WO2015145688A1 - Packing for substrate plating jig and substrate plating jig using same - Google Patents
Packing for substrate plating jig and substrate plating jig using same Download PDFInfo
- Publication number
- WO2015145688A1 WO2015145688A1 PCT/JP2014/058975 JP2014058975W WO2015145688A1 WO 2015145688 A1 WO2015145688 A1 WO 2015145688A1 JP 2014058975 W JP2014058975 W JP 2014058975W WO 2015145688 A1 WO2015145688 A1 WO 2015145688A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- packing
- plating jig
- plating
- jig
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Definitions
- the present invention relates to a packing for a plating jig used for plating a substrate and a plating jig using the same.
- plating jigs used in the electroplating method seal a portion of a substrate such as a semiconductor wafer where the current-carrying member contacts at the peripheral portion, and expose the surface to be plated on both the front surface and the back surface of the substrate so that it can be detached.
- a holding substrate holder is provided, and the substrate holder is immersed in a plating solution together with the substrate to plate the surface to be plated of the substrate.
- an endless elastic member molded in a ring shape As such a packing, as disclosed in the following patent documents, an endless elastic member molded in a ring shape, a so-called O-ring is generally used.
- the O-ring is arranged in a double concentric shape on the back surface of the substrate pressing portion of the substrate holder, and the substrate is sandwiched between the substrate pressing portion and the support portion.
- the substrate is provided so as to be in pressure contact with the surface of the substrate and the upper surface of the substrate support portion.
- O-rings are disposed on the back surface of the substrate pressing portion of the substrate holder and the upper surface of the substrate supporting portion, respectively, and when the substrate is sandwiched between the substrate pressing portion and the supporting portion, It is provided so as to be in pressure contact with the front surface of the substrate and the back surface of the substrate pressing portion.
- these O-rings arranged in duplicate are pressed between the inner surface and the outer ring by being pressed against the surface of the substrate and the upper surface of the substrate supporting portion, or the surface of the substrate and the rear surface of the substrate pressing portion.
- the sealed area is sealed from the penetration of the plating solution.
- the portion where the energizing member is in contact with the peripheral portion of the substrate surface and the portion where the energizing member of the substrate support is provided are protected from the plating solution.
- an endless elastic member with a low production cost and a wide variety of types is used to connect both ends of the endless member such as an O-ring. It is conceivable to form a seal member.
- the substrate plating jig fixes the substrate pressing portion against the substrate support portion when sandwiching the substrate, and releases the pressure contact when the plating substrate is attached / detached.
- the pressing and releasing of the pressing at the connecting portion of the end will be repeated, and if the connecting end is not properly fixed, a gap or a step is formed at the connecting portion, and the sealing effect is impaired. There was a possibility.
- the present invention overcomes the disadvantages of conventional packing for substrate plating jigs and substrate plating jigs using the same, and can provide a sealing effect equivalent to that of conventional O-rings, and is cost-effective compared to O-rings.
- a packing body comprising a packing body made of an elastic member having a long end, and a connecting member for connecting the connecting ends of both ends of the packing body to each other so as to be endless. It consists of a shaft part and a plurality of hooks that project at a predetermined angle to both sides or one side of the shaft part. When connecting both connection ends of the packing body, the connection member is connected to the connected connection end.
- a packing for a substrate plating jig wherein the packing is provided so as to extend from a connection end into both packing bodies within a predetermined range across a joint.
- the present invention also includes a substrate holder having a substrate accommodating portion on the upper surface, an opening for exposing a surface to be plated of the substrate, a substrate pressing portion for sandwiching and holding the substrate together with the substrate holder, and a substrate with respect to the substrate holder. It has a fixing means for fixing the pressing portion in a pressure contact state, and a part of the packing according to the present invention is exposed from the groove portion in the groove portion recessed in the back surface of the substrate pressing portion (and the upper surface of the substrate support portion). And the part that is exposed from the groove of the packing is in pressure contact with the substrate surface and the upper surface of the substrate holder (or the back surface of the substrate pressing part).
- the substrate plating jig is characterized in that the peripheral portion of the substrate and the portion provided with the energizing member around the substrate housing portion are sealed from the plating solution.
