CN213368439U

CN213368439U - Heat radiation protective shell

Info

Publication number: CN213368439U
Application number: CN202022481153.6U
Authority: CN
Inventors: 李豪
Original assignee: Shenzhen Ranvoo Technology Co Ltd
Current assignee: Shenzhen Ranvoo Technology Co Ltd
Priority date: 2020-10-30
Filing date: 2020-10-30
Publication date: 2021-06-04
Anticipated expiration: 2030-10-30

Abstract

The utility model discloses a heat dissipation protective housing, a be used for the heat dissipation for mobile terminal, the heat dissipation protective housing is equipped with the chamber that holds that is used for loading mobile terminal, the heat dissipation protective housing is including being used for forming the frame that holds the chamber lateral wall and being used for forming the heat dissipation backplate that holds the chamber diapire, frame and heat dissipation backplate form jointly and hold the chamber, the heat dissipation backplate includes the heat-conducting adhesive layer, graphite alkene layer and metal level, the heat-conducting adhesive layer is used for contacting with mobile terminal, the metal level is located the heat-conducting adhesive layer and keeps away from the one side that holds the chamber and expose in the bottom of this heat dissipation protective housing, graphite alkene layer is located between heat-conducting adhesive layer. The heat-conducting adhesive layer can improve the bonding performance with the mobile terminal and can be fully contacted; the graphene layer has very good heat conduction performance, and heat can be uniformly dispersed on the whole graphene layer; the metal layer has good heat dissipation performance and can quickly dissipate heat generated by the mobile terminal.

Description

Heat radiation protective shell

Technical Field

The utility model relates to a mobile terminal accessory technical field especially relates to a heat dissipation protective housing.

Background

The mobile phone in the current society becomes an important tool for people to people communication in daily life, and people often drop the mobile phone carelessly when using the mobile phone in daily life, so that the mobile phone is easily damaged, and property loss is caused to users. In order to protect the mobile phone of the user from being scratched or broken, various mobile phone shells come along, but the functions of the mobile phone shells on the market are often single, the outer surfaces of the mobile phone shells are easily worn, the heat dissipation effect is poor, the mobile phone is easy to heat and scald after being used for a long time, and the normal use of the mobile phone is affected. The smart mobile phone can send more heat in long-time use or when running a large amount of programs, and if this part heat can not in time dispel the heat, can cause the cell-phone slow response, reduces the life of battery. Over time, the service performance of the mobile phone is affected, which causes great trouble to the user.

SUMMERY OF THE UTILITY MODEL

In order to overcome the shortcoming and the deficiency that exist among the prior art, the utility model aims to provide a heat dissipation protective housing to but the cell-phone protection radiating effect is poor among the solution prior art problem.

The purpose of the utility model is realized through the following technical scheme:

the utility model provides a heat dissipation protective housing, a be used for dispelling the heat for mobile terminal, this heat dissipation protective housing is equipped with the chamber that holds that is used for loading this mobile terminal, this heat dissipation protective housing is including being used for forming the frame that should hold the chamber lateral wall and being used for forming the heat dissipation backplate that should hold the chamber diapire, this frame and this heat dissipation backplate form jointly and should hold the chamber, this heat dissipation backplate includes the heat conduction glue film, graphite alkene layer and metal level, this heat conduction glue film is used for contacting with this mobile terminal, this metal level is kept away from this heat conduction glue film and should hold one side in the chamber and show in the bottom of this heat dissipation protective housing, this graphite alkene layer is located between this heat conduction glue film and this metal level, this graphite alkene layer is used for conducting the heat that.

Furthermore, the metal layer is provided with a plurality of heat dissipation holes.

Furthermore, a heat dissipation enhancing area is formed by the heat dissipation holes and corresponds to the processor of the mobile terminal.

Further, this heat dissipation backplate still includes the dust layer, and this dust layer is located between this graphite alkene layer and this metal level, and this dust layer is used for sheltering from this louvre.

Further, this heat dissipation backplate still includes the viscose layer, and this viscose layer is located between this dust prevention layer and this graphite alkene layer, and this dust prevention layer passes through this viscose layer and bonds with this graphite alkene layer.

Further, the dustproof layer is any one of teflon, copper and heat-conducting glue.

Further, this heat dissipation protective housing still includes the bottom plate, and the hardness of this bottom plate is greater than the hardness of this frame, and this heat dissipation backplate passes through this bottom plate and is connected with this frame.

Furthermore, the bottom plate is provided with a first connecting portion along the outer edge of the heat dissipation back plate, the metal layer is provided with a second connecting portion matched with the first connecting portion, and the first connecting portion and the second connecting portion are mutually bonded.

Furthermore, the outer edge of the bottom plate is provided with a third connecting part, the frame is provided with a fourth connecting part matched with the third connecting part, and the third connecting part is connected with the fourth connecting part.

