JP2008140972A - Molded goods having conductive circuit, and manufacturing method thereof - Google Patents
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Abstract
Description
本発明は、表面に導電性の回路が形成された導電回路を有する成形品及びその製造方法に関するものである。 The present invention relates to a molded article having a conductive circuit having a conductive circuit formed on its surface and a method for manufacturing the same.
従来、導電回路を有する成形品として、例えば樹脂基板等の成形品の表面に導電回路を形成した回路基板が広く用いられている。この回路基板を効率よく形成する方法として、例えば、ポリブチレンテレフタレート、パイロジェン珪酸および銅を含有するスピネルをベースとする複合酸化物からなる配合物を射出成形したケーシングに、Ｎｄ：ＹＡＧレーザーからレーザー光を照射した後、ケーシングに化学的還元性銅メッキを行うことで、レーザー光を照射した部分に回路を形成する方法が提案されている（特許文献１参照）。 Conventionally, as a molded article having a conductive circuit, for example, a circuit board having a conductive circuit formed on the surface of a molded article such as a resin substrate has been widely used. As a method for efficiently forming this circuit board, for example, a casing made by injection-molding a compound composed of a composite oxide based on spinel containing polybutylene terephthalate, pyrogenic silicic acid and copper is irradiated with laser light from an Nd: YAG laser. A method of forming a circuit in a portion irradiated with laser light has been proposed (see Patent Document 1) by performing chemical reducing copper plating on the casing after irradiation.
しかしながら、上記特許文献１に記載の方法は、具体的な製造条件が不明であり、常に導電回路が形成されるのではなく、製造条件によっては回路が形成されないこともあった。また、成形品の製造コストを削減する為には、回路を確実に形成できると共に、更に効率よく回路を形成することが要望されている。 However, in the method described in Patent Document 1, specific manufacturing conditions are unknown, and a conductive circuit is not always formed, and a circuit may not be formed depending on manufacturing conditions. Moreover, in order to reduce the manufacturing cost of a molded product, while being able to form a circuit reliably, forming a circuit more efficiently is desired.
本発明が解決しようとする課題は、導電回路を有する成形品が確実に得られ、導電回路を更に効率良く形成することが可能な導電回路を有する成形品及びその製造方法を提供することにある。 The problem to be solved by the present invention is to provide a molded article having a conductive circuit capable of reliably forming a molded article having a conductive circuit and forming the conductive circuit more efficiently, and a method for manufacturing the same. .
上記課題を解決するために本発明の導電回路を有する成形品は、熱可塑性樹脂に非導電性無機繊維及び銅含有複合酸化物材料が添加された配合物から成形された成形体の表面に、レーザー光が照射された領域に無電解めっきによる導電回路が形成されている成形体であって、前記導電回路が非導電性無機繊維の配向方向と交差する方向に形成されていることを要旨とするものである。 In order to solve the above problems, a molded article having a conductive circuit of the present invention is formed on the surface of a molded article formed from a blend in which a non-conductive inorganic fiber and a copper-containing composite oxide material are added to a thermoplastic resin. It is a molded body in which a conductive circuit is formed by electroless plating in a region irradiated with laser light, and the conductive circuit is formed in a direction crossing the orientation direction of the non-conductive inorganic fiber. To do.
上記成形体の熱可塑性樹脂としては、射出成形などの成形が可能な樹脂であれば利用可能であるが、例えばポリブチレンテレフタレートが汎用性があり安価であって、成形性が良好である等の点から好ましい。上記銅含有複合酸化物材料は、スピネル型のＣｕＣｒ２Ｏ４の黒色顔料を用いるのが好ましい。上記非導電性無機繊維は、ガラス繊維が好ましい。また、上記成形体には、導電回路形成を阻害しない範囲で、その他の添加物を配合してもよい。 As the thermoplastic resin of the molded body, any resin that can be molded such as injection molding can be used. For example, polybutylene terephthalate is versatile and inexpensive, and has good moldability. It is preferable from the point. The copper-containing composite oxide material is preferably a spinel-type CuCr 2 O 4 black pigment. The non-conductive inorganic fiber is preferably a glass fiber. Moreover, you may mix | blend another additive with the said molded object in the range which does not inhibit electrically conductive circuit formation.
また上記成形体において、導電回路は、成形体の非導電性無機繊維の配向方向と直交する方向に形成されていることが好ましい。 Moreover, in the said molded object, it is preferable that the conductive circuit is formed in the direction orthogonal to the orientation direction of the nonelectroconductive inorganic fiber of a molded object.