- the packing for a substrate plating jig of the present invention is connected to the both ends of the endless packing body by a connecting member to be in an endless state, the length of the packing body can be adjusted as appropriate, and the plating process is performed. It is possible to form an endless packing that matches the size and shape of the substrate and the size and shape of the substrate pressing portion that holds the substrate.
- the packing for a substrate plating jig of the present invention can use an extruded elastic member, so that the manufacturing cost is low.
- the existing end-spun string-like or tube-like member that can be used as the material for the packing for the substrate plating jig of the present invention is suitably suitable depending on the composition of the plating solution because of its wide variety of chemical-resistant materials. It is possible to select a chemical-resistant member, and furthermore, since there are a wide variety of elastic forces, it is possible to select a member having a preferable elastic force as appropriate according to the plating jig.
- the plating jig using the packing for a substrate plating jig according to the present invention is a portion in which a current-carrying member is provided around the periphery of the substrate and the periphery of the substrate housing portion due to a sealing effect similar to that of packing using a conventional O-ring. Can be protected from the plating solution.
- the plating jig using the packing for the substrate plating jig of the present invention in which the packing is provided in two upper and lower stages can appropriately select different material types of packing in the upper stage and the lower stage. It is possible to achieve an elastic strength that can provide a high sealing effect, or to achieve chemical resistance according to the composition of the plating solution.
- the top view of the connection member of the packing for plating jigs of this invention (A) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of this invention with the connection member. (B) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of another aspect of this invention with the connection member. (C) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of another aspect of this invention with the connection member. (A) The top view which shows the procedure which connects and fixes the connection end of the packing for plating jigs of this invention with a connection member.
- the packing of the present invention is for connecting a packing main body 1 formed of a long end-shaped elastic material into a tube shape or a string shape and both ends of the packing main body 1 (hereinafter referred to as “connection ends”). It consists of a connecting member 2.
- the packing body 1 is preferably manufactured by extrusion which is advantageous in terms of manufacturing cost, but the manufacturing method is not limited to this.
- the packing main body 1 can be used as an endless ring-shaped, quadrangular, or other shape sealing member by connecting and fixing the two connecting ends to each other with a connecting member 2.
- the size in the circumferential direction as the packing when the two connection ends are connected can be arbitrarily determined by cutting it to an appropriate length.
- the packing body 1 can suitably use an existing end-shaped elastic material. Specifically, the packing body 1 does not have a tube-like one having an air core part therein or an air core part inside. Although a string-like thing can be utilized, the tube-like thing which has an air core part from the ease of attachment of the connection member 2 is preferable.
- the cross-sectional shape is preferably a circular shape, and in the case of a string shape, the cross-sectional shape is not limited to a circular shape, and may be an elliptical shape or a polygonal shape including a quadrangle.
- the material of the packing body 1 can be appropriately changed according to the composition of the plating chemical. Specifically, in addition to natural rubber, nitrile rubber, silicone rubber, acrylic rubber, styrene butadiene rubber, chloroprene rubber, fluoro rubber, Synthetic rubber such as ethylene propylene rubber, tetrafluoroethylene rubber (Teflon (registered trademark)), vinyl chloride resin and the like can be suitably used.
- FIG. 1 is a plan view of the connecting member 2.
- the connecting member 2 includes a shaft portion 21 formed in a rod shape or a plate shape, and a plurality of hooks 22 provided so as to protrude from the shaft portion 21 to both sides.
- the hook 22 is formed at both end portions 211 of the shaft portion 21 so as to protrude from the shaft portion 21 at an angle ⁇ within a predetermined range.
- the range of the angle ⁇ is preferably 30 ° to 90 °, more preferably 45 ° to 70 °. That is, when the protrusion angle ⁇ of the hook 22 is the maximum, as shown in FIG.
- the hook 22 protrudes from the shaft portion 21 in a right angle direction, and when the angle is less than that, the shaft portion 21 has a protrusion angle ⁇ as shown in FIG. It protrudes from the end side to the center side.
- the hook 22 may protrude from the end portion 211 of the shaft portion 21 as in the present embodiment.
- the hook 22 is not necessarily limited to the end portion 211 and protrudes slightly from the center of the shaft portion 21 near the end portion 211. May be.
