WO2015172014A1 - Substrats de saphir de haute qualité et procédé de fabrication desdits substrats de saphir - Google Patents

Substrats de saphir de haute qualité et procédé de fabrication desdits substrats de saphir Download PDF

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Publication number
WO2015172014A1
WO2015172014A1 PCT/US2015/029875 US2015029875W WO2015172014A1 WO 2015172014 A1 WO2015172014 A1 WO 2015172014A1 US 2015029875 W US2015029875 W US 2015029875W WO 2015172014 A1 WO2015172014 A1 WO 2015172014A1
Authority
WO
WIPO (PCT)
Prior art keywords
μηι
substrate
μιη
item
μγη
Prior art date
Application number
PCT/US2015/029875
Other languages
English (en)
Inventor
Maureen A. BROSNAN
Tigran DOLUKHANYAN
Christopher D. Jones
Haykaz Garegin PAPOYAN
Ramanujam Vedantham
Original Assignee
Saint-Gobain Ceramics & Plastics, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint-Gobain Ceramics & Plastics, Inc. filed Critical Saint-Gobain Ceramics & Plastics, Inc.
Publication of WO2015172014A1 publication Critical patent/WO2015172014A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/0242—Crystalline insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/02428—Structure
    • H01L21/0243—Surface structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Cette invention concerne des substrats de saphir appropriés pour la fabrication de semi-conducteurs, caractérisés par des caractéristiques dimensionnelles et de forme supérieures. Lesdits substrats de saphir sont spécifiquement caractérisés en ce qu'ils présentent une très faible planéité locale et gobale (SFQR et GFLR) et un faible coefficient de déviation par rapport au plan (ROA). L'invention concerne en outre un procédé de fabrication de substrats de saphir présentant de très faibles coefficients GFLR SFQR et ROA, ledit procédé étant économe en temps.
PCT/US2015/029875 2014-05-09 2015-05-08 Substrats de saphir de haute qualité et procédé de fabrication desdits substrats de saphir WO2015172014A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461991186P 2014-05-09 2014-05-09
US61/991,186 2014-05-09

Publications (1)

Publication Number Publication Date
WO2015172014A1 true WO2015172014A1 (fr) 2015-11-12

Family

ID=54393044

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/029875 WO2015172014A1 (fr) 2014-05-09 2015-05-08 Substrats de saphir de haute qualité et procédé de fabrication desdits substrats de saphir

Country Status (1)

Country Link
WO (1) WO2015172014A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105856441A (zh) * 2016-06-13 2016-08-17 江苏吉星新材料有限公司 一种大尺寸蓝宝石晶体的c向定向技术
CN109290853A (zh) * 2017-07-24 2019-02-01 蓝思科技（长沙）有限公司 一种超薄蓝宝石片的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040087146A1 (en) * 2002-10-31 2004-05-06 Strasbaugh, A California Corporation Method of preparing whole semiconductor wafer for analysis
US20110160890A1 (en) * 2009-12-29 2011-06-30 Memc Electronic Materials, Inc. Methods For Generating Representations of Flatness Defects on Wafers
US20120289126A1 (en) * 2006-12-28 2012-11-15 Saint-Gobain Ceramics & Plastics, Inc. Sapphire substrates and methods of making same
US20120286818A1 (en) * 2011-05-11 2012-11-15 Qualcomm Incorporated Assembly for optical backside failure analysis of wire-bonded device during electrical testing
US20140117380A1 (en) * 2012-10-26 2014-05-01 Dow Corning Corporation Flat sic semiconductor substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040087146A1 (en) * 2002-10-31 2004-05-06 Strasbaugh, A California Corporation Method of preparing whole semiconductor wafer for analysis
US20120289126A1 (en) * 2006-12-28 2012-11-15 Saint-Gobain Ceramics & Plastics, Inc. Sapphire substrates and methods of making same
US20110160890A1 (en) * 2009-12-29 2011-06-30 Memc Electronic Materials, Inc. Methods For Generating Representations of Flatness Defects on Wafers
US20120286818A1 (en) * 2011-05-11 2012-11-15 Qualcomm Incorporated Assembly for optical backside failure analysis of wire-bonded device during electrical testing
US20140117380A1 (en) * 2012-10-26 2014-05-01 Dow Corning Corporation Flat sic semiconductor substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105856441A (zh) * 2016-06-13 2016-08-17 江苏吉星新材料有限公司 一种大尺寸蓝宝石晶体的c向定向技术
CN109290853A (zh) * 2017-07-24 2019-02-01 蓝思科技（长沙）有限公司 一种超薄蓝宝石片的制备方法
CN109290853B (zh) * 2017-07-24 2021-06-04 蓝思科技（长沙）有限公司 一种超薄蓝宝石片的制备方法

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