また本発明の導電回路を有する成形体の製造方法は、熱可塑性樹脂に非導電性無機繊維及び銅含有複合酸化物材料を添加した配合物を射出成形し、得られた成形体の表面に非導電性無機繊維の配向方向と交差する方向にレーザー光を照射した後、成形体に無電解めっきを行い、レーザー光照射領域に無電解めっきによる導電回路を形成してなることを要旨とするものである。 The method for producing a molded article having a conductive circuit according to the present invention includes injection molding a compound obtained by adding a non-conductive inorganic fiber and a copper-containing composite oxide material to a thermoplastic resin, and forming a non-coated surface on the resulting molded article. The gist is that after irradiating laser light in the direction intersecting the orientation direction of the conductive inorganic fiber, the molded body is subjected to electroless plating, and a conductive circuit is formed by electroless plating in the laser light irradiation area. It is.
上記成形体の製造方法において、レーザー光の照射を、平均レーザー出力が１．３Ｗ以上であり、単位面積当たり付与エネルギーが０．３５Ｊ以上で行うことが、めっき層からなる導電回路がより確実に得られることから好ましい。 In the manufacturing method of the molded body, the conductive circuit composed of the plating layer can be more reliably performed by irradiating the laser beam with an average laser output of 1.3 W or more and an applied energy per unit area of 0.35 J or more. Since it is obtained, it is preferable.
上記本発明導電回路を有する成形体によれば、導電回路が非導電性無機繊維の配向方向と交差する方向に形成されているので、レーザー光照射領域に確実に導電回路が形成されている成形体が得られる。 According to the molded body having the conductive circuit of the present invention, since the conductive circuit is formed in a direction crossing the orientation direction of the non-conductive inorganic fibers, the conductive circuit is reliably formed in the laser light irradiation region. The body is obtained.
また上記本発明導電回路を有する成形体の製造方法によれば、導電回路を有する成形品が確実に得られると共に、導電回路を更に効率良く形成可能であり、レーザー光照射工程におけるスキャン速度を上げることで生産性が向上し、製造コストを低減することができる。 In addition, according to the method for producing a molded article having a conductive circuit of the present invention, a molded article having a conductive circuit can be obtained reliably, the conductive circuit can be formed more efficiently, and the scanning speed in the laser light irradiation process is increased. As a result, productivity can be improved and manufacturing costs can be reduced.
以下、本発明の実施形態を図面を参照して詳細に説明する。図１（ａ）は本発明導電回路を有する成形品の一例として回路基板を示す平面図である。図１の回路基板１は、熱可塑性樹脂としてポリブチレンテレフタレート（以下、ＰＢＴと言うこともある）を用い、非導電性無機繊維としてガラス繊維、及び銅含有複合酸化物材料としてスピネル型のＣｕＣｒ２Ｏ４の黒色顔料を添加した配合物が射出成形されてシート状に形成された成形体である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig.1 (a) is a top view which shows a circuit board as an example of the molded article which has this invention conductive circuit. 1 uses polybutylene terephthalate (hereinafter sometimes referred to as PBT) as a thermoplastic resin, glass fibers as non-conductive inorganic fibers, and spinel-type CuCr 2 as a copper-containing composite oxide material. It is a molded body formed by injection molding a compound to which a black pigment of O 4 is added and formed into a sheet shape.
図１の回路基板１は、前記ガラス繊維２が図中上下方向に配向するように成形されている。そして回路基板１の表面には、ガラス繊維２の配向方向（図中矢印Ｄで示す）と直交する方向（図中矢印Ｒで示す）に導電回路３が形成されている。尚、図１において、ガラス繊維２は、配向方向を説明するために、模式的に示した。 The circuit board 1 in FIG. 1 is formed such that the glass fibers 2 are oriented in the vertical direction in the figure. A conductive circuit 3 is formed on the surface of the circuit board 1 in a direction (indicated by an arrow R in the figure) orthogonal to the orientation direction of the glass fibers 2 (indicated by an arrow D in the figure). In FIG. 1, the glass fiber 2 is schematically shown in order to explain the orientation direction.
図１（ｂ）は同図（ａ）の回路基板の導電回路を示す拡大図である。回路基板１の導電回路３は、成形体の表面のガラス繊維２の配向方向と直交する方向となる矢印ＲＬ方向にレーザー光Ｌがスキャンされて照射された領域に、無電解銅めっきによる導電性金属層である、金属銅からなる回路が連続的に形成されているものである。 FIG. 1B is an enlarged view showing a conductive circuit of the circuit board of FIG. The conductive circuit 3 of the circuit board 1 has a conductive property by electroless copper plating in the region irradiated with the laser beam L in the direction of the arrow RL, which is a direction orthogonal to the orientation direction of the glass fiber 2 on the surface of the molded body. A circuit made of metallic copper, which is a metal layer, is continuously formed.
