WO2015147563A1 - Material enabling formation of selective conductive pattern - Google Patents

Material enabling formation of selective conductive pattern Download PDF

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Publication number
WO2015147563A1
WO2015147563A1 PCT/KR2015/002954 KR2015002954W WO2015147563A1 WO 2015147563 A1 WO2015147563 A1 WO 2015147563A1 KR 2015002954 W KR2015002954 W KR 2015002954W WO 2015147563 A1 WO2015147563 A1 WO 2015147563A1
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Prior art keywords
conductor pattern
flexible material
coating
forming
laser
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PCT/KR2015/002954
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French (fr)
Korean (ko)
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유명재
이철승
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전자부품연구원
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Publication of WO2015147563A1 publication Critical patent/WO2015147563A1/en

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    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M10/00—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements
    • D06M10/005—Laser beam treatment
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
    • D06M23/16—Processes for the non-uniform application of treating agents, e.g. one-sided treatment; Differential treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the present invention relates to a flexible material and a manufacturing process for implementing the conductor pattern.
  • the conventional method of forming a conductor pattern on a flexible material is a method of weaving a fiber material and a general fiber material coated with a metal such as nickel (Ni) or chromium (Cr) together in advance.
  • a method of directly coating general fiber materials by metal plating and weaving metal coated fiber materials is used.
  • a method of manufacturing a carbon-based material in the form of fibers, weaving it, and using it as a flexible material is used.
  • the method of coating the metal layer on the flexible material separately or incorporating the metal material into the elements constituting the flexible material does not facilitate formation of the selective conductor pattern and separate masking to form the selective conductor pattern. ), There is a problem that must go through at least three steps of etching, patterning (patterning).
  • the present invention to solve the above problems, by coating a flexible material that is activated during laser irradiation to form a metal layer in the plating process to a flexible (flexible) material and a method for producing a flexible material and easy to form a conductor pattern It aims to provide.
  • Material capable of forming a selective conductor pattern according to one aspect of the present invention for achieving the above object is a coating material which is coated on the flexible material consisting of a fiber material and the flexible material is activated by a laser to form a metal layer in the plating process It includes.
  • the coating material is a material that facilitates the formation of a conductor pattern on the flexible material
  • Zn acetate solution may be used
  • a liquid solution of CuCr 2 O 4 may be used.
  • the coating material may be an oxide of a metal element selected from Co, Ni, and Ag, or a liquid solution of the oxide may be used.
  • the coating material may be any one of silicate, borate and oxalate of a metal element selected from Co, Ni, Cu, and Ag.
  • the coating material may be a composite oxide of the ABO 2 form, where A is any one metal element selected from Co, Ni and Cu, B is any one selected from Ni, Mn, Cr, Al and Fe A metal element, and A and B may be different from each other.
  • the coating material may be copper chloride, a liquid solution of any one of Cu 2 (OH) PO 4 , copper phosphate, copper sulfate and cupric thiocyanate or a liquid solution of Cu 3 N may be used.
  • the present invention provides a flexible material that is easy to form a conductor pattern by utilizing electromagnetic waves, such as a laser, the flexible material forms a metal layer only a portion patterned through a plating process. In addition, it reduces the process cost by reducing the process for forming a conductor pattern on the flexible material.
  • FIG. 1 is a flow chart illustrating a process of a method for manufacturing a flexible material is easy to form a conductor pattern according to an embodiment of the present invention.
  • FIG. 2 is a flowchart illustrating a process of forming a conductor pattern on a flexible material according to an embodiment of the present invention.
  • the present invention includes a flexible material composed of a fiber material and a coating material coated on the flexible material, and specifically, a flexible material composed of a fiber material such as glass fiber, carbon fiber, aramid fiber, and having a flexible characteristic, and It is a material made of a coating material coated on a flexible material and activated by a laser to form a metal layer in a plating process.
  • the fiber material can be used by being treated with a surface treatment agent such as a focusing agent, a coupling agent, and a smoothing agent in advance in order to be composed of a flexible material, and by using a surface-treated fiber material, the damage of the fiber material itself is minimized.
  • a surface treatment agent such as a focusing agent, a coupling agent, and a smoothing agent in advance in order to be composed of a flexible material
  • the damage of the fiber material itself is minimized.
  • the adhesiveness, mechanical properties and chemical properties are improved.
  • the coating material may be a Zn acetate (acetate) solution, it may be a liquid solution of CuCr 2 O 4.
  • it may be any one of oxides of metal elements selected from Co, Ni, Ag, or a liquid solution of the oxides.
  • it may be any one of silicate, borate and oxalate of a metal element selected from Co, Ni, Cu, Ag.
  • ABO2 complex oxide wherein A is any one metal element selected from Co, Ni and Cu, B is any one metal element selected from Ni, Mn, Cr, Al and Fe, wherein A and B are It may be different.
  • it may be copper chloride, and may be a liquid solution of any one of Cu 2 (OH) PO 4, copper phosphate, copper sulfate, and cuprous thiocyanate.
  • a liquid solution of Cu 3 N may be used.
  • it is not limited to the above-described coating material.
  • the coating material When the coating material is coated on a flexible material and patterned by irradiating a laser on the coated surface, the patterned portion is activated by a laser to form a seed that forms a metal layer during the plating process.
