WO2015124736A2

WO2015124736A2 - Method and processing arrangement for machining a metal surface of a substrate or of a metal substrate

Info

Publication number: WO2015124736A2
Application number: PCT/EP2015/053642
Authority: WO
Inventors: Maik Vieluf; Harald Gross
Original assignee: Von Ardenne Gmbh
Priority date: 2014-02-21
Filing date: 2015-02-20
Publication date: 2015-08-27
Also published as: DE102014108141A1; WO2015124736A3

Abstract

The invention relates to a method (100, 200, 1000) for machining a metal surface of a substrate (302) or of a metal substrate, wherein the method (100, 200, 1000) can comprise the following: applying a layer (304) onto the metal surface (302) or onto the metal substrate (302), wherein the layer (304) can contain sp² hybridized carbon and/or sp³ hybridized carbon, wherein the layer (304) can have a carbon content of more than 30 at%; and the pulsed irradiation of the layer (302) such that the layer (302) can be heated, and the layer (302) can be structurally changed, at least in part.

Description

description

Method and processing arrangement for processing a

Metal surface of a substrate or a metal substrate

The invention relates to a method for processing a metal surface of a substrate or a metal substrate.

The use of metallic materials or, generally, surfaces of metallic materials (metal surfaces), such as iron-based alloys (e.g., steel), in corrosive environments, such as e.g. in a pure oxygen atmosphere, can be a treatment of

Require metal surface to provide protection against corrosion. In general, this can be done on the

Metal surface (for example, the surface of the metal substrate) an inert (inert) protective layer can be provided, which is a corrosion of the underlying

slows down metallic material. For example, a metal surface may have a suitable composition (e.g., by adding chromium to the metallic material) such that a stable metal surface is formed on the metal surface

Reaction layer (e.g., an oxide layer such as chromium oxide), which stable reaction layer may prevent or at least slow down further corrosion (e.g., oxidation) of the metal surface. At the same time, however, the protective layer provided can be the

reduce electrical conductivity of the metal surface and so electrically contacting the metal surface

difficult.

An aspect of various embodiments can be clearly seen in a method for processing a

To provide metal surface, e.g. of surfaces of a metal substrate or surfaces of a

metal-coated substrate, wherein by means of the method a layer, for example a corrosion-resistant and electrically conductive layer (eg, a protective layer and / or a contact layer) can be applied to the metal surface. Furthermore, according to various embodiments, it may be advantageous to apply a layer before applying the layer

to remove the reaction layer (e.g., an oxide layer) present from the metal surface to further reduce adhesion (i.e.

Adhesion) and increase the electrical contact of the layer to the metal surface. For example, it was clearly recognized that

Carbon based materials, such as

Graphite, a high electrical conductivity and at the same time have a high corrosion resistance in corrosive environments. According to various embodiments, various deposition methods may be used to form a layer containing carbon in various

2

Has configurations such as sp hybridized carbon and / or sp hybridized carbon, on a

Metal surface of a substrate, e.g. a metal substrate.

Various embodiments are further based on

Realizing that the conductivity of materials that

Have carbon in different configurations

2

may be higher, e higher the proportion of sp

hybridized carbon therein. According to various embodiments, by irradiating (for example by means of particle radiation, such as electrons, and / or by means of photons, for example, as heat radiation and / or as light) the layer, the carbon in various configurations

2

has, the proportion of sp hybridized carbon m of the layer and thus the conductivity of the layer are increased, which is an electrical contacting the

Metal surface, e.g. of the metal substrate.

One aspect of various embodiments can be clearly seen in that irradiation of the layer occurs briefly, with an average temperature of the likewise heated during irradiation substrate, eg

Metal substrate, below one (e.g., predetermined)

Maximum value remains, so that a thermal distortion of the substrate can be avoided or at least reduced. In other words, the irradiation may be pulsed and / or the irradiation may be selective (e.g., local) in one

Portion of a layer (e.g., radiation can be selectively deposited in the functional layer / layer system) such that the substrate, e.g. the metal substrate is only slightly heated and retains its shape.

Furthermore, another aspect may be different

Embodiments are clearly seen in a

To provide buffer layer between the

Metal surface of a substrate, e.g. the metal substrate, and the layer can be arranged, wherein the

Adhesiveness of the layer to the metal surface can be increased by means of the buffer layer. In other words, the buffer layer can act as a bonding agent.

According to various embodiments, a method of processing a metal surface of a substrate (also referred to as a method of processing a substrate), e.g. a metal substrate, comprising: applying a layer to the metal surface or the

Metal substrate (e.g., on an upper surface of the substrate), wherein

2 3 the layer sp may have hybridized carbon and / or sp hybridized carbon, which layer may have a carbon content of more than 30 at%; and the pulsed irradiation of the layer so that the layer can be heated and the layer at least partially structurally and / or at least partially chemically changed. Illustratively, by irradiating the layer, the chemical bond and / or the bonding structure or the structure of the carbon can be modified. Furthermore, by irradiating the layer, the electrical conductivity and / or the corrosion property (eg the

Corrosion resistance) of the layer can be increased.

According to various embodiments, the topside substrate may have a metal surface, i. a

Surface of a metal.

The pulsed irradiation of the layer may, according to various embodiments, be such that the layer is at least partially (e.g., a portion of the layer, also referred to as the layer)

Irradiation area or irradiated area) for a period of less than 1 s to more than 400 ° C, e.g. by more than 200 K, e.g. by more than 400 K or e.g. by more than 600 K, can be heated. In other words, the

Power of pulsed irradiation (i.e., that in a

enumerated energy for a certain period of time) in order to heat the layer at a heating rate (heating rate) of more than 500 K / s, eg more than 5000 K / s or eg more than 5-10 ⁴ K / s. Furthermore, the thermal energy introduced into the layer during pulsed irradiation can be dissipated into the substrate, eg the metal substrate, so that the

Layer (e.g., the heated or irradiated region of the

Layer) after pulsed irradiation within 1 s, again below 400 ° C, e.g. by more than 200 K, e.g. by more than 400 K or e.g. by more than 600 K, can cool off. In other words, the layer may have a cooling rate

(Cooling rate) of more than 500 K / s, for example more than 5000 K / s or eg more than 5-10 ⁴ K / s are cooled. The pulsed irradiation may be according to various

Embodiments further using a light source, e.g. using a laser, a lamp or a flashlamp (for example a gas discharge lamp or a light emitting diode) or using several

Light sources take place and exposed the layer pulsed

(irradiated by light). For example, several areas of the layer can be simultaneously (eg by means of a or multiple flash lamps) or sequentially exposed (for example by means of a pulsed or continuously operated laser). Furthermore, the wavelength, the energy distribution or the spectral composition (eg the energy spectrum) of the radiation generated for the pulsed irradiation of the layer can be set such that the radiation from the layer can be at least partially absorbed. For example, the layer can be irradiated by means of white light or alternatively monochromatic light (eg laser light or flash light).

Further, the pulsed irradiation may be according to various

Embodiments using a continuously operated irradiation source, for example a

Electron beam or a continuously operated

Lasers done. Furthermore, from the means of

Radiation source emitted radiation pulsed irradiation are formed.

It can be by means of the continuously operated

Irradiation source emitted radiation (e.g.

Screens, mirrors, reflectors, deflectors and / or

electrical / magnetic fields) to the layer, i. deflected, are that one or more areas of the layer each irradiated briefly (pulsed irradiation) can be. Vividly

for example, those of the continuously operated

Irradiation source emitted radiation can be guided linearly (for example along a grid) over the layer or the layer can be selectively exposed by means of a diaphragm or the multiple regions of the layer

will expose one after the other. In other words, the pulsed irradiation can be formed from the influence of the radiation. Furthermore, according to various embodiments, the

pulsed irradiation with a pulse duration (duration of one

Irradiation pulse) of up to 10 ms each. In other words, in the pulsed irradiation, a

Pulse duration of a maximum of 10 ms are used. For example, the pulse duration during pulsed irradiation may be shorter than

1 ms, e.g. shorter than 0.1 ms or, for example, shorter than 100 ys. Alternatively, the pulse duration can be pulsed

Irradiating a duration in a range of about 10 ys to about 10 ms, e.g. in a range of about 100 ys to about 1 ms, e.g. in a range of about 100 ys to about 600 ys.

According to various embodiments, the substrate, e.g. a metal substrate, a metal foil or a metal sheet having a thickness of less than 2 mm (with a maximum thickness of

2 mm), e.g. with a thickness less than 1 mm or a thickness less than 0.5 mm. For example, the substrate may be a metal sheet, which may have a thickness in a range of about 500 ym to about 2 mm. Alternatively, the substrate may be a metal foil having a thickness in a range of about 50 ym to about 500 ym

may, for example, in a range of about 100 ym to about 300 ym. Further, the substrate may have a thermal conductivity greater than 10 W / (m-K), e.g. greater than 50 W / (m-K) and a metal, e.g. Iron, titanium, nickel, copper, niobium, silver, gold, aluminum or chromium or be formed therefrom. Alternatively, the substrate may be used as a metal-coated substrate, i. a metal-coated substrate,

be educated. The metal surface may be, for example, the surface of the metal coating. The

For example, metal-coated substrate may be referred to as

metal-coated plastic substrate, metal-coated ceramic substrate or metal-coated glass substrate

be educated. Furthermore, according to various embodiments, the substrate, for example the metal substrate, may have a curved, corrugated and / or angled profile (eg cross section), for example the substrate, eg the metal substrate, a corrugated sheet, a corrugated foil, an embossed sheet or an embossed foil, be a trapezoidal sheet or a trapezoidal sheet. In this case, the substrate, for example the metal substrate, a

Embossing height (e.g., a tread depth or depth of

Profile depressions) of about 1 mm, for example in a range of about 0.1 mm to 2 mm and a

Embossing width (distance of the profile sinkers) of about 1 mm, for example in a range of about

0.1 mm to 2 mm. Furthermore, the substrate, e.g. the

Metal substrate, a curved or angled surface, e.g. have a periodically embossed surface or aperiodic embossed surface on which the layer

can be applied. According to various embodiments, the pulsed

Irradiating the layer such that an average temperature of the substrate, e.g. of the metal substrate, throughout the exposure below a maximum value, e.g. below a predetermined maximum value, so that the substrate, e.g. the metal substrate, in the form of which (e.g., the profile or cross section) remains substantially unchanged. The average temperature can be both a time averaged (e.g., one over time between two

Irradiation pulses averaged) or spatially averaged (e.g., over the volume of the

Substrate, e.g. of the metal substrate, averaged) temperature.

A substantially unchanged shape can be, for example, the (when the substrate, eg the metal substrate is being processed), a curvature of the substrate (also referred to as thermal distortion) having a radius of curvature greater than 10 m, for example of more than 50 m or a relative change in the embossing height (or embossing width) of less than 10%, for example of less than 1%. Furthermore, an im

Substantially unchanged form the coating area of the coating system for coating the substrate happen or unhindered by the coating area of the

Coating system to be transported through,

vividly e.g. without a transport role to

Transporting the substrate through the coating area of the coating system or another part of the coating system to collide.

According to various embodiments, the layer having a thickness (layer thickness) of at least 10 nm may be applied to the

Substrate are applied, e.g. with a thickness of

at least 100 nm or one with a thickness of at least 1 ym. Alternatively, the layer may be applied to a thickness in a range of about 20 nm to about 500 nm, e.g. in a range of about 50 nm to about 200 nm or in a range of about 100 nm to about 300 nm. The application of the layer on the substrate may have a common contact area between the substrate and the substrate

Define layer.

According to various embodiments, the layer may hybridize to hybridized carbon and / or sp

Have carbon in the form of graphite, nanocrystalline graphite, amorphous carbon and / or tetrahedral

Carbon.

According to various embodiments, the layer

Having carbon, e.g. can the layer one

Carbon content of more than about 30 at-% (atomic percent, equivalent to the molar fraction), for example, of more than about 50 at-%, for example, of more than about 70 at-%, for example, have more than about 90 at-%. Alternatively, the layer may have a carbon content in a range of about 30 at%. to about 90 at%. The middle one

Carbon content of the layer can be a spatial

average carbon content. Furthermore, the application can take place in such a way that the layer has a gradient in the proportion of the carbon (in the

Carbon content) may have. For example, the gradient of the carbon content may be a relative deviation of the carbon content from the average carbon content of the carbon fraction

Layer of more than 10%, e.g. of more than 30% or 50%. Furthermore, the application can be carried out such that the carbon content of the layer at the common

Contact area between the layer and the substrate is smallest and along a direction perpendicular to the common

Contact area between layer and substrate (e.g., monotone) may increase.

