WO2015145688A1 - Packing for substrate plating jig and substrate plating jig using same - Google Patents

Packing for substrate plating jig and substrate plating jig using same Download PDF

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Publication number
WO2015145688A1
WO2015145688A1 PCT/JP2014/058975 JP2014058975W WO2015145688A1 WO 2015145688 A1 WO2015145688 A1 WO 2015145688A1 JP 2014058975 W JP2014058975 W JP 2014058975W WO 2015145688 A1 WO2015145688 A1 WO 2015145688A1
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WO
WIPO (PCT)
Prior art keywords
substrate
packing
plating jig
plating
jig
Prior art date
Application number
PCT/JP2014/058975
Other languages
French (fr)
Japanese (ja)
Inventor
村山 隆史
Original Assignee
株式会社Jcu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Jcu filed Critical 株式会社Jcu
Priority to PCT/JP2014/058975 priority Critical patent/WO2015145688A1/en
Priority to US15/127,936 priority patent/US20170096744A1/en
Priority to JP2016509771A priority patent/JPWO2015145688A1/en
Priority to CN201480077157.2A priority patent/CN106103813A/en
Priority to KR1020167025772A priority patent/KR20160138018A/en
Publication of WO2015145688A1 publication Critical patent/WO2015145688A1/en

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004Sealing devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005Contacting devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated

Definitions

  • the present invention relates to a packing for a plating jig used for plating a substrate and a plating jig using the same.
  • plating jigs used in the electroplating method seal a portion of a substrate such as a semiconductor wafer where the current-carrying member contacts at the peripheral portion, and expose the surface to be plated on both the front surface and the back surface of the substrate so that it can be detached.
  • a holding substrate holder is provided, and the substrate holder is immersed in a plating solution together with the substrate to plate the surface to be plated of the substrate.
  • an endless elastic member molded in a ring shape As such a packing, as disclosed in the following patent documents, an endless elastic member molded in a ring shape, a so-called O-ring is generally used.
  • the O-ring is arranged in a double concentric shape on the back surface of the substrate pressing portion of the substrate holder, and the substrate is sandwiched between the substrate pressing portion and the support portion.
  • the substrate is provided so as to be in pressure contact with the surface of the substrate and the upper surface of the substrate support portion.
  • O-rings are disposed on the back surface of the substrate pressing portion of the substrate holder and the upper surface of the substrate supporting portion, respectively, and when the substrate is sandwiched between the substrate pressing portion and the supporting portion, It is provided so as to be in pressure contact with the front surface of the substrate and the back surface of the substrate pressing portion.
  • these O-rings arranged in duplicate are pressed between the inner surface and the outer ring by being pressed against the surface of the substrate and the upper surface of the substrate supporting portion, or the surface of the substrate and the rear surface of the substrate pressing portion.
  • the sealed area is sealed from the penetration of the plating solution.
  • the portion where the energizing member is in contact with the peripheral portion of the substrate surface and the portion where the energizing member of the substrate support is provided are protected from the plating solution.
  • an endless elastic member with a low production cost and a wide variety of types is used to connect both ends of the endless member such as an O-ring. It is conceivable to form a seal member.
  • the substrate plating jig fixes the substrate pressing portion against the substrate support portion when sandwiching the substrate, and releases the pressure contact when the plating substrate is attached / detached.
  • the pressing and releasing of the pressing at the connecting portion of the end will be repeated, and if the connecting end is not properly fixed, a gap or a step is formed at the connecting portion, and the sealing effect is impaired. There was a possibility.
  • the present invention overcomes the disadvantages of conventional packing for substrate plating jigs and substrate plating jigs using the same, and can provide a sealing effect equivalent to that of conventional O-rings, and is cost-effective compared to O-rings.
  • a packing body comprising a packing body made of an elastic member having a long end, and a connecting member for connecting the connecting ends of both ends of the packing body to each other so as to be endless. It consists of a shaft part and a plurality of hooks that project at a predetermined angle to both sides or one side of the shaft part. When connecting both connection ends of the packing body, the connection member is connected to the connected connection end.
  • a packing for a substrate plating jig wherein the packing is provided so as to extend from a connection end into both packing bodies within a predetermined range across a joint.
  • the present invention also includes a substrate holder having a substrate accommodating portion on the upper surface, an opening for exposing a surface to be plated of the substrate, a substrate pressing portion for sandwiching and holding the substrate together with the substrate holder, and a substrate with respect to the substrate holder. It has a fixing means for fixing the pressing portion in a pressure contact state, and a part of the packing according to the present invention is exposed from the groove portion in the groove portion recessed in the back surface of the substrate pressing portion (and the upper surface of the substrate support portion). And the part that is exposed from the groove of the packing is in pressure contact with the substrate surface and the upper surface of the substrate holder (or the back surface of the substrate pressing part).
  • the substrate plating jig is characterized in that the peripheral portion of the substrate and the portion provided with the energizing member around the substrate housing portion are sealed from the plating solution.
  • the packing for a substrate plating jig of the present invention is connected to the both ends of the endless packing body by a connecting member to be in an endless state, the length of the packing body can be adjusted as appropriate, and the plating process is performed. It is possible to form an endless packing that matches the size and shape of the substrate and the size and shape of the substrate pressing portion that holds the substrate.
  • the packing for a substrate plating jig of the present invention can use an extruded elastic member, so that the manufacturing cost is low.
  • the existing end-spun string-like or tube-like member that can be used as the material for the packing for the substrate plating jig of the present invention is suitably suitable depending on the composition of the plating solution because of its wide variety of chemical-resistant materials. It is possible to select a chemical-resistant member, and furthermore, since there are a wide variety of elastic forces, it is possible to select a member having a preferable elastic force as appropriate according to the plating jig.
  • the plating jig using the packing for a substrate plating jig according to the present invention is a portion in which a current-carrying member is provided around the periphery of the substrate and the periphery of the substrate housing portion due to a sealing effect similar to that of packing using a conventional O-ring. Can be protected from the plating solution.
  • the plating jig using the packing for the substrate plating jig of the present invention in which the packing is provided in two upper and lower stages can appropriately select different material types of packing in the upper stage and the lower stage. It is possible to achieve an elastic strength that can provide a high sealing effect, or to achieve chemical resistance according to the composition of the plating solution.
  • the top view of the connection member of the packing for plating jigs of this invention (A) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of this invention with the connection member. (B) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of another aspect of this invention with the connection member. (C) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of another aspect of this invention with the connection member. (A) The top view which shows the procedure which connects and fixes the connection end of the packing for plating jigs of this invention with a connection member.
  • the packing of the present invention is for connecting a packing main body 1 formed of a long end-shaped elastic material into a tube shape or a string shape and both ends of the packing main body 1 (hereinafter referred to as “connection ends”). It consists of a connecting member 2.
  • the packing body 1 is preferably manufactured by extrusion which is advantageous in terms of manufacturing cost, but the manufacturing method is not limited to this.
  • the packing main body 1 can be used as an endless ring-shaped, quadrangular, or other shape sealing member by connecting and fixing the two connecting ends to each other with a connecting member 2.
  • the size in the circumferential direction as the packing when the two connection ends are connected can be arbitrarily determined by cutting it to an appropriate length.
  • the packing body 1 can suitably use an existing end-shaped elastic material. Specifically, the packing body 1 does not have a tube-like one having an air core part therein or an air core part inside. Although a string-like thing can be utilized, the tube-like thing which has an air core part from the ease of attachment of the connection member 2 is preferable.
  • the cross-sectional shape is preferably a circular shape, and in the case of a string shape, the cross-sectional shape is not limited to a circular shape, and may be an elliptical shape or a polygonal shape including a quadrangle.
  • the material of the packing body 1 can be appropriately changed according to the composition of the plating chemical. Specifically, in addition to natural rubber, nitrile rubber, silicone rubber, acrylic rubber, styrene butadiene rubber, chloroprene rubber, fluoro rubber, Synthetic rubber such as ethylene propylene rubber, tetrafluoroethylene rubber (Teflon (registered trademark)), vinyl chloride resin and the like can be suitably used.
  • FIG. 1 is a plan view of the connecting member 2.
  • the connecting member 2 includes a shaft portion 21 formed in a rod shape or a plate shape, and a plurality of hooks 22 provided so as to protrude from the shaft portion 21 to both sides.
  • the hook 22 is formed at both end portions 211 of the shaft portion 21 so as to protrude from the shaft portion 21 at an angle ⁇ within a predetermined range.
  • the range of the angle ⁇ is preferably 30 ° to 90 °, more preferably 45 ° to 70 °. That is, when the protrusion angle ⁇ of the hook 22 is the maximum, as shown in FIG.
  • the hook 22 protrudes from the shaft portion 21 in a right angle direction, and when the angle is less than that, the shaft portion 21 has a protrusion angle ⁇ as shown in FIG. It protrudes from the end side to the center side.
  • the hook 22 may protrude from the end portion 211 of the shaft portion 21 as in the present embodiment.
  • the hook 22 is not necessarily limited to the end portion 211 and protrudes slightly from the center of the shaft portion 21 near the end portion 211. May be.
  • the hook 22 may protrude from the shaft portion 21 to both sides as in this embodiment, but may be protruded from the shaft portion 21 to one side as in the embodiment of FIG.
  • the length of the shaft portion 21 of the connecting member 2 is preferably 2 to 8 times the outer diameter of the packing body 1 (before deformation), and the hook 22 has the outer diameter of the packing body 1 (state before deformation). A length reaching 0.5 to 0.9 times that of (in) is preferred.
  • FIG. 2 is a horizontal sectional view showing a state in which the connection end 11 of the tubular packing body 1 is connected by the connection member 2.
  • the two connection ends 11 abutted from the left and right are both end portions of the same packing body 1.
  • both connection ends 11 of the packing body 1 are connected so that the connection end faces abut each other.