  • the pattern is formed on the flexible material by laser activation, adhesion between the formed pattern and the metal to be plated is facilitated, and thus a conductor pattern can be formed on the flexible material in a patterned form by laser, and the concentration of the coating material is appropriately controlled. It is possible to increase the seed formation rate for plating or to prevent the spreading of the laser pattern or the peeling of the conductor pattern.
  • the present invention can solve this problem.
  • the conductor pattern can be formed on the flexible material by a simple process compared to the conventional method of forming a conductor pattern.
  • a pattern mold or a mask can be manufactured to form a conductor pattern on the flexible material without forming a conductor pattern on the flexible material.
  • the material that is easy to form a conductor pattern according to an embodiment of the present invention is coated on a flexible material and the flexible material It is manufactured by a process of coating with a coating material that is activated by a laser to form a metal layer in the plating process.
  • the method of coating the coating material on the flexible material below is an embodiment of coating the coating material by the liquid phase method, and the technical spirit of the present invention is not limited to the following examples.
  • a method of manufacturing a material easily forming a conductor pattern includes first washing a surface of a flexible material composed of a fiber material (S110), dip coating, and spraying the prepared flexible material.
  • the coating material is activated by a laser by a method such as spray coating and blade coating to form a metal layer in a plating process (S120).
  • the flexible material made of a fiber material refers to a flexible material that can be bent, for example, a flexible material having non-conductive properties such as a cloth woven from glass fiber.
  • the coating material is a material that facilitates the formation of a conductor pattern on the flexible material
  • Zn acetate solution (2) Liquid solution of CuCr2O4 (3)
  • the method of coating the coating material to facilitate the formation of the conductor pattern on the flexible material may be a method of coating the Zn acetate solution in a liquid phase on a flexible cloth made of glass fiber.
  • the coated flexible material After coating a coating material for easily forming a conductor pattern on the prepared flexible material, the coated flexible material is dried by heating at a predetermined temperature or higher, for example, 90 or more to volatilize the remaining solution coated on the flexible material. (S130).
  • the drying temperature is determined according to the characteristics of the solution coated on the flexible material, and is heated for a predetermined time above the temperature at which the solution is volatilized to volatilize the remaining solution on the flexible material.
  • the dried flexible material is heat-treated in a predetermined temperature range, for example, 150 to 400 (S140).
  • the heat treatment temperature, the heat treatment holding time, the speed of cooling the temperature, etc. may vary depending on the flexible material or may be set differently depending on the desired characteristics.
  • the heat treatment method may be performed by using a rapid thermal processing oven (RT) or a heat treatment furnace.
  • RT rapid thermal processing oven
  • heat treatment furnace a heat treatment furnace
  • FIG. 2 is a flowchart illustrating a process of forming a conductor pattern on a material according to an embodiment of the present invention.
  • the method of forming a conductor pattern on a flexible material firstly activates only a portion patterned by a laser on a flexible material composed of a fiber material in the above-described manner. Coating with a coating material to form a metal layer (S210). Patterning by irradiating a laser in the form of a pattern to be formed on the surface of the coated flexible material (S220).
  • the patterned portion absorbs the laser and serves as a seed for forming a metal layer.
  • the metal pattern may be formed on the flexible material in a patterned form while passing.
  • the laser moves along a predetermined pattern path on the surface of the formed solution coating layer, and may repeatedly move a predetermined section or move along a predetermined path according to the shape and thickness of the pattern.
  • the wavelength of the laser may be 308 nm, 325 nm, 532 nm, and 1064 nm.
  • the laser's power and processing speed can be varied to maximize performance. For example, if a laser with a wavelength of 1064 nm is used, the power can be irradiated with 2 to 6 watts and a frequency of 40 Hz.
  • the flexible material prepared by patterning with a laser is plated by an electroless plating method (S230). After the electroless plating process, the metal layer is plated on the flexible material to form a metal pattern.
  • the metal layer may be formed on the flexible material through the above process
  • the electroplating process may be optionally performed after the electroless plating process to form a more uniform and dense conductor pattern (S240).
  • the material according to the embodiment of the present invention is simple and flexible compared to the conventional conductor pattern forming method by coating a coating material which is activated by a laser to form a metal layer in a plating process by a flexible material composed of a fiber material. Allow conductor patterns to be formed on the material.

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

The present invention provides a material enabling formation of a selective conductive pattern. The material enabling formation of a selective conductive pattern, according to the present invention, comprises: a flexible material formed of a fiber material; and a coating material which is coated on the flexible material and is activated by laser to thus form a metal layer in a plating process, and provides effects of a shortened process and reduced processing costs compared to a conventional conductive pattern formation method by enabling a conductive pattern to be easily formed using laser.

Description

선택적인 전도체 패턴 형성이 가능한 소재 Material capable of forming optional conductor patterns
본 발명은 전도체 패턴을 구현하기 위한 플랙시블 소재 및 그 제조 공정에 관한 것이다.The present invention relates to a flexible material and a manufacturing process for implementing the conductor pattern.
종래의 플렉시블(flexible)한 소재에 전도체 패턴을 형성하는 방법은, 니켈(Ni) 또는 크롬(Cr)과 같은 금속이 사전에 코팅된 화이버(fiber) 소재와 일반 화이버 소재를 함께 직조하는 방법을 이용하거나, 일반 화이버 소재들을 직접 도금공정으로 금속 코팅하고 금속 코팅된 화이버 소재들을 직조하는 방법을 이용한다. 또는, 카본(carbon)계 소재를 화이버 형태로 제조하고 이것을 직조하여 플렉시블한 형태의 소재로 활용하는 방법을 이용한다.The conventional method of forming a conductor pattern on a flexible material is a method of weaving a fiber material and a general fiber material coated with a metal such as nickel (Ni) or chromium (Cr) together in advance. Alternatively, a method of directly coating general fiber materials by metal plating and weaving metal coated fiber materials is used. Alternatively, a method of manufacturing a carbon-based material in the form of fibers, weaving it, and using it as a flexible material is used.