A gradient in the proportion of a constituent (e.g., carbon, nitrogen, or metal) of the layer can be a gradient in the composition of the layer, in the concentration of the layer

Component in the layer, the density of the layer or a substance gradient along one direction. In other words, the layer can be configured, for example, as a gradient layer. For example, the gradient may be greatest along a direction perpendicular to the common contact surface between layer and substrate, e.g. along a direction perpendicular to the surface of the layer or perpendicular to the thickness direction of the layer. Further, according to various embodiments, the layer may include a metal (e.g., titanium, nickel, copper, niobium, silver, gold, or chromium), such as those formed when coating (depositing the layer) substrates

Stresses in the layer (e.g., at the common

Contact area between the layer and the substrate). Illustratively, the layer can be applied, for example, as a corresponding carbon-metal mixture. Further, the layer (eg, a metal staggered

Layer) a gradient in the proportion of the metal (e.g.

perpendicular to the common contact surface between the layer and the substrate), wherein the stress in the layer along the gradient in the proportion of the metal can be steadily reduced. Illustratively, the proportion of metal in the layer may be greatest at the common contact surface between the layer and the substrate, and the adhesion of the layer to the substrate may be increased (e.g., as compared to a layer deposited directly on the substrate without metal).

As adhesion of the layer to the substrate, the

Property of the layer to follow a stretching or deformation of the substrate s (for example, due to thermal expansion or deformation) without departing from the

Detach substrate.

Furthermore, the layer may comprise a buffer layer (containing a metal, eg, titanium, nickel, copper, niobium, aluminum, hafnium, zirconium tantalum, vanadium, iron, molybdenum, tungsten or chromium, a metal nitride, eg titanium nitride (TiN), and / or a metal carbide, eg, titanium carbide (TiC), or may be formed therefrom), wherein the buffer layer as

Adhesion promoter of the layer can be set up to the substrate. For example, a buffer layer for

Adhesive agents be set up as a gradient layer.

Illustratively, the buffer layer can be arranged in direct contact with the substrate (between the substrate and the layer). For example, the buffer layer may have a layer thickness of in a range of about 10 nm to about 300 nm, eg, in a range of about 10 nm to about 200 nm. Further, the application of the layer may be multi-layered (in multiple layers with a respective layer thickness and a layer thickness) respective chemical composition of the individual layers), by at least one metal layer (metal layer) and

At least one carbon layer (carbon layer) are deposited on the substrate. Illustratively, for example, by means of the ratio of the thickness of the metal layer to the thickness of the carbon layer a predetermined

Carbon content can be adjusted.

For example, a metal layer may be more than 50 at% metal, e.g. to more than 70 at% of metal, or e.g. to more than 90 at% of metal. A

For example, carbon layer may be more than 50 at% carbon, e.g. to more than 70 at%

Carbon, or e.g. to more than 90 at% of carbon. Furthermore, a gradient in the proportion of the metal in the layer can be produced, for example by the layer being two-layered (consisting of layers arranged on one another).

is applied, wherein a layer may be a metal layer and a layer of a carbon layer, both of which may have a common contact surface. Further, a region between the carbon layer and the

Metal layer (e.g., the common contact surface)

Mixing of carbon and the metal, so that a continuous transition in the chemical composition of carbon to metal can take place.

Furthermore, a gradient in the proportion of the metal can be generated, for example, by applying a carbon-metal mixture, which can at least partially separate on heating and cooling of the layer. Alternatively, when applying the layer a temporally variable

Carbon-metal mixture can be used so that the layers deposited on one another may have a different chemical composition.

According to various embodiments, the pulsed

Irradiating the layer done in such a way that the proportion of sp? and / or sp3 hybridized carbon in the layer can be changed. For example, by means of the

2

pulsed irradiation of the layer, the proportion of sp

hybridized carbon in the layer.

Furthermore, according to various embodiments, the

pulsed irradiation of the layer, such that the conductivity of the layer can be increased, e.g. by means of

2

Increasing the proportion of sp hybridized carbon m of the layer. Furthermore, the specific electrical

Conductivity of the layer be greater than 10 ⁴ S / m, eg

greater than 10 ⁵ S / m.

According to various embodiments, the substrate can be processed on both sides. Illustratively, a (e.g.

planar or embossed) metal sheet or a metal foil are coated on both sides, with a pulsed irradiation can be done on both sides.

According to various embodiments, the method may further comprise: applying a further layer (also referred to as a second layer) to the substrate or

A metal substrate facing the layer (also referred to as a first layer) (e.g., a surface on an underside of the substrate or metal substrate opposite to the layer); and pulsed irradiation of the further layer. The underside of the substrate does not necessarily have to have a metal surface.

According to various embodiments, the layer may have a first absorption coefficient and the further layer a second absorption coefficient, wherein the

Pulsed irradiation is performed such that a first energy absorbed by the pulsed irradiation from the first absorption coefficient layer and a second energy absorbed by the pulsed irradiation from the other layer according to the second absorption coefficient become substantially equal are, so that a thermal load of the substrate or metal substrate on its top and bottom substantially

is compensated. In other words, the substrate, e.g. a metal substrate, heated on both sides substantially the same amount (e.g., its surface, i.e., its top and bottom).

According to various embodiments, pulsed irradiation of the layer and pulsed irradiation of the further layer may occur substantially simultaneously.

According to various embodiments, a method of processing a metal surface of a substrate may further comprise depositing at least one metal layer on the substrate.

According to various embodiments, a method of processing a metal surface or a metal layer may include: applying a layer;

Has carbon on the metal surface or the

Metal layer; and generating energy pulses (e.g., particles or photons) to irradiate the layer so that the carbon can be at least partially structurally altered. The layer may, for example, a

be inorganic layer. The layer can according to

various embodiments have a carbon content of more than 30 at%.

The carbon of the layer may be in the form of graphite,

nanocrystalline graphite, amorphous carbon and / or tetrahedral carbon.

According to various embodiments, the generation of energy pulses to irradiate the layer may be such that the layer may be heated to greater than 400 ° C for less than 1 second. For example, the energy pulses may be used to irradiate the layer with a spectral distribution and power are generated such that the energy pulses for irradiating the layer from the layer at least

can be partially absorbed. Furthermore, according to various embodiments, the

Generating energy pulses for irradiating the layer using a light source (e.g., a laser, a lamp, a flashlamp, or a light emitting diode) or more

Light sources take place, wherein the layer by means of

Energy pulses for irradiating the layer can be pulsed exposed.

Furthermore, according to various embodiments, the

Generating energy pulses to irradiate the layer using a continuously operated one

Irradiation source, wherein the means of

continuously irradiated radiation source emitted energy pulses for irradiating the layer (for example by means of mirrors, lenses, deflectors and / or

electrical / magnetic fields) can be conducted onto the layer in such a way that a region of the layer can be irradiated in each case for a short time.

Furthermore, the generation of energy pulses for irradiating the layer can take place with a pulse duration of up to 10 ms in each case. For example, the pulse duration of

Energy pulses for irradiating the layer are shorter than 1 ms, e.g. shorter than 0.1 ms or shorter than 100 ys.

Alternatively, the energy pulses for irradiating the

Layer a duration (pulse duration) in a range of

about 10 ys to about 10 ms, e.g. in a range of about 100 ys to about 1 ms, e.g. in a range from about 200 ys to about 500 ys. According to various embodiments, the

Generating energy pulses for irradiation of the layer carried out such that an average temperature of the Metal layer remains below a (predetermined) maximum value during the entire irradiation, so that the shape of the metal layer (eg the profile of the metal layer) remains substantially unchanged. Illustratively, the

Energy pulses for irradiating the layer in temporal

Distances are generated to each other, so that at the

Irradiate heated substrate, e.g. the metal substrate can cool sufficiently before re-irradiation.

According to various embodiments, generating the energy pulses to irradiate the layer with a

Repetition rate of more than 0.1 Hz, e.g. with more than 1 Hz. For example, generating the energy pulses to irradiate the layer at a repetition rate in one

Range between about 10 Hz and about 0.1 Hz.

According to various embodiments, the metal layer can be processed on both sides. Furthermore, the generation of energy pulses for irradiating the layer can be carried out in such a way that the conductivity of the layer can be increased.

According to various embodiments, the application of the layer by means of chemical vapor deposition or

physical vapor deposition, e.g. by sputtering (so-called sputtering) or by electron beam evaporation.

In various embodiments, a

Processing arrangement for processing a metal surface of a substrate, e.g. a metal substrate. The processing arrangement may comprise: a

Vacuum chamber for providing a vacuum, at least one arranged in the vacuum chamber coating device for applying a carbon-containing layer on the

Substrate, and at least one arranged in the vacuum chamber irradiation device for pulsed irradiation of carbonaceous layer, wherein the

Irradiation device is set up such that by means of the irradiation device, the carbonaceous layer can be heated.

The at least one irradiation device can have at least one light source.

Furthermore, the at least one irradiation device can be set up such that the carbon-containing layer can be heated by more than 400 ° C. in less than 1 s.

Furthermore, the at least one irradiation device can have at least one continuously operated irradiation source.

In one embodiment, the at least one

Irradiation device have at least one pulsed irradiation source.

In yet another embodiment, the at least one

Irradiation device be set up such that the carbon-containing layer can be irradiated pulsed at least partially with a pulse duration of a maximum of 10 ms.

Furthermore, the processing arrangement may further comprise at least one further arranged in the vacuum chamber

Coating device for applying a metal-containing layer to the substrate, e.g. on a metal substrate.

The at least one irradiation device may be such

2 be set up that when irradiated, the proportion of sp and / or sp hybridized carbon in the

carbonaceous layer can be changed.

According to various embodiments, a method of processing a substrate may include: applying a first layer with a first one

Absorption coefficient on an upper side of the substrate and applying a second layer with a second

Absorption coefficients on a lower surface of the substrate; and pulsed irradiation of the first layer and the second layer such that the first layer and / or the second layer

Layer are at least partially structurally altered; wherein the pulsed irradiation is such that a first energy absorbed by the pulsed irradiation from the first layer according to the first absorption coefficient and a second energy generated by the pulsed irradiation from the second layer according to the second

Absorption coefficient is absorbed, are substantially equal, so that a thermal load of the substrate on its top and bottom is substantially balanced. In other words, a thermal

Loading the substrate on its sides, which are coated, are balanced. In the context of this description, the absorption coefficient (also called attenuation constant or linear attenuation coefficient) can be understood as a measure of the

Reducing the intensity of radiation

(Radiation intensity) when passing through a material (e.g., the material of a layer or substrate). The inverse of the absorption coefficient describes the distance covered in the material at which the intensity of the radiation is 1 / e (corresponds to approximately 37%) of its

original intensity, before entering the material, is reduced, where e denotes the Euler number. In other words, the absorption coefficient of the inverse mean penetration depth of the radiation in the

Material. The absorption coefficient may be from radiation (e.g.

Particle radiation and / or photon radiation) depend, with which the irradiation takes place, or which of a Irradiation source is emitted. Illustratively, the

Absorption coefficient will depend on the type of radiation.

In the case of photon radiation (also referred to as electromagnetic radiation, e.g., light), the

Absorption coefficient depend on the wavelength of the photon radiation used, i. from their spectral

Composition. Will photon radiation with several

Wavelengths and / or with a wavelength continuum (i.e., with wavelengths continuously superimposed on each other), the intensity of the photon radiation as the sum (or integral) over all wavelengths of the

Photon radiation are understood. The intensity of the photon radiation may, for example, be defined by the energy which transmits the photon radiation to a certain area (e.g., the area of the radiation area) in a given period of time when it is completely absorbed by the area. The transmitted energy can, for example, lead to an increase in temperature of the surface.

When photonic radiation having multiple wavelengths and / or wavelength continuum (i.e., continuously superimposed wavelengths) is used, the intensity of the photon radiation may be understood according to the sum (or integral) over all wavelengths of the photon radiation.

In the case of particle radiation, the absorption coefficient of the particles used (e.g., electrons or e.g.

Protons) of the particle radiation and their energy depend (also referred to as energy spectrum). The energy which the particle radiation can transmit may depend on the number of particles and their energy which impinge upon the material in a given period of time. In other words, the intensity of the particle radiation can be defined by the energy which the particle radiation has in one certain period to a certain area (eg the

Area of the irradiation area) when fully absorbed by the area. The transmitted energy can, for example, lead to an increase in temperature of the surface.

When photonic radiation of multiple wavelengths and / or wavelength continuum (i.e., continuously superimposed wavelengths) is used, the intensity of photon radiation as the sum (or integral) over all

Wavelengths of photon radiation are understood.

