WO2015129938A1 - Ultrasonic probe having improved heat dissipation characteristics - Google Patents

Ultrasonic probe having improved heat dissipation characteristics Download PDF

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Publication number
WO2015129938A1
WO2015129938A1 PCT/KR2014/001650 KR2014001650W WO2015129938A1 WO 2015129938 A1 WO2015129938 A1 WO 2015129938A1 KR 2014001650 W KR2014001650 W KR 2014001650W WO 2015129938 A1 WO2015129938 A1 WO 2015129938A1
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WO
WIPO (PCT)
Prior art keywords
housing
circuit board
waterproof member
probe
outer groove
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PCT/KR2014/001650
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French (fr)
Korean (ko)
Inventor
조성택
김종철
김종훈
Original Assignee
알피니언메디칼시스템 주식회사
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Publication of WO2015129938A1 publication Critical patent/WO2015129938A1/en

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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/54Control of the diagnostic device
    • A61B8/546Control of the diagnostic device involving monitoring or regulation of device temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52079Constructional features

Definitions

  • the present invention relates to an ultrasonic probe provided in an ultrasonic diagnostic apparatus or the like for acquiring image information inside an object under examination using ultrasonic waves.
  • the ultrasound diagnosis apparatus transmits an ultrasound signal to the internal tissue of the subject by an ultrasound probe, and then receives an ultrasound signal reflected from the tissue boundary of an object having a different acoustic impedance by the ultrasound probe, thereby receiving the ultrasound signal.
  • the device obtains image information about tissues.
  • the image information is output to the monitor of the ultrasound diagnosis apparatus, and the diagnoser may perform diagnosis on the subject through the image information output to the monitor.
  • the ultrasonic probe may be configured by receiving a transducer and a probe circuit board in a housing.
  • the transducer may include a plurality of piezoelectric elements arranged in an array and a connection circuit board electrically connected to the piezoelectric elements and drawn outward.
  • the connection circuit board may be connected to the probe circuit board to electrically connect the piezoelectric elements to the probe circuit board.
  • the probe circuit board may be electrically connected to the main body of the ultrasonic diagnostic apparatus by a cable.
  • the cable is connected to the probe circuit board at one end of which is located inside the housing, and the other end of the cable is connected to the main body of the ultrasonic diagnostic apparatus by a cable connector.
  • heat may be generated from a heat generating source such as a probe circuit board when driving the ultrasonic probe. Since such heat accumulates in the sealed space inside the housing, it may cause heat damage to the probe circuit board and the transducer, and therefore, it is necessary to smoothly discharge the heat inside the housing to the outside of the housing.
  • heat dissipation means such as heatsinks are provided inside the housing. The heat sink absorbs heat inside the housing and transfers it to the cable, thereby releasing heat inside the housing to the outside of the housing.
  • the heat sink is heat exchanged with the internal hot air of the housing to absorb heat with the heat sink, and then heat conduction with a cable to release heat inside the housing, the external ambient air of the housing is transferred to the internal high temperature of the housing. It may not be as effective as direct heat exchange with air to dissipate heat inside the housing.
  • the ultrasonic probe has been configured to have more complex and various functions according to the technical development and application field expansion of the ultrasonic diagnostic apparatus.
  • the ultrasonic probe may be configured as a smart probe including a pulse generation module and a signal processing module, etc., which are located on the main body side of the ultrasonic diagnostic apparatus, as well as a pattern circuit for signal transmission to the probe circuit board.
  • the pulse generation module transmits the pulse of the electrical signal to the transducer
  • the signal processing module processes the electrical signal received from the transducer.
  • the ultrasonic probe may be configured as a wireless probe including a wireless communication module on the probe circuit board to enable wireless communication with the main body of the ultrasonic diagnostic apparatus without a cable.
  • the ultrasound probe may be configured as a 3D probe capable of acquiring a 3D image or a 4D probe capable of acquiring a 4D image.
  • the three-dimensional probe or the four-dimensional probe may be equipped with an actuator inside each housing to move the transducer in a pivotal manner.
  • Such ultrasonic probes have more circuit elements mounted on the probe circuit board or actuators mounted inside the housing, thereby increasing heat generation inside the housing. Therefore, there is a need for the development of an ultrasonic probe having more effective heat dissipation characteristics.
  • An object of the present invention is to provide an ultrasonic probe having more effective heat dissipation characteristics.
  • an ultrasonic probe includes a housing, a transducer, a probe circuit board, and a waterproof member.
  • the housing has a plurality of apertures to allow air to enter and exit.
  • the transducer is housed at least partially in the housing and transmits and receives ultrasonic signals.
  • the probe circuit board is housed in the housing and connected to the transducer.
  • the waterproof member is formed to surround the probe circuit board in the housing to block water from entering the probe circuit board.
  • the internal hot air of the housing is directly heat-exchanged with the ambient air outside the housing through the through hole, thereby more effectively transferring heat inside the housing. Can be released.
  • FIG. 1 is a perspective view of an ultrasonic probe according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the ultrasonic probe shown in FIG. 1.
  • FIG. 3 is a perspective view illustrating a state in which the waterproof member and the support frame are separated from the probe circuit board in FIG. 2.
  • FIG. 4 is a plan view showing a portion of the housing illustrated in FIG. 1.
  • FIG. 5 is a cross-sectional view taken along the line A-A of FIG. 4.
  • FIG. 6 is a plan view illustrating another example of the through hole.
  • FIG. 7 is a cross-sectional view taken along the line B-B of FIG. 6.
  • FIG. 1 is a perspective view of an ultrasonic probe according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the ultrasonic probe shown in FIG. 1.
  • 3 is a perspective view illustrating a state in which the waterproof member and the support frame are separated from the probe circuit board in FIG. 2.
  • FIG. 4 is a plan view showing a portion of the housing illustrated in FIG. 1.
  • 5 is a cross-sectional view taken along the line A-A of FIG. 4.
  • the ultrasonic probe 100 includes a housing 110, a transducer 120, a probe circuit board 130, and a waterproof member 140.
  • the housing 110 accommodates and protects the probe circuit board 130 and the waterproof member 140.
  • the housing 110 may be formed to have an inner space for accommodating the probe circuit board 130 and the waterproof member 140 in a state where the transducer 120 is partially inserted through an opening formed at one end.
  • the housing 110 may have a grip having a constricted shape so that the diagnostic person can comfortably hold it by hand.
  • the housing 110 When the ultrasonic probe 100 is connected to the main body of the ultrasonic diagnostic apparatus by a cable, the housing 110 may pass the cable through an opening formed at the opposite end.
  • the housing 110 may have a structure divided into first and second housing parts 111 and 112. As the first and second housing parts 111 and 112 are coupled to or separated from each other, the transducer 120, the probe circuit board 130, and the waterproof member 140 may be easily assembled or disassembled.
  • the first and second housing parts 111 and 112 may be made of a material such as plastic or rubber.
  • the housing 110 has a plurality of through parts 113 to allow air to enter and exit the housing 110.
  • the plurality of through parts 113 may be formed at a circumferential portion of the housing 110.
  • the through parts 113 allow the internal air of the housing 110 to be discharged to the outside of the housing 110 and the external air of the housing 110 to be introduced into the housing 110.
  • a heat generating source such as the probe circuit board 130 when the ultrasonic probe 100 is driven
  • the internal air temperature of the housing 110 rises
  • the internal hot air of the housing 110 passes through the through part 113. Through this, the heat can be directly exchanged with the ambient air outside the housing 110. Accordingly, heat inside the housing 110 may be more effectively released.
  • each of the through holes 113 may include an outer groove 113a, an inner groove 113b, and a connecting hole 113c.
  • the outer groove 113a is formed on the outer surface of the housing 110.
  • the outer groove 113a may be formed of a circular groove or the like.
  • the inner groove 113b is formed on the inner surface of the housing 110 to be eccentric with respect to the outer groove 113a. That is, the center of the inner groove 113b may be located away from the center of the outer groove 113a.
