WO2015156533A1 - Coating method using particle alignment and particle-coated substrate produced thereby - Google Patents

Abstract

Disclosed are a coating method using particle alignment and a particle-coated substrate produced thereby. The coating method using particle alignment according to the present invention comprises the steps of: (a) forming a primary coated film by coating an adhesive polymer substrate with a plurality of first particles; (b) irradiating light or an active gas toward the adhesive polymer substrate on which a mask having a masking pattern has been placed to change the adhesiveness of the exposed areas on the surface of the adhesive polymer substrate to which light or active gas has been irradiated; and (c) selectively removing a part of the plurality of first particles from the adhesive polymer substrate by means of the difference in degree of impregnation between the plurality of first particles due to the difference in adhesiveness between the exposed areas and non-exposed areas to which light or active gas has not been irradiated on the adhesive polymer substrate, and by means of a particle removal agent for removing the first particles from the adhesive polymer substrate. According to the present invention, a coated film can be formed by means of a simple process of applying pressure to the particles in a dry state from above the adhesive polymer substrate, without using a solvent or an adhesive supplement.

Description

Coating Method Using Particle Alignment and Particle Coating Substrate Prepared thereby

The present invention relates to a coating method using a particle alignment, and to a particle coated substrate produced by the same, and more particularly, to a single layer of a plurality of fine particles at a high density by using a particle alignment using a particle alignment A coating method and a particle coated substrate produced thereby.

BACKGROUND OF THE INVENTION There is a need in the art for a technique of sorting and coating nanoparticles or micrometer level fine particles on a substrate. In one example, such coating techniques include memory devices, linear and nonlinear optical devices, photovoltaic devices, photo masks, deposition masks, chemical sensors, biochemical sensors, sensors for medical molecular detection, dye-sensitized solar cells, thin film solar cells, cell culture, It can be applied to the implant surface and the like.

The Langmuir-Blodgett (LB) method (hereinafter referred to as "LB method") is well known as a technique for aligning and coating fine particles on a substrate. In the LB method, a solution in which fine particles are dispersed in a solvent is floated on the surface of the water and then compressed by a physical method to form a thin film. The technique using this LB method is disclosed in Korean Patent Publication No. 10-2006-2146.

However, in the LB method, temperature, humidity, and the like must be precisely controlled so that particles can be self-assembled in a solvent. It may also affect particle migration by the surface properties (eg, hydrophobicity, charge properties, surface roughness) of the particles on the substrate. As a result, the particles may aggregate together and may not be evenly applied on the substrate. That is, there may be many areas where the particles are not applied, and where the aggregated particles meet each other, grain boundaries may be formed and many defects may be located.

The present invention is to solve the problems of the prior art as described above, an object of the present invention is to provide a coating method using a particle alignment that can be evenly applied on the substrate by a simple method and a particle coated substrate produced thereby To provide.

Another object of the present invention is to provide a coating method using a particle alignment and a particle coated substrate produced thereby, which can form a coating film in which a plurality of particles are aligned in a predetermined pattern by a simple method.

Still another object of the present invention is to provide a coating method using particle alignment and a particle coated substrate produced thereby, which can form a coating film in which heterogeneous particles are aligned in a predetermined pattern by a simple method.

The object is (a) coating a plurality of first particles on the adhesive polymer substrate to form a primary coating film; (b) changing the adhesion of the exposed part irradiated with light or active gas on the surface of the adhesive polymer substrate by irradiating light or active gas onto the adhesive polymer substrate with the mask on which the mask pattern is formed; And (c) a non-exposure portion or an exposure portion in the plurality of first particles forming the primary coating layer by using an adhesive force difference between a portion irradiated with light or an active gas of the adhesive polymer substrate and a portion not irradiated. And selectively removing the first particles from the adhesive polymer substrate by using the degree of impregnation of the particles and the degree of adhesion of the particle removing member.

The object is to (a) the light or active gas on the surface of the adhesive polymer substrate by partially exposing or exposing the surface of the adhesive polymer substrate by irradiating light or active gas toward the adhesive polymer substrate with the mask on which the mask pattern is formed. Changing the adhesion of the irradiated area; (b) forming a first coating layer by coating a plurality of first particles on the adhesive polymer substrate; And (c) a non-exposure portion or an exposure portion in the plurality of first particles forming the primary coating layer by using an adhesive force difference between a portion irradiated with light or an active gas of the adhesive polymer substrate and a portion not irradiated. And selectively removing the first particles from the adhesive polymer substrate by using the degree of impregnation of the particles and the degree of adhesion of the particle removing member.

The purpose of the present invention is to provide an adhesion part including an exposed part region in which adhesion force is increased by irradiating light or an active gas on a surface, and a non-exposed part region in which light or active gas is not irradiated on the surface and having a relatively small adhesive force compared to the exposed part region. Polymer substrates; A plurality of first recesses formed to have a surface recessed in the exposed portion region; And a primary coating film comprising a plurality of first particles arranged to be aligned in the plurality of first recesses, respectively.

In the coating method using the particle alignment according to the present invention, a coating film is formed by applying pressure on the adhesive polymer substrate to dry particles without using a solvent or an adhesion aid. In this process, when the particles come into contact with the adhesive polymer substrate, the surface of the flexible adhesive polymer substrate having flexibility is deformed to surround a part of the particles under the influence of the surface tension. As a result, recesses corresponding to the particles are formed on the surface of the adhesive polymer substrate, thereby improving bonding properties. The reversible nature of the shape deformation of the adhesive polymer substrate surface facilitates two-dimensional movement of the particles in contact on the substrate so that the particle distribution can be easily rearranged.

Enhancement of particle adhesion through such shape modification lowers the dependence of the particle surface properties and the type of the polymer substrate so that particles of various surface properties can be coated in a single layer. Therefore, it is not necessary to control the environment such as temperature, humidity, and particle concentration required for self-assembly and spin coating when forming a coating film as in the prior art, and to easily coat particles having various surface properties in a wide range of environments and conditions. Can be. In addition to the case where the particles are chargeable or easy to bond with hydrogen, even when the material is non-chargeable and hydrophobic, single layer particle coating may be uniformly performed at high density.

As described above, according to the present exemplary embodiment, the particles are evenly distributed on the adhesive polymer substrate by a simple method, thereby easily forming a coating layer having a high density.

In addition, the coating method using the particle alignment according to the present invention by using a mask to partially irradiate light or active gas on the adhesive polymer substrate to change the adhesion of the area irradiated with light or active gas, the non-exposed portion that is relatively weak adhesion By removing the particles located in the, it is possible to easily form a coating film of various patterns.

