WO2015163483A1 - Heater and ignition device - Google Patents

Heater and ignition device Download PDF

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Publication number
WO2015163483A1
WO2015163483A1 PCT/JP2015/062651 JP2015062651W WO2015163483A1 WO 2015163483 A1 WO2015163483 A1 WO 2015163483A1 JP 2015062651 W JP2015062651 W JP 2015062651W WO 2015163483 A1 WO2015163483 A1 WO 2015163483A1
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WO
WIPO (PCT)
Prior art keywords
conductive layer
heater
heating resistor
ceramic
average particle
Prior art date
Application number
PCT/JP2015/062651
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French (fr)
Japanese (ja)
Inventor
弘和 永守
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京セラ株式会社
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Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to EP15782910.2A priority Critical patent/EP3136819B1/en
Priority to JP2016515248A priority patent/JP6027289B2/en
Priority to CN201580012328.8A priority patent/CN106105384B/en
Publication of WO2015163483A1 publication Critical patent/WO2015163483A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23Q—IGNITION; EXTINGUISHING-DEVICES
    • F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
    • F23Q7/001—Glowing plugs for internal-combustion engines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/027—Heaters specially adapted for glow plug igniters

Definitions

  • the present invention relates to a heater and an ignition device.
  • a heater in which a heating element is provided inside a ceramic body is known as a heater used for a gas range, an in-vehicle heating device, an oil fan heater, or a glow plug of an automobile engine.
  • a ceramic heater the ceramic heater disclosed by patent document 1 is mentioned, for example.
  • a ceramic heater disclosed in Japanese Unexamined Patent Publication No. 2000-156275 includes a ceramic structure, a heating resistor embedded in the ceramic structure, and a ceramic structure connected to the heating resistor. And a power supply line drawn out on the surface.
  • the heater includes a ceramic laminate formed by laminating a plurality of ceramic layers, a belt-like heating resistor provided between the ceramic layers and having both ends drawn to the side surfaces of the ceramic laminate, and the heating resistor between the ceramic layers.
  • FIG. 2 is a cross-sectional view of the heater shown in FIG. 1 cut along line AA ′.
  • FIG. 2 is a cross-sectional view of the heater shown in FIG. 1 cut along the line BB ′. It is a cross-sectional view showing a modification of the heater. It is a perspective view which shows the ignition device using the heater shown in FIG.
  • the heater 10 includes a ceramic laminated body 1 in which a plurality of ceramic layers 11 are laminated, a heating resistor 2 provided between adjacent ceramic layers 11, and a heating resistor 2. And a conductive layer 3 laminated thereon.
  • the heater 10 can be used for, for example, a glow plug or a gas range of an automobile engine.
  • Ceramic laminate 1 is a member in which heating resistor 2 and conductive layer 3 are embedded. By providing the heating resistor 2 and the conductive layer 3 inside the ceramic laminate 1, the durability of the heating resistor 2 and the conductive layer 3 can be improved.
  • the ceramic laminate 1 is, for example, a rod-shaped or plate-shaped member.
  • the ceramic laminate 1 is made of ceramics having electrical insulation properties such as insulating ceramics, nitride ceramics or carbide ceramics. Specifically, the ceramic laminate 1 is made of alumina ceramic, silicon nitride ceramic, aluminum nitride ceramic, silicon carbide ceramic, or the like.
  • the ceramic laminate 1 made of silicon nitride ceramics can be obtained by the following method. Specifically, for example, 5 to 15% by mass of a rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 or Er 2 O 3 as a sintering aid with respect to silicon nitride as a main component; 5 amount such that the amount of SiO 2 is 1.5 to 5 wt% contained Al 2 O 3 and sintered to 5% by weight is mixed with SiO 2 which is adjusted. Then, the ceramic laminate 1 made of silicon nitride ceramics can be obtained by forming into a predetermined shape and firing at a temperature of 1650 to 1780 ° C. For the firing, for example, hot press firing can be used.
  • a rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 or Er 2 O 3
  • the length of the ceramic laminate 1 is set to 20 to 100 mm, for example.
  • the cross section of the ceramic laminate 1 is set to a square having a thickness of 1 to 6 mm and a width of 2 to 40 mm, for example.
  • the heating resistor 2 is a layered member that generates heat when a voltage is applied.
  • the heating resistor 2 is provided between the adjacent ceramic layers 11.
  • a voltage is applied to the heating resistor 2
  • a current flows and the heating resistor 2 generates heat.
  • the heat generated by this heat generation is transmitted inside the ceramic laminate 1 and the surface of the ceramic laminate 1 becomes high temperature.
  • the heater 10 functions when heat is transferred from the surface of the ceramic laminate 1 to the object to be heated.
  • a to-be-heated material which can transmit heat from the surface of the ceramic laminated body 1, the light oil etc. which are supplied into the inside of the diesel engine for motor vehicles, etc. are mentioned, for example.
  • the both ends of the heating resistor 2 are drawn out to the side surface on the rear end side of the ceramic laminate 1.
  • the heating resistor 2 has a vertical cross section (a cross section parallel to the length direction of the heating resistor 2), for example, a folded shape.
  • the heating resistor 2 has two adjacent linear portions and a connecting portion that has an outer periphery and an inner periphery that are substantially semicircular or semi-elliptical and that folds and connects the two linear portions. is doing.
  • the heating resistor 2 is folded back near the tip of the ceramic laminate 1.
  • the total length of the heating resistor 2 is set to 35 to 100 mm, for example.
  • the heating resistor 2 is designed to generate a large amount of heat at the tip side of the ceramic laminate 1.
  • the conductive layer 3 is laminated on both ends of the heating resistor 2 on the rear end side of the ceramic laminate 1. Therefore, current flows through the heating resistor 2 and the conductive layer 3 on the rear end side of the ceramic laminate 1. As a result, heat generation of the heating resistor 2 is reduced on the rear end side of the ceramic laminate 1. On the contrary, current flows only through the heating resistor 2 on the tip side of the ceramic laminate 1. As a result, heat generation of the heating resistor 2 is increased on the tip side of the ceramic laminate 1.
