WO2015129635A1 - Illumination apparatus - Google Patents

Illumination apparatus Download PDF

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Publication number
WO2015129635A1
WO2015129635A1 PCT/JP2015/055075 JP2015055075W WO2015129635A1 WO 2015129635 A1 WO2015129635 A1 WO 2015129635A1 JP 2015055075 W JP2015055075 W JP 2015055075W WO 2015129635 A1 WO2015129635 A1 WO 2015129635A1
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WIPO (PCT)
Prior art keywords
cover
frame
substrate
led substrate
led
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PCT/JP2015/055075
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French (fr)
Japanese (ja)
Inventor
公史 齋藤
太一 ▲角▼野
坂本　哲也
Original Assignee
三菱電機株式会社
三菱電機照明株式会社
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Application filed by 三菱電機株式会社, 三菱電機照明株式会社 filed Critical 三菱電機株式会社
Priority to CN201580010344.3A priority Critical patent/CN106030190B/en
Publication of WO2015129635A1 publication Critical patent/WO2015129635A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/03—Lighting devices intended for fixed installation of surface-mounted type
    • F21S8/031—Lighting devices intended for fixed installation of surface-mounted type the device consisting essentially only of a light source holder with an exposed light source, e.g. a fluorescent tube
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED substrate fixing structure in a lighting fixture having an LED substrate.
  • Patent Document 1 discloses a light source unit in which a plurality of LEDs are mounted on the surface of a substrate, a heat dissipation member that contacts the back surface of the substrate, a reflector disposed on the surface side of the substrate, and the light source. It is a lighting fixture which has a unit main body holding the unit and the heat dissipation member, and a fixing member for fixing the substrate to the heat dissipation member.
  • the fixing member is provided on the non-reflective surface side of the reflection plate with the reflection plate, the attachment portion attached to the fixture main body, and the substrate by the elastic force between the fixture main body.
  • a sandwiching portion for sandwiching is integrally formed.
  • the substrate is held by the reflector, but the reflector is composed of two parts on the left and right sides, and the substrate is fixed by sliding one side at a time. Problems such as an increase in cost and a decrease in work efficiency occur.
  • This invention aims at provision of the illuminating device which can suppress the increase in a number of parts, and the fall of work efficiency.
  • the luminaire of this invention is An LED substrate on which a plurality of LEDs are arranged; A frame having a flat portion in contact with the back surface of the LED substrate; A cover that is integrally formed and includes a light-transmitting cover-side main body that covers the LED substrate, a cover-side substrate fixing portion, and a cover-side frame engaging portion; The cover is The cover is attached to the frame by the cover side frame engaging portion engaging with the frame in a state where the cover side substrate fixing portion is in contact with the LED mounting surface of the LED substrate, and the cover side The board fixing part fixes the LED board to the flat part of the frame.
  • the cover can be attached to the frame and the LED substrate can be fixed to the frame by one operation of engaging the cover with the frame, the number of parts and the number of work steps can be reduced. Can do.
  • FIG. 3 is a perspective view of the lighting apparatus 1000 in the first embodiment.
  • FIG. 3 is an exploded perspective view of the lighting apparatus 1000 in the first embodiment.
  • FIG. AA sectional view of FIG. FIG. 5 is a view corresponding to the AA cross-sectional view of FIG.
  • FIG. 6 is a diagram for explaining reflection of light 2 in the second embodiment.
  • FIG. 9 is a diagram showing a protrusion 232-1-1 in the third embodiment.
  • Embodiment 1 FIG.
  • an inverted Fuji type illumination that is attached to a mounted portion such as a ceiling
  • the ceiling is described as an example of the mounted portion but is not limited to the ceiling.
  • the instrument 1000 will be described.
  • the ceiling side attached surface side
  • the floor surface opposite side to the attached surface
  • the lighting fixture 1000 of the first embodiment is characterized in that the cover 230 is attached to the frame 220 by engaging the cover 230 with the frame 220.
  • the LED board 210 can be fixed to the frame 220.
  • the lighting apparatus 1000 according to the first embodiment will be described with reference to FIGS.
  • FIG. 1 is a perspective view of the lighting fixture 1000.
  • FIG. 2 is an exploded perspective view of the lighting fixture 1000 shown in FIG.
  • FIG. 3 is a perspective view in which the light source lid portion 240 is removed from the light source portion 200 shown in FIG.