In addition, the coating method using the particle alignment according to the present invention comprises the step of partially changing the adhesion of the adhesive polymer substrate by exposing the adhesive polymer substrate using a mask, and partially placing the particles located in the unexposed portion of the adhesive polymer substrate By repeatedly removing and coating new particles, it is possible to easily form various coating films in which various kinds of particles are arranged in a specific pattern on the adhesive polymer substrate.

1a to 1j show step by step a coating method using particle alignment according to an embodiment of the present invention.

2 shows another embodiment in which a coating film is formed on a transfer substrate by using a coating method using particle alignment according to the present invention.

Figure 3 shows another embodiment of forming a secondary coating film on the adhesive polymer substrate in the coating method using the particle alignment according to an embodiment of the present invention.

4A to 4D show step by step a coating method using particle alignment according to another embodiment of the present invention.

5A, 5B, 5C, 5D, 5E, and 5F are electron micrographs of a coating film made of SiO ₂ having an average particle diameter of 300 nm and 750 nm on a substrate in Experimental Example 1 of the present invention.

6A and 6B are electron micrographs of a coating film made of SiO ₂ having an average particle diameter of 750 nm on a substrate in Experimental Example 2 of the present invention.

7A and 7B are electron micrographs of a coating film made of SiO ₂ having an average particle diameter of 120 nm on a substrate in Experimental Example 3 of the present invention.

8 and 9 are electron micrographs of the coating film made of SiO ₂ having an average particle diameter of 120 nm on the substrate in Experimental Example 4 of the present invention.

10a, 10b, 10c, 11a and 11b is that the adhesion of the particles is controlled by adjusting the temperature and the irradiation time of the light or active gas when the particle coating on the adhesive polymer substrate in Experimental Example 5 of the present invention It is a figure which shows.

12A and 12B are electron micrographs of a coating film made of SiO ₂ having an average particle diameter of 750 nm and 300 nm on a substrate in Experimental Example 6 of the present invention.

<Description of Drawing>

10: adhesive polymer substrate 12, 17: first, second recessed portion

14 exposure part 15 non-exposure part

20, 24: first and second particles 22: primary coating film

25: secondary coating film 30, 50: mask

31, 51: mask pattern 35: particle removal member

40: particle coated substrate 42, 44: transfer substrate

 Hereinafter, with reference to the accompanying drawings, it will be described in detail with respect to the coating method using a particle alignment according to the present invention and a particle coated substrate produced thereby.

In describing the present invention, the size or shape of the components shown in the drawings may be exaggerated or simplified for clarity and convenience of description. In addition, terms that are specifically defined in consideration of the configuration and operation of the present invention may vary depending on the intention or custom of the user or operator. These terms should be interpreted as meanings and concepts corresponding to the technical spirit of the present invention based on the contents throughout the specification.

1A to 1J illustrate step by step coating methods using particle alignment according to an embodiment of the present invention. Referring to FIGS. 1A to 1J, a coating method using particle alignment according to an embodiment of the present invention will be described in detail. The explanation is as follows.

First, as shown in FIG. 1A, an adhesive polymer substrate 10 having a smooth surface is prepared. The surface of the adhesive polymer substrate 10 may have a state in which a specific pattern or curvature is not formed, and the particles 20 (see FIG. 1C) forming the coating layer 22 (see FIG. 1C) (see FIG. 1C) thereon. It may have a level of surface roughness and structure that does not limit the movement of () (see FIG. 1H).

In this embodiment, the adhesive polymer substrate 10 includes various adhesive polymer materials in which adhesion exists. Adhesive polymers are generally distinguished from adhesives because they do not have commonly used adhesive properties. At least the adhesive polymer has an adhesive force lower than about 0.6 kg / inch of the adhesive force of the Scotch Magic ^TM tape (ASTM D 3330 evaluation). In addition, the adhesive polymer can maintain the shape of a solid state (substrate or film) at room temperature without a separate support.

The adhesive polymer material may be a silicone-based polymer material such as polydimethylsiloxane (PDMS), or a wrap, adhesive or sealing material including polyethylene (PE), polyvinyl chloride (PVC), or the like. A protective film containing a high molecular material can be used. Here, the adhesive polymer substrate 10 may be manufactured by coating an adhesive polymer material on a base substrate or by attaching an adhesive polymer material in a sheet or film form.

Here, the adhesive polymer material generally refers to an organic polymer material including silicon in a solid state or endowed with adhesion properties through plasticizer addition or surface treatment. Here, the adhesive polymer material is generally characterized by having a low surface tension and easy deformation of the form by the linear molecular structure. The excellent adhesion of such an adhesive polymer material is due to the soft (flexible) surface material and low surface tension, which is easy to deform the surface in the fine region. The low surface tension of the adhesive polymer material has the property of broadly adhering to the particles (20, 24) to be attached (similar to the solution wetting phenomenon), and the flexible surface is tight with the particles (20, 24) to be attached. Ensure that no contact is made. Through this, it has the characteristics of the adhesive polymer which is easily detachable to the solid surface without the complementary bonding force.

The surface tension of silicon-based polymer materials such as PDMS, a typical adhesive polymer material, is about 20 to 23 dynes / cm, close to Teflon (18 dynes / cm), which is known as the lowest surface tension material. The surface tension of silicon-based polymers such as PDMS is most organic polymers (35-50 dynes / cm), natural materials (綿, 73 dynes / cm), metals (eg silver (Ag, 890 dynes /) cm)), aluminum (Al, 500 dynes / cm), inorganic oxides (eg, glass (1000 dynes / cm)), iron oxides (1357 dynes / cm). In addition, in the case of a wrap including PE, PVC, etc., a large amount of plasticizer is added to improve adhesion, and thus has a low surface tension.

In this embodiment, the adhesion of the adhesive polymer substrate 10 can be controlled using chemical bonding made through additional light or active gas. In other words, the adhesive force may be controlled depending on whether the adhesive polymer substrate 10 is irradiated with light or whether the active gas is supplied. In particular, when the adhesive polymer substrate 10 is made of a silicon-based polymer material such as polydimethylsiloxane (PDMS), adhesion control by light or active gas as described above becomes easier.

However, the present invention is not limited thereto, and the adhesive force of the adhesive polymer substrate 10 may be controlled by introducing a photosensitive functional group into the adhesive polymer material or by mixing the photosensitive material with the adhesive polymer material. Hereinafter, the adhesive force of the adhesive polymer substrate 10 will be described on the basis of the case of being controlled by light or an active gas.

Subsequently, after preparing the adhesive polymer substrate 10 as described above, as shown in FIGS. 1B and 1C, the plurality of first particles 20 are aligned to form a primary coating film on the adhesive polymer substrate 10. 22). This will be described in more detail as follows.