Further, the heat-conducting adhesive layer contains a phase-change energy storage material.

The utility model has the advantages that: the heat-conducting adhesive layer has very good bonding performance and can be fully contacted with the mobile terminal, so that the heat-conducting effect of the heat-conducting adhesive layer is enhanced; the graphene layer has very good heat conduction performance, and heat can be uniformly distributed on the whole graphene layer, so that local temperature is reduced; the metal layer has very good heat dissipation performance, can dispel the heat that the mobile terminal produced fast, and the metal layer is shown in the bottom and can also let the user through touching the metal layer to directly experience its radiating effect.

Drawings

Fig. 1 is a schematic front view of the heat dissipation protective housing of the present invention;

fig. 2 is a schematic rear view of the heat dissipation protective housing of the present invention;

fig. 3 is a schematic view of the detachable structure of the heat dissipation protective housing of the present invention;

fig. 4 is a schematic cross-sectional structure view of the heat dissipation protective casing of the present invention;

fig. 5 is a partially enlarged schematic view of a portion a in fig. 4.

In the figure: the heat dissipation protective housing 10, the accommodating cavity 101, the first through hole 102, the second through hole 103, the avoiding notch 104, the frame 11, the fourth connecting portion 111, the heat dissipation back plate 12, the heat conductive adhesive layer 121, the graphene layer 122, the metal layer 123, the heat dissipation hole 123a, the second connecting portion 123b, the dust-proof layer 124, the adhesive layer 125, the bottom plate 13, the first connecting portion 131, the third connecting portion 132, and the mounting hole 133.

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the objects of the present invention, the following detailed description is provided in conjunction with the accompanying drawings and preferred embodiments for the specific embodiments, structures, features and effects of the heat dissipation protection shell according to the present invention as follows:

as shown in fig. 1 to 5, the utility model provides a pair of heat dissipation protective housing 10 for the heat dissipation of mobile terminal (for example cell-phone, panel computer or palm computer), heat dissipation protective housing 10 is equipped with the chamber 101 that holds that is used for loading mobile terminal, and heat dissipation protective housing 10 is including being used for forming the frame 11 that holds the chamber 101 lateral wall and being used for forming the heat dissipation backplate 12 that holds the chamber 101 diapire, and frame 11 and heat dissipation backplate 12 form jointly and hold chamber 101. The heat dissipation back plate 12 includes a heat conductive adhesive layer 121, a graphene layer 122 and a metal layer 123, the heat conductive adhesive layer 121 is used for contacting with the mobile terminal, the metal layer 123 is located on one side of the heat conductive adhesive layer 121 far away from the accommodating cavity 101 and exposed at the bottom of the heat dissipation protective housing 10 (i.e., the back of the heat dissipation protective housing 10), the graphene layer 122 is located between the heat conductive adhesive layer 121 and the metal layer 123, and the graphene layer 122 is used for conducting heat generated by the mobile terminal to the metal layer 123 through the heat. Specifically, when using heat dissipation protective housing 10, mobile terminal installs in holding chamber 101, and mobile terminal's side contacts with frame 11 inner wall, and mobile terminal's the back contacts with heat-conducting glue layer 121, and mobile terminal produces and is heat conduction to heat-conducting glue layer 121 on, the rethread graphene layer 122 conducts to metal level 123 to reach fine radiating effect.

The heat conductive adhesive layer 121 is preferably a heat conductive silica gel and contains a phase change energy storage material, and the phase change energy storage material is a heat management material with high heat storage capacity and is made by wrapping a stable matrix with a phase change material. The phase change energy storage material is suitable for being prepared into sheets, and meets the requirements of portable equipment with small size space and light weight. In the phase change process of the phase change energy storage material, not only the appearance shape is not obviously changed, but also a large amount of heat can be absorbed, and further the heat conduction effect of the heat conduction adhesive layer 121 is effectively improved. Wherein, the phase change energy storage material is preferably paraffin. The heat-conducting adhesive layer 121 has a very good adhesion performance, and can be fully contacted with the mobile terminal, so that the heat-conducting effect of the heat-conducting adhesive layer is enhanced. Graphene layer 122 is preferably a thin film layer containing graphene powder, and graphene layer 122 has very good thermal conductivity, and can uniformly spread heat on the whole graphene layer 122, thereby reducing local temperature. The metal layer 123 is preferably made of aluminum alloy or copper, the metal layer 123 has excellent heat dissipation performance and can quickly dissipate heat generated by the mobile terminal, and the metal layer 123 is exposed at the bottom, so that a user can directly feel the heat dissipation effect by touching the metal layer 123.

