WO2015139357A1 - Mobile terminal - Google Patents
Mobile terminal Download PDFInfo
- Publication number
- WO2015139357A1 WO2015139357A1 PCT/CN2014/076468 CN2014076468W WO2015139357A1 WO 2015139357 A1 WO2015139357 A1 WO 2015139357A1 CN 2014076468 W CN2014076468 W CN 2014076468W WO 2015139357 A1 WO2015139357 A1 WO 2015139357A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- audio component
- component
- mobile terminal
- circuit board
- printed circuit
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 239000006260 foam Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 7
- 230000002708 enhancing effect Effects 0.000 abstract description 2
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 11
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 11
- 230000001965 increasing effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Definitions
- the present invention relates to a mobile terminal, and in particular to a mobile terminal that enhances the reliability of an audio component.
- a mobile terminal that enhances the reliability of an audio component.
- the terminal software will set the sound level to different levels.
- the output power of the audio component is natural. Will also increase.
- the body of the audio component gradually heats up, and the temperature of the internal magnetic structure rises, which not only reduces the sensitivity of the audio component, but also affects the magnetic flux density, thereby causing distortion and even causing audio components. damage.
- an object of embodiments of the present invention is to provide a mobile terminal that solves the problem that an audio component of a mobile terminal is not easily improved due to heat generation problems, and is easily damaged.
- An embodiment of the present invention provides a mobile terminal, including a front case, a rear case, an audio component and a printed circuit board disposed between the front case and the rear case, and further includes a heat conductive part, and the audio part is printed
- An accommodation space is disposed between the circuit boards, the heat conducting component is disposed in the receiving space, a first surface of the heat conducting component is in contact with a magnetic structural surface of the audio component, and a second surface is opposite to the printed circuit board Grounded copper contact.
- the heat conducting member is a sheet structure.
- the heat conductive member has a thickness of 0.1 mm.
- the first side of the thermally conductive component completely covers the magnetic structural surface of the audio component.
- the first surface of the heat conducting component is adhesively bonded to the magnetic structural surface of the audio component.
- the rear case is provided with a sound chamber for accommodating the audio component, and after assembly, the audio component, the heat conducting component, and the printed circuit board are sequentially pressed together under the pressing of the rear case.
- a foam is adhered to the sound chamber, and a diaphragm surface of the audio component is adhered to the foam.
- the copper surface of the printed circuit board grounded is in contact with the front case through a metal bracket.
- the material of the heat conducting component is graphite or thermal silica gel.
- the audio component comprises at least one speaker and a microphone.
- FIG. 1 is a schematic structural view of an embodiment of the present invention
- FIG. 2 is a schematic structural view of an audio component according to an embodiment of the present invention.
- FIG. 1 is a schematic structural view of an embodiment of the present invention.
- an embodiment of the present invention provides a mobile terminal, including a front case 1, a rear case 2, an audio component 3 disposed between the front case 1 and the rear case 2, and a printed circuit board 4 (PCB - Printed Circuit Board) and thermal conductive parts 5.
- the bottom of the rear case 2 is provided with a sound chamber 21 for accommodating the audio component 3, and the sound chamber 21 is adhered with a foam 6 for restricting the displacement of the audio component 3, and the diaphragm surface of the audio component 3 is adhered to the foam. 6 on.
- An accommodation space for accommodating the heat conductive member 5 is provided between the audio component 3 and the printed circuit board 4.
- the heat conductive member 5 is a sheet-shaped heat conductive silica gel. In order to ensure good heat storage capacity, the thickness of the heat conductive silica gel is about 0.1 mm. As shown in FIG. 1 and FIG. 2, the heat conducting member 5 is disposed in the accommodating space formed by the audio component 3 and the printed circuit board 4, the first side of the heat conducting component 5 and the audio component 3 The magnetic structure surface 31 is adhesively bonded, and the second surface is in contact with the copper surface 41 to which the PCB 4 is grounded. In the present embodiment, in order to achieve a better heat conduction effect, the first face of the heat conductive member 5 completely covers the magnetic structure surface 31 of the audio component 3.
