WO2015173032A1

WO2015173032A1 - Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

Info

Publication number: WO2015173032A1
Application number: PCT/EP2015/059547
Authority: WO
Inventors: Siegfried Herrmann
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2014-05-12
Filing date: 2015-04-30
Publication date: 2015-11-19
Also published as: DE102014208958A1; DE112015002255A5

Abstract

The invention relates to a surface-mountable optoelectronic component having a mounting surface arranged on an electrically insulating structural element and a radiation surface of an optoelectronic chip arranged perpendicular to the mounting surface. The structure element has a recess which completely penetrates the structural element in a direction perpendicular to the mounting surface. The chip is arranged in the recess. At least one side surface of the chip arranged perpendicular to the mounting surface is mechanically connected to a side surface of the recess arranged perpendicular to the mounting surface. A first and a second electrically conductive region are arranged on the structural element, which are electrically isolated from each other. The first and second electrically conductive regions are each arranged on the mounting surface and on the contact surfaces arranged perpendicular to the mounting surface and adjacent to the mounting surface and wherein the part of the electrically conductive regions arranged on the mounting surface forms connection contacts for electrical and mechanical contacting of a circuit carrier and the part of the electrically conductive regions arranged on the contact surfaces electrically contact the optoelectronic chip.

Description

Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

The subject matter described herein relates to a surface mountable

Optoelectronic component with a laterally arranged radiation surface. Further, a method of manufacturing a surface mountable

Optoelectronic device described with a laterally disposed radiation surface.

Optoelectronic components, such as light emitting diodes (LED), with laterally arranged radiation surfaces can be referred to as Sidelooker. These components can be mounted with their base on a circuit board, which generated by the component or the component to

Detecting electromagnetic radiation is emitted or recorded on a radiation surface arranged perpendicular to the base surface.

Such components may be provided, for example, for backlighting a display, for example a screen of a mobile telephone. The sidelooks are with their beam surface on the side surfaces of a

Light distribution plate arranged. The light distribution plate in turn is arranged behind the liquid crystal display. The light generated by the LEDs is coupled into the light distribution plate at the edges of the light distribution plate. The

Light distribution plate has coupling-out structures with which the coupled-in light is uniformly coupled out and emitted in the direction of the liquid-crystal display. The light penetrating the liquid crystal display can be perceived by a viewer of the display.

With regard to the miniaturization of mobile terminals, the requirement is to provide the most compact possible components in order to reduce the thickness of the display. In particular, the height of the component is a relevant

Criteria. For example, previously used components, such as the Micro SIDELED from OSRAM Opto Semiconductors, have a height of approximately 0.65 mm. It is therefore the object to provide an optoelectronic component with low height. Since the size and size of the components make it increasingly difficult to manufacture and process the components, there is also the task of providing a method for producing the optoelectronic components.

Proposed solution To solve the problem, a surface-mountable optoelectronic

Component having a arranged on an electrically insulating structural element mounting surface and arranged perpendicular to the mounting surface

Radiation surface of an optoelectronic chip proposed. The structural member has a recess that completely penetrates the structural member in a direction perpendicular to the mounting surface. In the recess of the structural element of the optoelectronic chip is arranged. At least one side surface of the optoelectronic chip arranged perpendicular to the mounting surface is mechanically connected to a side surface of the recess arranged perpendicular to the mounting surface. On the electrically insulating structural element, a first and a second electrically conductive region are arranged, which are electrically isolated from each other. The first and second electrically conductive region is arranged in each case on the mounting surface and on a contact surface arranged perpendicular to the mounting surface and adjacent to the mounting surface, wherein the contact surface on the mounting surface

arranged part of the first and second electrically conductive regions

Connection contacts for the electrical and mechanical contacting of a

Circuit carrier forms, and are provided on the contact surfaces arranged part of the first and second electrically conductive region for electrically contacting the optoelectronic chip. The simple structure allows low height components to be provided. The arranged on the structural member electrically conductive regions allow a compact electrical contacting of the optoelectronic chip. Since the electrical contact is made by the electrically conductive areas, can a device without vias or vias are provided. By arranging the chip in the recess, the structural element can be designed in such a way that the electrical and structural elements provided by the structural element

mechanical functions do not contribute to the height of the component. In simple terms, the structural elements and the recess are designed such that the chip is arranged next to the structural element. The device is for

different chip types suitable. For example, if the device has a light emitting chip, a sapphire chip, a sapphire flip chip, or a thin film chip may be provided as the chip. Further, chips may be provided with two backside contacts, two topside contacts, or one top and one backside contact.

Furthermore, to achieve the object, a method for producing a

proposed surface mount optoelectronic device. The method comprises providing a structural element carrier having a plurality of mechanically interconnected, electrically insulating structural elements, wherein the structural elements are arranged in rows and / or in columns and each have at least one recess which completely penetrates the structural elements. Furthermore, the method comprises applying electrically conductive regions to at least two mutually perpendicular and to each other

adjacent side surfaces of the structural elements; providing a plurality of optoelectronic chips; an introduction of the optoelectronic chips in the

Recesses of the structural elements; mechanically connecting the plurality of optoelectronic chips to the structure elements; and splitting the

Structural element carrier.

The common structural element carrier simplifies the production of the components, since instead of a plurality of individual structural elements, only one common structural element carrier has to be handled. In addition, the

Structural element carrier that some of the process steps for a plurality of components can be performed in parallel. For example, the electrically conductive regions may be simultaneously applied to a plurality of structural elements by a coating process. Furthermore, the mechanical Connecting the chips are performed with the structural elements for a plurality of components in parallel. The components can be produced without photographic technology. This simplifies the manufacture of the components. Further embodiments

As material for the structural element ceramic may be provided. Furthermore, plastic can be provided as the material for the structural element. For example, a material whose coefficient of thermal expansion corresponds approximately to the thermal expansion coefficient of the chip may be used. Further, a material that is emitted or absorbed by the chip may be used

electromagnetic radiation has a high reflectivity.

