WO2015166835A1 - Antenna device and communication terminal device - Google Patents

Antenna device and communication terminal device Download PDF

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Publication number
WO2015166835A1
WO2015166835A1 PCT/JP2015/062038 JP2015062038W WO2015166835A1 WO 2015166835 A1 WO2015166835 A1 WO 2015166835A1 JP 2015062038 W JP2015062038 W JP 2015062038W WO 2015166835 A1 WO2015166835 A1 WO 2015166835A1
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WO
WIPO (PCT)
Prior art keywords
conductor pattern
antenna device
capacitor
coil
main surface
Prior art date
Application number
PCT/JP2015/062038
Other languages
French (fr)
Japanese (ja)
Inventor
伊藤宏充
Original Assignee
株式会社村田製作所
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2016516323A priority Critical patent/JPWO2015166835A1/en
Publication of WO2015166835A1 publication Critical patent/WO2015166835A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to an antenna device and a communication terminal device used in a communication system of HF band or UHF band.
  • a conventional non-contact type IC card includes a resonance circuit composed of a coil formed of a conductor pattern formed in a loop shape on the peripheral edge of a card substrate and a capacitor mounted on the card substrate, and the resonance circuit resonates. Power is supplied to other circuits in the non-contact IC card by the voltage generated by this, and the circuit operates.
  • Patent Document 1 discloses a non-contact type IC card in which a capacitor is provided by forming a conductor pattern on both surfaces of a base material.
  • Patent Document 1 does not describe the thickness of a loop-shaped conductor pattern forming a coil or a conductor pattern forming a capacitor.
  • a coil having a particularly long line length is required.
  • the conductor loss increases and the antenna characteristics deteriorate due to the conductor pattern.
  • An object of the present invention is to provide an antenna device and a communication terminal device including the antenna device that can reduce the thickness of the entire antenna without degrading the characteristics of the antenna.
  • the antenna device of the present invention A base material layer having a first main surface and a second main surface and made of an insulator; a first main surface side conductor pattern formed on the first main surface of the base material layer; In an antenna device provided with the 2nd principal surface side conductor pattern formed on two principal surfaces, The second main surface side conductor pattern is thinner than the first main surface side conductor pattern,
  • the first main surface side conductor pattern includes a coil conductor pattern having a loop shape or a spiral shape, a first capacitor conductor pattern connected to a first end of the coil conductor pattern, and a first conductor pattern of the coil conductor pattern.
  • the second main surface side conductor pattern includes a third capacitor conductor pattern facing the first capacitor conductor pattern across the base material layer, and the second capacitor conductor across the base material layer.
  • a fourth capacitor conductor pattern facing the conductor pattern is provided.
  • the antenna device can be thinned.
  • connection conductor pattern for connecting the third capacitor conductor pattern and the fourth capacitor conductor pattern.
  • the LC resonance circuit is provided without providing an interlayer connection conductor such as a via for connection between the capacitor and the coil. Since it can be formed, the manufacturing cost can be reduced. In addition, the possibility of problems such as poor contact occurring is reduced.
  • the said 3rd capacitor conductor pattern or the said 4th capacitor conductor pattern is comprised by the some conductor piece and the linear connection conductor pattern which connects them.
  • the connecting conductor pattern is narrower than the width of the conductor piece, it is easier to separate the conductor pieces than in the case of a single planar conductor pattern, and the conductor pieces may be damaged or deformed during the separation. This makes it difficult for the capacity to fluctuate.
  • a plurality of conductor pieces can be separated at a time, the capacity can be easily adjusted.
  • the plurality of conductor pieces and the connecting conductor pattern which are part of the second main surface side conductor pattern are formed thinner than the first main surface side conductor pattern. Therefore, the conductor pieces can be easily separated from each other, dust generated when the conductor pieces are separated from each other is reduced, and the possibility of a change in capacitance or a short circuit due to the dust is low.
  • connection conductor pattern is preferably arranged so as to avoid a position overlapping the coil conductor pattern, the first capacitor conductor pattern, and the second capacitor conductor pattern in plan view. .
  • the first main surface side conductor pattern (the coil conductor pattern, the first capacitor conductor pattern, and the second capacitor conductor pattern) is not damaged when the conductor pieces are separated. Only the conductor pattern is removed by punching or trimming. Therefore, when the conductor piece is separated by punching or the like, the possibility of occurrence of a short circuit between the capacitor conductive patterns facing each other with the base material layer interposed therebetween can be reduced.
  • the feeding coil can be disposed at a relatively free position in the vicinity of the coil conductor pattern.
  • the power feeding coil overlaps the first capacitor conductor pattern, the second capacitor conductor pattern, the third capacitor conductor pattern, and the fourth capacitor conductor pattern in a plan view. It is preferable that they are arranged at positions that do not become necessary. With this configuration, the coupling degree of electromagnetic field coupling between the coil conductor pattern and the feeding coil can be further increased.
  • a communication terminal device of the present invention includes a housing and an antenna device installed inside the housing, and the antenna device has the configuration described in any one of (1) to (6) above. It is characterized by being.
  • a planar conductor disposed opposite to the coil conductor pattern of the antenna device is provided.
  • the planar conductor acts as a radiating portion of the antenna device, and an effective opening is increased. Therefore, the gain of the antenna is improved and the antenna characteristics are improved as compared with the case of only the antenna device.
  • the first capacitor conductor pattern, the second capacitor conductor pattern, the third capacitor conductor pattern, and the fourth capacitor conductor pattern of the antenna device are the coil conductor. It is preferable that the distance from the winding axis of the pattern to the outer edge of the planar conductor is arranged so as not to overlap the line connecting the position of the outer edge and the winding axis that is the shortest in plan view. With this configuration, it is possible to efficiently concentrate the magnetic flux and increase the degree of coupling of electromagnetic field coupling between the coil conductor pattern and the planar conductor.
  • the present invention it is possible to configure an antenna device in which the entire antenna is thinned and a communication terminal device including the antenna device without degrading the characteristics of the antenna.
  • FIG. 1A is a plan view of the antenna device 101 according to the first embodiment
  • FIG. 1B is a front view of the antenna device 101 according to the first embodiment
  • 2A is a plan view of the first main surface side conductor pattern 11 included in the antenna device 101
  • FIG. 2B is a plan view of the second main surface side conductor pattern 12 included in the antenna device 101
  • 3A is a plan view of the antenna device 102A according to the second embodiment
  • FIG. 3B is a plan view of the antenna device 102B
  • FIG. 3C is a plan view of the antenna device 102C
  • FIG. FIG. 4 is a plan view of the antenna device 103 according to the third embodiment.
  • FIG. 5A is a plan view of an antenna device 104A according to the fourth embodiment, and FIG. 5B is a cross-sectional view taken along line AA in FIG. 5A.
  • 6A is a plan view of the antenna device 104B, and FIG. 6B is a cross-sectional view taken along line BB in FIG. 6A.
  • FIG. 7 is a plan view of an antenna device 105 according to the fifth embodiment.
  • FIG. 8A is a plan view of the main part of a communication terminal apparatus according to the fifth embodiment.
  • FIG. 8B is a front view of the main part of the communication terminal apparatus according to the fifth embodiment.
  • FIG. 9 is a plan view of an antenna device 106 according to the sixth embodiment.
  • FIG. 10A is a plan view of the main part of a communication terminal apparatus according to the sixth embodiment.
  • FIG. 10B is a front view of the main part of the communication terminal apparatus according to the sixth embodiment.
  • FIG. 11 is a plan view of an antenna device 107 according to the seventh embodiment.
  • FIG. 12A is a cross-sectional view of a communication terminal apparatus 201A according to the eighth embodiment.
  • FIG. 12B is a cross-sectional view of another communication terminal apparatus 201B according to the eighth embodiment.
  • FIG. 13A is a plan view of the main part of a communication terminal apparatus according to the ninth embodiment.
  • FIG. 13B is a front view of the main part of the communication terminal apparatus according to the ninth embodiment.
  • FIG. 14A is a plan view of the main part of another communication terminal apparatus according to the ninth embodiment.
  • FIG. 14B is a front view of the main part of another communication terminal apparatus according to the ninth embodiment.
  • FIG. 15A is a plan view of a communication terminal apparatus 202 according to the tenth embodiment.
  • FIG. 15B is a cross-sectional view of the communication terminal apparatus 202 according to the tenth embodiment.
  • FIG. 16 is an exploded plan view of the communication terminal device 203 according to the eleventh embodiment.
  • FIG. 17 is an explanatory diagram of the positional relationship between the planar conductor and the antenna device.
  • the antenna apparatus is an antenna apparatus for transmitting and receiving an HF band (such as 13.56 MHz band) high-frequency signal provided in a communication terminal typified by a smartphone or a tablet terminal.
  • an HF band such as 13.56 MHz band
  • FIG. 1A is a plan view of the antenna device 101 according to the first embodiment, and FIG. 1B is a front view thereof.
  • 2A is a plan view of the first main surface side conductor pattern 11 included in the antenna device 101
  • FIG. 2B is a plan view of the second main surface side conductor pattern 12 included in the antenna device 101.
  • the antenna device 101 includes an insulating base material layer 21 having a first main surface and a second main surface.
  • the first main surface side conductor pattern 11 is formed on the first main surface of the base material layer 21, and the second main surface side conductor pattern 12 is formed on the second main surface of the base material layer 21.
  • the second main surface side conductor pattern 12 is thinner than the first main surface side conductor pattern 11. In FIG. 1B, the thickness of each portion is exaggerated. The same applies to front views in the following embodiments.
  • the first main surface side conductor pattern 11 includes a loop-shaped or spiral-shaped coil conductor pattern 13, a first capacitor conductor pattern 14, and a second capacitor conductor pattern 15.
  • a first capacitor conductor pattern 14 is connected to the first end of the coil conductor pattern 13, and a second capacitor conductor pattern 15 is connected to the second end of the coil conductor pattern 13. Yes.
  • the coil conductor pattern 13 functions as a radiating element.
  • the second main surface side conductor pattern 12 includes a third capacitor conductor pattern 16 and a fourth capacitor conductor pattern 17.
  • the third capacitor conductor pattern 16 and the fourth capacitor conductor pattern 17 are connected by a connection conductor pattern 20.
  • the first capacitor conductor pattern 14 and the third capacitor conductor pattern 16 constitute a first capacitor by facing each other with the base material layer 21 in between, and the second capacitor conductor pattern 15 and the fourth capacitor
  • the conductive pattern 17 constitutes a second capacitor by facing the base material layer 21 therebetween.
  • the two capacitors are electrically connected by a connection conductor pattern 20 that connects between the third capacitor conductor pattern 16 and the fourth capacitor conductor pattern 17.
  • the two capacitors and the coil conductor pattern 13 form a closed loop and constitute an LC resonance circuit. A method for supplying power to the antenna device 101 will be described in detail later.
  • the shape and size of the capacitor conductor patterns (14 and 16, or 15 and 17) facing each other with the base material layer 21 in between are substantially the same in plan view. It is not limited and can be changed arbitrarily.
  • the size of one capacitor conductor pattern (14 or 15) is made larger than the other capacitor conductor pattern (16 or 17) facing the base material layer 21 and overlaps so as to cover in plan view.
  • the vertical width of the fourth capacitor conductor pattern 17 in FIG. 1 is larger than that of the second capacitor conductor pattern 15, and the second capacitor conductor pattern 15 and the coil conductor pattern 13 are There are also configurations such that the book and the base material layer 21 are opposed to each other.
  • the capacitor conductive patterns (14, 15, 16, 17) are all rectangular, but are not limited to the shape of the present embodiment and can be arbitrarily changed.
  • the capacitor conductor patterns (14, 16) facing each other across the base material layer 21 are not formed only on the upper side as in the antenna device 101 in FIG. There are configurations.
  • the base material layer 21 is, for example, a PET (polyethylene-terephthalate) film, and the first main surface side conductor pattern and the second main surface side conductor pattern are, for example, aluminum (Al) foil. Therefore, the antenna device 101 has a structure of Al-PET-Al (second main surface side conductor pattern 12-base material layer 21-first main surface side conductor pattern 11) in order from the top in FIG.
  • the thickness of each layer is, for example, 10 ⁇ m-40 ⁇ m-30 ⁇ m (second main surface side conductor pattern 12-base material layer 21-first main surface side conductor pattern 11) in order from the top in FIG. 1B.
  • the first main surface side conductor pattern 11 is formed thicker than the second main surface side conductor pattern 12.
  • the antenna device 101 is manufactured by the following process, for example.
  • a film is prepared by laminating a 10 ⁇ m Al foil on a first main surface and a 30 ⁇ m Al foil on a second main surface of a PET film having a thickness of 40 ⁇ m.
  • An etching resist film for forming a first main surface side conductor pattern is printed on the first main surface of the laminate film and dried.
  • An etching resist film for forming a second main surface side conductor pattern is printed on the second main surface of the laminate film and dried.
  • a first main surface side conductor pattern and a second main surface side conductor pattern are formed by etching the laminate film. Thereafter, the etching resist film is removed.
  • a mask pattern may be overlaid on the photoresist film, and the etching resist film may be patterned by development and baking.
  • the first main surface side conductor pattern and the second main surface side conductor pattern do not need to be directly formed on the film (base material layer), and the first main surface side conductor pattern and the second main surface are interposed via the adhesive layer.
  • You may form a side conductor on a film (base material layer).
  • both the first main surface side conductor pattern and the second main surface side conductor pattern need not be Al foil.
  • the first main surface side conductor pattern and the second main surface side conductor pattern may be made of different materials such that one conductor pattern is an Al foil and the other conductor pattern is a Cu foil.
  • the conductor loss of the coil conductor pattern 13 is suppressed, and the antenna It is possible to prevent deterioration of characteristics.
  • the antenna device 101 has a configuration in which a first capacitor and a second capacitor are formed in the winding axis direction of the coil conductor pattern 13. Unlike the first main surface side conductor pattern 11, the second main surface side conductor pattern formed by only the third capacitor conductor pattern 16 and the fourth capacitor conductor pattern 17 has a wide line width, and The track length is extremely short. The current flowing through the capacitor conductor patterns 16 and 17 flows as a displacement current in the thickness direction of the base material layer 21 rather than in the longitudinal direction of the pattern. Therefore, even if the second main surface side conductor pattern 12 is formed thinner than the first main surface side conductor pattern 11, almost no conductor loss occurs in the capacitor conductor patterns 16 and 17. Therefore, by forming the second main surface side conductor pattern 12 thinner than the first main surface side conductor pattern 11, the antenna device can be thinned without deteriorating the antenna characteristics.
  • the antenna device 101 does not require an interlayer connection conductor such as a via for connection between the coil and the capacitor, the manufacturing cost can be reduced. In addition, the possibility of problems such as poor contact occurring is reduced.
  • 3A is a plan view of the antenna device 102A according to the second embodiment
  • FIG. 3B is a plan view of the antenna device 102B
  • FIG. 3C is a plan view of the antenna device 102C. is there.
  • the fourth capacitor conductor pattern 17 is not a single planar conductor pattern as shown in FIG. 1 or the like, but a linear shape connecting a plurality of conductor pieces 18 and the conductor pieces.
  • the connection conductor pattern 19 is formed. Since this connecting conductor pattern 19 is narrower than the width of the conductor piece 18, it is easier to separate the conductor pieces than in the case of one planar conductor pattern, and the conductor piece 18 is damaged or deformed during the separation. It is difficult for fluctuations in capacity due to Further, since the plurality of conductor pieces 18 can be separated at a time, the capacity can be easily adjusted.
  • the plurality of conductor pieces 18 and the connecting conductor pattern 19 which are part of the second main surface side conductor pattern are formed thinner than the first main surface side conductor pattern. Therefore, the conductor pieces can be easily separated from each other, dust generated when the conductor pieces are separated from each other is reduced, and the possibility of a change in capacitance or a short circuit due to the dust is low.
  • the connecting conductor pattern 19 is a first main surface side conductor pattern (coil conductor pattern 13 and first capacitor conductor pattern 14).
  • the second capacitor conductor pattern 15) is disposed so as to avoid (bypass) a position overlapping with the second capacitor conductor pattern 15) in plan view.
  • the first main surface side conductor pattern (coil pattern 13 for coil, conductor pattern 14 for first capacitor, conductor pattern 15 for second capacitor) is damaged. Only the connecting conductor pattern 19 is removed by punching or trimming. Therefore, there is a low possibility that a short circuit will occur between the capacitor conductive patterns facing each other across the base material layer 21.
  • the resonance frequency of the antenna device at the time of manufacture is set lower than the desired resonance frequency, and the capacitance per unit quantity of the conductor pieces 18 constituting the capacitor is examined in advance.
  • the resonance frequency is measured after the antenna device is mounted, and the number of conductor pieces 18 to be separated is calculated from the relationship between the measured value and the desired resonance frequency.
  • the conductor piece 18 is electrically separated by cutting the connecting conductor pattern 19 in a portion not overlapping with the first main surface side conductor pattern in plan view by laser trimming or the like, and adjusted to a desired resonance frequency. By adjusting the position where the connection conductor pattern 19 is cut, the plurality of conductor pieces 18 can be separated by a small number of trimmings.
  • two cuts are made at a time in the connecting conductor pattern 19 connecting the second and third conductor pieces 18 from the right in the drawing, so that two pieces are formed at a time.
  • the conductor pieces 18 can be separated at a time.
  • a larger number of conductor pieces 18 can be separated at a time by making cuts in the connecting conductor pattern 19 located closer to the connecting conductor pattern 20.
  • FIGS. 3A, 3B, and 3C show an example in which the fourth capacitor conductor pattern 17 includes six conductor pieces 18, the number of conductor pieces 18 is not limited to six. There may be more than one.
  • the configuration in which the capacitor conductor pattern is formed by the plurality of conductor pieces 18 and the connecting conductor pattern 19 is not limited to the fourth capacitor conductor pattern 17 shown in FIGS. 3 (A), (B), and (C).