  • a lighting fixture 1000 (lighting device) includes a main body 100 that is installed so as to abut on a ceiling (attached portion), and a light source unit 200 that is detachably attached to the main body 100. Composed. The light source unit 200 is detachably attached so as to face the main body unit 100. Both ends of the light source unit 200 are covered with light source cover units 240.
  • the light source unit 200 includes an LED substrate 210 (light source unit), a frame 220, and a cover 230.
  • the lighting fixture 1000 (FIG. 1) has a longitudinal shape, and the LED substrate 210 has a longitudinal shape as well. A plurality of LEDs 212 are mounted on the LED substrate 210 in the longitudinal direction of the mounting surface 211J of the substrate 211.
  • the frame 220 is made of a metal such as aluminum or iron, and heat generated from the LED 212 is transmitted to the frame 220 (frame side flat portion 221) through the substrate 211 to be radiated.
  • the frame 220 functions as a fixing member to which the LED substrate 210 is fixed and a heat radiating member that radiates heat from the LED substrate 210.
  • the frame 220 has a longitudinal shape substantially the same length as the main body 100 (FIG. 2). As shown in FIG. 4, the frame 220 has a frame-side flat portion 221 that abuts against the back surface of the LED substrate 210 (the surface on the back side of the mounting surface 211J).
  • the frame 220 has a side plate 222 that has a substantially “U” shape in cross section and that stands from both sides of a frame-side flat portion 221 that is a long rectangular shape.
  • the end portion of the side plate 222 in the vertical direction is curled along the longitudinal direction of the frame 220 (side plate curl portion 222R).
  • the cover 230 is made of a transparent or transparent resin such as polycarbonate or acrylic or containing a light diffusing material.
  • the cover 230 is an integrally molded product. As shown in FIG. 4, the cover 230 includes a flat cover-side flat portion 232 that contacts the frame-side flat portion 221, a translucent cover-side main body portion 233 that covers the LED substrate 210, and a claw portion 234 (cover-side frame engagement). Part).
  • the cover-side main body 233 rises from the cover-side flat portion 232 and covers the LED substrate 210.
  • a cover side substrate fixing portion 232-1 is formed at an end portion of each cover side flat portion 232 near the LED substrate 210.
  • a side plate-shaped claw portion 234 is erected in a wall shape from the back surface of the cover-side flat portion 232 in the longitudinal direction (FIG. 3).
  • the claw portion tip portion 234R has a bent R shape that fits the side plate curl portion 222R.
  • the LED substrate 210 is pressed against and fixed to the frame 220 (the frame-side flat portion 221) by the cover-side substrate fixing portion 232-1 and also efficiently transfers the heat emitted from the LED 212 to the frame 220. It becomes possible.
  • the LED substrate 210 may be fixed only by the cover 230, but an adhesive having a good thermal conductivity such as silicon is applied and adhered between the LED substrate 210 and the frame 220 (frame side flat portion 221). It may be fixed at 230.
  • the lighting fixture 1000 of Embodiment 1 described above is characterized in that a part of the cover 230 is configured to hold the LED substrate.
  • the cover 230 is an integrally molded product and is fixed by being fitted into the frame 220 which is a heat radiating member.
  • a part (claw part) of the cover 230 has a function of fixing the LED substrate again after being fixed to the frame 220, and the LED substrate 210 is attached by one operation of fitting the cover 230 into the frame (heat radiating member). Can be fixed. Therefore, there are effects such as a reduction in the number of parts and a reduction in work man-hours.
  • FIG. FIG. 6 shows an AA cross-sectional view (position of the AA cross-section of FIG. 3 of the first embodiment) in the second embodiment.
  • light emitted from the LED 212 includes light 1 emitted through the cover-side main body 233 and light 2 reflected from the cover inner surface (point P).
  • the light 2 reflected by the inner surface (point P) of the cover-side body 233 is reflected again by the cover-side flat portion 232 (including the cover-side substrate fixing portion 232-1) (point Q) inside the cover and reflected by the cover-side body.
  • Light is emitted from the unit 233.
  • the cover-side flat portion 232 serving as the internal reflection surface is made of a highly reflective material (cover-side flat portion 232A, cover-side substrate fixing portion 232-1A) having a higher reflectance than the cover-side main body portion 233.