The proposed structure enables the provision of low-height devices. Thus, the height of the structural element can correspond approximately to the height of the optoelectronic chip. Furthermore, the total height of the

surface mountable optoelectronic component to be maximally twice as large as the height of the optoelectronic chip. For example, devices may be provided in which the optoelectronic chip has a height of about 200 μm and the device has an overall height of 300 μm. It can thus be provided components whose total height corresponds to a maximum of 1.5 times the height of the chip. In some embodiments, devices may be provided in which the overall height of the device is approximately equal to the height of the radiating surface of the optoelectronic chip.

A reflector layer may be arranged on the mounting surface of the structural element and / or on an upper side of the structural element opposite the mounting surface. Through the reflector layer, the efficiency of the device can be increased. The reflector layer may be part of a film applied to the structural element. Furthermore, the reflector layer may be a reflective potting compound. In the beam path of the chip, a film may be arranged parallel to the radiation surface, wherein a phosphor is applied to the film. In further embodiments, a phosphor can be applied directly to the radiation surface of the optoelectronic chip. For example, a phosphor embedded in potting compound may be filled in a cavity formed by films and the structural member. For the filling of the phosphor into the cavity formed by the foils and the structural element, dispensing may be provided, for example. Furthermore, the phosphor can also be sprayed onto the radiation surface of the chip.

The first and second electrically conductive area can be superficially on the

Structural element applied. As applied superficially, for example, structures can be referred to, which with a coating process on the

Structural element have been applied. For example, the first and second electrically conductive regions may be layers that have been applied to the structural element. The layer thickness can be less than 10 μm. In further

Embodiments, the layer thickness can be 2 μηι.

The structural element may be the optoelectronic chip at three perpendicular to

Surrounding mounting surface arranged side surfaces. Accordingly, that can

Structural element to be substantially U-shaped. A function of the two legs of the U-shaped structural element may be, for example, sufficient area for a mechanical and electrically conductive connection between the

To provide device and a circuit carrier. A function of

Crosspiece of the U-shaped structural element may for example consist in mechanically connecting the two legs of the structural element together.

In a further embodiment, at least two components can be combined to form a multiple component. The individual components of a multiple component can be connected to one another mechanically and electrically conductively via an electrically conductive foil. The electrically conductive foil may be an example of a circuit carrier. The individual components of the

Multiple component can be arranged in an electrical series circuit. the electrically conductive foil may be arranged on the mounting surface and / or the upper side of the structural element. The electrically conductive foil may be a

Have reflector layer. Furthermore, arranged on the mounting surface and on the top films over the beam surface can survive and form a cavity together with the structural element. In this case, at least one of the films may be an electrically conductive film. In the cavity, a phosphor can be introduced. As an alternative or in addition to at least two components mechanically and / or electrically interconnected via a foil, at least two structural elements of a multiple component can be mechanically connected to one another. The interconnected structural elements may be integrally formed. The mechanically interconnected structural elements can

optoelectronic chip electrically connect the multiple component electrically conductive. For example, a first electrically conductive region and a second electrically conductive region may form a common electrically conductive region. Due to the larger dimensions, a multiple device can be processed more easily compared to a single device, for example.

In a further embodiment, the device or the

Multiple component be part of a backlight device. The backlighting device may be configured to illuminate the background of a liquid crystal display of a display screen. The

Backlight device may comprise a light distribution plate, wherein the component or the multiple component may be arranged on at least one arranged perpendicular to a light outcoupling surface of the light distribution plate side surface of the light distribution plate.

In a further embodiment, the components can be connected only mechanically to one another via a film arranged on the mounting surface and / or the upper side. Only mechanically interconnected can mean that between the components no electrically conductive

Connection exists. The mechanically interconnected components can then be separated from each other immediately prior to application to a circuit carrier. The foil may have a reflector layer. The through the film interconnected components can be easily handled, transported and processed.

The electrically conductive regions can be applied in a structured manner to the structural element carrier. The structured application of the electrically conductive regions can be carried out, for example, by a coating method. For example, a shadow mask may be provided for the structured application.

For the splitting of the structural element carrier, a material removal along a first trench can be provided. The removal of material along the first trench can also be referred to as row division in a simplified manner below. The series division may be provided for a structural element carrier in which the structural elements are arranged in rows and columns. With the row splitting, a structural element carrier can be provided which has only a single row of structural elements.

For the splitting of the structural element carrier, a material removal between two structural elements arranged in a row can furthermore be provided. This material removal can also be referred to as column division below. The column division may be provided after the row division. For example, with spade partitioning, a structural element support having a single row of structural elements may be divided into individual structural elements or into groups having at least two structural elements. The structural elements can be applied to a film after dividing the structural element carrier. Furthermore, a structural element support having a single row of structural elements may also be applied without prior partitioning to the foil. The film may be provided to mechanically bond a plurality of structural elements together. The film with the applied components can be wound up on a roll. The wound on a roll film may be provided as a transport packaging. Furthermore, a film with a plurality of components can be divided into individual components or in groups with at least two components. For dividing the film and the mechanically interconnected via the film components can be provided for example laser cutting or cutting.

Brief description of the figures

Exemplary embodiments will be explained in more detail below with reference to the figures. The same reference numerals are used for similar or equivalent elements or properties in all figures. The figures are not to scale.

Show it:

Fig. La is a schematic plan view of a first surface mountable optoelectronic device;

Fig. Lb is a schematic side view of the one shown in Fig. La

component;

Fig. Lc is a schematic sectional view of a second

surface-mountable optoelectronic component;

Fig. Ld is a schematic sectional view of a third

surface-mountable optoelectronic component; Fig. Le is a schematic sectional view of a fourth

surface-mountable optoelectronic component;

FIG. 2a is a schematic plan view of a fifth surface-mountable optoelectronic component; FIG.

Fig. 2b is a schematic sectional view of that shown in Fig. 2a

component;

3a shows a schematic plan view of a structural element carrier;

Fig. 3b is a schematic side view of that shown in Fig. 3a

Structural element carrier; Fig. 4a 4e schematic representations between individual

Processing steps;

5 shows a schematic representation of a first multiple component;

Fig. 6 is a schematic representation of a second multiple component.