  • the shaft portion 21 is substantially parallel to the axis X of the packing body 1, and both packing bodies 1 are connected from the connecting end 11 within a predetermined range across the joint between the two connecting ends 11. It is installed so as to extend inside.
  • the range extending from the connection end 11 is defined by the length of the shaft portion 21.
  • connection member 2 when the packing body 1 is formed in a tube shape, the connection member 2 is accommodated in the air core portion 12 of the packing body 1. Then, the tip end side of the hook 22 protruding from the end portion 211 of the shaft portion 21 bites or pierces the inner wall 13 of the air core portion 12. As described above, the hook 22 protruding at a predetermined angle from the shaft portion 21 bites or pierces the inner wall of the packing body 1, thereby causing resistance in the direction in which the connecting member 2 is pulled out from the packing body 1. As a result, both connection ends 11 of the packing body 1 are connected and fixed in a butted state.
  • connection member 2 is completely embedded in the packing body 1. That is, the connection member 2 is inserted and inserted from the connection end 11 along the axial center of the packing body 1, and the connection member 2 itself is inserted into the packing body 1. Further, since the hook 22 protruding at a predetermined angle from the shaft portion 21 is also stuck in the packing body 1, resistance to the direction in which the connecting member 2 is pulled out from the packing body 1 is generated, and both the packing body 1 are connected. The end 11 is fixed in a butted state.
  • connection end 11 of the packing body 1 using the connection member 2 of the present invention.
  • the end portion 211 of the shaft portion 21 is inserted into the air core portion 12 from the one connection end 11 side (FIG. 3 a).
  • the shaft portion 21 is inserted as it is, and the hook 22 portion is further inserted into the air core portion 12.
  • the vicinity of the connection end 11 is crushed by pressing it with a finger from above and below, and the cross-sectional shape of the air core portion 12 is expanded to be an elliptical shape.
  • the wide hook 22 can be easily inserted into the air core 12.
  • connection member 2 exposed to the outside from the connection end 11 is inserted into the air core portion 12 from the other connection end 11 side of the packing body 1.
  • shaft portion 21 is inserted as it is, and the hook 22 portion is further inserted into the air core portion 12.
  • the insertion is advanced to a position where the connection end surfaces of both connection ends 11 come into contact with each other, and the remaining hooks 22 are locked to the inner wall 13 to complete the connection and fixing of the connection ends 11 (FIG. 3c). In this state, since all the hooks 22 are locked to the inner wall 13, resistance in a direction in which the connection ends 11 are separated from each other is generated and can be fixed in a connected state.
  • connection method of the connection end 11 of the string-like packing body 1 that does not have an air core portion is basically the same procedure as that of the tube-like packing body 1.
  • the shaft portion 21 and the hook 22 are inserted into the packing body 1 from the end surface of the connection end 11 because the shaft portion 21 and the hook 22 are not provided with the air core portion 12. Is inserted.
  • the plating jig that can use the packing of the present invention is not limited to a type that performs plating on only one side of the substrate described below, but includes other types including a type that performs plating on both the front and back sides of the substrate at the same time. It can be widely used for various substrate plating jigs.
  • the plating jig 3 of the present invention is provided with a substrate holder 4 having a substrate accommodating portion 41 on the upper surface, and is attached to the substrate holder 4 so as to be openable and closable. And a clamping member 6 as means for fixing the substrate pressing portion 5 to the substrate holder 4 in a pressure contact state.
  • the packing of the present invention is attached to the substrate pressing portion 5.
  • the substrate holder 4 is attached in a horizontal state to a main body portion 41 formed in a substantially square shape, an arm portion 42 extending upward from the upper end of the main body portion 41, and the upper end of the arm portion 42.
  • Hanger part 43 A housing portion 411 for housing a substrate is provided in the center of the main body portion 41, and an external electrode is provided around the housing portion 411 and is sealed by a packing 1 of a substrate pressing portion 5 described later.
  • the hanger portion 43 is formed so as to protrude from the left and right sides of the width of the main body portion 41 so that both end portions thereof can be hooked to the wall surface of the plating tank, and an external electrode terminal is provided in a part thereof.
  • the external electrode terminal is connected to a conductor that leads from the hanger portion 43 to the first energization member 412 through the arm portion 42 and the main body portion 41.
  • the power feeding method for the substrate is not limited to that of the plating jig of the present invention, and a general method can be appropriately employed.
  • the substrate pressing portion 5 includes a frame portion 51 having a square opening 53 that exposes a surface to be plated of the substrate, and an attachment portion 52 that extends from the frame portion 51 to the substrate holder 4 side.
  • the frame 51 has an inner dimension (opening dimension) smaller than the outer dimension of the substrate 51 so that the peripheral edge of the substrate is covered when the substrate is held, and the outer dimension of the frame 51 is the outer dimension of the substrate. It is formed to be larger.
  • the substrate pressing portion 5 is rotatably attached to the hinge portion 44 of the substrate holder 4 at the mounting portion 52, and the substrate pressing portion 5 is closed and pressed onto the substrate holder 4 to sandwich the substrate therebetween. Can be held.
  • FIG. 4 shows a state where the substrate pressing portion 5 is opened.
  • the frame portion 51 is formed in a substantially square shape, but the shape of the frame portion is not limited to this, and may be a ring shape or other shapes depending on the shape of the substrate. Moreover, there is no restriction
  • the second energization member 7 is provided on the entire back surface of the frame portion 51.
  • packing according to the present invention is provided in a double manner along the inner and outer peripheries of the frame portion 51.
  • These packing 1 a and packing 1 b are inserted into a groove portion 511 that is recessed in the back surface of the frame portion 51 so that a part thereof is exposed from the groove portion 511.
  • the exposed part of packing 1a, 1b is press-contacted to the board
  • the packing is provided on the substrate pressing portion 5 side, but the packing 1b provided outside the second energizing member 7 is not the substrate pressing portion 5 but the main body portion of the substrate holder 4. It may be provided on the upper surface of 41.
  • FIG. 5 is a partial cross-sectional view of the substrate W held by the plating jig of the present invention.
  • the substrate W is placed on the substrate accommodating portion 411 of the substrate holder 4 and is sandwiched between the substrate pressing portions 5.
  • the substrate holder 4 and the substrate pressing portion 5 are sandwiched by clamp members 6 having a substantially U-shaped cross section from the peripheral wall side and are fixed in a pressure contact state.
  • the fixing means for the substrate holder 4 and the substrate pressing portion 5 is not limited to this, and may be fixed by tightening a bolt or the like.
  • the packing 1a portion exposed from the groove portion 511a on the back surface of the substrate pressing portion 5 is pressed against the surface of the substrate W, and the packing 1b portion exposed from the groove portion 511b is the substrate.
  • the holder 4 is in pressure contact with the upper surface of the main body 41.
  • a groove portion that can accommodate the packing 1b portion exposed from the groove portion 511 may be recessed in the upper surface portion of the main body portion 41 to which the packing 1b is pressed. Further, a packing may be further provided on the upper surface portion of the main body portion 41 to which the packing 1b is pressed, and the packings may come into contact with each other for sealing.
  • the packing attached to the main body 41 of the substrate holder 4 may be a normal O-ring, but may be a packing according to the present invention.
  • the packing attached to the substrate pressing portion 5 or the substrate holder 4 may be provided in one step per groove portion 511 as shown in FIG.
  • one groove portion 511 may be provided in two upper and lower stages.
  • the upper and lower packings may be the same, but may be different types in the upper and lower sides.
  • the lower packing may be a string-like packing having no air core
  • the upper packing may be a tube having an air core (FIG. 6c), or the lower packing. May be a tube having an air core
  • the upper packing may be a string-like packing having no air core.
  • the upper and lower stages when provided in two upper and lower stages, may be of the same shape and different elastic materials, or may have different chemical resistance in the upper and lower stages.
  • the upper packing it is preferable to use an upper packing exposed to the outside having high chemical resistance.
  • the ended packing according to the present invention may be used for one of the upper and lower stages, and the other endless packing such as an O-ring may be used.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The problem addressed by the present invention is providing packing for a substrate plating jig that is more advantageous in terms of cost than O-rings and can handle various dimensions and shapes for a substrate jig and a substrate plating jig that uses the packing for a substrate plating jig. Provided is packing for a substrate plating jig that is attached to the plating jig and is for sealing conductive members for electrifying the substrate and parts of the substrate surface in contact with the conductive members from plating fluid, and is characterized by being provided with a packing main body formed from an elastic material that has an elongated shape and an end, and a connecting member for making a non-ending shape by connecting and affixing connecting ends of both end parts of the packing main body to each other, and is characterized by the connecting member being formed from a shaft part and a plurality of hooks provided so as to protrude at a prescribed angle from the shaft part and the connecting member being provided inside and extending within the packing main body in both directions from the connecting point within a prescribed range so as to extend over the connecting point where the connection ends are linked when the two ends of the packing main body are linked. Also provided is a substrate plating jig that uses the packing for a substrate plating jig.

