WO2015120664A1 - 一种半导体散热器 - Google Patents

一种半导体散热器 Download PDF

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Publication number
WO2015120664A1
WO2015120664A1 PCT/CN2014/076369 CN2014076369W WO2015120664A1 WO 2015120664 A1 WO2015120664 A1 WO 2015120664A1 CN 2014076369 W CN2014076369 W CN 2014076369W WO 2015120664 A1 WO2015120664 A1 WO 2015120664A1
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Prior art keywords
heat
semiconductor
connection base
heat sink
hollow
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PCT/CN2014/076369
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English (en)
French (fr)
Inventor
谷静一
Original Assignee
谷静一
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Publication date
Application filed by 谷静一 filed Critical 谷静一
Priority to US14/384,903 priority Critical patent/US20150357259A1/en
Publication of WO2015120664A1 publication Critical patent/WO2015120664A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the field of heat dissipation technologies, and in particular, to a semiconductor heat sink.
  • the popular semiconductor heat sinks because of their structure and design principles, have different degrees of defects such as poor thermal insulation at the hot and cold end, which is not conducive to dust separation and easy to install and use.
  • heat sinks such as multiple fans
  • the interior of the device enters a large amount of dust along with the heat dissipation. If it is not cleaned in time, it may easily cause air blockage, temperature rise, short circuit, etc.
  • An object of the present invention is to provide a semiconductor heat sink which is simple in structure, dustproof, noiseless, stable in heat dissipation, and easy to install.
  • a semiconductor heat sink includes a rigid insulating and heat insulating substrate, wherein the hard insulating and heat insulating substrate is provided with a through hole, and the upper and lower end faces of the through hole are respectively provided with a hollow heat insulating platform and a lower heat conducting connecting base a boss having a through-hole and engaging with a cavity of the hollow heat insulating table, the top surface of the boss and the hollow insulating table being disposed on the lower heat-conducting connection base Top semiconductor cooling sheet The bottom surface of the semiconductor refrigerating sheet is attached with an upper heat-conducting connection base, and the upper surface of the upper heat-conducting connection base and the lower bottom surface of the lower heat-conducting connection base are respectively fastened Heat sink parts.
  • the upper end opening of the hollow heat insulating table is further provided with a fixing component for fixing the semiconductor refrigeration sheet, and an outer side wall of the semiconductor cooling sheet is matched with an inner side wall of the upper end opening of the hollow heat insulating table.
  • the outer sidewall of the periphery of the semiconductor refrigeration chip is provided with a card slot for engaging with the fixing component.
  • the fixing assembly includes a fixing member and a movable member, the fixing member has a U shape, and the inner side wall is provided with a protrusion that is engaged with the card slot, and the movable member and the power supply line of the semiconductor refrigeration chip The card slots on one side are engaged and fastened to the end faces of the hollow insulating table.
  • the lower thermally conductive connection base includes a base and a boss disposed on a top of the base, and a sidewall of the boss is in an interference fit with the through hole and an inner sidewall of the hollow heat insulation.
  • a pinch assembly for compressing the upper thermally conductive connection base and the lower thermally conductive connection base, and a support assembly for preventing the semiconductor refrigeration sheet from fracturing.
  • the pressing assembly comprises a U-shaped bolt and a pressing plate matched with the U-shaped bolt, and the bottom of the pressing plate is provided with an elastic pressing piece.
  • the support assembly includes a plurality of positioning support pressure limiting screws disposed between the rigid insulating and heat insulating substrate and the upper heat conductive connection base and the lower heat conductive connection base, and two ends of the positioning support pressure limiting screw A threaded nut, the nut including a first nut for supporting and/or a second nut for locking.
  • the heat sink member is a heat sink provided with a vent hole and a ventilation groove at the bottom.
  • the present invention comprises a rigid insulating and heat insulating substrate, wherein the hard insulating and heat insulating substrate is provided with a through hole, and the upper and lower end faces of the through hole are respectively provided with a hollow heat insulating table and a lower heat conduction Connecting the base, the lower heat-conducting connection base is provided with a boss penetrating the through hole and cooperating with the cavity of the hollow heat insulation table, and the top surface of the boss is disposed on the hollow partition
  • the bottom surface of the semiconductor refrigerating sheet on the top of the hot stage is attached, and the top surface of the semiconductor refrigerating sheet is attached with an upper heat-conducting connection base, and the upper surface of the upper heat-conducting connection base and the lower heat-conducting connection base Several pieces are fastened on the bottom surface Radiator parts.
  • the arrangement of the hollow insulating table and the boss on the lower heat-conducting connection base enables the heat radiated from the heat source to be concentrated and distributed through the semiconductor refrigeration sheet and the heat sink member disposed on the hollow heat insulating table, thereby effectively preventing dust and
  • the arrangement of the rigid insulating and heat-insulating substrate facilitates the installation of the heat sink and effectively separates the cold surface and the hot surface of the semiconductor cooling sheet, thereby effectively improving the heat dissipation efficiency.
  • the invention has the advantages of simple structure, dustproof, no noise, stable and reliable heat dissipation, and easy installation.
  • FIG. 1 is a schematic structural view of a semiconductor heat sink according to the present invention.
  • FIG. 2 is a schematic structural view of the semiconductor refrigeration chip assembly of FIG. 1.
  • Figure 3 is a cross-sectional view of the AA section of Figure 2.