Detailed description of embodiments

The term "optoelectronic component" may, for example, comprise components that are configured to emit electromagnetic radiation and / or to detect electromagnetic radiation The solution proposed below will be explained using the example of a light emitting diode (LED) as an LED explained features can also be provided in other optoelectronic devices.

In Fig. La, a surface mountable optoelectronic device 10 is shown schematically. 1a is a plan view of a mounting surface of the surface-mountable optoelectronic component 10. FIG. 1b is a schematic top view of the radiation surface 20 of the component 10. The surface-mountable component 10 designates components which are suitable for surface mounting on a circuit carrier, such as Example of a

PCB, are suitable. This component form can also be referred to as SMD (Surface Mounted Device). When surface mounting the components are placed with a mounting surface on the circuit board. The

Components are then glued or soldered, for example

Reflow soldering or with an electrically conductive adhesive, mechanically and electrically connected to the circuit carrier.

The component 10 shown in FIGS. 1 a and 1 b comprises a

Structural element 12 and an optoelectronic chip 16. The illustrated optoelectronic chip 16 has approximately the shape of a cuboid. The chip 16 is arranged in a recess of the structural element 12. The illustrated structural element 12 adjoins three side surfaces of the chip 16. The recess penetrates the structural element 12 in the vertical direction - ie in the representation of Fig. La perpendicular to the plane - completely. The recess is not bounded by the structural element 12 on one side. This page can also be referred to below as the open side of the recess. Thus, the first structural element 12 surrounds the chip 16 in a substantially U-shaped manner. The shape of the recess is adapted to the shape of the male optoelectronic chip 16. For example, a thin-film chip with two top-side contacts may be provided for the illustrated embodiment.

The chip 16 has a radiation surface 20 on a side surface, that is to say a surface arranged perpendicular to the mounting surface 18. The radiating surface 20 is provided in the illustrated example of the LED, which is generated by the chip

To couple electromagnetic radiation from the chip 16. The to

Provision of radiation generation layer sequence of the chip 16 is arranged parallel to the radiation surface 20. The radiation surface 20 is disposed on the open side of the recess. Since the radiation surface 20 is arranged in the device 10 perpendicular to the mounting surface 18, the light emitted by the device 10 is coupled out laterally. This design can be called Sidelooker. Sidelooker can be provided, for example, to couple light laterally in a light distribution plate.

In the illustrated device 10, the chip 16 is on three sides of the

Structural element 12 surrounded in a U-shape. A first side surface of the chip 16 adjoining the radiation surface 20 is located at one in the recess

arranged first side surface of the structural element 12 at. A second side surface of the chip 16 adjoining the radiation surface 20 bears against a second side surface of the structure element 12 arranged in the recess. One of the radiation surface 20 opposite rear side of the chip 16 abuts a third side surface of the structural element 12. The chip 16 is mechanically with the

Structural element 12 connected. For the mechanical connection is between at least one side surface of the chip 16 and at least one of the arranged in the recess side surfaces of the structural element, a connecting means 21 is provided. As connecting means 21 may be provided, for example, adhesive, electrically conductive adhesive or solder.

The structural element 12 is formed from an electrically insulating material such as plastic or ceramic. As plastic can for example

Polybutylene terephthalate (PBT) or polycarbonate (PC) may be provided. As a ceramic may be provided, for example, AI2O3. Furthermore, a machinable glass ceramic can be provided. Furthermore, the material of the structural element may be selected such that it has a high intensity for the radiation emitted by the chip 16

Has reflectivity. For example, materials that appear white to a viewer may be used.

On the electrically insulating structural element 12, a first electrically conductive region 22 and a second electrically conductive region 23 are arranged. The first and second electrically conductive areas 22, 23 are superficial on the

Structural element 12 applied. The superficial application of the electrically conductive regions can be effected by a coating method. For example, a physical vapor deposition method such as sputter deposition or thermal evaporation or a chemical vapor deposition method may be used

Gas phase deposition such as plasma-enhanced chemical vapor deposition may be provided. Furthermore, thermal spraying or electroplating may be provided. The coating can also be applied in two stages. For example, in a first step, for example by sputter deposition, a seed layer may be applied. In a second step, the layer thickness can be increased, for example, by electroplating. Especially for plastic molded

Structural elements 12 may include the structural element 12 and the electrically conductive regions 22, 23 also with a production method for injection molded parts

Circuit carriers (English Molded interconnect devices) are generated. When

Materials for the electrically conductive regions 22, 23 may be, for example, gold, Be provided silver, copper, nickel, titanium and / or an alloy containing these materials.

The electrically conductive regions 22, 23 can each be layers which cover the underlying contours of the structural element 12 with a substantially constant layer thickness. The electrically conductive regions may have one or more layers arranged one above the other. If superimposed layers are provided, these layers can have different materials. By means of a plurality of layers of different materials arranged one above another, for example, the adhesion of the electrically conductive material to the structural element 12 can be improved. Furthermore, the quality of the electrical and mechanical connections between the structural element 12 and a circuit carrier and / or between the structural element 12 and the chip 16 can be improved. For example, the electrically conductive regions may comprise a titanium layer, a platinum layer, a nickel layer, a copper layer and / or a gold layer. The layer thicknesses may be, for example, 100 nm for the titanium layer, 100 nm for the platinum layer and 100 nm for the gold layer. The layer thicknesses for the copper and nickel layer can be 1-2 μηι. The thickness of the electrically conductive region may generally be less than 10 μm.

The first and second electrically conductive regions 22, 23 are electrically isolated from each other. For example, the first and second electrically conductive regions 22, 23 may be disposed on the structural member 12 so as not to touch or overlap. Furthermore, the first and second electrically conductive regions 22, 23 can be arranged on the structural element such that they can be applied to the structural element 12 with a single coating step.

