WO2015121927A1

WO2015121927A1 - Device for assisting correction work for circuit board

Info

Publication number: WO2015121927A1
Application number: PCT/JP2014/053203
Authority: WO
Inventors: 真一伊東
Original assignee: 富士機械製造株式会社
Priority date: 2014-02-12
Filing date: 2014-02-12
Publication date: 2015-08-20
Also published as: JP6302493B2; JPWO2015121927A1

Abstract

An assistance device is provided with an inspection device, a housing device, a processing device, and a transport device. The inspection device performs inspection, which includes a plurality of inspection items, on a circuit board that is passed along a production line, and on the basis of the results of the inspection, assesses whether or not the circuit board is a defective product. The housing device comprises a plurality of board housing units, wherein each of the board housing units is capable of housing a circuit board that has been assessed to be a defective product by the inspection device. The processing device, on the basis of the results of the inspection by the inspection device, assigns at least one of the plurality of housing units to a circuit board assessed to be a defective product. Then, the transport device transports the circuit board that has been assessed to be a defective product to the housing unit that has been assigned by the processing device.

Description

Device for supporting circuit board correction work

The technology disclosed herein relates to a technology for producing a component mounting board, and more particularly, to a technology for assisting an operator who performs correction work on a defective circuit board generated on a production line.

JP-A-8-256000 describes a production line for component mounting boards. This production line includes a mounting process for mounting an electronic component on a circuit board, a soldering process for bonding the circuit board and the electronic component, and an inspection process for inspecting the circuit board. In the inspection process, the inspection apparatus performs an inspection including a plurality of inspection items on the circuit board, and determines whether or not the circuit board is a defective product based on the result of the inspection. The circuit board determined to be defective is sent to the correction process. In the correction process, the operator performs a correction operation on the circuit board determined to be defective and re-injects the corrected circuit board into the production line.

In order to maintain the productivity of the production line, it is preferable that the defective circuit board extracted in the inspection process is promptly re-entered into the production line after the correction work by the operator. However, for example, when the circuit board has a large number of defects, the worker may require a lot of time for the correction work. In this case, during the correction work by the operator, a defective circuit board may be newly extracted in the inspection process, and the circuit board requiring the correction work may stay in the correction process for a long time. As a result, there is a problem that the productivity of the production line is lowered.

This specification provides a technique for supporting correction work by an operator in order to solve or at least reduce the above problem.

According to one aspect of the present technology, an apparatus for supporting a work for correcting a defective product generated on a production line for a component mounting board is disclosed. This apparatus includes an inspection device, a storage device, a processing device, and a transfer device. The inspection apparatus performs an inspection including a plurality of inspection items on the circuit board flowing through the production line, and determines whether or not the circuit board is a defective product based on a result of the inspection. The accommodating device has a plurality of substrate accommodating portions, and each substrate accommodating portion is capable of accommodating a circuit board determined to be a defective product by the inspection device. The processing device assigns at least one of the plurality of accommodating portions to the circuit board determined to be defective based on the result of the inspection by the inspection device. And a conveyance apparatus conveys the circuit board determined to be inferior goods to the accommodating part allocated by the processing apparatus.

In the above-described apparatus, when the inspection apparatus determines that the circuit board is defective, the circuit board determined to be defective is accommodated in the accommodation apparatus. The operator can take out the circuit board from the housing device, confirm the defect generated in the circuit board, and perform necessary correction work. The accommodation device has a plurality of accommodation portions and can accommodate a plurality of circuit boards. When a plurality of circuit boards are accommodated in the accommodation device, the degree of failure occurring in each circuit board varies, and the time required for the correction work by the operator varies depending on the circuit board. In such a case, the operator is required to preferentially select a circuit board having a short time required for the correction work as a target of the correction work. Conversely, if a circuit board that requires a long time for correction work is selected first, one or more circuit boards waiting for the correction work will stay in the storage device for a long time, greatly reducing the productivity of the production line. End up.

Regarding the above points, in the apparatus according to the present technology, when a defective circuit board is accommodated in the accommodation device, one or a plurality of accommodation units that should accommodate the circuit board are based on the result of the inspection by the inspection device. To be determined selectively. Therefore, the accommodation position of each circuit board in the accommodation device is related to the result of the inspection of each circuit board, that is, the degree of failure occurring in each circuit board. Therefore, when the operator selects a circuit board to be corrected from the accommodation device, the operator easily determines a circuit board to be preferentially corrected based on the position where each circuit board is accommodated. be able to.

