WO2015147561A1

WO2015147561A1 - Composite material with which conductor pattern can easily be formed, method for manufacturing the composite material, copper nitride seed material of the composite material and method for synthesising the copper nitride

Info

Publication number: WO2015147561A1
Application number: PCT/KR2015/002951
Authority: WO
Inventors: 유명재; 임호선
Original assignee: 전자부품연구원
Priority date: 2014-03-26
Filing date: 2015-03-26
Publication date: 2015-10-01

Abstract

The present invention provides a composite material with which a conductor pattern can easily be formed and a method for manufacturing the composite material. A composite material according to the present invention comprises a fibre material that can be fabricated as three-dimensional components and a Cu₃N material that is coated onto the fibre material, and is activated when irradiated by a laser and forms a metal layer in a plating process. When the composite material according to the present invention is used, a conductor pattern can be more easily formed using a simpler process compared to existing conductor pattern formation methods.

Description

A method for preparing a composite material and a composite material of which a conductor pattern is easily formed, and a method for synthesizing a copper nitride and a copper nitride thereof as a seed material in the composite material

The present invention relates to a composite material that can implement a conductor pattern on a three-dimensional part using electromagnetic waves, in particular, a laser. Specifically, a composite material capable of forming a three-dimensional conductor pattern by a laser and a composite material It is about a method.

The conventional method of forming a conductor pattern on a three-dimensional part is a method of obtaining a part by sequentially injection molding different or different materials in a mold, and forming a conductor pattern thereon, specifically, a material that is not plated. After the first injection is a method of forming a conductor pattern on the second injection of a material capable of plating.

However, the method of forming a conductor pattern using the double injection method is not only difficult to manufacture a mold in producing a complicated part, but also has a great variation between the manufactured parts. According to the prior art, the thickness of the manufactured part should be 1 mm or more, which is slim. There is a problem that the production of one type of part is difficult. In particular, there is a problem in that it is difficult to form a conductor pattern of a complicated shape on the manufactured part.

Recently, in order to solve such a problem, a laser direct structuring (LSD) method of forming a conductor pattern by applying a laser treatment and plating process to a material is used, but it is included in a material to form a pattern by laser. There is a problem in that the seed forming agent to be deteriorated in the formability of the finally produced part.

In addition, in the manufacturing process using the laser direct structuring, since the laser is directly irradiated to the base material, there is a problem that the pattern spreads or the conductor pattern is peeled off after the plating process according to the characteristics of the base material.

Seed material, which is a core material in a composite material that implements a conductor pattern on a conventional three-dimensional part, is disclosed in US 2004/0241422 A1 (Conductor track structures and method for production). The disclosed Ferro spinel PK3095 is a spinel crystal of CuCr ₂ O ₄ material.

In the US Patent Publication US 6696173 B1 (Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same), it is activated during laser treatment using a Palladium complex material. Disclosed a material that can be implemented.

In order to solve the above problems, the composite material and the composite material that is easy to generate a conductor pattern by coating an inorganic material that is activated during laser irradiation to form a metal layer in the plating process on a fiber type material It aims at providing the manufacturing method.

Another object of the present invention is to improve a composite material capable of forming a three-dimensional conductor pattern by laser using a copper nitride (Cu ₃ N) material, and a method and a method for synthesizing copper nitride used in the composite material at low cost It is to provide a copper nitride that is a seed material of the composite material capable of forming a conductor pattern by a laser generated by the.

In order to achieve the above object, a composite material and a method of manufacturing the composite material, which can easily form a conductor pattern according to an aspect of the present invention, are coated on a fiber type material and a fiber type material that can be manufactured in a three-dimensional shape. Cu ₃ N material that is activated during laser irradiation to form a metal layer in the plating process.

According to another aspect of the present invention, a composite material having an easy conductor pattern and a method of manufacturing the composite material may be heated by heating a mixture including a fiber-type material and a liquid-form Cu ₃ N composition, except for the fiber-type material. Dissolving the same, cooling and degassing the mixture, heat treating the degassed mixture, and washing and drying the heat treated mixture.

According to another aspect of the present invention, a composite material and a method of manufacturing the composite material, which are easily formed with a conductor pattern, may be formed by injection molding the washed and dried mixture, and patterning the laser on the surface of the injection molded mixture. Plating the patterned mixture further.

According to another aspect of the present invention, seed produced in a composite material capable of forming a three-dimensional conductor pattern by laser, produced by dissolving copper acetate in urea and 1-nonanol It provides a copper nitride material.