First, as shown in FIG. 1B, the plurality of first particles 20 dried on the adhesive polymer substrate 10 is placed. Unlike the present embodiment, the particles dispersed in the solution are difficult to make direct contact with the adhesive polymer surface, so that the coating is not well made. Therefore, only a small amount of a solution or a volatile solvent less than the mass of the particles to be used may dry the particles during the coating operation to allow the coating operation.

In the present embodiment, the first particles 20 may include various materials for forming the primary coating layer 22. That is, the first particle 20 may include a polymer, an inorganic material, a metal, a magnetic material, a semiconductor, a biological material, and the like. In addition, a mixture of particles having different properties may be used as the first particle 20, and the second particle may be similarly applicable.

Polymers that can be used as the first particles 20 include polystyrene (PS), polymethyl methacrylate (PMMA), polyacrylate, polyvinyl chloride (PVC), polyalphastyrene, polybenzyl methacrylate, poly Phenyl methacrylate, polydiphenyl methacrylate, polycyclohexyl methacrylate, styrene-acrylonitrile copolymer, styrene-methyl methacrylate copolymer and the like.

Inorganic materials that can be used as the first particles 20 include silicon oxide (for example, SiO ₂ ), silver phosphate (for example, Ag ₃ PO ₄ ), titanium oxide (for example, TiO ₂ ), iron oxide ( For example, Fe ₂ O ₃ ), zinc oxide, cerium oxide, tin oxide, thallium oxide, barium oxide, aluminum oxide, yttrium oxide, zirconium oxide, copper oxide, nickel oxide and the like.

Examples of the metal that can be used as the first particles 20 include gold, silver, copper, iron, platinum, aluminum, platinum, zinc, cerium, thallium, barium, yttrium, zirconium, tin, titanium, alloys thereof, and the like. There is this.

Examples of semiconductors that can be used as the first particles 20 include silicon, germanium, or compound semiconductors (eg, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InP, InAs, InSb, etc.). .

Biomaterials that can be used as the first particles 20 include particles, surfaces of proteins, peptides, ribonucleic acid (RNA), deoxyribonucleic acid (DNA), polysaccharides, oligosaccharides, lipids, cells and complex materials thereof. Particles coated on the inside, and particles included therein. For example, a polymer particle coated with an antibody binding protein called protein A may be used as the first particle 20.

The first particle 20 may have a symmetrical shape, an asymmetrical shape, an amorphous shape, or a porous shape. For example, the first particle 20 may have a spherical shape, an ellipse shape, a hemispherical shape, a cube shape, a tetrahedron, a pentagonal surface, a hexahedron, an octahedron, a pillar shape, a horn shape, and the like. Among these, spherical or elliptical is preferable as the form of the 1st particle 20 compared with another form.

The first particles 20 preferably have an average particle diameter of 10 nm to 100 μm. When the average particle diameter is less than 10 nm, it may be in the form of being entirely wrapped by the adhesive polymer substrate 10 during coating, it may be difficult to coat the first particles 20 to a single layer level. In addition, when the average particle diameter of the first particles 20 is less than 10 nm, the particles may agglomerate with each other even in a dry state, and it may be difficult for the particles to individually move by only a rubbing force. When the average particle diameter of the first particles 20 exceeds 100 μm, adhesion of the particles may appear weak.

However, the present invention is not limited thereto, and the average particle diameter of the first particles 20 may vary depending on a material constituting the first particles 20 or a material constituting the adhesive polymer substrate 10. Here, when the first particles 20 are spherical, the diameter of the first particles 20 may be used as the particle diameter. On the other hand, when the first particle 20 is not spherical, various measurement methods may be used. For example, average values of long and short axes may be used as particle diameters.

Subsequently, as shown in FIG. 1C, a pressure is applied on the plurality of first particles 20 to form the primary coating film 22. As a method of applying pressure to the first particles 20, a method of rubbing using a latex, a sponge, a hand, a rubber plate, a plastic plate, a material having a smooth surface, or the like may be used. However, the present invention is not limited thereto, and pressure may be applied to the first particles 20 by various methods.

In the present exemplary embodiment, when the first particles 20 are raised on the surface of the adhesive polymer substrate 10 and then pressure is applied, the first particles 20 in the portion to which the pressure is applied are attached through the deformation of the adhesive polymer substrate 10. do. As a result, a plurality of first recesses 12 respectively corresponding to the first particles 20 are formed in the corresponding portion. Therefore, the first particles 20 are aligned on the adhesive polymer substrate 10 in a state in which the first particles 20 are wrapped in the first recesses 12.

The first recesses 12 are reversible to be formed by the interaction between the first particles 20 and the adhesive polymer substrate 10. That is, it may be extinguished and the position may be moved. For example, when the particles move in the rubbing process, the first concave portion 12 disappears due to the elastic restoring force of the adhesive polymer substrate 10, or the first concave portion 12 moves according to the movement of the first particle 20. The position can also be changed. Due to this reversible action, the first particles 20 can be evenly aligned (where “reversible” is a property generated by the flexibility and elastic restoring force of the surface of the adhesive polymer substrate during coating, so that the resilience of the adhesive polymer substrate is time-dependent). Broader meaning includes weakening or extinction over time).

The first particles 20 which are not bonded to the adhesive polymer substrate 10 are moved to an uncoated area where the first particles 20 of the adhesive polymer substrate 10 are not coated by rubbing force or the like. As described above, the first concave portion 12 is formed by the first particles 20 in the portion not provided. In addition, the adhesive polymer substrate 10 and the first particles 20 are bonded in the state where the first particles 20 are wrapped in the newly formed first recesses 12. Through this process, the primary coating film 22 having a single density is formed on the adhesive polymer substrate 10 at a high density.

Here, the first concave portion 12 may have a shape corresponding to the outer shape of the first particle 20 to surround a portion of the first particle 20. For example, when the first particles 20 are spherical, the first recesses 12 may also have a spherical shape, and a part of the first particles 20 may be in close contact with the first recesses 12. have. The depth L1 of the first concave portion 12 may vary depending on the hardness of the adhesive polymer substrate 10, the shape of the first particles 20, the hardness, and environmental factors (eg, temperature). That is, as the hardness of the adhesive polymer substrate 10 increases, the depth L1 of the first concave portion 12 may decrease, and as the temperature increases, the depth L1 of the first concave portion 12 may increase.

It is preferable that the ratio (sedimentation rate) (L1 / D) of the depth L1 of the 1st recessed part 12 with respect to the average particle diameter D of the 1st particle | grains 20 is 0.02-0.98. If the ratio L1 / D is less than 0.02, the bonding force between the first particles 20 and the adhesive polymer substrate 10 may not be sufficient, and when the ratio L1 / D exceeds 0.98, the first particles 20 may be monolayer. It can be difficult to coat to levels. In consideration of the bonding force and coating properties, etc., the ratio (L1 / D) is preferably 0.05 to 0.6, more preferably 0.08 to 0.4.