  • the heating resistor 2 is mainly composed of a carbide such as tungsten (W), molybdenum (Mo), or titanium (Ti), nitride, silicide, or the like.
  • a carbide such as tungsten (W), molybdenum (Mo), or titanium (Ti), nitride, silicide, or the like.
  • the ceramic laminate 1 is made of silicon nitride ceramic, it is preferable that the main component of the heating resistor 2 is made of tungsten carbide. Thereby, the thermal expansion coefficient of the ceramic laminated body 1 and the thermal expansion coefficient of the heating resistor 2 can be brought close to each other.
  • the conductive layer 3 is a member for adjusting the amount of heat generated by the heating resistor 2 at the rear end side of the ceramic laminate 1, that is, in the vicinity of the portion where the heating resistor 2 is drawn to the side surface of the ceramic laminate 1.
  • the conductive layer 3 is indicated by a broken line.
  • the broken line indicating the conductive layer 3 and the solid line indicating the heating resistor 2 are shifted from each other. Have substantially the same width, and the conductive layer 3 and the heating resistor 2 are laminated so as to have the same width. As shown in FIGS.
  • the conductive layer 3 is laminated between the ceramic layers 11 on both ends of the heating resistor 2, and one end is drawn out to the side surface of the ceramic laminate 1. Yes.
  • the heat generation on the rear end side of the ceramic laminate 1 can be reduced. . Therefore, the reliability of connection between the external circuit and the heater 10 can be improved.
  • the conductive layer 3 has a first conductive layer 31 drawn to the side surface of the ceramic laminate 1 and a second conductive layer 32 adjacent to the first conductive layer 31.
  • the first conductive layer 31 and the second conductive layer 32 are composed of a plurality of particles.
  • the average particle size of the particles of the first conductive layer 31 is smaller than the average particle size of the particles of the second conductive layer 32.
  • the density of the 1st conductive layer 31 can be raised because the 1st conductive layer 31 located in the outer side consists of a particle
  • the porosity of the first conductive layer 31 is reduced, it is possible to reduce the outside air from entering the conductive layer 3.
  • the portion drawn to the side surface can have a two-layer structure. Therefore, even if a crack occurs in one of the conductive layer 3 or the heating resistor 2, the risk of the crack developing in the other can be reduced.
  • the second conductive layer 32 is made of particles having a large average particle diameter, so that the grain boundaries of the particles in the second conductive layer 32 can be reduced, so that the resistance value of the second conductive layer 32 can be reduced. . Thereby, unnecessary heat generation occurring in the conductive layer 3 can be reduced.
  • the heater 10 has improved long-term reliability when used under a heat cycle.
  • the average particle size of the conductive layer is constant regardless of the part. That is, when the average particle size of the conductive layer is simply reduced, the resistance of the conductive layer itself is increased even if the outside air can be reduced from entering the conductive layer. In this case, unnecessary heat is generated. On the other hand, when the average particle size of the conductive layer is simply increased, it is easy for outside air to enter the conductive layer even if unnecessary heat generation in the conductive layer can be reduced. On the other hand, like the heater 10 described above, the average particle size of the particles of the first conductive layer 31 is made smaller than the average particle size of the particles of the second conductive layer 32, thereby reducing the entry of outside air. Unnecessary heat generation in the conductive layer 3 can be reduced.
  • the first conductive layer 31 and the second conductive layer 32 partially overlap as shown in FIG.
  • the thermal expansion coefficient of the conductive layer 3 is changed stepwise. Can be made. As a result, it is possible to reduce the possibility that the conductive layer 3 is cracked under a heat cycle.
  • the first conductive layer 31 is positioned between the second conductive layer 32 and the heating resistor 2, and the first conductive layer 31 is positioned between the second conductive layer 32 and the heating resistor 2 in the first It is preferable that the conductive layer 31 becomes thinner toward the other end. Thereby, the thermal expansion coefficient of the conductive layer 3 can be changed gently. As a result, it is possible to further reduce the possibility that the conductive layer 3 is cracked under a heat cycle.
  • the conductive layer 3 includes only the first conductive layer 31 and the second conductive layer 32.
  • the conductive layer 3 may have a portion other than the first conductive layer 31 and the second conductive layer 32.
  • the conductive layer 3 may include a third conductive layer 33 in addition to the first conductive layer 31 and the second conductive layer 32.
  • the third conductive layer 33 is adjacent to the second conductive layer 32 on the side opposite to the first conductive layer 31.
  • the layer used as the third conductive layer 33 is not particularly limited.
  • the average particle diameter of the particles of the third conductive layer 33 may be smaller than the average particle diameter of the particles of the second conductive layer 32.
  • the grain boundaries of the particles in the third conductive layer 33 increase. Therefore, the resistance value in the third conductive layer 33 can be made larger than the resistance value in the second conductive layer 32.
  • the emitted-heat amount of the heating resistor 2 can be changed in steps. Therefore, the temperature of the surface of the heater 10 can be changed stepwise. As a result, generation of a large thermal stress locally in the ceramic laminate 1 can be reduced.
  • the first conductive layer 31 to the third conductive layer 33 are made of a metal material having excellent heat resistance such as molybdenum (Mo), tungsten (W), or rhenium (Re), for example.
  • MoSi 2 and WSi 2 or the like are used in order to bring the coefficient of thermal expansion close to that of the ceramic laminate 1, it is preferable to mix MoSi 2 and WSi 2 or the like.
  • the length of the first conductive layer 31 is set such that the length of the portion along the length direction of the heating resistor 2 is about 2 to 10 mm.
  • the thickness of the first conductive layer 31 is set to about 5 to 30 ⁇ m.
  • the length of the second conductive layer 32 is set to about 5 to 20 mm at the portion along the length direction of the heating resistor 2.
  • the thickness of the second conductive layer 32 is set to about 25 to 75 ⁇ m.
  • the particle size of the first conductive layer 31 and the second conductive layer 32 can be adjusted as follows. Specifically, in the case where both the first conductive layer 31 and the second conductive layer 32 are made of W, the first conductive layer 31 and the second conductive layer are made different by changing the particle diameter of the starting W powder.
  • the particle size of 32 can be adjusted.
