shape of the connection terminals 2a and 2b1 of the second crystal unit is changed, The connection terminals are 2a4 and 2b4, respectively. The connection terminals 2a4 and 2b4 are made of AgPd.
　具体的には、図１４に示すように、第４の水晶振動子では、支持電極下層部３ａに接続しない接続端子２ｂ４は、ベース１の一方の対角線上に形成され、スルー端子２ｃに接続する角部を除いて、長方形のパターンとなっている。ここでは、接続端子２ｂ４は、ベース１の長辺に沿った方向が長く、短辺に沿った方向が短い形状に形成されている。
　尚、接続端子２ｂ４を、ベース１の短辺に沿った方向を長い形状に形成してもよい。
　接続端子２ｂ４は、請求項に記載した第２の接続端子に相当する。 Specifically, as shown in FIG. 14, in the fourth crystal resonator, the connection terminal 2b4 not connected to the support electrode lower layer portion 3a is formed on one diagonal line of the base 1 and connected to the through terminal 2c. Except for the corners, the pattern is rectangular. Here, the connection terminal 2b4 is formed in a shape in which the direction along the long side of the base 1 is long and the direction along the short side is short.
The connection terminal 2b4 may be formed in a long shape in the direction along the short side of the base 1.
The connection terminal 2b4 corresponds to the second connection terminal described in the claims.
　また、支持電極下層部３ａに接続する接続端子２ａ４は、ベース１の接続端子２ｂ４とは異なる対角線上に形成され、スルー端子２ｃに接続し、接続端子２ｂ４と同形状の矩形パターン２ａ４１と、支持電極下層部３ａに接続する略三角形状の接続パターン２ａ４２とが接続した形状に形成されている。矩形パターン２ａ４１は、請求項に記載した長方形のパターンに相当する。 Further, the connection terminal 2a4 connected to the support electrode lower layer portion 3a is formed on a diagonal line different from the connection terminal 2b4 of the base 1, is connected to the through terminal 2c, and has a rectangular pattern 2a41 having the same shape as the connection terminal 2b4. A substantially triangular connection pattern 2a42 connected to the electrode lower layer portion 3a is formed in a connected shape. The rectangular pattern 2a41 corresponds to the rectangular pattern recited in the claims.
　接続パターン２ａ４２は、その一辺が、矩形パターン２ａ４１の長辺に接続されている。
　尚、説明のために、接続端子２ａ４の矩形パターン２ａ４１と接続パターン２ａ４２の間に破線を示しているが、実際には境目がなく連続して一体に形成されている。
　接続端子２ａ４は、請求項に記載した第１の接続端子に相当する。 One side of the connection pattern 2a42 is connected to the long side of the rectangular pattern 2a41.
For the sake of explanation, a broken line is shown between the rectangular pattern 2a41 and the connection pattern 2a42 of the connection terminal 2a4.
The connection terminal 2a4 corresponds to the first connection terminal recited in the claims.
　接続端子２ｂ４の形状を、ベース１の短辺に沿った方向に長い長方形とした場合には、接続端子２ａ４の矩形パターン２ａ４１も同様に、ベース１の短辺に沿った方向を長く形成する。
　そして、接続パターン２ａ４２は、一辺が矩形パターン２ａ４１の長辺に接続された形状となる。 When the shape of the connection terminal 2b4 is a rectangle that is long in the direction along the short side of the base 1, the rectangular pattern 2a41 of the connection terminal 2a4 is similarly formed long in the direction along the short side of the base 1.
The connection pattern 2a42 has a shape in which one side is connected to the long side of the rectangular pattern 2a41.
　第４の水晶振動子では、接続端子２ａ４において、接続端子２ｂ４と同じ形状の矩形パターン２ａ４１を備えることにより、ベース１の角部におけるスルーホールの周囲の配線パターンを単純化し、パターニングを容易にするものである。 In the fourth crystal resonator, the connection terminal 2a4 includes the rectangular pattern 2a41 having the same shape as the connection terminal 2b4, thereby simplifying the wiring pattern around the through hole at the corner of the base 1 and facilitating patterning. Is.
［スルーホール周囲のパターニング：図１５］
　シート状の基板での、第４の水晶振動子におけるスルーホール周囲の配線パターンについて図１５を用いて説明する。図１５は、第４の水晶振動子におけるスルーホール周囲の配線パターンを示す平面説明図である。
　図１５では、切断前のシート状態における矩形領域（ベース１に相当）の角部を示しており、ブレイクライン１０１，１０２が交わる部分にスルーホールが形成され、スルーホールの壁面にはスルー端子２ｃが形成されている。 [Pattern around the through hole: Fig. 15]
A wiring pattern around a through hole in the fourth crystal resonator in a sheet-like substrate will be described with reference to FIG. FIG. 15 is an explanatory plan view showing a wiring pattern around a through hole in the fourth crystal unit.
FIG. 15 shows a corner portion of a rectangular region (corresponding to the base 1) in a sheet state before cutting. A through hole is formed at a portion where the break lines 101 and 102 intersect, and a through terminal 2c is formed on the wall surface of the through hole. Is formed.
　そして、図１５に示すように、ブレイクライン１０１，１０２で分割される４つの矩形領域がスルー端子２ｃを共有しており、左上の矩形領域と右下の矩形領域には、接続端子２ｂ４が形成され、右上と左下の矩形領域には、接続端子２ａ４が形成されている。 As shown in FIG. 15, the four rectangular areas divided by the break lines 101 and 102 share the through terminal 2c, and the connection terminal 2b4 is formed in the upper left rectangular area and the lower right rectangular area. The connection terminals 2a4 are formed in the upper right and lower left rectangular areas.
　ここで、第４の水晶振動子では、スルー端子２ｃ周囲のパターン形状をできるだけ矩形に近づけるようにして、パターンの凹凸を極力減らして単純な形状としている点が特徴となっている。
　つまり、スルー端子２ｃを共有する４つの矩形領域について、スルー端子周りのパターン形状を同じにして、パターンの輪郭線が複雑に入り組まない形状とし、製造を容易にするものである。 Here, the fourth crystal resonator is characterized in that the pattern shape around the through terminal 2c is made as close to a rectangle as possible, and the unevenness of the pattern is reduced as much as possible to obtain a simple shape.
That is, for the four rectangular regions sharing the through terminal 2c, the pattern shape around the through terminal is made the same so that the outline of the pattern does not become complicated and easy to manufacture.
　具体的には、第４の水晶振動子のスルーホール２ｃ周囲のパターンは、スルーホール２ｃを中心とする４つの矩形領域にまたがって形成される大きな四角形のパターンと、その対角線上に形成された２つの三角形の接続パターン２ａ４２とで形成されている。
　スルーホール２ｃを中心とする四角形のパターンは、２つの接続端子２ｂ４と、接続端子２ａ４の２つの矩形パターン２ａ４１とで構成され、角部で斜めに接する一組の矩形領域には、大きな四角形のパターンに接続して、接続パターン２ａ４２が形成されている。 Specifically, the pattern around the through-hole 2c of the fourth crystal unit was formed on a diagonal line with a large rectangular pattern formed across four rectangular regions centered on the through-hole 2c. It is formed by two triangular connection patterns 2a42.
The square pattern centered on the through hole 2c is composed of two connection terminals 2b4 and two rectangular patterns 2a41 of the connection terminal 2a4. A connection pattern 2a42 is formed in connection with the pattern.
　スルー端子２ｃを中心とする大きな四角形のパターンの各辺は、ブレイクライン１０１，１０２を横切って一直線に形成されている。
　また、支持電極下層部３ａに接続する接続端子２ａ４の接続パターン２ａ４２の一辺も、四角形のパターンの辺に続いて一直線に形成されている。 Each side of the large rectangular pattern centering on the through terminal 2c is formed in a straight line across the break lines 101 and 102.
Further, one side of the connection pattern 2a42 of the connection terminal 2a4 connected to the support electrode lower layer portion 3a is also formed in a straight line following the side of the square pattern.
　第４の水晶振動子では、接続端子２ａ４，２ｂ４をこのような形状とすることにより、図１０のパターンに比べてスルー端子２ｃ周辺のパターン形状を単純化し、凹凸を少なくして、パターニングを容易にし、歩留まりを向上させることができるものである。
　また、接続パターン２ａ４２を三角形とすることで、断線しにくくするものである。 In the fourth crystal resonator, the connection terminals 2a4 and 2b4 have such shapes, thereby simplifying the pattern shape around the through terminals 2c compared to the pattern of FIG. Thus, the yield can be improved.
In addition, the connection pattern 2a42 is triangular to make it difficult to disconnect.
　尚、接続端子２ａ４の接続パターン２ａ４２を、三角形ではなく、図１のように、矩形パターン２ａ４１と支持電極下層部３ａとを接続するライン形状に形成してもよい。
　この場合でも、矩形パターン２ａ４１が接続端子２ｂ４と同形状であるため、スルー端子２ｃの周りは凹凸の少ない四角形のパターンとなり、パターニングを容易にできるものである。
　第４の水晶振動子は、上述した第１の水晶振動子と同様の製造工程によって形成されるため、詳細な説明は省略する。 The connection pattern 2a42 of the connection terminal 2a4 may be formed in a line shape that connects the rectangular pattern 2a41 and the support electrode lower layer portion 3a as shown in FIG. 1 instead of a triangle.
Even in this case, since the rectangular pattern 2a41 has the same shape as that of the connection terminal 2b4, the periphery of the through terminal 2c becomes a square pattern with little unevenness, and the patterning can be facilitated.
Since the fourth crystal unit is formed by the same manufacturing process as the first crystal unit described above, detailed description thereof is omitted.
［第４の水晶振動子の構成：図１６］
　次に、第４の水晶振動子の構成について図１６を用いて説明する。図１６は、第４の水晶振動子の平面説明図である。
　図１６では、カバー搭載前の状態を示しており、図１４の配線パターンの上に、絶縁膜１０が形成されている。更に、積層された支持電極下層部３ａ、支持電極３ｂの上に、水晶片５が搭載され、導電性接着剤７によって固着されている。 [Configuration of Fourth Crystal Resonator: FIG. 16]
Next, the configuration of the fourth crystal resonator will be described with reference to FIG. FIG. 16 is an explanatory plan view of a fourth crystal resonator.
FIG. 16 shows a state before the cover is mounted, and the insulating film 10 is formed on the wiring pattern of FIG. Further, the crystal piece 5 is mounted on the laminated support electrode lower layer 3 a and the support electrode 3 b and fixed by the conductive adhesive 7.
　第４の水晶振動子では、絶縁膜１０の形状が図１１に示した第２の水晶振動子とは異なっており、開放部分がなく、ベース１の外周に沿ってその少し内側に環状に形成されている。また、ベース１の角部には、環状のパターンに接続して、スルー端子２ｃの周囲に円弧状の絶縁膜が形成されている。 In the fourth crystal resonator, the shape of the insulating film 10 is different from that of the second crystal resonator shown in FIG. 11, and there is no open portion, and the ring is formed slightly inside the base 1 along the outer periphery. Has been. Further, an arc-shaped insulating film is formed around the through terminal 2c at the corner portion of the base 1 so as to be connected to the annular pattern.
　第４の水晶振動子では、グランドレベルの実装端子４に接続する接続端子２ｂ４をベース１の長辺に沿って長く形成したことにより、絶縁膜１０のパターンとベース１の長辺との間の隙間から接続端子２ｂ４が露出するため、この露出部分（露出部）とカバー６とを導電性接着剤により電気的に接続する構成としている。これにより、導電性接着剤とスルー端子２ｃとの距離を長くとることができるものである。露出部は、絶縁膜１０の開放部分となっている。 In the fourth crystal resonator, the connection terminal 2b4 connected to the ground level mounting terminal 4 is formed long along the long side of the base 1, so that the gap between the pattern of the insulating film 10 and the long side of the base 1 is increased. Since the connection terminal 2b4 is exposed from the gap, the exposed portion (exposed portion) and the cover 6 are electrically connected by a conductive adhesive. Thereby, the distance of a conductive adhesive and the through terminal 2c can be taken long. The exposed portion is an open portion of the insulating film 10.
　また、接続端子２ｂ４をベース１の短辺側に沿って長く形成した場合には、短辺側に露出部が形成され、導電性接着剤によってカバー６と接続される。
　絶縁膜１０をこのような形状に形成することにより、スルー端子２ｃ周りの４つの矩形領域における絶縁膜１０の形状が同一となり、パターニングを容易にすることができるものである。 Further, when the connection terminal 2b4 is formed long along the short side of the base 1, an exposed portion is formed on the short side and is connected to the cover 6 with a conductive adhesive.