Further, the metal layer 123 is provided with a plurality of heat dissipation holes 123 a. In this embodiment, the plurality of heat dissipation holes 123a form a heat dissipation enhancing area, which corresponds to a processor of the mobile terminal, because the heat of the mobile terminal is mainly generated by the processor. Of course, the heat dissipation holes 123a may be disposed on the entire surface of the metal layer 123 to enhance the heat dissipation effect.

In this embodiment, the heat dissipation back plate 12 further includes a dust-proof layer 124, and the dust-proof layer 124 is preferably any one of teflon (i.e., polytetrafluoroethylene), copper, and a heat-conducting adhesive. The dustproof layer 124 is disposed between the graphene layer 122 and the metal layer 123, and the dustproof layer 124 is used for shielding the heat dissipation holes 123a, so as to prevent dust from entering the heat dissipation holes 123a and polluting the graphene layer 122. The heat dissipation back plate 12 further includes a glue layer 125, the glue layer 125 is preferably a double-sided adhesive, the glue layer 125 is disposed between the dust-proof layer 124 and the graphene layer 122, and the dust-proof layer 124 is bonded to the graphene layer 122 through the glue layer 125, so that the arrangement of the dust-proof layer 124 and the glue layer 125 does not affect the heat dissipation effect of the heat dissipation back plate 12. Because the heat conductive adhesive layer 121 itself has a certain viscosity, the adhesive may not be disposed between the heat conductive adhesive layer 121 and the graphene layer 122. Of course, an adhesive may also be disposed between the thermal conductive adhesive layer 121 and the graphene layer 122 to increase the connection strength between the thermal conductive adhesive layer 121 and the graphene layer 122. The dust-proof layer 124 and the metal layer 123 may be bonded together by an adhesive or welded together.

In this embodiment, the heat dissipation protection shell 10 further includes a bottom plate 13, the hardness of the bottom plate 13 is greater than that of the frame 11, and the heat dissipation back plate 12 is connected to the frame 11 through the bottom plate 13. The bottom plate 13 is preferably made of hard plastic, so that the bonding strength between the frame 11 and the heat dissipation back plate 12 is enhanced, and the heat dissipation back plate 12 is prevented from being deformed due to the fact that a user pulls the heat dissipation protection shell 10 with excessive force when taking down the mobile terminal. The frame 11 is preferably made of soft plastic, and the frame 11 may be made of a transparent material, so that the frame 11 can be deformed conveniently to load the mobile terminal in the accommodating cavity. Of course, in other embodiments, the heat dissipating back plate 12 may be directly connected to the frame 11, but the connection strength may be weakened.

Further, as shown in fig. 5, the bottom plate 13 is provided with a first connecting portion 131 along the outer edge of the heat dissipation back plate 12, the metal layer 123 is provided with a second connecting portion 123b matched with the first connecting portion 131, and the first connecting portion 131 and the second connecting portion 123b are adhered to each other. Specifically, the bottom plate 13 is an annular structure, the bottom plate 13 is provided with a mounting hole 133 (fig. 3) for mounting the heat dissipation back plate 12, the first connecting portion 131 is a boss disposed at an inner edge of the bottom plate 13, and an outer edge of the metal layer 123 protrudes relative to outer edges of the thermal conductive adhesive layer 121, the graphene layer 122, the dust-proof layer 124 and the adhesive layer 125, so that a second connecting portion 123b is formed at an outer edge of the heat dissipation back plate 12, and the metal layer 123 and the bottom plate 13 are fixed by dispensing. Of course, the first connecting portion 131 can also be a groove structure, and the second connecting portion 123b can be a protrusion structure; or the first connection portion 131 is a protrusion structure, and the second connection portion 123b is a groove structure (see the third connection portion 132 and the fourth connection portion 111 in fig. 5). In other embodiments, the bottom plate 13 is planar, the bottom plate 13 is provided with a mounting groove for mounting the heat dissipation back plate 12, the whole heat dissipation back plate 12 is mounted in the mounting groove, and the bottom plate 13 is provided with a through hole corresponding to the heat dissipation hole 123a, although this embodiment will affect the heat dissipation effect of the heat dissipation protection shell 10, but this embodiment is not excluded.

Further, the outer edge of the bottom plate 13 is provided with a third connecting portion 132, the frame 11 is provided with a fourth connecting portion 111 matched with the third connecting portion 132, and the third connecting portion 132 is connected with the fourth connecting portion 111. Specifically, the third connecting portion 132 is a protrusion structure, and the fourth connecting portion 111 is a groove structure; of course, the third connecting portion 132 may also be a groove structure, and the fourth connecting portion 111 is a protrusion structure; or the third connecting portion 132 and the fourth connecting portion 111 are mutually matched bosses (refer to the first connecting portion 131 and the second connecting portion 123b in fig. 5). The bottom plate 13 and the frame 11 are formed by two-time injection molding, and of course, the bottom plate 13 and the frame 11 may be bonded by glue.

