WO2015156529A1 - Dispositif de chauffage de substrat - Google Patents

Dispositif de chauffage de substrat Download PDF

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Publication number
WO2015156529A1
WO2015156529A1 PCT/KR2015/003131 KR2015003131W WO2015156529A1 WO 2015156529 A1 WO2015156529 A1 WO 2015156529A1 KR 2015003131 W KR2015003131 W KR 2015003131W WO 2015156529 A1 WO2015156529 A1 WO 2015156529A1
Authority
WO
WIPO (PCT)
Prior art keywords
hot plate
substrate heating
heating apparatus
peripheral support
peripheral
Prior art date
Application number
PCT/KR2015/003131
Other languages
English (en)
Korean (ko)
Inventor
이새봄
정동준
Original Assignee
주식회사 좋은기술
이새봄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150041658A external-priority patent/KR20150118025A/ko
Application filed by 주식회사 좋은기술, 이새봄 filed Critical 주식회사 좋은기술
Publication of WO2015156529A1 publication Critical patent/WO2015156529A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Definitions

  • the present invention relates to heating devices such as wafers for use in semiconductor manufacturing processes and the like, and more particularly, to heating devices including hot plates.
  • a hot plate in a conventional substrate heating apparatus, includes a heat source in the form of a plate and a plate material above and below it.
  • the plate is made of metal such as aluminum, and the upper and lower plates are joined together by a bolt or the like with a heat source interposed therebetween.
  • the hot plate is fixed with respect to the fixed table, in which a finger for raising and lowering the wafer is located at the center thereof and fixed by the outer fixed structure.
  • the wafer in the high temperature state lying on the distorted heating surface (upper surface) of the hot plate is deformed and deformed together. If the wafer is placed on the distorted hot plate, the temperature imbalance is intensified, causing a process defect.
  • the present invention provides a substrate heating apparatus capable of effectively suppressing distortion of a heating surface caused by thermal expansion of a hot plate.
  • Substrate heating device according to the invention:
  • a table supporting the hot plate A center support portion supporting the central portion of the hot plate on the table; And
  • Peripheral support for supporting the peripheral portion of the hot plate with respect to the table in a state that allows the thermal expansion in the planar direction of the hot plate.
  • the central support portion may fix the central portion of the hot plate to the table.
  • the central support portion may be installed to move the central portion of the hot plate at a predetermined distance with respect to the planar direction of the table.
  • the peripheral support may be fixed at one end to an edge of the hot plate, and the other end thereof may be installed to be moved relative to the table.
  • the lower end of the peripheral support may be provided with a rotary member for rolling movement on the surface of the table.
  • the rotating member may be a ball or a roller.
  • a slide lamp member may be provided at a lower end of the support pillar, and a sliding (guide) groove into which the sliding member is fitted may be provided at the table.
  • At least one of the central support and the peripheral support may have a structure capable of adjusting the length.
  • FIG. 1 is a schematic perspective view of a substrate heating apparatus according to an embodiment of the present invention.
  • FIG. 2 is a side view of a substrate heating apparatus according to an embodiment of the present invention shown in FIG.
  • FIG. 3 is a plan view of a substrate heating apparatus according to an embodiment of the present invention shown in FIG.
  • FIG. 4 is a bottom view of a substrate heating apparatus according to an embodiment of the present invention shown in FIG.
  • FIG. 5 and 6 are enlarged views of a portion “C” of FIG. 1 and a portion “D” of FIG. 2, respectively, as a lower end of a peripheral support part applied to a substrate heating apparatus according to an embodiment of the present invention illustrated in FIG. 1.
  • FIG. 7 shows the fixed position of the central support and the arrangement position of the peripheral support in the state in which the hot plate HP is omitted in the substrate heating apparatus shown in FIG.
  • FIG. 8 is a side view of FIG.
  • FIG. 9 is a schematic perspective view of a substrate heating apparatus according to another embodiment of the present invention.
  • FIG. 10 is an enlarged view of a portion A in FIG. 9.
  • FIG. 11 is a partial excerpt side view illustrating a coupling state of a hot plate and a table and peripheral supports therebetween in a substrate heating apparatus according to another embodiment of the present invention.
  • FIG. 1 is a schematic perspective view of a substrate heating apparatus according to an embodiment of the present invention
  • FIG. 2 is a side view thereof
  • FIG. 3 is a plan view thereof
  • FIG. 4 is a bottom view thereof.
  • a hot plate may be disposed between the heating upper plate 10 and the lower plate 30 and the heating upper plate 10 and the lower plate 30.
  • a heater 20 fitted therein is provided.
  • the hot plate HP is fixed to the rectangular table 40 by a support structure provided at the lower center and the periphery thereof.
  • a power line 21 connected to the heater 20, a sensor line 22 for detecting a temperature, and the like are exposed on the bottom surface of the hot plate HP.
  • the lower portion of the hot plate (HP) is provided with a movable center support portion 50 for supporting or fixing the central portion of the hot plate (HP) to the table, the periphery of the center support portion 50 of the hot plate A peripheral support 60 supporting the lower edge is provided.
  • the center support part 50 fixes the center part of the hot plate HP, and in this case, the center support part 50 moves in a planar direction at a predetermined distance of the hot plate HP or according to another embodiment of the present invention. It may also allow planar flow.
  • the peripheral support part 60 supports the hot plate HP in the vertical direction with respect to the upper surface of the table 40 while allowing the hot plate HP to thermally expand in the radial direction from its center by thermal expansion.
  • the upper end of the peripheral support 60 is fixed around the bottom of the hot plate (HP), the lower end is to be able to slide or rolling on the upper surface of the table (40).
  • the hot plate HP is free of radial thermal expansion and contraction in its planar direction in a state where the center is supported or fixed, thus preventing deformation in the direction perpendicular to the plane, that is, distortion of the upper surface of the hot plate. That is, the center support part 50 firmly fixes or supports the hot plate HP to the table 40, and the peripheral support part 60 of the hot plate HP, when the hot plate HP is thermally expanded, As the other end (lower end) rolls or slides with respect to the table, ie, the upper surface of the table 40 as it expands in the planar direction of the hot plate HP, the planar free thermal expansion of the hot plate HP is allowed, This prevents plane distortion of the hot plate HP.
  • FIG. 5 and 6 are enlarged views of a portion “C” of FIG. 1 and a portion “D” of FIG. 2, showing enlarged lower ends of the peripheral support 60.
  • a round or spherical protrusion 63 is provided at the lower end of the peripheral support 60. It is a ball in contact with the upper surface of the table in sliding or rolling motion. In the case of a rolling ball, the table 40 is moved while rotating (cloudy) at the lower end of the peripheral support 60.
  • the protrusions 63 may be replaced with various parts that can rotate, such as a roller in addition to the ball.
  • the peripheral support 60 is composed of a plurality of parts, according to an embodiment of the present invention has a structure capable of adjusting the height or length.
  • the peripheral support part 60 includes a pillar member 61 made of a heat insulating material and the like, and a sleeve 62 screwed thereto.
  • the protrusion or ball 63 may be provided at a lower end of the sleeve 62. have.
  • FIG. 7 shows the fixed position of the central support 50 with respect to the table 40 and the arrangement position of the peripheral support 60 with the hot plate HP omitted
  • FIG. 8 is a side view thereof.
  • the table 40 has only a fixed portion 41 to which the central support 50 is fixed, and does not have a portion to which the peripheral support 60 is fixed. That is, the table 40 fixes the hot plate HP through the central support part 40, and the peripheral part of the hot plate HP is provided around the bottom surface of the hot plate HP. Only contact with the ball or protrusion 63 of the.
  • the central support part 50 may include an upper fixing part 52 fixed to the hot plate HP, a lower fixing part 53 fixed to the fixing part 41 of the table 40, and the upper fixing part 52.
  • a pillar portion 51 made of a heat insulating material or the like provided between the lower fixing portions 53 is provided.
  • the lower fixing part 53 secures the heat insulating pillar part 51 so that the height of the front end of the upper fixing part 52 can be adjusted.
  • FIG. 9 is a schematic perspective view of a substrate heating apparatus according to another embodiment of the present invention
  • FIG. 10 is an enlarged view of a portion A in FIG. 9.
  • the hot plate HP is fixed by the columnar center support part 50 on the rectangular table 40, and the peripheral support part 60 is provided in the periphery.
  • the lower end portion of the peripheral support 60 is formed in the table 40 as shown in the enlarged view of part A of FIG. 9 and has a narrow neck portion 43. It has a part fitted to the guide groove 42.
  • the guide groove 42 allows movement in one direction while the sliding member 64 provided at the lower end of the support part 60 is coupled.
  • the moving direction of the sliding member 64 is the stretching direction of the hot plate HP according to the thermal expansion and thus the moving direction is directed in the radial direction toward the center support 50.
  • a guide bush 65 corresponding to the narrow neck portion 43 on the guide groove 42 may be provided on the sliding member 64.
  • FIG. 11 is a fragmentary side view showing the coupling state of the hot plate HP and the table 40 and the peripheral support 60 therebetween.
  • the upper end of the peripheral support part 60 is fixed to the hot plate HP, and the lower end is fitted into the guide groove 42 of the table 40.
  • a sliding member 64 positioned in the guide groove 42 is positioned at a lower end of the peripheral support part 60, and a sliding bush 65 corresponding to the neck portion 43 of the guide groove 42 is disposed thereon. .
  • a sleeve 62 having one or two (two in this embodiment) length adjusting parts 62a, 62b is provided in the middle portion of the peripheral support part 60. These have the function of adjusting the overall length of the peripheral support (60).
  • the thermal deformation of the hot plate thermal expansion to the internal heater can occur in a direction parallel to the surface. This allows the peripheral support of the hot plate to move in the planar direction of the hot plate to allow thermal expansion in the planar direction of the hot plate and thereby prevent the plane distortion of the hot plate.
  • the present invention prevents the wafer from being placed on the hot plate by preventing the plane distortion of the hot plate.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Resistance Heating (AREA)