  • the average particle size of the W powder used for the first conductive layer 31 may be set to 0.2 ⁇ m
  • the average particle size of the W powder used for the second conductive layer 32 may be set to 1.2 ⁇ m.
  • the average particle diameter of the first conductive layer 31 can be set to 0.2 to 2 ⁇ m
  • the average particle diameter of the second conductive layer 32 can be set to 1.2 to 12 ⁇ m.
  • the average particle size of the first conductive layer 31 is preferably less than 1 ⁇ m. Thereby, since it can reduce that external air penetrate
  • the porosity of the first conductive layer is preferably less than 20%. Thereby, the approach of the outside air to the first conductive layer 31 can be reduced.
  • the average particle diameter of the conductive layer 3 can be confirmed, for example, by the following method. Specifically, after the heater 10 is cut with a diamond cutter in a plane perpendicular to the conductive layer 3 passing through the conductive layer 3, the surface is polished with diamond powder. Then, what is necessary is just to observe the 1st conductive layer 31 and the 2nd conductive layer 32 using a scanning electron microscope or a metal microscope. More specifically, arbitrary five straight lines are drawn on the image obtained by the scanning electron microscope or the metal microscope. And the average value of the distance for 10 particles crossing these five straight lines is obtained. By dividing this average value by 10 which is the number of particles, the average particle diameter can be obtained. Further, the average particle diameter may be calculated using an image analyzer (manufactured by Nireco: LUZEX-FS). The above image analysis apparatus can also be used when measuring the porosity of the first conductive layer 31.
  • the heater 10 is used, for example, as an ignition device 100 as shown in FIG.
  • the ignition device 100 includes a heater 10 and a flow path 20 through which gaseous fuel flows through the heater 10.
  • the flow path 20 is comprised by the ventilation pipe 22 which has the gas valve 21 and the jet nozzle 23, for example.
  • the gas valve 21 has a function of controlling the flow rate of the gaseous fuel. Examples of the gaseous fuel supplied from the gas valve 21 include natural gas or propane gas.
  • the ventilation pipe 22 ejects the gaseous fuel supplied from the gas valve 21 toward the heater 10 from the ejection port 23. And it can ignite by heating the heater 10 with respect to the gaseous fuel currently injected. Since the ignition device 100 includes the heater 10 with improved long-term reliability, the stability of ignition of gaseous fuel is improved.
  • Ceramic laminate 11 Ceramic layer 2: Heating resistor 3: Conductive layer 31: First conductive layer 32: Second conductive layer 10: Heater 20: Channel 21: Gas valve 22: Ventilation pipe 23: Jet outlet 100: Ignition device

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Resistance Heating (AREA)

Abstract

A heater comprising: a ceramic laminate having a plurality of ceramic layers laminated therein; a belt-shaped heat-generating resistor provided between the ceramic layers and having both ends thereof pulled out to a side surface of the ceramic laminate; and a belt-shaped conductive layer laminated upon both end sections of the heat-generating resistor between the ceramic layers, each end thereof being pulled out to said side surface. The conductive layer has a first conductive layer pulled out to the side surface and a second conductive layer adjacent to the first conductive layer. The first and second conductive layers comprise a plurality of particles and the average particle diameter of the particles in the first conductive layer is smaller than the average particle diameter of the second conductive layer.

Description

ヒータおよび点火装置Heater and ignition device
　本発明は、ヒータおよび点火装置に関するものである。 The present invention relates to a heater and an ignition device.
　ガスレンジ、車載暖房装置、石油ファンヒータまたは自動車エンジンのグロープラグ等に用いられるヒータとして、セラミック体の内部に発熱体が設けられたヒータ（セラミックヒータ）が知られている。セラミックヒータとしては、例えば、特許文献１に開示されたセラミックヒータが挙げられる。 A heater (ceramic heater) in which a heating element is provided inside a ceramic body is known as a heater used for a gas range, an in-vehicle heating device, an oil fan heater, or a glow plug of an automobile engine. As a ceramic heater, the ceramic heater disclosed by patent document 1 is mentioned, for example.
　特開２０００－１５６２７５号公報（以下、特許文献１という）に開示されたセラミックヒータは、セラミック構造体と、セラミック構造体に埋設された発熱抵抗体と、発熱抵抗体に接続されてセラミック構造体の表面に引き出された給電線とを備えている。 A ceramic heater disclosed in Japanese Unexamined Patent Publication No. 2000-156275 (hereinafter referred to as Patent Document 1) includes a ceramic structure, a heating resistor embedded in the ceramic structure, and a ceramic structure connected to the heating resistor. And a power supply line drawn out on the surface.
　特許文献１に記載されたセラミックヒータは、高温環境下で繰り返し使用した場合に給電線にクラックが生じる場合があった。特に、このクラックが給電線のうちセラミック構造体の表面に露出している領域に生じた場合には、外気が給電線の内部に入り込む場合があった。そのため、給電線が外気と反応することによって、給電線の抵抗値が変化してしまい、局所的に異常な発熱をしてしまう場合があった。その結果、セラミックヒータを高温環境下において繰り返し使用した場合の長期信頼性を向上させることが困難であった。 When the ceramic heater described in Patent Document 1 is repeatedly used in a high temperature environment, cracks may occur in the power supply line. In particular, when this crack occurs in a region of the power supply line exposed on the surface of the ceramic structure, outside air may enter the inside of the power supply line. For this reason, when the power supply line reacts with the outside air, the resistance value of the power supply line changes, and abnormal heat generation may occur locally. As a result, it has been difficult to improve long-term reliability when the ceramic heater is repeatedly used in a high temperature environment.