Description

基板めっき治具用パッキン及びそれを利用した基板めっき治具Packing for substrate plating jig and substrate plating jig using the same
 本発明は、基板のめっき処理に使用されるめっき治具用のパッキン及びそれを利用するめっき治具に関するものである。 The present invention relates to a packing for a plating jig used for plating a substrate and a plating jig using the same.
 一般に電解めっき法で使用されるめっき治具は、半導体ウェーハ等の基板をその周縁部分で通電部材が接する部分をシールするとともに、基板表面もしくは表裏両面の被めっき処理面を露出させて着脱自在に保持する基板ホルダを備え、この基板ホルダを基板ごとめっき液中に浸漬して基板の被めっき処理面のめっきを行うようにしている。 In general, plating jigs used in the electroplating method seal a portion of a substrate such as a semiconductor wafer where the current-carrying member contacts at the peripheral portion, and expose the surface to be plated on both the front surface and the back surface of the substrate so that it can be detached. A holding substrate holder is provided, and the substrate holder is immersed in a plating solution together with the substrate to plate the surface to be plated of the substrate.
 このように、基板ホルダを基板ごとめっき液中に浸漬する場合、基板に通電するための通電部材と該通電部材が接する基板表面部分をめっき液から保護すべく、基板ホルダの内外周に沿って環状にシール部材によるパッキンを設け、通電部材が設けられた領域をシールすることが行われている。 Thus, when the substrate holder is immersed in the plating solution together with the substrate, in order to protect the energizing member for energizing the substrate and the substrate surface portion in contact with the energizing member from the plating solution, along the inner and outer peripheries of the substrate holder. An annular packing with a sealing member is provided to seal a region where an energizing member is provided.
 かかるパッキンとしては、下記の各特許文献でも開示されているように、リング状に型成形された無端状の弾性部材、いわゆるOリングが一般的に用いられている。このOリングは、例えば、特許文献1に開示された治具においては、基板ホルダの基板押さえ部の裏面に2重の同心円状に配設され、基板押さえ部と支持部により基板を挟持したときに、基板の表面と基板支持部の上面に圧接するように設けられている。また、特許文献2に開示された治具では、基板ホルダの基板押さえ部の裏面と基板支持部の上面にそれぞれOリングが配設され、基板押さえ部と支持部により基板を挟持したときに、基板の表面と基板押さえ部の裏面に圧接するように設けられている。このように、これらの2重に配設されたOリングが基板の表面と基板支持部の上面、もしくは基板の表面と基板押さえ部の裏面に圧接されることにより、内側と外側のリングに挟まれた領域がめっき液の浸入からシールされる。その結果、基板表面の周縁部分で通電部材が接する部分と、基板支持部の通電部材が設けられた部分がめっき液から保護される。 As such a packing, as disclosed in the following patent documents, an endless elastic member molded in a ring shape, a so-called O-ring is generally used. For example, in the jig disclosed in Patent Document 1, the O-ring is arranged in a double concentric shape on the back surface of the substrate pressing portion of the substrate holder, and the substrate is sandwiched between the substrate pressing portion and the support portion. The substrate is provided so as to be in pressure contact with the surface of the substrate and the upper surface of the substrate support portion. Further, in the jig disclosed in Patent Document 2, O-rings are disposed on the back surface of the substrate pressing portion of the substrate holder and the upper surface of the substrate supporting portion, respectively, and when the substrate is sandwiched between the substrate pressing portion and the supporting portion, It is provided so as to be in pressure contact with the front surface of the substrate and the back surface of the substrate pressing portion. In this way, these O-rings arranged in duplicate are pressed between the inner surface and the outer ring by being pressed against the surface of the substrate and the upper surface of the substrate supporting portion, or the surface of the substrate and the rear surface of the substrate pressing portion. The sealed area is sealed from the penetration of the plating solution. As a result, the portion where the energizing member is in contact with the peripheral portion of the substrate surface and the portion where the energizing member of the substrate support is provided are protected from the plating solution.
 ところで、かかる成形Oリングをシール部材として使用する場合、以下のような問題があった。すなわち、被めっき基板の多様な寸法・形状に伴い、基板ホルダの内外周の寸法もまちまちであり、かかる寸法・形状の違う治具ごとにOリングを成形することによるコスト高の問題があった。また、めっき薬品には様々な組成があるが、その組成に応じてOリングの耐薬品性も異なるため、1種類のOリングでは対応が困難な場合があった。 Incidentally, when such a molded O-ring is used as a seal member, there are the following problems. That is, along with the various dimensions and shapes of the substrate to be plated, the dimensions of the inner and outer circumferences of the substrate holder also vary, and there was a problem of high cost due to molding an O-ring for each jig having a different dimension and shape. . In addition, although there are various compositions for plating chemicals, the chemical resistance of the O-ring differs depending on the composition, and therefore it may be difficult to cope with one type of O-ring.
 そこで、かかる無端のOリングのシール部材の代わりに、製造コストも低廉で、種類も豊富な有端状の弾性部材を用いて、かかる部材の両端部を接続することによりOリングのような無端状シール部材とすることが考えられる。 Therefore, instead of such an endless O-ring seal member, an endless elastic member with a low production cost and a wide variety of types is used to connect both ends of the endless member such as an O-ring. It is conceivable to form a seal member.
 しかしながら、基板めっき治具は基板を挟持する際に基板支持部に対して基板押さえ部を圧接状態にて固定し、めっき基板の着脱の際にはかかる圧接を解除するため、そのたびにシール部材端部の接続部分における押圧および押圧の開放が繰り返されることになり、接続した端部における固定を適切に行わなければ、接続部分のつなぎ目に隙間や段差が生じるなどして、シール効果が損なわれる可能性があった。 However, the substrate plating jig fixes the substrate pressing portion against the substrate support portion when sandwiching the substrate, and releases the pressure contact when the plating substrate is attached / detached. The pressing and releasing of the pressing at the connecting portion of the end will be repeated, and if the connecting end is not properly fixed, a gap or a step is formed at the connecting portion, and the sealing effect is impaired. There was a possibility.
特開2003-226997JP 2003-226997 A 特開2003-301299JP2003-301299A
 そこで本発明は、従来の基板めっき治具用パッキン及びそれを利用した基板めっき治具のかかる欠点を克服し、従来のOリングと同等のシール効果が得られるとともに、Oリングと比較してコスト面において有利であり、さらに、様々な寸法・形状の基板治具に対応可能であり、また、めっき薬品の組成に応じて適宜交換可能な基板めっき治具用パッキン及び該パッキンを利用した基板めっき治具の提供をその課題とするものである。 Therefore, the present invention overcomes the disadvantages of conventional packing for substrate plating jigs and substrate plating jigs using the same, and can provide a sealing effect equivalent to that of conventional O-rings, and is cost-effective compared to O-rings. In addition, it is possible to deal with substrate jigs of various sizes and shapes, and can be appropriately replaced according to the composition of the plating chemical, and substrate plating using the packing The issue is to provide a jig.
 本発明は、上記課題を解決するものであり、めっき治具に取り付けられ、基板に通電するための通電部材と該通電部材が接する基板表面部分をめっき液からシールするための基板めっき治具用パッキンであって、長尺有端状の弾性部材からなるパッキン本体と、該パッキン本体の両端部の接続端を互いに連接して無端状とするための接続部材とを備え、該接続部材は、軸部と、該軸部の両側もしくは片側一方へ所定の角度で突出して設けられた複数のフックからなり、パッキン本体の両方の接続端を連接するとき、該接続部材は連接された接続端のつなぎ目にまたがって所定の範囲で接続端から双方のパッキン本体内に延伸するように内設されることを特徴とする基板めっき治具用パッキンである。 SUMMARY OF THE INVENTION The present invention solves the above-described problem, and is for a substrate plating jig that is attached to a plating jig and seals a current-carrying member for energizing the substrate and a substrate surface portion in contact with the current-carrying member from the plating solution. A packing body comprising a packing body made of an elastic member having a long end, and a connecting member for connecting the connecting ends of both ends of the packing body to each other so as to be endless. It consists of a shaft part and a plurality of hooks that project at a predetermined angle to both sides or one side of the shaft part. When connecting both connection ends of the packing body, the connection member is connected to the connected connection end. A packing for a substrate plating jig, wherein the packing is provided so as to extend from a connection end into both packing bodies within a predetermined range across a joint.
 また本発明は、上面に基板収容部を備えた基板ホルダと、基板の被めっき面を露出させる開口を備え、該基板ホルダとともに基板を挟み込んで保持する基板押さえ部と、基板ホルダに対して基板押さえ部を圧接状態で固定するための固定手段を有し、基板押さえ部の裏面(および基板支持部の上面)に凹設された溝部に本発明にかかるパッキンが一部を溝部から露出するように挿設され、基板押さえ部が基板支持部に対して圧接状態にて固定されることにより、パッキンの溝部から露出した部分が基板表面と基板ホルダの上面(もしくは基板押さえ部の裏面)に圧接され、基板の周縁部および基板収容部の周囲における通電部材が設けられた部分をめっき液よりシールすることを特徴とする基板めっき治具である。 The present invention also includes a substrate holder having a substrate accommodating portion on the upper surface, an opening for exposing a surface to be plated of the substrate, a substrate pressing portion for sandwiching and holding the substrate together with the substrate holder, and a substrate with respect to the substrate holder. It has a fixing means for fixing the pressing portion in a pressure contact state, and a part of the packing according to the present invention is exposed from the groove portion in the groove portion recessed in the back surface of the substrate pressing portion (and the upper surface of the substrate support portion). And the part that is exposed from the groove of the packing is in pressure contact with the substrate surface and the upper surface of the substrate holder (or the back surface of the substrate pressing part). The substrate plating jig is characterized in that the peripheral portion of the substrate and the portion provided with the energizing member around the substrate housing portion are sealed from the plating solution.
