WO2015176626A1 - Puce de grande taille à del et groupe de modules de machine optique - Google Patents

Puce de grande taille à del et groupe de modules de machine optique Download PDF

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Publication number
WO2015176626A1
WO2015176626A1 PCT/CN2015/079152 CN2015079152W WO2015176626A1 WO 2015176626 A1 WO2015176626 A1 WO 2015176626A1 CN 2015079152 W CN2015079152 W CN 2015079152W WO 2015176626 A1 WO2015176626 A1 WO 2015176626A1
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WO
WIPO (PCT)
Prior art keywords
led
chip
transparent
circuit
silver paste
Prior art date
Application number
PCT/CN2015/079152
Other languages
English (en)
Chinese (zh)
Inventor
张继强
张哲源
朱晓冬
Original Assignee
贵州光浦森光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201410211945.8A external-priority patent/CN103957649B/zh
Priority claimed from CN201410214077.9A external-priority patent/CN103985809B/zh
Priority claimed from CN201410214074.5A external-priority patent/CN103953902B/zh
Priority claimed from CN201410213282.3A external-priority patent/CN103953901B/zh
Priority claimed from CN201410213615.2A external-priority patent/CN103968342B/zh
Priority claimed from CN201410213349.3A external-priority patent/CN103968287B/zh
Priority claimed from CN201410213295.0A external-priority patent/CN103968286B/zh
Application filed by 贵州光浦森光电有限公司 filed Critical 贵州光浦森光电有限公司
Publication of WO2015176626A1 publication Critical patent/WO2015176626A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/17—Operational modes, e.g. switching from manual to automatic mode or prohibiting specific operations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices

Definitions

  • the current LED driver power supply is mostly a switching power supply, which is too large; there is also a slightly smaller linear power supply, but its driver chip is mostly in DIP dual in-line or SMD chip package type and auxiliary components, and its volume is still insufficient. Small enough to fit inside the optomechanical module.
  • the transition circuit integrated transparent block is used to connect an external power source or signal to more than one LED driving power large chip, and then output the large chip to the LED lighting large chip through the LED driving power. It solves the circuit requirements of the LED light machine module, so that the external power supply or signal should be connected to the LED drive power large chip or the LED drive power large chip output to the LED lighting large chip circuit needs to be involved on the optical machine template on both sides
  • the printed circuit can be realized.
  • the back of the optomechanical template will be used close to the heat sink, and the heat sink is mostly made of metal.
  • the back of the optomechanical template needs to be insulated, and the problem of the double-sided printed circuit cannot be realized.
  • the arrangement method of the large chip on the non-insulating heat-conducting substrate is characterized in that: the non-insulating heat-conducting substrate is included, the E-type transparent transition circuit is integrated with the transparent block, and one side of the silver paste circuit is closely attached to the non-insulating heat-conducting substrate; the LED driving power source is One side of the large chip with the interface wire circuit is attached to the side of the E-type transparent transition circuit integrated transparent block with the silver paste circuit for conducting butt welding; the side of the LED illumination large chip facing the silver paste circuit closely fits the non-insulated thermal conductive substrate arrangement, The interface wire end is aligned with the E-type transparent transition circuit integrated transparent block output end interface wire end; the LED illumination large chip with the chip side is further provided with an F-type transparent transition circuit integrated transparent block; the F-type transparent transition circuit One end of the integrated transparent block with the silver paste circuit surface and the side of the LED illumination large chip with the silver paste circuit are butt welded according to the interface wire, and the other end is integrated with the E-type transparent transition circuit
  • the segment in which the LED load is connected in series is controlled by a switch, and the control node of the switch is a segmentation limit of the voltage, the number of segments of the voltage and the LED
  • the number of segments in the load series corresponds.
  • the LED load can be divided into 3 to 7 segments, with few segments and simple circuit, but the current varies greatly, and it is easy to generate low-order harmonics in the power grid; if there are many segments, the circuit structure is complicated. Generally, 4 to 6 segments are preferred.
  • the power source driving wafer level chip, the rectifier bridge wafer level chip and the LED chip are filled with a transparent sealant for leveling, and then, in addition to the reserved installation and soldering position, Type and size of the same transparent cover plate with the templating template to form a seal thereon; or directly drive the wafer level chip, the rectifier bridge wafer level chip and the LED chip to form a layer to drive the wafer level chip, Rectifier bridge wafer level chip and LED chip sealed transparent sealant.
  • the LED lighting large chip of the invention can be conveniently used for LED light machine modules with different power requirements, and can be driven by a large power chip, and the LED lighting large chip is designed to have a fixed width W.
  • the length is determined according to the specifications of the manufacturing equipment, and is divided into different lengths when used. In this way, the LED lighting large chip does not need to be cut into a millimeter size for a single LED chip, and the mechanical characteristics of the substrate are reduced when the chip is fabricated, so that the selection range of the polycrystalline high-purity alumina and the like enters the substrate is greatly increased.
  • FIG. 2 is an external view of a LED lighting large chip of the present invention
  • FIG. 10 is a schematic circuit diagram of a small optical machine template of the present invention.
  • FIG. 13 is a schematic view of a medium-sized optical machine module with a horizontal arrangement of a large chip according to the present invention
  • FIG. 24 is a schematic structural view of a C-type transition circuit integrated transparent block of the present invention.
  • 26 is a schematic view showing a layout method of a large chip on a non-insulating heat-conductive substrate
  • FIG. 29 is a schematic structural view of a bulb with a heat conducting bracket as a substrate using the method shown in FIG. 26 according to the present invention.
  • Figure 30 is a schematic view showing the structure of a small-sized optical machine module using the method shown in Figure 26;
  • 38 is a circuit diagram of an internal circuit of a driving power supply chip according to an embodiment of the present invention.
  • FIG. 40 is a power loading distribution diagram of an LED chip array module in a DC52V series according to an embodiment of the present invention.
  • the LED illumination chip as shown in FIG. 1 to FIG. 3, includes a first transparent substrate 421 having a width W, and the first transparent substrate 421 is provided with N+1 parallel interface wires, and the first transparent substrate 421 is disposed.
  • LED driving power large chip comprising a second transparent substrate 413 having a width fixed by W, the second transparent substrate 413 is printed with a silver paste circuit, an interface wire is formed on the silver paste circuit, and the interface wire has an access end and an output end;
  • the width of the inlet end is the same as the width W G of the wire access end of the optomechanical template 43 or has a pad connected to the electrical connector;
  • the silver paste circuit at the output end has N+1 parallel interface wires, and the adjacent two interface wires
  • the second transparent substrate 413 is pasted with an unpackaged power source to drive the wafer level chip 411 and the rectifier bridge
  • the wafer level chip 412 then solders the unpackaged power source driving wafer level chip 411 and the rectifier bridge wafer level chip 412 on the second transparent substrate 413;
  • the rectifier bridge wafer level chip 412 can
  • a resistor 416 can be disposed on the back of the LED driving power large chip 410 to facilitate adjustment of the internal reference voltage, see FIG.
  • the side of the LED illumination chip 420 with the chip is attached to the side of the optomechanical template 43 with the silver paste circuit 414 for butt welding, and the interface wires of the two are soldered correspondingly; at the same time, the LED drive power chip 410 with the silver paste circuit One side is attached to the side of the optomechanical template 43 with the silver paste circuit 414 for butt welding; thereby, the LED illumination large chip 420 is connected to the LED driving power large chip 410; finally, the transparent LED is used to package the LED illumination large chip and the driving power supply around the large chip.
  • the LED chip carrying voltage is ⁇ DC3.2V or greater than DC10V High voltage.
  • the large-chip horizontally arranged LED light machine module comprises a transparent light machine template 43 printed with a silver paste circuit 414.
  • the silver paste circuit 414 forms an interface wire on the light machine template 43, the width and spacing of the interface wires and the LED
  • the width W and the width W JG of the large LED chip 420 and the LED driving power chip 410 are the same; for a large power module, or a transition circuit integrated transparent block 430, the optical template 43 and one are required.
  • the above LED driving power large chip 410 is connected; then the LED driving power large chip 410 and the LED lighting large chip 420 with a silver paste circuit 414 on one side of the transparent optical template 43 with the silver paste circuit 414 are soldered to the LED by the interface wire.
  • Light machine module is connected to then the LED driving power large chip 410 and the LED lighting large chip 420 with a silver paste circuit 414 on one side of the transparent optical template 43 with the silver paste circuit 414 are soldered to the LED by the interface wire.
  • Block 450 connects one or more LED lighting large chips 420 perpendicular to the optical template 43 to the optical template 43; and then the LED driving power large chip 410 with the silver paste circuit side and the transparent optical template 43 with the silver paste circuit One side is welded to the product by the interface wire.
  • the external power source or signal is directly connected through the connector 11 from the LED driving power large chip 410 soldered on the optomechanical template 43; As shown in FIG. 21 and FIG. 22, the optical template 43 is also soldered with a flexible circuit 44. The external power supply or signal is connected to the flexible circuit 44 through the connector 11 for soldering to the optical template 43.
  • the transparent block 460 is sealed with a transparent glue 45 to obtain an LED light machine module.
  • the F-type transparent transition circuit integrates one end of the transparent block 480 with the silver paste circuit surface and the side of the LED illumination large chip 420 with the silver paste circuit is butt welded according to the interface wire, and the other end is further transparent with the E-type transition
  • the side of the circuit integrated transparent block 470 with the silver paste circuit is butt welded to the product by the interface wire.
  • the non-insulating heat-conducting substrate is made of a metal or non-metal heat-conducting material, and the surface of the LED-illuminated large chip 420 is a mirror surface; the non-insulating heat-conducting substrate may be of a type of the light machine template 43; or the type of the heat-conducting bracket 3 of the light bulb, As shown in FIG. 29, it is a schematic diagram of the structure of the bulb in which the large chip is directly arranged on the heat conducting bracket according to the method of the present invention; or other heat sink-like type, as shown in FIG. 49; for the medium and small LED light machine template 43
  • the external power supply or signal is directly connected to the LED driving power large chip 410 attached to the optical template 43 through the connector 11 as shown in FIG.
  • the transition circuit integrated transparent block of the present invention comprises two kinds of transition circuit integrated transparent blocks: Type 1E: external power source and signal are respectively connected to the LED driving power large chip 410, as shown in FIG. 26 and FIG. 32, wherein the flexible circuit 44 is connected.
  • 2F type LED driving power large chip 410 output to LED lighting large chip 420, see Fig. 33, wherein LED driving power large chip 410 wire output width is W, wire spacing is W JG , height is H8; typical size is: width 12.4 mm, height: H8 is determined by the power of the LED illumination large chip 420.
  • the power of the sinusoidal pattern formed by the pulsating DC half-wave is 1 (Fig. 41); 3 is set to 120% of the load-carrying power of the LED load series segment.
  • a rectangular shadow map with an area of 1.2, the ordinate value of the rectangular shadow is the total maximum carrying voltage value of the series segment group; 4
  • the graphic area of the chipset can be obtained by drawing (See Figure 42), verify that the sum of the area of the chipset is greater than the pulsating DC sine wave area under the control node of the switch; 5 select the load voltage value of the chipset on the serial segment group by commodity, add up to or greater than the serial
  • the total maximum carrying voltage value of the segment group may be; wherein the LED chip set with a higher carrying voltage value is close to the positive terminal (the initial segment), and the LED chip group with a lower carrying voltage value is close to the negative terminal (the last segment).
  • Section 4 When V W is less than or equal to 4V WR /6, the switches K4 to K6 are turned ON (ON), the current is mainly formed by the node J4 through the switch K4, and the load is composed of LEDs with a rated voltage of 4V WR /6 in series;
  • the load voltage of the chip array is adjusted to DC244V; as shown in Fig. 43, the obtained chip array is loaded with a power area of 96.67% of the pulsating DC half-wave power area, and the power of the chip array is close to 1 is ideal; at this time, the power of the LED chip array is the chip array rating.
  • the output is 77.6%; the experimental verification is similar to the estimated value.
  • the optimization method is referred to above.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une puce d'éclairage de grande taille à DEL, une puce de grande taille d'alimentation électrique pour la commande de DEL et de multiples types de groupes de modules de machine optique La présente invention facilite la standardisation de l'éclairage à DEL, présente des avantages pour la standardisation de l'éclairage à DEL et sa structure peut être étendue à une grande échelle.
PCT/CN2015/079152 2014-05-20 2015-05-18 Puce de grande taille à del et groupe de modules de machine optique WO2015176626A1 (fr)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
CN201410211945.8A CN103957649B (zh) 2014-05-20 2014-05-20 Led驱动方法及led照明电路
CN201410213282.3 2014-05-20
CN201410213349.3 2014-05-20
CN201410214077.9A CN103985809B (zh) 2014-05-20 2014-05-20 Led照明大芯片
CN201410214074.5A CN103953902B (zh) 2014-05-20 2014-05-20 Led驱动电源大芯片
CN201410211945.8 2014-05-20
CN201410213615.2 2014-05-20
CN201410214074.5 2014-05-20
CN201410213282.3A CN103953901B (zh) 2014-05-20 2014-05-20 大芯片在非绝缘导热基板上的布置方法
CN201410213615.2A CN103968342B (zh) 2014-05-20 2014-05-20 Led光机模组
CN201410214077.9 2014-05-20
CN201410213349.3A CN103968287B (zh) 2014-05-20 2014-05-20 大芯片垂直布置的led光机模组
CN201410213295.0A CN103968286B (zh) 2014-05-20 2014-05-20 大芯片水平布置的led光机模组
CN201410213295.0 2014-05-20