The power of the radiation may be defined by the energy of the radiation emitted in a given period, e.g. during the duration of an energy pulse, or

Radiation pulse. For example, the pulse duration of a radiation pulse and its energy, the performance of the

Defining radiation pulses. In the context of this description, an organic substance, regardless of the respective state of matter, in chemically uniform form, by

characteristic physical and chemical properties characterized compound of the carbon. Besides carbon-free compounds, within the scope of this specification, some carbon-containing compounds, such as carbides (eg, pure carbon, graphite, diamond, or graphene), carbonates, and oxides of carbon, regardless of the particular state of matter, may be present in chemically unitary form by characteristic physical and chemical properties be characterized as inorganic substance. In the context of this description, under an organic-inorganic substance (hybrid substance), irrespective of the respective physical state, in

chemically uniform form present, by

Characteristic physical and chemical properties characterized compound with connecting parts, the Contain carbon, and with connecting parts that are free of carbon, to be understood. In the context of this description, the term "substance" encompasses all substances mentioned above, for example an organic substance, a substance

inorganic substance and / or a hybrid substance. Furthermore, in the context of this description, a mixture of substances can be understood as meaning components of two or more different substances, their constituents

for example, are very finely distributed. A substance class means a substance or a mixture of one or more organic substances, one or more inorganic substances or one or more hybrid substances. The term "material" can be used synonymously with the term "substance".

In the context of this description, a metal (also referred to as a metallic material) may comprise or be formed from at least one metallic element, e.g. Copper (Cu), Silver (Ag), Platinum (Pt), Gold (Au), Magnesium (Mg), Aluminum (AI), Barium (Ba), Indium (In), Calcium (Ca),

Samarium (Sm) or Lithium (Li). Further, a metal may include or be formed of a metallic compound (e.g., an intermetallic compound or an alloy), e.g. a compound of at least two metallic ones

Elements, such as e.g. Bronze or brass, or e.g. a

Compound of at least one metallic element and at least one non-metallic element, e.g. Stole.

In the context of this description, an organic layer can be understood as a layer which is an organic layer

Material comprises or is formed from it. Analogously, an inorganic layer can be understood as a layer which comprises or is formed from an inorganic material. Analogously, a metallic layer can be understood as a layer which is a metal

has or is formed therefrom. Similarly, a metallic substrate (also called

Metal substrate) can be understood as a

Substrate comprising or formed from a metal. The term "substrate" denotes both a

metallic substrate as well as a substrate of another material, e.g. Glass (e.g., window glass), ceramic or plastic, e.g. a polymer or fiber composite coated with metal. For example, the substrate may be a metal-coated plastic film or

Be plastic plate.

Embodiments of the invention are illustrated in the figures and are explained in more detail below. Show it

Figure 1 and Figure 2 each schematically a method for

Processing a substrate, e.g. one

Metal substrate, or a metal layer according to various embodiments;

FIG. 3A and FIG. 3B show a coating according to FIG

various embodiments; Figure 4A and Figure 4B irradiation of the layer or a

Generating energy pulses for irradiating the

Layer according to various embodiments;

5A and 5B show how to process a substrate, e.g.

a metal layer or a metal substrate, according to various embodiments;

Figure 6A shows a processed substrate, e.g. a processed one

Metal substrate or a machined metal layer, according to various embodiments; Figure 6B and Figure 6C shows an arrangement of machined

Substrates, e.g. machined metal substrates or processed metal layers, according to various embodiments in a fuel cell;

Figure 7 is a schematic representation of a spectroscopic

Analysis of differently processed substrates, e.g. differently processed metal substrates or differently processed metal layers;

8A and 8B each show a processing arrangement for

Processing a substrate, e.g. one

Metal substrate, according to various

Embodiments;

Figure 9 is a side view or cross-sectional view of a

A substrate in a method of processing a substrate according to various embodiments; Figure 10 is a side view or cross-sectional view of a

A substrate in a method of processing a substrate according to various embodiments;

Figure IIA and IIB each show a schematic diagram of optical properties of a layer in one

A method of processing a substrate according to various embodiments;

Figure 12 is a schematic diagram of structural

Properties of a layer in a method for

Processing a substrate according to various embodiments; and

Figure 13 is a side view or cross-sectional view of a

Processing arrangement in a method for processing a substrate according to various

Embodiments. In the following detailed description, reference is made to the accompanying drawings, which form a part hereof and in which is by way of illustration specific

Embodiments are shown in which the invention can be practiced. In this regard will

Directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. used with reference to the orientation of the described figure (s). There

Components of embodiments in number

different orientations can be positioned, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various exemplary embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be construed in a limiting sense, and the

Scope of the present invention is defined by the appended claims. In the context of this description, the terms

"connected", "connected" and "coupled" used to describe both a direct and indirect connection, a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

Fig.l illustrates schematically a method 100 for

Processing a substrate, e.g. a metal substrate according to various embodiments. The method 100 may include in 110 applying a layer to the substrate

2

have, wherein the layer sp hybridized carbon and / or sp can have hybridized carbon, eg in the form of graphite, nanocrystalline graphite, amorphous

Carbon and / or tetrahedral carbon.

2

For example, the layer can simultaneously sp

3

hybridized carbon and sp hybridized carbon.

2

Furthermore, the ratio of sp hybridized carbon

3

to sp hybridized carbon according to various

Embodiments when applying the layer are at least partially affected. For example, the

Process parameters, such as ambient pressure,

Composition of the process atmosphere, coating rate

(Speed to be coated),

Substrate temperature or composition of the coated

Materials are regulated or adjusted according to a specification.

Furthermore, the process parameters for applying the layer can be set in such a way that a layer thickness (thickness of the layer) can be deposited according to a specification.

For example, the thickness of the layer can be increased by coating longer or at a higher level

Coating rate is coated.

Furthermore, a method 100 according to various

Embodiments in FIG. 120 include pulsed irradiation of the layer, wherein the pulsed irradiation of the layer may be performed such that the layer may be heated and the layer may be at least partially structurally altered. The structural change of the layer can

for example, a change in the chemical

Have bonding structure of the carbon. For example

2

can by irradiation, the proportion of sp hybridized

3

Carbon (or the proportion of sp hybridized

Carbon). Furthermore, by means of the irradiation of the layer, a gradient of the carbon content can be set. For example, when irradiating a layer that has been applied in multiple layers, a mixing of the constituents of the plurality of layers of the layer can take place, or a homogeneous carbon-metal layer can at least partially segregate upon irradiation, whereby the surface of the layer

Carbon, for example in the form of graphite, can deposit.

FIG. 2 schematically illustrates a method 200 for

Processing a substrate, e.g. a metal layer, according to various embodiments. The method 200 may include, in 210, applying an inorganic layer, the

Having carbon on the substrate. The

Substrate may, for example, a metal layer, a

Metal foil, a metal substrate or a metal layer on a substrate (e.g., on a metallic or ceramic substrate or a glass or plastic substrate), e.g. a metallic buffer layer.

Further, at 220, method 200 may include generating

Having energy pulses for irradiating the inorganic layer, wherein the energy pulses for irradiating the

Layer can be produced such that the carbon can be at least partially structurally changed. The energy pulses for irradiating the layer can

for example (i.e., with a

spectral composition, e.g. monochromatic) that they can be at least partially absorbed by the layer.

Figure 3a illustrates the application 300 of a layer 304, which may include carbon, to a substrate 302, e.g. on a metal substrate 302 or on a metal layer, according to various embodiments. Applying 300 of the

Layer 304 may be formed, for example, by depositing 306b a material using at least one of the materials Coating arrangement 306 take place, whereby the at least one coating arrangement 306 can have one coating source or several coating sources. Further, the deposition 306b of the layer 304 may be done in a vacuum or vacuum with a controlled gas composition or controlled composition of the atmosphere (process atmosphere).

For example, the process atmosphere in which the layer 304 is deposited may include an inert (inert) gas or reducing gas for receiving oxygen (and thus protecting the layer 304 from oxidation), or, for example, hydrogen, nitrogen, molding gas, or hydrazine exhibit. For example, the deposition 306 b of the layer 304 by means of cathode sputtering 306 b,

Electron beam evaporation 306b or more chemical

Gas phase deposition 306b done.

Further, the deposition 306b of the layer 304 may be spatially uniform (e.g., homogeneous) on the surface of the substrate 302. Clearly, the layer 304 can be deposited with a spatially uniform coating rate or with a spatially uniform material composition. Alternatively, the deposition 306b of the layer 304 may be inhomogeneous according to various embodiments

(uneven). For example, only certain areas of the substrate 302 may be coated, or the

Layer 304 may be spatially uneven

chemical composition, e.g. using a mask (also referred to as shadow mask or template).

According to various embodiments, the

Carbon content of the deposited 306b layer 304 can be set according to a specification. For example, the layer 304 may be applied by exposing material from a target (material source) of the coating source, where Target may have a composition according to the specification is transferred to the substrate 302 (transported).

For example, a layer 304 by means of

Sputtering 306b or electron beam evaporation 306b of a target (the material to be sputtered or evaporated) or multiple targets are deposited. In this case, the respective material of the target or one of a plurality of targets corresponding to the predetermined

Carbon content of the layer 304 may be composed.

For example, a target may be a carbon coating source having a carbon content of more than 50 at%, and the deposited layer 304 may also have a carbon content of more than 50 at%. Further, the target may have a carbon content of more than 70 at% (90 at%), wherein the deposited layer 304 may have a carbon content of more than 70 at% (90 at%). Further, upon deposition 306b of layer 304

Components of the process atmosphere are at least partially incorporated into the layer 304. For example, hydrogen from the process atmosphere may be incorporated into layer 304, such that layer 304 may be partially (e.g., in a

Range from about 1 at% to about 20 at%)

Hydrogen can exist. Clearly, a carbon-hydrogen mixture can be deposited using a hydrogen process atmosphere, which is also known as

hydrogenated carbon can be called.

Further, for example, layer 304 (e.g.

Carbon layer) several areas with each

different carbon configuration (bond structure

2 3

of the carbon or composition of sp and sp

hybridized carbon). For example, you can

2

Regions of layer 304 graphite (with a proportion of sp hybridized carbon of more than 90 at%), nanocrystalline graphite (with a grain size of graphite from 1 nm up to 100 nm), so-called amorphous carbon

2

(with a proportion of sp hybridized carbon m in a range of about 70 at% to about 90 at%) or

3

tetrahedral carbon (with a proportion of sp

hybridized carbon of more than 40 at%).

For coating 306b, the substrate 302 can be replaced by a

Coating area (not shown, see Figure 8), in which the deposit 306b of the material by means of a

Coating source, as part of the coating device 306, can be transported through.

For example, the substrate 302 or the metal layer 302 may be provided with constant or variable (e.g., temporally

changeable) speed by means of a

Transport arrangement (e.g., rollers) through the

Coating area are transported through.

Alternatively, the substrate 302 may also be in the

Coating area transported into and after the

Coating 306b are transported out of the coating area again.

FIG. 3 b schematically illustrates an application of a

Layer on a substrate 302, e.g. a metal substrate 302 or a metal layer 304b, according to various

Embodiments wherein the layer 304 is provided, for example, in two layers (as shown in Figure 3b) or in more than two layers (e.g., three layers or four layers, etc.) by means of a coating device 306 (e.g.

Coating source or multiple coating sources) can be applied. For example, a first

Layer 304b (first layer) and thereon a second layer 304a (second layer) are deposited. The composition of the respective layers of the layer 304 can be determined by means of

Process parameters, e.g. by means of the composition of the

Material of the coating source or each of the plurality of coating sources can be adjusted according to a specification. For example, the first layer 304b may comprise a metal (eg, chromium or titanium) or a metal alloy. The first layer 304b may be formed by means of a coating arrangement 306, the coating arrangement 306 being a metal coating.

Coating source (which may be more than 50 at% of metal), deposited 306b, and a metal layer (which may be more than 50 at% of metal). Illustratively, the first layer 304b may include a metal buffer layer to increase the adhesion of the

Layer 304, as previously described. Further, the first layer 304b may include carbon, or at least a gradient of the carbon content, such that upon deposition 306b of the layer 304, the carbon content increases (or decreases) with increasing layer thickness.

The second layer 304a may be provided, for example, by means of a coating arrangement 306 (may also be referred to as

Coating device are called), wherein the

Coating arrangement 306 a carbon

Coating source (which may consist of more than 50 at% of carbon) can be deposited and a carbon layer (containing more than 50 at% of

Carbon may be) and also have a gradient of the carbon content, as in Fig.3a

has been described.