 本発明の基板めっき治具用パッキンは、有端状のパッキン本体の両接続端を接続部材により連接して無端状態とするため、パッキン本体の長さを適宜調整することができ、めっき処理される基板のサイズや形状並びに基板を保持する基板押さえ部のサイズや形状に合わせた無端状のパッキンを形成することができる。 Since the packing for a substrate plating jig of the present invention is connected to the both ends of the endless packing body by a connecting member to be in an endless state, the length of the packing body can be adjusted as appropriate, and the plating process is performed. It is possible to form an endless packing that matches the size and shape of the substrate and the size and shape of the substrate pressing portion that holds the substrate.
 また、本発明の基板めっき治具用パッキンは、成形Oリングとは異なり押出成形された弾性部材を利用可能なため、製造コストも低廉である。 Further, unlike the molded O-ring, the packing for a substrate plating jig of the present invention can use an extruded elastic member, so that the manufacturing cost is low.
 また、本発明の基板めっき治具用パッキンの素材として利用可能な既成の有端のヒモ状あるいはチューブ状部材は、耐薬品性の素材種類が豊富なため、めっき液の組成に応じて適宜好ましい耐薬品性の部材を選択することが可能であり、さらに、弾性力の種類も豊富なため、めっき治具に応じて適宜好ましい弾性力の部材を選択することが可能である。 In addition, the existing end-spun string-like or tube-like member that can be used as the material for the packing for the substrate plating jig of the present invention is suitably suitable depending on the composition of the plating solution because of its wide variety of chemical-resistant materials. It is possible to select a chemical-resistant member, and furthermore, since there are a wide variety of elastic forces, it is possible to select a member having a preferable elastic force as appropriate according to the plating jig.
 さらに、本発明の基板めっき治具用パッキンを利用するめっき治具は、従来のOリングによるパッキンと同様のシール効果により、基板の周縁部および基板収容部の周囲における通電部材が設けられた部分をめっき液より保護することができる。 Furthermore, the plating jig using the packing for a substrate plating jig according to the present invention is a portion in which a current-carrying member is provided around the periphery of the substrate and the periphery of the substrate housing portion due to a sealing effect similar to that of packing using a conventional O-ring. Can be protected from the plating solution.
 また、本発明の基板めっき治具用パッキンを利用するめっき治具でパッキンを上下2段に設けたものは、上段と下段において異なる素材種類のパッキンを適宜選択することができ、これにより、より高いシール効果を得られる弾性強度を実現し、または、めっき液の組成に応じた耐薬品性を実現することができる。 In addition, the plating jig using the packing for the substrate plating jig of the present invention in which the packing is provided in two upper and lower stages can appropriately select different material types of packing in the upper stage and the lower stage. It is possible to achieve an elastic strength that can provide a high sealing effect, or to achieve chemical resistance according to the composition of the plating solution.
本発明のめっき治具用パッキンの接続部材の平面図。The top view of the connection member of the packing for plating jigs of this invention. (a)本発明のめっき治具用パッキンの接続端を接続部材により連接した状態を示す水平断面図。(b)本発明の別態様のめっき治具用パッキンの接続端を接続部材により連接した状態を示す水平断面図。(c)本発明の別態様のめっき治具用パッキンの接続端を接続部材により連接した状態を示す水平断面図。(A) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of this invention with the connection member. (B) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of another aspect of this invention with the connection member. (C) The horizontal sectional view which shows the state which connected the connection end of the packing for plating jigs of another aspect of this invention with the connection member. (a)本発明のめっき治具用パッキンの接続端を接続部材により接続固定する手順を示す平面図。(b)本発明のめっき治具用パッキンの接続端を接続部材により接続固定する手順を示す平面図。(c)本発明のめっき治具用パッキンの接続端を接続部材により接続固定する手順を示す平面図。(A) The top view which shows the procedure which connects and fixes the connection end of the packing for plating jigs of this invention with a connection member. (B) The top view which shows the procedure which connects and fixes the connection end of the packing for plating jigs of this invention with a connection member. (C) The top view which shows the procedure which connects and fixes the connection end of the packing for plating jigs of this invention with a connection member. 本発明のめっき治具用パッキンを備えためっき治具の平面図。The top view of the plating jig provided with the packing for plating jigs of this invention. 本発明のめっき治具用パッキンを備えためっき治具の部分断面図。The fragmentary sectional view of the plating jig provided with packing for plating jigs of the present invention. (a)本発明のめっき治具用パッキンが治具に取り付けられた状態を示す部分断面図。(b) 本発明のめっき治具用パッキンが治具に取り付けられた状態を示す部分断面図。(c)本発明のめっき治具用パッキンが治具に取り付けられた状態を示す部分断面図。(A) The fragmentary sectional view which shows the state by which the packing for plating jigs of this invention was attached to the jig | tool. (B) The fragmentary sectional view which shows the state by which the packing for plating jigs of this invention was attached to the jig | tool. (C) The fragmentary sectional view which shows the state by which the packing for plating jigs of this invention was attached to the jig | tool.
 以下、本発明のめっき治具用パッキン及びそれを利用するめっき治具の実施態様を、図面に基づいて具体的に説明する。なお、本発明はこれら実施態様に何ら制約されるものではない。 Hereinafter, embodiments of the packing for a plating jig of the present invention and a plating jig using the same will be described in detail with reference to the drawings. Note that the present invention is not limited to these embodiments.
 本発明のパッキンは、長尺有端状の弾性材からなるチューブ状もしくはヒモ状に形成されたパッキン本体1と、パッキン本体1の両端部(以下、「接続端」という)を連接するための接続部材2からなる。パッキン本体1は、製造コストの面でも有利な押出成形により製造されることが好ましいが、製造方法はこれに限定されない。該パッキン本体1は、その両接続端を接続部材2により互いに接続、固定することにより、無端のリング状や四角形状、またはその他の形状のシール部材として利用することができる。このように、もとは1本の有端部材であるため、適当な長さに切るなどして、両接続端を連接したときのパッキンとしての周方向のサイズを任意に決めることができる。 The packing of the present invention is for connecting a packing main body 1 formed of a long end-shaped elastic material into a tube shape or a string shape and both ends of the packing main body 1 (hereinafter referred to as “connection ends”). It consists of a connecting member 2. The packing body 1 is preferably manufactured by extrusion which is advantageous in terms of manufacturing cost, but the manufacturing method is not limited to this. The packing main body 1 can be used as an endless ring-shaped, quadrangular, or other shape sealing member by connecting and fixing the two connecting ends to each other with a connecting member 2. Thus, since it is originally a single end member, the size in the circumferential direction as the packing when the two connection ends are connected can be arbitrarily determined by cutting it to an appropriate length.
 パッキン本体1は、既成の有端状の弾性材を好適に利用することができ、具体的には、その内部に空芯部を有するチューブ状のものや、内部に空芯部を有さないヒモ状のものが利用可能であるが、接続部材2の取付けの容易さから空芯部を有するチューブ状のものが好ましい。そして、チューブ状の場合、その断面形状は円形が好ましく、ヒモ状の場合、その断面形状は、円形に限らず、楕円形、または四角形をはじめとする多角形状としても良い。 The packing body 1 can suitably use an existing end-shaped elastic material. Specifically, the packing body 1 does not have a tube-like one having an air core part therein or an air core part inside. Although a string-like thing can be utilized, the tube-like thing which has an air core part from the ease of attachment of the connection member 2 is preferable. In the case of a tube shape, the cross-sectional shape is preferably a circular shape, and in the case of a string shape, the cross-sectional shape is not limited to a circular shape, and may be an elliptical shape or a polygonal shape including a quadrangle.
 パッキン本体1の材質は、めっき薬品の組成に応じて適宜変更することができ、具体的には、天然ゴムの他にニトリルゴム、シリコーンゴム、アクリルゴム、スチレンブタジエンゴム、クロロプレンゴム、フッ素ゴム、エチレンプロピレンゴムなどの合成ゴム、四フッ化エチレンゴム(テフロン(登録商標))、塩化ビニル樹脂等を好適に利用することができる。 The material of the packing body 1 can be appropriately changed according to the composition of the plating chemical. Specifically, in addition to natural rubber, nitrile rubber, silicone rubber, acrylic rubber, styrene butadiene rubber, chloroprene rubber, fluoro rubber, Synthetic rubber such as ethylene propylene rubber, tetrafluoroethylene rubber (Teflon (registered trademark)), vinyl chloride resin and the like can be suitably used.
 図1は接続部材2の平面図である。図に示すように、接続部材2は、棒状もしくは板状に形成された軸部21と、軸部21より両側へと突出して設けられた複数のフック22からなる。フック22は、軸部21の両端部211において、軸部21より所定の範囲の角度θに突出して形成されている。かかる角度θの範囲は、30°~90°が好ましく、45°~70°がより好ましい。すなわち、フック22の突出角度θが最大の場合は、図2(b)に示すように、軸部21から直角方向に突出し、それ以下の角度の場合は、図1のように軸部21の端部側から中央側へと折り返して突出する。また、フック22は、本実施態様のように軸部21の端部211より突出しても良いが、必ずしも端部211には限らず、端部211付近のやや軸部21の中央寄りから突出させても良い。さらに、フック22は本実施態様のように軸部21より両側へ突出しても良いが、図2(c)の態様のように、軸部21より片側一方へ突出させても良い。かかる接続部材2の軸部21における長さはパッキン本体1の外径(変形前の状態における)の2倍~8倍が好ましく、また、フック22はパッキン本体1の外径(変形前の状態における)の0.5から~0.9倍に達する長さが好ましい。 FIG. 1 is a plan view of the connecting member 2. As shown in the figure, the connecting member 2 includes a shaft portion 21 formed in a rod shape or a plate shape, and a plurality of hooks 22 provided so as to protrude from the shaft portion 21 to both sides. The hook 22 is formed at both end portions 211 of the shaft portion 21 so as to protrude from the shaft portion 21 at an angle θ within a predetermined range. The range of the angle θ is preferably 30 ° to 90 °, more preferably 45 ° to 70 °. That is, when the protrusion angle θ of the hook 22 is the maximum, as shown in FIG. 2B, the hook 22 protrudes from the shaft portion 21 in a right angle direction, and when the angle is less than that, the shaft portion 21 has a protrusion angle θ as shown in FIG. It protrudes from the end side to the center side. The hook 22 may protrude from the end portion 211 of the shaft portion 21 as in the present embodiment. However, the hook 22 is not necessarily limited to the end portion 211 and protrudes slightly from the center of the shaft portion 21 near the end portion 211. May be. Furthermore, the hook 22 may protrude from the shaft portion 21 to both sides as in this embodiment, but may be protruded from the shaft portion 21 to one side as in the embodiment of FIG. The length of the shaft portion 21 of the connecting member 2 is preferably 2 to 8 times the outer diameter of the packing body 1 (before deformation), and the hook 22 has the outer diameter of the packing body 1 (state before deformation). A length reaching 0.5 to 0.9 times that of (in) is preferred.