The structure of the production system of an Example is typically shown. The structure of the inferior goods operation apparatus is shown typically. The flowchart which shows the flow of operation | movement of inferior goods operation apparatus. The figure which shows an example of the data table which a processing apparatus memorize | stores. The figure which shows the update content of a data table. The figure which shows the update content of a data table. The figure which shows the update content of a data table. The figure which shows a mode that the existing circuit board is conveyed to the accommodating part updated. The figure which shows a mode that a circuit board is conveyed to the accommodating part to which it was allocated.

In one embodiment of the present technology, the processing device calculates a defect index indicating the degree of failure of the circuit board determined to be defective based on the inspection result of each inspection item by the inspection device, and calculates the calculated defect index. Based on the above, it is preferable to determine the accommodating portion to be allocated to the circuit board. According to such a configuration, the degree of failure occurring in the circuit board can be quantified by the failure index, and the accommodating portion to be allocated to the circuit board can be appropriately determined.

Here, the inspection items in the present specification may include various items in which the inspection result can be expressed in a binary manner (for example, good or bad). For example, when the inspection by the inspection apparatus obtains a binary inspection result for each inspection location in 100 inspection locations on the circuit board, it can be said that the inspection includes 100 inspection items. Or even if it is an inspection for one inspection location, for example, when a binary inspection result is obtained for two items, such as the presence or absence of an electronic component and its position, the inspection includes two inspection items. It can be said. In addition, for a test in which a single index expressed by a numerical value, such as the amount of solder, is determined in three stages based on two threshold values, a binary test result can be obtained for each threshold value. Therefore, it can be said that the inspection includes two inspection items.

In the above-described embodiment, it is preferable that the defect index is obtained by cumulatively adding individual defect indices determined for each inspection item according to the inspection result of each inspection item. Typically, the circuit board determined to be defective for many inspection items has a longer time required for the correction work, and therefore, the degree of the defect generated on the circuit board can be considered to be large. . Therefore, according to the method described above, it is possible to determine a defect index that is well related to the degree of defect relatively easily.

In the above-described embodiment, as an example, the defect index can be determined so as to satisfy the following formula (1) or (2). In the following formula (1) or (2), y represents a defect index, n represents the number of a plurality of inspection items, x _i represents the inspection result for each inspection item i, and the inspection result is X _i = 1 when good, x _i = 0 when bad, and α _i indicates a weighting factor for each inspection item i. The weighting factor α _i corresponds to the individual defect index described above, and the defect index calculated by the equation (1) or (2) is the individual defect index α _i determined for each inspection item i. It can be said that it is cumulatively added according to the inspection result of item i. In the case of Equation (1), the greater the degree of failure occurring on the circuit board, the smaller the failure index y. On the other hand, in the case of Equation (1), the failure index y becomes a larger value as the degree of failure occurring in the circuit board is larger.

In Equation above (1) or (2), at least a weight counting alpha _i in one test item i, other different it is preferred that the weight counting alpha _j in at least one inspection item j. Usually, the time required for the correction work differs depending on the inspection item. For example, the correction work for a large part is easier than the correction work for a small part, and the required time is short. Therefore, as an example, the weight coefficient α _i of the inspection item i for a large part can be set to a smaller value than the weight coefficient α _j of the inspection item _j for a small part. In this way, by calculating the weighting factors α _i and α _j according to the required time for the correction work, the calculation of the defect index is performed according to the time required for the correction work required by the circuit board. Can be related.

In each of the above-described embodiments, the processing apparatus includes a storage unit located closer to the re-input unit for re-inputting the circuit board into the production line as the degree of failure indicated by the failure index is smaller. It is preferable to assign the circuit board determined to be non-defective. Some circuit boards with a low degree of failure include those that can be re-entered into the production line with very simple correction work or substantially without the need for correction work. In such a case, if the circuit board is located in the accommodating part close to the re-input part, the operator can re-input the circuit board to the production line in a very short time.