그러나, 이와 같이 플렉시블 소재에 금속층을 별도로 코팅하거나 플렉시블 소재를 구성하는 요소에 금속 소재를 복합화하는 방법들은 선택적인 전도체 패턴의 형성이 용이하지 못하며, 선택적인 전도체 패턴을 형성하기 위해서는 별도의 마스킹(masking), 에칭(etching), 패터닝(patterning)의 최소 3단계 이상의 공정과정을 거쳐야 하는 문제점이 있다.However, the method of coating the metal layer on the flexible material separately or incorporating the metal material into the elements constituting the flexible material does not facilitate formation of the selective conductor pattern and separate masking to form the selective conductor pattern. ), There is a problem that must go through at least three steps of etching, patterning (patterning).
본 발명은 전술한 문제점을 해결하기 위하여, 레이저 조사시 활성화되어 도금공정에서 금속층을 형성하는 소재를 플렉시블(flexible) 소재에 코팅함으로써 전도체 패턴의 형성이 용이한 플렉시블 소재 및 그 소재를 제조하는 방법을 제공하는 것을 목적으로 한다.The present invention to solve the above problems, by coating a flexible material that is activated during laser irradiation to form a metal layer in the plating process to a flexible (flexible) material and a method for producing a flexible material and easy to form a conductor pattern It aims to provide.
상술한 목적을 달성하기 위한 본 발명의 일면에 따른 선택적인 전도체 패턴 형성이 가능한 소재는 화이버 소재로 구성되는 플렉시블 소재 및 상기 플렉시블 소재에 코팅되며 레이저에 의해 활성화되어 도금공정에서 금속층을 형성하는 코팅소재를 포함한다.Material capable of forming a selective conductor pattern according to one aspect of the present invention for achieving the above object is a coating material which is coated on the flexible material consisting of a fiber material and the flexible material is activated by a laser to form a metal layer in the plating process It includes.
상기 코팅소재는 플렉시블 소재에 전도체 패턴의 형성을 용이하게 하는 소재로서, Zn 아세테이트 용액이 사용될 수 있으며, CuCr2O4의 액상 용액일 사용될 수도 있다.The coating material is a material that facilitates the formation of a conductor pattern on the flexible material, Zn acetate solution may be used, a liquid solution of CuCr 2 O 4 may be used.
또는, 상기 코팅소재는 Co, Ni, Ag 중 선택된 금속 원소의 산화물이거나 그 산화물의 액상 용액이 사용될 수도 있다.Alternatively, the coating material may be an oxide of a metal element selected from Co, Ni, and Ag, or a liquid solution of the oxide may be used.
또는, 상기 코팅소재는 Co, Ni, Cu, Ag 중 선택된 금속 원소의 규산염, 붕산염 및 옥살산염 중 어느 하나가 사용될 수도 있다.Alternatively, the coating material may be any one of silicate, borate and oxalate of a metal element selected from Co, Ni, Cu, and Ag.
또는, 상기 코팅소재는 ABO2형태의 복합체 산화물이 사용될 수 있으며, 이때 A는 Co, Ni 및 Cu 중 선택된 어느 하나의 금속 원소이고, B는 Ni, Mn, Cr, Al 및 Fe 중 선택된 어느 하나의 금속 원소이며, 상기 A 및 B는 서로 다른 것일 수 있다.Alternatively, the coating material may be a composite oxide of the ABO 2 form, where A is any one metal element selected from Co, Ni and Cu, B is any one selected from Ni, Mn, Cr, Al and Fe A metal element, and A and B may be different from each other.
또는, 상기 코팅소재는 염화구리가 사용될 수 있으며, Cu2(OH)PO4, 인산구리, 황산구리 및 티오시안제1구리 중 어느 하나의 액상 용액 또는 Cu3N의 액상 용액이 사용될 수도 있다.Alternatively, the coating material may be copper chloride, a liquid solution of any one of Cu 2 (OH) PO 4 , copper phosphate, copper sulfate and cupric thiocyanate or a liquid solution of Cu 3 N may be used.
본 발명에 따르면, 레이저와 같은 전자기파를 활용하여 전도체 패턴의 형성이 용이한 플렉시블 소재를 제공하며, 상기 플렉시블 소재는 도금공정을 통해 패터닝된 부분만 금속층을 형성한다. 그리고 플렉시블 소재에 전도체 패턴을 형성하기 위한 과정을 축소시킴으로써 공정비용을 절감시키는 효과를 제공한다.According to the present invention, it provides a flexible material that is easy to form a conductor pattern by utilizing electromagnetic waves, such as a laser, the flexible material forms a metal layer only a portion patterned through a plating process. In addition, it reduces the process cost by reducing the process for forming a conductor pattern on the flexible material.