  • the highly reflective material is the same material as the light-transmitting material of the cover-side main body 233, for example, polycarbonate, and two kinds of materials can be extruded by integral molding. Further, if a highly reflective material is applied to the surface of the substrate 211, the optical efficiency can be further increased.
  • the cover 230 is integrally formed of two types of resin materials, the light emitting portion (cover side main body portion 233A) is made of a light transmissive material, and the reflective portion (cover side substrate fixing portion 232).
  • a highly reflective material having a reflectance of 90% or more is used for the cover side flat portion 232A) including -1A. This has the effect of improving the light extraction efficiency.
  • FIG. 7 and 8 are AA cross-sectional views (positions of the AA cross section of FIG. 4 of the first embodiment) showing the cover side substrate fixing part 232-1 of the third embodiment. is there.
  • the protrusion 232-1-1 is provided on the surface (location) of the cover side substrate fixing portion 232-1 that contacts the mounting surface 211 J of the substrate 211.
  • the substrate 211 can be reliably pressed against the frame 220 (frame side flat portion 221).
  • the protrusion 232-1-1 has a longitudinal shape along the plurality of LEDs in FIG. Embodiments 1 to 3 may be combined in whole or in part.

Abstract

　The purpose of the present invention is to provide an illumination apparatus having an LED substrate and, regarding the fixing of the LED substrate, being capable of suppressing an increase in the number of components or a decrease in work efficiency. In this cover (230), a hook section (234) engages with a side surface plate (222) of frame (220) in a state where a cover-side substrate-fixing section (232-1) is in contact with a mounting surface (211J) of the LED substrate (210). The cover (230) is mounted on the frame (220) through this engagement and the cover-side substrate-fixing section (232-1) fixes the LED substrate (210) to a frame-side flat section (221).

Description

照明器具lighting equipment
　この発明は、ＬＥＤ基板を有する照明器具における、ＬＥＤ基板の固定構造に関する。 The present invention relates to an LED substrate fixing structure in a lighting fixture having an LED substrate.
　従来から、ＬＥＤパッケージを直線状に配置した照明器具がある。例えば、特許文献１は、基板の表面に複数のＬＥＤが実装されている光源ユニットと、前記基板の裏面に当接する放熱部材と、前記基板の表面側に配置されている反射板と、前記光源ユニットと前記放熱部材を保持する器具本体と、前記基板を前記放熱部材に固定する固定部材とを有する照明器具である。この照明器具において、前記固定部材は、前記反射板と、前記器具本体に取り付けられる取付部と、前記反射板の非反射面側に設けられて前記器具本体との間で弾性力により前記基板を狭持する狭持部とが一体に構成されている。 Conventionally, there is a lighting fixture in which LED packages are arranged linearly. For example, Patent Document 1 discloses a light source unit in which a plurality of LEDs are mounted on the surface of a substrate, a heat dissipation member that contacts the back surface of the substrate, a reflector disposed on the surface side of the substrate, and the light source. It is a lighting fixture which has a unit main body holding the unit and the heat dissipation member, and a fixing member for fixing the substrate to the heat dissipation member. In this lighting fixture, the fixing member is provided on the non-reflective surface side of the reflection plate with the reflection plate, the attachment portion attached to the fixture main body, and the substrate by the elastic force between the fixture main body. A sandwiching portion for sandwiching is integrally formed.
特開２０１２－２２６９５７号公報JP 2012-226957 A
　特許文献１では反射板により基板を狭持しているが、反射板は左右２部品から構成されており、片側ずつスライドさせて基板を固定しており、部品点数、作業工数共に複数となる為、コストの上昇や、作業効率の低下といった問題が生じる。 In Patent Document 1, the substrate is held by the reflector, but the reflector is composed of two parts on the left and right sides, and the substrate is fixed by sliding one side at a time. Problems such as an increase in cost and a decrease in work efficiency occur.
　本発明は、部品点数の増加や作業効率の低下を抑えることができる照明装置の提供を目的とする。 This invention aims at provision of the illuminating device which can suppress the increase in a number of parts, and the fall of work efficiency.