The deposition of the first layer 304b and the second

For example, layer 304b may be sequentially formed by a plurality of coating sources of different composition (e.g., at least one metal coating source and

at least one carbon coating source). Furthermore, the coating area (the area on the substrate 302 on which the material of the layer 304, or for film formation is deposited) of at least two of the plurality of coating sources may overlap, so that between the at least two of the plurality of coating sources is a thorough mixing of the deposited materials.

For example, by means of the at least two of the plurality of coating sources, a gradient of a composition of the layer 304 (e.g., a gradient of the carbon content) between the at least two of the plurality

Coating sources are generated. Vividly

for example, a carbon-metal mixture in one

Area between the first and the second

Coating source (in the overlap area) are deposited.

4A illustrates irradiation 400 of layer 304 or generating 400 energy pulses to irradiate layer 304 according to various embodiments. The

Irradiating 400 of layer 304 or generating 400 energy pulses 308b for irradiating layer 304 may be effected by means of at least one irradiation arrangement 308 (also referred to as irradiation device), wherein the at least one irradiation arrangement 308 comprises at least one irradiation source, for example a light source (eg a laser, a lamp , a flash lamp or an X-ray source) or a source of matter (eg, an electron source or a proton source). In this case, the at least one irradiation arrangement 308 can be a pulsed or a

by means of the at least one irradiation arrangement 308, a pulsed or a continuous radiation 308b are generated, for example a continuous electron beam 308b by means of an electron accelerator (eg by means of a linear source) or a pulsed flash of light 308b by means of a flash lamp (eg a gas discharge lamp or a Led) .

The irradiation 308b of the layer 304 may be analogous to

Applying the layer 304 in a process atmosphere (eg an inert process atmosphere or a reducing one

Process atmosphere), as described above with reference to FIG. 3a. For irradiation, the substrate 302 may be replaced by a

Irradiation region in which the irradiation 308b of the material can be carried out by means of an irradiation source can be transported through. For example, the substrate 302 or the metal layer 302 may be driven by a transport assembly (e.g., rollers) at a constant or variable (e.g., time varying) speed

Irradiation be transported through. Alternatively, the substrate 302 may also be transported into the irradiation area and transported out of the irradiation area after the irradiation 308b.

Further, the generated radiation 308b or generated energy pulses 308b (radiation 308b) may be directed, deflected, or deflected by optical equipment (e.g., mirrors, reflectors, deflectors, apertures, or lenses)

be focused. The layer 304 may be uniformly (homogeneously) irradiated (e.g., at a uniform power density) or non-uniformly irradiated, e.g. For example, selected portions of layer 304 may be irradiated, e.g. using a mask.

When irradiated 308b, a first portion of the of the

Irradiation device 308 (with, for example, at least one

Irradiation source) and onto the layer 304

guided radiation 308b are absorbed by the layer 304 and converted into heat energy. With a larger layer thickness, the first part of the (from the layer 304

absorbed) radiation 308b be greater. Further, a second portion of the radiation 308b, which is not absorbed by the layer 304, may penetrate the layer 304 and strike the surface of the substrate 302, eg, a metal substrate 302, the second portion of the radiation 308b of which Substrate 302 partially absorbed or partially

can be reflected. The partially reflected second portion of the radiation 308b may be returned to the layer 304, and also partially from the layer 304

be absorbed.

The average penetration depth of the radiation 308b into the layer 304 (e.g., the depth of penetration in which more than half of the radiation 308b has been absorbed, e.g., about 63%) may be affected by the nature of the radiation 308b.

For example, an electron beam 308b having a

Energy of the electrons in a range of about 10 keV to about 50 keV have an average penetration depth in a range of about 1 ym to about 10 ym, wherein the penetration depth of the electron beam 308 b can be smaller, the smaller the energy of the electrons.

For example, an electron beam 308b having a

Electron energy of less than 10 keV have a penetration of less than 1 ym. By comparison, the depth of penetration of (the photons emitted by a light source) may additionally be material dependent and (e.g., non-linear) frequency dependent and have a penetration depth in a range of about 50 nm to about 10 ym, or more than 10 ym. For example, photons with a

Wavelength of about 500 nm, a penetration depth in graphite depending on the layer thickness in a range of about 50 nm to about 500 nm.

According to various embodiments, the

Properties (e.g., wavelength or kinetic

Energy) of the radiation 308b to the chemical composition and properties (e.g., the layer thickness or thickness)

Absorption characteristics) of the layer 304 may be adjusted such that the layer 304 may be heated by irradiation and the layer 304 may be at least partially structurally altered. For example, the radiation 308b may be monochromatic or the spectral Distribution according to a specification (eg, within a certain frequency range, or wavelength range) can be set by means of a suitable irradiation source. Furthermore, the radiation 308b may be replaced by a

absorbing material, wherein a portion of the radiation emitted by the radiation source 308b (e.g., a portion of the frequency range) of the

absorbing material at least partially absorbed

(filtered out) before layer 304

is irradiated.

In this case, the spectral distribution (also called spectral

Composition) of radiation 308b (e.g., photons) e.g. are adjusted such that the radiation 308b is primarily from the second layer 304a (e.g.

Carbon layer), and for the most part (e.g., more than 50%) of the substrate 302, e.g. one

Metal substrate 302, or the first layer 304b (e.g.

Metal buffer layer) can be reflected. Further, the generated radiation 308b may have a wavelength in a range of about 10 nm to about 10 mm, e.g. in a range of about 100 nm to about 1 mm.

The time within which the layer 304 may be heated (e.g., to a predetermined temperature) is

Power of the emitted radiation 308b to irradiate the layer 304 and the penetration depth of the radiation 308b in the layer 304 dependent. If the penetration depth is approximately on the order of the layer thickness, the layer 304

for example by means of pulsed irradiation within the pulse duration of pulsed irradiation at or above 400 ° C, e.g. over 1000 ° C with respect to the substrate 302, e.g. one

Metal substrate 302, are heated. For example, the layer 304 may have reached a maximum temperature at the end of a radiation pulse or at the end of an exposure time, wherein the duration of the radiation pulse may be adjusted to the temperature to be achieved. The radiant energy absorbed by the layer 304 may be dissipated as heat energy to the substrate 302, eg, a metal substrate 302, the rate at which the heat can be delivered to the substrate 302 from the

Thermal conductivity of the layer 304 and of the

Thermal conductivity of the substrate 302 can be determined. With a sufficient power of the

Irradiation source emitted radiation 308b may be the

Layer 304 are supplied faster heat energy than this heat energy can be delivered to the substrate 302.

Thereby, a temperature difference between the layer 304 and the substrate 302 in a range of about 50 ° C to about 2000 ° C, e.g. in a range of about 400 ° C to about 1000 ° C.

Depending on the power of the radiation 308b emitted by the irradiation source and the irradiation duration (for example pulse duration), the heat energy introduced into the layer 304 per irradiation pulse or per irradiation can be regulated or set. Furthermore, after irradiation, the

Heat energy from the layer 304 into the substrate 302

be derived, wherein the layer 304 to cool and thereby heat the substrate 302, to a

Temperature equilibrium is reached (e.g., the temperature of layer 304 and substrate 302 is equalized).

In this case, the volume of the substrate 302 in which the heat energy is distributed can be significantly greater than the volume of the layer 304, e.g. For example, the volume of the substrate 302 may be more than 10 times, more than 100 times, or more than 1000 times the volume of the layer 304. Therefore, the thermal energy distributed in the volume of the substrate 302 may result in little heating of the substrate 302 during degradation of the substrate

Temperature difference (eg when adjusting the temperature) between substrate 302 and layer 304 lead. For example, balancing the temperature difference to a Heating of the substrate 302 of less than 200 ° C, for example, less than 100 ° C, for example, less than 50 ° C.

Illustratively, by irradiating the layer 304, the layer 304 can be briefly strongly heated, wherein the average temperature of the substrate 302 under a

Maximum value, e.g. below 100 ° C, or e.g. below 200 ° C, or e.g. can remain below 400 ° C. Furthermore, the time intervals of the irradiation, e.g. the time intervals between the irradiation pulses 308b or energy pulses 308b, be set up such that the substrate 302 registered during the irradiation

Furthermore, thermal energy may be released to the environment (e.g., to the surrounding process atmosphere or to the transport assembly). Thus, a renewed or repeated irradiation can take place, wherein an average temperature of the substrate 302 can remain below a maximum value. For example, if the average temperature of the substrate 302 remains below a maximum value, it may be avoided that the substrate 302 is deformed due to heating (e.g., beyond a maximum value). For example, according to various embodiments, an embossed or corrugated substrate 302, such as a corrugated sheet 302 or

Profile sheet 302 to be processed, which may have a limited dimensional stability when heated.

Further, the composition of the layer 304 may be one

Affect the structural change of layer 304 upon irradiation, e.g. on the speed with

2 3

which the proportion of sp and / or sp hybridized

Carbon in layer 304 is changed (conversion rate). For example, incorporating hydrogen (or other constituents of the respective process atmosphere) from the process atmosphere at deposition 306b into layer 304 may increase or decrease the conversion rate Proportion of a metal in the layer 304 (eg by means of

Depositing a carbon-metal mixture) the

Affect conversion rate. 4B illustrates irradiation 400 of layer 304 or generating energy pulses 308b to irradiate layer 304 according to various embodiments, wherein a portion of layer 304 may be irradiated. The irradiation of a portion of the layer 304 may, for example, by

Be an advantage to prevent heating of the substrate 302, e.g. a metal substrate 302 to be able to avoid exceeding a maximum value by the registered thermal energy at a constant power density (power per irradiated area) can be limited.

Furthermore, for example, the irradiation angle (the angle at which the radiation 308b generated by the at least one irradiation arrangement 308 strikes the substrate 302) can be set or adjusted. For example, the amount of radiation 308b absorbed in the layer 304 may be increased by tilting or impinging the radiation 308b onto the layer 304, wherein the path that the radiation can travel within the layer 304 may be increased by setting the irradiation angle.

According to various embodiments, that of the

Irradiation source generated radiation 308b several areas of the layer 304 successively irradiate, e.g. For example, the continuous or pulsed radiation 308b may be over the

Surface of layer 304, or the radiation 308b generated by a plurality of radiation sources may simultaneously irradiate multiple areas of layer 304.

Furthermore, by irradiating the layer 304, the structure of the layer 304 and thus the absorption properties of the layer 304 can be changed. For example, by irradiating the layer 304, the mean penetration depth of the Increase or decrease radiation 308b so that the temperature of layer 304 reached upon irradiation may decrease (or increase) due to the structural change of layer 304.

Fig. 5A illustrates the processing 500 of a substrate 302, e.g. a metal layer 302 (e.g., the metal layer of a metal-coated substrate 302) or a metal layer 302

Metal substrate 302, according to various embodiments, wherein the substrate 302 may be transported through a coating area, e.g. along a

Direction 501, leaving a layer 304 continuous

can be deposited. Further, after the coating 306b, the substrate 302 may be transported through a coating area 306 (eg with one or more coating sources) in a coating area through an irradiation area in which the layer may be irradiated by means of an irradiation device 308 (eg with one or more irradiation sources) , eg along a direction 501.

In the description, the surface of the substrate 302, e.g. the metal layer 302 or the metal substrate 302 which is coated and irradiated according to various embodiments are to be understood as the surface of a metal, i. as a metal surface.

For example, the substrate 302 may be a tape substrate 302 or a film 302 which may be replaced by a tape substrate 302

Processing arrangement for processing (coating and

Irradiation) of the substrate 302, e.g. through a vacuum chamber or vacuum chamber assembly, e.g. from roll to roll. Further, multiple substrates 302, e.g. Metal substrates 302 are successively transported through a processing arrangement, e.g. in the form of plates, e.g. carried by a carrier

(Substrate carrier). The substrate 302, eg, a metal substrate 302, may

for example, have a width (perpendicular to the direction of transport) in a range of about 0.01 m to about 7 m, e.g. in a range of about 0.1 m to about 5 m, e.g. in a range of about 1 m to about 4 m and further a length (parallel to

Transport direction) of more than 0.01 m, for example more than 0.1 m, for example more than 1 m or eg more than 10 m. Further, the substrate 302 may have an area (to be coated) in a range of about 10 cm ² to about 100 m ² or more than 100 m ² .

Further, the coating source (s) may be tubular sputtering cathodes having a width in a range of about 1 m to about 5 m. Furthermore, the radiation source can be a

Gas discharge tube with a diameter in one

Range of about 2 cm to about 50 cm and a length in a range of about 1 m to about 5 m.

As illustrated in Figure 5A, for example, one layer 304 on the substrate 302, e.g. one

Metal substrate 302, are deposited continuously.