以下、上記成形体の製造方法について説明する。ＰＢＴ、ガラス繊維及びスピネル型のＣｕＣｒ２Ｏ４の黒色顔料を添加した配合物を混練しペレット状に押出成型する。このペレット射出成形機を用いてシート状に成型して基板を得る。次いで、この基板の表面にレーザー光を照射する。レーザー光の照射は、基板のガラス繊維の配向方向と交差する方向に照射する。 Hereinafter, the manufacturing method of the said molded object is demonstrated. A blend of PBT, glass fiber and spinel-type CuCr 2 O 4 black pigment is kneaded and extruded into a pellet. A substrate is obtained by molding into a sheet using this pellet injection molding machine. Next, the surface of the substrate is irradiated with laser light. Laser light is irradiated in a direction that intersects with the orientation direction of the glass fibers of the substrate.
基板表面のレーザー光が照射された成形体に、洗浄等の前処理を行った後、無電解銅めっきを施す。基板表面にレーザー光が照射された領域に、無電解銅めっきによる金属銅の層が連続的に形成される。スピネル型のＣｕＣｒ２Ｏ４等の銅含有複合酸化物材料を含む成形体は、レーザー光が照射されると、その熱エネルギーによって照射部のみがめっきに適した状態になると考えられる。そして、レーザー光を照射した成形体に無電解めっきを行うと、成形体のレーザー光照射部分にのみ、めっき皮膜が形成される。 After the pre-treatment such as washing is performed on the molded body irradiated with the laser beam on the substrate surface, electroless copper plating is performed. In the region where the laser beam is irradiated on the substrate surface, a metal copper layer is formed continuously by electroless copper plating. When a molded body containing a copper-containing composite oxide material such as spinel-type CuCr 2 O 4 is irradiated with laser light, only the irradiated portion is considered to be in a state suitable for plating due to its thermal energy. When electroless plating is performed on the molded body irradiated with laser light, a plating film is formed only on the laser light irradiated portion of the molded body.
レーザー光を照射した後で無電解めっきにを行った際、レーザー光照射領域にめっき層が形成されるかどうかは、レーザー光の照射条件（例えば、単位面積当たりの付与エネルギー、平均出力、スキャン速度等）に依存する。本発明では、成形体表面の導電回路を形成しようとする領域にレーザー光の照射を行う場合、成形体からなる基板に含まれるガラス繊維等の非導電性無機繊維の配向方向と直交方向等の交差方向にレーザー光を照射することで、レーザー光の単位面積当たりの付与エネルギーを小さくしたり、スキャン速度を速くすることができる。 When electroless plating is performed after laser light irradiation, whether or not a plating layer is formed in the laser light irradiation area depends on the laser light irradiation conditions (for example, applied energy per unit area, average output, scan) Speed). In the present invention, when irradiating a region on the surface of the molded body where a conductive circuit is to be formed with laser light, the orientation direction of the non-conductive inorganic fibers such as glass fibers contained in the substrate made of the molded body is orthogonal to the orientation direction. By irradiating the laser beam in the intersecting direction, the applied energy per unit area of the laser beam can be reduced or the scanning speed can be increased.
導電回路形成のために好ましいレーザー光の照射パワーと、単位面積当たりの付与エネルギー範囲は、以下の通りである。レーザー光の照射装置は、少なくともレーザー出力が１．３Ｗ以上、単位面積当たりの付与エネルギーが０．３５Ｊ程度以上であることが好ましい。またレーザー光の波長は、２４８ｎｍ、３０８ｎｍ、３５５ｎｍ、５３２ｎｍ、１０６４ｎｍ、１０６００ｎｍ等が用いられる。またレーザー照射装置は、ＹＶＯ４レーザーパターニング装置を用いることが好ましい。また無電解めっきは、市販の無電解銅めっき液などを用いて、めっきを行うことができる。 The irradiation power of laser light and the range of applied energy per unit area that are preferable for forming a conductive circuit are as follows. It is preferable that the laser beam irradiation apparatus has at least a laser output of 1.3 W or more and an applied energy per unit area of about 0.35 J or more. The wavelength of the laser light is 248 nm, 308 nm, 355 nm, 532 nm, 1064 nm, 10600 nm, or the like. The laser irradiation device is preferably a YVO4 laser patterning device. Electroless plating can be performed using a commercially available electroless copper plating solution or the like.