As in the present embodiment, when a portion of each first particle 20 is wrapped by the first concave portion 12 generated by the elastic deformation of the adhesive polymer substrate 10, the first particle 20 and The bonding force of the adhesive polymer substrate 10 may be increased. In addition, the first particles 20 bonded to the adhesive polymer substrate 10 may also move to an uncoated portion of the surroundings, such that the new first particles 20 are hollow first concave on the surface of the adhesive polymer substrate 10. It may be partially accommodated in the part 12. According to such rearrangement characteristics, the primary coating layer 22 may be coated at a single layer level at a high density. For example, the first particles 20 may be disposed such that each center thereof has a hexagonal shape.

On the other hand, when the first particle 20 is non-spherical (for example, Ag ₃ PO ₄ ) it can be determined whether or not it is a monolayer level by a variety of methods. For example, when the ratio of the average value of the thickness of the primary coating layer 22 to the average particle diameter of the top 10% of the first particles 20 (ie, particles having a particle size of less than 10%) is 1.9 or less, a single layer You can see the coating at the level.

Subsequently, after the primary coating film 22 is formed on the adhesive polymer substrate 10, as shown in FIG. 1D, the adhesive is irradiated with light or an active gas on the mask 30 having the mask pattern 31 formed thereon. The region where the primary coating layer 22 is formed on the surface of the polymer substrate 10 is partially exposed to exposure or gas. Although the surface of the adhesive polymer substrate 10 is covered with the primary coating film 22 composed of the plurality of first particles 20, the light irradiated as an example may be adhered through a gap between the plurality of first particles 20. The adhesive polymer substrate 10 may be exposed by reaching the polymer substrate 10. When the first particles 20 are made of a material through which light or active gas can pass, the irradiated light or active gas can pass through the first particles 20 to reach the adhesive polymer substrate 10. .

In the present embodiment, for example, when the adhesive polymer substrate 10 is made of a PDMS material, the above-described light may be specifically applied to ultraviolet rays, but the present invention is not limited thereto, and the visible light or infrared rays may be determined depending on the material of the adhesive polymer substrate 10. Of course, it is also applicable.

As such, when the mask 30 is disposed on the adhesive polymer substrate 10, the adhesive polymer substrate 10 is irradiated with light or an active gas. As shown in FIG. 1E, the surface of the adhesive polymer substrate 10 may be removed. The adhesion of the exposed portion 14 irradiated with light or active gas is greater than that of the non-exposed portion 15 not irradiated with light or active gas. This is because the solubility is poor and the thermal properties and chemical resistance are significantly improved while the molecular weight is greatly increased by a reaction such as crosslinking or light dimerization by irradiation of the light or the active gas. In addition, the hardness of PDMS is changed by the irradiation of light or active gas, or the bonding is performed with functional groups on the surface of the particle. Therefore, the first particles 20 positioned in the exposed portion 14 may maintain a state of being attached to the adhesive polymer substrate 10 with a stronger bonding force than the first particles 20 disposed in the non-exposed portion 15.

Subsequently, as illustrated in FIG. 1F, the particle removing member 35 having an adhesion force greater than that of the non-exposed portion 15 of the adhesive polymer substrate 10 and smaller than the adhesion force of the exposure portion 14 may be formed using a primary coating film ( 22) Touch above and remove. In this case, as illustrated in FIG. 1G, among the plurality of first particles 20 forming the primary coating layer 22, the first particles 20 disposed in the non-exposed part 15 may be the particle removing member 35. Attached to and removed from the adhesive polymer substrate 10. As the particle removal member 35, a difference between polymer materials such as polydimethylsiloxane (PDMS), polyethylene (polyethylene, PE), and polyvinyl chloride (PVC) and adhesive force, which have a difference in adhesion and relative adhesion on one surface, may be obtained. Branches may be used in various kinds such as Scotch Tape ^™ . For example, the particle removing member 35 may be applied as a low hardness 2 ~ 7% PDMS adhesive tape to utilize the removed particles.

As such, when the first particles 20 positioned in the non-exposed part 15 of the adhesive polymer substrate 10 are removed using the particle removing member 35, the exposed part 14 may be exposed to the adhesive polymer substrate 10. Only the first particles 20 positioned in the remaining portion may be left to form the particle coating substrate 40 on which the primary coating layer 22 of a predetermined pattern is formed.

In addition, the primary coating layer 22 formed in a predetermined pattern as described above may be used in a state of being bonded to the adhesive polymer substrate 10, or may be transferred to another substrate and the like. Although not shown, a transfer substrate having an adhesive force greater than that of the exposed portion 14 of the adhesive polymer substrate 10 is brought into contact with the primary coating layer 22, and then detached from the primary coating layer coated on the adhesive polymer substrate 10. It is possible to transfer the 22 to a new transfer substrate as it is.

Coating method using a particle alignment according to an embodiment of the present invention can make a particle coating substrate 40 having a primary coating film 22 of a predetermined pattern through the steps (Fig. 1a to 1g) as described above. . In addition, after this step, various subsequent steps may be additionally performed to form another pattern of coating film.

That is, as shown in FIG. 1H, the first particles 20 and the other second particles 24 are coated on the surface of the adhesive polymer substrate 10 on which the plurality of first particles 20 are coated. It is also possible to form a new coating film in which the particles 20 and 24 are aligned in a predetermined pattern, respectively. The method of coating the plurality of second particles 24 is the same as the method of coating the plurality of first particles 20 on the adhesive polymer substrate 10, and the specific method thereof is as follows.

First, a plurality of dried second particles 24 are placed on the adhesive polymer substrate 10 on which the primary coating layer 22 is formed. As the second particles 24, a polymer, an inorganic material, a metal, a magnetic material, a semiconductor, a biological material, or the like may be used, and the specific types thereof are the same as described above. Then, pressure is applied on the plurality of second particles 24 to coat the second particles 24 on the non-exposed part 15 where the first particles 20 are not disposed. The method of applying pressure to the second particles 24 is the same as the method used to coat the first particles 20 as described above, and includes latex, sponges, hands, rubber plates, plastic plates, materials having a smooth surface, and the like. A method of rubbing using may be used. The mechanism in which the plurality of second particles 24 are coated on the adhesive polymer substrate 10 is the same as that of the aforementioned first particles 20 is coated on the adhesive polymer substrate 10.