도 1은 본 발명의 일실시예에 따른 전도체 패턴의 형성이 용이한 플렉시블 소재를 제조하는 방법의 과정을 나타낸 흐름도이다.1 is a flow chart illustrating a process of a method for manufacturing a flexible material is easy to form a conductor pattern according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 플렉시블 소재에 전도체 패턴을 형성하는 방법의 과정을 나타낸 흐름도이다.2 is a flowchart illustrating a process of forming a conductor pattern on a flexible material according to an embodiment of the present invention.
본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있으며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하며, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것일 뿐이므로 본 발명의 권리범위는 청구항의 기재에 의해 정하여진다.Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various different forms, and the present embodiments only make the disclosure of the present invention complete, and those of ordinary skill in the art to which the present invention belongs. The scope of the present invention is defined by the description of the claims as it is provided only to fully inform the person having the scope of the invention.
한편, 본 명세서에서 사용된 용어는 실시예들을 설명하기 위한 것이며 본 발명을 제한하고자 하는 것은 아니다. 본 명세서에서 단수형은 문구에서 특별히 언급하지 않는 한 복수형도 포함한다. 명세서에서 사용되는 "포함한다(comprises)" 및/또는 "포함하는(comprising)"은 언급된 구성요소, 단계, 동작 및/또는 소자에 하나 이상의 다른 구성요소, 단계, 동작 및/또는 소자의 존재 또는 추가함을 배제하지 않는다. 이하, 본 발명의 따른 실시예를 첨부된 도면을 참조하여 상세하게 설명하도록 한다.Meanwhile, the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular forms also include the plural unless specifically stated otherwise in the phrases. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements in the mentioned components, steps, operations and / or elements. Or does not exclude the addition. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
본 발명은 화이버 소재로 구성되는 플렉시블 소재와 상기 플렉시블 소재에 코팅되는 코팅소재를 포함하며, 구체적으로는, 유리 섬유, 탄소 섬유, 아라미드 섬유와 같은 섬유 소재로 구성되며 유연한 특징을 갖는 플렉시블 소재와 상기 플렉시블 소재에 코팅되며 레이저에 의해 활성화되어 도금공정에서 금속층을 형성하는 코팅소재로 이루어진 소재이다.The present invention includes a flexible material composed of a fiber material and a coating material coated on the flexible material, and specifically, a flexible material composed of a fiber material such as glass fiber, carbon fiber, aramid fiber, and having a flexible characteristic, and It is a material made of a coating material coated on a flexible material and activated by a laser to form a metal layer in a plating process.
여기서, 화이버 소재는 플렉시블 소재로 구성되기 위하여 공정과정에서 사전에 집속제, 커플링제, 평활제와 같은 표면처리제로 처리되어 사용가능하며, 표면 처리된 화이버 소재를 사용하면 화이버 소재 자체의 손상을 최소화하는 이점 외에도 밀착성, 기계적 특성, 화학적 특성이 향상되는 이점을 제공한다. Here, the fiber material can be used by being treated with a surface treatment agent such as a focusing agent, a coupling agent, and a smoothing agent in advance in order to be composed of a flexible material, and by using a surface-treated fiber material, the damage of the fiber material itself is minimized. In addition to the advantages, the adhesiveness, mechanical properties and chemical properties are improved.
코팅소재는 Zn 아세테이트(acetate) 용액일 수 있으며, CuCr2O4의 액상 용액일 수 있다.The coating material may be a Zn acetate (acetate) solution, it may be a liquid solution of CuCr 2 O 4.
또는, Co, Ni, Ag로부터 선택된 금속 원소의 산화물 중 어느 하나이거나 그 산화물의 액상 용액일 수 있다.Alternatively, it may be any one of oxides of metal elements selected from Co, Ni, Ag, or a liquid solution of the oxides.
또는, Co, Ni, Cu, Ag로부터 선택된 금속 원소의 규산염, 붕산염 및 옥살산염 중 어느 하나일 수 있다.Alternatively, it may be any one of silicate, borate and oxalate of a metal element selected from Co, Ni, Cu, Ag.
또는, ABO2 형태의 복합체 산화물로서, A는 Co, Ni 및 Cu로부터 선택된 어느 하나의 금속 원소이고, B는 Ni, Mn, Cr, Al 및 Fe로부터 선택된 어느 하나의 금속 원소이며, 상기 A 및 B는 서로 다른 것일 수 있다.Or ABO2 complex oxide, wherein A is any one metal element selected from Co, Ni and Cu, B is any one metal element selected from Ni, Mn, Cr, Al and Fe, wherein A and B are It may be different.
또는, 염화구리일 수 있으며, Cu2(OH)PO4, 인산구리, 황산구리 및 티오시안제1구리 중 어느 하나의 액상 용액일 수 있다.Alternatively, it may be copper chloride, and may be a liquid solution of any one of Cu 2 (OH) PO 4, copper phosphate, copper sulfate, and cuprous thiocyanate.
또는, Cu3N의 액상 용액일 수도 있다. 그러나 상술한 종류의 코팅소재로 한정하는 것은 아니다. Alternatively, a liquid solution of Cu 3 N may be used. However, it is not limited to the above-described coating material.