  • the third capacitor conductor pattern 16 may be applied. Further, the present invention may be applied to both the third capacitor conductor pattern 16 and the fourth capacitor conductor pattern 17.
  • connection conductor pattern 19 and the connection conductor pattern 20 are not limited to the examples of the present embodiment.
  • FIG. 4 is a plan view of the antenna device 103 according to the third embodiment.
  • the antenna device 103 according to the third embodiment includes a base material layer 22 made of a material (dielectric material) having a high dielectric constant, and the other configuration is the same as that of the antenna device 102B according to the second embodiment. is there.
  • the base material layer 22 is, for example, a sheet obtained by filling a PPE resin base with a high dielectric constant inorganic filler.
  • the capacitance of the first capacitor configured by the first capacitor conductor pattern 14 and the third capacitor conductor pattern 16 facing each other with the base material layer 22 interposed therebetween is increased. can do.
  • the capacitance of the second capacitor formed by the second capacitor conductor pattern 15 and the fourth capacitor conductor pattern 17 facing each other with the base material layer 22 interposed therebetween can be increased.
  • the use of various materials having different dielectric constants for the base material layer 22 enables a wide range of capacitance adjustment.
  • FIG. 5A is a plan view of an antenna device 104A according to the fourth embodiment
  • FIG. 5B is a cross-sectional view taken along line AA in FIG. 5A.
  • the thickness of each part is exaggerated.
  • the antenna device 104A according to the fourth embodiment includes the base material layer 23 that is a magnetic body, and the other configuration is the same as that of the antenna device 102B according to the second embodiment. According to this embodiment, the magnetic flux collecting effect of the magnetic flux passing through the opening of the coil conductor pattern 13 can be enhanced, and the antenna characteristics are improved.
  • the degree of coupling between the coil conductor pattern 13 and the feeding coil that is electromagnetically coupled can be increased.
  • the coupling between the coil conductor pattern 13 and the power feeding coil to be electromagnetically coupled is strengthened.
  • the electromagnetic field coupling between the coil conductor pattern and the feeding coil will be described in detail later.
  • the term “electromagnetic field coupling” as used herein means a state in which at least one of electric field coupling or magnetic field coupling occurs, and includes a state in which both electric field coupling and magnetic field coupling occur (refer to “electromagnetic field coupling in this specification”). "Has the same meaning).
  • FIG. 6A is a plan view of the antenna device 104B
  • FIG. 6B is a cross-sectional view taken along the line BB in FIG. 6A.
  • the antenna device 104B has a magnetic sheet 24A having the same thickness as that of the first main surface side conductor pattern 11 attached to the first main surface side of the antenna device 103 according to the third embodiment. Further, a magnetic sheet 24B having the same thickness as that of the second main surface side conductor pattern 12 is attached to the second main surface side.
  • the magnetic material sheet 24 ⁇ / b> A is attached to a position that does not overlap the first main surface side conductor pattern 11 and is close to the coil conductor pattern 13.
  • the magnetic material sheet 24B is affixed on the position which does not overlap with the 2nd main surface side conductor pattern. According to this embodiment, the magnetic flux collecting effect of the magnetic flux passing through the opening of the coil conductor pattern 13 can be enhanced, and the antenna device can be thinned.
  • the magnetic sheets 24A and 24B are attached to the base material layer 22. However, they may be attached directly on the respective conductor patterns.
  • FIG. 7 is a plan view of an antenna device 105 according to the fifth embodiment.
  • An RFIC 31 is mounted on the base material layer 22 of the antenna device 105.
  • the RFIC 31 is connected between the first capacitor conductor pattern 14 and the second capacitor conductor pattern 15 of the antenna device 105 via a power supply connection conductor 32.
  • the antenna device 105 is an LC circuit, and constitutes an LC parallel resonance circuit together with the RFIC 31.
  • the RFIC 31 may be installed not on the antenna device but on a circuit board or a communication terminal device.
  • FIG. 8A is a plan view of the main part of a communication terminal apparatus according to the fifth embodiment.
  • FIG. 8B is a front view thereof.
  • This communication terminal device includes an antenna device 103, an RFIC 31, and a circuit board 35.
  • the antenna device 103 and the RFIC 31 are installed on the circuit board 35, and the RFIC 31 is connected between the first capacitor conductor pattern 14 and the second capacitor conductor pattern 15 via the power supply connection conductor 32. .
  • the antenna device 103 and the RFIC 31 constitute an LC parallel resonance circuit.
  • the antenna device 103 is the same as the antenna device 103 shown in the third embodiment.
  • the magnetic sheet may be arranged between the circuit board 35 and the coil conductor pattern 13. By disposing a magnetic sheet between the circuit board 35 and the coil conductor pattern 13, it is possible to suppress unnecessary coupling with electronic components, wiring patterns, and the like on the circuit board 35.
  • the antenna device 105 may be installed with either one of the first main surface and the second main surface of the base material layer 22 facing the circuit board 35.
  • the connection point of the connection conductor for use 32 is the first main surface side. Therefore, in this case, wiring on the circuit board 35 is easier if the first main surface is the surface on which the circuit board 35 is installed.
  • the shape of the circuit board 35 is rectangular, but is not limited to the shape of the present embodiment, and can be arbitrarily changed.
  • FIG. 9 is a plan view of an antenna device 106 according to the sixth embodiment.
  • the antenna device 106 includes a feeding coil 34, a matching capacitor 33, and an RFIC 31 on the base material layer 22 in addition to an LC resonance circuit that is a closed loop.
  • the feeding coil 34, the matching capacitor 33, and the RFIC 31 are connected by a feeding connecting conductor 32.
  • the feeding coil 34 is a primary side coil
  • the coil conductor pattern 13 is a secondary side coil
  • these two coils are electromagnetic. Bounded.
  • the feeding coil 34 can be disposed in a relatively free position in the vicinity of the coil conductor pattern 13. it can. Further, by bringing the opening of the coil conductor pattern 13 close to the opening of the feeding coil 34, the coupling degree of electromagnetic field coupling can be increased. However, when there is a capacitor conductor pattern (16, 18 or the like) in the vicinity of the feeding coil 34, the magnetic flux near the capacitor conductor pattern is reduced or along the surface so as to avoid the capacitor conductor pattern. Since the magnetic flux spreads, the coupling degree of the electromagnetic field coupling becomes small. Therefore, it is preferable to arrange the feeding coil 34 at a position (Z1 in FIG. 9) that does not overlap the capacitor conductor pattern in plan view.
  • FIG. 10A is a plan view of the main part of the communication terminal apparatus according to the sixth embodiment.
  • FIG. 10B is a front view thereof.
  • the communication terminal device includes an antenna device 103, an RFIC 31, a matching capacitor 33, a feeding coil 34, and a circuit board 35.
  • the antenna device 103, the RFIC 31, the matching capacitor 33, and the feeding coil 34 are all mounted on the circuit board 35.
  • the feeding coil 34, the matching capacitor 33, and the RFIC 31 are connected by a feeding connecting conductor 32.
  • the coil conductor pattern 13 is electromagnetically coupled to the feeding coil 34.
  • the shape of the circuit board 35 is rectangular, but is not limited to the shape of the present embodiment, and can be arbitrarily changed.
  • the magnetic sheet may be arranged between the circuit board 35 and the coil conductor pattern 13.
  • the antenna device 103 does not need to be directly connected to the RFIC 31 with respect to the coil conductor pattern 13, one of the first main surface and the second main surface of the base material layer 22 is installed on the circuit board 35. May be.
  • the coupling degree of electromagnetic field coupling is improved by using the first main surface on which the coil conductor pattern 13 is formed as the installation surface with respect to the circuit board 35. Is advantageous.
  • the feeding coil 34 may be installed on either the surface on which the antenna device of the circuit board 35 is installed or a surface different from the surface on which the antenna device of the circuit board 35 is installed.
  • 10A and 10B when the feeding coil 34 and the antenna device 103 are installed on the same surface of the circuit board 35, the number of circuit elements installed on the circuit board 35 increases. There is a possibility that the arrangement position is restricted. However, since the distance between the feeding coil 34 and the coil conductor pattern 13 is close, the coupling degree of electromagnetic coupling can be increased. On the contrary, when the feeding coil 34 and the antenna device are installed on different surfaces of the circuit board 35, the distance between the feeding coil 34 and the coil conductor pattern 13 is long, so that the coupling degree of electromagnetic coupling is lowered. However, since the number of circuit elements to be installed on the circuit board 35 is reduced, the possibility of being limited in the arrangement position is low.
  • the feeding coil 34 is a chip coil having the following configuration.
  • the power supply coil 34 is configured by a resin multilayer member in which an insulating layer is laminated, a sintered ceramic (including ferrite) multilayer member, or the like.
  • Interlayer connection conductors in which a plurality of linear conductor patterns extending in parallel to each other in a plane direction are formed in two predetermined layers of the plurality of layers, and the ends of the linear conductors are connected to the plurality of layers (Via conductor) is formed.
  • the helical coil along the horizontal square tube is formed in the laminated body.
  • Two terminals that are electrically connected to both ends of the coil are formed on the lower surface of the laminate.
  • the coil winding axis of the power feeding coil 34 is in the surface direction of the circuit board and is in the direction interlinking with the coil conductor pattern 13. Therefore, the chip coil and the coil conductor pattern 13 are electromagnetically coupled.
  • FIG. 11 is a plan view of an antenna device 107 according to the seventh embodiment.
  • the configuration of the antenna device 107 is substantially the same as that of the antenna device 105, but a connecting conductor that electrically connects the third capacitor conductor pattern 16 and the connecting conductor pattern 19 (fourth capacitor conductor pattern).
  • the antenna device 107 does not have a pattern (20 shown in FIG. 3B).
  • the antenna device 107 includes the RFIC 31 on the base material layer 22.
  • the RFIC 31 is connected between the third capacitor conductor pattern 16 and the connecting conductor pattern 19 (fourth capacitor conductor pattern) via a power supply connection conductor 32.
  • the RFIC 31 is connected in series between the first capacitor and the second capacitor to form an LC series resonance circuit.
  • the connection point of the power supply connecting conductor 32 connecting the third capacitor conductor pattern 16 and the connecting conductor pattern 19 and the RFIC 31 is the second. It becomes the main surface side. Therefore, in this case, the antenna device 107 can be easily wired on the circuit board when the second main surface of the base material layer 22 is the installation surface with respect to the circuit board.
  • FIG. 12A is a cross-sectional view of a communication terminal apparatus 201A according to the eighth embodiment.
  • the communication terminal device 201 ⁇ / b> A includes a housing 37, a circuit board 35 housed inside the housing 37, and the antenna device 103.
  • the antenna device 103 is installed on the inner wall surface of the casing 37, and the circuit board 35 is disposed to face the antenna device 103.
  • the antenna device 103 is the same as the antenna device 103 shown in the third embodiment. Since circuit elements are mounted on the surface of the circuit board 35 facing the antenna device 103, there is a gap between the antenna apparatus 103 and the circuit board 35 so that the circuit elements can be mounted.
  • An RFIC 31 that is a circuit element is mounted on the circuit board 35.
  • the RFIC 31 is connected to the antenna device 103 via the power supply connection conductor 32.
  • the power supply connection conductor 32 that electrically connects the gap between the circuit board 35 and the antenna device 103 is, for example, a spring pin.
  • the antenna device 103 is installed on the inner wall surface of the housing 37, so that the circuit element mounted on the circuit board 35 is compared with the case where the antenna device is mounted on the circuit board 35. Therefore, the degree of freedom regarding the arrangement of the circuit elements and the antenna device is high.
  • the magnetic sheet may be arranged between the circuit board 35 and the coil conductor pattern 13.
  • FIG. 12B is a cross-sectional view of another communication terminal apparatus 201B according to the eighth embodiment.
  • the communication terminal device 201B includes a housing 37, a circuit board 35 housed in the housing 37, and the antenna device 103.
  • the antenna device 103 is installed on the inner wall surface of the casing 37, and the circuit board 35 is disposed to face the antenna device 103. Since circuit elements are mounted on the surface of the circuit board 35 facing the antenna device 103, there is a gap between the antenna apparatus 103 and the circuit board 35 so that the circuit elements can be mounted.
  • the RFIC 31 which is a circuit element, a matching capacitor 33, and a feeding coil 34 are mounted.
  • the feeding coil 34 is electromagnetically coupled to the coil conductor pattern 13 of the antenna device 107. Since it is not necessary to directly connect the RFIC 31 and the antenna device, the feeding coil 34 can be disposed in a relatively free position as long as it is in the vicinity of the coil conductor pattern.
  • positioned between the circuit board 35 and the conductor pattern 13 for coils may be sufficient.
  • the magnetic sheet By disposing a magnetic sheet between the circuit board 35 and the coil conductor pattern 13, it is possible to suppress unnecessary coupling with electronic components, wiring patterns, and the like on the circuit board 35.
  • the magnetic sheet When a magnetic sheet is disposed between the circuit board 35 and the coil conductor pattern 13, the magnetic sheet may be disposed so as to avoid a region where the feeding coil 34 and the coil conductor pattern 13 face each other. As described above, the magnetic sheet is disposed so as to avoid the region where the feeding coil 34 and the coil conductor pattern 13 are opposed to each other, thereby preventing the magnetic sheet from hindering the coupling between the feeding coil 34 and the coil conductor pattern 13. .
  • FIG. 13A is a plan view of the main part of a communication terminal apparatus according to the ninth embodiment.
  • FIG. 13B is a front view thereof.
  • This communication terminal device includes an antenna device 103 and a circuit board 36.
  • the antenna device 103 is mounted on a circuit board 36, and the circuit board 36 is a multilayer board having a planar conductor 41 as a ground pattern therein.
  • the RFIC is also installed on the circuit board 36.
  • the RFIC is directly connected to the antenna device 103 via a feeding connection conductor, and constitutes an LC parallel resonance circuit.
  • the coil conductor pattern of the antenna device 103 and the planar conductor 41 are arranged to face each other, and the coil conductor pattern 13 and the planar conductor 41 are electromagnetically coupled. That is, since the planar conductor 41 acts as a radiating portion of the antenna device 103 and an effective aperture is increased, the antenna gain is improved and the antenna characteristics are improved as compared with the case of the antenna device 103 alone. .
  • FIG. 14A is a plan view of the main part of another communication terminal apparatus according to the ninth embodiment.
  • FIG. 14B is a front view thereof.
  • the communication terminal device includes an antenna device 103, a feeding coil 34, and a circuit board 36.
  • the antenna device 103 and the feeding coil 34 are mounted on a circuit board 36, and the circuit board 36 is a multilayer board having a conductive planar conductor 41 therein.
  • the RFIC and the matching capacitor are also installed on the circuit board 36 similarly to the feeding coil 34.
  • the feeding coil 34, the matching capacitor, and the RFIC are connected by a feeding connecting conductor.
  • the coil conductor pattern of the antenna device 103 is electromagnetically coupled to the feeding coil 34.
  • the feeding coil 34 is disposed in the vicinity of the coil conductor pattern 13 of the antenna device 103, and the feeding coil 34 and the coil conductor pattern 13 are electromagnetically coupled. Further, the coil conductor pattern of the antenna device 103 and the planar conductor 41 are arranged to face each other, and the coil conductor pattern 13 and the planar conductor 41 are electromagnetically coupled. Since the planar conductor 41 acts as a radiating portion of the antenna device 103 and an effective aperture is increased, the antenna gain is improved and the antenna characteristics are improved as compared with the case of the antenna device 103 alone.
  • the feeding coil 34, the coil conductor pattern 13, and the planar conductor 41 are electromagnetically coupled to each other.
  • the relationship of electromagnetic field coupling is at least one of the following.
  • the capacitor conductor pattern of the antenna device has an outer edge (in FIG. 17) where the distance from the winding axis of the coil conductor pattern 13 (46 in FIG. 17 described later) to the outer edge of the planar conductor 41 is the shortest. 47) and the line connecting the winding axis (48 in FIG. 17) so as not to overlap in plan view.
  • the capacitor conductor pattern of the antenna device is disposed at a position that does not overlap the outer edge (and the feeding coil 34) of the planar conductor 41 in plan view.
  • the capacitor conductor pattern of the antenna device is not arranged at a position along the vicinity of the outer edge (and the feeding coil 34) of the planar conductor 41 in plan view.
  • the vertical width of the planar conductor 41 (and the circuit board 36) and the width of the antenna device 103 are substantially the same length.
  • FIG. 17 is an explanatory diagram of the positional relationship between the planar conductor and the antenna device.
  • the vertical and horizontal widths of the planar conductor 41 are sufficiently wider than the width of the antenna device.
  • it is almost the same as the communication terminal apparatus shown in FIG. Even in this case, it is preferable to satisfy any one of the above configurations (1) to (3) in order to efficiently perform electromagnetic field coupling.
  • planar conductor 41 is the ground electrode of the circuit board 36
  • the conductor pattern of the antenna device 103 contacts the planar conductor 41
  • desired antenna characteristics cannot be obtained. Therefore, as in the present embodiment, an antenna plate 103 is sandwiched between the antenna device 103 and the planar conductor 41, or a gap is provided between the antenna device 103 and the planar conductor 41, so that the antenna It is desirable to prevent the device 103 and the planar conductor 41 from contacting each other.
  • the circuit board 36 is a multilayer board provided with a planar conductor 41 as a ground pattern therein, but is not limited to the configuration of the present embodiment and can be arbitrarily changed.
  • a planar conductor 41 as a ground pattern therein, but is not limited to the configuration of the present embodiment and can be arbitrarily changed.
  • the shape of the planar conductor 41 is the same rectangle as that of the circuit board 36, but is not limited to the shape of the present embodiment and can be arbitrarily changed.
  • positioned between the circuit board 36 and the conductor pattern 13 for coils may be sufficient.
  • unnecessary coupling that does not contribute to communication between the electronic component, the wiring pattern, the planar conductor 41, etc. on the circuit board 36. Can be suppressed.
  • FIG. 15A is a plan view of a communication terminal apparatus 202 according to the tenth embodiment.