Publications (1)

Publication Number Publication Date
WO2015176626A1 true WO2015176626A1 (fr) 2015-11-26

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PCT/CN2015/079152 WO2015176626A1 (fr) 2014-05-20 2015-05-18 Puce de grande taille à del et groupe de modules de machine optique

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3560296A4 (fr) * 2016-12-23 2020-08-05 Seoul Semiconductor Co., Ltd. Système intégré servant au pilotage de del et dispositif d'éclairage à del comprenant ledit système

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CN101772245A (zh) * 2010-03-12 2010-07-07 陈林 一种自适应供电电源电压的led照明装置
CN202182359U (zh) * 2011-08-31 2012-04-04 游文贤 一种无需外置电源的led灯管结构
CN102913880A (zh) * 2012-11-16 2013-02-06 王宁军 一体式led光源散热器件及其制备方法
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CN103957649A (zh) * 2014-05-20 2014-07-30 贵州光浦森光电有限公司 Led驱动方法及led照明电路
CN103953901A (zh) * 2014-05-20 2014-07-30 贵州光浦森光电有限公司 大芯片在非绝缘导热基板上的布置方法
CN103953902A (zh) * 2014-05-20 2014-07-30 贵州光浦森光电有限公司 Led驱动电源大芯片
CN103968342A (zh) * 2014-05-20 2014-08-06 贵州光浦森光电有限公司 Led光机模组
CN103968287A (zh) * 2014-05-20 2014-08-06 贵州光浦森光电有限公司 大芯片垂直布置的led光机模组
CN203761623U (zh) * 2013-11-29 2014-08-06 四川新力光源股份有限公司 一种自适应led日光灯管和自适应led交流驱动电路
CN103968286A (zh) * 2014-05-20 2014-08-06 贵州光浦森光电有限公司 大芯片水平布置的led光机模组
CN103985809A (zh) * 2014-05-20 2014-08-13 贵州光浦森光电有限公司 Led照明大芯片
CN203810156U (zh) * 2014-05-20 2014-09-03 贵州光浦森光电有限公司 大芯片水平布置的led光机模组
CN203810334U (zh) * 2014-05-20 2014-09-03 贵州光浦森光电有限公司 Led驱动电源大芯片
CN203810157U (zh) * 2014-05-20 2014-09-03 贵州光浦森光电有限公司 大芯片垂直布置的led光机模组
CN203812914U (zh) * 2014-05-20 2014-09-03 贵州光浦森光电有限公司 Led照明大芯片
CN203827588U (zh) * 2014-05-20 2014-09-10 贵州光浦森光电有限公司 Led照明电路
CN203836904U (zh) * 2014-05-20 2014-09-17 贵州光浦森光电有限公司 Led光机模组
CN204268108U (zh) * 2014-05-20 2015-04-15 贵州光浦森光电有限公司 非绝缘导热基板式的led光机模组