이러한 코팅소재를 플렉시블 소재에 코팅하고 코팅된 표면 위에 레이저를 조사하여 패터닝하면, 패터닝된 부분이 레이저에 의해 활성화되어 도금공정시 금속층을 형성하는 시드(seed)를 형성하게 된다. 이와 같이 레이저 활성화에 의해 플렉시블 소재에 패턴이 형성되면, 형성된 패턴과 도금되는 금속의 고착이 용이해져 레이저에 의해 패터닝된 형태로 플렉시블 소재에 전도체 패턴을 형성할 수 있으며, 코팅소재의 농도를 적절히 조절하여 도금을 위한 시드 형성률을 높이거나 레이저 패턴의 번짐 또는 전도체 패턴의 박리를 방지할 수 있다. When the coating material is coated on a flexible material and patterned by irradiating a laser on the coated surface, the patterned portion is activated by a laser to form a seed that forms a metal layer during the plating process. When the pattern is formed on the flexible material by laser activation, adhesion between the formed pattern and the metal to be plated is facilitated, and thus a conductor pattern can be formed on the flexible material in a patterned form by laser, and the concentration of the coating material is appropriately controlled. It is possible to increase the seed formation rate for plating or to prevent the spreading of the laser pattern or the peeling of the conductor pattern.
즉, 종래에는 플렉시블 소재에 전도체 패턴을 형성하기 위하여 베이스 프레임에 레이저를 바로 조사하기 때문에 레이저 패턴이 번지거나 도금 처리 후에 전도체 패턴이 박리되는 현상을 방지할 수 없고, 전도체 패턴을 형성하기 위해서 별도의 마스킹(masking), 에칭(etching), 패터닝(patterning)의 최소 3단계 이상의 공정과정을 거쳐야하는 번거로움이 있었으나, 본 발명을 통하여 이러한 문제점을 해결할 수 있다.That is, conventionally, since the laser is directly irradiated to the base frame to form the conductor pattern on the flexible material, the phenomenon that the laser pattern is smeared or the conductor pattern is peeled off after the plating process cannot be prevented. Although there has been a hassle of at least three steps of masking, etching, and patterning, the present invention can solve this problem.
본 발명에 따르면 종래의 전도체 패턴 형성 방법에 비하여 단순한 공정으로 플렉시블 소재에 전도체 패턴을 형성할 수 있으며, 특히 패턴 금형이나 마스크를 제작하여 플렉시블 소재 위에 전도체 패턴을 형성할 필요 없이, 플렉시블 소재 위에 레이저에 의해 활성화되어 도금공정에서 금속층을 형성하는 코팅소재를 코팅하고 그 위에 레이저를 조사함으로써, 레이저 조사기의 이동 경로와 관련된 프로그램 데이터를 간단히 조정하여 플렉시블 소재 위에 다양한 패턴의 형성이 가능하다.According to the present invention, the conductor pattern can be formed on the flexible material by a simple process compared to the conventional method of forming a conductor pattern. In particular, a pattern mold or a mask can be manufactured to form a conductor pattern on the flexible material without forming a conductor pattern on the flexible material. By coating the coating material activated by the plating process to form a metal layer in the plating process and irradiating a laser thereon, program data related to the movement path of the laser irradiator can be easily adjusted to form various patterns on the flexible material.
이하, 도 1과 도 2를 참조하여, 전술한 형태의 소재를 제조하는 방법에 관하여 구체적으로 설명한다.Hereinafter, with reference to FIG. 1 and FIG. 2, the method of manufacturing the raw material of the form mentioned above is demonstrated concretely.
도 1은 본 발명의 일실시예에 따른 전도체 패턴 형성이 용이한 소재를 제조하는 방법에 관한 것으로서, 본 발명의 일실시예에 따른 전도체 패턴 형성이 용이한 소재는 플렉시블 소재 및 상기 플렉시블 소재에 코팅되며 레이저에 의해 활성화되어 도금공정에서 금속층을 형성하는 코팅소재로 코팅되는 과정을 통해 제조된다.1 relates to a method for manufacturing a material that is easy to form a conductor pattern according to an embodiment of the present invention, the material that is easy to form a conductor pattern according to an embodiment of the present invention is coated on a flexible material and the flexible material It is manufactured by a process of coating with a coating material that is activated by a laser to form a metal layer in the plating process.
이하의 플렉시블 소재에 코팅소재를 코팅하는 방법은 액상법으로 코팅소재를 코팅하는 실시예로서, 본 발명의 기술적 사상이 아래의 실시예에 국한되는 것이 아님은 물론이다.The method of coating the coating material on the flexible material below is an embodiment of coating the coating material by the liquid phase method, and the technical spirit of the present invention is not limited to the following examples.
도 1에 도시된 바와 같이, 전도체 패턴의 형성이 용이한 소재를 제조하는 방법은 먼저, 화이버 소재로 구성된 플렉시블 소재의 표면을 세척하고(S110), 준비된 플렉시블 소재에 딥 코팅(dip coating), 스프레이 코팅(spray coating) 및 블레이드 코팅(blade coating)과 같은 방법으로 레이저에 의해 활성화되어 도금공정에서 금속층을 형성하는 코팅소재를 코팅한다(S120).As shown in FIG. 1, a method of manufacturing a material easily forming a conductor pattern includes first washing a surface of a flexible material composed of a fiber material (S110), dip coating, and spraying the prepared flexible material. The coating material is activated by a laser by a method such as spray coating and blade coating to form a metal layer in a plating process (S120).
여기서, 화이버 소재로 구성된 플렉시블 소재는 구부러질 수 있는 유연한 소재를 의미하는 것으로서, 예컨대, 유리 섬유(glass fiber)로 직조된 천과 같이 부도체 특성을 갖는 유연한 소재를 의미한다.Here, the flexible material made of a fiber material refers to a flexible material that can be bent, for example, a flexible material having non-conductive properties such as a cloth woven from glass fiber.