　この発明の照明器具は、
　複数のＬＥＤが配置されたＬＥＤ基板と、
　前記ＬＥＤ基板の裏面に当接する平坦部を有するフレームと、
　一体成形されたカバーであって、前記ＬＥＤ基板を覆う透光性のカバー側本体部と、カバー側基板固定部と、カバー側フレーム係合部とを有するカバーと
を備え、
　前記カバーは、
　前記カバー側基板固定部が前記ＬＥＤ基板のＬＥＤ実装面と接した状態で前記カバー側フレーム係合部が前記フレームと係合することにより、前記カバーは前記フレームに装着され、かつ、前記カバー側基板固定部が前記ＬＥＤ基板を前記フレームの前記平坦部に固定することを特徴とする。 The luminaire of this invention is
An LED substrate on which a plurality of LEDs are arranged;
A frame having a flat portion in contact with the back surface of the LED substrate;
A cover that is integrally formed and includes a light-transmitting cover-side main body that covers the LED substrate, a cover-side substrate fixing portion, and a cover-side frame engaging portion;
The cover is
The cover is attached to the frame by the cover side frame engaging portion engaging with the frame in a state where the cover side substrate fixing portion is in contact with the LED mounting surface of the LED substrate, and the cover side The board fixing part fixes the LED board to the flat part of the frame.
　本発明によれば、カバーをフレームに係合させるという一つの操作でカバーがフレームに装着されると共にＬＥＤ基板をフレームに固定することができるので、部品点数の削減や作業工数の削減を図ることができる。 According to the present invention, since the cover can be attached to the frame and the LED substrate can be fixed to the frame by one operation of engaging the cover with the frame, the number of parts and the number of work steps can be reduced. Can do.
実施の形態１の図で、照明器具１０００の斜視図。FIG. 3 is a perspective view of the lighting apparatus 1000 in the first embodiment. 実施の形態１の図で、照明器具１０００の分解斜視図。FIG. 3 is an exploded perspective view of the lighting apparatus 1000 in the first embodiment. 実施の形態１の図で、光源蓋部２４０を取り外した状態の光源部２００の斜視図。The perspective view of the light source part 200 of the state of Embodiment 1 in the state which removed the light source cover part 240. FIG. 図３のＡ－Ａ断面図。AA sectional view of FIG. 図４のＡ－Ａ断面図に相当する図であり、カバー２３０の装着を説明する図。FIG. 5 is a view corresponding to the AA cross-sectional view of FIG. 実施の形態２の図で、光２の反射を説明する図。FIG. 6 is a diagram for explaining reflection of light 2 in the second embodiment. 実施の形態３の図で、突起２３２－１－１を示す図。FIG. 9 is a diagram showing a protrusion 232-1-1 in the third embodiment. 実施の形態３の図７のＡ部拡大図。The A section enlarged view of FIG. 7 of Embodiment 3. FIG.
　実施の形態１．
　実施の形態１では、本発明に係る照明器具の一例として、天井などの被取付部（以下、被取付部として天井を例に説明するが天井に限定されない）に取り付けられる、逆富士形の照明器具１０００について説明する。以下の説明において、便宜上、天井面側（被取付面側）を上面側とし、床面側（被取付面と反対側）を下面側として説明をおこなう。 Embodiment 1 FIG.
In the first embodiment, as an example of the lighting apparatus according to the present invention, an inverted Fuji type illumination that is attached to a mounted portion such as a ceiling (hereinafter, the ceiling is described as an example of the mounted portion but is not limited to the ceiling). The instrument 1000 will be described. In the following description, for convenience, the ceiling side (attached surface side) will be described as the upper surface side, and the floor surface (opposite side to the attached surface) will be described as the lower surface side.
（照明器具１０００の特徴）
　実施の形態１の照明器具１０００の特徴は、後述（図４、図６、図７等）のように、カバー２３０をフレーム２２０に係合させることで、カバー２３０がフレーム２２０に装着すると共に、ＬＥＤ基板２１０をフレーム２２０に固定できる点にある。以下、図１～図８を参照して実施の形態１の照明器具１０００を説明する。 (Characteristics of lighting fixture 1000)
As described below (FIGS. 4, 6, 7, etc.), the lighting fixture 1000 of the first embodiment is characterized in that the cover 230 is attached to the frame 220 by engaging the cover 230 with the frame 220. The LED board 210 can be fixed to the frame 220. Hereinafter, the lighting apparatus 1000 according to the first embodiment will be described with reference to FIGS.
　図１は、照明器具１０００の斜視図である。図２は図１に示す照明器具１０００の分解斜視図である。図３は、図２に示す光源部２００から光源蓋部２４０を取り外し斜視図である。 FIG. 1 is a perspective view of the lighting fixture 1000. FIG. 2 is an exploded perspective view of the lighting fixture 1000 shown in FIG. FIG. 3 is a perspective view in which the light source lid portion 240 is removed from the light source portion 200 shown in FIG.
（照明器具１０００の構成）
　図１、図２のように、照明器具１０００（照明装置）は、天井（被取付部）に当接するように設置される本体部１００と、本体部１００に脱着可能に取り付けられる光源部２００から構成される。光源部２００は本体部１００に対向するように脱着可能に取り付けられる。光源部２００の両端は光源蓋部２４０で蓋がされている。 (Configuration of lighting apparatus 1000)
As shown in FIGS. 1 and 2, a lighting fixture 1000 (lighting device) includes a main body 100 that is installed so as to abut on a ceiling (attached portion), and a light source unit 200 that is detachably attached to the main body 100. Composed. The light source unit 200 is detachably attached so as to face the main body unit 100. Both ends of the light source unit 200 are covered with light source cover units 240.
　図３は光源部２００の斜視図であり、図２の光源部２００から光源蓋部２４０取り外した斜視図である。図４は図３のＡ－Ａ断面図である。図３、図４に示すように、光源部２００は、ＬＥＤ基板２１０（光源ユニット）、フレーム２２０、カバー２３０を備える。 3 is a perspective view of the light source unit 200, and is a perspective view of the light source cover unit 240 removed from the light source unit 200 of FIG. 4 is a cross-sectional view taken along the line AA in FIG. As shown in FIGS. 3 and 4, the light source unit 200 includes an LED substrate 210 (light source unit), a frame 220, and a cover 230.
（ＬＥＤ基板）
　照明器具１０００（図１）は長手形状であり、ＬＥＤ基板２１０も同様に長手形状である。ＬＥＤ基板２１０には基板２１１の実装面２１１Ｊの長手方向に複数のＬＥＤ２１２が実装されている。 (LED board)
The lighting fixture 1000 (FIG. 1) has a longitudinal shape, and the LED substrate 210 has a longitudinal shape as well. A plurality of LEDs 212 are mounted on the LED substrate 210 in the longitudinal direction of the mounting surface 211J of the substrate 211.
（フレーム２２０）
　フレーム２２０は、アルミや鉄などの金属で出来ており、ＬＥＤ２１２から出る熱が基板２１１を通してフレーム２２０（フレーム側平坦部２２１）に伝わり、放熱される。フレーム２２０はＬＥＤ基板２１０が固定される固定部材と、ＬＥＤ基板２１０の熱を放熱する放熱部材の機能をする。フレーム２２０は本体部１００とほぼ同じ長さの長手形状をなす（図２）。図４のように、フレーム２２０はＬＥＤ基板２１０の裏面（実装面２１１Ｊの裏側の面）に当接するフレーム側平坦部２２１を有する。フレーム２２０は断面が略「コの字」の形状をなし、長手の長方形形状であるフレーム側平坦部２２１の両側からそれぞれ起立して側面をなす側面板２２２を有する。側面板２２２の切立方向の端部は、フレーム２２０の長手方向にわたって、カール加工がされている（側面板カール部２２２Ｒ）。 (Frame 220)
The frame 220 is made of a metal such as aluminum or iron, and heat generated from the LED 212 is transmitted to the frame 220 (frame side flat portion 221) through the substrate 211 to be radiated. The frame 220 functions as a fixing member to which the LED substrate 210 is fixed and a heat radiating member that radiates heat from the LED substrate 210. The frame 220 has a longitudinal shape substantially the same length as the main body 100 (FIG. 2). As shown in FIG. 4, the frame 220 has a frame-side flat portion 221 that abuts against the back surface of the LED substrate 210 (the surface on the back side of the mounting surface 211J). The frame 220 has a side plate 222 that has a substantially “U” shape in cross section and that stands from both sides of a frame-side flat portion 221 that is a long rectangular shape. The end portion of the side plate 222 in the vertical direction is curled along the longitudinal direction of the frame 220 (side plate curl portion 222R).