  • FIG. 15B is a cross-sectional view of the communication terminal apparatus 202 according to the tenth embodiment.
  • the upper casing 38 of the communication terminal device is made of metal and acts as a planar conductor.
  • the communication terminal device 202 includes an upper casing 38, an antenna device 103, standing wave antenna radiation elements 61 and 62, a display glass 39, a circuit board 35, and the like.
  • the upper casing 38 and the radiating elements 61 and 62 of the standing wave antenna constitute a part of the casing of the communication terminal device 202.
  • the radiating elements 61 and 62 of the standing wave antenna are conductive, and are radiating elements that generate a standing wave in the UHF band or the SHF band, and are connected to a feeder circuit (not shown).
  • the antenna device 103 is installed on (into) the adhesive layer 49 on the inner wall surface of the upper housing 38, and the circuit board 35 is arranged to face the antenna device 103.
  • Slits 40 and 42 extending in the Y-axis direction of the exploded plan view of FIG. 15A are formed in the upper housing 38, and the opening 44 according to the shape of the coil conductor pattern 13 of the antenna device 103. Is provided.
  • a slit 43 is further provided from the opening 44 toward the slit 42.
  • a device 63 is disposed in the opening 44.
  • an opening provided in the housing can be used to provide the device 63.
  • the device 63 is, for example, a device such as a camera, a flash, a speaker, an earphone jack, a card slot, a USB terminal, a battery cover, a button, or a sensor.
  • the device 63 is disposed in the opening 44.
  • the opening 44 and the slits 40, 42, and 43 may be covered with resin.
  • the magnetic sheet 45 is disposed on the second main surface of the base material layer 22 (main surface of the antenna device 103 facing the circuit board 35). . Therefore, due to the high magnetic permeability of the magnetic sheet 45, the coil conductor pattern 13 can obtain a predetermined inductance with a small number of turns. Further, the magnetic coupling effect of the magnetic material sheet 45 can enhance the magnetic field coupling with the coil antenna on the communication partner side. In addition, by arranging the magnetic sheet 45 between the circuit board 35 and the circuit board 35, a magnetic shield effect on the circuit board 35 side can be obtained.
  • the magnetic sheet 45 of this embodiment includes a power supply coil 34 and a coil as shown in FIG.
  • the conductive pattern 13 is disposed so as to avoid the region facing the conductive pattern 13.
  • a magnetic sheet may be arranged around the casing or the casing opening.
  • the magnetic flux collecting effect of the magnetic flux passing through the opening of the coil conductor pattern 13 can be enhanced, and the antenna characteristics are improved.
  • the degree of coupling between the coil conductor pattern 13 and the feeding coil 34 that is electromagnetically coupled can be increased.
  • the communication terminal device 202 is disposed in the X-axis direction in the order of the radiating element 61 of the standing wave antenna, the upper casing 38, and the radiating element 62 of the standing wave antenna with the slits 40 and 42 interposed therebetween. It is a structure. That is, the communication terminal device 202 is not only the antenna device 103 having a communication frequency in the HF band, but also a standing wave antenna that generates a standing wave in the UHF band or the SHF band for cellular communication or Wi-Fi (registered trademark). Since the radiating element is further provided, it can be shared by a plurality of systems having different frequency bands.
  • FIG. 16 is an exploded plan view of the communication terminal device 203 according to the eleventh embodiment.
  • Circuit boards 53A, 53B, and 53C, a power supply coil 54, a battery pack 55, a camera module 57A, and the like are mounted inside the upper casing 51.
  • a UHF band antenna 56A and the like are mounted on the circuit board 53A.
  • a UHF band antenna 56B and the like are mounted on the circuit board 53B
  • a UHF band antenna 56B and the like are mounted on the circuit board 53C.
  • the circuit boards 53A, 53B, and 53C are connected via cables 58A, 58B, and 58C, respectively.
  • the lower casing 52 is provided with an antenna device 103 and a camera module opening 57B.
  • the coil conductor pattern 13 of the antenna device 103 is electromagnetically coupled to the feeding coil 54 mounted on the circuit board 53B.
  • the feeding coil 54 is electrically connected to the RFIC.
  • the lower housing 52 is made of resin, but a planar conductor made of a metal film may be formed on the inner surface thereof.

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Abstract

A base layer (21) is provided with a first main surface-side conductor pattern (11) on a first main surface and a second main surface-side conductor pattern (12) on a second main surface. The second main surface-side conductor pattern (12) is thinner than the first main surface-side conductor pattern (11). The first main surface-side conductor pattern (11) is provided with a conductor pattern (13) for coils, a first conductor pattern (14) for capacitors and a second conductor pattern (15) for capacitors. The second main surface-side conductor pattern (12) is provided with a third conductor pattern (16) for capacitors and a fourth conductor pattern (17) for capacitors. The first conductor pattern (14) for capacitors and the third conductor pattern (16) for capacitors, and the second conductor pattern (15) for capacitors and the fourth conductor pattern (17) for capacitors form two capacitors, and constitute an antenna device (101) together with the conductor pattern (13) for coils.

Description

アンテナ装置および通信端末装置Antenna device and communication terminal device
　本発明は、ＨＦ帯やＵＨＦ帯の通信システムに用いられるアンテナ装置および通信端末装置に関する。 The present invention relates to an antenna device and a communication terminal device used in a communication system of HF band or UHF band.
　従来の非接触型ＩＣカードは、カード基板の周縁部にループ状に形成された導体パターンからなるコイルとカード基板上に搭載されたコンデンサとにより構成した共振回路を備え、その共振回路が共振することによって発生する電圧によって非接触ＩＣカード内の他の回路に電力が供給され、その回路が動作するものである。特許文献１には、基材の両面に導体パターンを形成することでコンデンサを設けた非接触型ＩＣカードが示されている。 A conventional non-contact type IC card includes a resonance circuit composed of a coil formed of a conductor pattern formed in a loop shape on the peripheral edge of a card substrate and a capacitor mounted on the card substrate, and the resonance circuit resonates. Power is supplied to other circuits in the non-contact IC card by the voltage generated by this, and the circuit operates. Patent Document 1 discloses a non-contact type IC card in which a capacitor is provided by forming a conductor pattern on both surfaces of a base material.
特開平１１－３５３４４０号公報JP-A-11-353440
　特許文献１にはコイルを形成するループ状の導体パターンやコンデンサを形成する導体パターンの厚みについての記載はない。近年は携帯通信端末や非接触ＩＣカードの薄型化の要望が強くなっており、薄型化に対応するために基材の両面に形成する導体パターンを単純に薄型化すると、特に線路長が長いコイルの導体パターンで導体損失が大きくなってアンテナ特性が劣化するという問題が生じる。 Patent Document 1 does not describe the thickness of a loop-shaped conductor pattern forming a coil or a conductor pattern forming a capacitor. In recent years, there has been a strong demand for thinning of portable communication terminals and non-contact IC cards, and when the conductor pattern formed on both surfaces of the base material is simply thinned to cope with the thinning, a coil having a particularly long line length is required. There is a problem that the conductor loss increases and the antenna characteristics deteriorate due to the conductor pattern.
　本発明の目的は、アンテナの特性を劣化させることなくアンテナ全体を薄型化できるようにしたアンテナ装置およびそれを備えた通信端末装置を提供することにある。 An object of the present invention is to provide an antenna device and a communication terminal device including the antenna device that can reduce the thickness of the entire antenna without degrading the characteristics of the antenna.
（１）本発明のアンテナ装置は、
　第１主面および第２主面を有し絶縁体からなる基材層と、前記基材層の第１主面上に形成された第１主面側導体パターンと、前記基材層の第２主面上に形成された第２主面側導体パターンとを備えるアンテナ装置において、
　前記第２主面側導体パターンは、前記第１主面側導体パターンよりも薄く、
　前記第１主面側導体パターンは、ループ状またはスパイラル状のコイル用導体パターン、前記コイル用導体パターンの第１端に接続された第１のキャパシタ用導体パターン、および前記コイル用導体パターンの第２端に接続された第２のキャパシタ用導体パターンを備え、
　前記第２主面側導体パターンは、前記基材層を挟んで前記第１のキャパシタ用導体パターンに対向する第３のキャパシタ用導体パターン、および前記基材層を挟んで前記第２のキャパシタ用導体パターンに対向する第４のキャパシタ用導体パターンを備えたことを特徴とする。 (1) The antenna device of the present invention
A base material layer having a first main surface and a second main surface and made of an insulator; a first main surface side conductor pattern formed on the first main surface of the base material layer; In an antenna device provided with the 2nd principal surface side conductor pattern formed on two principal surfaces,
The second main surface side conductor pattern is thinner than the first main surface side conductor pattern,
The first main surface side conductor pattern includes a coil conductor pattern having a loop shape or a spiral shape, a first capacitor conductor pattern connected to a first end of the coil conductor pattern, and a first conductor pattern of the coil conductor pattern. A second capacitor conductor pattern connected to two ends;
The second main surface side conductor pattern includes a third capacitor conductor pattern facing the first capacitor conductor pattern across the base material layer, and the second capacitor conductor across the base material layer. A fourth capacitor conductor pattern facing the conductor pattern is provided.
　上記構成により、コイル用導体パターンが形成される第１主面側導体パターンが、第２主面側導体パターンよりも厚く形成されていることから、コイル用導体パターンの導体損失が抑えられ、アンテナ特性の劣化を防ぐことができる。また、第２主面側導体パターン１２が第１主面側導体パターン１１よりも薄く形成されていることで、アンテナ装置を薄型化できる。 With the above configuration, since the first main surface side conductor pattern on which the coil conductor pattern is formed is formed thicker than the second main surface side conductor pattern, the conductor loss of the coil conductor pattern is suppressed, and the antenna It is possible to prevent deterioration of characteristics. Further, since the second main surface side conductor pattern 12 is formed thinner than the first main surface side conductor pattern 11, the antenna device can be thinned.
（２）前記第３のキャパシタ用導体パターンと前記第４のキャパシタ用導体パターンとの間を接続する接続用導体パターンを備えることが好ましい。この構成により、例えばチップコンデンサとコイルとを層間接続導体で接続してＬＣ共振回路を構成する場合とは異なり、コンデンサとコイル間の接続にビアなどの層間接続導体を設けることなくＬＣ共振回路を形成することができるため、製造コストの削減ができる。また、接触不良などの問題が発生する可能性が低減される。 (2) It is preferable to provide a connection conductor pattern for connecting the third capacitor conductor pattern and the fourth capacitor conductor pattern. With this configuration, for example, unlike the case where an LC resonance circuit is configured by connecting a chip capacitor and a coil with an interlayer connection conductor, the LC resonance circuit is provided without providing an interlayer connection conductor such as a via for connection between the capacitor and the coil. Since it can be formed, the manufacturing cost can be reduced. In addition, the possibility of problems such as poor contact occurring is reduced.
（３）前記第３のキャパシタ用導体パターンまたは前記第４のキャパシタ用導体パターンは、複数の導体片と、それらを連結する線状の連結導体パターンとにより構成されていることが好ましい。この構成により、連結導体パターンが導体片の幅よりも細いため、１つの平面導体パターンの場合と比べて導体片同士の切り離しが容易であり、切り離しの際に導体片が破損したり変形したりすることによる容量の変動が生じ難くなる。さらに、一度に複数の導体片を切り離すこともできるため、容量の調整がしやすい。また、第２主面側導体パターンの一部である複数の導体片および連結導体パターンは第１主面側導体パターンよりも薄く形成されている。そのため、導体片同士の切り離しが容易となるうえ、導体片同士を切り離す場合に発生する塵などが減少し、塵などに起因する容量の変化や短絡が発生する可能性が低い。 (3) It is preferable that the said 3rd capacitor conductor pattern or the said 4th capacitor conductor pattern is comprised by the some conductor piece and the linear connection conductor pattern which connects them. With this configuration, since the connecting conductor pattern is narrower than the width of the conductor piece, it is easier to separate the conductor pieces than in the case of a single planar conductor pattern, and the conductor pieces may be damaged or deformed during the separation. This makes it difficult for the capacity to fluctuate. Furthermore, since a plurality of conductor pieces can be separated at a time, the capacity can be easily adjusted. Further, the plurality of conductor pieces and the connecting conductor pattern which are part of the second main surface side conductor pattern are formed thinner than the first main surface side conductor pattern. Therefore, the conductor pieces can be easily separated from each other, dust generated when the conductor pieces are separated from each other is reduced, and the possibility of a change in capacitance or a short circuit due to the dust is low.
（４）前記連結導体パターンは、前記コイル用導体パターン、前記第１のキャパシタ用導体パターン、および前記第２のキャパシタ用導体パターンと平面視で重なる位置を避けるように配置されていることが好ましい。この構成により、導体片を切り離す際には第１主面側導体パターン（前記コイル用導体パターン、前記第１のキャパシタ用導体パターン、および前記第２のキャパシタ用導体パターン）を傷つけることなく前記連結導体パターンのみがパンチングやトリミングなどにより取り除かれる。したがって、パンチングなどにより導体片を切り離す際に、基材層を挟んで対向するキャパシタ用導電パターン間に短絡が発生する可能性が低くすることができる。 (4) The connection conductor pattern is preferably arranged so as to avoid a position overlapping the coil conductor pattern, the first capacitor conductor pattern, and the second capacitor conductor pattern in plan view. . With this configuration, the first main surface side conductor pattern (the coil conductor pattern, the first capacitor conductor pattern, and the second capacitor conductor pattern) is not damaged when the conductor pieces are separated. Only the conductor pattern is removed by punching or trimming. Therefore, when the conductor piece is separated by punching or the like, the possibility of occurrence of a short circuit between the capacitor conductive patterns facing each other with the base material layer interposed therebetween can be reduced.
（５）前記コイル用導体パターンと電磁界結合する給電コイルを備えることが好ましい。この構成により、ＲＦＩＣとアンテナ装置とを直接接続する必要がなくなるため、コイル用導体パターンの近傍であれば給電コイルを比較的自由な位置に配置することができる。 (5) It is preferable to provide a feeding coil that is electromagnetically coupled to the coil conductor pattern. With this configuration, since it is not necessary to directly connect the RFIC and the antenna device, the feeding coil can be disposed at a relatively free position in the vicinity of the coil conductor pattern.
（６）前記給電コイルは、前記第１のキャパシタ用導体パターン、前記第２のキャパシタ用導体パターン、前記第３のキャパシタ用導体パターン、および前記第４のキャパシタ用導体パターンとは平面視で重ならない位置に配置されていることが好ましい。この構成により、コイル用導体パターンと給電コイルとの電磁界結合の結合度をより高めることができる。 (6) The power feeding coil overlaps the first capacitor conductor pattern, the second capacitor conductor pattern, the third capacitor conductor pattern, and the fourth capacitor conductor pattern in a plan view. It is preferable that they are arranged at positions that do not become necessary. With this configuration, the coupling degree of electromagnetic field coupling between the coil conductor pattern and the feeding coil can be further increased.
（７）本発明の通信端末装置は、筐体と、筐体内部に設置されたアンテナ装置と、を備え、前記アンテナ装置は、上記（１）～（６）のいずれかに記載の構成であることを特徴とする。 (7) A communication terminal device of the present invention includes a housing and an antenna device installed inside the housing, and the antenna device has the configuration described in any one of (1) to (6) above. It is characterized by being.
（８）上記（７）において、アンテナ装置のコイル用導体パターンと対向して配置される面状導体を備えることが好ましい。この構成により、面状導体はアンテナ装置の放射部として作用し、実効的な開口が大きくなる。したがって、アンテナ装置のみの場合と比較してアンテナの利得が向上し、アンテナ特性が改善される。 (8) In the above (7), it is preferable that a planar conductor disposed opposite to the coil conductor pattern of the antenna device is provided. With this configuration, the planar conductor acts as a radiating portion of the antenna device, and an effective opening is increased. Therefore, the gain of the antenna is improved and the antenna characteristics are improved as compared with the case of only the antenna device.
（９）上記（８）において、アンテナ装置の第１のキャパシタ用導体パターン、第２のキャパシタ用導体パターン、第３のキャパシタ用導体パターン、および第４のキャパシタ用導体パターンは、前記コイル用導体パターンの巻回軸から面状導体の外縁までの距離が最短となる外縁端の位置と巻回軸とを結ぶ線に平面視で重ならないよう配置されていることが好ましい。この構成により、効率よく磁束を集中させてコイル用導体パターンと面状導体間における電磁界結合の結合度を高めることができる。 (9) In the above (8), the first capacitor conductor pattern, the second capacitor conductor pattern, the third capacitor conductor pattern, and the fourth capacitor conductor pattern of the antenna device are the coil conductor. It is preferable that the distance from the winding axis of the pattern to the outer edge of the planar conductor is arranged so as not to overlap the line connecting the position of the outer edge and the winding axis that is the shortest in plan view. With this configuration, it is possible to efficiently concentrate the magnetic flux and increase the degree of coupling of electromagnetic field coupling between the coil conductor pattern and the planar conductor.
　本発明によれば、アンテナの特性を劣化させることなくアンテナ全体を薄型化したアンテナ装置およびそれを備えた通信端末装置を構成できる。 According to the present invention, it is possible to configure an antenna device in which the entire antenna is thinned and a communication terminal device including the antenna device without degrading the characteristics of the antenna.