그리고 코팅소재는 플렉시블 소재에 전도체 패턴의 형성을 용이하게 하는 소재로서 (1) Zn 아세테이트 용액 (2) CuCr2O4의 액상 용액 (3) Co, Ni, Ag로부터 선택된 금속 원소의 산화물(예컨대, Ni2O3, Co2O3, Co3O4) 중 어느 하나이거나 그 산화물의 액상 용액 (4) Co, Ni, Cu, Ag로부터 선택된 금속 원소의 규산염, 붕산염 및 옥살산염 중 어느 하나 (5) ABO2 형태의 복합체 산화물로서, A는 Co, Ni 및 Cu로부터 선택된 어느 하나의 금속 원소이고, B는 Ni, Mn, Cr, Al 및 Fe로부터 선택된 어느 하나의 금속 원소이며, 상기 A 및 B는 서로 다른 것 (6) 염화구리 (7) Cu2(OH)PO4, 인산구리, 황산구리 및 티오시안제1구리 중 어느 하나의 액상 용액 (8) Cu3N의 액상 용액 일 수 있으며, 이상의 8가지의 코팅소재로 한정되는 것은 아니다.And the coating material is a material that facilitates the formation of a conductor pattern on the flexible material (1) Zn acetate solution (2) Liquid solution of CuCr2O4 (3) Oxides of metal elements selected from Co, Ni, Ag (e.g. Ni2O3, Co2O3 (4) any one of or a liquid solution of an oxide thereof (4) a silicate, borate or oxalate of a metal element selected from Co, Ni, Cu, Ag (5) ABO2 complex oxide, wherein A is Co, Any one metal element selected from Ni and Cu, and B is any one metal element selected from Ni, Mn, Cr, Al and Fe, wherein A and B are different from each other (6) copper chloride (7) Cu 2 ( Liquid solution of any one of OH) PO4, copper phosphate, copper sulfate and cuprous thiocyanate (8) It may be a liquid solution of Cu3N, and is not limited to the above eight coating materials.
예컨대, 플렉시블 소재에 전도체 패턴의 형성을 용이하게 하는 코팅소재를 코팅하는 방법은 유리 섬유로 구성된 플렉시블한 천에 Zn 아세테이트 용액을 액상법으로 코팅하는 방법일 수 있다.For example, the method of coating the coating material to facilitate the formation of the conductor pattern on the flexible material may be a method of coating the Zn acetate solution in a liquid phase on a flexible cloth made of glass fiber.
세척하여 준비된 플렉시블 소재에 전도체 패턴을 용이하게 형성하기 위한 코팅소재를 코팅한 후, 플렉시블 소재에 코팅되고 남은 용액을 휘발시키기 위해 일정 온도 이상, 예컨대, 90 이상에서 가열하여 코팅된 플렉시블 소재를 건조시킨다(S130). 건조시키는 온도는 플렉시블 소재에 코팅된 용액의 특성에 따라 결정되며, 용액이 휘발되는 온도 이상에서 일정시간 동안 가열하여 플렉시블 소재에 남아있는 용액을 휘발시킨다.After coating a coating material for easily forming a conductor pattern on the prepared flexible material, the coated flexible material is dried by heating at a predetermined temperature or higher, for example, 90 or more to volatilize the remaining solution coated on the flexible material. (S130). The drying temperature is determined according to the characteristics of the solution coated on the flexible material, and is heated for a predetermined time above the temperature at which the solution is volatilized to volatilize the remaining solution on the flexible material.
코팅된 플렉시블 소재에 대한 건조가 완료되면, 건조된 플렉시블 소재를 일정 온도 범위, 예컨대, 150에서 400 사이에서 열처리한다(S140).When the drying of the coated flexible material is completed, the dried flexible material is heat-treated in a predetermined temperature range, for example, 150 to 400 (S140).
열처리에 의하여, 플렉시블 소재에 코팅된 용액과 플렉시블 소재 사이의 결합력을 높이거나, 플렉시블 소재의 기계적 성질을 높이거나, 사용처에 알맞은 특성을 가지도록 할 수 있다.By heat treatment, it is possible to increase the bonding force between the solution and the flexible material coated on the flexible material, to increase the mechanical properties of the flexible material, or to have characteristics suitable for the intended use.
열처리 온도, 열처리 유지 시간, 온도를 식히는 속도 등은 플렉시블 소재에 따라 달라지거나 얻고자 하는 특성에 따라 다르게 설정될 수 있다.The heat treatment temperature, the heat treatment holding time, the speed of cooling the temperature, etc. may vary depending on the flexible material or may be set differently depending on the desired characteristics.
또한, 열처리 방법으로는 RTP(Rapid Thermal Processing)로 일반적인 고온의 열처리 오븐(oven) 또는 열처리 로(furnace)를 이용하여 수행할 수 있다.In addition, the heat treatment method may be performed by using a rapid thermal processing oven (RT) or a heat treatment furnace.
전술한 과정에 의하여 플렉시블 소재에 코팅이 완료되면 전도체 패터닝의 형성이 용이한 소재를 얻을 수 있다.When the coating is completed on the flexible material by the above-described process, it is possible to obtain a material in which conductor patterning is easily formed.
이하, 도 2를 참조하여 전술한 방법으로 제조된 플렉시블 소재에 전도체 패턴을 형성하는 방법을 구체적으로 설명한다.Hereinafter, a method of forming a conductor pattern on the flexible material manufactured by the above-described method will be described in detail with reference to FIG. 2.