Alternatively, the substrate 302 may be only partially coated during transport through the coating area. For example, the coating can be interrupted by means of a diaphragm or partially exposed.

Further, prior to application of layer 304, the native oxide layer of substrate 302, eg, a metal substrate 302, may be removed, eg, by polishing, plasma etching, chemical etching, or chemical reduction (eg, by means of a suitable gas). By removing the oxide layer, an electrical contact resistance between the coated layer 304 and the substrate 302 can be reduced.

5B illustrates the processing 500 of a substrate 302 (e.g., a metal layer 302 or a metal substrate 302) according to various embodiments, wherein the layer 304 may be multilayer deposited by a plurality of coating sources 316a, 316b. For example, the layer 304 may be two-layered by means of two coating sources 316a, 316b or by means of three coating sources (not shown).

three layers (or by four coating sources (not shown) four-ply, etc.) are deposited.

By way of example, by means of a first coating source 316a, a metal layer 304b (which can consist for example of more than 50 at% of chromium or titanium) and by means of a second coating source 316b a carbon layer 304a (which may for example consist of more than 50 at% of carbon ) are deposited. Further, after deposition of carbon, the two-layer carbon-metal layer 304a, 304b may be irradiated, so that in the

Carbon layer, for example graphite or

Nanocrystalline graphite can be formed. Alternatively or additionally, by means of the metal layer 304b, a metallic coating of an uncoated substrate 302, e.g. a glass substrate, plastic substrate or ceramic substrate. In other words, a metal-coated substrate may or may not be formed by means of the first coating source 316a.

Further, as described above, the first coating source 316a and the second coating source 316b may have an overlapping coating area such that at the common contact area between the

Metal layer 304b and carbon layer 304a

Metal-carbon gradient can arise. Further, the plural coating sources and the

Irradiation device 308 (with at least one

Irradiation source) may be arranged such that after the deposition and irradiation of a first layer, a second layer can be deposited, which can optionally be irradiated by means of a further irradiation source. This can be beneficial when using layers

different chemical composition require different irradiation parameters (e.g., wavelength of the pulse duration of the irradiation), or the irradiation of different layers (also referred to as layers) must be done separately.

Fig. 6A illustrates a processed substrate 600, e.g. a machined metal substrate 600 or a machined metal layer 600, according to various embodiments, wherein the substrate 302 can be machined on both sides. Further, as previously described, the substrate 302 may be an embossed or corrugated substrate 302 which may have a curved, corrugated, and / or angled profile. According to various embodiments, the substrate 302 may include, for example, an embossment depth or

Profile depth along the direction 603 and have an embossing width or profile width along the direction 601.

For example, a substrate 600 processed according to various embodiments (e.g., both sides) may be advantageously used when used as a bipolar plate (e.g.

Fuel cell). Bipolar plates, provide in one

Fuel cell with good electrical conductivity and adequate corrosion protection for a targeted distribution of fuel 602 and / or oxygen 604, as well as a targeted removal of reaction products, such. Water, as schematically illustrated in Fig. 6B.

FIG. 6B illustrates an assembly 650 of processed substrates 600 or processed metal layers 600 according to FIG various embodiments in a fuel cell and illustrates the schematic structure of an insulated

Fuel cell (wherein a stacking unit 650 is shown by several stackable units of a fuel cell that can be coupled together). The fuel 602 (e.g., hydrogen) may be passed through a gas diffusion layer 608 (gas diffusion layer, GDL), e.g. by graphitic electrically conductive

Paper, on the oxidation side, passed through to the anode 612, whereas the oxygen 604 by means of another GDL 608 finely divided can reach the cathode 616.

Conventional bipolar plates in low-temperature fuel cells, such as polymer electrolyte membrane fuel cells (PEM) or proton exchange membrane fuel cells (proton exchange membrane) can account for about 40% of the total manufacturing cost of a stacking unit (stack cost) and about 80% determine the total weight. For example, conventional bipolar plates may be graphite, brittle and have a thickness in one

Range of about 4 mm to about 6 mm, which may be relatively thick compared to a stacking unit. Alternatively to bipolar plates made of graphite

However, bipolar plates of substrates such as metal substrates 302 (e.g., austenitic stainless steel substrates 302 only a few hundred ym thick) are of reduced thickness, however, e.g. be passivated by means of a protective layer in order to be used in fuel cells can. Major advantages of metal substrates for use as

Bipolar plates in fuel cells can be seen in that metal substrates can intrinsically have no (or a negligible) gas permeability, can have a high electrical and thermal conductivity and can be processed (produced) very economically. A major disadvantage of conventional metal substrates for use as bipolar plates in fuel cells, however, can be seen inter alia in that in

corrosive environments (such as in fuel cells)

Thickness of the native oxide layer of the stainless steel (in the operation of fuel cells) may increase, which may lead to an undesirable power dip (of the fuel cell).

Clearly, a thicker native oxide layer can

Increase internal resistance of a stacking unit and thus the

Reduce power that can give off a fuel cell, since the internal resistance of several stacking units of a fuel cell can add up.

According to various embodiments, according to a

In accordance with effective pre-treatment to ablate this native oxide layer (e.g., by chemical etching or by plasma etching), a functional coating greatly minimizes the corrosive action of the metal substrates.

Graphitic amorphous carbon may be in the range

(within the operating parameters, e.g., within the

Operating temperature) of low temperature fuel cells 650 provide excellent corrosion protection, e.g. already at layer thicknesses greater than 20 nm.

As the thickness of such a coating 304 (e.g., a carbon layer) increases, pronounced delamination effects (peeling effects) may occur. A weak adhesion of the layer to the stainless steel substrate can be caused mainly due to a high internal stress and thereby be regarded as the main cause of separation effects.

Remedy can be provided, according to various embodiments, by means of thin metallic buffer layers 304a, such as titanium or chromium buffer layers, or thin Ti: C (carbon-titanium mixture) or Cr: C (carbon-chromium mixture) buffer layers or gradient buffer layers (US Pat. the May have gradients in the proportion of carbon).

By means of the buffer layers, for example, the internal stress / strain of the carbon (the carbon layer 304b) to the substrate 302, e.g. a metal substrate 302, toward continuously degraded and so the adhesion of the layer can be increased.

One challenge can be seen in the fact that in addition to a high level of corrosion protection of the electrical

Resistance of the functionally coated stainless steel (without oxide layer) may increase only slightly. According to

According to various embodiments, by irradiating the interface resistance of the carbon coating (the layer 304) of the stainless steel can be reduced. typical

Interfacial resistances or contact resistances (also referred to in the literature as ICR, Interfacial Contact Resistance) according to various embodiments

applied functional layer system can be in a range from about 10 mu cm ² to about 20 mu cm ² at a compressive force of 150 N / cm ² (GDL-adjusted). With the same compressive force, values between 0.5 cm ² and 10 cm ² can be achieved. Alternatively, the

For example, the interfacial resistance of the processed substrate 302 may be less than about 100 mu-cm, eg, less than 50 mu-cm ² . The interfacial resistance may be, for example, a resistance that occurs during

Contacting (the surface) of the substrate between the contacts and the substrate may result. Further, the resistivity of the layer 304 may be less than 100μmm ² / cm, eg less than 20μm ² / cm.

Such ICR values can be obtained, for example, using substrates made of stainless steel SUS316L or according to DIN 1.4404 with a thickness (substrate thickness) of 100 μm. If stainless steel (ie a stainless steel material) with a different chemical composition and / or substrate thickness is used, slightly different values may occur. The measurement of the contact resistance (ICR) can be done on embossed substrates 600 (eg embossed panels) or alternatively on unembossed substrates 600. The measurement of the contact resistance can be done in combination with a

Graphite foil and / or a GDL 608 and by means of a combination measurement, as described below, be GDL-cleaned. The term "GDL-cleaned" can be understood as meaning that the contact resistance of the processed substrate 600 is cleaned up from the influence of the gas diffusion layer 608. That that a GDL-adjusted

Transition resistance independent of the influence of

used gas diffusion layer 608 is indicated. Thus, contact resistances of different systems and measurements can be compared.

Analogously, the contact resistance can be adjusted by the influence of the measuring method. For example, the machined substrate 600, or the gas diffusion layer 608, can be contacted on both sides by means of a graphite foil for measuring the contact resistance. For this purpose, in a first step, two graphite foils (with or without gas diffusion layer 608) can be brought into contact with one another and their contact resistance determined, which is referred to as first contact resistance in the context of the combination measurement.

In a second step, the measurement of the

Transition resistance on the whole system, i. to the

processed substrate 600 with or without

Gas diffusion layer 608, which on both sides with

Graphite films is contacted, what in the context of

Combination measurement as second contact resistance

is designated. In a third step, the first contact resistance is subtracted from the second contact resistance, which is a third in the context of the combination measurement

Transition resistance indicates the contact resistance of the processed substrate 600 itself, i. GDL-adjusted describes.

Traditionally, economically viable manufacturing can motivate a technological concept that first coats and then (coated)

Stainless steel substrates 302 shapes. The main disadvantage can be seen in the fact that due to the

Imprinting process smallest micro cracks (in the coating) can be generated, which can produce corrosion channels. In contrast, according to various embodiments, this disadvantage can be avoided by coating molded bipolar plates. For this purpose, substrates, e.g. Stainless Steel Substrates 302, to

Use can be mechanically stamped in fuel cells before the coating process, whereby the typical gas channels of the bipolar plates can arise, as in Fig.6B

is illustrated. Coating processes based thereon, for example, establish a sheet-to-sheet system design.

For the deposition of thin metal layers 304b and

Carbon layers 304a on substrates such as e.g.

Metal substrates 302 for use in fuel cells may vary according to various embodiments

Methodologies (manufacturing process) can be used.

Promising properties can be applied, for example, by means of CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition) methods. Common PVD processes are e.g. sputtering or that

Electron beam evaporation. According to various embodiments, both the

Deposition temperature as well as a thermal aftertreatment affect the chemical bond structure amorphous

Have carbon layers 304a. Accordingly, for example, the electrical, optical and mechanical properties of carbon can be selectively changed by means of thermal energy.

At higher annealing temperatures, carbon layers 304a may become increasingly graphitic

Properties (e.g., NC graphite, nano-crystalline graphites). In other words, the size of NC graphite clusters (grain size of nanocrystalline graphite) and thus

2

the proportion of sp hybridized carbon and the correlated intensity ratio I Q / I G (D: Disordered Peak, G: Graphite Peak) of a spectrum obtained by Raman spectroscopy as a function of the annealing temperature increase, as illustrated in FIG. Such carbon layers 304a, applied on

Bipolar plates 600, can have a low electrical

Having resistance which in turn has a higher

Power conversion in fuel cells can lead. According to various embodiments, coating processes may be at higher temperatures or active substrate heating, respectively

expire. However, in the case of pre-embossed bipolar plates 600, the maximum temperature input (e.g., the maximum temperature to which a pre-stamped bipolar plate 600 may be heated) may be severely limited.

When exceeding the mean temperature of a

pre-stamped bipolar plate 600 beyond a threshold or maximum value (which threshold may be, for example, dependent on the thickness of bipolar plate 600) may result in unwanted deformation of bipolar plate 600, thereby increasing the use of heat input to improve the electrical properties (of carbon layers 304a ) can not be used all-inclusive, or may be limited.

According to various embodiments, functional surface layers and near-surface amorphous

Carbon layers 304a having at least one underlying effective metallic buffer layer 304b on austenitic stainless steel 302 (by means of

Irradiating) are selectively heated, whereby a

Modification of the chemical bonding of the carbon can be achieved so that in particular embossed substrates 302, such as e.g. embossed metal substrates 302, their original

can maintain three-dimensional shape. Further, according to various embodiments, by means of a so-called rapid thermal process (RTP), an ultra-short energy pulse in the form of light quanta (photons) can non-destructively strike the surface of the coated substrate 600, whereby a stamped thin substrate, e.g. Stainless steel substrate, a (thermally induced) any relaxation can not follow because in the volume necessary for the deformation

Heat energy can not exceed a sufficient threshold.

If, for example, the energy pulse is generated by means of flash lamps, then the deposited energy can concentrate at a pulse duration of about 1 ms at the surface down to a depth of a few micrometers, in which the resulting dynamics for modifying the chemical bond is needed. The energy initially located at the surface can then flow towards the substrate 302 and decrease in time and place

Distribute energy density throughout the volume in less than a second. Due to the relatively high heat capacity of the substrate 302, the energy pulse can only lead to a minimal increase in the temperature of the entire substrate 302. Depending on various parameters, such as amount of energy, pulse duration and pulse shape (temporal energy profile or temporal

Power profile) of the flash of light can be the structural

Change can be influenced in a targeted way. Alternatively, pulsed lasers can be used which can allow a significantly shorter exposure time than 1 ms,

However, this can be associated with higher process costs.

