DE112015002255A5 - Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component - Google Patents

Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component Download PDF

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Publication number
DE112015002255A5
DE112015002255A5 DE112015002255.4T DE112015002255T DE112015002255A5 DE 112015002255 A5 DE112015002255 A5 DE 112015002255A5 DE 112015002255 T DE112015002255 T DE 112015002255T DE 112015002255 A5 DE112015002255 A5 DE 112015002255A5
Authority
DE
Germany
Prior art keywords
optoelectronic component
mountable optoelectronic
producing
mountable
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112015002255.4T
Other languages
German (de)
Inventor
Siegfried Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112015002255A5 publication Critical patent/DE112015002255A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE112015002255.4T 2014-05-12 2015-04-30 Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component Withdrawn DE112015002255A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014208958.1 2014-05-12
DE102014208958.1A DE102014208958A1 (en) 2014-05-12 2014-05-12 Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component
PCT/EP2015/059547 WO2015173032A1 (en) 2014-05-12 2015-04-30 Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

Publications (1)

Publication Number Publication Date
DE112015002255A5 true DE112015002255A5 (en) 2017-01-26

Family

ID=53175021

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014208958.1A Withdrawn DE102014208958A1 (en) 2014-05-12 2014-05-12 Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component
DE112015002255.4T Withdrawn DE112015002255A5 (en) 2014-05-12 2015-04-30 Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014208958.1A Withdrawn DE102014208958A1 (en) 2014-05-12 2014-05-12 Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

Country Status (2)

Country Link
DE (2) DE102014208958A1 (en)
WO (1) WO2015173032A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016106270A1 (en) * 2016-04-06 2017-10-12 Osram Opto Semiconductors Gmbh PREPARATION OF A SEMICONDUCTOR CONSTRUCTION ELEMENT
DE102019202716B4 (en) 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. FLEX FILM PACKAGE WITH COPLANAR TOPOLOGY FOR HIGH FREQUENCY SIGNALS AND PROCESS FOR MANUFACTURING SUCH A FLEX FILM PACKAGE
DE102019202721B4 (en) 2019-02-28 2021-03-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. 3D FLEX FILM PACKAGE
DE102019202715A1 (en) 2019-02-28 2020-09-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. FILM-BASED PACKAGE WITH DISTANCE COMPENSATION
DE102019202718B4 (en) 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thin dual foil package and method of making the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005031883A1 (en) * 2003-09-29 2005-04-07 Matsushita Electric Industrial Co., Ltd. Linear light source and production method therefor and surface emission device
JP2006278205A (en) * 2005-03-30 2006-10-12 Matsushita Electric Ind Co Ltd Linear light source device and manufacturing method thereof
JP4903393B2 (en) * 2005-04-27 2012-03-28 京セラ株式会社 Light source device and liquid crystal display device
US20080101062A1 (en) * 2006-10-27 2008-05-01 Hong Kong Applied Science and Technology Research Institute Company Limited Lighting device for projecting a beam of light
JP2009038184A (en) * 2007-08-01 2009-02-19 Harison Toshiba Lighting Corp Semiconductor light emitting device, light source device, and surface light emitting device
US8431951B2 (en) * 2009-10-01 2013-04-30 Excelitas Canada, Inc. Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation
KR20110087579A (en) * 2010-01-26 2011-08-03 삼성엘이디 주식회사 Led light module and backlight unit having led module

Also Published As

Publication number Publication date
WO2015173032A1 (en) 2015-11-19
DE102014208958A1 (en) 2015-11-12

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R082 Change of representative
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee