WO2015154881A2 - Composant pourvu d'une barrière de diffusion gazeuse étirable - Google Patents

Composant pourvu d'une barrière de diffusion gazeuse étirable Download PDF

Info

Publication number
WO2015154881A2
WO2015154881A2 PCT/EP2015/000753 EP2015000753W WO2015154881A2 WO 2015154881 A2 WO2015154881 A2 WO 2015154881A2 EP 2015000753 W EP2015000753 W EP 2015000753W WO 2015154881 A2 WO2015154881 A2 WO 2015154881A2
Authority
WO
WIPO (PCT)
Prior art keywords
component
gas diffusion
diffusion barrier
substrate
layer
Prior art date
Application number
PCT/EP2015/000753
Other languages
German (de)
English (en)
Other versions
WO2015154881A3 (fr
Inventor
Thomas Riedl
Patrick GÖRRN
Original Assignee
Bergische Universität Wuppertal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergische Universität Wuppertal filed Critical Bergische Universität Wuppertal
Publication of WO2015154881A2 publication Critical patent/WO2015154881A2/fr
Publication of WO2015154881A3 publication Critical patent/WO2015154881A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present invention relates to a thin-film device that is at least partially encapsulated with a gas diffusion barrier. Furthermore, the invention relates to a method for producing a stretchable gas diffusion barrier on a substrate for producing such a device and a composite system, which consists of at least one substrate and a gas diffusion barrier applied thereto.
  • Gas diffusion barriers are used to reduce the permeation rate for gases or liquids. They prevent the permeation of gases or
  • Liquids or reduce the permeation rate for gases or liquids for example, to prevent their passage from the atmosphere into a plastic film (for example, from the polymer PET) into or out of this film.
  • a plastic film for example, from the polymer PET
  • One area of application is, for example, the protection of food from oxygen or moisture entering the packaging.
  • Another, particularly technologically important application is found in the encapsulation of components,
  • the organic electronics such as OLEDs (organic light-emitting diodes), which must be protected from oxygen and moisture to a particularly high degree.
  • OLEDs organic light-emitting diodes
  • ALD atomic layer deposition
  • the materials used for the gas diffusion barriers are metal oxides or metal nitrides, i. inorganic materials with rigid covalent or
  • Non-stretchable This property will be referred to as “non-stretchable” in a simplified manner, whereas a non-destructive extensibility should be shortened by more than 5% as “ductile”. In this sense, stretchable materials with significant barrier effect are not known.
  • the materials to be encapsulated are soft compared to those for gas diffusion barriers
  • EP 2 059 847 A1 describes a
  • Permeation barrier on a flexible display device In this case, a hermetic protective layer made of aluminum oxide is applied to a polymer film, for example made of PET, coated on the side facing away from the polymer substrate with an adhesive and then adhered with this adhesive layer on the Fronsubstrat an electro-optical layer. This arrangement is not stretchable.
  • a hermetic protective layer made of aluminum oxide is applied to a polymer film, for example made of PET, coated on the side facing away from the polymer substrate with an adhesive and then adhered with this adhesive layer on the Fronsubstrat an electro-optical layer. This arrangement is not stretchable.
  • patent application describes an edge seal arranged at the edge of the optoelectronic layer below the hermetic barrier, in order to prevent permeation of hydrogen or oxygen from the side under the display even when the display is bent. A high flexibility of the display device is not achieved.
  • rigid permeation barriers should be made compatible with soft components.
  • the possibility should be created to encapsulate flexible and stretchable thin-film electronics by simply applying a stretchable barrier.
  • a thin-layer component which is encapsulated at least partially with a gas diffusion barrier is proposed, in which the
  • Gas diffusion barrier is formed by a layer applied to a stretchable substrate layer, which covers the device and in the unstretched state of the substrate has a wave or fold-like surface structure.
  • the gas diffusion barrier in the lateral direction of the substrate becomes highly expandable as well as highly bendable without having its permeation property, i. loses its low permeation rate for oxygen and moisture.
  • substrate in relation to the production of a composite system of gas permeation barrier and a support material carrying them to understand and is not to equate with a possible component substrate of the device to be encapsulated.
  • the thin-film component may consist of one or more thin layers. It should be noted that the term “thin” here means that the
  • Layer thickness or the sum of the thicknesses of the individual layers D is small compared to the lateral extent A of the component. For example, A / D> 10.
  • the layer thickness D or total layer thickness D may be small compared to the thickness of the substrate (S), e.g. S / D> 10.
  • the layer thickness is D or
  • Total layer thickness D in the range between 10nm to 10 pm.
  • Thin-film components known, for example, from "A. Eishabini, A. Elshabini-Riad, F.D. Barlow, Thin Film Technology Handbook, McGraw-Hill, 1998. "
  • the gas diffusion barrier has been applied to the substrate in a thermally or mechanically stretched state of the substrate, so that it increasingly forms the wavy or fold-like surface structure as the expansion or cooling-induced shrinkage of the substrate progresses.
  • the formation of the surface structure thus occurs by the structural connection of the gas diffusion barrier formed from a non-stretchable material and the stretchable substrate, because the gas diffusion barrier contracts due to contraction or shrinkage and thereby leads to a permanent compression of the hard coating, causing distortions in this layer, and which in turn leads to the formation of the wrinkle structure.
  • the stretching of the substrate before the application of the gas diffusion layer can take place in different ways.
  • the substrate may be mechanically stretched, ie, by applying a tensile force that attaches to at least two ideally opposing areas, thereby elongating the substrate.
  • a mechanical expansion can also take place in more than two directions, ie in three, four or more directions.
  • the substrate may then be held under this mechanical bias so applied, for example between 5% and 50%, preferably about 15%.
  • An absolute upper limit is determined by the maximum ductility (destruction threshold) of the
  • the mechanical elongation of the substrate has the advantage that it can take place with a specific, exactly predetermined pulling force, in particular in one or even more specific directions, so that the growth of the
  • Surface structure when relaxing the substrate can be specifically predetermined or at least influenced. This is particularly advantageous in order to achieve certain expansion properties of the gas diffusion barrier in certain lateral directions, for example to make the extensibility in a lateral direction stronger than in another direction.
  • the substrate is only on two opposite sides
  • the stretched state can be thermally induced by heating the substrate, thereby expanding it. This can be done, for example, at a temperature between 80 ° C and 120 ° C. Preferably, the substrate is then held at this temperature during the application of the gas diffusion barrier.
  • the thermal expansion of the substrate has the advantage that a uniform extension of the lateral extension takes place, so that the substrate contracts to the same extent on cooling to its center in all radial directions. Furthermore, there is an advantage over the mechanical strain in that the substrate cools only gradually, without special measures, so that the surface structure slowly forms or grows can. The cooling-related shrinkage of the substrate results in a brain structure-like surface structure.
  • the substrate in the unstretched state has a wave-like or pleat-like manner produced by a shaping process
  • the substrate is elastically or plastically extensible and receives in a shaping process the wrinkle or wave-like surface structure.
  • the gas diffusion barrier-forming layer is then applied to this.
  • the shaping process may, for example, in a first step, be a casting of a liquid phase substrate material in a mold having a surface structure complementary to the surface structure to be produced.
  • the substrate material may then cure or by cooling
  • a liquid starting material for example, a mixture of still uncrosslinked liquid PDMS (polydimethylsiloxane) and a cross-linker in question, which results after crosslinking the elastic PDMS substrate, which is easily removable from the mold and then further processed as an elastic substrate with a corresponding surface structure can be. Subsequently, the gas diffusion barrier forming layer is then applied to the demolded substrate.
  • PDMS polydimethylsiloxane
  • the shaping can also be produced in such a way that the substrate is first produced without a surface structure and subsequently the surface structure is produced in a molding process.
  • this can be done, for example, by means of a stamp having the corresponding counter-shape of the desired surface structuring, which is pressed onto the substrate material.
  • a plastic deformability of a substrate material which is elastic under normal circumstances may also be due to certain external conditions
  • Next alternatively or cumulatively structuring or further structuring can be done in other ways, for example by etching or plasma etching or by mechanically removing substrate material as well as by locally rupturing the substrate or its hardened surface.
  • the layer forming the gas diffusion barrier may be, as known in the art, a metallic or ceramic material, for example a
  • the gas diffusion barrier forming layer may consist of several partial layers of a combination of two or more of said materials.
  • an elastomer in particular a silicone, such as PDMS (polydimethylsiloxane) can be used in the inventive method.
  • PDMS polydimethylsiloxane
  • the substrate is a film.
  • This is particularly suitable for thin forming the composite system of substrate and gas diffusion barrier and encapsulation by lamination in a complex objects spatial To reach geometry. It should be noted that the term "film”, no conclusions on the thickness of the substrate compared to the thickness of
  • the gas diffusion barrier forming layer can be applied to the substrate by various methods. Particularly suitable as methods are thermal evaporation, sputtering, electron beam evaporation,
  • the gas diffusion barrier may preferably have a layer thickness between 10 nm and 200 nm, preferably between 100 nm and 130 nm.
  • the depth of the surface structure in the unstretched state of the gas diffusion barrier can typically be at least 0.1 ⁇ m, but preferably between 1.7 ⁇ m and 4 ⁇ m.
  • it is precisely the depth of the surface structure, i. the amplitude of the formed waves or wrinkles in the surface of the substrate is a decisive criterion. Because a wrinkle or wave-like structure can be bent or stretched, thereby becoming smoother that the amplitude or the depth of the surface structure decreases.
  • the layer forming the gas diffusion layer is electrically conductive. This is achieved, for example, by a layer which consists of tin oxide, zinc oxide and / or indium oxide or contains at least one of the stated materials. Electrically conductive gas diffusion layers can for example act as an electrode and thus offer a variety of technical
  • the layer forming the gas diffusion layer is transparent in a specific spectral range of the electromagnetic spectrum.
  • the layer forming the gas diffusion layer is transparent in a specific spectral range of the electromagnetic spectrum.
  • this high transparency is given in the visible spectral range.
  • light can pass through the encapsulation in the Component (for example, in a solar cell) or out of the device out (for example, in a light emitting diode or a laser).
  • the gas diffusion barrier lies between the substrate and the
  • the substrate is located on the backside of the component. As a result, the substrate is optionally recorded
  • gas diffusion barrier or its substrate is connected only to the edge of the component with a component substrate carrying the component. As a result, a high degree of freedom of movement
  • Gas diffusion barrier ensured, in particular relative movements between the device surface and the gas diffusion barrier are possible.
  • the gas diffusion barrier is arranged so that it faces the component, so that there is a free space between them.
  • This has the advantage that for joining a method or material can be used, against which the device itself, in particular its surface is sensitive. For example, the surface of the device free of a
  • the gas diffusion barrier can be connected to the entire surface of the component. As a result, a better thermal coupling of the device is made possible to the outside, so that heat generated by the device can be better outwardly rented.
  • the gas diffusion barrier is bonded or laminated to the device and / or the device substrate.
  • the device is deposited or deposited on the gas diffusion barrier.
  • the composite system is used as a device substrate.
  • the deposition is advantageously carried out in the thermally or mechanically stretched state of the substrate, so that the Component with progressive relaxation or cooling-related shrinkage of the substrate increasingly wavy or pleated
  • the component thus receives a high elastic extensibility.
  • a further layer forming a gas diffusion barrier is applied to the rear side of the component facing away from the gas diffusion barrier. In this way, the device is completely encapsulated by the gas diffusion barrier.
  • a composite system which consists of at least one substrate and a gas diffusion barrier applied thereto, wherein the substrate is stretchable and in the unstretched state has a wave-like or fold-like surface structure onto which a layer forming the gas diffusion barrier is applied.
  • the substrate can be stretched elastically in the composite system
  • This composite system according to the invention can be produced according to the first variant of the method according to the invention.
  • a composite system which consists of at least a substrate and a gas diffusion barrier applied thereto, wherein the substrate is elastically or plastically extensible, in particular an elastically or plastically stretchable film, and in the unstretched state has a wrinkle-like or wavy surface structuring on the a gas diffusion layer forming layer is applied.
  • a composite system can be produced according to the second variant of the method according to the invention.
  • a plastically deformable substrate material can be used, ie a material that, although deformable, So is stretchable and compressible, but maintains a deformed state.
  • all elastoplastic deformable substrate materials are used which react partially plastic and partially elastic to deformation.
  • the component can be an electronic, opto-electronic or optical
  • Solar cells are encapsulated with one of the composite systems according to the invention.
  • the application of the composite system on the object or on a housing of the object can be done in various ways. It can for example be glued or laminated (FIGS. 10 and 11).
  • encapsulating a thin film device on a device substrate with the interconnect system such that the gas diffusion barrier is directly on the device e.g. encapsulating a thin film device on a device substrate with the interconnect system such that the gas diffusion barrier is directly on the device.
  • a stack is produced: component substrate / component / gas diffusion barrier / substrate (encapsulation substrate), as shown in FIGS. 10 and 11, on the left.
  • Gas diffusion barrier form a thin-layer encapsulation, wherein the
  • Gas diffusion barrier in Figure 10 was first applied to the substrate but is reversed on the device respectively edge on the
  • Component substrate is glued.
  • Composite system deposited This deposition can be done on the relaxed, so wavy composite system but also in the stressed on the surface smooth state. As shown in Fig. 13, the corresponding arrangement on the surface can be fully encapsulated by another thin film permeation barrier.
  • the corresponding thin film device e.g. an organic one
  • Light-emitting diode or solar cell is then completely protected against atmospheric influences and at the same time elastic and flexible.
  • FIG. 2 is a plan view of the herringbone structure according to FIG. 1
  • FIG. 3 Top view of a gas diffusion barrier with a brain structure
  • FIG. 5 Profile section through a gas diffusion barrier with wave structure at a temperature of 100 ° C. (elongation test)
  • FIG. 6 Bending test of a gas diffusion barrier in the relaxed state
  • FIG. 7 Bending test for mechanical strain
  • FIG. 8 Production of the composite system according to the first variant of FIG.
  • Figure 12 stretchable composite system according to the invention as a substrate for
  • FIG. 13 full encapsulation of a thin-film component
  • FIG. 1 shows a perspective view of a part of the surface of a composite system 1 produced according to the invention from a stretchable substrate and a gas diffusion barrier applied thereto, which are not shown separately here.
  • the surface structure of the gas diffusion barrier resembles a herringbone structure at least in areas of the surface. This has parallel waves with wave crests and corresponding troughs, wherein the extension of the waves in the longitudinal direction is not rectilinear but corresponds to a zig-zag pattern.
  • Figure 2 shows a plan view of the gas diffusion barrier with herringbone structure according to Figure 1. From her it is clear that the surface in the manner of a
  • Fold mountains each in a partial region of the surface parallel Has waves whose longitudinal extent is substantially rectilinear, wherein in the transition region from a portion of the surface to the adjacent
  • Part of the longitudinal extent of the waves has a kink.
  • the gas diffusion barrier formed with the fold structure described can be stretched in the plane in two spatial directions simultaneously, wherein the
  • An elongation can be, for example, the result of a bend along an arbitrary intersection straight line through the surface structure, in which case only an expansion stress of the gas diffusion barrier takes place along this straight line and the amplitude of the surface structure is reduced there.
  • a gas diffusion barrier having a surface structure according to FIGS. 1 and 2 can be produced, for example, by using an elastomer, such as an elastomer
  • PDMS polydimethylsiloxane
  • FIG. 8 shows in step A1 the provision of the elastic substrate 3 (in cross-section) for the production of the composite system 1.
  • Step B1 shows the substrate 3 as a stretched substrate 3a. The stretching is done by pulling it in the width.
  • an aluminum oxide layer is then applied to the elastomer 3, for example, as a gas diffusion barrier 2, see step C1 in FIG. 8.
  • gases in particular oxygen and moisture having.
  • other metal oxides for example, other metal oxides,
  • Metal nitrides, Metalloxynitride, metal carbides or metal sulfides or an organic material find use. Also, several layers of said materials can be applied to each other on the stretched elastomer.
  • the application is preferably carried out by atomic layer deposition, so that the gas diffusion barrier 2 (for example, made of aluminum oxide) monolayer for monolayer is deposited on the stretched elastomer 3a.
  • the gas diffusion barrier 2 forms here a thin film permeation barrier. If the mechanical expansion of the elastomer 3a is now reduced, in particular canceled, a contraction of the elastomer 3a accordingly arises. It contracts opposite to the stretching directions. The substrate 3a is thereby relaxed with respect to the original extent. The after the gas diffusion barrier 2 (for example, made of aluminum oxide) monolayer for monolayer is deposited on the stretched elastomer 3a.
  • the gas diffusion barrier 2 forms here a thin film permeation barrier. If the mechanical expansion of the elastomer 3a is now reduced,
  • FIG. 3 shows an alternative composite system with a substrate and a gas diffusion barrier applied thereto, having a surface structure which is attached to the substrate
  • the geometry of a brain is reminiscent, and thus can also be called a brain structure.
  • the surface of the gas diffusion barrier in the variant in FIG. 3 is clearly more disordered and resembles a labyrinth.
  • Gas diffusion barrier for example, be made by a
  • Elastomer e.g. Polydimethylsiloxane (PDMS) is heated to a temperature of, for example, 100 ° C, whereby it expands (step Bi in Figure 8).
  • PDMS Polydimethylsiloxane
  • step Bi the thermally stretched state 3a, for example, aluminum oxide 2 is then applied to the substrate 3. This can be done by means of
  • coated layer consists only of a single material, such as said alumina, or of several layers of different materials, in particular the aforementioned materials is formed.
  • the substrate 3a shrinks, whereby it is uniform in the radial direction towards the center
  • a gas diffusion barrier 2 thus prepared is elastically extensible without losing its barrier property, i. to lose their low permeation rates for oxygen and hydrogen.
  • FIG. 5 shows the same surface structure at a temperature of 100 ° C.
  • Temperature-induced expansion of the composite system 1 is a reduction in the amplitude at its surface, whereas the period remains largely the same.
  • the depth of the profile in unstretched case at room temperature is about 1, 9pm, whereas it is at the temperature of 100 ° C at 1, 4 pm.
  • FIGS. 4 and 5 illustrate a thermal expansion
  • FIGS. 6 and 7 a mechanical strain is shown which in the case of a bending test of the
  • Gas diffusion barrier 2 according to the invention arises.
  • FIG. 6 shows a profile section through the gas diffusion barrier 2 in the relaxed state, wherein the layer forming the gas diffusion barrier 2 was deposited during a pretensioning of 8% applied to the substrate 3.
  • FIG. 7 shows a profile section through the gas diffusion barrier 2 in the mechanically stretched state, with an elongation of 8%. It can also be seen here that the depth of the surface structure is about 2 ⁇ in the case of
  • Gas diffusion barrier 2 especially for the encapsulation of flexible electronic, opto-electronic or optical components.
  • FIG. 9 shows a further variant for producing a novel product
  • step A2 in Figure 9 The substrate material 3 'then hardens, see step B2 in Figure 9, and can then be removed from the mold.
  • the withdrawn and inverted substrate 3 in the relaxed state is shown in step C2 in FIG.
  • the gas diffusion barrier 3 in particular as
  • step D2 leaving the finished product
  • FIG. 10 shows a thin-layer component 4 on a component substrate 6, which is provided with a composite system 1 according to the invention comprising substrate 3 and
  • Gas diffusion barrier 2 is encapsulated.
  • the encapsulation is carried out by edge-side bonding of the composite system 1 by means of adhesive 5, which is present here only at the edge, i. between the composite system 1 and the side of the device 4 projecting component substrate 6 is located.
  • adhesive 5 is present here only at the edge, i. between the composite system 1 and the side of the device 4 projecting component substrate 6 is located.
  • the composite system 1 is the
  • Gas diffusion barrier 2 directed to the device 4.
  • FIG. 11 shows a thin-layer component 4 on a component substrate 6, which is provided with a composite system 1 according to the invention comprising substrate 3 and Gas diffusion barrier 2 is encapsulated according to a second variant.
  • the gas diffusion barrier 2 is also directed to the device 4. The encapsulation is carried out by gluing the entire surface of the
  • Composite system 1 by means of adhesive 5a. This is soft here to achieve elastic deformability. This means that there is no free space between the gas diffusion barrier 2 and the component 4. The space between the gas diffusion barrier 2 and the device 4 is completely filled by the soft adhesive 5a.
  • FIG. 12 shows a further variant for the encapsulation of a
  • the composite system 1 serves simultaneously as a device substrate 6, wherein the
  • Component 4 is applied directly to the gas diffusion barrier 2.
  • the component 4 is or the layers forming the component 4 are applied or deposited in the stretched state of the composite system 1. As a result, the component 4 encapsulated in this way is likewise stretchable.
  • FIG. 13 shows an alternative variant to FIG. 12, in which full encapsulation of the component 4 takes place.
  • the composite system 1 also serves simultaneously as a component substrate 6, wherein the component 4 is applied to the gas diffusion barrier 2a.
  • the component 4 is or the layers forming the component 4 are applied in the stretched state of the composite system 1.
  • Another layer 2b forming a gas diffusion barrier is the upper side of the
  • Component 4 is present, so that the component 4 is completely embedded in the gas diffusion barrier 2a, 2b.
  • the gas diffusion barrier layer 2b is applied in the stretched state of the composite system 1. As a result, the thus encapsulated component is also stretchable.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un composant (4) à couche mince au moins partiellement recouvert d'une barrière de diffusion gazeuse (2), ladite barrière de diffusion gazeuse (2) étant formée par une couche appliquée sur un substrat (3) étirable, qui couvre le composant (4) et qui présente à l'état non étiré du substrat (3) une structure de surface ondulée ou plissée.
PCT/EP2015/000753 2014-04-09 2015-04-09 Composant pourvu d'une barrière de diffusion gazeuse étirable WO2015154881A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014005228.1 2014-04-09
DE102014005228.1A DE102014005228A1 (de) 2014-04-09 2014-04-09 Dehnbare Gasdiffusionsbarriere

Publications (2)

Publication Number Publication Date
WO2015154881A2 true WO2015154881A2 (fr) 2015-10-15
WO2015154881A3 WO2015154881A3 (fr) 2015-12-10

Family

ID=53365955

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/000753 WO2015154881A2 (fr) 2014-04-09 2015-04-09 Composant pourvu d'une barrière de diffusion gazeuse étirable

Country Status (2)

Country Link
DE (1) DE102014005228A1 (fr)
WO (1) WO2015154881A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016099695A1 (fr) * 2014-12-19 2016-06-23 Exxonmobil Chemical Patents Inc. Ensembles films barrières expansibles
CN113838372A (zh) * 2021-08-11 2021-12-24 闽都创新实验室 双层包覆的褶皱式可拉伸显示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016122685A1 (de) * 2016-11-24 2018-05-24 Osram Oled Gmbh Organisches Bauelement und Verfahren zur Herstellung eines organischen Bauelements
US11127778B2 (en) 2017-02-24 2021-09-21 Flexucell Aps Light emitting transducer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2059847A2 (fr) 2006-08-24 2009-05-20 Polymer Vision Limited Barrière d'étanchéité sur un dispositif flexible

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3663288A (en) * 1969-09-04 1972-05-16 American Cyanamid Co Physiologically acceptible elastomeric article
CH641063A5 (de) * 1979-12-06 1984-02-15 Balzers Hochvakuum Verfahren zum ueberziehen eines oberflaechenteiles eines elastischen koerpers mit einer zusammenhaengenden schicht.
JP5290268B2 (ja) * 2009-12-31 2013-09-18 三星ディスプレイ株式會社 バリア・フィルム複合体、これを含む表示装置、バリア・フィルム複合体の製造方法、及びこれを含む表示装置の製造方法
EP2503621A1 (fr) * 2011-03-24 2012-09-26 Moser Baer India Ltd. Couche de barrière et procédé de fabrication de la couche de barrière
DE102011101585B4 (de) * 2011-05-12 2015-11-12 Technische Universität Dresden Verfahren zur Herstellung von Leuchtdioden oder photovoltaischen Elementen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2059847A2 (fr) 2006-08-24 2009-05-20 Polymer Vision Limited Barrière d'étanchéité sur un dispositif flexible

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
A. ELSHABINI; A. EISHABINI-RIAD; F. D. BARLOW: "Thin Film Technology Handbook", 1998, MCGRAW-HILL
T. RIEDL; P. GÖRRN ET AL.: "Al 0 /Zr0 Nanolaminates as Ultra High Gas Diffusion Barriers - A Strategy for Reliable Encapsulation of Organic Electronics", ADV. MATER., vol. 21, 2009, pages 1845 - 1849

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016099695A1 (fr) * 2014-12-19 2016-06-23 Exxonmobil Chemical Patents Inc. Ensembles films barrières expansibles
US10894443B2 (en) 2014-12-19 2021-01-19 Exxonmobil Chemical Patents Inc. Expansible barrier film assemblies
CN113838372A (zh) * 2021-08-11 2021-12-24 闽都创新实验室 双层包覆的褶皱式可拉伸显示装置
CN113838372B (zh) * 2021-08-11 2023-02-07 闽都创新实验室 双层包覆的褶皱式可拉伸显示装置

Also Published As

Publication number Publication date
WO2015154881A3 (fr) 2015-12-10
DE102014005228A1 (de) 2015-12-17

Similar Documents

Publication Publication Date Title
EP2412040B1 (fr) Encapsulation en couches minces pour un composant optoélectronique, son procédé de fabrication et composant optoélectronique
DE69937407T2 (de) Verkapselung einer vorrichtung
EP1050078B1 (fr) Microsysteme et procede de production d'un microsysteme
EP3210247B1 (fr) Bande composite à feuille de verre mince pourvue de bandes de renforcement
DE102013106353B4 (de) Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
EP2382656B1 (fr) Procédé de séparation pour système stratifié comprenant une tranche
EP1350078B1 (fr) Detecteur de flux micromecanique a revetement extensible
WO2015154881A2 (fr) Composant pourvu d'une barrière de diffusion gazeuse étirable
DE102012112058B4 (de) MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen
EP3970210A1 (fr) Procédé de fabrication d'une unité d'affichage comprenant un substrat porteur, substrat porteur fabriqué d'après ce procédé ainsi que verre de couverture destiné à une unité d'affichage flexible
WO1997026782A2 (fr) Boitier a effet de blindage electrique
EP1421633B1 (fr) Ensemble transistor et son procede de production
DE102011081033A1 (de) Verfahren zur Herstellung einer mikromechanischen Struktur und mikromechanische Struktur
DE102005056879A1 (de) Verfahren zur Erzeugung einer Mehrzahl regelmäßig angeordneter Nanoverbindungen auf einem Substrat
DE102014222818B4 (de) Elektronik-Sandwichstruktur mit zwei mittels einer Sinterschicht zusammengesinterten Fügepartnern
WO2016045668A1 (fr) Procédé pour appliquer une couche protectrice, couche protectrice et semi-produit pourvu d'une couche protectrice
DE102014112672B4 (de) Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement
DE102016119906A1 (de) Verfahren zum Herstellen einer optoelektronischen Vorrichtung und eine durch das Verfahren hergestellte optoelektronische Vorrichtung
DE102008037947A1 (de) Element-Wafer und Verfahren zu dessen Herstellung
DE102008048051A1 (de) Bauelement sowie Verfahren zum Kontaktieren eines Bauelements
DE102015011066A1 (de) Substrat,insbesondere für den Aufbau einer dehnbaren Elektronik und Verfahren zu dessen Herstellung
WO2017068041A1 (fr) Composant optoélectronique organique et procédé de fabrication d'un composant optoélectronique organique
DE112018006230T5 (de) Fahrzeuginterne anzeigevorrichtung, die ein lichtemittierendes halbleiterelement verwendet
DE202018104993U1 (de) Dachleitungshalter für den äußeren Blitzschutz
DE112017000857T5 (de) Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15727547

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 15727547

Country of ref document: EP

Kind code of ref document: A2