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Publication number Priority date Publication date Assignee Title
CN101652861A (zh) * 2007-01-22 2010-02-17 科锐Led照明科技公司 容错发光体、包含容错发光体的系统以及制造容错发光体的方法
CN101772245A (zh) * 2010-03-12 2010-07-07 陈林 一种自适应供电电源电压的led照明装置
CN103348773A (zh) * 2011-01-28 2013-10-09 首尔半导体株式会社 Led发光装置及其驱动方法
CN202182359U (zh) * 2011-08-31 2012-04-04 游文贤 一种无需外置电源的led灯管结构
CN202852470U (zh) * 2012-07-06 2013-04-03 杭州福光工贸有限公司 一种新型led芯片模块
CN102913880A (zh) * 2012-11-16 2013-02-06 王宁军 一体式led光源散热器件及其制备方法
CN203068208U (zh) * 2013-01-08 2013-07-17 陕西亚成微电子股份有限公司 一种led光源
CN203761623U (zh) * 2013-11-29 2014-08-06 四川新力光源股份有限公司 一种自适应led日光灯管和自适应led交流驱动电路
CN103968342A (zh) * 2014-05-20 2014-08-06 贵州光浦森光电有限公司 Led光机模组
CN203810156U (zh) * 2014-05-20 2014-09-03 贵州光浦森光电有限公司 大芯片水平布置的led光机模组
CN103953901A (zh) * 2014-05-20 2014-07-30 贵州光浦森光电有限公司 大芯片在非绝缘导热基板上的布置方法
CN103968287A (zh) * 2014-05-20 2014-08-06 贵州光浦森光电有限公司 大芯片垂直布置的led光机模组
CN103957649A (zh) * 2014-05-20 2014-07-30 贵州光浦森光电有限公司 Led驱动方法及led照明电路
CN103968286A (zh) * 2014-05-20 2014-08-06 贵州光浦森光电有限公司 大芯片水平布置的led光机模组
CN103985809A (zh) * 2014-05-20 2014-08-13 贵州光浦森光电有限公司 Led照明大芯片
CN103953902A (zh) * 2014-05-20 2014-07-30 贵州光浦森光电有限公司 Led驱动电源大芯片
CN203810334U (zh) * 2014-05-20 2014-09-03 贵州光浦森光电有限公司 Led驱动电源大芯片
CN203810157U (zh) * 2014-05-20 2014-09-03 贵州光浦森光电有限公司 大芯片垂直布置的led光机模组
CN203812914U (zh) * 2014-05-20 2014-09-03 贵州光浦森光电有限公司 Led照明大芯片
CN203827588U (zh) * 2014-05-20 2014-09-10 贵州光浦森光电有限公司 Led照明电路
CN203836904U (zh) * 2014-05-20 2014-09-17 贵州光浦森光电有限公司 Led光机模组
CN204268108U (zh) * 2014-05-20 2015-04-15 贵州光浦森光电有限公司 非绝缘导热基板式的led光机模组

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3560296A4 (fr) * 2016-12-23 2020-08-05 Seoul Semiconductor Co., Ltd. Système intégré servant au pilotage de del et dispositif d'éclairage à del comprenant ledit système

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