That is, when the second particles 24 are placed on the adhesive polymer substrate 10 and then pressure is applied, the second particles 24 in the portion to which the pressure is applied are attached through the deformation of the adhesive polymer substrate 10. A plurality of second recesses 17 corresponding to the second particles 24 are formed in corresponding portions of the polymer substrate 10. Accordingly, while the second particles 24 are aligned with the non-exposed portions 15 of the adhesive polymer substrate 10 while the second particles 24 are wrapped in the second recessed portions 17, the non-exposed portions 15 A secondary coating film 25 composed of a plurality of second particles 24 is formed. Of course, the second particles 24 may be aligned and coated on the adhesive polymer substrate 10 while the second particles 24 are partially accommodated in the empty first recesses 12 from which the first particles 20 are removed. have. On the other hand, it is preferable that the ratio (sedimentation rate) of the depth of the 2nd recessed part 17 with respect to the average particle diameter D of the 2nd particle 24 is 0.02-0.98 similarly.

The secondary coating film 25 formed on the adhesive polymer substrate 10 may be used as it is bonded to the adhesive polymer substrate 10 or may be transferred to another substrate. That is, as illustrated in FIG. 1I, the second coating layer 25 may be formed of another transfer substrate 42 having an adhesion force greater than that of the non-exposed portion 15 of the adhesive polymer substrate 10 and less than that of the exposure portion 14. When the contact layer is contacted and removed, the secondary coating film 25 can be transferred to the transfer substrate 42 as shown in FIG. 1J.

In this case, the particle coating substrate 40 having the primary coating layer 22 formed on the adhesive polymer substrate 10 may be used as a mold for forming the secondary coating layer 25. That is, as described above, after the second coating layer 25 is transferred to another transfer substrate 42, the second particles 24 are coated on the adhesive polymer substrate 10, and the second particles 24 are coated with the second particles 24. By repeating the step of transferring the made secondary coating film 25 to another transfer substrate 42, a plurality of secondary coating film 25 can be repeatedly formed with one particle coating substrate 40.

As another example, the secondary coating layer 25 formed on the adhesive polymer substrate 10 may be transferred to another substrate together with the primary coating layer 22. That is, after forming the primary coating film 22 and the secondary coating film 25 on the adhesive polymer substrate 10, the other transfer substrate 44 having a greater adhesion than the exposed portion 14 of the adhesive polymer substrate 10 After contacting the primary coating film 22 and the secondary coating film 25 on the peeled off, as shown in Figure 2, the coating film in which the primary coating film 22 and the secondary coating film 25 combined in a specific pattern is different The transfer substrate 44 can be transferred.

In addition, the coating method using the particle alignment according to an embodiment of the present invention by repeatedly performing the exposure step, the partial particle removal step, the new particle coating step, the transfer step and the like as described above, the adhesive polymer substrate 10 Various types of particles may be formed on the coating layer in which various kinds of particles are arranged in a specific pattern. The alignment pattern of each particle can be varied by varying the mask pattern 31 of the mask 30 used in the exposure step.

Meanwhile, FIG. 3 shows another embodiment in which the second particles 24 are coated on the adhesive polymer substrate 10 in the coating method using the particle alignment according to the present invention. In the present invention, since the concave portion is formed in the adhesive polymer substrate 10 by elastic deformation, when the particles accommodated in the concave portion are removed, the surface of the adhesive polymer substrate 10 as shown in FIG. This recess may disappear and return to the smooth surface. In this state in which the first concave portion 12 (see FIG. 1G) in which the first particles 20 are accommodated is reversibly dissipated, the plurality of second particles 24 are placed on the adhesive polymer substrate 10 and pressure is applied thereto. The second particles 24 may be coated while the second recesses 17 corresponding to the second particles 24 are formed in the non-exposed parts 15.

Of course, when the first particles 20 are removed from the first recesses 12 after a long time after the primary coating layer 22 is formed, as described above, the first recesses 12 or the first The traces of the first recesses 12 may remain on the surface of the adhesive polymer substrate 10. In this case, the newly coated second particles 24 are partially wrapped in the first recesses 12, or the adhesive polymer substrates are penetrated by digging into the adhesive polymer substrate 10 at a position corresponding to the first recesses 12. 10 may be attached.

As described above, the coating method using the particle alignment according to the present invention is applied by applying a pressure in a state in which the dry particles (20, 24) in direct contact on the adhesive polymer substrate 10 without using a solvent ( 22,25). Accordingly, since the self-assembly of the particles in the solvent is not required when forming the coating film as compared with the related art, it is not necessary to precisely control the temperature, humidity, and the like, and does not significantly affect the surface properties of the particles. That is, the coating can be uniformly made at a high density not only when the particles are chargeable materials, but also when they are non-chargeable (ie, near charge neutral) materials. In addition, not only hydrophilic particles but also hydrophobic particles can be uniformly coated. As described above, according to the present invention, the particles 20 and 24 may be evenly distributed on the adhesive polymer substrate 10 by a simple method to form the coating layers 22 and 25 having a single density.

In addition, in the coating method using particle alignment according to the present invention, the adhesive force of the region 14 irradiated with light or active gas is changed by partially irradiating light or active gas onto the adhesive polymer substrate 10 using the mask 30. By removing the particles 20 located in the non-exposure portion 15 having a relatively weak adhesive force, a coating film having various patterns can be formed.

In addition, the coating method using the particle alignment according to the present invention comprises the step of partially changing the adhesion of the adhesive polymer substrate 10 by exposing the adhesive polymer substrate 10 using the mask 30, the adhesive polymer substrate 10 By repeatedly performing the steps of partially removing the particles 20 located in the unexposed portions of the coating, coating the new particles 24, and the like, a plurality of particles are respectively identified on the adhesive polymer substrate 10. Various coating films arranged in a pattern can be formed.

On the other hand, Figures 4a to 4d shows step by step coating method using the particle alignment according to another embodiment of the present invention. 4A to 4D, the coating method using particle alignment according to another embodiment of the present invention will be described in detail as follows.

First, as shown in FIG. 4A, the adhesive polymer substrate 10 having a smooth surface is prepared, and the adhesive polymer substrate 10 is irradiated with light or an active gas on the mask 50 on which the mask pattern 51 is formed. The surface of is partially exposed. The adhesive polymer substrate 10 is as described above.

As such, when the mask 50 is disposed on the adhesive polymer substrate 10, the adhesive polymer substrate 10 is irradiated with light or an active gas, and as shown in FIG. 4B, the surface of the adhesive polymer substrate 10 may be removed. The adhesion of the exposed portion 14 irradiated with light or active gas is greater than that of the non-exposed portion 15 not irradiated with light or active gas. After exposing the adhesive polymer substrate 10 to light or an active gas to form the exposed portion 14, as shown in FIG. 4C, a plurality of particles 20 are aligned to form a coating film on the adhesive polymer substrate 10. To form (22).