For example, irradiation of a substrate 302 (also referred to as RTP treatment) may be carried out in a vacuum at a pressure of about 9-10 ^-6 mbar. Although the contact resistance of the substrate 302 may remain substantially unchanged in this case, by irradiating a substrate 302, the corrosion protection by the layer may be substantially improved. The corrosion protection can be determined by means of a corrosion test in which the substrate 302 is exposed to a strongly corrosive environment. For example, the substrate 302 may be at 80 ° C for about 100 hours

Ambient temperature in a bath with or from sulfuric acid (H ₂ SO ₄ ) introduced, for example, immersed, be or become. For example, the bath may have a pH of about 4.

In order to determine the effect of the corrosion test, the first contact resistance before the corrosion test and a second contact resistance after the corrosion test can be measured. Based on the difference of the first

Transition resistance to the second contact resistance may be closed to changes in the treated substrate 302. For example, a deterioration of the

Transition resistance through the corrosion test (i.e., that the second contact resistance is greater than the first

Transition resistance) may be an indication that the The contact resistance of a component with the treated layer 304, for example a fuel cell, will deteriorate in the course of operation, which may impair its efficiency. The more the contact resistance through the

Corrosion test is deteriorated, the smaller the corrosion resistance of the layer 304 may be.

If, for example, the irradiation of the layer 304 is dispensed with, the contact resistance of a

coated unirradiated substrate (i.e., before it was irradiated) by the corrosion test, e.g. in a range of a few percent to a few factors, i. increase or even double, triple or quadruple by a few percent.

By the method 100, 200, 1000 according to various

Embodiments for treating the substrate 302 may be achieved such that the contact resistance of the substrate 302 before the irradiation is substantially equal to the contact resistance of the substrate 302 after the irradiation. In contrast to unirradiated substrates, the

Contact resistance of the irradiated substrate 302 can be reduced by a corrosion test. In other words, according to various embodiments, a functionally coated substrate 302 may be provided, or its junction resistance in one

corrosive environment decreases. This can be the

Contact resistance of a component with the layer treated according to various embodiments, e.g. one

Fuel cell, on the one hand and on the other in the course of operation improve, which can increase its efficiency.

Fig. 6C illustrates an arrangement of processed

Substrates 600, e.g. Metal substrates 600 or machined

Metal layers 600, according to various embodiments in a fuel cell 650. In this case, in the Fuel cell was charge separation 618 by the

Electrolyte membrane 614 (Membrane Electron Unit: MEA), anode 612 (or cathode 616), and GDL 608 are tapped or contacted by bipolar plates 600, which are processed in accordance with various embodiments, such that a fuel cell stack unit has low internal resistance and can have a high power yield. Fig. 7 illustrates a schematic representation of a spectroscopic analysis 700 of differently processed substrates, e.g. differently processed metal substrates or differently processed metal layers, according to various embodiments. It can by means of

2

Irradiating the proportion of sp hybridized carbon and / or sp hybridized carbon can be influenced in the layer. Furthermore, the composition (proportion

2 3

sp hybridized carbon and / or sp

hybridized carbon) of the layer (by spectroscopy, for example, Raman spectroscopy) and correlated with the composition of the layer position of the peaks 710 in lG ^_

Spectrum and the intensity ratio IQ / IG 720. In Figure 7 the position of the peaks lG ^_ by way of example 710 and the intensity ratio IQ / IG 720 i ⁿ dependence of the

2 3

Proportion of sp hybridized carbon and sp

hybridized carbon shown. It can by means of

2

Irradiating the layer, the proportion of sp hybridized carbon in the layer step by step 712, 714, 716 are increased, which IQ / IG 720 may lead to a change in the position of the LG ^_ Peaks 710 and the intensity ratio.

For example, one, e.g. combined with

corresponding process parameters deposited layer, which has predominantly tetrahedrally modified carbon 702, 712 structurally changed by irradiation be, so that the layer, for example, amorphous

May have carbon 704. Further, the layer may be structurally altered 714 such that the layer may include nanocrystalline carbon 706 or, ultimately, graphite 708.

Fig. 8A schematically illustrates a processing arrangement 800 for processing a substrate 812, e.g. one

Metal substrate 812, according to various embodiments. As described above, a processing assembly 800 for processing a substrate 812 may include a vacuum chamber 802 for providing a vacuum by means of a vacuum pump assembly coupled to the vacuum chamber 802. Further, the vacuum chamber 802 may include an access area 802z and / or an exit area 802a, with the substrate 812 passing through the access area 802z and / or

Exit region 802 a through into the vacuum chamber 802 and / or can be transported out of the vacuum chamber 802 out, for example, along a direction 801. Further, the substrate 812 in a coating area 803 of

Vacuum chamber 802 and / or in an irradiation area 805 of the vacuum chamber 802 into or out of the coating area 803 and / or out of the irradiation area 805 out

be transported. Furthermore, the substrate 812 may pass through the coating area 803 and / or through the

Irradiation region 805 are transported through, for example, along a Substrattransportrichtung 801. Further, a processing arrangement 800 a in the

Vacuum chamber 802 arranged coating device 804 for applying a carbon-containing layer on a substrate 812 in the coating area 803. Further, a processing assembly 800 may have a disposed in the vacuum chamber 802 irradiation device 806 for pulsed irradiation of the carbonaceous layer in the irradiation area 805, wherein the irradiation device 806 may be configured such that by means of

Irradiation device 806, the carbonaceous layer 304 can be heated. The coating apparatus 804 may, as described above, one or more coating sources

Have coating sources, e.g. can the

Coating device 804 comprises one of: a sputtering source (e.g., a magnetron), a

A laser beam evaporator, an electron beam evaporator, a thermal evaporator (e.g., an induction evaporator or a resistance evaporator), a

Ion beam evaporator or an arc evaporator. The irradiation device 806 may, as described above, comprise one or more irradiation sources, e.g. For example, the irradiation device 806 may include one of: an electron beam source, a gas discharge lamp, an X-ray source, a laser (e.g., a continuously operated laser or a pulsed-powered laser), a light emitting diode, a light emitting diode

Proton beam source or a flashlight bulb.

According to various embodiments, a

Processing arrangement 800 for processing a substrate 812 have a plurality of vacuum chambers 802, wherein the

Coating area 803 and the irradiation area 805 may be provided in different vacuum chambers of the plurality of vacuum chambers 802. Fig. 8B illustrates a side view or

Cross-sectional view of a processing assembly 800 for

Processing a substrate 812 according to various

Embodiments in a method of processing the substrate 812.

The processing arrangement 800b illustrated in FIG. 8B largely corresponds to that illustrated in FIG. 8A Processing assembly 800, wherein the substrate 812 is processed on both sides. The substrate 812 may be a metal substrate and / or a metal-coated substrate, eg, a metal-coated plastic substrate or a metal-coated glass substrate, which may be attached to

having machined metal surface.

The processing assembly 800b illustrated in Fig. 8B may be configured to process the substrate, e.g. in a vacuum. For this purpose, the processing arrangement 800b can have a

Have vacuum chamber 802. The vacuum chamber 802 may be configured to provide a vacuum.

For this purpose, the vacuum chamber 802 may be coupled to a pump system (not shown), so that within the

Vacuum chamber 802 a vacuum (i.e., a pressure less than

0.3 bar) and / or a vacuum (i.e., a pressure less than 1 bar) may or may not be provided. Further, the vacuum chamber 802 may be configured such that the

Environmental conditions (the process conditions) within the

Vacuum chamber 802 (e.g., pressure, temperature, gas composition, etc.) can be adjusted or regulated during the treatment. The vacuum chamber 802 can do this, for example

be airtight, dustproof and / or vacuum-tight set up or be. For example, the gas may be supplied to the vacuum chamber 802 via a gas supply to form a process atmosphere in the vacuum chamber 802.

The processing assembly 800b may further include two in the

Vacuum chamber 802 arranged coating devices 804 (also as a first coating device and second

Coating apparatus) for applying carbonaceous layers 304 to the substrate 812. The processing assembly 800b may further comprise two in the

Vacuum chamber 802 arranged irradiation devices 806 for pulsed irradiation of the carbonaceous layers exhibit. The irradiation devices 806 may be configured such that by pulsed irradiation the bicarbonate-containing layers 304 may be heated. For this, the irradiation devices 806 can generate and emit radiation with sufficient energy.

The processing arrangement 800b may further comprise a

Transport device 822 have to transport the substrate. For example, the transport device 822 may include a plurality of transport rollers 822r on which the substrate 812 may be transported.

The transport device 822 may be arranged and arranged such that it can transport the substrate 812 along a transport plane in a direction 801. The substrate 812 may be transported through the coating area 803 and through the irradiation area 805. The transport device 822 may be arranged and arranged to transport the substrate 812 between the two coating devices 804. In other words, the transport plane extends between the two coating devices 804.

The transport device 822 may be arranged and arranged to transport the substrate 812 between the two irradiation devices 806. In other words, the transport plane extends between the two irradiation devices 806.

9 illustrates a side view or

A cross-sectional view of a substrate 302 in a method of processing 900 a substrate 302 according to various embodiments. According to various embodiments, a first layer 304 having a first absorption coefficient may be formed on or over an upper surface 302a of the substrate 302, and a second layer 904 may be formed with a second one

Absorption coefficients are formed on or over a bottom 302 b of the substrate. The application of the first layer 304 and the second layer 904 may occur substantially simultaneously or at a time interval from one another.

The application 306b of the first layer 304 may include a first coating arrangement 306 (may also be the first

Coating device can be designated) and the application 906b of the second layer 904 can be carried out with a second coating arrangement 906 (can also be referred to as the second coating device).

Furthermore, the first layer 304 and the second

Layer 904 pulsed irradiated 308b, 908b. The

Irradiation 308b of the first layer 304 may be carried out with a first irradiation arrangement 308 and the irradiation 908b of the second layer 904 may be performed with a second irradiation arrangement 308b

Irradiation arrangement 908 take place. The irradiation 308b of the first layer 304 may be performed such that the first layer 304 is at least partially structurally altered. Alternatively or additionally, the irradiation 908b of the second layer 904 may take place such that the second layer 904 is at least partially structurally changed.

The pulsed irradiation absorbs a first energy according to the first absorption coefficient from the first layer 304. The first energy may cause heating of the first layer 304. As a result, the heating of the first layer 304 may also be the top surface 302a of the

Substrate 302 are heated. The heating of the top 302a of the substrate 302 may cause thermal expansion of the top surface 302a of the substrate 302, ie

stress within the top 302a of the substrate 302, which mechanically stress the substrate 302. For example, by the thermal expansion of the top surface 302a, the substrate 302 may curve downwardly (i.e., the substrate 302 curves about an axis that extends below the substrate 302).

Alternatively or additionally, a second energy is absorbed by the second layer 904 according to the second absorption coefficient. The second energy may cause heating of the second layer 904. By heating the second layer 904, the lower surface 302b of the substrate 302 may also be heated. The heating of the bottom 302b of

Substrate 302 may cause thermal expansion of bottom surface 302b of substrate 302, i. lead to mechanical stresses within the bottom surface 302b of the substrate 302, which mechanically stress the substrate 302.

For example, the substrate 302 may be replaced by the

thermal curvature of the top surface 302a upward (i.e., the substrate 302 curves about an axis that extends above the substrate 302). The curvature, i. the deformation, by the action of

(Thermal) energy can also be referred to as thermal distortion or thermal stress.

If the first energy is substantially equal to the second energy, curving the substrate 302 upward may compensate for the downward curvature of the substrate 302. It can thus be achieved that the resulting curvature of the substrate 302 after the irradiation 308b of the first layer 304 and after the irradiation 908b of the second layer 904 in FIG

Is substantially negligible or even disappears, ie that the substrate 302 after irradiation 308b, 908b has substantially the same shape as before the irradiation 308b, 908b. Substantially equal in size, it can be understood that a ratio of the smaller of the two values (eg, the two energies) to the larger of the two values is in a range of about 80% to about 100%. For example, the ratio of the smaller of the two values to the larger of the two values may be greater than about 85%, eg greater than 90%, eg greater than 95%, eg greater than 99%.