By obtaining the copper acetate by reacting copper hydroxide (Copper Hydroxide) or copper carbonate (Copper Carbonate) with acetic acid, it is possible to provide copper acetate at a lower cost.

The copper acetate may be obtained from a copper electrode using an electrolysis process in water containing calcium acetate, thereby providing copper nitride having lower purity and higher purity than conventional copper nitride.

The ratio of the copper acetate and the urea may be 1: 1 to 1: 100.

According to another aspect of the invention, dissolving copper acetate in urea and 1-octanol (1-Octanol); And when the copper acetate is dissolved provides a method for synthesizing the copper nitride of the seed material in a composite material capable of forming a three-dimensional conductor pattern by a laser comprising a step of degassing and heat treatment in a nitrogen atmosphere.

According to another aspect of the invention, the step of heating dodecanol (Dodecanol); Mixing copper acetate and urea with the heated dodecanol; Performing nitrogen gas bubbling while stirring the mixed solution; And it provides a method for synthesizing a copper nitride as a seed material in a composite material capable of forming a three-dimensional conductor pattern by a laser including a step of performing a heat treatment stepwise at a temperature within 250 degrees and maintaining a predetermined time.

According to the present invention, an inorganic material, particularly Cu ₃ N (copper nitride) is coated on a fiber-type material, thereby providing a composite material which is easy to form a conductor pattern through a laser treatment and a plating process.

In addition, the composite material according to the present invention provides the advantage that the conductor pattern can be formed even in a slim or three-dimensional complex form parts. In addition, when the conductor pattern is formed on the composite material, the process pattern is reduced by the first injection process, thereby forming the conductor pattern, thereby reducing the manufacturing cost of the part.

In addition, according to the present invention, by providing a technology for synthesizing copper nitride, which is the seed material of the composite material at low cost, it provides an advantage to ensure the price competitiveness of the composite material as a whole.

1 is a flowchart illustrating a process of a method of manufacturing a composite material having easy conductor pattern formation according to an embodiment of the present invention.

2 is a view showing a composite material coated with copper nitride on glass fiber according to one embodiment of the present invention.

3 and 4 is a view showing a method for forming a conductor pattern on the composite material according to an embodiment of the present invention and the components manufactured according to the method.

FIG. 5 is a flowchart illustrating a method of synthesizing a copper nitride as a seed material in a composite material capable of forming a three-dimensional conductor pattern by a laser according to an embodiment of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various different forms, and the present embodiments only make the disclosure of the present invention complete, and those of ordinary skill in the art The scope of the present invention is defined by the description of the claims as it is provided only to fully inform the person having the scope of the invention.

Meanwhile, the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular forms also include the plural unless specifically stated otherwise in the phrases. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements in the mentioned components, steps, operations and / or elements. Or does not exclude the addition. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention includes a fiber type material and a material coated on the fiber type material, specifically, glass fiber, carbon fiber, cellulose fiber, kenaf On a composite material including a fiber type material such as fiber, graphite fiber and carbon nanotube, and a Cu 3 N material coated on the fiber type material and activated during laser irradiation to form a metal layer in a plating process. It is about.

In this case, the fiber-type material may be used after being treated with a surface treatment agent such as a focusing agent, a coupling agent, and a smoothing agent, and in particular, when the fiber material surface-treated with the coupling agent is used, an interface between the fiber-type material and the Cu3N material It is possible to coat more uniform and dense Cu3N material on the fiber type material by increasing the bonding force.

Coupling agents include silane coupling agents (e.g., shinet su, momentive, dow corning), polymer couplings (e.g. polycarboxylic, polyacrylic acid), polymerizable coupling agents (e.g. triazinethiosulfate) and alkoxythio Sulfuric acid (alkoxythiosulfate) coupling agents and the like may be used.

In addition, the use of fiber-type materials surface-treated in various ways provides the advantages of minimizing damage to the fiber-type material itself, as well as improving adhesion, mechanical properties, and chemical properties.

The Cu ₃ N material coated on the fiber type material may be coated on the aforementioned fiber type material by a liquid phase method, which is a typical coating method.

The Cu ₃ N composition provided to be coated in a liquid form on a fiber-type material includes copper nitrate trihydrate, octadecene, octadecylamine, and the like. Octadecin and octa The decylamine nanoparticles Cu ₃ N particles to provide the effect of increasing the interfacial bonding force with the fiber type material.

By coating the fiber type material with Cu ₃ N material and patterning by irradiating a laser on the coated surface, the patterned part is activated by a laser, and the patterned part is easily adhered to the metal to be plated later. To form a metal layer.