By forming the insulating film 10 in such a shape, the shape of the insulating film 10 in the four rectangular regions around the through terminal 2c becomes the same, and the patterning can be facilitated.
　尚、絶縁膜１０を環状に形成するのではなく、導電性接着剤を塗布する部分に絶縁膜１０のパターンが切断された部分を設けて、接続端子２ｂが絶縁膜１０で覆われない露出部を形成し、その位置でカバー６と接続端子２ｂとを接続するようにしてもよい。
　更に、図１６では、支持電極下層部３ａに接続する接続端子２ａ４にもベース１の長辺に沿って絶縁膜１０で覆われない露出部が形成されるが、確実に絶縁するために接続端子２ａ４の露出部を覆うように絶縁膜１０を形成してもよい。 In addition, the insulating film 10 is not formed in a ring shape, but a portion where the pattern of the insulating film 10 is cut is provided in a portion where the conductive adhesive is applied, and the exposed portion where the connection terminal 2b is not covered with the insulating film 10 And the cover 6 and the connection terminal 2b may be connected at that position.
Further, in FIG. 16, an exposed portion that is not covered with the insulating film 10 is formed along the long side of the base 1 also in the connection terminal 2 a 4 connected to the support electrode lower layer portion 3 a. The insulating film 10 may be formed so as to cover the exposed portion of 2a4.
［第４の水晶振動子のカバー搭載後：図１７］
　次に、第４の水晶振動子のカバー搭載後の状態について図１７を用いて説明する。図１７は、第４の水晶振動子のカバー搭載後を示す平面説明図である。
　図１７に示すように、カバー６は、水晶片５を覆うように、図１６の絶縁膜１０の上に樹脂層（図示せず）を介して搭載され、樹脂層によって絶縁膜１０とカバー６とが接合される。 [After mounting the cover of the fourth crystal unit: FIG. 17]
Next, the state of the fourth crystal resonator after the cover is mounted will be described with reference to FIG. FIG. 17 is an explanatory plan view showing the fourth crystal resonator after the cover is mounted.
As shown in FIG. 17, the cover 6 is mounted on the insulating film 10 of FIG. 16 via a resin layer (not shown) so as to cover the crystal piece 5, and the insulating film 10 and the cover 6 are covered by the resin layer. And are joined.
　そして、接続端子２ｂ４の露出部分において、接続端子２ｂ４とカバー６とを導電性接着剤１１によって電気的、物理的に接着してカバー６をグランドレベルとする。
　このように、スルー端子２ｃから離れた位置に導電性接着剤１１を塗布することにより、スルー端子２ｃから半田が這い上がっても、導電性接着剤１１のＡｇが食われて導通不良となるのを防ぐことができるものである。 Then, in the exposed portion of the connection terminal 2b4, the connection terminal 2b4 and the cover 6 are electrically and physically bonded by the conductive adhesive 11 to bring the cover 6 to the ground level.
Thus, by applying the conductive adhesive 11 at a position away from the through terminal 2c, even if the solder crawls up from the through terminal 2c, the Ag of the conductive adhesive 11 is eaten, resulting in poor conduction. Can be prevented.
　また、図１７の例では、対角線上の２箇所で導電性接着剤１１により接着しているが、どちらか一方のみで接着してもよい。
　尚、カバー６は、絶縁膜１０の外側の辺に沿って搭載されるが、位置ずれが生じても、絶縁膜１０及び樹脂層の厚みがあるため、接続端子２ａ４がカバー６と接続することはない。 Moreover, in the example of FIG. 17, although it adhere | attached with the conductive adhesive 11 in two places on a diagonal line, you may adhere | attach only in any one.
Although the cover 6 is mounted along the outer side of the insulating film 10, the connection terminal 2 a 4 is connected to the cover 6 because of the thickness of the insulating film 10 and the resin layer even if a positional shift occurs. There is no.
［第４の水晶振動子の断面：図１８］
　第４の水晶振動子の断面について図１８を用いて説明する。図１８は、図１６にカバーを搭載した状態（図１７）のＡ－Ａ′断面説明図である。尚、分かりやすくするために、Ａ－Ａ′は図１６上で示している。
　図１８に示すように、支持電極下層部３ａの上に支持電極３ｂが形成され、その上に導電性接着剤７を介して水晶片５が搭載されている。
　また、絶縁膜１０の上に樹脂層８を介してカバー６が搭載されており、裏面のグランド端子４に接続する接続電極２ｂ４とカバー６とが導電性接着剤１１によって接続されている。 [Cross section of fourth crystal resonator: FIG. 18]
A cross section of the fourth crystal resonator will be described with reference to FIG. 18 is a cross-sectional explanatory view taken along the line AA ′ of FIG. 16 with the cover mounted (FIG. 17). For the sake of easy understanding, AA ′ is shown in FIG.
As shown in FIG. 18, the support electrode 3 b is formed on the support electrode lower layer portion 3 a, and the crystal piece 5 is mounted on the support electrode 3 via the conductive adhesive 7.
A cover 6 is mounted on the insulating film 10 via a resin layer 8, and the connection electrode 2 b 4 connected to the ground terminal 4 on the back surface and the cover 6 are connected by the conductive adhesive 11.
［第４の水晶振動子の効果］
　第４の水晶振動子によれば、接続端子２ｂ４をベース１の長辺側が長い長方形パターンとし、接続端子２ａ４を、接続端子２ｂ４と同形状の長方形パターン２ａ４１と支持電極下層部３ａに接続する三角形パターン２ａ４２とを接続したパターンとしているので、スルー端子２ｃ周囲の電極パターンを略四角形として、凹凸をなくしてパターニングを容易にすることができると共に、カバー６をグランドレベルとして外部からのノイズの影響を小さくし、更に、接続端子２ｂ４とカバー６とを接続する導電性接着剤１１の塗布位置をスルー端子２ｃから離れた位置として、水晶振動子の実装後にスルー端子２ｃから半田が這い上がったとしても、導電性接着剤１１のＡｇが溶融して不良となるのを防ぐことができる効果がある。 [Effect of the fourth crystal unit]
According to the fourth crystal resonator, the connection terminal 2b4 is a rectangular pattern having a long long side of the base 1, and the connection terminal 2a4 is connected to the rectangular pattern 2a41 having the same shape as the connection terminal 2b4 and the support electrode lower layer 3a. Since the pattern is connected to the pattern 2a42, the electrode pattern around the through terminal 2c can be made substantially rectangular to eliminate the unevenness, and the patterning can be facilitated. Even if the solder is scooped up from the through terminal 2c after mounting the crystal resonator, the application position of the conductive adhesive 11 that connects the connection terminal 2b4 and the cover 6 is set away from the through terminal 2c. There is an effect of preventing the Ag of the conductive adhesive 11 from melting and becoming defective.
