DE112015005016A5 - Method for producing an optoelectronic component and optoelectronic component - Google Patents

Method for producing an optoelectronic component and optoelectronic component Download PDF

Info

Publication number
DE112015005016A5
DE112015005016A5 DE112015005016.7T DE112015005016T DE112015005016A5 DE 112015005016 A5 DE112015005016 A5 DE 112015005016A5 DE 112015005016 T DE112015005016 T DE 112015005016T DE 112015005016 A5 DE112015005016 A5 DE 112015005016A5
Authority
DE
Germany
Prior art keywords
optoelectronic component
producing
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112015005016.7T
Other languages
German (de)
Inventor
Wolfgang Mönch
Frank Singer
Thomas Schwarz
Jürgen Moosburger
Stefan Illek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112015005016A5 publication Critical patent/DE112015005016A5/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE112015005016.7T 2014-11-05 2015-11-05 Method for producing an optoelectronic component and optoelectronic component Ceased DE112015005016A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014116134.3A DE102014116134A1 (en) 2014-11-05 2014-11-05 Method for producing an optoelectronic component and optoelectronic component
DE102014116134.3 2014-11-05
PCT/EP2015/075801 WO2016071439A1 (en) 2014-11-05 2015-11-05 Method for producing an optoelectronic component, and optoelectronic component

Publications (1)

Publication Number Publication Date
DE112015005016A5 true DE112015005016A5 (en) 2017-07-27

Family

ID=54427757

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014116134.3A Withdrawn DE102014116134A1 (en) 2014-11-05 2014-11-05 Method for producing an optoelectronic component and optoelectronic component
DE112015005016.7T Ceased DE112015005016A5 (en) 2014-11-05 2015-11-05 Method for producing an optoelectronic component and optoelectronic component

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014116134.3A Withdrawn DE102014116134A1 (en) 2014-11-05 2014-11-05 Method for producing an optoelectronic component and optoelectronic component

Country Status (5)

Country Link
US (1) US10256380B2 (en)
JP (1) JP2017532786A (en)
CN (1) CN107078185A (en)
DE (2) DE102014116134A1 (en)
WO (1) WO2016071439A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018133940A1 (en) * 2017-01-19 2018-07-26 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic element
DE102017120385B4 (en) * 2017-09-05 2024-02-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Light-emitting component and method for producing a light-emitting component
DE102018127521A1 (en) * 2018-11-05 2020-05-07 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
DE102004053116A1 (en) * 2004-11-03 2006-05-04 Tridonic Optoelectronics Gmbh Light-emitting diode arrangement with color conversion material
JP5041732B2 (en) 2006-05-16 2012-10-03 アルプス電気株式会社 Luminescent body and manufacturing method thereof
JP2009081346A (en) * 2007-09-27 2009-04-16 Panasonic Corp Optical device and method for manufacturing same
DE102008011153B4 (en) 2007-11-27 2023-02-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Process for producing an arrangement with at least two light-emitting semiconductor components
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
JP5521325B2 (en) * 2008-12-27 2014-06-11 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
JP5377985B2 (en) 2009-01-13 2013-12-25 株式会社東芝 Semiconductor light emitting device
JP2011009572A (en) * 2009-06-26 2011-01-13 Citizen Electronics Co Ltd Flip-chip packaging type led and method for manufacturing flip-chip packaging type led
DE102009036621B4 (en) * 2009-08-07 2023-12-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic semiconductor component
DE102010027875A1 (en) 2010-04-16 2011-10-20 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
DE102010024864B4 (en) 2010-06-24 2021-01-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic semiconductor component
DE102010027253B4 (en) 2010-07-15 2022-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic semiconductor component
DE102010046254A1 (en) 2010-09-22 2012-04-19 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component
DE102010055265A1 (en) 2010-12-20 2012-06-21 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device
DE102011011139B4 (en) 2011-02-14 2023-01-19 Osram Opto Semiconductors Gmbh Method for producing at least one optoelectronic semiconductor component and optoelectronic semiconductor component
DE102011007328A1 (en) 2011-04-13 2012-10-18 Robert Bosch Gmbh Device and method for influencing a radiation characteristic of a light emitting diode
US20120326170A1 (en) * 2011-06-22 2012-12-27 Yong Liu Wafer level molded opto-couplers
DE102012215524A1 (en) 2012-08-31 2014-03-06 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device
DE102012113003A1 (en) 2012-12-21 2014-04-03 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
DE102013202906A1 (en) * 2013-02-22 2014-08-28 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component
DE102013202910A1 (en) 2013-02-22 2014-09-25 Osram Opto Semiconductors Gmbh Optoelectronic component and method for its production
DE102013202902B4 (en) * 2013-02-22 2021-06-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method for producing an optoelectronic component

Also Published As

Publication number Publication date
US20180287022A1 (en) 2018-10-04
JP2017532786A (en) 2017-11-02
CN107078185A (en) 2017-08-18
WO2016071439A1 (en) 2016-05-12
DE102014116134A1 (en) 2016-05-12
US10256380B2 (en) 2019-04-09

Similar Documents

Publication Publication Date Title
DE112016002417A5 (en) Optoelectronic component and method for producing an optoelectronic component
DE112013001553A5 (en) Optoelectronic component and method for producing an optoelectronic component
DE112015005232A5 (en) COMPONENT AND METHOD FOR PRODUCING A COMPONENT
DE112018001263A5 (en) Method for operating an optoelectronic component and optoelectronic component
DE112015004073A5 (en) Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
DE102014000636A8 (en) Method and device for producing an electrotechnical coil
DE112015005495A5 (en) Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
DE102014102565A8 (en) Optoelectronic component and method for producing an optoelectronic component
DE112015002048A5 (en) LIGHTING DEVICE AND METHOD FOR MANUFACTURING AN ILLUMINATOR
FI20140266A (en) Method and apparatus for preparing nanoparticles
DE112015001999A5 (en) Optoelectronic component and method for producing an optoelectronic component
DE112015003591A5 (en) Electronic component, optoelectronic component, component arrangement and method for producing an electronic component
DE112014005022A5 (en) Electronic component and method for manufacturing an electronic component
DE112015004631A5 (en) Laser component and method for its production
DE112015004068A5 (en) Method for producing an optoelectronic semiconductor component
DE112015005127A5 (en) Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
DE112013001133A5 (en) Method for producing an optoelectronic component and thus produced optoelectronic component
DE112017001889A5 (en) Optoelectronic component and method for producing an optoelectronic component
DE112015002255A5 (en) Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component
DE112015002211A5 (en) Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component
DE112015003309A5 (en) Optoelectronic assembly and method for manufacturing an optoelectronic assembly
DE112018001835A5 (en) Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
DE112015003629A5 (en) Optoelectronic component and method for its production
DE112015003413A5 (en) Method for producing acoustic damping elements
DE112017003099A5 (en) OPTOELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC COMPONENT

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final