Therefore, according to the present invention, the conductor pattern can be formed on the composite material in a simple process as compared with the conventional method of forming the conductor pattern.

Hereinafter, a method of manufacturing the composite material of the above-described form will be described in detail with reference to FIGS. 1 to 4.

1 is a method for manufacturing a composite material easy to form a conductor pattern according to an embodiment of the present invention, the following method is an embodiment of coating a Cu ₃ N material by a liquid phase method on a fiber-type material Of course, the technical spirit of the present invention is not limited to the following examples.

As shown in Figure 1, the composite material manufacturing method according to an embodiment of the present invention, first, the temperature of the mixture comprising a fiber-type material and a liquid form of Cu ₃ N composition to 60 to heat up the material of the fiber type Dissolve the remaining mixture except for (S110).

When the remaining mixture except the fiber-type material is dissolved, the dissolved mixture is cooled to produce a solid mixture, and the resulting solid mixture is degassed (S120).

For example, the dissolved mixture may be cooled using liquid nitrogen to form a solid state, and then gaseous nitrogen may be used to remove unnecessary residual gas. In addition, the degassing process may be repeated one or more times to increase the removal rate of residual gas.

After the degassed mixture is heated in the first temperature range for a predetermined time or more, the temperature of the mixture is gradually heat-treated to the second temperature range (S130).

For example, the degassed mixture may be heat treated at a temperature of about 150 to 3 hours or more, followed by stepwise raising the temperature to 270. By appropriately heat treating the mixture, the mechanical or chemical properties of the final part to be produced can be adjusted to suit the purpose.

After the heat-treated mixture is subjected to a post-treatment process such as washing with a washing agent such as ethanol and chloroform (chloroform) or drying (S140).

In an embodiment of the present invention, a liquid phase method of dissolving and coating Cu ₃ N in a liquid phase in a fiber type material is used. According to another embodiment of the present invention, Cu ₃ N is paste screen coated and roll coated in a fiber type material. Of course, the coating by the sputtering method, the evaporation method or the like can also be used.

Hereinafter, a method of coating Cu ₃ N using a fiber material surface-treated with a coupling agent will be described in detail with reference to FIG. 2.

Figure 2 is a view showing a glass fiber (glass fiber) coated with Cu ₃ N according to the composite material manufacturing method according to an embodiment of the present invention.

As Figure 2a showing the surface of the coated glass fiber Cu ₃ N, when to coat the Cu ₃ N on the surface of the glass fibers of the material of fiber type, Cu ₃ N is a glass fiber surface in the form of a cube of about 25nm in size It can be seen that it is coated.

On the other hand, in order to coat Cu ₃ N more densely on the fiber type material, the fiber type material may be surface treated with a coupling agent in advance. Specifically, the glass fiber type material may be washed with an acid or a base, and then By surface treatment with a ring agent to coat the above-described liquid form of Cu ₃ N can be coated with a more dense form Cu ₃ N.

Figure 2b is a surface treatment and then Cu ₃ N is as shown the surface of the coated glass fiber, is coated by the wet method the amino-based silane coupling agent on the surface of the glass fiber to form a bonding layer of glass fiber and Cu ₃ N Cu ₃ When coating N, it can be seen that the nano-sized Cu ₃ N is coated more uniformly and densely than the surface of the glass fiber type material shown in FIG. 2A. As such, the Cu ₃ N is more densely coated on the fiber-type material, thereby forming a more uniform conductor catalyst layer during laser treatment for forming a conductor pattern.

Herein, the coupling agent may be a silane coupling agent, a polymer coupling agent, a polymerizable coupling agent, an alkoxythiosulfate coupling agent, or the like, and the coupling agent used may be selected according to the type and properties of the fiber type material. Can be. In addition, the processing method of a coupling agent can be performed by the processing method of various systems other than a wet method.

Hereinafter, a method of forming a conductor pattern on a composite material coated with Cu ₃ N in the manner described above with reference to FIGS. 3 and 4 will be described in detail.

3 is a flowchart illustrating a method of forming a conductor pattern on a composite material according to an embodiment of the present invention, and FIG. 4 is a view illustrating a part manufactured according to the method of forming a conductor pattern on a composite material according to an embodiment of the present invention. to be.