- the heat generated by the audio component 3 during operation can be effectively transmitted to the PCB 4 through the heat conductive component 5, and the original radiation heat dissipation mode is optimized as a heat conduction heat dissipation mode, which increases the heat transfer efficiency and makes the audio component Reliability is greatly improved, reducing the possibility of damage to audio components.
- the audio component 3, the heat conducting component 5, and the PCB 4 are sequentially pressed together under the extrusion of the rear case 2 to maintain reliable contact.
- the copper surface 41 of the PCB 4 grounded may be in contact with the front case 1 through the metal bracket 8, so that the heat of the audio component 3 is conducted to the copper foil of the PCB 4 through the heat conduction member 5, and the thermal conductivity is high.
- the copper foil spreads the heat to the surface of the PCB 4, and then the heat generated by the audio component 3 is radiated to the whole machine through the metal bracket 8, which greatly increases the heat dissipation area and improves the heat dissipation rate.
- the audio component 3 is a separate Speaker and Receiver 2-in-1 device.
- the audio component 3 can also be a Speaker and Receiver placed in the upper and lower two sound chambers, or three Speakers to satisfy the stereo experience of the music enthusiast.
- the material of the heat conductive member 5 may also be graphite.
- the heat-conducting member 5 itself has the characteristics of good elasticity, strong heat dissipation capability, and high impact load resistance, and can not only conduct heat, but also control the displacement of the audio component 3, and protect the audio component 3 when the mobile terminal receives an external force impact. In the prior art, the protection of the audio component is achieved by sacrificing the audio index or the manufacturing cost, and the present embodiment adds heat to the audio component 3 by adding the heat conducting component 5 between the audio component 3 and the PCB 4.
- the copper foil on the PCB 4 serves as a good conductor of heat, and the ground hole is used to uniformly distribute the heat to the whole.
- the heat dissipation area is increased, and the heat dissipation effect of the audio component 3 is enhanced.
- the metal bracket 8 the heat is further spread from the PCB 4 to the whole machine, whereby the heat generated by the audio component 3 is quickly dissipated to restore the normal temperature.
- the improvement of the embodiment of the invention not only enhances the reliability of the audio component, but also increases the service life of the audio component and even the whole machine.
- the above embodiments are only used to describe the technical solutions of the embodiments of the present invention, and the technical solutions of the embodiments of the present invention may be modified or equivalently replaced without departing from the technical solutions of the embodiments of the present invention.
- the scope of the spirit should be covered by the scope of the claims of the embodiments of the invention.
- Industrial Applicability The technical solution provided by the embodiments of the present invention can be applied to a mobile terminal, by providing a heat conducting component that is in contact with both of the audio component and the printed circuit board, so that the heat generated by the audio component is generated.
- the heat conduction component can be uniformly conducted to the printed circuit board, thereby increasing the heat dissipation effect of the audio component. Thereby, the heat generated by the audio component during use is effectively distributed, and the usability of the audio component is enhanced, and the service life thereof is also increased.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
Provided is a mobile terminal. The mobile terminal comprises a front shell (1), a rear shell (2), an audio component (3) arranged between the front shell (1) and the rear shell (2) and a printed circuit board (4). The mobile terminal also comprises a heat conduction component (5). An accommodating space is provided between the audio component (3) and the printed circuit board (4); the heat conduction component (5) is arranged in the accommodating space; and the first surface of the heat conduction component (5) comes into contact with a magnetic structure surface (31) of the audio component (3), and the second surface thereof comes into contact with a grounded copper surface (41) of the printed circuit board (4). In the present invention, the heat conduction component (5) which comes into contact with and is connected to both the audio component (3) and the printed circuit board (4) is arranged between the audio component (3) and the printed circuit board (4), so that the heat generated by the audio component (3) can be conducted to the printed circuit board (4) uniformly via the heat conduction component (5), and therefore the heat dissipation effect of the audio component (3) is improved, thereby effectively dissipating the heat generated during the process of using the audio component (3), enhancing the reliability of the audio component (3) and prolonging the service life thereof.