 図2は、チューブ状のパッキン本体1の接続端11を接続部材2により連接した状態を示す水平断面図である。なお、同図において、左右から突き合わされた2つの接続端11は、ともに同じ1本のパッキン本体1の両端部分である。図に示すように、パッキン本体1の両方の接続端11は、接続端面を互いに突き合わせるようにして連接される。このとき、接続部材2は、軸部21がパッキン本体1の軸芯Xと略平行状態であり、2つの接続端11のつなぎ目にまたがって所定の範囲で該接続端11から双方のパッキン本体1内に延伸するように内設されている。なお、接続端11から延伸する範囲は、軸部21の長さにより規定される。 FIG. 2 is a horizontal sectional view showing a state in which the connection end 11 of the tubular packing body 1 is connected by the connection member 2. In addition, in the same figure, the two connection ends 11 abutted from the left and right are both end portions of the same packing body 1. As shown in the drawing, both connection ends 11 of the packing body 1 are connected so that the connection end faces abut each other. At this time, in the connecting member 2, the shaft portion 21 is substantially parallel to the axis X of the packing body 1, and both packing bodies 1 are connected from the connecting end 11 within a predetermined range across the joint between the two connecting ends 11. It is installed so as to extend inside. The range extending from the connection end 11 is defined by the length of the shaft portion 21.
 図2の実施態様のように、パッキン本体1がチューブ状に形成されている場合は、接続部材2はパッキン本体1の空芯部12内に収容される。そして、軸部21の端部211から突出するフック22の先端側が空芯部12の内壁13に食い込み、もしくは刺さっている。このように、軸部21より所定の角度で突出するフック22がパッキン本体1の内壁に食い込み、もしくは刺さることにより、接続部材2をパッキン本体1から引き抜く方向に対する抵抗が生じる。その結果、パッキン本体1の両方の接続端11は、突き合わせ状態で接続固定される。 2, when the packing body 1 is formed in a tube shape, the connection member 2 is accommodated in the air core portion 12 of the packing body 1. Then, the tip end side of the hook 22 protruding from the end portion 211 of the shaft portion 21 bites or pierces the inner wall 13 of the air core portion 12. As described above, the hook 22 protruding at a predetermined angle from the shaft portion 21 bites or pierces the inner wall of the packing body 1, thereby causing resistance in the direction in which the connecting member 2 is pulled out from the packing body 1. As a result, both connection ends 11 of the packing body 1 are connected and fixed in a butted state.
 一方、パッキン本体1が空芯部12を有さないヒモ状に形成されている場合、接続部材2はパッキン本体1の内部に完全に埋設された状態となる。すなわち、接続部材2はパッキン本体1の軸芯に沿って接続端11より刺し込み挿入され、接続部材2自体がパッキン本体1の内部に刺さった状態となっている。そして、軸部21より所定の角度で突出するフック22もパッキン本体1内にて突き刺さった状態であるため、接続部材2をパッキン本体1から引き抜く方向に対する抵抗が生じ、パッキン本体1の両方の接続端11は、突き合わせ状態で固定される。 On the other hand, when the packing body 1 is formed in a string shape that does not have the air core portion 12, the connection member 2 is completely embedded in the packing body 1. That is, the connection member 2 is inserted and inserted from the connection end 11 along the axial center of the packing body 1, and the connection member 2 itself is inserted into the packing body 1. Further, since the hook 22 protruding at a predetermined angle from the shaft portion 21 is also stuck in the packing body 1, resistance to the direction in which the connecting member 2 is pulled out from the packing body 1 is generated, and both the packing body 1 are connected. The end 11 is fixed in a butted state.
 次に、図3により、本発明の接続部材2によるパッキン本体1の接続端11の接続固定の手順について説明する。まず、パッキン本体1の両方の接続端11が離間した状態において、一方の接続端11側から空芯部12内へ、軸部21の端部211を挿入する(図3a)。そして、そのまま軸部21の挿入を進めて、フック22部分をさらに空芯部12内へと挿入する。このとき、チューブ状のパッキン本体1を使用する場合は、接続端11付近を指で上下から押圧することで潰して、空芯部12の断面形状が横に広がる楕円形にすることにより、幅の広いフック22部分を空芯部12内に容易に挿入できる。  Next, with reference to FIG. 3, a procedure for fixing the connection end 11 of the packing body 1 using the connection member 2 of the present invention will be described. First, in a state where both the connection ends 11 of the packing body 1 are separated from each other, the end portion 211 of the shaft portion 21 is inserted into the air core portion 12 from the one connection end 11 side (FIG. 3 a). Then, the shaft portion 21 is inserted as it is, and the hook 22 portion is further inserted into the air core portion 12. At this time, when using the tubular packing body 1, the vicinity of the connection end 11 is crushed by pressing it with a finger from above and below, and the cross-sectional shape of the air core portion 12 is expanded to be an elliptical shape. The wide hook 22 can be easily inserted into the air core 12. *
 そして、軸部21の長さの約半分が挿入されたところで、接続端11付近の上下からの押圧を開放すると、空芯部12の断面形状は弾性変形により元の真円形状に戻るため、フック22が内壁13に確実に係止する。この状態において、接続部材2は軸部21の約半分が一方の接続端11から空芯部12内に挿入されており、残りの半分は挿入された側の接続端11より外部へ露出している(図3b)。 And when about half of the length of the shaft portion 21 is inserted, when the pressure from above and below near the connection end 11 is released, the cross-sectional shape of the air core portion 12 returns to the original perfect circle shape by elastic deformation. The hook 22 is securely locked to the inner wall 13. In this state, about half of the shaft portion 21 of the connection member 2 is inserted into the air core portion 12 from one connection end 11, and the other half is exposed to the outside from the connection end 11 on the inserted side. (FIG. 3b).
 次に、接続端11より外部へ露出する接続部材2の端部211側を、パッキン本体1のもう一方の接続端11側から空芯部12内へ挿入する。そして、そのまま軸部21の挿入を進めて、フック22部分をさらに空芯部12内へと挿入する。最終的に、双方の接続端11の接続端面を互いに当接させる位置まで挿入を進め、残りのフック22を内壁13に係止させて接続端11の接続及び固定が完了する(図3c)。この状態において、フック22はいずれも内壁13に係止しているため、接続端11同士が離間する方向への抵抗が生じて接続状態で固定することができる。 Next, the end portion 211 side of the connection member 2 exposed to the outside from the connection end 11 is inserted into the air core portion 12 from the other connection end 11 side of the packing body 1. Then, the shaft portion 21 is inserted as it is, and the hook 22 portion is further inserted into the air core portion 12. Finally, the insertion is advanced to a position where the connection end surfaces of both connection ends 11 come into contact with each other, and the remaining hooks 22 are locked to the inner wall 13 to complete the connection and fixing of the connection ends 11 (FIG. 3c). In this state, since all the hooks 22 are locked to the inner wall 13, resistance in a direction in which the connection ends 11 are separated from each other is generated and can be fixed in a connected state.
 また、空芯部を有さないヒモ状のパッキン本体1の接続端11の接続方法については、基本的にはチューブ状のパッキン本体1と同様の手順による。ただし、チューブ状のものとは異なり、軸部21やフック22を挿入可能な空芯部12を有さないため、軸部21およびフック22は接続端11の端面からパッキン本体1内に刺し込むことにより挿入される。 Further, the connection method of the connection end 11 of the string-like packing body 1 that does not have an air core portion is basically the same procedure as that of the tube-like packing body 1. However, unlike the tube-like one, the shaft portion 21 and the hook 22 are inserted into the packing body 1 from the end surface of the connection end 11 because the shaft portion 21 and the hook 22 are not provided with the air core portion 12. Is inserted.
 次に、本発明のパッキンを利用するめっき治具の一実施態様について説明する。なお、本発明のパッキンを利用可能なめっき治具は以下に説明する基板の片面のみにめっき処理を施すタイプのものに限らず、基板の表裏両面に同時にめっき処理を施すタイプを含むその他一般的な基板めっき治具に広く利用することができる。 Next, an embodiment of a plating jig using the packing of the present invention will be described. The plating jig that can use the packing of the present invention is not limited to a type that performs plating on only one side of the substrate described below, but includes other types including a type that performs plating on both the front and back sides of the substrate at the same time. It can be widely used for various substrate plating jigs.
 図4に示すように、本発明のめっき治具3は、上面に基板収容部41を備えた基板ホルダ4と、該基板ホルダ4に開閉自在に取り付けられ、基板ホルダ4とともに基板を挟み込んで保持する基板押さえ部5と、基板押さえ部5を基板ホルダ4に対して圧接状態にて固定する手段としてのクランプ部材6を備え、基板押さえ部5には本発明のパッキンが取り付けられている。以下、各部材について説明する。 As shown in FIG. 4, the plating jig 3 of the present invention is provided with a substrate holder 4 having a substrate accommodating portion 41 on the upper surface, and is attached to the substrate holder 4 so as to be openable and closable. And a clamping member 6 as means for fixing the substrate pressing portion 5 to the substrate holder 4 in a pressure contact state. The packing of the present invention is attached to the substrate pressing portion 5. Hereinafter, each member will be described.
 図に示すように、基板ホルダ4は、略正方形に形成された本体部41と、該本体部41の上端より上方へ延伸するアーム部42と、該アーム部42の上端に水平状態に取り付けられたハンガー部43からなる。本体部41の中央には、基板を収容するための収容部411が設けられており、該収容部411の周囲で、後述する基板押さえ部5のパッキン1によりシールされる領域には、外部電極に通ずる導電体が接続された第一通電部材412が4箇所設けられている。 As shown in the figure, the substrate holder 4 is attached in a horizontal state to a main body portion 41 formed in a substantially square shape, an arm portion 42 extending upward from the upper end of the main body portion 41, and the upper end of the arm portion 42. Hanger part 43. A housing portion 411 for housing a substrate is provided in the center of the main body portion 41, and an external electrode is provided around the housing portion 411 and is sealed by a packing 1 of a substrate pressing portion 5 described later. There are provided four first energizing members 412 connected to conductors leading to.