図１（Ａ）は第１の実施形態に係るアンテナ装置１０１の平面図であり、図１（Ｂ）は第１の実施形態に係るアンテナ装置１０１の正面図である。FIG. 1A is a plan view of the antenna device 101 according to the first embodiment, and FIG. 1B is a front view of the antenna device 101 according to the first embodiment. 図２（Ａ）はアンテナ装置１０１に備える第１主面側導体パターン１１の平面図であり、図２（Ｂ）はアンテナ装置１０１に備える第２主面側導体パターン１２の平面図である。2A is a plan view of the first main surface side conductor pattern 11 included in the antenna device 101, and FIG. 2B is a plan view of the second main surface side conductor pattern 12 included in the antenna device 101. 図３（Ａ）は、第２の実施形態に係るアンテナ装置１０２Ａの平面図であり、図３（Ｂ）は、アンテナ装置１０２Ｂの平面図であり、図３（Ｃ）はアンテナ装置１０２Ｃの平面図である。3A is a plan view of the antenna device 102A according to the second embodiment, FIG. 3B is a plan view of the antenna device 102B, and FIG. 3C is a plan view of the antenna device 102C. FIG. 図４は、第３の実施形態に係るアンテナ装置１０３の平面図である。FIG. 4 is a plan view of the antenna device 103 according to the third embodiment. 図５（Ａ）は第４の実施形態に係るアンテナ装置１０４Ａの平面図であり、図５（Ｂ）は図５（Ａ）におけるＡ－Ａ断面図である。FIG. 5A is a plan view of an antenna device 104A according to the fourth embodiment, and FIG. 5B is a cross-sectional view taken along line AA in FIG. 5A. 図６（Ａ）はアンテナ装置１０４Ｂの平面図であり、図６（Ｂ）は図６（Ａ）におけるＢ－Ｂ断面図である。6A is a plan view of the antenna device 104B, and FIG. 6B is a cross-sectional view taken along line BB in FIG. 6A. 図７は、第５の実施形態に係るアンテナ装置１０５の平面図である。FIG. 7 is a plan view of an antenna device 105 according to the fifth embodiment. 図８（Ａ）は、第５の実施形態に係る通信端末装置の主要部の平面図である。図８（Ｂ）は、第５の実施形態に係る通信端末装置の主要部の正面図である。FIG. 8A is a plan view of the main part of a communication terminal apparatus according to the fifth embodiment. FIG. 8B is a front view of the main part of the communication terminal apparatus according to the fifth embodiment. 図９は、第６の実施形態に係るアンテナ装置１０６の平面図である。FIG. 9 is a plan view of an antenna device 106 according to the sixth embodiment. 図１０（Ａ）は、第６の実施形態に係る通信端末装置の主要部の平面図である。図１０（Ｂ）は、第６の実施形態に係る通信端末装置の主要部の正面図である。FIG. 10A is a plan view of the main part of a communication terminal apparatus according to the sixth embodiment. FIG. 10B is a front view of the main part of the communication terminal apparatus according to the sixth embodiment. 図１１は、第７の実施形態に係るアンテナ装置１０７の平面図である。FIG. 11 is a plan view of an antenna device 107 according to the seventh embodiment. 図１２（Ａ）は、第８の実施形態に係る通信端末装置２０１Ａの断面図である。図１２（Ｂ）は、第８の実施形態に係る別の通信端末装置２０１Ｂの断面図である。FIG. 12A is a cross-sectional view of a communication terminal apparatus 201A according to the eighth embodiment. FIG. 12B is a cross-sectional view of another communication terminal apparatus 201B according to the eighth embodiment. 図１３（Ａ）は、第９の実施形態に係る通信端末装置の主要部の平面図である。図１３（Ｂ）は、第９の実施形態に係る通信端末装置の主要部の正面図である。FIG. 13A is a plan view of the main part of a communication terminal apparatus according to the ninth embodiment. FIG. 13B is a front view of the main part of the communication terminal apparatus according to the ninth embodiment. 図１４（Ａ）は、第９の実施形態に係る別の通信端末装置の主要部の平面図である。図１４（Ｂ）は、第９の実施形態に係る別の通信端末装置の主要部の正面図である。FIG. 14A is a plan view of the main part of another communication terminal apparatus according to the ninth embodiment. FIG. 14B is a front view of the main part of another communication terminal apparatus according to the ninth embodiment. 図１５（Ａ）は、第１０の実施形態に係る通信端末装置２０２の平面図である。図１５（Ｂ）は、第１０の実施形態に係る通信端末装置２０２の断面図である。FIG. 15A is a plan view of a communication terminal apparatus 202 according to the tenth embodiment. FIG. 15B is a cross-sectional view of the communication terminal apparatus 202 according to the tenth embodiment. 図１６は、第１１の実施形態に係る通信端末装置２０３の分解平面図である。FIG. 16 is an exploded plan view of the communication terminal device 203 according to the eleventh embodiment. 図１７は、面状導体とアンテナ装置との位置関係についての説明図である。FIG. 17 is an explanatory diagram of the positional relationship between the planar conductor and the antenna device.
　以降、図を参照していくつかの具体的な例を挙げて、本発明を実施するための複数の形態を示す。各図中には同一箇所に同一符号を付している。各実施形態は例示であり、異なる実施形態で示した構成の部分的な置換または組み合わせが可能であることは言うまでもない。 Hereinafter, a plurality of embodiments for carrying out the present invention will be described by giving some specific examples with reference to the drawings. In each figure, the same reference numerals are assigned to the same portions. Each embodiment is an exemplification, and needless to say, partial replacement or combination of configurations shown in different embodiments is possible.
　以降に示す幾つかの実施形態のアンテナ装置は、スマートフォンやタブレット端末などに代表される通信端末に設けられたＨＦ帯（１３．５６ＭＨｚ帯など）高周波信号を送受するためのアンテナ装置である。 The antenna apparatus according to some embodiments described below is an antenna apparatus for transmitting and receiving an HF band (such as 13.56 MHz band) high-frequency signal provided in a communication terminal typified by a smartphone or a tablet terminal.
　《第１の実施形態》
　図１（Ａ）は第１の実施形態に係るアンテナ装置１０１の平面図であり、図１（Ｂ）はその正面図である。図２（Ａ）はアンテナ装置１０１に備える第１主面側導体パターン１１の平面図であり、図２（Ｂ）はアンテナ装置１０１に備える第２主面側導体パターン１２の平面図である。 << First Embodiment >>
FIG. 1A is a plan view of the antenna device 101 according to the first embodiment, and FIG. 1B is a front view thereof. 2A is a plan view of the first main surface side conductor pattern 11 included in the antenna device 101, and FIG. 2B is a plan view of the second main surface side conductor pattern 12 included in the antenna device 101.
　アンテナ装置１０１は第１主面および第２主面を有する絶縁体の基材層２１を備えている。基材層２１の第１主面には第１主面側導体パターン１１が形成されていて、基材層２１の第２主面には第２主面側導体パターン１２が形成されている。第２主面側導体パターン１２は第１主面側導体パターン１１よりも薄い。図１（Ｂ）において、各部の厚みは誇張して図示している。以降の各実施形態における正面図についても同様である。第１主面側導体パターン１１は、ループ状またはスパイラル状のコイル用導体パターン１３、第１のキャパシタ用導体パターン１４、および第２のキャパシタ用導体パターン１５で構成されている。コイル用導体パターン１３の第１端には、第１のキャパシタ用導体パターン１４が接続されており、コイル用導体パターン１３の第２端には、第２のキャパシタ用導体パターン１５が接続されている。コイル用導体パターン１３は放射素子として作用する。第２主面側導体パターン１２は、第３のキャパシタ用導体パターン１６、第４のキャパシタ用導体パターン１７で構成されている。第３のキャパシタ用導体パターン１６と第４のキャパシタ用導体パターン１７との間は接続用導体パターン２０で接続されている。 The antenna device 101 includes an insulating base material layer 21 having a first main surface and a second main surface. The first main surface side conductor pattern 11 is formed on the first main surface of the base material layer 21, and the second main surface side conductor pattern 12 is formed on the second main surface of the base material layer 21. The second main surface side conductor pattern 12 is thinner than the first main surface side conductor pattern 11. In FIG. 1B, the thickness of each portion is exaggerated. The same applies to front views in the following embodiments. The first main surface side conductor pattern 11 includes a loop-shaped or spiral-shaped coil conductor pattern 13, a first capacitor conductor pattern 14, and a second capacitor conductor pattern 15. A first capacitor conductor pattern 14 is connected to the first end of the coil conductor pattern 13, and a second capacitor conductor pattern 15 is connected to the second end of the coil conductor pattern 13. Yes. The coil conductor pattern 13 functions as a radiating element. The second main surface side conductor pattern 12 includes a third capacitor conductor pattern 16 and a fourth capacitor conductor pattern 17. The third capacitor conductor pattern 16 and the fourth capacitor conductor pattern 17 are connected by a connection conductor pattern 20.
　第１のキャパシタ用導体パターン１４および第３のキャパシタ用導体パターン１６は、基材層２１を挟んで対向することにより第１キャパシタを構成し、第２のキャパシタ用導体パターン１５および第４のキャパシタ用導体パターン１７は、基材層２１を挟んで対向することにより第２キャパシタを構成している。上記２つのキャパシタは、第３のキャパシタ用導体パターン１６と第４のキャパシタ用導体パターン１７との間を接続する接続用導体パターン２０により電気的に接続されている。上記２つのコンデンサとコイル用導体パターン１３とで、閉ループを形成し、ＬＣ共振回路を構成している。アンテナ装置１０１に対する給電方法については後に詳述する。 The first capacitor conductor pattern 14 and the third capacitor conductor pattern 16 constitute a first capacitor by facing each other with the base material layer 21 in between, and the second capacitor conductor pattern 15 and the fourth capacitor The conductive pattern 17 constitutes a second capacitor by facing the base material layer 21 therebetween. The two capacitors are electrically connected by a connection conductor pattern 20 that connects between the third capacitor conductor pattern 16 and the fourth capacitor conductor pattern 17. The two capacitors and the coil conductor pattern 13 form a closed loop and constitute an LC resonance circuit. A method for supplying power to the antenna device 101 will be described in detail later.
　本実施形態において、基材層２１を挟んで対向するキャパシタ用導体パターン同士（１４と１６、または１５と１７）の形状および大きさは平面視でほぼ同一であるが、本実施形態の構成に限られるものではなく、任意に変更可能である。例えば、一方のキャパシタ用導体パターン（１４または１５）の大きさを、基材層２１を挟んで対向する他方のキャパシタ用導体パターン（１６または１７）よりも大きくし、平面視で覆うように重なる位置に配置する構成がある。この構成により、第１主面側導体パターンと第２主面側導体パターンの形成位置にずれが生じたとしても、上記第１キャパシタおよび上記第２キャパシタは正常に構成され、共振周波数のばらつきを小さくすることができる。このほかに、例えば、図１における第３のキャパシタ用導体パターン１６の縦方向の幅が第１のキャパシタ用導体パターン１４よりも太く、第１のキャパシタ用導体パターン１４およびコイル用導体パターン１３の何本かと基材層２１を挟んで対向する構成がある。逆に、例えば、図１における第４のキャパシタ用導体パターン１７の縦方向の幅が第２のキャパシタ用導体パターン１５よりも太く、第２のキャパシタ用導体パターン１５およびコイル用導体パターン１３の何本かと基材層２１を挟んで対向する構成などもある。 In the present embodiment, the shape and size of the capacitor conductor patterns (14 and 16, or 15 and 17) facing each other with the base material layer 21 in between are substantially the same in plan view. It is not limited and can be changed arbitrarily. For example, the size of one capacitor conductor pattern (14 or 15) is made larger than the other capacitor conductor pattern (16 or 17) facing the base material layer 21 and overlaps so as to cover in plan view. There is a configuration to be arranged at the position. With this configuration, even if the first main surface side conductor pattern and the second main surface side conductor pattern are misaligned, the first capacitor and the second capacitor are normally configured, and the resonance frequency varies. Can be small. In addition, for example, the vertical width of the third capacitor conductor pattern 16 in FIG. 1 is larger than that of the first capacitor conductor pattern 14, and the first capacitor conductor pattern 14 and the coil conductor pattern 13 There is a configuration in which several are opposed to each other with the base material layer 21 interposed therebetween. On the other hand, for example, the vertical width of the fourth capacitor conductor pattern 17 in FIG. 1 is larger than that of the second capacitor conductor pattern 15, and the second capacitor conductor pattern 15 and the coil conductor pattern 13 are There are also configurations such that the book and the base material layer 21 are opposed to each other.
　本実施形態において、キャパシタ用導体パターン（１４，１５，１６，１７）はいずれも矩形であるが、本実施形態の形状に限られるものではなく、任意に変更可能である。例えば、基材層２１を挟んで対向するキャパシタ用導体パターン（１４，１６）を、図１におけるアンテナ装置１０１のように上辺だけに形成するのではなく、左辺にも形成してＬ字形とする構成などがある。 In the present embodiment, the capacitor conductive patterns (14, 15, 16, 17) are all rectangular, but are not limited to the shape of the present embodiment and can be arbitrarily changed. For example, the capacitor conductor patterns (14, 16) facing each other across the base material layer 21 are not formed only on the upper side as in the antenna device 101 in FIG. There are configurations.
　基材層２１は例えばＰＥＴ（polyethylene-terephthalate）フィルム、第１主面側導体パターンおよび第２主面側導体パターンは例えばアルミニウム（Al）箔である。よって、アンテナ装置１０１は、図１（Ｂ）において上から順にAl－PET－Al（第２主面側導体パターン１２－基材層２１－第１主面側導体パターン１１）の構造となる。また、各層の厚みについては、例えば図１（Ｂ）において上から順に１０μｍ－４０μｍ－３０μｍ（第２主面側導体パターン１２－基材層２１－第１主面側導体パターン１１）である。コイル用導体パターン１３の導体損失を抑えるため、第１主面側導体パターン１１は第２主面側導体パターン１２よりも厚く形成されている。 The base material layer 21 is, for example, a PET (polyethylene-terephthalate) film, and the first main surface side conductor pattern and the second main surface side conductor pattern are, for example, aluminum (Al) foil. Therefore, the antenna device 101 has a structure of Al-PET-Al (second main surface side conductor pattern 12-base material layer 21-first main surface side conductor pattern 11) in order from the top in FIG. The thickness of each layer is, for example, 10 μm-40 μm-30 μm (second main surface side conductor pattern 12-base material layer 21-first main surface side conductor pattern 11) in order from the top in FIG. 1B. In order to suppress the conductor loss of the coil conductor pattern 13, the first main surface side conductor pattern 11 is formed thicker than the second main surface side conductor pattern 12.
　上記アンテナ装置１０１は例えば次のような工程で製造される。 The antenna device 101 is manufactured by the following process, for example.
（１）先ず、厚さ４０μｍのPETフィルムの第１主面に１０μｍのAl箔、第２主面に３０μｍのAl箔、をそれぞれラミネートしたフィルムを用意する。 (1) First, a film is prepared by laminating a 10 μm Al foil on a first main surface and a 30 μm Al foil on a second main surface of a PET film having a thickness of 40 μm.
（２）上記ラミネートフィルムの第１主面に第１主面側導体パターン形成用のエッチングレジスト膜を印刷し、乾燥させる。 (2) An etching resist film for forming a first main surface side conductor pattern is printed on the first main surface of the laminate film and dried.
（３）上記ラミネートフィルムの第２主面に第２主面側導体パターン形成用のエッチングレジスト膜を印刷し、乾燥させる。 (3) An etching resist film for forming a second main surface side conductor pattern is printed on the second main surface of the laminate film and dried.
（４）上記ラミネートフィルムをエッチングすることで、第１主面側導体パターンおよび第２主面側導体パターンを形成する。その後、エッチングレジスト膜を除去する。 (4) A first main surface side conductor pattern and a second main surface side conductor pattern are formed by etching the laminate film. Thereafter, the etching resist film is removed.
　なお、フォトレジスト膜にマスクパターンを重ねて露光し、現像、ベークによりエッチングレジスト膜をパターンニングしてもよい。また、第１主面側導体パターンおよび第２主面側導体パターンはフィルム（基材層）に直接形成する必要はなく、接着層を介して、第１主面側導体パターンおよび第２主面側導体をフィルム（基材層）上に形成してもよい。また、第１主面側導体パターンおよび第２主面側導体パターンはともにAl箔である必要はない。例えば一方の導体パターンがAl箔とし、他方の導体パターンがCu箔とするなど、第１主面側導体パターンおよび第２主面側導体パターンは異なる材料であってもよい。 Note that a mask pattern may be overlaid on the photoresist film, and the etching resist film may be patterned by development and baking. The first main surface side conductor pattern and the second main surface side conductor pattern do not need to be directly formed on the film (base material layer), and the first main surface side conductor pattern and the second main surface are interposed via the adhesive layer. You may form a side conductor on a film (base material layer). Further, both the first main surface side conductor pattern and the second main surface side conductor pattern need not be Al foil. For example, the first main surface side conductor pattern and the second main surface side conductor pattern may be made of different materials such that one conductor pattern is an Al foil and the other conductor pattern is a Cu foil.
　本実施形態によれば次のような効果を奏する。 According to this embodiment, the following effects are obtained.
　コイル用導体パターン１３が形成される第１主面側導体パターン１１は、第２主面側導体パターン１２よりも厚く形成されていることから、コイル用導体パターン１３の導体損失が抑えられ、アンテナ特性の劣化を防ぐことができる。 Since the first main surface side conductor pattern 11 on which the coil conductor pattern 13 is formed is formed thicker than the second main surface side conductor pattern 12, the conductor loss of the coil conductor pattern 13 is suppressed, and the antenna It is possible to prevent deterioration of characteristics.
　アンテナ装置１０１はコイル用導体パターン１３の巻回軸方向に向かって第１キャパシタおよび第２キャパシタを形成した構成である。ほぼ第３のキャパシタ用導体パターン１６および第４のキャパシタ用導体パターン１７のみで形成される第２主面側導体パターンは、第１主面側導体パターン１１とは異なり、線幅が広く、且つ線路長は極めて短い。また、キャパシタ用導体パターン１６，１７に流れる電流は、パターンの長手方向よりも基材層２１の厚み方向に変位電流として流れる。そのため、第２主面側導体パターン１２は、第１主面側導体パターン１１よりも薄く形成されていても、キャパシタ用導体パターン１６，１７での導体損失は殆ど生じない。したがって、第２主面側導体パターン１２を第１主面側導体パターン１１よりも薄く形成することで、アンテナ特性を劣化させることなくアンテナ装置を薄型化できる。 The antenna device 101 has a configuration in which a first capacitor and a second capacitor are formed in the winding axis direction of the coil conductor pattern 13. Unlike the first main surface side conductor pattern 11, the second main surface side conductor pattern formed by only the third capacitor conductor pattern 16 and the fourth capacitor conductor pattern 17 has a wide line width, and The track length is extremely short. The current flowing through the capacitor conductor patterns 16 and 17 flows as a displacement current in the thickness direction of the base material layer 21 rather than in the longitudinal direction of the pattern. Therefore, even if the second main surface side conductor pattern 12 is formed thinner than the first main surface side conductor pattern 11, almost no conductor loss occurs in the capacitor conductor patterns 16 and 17. Therefore, by forming the second main surface side conductor pattern 12 thinner than the first main surface side conductor pattern 11, the antenna device can be thinned without deteriorating the antenna characteristics.