（カバー２３０）
　カバー２３０は、ポリカーボネートやアクリルなどの透明または光拡散材を含んだ透光性樹脂でできている。カバー２３０は、一体成形品である。図４のように、カバー２３０は、フレーム側平坦部２２１と接する平板状のカバー側平坦部２３２、ＬＥＤ基板２１０を覆う透光性のカバー側本体部２３３、爪部２３４（カバー側フレーム係合部）を有する。カバー側本体部２３３は、カバー側平坦部２３２から立ち上がってＬＥＤ基板２１０を覆う。それぞれのカバー側平坦部２３２のＬＥＤ基板２１０寄りの端部には、カバー側基板固定部２３２－１が形成されている。またカバー側平坦部２３２の裏面からは長手方向にわたって（図３）、側板形状の爪部２３４が壁状に立設している。爪部先端部２３４Ｒは、側面板カール部２２２Ｒに適合する形状の曲げＲ形状となっている。 (Cover 230)
The cover 230 is made of a transparent or transparent resin such as polycarbonate or acrylic or containing a light diffusing material. The cover 230 is an integrally molded product. As shown in FIG. 4, the cover 230 includes a flat cover-side flat portion 232 that contacts the frame-side flat portion 221, a translucent cover-side main body portion 233 that covers the LED substrate 210, and a claw portion 234 (cover-side frame engagement). Part). The cover-side main body 233 rises from the cover-side flat portion 232 and covers the LED substrate 210. A cover side substrate fixing portion 232-1 is formed at an end portion of each cover side flat portion 232 near the LED substrate 210. In addition, a side plate-shaped claw portion 234 is erected in a wall shape from the back surface of the cover-side flat portion 232 in the longitudinal direction (FIG. 3). The claw portion tip portion 234R has a bent R shape that fits the side plate curl portion 222R.
（カバー２３０とフレーム２２０の係合）
　図５を参照してカバー２３０とフレーム２２０の係合を説明する。カバー２３０をフレーム２２０に係合させる際には、それぞれのカバー側基板固定部２３２－１によって、ＬＥＤ基板２１０の長手方向の端部を押さえた状態で、作業者がカバー２３０の爪部２３４を破線のように弾性変形させて広げて、カバー２３０の爪部２３４をフレーム２２０の側面板２２２に係合させる。つまり図４に示す寸法Ｌ１はカバー２３０側における寸法Ｌ１、フレーム２２０側における寸法Ｌ１が考慮され、また寸法Ｌ２はＬＥＤ基板２１０の板厚が考慮されてカバー側基板固定部２３２－１のカバー側平坦部２３２に対する段差寸法（カバー２３０側の寸法Ｌ１）が決められる。これらの寸法関係によってＬＥＤ基板２１０は、カバー側基板固定部２３２－１により、フレーム２２０（フレーム側平坦部２２１）に押さえつけられて固定されると共に、ＬＥＤ２１２から出た熱を効率よくフレーム２２０に伝えることが可能となる。なおＬＥＤ基板２１０はカバー２３０だけで固定してもよいが、ＬＥＤ基板２１０とフレーム２２０（フレーム側平坦部２２１）との間にシリコンなどの熱伝導の良い接着剤を塗布して接着し、カバー２３０で固定してもよい。 (Engagement of cover 230 and frame 220)
The engagement between the cover 230 and the frame 220 will be described with reference to FIG. When the cover 230 is engaged with the frame 220, the operator holds the claw portion 234 of the cover 230 with the cover side substrate fixing portion 232-1 holding the end portion in the longitudinal direction of the LED substrate 210. The claws 234 of the cover 230 are engaged with the side plates 222 of the frame 220 by elastically deforming and spreading as shown by broken lines. That is, the dimension L1 shown in FIG. 4 considers the dimension L1 on the cover 230 side and the dimension L1 on the frame 220 side, and the dimension L2 considers the plate thickness of the LED substrate 210 and covers the cover side of the cover side substrate fixing portion 232-1 A step size (dimension L1 on the cover 230 side) with respect to the flat portion 232 is determined. Due to these dimensional relationships, the LED substrate 210 is pressed against and fixed to the frame 220 (the frame-side flat portion 221) by the cover-side substrate fixing portion 232-1 and also efficiently transfers the heat emitted from the LED 212 to the frame 220. It becomes possible. The LED substrate 210 may be fixed only by the cover 230, but an adhesive having a good thermal conductivity such as silicon is applied and adhered between the LED substrate 210 and the frame 220 (frame side flat portion 221). It may be fixed at 230.