  • the inner groove 113b may be formed of a circular groove or the like.
  • the inner groove 113b may be smaller in diameter than the outer groove 113a.
  • the connecting through hole 113c connects the outer groove 113a with the inner groove 113b at the bottom of the outer groove 113a. Accordingly, the air inside the housing 110 may be discharged to the outside of the housing 110 through the through holes 113, and the outside air of the housing 110 may flow into the inside of the housing 110 through the through holes 113. have.
  • the inner groove 113b is eccentric from the outer groove 113a, even if the diagnostic person grasps the outer surface of the housing 110 by hand, the skin of the hand is inside the housing 110 through the through holes 113. It may block the contact with, it can minimize the view of the inside of the housing 110 from the outside of the housing (110).
  • the edge of the inner groove 113b is shown to coincide with the edge of the outer groove 113a, the edge of the inner groove 113b may be positioned to deviate or partially overlap the edge of the outer groove 113a. Do.
  • the size and arrangement of the through-holes 113 may be variously set in a range capable of performing the above-described functions, and is not limited to the illustrated.
  • the transducer 120 is at least partially housed in the housing 110.
  • the transducer 120 transmits an ultrasonic signal to the internal tissue of the subject and receives the ultrasonic signal reflected from the internal tissue of the subject.
  • the transducer 120 may include a plurality of piezoelectric elements arranged in an array form. Piezoelectric elements generate an ultrasonic signal by resonating when an electrical signal is applied, and generate an electrical signal by vibrating when an ultrasonic signal is received.
  • Piezoelectric elements may be disposed and supported on a backing material. Matching layers may be stacked on the piezoelectric elements. An acoustic lens may be stacked on the matching layer.
  • the piezoelectric elements may be connected to the connection circuit boards 121.
  • the connection circuit boards 121 may be each made of a flexible substrate. One of the connection circuit boards 121 may have a pattern circuit electrically connected to the signal electrodes of the piezoelectric elements, and the other may have a pattern circuit electrically connected to the ground electrodes of the piezoelectric elements.
  • the piezoelectric elements may be accommodated in the transducer case 122 and protected.
  • the transducer case 122 may have a structure for accommodating not only the piezoelectric elements but also the backing material, the matching layer, and the acoustic lens in the state in which the connection circuit boards 121 are drawn out.
  • the transducer case 122 may be sealed to prevent moisture or foreign matter from entering the inside.
  • the transducer case 122 may be fitted to the opening of the housing 110 in a state where the connection circuit board 121 is inserted through an opening formed at one end of the housing 110.
  • the transducer 120 may be of a linear array type or a convex array type.
  • the probe circuit board 130 is accommodated in the housing 110.
  • the probe circuit board 130 is connected to the transducer 120.
  • the probe circuit board 130 may be connected to the transducer 120 by the connection circuit boards 121.
  • Connectors may be formed on the probe circuit board 130 to be coupled to or separated from the connectors of the connection circuit boards 121.
  • the probe circuit board 130 may have a pattern circuit for signal transmission with the transducer 120.
  • the probe circuit board 130 may include not only a pattern circuit for signal transmission, but also a pulse generation module and a signal processing module which are located on the main body side of the ultrasonic diagnostic apparatus.
  • the pulse generation module transmits the pulse of the electrical signal to the transducer
  • the signal processing module processes the electrical signal received from the transducer.
  • the probe circuit board 130 may include a wireless communication module to enable wireless communication with the main body of the ultrasonic diagnostic apparatus without a cable.
  • the ultrasonic probe 100 is composed of a three-dimensional probe capable of acquiring a three-dimensional image or a four-dimensional probe capable of acquiring a four-dimensional image
  • An actuator may be installed. Accordingly, the heat generating source may be increased inside the housing 110.
  • the housings may be formed by the through holes 113. 110) the heat inside can be released more effectively.
  • the waterproof member 140 is formed to surround the probe circuit board 130 in the housing 110 to block water from entering the probe circuit board 130. Even if moisture penetrates into the housing 110 through the through holes 113, the waterproof member 140 may block the penetrated moisture from entering the probe circuit board 130. Therefore, it is possible to prevent the probe circuit board 130 from being damaged by moisture.
  • the waterproof member 140 may be made of a material such as fiber or resin having a waterproof function. The waterproof member 140 may be sealed with respect to the transducer 120 while one opening portion is accommodated in the probe circuit board 130 and the connection boards 121 through one opening.
  • the waterproof member 140 may further have an air permeation function.
  • the internal high temperature air of the waterproof member 140 passes through the waterproof member 140 having an air permeation function. It is possible to directly exchange heat with the ambient air outside the 140. Therefore, heat generated from the probe circuit board 130 may be more effectively discharged to the outside of the waterproof member 140.
  • the waterproof member 140 may be made of a special fiber having a waterproof and air permeable function, such as Gore-tex fabric.
  • Gore-Tex is a thin membrane with a large number of small pores formed by heating a polytetrafluoroetylene-based resin, and the Gore-Tex fabric is bonded to nylon fibers.
  • Gore-Tex has more than 9 billion micropores per square inch. Thus, water molecules cannot pass through the fine pores of the Gore-Tex, while water vapor molecules can pass through the fine pores of the Gore-Tex.
  • the waterproof member may be made of eVENT® fabric or the like.
  • the waterproof member 140 may further have a heat dissipation function.
  • the waterproof member 140 may be coated with a conductive material such as carbon nanotube, silver, copper, or the like. Accordingly, heat generated from the probe circuit board 130 may be smoothly transferred to the waterproof member 140 having a heat dissipation function and may be discharged to the outside of the waterproof member 140.
  • the waterproof member 140 may further have an EMI shielding function. Accordingly, the electromagnetic wave generated from the probe circuit board 130 may be blocked from being emitted to the outside of the waterproof member 140 by the waterproof member 140 having the EMI shielding function.
  • the ultrasonic probe 100 may include a support frame 150 disposed to abut against the inner surface of the waterproof member 140 to support the waterproof member 140.
  • the support frame 150 may maintain the shape of the waterproof member 140 by supporting the inner surface of the waterproof member 140.
  • One opening portion of the waterproof member 140 may be bonded to the support frame 150 to be sealed.
  • the support frame 150 may have a rectangular parallelepiped shape having an inner space.
  • the support frame 150 may be accommodated in the internal space by inserting the probe circuit board 130 and the connection circuit board 121 through one opening.
  • the support frame 150 may be coupled to the transducer case 122.
  • the support frame 150 has a structure in which the remaining surfaces are opened to allow the air to flow in and out smoothly between the probe circuit board 130 and the waterproof member 140.
  • the support frame 150 may be made of a material such as plastic or metal.
  • the inner surface of the support frame 150 may be coated with an insulating material.
  • the support frame 150 may be sealed by a sealing material such as silicon at a portion coupled with the transducer 120. Therefore, the probe circuit board 130 and the connection circuit board 121 may be wrapped and sealed by the waterproof member 140 in a state accommodated in the support frame 150.
  • the waterproof member 140 may be fixed to the inside of the housing 110 without the supporting frame 150.
  • the waterproof member 140 may be fixed by attaching an adhesive material to the inside of the housing 110.
  • each of the through holes 213 is arranged in the circumferential direction of the outer groove 213a with a plurality of inner grooves 213b eccentric with respect to the outer groove 213a, respectively. It may be formed on the inner surface of the housing 110.
  • the connecting through holes 213c may connect the outer grooves 213a with the inner grooves 213b at the bottom of the outer groove 213a, respectively.
  • the inner grooves 213b may have smaller diameters than the outer grooves 213a and may be arranged at regular intervals.
  • the through-holes 213 may not only release air into and out of the housing 110 to release heat from the inside of the housing 110, but also the skin of the hand may be held in a state where the hand of the diagnoser holds the housing 110 by hand. 110 may be prevented from contacting the inside, it is possible to minimize the view of the inside of the housing 110 from the outside of the housing (110).