In each of the embodiments described above, the processing apparatus ranks the circuit boards determined to be defective based on the defect index, and determines the accommodation unit to be assigned to the circuit board determined to be defective based on the rank. It is preferable to do. Although this ranking is an example, it may be a two-level ranking using a single threshold or a multi-level ranking using a plurality of thresholds. Alternatively, the processing apparatus may perform ranking based on the magnitude relationship with the defect index of another circuit board.

In addition to the above, the processing apparatus further determines the rank of the circuit board newly determined as a defective product by further adding a defect index of at least one circuit board already accommodated in the accommodation apparatus in the ranking described above. It is preferable. According to such a configuration, with respect to the order to be subjected to the correction work, the priority order of the circuit board newly determined as defective is relative to at least one circuit board already accommodated in the accommodation device. And a storage unit corresponding to the priority order can be assigned.

In addition to the above, the processing apparatus may update the rank of at least one circuit board already accommodated in the accommodation apparatus in accordance with the rank of the circuit board newly determined as a defective product in the ranking described above. preferable. And it is preferable that a processing apparatus allocates a new accommodating part to the at least 1 circuit board already accommodated in the accommodating apparatus based on the updated rank. According to such a configuration, when a plurality of circuit boards are accommodated in the accommodation device, an appropriate accommodation portion can be assigned to each circuit board regardless of the order in which the circuit boards are accommodated in the accommodation device. it can.

In the above-described embodiment, it is preferable that the transfer device moves at least one circuit board already accommodated in the accommodation device to the newly assigned accommodation unit. According to such a configuration, a plurality of circuit boards that are defective products can be arranged in a plurality of housing portions of the housing device according to the degree of failure of each circuit board.

In one embodiment of the present technology, it is preferable to further include a display device that associates and displays the identification information of the circuit board accommodated in the accommodation device and the identification information of the accommodation unit that accommodates the circuit board. According to such a configuration, the operator can easily recognize the circuit board accommodated in the accommodation device based on the information displayed on the display device.

Referring to the drawings, a production system that is an embodiment of the present technology will be described. The production system of this embodiment is a component mounting board production system in which a plurality of electronic components are mounted on a circuit board 4. As shown in FIG. 1, the production system includes a production line 10 and a defective product operating device 30 (hereinafter referred to as an operating device 30) provided in the production line 10. The production line 10 includes a line conveyor 20 that conveys the circuit board 4, and a solder printing device 12, a component mounting device 14, an inspection device 16, and a reflow device 18 that are arranged along the line conveyor 20. The solder printing device 12 prints solder on the circuit board 4, and the component mounting device 14 mounts a plurality of electronic components on the circuit board 4 coated with solder.

The inspection device 16 performs an inspection on the circuit board 4 and determines whether or not the circuit board 4 is defective. The inspection by the inspection device 16 includes a plurality of inspection items. For example, the inspection device 16 images the circuit board 4 and analyzes the image of the circuit board 4, whereby a plurality of inspection items including presence / absence, position, orientation, and solder amount are obtained for each electronic component on the circuit board 4. Judge the quality of the. In addition, it does not specifically limit about a specific test | inspection item, Furthermore, you may have a some test | inspection item. The circuit board 4 that has passed the inspection is sent to the reflow device 18. The reflow device 18 heats the circuit board 4 to reflow the solder on the circuit board 4. Note that the configuration of the production line 10 can be variously changed and is not limited to the configuration described in the present embodiment.

On the other hand, when the inspection device 16 determines that the circuit board 4 is a defective product, the circuit board 4 is temporarily discharged from the production line 10 by the operation device 30 in order to receive a correction work by an operator. The operating device 30 is a device that discharges the circuit board 4 determined to be defective from the production line 10 and temporarily stores it until a correction operation is performed by an operator. The operation device 30 is also a device that re-injects the circuit board 4 after the correction work into the production line 10. The operation device 30 and the inspection device 16 constitute a device that supports correction work by an operator. Hereinafter, the configuration and function of the operation device 30 will be described in detail.

As shown in FIGS. 1 and 2, the operating device 30 is provided downstream of the inspection device 16 in the production line 10. The operation device 30 includes a gate conveyor 32, a distribution storage device 34, a processing device 36, and an operation panel 38. The gate conveyor 32 can take in and out the circuit board 4 with respect to the line conveyor 20 of the production line 10. For example, the gate conveyor 32 can discharge the circuit board 4 determined to be defective by the inspection device 16 from the line conveyor 20 of the production line 10. Further, the gate conveyor 32 can re-inject the circuit board 4 after the correction work into the line conveyor 20 of the production line 10. Although the gate conveyor 32 of a present Example is a belt conveyor which drives a conveyor belt with a motor, about the specific structure of the gate conveyor 32, it does not specifically limit.