［片持ちタイプへの適用］
　上述した例は、いずれも水晶片の両短辺を保持する両持ち型の水晶片を用いた水晶振動子であったが、一方の短辺で水晶片を保持する片持ち型に適用した水晶振動子について説明する。
［第５の水晶振動子の電極パターン：図１９］
　まず、本発明の実施の形態に係る第５の水晶振動子（第５の水晶振動子）の電極パターンについて図１９を用いて説明する。図１９は、第５の水晶振動子の電極パターンを示す平面説明図である。
　図１９に示すように、第５の水晶振動子の電極パターンは、図１に示した第１の水晶振動子の電極パターンを片持ち型に変形したものであり、ベース１の四隅に形成されたスルー端子２ｃと、支持電極下層部３ａに接続しない接続端子２ｂは、図１と同様の形状に形成されている。
　特に、接続端子２ｂは、ベース１の中央方向に向かって突出するよう、矩形パターンとして形成されている。 [Application to cantilever type]
The above-mentioned examples are all quartz crystal resonators using a double-sided crystal piece that holds both short sides of the crystal piece, but a crystal that is applied to a cantilever type that holds the crystal piece on one short side. The vibrator will be described.
[Fifth Quartz Crystal Electrode Pattern: FIG. 19]
First, an electrode pattern of a fifth crystal resonator (fifth crystal resonator) according to an embodiment of the present invention will be described with reference to FIG. FIG. 19 is an explanatory plan view showing an electrode pattern of the fifth crystal resonator.
As shown in FIG. 19, the electrode pattern of the fifth crystal unit is a cantilevered version of the electrode pattern of the first crystal unit shown in FIG. The through terminal 2c and the connection terminal 2b not connected to the support electrode lower layer 3a are formed in the same shape as in FIG.
In particular, the connection terminal 2 b is formed as a rectangular pattern so as to protrude toward the center of the base 1.
　第５の水晶振動子は片持ちタイプであるため、水晶片の一方の短辺を保持する２つの支持電極下層部３ａが、ベース１の一方の短辺寄りに設けられている。そして、当該短辺の反対側の短辺には、水晶片の他方の短辺で水晶片を支持する支持部の下層部（支持下層部）３ａ′が形成されている。
　また、支持電極下層部３ａとスルー端子２ｃとを接続する接続端子は、接続端子２ａ５１，２ａ５２，２ａ５３のパターンを備えている。 Since the fifth crystal unit is a cantilever type, the two support electrode lower layer portions 3 a that hold one short side of the crystal piece are provided near one short side of the base 1. And, on the short side opposite to the short side, a lower layer portion (supporting lower layer portion) 3a ′ of the support portion that supports the crystal piece with the other short side of the crystal piece is formed.
The connection terminals connecting the support electrode lower layer portion 3a and the through terminals 2c have patterns of connection terminals 2a51, 2a52, and 2a53.
　接続端子２ａ５１は、一方の支持電極下層部３ａ（図１の下側の支持電極下層部３ａ）の端部から最も近い角部のスルー端子２ｃ（図１の左下側のスルー端子２ｃ）に直線的に接続するよう形成されている。
　特に、接続端子２ａ５１は、支持電極下層部３ａの端部の内、近い方のベース１の長辺側の端部からスルー端子２ｃに引き出されている。 The connection terminal 2a51 is straight to the through terminal 2c (the lower left through terminal 2c in FIG. 1) at the corner closest to the end of one support electrode lower layer 3a (the lower support electrode lower layer 3a in FIG. 1). It is formed so that it may connect.
Particularly, the connection terminal 2a51 is led out to the through terminal 2c from the end on the long side of the base 1 which is closer to the end of the support electrode lower layer 3a.
　また、接続端子２ａ５２は、他方の支持電極下層部３ａ（図１の上側の支持電極下層部３ａ）の端部からベース１の長辺に平行に引き出され、その後、接続端子２ａ５３の一端に接続し、接続端子２ａ５３の他端がスルー端子２ｃ（図１の右上側のスルー端子２ｃ）に接続している。
　具体的に、接続端子２ａ５３は、スルー端子２ｃからベース１のほぼ中央方向に斜めに形成されている。 Further, the connection terminal 2a52 is drawn out in parallel to the long side of the base 1 from the end of the other support electrode lower layer 3a (the upper support electrode lower layer 3a in FIG. 1), and then connected to one end of the connection terminal 2a53. The other end of the connection terminal 2a53 is connected to the through terminal 2c (the upper right side through terminal 2c in FIG. 1).
Specifically, the connection terminal 2a53 is formed obliquely from the through terminal 2c in the substantially central direction of the base 1.
　そして、ここでは、接続端子２ａ５２は、支持電極下層部３ａの端部の内、ベース１の中央寄りの端部から引き出されている。通常、スルー端子に接続する接続端子は、支持電極下層部３ａにおいて、ベース１の長辺に近い方の端部から引き出されるが、ここでは長辺側の端部から特定の距離ｄだけ中央側に接続端子２ａ５２が形成される。
　これは、その後の工程で、水晶片が搭載され、周波数調整のためＡｒイオンによって励振電極を削る場合に、接続端子２ａ５２が水晶片の裏側に隠れるため、誤って接続端子２ａ５２が削られるのを防ぐためである。 Here, the connection terminal 2a52 is drawn from the end of the base 1 near the center of the end of the support electrode lower layer 3a. Normally, the connection terminal connected to the through terminal is drawn out from the end of the support electrode lower layer 3a that is closer to the long side of the base 1, but here the center side by a specific distance d from the end of the long side. The connection terminal 2a52 is formed.
This is because the connection terminal 2a52 is hidden behind the crystal piece when the crystal piece is mounted and the excitation electrode is cut by Ar ions for frequency adjustment in the subsequent process. This is to prevent it.