  • the inner grooves 213b are shown as being partially overlapped with the outer grooves 213a, but it is also possible for each edge of the inner grooves 213b to be positioned so as to deviate from or coincide with the edge of the outer groove 213a.
  • the size and arrangement of the through-holes 213 may be variously set in a range capable of performing the above-described functions, and is not limited to the illustrated.

Abstract

The present invention relates to an ultrasonic probe having improved heat dissipation characteristics. The ultrasonic probe includes: a housing; a transducer; a probe circuit board; and a waterproof member. The housing has a plurality of through-holes to allow air to flow in and out. At least a part of the transducer is received in the housing, and the transducer transmits and receives an ultrasonic signal. The probe circuit board is accommodated in the housing and is connected to the transducer. The waterproof member is formed to surround the probe circuit board within the housing to block water inflow into the probe circuit board.

Description

개선된 방열 특성을 갖는 초음파 프로브Ultrasonic probes with improved heat dissipation
본 발명은 초음파를 이용하여 피검사체 내부의 영상 정보를 획득하는 초음파 진단장치 등에 구비되는 초음파 프로브에 관한 것이다.The present invention relates to an ultrasonic probe provided in an ultrasonic diagnostic apparatus or the like for acquiring image information inside an object under examination using ultrasonic waves.
초음파 진단장치는 초음파 프로브에 의해 피검사체의 내부 조직에 초음파 신호를 송신한 후, 초음파 프로브에 의해 음향 임피던스(acoustic impedance)가 다른 대상체의 조직 경계로부터 반사된 초음파 신호를 수신하여, 피검사체의 내부 조직에 대한 영상 정보를 획득하는 장치이다. 이러한 영상 정보는 초음파 진단장치의 모니터로 출력되고, 진단자는 모니터로 출력되는 영상 정보를 통해 피검사체에 대한 진단을 실시할 수 있다.The ultrasound diagnosis apparatus transmits an ultrasound signal to the internal tissue of the subject by an ultrasound probe, and then receives an ultrasound signal reflected from the tissue boundary of an object having a different acoustic impedance by the ultrasound probe, thereby receiving the ultrasound signal. The device obtains image information about tissues. The image information is output to the monitor of the ultrasound diagnosis apparatus, and the diagnoser may perform diagnosis on the subject through the image information output to the monitor.
일 예로, 초음파 프로브는 하우징에 트랜스듀서와 프로브 회로기판이 수용되어 구성될 수 있다. 트랜스듀서는 어레이 형태로 배열된 복수의 압전 소자(piezoelectric element)들과, 압전 소자들과 전기적으로 연결되어 외측으로 인출된 접속 회로기판을 포함할 수 있다. 접속 회로기판은 프로브 회로기판과 접속됨으로써, 압전 소자들을 프로브 회로기판과 전기적으로 연결할 수 있다. 그리고, 프로브 회로기판은 케이블에 의해 초음파 진단장치의 본체와 전기적으로 연결될 수 있다. 케이블은 한쪽 단부가 하우징 내부에 위치되어 프로브 회로기판과 접속되며, 반대쪽 단부가 케이블 커넥터에 의해 초음파 진단장치의 본체와 접속될 수 있다.For example, the ultrasonic probe may be configured by receiving a transducer and a probe circuit board in a housing. The transducer may include a plurality of piezoelectric elements arranged in an array and a connection circuit board electrically connected to the piezoelectric elements and drawn outward. The connection circuit board may be connected to the probe circuit board to electrically connect the piezoelectric elements to the probe circuit board. The probe circuit board may be electrically connected to the main body of the ultrasonic diagnostic apparatus by a cable. The cable is connected to the probe circuit board at one end of which is located inside the housing, and the other end of the cable is connected to the main body of the ultrasonic diagnostic apparatus by a cable connector.
한편, 초음파 프로브의 구동시 프로브 회로기판 등과 같은 열 발생원으로부터 열이 발생될 수 있다. 이러한 열은 하우징 내부의 밀폐 공간에 적체되어 있으면, 프로브 회로기판과 트랜스듀서에 열 손상을 일으킬 수 있기 때문에, 하우징 내부의 열을 하우징 외부로 원활히 방출시킬 필요가 있다. 종래에 따르면, 하우징 내부에 방열 수단, 예컨대 히트싱크(heatsink)가 마련되어 있다. 히트싱크는 하우징 내부의 열을 흡수해서 케이블로 전달함으로써, 하우징 내부의 열을 하우징 외부로 방출시키게 된다.On the other hand, heat may be generated from a heat generating source such as a probe circuit board when driving the ultrasonic probe. Since such heat accumulates in the sealed space inside the housing, it may cause heat damage to the probe circuit board and the transducer, and therefore, it is necessary to smoothly discharge the heat inside the housing to the outside of the housing. According to the prior art, heat dissipation means such as heatsinks are provided inside the housing. The heat sink absorbs heat inside the housing and transfers it to the cable, thereby releasing heat inside the housing to the outside of the housing.
그런데, 전술한 경우, 히트싱크를 하우징의 내부 고온 공기와 열 교환시켜 히트싱크로 열을 흡수한 후 케이블로 열 전도시켜 하우징 내부의 열을 방출하는 방식이므로, 하우징의 외부 주변 공기를 하우징의 내부 고온 공기와 직접적으로 열 교환시켜 하우징 내부의 열을 방출하는 것보다 효과적이지 못할 수 있다.However, in the case described above, since the heat sink is heat exchanged with the internal hot air of the housing to absorb heat with the heat sink, and then heat conduction with a cable to release heat inside the housing, the external ambient air of the housing is transferred to the internal high temperature of the housing. It may not be as effective as direct heat exchange with air to dissipate heat inside the housing.
최근에는 초음파 진단장치의 기술발전 및 응용분야 확대에 따라 초음파 프로브는 보다 복잡하고 다양한 기능을 갖도록 구성되고 있다. 일 예로, 초음파 프로브는 프로브 회로기판에 신호 전달을 위한 패턴 회로뿐 아니라, 초음파 진단장치의 본체 쪽에 있던 펄스 발생모듈과 신호 처리모듈 등을 포함한 스마트(smart) 프로브로 구성될 수 있다. 여기서, 펄스 발생모듈은 전기적 신호의 펄스를 트랜스듀서로 송신하며, 신호 처리모듈은 트랜스듀서로부터 수신되는 전기적 신호를 처리한다.Recently, the ultrasonic probe has been configured to have more complex and various functions according to the technical development and application field expansion of the ultrasonic diagnostic apparatus. For example, the ultrasonic probe may be configured as a smart probe including a pulse generation module and a signal processing module, etc., which are located on the main body side of the ultrasonic diagnostic apparatus, as well as a pattern circuit for signal transmission to the probe circuit board. Here, the pulse generation module transmits the pulse of the electrical signal to the transducer, the signal processing module processes the electrical signal received from the transducer.
다른 예로, 초음파 프로브는 케이블 없이 초음파 진단장치의 본체와 무선(wireless) 통신이 가능하도록 프로브 회로기판에 무선 통신모듈을 포함한 무선 프로브로 구성될 수 있다. 또 다른 예로, 초음파 프로브는 3차원 영상을 획득할 수 있는 3차원 프로브로 구성되거나, 4차원 영상을 획득할 수 있는 4차원 프로브로 구성될 수 있다. 3차원 프로브나 4차원 프로브는 각 하우징 내부에 트랜스듀서를 피벗 동작과 같이 운동시키기 위한 액추에이터가 장착될 수 있다.As another example, the ultrasonic probe may be configured as a wireless probe including a wireless communication module on the probe circuit board to enable wireless communication with the main body of the ultrasonic diagnostic apparatus without a cable. As another example, the ultrasound probe may be configured as a 3D probe capable of acquiring a 3D image or a 4D probe capable of acquiring a 4D image. The three-dimensional probe or the four-dimensional probe may be equipped with an actuator inside each housing to move the transducer in a pivotal manner.