　ヒータは、複数のセラミック層が積層されてなるセラミック積層体と、前記セラミック層間に設けられて両端が前記セラミック積層体の側面に引き出された帯状の発熱抵抗体と、前記セラミック層間で前記発熱抵抗体の両方の端部上に積層されてそれぞれ一端が前記側面に引き出された帯状の導電層とを備えており、該導電層は、前記側面に引き出された第１導電層および該第１導電層に隣り合う第２導電層を有しており、前記第１導電層および前記第２導電層が複数の粒子から成るとともに、前記第１導電層の粒子の平均粒径が前記第２導電層の粒子の平均粒径よりも小さい。 The heater includes a ceramic laminate formed by laminating a plurality of ceramic layers, a belt-like heating resistor provided between the ceramic layers and having both ends drawn to the side surfaces of the ceramic laminate, and the heating resistor between the ceramic layers. A strip-shaped conductive layer laminated on both ends of the body and having one end drawn to the side surface, the conductive layer including the first conductive layer drawn to the side surface and the first conductive layer. A second conductive layer adjacent to the first conductive layer, wherein the first conductive layer and the second conductive layer are composed of a plurality of particles, and the average particle size of the particles of the first conductive layer is the second conductive layer. Smaller than the average particle size of the particles.
ヒータを示す縦断面図である。It is a longitudinal cross-sectional view which shows a heater. 図１に示すヒータをＡ－Ａ'線で切断した横断面図である。FIG. 2 is a cross-sectional view of the heater shown in FIG. 1 cut along line AA ′. 図１に示すヒータをＢ－Ｂ'線で切断した横断面図である。FIG. 2 is a cross-sectional view of the heater shown in FIG. 1 cut along the line BB ′. ヒータの変形例を示す横断面図である。It is a cross-sectional view showing a modification of the heater. 図１に示すヒータを用いた点火装置を示す斜視図である。It is a perspective view which shows the ignition device using the heater shown in FIG.
　以下、ヒータ１０について図面を参照して説明する。 Hereinafter, the heater 10 will be described with reference to the drawings.
　図１～図３に示すように、ヒータ１０は、複数のセラミック層１１が積層されてなるセラミック積層体１と、隣り合うセラミック層１１間に設けられた発熱抵抗体２と、発熱抵抗体２に積層された導電層３とを備えている。ヒータ１０は、例えば、自動車エンジンのグロープラグまたはガスレンジ等に用いることができる。 As shown in FIGS. 1 to 3, the heater 10 includes a ceramic laminated body 1 in which a plurality of ceramic layers 11 are laminated, a heating resistor 2 provided between adjacent ceramic layers 11, and a heating resistor 2. And a conductive layer 3 laminated thereon. The heater 10 can be used for, for example, a glow plug or a gas range of an automobile engine.
　セラミック積層体１は、内部に発熱抵抗体２および導電層３が埋設された部材である。セラミック積層体１の内部に発熱抵抗体２および導電層３を設けることによって、発熱抵抗体２および導電層３の耐久性を向上させることができる。セラミック積層体１は、例えば、棒状または板状の部材である。 Ceramic laminate 1 is a member in which heating resistor 2 and conductive layer 3 are embedded. By providing the heating resistor 2 and the conductive layer 3 inside the ceramic laminate 1, the durability of the heating resistor 2 and the conductive layer 3 can be improved. The ceramic laminate 1 is, for example, a rod-shaped or plate-shaped member.
　セラミック積層体１は、例えば絶縁性セラミックス、窒化物セラミックスまたは炭化物セラミックス等の電気的な絶縁性を有するセラミックスから成る。具体的には、セラミック積層体１は、アルミナ質セラミックス、窒化珪素質セラミックス、窒化アルミニウム質セラミックスまたは炭化珪素質セラミックス等から成る。 The ceramic laminate 1 is made of ceramics having electrical insulation properties such as insulating ceramics, nitride ceramics or carbide ceramics. Specifically, the ceramic laminate 1 is made of alumina ceramic, silicon nitride ceramic, aluminum nitride ceramic, silicon carbide ceramic, or the like.
　窒化珪素質セラミックスから成るセラミック積層体１は、以下の方法で得ることができる。具体的には、例えば、主成分の窒化珪素に対して、焼結助剤として５～１５質量％のＹ２Ｏ３、Ｙｂ２Ｏ３またはＥｒ２Ｏ３等の希土類元素酸化物、０．５～５質量％のＡｌ２Ｏ３および焼結体に含まれるＳｉＯ２の量が１．５～５質量％となるように量が調整されたＳｉＯ２を混合する。そして、所定の形状に成形した後に１６５０～１７８０℃での温度で焼成することによって、窒化珪素質セラミックスから成るセラミック積層体１を得ることができる。焼成には、例えばホットプレス焼成を用いることができる。 The ceramic laminate 1 made of silicon nitride ceramics can be obtained by the following method. Specifically, for example, 5 to 15% by mass of a rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 or Er 2 O 3 as a sintering aid with respect to silicon nitride as a main component; 5 amount such that the amount of SiO 2 is 1.5 to 5 wt% contained Al 2 O 3 and sintered to 5% by weight is mixed with SiO 2 which is adjusted. Then, the ceramic laminate 1 made of silicon nitride ceramics can be obtained by forming into a predetermined shape and firing at a temperature of 1650 to 1780 ° C. For the firing, for example, hot press firing can be used.
　セラミック積層体１の形状が棒状である場合、より具体的には四角柱状である場合には、セラミック積層体１の長さは例えば２０～１００ｍｍに設定される。また、セラミック積層体１の断面は、例えば厚さ１～６ｍｍ、幅２～４０ｍｍの四角形に設定される。 When the shape of the ceramic laminate 1 is a rod shape, more specifically, when the shape is a quadrangular prism shape, the length of the ceramic laminate 1 is set to 20 to 100 mm, for example. Further, the cross section of the ceramic laminate 1 is set to a square having a thickness of 1 to 6 mm and a width of 2 to 40 mm, for example.