　アンテナ装置１０１は、コイルとコンデンサ間の接続にビアなどの層間接続導体が不要であるため、製造コストが削減できる。また、接触不良などの問題が発生する可能性が低減される。 Since the antenna device 101 does not require an interlayer connection conductor such as a via for connection between the coil and the capacitor, the manufacturing cost can be reduced. In addition, the possibility of problems such as poor contact occurring is reduced.
　《第２の実施形態》
　図３（Ａ）は第２の実施形態に係るアンテナ装置１０２Ａの平面図であり、図３（Ｂ）はアンテナ装置１０２Ｂの平面図であり、図３（Ｃ）はアンテナ装置１０２Ｃの平面図である。 << Second Embodiment >>
3A is a plan view of the antenna device 102A according to the second embodiment, FIG. 3B is a plan view of the antenna device 102B, and FIG. 3C is a plan view of the antenna device 102C. is there.
　図３（Ａ）に示すアンテナ装置１０２Ａでは、第４のキャパシタ用導体パターン１７が図１などに示すような１つの平面導体パターンではなく、複数の導体片１８と導体片同士を連結する線状の連結導体パターン１９とで形成されている。この連結導体パターン１９は、導体片１８の幅よりも細いため、１つの平面導体パターンの場合と比べて導体片同士の切り離しが容易であり、切り離しの際に導体片１８が破損したり変形したりすることによる容量の変動が生じ難くなる。また、一度に複数の導体片１８を切り離すこともできるため、容量の調整がしやすい。 In the antenna device 102A shown in FIG. 3A, the fourth capacitor conductor pattern 17 is not a single planar conductor pattern as shown in FIG. 1 or the like, but a linear shape connecting a plurality of conductor pieces 18 and the conductor pieces. The connection conductor pattern 19 is formed. Since this connecting conductor pattern 19 is narrower than the width of the conductor piece 18, it is easier to separate the conductor pieces than in the case of one planar conductor pattern, and the conductor piece 18 is damaged or deformed during the separation. It is difficult for fluctuations in capacity due to Further, since the plurality of conductor pieces 18 can be separated at a time, the capacity can be easily adjusted.
　第２主面側導体パターンの一部である複数の導体片１８および連結導体パターン１９は第１主面側導体パターンよりも薄く形成されている。そのため、導体片同士の切り離しが容易となるうえ、導体片同士を切り離す場合に発生する塵などが減少し、塵などに起因する容量の変化や短絡が発生する可能性が低い。 The plurality of conductor pieces 18 and the connecting conductor pattern 19 which are part of the second main surface side conductor pattern are formed thinner than the first main surface side conductor pattern. Therefore, the conductor pieces can be easily separated from each other, dust generated when the conductor pieces are separated from each other is reduced, and the possibility of a change in capacitance or a short circuit due to the dust is low.
　図３（Ｂ）に示すアンテナ装置１０２Ｂおよび図３（Ｃ）に示すアンテナ装置１０２Ｃでは、連結導体パターン１９が第１主面側導体パターン（コイル用導体パターン１３、第１のキャパシタ用導体パターン１４、第２のキャパシタ用導体パターン１５）と平面視で重なる位置を避ける（迂回する）ように配置されている。本実施形態によれば、導体片１８を切り離す際には第１主面側導体パターン（コイル用導体パターン１３、第１のキャパシタ用導体パターン１４、第２のキャパシタ用導体パターン１５）を傷つけることなく連結導体パターン１９のみがパンチングやトリミングなどにより取り除かれる。したがって、基材層２１を挟んで対向するキャパシタ用導電パターン間に短絡が発生する可能性が低い。 In the antenna device 102B shown in FIG. 3B and the antenna device 102C shown in FIG. 3C, the connecting conductor pattern 19 is a first main surface side conductor pattern (coil conductor pattern 13 and first capacitor conductor pattern 14). The second capacitor conductor pattern 15) is disposed so as to avoid (bypass) a position overlapping with the second capacitor conductor pattern 15) in plan view. According to the present embodiment, when the conductor piece 18 is separated, the first main surface side conductor pattern (coil pattern 13 for coil, conductor pattern 14 for first capacitor, conductor pattern 15 for second capacitor) is damaged. Only the connecting conductor pattern 19 is removed by punching or trimming. Therefore, there is a low possibility that a short circuit will occur between the capacitor conductive patterns facing each other across the base material layer 21.
　パンチングやトリミングなどの方法は、以下のとおりである。製造時におけるアンテナ装置の共振周波数は、所望の共振周波数より低く設定しておき、予めコンデンサを構成する導体片１８の単位数量あたりの静電容量を調べておく。アンテナ装置を実装後に共振周波数の測定を行い、測定値と所望の共振周波数との関係から、切り離す導体片１８の数を算出する。平面視で第１主面側導体パターンと重なっていない部分の連結導体パターン１９にレーザートリミングなどで切り込みを入れることより導体片１８を電気的に切り離し、所望の共振周波数に調整する。連結導体パターン１９に切れ込みを入れる位置を調整することにより、少ない回数のトリミングにより複数の導体片１８を切り離すことができる。例えば、図３（Ｃ）に示すアンテナ装置１０２Ｃにおいて、図中の右から２個目と３個目の導体片１８を連結している連結導体パターン１９に切れ込みを入れることで、一度に２個の導体片１８を一度に切り離すことができる。なお、本実施形態においては接続用導体パターン２０のより近い位置にある連結導体パターン１９に切れ込みを入れることで、より多くの導体片１８を一度に切り離すことができる。 パ ン チ Punching and trimming methods are as follows. The resonance frequency of the antenna device at the time of manufacture is set lower than the desired resonance frequency, and the capacitance per unit quantity of the conductor pieces 18 constituting the capacitor is examined in advance. The resonance frequency is measured after the antenna device is mounted, and the number of conductor pieces 18 to be separated is calculated from the relationship between the measured value and the desired resonance frequency. The conductor piece 18 is electrically separated by cutting the connecting conductor pattern 19 in a portion not overlapping with the first main surface side conductor pattern in plan view by laser trimming or the like, and adjusted to a desired resonance frequency. By adjusting the position where the connection conductor pattern 19 is cut, the plurality of conductor pieces 18 can be separated by a small number of trimmings. For example, in the antenna device 102C shown in FIG. 3C, two cuts are made at a time in the connecting conductor pattern 19 connecting the second and third conductor pieces 18 from the right in the drawing, so that two pieces are formed at a time. The conductor pieces 18 can be separated at a time. In the present embodiment, a larger number of conductor pieces 18 can be separated at a time by making cuts in the connecting conductor pattern 19 located closer to the connecting conductor pattern 20.
　なお、図３（Ａ）（Ｂ）（Ｃ）では第４のキャパシタ用導体パターン１７が６つの導体片１８を備えている例を示しているが、導体片１８の数は６つに限らず複数であればよい。また、キャパシタ用導体パターンを複数の導体片１８と連結導体パターン１９とで形成する構成は、図３（Ａ）（Ｂ）（Ｃ）に示された第４のキャパシタ用導体パターン１７に限らず、第３のキャパシタ用導体パターン１６に適用してもよい。また、第３のキャパシタ用導体パターン１６および第４のキャパシタ用導体パターン１７の両方に適用してもよい。また、本実施形態では、第２主面側導体パターンに複数の導体片１８および連結導体パターン１９を形成した例を示したが、第１主面側導体パターンに複数の導体片および連結導体パターンを形成してもよい。さらに、連結導体パターン１９および接続用導体パターン２０の位置や接続経路について本実施形態の実施例に限られるものではない。 3A, 3B, and 3C show an example in which the fourth capacitor conductor pattern 17 includes six conductor pieces 18, the number of conductor pieces 18 is not limited to six. There may be more than one. The configuration in which the capacitor conductor pattern is formed by the plurality of conductor pieces 18 and the connecting conductor pattern 19 is not limited to the fourth capacitor conductor pattern 17 shown in FIGS. 3 (A), (B), and (C). The third capacitor conductor pattern 16 may be applied. Further, the present invention may be applied to both the third capacitor conductor pattern 16 and the fourth capacitor conductor pattern 17. Moreover, in this embodiment, although the example which formed the several conductor piece 18 and the connection conductor pattern 19 in the 2nd main surface side conductor pattern was shown, the some conductor piece and connection conductor pattern were formed in the 1st main surface side conductor pattern. May be formed. Furthermore, the positions and connection paths of the connection conductor pattern 19 and the connection conductor pattern 20 are not limited to the examples of the present embodiment.
　《第３の実施形態》
　図４は、第３の実施形態に係るアンテナ装置１０３の平面図である。第３の実施形態に係るアンテナ装置１０３は、誘電率の高い素材（誘電体）でできた基材層２２を備えており、それ以外は第２の実施形態に係るアンテナ装置１０２Ｂと同じ構成である。基材層２２は、例えばＰＰＥ樹脂ベースに高誘電率無機フィラーを充填させたシートである。 << Third Embodiment >>
FIG. 4 is a plan view of the antenna device 103 according to the third embodiment. The antenna device 103 according to the third embodiment includes a base material layer 22 made of a material (dielectric material) having a high dielectric constant, and the other configuration is the same as that of the antenna device 102B according to the second embodiment. is there. The base material layer 22 is, for example, a sheet obtained by filling a PPE resin base with a high dielectric constant inorganic filler.
　基材層を誘電体とすることにより、第１のキャパシタ用導体パターン１４および第３のキャパシタ用導体パターン１６が基材層２２を挟んで対向することにより構成された第１キャパシタの容量を大きくすることができる。同様に、第２のキャパシタ用導体パターン１５および第４のキャパシタ用導体パターン１７が基材層２２を挟んで対向することにより構成された第２キャパシタの容量も大きくすることができる。また、基材層２２に誘電率の異なる様々な素材を用いることで容量の調整を幅広く行うことができる。 By using the base material layer as a dielectric, the capacitance of the first capacitor configured by the first capacitor conductor pattern 14 and the third capacitor conductor pattern 16 facing each other with the base material layer 22 interposed therebetween is increased. can do. Similarly, the capacitance of the second capacitor formed by the second capacitor conductor pattern 15 and the fourth capacitor conductor pattern 17 facing each other with the base material layer 22 interposed therebetween can be increased. Further, the use of various materials having different dielectric constants for the base material layer 22 enables a wide range of capacitance adjustment.
　《第４の実施形態》
　図５（Ａ）は第４の実施形態に係るアンテナ装置１０４Ａの平面図であり、図５（Ｂ）は図５（Ａ）におけるＡ－Ａ断面図である。図５（Ｂ）において、各部の厚みは誇張して図示している。以降の各実施形態における断面図についても同様である。第４の実施形態に係るアンテナ装置１０４Ａは、磁性体である基材層２３を備えており、それ以外は第２の実施形態に係るアンテナ装置１０２Ｂと同じ構成である。本実施形態によれば、コイル用導体パターン１３の開口部を通る磁束の集磁効果を高めることができ、アンテナ特性が向上する。また、コイル用導体パターン１３と電磁界結合する給電コイルとの結合度を高めることもできる。磁性体である基材層２３と給電コイルとの間に、コイル用導体パターン１３を配置することにより、電磁界結合するコイル用導体パターン１３と給電コイルとの結合が強まる。コイル用導体パターンと給電コイルとの電磁界結合については後に詳述する。なお、ここでいう「電磁界結合」とは、電界結合または磁界結合の少なくとも一方が生じる状態を意味し、電界結合および磁界結合の両方が生じる状態も含まれる（本明細書における「電磁界結合」も同様の意味とする）。 << Fourth Embodiment >>
FIG. 5A is a plan view of an antenna device 104A according to the fourth embodiment, and FIG. 5B is a cross-sectional view taken along line AA in FIG. 5A. In FIG. 5B, the thickness of each part is exaggerated. The same applies to the sectional views in the following embodiments. The antenna device 104A according to the fourth embodiment includes the base material layer 23 that is a magnetic body, and the other configuration is the same as that of the antenna device 102B according to the second embodiment. According to this embodiment, the magnetic flux collecting effect of the magnetic flux passing through the opening of the coil conductor pattern 13 can be enhanced, and the antenna characteristics are improved. In addition, the degree of coupling between the coil conductor pattern 13 and the feeding coil that is electromagnetically coupled can be increased. By disposing the coil conductor pattern 13 between the base material layer 23 that is a magnetic body and the power feeding coil, the coupling between the coil conductor pattern 13 and the power feeding coil to be electromagnetically coupled is strengthened. The electromagnetic field coupling between the coil conductor pattern and the feeding coil will be described in detail later. The term “electromagnetic field coupling” as used herein means a state in which at least one of electric field coupling or magnetic field coupling occurs, and includes a state in which both electric field coupling and magnetic field coupling occur (refer to “electromagnetic field coupling in this specification”). "Has the same meaning).
　図６（Ａ）はアンテナ装置１０４Ｂの平面図であり、図６（Ｂ）は図６（Ａ）におけるＢ－Ｂ断面図である。アンテナ装置１０４Ｂは、第３の実施形態に係るアンテナ装置１０３に対して、その第１主面側に第１主面側導体パターン１１と同じ厚みの磁性体シート２４Ａを貼付している。また、第２主面側に第２主面側導体パターン１２と同じ厚みの磁性体シート２４Ｂを貼付している。磁性体シート２４Ａは、第１主面側導体パターン１１と重ならず、かつコイル用導体パターン１３と近接する位置に貼付する。また、磁性体シート２４Ｂは、第２主面側導体パターンと重ならない位置に貼付する。本実施形態によれば、コイル用導体パターン１３の開口部を通る磁束の集磁効果を高めることができるとともにアンテナ装置を薄型化できる。 6A is a plan view of the antenna device 104B, and FIG. 6B is a cross-sectional view taken along the line BB in FIG. 6A. The antenna device 104B has a magnetic sheet 24A having the same thickness as that of the first main surface side conductor pattern 11 attached to the first main surface side of the antenna device 103 according to the third embodiment. Further, a magnetic sheet 24B having the same thickness as that of the second main surface side conductor pattern 12 is attached to the second main surface side. The magnetic material sheet 24 </ b> A is attached to a position that does not overlap the first main surface side conductor pattern 11 and is close to the coil conductor pattern 13. Moreover, the magnetic material sheet 24B is affixed on the position which does not overlap with the 2nd main surface side conductor pattern. According to this embodiment, the magnetic flux collecting effect of the magnetic flux passing through the opening of the coil conductor pattern 13 can be enhanced, and the antenna device can be thinned.
　図６（Ａ）（Ｂ）の例では、磁性体シート２４Ａ，２４Ｂを基材層２２に貼付したが、それぞれの導体パターン上に直接貼付してもよい。 6A and 6B, the magnetic sheets 24A and 24B are attached to the base material layer 22. However, they may be attached directly on the respective conductor patterns.
　《第５の実施形態》
　図７は、第５の実施形態に係るアンテナ装置１０５の平面図である。アンテナ装置１０５の基材層２２には、ＲＦＩＣ３１が実装されている。アンテナ装置１０５の第１のキャパシタ用導体パターン１４と第２のキャパシタ用導体パターン１５との間はこのＲＦＩＣ３１が給電用接続導体３２を介して接続されている。アンテナ装置１０５はＬＣ回路であり、ＲＦＩＣ３１と併せてＬＣ並列共振回路を構成している。 << Fifth Embodiment >>
FIG. 7 is a plan view of an antenna device 105 according to the fifth embodiment. An RFIC 31 is mounted on the base material layer 22 of the antenna device 105. The RFIC 31 is connected between the first capacitor conductor pattern 14 and the second capacitor conductor pattern 15 of the antenna device 105 via a power supply connection conductor 32. The antenna device 105 is an LC circuit, and constitutes an LC parallel resonance circuit together with the RFIC 31.
　ＲＦＩＣ３１は、アンテナ装置にではなく回路基板や通信端末装置などに設置してもよい。図８（Ａ）は、第５の実施形態に係る通信端末装置の主要部の平面図である。図８（Ｂ）は、その正面図である。この通信端末装置は、アンテナ装置１０３、ＲＦＩＣ３１、および回路基板３５を備えている。アンテナ装置１０３およびＲＦＩＣ３１は回路基板３５に設置されており、第１のキャパシタ用導体パターン１４と第２のキャパシタ用導体パターン１５との間にＲＦＩＣ３１が給電用接続導体３２を介して接続されている。アンテナ装置１０３とＲＦＩＣ３１とでＬＣ並列共振回路を構成している。アンテナ装置１０３は第３の実施形態で示したアンテナ装置１０３と同じものである。なお、回路基板３５とコイル用導体パターン１３との間には磁性体シートが配置される構成でもよい。回路基板３５とコイル用導体パターン１３との間に磁性体シートを配置することにより、回路基板３５上の電子部品や配線パターン等との間の不要な結合を抑制できる。 The RFIC 31 may be installed not on the antenna device but on a circuit board or a communication terminal device. FIG. 8A is a plan view of the main part of a communication terminal apparatus according to the fifth embodiment. FIG. 8B is a front view thereof. This communication terminal device includes an antenna device 103, an RFIC 31, and a circuit board 35. The antenna device 103 and the RFIC 31 are installed on the circuit board 35, and the RFIC 31 is connected between the first capacitor conductor pattern 14 and the second capacitor conductor pattern 15 via the power supply connection conductor 32. . The antenna device 103 and the RFIC 31 constitute an LC parallel resonance circuit. The antenna device 103 is the same as the antenna device 103 shown in the third embodiment. The magnetic sheet may be arranged between the circuit board 35 and the coil conductor pattern 13. By disposing a magnetic sheet between the circuit board 35 and the coil conductor pattern 13, it is possible to suppress unnecessary coupling with electronic components, wiring patterns, and the like on the circuit board 35.