 ハンガー部43は、その両端部がめっき槽の壁面に掛着できるように、本体部41の幅よりも左右に突出して形成されており、その一部に外部電極端子が設けられている。そして、該外部電極端子には、ハンガー部43からアーム部42、本体部41内を介して第一通電部材412に通じる導電体が接続されている。なお、基板に対する給電方法としては、本発明のめっき治具のものに限らず、一般的な方法を適宜採用することができる。 The hanger portion 43 is formed so as to protrude from the left and right sides of the width of the main body portion 41 so that both end portions thereof can be hooked to the wall surface of the plating tank, and an external electrode terminal is provided in a part thereof. The external electrode terminal is connected to a conductor that leads from the hanger portion 43 to the first energization member 412 through the arm portion 42 and the main body portion 41. Note that the power feeding method for the substrate is not limited to that of the plating jig of the present invention, and a general method can be appropriately employed.
 基板押さえ部5は、基板の被めっき面を露出させる角型開口53を備えた枠部51と、該枠部51より基板ホルダ4側へ延伸する取付部52からなる。枠部51は、基板を保持したときに基板の周縁部を被覆するように、枠部51の内寸(開口寸法)が基板外寸より小さく、且つ、枠部51の外寸が基板外寸より大きくなるように形成されている。かかる基板押さえ部5は、取付部52において、基板ホルダ4のヒンジ部44に回動自在に取り付けられ、基板押さえ部5を閉じて基板ホルダ4上に圧接することにより、基板を間に挟み込んで保持することができる。なお、図4は基板押さえ部5が開いた状態を示している。本実施態様のものは、枠部51が略正方形に形成されているが、枠部の形状はこれに限定されず、基板の形状に応じてリング状やその他の形状としても良い。また、パッキンの長さを決める枠部51の周方向の長さについても、特に制限はない。 The substrate pressing portion 5 includes a frame portion 51 having a square opening 53 that exposes a surface to be plated of the substrate, and an attachment portion 52 that extends from the frame portion 51 to the substrate holder 4 side. The frame 51 has an inner dimension (opening dimension) smaller than the outer dimension of the substrate 51 so that the peripheral edge of the substrate is covered when the substrate is held, and the outer dimension of the frame 51 is the outer dimension of the substrate. It is formed to be larger. The substrate pressing portion 5 is rotatably attached to the hinge portion 44 of the substrate holder 4 at the mounting portion 52, and the substrate pressing portion 5 is closed and pressed onto the substrate holder 4 to sandwich the substrate therebetween. Can be held. FIG. 4 shows a state where the substrate pressing portion 5 is opened. In this embodiment, the frame portion 51 is formed in a substantially square shape, but the shape of the frame portion is not limited to this, and may be a ring shape or other shapes depending on the shape of the substrate. Moreover, there is no restriction | limiting in particular also about the length of the circumferential direction of the frame part 51 which determines the length of packing.
 図に示すように、枠部51の裏面には第二通電部材7が全周に渡って設けられている。かかる第二通電部材7の両側には、本発明にかかるパッキンが枠部51の内外周に沿って2重に設けられている。これらのパッキン1aとパッキン1bは、枠部51の裏面に凹設された溝部511に、一部が該溝部511より露出する形で挿設されている。そして、基板押さえ部5を閉じて基板を挟持したときに、パッキン1a、1bの露出した部分が基板表面と本体部41の上面に圧接される。なお、本実施態様では、基板押さえ部5側にパッキンが設けられているが、第二通電部材7の外側に設けられるパッキン1bについては、これを基板押さえ部5ではなく基板ホルダ4の本体部41の上面に設けても良い。 As shown in the figure, the second energization member 7 is provided on the entire back surface of the frame portion 51. On both sides of the second energizing member 7, packing according to the present invention is provided in a double manner along the inner and outer peripheries of the frame portion 51. These packing 1 a and packing 1 b are inserted into a groove portion 511 that is recessed in the back surface of the frame portion 51 so that a part thereof is exposed from the groove portion 511. And when the board | substrate holding | suppressing part 5 is closed and a board | substrate is clamped, the exposed part of packing 1a, 1b is press-contacted to the board | substrate surface and the upper surface of the main-body part 41. FIG. In this embodiment, the packing is provided on the substrate pressing portion 5 side, but the packing 1b provided outside the second energizing member 7 is not the substrate pressing portion 5 but the main body portion of the substrate holder 4. It may be provided on the upper surface of 41.
 図5は、本発明のめっき治具により基板Wを挟持した状態における部分断面図である。図に示すように、基板Wは基板ホルダ4の基板収容部411上に載置され、基板押さえ部5によって挟持されている。基板ホルダ4と基板押さえ部5は、それらの周壁側から断面略コ字形状のクランプ部材6によって挟み込まれて圧接状態に固定されている。なお、基板ホルダ4と基板押さえ部5との固定手段はこれに限定されず、ボルトなどの締め込みによる固定でも良い。 FIG. 5 is a partial cross-sectional view of the substrate W held by the plating jig of the present invention. As shown in the figure, the substrate W is placed on the substrate accommodating portion 411 of the substrate holder 4 and is sandwiched between the substrate pressing portions 5. The substrate holder 4 and the substrate pressing portion 5 are sandwiched by clamp members 6 having a substantially U-shaped cross section from the peripheral wall side and are fixed in a pressure contact state. The fixing means for the substrate holder 4 and the substrate pressing portion 5 is not limited to this, and may be fixed by tightening a bolt or the like.
 基板押さえ部5が圧接状態に固定されることにより、基板押さえ部5の裏面の溝部511aから露出したパッキン1a部分が基板Wの表面に圧接し、さらに、溝部511bから露出したパッキン1b部分が基板ホルダ4の本体部41の上面に圧接する。その結果、基板Wを基板ホルダ4上にしっかりと保持しつつ、パッキン1a、1bの間に挟まれた領域、すなわち、基板Wの周縁部と、基板収容部411の周囲における第一通電部材412が設けられた部分、さらに、基板押さえ部5における第二通電部材7をめっき液から確実にシールすることができる。 When the substrate pressing portion 5 is fixed in a pressure contact state, the packing 1a portion exposed from the groove portion 511a on the back surface of the substrate pressing portion 5 is pressed against the surface of the substrate W, and the packing 1b portion exposed from the groove portion 511b is the substrate. The holder 4 is in pressure contact with the upper surface of the main body 41. As a result, while holding the substrate W firmly on the substrate holder 4, the region between the packings 1 a and 1 b, that is, the peripheral portion of the substrate W and the first energization member 412 around the substrate housing portion 411. Further, the second energizing member 7 in the substrate pressing portion 5 can be reliably sealed from the plating solution.
 なお、本発明のパッキンを利用するめっき治具において、パッキン1bが圧接する本体部41の上面部分に、溝部511より露出するパッキン1b部分を収容可能な溝部を凹設しても良い。また、パッキン1bが圧接する本体部41の上面部分にさらにパッキンを設け、パッキン同士が当接してシールするようにしても良い。この場合、基板ホルダ4の本体部41に取り付けられるパッキンは、通常のOリングでもよいが、本発明にかかるパッキンとしても良い。 In the plating jig using the packing of the present invention, a groove portion that can accommodate the packing 1b portion exposed from the groove portion 511 may be recessed in the upper surface portion of the main body portion 41 to which the packing 1b is pressed. Further, a packing may be further provided on the upper surface portion of the main body portion 41 to which the packing 1b is pressed, and the packings may come into contact with each other for sealing. In this case, the packing attached to the main body 41 of the substrate holder 4 may be a normal O-ring, but may be a packing according to the present invention.
 また、本発明のパッキンを利用するめっき治具において、基板押さえ部5もしくは基板ホルダ4に取り付けられるパッキンは、図6(a)に示すように1箇所の溝部511につき1段に設けてもよいが、図6(b)、(c)に示すように、1箇所の溝部511につき上下2段に設けても良い。このとき、上下のパッキンは同一のものとしても良いが、上下で異なる種類としても良い。具体的には、例えば、下段のパッキンは空芯部を有さないヒモ状のパッキンとし、上段のパッキンは空芯部を有するチューブ状のものとしても良く(図6c)、あるいは、下段のパッキンは空芯部を有するチューブ状のものとし、上段のパッキンは空芯部を有さないヒモ状のパッキンとしても良い。このように、上下段のいずれか一方をヒモ状のパッキンとし、他方をチューブ状のものとすることにより、同一種類のものを2段にする場合とは異なる固有の弾性強度を実現でき、これにより、シール性の向上を図ることができる。 Further, in the plating jig using the packing of the present invention, the packing attached to the substrate pressing portion 5 or the substrate holder 4 may be provided in one step per groove portion 511 as shown in FIG. However, as shown in FIGS. 6B and 6C, one groove portion 511 may be provided in two upper and lower stages. At this time, the upper and lower packings may be the same, but may be different types in the upper and lower sides. Specifically, for example, the lower packing may be a string-like packing having no air core, and the upper packing may be a tube having an air core (FIG. 6c), or the lower packing. May be a tube having an air core, and the upper packing may be a string-like packing having no air core. In this way, by using either one of the upper and lower stages as a string-like packing and the other as a tube-like one, it is possible to achieve a unique elastic strength different from the case where the same kind is made into two stages. Thus, the sealing performance can be improved.
 また、上下2段に設ける場合、上段と下段において同一形状で異なる弾性素材のものとしても良く、上下で異なる耐薬品性を有するものとしても良い。例えば、外部に露出する上部のパッキンは耐薬品性が高いものを使用することは好ましい。さらに、上下段のいずれか一方に本発明にかかる有端のパッキンを用い、他方には無端のOリング等のパッキンを用いても良い。 In addition, when provided in two upper and lower stages, the upper and lower stages may be of the same shape and different elastic materials, or may have different chemical resistance in the upper and lower stages. For example, it is preferable to use an upper packing exposed to the outside having high chemical resistance. Furthermore, the ended packing according to the present invention may be used for one of the upper and lower stages, and the other endless packing such as an O-ring may be used.
   1 … … パッキン本体
   2 … … 接続部材
   3 … … めっき治具
   4 … … 基板ホルダ
   5 … … 基板押さえ部
   6 … … クランプ部材
   7 … … 第二通電部材
  11 … … 接続端
  12 … … 空芯部
  13 … … 内壁
  21 … … 軸部
  22 … … フック
  41 … … 本体部
  42 … … アーム部
  43 … … ハンガー部
  44 … … ヒンジ部
  51 … … 枠部  
  52 … … 取付部
  53 … … 開口部
 211 … … 端部
 411 … … 収容部
 412 … … 第一通電部材
   θ … … フックの突出角度
   X … … 軸芯
   W … … 基板
      