Description
一种移动终端 技术领域 本发明实施例涉及一种移动终端，尤其涉及一种增强音频部件可靠性的移动终端。 背景技术 现有的移动终端， 都会配有至少一个音频部件， 最常见的包括一个扬声器 The present invention relates to a mobile terminal, and in particular to a mobile terminal that enhances the reliability of an audio component. BACKGROUND OF THE INVENTION Existing mobile terminals are equipped with at least one audio component, the most common of which includes a speaker.
( Speaker)和一个收音器（Receiver)。 其中 Speaker用于 MP3外放、 免提通话、 来电 铃音等； Receiver用于手持通话。 为了满足不同用户需求以及不同应用场景， 终端软 件会将声音响度设置成高低不同的等级， 当用户需要大铃音响度， 比如外放 MP3或者 在吵杂的环境下通话， 音频部件的输出功率自然也会增加。 当音频部件长时间工作在 大音量状态下， 音频部件本体会逐渐发热， 内部磁性结构温度上升， 这样不仅会降低 音频部件的灵敏度， 还会影响到磁通密度， 从而引起失真， 甚至导致音频部件损坏。 针对此问题， 目前常见的解决方案是： 1、 使用钕铁硼材料， 可以做到耐高温 150 度左右； 2、 降低铃声响度。传统解决方案虽然能在一定程度上解决音频部件的发热问 题， 但是使用钕铁硼材料成本很高， 而降低铃声响度会影响用户体验， 此问题有待解 决。 发明内容 基于现有技术中存在的上述缺陷， 本发明实施例的目的在于提供一种移动终端， 解决移动终端的音频部件由于发热问题得不到有效改善， 而容易损坏的问题。 本发明实施例提供了一种移动终端， 包括前壳、 后壳、 设置于所述前壳和后壳之 间的音频部件和印制电路板， 还包括导热部件， 所述音频部件与印制电路板之间设置 有容纳空间， 所述导热部件设置在所述容纳空间中， 所述导热部件的第一面与所述音 频部件的磁性结构表面接触， 第二面与所述印制电路板接地的铜面接触。 优选地， 所述导热部件为片体结构。 优选地， 所述导热部件的厚度为 0.1mm 。 优选地， 所述导热部件的第一面完全覆盖住所述音频部件的磁性结构表面。
优选地， 所述导热部件的第一面与所述音频部件的磁性结构表面黏贴连接。 优选地， 所述后壳设置有用于容纳所述音频部件的音腔， 组装后， 在所述后壳的 挤压下， 所述音频部件、 导热部件、 印制电路板依次压接在一起。 优选地， 所述音腔中还黏附有泡棉， 所述音频部件的振膜面黏附于所述泡棉上。 优选地， 所述印制电路板接地的铜面通过金属支架与所述前壳相接触。 优选地， 所述导热部件的材料为石墨或者导热硅胶。 优选地， 所述音频部件包括至少一个扬声器和一个话筒。 本发明实施例的有益效果在于， 通过在所述音频部件与印制电路板之间设置了与 两者均接触连接的导热部件， 使得所述音频部件产生的热量能够通过所述导热部件均 匀的传导至所述印制电路板上， 增加了所述音频部件的散热效果， 从而有效的散发了 所述音频部件在使用过程中产生的热量， 增强了所述音频部件可靠性的同时， 也增加 了其使用寿命。 附图说明 图 1为本发明实施例的结构示意图； 图 2为本发明实施例的音频部件的结构示意图。 具体实施方式 为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合附图及具体实 施例对本发明实施例进行详细描述。 图 1为本发明实施例的结构示意图。 如图 1所示， 本发明实施例提供一种移动终 端，包括前壳 1、后壳 2、设置于前壳 1和后壳 2之间的音频部件 3、印制电路板 4 (PCB - Printed Circuit Board) 及导热部件 5。 在本实施例中， 后壳 2的底部设置有用于容纳 音频部件 3的音腔 21， 音腔 21 中黏附有限制音频部件 3位移的泡棉 6， 音频部件 3 的振膜面黏附于泡棉 6上。 音频部件 3与印制电路板 4之间设置有用于容纳导热部件 5的容纳空间。 在本实施例中， 导热部件 5为呈片状的导热硅胶， 为了保证其良好的 储热能力， 导热硅胶的厚度约为 0.1mm。 结合图 1、 图 2所示， 导热部件 5设置在音 频部件 3与印制电路板 4所形成的容纳空间中， 导热部件 5的第一面与音频部件 3的
磁性结构表面 31黏贴连接， 第二面与 PCB 4接地的铜面 41接触。 在本实施例中， 为 了达到更好的导热效果， 导热部件 5的第一面完全覆盖住音频部件 3的磁性结构表面 31。如此，音频部件 3在工作中所产生的热量，能够有效的通过导热部件 5传导给 PCB 4， 将原有的辐射散热的方式优化为导热的散热方式， 增加了热传递效率， 使音频部件 的可靠性能大大提升， 减少了音频部件损坏的可能性。 组装后， 在后壳 2的挤压下， 音频部件 3、 导热部件 5、 PCB 4依次压接在一起， 保持可靠接触。 为了进一步改善散热效果， PCB 4接地的铜面 41可通过金属支架 8与前壳 1相接 触， 如此， 音频部件 3的热量通过导热部件 5传导给 PCB 4的铜箔， 通过这些导热率 较高的铜箔， 将热量散播到 PCB 4的表面， 再通过金属支架 8， 将音频部件 3产生的 热量散发到整机， 大大的增加了散热面积， 提高了散热率。 在本实施例中， 音频部件 3为单独的一个 Speaker和 Receiver二合一器件。 音频 部件 3也可为分别放置于上下两个音腔中的 Speaker和 Receiver, 亦可为三个 Speaker 以满足音乐发烧友的立体声体验。 导热部件 5的材料也可选用石墨。 导热部件 5本身 具有弹性好、 散热能力强、 承受冲击载荷能力大的性能， 不仅能够导热， 还能控制音 频部件 3移位， 在移动终端收到外力冲击的时候保护音频部件 3。 在现有技术中， 音频部件的保护是通过牺牲音频指标或者是制造成本来实现的， 而本实施例通过在音频部件 3与 PCB 4之间增设了导热部件 5， 使得音频部件 3产生 的热量能够通过导热部件 5均匀的传导至 PCB 4上， 将原有的辐射散热的方式转化为 导热的散热方式， PCB 4上的铜箔作为热的良导体， 配合地孔使得热量均匀的散布到 整板 PCB 4上， 增大了散热面积， 增强了音频部件 3的散热效果。 而后， 再通过金属 支架 8， 有效的将热量进一步从 PCB 4散布到整机， 由此， 音频部件 3产生的热量得 以快速散发， 以恢复正常温度。 本发明实施例的改进不仅增强了音频部件的可靠性， 同时也增加了音频部件乃至整机的使用寿命。 以上实施例仅用以说明本发明实施例的技术方案而非限制， 本领域的普通技术人 员应当理解， 可以对本发明实施例的技术方案进行修改或者等同替换， 而不脱离本发 明实施例技术方案的精神范围， 其均应涵盖在本发明实施例的权利要求范围当中。 工业实用性 本发明实施例提供的技术方案可以应用于移动终端， 通过在所述音频部件与印制 电路板之间设置了与两者均接触连接的导热部件， 使得所述音频部件产生的热量能够 通过所述导热部件均匀的传导至所述印制电路板上，增加了所述音频部件的散热效果，
从而有效的散发了所述音频部件在使用过程中产生的热量， 增强了所述音频部件可 性的同时， 也增加了其使用寿命。