　アンテナ装置１０５は、その基材層２２の第１主面および第２主面のうち、どちらの面を回路基板３５に対面させて設置してもよい。但し、図８（Ａ）（Ｂ）に示したようなＬＣ並列共振回路を構成する場合には、第１のキャパシタ用導体パターン１４および第２のキャパシタ用導体パターン１５とＲＦＩＣ３１とを接続する給電用接続導体３２の接続点が第１主面側となる。したがって、この場合には第１主面を回路基板３５と設置する面とした方が回路基板３５上の配線が容易となる。なお、図８（Ａ）（Ｂ）の例では、回路基板３５の形状は矩形であるが、本実施形態の形状に限られるものではなく、任意に変更可能である。 The antenna device 105 may be installed with either one of the first main surface and the second main surface of the base material layer 22 facing the circuit board 35. However, when the LC parallel resonance circuit as shown in FIGS. 8A and 8B is configured, the power supply for connecting the first capacitor conductor pattern 14 and the second capacitor conductor pattern 15 to the RFIC 31. The connection point of the connection conductor for use 32 is the first main surface side. Therefore, in this case, wiring on the circuit board 35 is easier if the first main surface is the surface on which the circuit board 35 is installed. In the example of FIGS. 8A and 8B, the shape of the circuit board 35 is rectangular, but is not limited to the shape of the present embodiment, and can be arbitrarily changed.
　《第６の実施形態》
　図９は、第６の実施形態に係るアンテナ装置１０６の平面図である。アンテナ装置１０６は、閉ループであるＬＣ共振回路のほかに基材層２２の上に給電コイル３４、整合用キャパシタ３３、およびＲＦＩＣ３１を備える。給電コイル３４、整合用キャパシタ３３、およびＲＦＩＣ３１は、給電用接続導体３２で接続されている。給電コイル３４をアンテナ装置１０６のコイル用導体パターン１３の近傍に配置することにより、給電コイル３４を例えば１次側コイルとし、コイル用導体パターン１３を２次側コイルとして、これら２つのコイルが電磁界結合される。 << Sixth Embodiment >>
FIG. 9 is a plan view of an antenna device 106 according to the sixth embodiment. The antenna device 106 includes a feeding coil 34, a matching capacitor 33, and an RFIC 31 on the base material layer 22 in addition to an LC resonance circuit that is a closed loop. The feeding coil 34, the matching capacitor 33, and the RFIC 31 are connected by a feeding connecting conductor 32. By arranging the feeding coil 34 in the vicinity of the coil conductor pattern 13 of the antenna device 106, the feeding coil 34 is a primary side coil, the coil conductor pattern 13 is a secondary side coil, and these two coils are electromagnetic. Bounded.
　給電コイル３４は、図７などに示すアンテナ装置１０５のようにＲＦＩＣ３１とアンテナ装置とを直接接続する必要がないため、コイル用導体パターン１３の近傍であれば比較的自由な位置に配置することができる。また、コイル用導体パターン１３の開口部と給電コイル３４の開口部を近接させることにより、電磁界結合の結合度を高めることができる。ただし、給電コイル３４の近傍にキャパシタ用導体パターン（１６，１８など）が存在する場合には、キャパシタ用導体パターン近傍の磁束が減少したり、キャパシタ用導体パターンを避けるようにその表面に沿って磁束が広がったりするため、電磁界結合の結合度は小さくなる。したがって、給電コイル３４をキャパシタ用導体パターンと平面視で重ならない位置（図９中のＺ１）に配置することが好ましい。 Since it is not necessary to directly connect the RFIC 31 and the antenna device as in the antenna device 105 shown in FIG. 7 and the like, the feeding coil 34 can be disposed in a relatively free position in the vicinity of the coil conductor pattern 13. it can. Further, by bringing the opening of the coil conductor pattern 13 close to the opening of the feeding coil 34, the coupling degree of electromagnetic field coupling can be increased. However, when there is a capacitor conductor pattern (16, 18 or the like) in the vicinity of the feeding coil 34, the magnetic flux near the capacitor conductor pattern is reduced or along the surface so as to avoid the capacitor conductor pattern. Since the magnetic flux spreads, the coupling degree of the electromagnetic field coupling becomes small. Therefore, it is preferable to arrange the feeding coil 34 at a position (Z1 in FIG. 9) that does not overlap the capacitor conductor pattern in plan view.
　図１０（Ａ）は、第６の実施形態に係る通信端末装置の主要部の平面図である。図１０（Ｂ）は、その正面図である。この通信端末装置は、アンテナ装置１０３、ＲＦＩＣ３１、整合用キャパシタ３３、給電コイル３４、および回路基板３５を備えている。アンテナ装置１０３、ＲＦＩＣ３１、整合用キャパシタ３３、および給電コイル３４はいずれも回路基板３５に実装されている。給電コイル３４、整合用キャパシタ３３、およびＲＦＩＣ３１は、給電用接続導体３２で接続されている。コイル用導体パターン１３は、給電コイル３４と電磁界結合される。なお、図１０（Ａ）（Ｂ）の例では、回路基板３５の形状は矩形であるが、本実施形態の形状に限られるものではなく、任意に変更可能である。なお、回路基板３５とコイル用導体パターン１３との間には磁性体シートが配置される構成でもよい。 FIG. 10A is a plan view of the main part of the communication terminal apparatus according to the sixth embodiment. FIG. 10B is a front view thereof. The communication terminal device includes an antenna device 103, an RFIC 31, a matching capacitor 33, a feeding coil 34, and a circuit board 35. The antenna device 103, the RFIC 31, the matching capacitor 33, and the feeding coil 34 are all mounted on the circuit board 35. The feeding coil 34, the matching capacitor 33, and the RFIC 31 are connected by a feeding connecting conductor 32. The coil conductor pattern 13 is electromagnetically coupled to the feeding coil 34. In the example of FIGS. 10A and 10B, the shape of the circuit board 35 is rectangular, but is not limited to the shape of the present embodiment, and can be arbitrarily changed. The magnetic sheet may be arranged between the circuit board 35 and the coil conductor pattern 13.
　アンテナ装置１０３は、そのコイル用導体パターン１３に対してＲＦＩＣ３１と直接接続する必要がないため、基材層２２の第１主面および第２主面のうち、どちらの面を回路基板３５に設置してもよい。但し、給電コイル３４を回路基板３５に実装する場合には、コイル用導体パターン１３が形成されている第１主面を回路基板３５に対する設置面とした方が電磁界結合の結合度を高めるには有利である。 Since the antenna device 103 does not need to be directly connected to the RFIC 31 with respect to the coil conductor pattern 13, one of the first main surface and the second main surface of the base material layer 22 is installed on the circuit board 35. May be. However, when the power feeding coil 34 is mounted on the circuit board 35, the coupling degree of electromagnetic field coupling is improved by using the first main surface on which the coil conductor pattern 13 is formed as the installation surface with respect to the circuit board 35. Is advantageous.
　また、給電コイル３４は、回路基板３５のアンテナ装置を設置している面、または回路基板３５のアンテナ装置を設置している面と異なる面、のいずれに設置してもよい。図１０（Ａ）（Ｂ）の例のように、給電コイル３４とアンテナ装置１０３を回路基板３５の同じ面に設置する場合には、回路基板３５上に設置する回路素子の点数が増加するため、配置位置の制限をうける可能性はある。しかし、給電コイル３４とコイル用導体パターン１３との距離が近接するため電磁界結合の結合度を高めることができる。逆に、給電コイル３４とアンテナ装置をそれぞれ回路基板３５の異なる面に設置する場合には、給電コイル３４とコイル用導体パターン１３との距離が遠くなるため電磁界結合の結合度が下がる。しかし、回路基板３５上に設置する回路素子の点数が減少するため、配置位置の制限をうける可能性は低い。 Further, the feeding coil 34 may be installed on either the surface on which the antenna device of the circuit board 35 is installed or a surface different from the surface on which the antenna device of the circuit board 35 is installed. 10A and 10B, when the feeding coil 34 and the antenna device 103 are installed on the same surface of the circuit board 35, the number of circuit elements installed on the circuit board 35 increases. There is a possibility that the arrangement position is restricted. However, since the distance between the feeding coil 34 and the coil conductor pattern 13 is close, the coupling degree of electromagnetic coupling can be increased. On the contrary, when the feeding coil 34 and the antenna device are installed on different surfaces of the circuit board 35, the distance between the feeding coil 34 and the coil conductor pattern 13 is long, so that the coupling degree of electromagnetic coupling is lowered. However, since the number of circuit elements to be installed on the circuit board 35 is reduced, the possibility of being limited in the arrangement position is low.
　上記給電コイル３４は、次のような構成のチップコイルである。例えば、給電コイル３４は、絶縁体層が積層された樹脂多層部材や焼結されたセラミック（フェライトを含む）多層部材等で構成されている。また、給電コイル３４内部に配置される絶縁体層は少なくとも一部が磁性体であることが好ましい。給電コイル３４内部に磁性体が配置されることにより、コイルから生じる磁束が多くなり、給電コイル３４とコイル用導体パターン１３との結合が強まる。複数の層のうち所定の２つの層に、面方向に互いに平行に延伸する複数の線条導体パターンが形成されていて、複数の層に上記線条導体の端部同士を接続する層間接続導体（ビア導体）が形成されている。これにより、横向きの角筒に沿ったヘリカル状のコイルが積層体内に形成されている。積層体の下面にはコイルの両端に導通する２つの端子が形成されている。 The feeding coil 34 is a chip coil having the following configuration. For example, the power supply coil 34 is configured by a resin multilayer member in which an insulating layer is laminated, a sintered ceramic (including ferrite) multilayer member, or the like. Moreover, it is preferable that at least a part of the insulating layer disposed inside the power feeding coil 34 is a magnetic material. By arranging the magnetic body inside the power feeding coil 34, the magnetic flux generated from the coil increases, and the coupling between the power feeding coil 34 and the coil conductor pattern 13 is strengthened. Interlayer connection conductors in which a plurality of linear conductor patterns extending in parallel to each other in a plane direction are formed in two predetermined layers of the plurality of layers, and the ends of the linear conductors are connected to the plurality of layers (Via conductor) is formed. Thereby, the helical coil along the horizontal square tube is formed in the laminated body. Two terminals that are electrically connected to both ends of the coil are formed on the lower surface of the laminate.
　給電コイル３４を回路基板に実装することにより、給電コイル３４のコイル巻回軸は回路基板の面方向にあり、コイル用導体パターン１３と鎖交する向きとなる。したがって、チップコイルとコイル用導体パターン１３とが電磁界結合する。 By mounting the power feeding coil 34 on the circuit board, the coil winding axis of the power feeding coil 34 is in the surface direction of the circuit board and is in the direction interlinking with the coil conductor pattern 13. Therefore, the chip coil and the coil conductor pattern 13 are electromagnetically coupled.
　《第７の実施形態》
　図１１は、第７の実施形態に係るアンテナ装置１０７の平面図である。アンテナ装置１０７の構成はアンテナ装置１０５とほぼ同様であるが、第３のキャパシタ用導体パターン１６と連結導体パターン１９（第４のキャパシタ用導体パターン）との間を電気的に接続する接続用導体パターン（図３（Ｂ）に示した２０）がアンテナ装置１０７にはない。アンテナ装置１０７は、基材層２２にＲＦＩＣ３１を備える。第３のキャパシタ用導体パターン１６と連結導体パターン１９（第４のキャパシタ用導体パターン）との間にこのＲＦＩＣ３１が給電用接続導体３２を介して接続されている。したがって、アンテナ装置１０７は、第１キャパシタおよび第２キャパシタの間にＲＦＩＣ３１が直列に接続されてＬＣ直列共振回路を構成している。なお、ＲＦＩＣ３１を回路基板に備えてＬＣ直列共振回路を構成する場合には、第３のキャパシタ用導体パターン１６および連結導体パターン１９とＲＦＩＣ３１とを接続する給電用接続導体３２の接続点が第２主面側となる。したがって、この場合にアンテナ装置１０７は、その基材層２２の第２主面を回路基板に対する設置面とした方が回路基板上の配線が容易となる。 << Seventh Embodiment >>
FIG. 11 is a plan view of an antenna device 107 according to the seventh embodiment. The configuration of the antenna device 107 is substantially the same as that of the antenna device 105, but a connecting conductor that electrically connects the third capacitor conductor pattern 16 and the connecting conductor pattern 19 (fourth capacitor conductor pattern). The antenna device 107 does not have a pattern (20 shown in FIG. 3B). The antenna device 107 includes the RFIC 31 on the base material layer 22. The RFIC 31 is connected between the third capacitor conductor pattern 16 and the connecting conductor pattern 19 (fourth capacitor conductor pattern) via a power supply connection conductor 32. Therefore, in the antenna device 107, the RFIC 31 is connected in series between the first capacitor and the second capacitor to form an LC series resonance circuit. In the case where the circuit board is provided with the RFIC 31 to form an LC series resonance circuit, the connection point of the power supply connecting conductor 32 connecting the third capacitor conductor pattern 16 and the connecting conductor pattern 19 and the RFIC 31 is the second. It becomes the main surface side. Therefore, in this case, the antenna device 107 can be easily wired on the circuit board when the second main surface of the base material layer 22 is the installation surface with respect to the circuit board.
　《第８の実施形態》
　図１２（Ａ）は、第８の実施形態に係る通信端末装置２０１Ａの断面図である。通信端末装置２０１Ａは、筐体３７と筐体３７の内部に収めた回路基板３５およびアンテナ装置１０３を備える。アンテナ装置１０３は筐体３７内側の壁面に設置されており、回路基板３５はアンテナ装置１０３に対向配置している。アンテナ装置１０３は第３の実施形態で示したアンテナ装置１０３と同じものである。アンテナ装置１０３と対向する回路基板３５の面には回路素子を実装するため、アンテナ装置１０３と回路基板３５との間には、上記回路素子が実装できる程度の間隙が存在する。回路基板３５には回路素子であるＲＦＩＣ３１が実装されている。ＲＦＩＣ３１は、給電用接続導体３２を介してアンテナ装置１０３に接続される。回路基板３５とアンテナ装置１０３の間隙を電気的に接続する給電用接続導体３２は、例えばスプリングピンなどである。図１２（Ａ）に示した構成では、アンテナ装置１０３を筐体３７内側の壁面に設置したことにより、アンテナ装置を回路基板３５に実装する場合と比較して、回路基板３５に実装する回路素子の点数が減少するため、回路素子およびアンテナ装置の配置についての自由度は高い。なお、回路基板３５とコイル用導体パターン１３との間には磁性体シートが配置される構成でもよい。 << Eighth Embodiment >>
FIG. 12A is a cross-sectional view of a communication terminal apparatus 201A according to the eighth embodiment. The communication terminal device 201 </ b> A includes a housing 37, a circuit board 35 housed inside the housing 37, and the antenna device 103. The antenna device 103 is installed on the inner wall surface of the casing 37, and the circuit board 35 is disposed to face the antenna device 103. The antenna device 103 is the same as the antenna device 103 shown in the third embodiment. Since circuit elements are mounted on the surface of the circuit board 35 facing the antenna device 103, there is a gap between the antenna apparatus 103 and the circuit board 35 so that the circuit elements can be mounted. An RFIC 31 that is a circuit element is mounted on the circuit board 35. The RFIC 31 is connected to the antenna device 103 via the power supply connection conductor 32. The power supply connection conductor 32 that electrically connects the gap between the circuit board 35 and the antenna device 103 is, for example, a spring pin. In the configuration shown in FIG. 12A, the antenna device 103 is installed on the inner wall surface of the housing 37, so that the circuit element mounted on the circuit board 35 is compared with the case where the antenna device is mounted on the circuit board 35. Therefore, the degree of freedom regarding the arrangement of the circuit elements and the antenna device is high. The magnetic sheet may be arranged between the circuit board 35 and the coil conductor pattern 13.
　図１２（Ｂ）は、第８の実施形態に係る別の通信端末装置２０１Ｂの断面図である。通信端末装置２０１Ｂは、通信端末装置２０１Ａと同様に、筐体３７と筐体３７の内部に収めた回路基板３５およびアンテナ装置１０３を備える。アンテナ装置１０３は筐体３７内側の壁面に設置されており、回路基板３５はアンテナ装置１０３に対向配置している。アンテナ装置１０３と対向する回路基板３５の面には、回路素子を実装するため、アンテナ装置１０３と回路基板３５との間には上記回路素子が実装できる程度の間隙が存在する。回路基板３５には、回路素子である、ＲＦＩＣ３１、整合用キャパシタ３３、および給電コイル３４が実装されており、給電コイル３４はアンテナ装置１０７のコイル用導体パターン１３と電磁界結合する。給電コイル３４は、ＲＦＩＣ３１とアンテナ装置とを直接接続する必要がないため、コイル用導体パターンの近傍であれば比較的自由な位置に配置することができる。 FIG. 12B is a cross-sectional view of another communication terminal apparatus 201B according to the eighth embodiment. Similar to the communication terminal device 201A, the communication terminal device 201B includes a housing 37, a circuit board 35 housed in the housing 37, and the antenna device 103. The antenna device 103 is installed on the inner wall surface of the casing 37, and the circuit board 35 is disposed to face the antenna device 103. Since circuit elements are mounted on the surface of the circuit board 35 facing the antenna device 103, there is a gap between the antenna apparatus 103 and the circuit board 35 so that the circuit elements can be mounted. On the circuit board 35, the RFIC 31, which is a circuit element, a matching capacitor 33, and a feeding coil 34 are mounted. The feeding coil 34 is electromagnetically coupled to the coil conductor pattern 13 of the antenna device 107. Since it is not necessary to directly connect the RFIC 31 and the antenna device, the feeding coil 34 can be disposed in a relatively free position as long as it is in the vicinity of the coil conductor pattern.