　以上の実施の形態１の照明器具１０００は、カバー２３０の一部がＬＥＤ基板を押さえる構成であることが特徴である。カバー２３０は一体成形品であり、放熱部材であるフレーム２２０にはまり込むことで固定される。フレーム２２０に固定される再に、カバー２３０の一部（爪部）がＬＥＤ基板を固定する機能を有しており、カバー２３０をフレーム（放熱部材）にはめ込むという一つの操作でＬＥＤ基板２１０を固定することができる。よって、部品点数の削減や、作業工数の削減などの効果がある。 The lighting fixture 1000 of Embodiment 1 described above is characterized in that a part of the cover 230 is configured to hold the LED substrate. The cover 230 is an integrally molded product and is fixed by being fitted into the frame 220 which is a heat radiating member. A part (claw part) of the cover 230 has a function of fixing the LED substrate again after being fixed to the frame 220, and the LED substrate 210 is attached by one operation of fitting the cover 230 into the frame (heat radiating member). Can be fixed. Therefore, there are effects such as a reduction in the number of parts and a reduction in work man-hours.
　実施の形態２．
　図６は、本実施の形態２におけるＡ－Ａ断面図（実施の形態１の図３のＡ－Ａ断面の位置）を示す。図６に示すように、ＬＥＤ２１２から出た光はカバー側本体部２３３を通して発光する光１と、カバー内面（Ｐ点）で反射する光２がある。カバー側本体部２３３の内面（Ｐ点）で反射した光２は、カバー内側のカバー側平坦部２３２（カバー側基板固定部２３２－１を含む）（Ｑ点）で再度反射してカバー側本体部２３３から発光される。ここで、カバー２３０のうち、内部反射面となるカバー側平坦部２３２を、カバー側本体部２３３よりも反射率の大きい高反射材料（カバー側平坦部２３２Ａ、カバー側基板固定部２３２－１Ａ）にすることにより、カバー２３０からの発光効率を上げることができる。高反射材料はカバー側本体部２３３の透光材料と同質の材料、例えばポリカーボネートであり、２種類の材料を一体成形で押出すことができる。また、基板２１１の表面に高反射材料を塗布すれば、更に光学効率を上げることができる。 Embodiment 2. FIG.
FIG. 6 shows an AA cross-sectional view (position of the AA cross-section of FIG. 3 of the first embodiment) in the second embodiment. As shown in FIG. 6, light emitted from the LED 212 includes light 1 emitted through the cover-side main body 233 and light 2 reflected from the cover inner surface (point P). The light 2 reflected by the inner surface (point P) of the cover-side body 233 is reflected again by the cover-side flat portion 232 (including the cover-side substrate fixing portion 232-1) (point Q) inside the cover and reflected by the cover-side body. Light is emitted from the unit 233. Here, in the cover 230, the cover-side flat portion 232 serving as the internal reflection surface is made of a highly reflective material (cover-side flat portion 232A, cover-side substrate fixing portion 232-1A) having a higher reflectance than the cover-side main body portion 233. Thus, the light emission efficiency from the cover 230 can be increased. The highly reflective material is the same material as the light-transmitting material of the cover-side main body 233, for example, polycarbonate, and two kinds of materials can be extruded by integral molding. Further, if a highly reflective material is applied to the surface of the substrate 211, the optical efficiency can be further increased.
　実施の形態２の照明器具は、カバー２３０が２種類の樹脂材料で一体成形されており、発光部分（カバー側本体部２３３Ａ）は光透過性材料からなり、反射部分（カバー側基板固定部２３２－１Ａを含むカバー側平坦部２３２Ａ）には反射率９０％以上の高反射材料を使用する。これにより、光の取り出し効率を向上させる効果がある。 In the lighting apparatus of Embodiment 2, the cover 230 is integrally formed of two types of resin materials, the light emitting portion (cover side main body portion 233A) is made of a light transmissive material, and the reflective portion (cover side substrate fixing portion 232). A highly reflective material having a reflectance of 90% or more is used for the cover side flat portion 232A) including -1A. This has the effect of improving the light extraction efficiency.
　実施の形態３．
　図７、図８（Ａ部拡大図）は、実施の形態３のカバー側基板固定部２３２－１を示すＡ－Ａ断面図（実施の形態１の図４のＡ－Ａ断面の位置）である。 Embodiment 3 FIG.
7 and 8 (enlarged view of A part) are AA cross-sectional views (positions of the AA cross section of FIG. 4 of the first embodiment) showing the cover side substrate fixing part 232-1 of the third embodiment. is there.
