WO2015176752A1 - Ensemble capteur capacitif et écouteur équipé d'un ensemble capteur capacitif - Google Patents
Ensemble capteur capacitif et écouteur équipé d'un ensemble capteur capacitif Download PDFInfo
- Publication number
- WO2015176752A1 WO2015176752A1 PCT/EP2014/060364 EP2014060364W WO2015176752A1 WO 2015176752 A1 WO2015176752 A1 WO 2015176752A1 EP 2014060364 W EP2014060364 W EP 2014060364W WO 2015176752 A1 WO2015176752 A1 WO 2015176752A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrically conductive
- sensor unit
- capacitive sensor
- housing wall
- unit according
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/96071—Capacitive touch switches characterised by the detection principle
- H03K2217/960725—Charge-transfer
Definitions
- the present invention relates to a capacitive
- Capacitive sensor units are used to control
- control panel accessible location, in particular on control panel attached.
- the attachment is done for example by means of screws or with the aid of adhesive.
- the object of the present invention is therefore to provide a sensor unit which the above
- Capacitive sensor unit are specified in further claims.
- the capacitive sensor unit according to the present
- At least one electrically conductive surface is arranged in or on a housing wall, which consists of an electrically non-conductive material, wherein the at least one electrically conductive surface using the MID (Molded
- Interconnect Device technology is manufactured and wherein the at least one electrically conductive surface is arranged closer to an inner side of the housing wall, so that an insulating layer between the at least one electrically conductive surface and an outer side of the
- Housing wall is present.
- a variant of the inventive sensor unit is characterized in that a plurality of electrically conductive surfaces are arranged in a matrix, wherein the electrically conductive surfaces are electrically insulated from each other.
- Sensor unit are characterized in that the matrix has four surfaces, which are arranged in two rows and two columns.
- circular movements for example in a clockwise direction over the matrix, can be detected in order to increase a parameter, for example a volume.
- circular, counterclockwise movements lead to one
- Sensor unit are characterized in that a plurality of electrically conductive surfaces are arranged in a row, wherein the electrically conductive surfaces are electrically isolated from each other. This wiping movements can be detected with the inventive sensor units. Still further embodiments of the inventive sensor unit are characterized in that a
- Transmitter is present, which is operatively connected to the electrically conductive surfaces, and that the
- Evaluation electronics can detect capacitance changes of the electrically conductive surfaces.
- Time sequence of detected capacitance changes of the electrically conductive surfaces for controlling parameters is usable. Further variants of the inventive
- Outside of the housing wall in the region of the electrically conductive surfaces has a structure or a color that differs from the rest of the housing wall.
- Layer materials copper, nickel and gold, or copper and silver, or copper and tin are provided.
- the insulating layer consists of the material of the housing wall.
- housing wall of an LDS (Laser Direct Structuring) - capable polymer, such as VECTRA or ZEONEX exists. Furthermore, the present invention relates to a headphone with a housing in which a capacitive sensor unit according to one or more of the preceding
- Embodiment variants is provided.
- a variant of the headphone is that the headphone is of the type in-ear headphones.
- Fig. 1 is a plan view of an inside of a
- FIG. 2 shows a cross section perpendicular through the housing wall of the first embodiment according to FIG. 1, FIG.
- Fig. 3 is a plan view of an inside of a second
- Embodiment of the invention with four arranged as a matrix sensor surfaces,
- FIG. 3 a perspective view of a housing component of a headphone having a matrix with inventive sensor surfaces according to the second embodiment and a plan view of an inner side of a third embodiment of the invention with four in a row arranged sensor surfaces.
- Fig. 1 is a plan view of a section of a housing wall 1 of a housing, with the example, electronic components are protected against external influences.
- the top view shows the inside of the housing wall 1, on which or in which an electrically conductive surface 2 is provided.
- the electrically conductive surface 2 is manufactured using the MID (Molded Interconnect Device) technology and forms the main component of the capacitive sensor unit according to the invention, wherein the surface 2 is electrically connected to an evaluation electronics (not shown in FIG. 1) for detecting changes in capacitance.
- the evaluation electronics for a section of a housing wall 1 of a housing, with the example, electronic components are protected against external influences.
- the top view shows the inside of the housing wall 1, on which or in which an electrically conductive surface 2 is provided.