図２は本発明の導電回路を有する成形体の他の例を示す斜視図である。図２に示す成形体は、補聴器等の内部立体回路基板である。同図に示すように、この回路基板１は、図中矢印Ｇ１及び矢印Ｇ２（図中、この方向を互いに直交するＸ、Ｙ、Ｚ軸のうちＸ軸方向とする）位置に射出成形のゲートを設けて、ガラス繊維入りのＰＢＴ及びスピネル型のＣｕＣｒ２Ｏ４黒色顔料配合物を射出成形して形成したものである。この回路基板は、上記ゲート位置の成形装置により成形されているので、矢印Ｇ１及びＧ２と同じ図中Ｘ軸方向にガラス繊維が配向している。更に回路基板の表面には、ガラス繊維の配向方向と直交する方向（Ｙ軸方向）に導電回路３が形成されている。本発明の成形体及び製造方法では、このようにゲートの配置等を適宜選択して成形を行うことで、導電回路を形成したい方向と直交するように成形体のガラス繊維を配向させることができる。 FIG. 2 is a perspective view showing another example of a molded body having a conductive circuit of the present invention. 2 is an internal three-dimensional circuit board such as a hearing aid. As shown in the figure, this circuit board 1 is formed by injection molding at the position of arrows G1 and G2 (in the figure, the direction is the X-axis direction among X, Y, and Z axes orthogonal to each other). Are formed by injection molding of a PBT containing glass fiber and a spinel-type CuCr 2 O 4 black pigment compound. Since this circuit board is formed by the forming device at the gate position, the glass fibers are oriented in the X-axis direction in the same drawing as the arrows G1 and G2. Furthermore, a conductive circuit 3 is formed on the surface of the circuit board in a direction (Y-axis direction) orthogonal to the glass fiber orientation direction. In the molded body and the manufacturing method of the present invention, the glass fibers of the molded body can be oriented so as to be orthogonal to the direction in which the conductive circuit is to be formed by appropriately selecting the gate arrangement and the like in this way. .
以下、本発明の実施例、比較例を示す。
実施例
ガラス繊維が３０質量％添加されたポリブチレンテレフタレート樹脂（ＢＡＳＦ社製：Ｕｌｔｒａｄｕｒ Ｂ４３００Ｇ６）を９５質量％に銅含有複合酸化物材料としてＣｕＣｒ２Ｏ４（フェロージャパン社製：ＰＫ３０９５）を５質量％添加した配合物を２軸成形機で混合し温度２５０℃程度でペレット化した。該ペレットを射出成形機でシートを成形した。
Examples of the present invention and comparative examples are shown below.
Example 5 mass of CuCr 2 O 4 (manufactured by Fellow Japan: PK3095) as a copper-containing composite oxide material with 95 mass% of polybutylene terephthalate resin (BASF: Ultradur B4300G6) added with 30 mass% of glass fiber. % Of the blended product was mixed with a biaxial molding machine and pelletized at a temperature of about 250 ° C. The pellet was formed into a sheet by an injection molding machine.
上記の成形シートに対し、レーザー照射装置（キーエンス社製：レーザーマーカーＭＤ−Ｖ９６２０）を用いて、ガラス繊維の配向方向に対し直交する方向にレーザー光（波長１０６４ｎｍ）を照射した。レーザー光の照射条件を種々の条件として種々の試料を作成した（このレーザ光の照射条件は後述する）。レーザー光を照射した成形シートを、イオン交換水（５０℃）で５分間超音波洗浄した後、無電解銅めっき液（Ｅｎｔｈｏｎｅ社製：Ｅｎｐｌａｔｅ Ｃｕ８７２）を用いて、ビーカーを空気攪拌しながらヒーターで温度保持をして、４３℃で４０分間処理して無電解めっきを行った。成形体のレーザー光の照射条件とめっき層の形成状態を観察した。その結果を図３のグラフに示す。 Laser light (wavelength 1064 nm) was irradiated to the above-mentioned molded sheet in a direction orthogonal to the orientation direction of the glass fiber using a laser irradiation device (manufactured by Keyence Corporation: Laser Marker MD-V9620). Various samples were prepared under various laser light irradiation conditions (the laser light irradiation conditions will be described later). The molded sheet irradiated with laser light is ultrasonically cleaned with ion-exchanged water (50 ° C.) for 5 minutes, and then an electroless copper plating solution (Enthone: Enplate Cu872) is used with a heater while stirring the beaker with air. The temperature was maintained, and electroless plating was performed by treating at 43 ° C. for 40 minutes. The laser beam irradiation conditions of the molded body and the formation state of the plating layer were observed. The result is shown in the graph of FIG.