　図７、図８に示すように、カバー側基板固定部２３２－１のうち基板２１１の実装面２１１Ｊと接触する面（箇所）に突起２３２－１－１を設けた。この突起２３２－１－１により、基板２１１をフレーム２２０（フレーム側平坦部２２１）に確実に押さえ付けることができる。突起２３２－１－１は、図３において、複数のＬＥＤに沿う長手形状である。
　なお、実施の形態１～３は、全てまたは部分的に組み合わせてもよい。 As shown in FIGS. 7 and 8, the protrusion 232-1-1 is provided on the surface (location) of the cover side substrate fixing portion 232-1 that contacts the mounting surface 211 J of the substrate 211. By this protrusion 232-1-1, the substrate 211 can be reliably pressed against the frame 220 (frame side flat portion 221). The protrusion 232-1-1 has a longitudinal shape along the plurality of LEDs in FIG.
Embodiments 1 to 3 may be combined in whole or in part.
　１００　本体部、２００　光源部、２１０　ＬＥＤ基板、２１１　基板、２１１Ｊ　実装面、２１２　ＬＥＤ、２２０　フレーム、２２１　フレーム側平坦部、２２２　側面板、２２２Ｒ　側面板カール部、２３０　カバー、２３２，２３２Ａ　カバー側平坦部、２３２－１，２３２－１Ａ　カバー側基板固定部、２３２－１－１　突起、２３３，２３３Ａ　カバー側本体部、２３４　爪部、２３４Ｒ　爪部先端部、２４０　光源蓋部、１０００　照明器具。 100 body part, 200 light source part, 210 LED board, 211 board, 211J mounting surface, 212 LED, 220 frame, 221 frame side flat part, 222 side plate, 222R side plate curl part, 230 cover, 232, 232A cover side flat Part, 232-1, 232-1A cover side substrate fixing part, 232-1-1 projection, 233,233A cover side main body part, 234 claw part, 234R claw part tip part, 240 light source cover part, 1000 lighting fixture.

Claims (3)

  1. 　複数のＬＥＤが配置されたＬＥＤ基板と、
    　前記ＬＥＤ基板の裏面に当接する平坦部を有するフレームと、
    　一体成形されたカバーであって、前記ＬＥＤ基板を覆う透光性のカバー側本体部と、カバー側基板固定部と、カバー側フレーム係合部とを有するカバーと
    を備え、
    　前記カバーは、
    　前記カバー側基板固定部が前記ＬＥＤ基板のＬＥＤ実装面と接した状態で前記カバー側フレーム係合部が前記フレームと係合することにより、前記カバーは前記フレームに装着され、かつ、前記カバー側基板固定部が前記ＬＥＤ基板を前記フレームの前記平坦部に固定することを特徴とする照明器具。     An LED substrate on which a plurality of LEDs are arranged;
    A frame having a flat portion in contact with the back surface of the LED substrate;
    A cover that is integrally formed and includes a light-transmitting cover-side main body that covers the LED substrate, a cover-side substrate fixing portion, and a cover-side frame engaging portion;
    The cover is
    The cover is attached to the frame by the cover side frame engaging portion engaging with the frame in a state where the cover side substrate fixing portion is in contact with the LED mounting surface of the LED substrate, and the cover side A board fixture fixes the LED board to the flat part of the frame.
  2. 　前記カバーは、
    　前記フレームの前記平坦部と接する平板状のカバー側平坦部を有し、
    　前記カバー側本体部は、
    　前記カバー側平坦部から立ち上がって前記ＬＥＤ基板を覆うと共に、
    　前記カバー側平坦部は、
    　前記カバー側本体部よりも光の反射率が高いことを特徴とする請求項１に記載の照明器具。     The cover is
    A flat cover-side flat portion in contact with the flat portion of the frame;
    The cover side main body is
    While standing up from the cover side flat part and covering the LED substrate,
    The cover side flat portion is
    The lighting fixture according to claim 1, wherein the light reflectance is higher than that of the cover-side main body.
  3. 　前記カバー側基板固定部は、
    　前記ＬＥＤ基板の前記実装面と接する箇所に突起が形成されたことを特徴とする請求項１または２に記載の照明器具。     The cover side substrate fixing part is
    The lighting fixture according to claim 1, wherein a protrusion is formed at a location in contact with the mounting surface of the LED substrate.
PCT/JP2015/055075 2014-02-25 2015-02-23 Illumination apparatus WO2015129635A1 (en)

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