(Speaker) and a receiver (Receiver). Among them, Speaker is used for MP3 external release, hands-free calling, call ring tone, etc.; Receiver is used for handheld calls. In order to meet different user needs and different application scenarios, the terminal software will set the sound level to different levels. When the user needs a big bell sound level, such as external MP3 or talking in a noisy environment, the output power of the audio component is natural. Will also increase. When the audio component is working at a large volume for a long time, the body of the audio component gradually heats up, and the temperature of the internal magnetic structure rises, which not only reduces the sensitivity of the audio component, but also affects the magnetic flux density, thereby causing distortion and even causing audio components. damage. In response to this problem, the current common solutions are: 1. Using NdFeB materials, it can achieve high temperature resistance of about 150 degrees; 2. Reduce ringing loudness. Although the traditional solution can solve the heating problem of the audio component to a certain extent, the use of the NdFeB material is costly, and reducing the ringing loudness will affect the user experience, and this problem needs to be solved. SUMMARY OF THE INVENTION Based on the above-mentioned deficiencies in the prior art, an object of embodiments of the present invention is to provide a mobile terminal that solves the problem that an audio component of a mobile terminal is not easily improved due to heat generation problems, and is easily damaged. An embodiment of the present invention provides a mobile terminal, including a front case, a rear case, an audio component and a printed circuit board disposed between the front case and the rear case, and further includes a heat conductive part, and the audio part is printed An accommodation space is disposed between the circuit boards, the heat conducting component is disposed in the receiving space, a first surface of the heat conducting component is in contact with a magnetic structural surface of the audio component, and a second surface is opposite to the printed circuit board Grounded copper contact. Preferably, the heat conducting member is a sheet structure. Preferably, the heat conductive member has a thickness of 0.1 mm. Preferably, the first side of the thermally conductive component completely covers the magnetic structural surface of the audio component. Preferably, the first surface of the heat conducting component is adhesively bonded to the magnetic structural surface of the audio component. Preferably, the rear case is provided with a sound chamber for accommodating the audio component, and after assembly, the audio component, the heat conducting component, and the printed circuit board are sequentially pressed together under the pressing of the rear case. Preferably, a foam is adhered to the sound chamber, and a diaphragm surface of the audio component is adhered to the foam. Preferably, the copper surface of the printed circuit board grounded is in contact with the front case through a metal bracket. Preferably, the material of the heat conducting component is graphite or thermal silica gel. Preferably, the audio component comprises at least one speaker and a microphone. An advantageous effect of the embodiment of the present invention is that a heat conducting component that is in contact with both of the audio component and the printed circuit board is disposed such that heat generated by the audio component can be uniform through the heat conducting component. Conduction to the printed circuit board increases the heat dissipation effect of the audio component, thereby effectively dissipating the heat generated by the audio component during use, enhancing the reliability of the audio component, and increasing Its service life. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic structural view of an embodiment of the present invention; FIG. 2 is a schematic structural view of an audio component according to an embodiment of the present invention. The embodiments of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. FIG. 1 is a schematic structural view of an embodiment of the present invention. As shown in FIG. 1 , an embodiment of the present invention provides a mobile terminal, including a front case 1, a rear case 2, an audio component 3 disposed between the front case 1 and the rear case 2, and a printed circuit board 4 (PCB - Printed Circuit Board) and thermal conductive parts 5. In the present embodiment, the bottom of the rear case 2 is provided with a sound chamber 21 for accommodating the audio component 3, and the sound chamber 21 is adhered with a foam 6 for restricting the displacement of the audio component 3, and the diaphragm surface of the audio component 3 is adhered to the foam. 6 on. An accommodation space for accommodating the heat conductive member 5 is provided between the audio component 3 and the printed circuit board 4. In the present embodiment, the heat conductive member 5 is a sheet-shaped heat conductive silica gel. In order to ensure good heat storage capacity, the thickness of the heat conductive silica gel is about 0.1 mm. As shown in FIG. 1 and FIG. 2, the heat conducting member 5 is disposed in the accommodating space formed by the audio component 3 and the printed circuit board 4, the first side of the heat conducting component 5 and the audio component 3 The magnetic structure surface 31 is adhesively bonded, and the second surface is in contact with the copper surface 41 to which the PCB 4 is grounded. In the present embodiment, in order to achieve a better heat conduction effect, the first face of the heat conductive member 5 completely covers the magnetic structure surface 31 of the audio component 3. In this way, the heat generated by the audio component 3 during operation can be effectively transmitted to the PCB 4 through the heat conductive component 5, and the original radiation heat dissipation mode is optimized as a heat conduction heat dissipation mode, which increases the heat transfer efficiency and makes the audio component Reliability is greatly improved, reducing the possibility of damage to audio components. After assembly, the audio component 3, the heat conducting component 5, and the PCB 4 are sequentially pressed together under the extrusion of the rear case 2 to maintain reliable contact. In order to further improve the heat dissipation effect, the copper surface 41 of the PCB 4 grounded may be in contact with the front case 1 through the metal bracket 8, so that the heat of the audio component 3 is conducted to the copper foil of the PCB 4 through the heat conduction member 5, and the thermal conductivity is high. The copper foil spreads the heat to the surface of the PCB 4, and then the heat generated by the audio component 3 is radiated to the whole machine through the metal bracket 8, which greatly increases the heat dissipation area and improves the heat dissipation rate. In this embodiment, the audio component 3 is a separate Speaker and Receiver 2-in-1 device. The audio component 3 can also be a Speaker and Receiver placed in the upper and lower two sound chambers, or three Speakers to satisfy the stereo experience of the music enthusiast. The material of the heat conductive member 5 