- the hook 22 may protrude from the shaft portion 21 to both sides as in this embodiment, but may be protruded from the shaft portion 21 to one side as in the embodiment of FIG.
- the length of the shaft portion 21 of the connecting member 2 is preferably 2 to 8 times the outer diameter of the packing body 1 (before deformation), and the hook 22 has the outer diameter of the packing body 1 (state before deformation). A length reaching 0.5 to 0.9 times that of (in) is preferred.
- FIG. 2 is a horizontal sectional view showing a state in which the connection end 11 of the tubular packing body 1 is connected by the connection member 2.
- the two connection ends 11 abutted from the left and right are both end portions of the same packing body 1.
- both connection ends 11 of the packing body 1 are connected so that the connection end faces abut each other.
- the shaft portion 21 is substantially parallel to the axis X of the packing body 1, and both packing bodies 1 are connected from the connecting end 11 within a predetermined range across the joint between the two connecting ends 11. It is installed so as to extend inside.
- the range extending from the connection end 11 is defined by the length of the shaft portion 21.
- connection member 2 when the packing body 1 is formed in a tube shape, the connection member 2 is accommodated in the air core portion 12 of the packing body 1. Then, the tip end side of the hook 22 protruding from the end portion 211 of the shaft portion 21 bites or pierces the inner wall 13 of the air core portion 12. As described above, the hook 22 protruding at a predetermined angle from the shaft portion 21 bites or pierces the inner wall of the packing body 1, thereby causing resistance in the direction in which the connecting member 2 is pulled out from the packing body 1. As a result, both connection ends 11 of the packing body 1 are connected and fixed in a butted state.
- connection member 2 is completely embedded in the packing body 1. That is, the connection member 2 is inserted and inserted from the connection end 11 along the axial center of the packing body 1, and the connection member 2 itself is inserted into the packing body 1. Further, since the hook 22 protruding at a predetermined angle from the shaft portion 21 is also stuck in the packing body 1, resistance to the direction in which the connecting member 2 is pulled out from the packing body 1 is generated, and both the packing body 1 are connected. The end 11 is fixed in a butted state.
- connection end 11 of the packing body 1 using the connection member 2 of the present invention.
- the end portion 211 of the shaft portion 21 is inserted into the air core portion 12 from the one connection end 11 side (FIG. 3 a).
- the shaft portion 21 is inserted as it is, and the hook 22 portion is further inserted into the air core portion 12.
- the vicinity of the connection end 11 is crushed by pressing it with a finger from above and below, and the cross-sectional shape of the air core portion 12 is expanded to be an elliptical shape.
- the wide hook 22 can be easily inserted into the air core 12.
- connection member 2 exposed to the outside from the connection end 11 is inserted into the air core portion 12 from the other connection end 11 side of the packing body 1.
- shaft portion 21 is inserted as it is, and the hook 22 portion is further inserted into the air core portion 12.
- the insertion is advanced to a position where the connection end surfaces of both connection ends 11 come into contact with each other, and the remaining hooks 22 are locked to the inner wall 13 to complete the connection and fixing of the connection ends 11 (FIG. 3c). In this state, since all the hooks 22 are locked to the inner wall 13, resistance in a direction in which the connection ends 11 are separated from each other is generated and can be fixed in a connected state.
- connection method of the connection end 11 of the string-like packing body 1 that does not have an air core portion is basically the same procedure as that of the tube-like packing body 1.
- the shaft portion 21 and the hook 22 are inserted into the packing body 1 from the end surface of the connection end 11 because the shaft portion 21 and the hook 22 are not provided with the air core portion 12. Is inserted.
- the plating jig that can use the packing of the present invention is not limited to a type that performs plating on only one side of the substrate described below, but includes other types including a type that performs plating on both the front and back sides of the substrate at the same time. It can be widely used for various substrate plating jigs.
- the plating jig 3 of the present invention is provided with a substrate holder 4 having a substrate accommodating portion 41 on the upper surface, and is attached to the substrate holder 4 so as to be openable and closable. And a clamping member 6 as means for fixing the substrate pressing portion 5 to the substrate holder 4 in a pressure contact state.
- the packing of the present invention is attached to the substrate pressing portion 5.