DESCRIPTION OF SYMBOLS 1 ...... Packing body 2 ...... Connection member 3 ...... Plating jig 4 ...... Substrate holder 5 ...... Substrate pressing part 6 ...... Clamp member 7 ...... Second electricity supply member 11 ...... Connection end 12 ...... Air core part 13 ... ... Inner wall 21 ... ... Shaft part 22 ... ... Hook 41 ... ... Body part 42 ... ... Arm part 43 ... ... Hanger part 44 ... ... Hinge part 51 ... ... Frame part
52…… Mounting portion 53…… Opening portion 211…… End portion 411…… Housing portion 412…… First energizing member θ…… Hook protrusion angle X…… Shaft core W…… Substrate

Claims (8)

  1.  めっき治具に取り付けられ、基板に通電するための通電部材と該通電部材が接する基板表面部分をめっき液からシールするための基板めっき治具用パッキンであって、長尺有端状の弾性部材からなるパッキン本体と、該パッキン本体の両端部の接続端を互いに連接して無端状とするための接続部材とを備え、該接続部材は、軸部と、該軸部の両側もしくは片側一方へ所定の角度で突出して設けられた複数のフックからなり、パッキン本体の両方の接続端を連接するとき、該接続部材は連接された接続端のつなぎ目にまたがって所定の範囲で接続端から双方のパッキン本体内に延伸するように内設されることを特徴とする基板めっき治具用パッキン。 A long-end elastic member that is attached to a plating jig and is a packing for a substrate plating jig for sealing a current-carrying member for energizing the substrate and a substrate surface portion in contact with the current-carrying member from the plating solution. And a connecting member for connecting the connecting ends of both end portions of the packing body to each other so as to be endless. The connecting member is connected to the shaft portion and both sides or one side of the shaft portion. It consists of a plurality of hooks projecting at a predetermined angle, and when connecting both connecting ends of the packing body, the connecting member extends from the connecting end to the both ends of the connecting end across the joint of the connected connecting ends. A packing for a substrate plating jig, wherein the packing is provided so as to extend into the packing body.
  2.  前記フックは、前記軸部より30°~90°の範囲の角度で突出するように形成されていることを特徴とする請求項1に記載の基板めっき治具用パッキン。 2. The packing for a substrate plating jig according to claim 1, wherein the hook is formed so as to protrude from the shaft portion at an angle in a range of 30 ° to 90 °.
  3.  前記パッキン本体が空芯部を有するチューブ状であることを特徴とする請求項1または2のいずれかに記載の基板めっき治具用パッキン。 3. The packing for a substrate plating jig according to claim 1, wherein the packing body is in a tube shape having an air core part.
  4.  前記パッキン本体がチューブ状であって、前記接続部材の軸部は該パッキン本体の空芯部内に収容されるとともに、前記フックの先端側が空芯部の内壁に食い込み、もしくは刺さることにより係止していることを特徴とする請求項1または2のいずれかに記載の基板めっき治具用パッキン。 The packing body is tube-shaped, and the shaft portion of the connecting member is accommodated in the air core portion of the packing body, and the front end side of the hook is engaged with the inner wall of the air core portion to be locked. The packing for a substrate plating jig according to claim 1, wherein the packing is for a substrate plating jig.
  5.  上面に基板収容部を備えた基板ホルダと、基板の被めっき面を露出させる開口を備え、基板ホルダとともに基板を挟み込んで保持する基板押さえ部と、基板ホルダに対して基板押さえ部を圧接状態で固定するための固定手段を備えた基板めっき治具であって、基板押さえ部の裏面に凹設された溝部に請求項1ないし4のいずれかに記載のパッキンが一部を溝部から露出するように挿設され、基板押さえ部が基板支持部に対して圧接状態にて固定されることにより、パッキンの溝部から露出した部分が基板表面と基板ホルダの上面に圧接され、基板の周縁部および基板収容部の周囲における通電部材が設けられた部分をめっき液よりシールすることを特徴とする基板めっき治具。 A substrate holder having a substrate housing portion on the upper surface, an opening for exposing the surface to be plated of the substrate, a substrate pressing portion for holding the substrate sandwiched together with the substrate holder, and the substrate pressing portion in pressure contact with the substrate holder A substrate plating jig provided with a fixing means for fixing, wherein the packing according to any one of claims 1 to 4 is partially exposed from the groove portion in the groove portion provided in the back surface of the substrate pressing portion. When the substrate pressing portion is fixed to the substrate support portion in a pressure contact state, the portion exposed from the groove portion of the packing is pressed against the substrate surface and the upper surface of the substrate holder, and the peripheral portion of the substrate and the substrate A substrate plating jig, wherein a portion provided with a current-carrying member around a housing portion is sealed from a plating solution.
  6.  上面に基板収容部を備えた基板ホルダと、基板の被めっき面を露出させる開口を備え、基板ホルダとともに基板を挟み込んで保持する基板押さえ部と、基板ホルダに対して基板押さえ部を圧接状態で固定するための固定手段を備えた基板めっき治具であって、基板押さえ部の裏面および基板支持部の上面に凹設された溝部に請求項1ないし4のいずれかに記載のパッキンが一部を溝部から露出するようにそれぞれ挿設され、基板押さえ部が基板支持部に対して圧接状態にて固定されることにより、パッキンの一部が基板表面と基板押さえ部の裏面に圧接され、基板の周縁部および基板収容部の周囲における通電部材が設けられた部分をめっき液よりシールすることを特徴とする基板めっき治具。 A substrate holder having a substrate housing portion on the upper surface, an opening for exposing the surface to be plated of the substrate, a substrate pressing portion for holding the substrate sandwiched together with the substrate holder, and the substrate pressing portion in pressure contact with the substrate holder 5. A substrate plating jig provided with a fixing means for fixing, wherein the packing according to any one of claims 1 to 4 is partially formed in a groove provided in a back surface of the substrate pressing portion and an upper surface of the substrate support portion. Are inserted so as to be exposed from the groove portions, and the substrate pressing portion is fixed in pressure contact with the substrate supporting portion, so that a part of the packing is pressed against the substrate surface and the back surface of the substrate pressing portion. A substrate plating jig, wherein a portion provided with a current-carrying member in the periphery of the substrate and the periphery of the substrate housing portion is sealed with a plating solution.
  7.  前記パッキンが1箇所の前記溝部につき上下2段に設けられていることを特徴とする請求項5または6のいずれかに記載の基板めっき治具。 The substrate plating jig according to claim 5 or 6, wherein the packing is provided in two upper and lower stages per one groove portion.
  8.  前記上下2段に設けられたパッキンのいずれか一方が空芯部を有するチューブ状のパッキンであり、他方が空芯部を有さないヒモ状のパッキンであることを特徴とする請求項7に記載の基板めっき治具。
     
     
    8. One of the packings provided in the two upper and lower stages is a tube-like packing having an air core part, and the other is a string-like packing having no air core part. The substrate plating jig described.

PCT/JP2014/058975 2014-03-27 2014-03-27 Packing for substrate plating jig and substrate plating jig using same WO2015145688A1 (en)

Priority Applications (5)

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PCT/JP2014/058975 WO2015145688A1 (en) 2014-03-27 2014-03-27 Packing for substrate plating jig and substrate plating jig using same
US15/127,936 US20170096744A1 (en) 2014-03-27 2014-03-27 Packing for substrate plating jig and substrate plating jig using the same
JP2016509771A JPWO2015145688A1 (en) 2014-03-27 2014-03-27 Packing for substrate plating jig and substrate plating jig using the same
CN201480077157.2A CN106103813A (en) 2014-03-27 2014-03-27 Substrate plating fixture liner and utilize its substrate plating fixture
KR1020167025772A KR20160138018A (en) 2014-03-27 2014-03-27 Packing for substrate plating jig and substrate plating jig using the same

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JP7132135B2 (en) * 2019-01-23 2022-09-06 上村工業株式会社 Work holding jig and electroplating device
JP7132136B2 (en) * 2019-01-23 2022-09-06 上村工業株式会社 Work holding jig and electroplating device
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JP7256027B2 (en) * 2019-02-20 2023-04-11 株式会社荏原製作所 Substrate holder and plating apparatus equipped with the substrate holder

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CN106103813A (en) 2016-11-09
US20170096744A1 (en) 2017-04-06

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