Here, the kind of particle 20 and the specific method of forming the coating film 22 from the some particle 20 are as having mentioned above. However, in the present exemplary embodiment, when the plurality of particles 20 are placed on the adhesive polymer substrate 10 having the exposed portion 14 and are applied to the adhesive polymer substrate 10 by applying pressure thereto, the particles 20 are positioned on the exposed portion 14. The binding force of the particles 20 to the adhesive polymer substrate 10 is greater than the bonding force of the particles 20 positioned on the non-exposed part 15 to the adhesive polymer substrate 10, and thus the particles positioned on the exposed part 14. 20 is more firmly bonded to the adhesive polymer substrate 10 than the particles 20 located in the non-exposed part 15.

Subsequently, as shown in FIG. 4D, a particle removal member 35 (see FIG. 1F) having an adhesion force greater than that of the non-exposed portion 15 of the adhesive polymer substrate 10 and smaller than the adhesion force of the exposed portion 14 is provided. If the particles 20 disposed on the non-exposed part 15 are removed from the plurality of particles 20 forming the coating film 22 by using the coating film 22, the coating film 22 having a pattern corresponding to the exposure pattern may be formed.

On the other hand, by performing the steps (FIG. 1H to 1J), such as secondary coating film formation, coating film transfer, as described above, to form a variety of coating film, each of the various types of particles arranged in a specific pattern on the adhesive polymer substrate 10 Alternatively, the coating film made of various particles or formed in various patterns may be transferred to another substrate.

Hereinafter, the present invention will be described in more detail with reference to experimental examples of the present invention. These experimental examples are only illustrated to explain the present invention in detail, but the present invention is not limited thereto.

Experimental Example 1

An adhesive polymer substrate made of PDMS formed in Sylgard 184 (Dow Corning, USA) was prepared containing 20 wt% of a curing agent.

After placing 300 nm SiO ₂ particles on the adhesive polymer substrate, using a sponge wrapped with a latex film, rubbing while applying pressure by hand to form a recess in the surface of the adhesive polymer substrate. The 300 nm SiO ₂ particles and the adhesive polymer substrate are combined to form a 300 nm SiO ₂ coating film, and then nitrogen gas is blown to remove the particles in the part where the multi layer is formed for the single layer coating.

5A and 5C show a state in which a mask pattern is formed by depositing Au on a quartz substrate. The mask pattern is applied onto the adhesive polymer substrate on which the 300 nm SiO ₂ coating film is formed and irradiated with UV of 185 nm under an air atmosphere.

Then, after stabilizing for one day, the 3M scotch tape is adhered and then pressurized with a roller and the 3M scotch tape is removed to remove only the weakly adherent areas (non-exposed areas) that are not irradiated with UV. At this time, the area to be stabilized varies depending on the irradiation time, which can be confirmed through the coating area of the substrate irradiated with UV of FIG. 5D for 10 minutes and the substrate irradiated with UV of FIG. 5E for 20 minutes.

After the 750nm SiO ₂ particles were placed on the substrate irradiated under the condition of FIG. 5E for 20 minutes, 750 nm SiO ₂ coating film was deposited on the surface of the adhesive polymer substrate where the particles were removed by rubbing while applying pressure by hand using a sponge wrapped with a latex film. After the formation of nitrogen, blowing the nitrogen gas to remove the particles of the portion where the multi-layer is formed to prepare a substrate coated with a single layer of SiO ₂ particles of 300nm and 750nm, the measurement results are shown in Figure 5f. Figure 5f is the result of measuring the substrate through a confocal microscope, as can be seen in the results of Figure 5f in the case of the present invention particles of different sizes (750nm, 300nm) can be coated on the same substrate as a single layer and the coating site It can be seen that the mask pattern can be selectively determined. Specifically, in FIG. 5F, particles having a size of 750 nm are coated on the circular portion, and particles having a size of 300 nm are coated on the periphery thereof.

Experimental Example 2

An adhesive polymer substrate made of PDMS formed in Sylgard 184 (Dow Corning, USA) was prepared containing 20 wt% of a curing agent.

An aluminum mask pattern having a hole pattern was applied to the substrate, and 185 nm UV was irradiated for 10 minutes under an air atmosphere, and then 750 nm SiO ₂ particles modified with FITC (Fluorescein isothiocyanate) were placed on the adhesive polymer substrate. After wrapping a latex film with a sponge to combine the modified a 750nm SiO ₂ particles and the adhesion between a polymer substrate for, forming parts of a while rubbing the concave on the surface of adhesion between the polymer substrate pressure FITC (Fluorescein isothiocyanate) by hand (Fluorescein isothiocyanate) FITC by After the modified 750 nm SiO ₂ particle coating film was formed, nitrogen gas was blown for the single layer coating to remove particles in the part where the multi layer was formed.

After stabilization for 1 day, the 3M scotch tape is bonded and then pressurized with a roller and the 3M scotch tape is removed to remove only the weakly adherent areas (non-exposed areas) that are not irradiated with UV. A picture thereof is shown in FIG. 6B.

Thereafter, 750 nm SiO ₂ particles are placed on the substrate, and then rubbed while applying pressure by hand using a sponge wrapped with a latex film to form a recess in the surface of the adhesive polymer substrate where the particles are removed. The 750 nm SiO ₂ particles were combined with the adhesive polymer substrate in the region where the particles were removed to form a 750 nm SiO ₂ coating film, followed by blowing nitrogen gas for single layer coating to remove the particles in the part where the multi layer was formed. 6a.

From the results, the present invention can be confirmed that the light-sensitive particles such as photospecific (photosensitive) particles can be coated on a substrate without damaging even a single layer, and the particle coating site can be selectively determined through exposure using a mask pattern. there was.

Experimental Example 3

An adhesive polymer substrate in the form of a negative lens consisting of PDMS formed in Sylgard 184 (Dow Corning, USA) containing 20 wt% of a curing agent was prepared.

After irradiating 254nm UV for 60 minutes to the intaglio-type adhesive polymer substrate under air atmosphere, put 120nm SiO ₂ particles on the substrate and rub it tightly several times while applying pressure by hand using a sponge wrapped with a latex film. While forming recesses on the surface of the polymer substrate, 120 nm SiO ₂ particles and the adhesive polymer substrate were bonded to form a 120 nm SiO ₂ coating film. Nitrogen gas is then blown to remove particles from the part where the multi-layer is formed. After washing through ethanol to completely remove the multi-parts present in the concave portion of the lens, ethanol is filled in the coated portion of the substrate, the Sonicator is operated for 10 minutes, washed with water and then dried with nitrogen.

The particles are then transferred through the UV curable resin to form the embossed microstructure of FIG. 7A. If irradiated with UV under an air atmosphere for 30 minutes before the transition to increase the adhesion between the particles and the adhesive polymer substrate and then transferred through the UV curable resin, the particles do not transfer, thereby forming a negative microstructure as shown in FIG. 7B. It can be seen that the PDMS adhesive polymer substrate can be transferred not only in the planar shape but also in the curved lens structure.