The distribution storage device 34 includes a distribution device 40 and a storage device 50. The housing device 50 is a device that houses the circuit board 4 that has been determined to be defective by the inspection device 16. The storage device 50 has a plurality of storage portions 52a to 52j. The plurality of accommodating portions 52a to 52j include first to tenth accommodating portions 52a to 52j in order from the top. Each of the accommodating portions 52a to 52j can accommodate one circuit board 4. Each of the accommodating portions 52a to 52j has a configuration that allows the operator 100 to insert and remove the circuit board 4. Although the storage device 50 of the present embodiment has a multistage rack structure, the specific configuration of the storage device 50 is not limited to this.

The circuit board 4 accommodated in the accommodation device 50 is subjected to correction work by the worker 100. The worker 100 takes out the defective circuit board 4 from the storage device 50, confirms the defect generated in the circuit board 4, and performs necessary correction work. After the correction work, the worker 100 returns the circuit board 4 to any one of the housing portions 52a to 52j. Alternatively, the worker 100 may set the circuit board 4 after the correction work on the gate conveyor 32. In this case, the gate conveyor 32 can re-inject the circuit board 4 after the correction work into the production line 10.

The distribution device 40 is a device that conveys the circuit board 4 between the gate conveyor 32 and each of the accommodating portions 52a to 52j. The distribution device 40 can selectively convey the circuit board 4 discharged from the production line 10 by the gate conveyor 32 to any one of the accommodating portions 52a to 52j. Further, the distribution device 40 can transport the circuit board 4 after the correction work accommodated in the accommodating portions 52a to 52j to the gate conveyor 32 which is a re-input portion to the production line 10. The distribution device 40 of the present embodiment is configured by a combination of a belt conveyor that transports the circuit board 4 in the horizontal direction and a lifting device that moves the belt conveyor in the vertical direction. The configuration is not limited to this.

The processing device 36 is configured using a computer having a storage device and a processor, and executes various arithmetic processes. In particular, when the inspection device 16 determines that the circuit board 4 is a defective product, the processing device 36 includes a plurality of storage units in the circuit board 4 determined to be defective based on the result of the inspection by the inspection device 16. A process of assigning one of 52a to 52j is executed. The accommodating portions 52a to 52j assigned by the processing device 36 are taught to the gate conveyor 32 and the distribution device 40 described above. Thereby, the circuit board 4 determined to be defective is conveyed by the gate conveyor 32 and the distribution device 40 to one of the accommodating units 52a to 52j assigned by the processing device 36.

The processing device 36 stores a data table shown in FIG. In this data table, column A describes the identification information of each of the accommodating units 52a to 52j. Here, “1st” to “10th” indicate identification information of the first to tenth accommodating portions 52a to 52j, respectively. Column B describes the rank of each of the accommodating portions 52a to 52J. This rank is based on the distance from the gate conveyor 32, and higher ranks are given to the accommodating portions 52a to 52j closer to the gate conveyor 32. The C, D, and E columns of the data table describe the identification information, defect index, and rank of the circuit board 4 accommodated in each of the accommodating portions 52a to 52j. As described above, the data table describes information related to the circuit board 4 accommodated in each of the accommodating portions 52a to 52j.

The operation panel 38 is an example of a user interface, and is a display device that displays various types of information to the worker 100 and an input device that receives various instructions from the worker. The operation panel 38 displays the information described in the data table, for example, the identification information of each of the accommodating units 52a to 52j and the identification information of the circuit board 4 accommodated in each of the accommodating units 52a to 52j in association with each other. can do. The operation panel 38 of the present embodiment is configured using a liquid crystal touch panel, but the specific configuration of the operation panel 38 is not limited to this.

Next, the operation flow of the operation device 30 will be described with reference to the flowchart shown in FIG. For convenience of explanation, as shown in FIGS. 2 and 4, it is assumed that the circuit boards 4 of the identification information SB01 to SB06 are accommodated in the third accommodating portion 52c to the eighth accommodating portion 52h, respectively. Then, it is assumed that the circuit board 4 having the identification information SB07 is newly determined as a defective product and stored in the storage device 50. Hereinafter, the circuit board 4 of the identification information SB01 to SB06 is referred to as an existing defective board SB01 to SB06, respectively, and the circuit board 4 of the circuit board 4 of the identification information SB07 is referred to as a new defective board SB07.