　発熱抵抗体２は、電圧が加えられることによって発熱する層状の部材である。発熱抵抗体２は、隣り合うセラミック層１１間に設けられている。発熱抵抗体２に電圧が加えられることによって電流が流れ、発熱抵抗体２が発熱する。この発熱によって生じた熱がセラミック積層体１の内部を伝わって、セラミック積層体１の表面が高温になる。そして、セラミック積層体１の表面から被加熱物に対して熱が伝わることによって、ヒータ１０が機能する。セラミック積層体１の表面から熱を伝えられることになる被加熱物としては、例えば自動車用ディーゼルエンジンの内部に供給される軽油等が挙げられる。 The heating resistor 2 is a layered member that generates heat when a voltage is applied. The heating resistor 2 is provided between the adjacent ceramic layers 11. When a voltage is applied to the heating resistor 2, a current flows and the heating resistor 2 generates heat. The heat generated by this heat generation is transmitted inside the ceramic laminate 1 and the surface of the ceramic laminate 1 becomes high temperature. The heater 10 functions when heat is transferred from the surface of the ceramic laminate 1 to the object to be heated. As a to-be-heated material which can transmit heat from the surface of the ceramic laminated body 1, the light oil etc. which are supplied into the inside of the diesel engine for motor vehicles, etc. are mentioned, for example.
　発熱抵抗体２は、両端がセラミック積層体１の後端側の側面に引き出されている。発熱抵抗体２は、縦断面（発熱抵抗体２の長さ方向に対して平行な断面）の形状が、例えば折り返し形状になっている。詳しくは、発熱抵抗体２は、２つの隣り合って並んだ直線状部分と外周および内周が略半円形状または略半楕円形状であって２つの直線部分を折り返して繋ぐ連結部分とを有している。発熱抵抗体２はセラミック積層体１の先端付近で折り返している。発熱抵抗体２の全長は、例えば３５～１００ｍｍに設定される。 The both ends of the heating resistor 2 are drawn out to the side surface on the rear end side of the ceramic laminate 1. The heating resistor 2 has a vertical cross section (a cross section parallel to the length direction of the heating resistor 2), for example, a folded shape. Specifically, the heating resistor 2 has two adjacent linear portions and a connecting portion that has an outer periphery and an inner periphery that are substantially semicircular or semi-elliptical and that folds and connects the two linear portions. is doing. The heating resistor 2 is folded back near the tip of the ceramic laminate 1. The total length of the heating resistor 2 is set to 35 to 100 mm, for example.
　発熱抵抗体２は、セラミック積層体１の先端側において大きく発熱するように設計されている。具体的には、セラミック積層体１の後端側において、発熱抵抗体２の両方の端部上には導電層３が積層されている。そのため、セラミック積層体１の後端側においては電流が発熱抵抗体２にも導電層３にも流れるようになる。この結果、セラミック積層体１の後端側においては発熱抵抗体２の発熱が小さくなる。逆に、セラミック積層体１の先端側においては電流が発熱抵抗体２にのみ流れる。この結果、セラミック積層体１の先端側においては発熱抵抗体２の発熱が大きくなる。 The heating resistor 2 is designed to generate a large amount of heat at the tip side of the ceramic laminate 1. Specifically, the conductive layer 3 is laminated on both ends of the heating resistor 2 on the rear end side of the ceramic laminate 1. Therefore, current flows through the heating resistor 2 and the conductive layer 3 on the rear end side of the ceramic laminate 1. As a result, heat generation of the heating resistor 2 is reduced on the rear end side of the ceramic laminate 1. On the contrary, current flows only through the heating resistor 2 on the tip side of the ceramic laminate 1. As a result, heat generation of the heating resistor 2 is increased on the tip side of the ceramic laminate 1.
　発熱抵抗体２は、例えば、タングステン（Ｗ）、モリブデン（Ｍｏ）またはチタン（Ｔｉ）等の炭化物、窒化物または珪化物等を主成分とする。セラミック積層体１が窒化珪素質セラミックスから成る場合には、発熱抵抗体２の主成分が炭化タングステンから成ることが好ましい。これにより、セラミック積層体１の熱膨張率と発熱抵抗体２の熱膨張率とを近付けることができる。 The heating resistor 2 is mainly composed of a carbide such as tungsten (W), molybdenum (Mo), or titanium (Ti), nitride, silicide, or the like. When the ceramic laminate 1 is made of silicon nitride ceramic, it is preferable that the main component of the heating resistor 2 is made of tungsten carbide. Thereby, the thermal expansion coefficient of the ceramic laminated body 1 and the thermal expansion coefficient of the heating resistor 2 can be brought close to each other.
　導電層３は、セラミック積層体１の後端側、つまり発熱抵抗体２がセラミック積層体１の側面に引き出される部位の近傍において、発熱抵抗体２の発熱量を調整するための部材である。図１においては、導電層３を破線で示している。なお、図１においては、図面を見やすくするために、導電層３を示す破線と発熱抵抗体２を示す実線とをずらして記載しているが、実際には導電層３と発熱抵抗体２とはほぼ同一の幅を有するとともに、導電層３と発熱抵抗体２とは幅が揃うように積層されている。図２および図３に示すように、導電層３は、セラミック層１１間であって発熱抵抗体２の両方の端部上に積層されて、それぞれ一端がセラミック積層体１の側面に引き出されている。このように、発熱抵抗体２のうち外部の回路と接続されることになる両方の端部上を導電層３で覆うことによって、セラミック積層体１の後端側における発熱を低減することができる。そのため、外部の回路とヒータ１０との接続の信頼性を向上させることができる。 The conductive layer 3 is a member for adjusting the amount of heat generated by the heating resistor 2 at the rear end side of the ceramic laminate 1, that is, in the vicinity of the portion where the heating resistor 2 is drawn to the side surface of the ceramic laminate 1. In FIG. 1, the conductive layer 3 is indicated by a broken line. In FIG. 1, in order to make the drawing easier to see, the broken line indicating the conductive layer 3 and the solid line indicating the heating resistor 2 are shifted from each other. Have substantially the same width, and the conductive layer 3 and the heating resistor 2 are laminated so as to have the same width. As shown in FIGS. 2 and 3, the conductive layer 3 is laminated between the ceramic layers 11 on both ends of the heating resistor 2, and one end is drawn out to the side surface of the ceramic laminate 1. Yes. Thus, by covering the both ends of the heating resistor 2 to be connected to the external circuit with the conductive layer 3, the heat generation on the rear end side of the ceramic laminate 1 can be reduced. . Therefore, the reliability of connection between the external circuit and the heater 10 can be improved.