may also be graphite. The heat-conducting member 5 itself has the characteristics of good elasticity, strong heat dissipation capability, and high impact load resistance, and can not only conduct heat, but also control the displacement of the audio component 3, and protect the audio component 3 when the mobile terminal receives an external force impact. In the prior art, the protection of the audio component is achieved by sacrificing the audio index or the manufacturing cost, and the present embodiment adds heat to the audio component 3 by adding the heat conducting component 5 between the audio component 3 and the PCB 4. It can be uniformly transmitted to the PCB 4 through the heat conducting component 5, and the original radiation heat dissipation mode is converted into a heat conduction heat dissipation mode. The copper foil on the PCB 4 serves as a good conductor of heat, and the ground hole is used to uniformly distribute the heat to the whole. On the board PCB 4, the heat dissipation area is increased, and the heat dissipation effect of the audio component 3 is enhanced. Then, through the metal bracket 8, the heat is further spread from the PCB 4 to the whole machine, whereby the heat generated by the audio component 3 is quickly dissipated to restore the normal temperature. The improvement of the embodiment of the invention not only enhances the reliability of the audio component, but also increases the service life of the audio component and even the whole machine. The above embodiments are only used to describe the technical solutions of the embodiments of the present invention, and the technical solutions of the embodiments of the present invention may be modified or equivalently replaced without departing from the technical solutions of the embodiments of the present invention. The scope of the spirit should be covered by the scope of the claims of the embodiments of the invention. Industrial Applicability The technical solution provided by the embodiments of the present invention can be applied to a mobile terminal, by providing a heat conducting component that is in contact with both of the audio component and the printed circuit board, so that the heat generated by the audio component is generated. The heat conduction component can be uniformly conducted to the printed circuit board, thereby increasing the heat dissipation effect of the audio component. Thereby, the heat generated by the audio component during use is effectively distributed, and the usability of the audio component is enhanced, and the service life thereof is also increased.
Claims
权 利 要 求 书 一种移动终端， 包括前壳、 后壳、 设置于所述前壳和后壳之间的音频部件和印 制电路板，还包括导热部件，所述音频部件与印制电路板之间设置有容纳空间， 所述导热部件设置在所述容纳空间中， 所述导热部件的第一面与所述音频部件 的磁性结构表面接触， 第二面与所述印制电路板接地的铜面接触。 根据权利要求 1所述的移动终端， 其中， 所述导热部件为片体结构。 The claim is a mobile terminal, including a front case, a back case, an audio component and a printed circuit board disposed between the front case and the back case, and also includes a thermal conductive component, between the audio component and the printed circuit board An accommodation space is provided between them, the thermally conductive component is arranged in the accommodation space, the first surface of the thermally conductive component is in contact with the magnetic structure surface of the audio component, and the second surface is in contact with the grounded copper of the printed circuit board. surface contact. The mobile terminal according to claim 1, wherein the thermally conductive component has a sheet structure.