［第５の水晶振動子の絶縁膜形成：図２０］
　次に、第５の水晶振動子の絶縁膜形成について図２０を用いて説明する。図２０は、第５の水晶振動子における絶縁膜パターンを示す平面説明図である。
　第５の水晶振動子では、図１９に示した電極パターン形成後、図２０に示すように、支持電極下層部３ａの上に支持電極３ｂが形成され、支持下層部３ａ′の上に支持部３ｂ′が形成されている。支持電極３ｂ、支持部３ｂ′はＡｇで形成される。 [Insulation film formation of fifth crystal resonator: FIG. 20]
Next, the formation of the insulating film of the fifth crystal resonator will be described with reference to FIG. FIG. 20 is an explanatory plan view showing an insulating film pattern in the fifth crystal unit.
In the fifth crystal unit, after the electrode pattern shown in FIG. 19 is formed, as shown in FIG. 20, the support electrode 3b is formed on the support electrode lower layer portion 3a, and the support portion is formed on the support lower layer portion 3a ′. 3b 'is formed. The support electrode 3b and the support portion 3b 'are made of Ag.
　そして、カバーを搭載するための絶縁膜１０が形成される。
　絶縁膜１０の形状は、図３に示した絶縁膜１０の形状と同様に、接続端子２ａ５１及び接続端子２ａ５３の上部を横切って覆うと共に、接続端子２ｂの四角形状を覆わないよう開放部分を備えている。 And the insulating film 10 for mounting a cover is formed.
Similar to the shape of the insulating film 10 shown in FIG. 3, the shape of the insulating film 10 covers the connection terminals 2a51 and 2a53 so as to cover the upper portion of the connection terminals 2a51 and 2a53, and has an open portion so as not to cover the rectangular shape of the connection terminals 2b. ing.
　更に、励振電極５ａ′が形成された片持ち型の水晶片５′が支持電極３ｂの上に導電性接着剤７を介して搭載されている。
　そして、水晶片５′を覆うカバーが絶縁膜１０の上に樹脂層を介して搭載され、絶縁膜１０とカバーとが接合される。 Further, a cantilever crystal piece 5 ′ on which an excitation electrode 5 a ′ is formed is mounted on the support electrode 3 b via a conductive adhesive 7.
Then, a cover that covers the crystal piece 5 'is mounted on the insulating film 10 via a resin layer, and the insulating film 10 and the cover are joined.
　カバーが搭載された後、グランド端子に接続される接続端子２ｂとカバーとを絶縁膜１０の開放部分において導電性接着剤で接着されるものである。
　接続端子２ｂはベース１の中心方向に角部が突出した四角形状であるため、スルー端子２ｃから中心側に寄った位置に導電性接着剤を塗布して接着することができ、スルー端子２ｃから半田が這い上がっても、Ａｇが食われるのを防ぐことができるものである。
　尚、接続端子２ａ５１及び２ａ５３の上には絶縁膜１０が形成されており、これらの端子がカバーと接触するのを防いでいる。 After the cover is mounted, the connection terminal 2b connected to the ground terminal and the cover are bonded with a conductive adhesive at an open portion of the insulating film 10.
Since the connection terminal 2b has a quadrangular shape with corners protruding in the center direction of the base 1, a conductive adhesive can be applied and adhered to a position closer to the center side from the through terminal 2c. Even if the solder crawls up, it is possible to prevent Ag from being eaten.
An insulating film 10 is formed on the connection terminals 2a51 and 2a53 to prevent these terminals from coming into contact with the cover.
［第５の水晶振動子の効果］
　第５の水晶振動子によれば、片持ち型の水晶振動子であって、接続端子２ｂをベース１の中心方向に向かって角部が突出した四角形のパターンとし、接続端子２ｂ付近に絶縁膜１０の開放部分を備え、当該開放部分で導電性接着剤によって接続端子２ｂとカバーとを接続する構成としているので、スルー端子２ｃから離れた位置に導電性接着剤を設けるため、半田が這い上がってもＡｇが食われるのを防ぎ、導通不良を防止することができる効果がある。 [Effect of the fifth crystal unit]
According to the fifth crystal unit, the crystal unit is a cantilever type crystal unit, and the connection terminal 2b has a rectangular pattern with corners protruding toward the center of the base 1, and an insulating film is formed in the vicinity of the connection terminal 2b. Since the connection terminal 2b and the cover are connected to each other by a conductive adhesive at the open part, the solder rises in order to provide the conductive adhesive at a position away from the through terminal 2c. However, there is an effect that Ag is prevented from being eaten and conduction failure can be prevented.
［第６の水晶振動子の電極パターン：図２１］
　次に、本発明の実施の形態に係る第６の水晶振動子（第６の水晶振動子）の電極パターンについて図２１を用いて説明する。図２１は、第６の水晶振動子の電極パターンを示す平面説明図である。
　第６の水晶振動子は、図１４に示した第４の水晶振動子を片持ち型に変形させたものである。
　図２１に示すように、第６の水晶振動子の電極パターンは、図１９の第５の水晶振動子と同様に、ベース１の一方の短辺寄りに、２つの支持電極下層部３ａが形成され、他方の短辺寄りに支持下層部３ａ′が形成されている。 [Sixth Quartz Crystal Electrode Pattern: FIG. 21]
Next, an electrode pattern of a sixth crystal unit (sixth crystal unit) according to the embodiment of the present invention will be described with reference to FIG. FIG. 21 is an explanatory plan view showing an electrode pattern of a sixth crystal resonator.
The sixth crystal unit is obtained by deforming the fourth crystal unit shown in FIG. 14 into a cantilever type.
As shown in FIG. 21, in the electrode pattern of the sixth crystal resonator, two support electrode lower layer portions 3a are formed near one short side of the base 1, similarly to the fifth crystal resonator of FIG. A supporting lower layer 3a ′ is formed near the other short side.
　スルー端子２ｃと水晶片に接続しない接続端子２ｂ６の形状は図１４に示した両持ち型と同様であり、接続端子２ｂ６は、ベース１の短辺方向に長い長方形のパターンとなっている。 The shape of the connection terminal 2b6 that is not connected to the through terminal 2c and the crystal piece is the same as that of the dual-support type shown in FIG. 14, and the connection terminal 2b6 has a rectangular pattern that is long in the short side direction of the base 1.
　また、水晶片に接続する接続端子は、接続端子２ａ６１，２ａ６２，２ａ６３のパターンを備えている。
　接続端子２ａ６１は、接続端子２ｂ６と同一の長方形のパターンと、長方形のパターンの長辺に接続する略三角形の三角形パターンとを備え、三角形パターンの先端は一方（ここでは左下）の支持電極下層部３ａに接続されている。 Moreover, the connection terminal connected to the crystal piece has a pattern of connection terminals 2a61, 2a62, and 2a63.