　導電層３は、セラミック積層体１の側面に引き出された第１導電層３１および第１導電層３１に隣り合う第２導電層３２を有している。第１導電層３１および第２導電層３２は複数の粒子から成る。そして、第１導電層３１の粒子の平均粒径が第２導電層３２の粒子の平均粒径よりも小さい。このように外側に位置する第１導電層３１が平均粒径の小さい粒子からなることによって、第１導電層３１の密度を高めることができる。その結果、第１導電層３１の空隙率が低くなるので、外気が導電層３に入り込むことを低減できる。 The conductive layer 3 has a first conductive layer 31 drawn to the side surface of the ceramic laminate 1 and a second conductive layer 32 adjacent to the first conductive layer 31. The first conductive layer 31 and the second conductive layer 32 are composed of a plurality of particles. The average particle size of the particles of the first conductive layer 31 is smaller than the average particle size of the particles of the second conductive layer 32. Thus, the density of the 1st conductive layer 31 can be raised because the 1st conductive layer 31 located in the outer side consists of a particle | grain with a small average particle diameter. As a result, since the porosity of the first conductive layer 31 is reduced, it is possible to reduce the outside air from entering the conductive layer 3.
　また、導電層３だけではなく発熱抵抗体２もセラミック積層体１の側面に引き出されていることによって、側面に引き出された部分を２層構造にすることができる。そのため、導電層３または発熱抵抗体２の一方にクラックが生じたとしても、他方にクラックが進展するおそれを低減できる。 Further, since not only the conductive layer 3 but also the heating resistor 2 is drawn to the side surface of the ceramic laminate 1, the portion drawn to the side surface can have a two-layer structure. Therefore, even if a crack occurs in one of the conductive layer 3 or the heating resistor 2, the risk of the crack developing in the other can be reduced.
　また、第２導電層３２が平均粒径の大きい粒子からなることによって、第２導電層３２における粒子の粒界を減らすことができるので、第２導電層３２の抵抗値を小さくすることができる。これにより、導電層３において生じる不要な発熱を低減することができる。 In addition, since the second conductive layer 32 is made of particles having a large average particle diameter, the grain boundaries of the particles in the second conductive layer 32 can be reduced, so that the resistance value of the second conductive layer 32 can be reduced. . Thereby, unnecessary heat generation occurring in the conductive layer 3 can be reduced.
　これらの結果、ヒータ１０はヒートサイクル下で使用した際の長期信頼性が向上している。 As a result, the heater 10 has improved long-term reliability when used under a heat cycle.
　具体的には、例えば、上述のヒータ１０とは異なり、導電層の平均粒径の大きさが部位に関わらず一定の場合には以下のような問題がある。すなわち、導電層の平均粒径の大きさを単純に小さくしただけの場合には、外気が導電層に侵入することは低減できても、導電層自体の抵抗が大きくなってしまうので、導電層において不要な発熱が生じてしまうことになる。反対に、導電層の平均粒径の大きさを単純に大きくしただけの場合には、導電層における不要な発熱を低減できても、外気が導電層に侵入しやすくなってしまう。これに対して、上述のヒータ１０のように、第１導電層３１の粒子の平均粒径を第２導電層３２の粒子の平均粒径よりも小さくすることによって、外気の進入を低減しつつ、導電層３における不要な発熱を低減できる。 Specifically, for example, unlike the heater 10 described above, there is the following problem when the average particle size of the conductive layer is constant regardless of the part. That is, when the average particle size of the conductive layer is simply reduced, the resistance of the conductive layer itself is increased even if the outside air can be reduced from entering the conductive layer. In this case, unnecessary heat is generated. On the other hand, when the average particle size of the conductive layer is simply increased, it is easy for outside air to enter the conductive layer even if unnecessary heat generation in the conductive layer can be reduced. On the other hand, like the heater 10 described above, the average particle size of the particles of the first conductive layer 31 is made smaller than the average particle size of the particles of the second conductive layer 32, thereby reducing the entry of outside air. Unnecessary heat generation in the conductive layer 3 can be reduced.
　さらに、図２に示すように、第１導電層３１と第２導電層３２とが部分的に重なっていることが好ましい。これにより、第１導電層３１と第２導電層３２とが重なっていない場合と比較して、導電層３を長さ方向で見たときに、導電層３の熱膨張率を段階的に変化させることができる。その結果、ヒートサイクル下において導電層３にクラックが生じる可能性を低減できる。 Furthermore, it is preferable that the first conductive layer 31 and the second conductive layer 32 partially overlap as shown in FIG. Thereby, compared with the case where the 1st conductive layer 31 and the 2nd conductive layer 32 have not overlapped, when the conductive layer 3 is seen in the length direction, the thermal expansion coefficient of the conductive layer 3 is changed stepwise. Can be made. As a result, it is possible to reduce the possibility that the conductive layer 3 is cracked under a heat cycle.
　さらに、第１導電層３１が第２導電層３２と発熱抵抗体２との間に位置しており、第２導電層３２と発熱抵抗体２との間に位置している部分において、第１導電層３１が他端に向かうにつれて薄くなっていることが好ましい。これにより、導電層３の熱膨張率をゆるやかに変化させることができる。その結果、ヒートサイクル下において導電層３にクラックが生じる可能性をさらに低減できる。 Further, the first conductive layer 31 is positioned between the second conductive layer 32 and the heating resistor 2, and the first conductive layer 31 is positioned between the second conductive layer 32 and the heating resistor 2 in the first It is preferable that the conductive layer 31 becomes thinner toward the other end. Thereby, the thermal expansion coefficient of the conductive layer 3 can be changed gently. As a result, it is possible to further reduce the possibility that the conductive layer 3 is cracked under a heat cycle.
　なお、上述のヒータ１０においては、導電層３が第１導電層３１および第２導電層３２のみから成っているが、これに限られない。導電層３が第１導電層３１および第２導電層３２以外の部分を有していてもよい。例えば、図４に示すように、導電層３が、第１導電層３１および第２導電層３２に加えて、第３導電層３３を有していてもよい。第３導電層３３は、第２導電層３２のうち第１導電層３１とは反対側で隣り合っている。 In the heater 10 described above, the conductive layer 3 includes only the first conductive layer 31 and the second conductive layer 32. However, the present invention is not limited to this. The conductive layer 3 may have a portion other than the first conductive layer 31 and the second conductive layer 32. For example, as shown in FIG. 4, the conductive layer 3 may include a third conductive layer 33 in addition to the first conductive layer 31 and the second conductive layer 32. The third conductive layer 33 is adjacent to the second conductive layer 32 on the side opposite to the first conductive layer 31.