The first and second electrically conductive regions 22, 23 are on two, in

Essentially arranged perpendicular to each other surfaces of the structural element 12. In addition, the electrically conductive portions 22, 23 cover the edge, the is located between the mutually perpendicular surfaces. In the illustrated embodiment, the electrically conductive portions 22, 23 cover a portion of the mounting surface 18, and adjacent the radiation surface 20 arranged bonding surfaces 32, 36. The arranged perpendicular to the mounting surface 18 surfaces of the electrically conductive portions 22, 23 can hereinafter generally as

Contact surfaces are called. Additionally or alternatively, as

Contact surfaces also be provided two separate surfaces on the third side surface of the recess. Furthermore, the first or the second electrically conductive region 22, 23 may also cover the first and second side surfaces of the structural element 12 arranged in the recess and / or an end surface 38 of the structural element 12. The contact surfaces are for electrical

Contacting the chip 16 is provided. The electrical contacting of the chip 16 can be done for example by solder joints, electrically conductive adhesive bonds and / or bonding wire connections.

The arranged perpendicular to the mounting surface 18 contact surfaces are shown in Fig. Lb. The edge of the structural element 12 between the mounting surface 18 and the contact surfaces may be rounded or chamfered. For example, a rounded or bevelled edge can improve the quality of the edge coverage. The portions of the first and second electrically conductive regions 22, 23 disposed on the mounting surface 18 form a first and a second

Terminal contact 24, 26. The first and second terminal contact 24, 26 are provided for surface mounting of the device 10. The connection contacts 22, 23 are suitable to be connected by soldering or gluing, mechanically and electrically conductive with a circuit carrier.

In the exemplary embodiment illustrated in FIGS. 1 a and 1 b, at least two bonding wires 28 are provided for electrical contacting of the chip 16. A first bonding wire 28 connects a first bonding pad 30 arranged on the radiation surface 20 of the chip 16 to the first bonding surface 32 arranged on the structural element 12. A second bonding wire 28 connects a second bonding wire 28

Radiation surface 20 of the chip 16 arranged Bondpad 34 with the on the Structural element 12 arranged second bonding surface 36. The first and second bonding surface 32, 36 and the beam ungsfläche 20 are compared to in the

Essentially arranged parallel to the radiation surface 20 of the chip 16 arranged end face 38 of the device 10 is reset. By the reset

Arrangement of the bonding surfaces 32, 36 do not protrude the bonding wires 28 over the

End face 38 addition.

On the beam ungsfläche 20, a phosphor 40 may be applied. In the

Representations of Figures la and lb the phosphor 40 is shown hatched. The phosphor 40 is intended to be that of the chip 16 in a first

At least partially into radiation having a second wavelength range such that a viewer perceives the emitted radiation as, for example, "white." The bonding wires 28 may be at least partially embedded in the phosphor 40. The phosphor 40 may have a thickness, for example of 20 mm.

FIG. 1c is a schematic sectional view through a second component 42. The second component 42 is a variant of the first component 10 illustrated in conjunction with FIGS. 1a and 1b. The second component 42

differs from the first component by a first film 46 arranged on an upper side 44 of the component 42. Furthermore, the second component illustrated in FIG. 1c has steps 47.

The upper side 44 of the component is opposite the mounting surface. The first film 46 has several layers. In the exemplary embodiment illustrated in FIG. 1b, the first film 46 comprises an adhesive layer 48, an insulation layer 49 and a reflector layer 50. The insulation layer 49 is arranged between the adhesive layer 48 and the reflector layer 50. The insulation layer 49 is electrically non-conductive. In addition to the electrical insulation, the insulating layer 49 also for

mechanical stabilization of the first film 46 may be provided. As the material for the insulating layer 49, for example, polyimides or polymethyl methacrylates be provided. The reflector layer 50 is formed of a material that has a high for the electromagnetic radiation emitted by the chip 16

Reflectance has. As the material for the reflector layer 50 may be provided, for example, silver or aluminum. The reflector layer 50 may, for example, be applied to the insulation layer 49 by means of a coating. Furthermore, further layers such as, for example, a second insulation layer may be arranged above the reflector layer 50. For example, the first foil 46 may have a thickness of less than 50 μm.

The first film 46 is coated with the adhesive layer 48 on the top 44 of the

Structural element 12 attached. In addition to the reflective properties, the first foil 46 may mechanically stabilize the device. The first foil 46 can reach up to the end face 38 of the component. The first film 46 can in the region of the recess on the recessed bonding surfaces 32, 36 and the chip 16th

survive. The projecting portion of the first film 46 may be further provided as a limit to the introduction of the phosphor 40 in addition to a mechanical stabilization and the reflection of radiation.

On the structural element 12 of the second component 42, steps 47 are arranged. The steps 47 may be provided, for example, to adjust the height of the component to a desired height. In that shown in Fig. Lc

Component 42 is on the top of a projecting stage 47 a and on the

Mounting surface 18 a recessed step 47 b arranged. The arrangement of Fig. Lc is exemplary. In further embodiments, for example, only one stage, two protruding stages or two recessed stages may be provided. The steps 47 can be generated, for example, when the structural elements 12 are separated.

1 d is a schematic sectional view through a third component 52. The third component 52 is a variant of the first component 10 illustrated in conjunction with FIGS. 1 a and 1 b. The third component 52 differs itself from the first component 10 in that a first film 46 is arranged on the upper side 44 and a second film 66 is arranged on the mounting surface 18. The second film 66 may substantially correspond to the first film 46. The second film 66 has a second one already mentioned in connection with FIG

Insulation layer 51 on. The second insulation layer 51 corresponds to the first one

Insulation layer 49. The second insulation layer 49 is disposed on the reflector layer 50.

The first and second films 46, 66 are in the region of the recess on the recessed bonding surfaces 32, 36 and the chip 16 via. Openings for the first and second connection contacts 24, 26 arranged on the mounting surface 18 are provided on the second film 66. The protruding first and second foils 46, 66 together with the structural element 12 form a cavity, wherein the

Radiation surface 20 and the bonding surfaces 32, 36 form the bottom of the cavity. In this cavity, for example, a phosphor particles having potting compound 40 are filled.