이와 같은 초음파 프로브들은 프로브 회로기판에 보다 많은 회로 소자들이 장착되거나 하우징 내부에 액추에이터가 장착되므로, 하우징 내부의 열 발생원이 많아지게 된다. 따라서, 보다 효과적인 방열 특성을 갖는 초음파 프로브의 개발이 필요하다.Such ultrasonic probes have more circuit elements mounted on the probe circuit board or actuators mounted inside the housing, thereby increasing heat generation inside the housing. Therefore, there is a need for the development of an ultrasonic probe having more effective heat dissipation characteristics.
본 발명의 과제는 보다 효과적인 방열 특성을 갖는 초음파 프로브를 제공함에 있다.An object of the present invention is to provide an ultrasonic probe having more effective heat dissipation characteristics.
상기의 과제를 달성하기 위한 본 발명에 따른 초음파 프로브는 하우징과, 트랜스듀서와, 프로브 회로기판, 및 방수 부재를 포함한다. 하우징은 내외로 공기가 출입 가능하도록 복수의 통공부들을 갖는다. 트랜스듀서는 하우징에 적어도 일부가 수용되며, 초음파 신호를 송수신한다. 프로브 회로기판은 하우징에 수용되며, 트랜스듀서와 접속된다. 방수 부재는 하우징 내부에서 프로브 회로기판을 감싸도록 형성되어 프로브 회로기판으로 수분 유입을 차단한다.According to an aspect of the present invention, an ultrasonic probe includes a housing, a transducer, a probe circuit board, and a waterproof member. The housing has a plurality of apertures to allow air to enter and exit. The transducer is housed at least partially in the housing and transmits and receives ultrasonic signals. The probe circuit board is housed in the housing and connected to the transducer. The waterproof member is formed to surround the probe circuit board in the housing to block water from entering the probe circuit board.
본 발명에 따르면, 하우징에 수용된 프로브 회로기판을 방수 부재에 의해 방수시킨 상태에서, 하우징의 내부 고온 공기를 통공부를 통해 하우징의 외부 주변 공기와 직접적으로 열 교환시킴으로써, 하우징 내부의 열을 보다 효과적으로 방출시킬 수 있다.According to the present invention, in a state in which the probe circuit board accommodated in the housing is waterproofed by the waterproof member, the internal hot air of the housing is directly heat-exchanged with the ambient air outside the housing through the through hole, thereby more effectively transferring heat inside the housing. Can be released.
도 1은 본 발명의 일 실시예에 따른 초음파 프로브에 대한 사시도이다.1 is a perspective view of an ultrasonic probe according to an embodiment of the present invention.
도 2는 도 1에 도시된 초음프 프로브에 대한 분해 사시도이다.FIG. 2 is an exploded perspective view of the ultrasonic probe shown in FIG. 1.
도 3은 도 2에 있어서, 프로브 회로기판으로부터 방수 부재와 지지 프레임이 분리된 상태를 도시한 사시도이다.3 is a perspective view illustrating a state in which the waterproof member and the support frame are separated from the probe circuit board in FIG. 2.
도 4는 도 1에 도시된 하우징의 일부 영역을 발췌하여 도시한 평면도이다.FIG. 4 is a plan view showing a portion of the housing illustrated in FIG. 1.
도 5는 도 4의 A-A 선을 따라 절취하여 도시한 단면도이다.5 is a cross-sectional view taken along the line A-A of FIG. 4.
도 6은 통공부의 다른 예를 도시한 평면도이다.6 is a plan view illustrating another example of the through hole.
도 7은 도 6의 B-B 선을 따라 절취하여 도시한 단면도이다.FIG. 7 is a cross-sectional view taken along the line B-B of FIG. 6.
본 발명에 대해 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다. 여기서, 동일한 구성에 대해서는 동일부호를 사용하며, 반복되는 설명, 본 발명의 요지를 불필요하게 흐릴 수 있는 공지 기능 및 구성에 대한 상세한 설명은 생략한다. 본 발명의 실시형태는 당업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위해서 제공되는 것이다. 따라서, 도면에서의 요소들의 형상 및 크기 등은 보다 명확한 설명을 위해 과장될 수 있다.When described in detail with reference to the accompanying drawings for the present invention. Here, the same reference numerals are used for the same components, and repeated descriptions and detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity.
도 1은 본 발명의 일 실시예에 따른 초음파 프로브에 대한 사시도이다. 도 2는 도 1에 도시된 초음프 프로브에 대한 분해 사시도이다. 도 3은 도 2에 있어서, 프로브 회로기판으로부터 방수 부재와 지지 프레임이 분리된 상태를 도시한 사시도이다. 도 4는 도 1에 도시된 하우징의 일부 영역을 발췌하여 도시한 평면도이다. 도 5는 도 4의 A-A 선을 따라 절취하여 도시한 단면도이다.1 is a perspective view of an ultrasonic probe according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the ultrasonic probe shown in FIG. 1. 3 is a perspective view illustrating a state in which the waterproof member and the support frame are separated from the probe circuit board in FIG. 2. FIG. 4 is a plan view showing a portion of the housing illustrated in FIG. 1. 5 is a cross-sectional view taken along the line A-A of FIG. 4.
도 1 내지 도 5를 참조하면, 초음파 프로브(100)는 하우징(110)과, 트랜스듀서(120)와, 프로브 회로기판(130), 및 방수 부재(140)를 포함한다.1 to 5, the ultrasonic probe 100 includes a housing 110, a transducer 120, a probe circuit board 130, and a waterproof member 140.
하우징(110)은 프로브 회로기판(130), 및 방수 부재(140)를 수용해서 보호한다. 예컨대, 하우징(110)은 한쪽 단부에 형성된 개구를 통해 트랜스듀서(120)를 일부 끼운 상태에서 프로브 회로기판(130)과 방수 부재(140)를 수용하는 내부 공간을 갖도록 형성될 수 있다. 하우징(110)은 진단자가 편안하게 손으로 쥘 수 있게 잘록한 형상의 파지부를 가질 수 있다.The housing 110 accommodates and protects the probe circuit board 130 and the waterproof member 140. For example, the housing 110 may be formed to have an inner space for accommodating the probe circuit board 130 and the waterproof member 140 in a state where the transducer 120 is partially inserted through an opening formed at one end. The housing 110 may have a grip having a constricted shape so that the diagnostic person can comfortably hold it by hand.
초음파 프로브(100)가 케이블에 의해 초음파 진단장치의 본체와 연결되는 경우, 하우징(110)은 반대쪽 단부에 형성된 개구를 통해 케이블을 통과시킬 수 있다. 하우징(110)은 제1,2 하우징부(111)(112)로 분할된 구조로 이루어질 수 있다. 제1,2 하우징부(111)(112)가 상호 결합 또는 분리됨에 따라 트랜스듀서(120)와, 프로브 회로기판(130), 및 방수 부재(140)의 조립 또는 분해를 용이하게 할 수 있다. 제1,2 하우징부(111)(112)는 플라스틱 또는 고무 등의 재질로 이루어질 수 있다.When the ultrasonic probe 100 is connected to the main body of the ultrasonic diagnostic apparatus by a cable, the housing 110 may pass the cable through an opening formed at the opposite end. The housing 110 may have a structure divided into first and second housing parts 111 and 112. As the first and second housing parts 111 and 112 are coupled to or separated from each other, the transducer 120, the probe circuit board 130, and the waterproof member 140 may be easily assembled or disassembled. The first and second housing parts 111 and 112 may be made of a material such as plastic or rubber.