- the substrate holder 4 is attached in a horizontal state to a main body portion 41 formed in a substantially square shape, an arm portion 42 extending upward from the upper end of the main body portion 41, and the upper end of the arm portion 42.
- Hanger part 43 A housing portion 411 for housing a substrate is provided in the center of the main body portion 41, and an external electrode is provided around the housing portion 411 and is sealed by a packing 1 of a substrate pressing portion 5 described later.
- the hanger portion 43 is formed so as to protrude from the left and right sides of the width of the main body portion 41 so that both end portions thereof can be hooked to the wall surface of the plating tank, and an external electrode terminal is provided in a part thereof.
- the external electrode terminal is connected to a conductor that leads from the hanger portion 43 to the first energization member 412 through the arm portion 42 and the main body portion 41.
- the power feeding method for the substrate is not limited to that of the plating jig of the present invention, and a general method can be appropriately employed.
- the substrate pressing portion 5 includes a frame portion 51 having a square opening 53 that exposes a surface to be plated of the substrate, and an attachment portion 52 that extends from the frame portion 51 to the substrate holder 4 side.
- the frame 51 has an inner dimension (opening dimension) smaller than the outer dimension of the substrate 51 so that the peripheral edge of the substrate is covered when the substrate is held, and the outer dimension of the frame 51 is the outer dimension of the substrate. It is formed to be larger.
- the substrate pressing portion 5 is rotatably attached to the hinge portion 44 of the substrate holder 4 at the mounting portion 52, and the substrate pressing portion 5 is closed and pressed onto the substrate holder 4 to sandwich the substrate therebetween. Can be held.
- FIG. 4 shows a state where the substrate pressing portion 5 is opened.
- the frame portion 51 is formed in a substantially square shape, but the shape of the frame portion is not limited to this, and may be a ring shape or other shapes depending on the shape of the substrate. Moreover, there is no restriction
- the second energization member 7 is provided on the entire back surface of the frame portion 51.
- packing according to the present invention is provided in a double manner along the inner and outer peripheries of the frame portion 51.
- These packing 1 a and packing 1 b are inserted into a groove portion 511 that is recessed in the back surface of the frame portion 51 so that a part thereof is exposed from the groove portion 511.
- the exposed part of packing 1a, 1b is press-contacted to the board
- the packing is provided on the substrate pressing portion 5 side, but the packing 1b provided outside the second energizing member 7 is not the substrate pressing portion 5 but the main body portion of the substrate holder 4. It may be provided on the upper surface of 41.
- FIG. 5 is a partial cross-sectional view of the substrate W held by the plating jig of the present invention.
- the substrate W is placed on the substrate accommodating portion 411 of the substrate holder 4 and is sandwiched between the substrate pressing portions 5.
- the substrate holder 4 and the substrate pressing portion 5 are sandwiched by clamp members 6 having a substantially U-shaped cross section from the peripheral wall side and are fixed in a pressure contact state.
- the fixing means for the substrate holder 4 and the substrate pressing portion 5 is not limited to this, and may be fixed by tightening a bolt or the like.
- the packing 1a portion exposed from the groove portion 511a on the back surface of the substrate pressing portion 5 is pressed against the surface of the substrate W, and the packing 1b portion exposed from the groove portion 511b is the substrate.
- the holder 4 is in pressure contact with the upper surface of the main body 41.
- a groove portion that can accommodate the packing 1b portion exposed from the groove portion 511 may be recessed in the upper surface portion of the main body portion 41 to which the packing 1b is pressed. Further, a packing may be further provided on the upper surface portion of the main body portion 41 to which the packing 1b is pressed, and the packings may come into contact with each other for sealing.
- the packing attached to the main body 41 of the substrate holder 4 may be a normal O-ring, but may be a packing according to the present invention.
- the packing attached to the substrate pressing portion 5 or the substrate holder 4 may be provided in one step per groove portion 511 as shown in FIG.
- one groove portion 511 may be provided in two upper and lower stages.
- the upper and lower packings may be the same, but may be different types in the upper and lower sides.
- the lower packing may be a string-like packing having no air core
- the upper packing may be a tube having an air core (FIG. 6c), or the lower packing. May be a tube having an air core
- the upper packing may be a string-like packing having no air core.