FIG. 1e is a schematic sectional view through a fourth component 54. The fourth component 54 is a variant of the first component 10 illustrated in conjunction with FIGS. 1a and 1b. The fourth component 54

differs from the first component 10 in that a reflective potting compound 56 is arranged on the upper side 44 and / or the mounting surface 18. The reflective potting compound 56 may be, for example, a titanium dioxide particle filled silicone resin. The reflective potting compound 56 may have a

Form reflector layer. On the mounting surface 18 of the fourth component 54, the connection contacts 24, 26 are arranged.

In Figures 2a and 2b is a fifth surface mountable

Optoelectronic device 60 shown. FIG. 2 a is a plan view of the mounting surface 18 of the surface-mountable optoelectronic component 60. FIG. 2 b is a schematic sectional view along that in FIG. 2 a represented line AA. The fifth component 60 differs from the first component 10 in particular in that instead of a thin-film chip with two top-side contacts, a sapphire flip-chip 61 is provided whose contacts are provided on the rear side. Accordingly, 61 no bonding wires are required for electrical contacting of the chip. The contacts arranged on the rear side of the chip 61 are electrically conductively connected via two connection means 21 to the contact surfaces of the first and second electrically conductive regions 22, 23 arranged on the third side surface of the recess. To the

For example, a soldering alloy whose soldering temperature is above 250 ° C. may be provided as the connecting means.

Further, in the embodiment shown in Figures 2a and 2b on the upper side 44 of the structural member 12, the first sheet 46 and on the

Mounting surface 18, the second film 66 is arranged. The films are shown dashed and transparent in the illustration of FIG. 2a, since otherwise the chip 16 is covered by the films. The films may correspond to the films already explained in connection with FIG. In the illustration of FIGS. 2 a and 2 b, the first and second films 46, 66 are connected to one another via a film web 74. The film web 74 is arranged at the level of the end face 38 parallel to the radiation surface 20. On the film web 74, a phosphor 80 may be applied. This is indicated in the illustration of FIG. 2b by the hatched area. The foil web 74 may, for example, an insulating layer 49 or a

Carrier layer of the film may be formed. Furthermore, the foil web 74 is transparent to the radiation emitted by the chip 16 and / or the phosphor 80.

The features explained in connection with FIGS. 1 and 2 are independent of each other. For example, the second film 66 explained in conjunction with FIGS. 2a and 2b may also be provided in the case of the first component 10. In addition, mixed forms are possible, so for example, a thin-film chip with a top contact and a back contact can be provided. Accordingly, at the beam ungsfläche 20 of the chip 16 a in connection with the figures la and lb described bonding wire 28 for electrical contacting of the Top contact and on the back of the chip 16 may be arranged in connection with the figures 2a and 2b described solder joint for making electrical contact with the rear side contact. Furthermore, the fifth component 60 may also have features of the second, third and / or fourth component 42, 52, 54.

In the case of the components 10, 42, 52, 54, 60, the height "hc" of the chips 16, 61 corresponds approximately to the height of the structural element 12. Since through the films 46, 66 the

Total height "hg" of the device is only slightly increased, a device can be provided whose total height "hc" is at most twice as high as the height "hc" of the chip 16, 61. It can be provided a device whose total height "hg "is less than 0.5 mm. For example, devices 10 having a height in the range between 0.3 mm and 0.15 mm

to be provided. In one embodiment, the total height "hg" of the device 200 may be Mm The overall length "Ig" of the devices 10, 60 may be, for example, between 0.8 mm and 2.5 mm. The total width "bg" of the components 10, 60 may be, for example, between 0.3 mm and 1 mm.

FIGS. 3 a and 3 b show a structural element carrier 102. FIG. 3 a is a schematic plan view of the structural element carrier 102. FIG. 3 b is a schematic side view of the structural element carrier 102

Structural element carrier is provided to facilitate the manufacture of in

Connection with the figures 1 and 2 explained to allow components.

On the structural element carrier 102, a plurality of interconnected structural elements 12 is arranged. For a clearer illustration, the individual structural elements 12 are shown dotted in FIGS. 3a and 3b. The

Dashed lines indicate in the illustration of Figures 3a and 3b dividing lines, along which the individual structural elements can be separated. The

Structural elements 102 are along columns 104 and / or rows 106

arranged. In the illustration of Figures 3a and 3b rows 106 are provided, wherein in each row 106 each two structural elements 12 are arranged. In the Structural element carriers 102 are introduced into first trenches 108 and second trenches 110a, 110b. The first trenches 108 are arranged parallel to the rows 106. The second trenches 110a, 110b are arranged parallel to the gaps 104. The second trenches 110a, 110b are arranged perpendicular to the first trenches 108. In the illustration of FIG. 3 a, the first trench 108 overlaps the second trenches 110 a, 110 b. Accordingly, in the illustration of FIG. 3 a, the first trench 108 is inserted deeper into the material of the structural element carrier than the second trenches 110 a, 110 b. In addition to the illustrated structural element carrier 102 in which the

Structural elements arranged in columns and rows can also

Structure element carrier may be provided, in which the structural elements are arranged only in a row 106. Structural element carriers consisting of structural elements arranged along a row have correspondingly no first trenches.

In the structural element carrier 102 illustrated in FIGS. 3a and 3b, different second trenches 110a, 110b are illustrated. The second trench 110a arranged on the left in FIGS. 3a and 3b is longer and shallower than the second trench 110b arranged on the right. Further, the leftmost second trench 110a has gradations. These gradations form the bonding surfaces 32, 36 of the later component. The left second trench 110a and the right second trench 110b are provided for receiving different types of chips. The left

Structural element is provided for receiving a chip 16 with surface contacts. The right structural element is provided for receiving a chip 61 with backside contacts. In addition to the structural element carrier 102 illustrated in FIGS. 3 a and 3 b, structural element carriers 102 with the same second trenches 110 may also be provided. Furthermore, structural element carriers can be provided, in which the structural elements each have only one step. Such structural elements may be provided for receiving a chip having a top side contact and a rear side contact.

The structural element carrier 102 can be produced, for example, by transfer molding. For structural elements made of ceramic, for example, hot isostatic Be provided for pressing. In general, manufacturing processes can be provided, with which first and second trenches can already be introduced during the molding of the structural element carrier 102. Furthermore, the first and second trenches 108, 110a, 110b may be introduced into the structural member carrier 102 by a material removal such as sawing and / or grinding.