That is, in the case of the present invention it can be seen that the particles can be coated on the adhesive polymer substrate that already has a three-dimensional structure pattern instead of a plane. In the above description, the case where the adhesive polymer substrate has a flat surface has been described. However, in the case of FIGS. 7A and 7B, a plurality of separate protrusion structures are already provided to form a three-dimensional structure pattern on the adhesive polymer substrate. Through the present experimental example it can be seen that the present invention can additionally form a coating film by coating the particles on the surface of the plurality of protrusions. Here, the plurality of protrusions are made of the same material as the adhesive polymer substrate.

Experimental Example 4

An adhesive pyramidal substrate in the form of an intaglio pyramid made of PDMS formed in Sylgard 184 (Dow Corning, USA) containing 20 wt% of a curing agent was prepared. Here, the adhesive polymer substrate has a three-dimensional three-dimensional prism film optical form, not a plane.

The substrate was irradiated with UV at 185 nm for 60 minutes in an air atmosphere, and then 120 nm SiO ₂ particles were placed on the substrate, and rubbed several times with pressure by hand using a sponge wrapped with a latex film. Form a recess in the. The 120 nm SiO ₂ particles and the adhesive polymer substrate are combined to form a 120 nm SiO ₂ coating film. After blowing the nitrogen gas to remove the particles in the multi-layered part, and washing through ethanol to completely remove the multi-parts in the concave part of the lens, and then fill the coated part of the substrate with ethanol and the Sonicator Run for 10 minutes, wash with water and dry with nitrogen. The particles are then transferred through the UV curable resin to form the embossed microstructure of FIG. 8.

It can be seen that the PDMS adhesive polymer substrate can be transferred not only in the planar shape but also in the three-dimensional pyramidal structure. Specifically, referring to FIG. 9, it can be seen that the particles are uniformly coated on all parts of the pattern such as the upper surface of the protrusion of the prism film having the protrusion and the recess of the three-dimensional structure, the lower surface of the recess, and the inclined surface thereof.

Experimental Example 5

An adhesive polymer substrate made of PDMS formed in Sylgard 184 (Dow Corning, USA) was prepared containing 20 wt% of a curing agent.

After placing the particles on the adhesive polymer substrate, using a sponge wrapped with a latex film, rub with pressure by hand to form a recess on the surface of the adhesive polymer substrate to form a coating film by combining the particles and the adhesive polymer substrate to form a coating film. Blowing was performed to remove particles from the part where the multi-layer was formed.

At this time, the particles are the type of particles to coat each 750nm SiO _2, amine This was used for 750nm SiO _2, 800nm PS, which is modified 750nm SiO _2, the RGD is modified adhesion to polymer substrates such as table of Figure 10b, 10c and ratio is the 750nm SiO _2, amine this is modified 750nm SiO _2, RGD is 750nm, which is modified SiO ₂ 10% + amine is 90% 750nm SiO ₂ that is modified, 50% 750nm SiO ₂ that RGD is modified + amine Six types of modified 750 nm SiO ₂ 50%, RGD modified 750 nm SiO ₂ 90% + amine modified 750 nm SiO ₂ 10%, RGD modified 750 nm SiO ₂ , and 800 nm PS were used.

In addition, each adhesive polymer substrate is stabilized at 55 ° C. after irradiating the particles for 5 minutes and 10 minutes under UV atmosphere with PDMS without particle coating as shown in FIGS. 10A, 10B, and 10C. , PDMS uncoated particles were irradiated with UV for 5 minutes and 10 minutes under an air atmosphere, and the particles were coated and stabilized at room temperature dry conditions, and PDMS without particles coated with PDMS for 5 minutes and 10 minutes under an air atmosphere The particles were irradiated and coated, and then stabilized under vacuum temperature conditions, and tested under a total of six conditions. In FIG. 10B, the stabilization time was given for 5 hours, and in FIG.

Separately, as shown in FIGS. 11A and 11B, PDMS without particles were irradiated with UV for 5 minutes under an air atmosphere, and after the particles were coated, the stabilization time was changed to a stabilization temperature of 37 ° C. for 5 hours and 20 hours. Experimented.

After particle coating, stabilize to 5 hours and 20 hours according to each condition, and then attach 3M scotch tape, pressurize with a roller, and remove 3M scotch tape to check the difference in particle adhesion between each condition according to temperature and condition. saw.

In Figs. 10B, 10C, and 11B, the numbers 1 to 5 represent the extent to which the particles are removed when the 3M scotch tape is removed. 5 indicates no damage and 1 indicates that many particles are removed.

Looking at Figure 10b it can be seen that the particle adhesion increased in all the particles except the 800nm PS under the increased temperature conditions, it can be seen that UV treatment is suitable for improving the particle adhesion. In comparison with FIG. 10c, which has only a stabilization time under the same conditions, in FIG. 10c, where the stabilization time is long, the particle adhesion of all the conditions is increased except for 800 nm PS, and stabilization at a relatively high temperature is very effective. .

That is, it is possible to control the degree of adhesion of the particles by controlling the temperature and the irradiation time of light or active gas when coating the particles on the adhesive polymer substrate, and can have a variety of surface properties by using and mixing the particles in various ways.

Experimental Example 6

In FIG. 12A, three adhesive polymer substrates including PDMS formed of Sylgard 184 (Dow Corning, USA) including 20 wt%, 10 wt%, and 5 wt% of a curing agent were prepared.

750nm SiO ₂ particles were placed on the adhesive polymer substrate and rubbed while applying pressure by hand using a sponge wrapped with a latex film to form recesses on the surface of the adhesive polymer substrate, thereby combining the 750nm SiO ₂ particles and the adhesive polymer substrate to form 750nm SiO ₂ particles. ₂ After forming a coating film, nitrogen gas was blown and the particle | grains of the part in which the multi layer is formed were removed.

Thereafter, the UV cured resin is poured onto the substrate coated with each particle, and then cured to transfer the particles. 12a, it can be seen that the impregnation degree of the particles transferred to the UV curing resin according to the PDMS concentration, respectively.

In the case of FIG. 12B, when preparing an intaglio mold, first, an adhesive polymer substrate made of PDMS including 20 wt% of a curing agent based on Sylgard 184 (Dow Corning, USA) was prepared. 3min, 10min, 30min time.

300nm SiO ₂ particles were placed on the adhesive polymer substrate and rubbed while applying pressure by hand using a sponge wrapped with a latex film to form recesses on the surface of the adhesive polymer substrate, thereby combining 300nm SiO ₂ particles and the adhesive polymer substrate to form 300nm SiO ₂ particles. ₂ After forming a coating film, nitrogen gas was blown and the particle | grains of the part in which the multi layer is formed were removed.