- the electrically conductive surface 2 is manufactured using the MID (Molded Interconnect Device) technology and forms the main component of the capacitive sensor unit according to the invention, wherein the surface 2 is electrically connected to an evaluation electronics (not shown in
- the ID technology is used for metallizing and
- Plastic substrate pressed.
- the substrate is melted by the heat at the surface.
- Conductors are sheared out of the copper foil and connected to the substrate.
- the primer makes a chemical bond with the substrate surface and provides good adhesion.
- the film is reshaped. Subsequently, the film is placed in an injection molding machine and
- Plastic still to be treated.
- the sprue is placed again in a mold and not with
- Substrate serves a plastic injection molded part, in which the surface is first prepared for pickling by pickling or etching. Subsequently, the
- Metallization For structuring, a photoresist is applied and exposed through a three-dimensional mask with UV light. After development of the photoresist, the exposed metal layer is galvanically reinforced and coated with an etching mask. After removal of the photoresist, the remaining metal is etched away and then the surface is finished. In contrast to the mask method, the direct laser structuring structures the etching resist directly with the laser. At the locations where the etch resist was removed by the laser, the metal is etched away.
- electrically conductive surfaces 2 applied to the inside 3 of the housing wall 1.
- the electrical connection between the surface 2 and the mentioned evaluation electronics (not shown in FIG. 1) can be applied to the housing wall 1 by the same method.
- the electrically conductive surface 2 is embedded in the housing wall 1, so that the housing wall thickness in the region of the recessed
- FIG. 2 shows a cross section of the embodiment variant of the capacitive sensor unit according to the invention shown in FIG.
- the electrically conductive surface 2 is - as already mentioned - applied to the inside 3. If a user's finger moves towards the outside 4 or if it touches the outside of the finger 4, in the region of the outside, where the electrically conductive surface 2 is arranged opposite on the inside 3, so the capacitance, which by the finger, the electrically conductive surface 2, the thickness of the intermediate layer between fingers and electrically conductive Surface as well as the material characteristics
- Charge change can be determined in a known manner is detected by the transmitter, whereby, for example, a switching operation can be triggered.
- Such a structure 5 can be produced by embossing the outer housing wall 1 or by gluing elements and serves for the tactile or visual orientation of the user of the sensor unit according to the invention. It is also conceivable that the recognizability is expressed by a color that differs from the color of the rest of the housing.
- the electrically conductive surface 2 has, for example, a multi-layer structure, wherein - starting from the inner side 3 of the housing wall - first a layer of copper is provided with a layer thickness of usually 5 to 20pm. It follows a layer of nickel with a Layer thickness of 5 to 20 ⁇ and a thin layer of gold or silver directly on copper or tin directly on copper as oxidation protection.
- 3 shows an embodiment with a plurality of electrically conductive surfaces 10 to 13 arranged in a matrix. This arrangement not only offers the possibility of
- Switching operations for different processes which are associated with the individual surfaces 10 to 13, trigger on contact, and in particular the detection of a predetermined sequence of stimulations of individual
- a counterclockwise stimulation sequence i. with a stimulation of the surfaces 10 to 13 in the sequence 13-12-11-10-13 -..., leads to a reduction of the parameter value.
- the evaluation electronics preferably not only the sequence is used as a decision criterion for a given process, but also the temporal aspect is taken into account so that faulty circuits can be minimally or completely prevented. So it is intended that between two stimulations
- FIG. 5 an application of the embodiment with in a two-by-two matrix according to FIGS. 3 and 4 is shown. This is a case component of a headphone 20 of the type in-ear headphones, as it is often used today in connection with smartphones in particular. In particular, the mentioned detection of stimulations of the surfaces in a sequence is suitable
- the present invention is not limited to being used with a headset for control. Rather, the capacitive sensor unit or the
- FIG. 6 shows a further embodiment of the present invention, in which four electrically
- conductive surfaces 10 to 13 are arranged in a row. Incidentally, the surfaces 10 to 13 are in turn made the same, as has already been explained above.
- the arrangement of electrically conductive surfaces 10 to 13 in a row makes it possible to detect so-called wiping movements readily.