The connection terminal 2a61 has the same rectangular pattern as the connection terminal 2b6 and a substantially triangular pattern connected to the long side of the rectangular pattern, and the tip of the triangular pattern is one (here, lower left) lower layer of the support electrode 3a is connected.
　接続端子２ａ６２は、一端が、他方（ここでは左上）の支持電極下層部３ａの、ベース１の長辺から遠い方の端部に接続し、ベース１の長辺に沿って当該長辺に平行に形成され、他端が右上のスルー端子２ｃに向かって折れ曲がって形成されている。
　接続端子２ａ６３は、接続端子２ａ６１と同様に、ベース１の短辺側が長辺となる長方形パターンがスルー端子２ｃに接続すると共に、三角形パターンが接続端子２ａ６２に接続するよう形成されている。 One end of the connection terminal 2a62 is connected to the end of the other (here, upper left) supporting electrode lower layer 3a far from the long side of the base 1, and is parallel to the long side along the long side of the base 1. The other end is bent toward the upper right through terminal 2c.
Similarly to the connection terminal 2a61, the connection terminal 2a63 is formed such that a rectangular pattern having a long side on the short side of the base 1 is connected to the through terminal 2c, and a triangular pattern is connected to the connection terminal 2a62.
　これにより、シート状セラミックベースにおいて、スルー端子２ｃの周囲のパターンは、４つの矩形領域に亘って形成された大きな四角形のパターンと、それに接続する略三角形のパターンとで構成され、パターニングを容易にすることができるものである。
　また、接続端子２ｂ６と、接続端子２ａ６１，２ａ６３の長方形のパターンを、ベース１の短辺方向に長い長方形に形成することにより、接続端子２ｂ６，２ａ６１と支持電極下層部３ａとの距離を長くとることができ、ショートしにくくするものである。
　電極の配置等によっては、接続端子２ｂ６等をベース１の長辺方向に長い長方形のパターンとすることも可能である。 As a result, in the sheet-like ceramic base, the pattern around the through terminal 2c is composed of a large square pattern formed over four rectangular areas and a substantially triangular pattern connected to the large rectangular pattern. Is something that can be done.
Further, by forming the rectangular pattern of the connection terminal 2b6 and the connection terminals 2a61, 2a63 into a rectangle that is long in the short side direction of the base 1, the distance between the connection terminals 2b6, 2a61 and the support electrode lower layer 3a is increased. It is possible to prevent short circuit.
Depending on the arrangement of the electrodes and the like, the connection terminals 2b6 and the like can be formed in a rectangular pattern that is long in the long side direction of the base 1.
　また、カバーが搭載される絶縁膜は、図１６に示した第４の水晶振動子の絶縁膜１０と同様の形状に形成されており、ベース１の短辺に沿って形成される接続端子２ｂ６の露出部と、カバーとが導電性接着剤によって接続されるものである。接続端子２ｂ６の露出部は、絶縁膜１０の開放部分となっている。 Further, the insulating film on which the cover is mounted is formed in the same shape as the insulating film 10 of the fourth crystal unit shown in FIG. 16, and the connection terminal 2b6 formed along the short side of the base 1. The exposed portion and the cover are connected by a conductive adhesive. The exposed portion of the connection terminal 2b6 is an open portion of the insulating film 10.
　また、接続端子２ｂ６とカバーとを、図１７と同様の位置で導電性接着剤によって接続することにより、導電性接着剤をスルー端子２ｃから離れたところに塗布することができ、Ａｇが食われることによる導通不良を防ぐことができるものである。 Further, by connecting the connection terminal 2b6 and the cover with a conductive adhesive at the same position as in FIG. 17, the conductive adhesive can be applied away from the through terminal 2c, and Ag is eaten. It is possible to prevent poor conduction due to this.
［第６の水晶振動子の効果］
　本発明の第６の水晶振動子によれば、片持ち型の水晶振動子であって、スルーホール２ｃ周囲において、接続端子２ａ６１、２ｂ６、２ａ６３が同一形状の略四角形となるパターンに形成されているので、電極のパターニングを容易にすることができ、また、接続端子２ｂ６とカバーとを接続する導電性接着剤をスルー端子２ｃから離れた位置に塗布して、半田が這い上がったとしても、導電性接着剤１１のＡｇが溶融して不良となるのを防ぐことができる効果がある。 [Effect of the sixth crystal unit]
According to the sixth crystal resonator of the present invention, it is a cantilever crystal resonator, and the connection terminals 2a61, 2b6, and 2a63 are formed in a substantially rectangular pattern having the same shape around the through hole 2c. Therefore, patterning of the electrode can be facilitated, and even if the conductive adhesive connecting the connection terminal 2b6 and the cover is applied to a position away from the through terminal 2c and the solder rises, There is an effect that the Ag of the conductive adhesive 11 can be prevented from melting and becoming defective.
　本発明は、製造を容易にして生産性を向上させ、品質を良好にして、金属カバーをグランドレベルにすることにより外部からのノイズの影響を小さくできる表面実装水晶振動子及びその製造方法、発振器に好適である。 The present invention provides a surface-mount crystal resonator that can be easily manufactured to improve productivity, improve quality, and reduce the influence of external noise by setting the metal cover to the ground level, and a method for manufacturing the surface-mounted crystal resonator. It is suitable for.