도 2는 본 발명의 일실시예에 따른 소재에 전도체 패턴을 형성하는 방법의 과정을 나타낸 흐름도이다.2 is a flowchart illustrating a process of forming a conductor pattern on a material according to an embodiment of the present invention.
도 2에 도시된 바와 같이, 본 발명의 일실시예에 따른 플렉시블 소재에 전도체 패턴을 형성하는 방법은 먼저, 전술한 방식으로 화이버 소재로 구성된 플렉시블 소재에 레이저에 의해 패터닝된 부분만 활성화되어 도금공정에서 금속층을 형성하는 코팅소재로 코팅한다(S210). 코팅된 플렉시블 소재 표면에 형성하고자 하는 패턴의 형태로 레이저를 조사하여 패터닝한다(S220).As shown in FIG. 2, the method of forming a conductor pattern on a flexible material according to an embodiment of the present invention firstly activates only a portion patterned by a laser on a flexible material composed of a fiber material in the above-described manner. Coating with a coating material to form a metal layer (S210). Patterning by irradiating a laser in the form of a pattern to be formed on the surface of the coated flexible material (S220).
구체적으로, Zn 아세테이트 용액과 같은 특수 용액을 플렉시블 소재에 코팅하여 레이저와 같은 전자기파로 패터닝하면, 패터닝된 부분이 레이저를 흡수하여 금속층이 형성될 수 있는 시드(seed) 역할을 하게 되어 이후 도금 과정을 거치면서 패터닝된 형태로 플렉시블 소재에 금속 패턴을 형성할 수 있다.Specifically, when a special solution such as a Zn acetate solution is coated on a flexible material and patterned by electromagnetic waves such as a laser, the patterned portion absorbs the laser and serves as a seed for forming a metal layer. The metal pattern may be formed on the flexible material in a patterned form while passing.
또한, 레이저는 형성된 용액 코팅층의 표면에서 기설정된 패턴 경로를 따라 움직이며, 패턴의 형상 및 굵기에 따라 일정 구간을 반복하여 이동하거나 일정 경로를 따라 움직일 수 있다.In addition, the laser moves along a predetermined pattern path on the surface of the formed solution coating layer, and may repeatedly move a predetermined section or move along a predetermined path according to the shape and thickness of the pattern.
패터닝 과정에 사용되는 레이저로는 특별히 한정되는 것은 없으며 레이저의 파장은 308nm, 325nm, 532nm 및 1064nm인 것을 이용할 수 있다. 이용되는 파장에 따라 레이저의 파워나 처리 속도 등을 변화시켜 성능을 최대화 할 수 있다. 예컨대, 파장이 1064nm의 레이저를 활용할 경우 파워는 2~6watt 및 주파수는 40Hz로 조사할 수 있다.There is no particular limitation on the laser used in the patterning process, and the wavelength of the laser may be 308 nm, 325 nm, 532 nm, and 1064 nm. Depending on the wavelength used, the laser's power and processing speed can be varied to maximize performance. For example, if a laser with a wavelength of 1064 nm is used, the power can be irradiated with 2 to 6 watts and a frequency of 40 Hz.
레이저로 패터닝되어 준비된 플렉시블 소재를 무전해 도금 방법으로 도금한다(S230). 무전해 도금공정을 거치면, 플렉시블 소재 위에 패터닝한 형태로 금속층이 도금되어 금속체 패턴이 형성된다.The flexible material prepared by patterning with a laser is plated by an electroless plating method (S230). After the electroless plating process, the metal layer is plated on the flexible material to form a metal pattern.
이상의 과정으로도 플렉시블 소재에 금속층을 형성할 수 있으나 보다 균일하고 조밀한 형태의 전도체 패턴을 형성하기 위하여 선택적으로 무전해 도금공정 이후 전해 도금공정을 실시할 수도 있다(S240).Although the metal layer may be formed on the flexible material through the above process, the electroplating process may be optionally performed after the electroless plating process to form a more uniform and dense conductor pattern (S240).
전술한 바와 같이 본 발명의 일실시예에 따른 소재는 화이버 소재로 구성된 플렉시블 소재에 레이저에 의해 활성화되어 도금공정에서 금속층을 형성하는 코팅소재를 코팅함으로써 종래의 전도체 패턴 형성 방법에 비하여 단순한 용이하게 플렉시블 소재에 전도체 패턴을 형성할 수 있도록 한다.As described above, the material according to the embodiment of the present invention is simple and flexible compared to the conventional conductor pattern forming method by coating a coating material which is activated by a laser to form a metal layer in a plating process by a flexible material composed of a fiber material. Allow conductor patterns to be formed on the material.
이상의 설명은 본 발명의 기술적 사상을 예시적으로 설명한 것에 불과한 것으로서, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면, 본 발명의 본질적 특성을 벗어나지 않는 범위에서 다양한 수정 및 변형이 가능하다. 따라서 본 발명에 표현된 실시예들은 본 발명의 기술적 사상을 한정하는 것이 아니라, 설명하기 위한 것이고, 이러한 실시예에 의하여 본 발명의 권리범위가 한정되는 것은 아니다. 본 발명의 보호 범위는 아래의 특허청구범위에 의하여 해석되어야 하고, 그와 동등하거나, 균등한 범위 내에 있는 모든 기술적 사상은 본 발명의 권리범위에 포함되는 것으로 해석되어야 할 것이다.The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments represented in the present invention are not intended to limit the technical spirit of the present invention, but to describe, and the scope of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas that are equivalent to or equivalent to the equivalent scope should be construed as being included in the scope of the present invention.