　第３導電層３３として用いられる層としては、特に、限定されない。例えば、第３導電層３３の粒子の平均粒径が第２導電層３２の粒子の平均粒径よりも小さくてもよい。これにより、第３導電層３３における粒子の結晶粒界が増加する。そのため、第３導電層３３における抵抗値を第２導電層３２における抵抗値よりも大きくすることができる。これにより、発熱抵抗体２の発熱量を段階的に変化させることができる。そのため、ヒータ１０の表面の温度を段階的に変化させることができる。その結果、セラミック積層体１において局所的に大きな熱応力が発生することを低減できる。 The layer used as the third conductive layer 33 is not particularly limited. For example, the average particle diameter of the particles of the third conductive layer 33 may be smaller than the average particle diameter of the particles of the second conductive layer 32. As a result, the grain boundaries of the particles in the third conductive layer 33 increase. Therefore, the resistance value in the third conductive layer 33 can be made larger than the resistance value in the second conductive layer 32. Thereby, the emitted-heat amount of the heating resistor 2 can be changed in steps. Therefore, the temperature of the surface of the heater 10 can be changed stepwise. As a result, generation of a large thermal stress locally in the ceramic laminate 1 can be reduced.
　第１導電層３１乃至第３導電層３３は、例えば、モリブデン（Ｍｏ）、タングステン（Ｗ）またはレニウム（Ｒｅ）等の耐熱性に優れた金属材料から成る。特に熱膨張率をセラミック積層体１に近付けるために、ＭｏＳｉ２およびＷＳｉ２等を混合しておくことが好ましい。第１導電層３１の長さは、発熱抵抗体２の長さ方向に沿った部分の長さが２～１０ｍｍ程度に設定される。第１導電層３１の厚みは５～３０μｍ程度に設定される。また、第２導電層３２の長さは、発熱抵抗体２の長さ方向に沿った部分の長さが５～２０ｍｍ程度に設定される。第２導電層３２の厚みは２５～７５μｍ程度に設定される。また、第１導電層３１と第２導電層３２とが重なっている場合には、この領域の長さは、例えば５００μｍ程度に設定される。 The first conductive layer 31 to the third conductive layer 33 are made of a metal material having excellent heat resistance such as molybdenum (Mo), tungsten (W), or rhenium (Re), for example. In particular, in order to bring the coefficient of thermal expansion close to that of the ceramic laminate 1, it is preferable to mix MoSi 2 and WSi 2 or the like. The length of the first conductive layer 31 is set such that the length of the portion along the length direction of the heating resistor 2 is about 2 to 10 mm. The thickness of the first conductive layer 31 is set to about 5 to 30 μm. Further, the length of the second conductive layer 32 is set to about 5 to 20 mm at the portion along the length direction of the heating resistor 2. The thickness of the second conductive layer 32 is set to about 25 to 75 μm. When the first conductive layer 31 and the second conductive layer 32 overlap, the length of this region is set to about 500 μm, for example.
　第１導電層３１および第２導電層３２の粒径は、以下のように調整できる。具体的には、第１導電層３１および第２導電層３２が共にＷから成る場合には、出発原料のＷの粉末の粒径を異ならせることによって、第１導電層３１および第２導電層３２の粒径を調整できる。例えば、第１導電層３１に用いるＷの粉末の平均粒径を０．２μｍに、第２導電層３２に用いるＷの粉末の平均粒径を１．２μｍに設定すればよい。これにより、第１導電層３１の平均粒径を０．２～２μｍに、第２導電層３２の平均粒径を１．２～１２μｍに設定することができる。 The particle size of the first conductive layer 31 and the second conductive layer 32 can be adjusted as follows. Specifically, in the case where both the first conductive layer 31 and the second conductive layer 32 are made of W, the first conductive layer 31 and the second conductive layer are made different by changing the particle diameter of the starting W powder. The particle size of 32 can be adjusted. For example, the average particle size of the W powder used for the first conductive layer 31 may be set to 0.2 μm, and the average particle size of the W powder used for the second conductive layer 32 may be set to 1.2 μm. Thereby, the average particle diameter of the first conductive layer 31 can be set to 0.2 to 2 μm, and the average particle diameter of the second conductive layer 32 can be set to 1.2 to 12 μm.
　特に、第１導電層３１の平均粒径が１μｍ未満であることが好ましい。これにより、粒子間から外気が浸入することを低減できるので、第１導電層３１に外気が入り込む可能性を低減できる。また、このとき、第１導電層の空隙率は、２０％未満であることが好ましい。これにより、第１導電層３１への外気の進入を低減できる。 In particular, the average particle size of the first conductive layer 31 is preferably less than 1 μm. Thereby, since it can reduce that external air penetrate | invades between particle | grains, possibility that external air will enter into the 1st conductive layer 31 can be reduced. At this time, the porosity of the first conductive layer is preferably less than 20%. Thereby, the approach of the outside air to the first conductive layer 31 can be reduced.