After particle coating, each mold is irradiated with UV under an air atmosphere for 10 minutes to stabilize, and then each UV-cured resin is poured onto a substrate coated with each particle and cured to form a negative mold. It can be seen from Figure 12b that the depth of the intaglio mold formed on the UV curing resin according to the initial UV irradiation time.

That is, it can be seen from the results of FIGS. 12a and 12b that the impregnation degree of the particles can be controlled by controlling the hardness or temperature of the adhesive polymer substrate itself, and also controlling the impregnation of the particles by controlling the irradiation time of light or active gas. It can be seen that this is possible.

In addition, it can be seen that the particle impregnation can also be adjusted in the embossed form as well as the particle impregnation in the engraved form.

Embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can improve and change the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the protection scope of the present invention as long as it will be apparent to those skilled in the art.

In the coating method using the particle alignment according to the present embodiment, a light or active gas is partially irradiated onto the adhesive polymer substrate using a mask to change the adhesion of the area irradiated with light or the active gas, and to a non-exposed area having relatively weak adhesion. By removing the particles that are located, it is possible to easily form a coating film of various patterns. In addition, it is useful industrially because it is possible to easily form a variety of coating film in which a plurality of particles are arranged in a specific pattern on the adhesive polymer substrate.

Claims (19)

1. (a) coating a plurality of first particles on the adhesive polymer substrate to form a primary coating film;

   (b) changing the adhesion of the exposed part irradiated with light or active gas on the surface of the adhesive polymer substrate by irradiating light or active gas onto the adhesive polymer substrate with the mask on which the mask pattern is formed; And

   (c) a non-exposed portion or an exposed portion disposed in the non-exposed portion or the exposed portion of the plurality of first particles forming the primary coating film by using a difference in adhesion between the irradiated portion of the adhesive polymer substrate and the irradiated portion of the light or active gas; And selectively removing the particles from the adhesive polymer substrate using the degree of impregnation of the particles and the degree of adhesion of the particle removing member.
2. (a) a region in which light or an active gas is irradiated on the surface of the adhesive polymer substrate by partially exposing or exposing the surface of the adhesive polymer substrate by irradiating light or an active gas toward the adhesive polymer substrate with a mask having a mask pattern formed thereon; Changing the adhesion of the;

   (b) forming a first coating layer by coating a plurality of first particles on the adhesive polymer substrate; And

   (c) a non-exposed portion or an exposed portion disposed in the non-exposed portion or the exposed portion of the plurality of first particles forming the primary coating film by using a difference in adhesion between the irradiated portion of the adhesive polymer substrate and the irradiated portion of the light or active gas; And selectively removing the particles from the adhesive polymer substrate using the degree of impregnation of the particles and the degree of adhesion of the particle removing member.
3. The method according to claim 1 or 2,

   After the step (c),

   And forming a secondary coating layer by coating a plurality of second particles on a region where the first particles are removed on the adhesive polymer substrate.
4. The method according to claim 1 or 2,

   Coating method using the particle alignment, characterized in that the adhesion area and the adhesion area of the adhesive polymer substrate can be adjusted according to the irradiation time or the irradiation intensity of the light or active gas.
5. The method according to claim 1 or 2,

   Coating method using a particle alignment, characterized in that the adhesion between the plurality of first particles and the adhesive polymer substrate can be adjusted by changing the temperature to stabilize after coating the plurality of first particles on the adhesive polymer substrate.
6. The method of claim 3,

   At least one of the plurality of first particles and the plurality of second particles is rubbed onto the adhesive polymer substrate to apply pressure to coat the adhesive polymer substrate with at least one of the plurality of first particles and the plurality of second particles. Coating method using particle alignment to be.
7. The method of claim 3,

   After the formation of the secondary coating film,

   And transferring at least one of the primary coating film and the secondary coating film to another transfer substrate using a difference in adhesion between the non-exposed part and the exposed part of the adhesive polymer substrate.
8. The method of claim 3,

   The primary coating film and the secondary coating film, the coating method using a particle alignment, characterized in that the plurality of first particles and the plurality of second particles are each coated with a single layer.
9. The method according to claim 1 or 2,

   In the first coating film forming step, the adhesive polymer substrate is provided with a plurality of first recesses recessed to correspond to the plurality of first particles by deformation of the adhesive polymer substrate,

   And the first concave portion is provided in a reversible state.
10. An adhesive polymer substrate including an exposed part region in which adhesion force is increased by irradiating light or active gas on a surface, and a non-exposed part region in which light or active gas is not irradiated on the surface and having a relatively small adhesive force compared to the exposed part region;

    A plurality of first recesses formed to have a surface recessed in the exposed portion region; And

    Particle coating substrate comprising a primary coating film consisting of a plurality of first particles arranged to be aligned in each of the plurality of first recesses.
11. The method of claim 10,

    A plurality of second concave portions formed to have a surface recessed in the non-exposed portion region; And

    Particle coating substrate further comprises a secondary coating film made of a plurality of second particles arranged to be aligned in each of the second recess.
12. The method of claim 10,

    The adhesive polymer substrate is a particle-coated substrate, characterized in that selected from silicon-based polymer material, wraps, a film for protecting the surface, a film having a gloss easy to change the surface shape.
13. The method of claim 10,

    The adhesive polymer substrate is a particle coating substrate comprising at least one of polydimethylsiloxane (PDMS), polyethylene (PE, PE), polyvinyl chloride (PVC).
14. The method of claim 11,

    At least one of the plurality of first particles and the plurality of second particles is in direct contact with the adhesive polymer substrate.
15. The method of claim 11,

    Particle coating substrate, characterized in that the primary coating film and the secondary coating film is formed by coating the plurality of first particles and the plurality of second particles in a single layer, respectively.
16. The method of claim 11,

    When the plurality of first particles and the plurality of second particles are each non-spherical, the primary coating film and the average particle diameter of the particles having the highest 10% particle diameter among the plurality of first particles and the plurality of second particles Particle-coated substrate, characterized in that the ratio of the average value of the secondary coating film thickness is 1.9 or less, respectively.
17. The method of claim 11,

    And a depth ratio of the first concave portion and the second concave portion to an average particle diameter of the first particle and the second particle is 0.02 to 0.98, respectively.
18. The method of claim 11,

    And wherein the plurality of first particles and the plurality of second particles each comprise at least one of a chargeable material and a non-chargeable material, a hydrophobic material and a hydrophilic material.
19. The method of claim 10,

    Particle-coated substrate, characterized in that the three-dimensional pattern of the three-dimensional structure is provided on the surface of the adhesive polymer substrate.

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