　なお、回路基板３５とコイル用導体パターン１３との間には磁性体シートが配置される構成でもよい。回路基板３５とコイル用導体パターン１３との間に磁性体シートを配置することにより、回路基板３５上の電子部品や配線パターン等との間の不要な結合を抑制できる。回路基板３５とコイル用導体パターン１３との間に磁性体シートが配置される場合、磁性体シートは、給電コイル３４とコイル用導体パターン１３とが対向する領域を避けて配置してもよい。このように、磁性体シートが給電コイル３４とコイル用導体パターン１３とが対向する領域を避けて配置することにより、磁性体シートによって給電コイル３４とコイル用導体パターン１３との結合の阻害を防ぐ。 In addition, the structure by which a magnetic material sheet is arrange | positioned between the circuit board 35 and the conductor pattern 13 for coils may be sufficient. By disposing a magnetic sheet between the circuit board 35 and the coil conductor pattern 13, it is possible to suppress unnecessary coupling with electronic components, wiring patterns, and the like on the circuit board 35. When a magnetic sheet is disposed between the circuit board 35 and the coil conductor pattern 13, the magnetic sheet may be disposed so as to avoid a region where the feeding coil 34 and the coil conductor pattern 13 face each other. As described above, the magnetic sheet is disposed so as to avoid the region where the feeding coil 34 and the coil conductor pattern 13 are opposed to each other, thereby preventing the magnetic sheet from hindering the coupling between the feeding coil 34 and the coil conductor pattern 13. .
　《第９の実施形態》
　図１３（Ａ）は、第９の実施形態に係る通信端末装置の主要部の平面図である。図１３（Ｂ）は、その正面図である。この通信端末装置は、アンテナ装置１０３および回路基板３６を備えている。アンテナ装置１０３は回路基板３６に実装されており、回路基板３６はグランドパターンである面状導体４１を内部に備えた多層基板である。なお、図８などに示したように、図示してはいないがＲＦＩＣも回路基板３６に設置されている。ＲＦＩＣは、給電用接続導体を介してアンテナ装置１０３と直接接続されており、ＬＣ並列共振回路を構成している。 << Ninth embodiment >>
FIG. 13A is a plan view of the main part of a communication terminal apparatus according to the ninth embodiment. FIG. 13B is a front view thereof. This communication terminal device includes an antenna device 103 and a circuit board 36. The antenna device 103 is mounted on a circuit board 36, and the circuit board 36 is a multilayer board having a planar conductor 41 as a ground pattern therein. As shown in FIG. 8 and the like, although not shown, the RFIC is also installed on the circuit board 36. The RFIC is directly connected to the antenna device 103 via a feeding connection conductor, and constitutes an LC parallel resonance circuit.
　この構成により、アンテナ装置１０３のコイル用導体パターンと面状導体４１とが対向して配置され、コイル用導体パターン１３と面状導体４１とは電磁界結合される。つまり、面状導体４１はアンテナ装置１０３の放射部として作用し、実効的な開口が大きくなることから、アンテナ装置１０３のみの場合と比較してアンテナの利得が向上し、アンテナ特性が改善される。 With this configuration, the coil conductor pattern of the antenna device 103 and the planar conductor 41 are arranged to face each other, and the coil conductor pattern 13 and the planar conductor 41 are electromagnetically coupled. That is, since the planar conductor 41 acts as a radiating portion of the antenna device 103 and an effective aperture is increased, the antenna gain is improved and the antenna characteristics are improved as compared with the case of the antenna device 103 alone. .
　図１４（Ａ）は、第９の実施形態に係る別の通信端末装置の主要部の平面図である。図１４（Ｂ）は、その正面図である。この通信端末装置は、アンテナ装置１０３、給電コイル３４、および回路基板３６を備えている。アンテナ装置１０３および給電コイル３４は回路基板３６に実装されており、回路基板３６は導電性を有する面状導体４１を内部に備えた多層基板である。なお、図示してはいないが、図１０などに示したように、ＲＦＩＣおよび整合用キャパシタも給電コイル３４と同様に回路基板３６に設置されている。給電コイル３４、整合用キャパシタ、およびＲＦＩＣは、給電用接続導体で接続されている。アンテナ装置１０３のコイル用導体パターンは給電コイル３４と電磁界結合する。 FIG. 14A is a plan view of the main part of another communication terminal apparatus according to the ninth embodiment. FIG. 14B is a front view thereof. The communication terminal device includes an antenna device 103, a feeding coil 34, and a circuit board 36. The antenna device 103 and the feeding coil 34 are mounted on a circuit board 36, and the circuit board 36 is a multilayer board having a conductive planar conductor 41 therein. Although not shown, as shown in FIG. 10 and the like, the RFIC and the matching capacitor are also installed on the circuit board 36 similarly to the feeding coil 34. The feeding coil 34, the matching capacitor, and the RFIC are connected by a feeding connecting conductor. The coil conductor pattern of the antenna device 103 is electromagnetically coupled to the feeding coil 34.
　この構成により、給電コイル３４はアンテナ装置１０３のコイル用導体パターン１３の近傍に対向して配置され、給電コイル３４とコイル用導体パターン１３とが電磁界結合される。また、アンテナ装置１０３のコイル用導体パターンと面状導体４１とが対向して配置され、コイル用導体パターン１３と面状導体４１とは電磁界結合される。面状導体４１はアンテナ装置１０３の放射部として作用し、実効的な開口が大きくなることから、アンテナ装置１０３のみの場合と比較してアンテナの利得が向上し、アンテナ特性が改善される。 With this configuration, the feeding coil 34 is disposed in the vicinity of the coil conductor pattern 13 of the antenna device 103, and the feeding coil 34 and the coil conductor pattern 13 are electromagnetically coupled. Further, the coil conductor pattern of the antenna device 103 and the planar conductor 41 are arranged to face each other, and the coil conductor pattern 13 and the planar conductor 41 are electromagnetically coupled. Since the planar conductor 41 acts as a radiating portion of the antenna device 103 and an effective aperture is increased, the antenna gain is improved and the antenna characteristics are improved as compared with the case of the antenna device 103 alone.
　給電コイル３４、コイル用導体パターン１３、および面状導体４１は相互に電磁界結合される。コイル用導体パターン１３を介して相手側通信端末との通信が行われる場合、電磁界結合の関係は少なくとも以下の１つである。 The feeding coil 34, the coil conductor pattern 13, and the planar conductor 41 are electromagnetically coupled to each other. When communication with the counterpart communication terminal is performed via the coil conductor pattern 13, the relationship of electromagnetic field coupling is at least one of the following.
・相手側通信端末⇔コイル用導体パターン１３⇔給電コイル３４
・相手側通信端末⇔コイル用導体パターン１３⇔面状導体４１⇔給電コイル３４
・相手側通信端末⇔面状導体４１⇔コイル用導体パターン１３⇔給電コイル３４
　面状導体４１の外縁端は縁端効果により磁束が集中しやすいため、コイル用導体パターン１３の開口部および給電コイル３４の開口部と面状導体４１の外縁端を平面視で近接させることにより、効率よく磁束を集中させてコイル用導体パターン１３と面状導体４１間における電磁界結合の結合度を高めることができる。但し、面状導体４１の外縁端や給電コイル３４の近傍にキャパシタ用導体パターン（１４，１５，１６，１７）が存在する場合には、キャパシタ用導体パターン近傍の磁束が減少したり、キャパシタ用導体パターンを避けるようにその表面に沿って磁束が広がったりするため、電磁界結合の結合度は小さくなる。そこで、以下の（１）～（３）のいずれか構成を満たすことが好ましい。この構成により効率よく電磁界結合させることができる。 -Conductor pattern 13 for coil on the other party side 13 Feeding coil 34
-Conductor pattern 13 for coil on the other end side 13 Conductor pattern for coil 13 Planar conductor 41 ⇔ Feeding coil 34
The other party communication terminal side surface conductor 41 side coil conductor pattern 13 side feed coil 34
Since the magnetic flux tends to concentrate on the outer edge of the planar conductor 41 due to the edge effect, the opening of the coil conductor pattern 13 and the opening of the feeding coil 34 and the outer edge of the planar conductor 41 are brought close to each other in plan view. The magnetic flux can be concentrated efficiently, and the coupling degree of the electromagnetic field coupling between the coil conductor pattern 13 and the planar conductor 41 can be increased. However, when the capacitor conductor pattern (14, 15, 16, 17) is present near the outer edge of the planar conductor 41 or near the feeding coil 34, the magnetic flux in the vicinity of the capacitor conductor pattern decreases or the capacitor conductor pattern decreases. Since the magnetic flux spreads along the surface so as to avoid the conductor pattern, the coupling degree of the electromagnetic field coupling becomes small. Therefore, it is preferable to satisfy any of the following configurations (1) to (3). This configuration enables efficient electromagnetic field coupling.
（１）アンテナ装置のキャパシタ用導体パターンが、コイル用導体パターン１３の巻回軸（後に示す図１７中の４６）から面状導体４１の外縁までの距離が最短となる外縁端（図１７中の４７）の位置と巻回軸とを結ぶ線（図１７中の４８）に平面視で重ならないよう配置されていること。 (1) The capacitor conductor pattern of the antenna device has an outer edge (in FIG. 17) where the distance from the winding axis of the coil conductor pattern 13 (46 in FIG. 17 described later) to the outer edge of the planar conductor 41 is the shortest. 47) and the line connecting the winding axis (48 in FIG. 17) so as not to overlap in plan view.
（２）アンテナ装置のキャパシタ用導体パターンが、平面視で面状導体４１の外縁端（および給電コイル３４）に重ならない位置に配置されていること。 (2) The capacitor conductor pattern of the antenna device is disposed at a position that does not overlap the outer edge (and the feeding coil 34) of the planar conductor 41 in plan view.
（３）アンテナ装置のキャパシタ用導体パターンが、平面視で面状導体４１の外縁端（および給電コイル３４）の近傍に沿うような位置に配置されていないこと。 (3) The capacitor conductor pattern of the antenna device is not arranged at a position along the vicinity of the outer edge (and the feeding coil 34) of the planar conductor 41 in plan view.
　なお、図１３（Ａ）や図１４（Ａ）に示したように、本実施形態において、面状導体４１（および回路基板３６）の縦方向の幅とアンテナ装置１０３の幅とはほぼ同じ長さであるが、本実施形態の構成に限られるものではなく、任意に変更可能である。図１７は、面状導体とアンテナ装置との位置関係についての説明図である。この例では、面状導体４１の縦および横方向の幅がアンテナ装置の幅よりも充分広い。それ以外は図１３に示す通信端末装置とほぼ同じである。この場合でも、効率よく電磁界結合させるためには上記（１）～（３）のいずれかの構成を満たすことが好ましい。 13A and 14A, in the present embodiment, the vertical width of the planar conductor 41 (and the circuit board 36) and the width of the antenna device 103 are substantially the same length. However, it is not limited to the configuration of the present embodiment, and can be arbitrarily changed. FIG. 17 is an explanatory diagram of the positional relationship between the planar conductor and the antenna device. In this example, the vertical and horizontal widths of the planar conductor 41 are sufficiently wider than the width of the antenna device. Other than that, it is almost the same as the communication terminal apparatus shown in FIG. Even in this case, it is preferable to satisfy any one of the above configurations (1) to (3) in order to efficiently perform electromagnetic field coupling.
　面状導体４１が、回路基板３６のグランド電極である場合、面状導体４１にアンテナ装置１０３の導体パターンが接触すると、所期のアンテナ特性が得られない。したがって、本実施形態のようにアンテナ装置１０３と面状導体４１との間に絶縁体の平板を挟んだ構成や、アンテナ装置１０３と面状導体４１との間に間隙を設けたりして、アンテナ装置１０３と面状導体４１とが接触しないようにすることが望ましい。 When the planar conductor 41 is the ground electrode of the circuit board 36, if the conductor pattern of the antenna device 103 contacts the planar conductor 41, desired antenna characteristics cannot be obtained. Therefore, as in the present embodiment, an antenna plate 103 is sandwiched between the antenna device 103 and the planar conductor 41, or a gap is provided between the antenna device 103 and the planar conductor 41, so that the antenna It is desirable to prevent the device 103 and the planar conductor 41 from contacting each other.
　本実施形態において、回路基板３６は、グランドパターンである面状導体４１を内部に備えた多層基板であるが、本実施形態の構成に限られるものではなく、任意に変更可能である。例えば、アンテナ装置と設置する範囲のみ絶縁体の平板を挟んだ構成や、回路基板のアンテナ装置を設置している面と異なる面に面状導体を備えた構成などがある。また、本実施形態において、面状導体４１の形状は回路基板３６と同じ矩形であるが、本実施形態の形状に限られるものではなく、任意に変更可能である。なお、回路基板３６とコイル用導体パターン１３との間には磁性体シートが配置される構成でもよい。回路基板３６とコイル用導体パターン１３との間に磁性体シートを配置することにより、回路基板３６上の電子部品や配線パターン、面状導体４１等との間の、通信に寄与しない不要な結合を抑制できる。 In the present embodiment, the circuit board 36 is a multilayer board provided with a planar conductor 41 as a ground pattern therein, but is not limited to the configuration of the present embodiment and can be arbitrarily changed. For example, there are a configuration in which a flat plate of an insulator is sandwiched only in a range where the antenna device is installed, and a configuration in which a planar conductor is provided on a surface different from the surface on which the antenna device is installed. In the present embodiment, the shape of the planar conductor 41 is the same rectangle as that of the circuit board 36, but is not limited to the shape of the present embodiment and can be arbitrarily changed. In addition, the structure by which a magnetic material sheet is arrange | positioned between the circuit board 36 and the conductor pattern 13 for coils may be sufficient. By disposing a magnetic sheet between the circuit board 36 and the coil conductor pattern 13, unnecessary coupling that does not contribute to communication between the electronic component, the wiring pattern, the planar conductor 41, etc. on the circuit board 36. Can be suppressed.
　《第１０の実施形態》
　図１５（Ａ）は、第１０の実施形態に係る通信端末装置２０２の平面図である。図１５（Ｂ）は、第１０の実施形態に係る通信端末装置２０２の断面図である。この例では、通信端末装置の上部筐体３８が金属製であり、面状導体として作用する。通信端末装置２０２は、上部筐体３８、アンテナ装置１０３、定在波型アンテナの放射素子６１，６２、ディスプレイ用ガラス３９および回路基板３５などを備える。 << Tenth Embodiment >>
FIG. 15A is a plan view of a communication terminal apparatus 202 according to the tenth embodiment. FIG. 15B is a cross-sectional view of the communication terminal apparatus 202 according to the tenth embodiment. In this example, the upper casing 38 of the communication terminal device is made of metal and acts as a planar conductor. The communication terminal device 202 includes an upper casing 38, an antenna device 103, standing wave antenna radiation elements 61 and 62, a display glass 39, a circuit board 35, and the like.
　図１５（Ａ）（Ｂ）に示すように、上部筐体３８および定在波型アンテナの放射素子６１，６２は、通信端末装置２０２の筐体の一部を構成している。定在波型アンテナの放射素子６１，６２は導電性を有し、ＵＨＦ帯またはＳＨＦ帯で定在波を生じる放射素子であり、給電回路に接続されている（図示省略）。 15A and 15B, the upper casing 38 and the radiating elements 61 and 62 of the standing wave antenna constitute a part of the casing of the communication terminal device 202. The radiating elements 61 and 62 of the standing wave antenna are conductive, and are radiating elements that generate a standing wave in the UHF band or the SHF band, and are connected to a feeder circuit (not shown).
　アンテナ装置１０３は上部筐体３８内側の壁面に接着層４９を挟んで（介して）設置されており、回路基板３５はこのアンテナ装置１０３に対向して配置されている。上部筐体３８には、図１５（Ａ）の分解平面図のＹ軸方向に延伸するスリット４０，４２が形成されており、アンテナ装置１０３のコイル用導体パターン１３の形状に合わせた開口部４４が設けられている。また、開口部４４からスリット４２に向かってさらにスリット４３が設けられている。本実施形態において開口部４４内にはデバイス６３が配置されている。 The antenna device 103 is installed on (into) the adhesive layer 49 on the inner wall surface of the upper housing 38, and the circuit board 35 is arranged to face the antenna device 103. Slits 40 and 42 extending in the Y-axis direction of the exploded plan view of FIG. 15A are formed in the upper housing 38, and the opening 44 according to the shape of the coil conductor pattern 13 of the antenna device 103. Is provided. A slit 43 is further provided from the opening 44 toward the slit 42. In the present embodiment, a device 63 is disposed in the opening 44.
　この構成とすることで、コイル用導体パターン１３の開口部を通る磁束の集磁効果を高めることができるとともに、面状導体の垂直方向の磁束がとらえやすくなるため、アンテナの利得が向上し、アンテナ特性が改善される。 With this configuration, it is possible to enhance the magnetic flux collecting effect of the magnetic flux passing through the opening of the coil conductor pattern 13 and to easily capture the magnetic flux in the vertical direction of the planar conductor, thereby improving the antenna gain, Antenna characteristics are improved.
　本実施形態に示すように、デバイス６３を備えるために筐体に設けられた開口部を利用することができる。デバイス６３は例えば、カメラやフラッシュ、スピーカー、イヤホンジャック、カードスロット、ＵＳＢなどの端子、電池カバー、ボタン、センサなどのデバイスである。なお、本実施形態では、開口部４４内にデバイス６３が配置される例を示したが、開口部４４およびスリット４０，４２，４３が樹脂で覆われる構成であってもよい。 As shown in the present embodiment, an opening provided in the housing can be used to provide the device 63. The device 63 is, for example, a device such as a camera, a flash, a speaker, an earphone jack, a card slot, a USB terminal, a battery cover, a button, or a sensor. In the present embodiment, the device 63 is disposed in the opening 44. However, the opening 44 and the slits 40, 42, and 43 may be covered with resin.