　導電層３の平均粒径は、例えば以下の方法で確認することができる。具体的には、ヒータ１０をダイヤモンドカッターを用いて、導電層３を通る導電層３に垂直な方向の面で切断した後に、ダイヤモンド粉末を用いて表面の研磨を行なう。その後、走査型電子顕微鏡または金属顕微鏡を用いて第１導電層３１および第２導電層３２を観察すればよい。より具体的には、走査型電子顕微鏡または金属顕微鏡によって得られた画像に、任意の５本の直線を引く。そして、この５本の直線を横切った粒子１０個分の距離の平均値を求める。この平均値を粒子の数である１０で割ることによって、平均粒径を求めることができる。また、画像解析装置（ニレコ社製：ＬＵＺＥＸ－ＦＳ）を用いて平均粒径を算出してもよい。第１導電層３１の空隙率を測定する際にも、上記の画像解析装置を用いることができる。 The average particle diameter of the conductive layer 3 can be confirmed, for example, by the following method. Specifically, after the heater 10 is cut with a diamond cutter in a plane perpendicular to the conductive layer 3 passing through the conductive layer 3, the surface is polished with diamond powder. Then, what is necessary is just to observe the 1st conductive layer 31 and the 2nd conductive layer 32 using a scanning electron microscope or a metal microscope. More specifically, arbitrary five straight lines are drawn on the image obtained by the scanning electron microscope or the metal microscope. And the average value of the distance for 10 particles crossing these five straight lines is obtained. By dividing this average value by 10 which is the number of particles, the average particle diameter can be obtained. Further, the average particle diameter may be calculated using an image analyzer (manufactured by Nireco: LUZEX-FS). The above image analysis apparatus can also be used when measuring the porosity of the first conductive layer 31.
　ヒータ１０は、例えば、図５に示すような点火装置１００として用いられる。点火装置１００は、ヒータ１０とヒータ１０に気体燃料を流す流路２０とによって構成されている。流路２０は、例えば、ガスバルブ２１と噴出口２３を有する通風管２２とによって構成される。ガスバルブ２１は、気体燃料の流量を制御する機能を有している。ガスバルブ２１から供給される気体燃料としては、例えば、天然ガスまたはプロパンガス等が挙げられる。通風管２２は、ガスバルブ２１から供給された気体燃料を噴出口２３からヒータ１０に向かって噴出する。そして、噴出されている気体燃料に対してヒータ１０を加熱することにより点火することができる。点火装置１００は、長期信頼性が向上したヒータ１０を有していることによって、気体燃料の点火の安定性が向上している。 The heater 10 is used, for example, as an ignition device 100 as shown in FIG. The ignition device 100 includes a heater 10 and a flow path 20 through which gaseous fuel flows through the heater 10. The flow path 20 is comprised by the ventilation pipe 22 which has the gas valve 21 and the jet nozzle 23, for example. The gas valve 21 has a function of controlling the flow rate of the gaseous fuel. Examples of the gaseous fuel supplied from the gas valve 21 include natural gas or propane gas. The ventilation pipe 22 ejects the gaseous fuel supplied from the gas valve 21 toward the heater 10 from the ejection port 23. And it can ignite by heating the heater 10 with respect to the gaseous fuel currently injected. Since the ignition device 100 includes the heater 10 with improved long-term reliability, the stability of ignition of gaseous fuel is improved.
１：セラミック積層体
１１：セラミック層
２：発熱抵抗体
３：導電層
３１：第１導電層
３２：第２導電層
１０：ヒータ
２０：流路
２１：ガスバルブ
２２：通風管
２３：噴出口
１００：点火装置 1: Ceramic laminate 11: Ceramic layer 2: Heating resistor 3: Conductive layer 31: First conductive layer 32: Second conductive layer 10: Heater 20: Channel 21: Gas valve 22: Ventilation pipe 23: Jet outlet 100: Ignition device

Claims (6)

  1. 　複数のセラミック層が積層されてなるセラミック積層体と、前記セラミック層間に設けられて両端が前記セラミック積層体の側面に引き出された帯状の発熱抵抗体と、前記セラミック層間で前記発熱抵抗体の両方の端部上に積層されてそれぞれ一端が前記側面に引き出された帯状の導電層とを備えており、
    該導電層は、前記側面に引き出された第１導電層および該第１導電層に隣り合う第２導電層を有しており、前記第１導電層および前記第２導電層が複数の粒子から成るとともに、前記第１導電層の粒子の平均粒径が前記第２導電層の粒子の平均粒径よりも小さいヒータ。     Both a ceramic laminate in which a plurality of ceramic layers are laminated, a belt-like heating resistor provided between the ceramic layers and having both ends drawn to the side surfaces of the ceramic laminate, and the heating resistor between the ceramic layers And a strip-shaped conductive layer that is laminated on the end of each of the layers and one end of which is drawn to the side surface,
    The conductive layer has a first conductive layer drawn out to the side surface and a second conductive layer adjacent to the first conductive layer, and the first conductive layer and the second conductive layer are formed of a plurality of particles. And a heater in which the average particle size of the particles of the first conductive layer is smaller than the average particle size of the particles of the second conductive layer.
  2. 　前記第１導電層と前記第２導電層とが部分的に重なっている請求項１に記載のヒータ。 The heater according to claim 1, wherein the first conductive layer and the second conductive layer partially overlap.
  3. 　前記第１導電層と前記第２導電層とが重なっている部分において、前記第１導電層が前記第２導電層と前記発熱抵抗体との間に位置しており、
    前記第２導電層と前記発熱抵抗体との間に位置している部分において、前記第１導電層が他端に向かうにつれて薄くなっている請求項２に記載のヒータ。     In the portion where the first conductive layer and the second conductive layer overlap, the first conductive layer is located between the second conductive layer and the heating resistor,
    The heater according to claim 2, wherein the first conductive layer becomes thinner toward the other end in a portion located between the second conductive layer and the heating resistor.
  4. 　前記第１導電層の粒子の平均粒径が０．２～２μｍであり、前記第２導電層の粒子の平均粒径が１．２～１２μｍである請求項１乃至請求項３のいずれかに記載のヒータ。 The average particle size of the particles of the first conductive layer is 0.2 to 2 µm, and the average particle size of the particles of the second conductive layer is 1.2 to 12 µm. The heater described.
  5. 　前記第１導電層の空隙率が２０％未満である請求項１乃至請求項４のいずれかに記載のヒータ。 The heater according to any one of claims 1 to 4, wherein the porosity of the first conductive layer is less than 20%.
  6. 　請求項１乃至請求項５のいずれかに記載のヒータと、該ヒータのうち前記セラミック積層体に気体燃料を流す流路とを備えた点火装置。 An ignition device comprising: the heater according to any one of claims 1 to 5; and a flow path for allowing gaseous fuel to flow through the ceramic laminate of the heater.
PCT/JP2015/062651 2014-04-25 2015-04-27 Heater and ignition device WO2015163483A1 (en)

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