- the upper and lower stages when provided in two upper and lower stages, may be of the same shape and different elastic materials, or may have different chemical resistance in the upper and lower stages.
- the upper packing it is preferable to use an upper packing exposed to the outside having high chemical resistance.
- the ended packing according to the present invention may be used for one of the upper and lower stages, and the other endless packing such as an O-ring may be used.
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Abstract
Description
2 … … 接続部材
3 … … めっき治具
4 … … 基板ホルダ
5 … … 基板押さえ部
6 … … クランプ部材
7 … … 第二通電部材
11 … … 接続端
12 … … 空芯部
13 … … 内壁
21 … … 軸部
22 … … フック
41 … … 本体部
42 … … アーム部
43 … … ハンガー部
44 … … ヒンジ部
51 … … 枠部
52 … … 取付部
53 … … 開口部
211 … … 端部
411 … … 収容部
412 … … 第一通電部材
θ … … フックの突出角度
X … … 軸芯
W … … 基板
DESCRIPTION OF
52…… Mounting
Claims (8)
- めっき治具に取り付けられ、基板に通電するための通電部材と該通電部材が接する基板表面部分をめっき液からシールするための基板めっき治具用パッキンであって、長尺有端状の弾性部材からなるパッキン本体と、該パッキン本体の両端部の接続端を互いに連接して無端状とするための接続部材とを備え、該接続部材は、軸部と、該軸部の両側もしくは片側一方へ所定の角度で突出して設けられた複数のフックからなり、パッキン本体の両方の接続端を連接するとき、該接続部材は連接された接続端のつなぎ目にまたがって所定の範囲で接続端から双方のパッキン本体内に延伸するように内設されることを特徴とする基板めっき治具用パッキン。 A long-end elastic member that is attached to a plating jig and is a packing for a substrate plating jig for sealing a current-carrying member for energizing the substrate and a substrate surface portion in contact with the current-carrying member from the plating solution. And a connecting member for connecting the connecting ends of both end portions of the packing body to each other so as to be endless. The connecting member is connected to the shaft portion and both sides or one side of the shaft portion. It consists of a plurality of hooks projecting at a predetermined angle, and when connecting both connecting ends of the packing body, the connecting member extends from the connecting end to the both ends of the connecting end across the joint of the connected connecting ends. A packing for a substrate plating jig, wherein the packing is provided so as to extend into the packing body.
- 前記フックは、前記軸部より30°~90°の範囲の角度で突出するように形成されていることを特徴とする請求項1に記載の基板めっき治具用パッキン。 2. The packing for a substrate plating jig according to claim 1, wherein the hook is formed so as to protrude from the shaft portion at an angle in a range of 30 ° to 90 °.
- 前記パッキン本体が空芯部を有するチューブ状であることを特徴とする請求項1または2のいずれかに記載の基板めっき治具用パッキン。 3. The packing for a substrate plating jig according to claim 1, wherein the packing body is in a tube shape having an air core part.
- 前記パッキン本体がチューブ状であって、前記接続部材の軸部は該パッキン本体の空芯部内に収容されるとともに、前記フックの先端側が空芯部の内壁に食い込み、もしくは刺さることにより係止していることを特徴とする請求項1または2のいずれかに記載の基板めっき治具用パッキン。 The packing body is tube-shaped, and the shaft portion of the connecting member is accommodated in the air core portion of the packing body, and the front end side of the hook is engaged with the inner wall of the air core portion to be locked. The packing for a substrate plating jig according to claim 1, wherein the packing is for a substrate plating jig.
- 上面に基板収容部を備えた基板ホルダと、基板の被めっき面を露出させる開口を備え、基板ホルダとともに基板を挟み込んで保持する基板押さえ部と、基板ホルダに対して基板押さえ部を圧接状態で固定するための固定手段を備えた基板めっき治具であって、基板押さえ部の裏面に凹設された溝部に請求項1ないし4のいずれかに記載のパッキンが一部を溝部から露出するように挿設され、基板押さえ部が基板支持部に対して圧接状態にて固定されることにより、パッキンの溝部から露出した部分が基板表面と基板ホルダの上面に圧接され、基板の周縁部および基板収容部の周囲における通電部材が設けられた部分をめっき液よりシールすることを特徴とする基板めっき治具。 A substrate holder having a substrate housing portion on the upper surface, an opening for exposing the surface to be plated of the substrate, a substrate pressing portion for holding the substrate sandwiched together with the substrate holder, and the substrate pressing portion in pressure contact with the substrate holder A substrate plating jig provided with a fixing means for fixing, wherein the packing according to any one of claims 1 to 4 is partially exposed from the groove portion in the groove portion provided in the back surface of the substrate pressing portion. When the substrate pressing portion is fixed to the substrate support portion in a pressure contact state, the portion exposed from the groove portion of the packing is pressed against the substrate surface and the upper surface of the substrate holder, and the peripheral portion of the substrate and the substrate A substrate plating jig, wherein a portion provided with a current-carrying member around a housing portion is sealed from a plating solution.
- 上面に基板収容部を備えた基板ホルダと、基板の被めっき面を露出させる開口を備え、基板ホルダとともに基板を挟み込んで保持する基板押さえ部と、基板ホルダに対して基板押さえ部を圧接状態で固定するための固定手段を備えた基板めっき治具であって、基板押さえ部の裏面および基板支持部の上面に凹設された溝部に請求項1ないし4のいずれかに記載のパッキンが一部を溝部から露出するようにそれぞれ挿設され、基板押さえ部が基板支持部に対して圧接状態にて固定されることにより、パッキンの一部が基板表面と基板押さえ部の裏面に圧接され、基板の周縁部および基板収容部の周囲における通電部材が設けられた部分をめっき液よりシールすることを特徴とする基板めっき治具。 A substrate holder having a substrate housing portion on the upper surface, an opening for exposing the surface to be plated of the substrate, a substrate pressing portion for holding the substrate sandwiched together with the substrate holder, and the substrate pressing portion in pressure contact with the substrate holder 5. A substrate plating jig provided with a fixing means for fixing, wherein the packing according to any one of claims 1 to 4 is partially formed in a groove provided in a back surface of the substrate pressing portion and an upper surface of the substrate support portion. Are inserted so as to be exposed from the groove portions, and the substrate pressing portion is fixed in pressure contact with the substrate supporting portion, so that a part of the packing is pressed against the substrate surface and the back surface of the substrate pressing portion. A substrate plating jig, wherein a portion provided with a current-carrying member in the periphery of the substrate and the periphery of the substrate housing portion is sealed with a plating solution.
- 前記パッキンが1箇所の前記溝部につき上下2段に設けられていることを特徴とする請求項5または6のいずれかに記載の基板めっき治具。 The substrate plating jig according to claim 5 or 6, wherein the packing is provided in two upper and lower stages per one groove portion.
- 前記上下2段に設けられたパッキンのいずれか一方が空芯部を有するチューブ状のパッキンであり、他方が空芯部を有さないヒモ状のパッキンであることを特徴とする請求項7に記載の基板めっき治具。
8. One of the packings provided in the two upper and lower stages is a tube-like packing having an air core part, and the other is a string-like packing having no air core part. The substrate plating jig described.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/058975 WO2015145688A1 (en) | 2014-03-27 | 2014-03-27 | Packing for substrate plating jig and substrate plating jig using same |
US15/127,936 US20170096744A1 (en) | 2014-03-27 | 2014-03-27 | Packing for substrate plating jig and substrate plating jig using the same |
JP2016509771A JPWO2015145688A1 (en) | 2014-03-27 | 2014-03-27 | Packing for substrate plating jig and substrate plating jig using the same |
CN201480077157.2A CN106103813A (en) | 2014-03-27 | 2014-03-27 | Substrate plating fixture liner and utilize its substrate plating fixture |
KR1020167025772A KR20160138018A (en) | 2014-03-27 | 2014-03-27 | Packing for substrate plating jig and substrate plating jig using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2014/058975 WO2015145688A1 (en) | 2014-03-27 | 2014-03-27 | Packing for substrate plating jig and substrate plating jig using same |