First, when the inspection device 16 determines that the new circuit board SB07 is a defective product (YES in S12), the gate conveyor 32 discharges the new circuit board SB07 from the production line 10 (S14). At the same time, the processing device 36 acquires the result of the inspection of the new defective substrate SB07 from the inspection device 16. The result of the inspection by the inspection device 16 includes information indicating either good or defective for each of the plurality of inspection items.

Next, the processing device 36 calculates a defect index of the new defective substrate SB07 based on the acquired inspection result. The defect index is a numerical value of the degree of defect occurring in the circuit board 4. Although it is an example, the processing apparatus 36 of a present Example calculates a defect parameter | index using (1) Formula mentioned above. Therefore, it can be said that the smaller the defect index y is, the greater the degree of defects occurring in the new defective substrate SB07. Here, the weight coefficient α _i (individual defect index) can be determined in consideration of various factors, and in particular, it may be determined in consideration of the burden on the worker in the correction work. In particular, inspection items that are difficult for the operator to visually inspect the inspection object can be said to be inspection items that place a heavy burden on the operator in the correction work. Therefore, the weight coefficient α _i can be appropriately determined in consideration of, for example, at least one of the size and shape of the electronic component to be inspected.

Next, the processing device 36 ranks the new defective substrate SB07 based on the calculated defect index (S20 in FIG. 3). At this time, the processing device 36 refers to the data table shown in FIG. 4 to determine the rank to be given to the new defective substrate SB07. For example, assume that the defect index of the new defective substrate SB07 is 0.4. In this case, the defect index of 0.4 corresponds to the sixth largest value among the existing defective substrates SB01 to SB06 described in the data table. Accordingly, the processing device 36 gives a rank “6” to the new defective substrate SB07. Here, the rank “6” overlaps with the rank of the existing defective substrate SB01 accommodated in the third accommodating portion 52c. Therefore, as illustrated in FIG. 5, the processing device 36 changes the rank of the existing defective substrate SB01 described in the data table from “6” to “7”. As described above, the processing apparatus 36 can update the ranks of the existing defective substrates SB01 to SB06 in accordance with the rank assigned to the new defective substrate SB07.

Next, the processing device 36 assigns the accommodating units 52a to 52j to the existing defective substrate SB01 and the new defective substrate SB07 based on the rank determined in the above processing (S22 in FIG. 3). First, as illustrated in FIG. 6, the processing device 36 newly assigns the ninth accommodating portion 52 i having the same rank “7” to the existing defective substrate SB <b> 01 whose rank has been updated based on the updated rank. Next, as illustrated in FIG. 7, the processing apparatus 36 assigns the third accommodating portion 52 c having the same rank “6” to the new defective substrate SB07. Thereby, in the data table, the ranks match between the circuit boards SB01 to SB07 and the accommodating portions 52c to 52i assigned to the circuit boards SB01 to SB07.

When the data table is updated, the gate conveyor 32 and the distribution device 40 refer to the updated data table and carry the existing defective substrate SB01 and the new defective substrate SB07. First, as shown in FIG. 8, the distribution device 40 transports the existing defective substrate SB01 to the ninth accommodating portion 52i assigned thereto (S24 in FIG. 3). Next, as shown in FIG. 9, the gate conveyor 32 and the distribution device 40 convey the new defective substrate SB07 to the third accommodating portion 52c assigned thereto (S26 in FIG. 3). As a result, also in the accommodating device 50, the ranks coincide between the circuit boards SB01 to SB07 and the accommodating portions 52c to 52i that accommodate the circuit boards SB01 to SB07. The above operation is repeatedly executed until the production line 10 is stopped (S28 in FIG. 3).