하우징(110)은 내외로 공기가 출입 가능하도록 복수의 통공부(113)들을 갖는다. 예컨대, 복수의 통공부(113)들은 하우징(110)의 둘레 부위에 형성될 수 있다. 통공부(113)들은 하우징(110)의 내부 공기가 하우징(110) 외부로 배출되고 하우징(110)의 외부 공기가 하우징(110) 내부로 유입될 수 있게 한다. 초음파 프로브(100)의 구동시 프로브 회로기판(130) 등과 같은 열 발생원으로부터 열이 발생되어 하우징(110)의 내부 공기 온도가 상승하게 되면, 하우징(110)의 내부 고온 공기는 통공부(113)들을 통해 하우징(110)의 외부 주변 공기와 직접적으로 열 교환할 수 있게 된다. 이에 따라, 하우징(110) 내부의 열이 보다 효과적으로 방출될 수 있다.The housing 110 has a plurality of through parts 113 to allow air to enter and exit the housing 110. For example, the plurality of through parts 113 may be formed at a circumferential portion of the housing 110. The through parts 113 allow the internal air of the housing 110 to be discharged to the outside of the housing 110 and the external air of the housing 110 to be introduced into the housing 110. When heat is generated from a heat generating source such as the probe circuit board 130 when the ultrasonic probe 100 is driven, and the internal air temperature of the housing 110 rises, the internal hot air of the housing 110 passes through the through part 113. Through this, the heat can be directly exchanged with the ambient air outside the housing 110. Accordingly, heat inside the housing 110 may be more effectively released.
일 예로, 도 5에 도시된 바와 같이, 각각의 통공부(113)는 외측 홈(113a)과 내측 홈(113b) 및 연결 통공(113c)을 포함할 수 있다. 외측 홈(113a)은 하우징(110)의 외면에 형성된다. 외측 홈(113a)은 원형 홈 등으로 이루어질 수 있다. 내측 홈(113b)은 외측 홈(113a)에 대해 편심되도록 하우징(110)의 내면에 형성된다. 즉, 내측 홈(113b)의 중심은 외측 홈(113a)의 중심으로부터 벗어나 위치될 수 있다. 내측 홈(113b)은 원형 홈 등으로 이루어질 수 있다. 내측 홈(113b)은 외측 홈(113a)보다 지름이 작을 수 있다.For example, as illustrated in FIG. 5, each of the through holes 113 may include an outer groove 113a, an inner groove 113b, and a connecting hole 113c. The outer groove 113a is formed on the outer surface of the housing 110. The outer groove 113a may be formed of a circular groove or the like. The inner groove 113b is formed on the inner surface of the housing 110 to be eccentric with respect to the outer groove 113a. That is, the center of the inner groove 113b may be located away from the center of the outer groove 113a. The inner groove 113b may be formed of a circular groove or the like. The inner groove 113b may be smaller in diameter than the outer groove 113a.
연결 통공(113c)은 외측 홈(113a)의 바닥 쪽에서 외측 홈(113a)을 내측 홈(113b)과 통하게 연결한다. 이에 따라, 하우징(110)의 내부 공기가 통공부(113)들을 통해 하우징(110) 외부로 배출되고 하우징(110)의 외부 공기가 통공부(113)들을 통해 하우징(110) 내부로 유입될 수 있다.The connecting through hole 113c connects the outer groove 113a with the inner groove 113b at the bottom of the outer groove 113a. Accordingly, the air inside the housing 110 may be discharged to the outside of the housing 110 through the through holes 113, and the outside air of the housing 110 may flow into the inside of the housing 110 through the through holes 113. have.
그리고, 전술한 바와 같이 내측 홈(113b)은 외측 홈(113a)으로부터 편심되어 있으므로, 진단자가 하우징(110)의 외면을 손으로 쥐더라도 손 피부가 통공부(113)들을 통해 하우징(110) 내부와 접촉되는 것을 차단할 수 있으며, 하우징(110) 외부에서 하우징(110) 내부가 보이는 것을 최소화할 수 있다. 한편, 내측 홈(113b)의 가장자리가 외측 홈(113a)의 가장자리와 일치하는 것으로 도시되어 있으나, 내측 홈(113b)의 가장자리가 외측 홈(113a)의 가장자리로부터 벗어나거나 일부 겹쳐지게 위치되는 것도 가능하다. 또한, 통공부(113)들의 크기와 배열 형태는 전술한 기능을 수행할 수 있는 범주에서 다양하게 설정될 수 있으므로, 도시된 바에 한정되지 않는다.In addition, as described above, since the inner groove 113b is eccentric from the outer groove 113a, even if the diagnostic person grasps the outer surface of the housing 110 by hand, the skin of the hand is inside the housing 110 through the through holes 113. It may block the contact with, it can minimize the view of the inside of the housing 110 from the outside of the housing (110). On the other hand, although the edge of the inner groove 113b is shown to coincide with the edge of the outer groove 113a, the edge of the inner groove 113b may be positioned to deviate or partially overlap the edge of the outer groove 113a. Do. In addition, the size and arrangement of the through-holes 113 may be variously set in a range capable of performing the above-described functions, and is not limited to the illustrated.
트랜스듀서(120)는 하우징(110)에 적어도 일부가 수용된다. 트랜스듀서(120)는 초음파 신호를 피검사체의 내부 조직으로 송신하고 피검사체의 내부 조직으로부터 반사된 초음파 신호를 수신한다. 트랜스듀서(120)는 어레이 형태로 배열된 복수의 압전 소자들을 포함할 수 있다. 압전 소자들은 전기적 신호가 인가되면 공진하여 초음파 신호를 발생시키고, 초음파 신호를 수신하게 되면 진동하여 전기적 신호를 발생시킨다.The transducer 120 is at least partially housed in the housing 110. The transducer 120 transmits an ultrasonic signal to the internal tissue of the subject and receives the ultrasonic signal reflected from the internal tissue of the subject. The transducer 120 may include a plurality of piezoelectric elements arranged in an array form. Piezoelectric elements generate an ultrasonic signal by resonating when an electrical signal is applied, and generate an electrical signal by vibrating when an ultrasonic signal is received.
압전 소자들은 배킹재(backing material) 상에 배치되어 지지될 수 있다. 압전 소자들에는 정합층(matching layer)이 적층될 수 있다. 정합층에는 음향 렌즈(acoustic lens)가 적층될 수 있다. 압전 소자들은 접속 회로기판(121)들과 접속될 수 있다. 접속 회로기판(121)들은 플랙시블(flexible) 기판으로 각각 이루어질 수 있다. 접속 회로기판(121)들 중 하나에는 압전 소자들의 신호 전극들과 전기적으로 연결되는 패턴 회로가 형성되며, 다른 하나에는 압전 소자들의 그라운드 전극들과 전기적으로 연결되는 패턴 회로가 형성될 수 있다.Piezoelectric elements may be disposed and supported on a backing material. Matching layers may be stacked on the piezoelectric elements. An acoustic lens may be stacked on the matching layer. The piezoelectric elements may be connected to the connection circuit boards 121. The connection circuit boards 121 may be each made of a flexible substrate. One of the connection circuit boards 121 may have a pattern circuit electrically connected to the signal electrodes of the piezoelectric elements, and the other may have a pattern circuit electrically connected to the ground electrodes of the piezoelectric elements.
압전 소자들은 트랜스듀서 케이스(122)에 수용되어 보호될 수 있다. 트랜스듀서 케이스(122)는 접속 회로기판(121)들을 외부로 인출시킨 상태에서 압전 소자들뿐 아니라 배킹재와 정합층 및 음향 렌즈를 수용하는 구조로 이루어질 수 있다. 또한, 트랜스듀서 케이스(122)는 내부로 수분이나 이물질이 유입되지 않도록 밀봉 처리될 수 있다. 트랜스듀서 케이스(122)는 접속 회로기판(121)들이 하우징(110)의 한쪽 단부에 형성된 개구를 통해 삽입된 상태에서 하우징(110)의 개구 부위에 끼움 결합될 수 있다. 트랜스듀서(120)는 리니어 어레이 타입(linear array type) 또는 컨벡스 어레이 타입(convex array type) 등으로 이루어질 수 있다.The piezoelectric elements may be accommodated in the transducer case 122 and protected. The transducer case 122 may have a structure for accommodating not only the piezoelectric elements but also the backing material, the matching layer, and the acoustic lens in the state in which the connection circuit boards 121 are drawn out. In addition, the transducer case 122 may be sealed to prevent moisture or foreign matter from entering the inside. The transducer case 122 may be fitted to the opening of the housing 110 in a state where the connection circuit board 121 is inserted through an opening formed at one end of the housing 110. The transducer 120 may be of a linear array type or a convex array type.