　１...基板（ベース）、　２ａ，２ｂ，２ａ４１，２ｂ４，２ａ５１，２ａ５２，２ａ５３，２ａ６１，２ａ６２，２ａ６３，２ｂ６...接続端子、　２ｂ１，２ｂ２，２ａ４２...接続パターン、　２ｃ...スルー端子、　３ａ...支持電極下層部、　３ａ′...支持下層部、　３ｂ...支持電極、　３ｂ′...支持部、　３ｂ１...第１の支持電極、　３ｂ２...第２の支持電極、　４...実装端子、　５，５′...水晶片、　５ａ，５ａ′...励振電極、　５ｂ...引出電極、　６...カバー、　７...導電性接着剤、　８...樹脂層、　１０...絶縁膜、　１１...導電性接着剤、　１０１，１０２...ブレイクライン 1. Board (base), 2a, 2b, 2a41, 2b4, 2a51, 2a52, 2a53, 2a61, 2a62, 2a63, 2b6 ... connection terminal, 2b1, 2b2, 2a42 ... connection pattern, 2c ... Through terminal, 3a ... support electrode lower layer, 3a '... support lower layer, 3b ... support electrode, 3b' ... support, 3b1 ... first support electrode, 3b2 .. Second support electrode, 4 ... mounting terminal, 5, 5 '... crystal piece, 5a, 5a' ... excitation electrode, 5b ... extraction electrode, 6 ... cover, 7 .. Conductive adhesive, 8 ... resin layer, 10 ... insulating film, 11 ... conductive adhesive, 101,102 ... break line

Claims (15)

  1. 　矩形のセラミック基板上に水晶片が搭載される表面実装水晶振動子であって、
    　前記水晶片を保持する第１及び第２の支持電極と、
    　前記基板の角部に形成された貫通孔の壁面に形成されたスルー端子と、
    　前記第１の支持電極の端部又は前記第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、
    　前記第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子と、
    　前記水晶片を覆い、内部を気密封止する金属カバーと、
    　前記金属カバーが前記基板に搭載される部分に形成される絶縁膜とを備え、
    　前記第２の接続端子と前記金属カバーとを導電性接着剤で接続する部分において、当該第２の接続端子上に前記絶縁膜を設けない開放部分を形成したことを特徴とする表面実装水晶振動子。     A surface-mount crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate,
    First and second support electrodes for holding the crystal piece;
    A through terminal formed on a wall surface of a through hole formed in a corner of the substrate;
    A first connection terminal connecting the end of the first support electrode or the end of the second support electrode and the through terminal at the shortest corner from the end;
    A second connection terminal connected to a corner through terminal not connected to the first support electrode and the second support electrode;
    A metal cover that covers the crystal piece and hermetically seals the inside;
    An insulating film formed on a portion where the metal cover is mounted on the substrate;
    A surface-mounted crystal vibration characterized in that, in a portion where the second connection terminal and the metal cover are connected by a conductive adhesive, an open portion where the insulating film is not provided is formed on the second connection terminal. Child.
  2. 　第２の接続端子のパターンは、基板の略中心方向に向けて形成されていることを特徴とする請求項１記載の表面実装水晶振動子。 2. The surface mount crystal resonator according to claim 1, wherein the pattern of the second connection terminal is formed toward a substantially central direction of the substrate.
  3. 　第２の接続端子のパターンは、基板の長辺に沿って延びて形成されていることを特徴とする請求項１記載の表面実装水晶振動子。 2. The surface mount crystal resonator according to claim 1, wherein the pattern of the second connection terminal extends along the long side of the substrate.
  4. 　第２の接続端子のパターンは、基板の短辺に沿って延びて形成されていることを特徴とする請求項１記載の表面実装水晶振動子。 2. The surface mount crystal resonator according to claim 1, wherein the pattern of the second connection terminal extends along the short side of the substrate.
  5. 　基板上に温度センサを搭載し、前記温度センサの一方の端子に一方の第２の接続端子が接続され、前記温度センサの他方の端子に他方の第２の接続端子が接続され、前記他方の第２の接続端子と金属カバーとを導電性接着剤で接続する部分において、当該他方の第２の接続端子上に絶縁膜を設けない開放部分を形成したことを特徴とする請求項１乃至４のいずれか記載の表面実装水晶振動子。 A temperature sensor is mounted on the substrate, one second connection terminal is connected to one terminal of the temperature sensor, the other second connection terminal is connected to the other terminal of the temperature sensor, and the other 5. An open portion where an insulating film is not provided on the other second connection terminal is formed in a portion where the second connection terminal and the metal cover are connected by a conductive adhesive. A surface-mount crystal resonator according to any one of the above.
  6. 　矩形のセラミック基板上に水晶片が搭載される表面実装水晶振動子の製造方法であって、
    　前記基板の角部に形成された貫通孔の壁面にスルー端子を形成すると共に、基板の表面には水晶片を保持する第１の支持電極又は第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、前記第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子とを、金属膜で形成し、
    　前記第２の接続端子と搭載される金属カバーとを導電性接着剤で接続する部分において、前記第２の接続端子上に開放部分を設けるよう、前記金属カバーの接着面に絶縁膜を形成し、
    　前記水晶片を覆い、前記絶縁膜を介して内部を気密封止する前記金属カバーを搭載することを特徴とする表面実装水晶振動子の製造方法。     A method of manufacturing a surface-mounted crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate,
    A through terminal is formed on the wall surface of the through hole formed in the corner of the substrate, and the end of the first support electrode or the second support electrode holding the crystal piece on the surface of the substrate and the end A first connection terminal that connects a through terminal at the shortest corner, and a second connection terminal that connects to a through terminal at a corner that is not connected to the first support electrode and the second support electrode, Formed with a film,
    An insulating film is formed on the bonding surface of the metal cover so as to provide an open portion on the second connection terminal in a portion where the second connection terminal and the metal cover to be mounted are connected with a conductive adhesive. ,
    A method for manufacturing a surface-mounted crystal resonator, comprising: mounting the metal cover that covers the crystal piece and hermetically seals the inside through the insulating film.
  7. 　矩形のセラミック基板上に水晶片が搭載される発振器であって、
    　前記水晶片の下側で前記基板の表面又は裏面に発振回路を収納する空間を形成し、当該空間に前記発振回路を収納したものであり、
    　前記水晶片を保持する第１及び第２の支持電極と、
    　前記基板の角部に形成された貫通孔の壁面に形成されたスルー端子と、
    　前記第１の支持電極の端部又は前記第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、
    　前記第１の支持電極及び前記第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子と、
    　前記水晶片を覆い、内部を気密封止する金属カバーと、
    　前記金属カバーが前記基板に搭載される部分に形成される絶縁膜とを備え、
    　前記第２の接続端子と前記金属カバーとを導電性接着剤で接続する部分において、当該第２の接続端子上に前記絶縁膜を設けない開放部分を形成したことを特徴とする発振器。     An oscillator in which a crystal piece is mounted on a rectangular ceramic substrate,
    A space for accommodating an oscillation circuit is formed on the front or back surface of the substrate below the crystal piece, and the oscillation circuit is accommodated in the space.