Abstract
L'invention concerne un ensemble capteur capacitif comprenant une ou plusieurs surfaces électriquement conductrices (10, 11, 12, 13) qui sont disposées dans ou sur une paroi de boîtier (1) en matériau électriquement non conducteur. La ou les surfaces électriquement conductrices (2; 10, 11, 12, 13) sont réalisées en utilisant la technologie MID (Molded Interconnect Device) et elles sont disposées plus près d'une face interne (3) de la paroi de boîtier (1) de façon à ménager une couche isolante entre la ou les surfaces électriquement conductrices (2; 10, 11, 12, 13) et une face externe (4) de la paroi de boîtier (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2014/060364 WO2015176752A1 (fr) | 2014-05-20 | 2014-05-20 | Ensemble capteur capacitif et écouteur équipé d'un ensemble capteur capacitif |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2014/060364 WO2015176752A1 (fr) | 2014-05-20 | 2014-05-20 | Ensemble capteur capacitif et écouteur équipé d'un ensemble capteur capacitif |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015176752A1 true WO2015176752A1 (fr) | 2015-11-26 |
Family
ID=50733095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2014/060364 WO2015176752A1 (fr) | 2014-05-20 | 2014-05-20 | Ensemble capteur capacitif et écouteur équipé d'un ensemble capteur capacitif |
Country Status (1)
Country | Link |
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WO (1) | WO2015176752A1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2426012A1 (fr) * | 2010-09-07 | 2012-03-07 | Marquardt GmbH | Volant pour un véhicule automobile |
DE102011077170A1 (de) * | 2011-06-08 | 2012-12-13 | BSH Bosch und Siemens Hausgeräte GmbH | Bedien- und Anzeigeeinrichtung und Haushaltsgerät |
WO2013041520A1 (fr) * | 2011-09-22 | 2013-03-28 | Behr-Hella Thermocontrol Gmbh | Dispositif de commande, par exemple interface homme-machine, en particulier pour un composant de véhicule |
US20130249568A1 (en) * | 2013-05-23 | 2013-09-26 | Peter Botten | Cabinet touch control |
-
2014
- 2014-05-20 WO PCT/EP2014/060364 patent/WO2015176752A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2426012A1 (fr) * | 2010-09-07 | 2012-03-07 | Marquardt GmbH | Volant pour un véhicule automobile |
DE102011077170A1 (de) * | 2011-06-08 | 2012-12-13 | BSH Bosch und Siemens Hausgeräte GmbH | Bedien- und Anzeigeeinrichtung und Haushaltsgerät |
WO2013041520A1 (fr) * | 2011-09-22 | 2013-03-28 | Behr-Hella Thermocontrol Gmbh | Dispositif de commande, par exemple interface homme-machine, en particulier pour un composant de véhicule |
US20130249568A1 (en) * | 2013-05-23 | 2013-09-26 | Peter Botten | Cabinet touch control |
Non-Patent Citations (5)
Title |
---|
"Compounds TECACOMP LDS Compounds for Laser Direct Structuring", 17 December 2013 (2013-12-17), XP055160548, Retrieved from the Internet <URL:http://www.ensinger-online.com/uploads/media/TECACOMP_LDS_ENG_05.pdf> [retrieved on 20150108] * |
"Metal Plating of High Performance Plastics", 30 January 2009 (2009-01-30), XP055160544, Retrieved from the Internet <URL:http://www.mamesta.nl/files/metacoat_engl.pdf> [retrieved on 20150108] * |
ANONYMOUS: "Compounds TECACOMP LDS Compounds for Laser Direct Structuring", 17 December 2013 (2013-12-17), XP055160047, Retrieved from the Internet <URL:http://www.ensinger-online.com/uploads/media/TECACOMP_LDS_ENG_05.pdf> [retrieved on 20150105] * |
ANONYMOUS: "Metal Plating of High Performance Plastics", 30 January 2009 (2009-01-30), pages 1 - 8, XP055160121, Retrieved from the Internet <URL:http://www.mamesta.nl/files/metacoat_engl.pdf> [retrieved on 20150106] * |
THOMAS LENEKE ET AL: "A multilayer process for the connection of fine-pitch-devices on molded interconnect devices (MIDs)", CIRCUIT WORLD, vol. 35, no. 2, 15 May 2009 (2009-05-15), pages 23 - 29, XP055160123, ISSN: 0305-6120, DOI: 10.1108/03056120910953286 * |
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