Further, the heat dissipation protection shell 10 is provided with a first through hole 102 corresponding to a rear camera of the mobile terminal, a second through hole 103 corresponding to a charging interface of the mobile terminal, and a third through hole (not shown) corresponding to a speaker and a microphone of the mobile terminal, and the heat dissipation protection shell 10 is further provided with an avoidance notch 104 corresponding to a volume button and/or a mute switch key of the mobile terminal. The first through hole 102 is disposed on the bottom plate 13, the heat dissipation back plate 12 is provided with a notch corresponding to the first through hole 102, the avoidance notch 104 is disposed on the left and right side walls of the frame 11, and the second through hole 103 and the third through hole are disposed on the lower side wall of the frame 11. In other embodiments, the first through hole 102 may also be disposed on the heat dissipation back plate 12, or the heat dissipation protection shell 10 is disposed with an avoiding hole corresponding to a volume button and/or a mute switch of the mobile terminal.

In this document, the terms of upper, lower, left, right, front, rear and the like are used to define the positions of the structures in the drawings and the positions of the structures relative to each other, and are only used for the sake of clarity and convenience in technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description in any form, and although the present invention has been disclosed with the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make some changes or modifications within the technical scope of the present invention without departing from the technical scope of the present invention, and the technical contents of the above disclosure can be utilized to make equivalent embodiments, but the technical contents of the present invention are not broken away from, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention all still belong to the protection scope of the technical solution of the present invention.

Claims

1. A heat dissipation protective shell is used for dissipating heat of a mobile terminal, the heat dissipation protective shell (10) is provided with an accommodating cavity (101) for loading the mobile terminal, and the heat dissipation protective shell (10) is characterized by comprising a frame (11) for forming the side wall of the accommodating cavity (101) and a heat dissipation back plate (12) for forming the bottom wall of the accommodating cavity (101), the frame (11) and the heat dissipation back plate (12) jointly form the accommodating cavity (101), the heat dissipation back plate (12) comprises a heat conduction adhesive layer (121), a graphene layer (122) and a metal layer (123), the heat conduction adhesive layer (121) is used for contacting with the mobile terminal, the metal layer (123) is located on one side of the heat conduction adhesive layer (121) far away from the accommodating cavity (101) and exposed at the bottom of the heat dissipation protective shell (10), and the graphene layer (122) is located between the heat conduction adhesive layer (121) and the metal layer (123), the graphene layer (122) is used for conducting heat generated by the mobile terminal to the metal layer (123) through the heat conducting adhesive layer (121).

2. The heat dissipating protective case of claim 1, wherein the metal layer (123) is provided with a plurality of heat dissipating holes (123 a).

3. The heat dissipation protective case of claim 2, wherein a plurality of heat dissipation holes (123a) form a heat dissipation enhanced area corresponding to the processor of the mobile terminal.

4. The heat dissipation protective case of claim 2, wherein the heat dissipation backplate (12) further comprises a dust-proof layer (124), the dust-proof layer (124) is disposed between the graphene layer (122) and the metal layer (123), and the dust-proof layer (124) is used for shielding the heat dissipation holes (123 a).

5. The heat dissipation protective case of claim 4, wherein the heat dissipation backplate (12) further comprises an adhesive layer (125), the adhesive layer (125) is disposed between the dust-proof layer (124) and the graphene layer (122), and the dust-proof layer (124) is bonded to the graphene layer (122) through the adhesive layer (125).

6. The heat dissipating protective case of claim 4, wherein the dust protective layer (124) is any one of Teflon, copper and thermally conductive glue.

7. The heat dissipation protective case according to claim 1, wherein the heat dissipation protective case (10) further comprises a bottom plate (13), the hardness of the bottom plate (13) is greater than that of the rim (11), and the heat dissipation back plate (12) is connected to the rim (11) through the bottom plate (13).

8. The heat dissipating protective case of claim 7, wherein the bottom plate (13) is provided with a first connecting portion (131) along an outer edge of the heat dissipating back plate (12), the metal layer (123) is provided with a second connecting portion (123b) engaged with the first connecting portion (131), and the first connecting portion (131) and the second connecting portion (123b) are bonded to each other.

9. The heat dissipation protective case of claim 7, wherein the bottom plate (13) is provided at an outer edge thereof with a third connecting portion (132), the rim (11) is provided with a fourth connecting portion (111) engaged with the third connecting portion (132), and the third connecting portion (132) and the fourth connecting portion (111) are connected.

10. The heat dissipating protective case of any one of claims 1 to 9, wherein the layer of thermally conductive adhesive (121) comprises a phase change energy storage material.