A method for producing optoelectronic components is explained with reference to FIGS. 4a-4e. Figures 4a-4e are schematic representations of the components between individual processing steps.

4a is a schematic plan view of the structural element carrier 102 explained in conjunction with FIGS. 3a and 3b. In connection with FIG. 4a, an application of an electrically conductive material is explained. The electrically conductive material can be applied, for example, by means of anisotropic metallization. This is indicated in Fig. 4a by the arrows shown. For example, to

Metalization of the structural element carrier method of physical or chemical vapor deposition may be provided. Furthermore, the metallization can also be done for example by thermal spraying. The coating allows all surfaces arranged parallel to the plane of the drawing to be coated. In the illustrated embodiment, these are the end faces 38, the bonding surfaces 32, 38, the bottom surface of the first trenches 108, and the bottom surfaces of the second trenches 110a, 110b. In addition, at least a part of the surfaces of the structural elements 12 is also coated, which are arranged perpendicular to the plane of the drawing in FIG. 4a. For example, the later mounting surface 18 of the device in the representation of FIG. 4a is arranged perpendicular to the plane of the drawing. The metallization can, for example, with a layer thickness of 2 μηι on the

Structural element carrier 102 are applied. For the metallization, it is also possible to apply a plurality of overlapping layers of different materials, as has already been explained, for example, in connection with the first component. In a further embodiment, the

Structural element carrier 102 and the metallization can also be produced with a production method for injection-molded circuit carriers (MID method). For structuring the electrically conductive regions 22, 23, a shadow mask 111 may be provided. In the illustrated embodiment, the

Shadow mask 111 elongate structures 112 have. The elongate structures have a constant thickness and extend in the

Substantially parallel to the coating direction and the second trenches 110a, 110b. Furthermore, the metallization can be structured by a material removal. For material removal, machining processes such as sawing or grinding can be used. For example, by sawing along the second trenches 110a, 110b, on the bottom surface of the second trench 110a,

110b applied metallization are removed again to produce separate electrically conductive regions. The structurally applied metallization or the structured metallization form the electrically conductive regions 22, 23 of the later component.

Fig. 4b is a schematic representation of a section through the

Structural element carrier 102 along the line BB shown in Fig. 4a. The

Structural elements 12 are interconnected by the material disposed below the first trench 108.

The hatched areas 114 in FIG. 4b show the electrically conductive areas 22, 23. The structured application of the metallization means that the first electrically conductive area 22 and the second electrically conductive area 23 are separated from one another. A part of the mounting surface is thus not covered by the electrically conductive regions 22, 23. In addition to the surfaces shown in Fig. 4b, the electrically conductive regions also cover the end faces 38 and the bonding surfaces 32, 36. As contact surfaces for electrical contacting of the chip are in the

Structural element 12 with the left second trench 110 a, the bonding surfaces 32, 36 are provided. In the case of the structural element 12 with the right-hand second trench 110b, the bottom surface of the right-hand second trench 110b is provided as contact surfaces for electrical contacting of the chip. On the bottom surface of the right second Trench 110b, two electrically insulated from each other electrically conductive surfaces are provided.

FIG. 4c shows a structural element carrier 102 in which chips 16, 61 have been introduced. Before introducing the chips 16, 61, solder or adhesive can be applied to at least one of the side surfaces of the recess arranged in the recess

Structural elements 12 and / or on a side surface of the chips 16, 61 are arranged. The second trenches may, for example, be 15 μm longer than the chips 16, 61. The chip 16 introduced into the left second trench 110a may be mechanically connected to the bottom surface of the left second trench 110a by means of an electrically insulating adhesive, for example. For electrical contacting, the surface contacts of the chip 16 are connected via the bonding wires 28 to the bonding surfaces 32, 36. The chip 61 introduced into the right-hand second trench 110b may, for example, be connected to the bottom surface of the right-hand second trench 110b mechanically and electrically conductively with its electrically conductive adhesive via its rear side. For electrical contacting of the two back contacts two connecting means 21 are provided. After this

Insertion of the chips 16, 61 may be cured, for example, by applying heat energy of the adhesive disposed between the chips 16, 61 and the structural element carrier 102, or soldering a solder alloy.

A phosphor 40 can be sprayed onto the radiation surface of the chips 16, 61 introduced into the structural element carrier. The phosphor 40 is applied in a structured manner. For example, the electrically conductive regions 22, 23 of the device may be concealed by a shadow mask. In other

Embodiments, the phosphor can also be applied later.

Further, a reflective potting compound may be filled in the first trenches 108 to provide the structure illustrated in FIG. On the electrically conductive regions 22, 23 can be applied, for example, before filling the reflective potting compound, a layer, which after a division of the Components removal of the potting compound of the connection contacts 24, 26 facilitates.

In Fig. 4d dashed lines are shown. The dividing lines are arranged in the first trenches 108. The structural element carrier 102 can by a

Material removal along the first trenches 108 are divided. The splitting of the structural element carrier 102 along the first trench 108 may also be referred to as a series division below. Sawing, grinding or laser cutting can be provided for the removal of material, for example. The material removal can be done for example from above or from below. With the top, a material removal can be referred to, which takes place substantially from the side of the structural element carrier 102, on which the chips are arranged. From below may refer to a material removal, which takes place substantially from the side of the structural element carrier 102, which faces the recesses. As a result of the series division, the steps 47 illustrated in FIG. 1c on the mounting surface 18 and / or the

Surface 44 are generated. The steps may be provided, for example, to adjust the height of the components to a desired value. In this case, a protruding step 47 can be generated by a material removal from above. As the above stage 47 can be referred to a stage that over the

Connection contacts 24, 26 protrudes. Material removal from below can create protruding or recessed steps. The reset can be a stage where material has been removed from the mounting surface. In embodiments in which structural element carriers are used which have only one row of structural elements 12, the row division can be dispensed with.