比較例
図４に示すように、上記成形シートのガラス繊維２の配向方向と同じ方向ＤＬにレーザー光Ｌを照射した以外は上記実施例と同様に行って、成形体のレーザー光の照射条件とめっき層の形成状態を観察した。その結果を図５のグラフに示す。
Comparative Example As shown in FIG. 4, except that the laser beam L was irradiated in the same direction DL as the orientation direction of the glass fiber 2 of the molded sheet, the same as in the above example, The formation state of the plating layer was observed. The results are shown in the graph of FIG.
図３及び図５は、レーザー照射装置の平均出力と単位面積当たりの付与エネルギーの関係を示すグラフである。このグラフにおいて、めっき反応が起こったのは、図中点線の右側で且つ点線の上側となる範囲であった。この点線で示した点が、導電回路が形成されるレーザー光の照射エネルギーの閾値と言える。すなわち単位面積当たりの付与エネルギー或いはレーザー平均出力が、この閾値以上であれば、レーザー光を照射領域には、無電解めっきを行った際に導電回路が連続的に確実に形成されることを意味する。 3 and 5 are graphs showing the relationship between the average output of the laser irradiation apparatus and the applied energy per unit area. In this graph, the plating reaction occurred in the range on the right side of the dotted line and the upper side of the dotted line in the figure. It can be said that the point indicated by the dotted line is the threshold value of the irradiation energy of the laser beam for forming the conductive circuit. That is, if the applied energy per unit area or the laser average output is equal to or greater than this threshold value, it means that a conductive circuit is continuously and reliably formed in the region irradiated with laser light when electroless plating is performed. To do.
図３の実施例のグラフでは、めっき層が形成される閾値が、平均レーザ出力が１．３Ｗ以上、単位面積（１ｍｍ２）あたり付与エネルギーが０．０９６Ｊ以上である。そして、レーザー光照射のスキャン速度が、最高５０ｍｍ／ｓまでめっき層形成可能という結果が得られた。これに対し比較例は、図５のグラフに示すように、めっき層が形成される閾値は、平均レーザ出力が１．３Ｗ以上、単位面積（１ｍｍ２）あたり付与エネルギーが０．３５Ｊ以上である。そして、めっき層形成可能なレーザー光照射のスキャン速度は、１０ｍｍ／ｓ以下であった。 In the graph of the example of FIG. 3, the threshold for forming the plating layer is that the average laser output is 1.3 W or more, and the applied energy per unit area (1 mm 2 ) is 0.096 J or more. As a result, it was possible to form a plating layer up to a scanning speed of laser light irradiation of 50 mm / s at the maximum. In contrast, in the comparative example, as shown in the graph of FIG. 5, the threshold for forming the plating layer is that the average laser output is 1.3 W or more and the applied energy per unit area (1 mm 2 ) is 0.35 J or more. . And the scanning speed of the laser beam irradiation which can form a plating layer was 10 mm / s or less.
つまり実施例では、レーザー光の照射の際のスキャン速度が、比較例の１０ｍｍ／ｓの５倍の５０ｍｍ／ｓでもめっき層が形成されたのである。これは、成形シートのガラス繊維の配向方向と直交する方向にレーザー光を照射することで、単位面積当たりの付与エネルギーが比較例の１／５の場合でも、連続的にめっき層が形成されることを意味するものである。この実施例の結果は、本来めっき反応が起こりにくい条件であっても、本願発明によれば、めっき反応を促進させる効果があることを裏付けるものである。 That is, in the example, the plating layer was formed even when the scanning speed at the time of laser light irradiation was 50 mm / s, which is 5 times the 10 mm / s of the comparative example. By irradiating laser light in a direction orthogonal to the orientation direction of the glass fibers of the molded sheet, a plating layer is continuously formed even when the applied energy per unit area is 1/5 of the comparative example. It means that. The result of this example confirms that there is an effect of promoting the plating reaction according to the present invention even under conditions where the plating reaction hardly occurs.
１ 回路基板
２ ガラス繊維
３ 導電回路
Ｌ レーザー光
Ｒ ガラス繊維の配向方向と直交する方向
DESCRIPTION OF SYMBOLS 1 Circuit board 2 Glass fiber 3 Conductive circuit L Laser beam R The direction orthogonal to the orientation direction of glass fiber
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