Publications (1)
Publication Number | Publication Date |
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WO2015145688A1 true WO2015145688A1 (en) | 2015-10-01 |
Family
ID=54194278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/058975 WO2015145688A1 (en) | 2014-03-27 | 2014-03-27 | Packing for substrate plating jig and substrate plating jig using same |
Country Status (5)
Country | Link |
---|---|
US (1) | US20170096744A1 (en) |
JP (1) | JPWO2015145688A1 (en) |
KR (1) | KR20160138018A (en) |
CN (1) | CN106103813A (en) |
WO (1) | WO2015145688A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019021607A1 (en) * | 2017-07-25 | 2019-01-31 | 上村工業株式会社 | Work holding jig and electroplating apparatus |
JP7478109B2 (en) | 2021-02-24 | 2024-05-02 | 株式会社東芝 | Method for manufacturing semiconductor device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7085968B2 (en) * | 2018-11-15 | 2022-06-17 | 株式会社荏原製作所 | Board holder, plating equipment and board plating method |
JP7132135B2 (en) * | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | Work holding jig and electroplating device |
JP7132136B2 (en) * | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | Work holding jig and electroplating device |
JP7132134B2 (en) * | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | Work holding jig and electroplating device |
JP7256027B2 (en) * | 2019-02-20 | 2023-04-11 | 株式会社荏原製作所 | Substrate holder and plating apparatus equipped with the substrate holder |
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JPH0518465A (en) * | 1991-07-11 | 1993-01-26 | Nec Corp | Sealing structure for vacuum device |
JPH09100917A (en) * | 1995-10-06 | 1997-04-15 | Iwata Seisakusho:Kk | Seal rubber connecting member |
JP2003226997A (en) * | 2002-02-06 | 2003-08-15 | Sony Corp | Semi-conductor wafer plating tool |
JP2003301299A (en) * | 2002-04-12 | 2003-10-24 | Yamamoto Mekki Shikenki:Kk | Cathode cartridge of electroplating tester |
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JP2006070311A (en) * | 2004-09-01 | 2006-03-16 | Sumino Kogyo Kk | Suspension hanger device for coating |
US7829001B2 (en) * | 2006-06-30 | 2010-11-09 | Federal-Mogul World Wide, Inc. | Cold static gasket for complex geometrical sealing applications |
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2014
- 2014-03-27 CN CN201480077157.2A patent/CN106103813A/en active Pending
- 2014-03-27 WO PCT/JP2014/058975 patent/WO2015145688A1/en active Application Filing
- 2014-03-27 KR KR1020167025772A patent/KR20160138018A/en not_active Application Discontinuation
- 2014-03-27 JP JP2016509771A patent/JPWO2015145688A1/en active Pending
- 2014-03-27 US US15/127,936 patent/US20170096744A1/en not_active Abandoned
Patent Citations (6)
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JPS61127931U (en) * | 1985-01-29 | 1986-08-11 | ||
JPH0399063U (en) * | 1990-01-26 | 1991-10-16 | ||
JPH0518465A (en) * | 1991-07-11 | 1993-01-26 | Nec Corp | Sealing structure for vacuum device |
JPH09100917A (en) * | 1995-10-06 | 1997-04-15 | Iwata Seisakusho:Kk | Seal rubber connecting member |
JP2003226997A (en) * | 2002-02-06 | 2003-08-15 | Sony Corp | Semi-conductor wafer plating tool |
JP2003301299A (en) * | 2002-04-12 | 2003-10-24 | Yamamoto Mekki Shikenki:Kk | Cathode cartridge of electroplating tester |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2019021607A1 (en) * | 2017-07-25 | 2019-01-31 | 上村工業株式会社 | Work holding jig and electroplating apparatus |
JP2019026863A (en) * | 2017-07-25 | 2019-02-21 | 上村工業株式会社 | Work-piece holding jig and electroplating device |
TWI759504B (en) * | 2017-07-25 | 2022-04-01 | 日商上村工業股份有限公司 | Workpiece holding jig and electroplating device |
JP7478109B2 (en) | 2021-02-24 | 2024-05-02 | 株式会社東芝 | Method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPWO2015145688A1 (en) | 2017-04-13 |
KR20160138018A (en) | 2016-12-02 |
CN106103813A (en) | 2016-11-09 |
US20170096744A1 (en) | 2017-04-06 |
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