After a series division, material removal may be provided to separate structural elements arranged in a row. A corresponding parting line is shown in Fig. 4e. This material removal can be referred to below as column division. By splitting the columns, individual components or groups of at least two components can be provided. to Column division can be provided, for example, grinding, sawing, cutting or laser cutting.

In Fig. 4e, a number of structural elements 12 with a first and second foil 46, 66 is shown. For example, the row of the structural elements 12 is placed on the first or second foil 46, 66 after singulation. After the structural elements 12 have been applied to the first or the second film 46, 66, the other film can be applied. In the illustration of FIG. 4e, the second film 66 has openings for the connection contacts 24, 26.

If no phosphor has yet been applied, after the application of the first and second films 46, 66, phosphor 40 can be applied to the radiation surface 40. For example, embedded in potting compound

Phosphor particles are applied to the radiation surface 40 in a cavity formed by the protruding first and second foils 46, 66 and the structural element 12. Furthermore, it is possible for the first and second films 46, 66 to be connected to one another via a film web 74 explained in conjunction with FIGS. 2a and 2b. In this case, the phosphor 80 can be arranged on the film web 74. For the first components 10 which have no foil, the application of the first and second foil 46, 66 explained in connection with FIG. 4d can be dispensed with.

The division of the columns can be carried out before or after application to the first and / or second film. For example, the components after the

Column division individually on the film 44, 66 are applied. This can be provided, for example, if during the further processing of the components, a large distance between the individual components is desired.

In a division of columns after the application of the components to the film, the components can be divided together with the film 44, 66 by the column division. In addition to these two variants, mixed forms are also possible. Thus, for example, before applying the components to the film a

Column division may be provided, in which the structural element carrier 102 is divided into groups of at least two components and after the application of the groups of components on the film 46, 66, a new column division may be provided to separate the components. This can be provided, for example, to simplify the handling of the components during manufacture or further processing.

The film 44, 66 with the applied components may be on a roll

be wound up. The role with the multiplicity of connected ones

Components can be delivered to a customer. The step of

Column division can then be carried out by a customer, for example immediately before the components are applied to a circuit carrier.

If the separation of the components immediately before the application of the

Components is provided on a circuit board, the handling and transport of the components can be simplified. This is particularly advantageous for components with small dimensions.

5 is a schematic illustration of a first multiple component 500. The multiple component 500 comprises at least two components 502, 504. The at least two components 502, 504 are connected to one another mechanically and electrically conductively via an electrically conductive foil 506. The components 502, 504 are applied to the electrically conductive foil 506 spaced apart along one direction. The spaces between the individual components can remain free or be filled with silicone, for example.

The electrically conductive film 506 differs from the first and second films 46, 66 at least in that in addition to the adhesive layer 48, the

Insulation layer 49 and the reflector layer 50 at least one more

Insulation layer and electrical conductors 510 are provided. The electrical interconnects 510 may, for example, between two insulating layers 49 be embedded. The electrical traces 510 may be on the of the

Structure elements 12 facing away from the electrically conductive film 506 may be arranged. The electrically conductive foil can be based on the

Structural element 12, an adhesive layer 48, an insulating layer 49, a

Reflector layer 50, an insulating layer 49, electrical interconnects 510, and a further insulating layer 49 have. Furthermore, the electrically conductive foil 506 has plated-through holes 512. The plated-through holes 512 penetrate part of the insulating layers 49 and the reflector layer 50 and form an electrically conductive connection between the electrical conductor tracks 510 and the terminal contacts 24, 26 of the individual components. The reflector layer may have openings for the plated-through holes 512. The plated-through holes 512 may, for example, be electrically conductively connected to the connection contacts 24, 26 with an electrically conductive adhesive or by means of a solder connection. The electrically conductive foil may, for example, have a thickness of less than 100 μm.

Furthermore, the electrically conductive foil 506 has a first and a second external connection contact 514, 516. The first and the second external

Terminal contacts 514, 516 are provided to electrically contact the multiple device 500. In the exemplary embodiment illustrated, the first external connection contact 514 is electrically conductively connected via an electrical interconnect 510 to a first connection contact 24 of the component 502. The second connection contact 26 of the component 502 is electrically conductively connected via an electrical interconnect 510 to the first connection contact 24 of the component 504. The second terminal contact 26 of the component 506 is electrically conductively connected to the second external terminal contact 516 via an electrical conductor track 510. The components 504, 506 of the multiple component 500 are electrically connected in series. In addition to the electrically conductive foil 506, one of the foils 46, 66 described in connection with FIGS. 1c, 1d, 2a, 2b may be provided on the other side of the components. Furthermore, an electrically conductive foil 506 can be arranged on the upper side and the lower side of the components. The multiple device 500 thus differs from, for example, one Roll arranged individual components in particular characterized in that the components of the multiple component 500 electrically conductive with each other

are connected.

6 is a schematic representation of a second multiple component 600. The second multiple component 600 illustrated in FIG. 6 differs from the first multiple component 500 shown in FIG. 5 in that the structural elements 12 are connected to one another in a mechanically and electrically conductive manner. The multiple device 600 may be, for example, a row of the type shown in FIG. 4c

have schematically indicated structural element carrier 102. In contrast to the representation of the schematic representation of FIG. 4c, the second

Multiple device 600 only chips of one type. Further, the second multiple device 600 may, for example, comprise a row of the structural element carrier 102 having three recesses and three chips 16 arranged in the recesses.

The second multiple component 600 has common electrically conductive regions 602. The common electrically conductive regions 602 have a first electrically conductive region 22 provided for contacting a first chip and a second electrically conductive region 23 provided for contacting a second chip arranged adjacent thereto.

On the upper side 44 and / or the mounting surface 18 of the structural elements 12, a film 46, 66 may be arranged. The film 46, 66 has a reflector layer 50. By means of the reflector layer 50, light emitted laterally from the component can be deflected in the direction of the radiation surface. Accordingly, the film 46, 46 can provide a light-guiding function.