Claims (9)

  1. 화이버 소재로 구성되는 플렉시블 소재; 및Flexible material composed of fiber material; And
    상기 플렉시블 소재에 코팅되며 레이저에 의해 활성화되어 도금공정에서 금속층을 형성하는 코팅소재Coating material coated on the flexible material and activated by a laser to form a metal layer in the plating process
    를 포함하는 선택적인 전도체 패턴 형성이 가능한 소재.A material capable of forming a selective conductor pattern comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 코팅소재는 Zn 아세테이트의 액상 용액인 것인 선택적인 전도체 패턴 형성이 가능한 소재.The coating material is a material capable of forming a selective conductor pattern is a liquid solution of Zn acetate.
  3. 제1항에 있어서,The method of claim 1,
    상기 코팅소재는 CuCr2O4의 액상 용액인 것인 선택적인 전도체 패턴 형성이 가능한 소재.The coating material is a material capable of forming a selective conductor pattern that is a liquid solution of CuCr 2 O 4 .
  4. 제1항에 있어서,The method of claim 1,
    상기 코팅소재는 Co, Ni, Ag 중 선택된 금속 원소의 산화물이거나 그 산화물의 액상 용액인 것인 선택적인 전도체 패턴 형성이 가능한 소재.The coating material is a material capable of forming a selective conductor pattern is an oxide of a metal element selected from Co, Ni, Ag or a liquid solution of the oxide.
  5. 제1항에 있어서,The method of claim 1,
    상기 코팅소재는 Co, Ni, Cu, Ag 중 선택된 금속 원소의 규산염, 붕산염 및 옥살산염 중 어느 하나인 것인 선택적인 전도체 패턴 형성이 가능한 소재.The coating material is a material capable of forming a selective conductor pattern of any one of silicate, borate and oxalate of a metal element selected from Co, Ni, Cu, and Ag.
  6. 제1항에 있어서,The method of claim 1,
    상기 코팅소재는 ABO2형태의 복합체 산화물로서, A는 Co, Ni 및 Cu 중 선택된 어느 하나의 금속 원소이고, B는 Ni, Mn, Cr, Al 및 Fe 중 선택된 어느 하나의 금속 원소이며, 상기 A 및 B는 서로 다른 것인 선택적인 전도체 패턴 형성이 가능한 소재.The coating material is a composite oxide of the ABO 2 form, A is any one metal element selected from Co, Ni and Cu, B is any one metal element selected from Ni, Mn, Cr, Al and Fe, A And B is a different material capable of forming a selective conductor pattern.
  7. 제1항에 있어서,The method of claim 1,
    상기 코팅소재는 염화구리인 것인 선택적인 전도체 패턴 형성이 가능한 소재.The coating material is a copper chloride material capable of forming a selective conductor pattern.
  8. 제1항에 있어서,The method of claim 1,
    상기 코팅소재는 Cu2(OH)PO4, 인산구리, 황산구리 및 티오시안제1구리 중 어느 하나의 액상 용액인 것인 선택적인 전도체 패턴 형성이 가능한 소재.The coating material is a material capable of forming a selective conductor pattern that is a liquid solution of any one of Cu 2 (OH) PO 4 , copper phosphate, copper sulfate, and cuprous thiocyanate.
  9. 제1항에 있어서,The method of claim 1,
    상기 코팅소재는 Cu3N의 액상 용액인 것인 선택적인 전도체 패턴 형성이 가능한 소재.The coating material is a material capable of forming a selective conductor pattern is a liquid solution of Cu 3 N.
PCT/KR2015/002954 2014-03-26 2015-03-26 Material enabling formation of selective conductive pattern WO2015147563A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020069956A1 (en) * 2018-10-02 2020-04-09 Chemische Fabrik Budenheim Kg Conductive textiles

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090025845A (en) * 2007-09-07 2009-03-11 주식회사 하나일렉콤 Fabric for shielding electromagnetic waves and its manufacturing method
KR20100054626A (en) * 2008-11-14 2010-05-25 박병주 Plate-shaped conductive body
KR20100126991A (en) * 2009-05-25 2010-12-03 전자부품연구원 A flexible pcb embedding active elements and passive elements and a manufacturing method ofthere
KR20140020635A (en) * 2012-08-10 2014-02-19 한국과학기술원 Method of manufacturing a transparent electrode, and method of manufacturing an electronic device having the transparent electrode

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090025845A (en) * 2007-09-07 2009-03-11 주식회사 하나일렉콤 Fabric for shielding electromagnetic waves and its manufacturing method
KR20100054626A (en) * 2008-11-14 2010-05-25 박병주 Plate-shaped conductive body
KR20100126991A (en) * 2009-05-25 2010-12-03 전자부품연구원 A flexible pcb embedding active elements and passive elements and a manufacturing method ofthere
KR20140020635A (en) * 2012-08-10 2014-02-19 한국과학기술원 Method of manufacturing a transparent electrode, and method of manufacturing an electronic device having the transparent electrode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020069956A1 (en) * 2018-10-02 2020-04-09 Chemische Fabrik Budenheim Kg Conductive textiles
US20210388532A1 (en) * 2018-10-02 2021-12-16 Chemische Fabrik Budenheim Kg Conductive textiles

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