As described above, in the production system of the present embodiment, when the inspection device 16 determines that the circuit board 4 is defective, the circuit board 4 determined to be defective is stored in the storage device 50. The worker 100 can take out the circuit board 4 from the storage device 50, confirm a defect occurring in the circuit board 4, and perform necessary correction work. Here, the accommodation position of each circuit board 4 in the accommodation device 50 is related to the degree of failure occurring in each circuit board 4. Therefore, when the operator 100 selects the circuit board 4 to be corrected from the accommodation device 50, the worker 100 can easily select the circuit board 4 to be corrected based on the accommodation position of each circuit board 4. Can be determined. That is, the worker 100 can carry out the correction work with priority from the circuit board 4 that has a minor defect and requires a short time for the correction work.

Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

In the above-described embodiment, different ranks are given to the plurality of circuit boards 4 that are defective products, but in other embodiments, some of the plurality of accommodating portions 52a to 52j that are defective products are used. The same rank may be given. For example, the processing device 36 may assign a rank of “1” to the circuit board 4 whose defect index is within a predetermined range, and may assign a rank of “2” to the circuit board 4 that is not. In this case, the plurality of accommodating portions 52a to 52j can also be given a rank of “1” for a part thereof and a rank of “2” for the other part. The circuit board 4 given the rank “1” is accommodated in one of the accommodating parts 52a to 52j assigned the rank “1”, and the circuit board 4 given the rank “2” , “2” can be stored in any one of the storage units 52a to 52j.

The technical elements described in the present specification or drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

4: Circuit board 10: Production line 12: Solder printing device 14: Component mounting device 16: Inspection device 18: Reflow device 20: Line conveyor 30: Defective product operation device 30: Operation device 32: Gate conveyor 34: Distribution accommodation device 36 : Processing device 38: Operation panel 40: Distributing device 50: Storage devices 52a to 52j: Storage unit 100: Worker

Claims

A device that supports correction work of defective products that occur on the production line of component mounting boards,
An inspection device that performs inspection including a plurality of inspection items on the circuit board flowing through the production line, and determines whether or not the circuit board is defective based on the result of the inspection;
A housing device having a plurality of substrate housing portions, each of the substrate housing portions being capable of housing a circuit board determined to be defective by the inspection device;
A processing device that assigns at least one of the plurality of accommodating portions to the circuit board determined to be defective based on the result of the inspection by the inspection device;
A transport device for transporting the circuit board determined to be defective to a storage unit assigned by the processing device;
A device comprising:
The processing device calculates a defect index indicating the degree of failure of the circuit board determined as the defective product based on the inspection result of each inspection item by the inspection device, and based on the calculated defect index, The apparatus according to claim 1, wherein an accommodation unit to be allocated to the circuit board is determined.
The apparatus according to claim 2, wherein the defect index is obtained by cumulatively adding individual defect indexes determined for each inspection item according to the inspection result of each inspection item.
Wherein the plurality of the number of test items is n, the test result x i in each test item i, when the good is "1", when the failure is set to "0", the weighting count for each of the test items i The apparatus according to claim 2 or 3, wherein the failure index y satisfies the following formula (1) or (2) when α i is set.
In Equation (1) or (2), at least one and the weight counter alpha i in the test item i of the different from other weight counting alpha j in at least one inspection item j The apparatus of claim 4.
The processing apparatus determines, as the degree of failure indicated by the failure index is smaller, an accommodating portion positioned closer to a re-injection unit for re-injecting the circuit board into the production line as the defective product. 6. An apparatus according to any one of claims 2 to 5, wherein the apparatus is assigned to a printed circuit board.
The processing apparatus ranks the circuit board determined to be defective based on the defect index, and determines a storage unit to be allocated to the circuit board determined to be defective based on the rank. The device according to any one of 6 to 6.
The processing apparatus further determines a rank of a circuit board newly determined as a defective product by further considering a defect index of at least one circuit board already accommodated in the accommodation apparatus in the ranking. 8. The apparatus according to 7.
In the ranking, the processing device updates the rank of at least one circuit board already accommodated in the accommodation device according to the rank of the newly determined defective circuit board, and the updated rank 9. The apparatus according to claim 8, wherein a new accommodating part is allocated to at least one circuit board already accommodated in the accommodating apparatus based on the method.
10. The apparatus according to claim 9, wherein the transfer device moves at least one circuit board already accommodated in the accommodation device to the newly assigned accommodation unit.
11. The display device according to claim 1, further comprising: a display device that displays the identification information of the circuit board accommodated in the accommodation device and the identification information of the accommodation unit that accommodates the circuit board in association with each other. Equipment.