By combining at least two components into one

Multiple component, the handling of the components can be simplified in the further processing. The components and the multiple components can, for example, for

Coupling of light to be provided in a light distribution plate. The

For example, the multiple device and the light distribution plate may be part of a backlight of a display, such as a display

Be liquid crystal display. The components may be arranged with their radiation surface 20 on a side surface of the light distribution plate. The side surface of the light distribution plate can perpendicular to a light output surface of the

Be arranged light distribution plate. The light path between the radiating surface and the side surface of the light distribution plate may be adjustable. Adjustable, for example, mean that the length of the light path can be set to a desired value. The desired value may, for example, be less than 100 μm. The length of the light path can be adjusted, for example, over the depth of the second trenches relative to the end face 38. Furthermore, the length of the light path can be adjusted by the thickness of a phosphor 40 arranged on the radiation surface.

The optoelectronic component and the method for producing an optoelectronic component were used for the purpose of vera nschaul ich

underlying idea described with reference to some embodiments. The embodiments are not limited to specific feature combinations. Although some features and designs only in the

Related to a particular embodiment or individual

Embodiments have been described, they can each with others

Characteristics are combined from other embodiments. It is also possible to omit or add in individual embodiments illustrated features or particular embodiments, as far as the general technical teaching is realized.

Although the steps of the method of manufacturing the optoelectronic device are described in a particular order, it is It should be understood, of course, that any of the methods described in this disclosure may be practiced in any other meaningful order, and that process steps may be omitted or added so long as it is not departed from the spirit of the described technical teaching.

Claims

claims

1. Surface-mountable optoelectronic component (10, 42, 52, 54, 60) having a mounting surface (18) arranged on an electrically insulating structural element (12) and a radiation surface (20) of an optoelectronic chip (16, 16) arranged perpendicular to the mounting surface (18). 61), where

the structural member (12) has a recess that completely penetrates the structural member (12) in a direction perpendicular to the mounting surface (18); in the recess of the structural element (12) of the optoelectronic chip (16, 61) is arranged;

at least one side surface of the optoelectronic chip (16, 61) arranged perpendicular to the mounting surface (18) is mechanically connected to a side surface of the recess arranged perpendicular to the mounting surface (18);

on the electrically insulating structural element (12) a first and a second electrically conductive region (22, 23) are arranged, which are electrically insulated from each other;

the first and second electrically conductive regions (22, 23) are respectively arranged on the mounting surface (18) and on contact surfaces arranged perpendicular to the mounting surface and adjacent to the mounting surface (18), and wherein

- The arranged on the mounting surface portion of the first and second electrically conductive regions (22, 23) terminal contacts for electrical and mechanical contacting of a circuit substrate and the contact surfaces arranged on the part of the first and second electrically conductive region (22, 23) the optoelectronic chips (16, 61) contact electrically.

2. The component according to claim 1, wherein a height of the structural element (12) corresponds approximately to a height (hc) of the optoelectronic chip (16, 61).

3. The component according to claim 1 or 2, wherein the total height (hg) of the component is at most twice as large as the height (hc) of the optoelectronic chip (16, 61).

4. The component according to one of claims 1 to 3, wherein on the mounting surface (18) of the structural element (12) and / or on one of the mounting surface (18) opposite upper side (44) of the structural element (12) has a reflector layer (50, 56) is arranged.

5. The component according to one of claims 1 to 4, wherein in the beam path of the chip (16, 61) parallel to the radiation surface (20) a film (74) is arranged and on the film, a phosphor (80) is applied.

6. The component according to one of claims 1 to 4, wherein on the mounting surface (18) and the top (44) over the radiation surface (20) projecting film (46, 66) is arranged and in a by the projecting film (46, 66) and the structural element (12) formed cavity phosphor (40) is arranged.

7. The component according to one of claims 1 to 6, wherein the first and second electrically conductive region (22, 23) are superficially applied to the structural element (12).

8. The component according to one of claims 1 to 7, wherein the structural element (12) surrounding the optoelectronic chip (16, 61) on three perpendicular to the mounting surface (18) arranged side surfaces.

9. multiple component (500) having at least two of the components described in claims 1 to 8 (10, 42, 52, 54, 60, 502, 504), wherein the at least two components via an electrically conductive film (506) electrically conductive with each other are connected.

10. Multiple component (600) with at least two of the components described in claims 1 to 8 (10, 42, 52, 54, 60, 502, 504), wherein the

Structural elements (12) are mechanically interconnected and wherein a first electrically conductive region and a second electrically conductive region (23) form a common electrically conductive region (602).

11. component transport arrangement having a plurality of components (10, 42, 52, 54) according to one of claims 1 to 8, wherein the plurality of components (10, 42, 52, 54) via at least one film (46, 66) mechanically together connected is.

12. A backlight device for a display device, wherein the backlight device comprises at least one of the components (10, 60) according to one of claims 1 to 10 and a light distribution plate, wherein the at least one component (10, 42, 52, 56, 60) with the radiation surface (20) is disposed on a side surface of the light distribution plate, and wherein the side surface of the light distribution plate perpendicular to a light output surface of

Light distribution plate is arranged.

13. A method for producing a surface mountable optoelectronic device with

Providing a structural element carrier (102) with a plurality of mechanically interconnected, electrically insulating structural elements (12), wherein the structural elements (12) are arranged in rows and / or in columns and each have at least one recess which completely penetrates the structural elements;

Applying electrically conductive areas on at least two mutually perpendicular and adjacent side surfaces of the

Structural elements (12);

Providing a plurality of optoelectronic chips (16, 61);

Introducing optoelectronic chips (16, 61) into the recesses of the

Structural elements (12);

mechanically connecting the plurality of optoelectronic chips (16, 61) to the structural elements (12);

Splitting the structural element carrier (102).

14. The method of claim 13, wherein the electrically conductive regions

structured on the structural element carrier (102) are applied.

15. The method of claim 13 or 14, wherein for the splitting of the structural element carrier (102) a material removal along a first trench (108) is provided and / or a material removal between two in a row

arranged structural elements is provided.

16. The method according to any one of claims 13 to 15, wherein the structural elements (12) after the splitting of the structural element carrier (102) on a film (46, 66, 506) are applied.

17. The method of claim 16, wherein the film (46, 66, 506) with the

applied structural elements (12) is wound on a roll.