As shown in Figure 3, the method of forming a conductor pattern on the composite material according to an embodiment of the present invention, first, to produce a composite material by coating Cu ₃ N on the fiber-type material in the manner described above (S310) . Injection molding into a shape to manufacture the manufactured composite material (S320). Patterning by irradiating a laser in the form of a pattern to be formed on the injection-molded composite material (S330). The patterned composite is first plated by an electroless plating method (S340). In the above process, a more uniform metal layer may be formed, but in order to implement a more uniform metal layer, it is preferable to perform a second electroplating process after the electroless process (S350).

Specifically, the composite material is manufactured by coating a Cu ₃ N in the material of fiber type Cu ₃ N is activated, when the laser irradiation by the laser absorbent role to form a pattern. Figure 4a shows an example of forming a rectangular pattern using a laser on the surface of the part produced by injection molding.

Such a composite material is a thermoplastic resin, various resins capable of injection molding can be used. For example, PE, ABS, PBT, PET, LCP, PPA, PA6 or composite resins thereof may be used.

In addition, the laser moves along a predetermined pattern path on the surface of the formed Cu ₃ N coating layer, and may repeatedly move a predetermined section or move along a predetermined path according to the shape and thickness of the pattern. It does not specifically limit as a laser, According to a laser wavelength, a power, a processing speed, etc. can change. For example, if a laser with a wavelength of 1064 nm is used, the power can be irradiated with 2 to 6 watts and a frequency of 40 Hz.

After laser patterning, the activated pattern can be metallized via electrolytic plating or electroless plating or both. 4B illustrates an example in which a metal layer is formed by electroless plating the component of FIG. 4A.

As described above, the composite material according to the embodiment of the present invention enables the conductor pattern to be easily formed by a simple process compared to the conventional conductor pattern forming method by coating Cu ₃ N on a fiber type material.

On the other hand, the present invention provides a method and a seed material that can provide an expensive seed material at a low cost in the composite material that can easily form a conductor pattern while also providing the appropriate mechanical properties to the three-dimensional component parts It aims to do it.

The present invention provides a technique for inexpensively synthesizing nitride, in particular Cu ₃ N material, the Cu ₃ N inorganic filler is a cubic structure of space group Pm3m.

As a method of synthesizing a conventional copper nitride-based material, a gas phase method and a liquid phase method are largely known, and representative examples thereof are as follows.

1. Dissolve copper nitrate trihydrate using 1-octadecene and octadecylamine, degassing with nitrogen atmosphere, heat-treat within 300 ° C and centrifuge.

2. Dissolve copper chloride using sodium azide and toluene or THF (Tetrahydrofuran), and heat-treat at 300 ° C in a nitrogen atmosphere to synthesize powder.

3. Dissolve copper (2) hexafluoroacetylacetonate in methanol and heat-treat to apply a temperature range and pressure within 300 ° C in ammonia gas to synthesize powder.

The present invention provides a method for synthesizing copper nitride using a cheap material unlike the above and in the composite material capable of forming a three-dimensional conductor pattern by a laser according to an embodiment of the present invention in FIG. Indicate the process.

In the present invention, unlike in the above-described method, copper acetate (Copper (2) acetate monohydrate) is dissolved in urea (Urea) and 1-nonanol (1-Nonaol) (S410), and degassing in a nitrogen atmosphere (S420), Heat treatment is performed in a temperature range within 250 degrees (S430) to synthesize a copper nitride (Cu ₃ N) powder (S440).

At this time, according to another embodiment of the present invention, copper acetate (Copper (2) hydroxide) or copper carbonate (Copper (2) carbonate) in acetic acid (Acetic acid) ) Can be used to react to

According to another embodiment, it may be synthesized using an electrolysis process in water containing calcium acetate from a Cu electrode to provide a higher purity copper (2) acetate. The copper acetate (Copper (2) acetate) thus provided is cheaper and more pure than conventional copper compounds.

According to another embodiment, dodecanol (molecular weight 186.33), 1-octanol (1-Octanol, molecular weight 130.23) or 1 instead of 1-nonanol as a solvent in which copper acetate is dissolved to provide a cheaper synthesis method -Hexadecanol (1-Hexadecanol, molecular weight 242.44) can also be used.

The process of synthesizing copper nitride using dodecanol as a solvent heats the dodecanol and mixes copper acetate and urea with the heated dodecanol. Nitrogen gas bubbling is carried out while stirring the mixed solution, and heat treatment is performed stepwise at a temperature within 250 degrees and maintained for a certain time. The product can then be washed in an organic solvent and dried to obtain a copper nitride powder.

The present invention can provide even more inexpensive synthesis technology by utilizing urea as providing nitrogen which facilitates the synthesis into copper nitride in synthesis.