프로브 회로기판(130)은 하우징(110)에 수용된다. 프로브 회로기판(130)은 트랜스듀서(120)와 접속된다. 예컨대, 프로브 회로기판(130)은 접속 회로기판(121)들에 의해 트랜스듀서(120)와 접속될 수 있다. 프로브 회로기판(130)에는 커넥터들이 형성되어 접속 회로기판(121)들의 커넥터들과 결합 또는 분리될 수 있다. 프로브 회로기판(130)에는 트랜스듀서(120)와의 신호 전달을 위한 패턴 회로가 형성될 수 있다. 초음파 프로브(100)가 케이블에 의해 초음파 진단장치의 본체와 연결될 경우, 케이블의 일단부가 하우징(110) 내부로 삽입되어 프로브 회로기판(130)과 접속될 수 있다.The probe circuit board 130 is accommodated in the housing 110. The probe circuit board 130 is connected to the transducer 120. For example, the probe circuit board 130 may be connected to the transducer 120 by the connection circuit boards 121. Connectors may be formed on the probe circuit board 130 to be coupled to or separated from the connectors of the connection circuit boards 121. The probe circuit board 130 may have a pattern circuit for signal transmission with the transducer 120. When the ultrasonic probe 100 is connected to the main body of the ultrasonic diagnostic apparatus by a cable, one end of the cable may be inserted into the housing 110 to be connected to the probe circuit board 130.
초음파 프로브(100)가 스마트 프로브로 구성되는 경우, 프로브 회로기판(130)은 신호 전달을 위한 패턴 회로뿐 아니라, 초음파 진단장치의 본체 쪽에 있던 펄스 발생모듈과 신호 처리모듈 등을 포함할 수 있다. 여기서, 펄스 발생모듈은 전기적 신호의 펄스를 트랜스듀서로 송신하며, 신호 처리모듈은 트랜스듀서로부터 수신되는 전기적 신호를 처리한다. 초음파 프로브(100)가 무선(wireless) 프로브로 구성되는 경우, 프로브 회로기판(130)은 케이블 없이 초음파 진단장치의 본체와 무선 통신이 가능하도록 무선 통신모듈을 포함할 수 있다.When the ultrasonic probe 100 is configured as a smart probe, the probe circuit board 130 may include not only a pattern circuit for signal transmission, but also a pulse generation module and a signal processing module which are located on the main body side of the ultrasonic diagnostic apparatus. Here, the pulse generation module transmits the pulse of the electrical signal to the transducer, the signal processing module processes the electrical signal received from the transducer. When the ultrasonic probe 100 is configured as a wireless probe, the probe circuit board 130 may include a wireless communication module to enable wireless communication with the main body of the ultrasonic diagnostic apparatus without a cable.
또한, 초음파 프로브(100)가 3차원 영상을 획득할 수 있는 3차원 프로브로 구성되거나, 4차원 영상을 획득할 수 있는 4차원 프로브로 구성되는 경우, 하우징(110) 내부에는 트랜스듀서를 운동시키기 위한 액추에이터가 설치될 수 있다. 이에 따라, 하우징(110) 내부에는 열 발생원이 많아질 수 있는데, 전술한 바와 같이 하우징(110)에는 공기를 출입시키는 통공부(113)들이 형성되어 있으므로, 통공부(113)들에 의해 하우징(110) 내부의 열이 보다 효과적으로 방출될 수 있다.In addition, when the ultrasonic probe 100 is composed of a three-dimensional probe capable of acquiring a three-dimensional image or a four-dimensional probe capable of acquiring a four-dimensional image, moving the transducer inside the housing 110. An actuator may be installed. Accordingly, the heat generating source may be increased inside the housing 110. As described above, since the through holes 113 are formed in the housing 110 to allow air to enter and exit the housing 110, the housings may be formed by the through holes 113. 110) the heat inside can be released more effectively.
방수 부재(140)는 하우징(110) 내부에서 프로브 회로기판(130)을 감싸도록 형성되어 프로브 회로기판(130)으로 수분 유입을 차단한다. 통공부(113)들을 통해 하우징(110) 내부로 수분이 침투하더라도, 방수 부재(140)는 침투된 수분이 프로브 회로기판(130)으로 유입되지 않게 차단할 수 있다. 따라서, 프로브 회로기판(130)이 수분에 의해 손상되는 것을 방지할 수 있다. 방수 부재(140)는 방수 기능을 갖는 섬유나 수지 등의 재질로 이루어질 수 있다. 방수 부재(140)는 한쪽 개구를 통해 프로브 회로기판(130)과 접속 기판(121)들을 수용한 상태에서 한쪽 개구 부위가 트랜스듀서(120)에 대해 밀봉 처리될 수 있다.The waterproof member 140 is formed to surround the probe circuit board 130 in the housing 110 to block water from entering the probe circuit board 130. Even if moisture penetrates into the housing 110 through the through holes 113, the waterproof member 140 may block the penetrated moisture from entering the probe circuit board 130. Therefore, it is possible to prevent the probe circuit board 130 from being damaged by moisture. The waterproof member 140 may be made of a material such as fiber or resin having a waterproof function. The waterproof member 140 may be sealed with respect to the transducer 120 while one opening portion is accommodated in the probe circuit board 130 and the connection boards 121 through one opening.
방수 부재(140)는 공기 투과 기능을 추가로 가질 수 있다. 프로브 회로기판(130)으로부터 열이 발생되어 방수 부재(140)의 내부 공기 온도가 상승하게 되면, 방수 부재(140)의 내부 고온 공기는 공기 투과 기능을 갖는 방수 부재(140)를 통해 방수 부재(140)의 외부 주변 공기와 직접적으로 열 교환할 수 있게 된다. 따라서, 프로브 회로기판(130)으로부터 발생된 열이 방수 부재(140)의 외부로 보다 효과적으로 방출될 수 있다.The waterproof member 140 may further have an air permeation function. When heat is generated from the probe circuit board 130 and the internal air temperature of the waterproof member 140 rises, the internal high temperature air of the waterproof member 140 passes through the waterproof member 140 having an air permeation function. It is possible to directly exchange heat with the ambient air outside the 140. Therefore, heat generated from the probe circuit board 130 may be more effectively discharged to the outside of the waterproof member 140.
예컨대, 방수 부재(140)는 고어텍스(Gore-tex) 원단과 같은 방수 및 공기 투과 기능을 갖는 특수 섬유로 이루어질 수 있다. 고어텍스란 테플론(polytetrafluoroetylene)계 수지를 가열하여 늘려서 많은 수의 작은 구멍이 생긴 얇은 막이며, 이러한 막을 나일론 섬유에 접착한 것이 고어텍스 원단이다. 고어텍스는 1제곱인치당 90억 개 이상의 미세한 구멍을 갖는다. 따라서, 물 분자는 고어텍스의 미세한 구멍을 통과하지 못하지만, 수증기 분자는 고어텍스의 미세한 구멍을 통과할 수 있다. 방수 부재는 이벤트(eVENT®) 원단 등으로 이루어질 수도 있다.For example, the waterproof member 140 may be made of a special fiber having a waterproof and air permeable function, such as Gore-tex fabric. Gore-Tex is a thin membrane with a large number of small pores formed by heating a polytetrafluoroetylene-based resin, and the Gore-Tex fabric is bonded to nylon fibers. Gore-Tex has more than 9 billion micropores per square inch. Thus, water molecules cannot pass through the fine pores of the Gore-Tex, while water vapor molecules can pass through the fine pores of the Gore-Tex. The waterproof member may be made of eVENT® fabric or the like.