Abstract

Cette invention concerne un dispositif de chauffage de substrat. Ledit dispositif de chauffage de substrat comprend : une plaque chaude ; une table pour supporter la plaque chaude ; une unité de support central pour supporter la partie centrale de la plaque chaude sur la table ; et des unités de support périphérique pour supporter des parties périphériques de la plaque chaude sur la table tout en permettant la dilatation thermique de la plaque chaude dans la direction du plan.
PCT/KR2015/003131 2014-04-11 2015-03-31 Dispositif de chauffage de substrat WO2015156529A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20140043688 2014-04-11
KR10-2014-0043688 2014-04-11
KR1020150041658A KR20150118025A (ko) 2014-04-11 2015-03-25 기판 가열 장치
KR10-2015-0041658 2015-03-25

Publications (1)

Publication Number Publication Date
WO2015156529A1 true WO2015156529A1 (fr) 2015-10-15

Family

ID=54288060

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/003131 WO2015156529A1 (fr) 2014-04-11 2015-03-31 Dispositif de chauffage de substrat

Country Status (1)

Country Link
WO (1) WO2015156529A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108231520A (zh) * 2017-12-29 2018-06-29 信利（惠州）智能显示有限公司 基板干法刻蚀装置
US11521890B2 (en) * 2017-03-07 2022-12-06 Shinkawa Ltd. Apparatus for manufacturing semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010112685A (ko) * 2000-06-10 2001-12-21 신규식 인터넷을 이용한 전자상거래 시스템에서의 비용결제방법
KR20110030049A (ko) * 2009-09-17 2011-03-23 주성엔지니어링(주) 기판 지지부재와 이를 포함하는 기판 가열 장치
US20120160419A1 (en) * 2009-06-01 2012-06-28 Dong-Keun Lee Substrate-supporting unit and substrate-processing apparatus comprising same
KR20130010557A (ko) * 2011-07-19 2013-01-29 (주)이지스 반도체 제조장비용 핫플레이트
KR20130131045A (ko) * 2012-05-23 2013-12-03 주식회사 에스에프에이 평면디스플레이용 화학 기상 증착장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010112685A (ko) * 2000-06-10 2001-12-21 신규식 인터넷을 이용한 전자상거래 시스템에서의 비용결제방법
US20120160419A1 (en) * 2009-06-01 2012-06-28 Dong-Keun Lee Substrate-supporting unit and substrate-processing apparatus comprising same
KR20110030049A (ko) * 2009-09-17 2011-03-23 주성엔지니어링(주) 기판 지지부재와 이를 포함하는 기판 가열 장치
KR20130010557A (ko) * 2011-07-19 2013-01-29 (주)이지스 반도체 제조장비용 핫플레이트
KR20130131045A (ko) * 2012-05-23 2013-12-03 주식회사 에스에프에이 평면디스플레이용 화학 기상 증착장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521890B2 (en) * 2017-03-07 2022-12-06 Shinkawa Ltd. Apparatus for manufacturing semiconductor device
CN108231520A (zh) * 2017-12-29 2018-06-29 信利（惠州）智能显示有限公司 基板干法刻蚀装置
CN108231520B (zh) * 2017-12-29 2020-02-14 信利（惠州）智能显示有限公司 基板干法刻蚀装置

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