　さらに、図１５（Ｂ）に示すように、本実施形態では、基材層２２の第２主面（回路基板３５と対向するアンテナ装置１０３の主面）に磁性体シート４５が配置されている。そのため、磁性体シート４５の高い透磁率の作用により、コイル用導体パターン１３は少ないターン数で所定のインダクタンスが得ることができる。また、磁性体シート４５の集磁効果により、通信相手側のコイルアンテナとの磁界結合を高めることができる。また、磁性体シート４５を回路基板３５との間に配置することにより、回路基板３５側の磁気シールド効果も得られる。なお、磁性体シート４５によって給電コイル３４とコイル用導体パターン１３との結合の阻害を防ぐため、本実施形態の磁性体シート４５は、図１５（Ｂ）に示すように、給電コイル３４とコイル用導体パターン１３とが対向する領域を避けて配置している。 Further, as shown in FIG. 15B, in the present embodiment, the magnetic sheet 45 is disposed on the second main surface of the base material layer 22 (main surface of the antenna device 103 facing the circuit board 35). . Therefore, due to the high magnetic permeability of the magnetic sheet 45, the coil conductor pattern 13 can obtain a predetermined inductance with a small number of turns. Further, the magnetic coupling effect of the magnetic material sheet 45 can enhance the magnetic field coupling with the coil antenna on the communication partner side. In addition, by arranging the magnetic sheet 45 between the circuit board 35 and the circuit board 35, a magnetic shield effect on the circuit board 35 side can be obtained. In order to prevent the magnetic sheet 45 from hindering the coupling between the power supply coil 34 and the coil conductor pattern 13, the magnetic sheet 45 of this embodiment includes a power supply coil 34 and a coil as shown in FIG. The conductive pattern 13 is disposed so as to avoid the region facing the conductive pattern 13.
　また、筐体または筐体開口部の周囲に磁性体シートを配置してもよい。このことにより、コイル用導体パターン１３の開口部を通る磁束の集磁効果を高めることができ、アンテナ特性が向上する。また、コイル用導体パターン１３と電磁界結合する給電コイル３４との結合度を高めることもできる。 Further, a magnetic sheet may be arranged around the casing or the casing opening. Thereby, the magnetic flux collecting effect of the magnetic flux passing through the opening of the coil conductor pattern 13 can be enhanced, and the antenna characteristics are improved. In addition, the degree of coupling between the coil conductor pattern 13 and the feeding coil 34 that is electromagnetically coupled can be increased.
　また、通信端末装置２０２は、スリット４０，４２を挟んで、定在波型アンテナの放射素子６１、上部筐体３８および定在波型アンテナの放射素子６２の順でＸ軸方向に配置された構造である。つまり、通信端末装置２０２はＨＦ帯を通信周波数とするアンテナ装置１０３だけでなく、セルラー通信やＷｉ－Ｆｉ（登録商標）用などのＵＨＦ帯またはＳＨＦ帯で定在波を生じる定在波型アンテナの放射素子をさらに備えるため、周波数帯の異なる複数のシステムで兼用することができる。 In addition, the communication terminal device 202 is disposed in the X-axis direction in the order of the radiating element 61 of the standing wave antenna, the upper casing 38, and the radiating element 62 of the standing wave antenna with the slits 40 and 42 interposed therebetween. It is a structure. That is, the communication terminal device 202 is not only the antenna device 103 having a communication frequency in the HF band, but also a standing wave antenna that generates a standing wave in the UHF band or the SHF band for cellular communication or Wi-Fi (registered trademark). Since the radiating element is further provided, it can be shared by a plurality of systems having different frequency bands.
　《第１１の実施形態》
　図１６は、第１１の実施形態に係る通信端末装置２０３の分解平面図である。上部筐体５１の内部には回路基板５３Ａ，５３Ｂ，５３Ｃ、給電コイル５４、バッテリーパック５５、カメラモジュール５７Ａなどが実装されている。回路基板５３ＡにはＵＨＦ帯アンテナ５６Ａなどが搭載されている。また、回路基板５３ＢにはＵＨＦ帯アンテナ５６Ｂなどが搭載され、回路基板５３ＣにはＵＨＦ帯アンテナ５６Ｂなどが搭載されている。回路基板５３Ａ，５３Ｂ，５３Ｃそれぞれはケーブル５８Ａ，５８Ｂ，５８Ｃを介して接続されている。 << Eleventh Embodiment >>
FIG. 16 is an exploded plan view of the communication terminal device 203 according to the eleventh embodiment. Circuit boards 53A, 53B, and 53C, a power supply coil 54, a battery pack 55, a camera module 57A, and the like are mounted inside the upper casing 51. A UHF band antenna 56A and the like are mounted on the circuit board 53A. Further, a UHF band antenna 56B and the like are mounted on the circuit board 53B, and a UHF band antenna 56B and the like are mounted on the circuit board 53C. The circuit boards 53A, 53B, and 53C are connected via cables 58A, 58B, and 58C, respectively.
　下部筐体５２にはアンテナ装置１０３およびカメラモジュール用開口５７Ｂが設けられている。アンテナ装置１０３のコイル用導体パターン１３は、回路基板５３Ｂに搭載されている給電コイル５４と電磁界結合する。給電コイル５４はＲＦＩＣと電気的に接続されている。下部筐体５２は樹脂製であるが、その内面に金属膜による面状導体を形成してもよい。 The lower casing 52 is provided with an antenna device 103 and a camera module opening 57B. The coil conductor pattern 13 of the antenna device 103 is electromagnetically coupled to the feeding coil 54 mounted on the circuit board 53B. The feeding coil 54 is electrically connected to the RFIC. The lower housing 52 is made of resin, but a planar conductor made of a metal film may be formed on the inner surface thereof.
　《その他の実施形態》
　以上の各実施形態は例示であって、本発明はこれらの実施形態に限るものではない。アンテナ装置の各導体パターンおよび基材層に例示した材料とは異なる材質を使用してもよく、これらの厚みを適宜変更してもよい。また、通信端末装置の金属製の筐体を面状導体として利用することに限らない。例えば、シールドケース、シールド板、ＬＣＤパネル等を面状導体として利用してもよい。 << Other Embodiments >>
Each of the above embodiments is an exemplification, and the present invention is not limited to these embodiments. Different materials from those exemplified for each conductor pattern and base material layer of the antenna device may be used, and the thicknesses thereof may be appropriately changed. Moreover, it does not restrict to using the metal housing | casing of a communication terminal device as a planar conductor. For example, a shield case, a shield plate, an LCD panel, or the like may be used as the planar conductor.
１…基材
２…コイル
３…コンデンサ
４…ＩＣチップ
１１…第１主面側導体パターン
１２…第２主面側導体パターン
１３…コイル用導体パターン
１４…第１のキャパシタ用導体パターン
１５…第２のキャパシタ用導体パターン
１６…第３のキャパシタ用導体パターン
１７…第４のキャパシタ用導体パターン
１８…導体片
１９…連結導体パターン
２０…接続用導体パターン
２１…基材層（絶縁体）
２２…基材層（誘電体）
２３…基材層（磁性体）
２４Ａ，２４Ｂ…磁性体シート
３１…ＲＦＩＣ
３２…給電用接続導体
３３…整合用キャパシタ
３４…給電コイル
３５，３６…回路基板
３７…筐体
３８…上部筐体
３９…ディスプレイ用ガラス
４１…面状導体
４０，４２，４３…スリット
４４…開口部
４５…磁性体シート
４６…コイル用導体パターンの巻回軸
４７…コイル用導体パターンの巻回軸から面状導体の外縁までの距離が最短となる外縁端の位置
４８…コイル用導体パターンの巻回軸から面状導体の外縁までの距離が最短となる外縁端の位置と巻回軸とを結ぶ線
４９…接着層
５１…上部筐体
５２…下部筐体
５３Ａ，５３Ｂ，５３Ｃ…回路基板
５４…給電コイル
５５…バッテリーパック
５６Ａ，５６Ｂ…ＵＨＦ帯アンテナ
５７Ａ…カメラモジュール
５７Ｂ…カメラモジュール用開口
５８Ａ，５８Ｂ，５８Ｃ…ケーブル
６１，６２…定在波型アンテナの放射素子
６３…デバイス
１０１…アンテナ装置
１０２Ａ，１０２Ｂ，１０２Ｃ…アンテナ装置
１０３…アンテナ装置
１０４Ａ，１０４Ｂ…アンテナ装置
１０５～１０７…アンテナ装置
２０１Ａ，２０１Ｂ…通信端末装置
２０２，２０３…通信端末装置 DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Coil 3 ... Capacitor 4 ... IC chip 11 ... 1st main surface side conductor pattern 12 ... 2nd main surface side conductor pattern 13 ... Conductor pattern 14 for coils ... 1st conductor pattern 15 for capacitors ... Second capacitor conductor pattern 16 ... Third capacitor conductor pattern 17 ... Fourth capacitor conductor pattern 18 ... Conductor piece 19 ... Connection conductor pattern 20 ... Connection conductor pattern 21 ... Base material layer (insulator)
22 ... Base material layer (dielectric)
23 ... Base material layer (magnetic material)
24A, 24B ... Magnetic material sheet 31 ... RFIC
32 ... Feeding connection conductor 33 ... Matching capacitor 34 ... Feeding coils 35, 36 ... Circuit board 37 ... Housing 38 ... Upper housing 39 ... Display glass 41 ... Planar conductors 40, 42, 43 ... Slit 44 ... Opening Part 45 ... Magnetic sheet 46 ... Winding shaft 47 of coil conductor pattern ... Position 48 of outer edge where distance from winding axis of coil conductor pattern to outer edge of planar conductor is shortest ... Coil conductor pattern A line 49 connecting the position of the outer edge where the distance from the winding axis to the outer edge of the planar conductor is the shortest and the winding axis ... adhesive layer 51 ... upper casing 52 ... lower casing 53A, 53B, 53C ... circuit board 54 ... Feed coil 55 ... Battery pack 56A, 56B ... UHF band antenna 57A ... Camera module 57B ... Camera module opening 58A, 58B, 58C ... Cable 61, 62 ... Standing Radiating element 63 ... device 101 ... antenna unit 102A type antenna, 102B, 102C ... antenna device 103 ... antenna unit 104A, 104B ... antenna unit 105-107 ... antenna device 201A, 201B ... communication terminal device 202, 203 ... communication terminal device

Claims (9)

  1. 　第１主面および第２主面を有し絶縁体からなる基材層と、前記基材層の第１主面上に形成された第１主面側導体パターンと、前記基材層の第２主面上に形成された第２主面側導体パターンとを備えるアンテナ装置において、
    　前記第２主面側導体パターンは、前記第１主面側導体パターンよりも薄く、
    　前記第１主面側導体パターンは、ループ状またはスパイラル状のコイル用導体パターン、前記コイル用導体パターンの第１端に接続された第１のキャパシタ用導体パターン、および前記コイル用導体パターンの第２端に接続された第２のキャパシタ用導体パターンを備え、
    　前記第２主面側導体パターンは、前記基材層を挟んで前記第１のキャパシタ用導体パターンに対向する第３のキャパシタ用導体パターン、および前記基材層を挟んで前記第２のキャパシタ用導体パターンに対向する第４のキャパシタ用導体パターンを備えたことを特徴とする、アンテナ装置。     A base material layer having a first main surface and a second main surface and made of an insulator; a first main surface side conductor pattern formed on the first main surface of the base material layer; In an antenna device provided with the 2nd principal surface side conductor pattern formed on two principal surfaces,
    The second main surface side conductor pattern is thinner than the first main surface side conductor pattern,
    The first main surface side conductor pattern includes a coil conductor pattern having a loop shape or a spiral shape, a first capacitor conductor pattern connected to a first end of the coil conductor pattern, and a first conductor pattern of the coil conductor pattern. A second capacitor conductor pattern connected to two ends;
    The second main surface side conductor pattern includes a third capacitor conductor pattern facing the first capacitor conductor pattern across the base material layer, and the second capacitor conductor across the base material layer. An antenna device comprising a fourth capacitor conductor pattern facing the conductor pattern.
  2. 　前記第３のキャパシタ用導体パターンと前記第４のキャパシタ用導体パターンとの間を接続する接続用導体パターンを備える、請求項１に記載のアンテナ装置。 The antenna device according to claim 1, further comprising a connection conductor pattern that connects the third capacitor conductor pattern and the fourth capacitor conductor pattern.
  3. 　前記第３のキャパシタ用導体パターンまたは前記第４のキャパシタ用導体パターンは、複数の導体片と、それらを連結する線状の連結導体パターンとにより構成されている、請求項１または２に記載のアンテナ装置。 The said 3rd capacitor conductor pattern or the said 4th capacitor conductor pattern is comprised by several conductor pieces and the linear connection conductor pattern which connects them, The Claim 1 or 2 Antenna device.
  4. 　前記連結導体パターンは、前記コイル用導体パターン、前記第１のキャパシタ用導体パターン、および前記第２のキャパシタ用導体パターンと平面視で重なる位置を避けるように配置されている、請求項３に記載のアンテナ装置。 The said connection conductor pattern is arrange | positioned so that the position which overlaps with the said conductor pattern for coils, the said 1st conductor pattern for capacitors, and the said 2nd capacitor conductor pattern in planar view may be arrange | positioned. Antenna device.
  5. 　前記コイル用導体パターンと電磁界結合する給電コイルを備える、請求項２～４のいずれかに記載のアンテナ装置。 The antenna device according to any one of claims 2 to 4, further comprising a feeding coil that is electromagnetically coupled to the coil conductor pattern.
  6. 　前記給電コイルは、前記第１のキャパシタ用導体パターン、前記第２のキャパシタ用導体パターン、前記第３のキャパシタ用導体パターン、および前記第４のキャパシタ用導体パターンとは平面視で重ならない位置に配置されている、請求項５に記載のアンテナ装置。 The feeding coil is positioned so as not to overlap the first capacitor conductor pattern, the second capacitor conductor pattern, the third capacitor conductor pattern, and the fourth capacitor conductor pattern in plan view. The antenna device according to claim 5, wherein the antenna device is arranged.
  7. 　筐体と、筐体内部に設置されたアンテナ装置と、を備えた通信端末装置において、
    　前記アンテナ装置は、請求項１～６のいずれかに記載のアンテナ装置である、通信端末装置。     In a communication terminal device comprising a housing and an antenna device installed inside the housing,
    The communication terminal apparatus, wherein the antenna apparatus is the antenna apparatus according to any one of claims 1 to 6.
  8. 　前記アンテナ装置のコイル用導体パターンと対向して配置される面状導体を備えた、請求項７に記載の通信端末装置。 The communication terminal device according to claim 7, comprising a planar conductor disposed opposite to the coil conductor pattern of the antenna device.
  9. 　前記アンテナ装置の第１のキャパシタ用導体パターン、第２のキャパシタ用導体パターン、第３のキャパシタ用導体パターン、および第４のキャパシタ用導体パターンは、前記コイル用導体パターンの巻回軸から面状導体の外縁までの距離が最短となる外縁端の位置と巻回軸とを結ぶ線に平面視で重ならないよう配置されている、請求項８に記載の通信端末装置。 The first capacitor conductor pattern, the second capacitor conductor pattern, the third capacitor conductor pattern, and the fourth capacitor conductor pattern of the antenna device are planar from the winding axis of the coil conductor pattern. The communication terminal device according to claim 8, wherein the communication terminal device is disposed so as not to overlap with a line connecting a position of an outer edge end where the distance to the outer edge of the conductor is shortest and the winding axis in a plan view.
PCT/JP2015/062038 2014-04-30 2015-04-21 Antenna device and communication terminal device WO2015166835A1 (en)

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WO2017094355A1 (en) * 2015-12-03 2017-06-08 株式会社村田製作所 Antenna device and electronic apparatus
JP2017153060A (en) * 2016-02-22 2017-08-31 株式会社村田製作所 Antenna device and electronic apparatus
CN112018499A (en) * 2019-05-28 2020-12-01 Tdk株式会社 Antenna device and IC card provided with same

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JPH07141578A (en) * 1993-11-19 1995-06-02 Toyo Alum Kk Resonance label
JP2002124415A (en) * 2000-10-17 2002-04-26 Tdk Corp Printed circuit board for high frequency and its manufacturing method
WO2009011154A1 (en) * 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Wireless ic device and electronic device
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JP2013247554A (en) * 2012-05-28 2013-12-09 Murata Mfg Co Ltd Antenna device and communication terminal device

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JPH07141578A (en) * 1993-11-19 1995-06-02 Toyo Alum Kk Resonance label
JP2002124415A (en) * 2000-10-17 2002-04-26 Tdk Corp Printed circuit board for high frequency and its manufacturing method
WO2009011154A1 (en) * 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Wireless ic device and electronic device
JP2012094948A (en) * 2010-10-25 2012-05-17 Nec Tokin Corp Inlet for non-contact communication recording medium, method of manufacturing the same, and non-contact communication recording medium
JP2013247554A (en) * 2012-05-28 2013-12-09 Murata Mfg Co Ltd Antenna device and communication terminal device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017094355A1 (en) * 2015-12-03 2017-06-08 株式会社村田製作所 Antenna device and electronic apparatus
JPWO2017094355A1 (en) * 2015-12-03 2018-03-01 株式会社村田製作所 ANTENNA DEVICE AND ELECTRONIC DEVICE
US10511089B2 (en) 2015-12-03 2019-12-17 Murata Manufacturing Co., Ltd. Antenna device and electronic apparatus
JP2017153060A (en) * 2016-02-22 2017-08-31 株式会社村田製作所 Antenna device and electronic apparatus
CN112018499A (en) * 2019-05-28 2020-12-01 Tdk株式会社 Antenna device and IC card provided with same

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