방수 부재(140)는 방열 기능을 추가로 가질 수 있다. 예컨대, 방수 부재(140)에는 탄소나노튜브(Carbon nanotube), 은(silver), 구리(copper) 등과 같은 도전성 물질이 코팅될 수 있다. 이에 따라, 프로브 회로기판(130)으로부터 발생된 열은 방열 기능을 갖는 방수 부재(140)로 원활히 전달되어 방수 부재(140)의 외부로 방출될 수 있다. 또한, 방수 부재(140)는 EMI(Electro Magnetic Interference) 차폐 기능을 추가로 가질 수 있다. 이에 따라, 프로브 회로기판(130)으로부터 발생된 전자파는 EMI 차폐 기능을 갖는 방수 부재(140)에 의해 방수 부재(140)의 외부로 방출되지 않게 차단될 수 있다.The waterproof member 140 may further have a heat dissipation function. For example, the waterproof member 140 may be coated with a conductive material such as carbon nanotube, silver, copper, or the like. Accordingly, heat generated from the probe circuit board 130 may be smoothly transferred to the waterproof member 140 having a heat dissipation function and may be discharged to the outside of the waterproof member 140. In addition, the waterproof member 140 may further have an EMI shielding function. Accordingly, the electromagnetic wave generated from the probe circuit board 130 may be blocked from being emitted to the outside of the waterproof member 140 by the waterproof member 140 having the EMI shielding function.
초음파 프로브(100)는 방수 부재(140)의 내면에 맞닿게 배치되어 방수 부재(140)를 지지하는 지지 프레임(150)을 포함할 수 있다. 방수 부재(140)가 섬유 등으로 이루어져 자유롭게 변형되는 구조인 경우, 지지 프레임(150)은 방수 부재(140)의 내면을 지지해서 방수 부재(140)의 형태를 유지시킬 수 있다. 방수 부재(140)의 한쪽 개구 부위는 지지 프레임(150)에 접착되어 밀봉 처리될 수 있다.The ultrasonic probe 100 may include a support frame 150 disposed to abut against the inner surface of the waterproof member 140 to support the waterproof member 140. When the waterproof member 140 is made of fiber or the like and is freely deformed, the support frame 150 may maintain the shape of the waterproof member 140 by supporting the inner surface of the waterproof member 140. One opening portion of the waterproof member 140 may be bonded to the support frame 150 to be sealed.
지지 프레임(150)은 내부 공간을 갖는 직육면체 형상으로 이루어질 수 있다. 지지 프레임(150)은 한쪽 개구를 통해 프로브 회로기판(130)과 접속 회로기판(121)들을 삽입시켜 내부 공간에 수용할 수 있다. 지지 프레임(150)은 트랜스듀서 케이스(122)와 끼움 결합될 수 있다. 지지 프레임(150)은 나머지 면들이 개구된 구조로 이루어져 프로브 회로기판(130)과 방수 부재(140) 사이에 공기를 원활히 출입시킬 수 있다.The support frame 150 may have a rectangular parallelepiped shape having an inner space. The support frame 150 may be accommodated in the internal space by inserting the probe circuit board 130 and the connection circuit board 121 through one opening. The support frame 150 may be coupled to the transducer case 122. The support frame 150 has a structure in which the remaining surfaces are opened to allow the air to flow in and out smoothly between the probe circuit board 130 and the waterproof member 140.
지지 프레임(150)은 플라스틱이나 금속 등의 재질로 이루어질 수 있다. 지지 프레임(150)이 금속 재질로 이루어진 경우, 지지 프레임(150)의 내면은 절연 물질로 코팅될 수 있다. 지지 프레임(150)은 트랜스듀서(120)와 결합된 부위가 실리콘 등의 밀봉 물질에 의해 밀봉 처리될 수 있다. 따라서, 프로브 회로기판(130)과 접속 회로기판(121)들은 지지 프레임(150)에 수용된 상태에서 방수 부재(140)에 의해 감싸져 밀봉될 수 있다. 한편, 방수 부재(140)는 지지 프레임(150) 없이 하우징(110)의 내측에 고정될 수도 있다. 예컨대, 방수 부재(140)는 하우징(110)의 내측에 접착 물질로 부착되는 방식에 의해 고정될 수 있다.The support frame 150 may be made of a material such as plastic or metal. When the support frame 150 is made of a metal material, the inner surface of the support frame 150 may be coated with an insulating material. The support frame 150 may be sealed by a sealing material such as silicon at a portion coupled with the transducer 120. Therefore, the probe circuit board 130 and the connection circuit board 121 may be wrapped and sealed by the waterproof member 140 in a state accommodated in the support frame 150. Meanwhile, the waterproof member 140 may be fixed to the inside of the housing 110 without the supporting frame 150. For example, the waterproof member 140 may be fixed by attaching an adhesive material to the inside of the housing 110.
다른 예로, 도 6 및 도 7에 도시된 바와 같이, 각각의 통공부(213)는 복수의 내측 홈(213b)들이 외측 홈(213a)에 대해 각각 편심되어 외측 홈(213a)의 둘레 방향으로 배열되도록 하우징(110)의 내면에 형성될 수 있다. 연결 통공(213c)들은 외측 홈(213a)의 바닥 쪽에서 외측 홈(213a)을 내측 홈(213b)들과 각각 통하게 연결할 수 있다. 내측 홈(213b)들은 외측 홈(213a)보다 각각 작은 지름을 가지며 일정 간격으로 배열될 수 있다. 이러한 통공부(213)들은 하우징(110) 내외로 공기를 출입시켜 하우징(110) 내부의 열을 방출시킬 수 있을 뿐 아니라, 진단자가 하우징(110) 외면을 손으로 쥔 상태에서 손 피부가 하우징(110) 내부와 접촉되는 것을 차단할 수 있으며, 하우징(110) 외부에서 하우징(110) 내부가 보이는 것을 최소화할 수 있다.As another example, as shown in FIGS. 6 and 7, each of the through holes 213 is arranged in the circumferential direction of the outer groove 213a with a plurality of inner grooves 213b eccentric with respect to the outer groove 213a, respectively. It may be formed on the inner surface of the housing 110. The connecting through holes 213c may connect the outer grooves 213a with the inner grooves 213b at the bottom of the outer groove 213a, respectively. The inner grooves 213b may have smaller diameters than the outer grooves 213a and may be arranged at regular intervals. The through-holes 213 may not only release air into and out of the housing 110 to release heat from the inside of the housing 110, but also the skin of the hand may be held in a state where the hand of the diagnoser holds the housing 110 by hand. 110 may be prevented from contacting the inside, it is possible to minimize the view of the inside of the housing 110 from the outside of the housing (110).
한편, 내측 홈(213b)들은 외측 홈(213a)과 일부 겹쳐지게 위치된 것으로 도시되어 있으나, 내측 홈(213b)들의 각 가장자리가 외측 홈(213a)의 가장자리로부터 벗어나거나 일치하도록 위치되는 것도 가능하다. 또한, 통공부(213)들의 크기와 배열 형태는 전술한 기능을 수행할 수 있는 범주에서 다양하게 설정될 수 있으므로, 도시된 바에 한정되지 않는다.On the other hand, the inner grooves 213b are shown as being partially overlapped with the outer grooves 213a, but it is also possible for each edge of the inner grooves 213b to be positioned so as to deviate from or coincide with the edge of the outer groove 213a. . In addition, the size and arrangement of the through-holes 213 may be variously set in a range capable of performing the above-described functions, and is not limited to the illustrated.
본 발명은 첨부된 도면에 도시된 일 실시예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 당해 기술분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 수 있을 것이다. 따라서, 본 발명의 진정한 보호 범위는 첨부된 청구 범위에 의해서만 정해져야 할 것이다.Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Accordingly, the true scope of protection of the invention should be defined only by the appended claims.