    First and second support electrodes for holding the crystal piece;
    A through terminal formed on a wall surface of a through hole formed in a corner of the substrate;
    A first connection terminal connecting the end of the first support electrode or the end of the second support electrode and the through terminal at the shortest corner from the end;
    A second connection terminal connected to a corner through terminal not connected to the first support electrode and the second support electrode;
    A metal cover that covers the crystal piece and hermetically seals the inside;
    An insulating film formed on a portion where the metal cover is mounted on the substrate;
    An oscillator characterized in that, in a portion where the second connection terminal and the metal cover are connected by a conductive adhesive, an open portion where the insulating film is not provided is formed on the second connection terminal.
  8. 　第２の接続端子のパターンは、基板の略中心方向に向けて形成されていることを特徴とする請求項７記載の発振器。 The oscillator according to claim 7, wherein the pattern of the second connection terminal is formed toward a substantially central direction of the substrate.
  9. 　第２の接続端子のパターンは、基板の長辺に沿って延びて形成されていることを特徴とする請求項７記載の発振器。 8. The oscillator according to claim 7, wherein the pattern of the second connection terminal is formed to extend along the long side of the substrate.
  10. 　第２の接続端子のパターンは、基板の短辺に沿って延びて形成されていることを特徴とする請求項７記載の発振器。 8. The oscillator according to claim 7, wherein the pattern of the second connection terminal is formed to extend along the short side of the substrate.
  11. 　矩形のセラミック基板上に水晶片が搭載される表面実装水晶振動子であって、
    　前記水晶片を保持する第１及び第２の支持電極と、
    　前記基板の角部に形成された貫通孔の壁面に形成されたスルー端子と、
    　前記第１の支持電極の端部又は前記第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、
    　前記第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子と、
    　前記水晶片を覆い、内部を気密封止する金属カバーと、
    　前記金属カバーが前記基板に搭載される部分に形成される絶縁膜とを備え、
    　前記第２の接続端子が、前記基板の一辺に沿って延びた長方形に形成され、
    　前記第１の接続端子が、前記第２の接続端子と同形状の長方形のパターンと、前記長方形のパターンと前記第１の支持電極とを接続する接続パターンとを備え、
    　前記第２の接続端子と前記金属カバーとを導電性接着剤で接続する部分において、当該第２の接続端子上に前記絶縁膜を設けない開放部分を形成したことを特徴とする表面実装水晶振動子。     A surface-mount crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate,
    First and second support electrodes for holding the crystal piece;
    A through terminal formed on a wall surface of a through hole formed in a corner of the substrate;
    A first connection terminal connecting the end of the first support electrode or the end of the second support electrode and the through terminal at the shortest corner from the end;
    A second connection terminal connected to a corner through terminal not connected to the first support electrode and the second support electrode;
    A metal cover that covers the crystal piece and hermetically seals the inside;
    An insulating film formed on a portion where the metal cover is mounted on the substrate;
    The second connection terminal is formed in a rectangular shape extending along one side of the substrate;
    The first connection terminal includes a rectangular pattern having the same shape as the second connection terminal, and a connection pattern for connecting the rectangular pattern and the first support electrode.
    A surface-mounted crystal vibration characterized in that, in a portion where the second connection terminal and the metal cover are connected by a conductive adhesive, an open portion where the insulating film is not provided is formed on the second connection terminal. Child.
  12. 　第２の接続端子のパターンは、基板の長辺に沿って延びて形成されていることを特徴とする請求項１１記載の表面実装水晶振動子。 12. The surface mount crystal resonator according to claim 11, wherein the pattern of the second connection terminal extends along the long side of the substrate.
  13. 　第２の接続端子のパターンは、基板の短辺に沿って延びて形成されていることを特徴とする請求項１１記載の表面実装水晶振動子。 12. The surface mount crystal resonator according to claim 11, wherein the pattern of the second connection terminal extends along the short side of the substrate.
  14. 　第１の接続端子の接続パターンは、一辺が長方形のパターンの長辺と接続する略三角形に形成されていることを特徴とする請求項１１乃至１３のいずれか記載の表面実装水晶振動子。 14. The surface-mount crystal resonator according to claim 11, wherein the connection pattern of the first connection terminal is formed in a substantially triangular shape with one side connected to the long side of the rectangular pattern.
  15. 　シート状のセラミック基板上に複数の矩形領域がマトリクス状に配置され、前記各矩形領域に水晶片が搭載される表面実装水晶振動子の製造方法であって、
    　前記矩形領域の角部に形成された貫通孔の壁面にスルー端子を形成すると共に、前記矩形領域の表面には水晶片を保持する第１の支持電極及び第２の支持電極を形成し、前記第１の支持電極又は前記第２の支持電極の端部と当該端部から最短の角部のスルー端子とを接続する第１の接続端子と、前記第１の支持電極及び第２の支持電極に接続しない角部のスルー端子に接続する第２の接続端子とを形成し、その際に前記スルー端子を共有する複数の矩形領域の前記第１の接続端子の一部及び前記第２の接続端子とが、前記貫通孔を中心とする矩形のパターンとなるよう形成し、
    　前記第２の接続端子と搭載される金属カバーとを導電性接着剤で接続する部分において、前記第２の接続端子上に開放部分を設けるよう、前記金属カバーの接着面に絶縁膜を形成し、
    　前記水晶片を覆い、前記絶縁膜を介して内部を気密封止する前記金属カバーを搭載することを特徴とする表面実装水晶振動子の製造方法。     A method of manufacturing a surface-mounted crystal resonator in which a plurality of rectangular regions are arranged in a matrix on a sheet-like ceramic substrate, and a crystal piece is mounted on each rectangular region,
    A through terminal is formed on a wall surface of a through hole formed in a corner of the rectangular region, and a first supporting electrode and a second supporting electrode for holding a crystal piece are formed on the surface of the rectangular region, A first connection terminal for connecting an end portion of the first support electrode or the second support electrode and a through terminal at a shortest corner from the end portion; and the first support electrode and the second support electrode A second connection terminal connected to a through terminal at a corner portion not connected to the first terminal, a part of the first connection terminal in the plurality of rectangular regions sharing the through terminal at that time, and the second connection The terminal is formed to have a rectangular pattern centered on the through hole,
    An insulating film is formed on the bonding surface of the metal cover so as to provide an open portion on the second connection terminal in a portion where the second connection terminal and the metal cover to be mounted are connected with a conductive adhesive. ,
    A method for manufacturing a surface-mounted crystal resonator, comprising: mounting the metal cover that covers the crystal piece and hermetically seals the inside through the insulating film.
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