3. 根据权利要求 2所述的移动终端， 其中， 所述导热部件的厚度为 0.1mm 根据权利要求 1所述的移动终端， 其中， 所述导热部件的第一面完全覆盖住所 述音频部件的磁性结构表面。 根据权利要求 1所述的移动终端， 其中， 所述导热部件的第一面与所述音频部 件的磁性结构表面黏贴连接。 根据权利要求 1所述的移动终端， 其中， 所述后壳设置有用于容纳所述音频部 件的音腔， 组装后， 在所述后壳的挤压下， 所述音频部件、 导热部件、 印制电 路板依次压接在一起。 根据权利要求 6所述的移动终端， 其中， 所述音腔中还黏附有泡棉， 所述音频 部件的振膜面黏附于所述泡棉上。 根据权利要求 1所述的移动终端， 其中， 所述印制电路板接地的铜面通过金属 支架与所述前壳相接触。 根据权利要求 1所述的移动终端， 其中， 所述导热部件的材料为石墨或者导热 硅胶。 根据权利要求 1所述的移动终端， 其中， 所述音频部件包括至少一个扬声器和 一个话筒。
3. The mobile terminal according to claim 2, wherein the thickness of the thermally conductive component is 0.1 mm. The mobile terminal according to claim 1, wherein the first surface of the thermally conductive component completely covers the audio component. Magnetic structured surface. The mobile terminal according to claim 1, wherein the first surface of the thermally conductive component is adhesively connected to the magnetic structure surface of the audio component. The mobile terminal according to claim 1, wherein the back shell is provided with a sound cavity for accommodating the audio component. After assembly, under the extrusion of the back shell, the audio component, thermal conductive component, and printing The circuit boards are pressed together in sequence. The mobile terminal according to claim 6, wherein foam is also adhered to the sound cavity, and the diaphragm surface of the audio component is adhered to the foam. The mobile terminal according to claim 1, wherein the grounded copper surface of the printed circuit board is in contact with the front case through a metal bracket. The mobile terminal according to claim 1, wherein the material of the thermally conductive component is graphite or thermally conductive silica gel. The mobile terminal according to claim 1, wherein the audio component includes at least one speaker and a microphone.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420003850.2U CN203722986U (en) | 2014-01-03 | 2014-01-03 | Mobile terminal |
| CN201420003850.2 | 2014-03-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015139357A1 true WO2015139357A1 (en) | 2015-09-24 |
Family
ID=51162101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2014/076468 WO2015139357A1 (en) | 2014-01-03 | 2014-04-29 | Mobile terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203722986U (en) |
| WO (1) | WO2015139357A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10729036B2 (en) | 2016-09-28 | 2020-07-28 | Huawei Technologies Co., Ltd. | Heat dissipation structure for electronic device and electronic device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106453702A (en) * | 2016-09-28 | 2017-02-22 | 努比亚技术有限公司 | Cover plate and smart phone |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2598039Y (en) * | 2002-12-06 | 2004-01-07 | 李秉彧 | Inserted thin material space improved radiating structure for small horn |
| CN102223590A (en) * | 2010-04-14 | 2011-10-19 | 财团法人工业技术研究院 | Planar loudspeaker with heat-dissipation structure and heat-dissipation method of planar loudspeaker |
| CN202334626U (en) * | 2011-11-29 | 2012-07-11 | 四川华立德科技有限公司 | Mobile phone structure facilitating heat dissipation |
-
2014
- 2014-01-03 CN CN201420003850.2U patent/CN203722986U/en not_active Expired - Fee Related
- 2014-04-29 WO PCT/CN2014/076468 patent/WO2015139357A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2598039Y (en) * | 2002-12-06 | 2004-01-07 | 李秉彧 | Inserted thin material space improved radiating structure for small horn |
| CN102223590A (en) * | 2010-04-14 | 2011-10-19 | 财团法人工业技术研究院 | Planar loudspeaker with heat-dissipation structure and heat-dissipation method of planar loudspeaker |
| CN202334626U (en) * | 2011-11-29 | 2012-07-11 | 四川华立德科技有限公司 | Mobile phone structure facilitating heat dissipation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10729036B2 (en) | 2016-09-28 | 2020-07-28 | Huawei Technologies Co., Ltd. | Heat dissipation structure for electronic device and electronic device |
| US11122710B2 (en) | 2016-09-28 | 2021-09-14 | Huawei Technologies Co., Ltd. | Heat dissipation structure for electronic device and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203722986U (en) | 2014-07-16 |
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