Thus, the first layer 304 is substantially the same amount

Energy, like the second layer 904 (in other words, the first energy is substantially the same as the second energy) may be absorbed, e.g. the first

Irradiation device 308 generate and / or emit energy (also referred to as first emission energy) that is substantially the same as energy that second irradiation device 908 generates

and / or emitted (also as second emission energy

designated) . Alternatively or additionally, the first

Absorption coefficient be substantially equal to the second absorption coefficient. Alternatively or additionally, the absorption coefficient according to that of the first irradiation device 308, or second

Irradiation device 908, generated and / or emitted energy are measured (i.e., e.g.

Wavelength range, which of the respective

Irradiation device 308, 908 is emitted).

The respective absorption coefficients deviate strongly

from each other, or are the layers 304, 904 e.g.

different thickness and therefore absorb different amounts of energy, may alternatively or additionally a ratio of the first absorption coefficient to the first

Emission energy substantially equal to a ratio of the second absorption coefficient to the second emission energy. Alternatively or additionally, a

Ratio of the first absorption coefficient to a Energy at which the first layer 304 is irradiated to be substantially equal to a ratio of the second absorption coefficient to an energy with which the second layer 904 is irradiated.

The first energy may define a first energy density which describes which energy is irradiated per area. The area can be, for example, the irradiated area of a layer 304, 904, or by the size of the

Be defined irradiation area. The first irradiation 308b, or the second irradiation 908b, for example, may have an energy density in a range of approximately

0.5 J / cm ² to about 5 J / cm ² , for example in one

Range from about 1 J / cm ² to about 3 J / cm ² , eg in a range from about 1.5 J / cm ² to about 2.5 J / cm ² , eg in a range of about 2 J / cm ² to about 2.5 J / cm ² . With increasing emission energy, the

Energy density accordingly increase, e.g. directly

proportional.

In order for the first layer 304 to absorb substantially the same amount of energy as the second layer 904, the corresponding energy densities may be analogous to those above

described relations set up the respective energy.

The irradiated area may have a size in a range of about 100 cm ² (eg 10 cm x 10 cm) to

about 4 m ² (eg 1 mx 4 m), for example in a range of 0.1 m ² to about 1 m ² . The irradiation 308b, 908b may be performed such that over the irradiated area, a critical energy or energy density required to convert a layer 304, 904 is exceeded and is transferred to the layer 304, 904, ie from the Layer 304, 904 is absorbed. Depending on the material of the substrate 302, the bending of the substrate 302 and the associated mechanical stresses can cause irreversible changes in the substrate

Substrate 302 occur. For example, you can

Grain boundaries in a metallic substrate 302

(Metal substrate) or generally in a metallic

Irreversibly move material or can

Dislocations are formed whose formation is not reversible. In other words, the substrate can be plastically deformed. These irreversible changes can lead to the smallest near-surface curvature

Microcracks (in the coating and / or the substrate 302) can be generated, which can produce corrosion channels and so affect the corrosion protection by the layer 304, or the corrosion resistance of the

treated substrate 302, which in turn reduces the electrical or electrochemical properties

deteriorates. In this case, the pulsed irradiation 308b, 908b of the first layer 304 and the second layer 904 in FIG

Essentially at the same time. Thereby, the stress of the substrate 302 by the heat (also known as

thermal load) on its upper side 302a and lower side 302b are substantially balanced.

In essence, it can be understood that the mechanical stresses within the top surface 302a of the substrate 302 and the stresses within the bottom surface 302b of the substrate 302 in FIG

Are substantially equal, analogous to the first energy and the second energy, as described above.

At substantially the same time, it can be understood that the irradiation 308b of the first layer 304 (also first

Irradiation 308b) with a time shift (in other words with a time offset) to the Irradiation 908b of the second layer 904 (also referred to as second irradiation 908b), which is smaller than the duration of the first irradiation 308b and / or of the second irradiation 908b. The time shift can

for example, by the time difference between the beginning of the first irradiation 308b and the beginning of the second

Irradiating 908b be defined.

For example, the time shift may be less than 30% of the duration of the first irradiation 308b and / or the second irradiation 908b, e.g. less than 25% of the duration of the first irradiation 308b and / or the second irradiation 908b, e.g. less than 20% of the duration of the first irradiation 308b and / or the second irradiation 908b, e.g. less than 15% of the duration of the first irradiation 308b and / or the second irradiation 908b, e.g. less than 10% of the duration of the first irradiation 308b and / or the second irradiation 908b, e.g. less than 5% of the duration of the first irradiation 308b and / or the second irradiation 908b, e.g. less than 2% of the duration of the first irradiation 308b and / or the second irradiation 908b, e.g. less than 1% of the duration of the first irradiation 308b and / or the second irradiation 908b.

In other words, the first irradiation 308b and the second irradiation 908b may overlap one another, e.g. greater than about 70%, e.g. greater than about 80%, e.g. to more than about 90%.

The duration of the first irradiation 308b and / or the second irradiation 908b may depend on the type of irradiation. The duration of the first irradiation 308b and / or of the second irradiation 908b may depend on the energy with which the first irradiation 308b and / or the second irradiation 908b is to take place, ie what amount of energy into the first layer 304 and / or the second layer 904 is to be transmitted. For example, the first irradiation 308b, or the second irradiation 908b, may be by means of an energy pulse (eg, a flash of light) having a pulse duration in a range of about 100 ys to about 600 ys, eg, in a range of about 200 ys to about

500 ys, e.g. in a range of about 300 ys to

about 400 ys. If the first irradiation 308b or the second irradiation 908b has exactly one energy pulse, the duration of the irradiation can correspond to the pulse duration.

The time shift may be less than about 90 ys, e.g. less than about 80 ys, e.g. less than about 60 ys, e.g. be less than about

40 ys, e.g. less than about 30 ys, e.g. less than about 20 ys, less than about 10 ys, less than about 5 ys, e.g. For example, when the pulse duration of the first irradiation 308b and / or the second irradiation 908b is about 300 ys. According to various embodiments, the pulse duration of the first irradiation 308b may be substantially equal to the pulse duration of the second irradiation 908b.

Alternatively, the pulse duration of the first irradiation 308b may be different in magnitude than the pulse duration of the second

Irradiating 908b, e.g. half the size. In that case, the power of the first irradiation 308b may be twice the power of the second irradiation 908b to achieve equal energy inputs. In this case, the time shift may or may not be defined by the shorter duration of the irradiation.

The first irradiation 308b may alternatively be by means of multiple energy pulses, i. a group of energy pulses. The group of energy pulses can at least a first

Have energy pulse and a last energy pulse. If the first irradiation 308b has more than one energy pulse, For example, the duration of the irradiation may be defined from the time interval of the first energy pulse to the last energy pulse of the first irradiation 308b. Similarly, the duration of the second irradiation 908b may be defined. Clearly, the energy pulses of a group of energy pulses can overlap one another or at least in a short sequence

be emitted successively, e.g. in the form of intervals, i. that e.g. a group of energy pulses to one

Irradiation interval is summarized.

The duration of the first irradiation 308b, or the second

Irradiating 908b, may have a value in the range of about 100 ys to about 10 ms, e.g. in a range of about 200 ys to about 1 ms, e.g. in a range from about 300 ys to about 500 ys.

According to various embodiments, during irradiation 308b, 908b, the substrate 302 may be continuously irradiated through the irradiation region 805 (analogous to FIG

Coating area 803) are transported. At this time, the areas sequentially irradiated by the first irradiation 308b may overlap each other, and the areas irradiated successively by the second irradiation 908b may overlap each other.

The surfaces, each by the essentially

simultaneous first irradiation 308b and second irradiation 908b may also overlap one another (i.e., when projected onto each other, along a

Normal of at least one of the surfaces (surface normal)), e.g. greater than about 70%, e.g. greater than about 80%, e.g. greater than about 90%, e.g. greater than about 95%, e.g. to more than about 99%. In other words, the first

Irradiate 308b and second irradiation 908b, which in the

Essentially, at the same time, an overlapping one

Have irradiation area, and both together on one

Section of the substrate 302 act. Fig. 10 illustrates a side view or

A cross-sectional view of a substrate 302 in a method 1000 for processing a substrate 302 according to various embodiments.

The first layer 304 may be connected by means of a first

Coating arrangement 306 are deposited in multiple layers, as described above. This can be the first

Coating arrangement 306, a first coating source

316a and a second coating source 316b. The first coating source 316a may be, for example, a

Carbon source and the second coating source 316b may be, for example, a metal source.

The first layer 304 may include a first sub-layer 304a, e.g. a carbon layer, and a second sub-layer 304b, e.g. a metal layer. Further, as described above, the first coating source 316a and the second coating source 316b may have an overlapping coating area such that a material gradient is formed at the common contact area between the first sub-layer 304a and the second sub-layer 304b of the first layer 304.

Similarly, the second layer 904 may be multilayer deposited by a second coating arrangement 306 as previously described. This can be the second

Coating arrangement 906, a third coating source

916a and a fourth coating source 916b. For example, the third coating source 916a may be a carbon source, and the fourth coating source 916b may be a metal source, for example. The second layer 904 may include a first sub-layer 904a, eg, a carbon layer 904a, and a second sub-layer 904b, eg, a metal layer 904b. Further, as described above, the third coating source 916a and the fourth coating source 916b may have an overlapping coating area such that a material gradient is formed at the common contact area between the first sub-layer 904a and the second sub-layer 904b of the second layer 904.

After forming the first layer 304 and the second

Layer 904 may be irradiated 308b, 908b of the first layer 304 and the second layer 904, as described above.

The second layer 904 may be formed identically to the first layer 304, or may be formed, e.g. of the same thickness and of the same material, e.g. with the same chemical composition, e.g. with the same stoichiometry. Thus, it can be achieved that the first absorption coefficient is equal to the second absorption coefficient.

The second layer 904 may alternatively be or may be different than the first layer 304, e.g. with a different thickness and / or material (e.g., oxide), e.g. with another chemical

Composition, e.g. with a different stoichiometry, e.g. according to the first absorption coefficient. For example, the second layer 904 may be composed to have a suitable absorption coefficient, e.g. essentially the same as the first

Absorption coefficients. Figs. IIA and IIB respectively illustrate one

schematic diagram 1100a and 1100b of optical

Properties of a layer (not shown) in one A method of processing a substrate according to various embodiments.

The graph 1100a illustrated in FIG. IIA shows a refractive index 1103 (may also be referred to as a refractive index) of a layer as a function of the wavelength 1101 (may also be referred to as a spectrum) of

Photon radiation. The wavelength 1101 is given in nanometers (nm). The layer may e.g. to be a carbon layer. Alternatively or additionally, the layer may comprise or be formed from amorphous carbon.

Alternatively or additionally, the layer may comprise or be formed from graphite. Alternatively or additionally, the layer may comprise or be formed from nanocrystalline graphite. Alternatively or additionally, the layer may comprise or be formed from tetrahedral carbon.

The layer may, for example, have a layer thickness in a range from about 50 nm to about 200 nm, e.g. in a range of about 60 nm to about 150 nm, in a range of about 70 nm to about 90 nm, e.g. about 79 nm.

The layer may be formed on or over a substrate, e.g. a metal substrate or a glass substrate.

In this case, the curve 1004 describes the wavelength-dependent real part of the refractive index 1103 and the curve 1006 describes the wavelength-dependent imaginary part of the refractive index 1006 (also referred to as the extinction coefficient).

The extinction coefficient can be considered as a path-length measure of the weakening of electromagnetic

Waves are understood when passing through a medium. The weakening can be done by scattering and absorption. If the proportion of scattering can be neglected

the extinction coefficient corresponds to

Absorption coefficients. The diagram 1100b illustrated in FIG. IIB shows an absorption coefficient 1105 of a layer which has been described above as a function of the wavelength 1101 (may also be referred to as a spectrum) of FIG

Photon radiation. The wavelength 1101 is given in nanometers (nm). The absorption coefficient 1105 is given in reciprocal centimeters (cm ^-1 ).

The larger the absorption coefficient 1105, the smaller the layer thickness of the layer can be to absorb an assigned amount of energy. For example, an irradiation source, e.g. a photon source, such as a flashlamp, may be designed to be mainly light in a range (i.e., spectral)

Composition) of about 300 nm to about 700 nm and emitted. Alternatively or additionally, the irradiation source may generate and emit light in the infrared, ultraviolet, and / or visible range, e.g. a layer 304 (may also be referred to as an absorptive layer) has a matching one

Has absorption coefficient.

The absorption layer can clearly be seen as a layer

which is arranged to absorb radiation, i. which absorbs part of the radiation, e.g. which absorbs more radiation than

reflected, e.g. which absorbs more than twice as much radiation as reflected.