Claims (15)

  1. 내외로 공기가 출입 가능하도록 복수의 통공부들을 갖는 하우징;A housing having a plurality of through parts to allow air to enter and exit the air;
    상기 하우징에 적어도 일부가 수용되며, 초음파 신호를 송수신하는 트랜스듀서;At least a part accommodated in the housing and configured to transmit and receive an ultrasonic signal;
    상기 하우징에 수용되며, 상기 트랜스듀서와 접속되는 프로브 회로기판; 및A probe circuit board accommodated in the housing and connected to the transducer; And
    상기 하우징 내부에서 상기 프로브 회로기판을 감싸도록 형성되어 상기 프로브 회로기판으로 수분 유입을 차단하는 방수 부재;A waterproof member formed inside the housing to surround the probe circuit board to block water from entering the probe circuit board;
    를 포함하는 초음파 프로브.Ultrasonic probe comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 각각의 통공부는,Each of the through parts,
    상기 하우징의 외면에 형성된 외측 홈과,An outer groove formed on an outer surface of the housing,
    상기 외측 홈에 대해 편심되도록 상기 하우징의 내면에 형성된 내측 홈, 및An inner groove formed in the inner surface of the housing so as to be eccentric with respect to the outer groove, and
    상기 외측 홈의 바닥 쪽에서 상기 외측 홈을 상기 내측 홈과 통하게 연결하는 연결 통공을 포함하는 것을 특징으로 하는 초음파 프로브.And a connecting through hole for connecting the outer groove to the inner groove at a bottom side of the outer groove.
  3. 제1항에 있어서,The method of claim 1,
    상기 각각의 통공부는,Each of the through parts,
    상기 하우징의 외면에 형성된 외측 홈과,An outer groove formed on an outer surface of the housing,
    상기 외측 홈에 대해 각각 편심되어 상기 외측 홈의 둘레 방향으로 배열되도록 상기 하우징의 내면에 형성된 복수의 내측 홈들, 및A plurality of inner grooves formed on an inner surface of the housing so as to be eccentric with respect to the outer groove and arranged in a circumferential direction of the outer groove, and
    상기 외측 홈의 바닥 쪽에서 상기 외측 홈을 상기 내측 홈들과 각각 통하게 연결하는 연결 통공들을 포함하는 것을 특징으로 하는 초음파 프로브.Ultrasonic probe, characterized in that it comprises a connecting through hole connecting the outer groove with the inner groove in the bottom side of the outer groove, respectively.
  4. 제1항에 있어서,The method of claim 1,
    상기 방수 부재는 공기 투과 기능을 추가로 갖는 것을 특징으로 하는 초음파 프로브.And the waterproof member further has an air permeation function.
  5. 제1항에 있어서, The method of claim 1,
    상기 방수 부재는 방열 기능을 추가로 갖는 것을 특징으로 하는 초음파 프로브.The waterproof member is an ultrasonic probe, characterized in that it further has a heat radiation function.
  6. 제1항에 있어서,The method of claim 1,
    상기 방수 부재는 EMI(Electro Magnetic Interference) 차폐 기능을 추가로 갖는 것을 특징으로 하는 초음파 프로브.The waterproof member is an ultrasonic probe, characterized in that it further has an EMI (Electro Magnetic Interference) shielding function.
  7. 제1항에 있어서,The method of claim 1,
    상기 방수 부재의 내면에 맞닿게 배치되어 상기 방수 부재를 지지하는 지지 프레임을 더 포함하는 것을 특징으로 하는 초음파 프로브.Ultrasonic probe further comprises a support frame disposed in contact with the inner surface of the waterproof member for supporting the waterproof member.
  8. 제7항에 있어서,The method of claim 7, wherein
    상기 지지 프레임은 상기 트랜스듀서와 결합된 부위가 밀봉 처리된 것을 특징으로 하는 초음파 프로브.The support frame is an ultrasonic probe, characterized in that the sealing portion coupled to the transducer.
  9. 제1항에 있어서,The method of claim 1,
    상기 하우징은,The housing,
    한쪽 단부에 형성된 개구를 통해 상기 트랜스듀서를 일부 끼운 상태에서 상기 프로브 회로기판과 방수 부재를 수용하는 내부 공간을 가지며 둘레 부위에 상기 복수의 통공부들을 갖는 것을 특징으로 하는 초음파 프로브.And an inner space for accommodating the probe circuit board and the waterproof member in a state in which the transducer is partially inserted through an opening formed at one end, and having a plurality of through-holes in a peripheral portion thereof.
  10. 내외로 공기가 출입 가능하도록 복수의 통공부들을 갖는 하우징;A housing having a plurality of through parts to allow air to enter and exit the air;
    상기 하우징에 적어도 일부가 수용되며, 초음파 신호를 송수신하는 트랜스듀서;At least a part accommodated in the housing and configured to transmit and receive an ultrasonic signal;
    상기 하우징에 수용되며, 상기 트랜스듀서와 접속되는 프로브 회로기판; 및A probe circuit board accommodated in the housing and connected to the transducer; And
    상기 하우징의 내측에 고정되며, 상기 프로브 회로기판을 감싸도록 형성되어 상기 프로브 회로기판으로 수분 유입을 차단하는 방수 부재;A waterproof member fixed inside the housing and formed to surround the probe circuit board to block water from entering the probe circuit board;
    를 포함하는 초음파 프로브.Ultrasonic probe comprising a.
  11. 제10항에 있어서,The method of claim 10,
    상기 각각의 통공부는,Each of the through parts,
    상기 하우징의 외면에 형성된 외측 홈과,An outer groove formed on an outer surface of the housing,
    상기 외측 홈에 대해 편심되도록 상기 하우징의 내면에 형성된 내측 홈, 및An inner groove formed in the inner surface of the housing so as to be eccentric with respect to the outer groove, and
    상기 외측 홈의 바닥 쪽에서 상기 외측 홈을 상기 내측 홈과 통하게 연결하는 연결 통공을 포함하는 것을 특징으로 하는 초음파 프로브.And a connecting through hole for connecting the outer groove to the inner groove at a bottom side of the outer groove.
  12. 제10항에 있어서,The method of claim 10,
    상기 각각의 통공부는,Each of the through parts,
    상기 하우징의 외면에 형성된 외측 홈과,An outer groove formed on an outer surface of the housing,
    상기 외측 홈에 대해 각각 편심되어 상기 외측 홈의 둘레 방향으로 배열되도록 상기 하우징의 내면에 형성된 복수의 내측 홈들, 및A plurality of inner grooves formed on an inner surface of the housing so as to be eccentric with respect to the outer groove and arranged in a circumferential direction of the outer groove, and
    상기 외측 홈의 바닥 쪽에서 상기 외측 홈을 상기 내측 홈들과 각각 통하게 연결하는 연결 통공들을 포함하는 것을 특징으로 하는 초음파 프로브.Ultrasonic probe, characterized in that it comprises a connecting through hole connecting the outer groove with the inner groove in the bottom side of the outer groove, respectively.
  13. 제10항에 있어서,The method of claim 10,
    상기 방수 부재는 공기 투과 기능을 추가로 갖는 것을 특징으로 하는 초음파 프로브.And the waterproof member further has an air permeation function.
  14. 제10항에 있어서, The method of claim 10,
    상기 방수 부재는 방열 기능을 추가로 갖는 것을 특징으로 하는 초음파 프로브.The waterproof member is an ultrasonic probe, characterized in that it further has a heat radiation function.
  15. 제10항에 있어서,The method of claim 10,
    상기 방수 부재는 EMI(Electro Magnetic Interference) 차폐 기능을 추가로 갖는 것을 특징으로 하는 초음파 프로브.The waterproof member is an ultrasonic probe, characterized in that it further has an EMI (Electro Magnetic Interference) shielding function.
PCT/KR2014/001650 2014-02-27 2014-02-27 Ultrasonic probe having improved heat dissipation characteristics WO2015129938A1 (en)

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KR1020140023313A KR20150101699A (en) 2014-02-27 2014-02-27 Acoustic Probe with Improved Thermal Dissipation Properties

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