And the ratio of copper acetate (Copper (2) acetate) and urea (Urea) synthesized in the present invention can be limited to 1 to 1 to 100.

The following shows an example of synthesizing a copper nitride material according to the present invention.

here,

Is

Means.

Therefore, according to the present invention, by inexpensively synthesizing copper nitride, which is a seed material, in a composite material capable of forming a three-dimensional conductor pattern by a laser, the overall price of the composite material can be lowered, thereby enabling the formation of a three-dimensional conductor pattern by a laser. It is possible to provide a material that can replace the conventional composite material.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments represented in the present invention are not intended to limit the technical spirit of the present invention, but to describe, and the scope of the present invention is not limited to these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas that are equivalent to or equivalent to the equivalent scope should be construed as being included in the scope of the present invention.

Claims

Fiber-type material which can be manufactured from three-dimensional parts; And

The composite material is easy to form a conductor pattern comprising a Cu 3 N material coated on the fiber-type material and is activated during laser irradiation to form a metal layer in the plating process.
The method of claim 1,

The fiber-type material is any one of glass fiber, carbon fiber, cellulose fiber, kenaf fiber, graphite fiber and carbon nanotube composite material easy to form a conductor.
The method of claim 1,

The Cu 3 N material is a composite material that is easy to form a conductor pattern that is adsorbed in a liquid form to the fiber-type material.
The method of claim 1,

The fiber-type material is easy to form a conductor pattern that is surface-treated with a coupling agent washed with acid or base.
The method of claim 4, wherein

The coupling agent is any one of a silane coupling agent, a polymer coupling agent, a polymerizable coupling agent, and an alkoxythiosulfuric acid coupling agent, and the composite material is easy to form a conductor pattern is selected according to the type of the fiber type.
Heating the mixture comprising a fiber type material and a liquid type Cu 3 N composition to dissolve the remaining mixture except the fiber type material;

Cooling and degassing the mixture;

Heat treating the degassed mixture; And

Washing and drying the heat-treated mixture

Easily formed composite pattern comprising a conductive material.
The method of claim 6,

Injection molding the washed and dried mixture, and patterning the surface of the injection molded mixture by irradiating a laser; And

Plating the patterned mixture

The composite material manufacturing method easy to form a conductor pattern further comprising.
The method of claim 7, wherein the plating of the patterned mixture,

After the patterned mixture is plated by the electroless plating method, the plating method by the electroplating method is easy composite material manufacturing method.
Copper nitride, a seed material in a composite material, produced by dissolving copper acetate in urea and 1-nonanol.
The method of claim 9, wherein the copper acetate

Copper nitride as a seed material in a composite material obtained by reacting copper hydroxide (Copper Hydroxide) or copper carbonate (Copper Carbonate) with acetic acid.
The method of claim 9, wherein the copper acetate

Copper nitride as a seed material in a composite material that is obtained from a copper electrode using an electrolysis process in water containing calcium acetate (Calcium Acetate).
The method of claim 9,

The copper nitride is a seed material in the composite material capable of forming a three-dimensional conductor pattern by a laser, characterized in that the ratio of the copper acetate and the urea is 1: 1 to 1: 100.
Dissolving copper acetate in urea and 1-octanol; And

Degassing and heat treatment in a nitrogen atmosphere when the copper acetate is dissolved

Method of synthesizing copper nitride which is a seed material in a composite material comprising a.
The method of claim 13, wherein dissolving the copper acetate in urea and 1-octanol

A method for synthesizing copper nitride, which is a seed material, in a composite material in which copper acetate or copper carbonate obtained by reacting copper hydroxide or copper carbonate with acetic acid is dissolved in the urea and 1-octanol.
The method of claim 13, wherein dissolving the copper acetate in urea and 1-octanol

A method of synthesizing a copper nitride, which is a seed material, in a composite material in which copper acetate obtained from a copper electrode is dissolved in the urea and the 1-octanol using an electrolysis process in water containing calcium acetate.
The method of claim 13, wherein dissolving the copper acetate in urea and 1-octanol

The copper nitride and the urea is dissolved in a ratio of 1: 1 to 1: 100 in a composite material method for synthesizing a copper nitride seed material.
Heating Dodecanol;

Mixing copper acetate and urea with the heated dodecanol;

Performing nitrogen gas bubbling while stirring the mixed solution; And

Heat treatment step by step at a temperature within 250 degrees to maintain a certain time

Method of synthesizing copper nitride which is a seed material in a composite material comprising a.