12 illustrates a schematic diagram 1200 of structural properties of a layer (not shown) in a method of processing a substrate according to various embodiments. In the diagram 1200, the axis 1201 indicates the relative

3

Proportion of sp hybridized carbon m of the layer. Of the

3

relative proportion of sp hybridized carbon can by

3

the quotient of the number of sp hybridized

2

Carbon atoms and the sum of sp hybridized

3

Carbon atoms and sp hybridized carbon m of the layer to be defined. Furthermore, axis 1201 denotes the atomic fraction of hydrogen in the layer.

The point 1 / 3-0 corresponds to a relative proportion of sp hybridized carbon in the layer of 0% and an atomic fraction of hydrogen in the layer of 0%. Of the

3

Point 1-100 corresponds to a relative proportion of sp

hybridized carbon in the layer of 100% and an atomic fraction of hydrogen in the layer of 0%. Of the

3

Point 3-100 corresponds to a relative proportion of sp

hybridized carbon in the layer of 0% and an atomic fraction of hydrogen in the layer of 100%.

The region 1112 denotes a layer composition in which graphite is formed. That that the carbon in the layer is mainly or completely in graphite configuration. The region 1114 denotes a layer composition in which amorphous carbon

is trained. That that the carbon in the layer is mainly or fully in an amorphous configuration. The area 1116 denotes a

Layered composition in which hydrogenated amorphous

Carbon is formed. This means that the carbon in the layer is mainly or completely in the amorphous configuration and has additionally taken up hydrogen. The region 1118 denotes a layer composition in which tetragonal carbon is formed. That is, the carbon in the layer is mainly or completely in tetragonal configuration. The region 1122 denotes a layer composition in which diamond is trained. That is, the carbon in the layer is mainly or completely in diamond configuration. The term "principal" may be understood in this context to mean that more than 90% of the carbon atoms are in a particular configuration.

In the context of this description, the foregoing

described configurations of the carbon as

be understood inorganically.

13 is a side view or cross-sectional view of a processing assembly 1300 in a method of processing a substrate 302 according to various embodiments or in a method of processing a substrate 302 according to various embodiments.

The vacuum chamber 802 may include or may be formed as a so-called RTP module 1304 (also referred to as an RTP compartment). The RTP module 1304 may be configured to expose a substrate 302 therein.

For example, the RTP module 1304 may include a gas supply that allows gas of a defined chemical composition (gas composition) to be supplied so that in the RTP module 1304, the gas composition may be regulated or controlled. The RTP module 1304 may

clearly surround the irradiation area 805 and this gas from the coating area 803 gasseparieren. As a result, sputtered material can be prevented from accumulating on one of the irradiation devices 308, 908. For this purpose, the RTP module 1304 may have one or more gas separation walls.

Further, the gas provided in the RTP module 1304 may include or be formed from air, or may include or form an inert gas. Alternatively or additionally, in the RTP module 1304 provided gas, ie the provided therein

Process atmosphere, have a pressure which is less than 0.3 mbar. In other words, vacuum may be provided in the RTP module 1304.

Alternatively or additionally, the gas provided in the RTP module 1304 may have a pressure which is less than 0.1 mbar, for example less than 10 ^-2 mbar, eg less than 10 ^-3 mbar, eg less than 10 ^-4 mbar, eg less than 10 ^"5 mbar.

In other words, irradiation (also known as

Energy application) may be in air, under inert gas and / or in vacuum (e.g., with a pressure less than

_3

10 mbar).

According to various embodiments, the substrate 302 may be on or in a carrier 1302 (also referred to as carrier or

Substrate carrier referred) be included. The carrier 1302 may include, for example, substrate receiving areas for receiving substrates 302, wherein in each

Substrate receiving area in each case a substrate 302 may be included or may be. The substrate receiving areas may be formed, for example, in the form of a depression in the carrier 1302. It can thereby be achieved that a plurality of smaller substrates 302 can be treated economically by means of a processing system 1300 designed for larger substrates 302. The carrier 1302 may have a through opening in each of the substrate receiving regions, which exposes the underside of the substrate 302, so that a two-sided treatment of the substrates 302 may take place. The irradiation devices 308, 908 can each have one field, ie an array, of a plurality of flash lamps, which can be aligned, for example, parallel to one another. In In this case, the irradiation devices 308, 908 may also be used as exposure devices or RTP units

be designated. Prior to irradiating the substrates 302 carried by the carrier 1302, the substrates 302 may have been coated as previously described. In other words, these may be functionally coated substrates 302.

During the application of a rapid thermal process (i.e., during flash exposure), intrinsic stress in a substrate 302 may occur due to laterally high energy densities and the concomitant change in the mechanical stresses in the near-surface layer. At sufficiently high energy densities, there will be a concave curvature of the substrate (i.e., directed away from the radiation). In this case, on the convexly curved surface, induced by stretching, microcracks occur that are not reversible and a

Operability of the layer and / or the substrate, e.g. in the form of a bipolar plate.

A subsequent exposure of the precurved substrate leads to a no longer 100% neutralization of the mechanical stresses. The substrate, e.g. a

Bipolar plate, therefore loses its original shape. Another process step that restores the component

Origingestalt forms is very expensive, or almost impossible.

According to various embodiments, the RTP units may be disposed opposite each other, and may at the time of irradiation (in other words, the

Post-treatment of the layer) synchronously (in other words flashing). A substrate 302 or a carrier 1302 with

Substrates 302, or a substrate in the form of a band, or a film, it may be centrally, ie positioned between the RTP units. As a result, it can be achieved that on the top side 302 a of the substrate 302

transferred (in other words deposited or registered) energy is substantially the same as that on the

Bottom 302 b of the substrate 302 transmitted energy.

Due to the substantially equal energy inputs can be a deformation (deformation), or one-sided

mechanical and / or thermal loading of the substrates 302, e.g. Bipolar plates, e.g. embossed or unembossed

Bipolar plates, and thus damage to the functional layers 304, 904 on the substrates 302 are avoided.

Claims

claims

Method (100, 200, 1000) for editing a

Metal substrate (302) or for processing a

Metal surface of a substrate (302), wherein the

Method (100, 200, 1000) comprising:

Applying a layer (304) to the

Metal substrate or the metal surface, wherein the

2

Layer (304) sp hybridized carbon and / or sp hybridized carbon, wherein the layer (304) has a carbon content of more than 30 at%; and

Pulsed irradiation of the layer (304) so that the layer (304) is heated and the layer (304) is at least partially structurally altered.

Method (100, 200, 1000) according to claim 1,

wherein the pulsed irradiation of the layer (304) is such that the layer (304) is heated to more than 400 ° C for less than 1 second.

The method (100, 200, 1000) according to claim 1 or 2, wherein the pulsed irradiation using

at least one light source takes place.

Method (100, 200, 1000) according to one of claims 1 to 3,

wherein the pulsed irradiation is performed using a flashlamp.

5. Method (100, 200, 1000) according to one of claims 3 or 4,

wherein in the pulsed irradiation a maximum pulse duration of 10 ms, preferably of a maximum of 1 ms,

preferably a maximum of 500 ys is used. Method (100, 200, 1000) according to one of claims 1 to 5,

wherein the metal substrate (302) or the substrate (302) is a metal foil or a metal sheet with a maximum thickness of 2 mm.

Method (100, 200, 1000) according to one of Claims 1 to 6,

wherein the metal substrate (302) or the substrate (302) has a curved, corrugated and / or angled profile, and wherein the layer (304) is applied to the curved or angled surface.

Method (100, 200, 1000) according to one of claims 1 to 7,

wherein the pulsed irradiation of the layer (304) is such that an average temperature of the

Metal substrate (302) or substrate (302) remains below a predetermined maximum value during the entire irradiation so that the metal substrate (302) or the substrate (302) remains substantially unchanged in its shape.

Method (100, 200, 1000) according to one of claims 1 to 8,

wherein the layer (304) is applied to a thickness of at least 10 nm.

Method (100, 200, 1000) according to one of claims 1 to 9,

wherein the layer (304) further comprises a metal.

Method (100, 200, 1000) according to one of claims 1 to 10,

2

wherein the layer (304) comprises sp hybridized carbon and / or hybridized carbon in the form of graphite, nanocrystalline graphite, amorphous

Carbon and / or tetrahedral carbon.

The method (100, 200, 1000) according to any one of claims 1 to 11, further comprising:

Depositing at least one metal layer (304b) on the metal substrate (302) or the metal surface.

Method (100, 200, 1000) according to one of claims 1 to 12,

wherein the pulsed irradiation of the layer (304) is such

2 3

that the proportion of sp and / or sp

hybridized carbon in the layer (304)

is changed.

Method (100, 200, 1000) according to one of Claims 1 to 13,

wherein the pulsed exposure of the layer (304) increases the electrical conductivity of the layer (304) and / or the corrosion resistance of the layer (304).

The method (100, 200, 1000) of any one of claims 1 to 14, further comprising:

Applying another layer (904) to one

Surface of the metal substrate (302) or the

Substrate (302) facing the layer (304); and

Pulsed irradiation of the further layer (904).

Method (100, 200, 1000) according to claim 15,

Where the layer (304) is a first

Absorption coefficient and the other layer (904) has a second absorption coefficient

having; and

Wherein the pulsed irradiation is such that a first energy generated by the pulsed Irradiation of the layer (304) is absorbed according to the first absorption coefficient, and a second energy which is absorbed by the pulsed irradiation of the further layer (904) according to the second absorption coefficient, in the

Are essentially the same size, so that one

thermal stress on the surfaces of the substrate (302) that are coated is substantially balanced.

The method (100, 200, 1000) according to claim 15 or 16, wherein the pulsed irradiation of the layer (304) and the pulsed irradiation of the further layer (904) in

Essentially at the same time.

Method (100, 200, 1000) for editing a

Metal layer or a metal surface of a

Substrate (302), comprising:

Applying a layer comprising carbon to the metal layer or the metal surface, the layer having a carbon content of more than 30 at%; and

• Generating energy pulses to irradiate the

Layer, so that the carbon is at least partially structurally changed.

Processing arrangement (800b, 1300) for processing a metal substrate or metal surfaces of a

Substrate (302), comprising:

A vacuum chamber (802) for providing a

vacuum; and

• two in the vacuum chamber (802) arranged

Coating devices (804) for applying carbonaceous layers to the metal substrate (302) or the metal surfaces;

• two in the vacuum chamber (802) arranged

Irradiation devices (806) for pulsed Irradiating the carbonaceous layers, wherein the irradiation device (806) is such

is set up that by means of the pulsed

Irradiating the bicarbonate-containing layers; and

a transport device (822) for transporting the substrate (302) between each of the two

Coating devices (804) and between each of the two irradiation devices (806) therethrough, so that the metal substrate (302) or the substrate (302) is processed on both sides.

Processing arrangement according to claim 19,

wherein the two irradiation devices (806) each comprise at least one light source.

Processing arrangement according to one of claims 19 or 20,

wherein the two irradiation devices (806) are arranged such that the carbonaceous

Layers can be heated by more than 400 ° C in less than 1 s.

The processing arrangement according to one of claims 19 to 21, wherein the two irradiation devices (806) each comprise at least one flashlamp.

The processing arrangement according to one of claims 19 to 22, wherein the two irradiation devices (806) each have at least one pulsed irradiation source.

Processor arrangement according to one of the claims 19 to 19, wherein the two irradiation devices (806) are arranged such that the carbonaceous ones

Layers each at least partially with a Pulse duration of a maximum of 10 ms can be pulsed irradiated.

The processing assembly of any one of claims 19 to 24, further comprising:

at least one in the vacuum chamber (802) arranged further coating device (316b) for applying a metal-containing layer on the metal substrate (302) or the substrate (302).

Processing arrangement according to one of claims 19 to 25, wherein the two irradiation devices (806) are arranged such that when irradiated the proportion of

2 3

sp and / or sp hybridized carbon in the carbonaceous layers (304, 904) can be changed.

Method (100, 200, 1000) for editing a

Substrate (302), the method comprising:

Applying a first layer (304) with a

first absorption coefficient on a top surface (302a) of the substrate (302) and applying a second layer (904) with a second one

Absorption coefficients on a lower surface (302b) of the substrate (302); and

Pulsed irradiation of the first layer (304) and the second layer (904) such that the first layer (304) and / or the second layer (904) are at least partially structurally altered;

Wherein the pulsed irradiation is such that a first energy generated by the pulsed

Radiation is absorbed by the first layer (304) according to the first absorption coefficient, and a second energy by the pulsed

Irradiation of the second layer (904) is absorbed in accordance with the second absorption coefficient, are substantially equal, so that a thermal stress of the substrate (302) on its upper surface (302a) and lower surface (302b) in the

Is substantially compensated.