  • Hard insulating and insulating substrate 2. Hollow insulating platform, 3. Lower thermal connection base, 4. Semiconductor refrigeration chip assembly, 5. Semiconductor cooling plate, 6. Thermal connection base, 7. Radiator parts, 8. Fixing parts, 9. Moving parts, 1 0. U-bolt, 1 1. Pressing plate, 12. Elastic pressing piece, 1 3. Positioning support pressure limiting screw, 14. First nut, 1 5. Second nut.
  • a semiconductor heat sink includes a rigid insulating and heat insulating substrate 1 , wherein the hard insulating and heat insulating substrate 1 is provided with a through hole, and the upper and lower end faces of the through hole are respectively provided with a hollow insulating table 2 and a lower portion a heat-conducting connection base 3, the lower heat-conducting connection base 3 is provided with a boss penetrating the through-hole and cooperating with the cavity of the hollow heat insulation board 2, the top surface of the boss is disposed at The bottom surface of the semiconductor refrigerating sheet 5 at the top of the hollow heat insulating table 2 is attached to the bottom surface of the semiconductor refrigerating sheet 5, and the top surface of the semiconductor refrigerating sheet 5 is bonded with an upper heat conducting connecting base 6, and the upper surface of the upper heat conducting connecting base 6 and A plurality of heat sink members 7 are fastened to the lower bottom surface of the lower heat conductive connection base 3, respectively.
  • the bosses on the hollow heat insulation platform and the lower heat conduction connection base are arranged such that the boss penetrates the through hole and the inner side wall of the hollow heat insulation platform, and the gap around the through hole is sealed with the heat conductive glue, thereby effectively avoiding The dust falls in, at the same time, the hollow insulation table is set, which also makes the bottom of the boss hot.
  • the heat of the source is concentrated by the semiconductor refrigerating sheet and the heat sink member disposed on the hollow insulating table, thereby providing effective dustproof and concentrated heat dissipating effects, and the arrangement of the hard insulating and insulating substrate is convenient for the heat sink.
  • the cold surface and the hot surface of the semiconductor refrigeration chip are installed and effectively separated, thereby effectively improving the heat dissipation efficiency.
  • the invention has the advantages of simple structure, dustproof, no noise, stable and reliable heat dissipation, and easy installation.
  • a fixing assembly for fixing the semiconductor refrigerating sheet 5 is further disposed at an opening of the upper end of the hollow heat insulating table 2, and an outer side wall of the semiconductor refrigerating sheet 5 and an inner side wall at an upper end opening of the hollow heat insulating table 2 Match.
  • the outer side wall of the semiconductor refrigerating sheet 5 is interference-fitted with the inner wall of the hollow heat insulating table 2, thereby effectively preventing the entry of dust, and at the same time setting the fixing assembly, also for the semiconductor refrigerating sheet 5
  • the semiconductor refrigerating sheet 5 can also be directly embedded in the upper end opening of the hollow heat insulating table 2 to a certain protection and fixing effect.
  • a card slot for engaging with the fixing component is disposed on an outer sidewall of the periphery of the semiconductor refrigerating sheet 5.
  • the fixing component includes a fixing member 8 and a movable member 9.
  • the fixing member 8 has a U shape and the inner side wall is provided with a protrusion that is engaged with the card slot, and the movable member 9 and the semiconductor refrigerating sheet 5 are The card slot on the side of the power cord is engaged and fastened to the end surface of the hollow heat insulating table 2.
  • the movable member 9 can be fastened to the hollow heat insulating table 2 by means of a countersunk head self-tapping screw and a high temperature resistant super glue, thereby effectively fixing the semiconductor refrigeration sheet 5 firmly.
  • the heat is effectively transmitted, and the gap between the fixing component and the heat insulating table is sealed with high temperature resistant super glue, so that the cold and hot surface of the semiconductor refrigeration sheet 5 is thoroughly
  • the lower thermally conductive connection base 3 includes a base and a boss disposed on the top of the base, and the side wall of the boss has an interference fit with the through hole and the inner side wall of the hollow heat insulation board 2.
  • the boss penetrates the through hole and the top surface is in contact with the bottom surface of the semiconductor refrigerating sheet 5, and is effectively conducted by the lower heat conducting connection base 3 to the bottom heat source, and is fully isolated from the hot surface, thereby greatly improving heat dissipation. effectiveness.
  • a pressing assembly for pressing the upper thermally conductive connection base 6 and the lower thermally conductive connection base 3, and a support assembly for preventing the semiconductor refrigeration sheet 5 from being fractured.
  • the pressing assembly includes a U-bolt 10 and a pressing plate 11 that cooperates with the U-bolt 10.
  • the bottom of the pressing plate 11 is provided with an elastic pressing piece 12.
  • the elastic pressing piece can effectively adjust the heat dissipating parts The pressing force between the two, and effectively avoiding the pressing force is too large, causing the semiconductor refrigeration sheet to fracturing.
  • the support assembly includes a plurality of positioning support pressure limiting screws 13 disposed between the rigid insulating and thermally insulating substrate 1 and the upper thermally conductive connecting base 6 and the lower thermally conductive connecting base 3, and the positioning support is limited
  • the arrangement of the first nut 14 for supporting can effectively adjust the pressure of the upper thermal conductive connection base 6 and the lower thermal connection base 3 to the semiconductor refrigerating sheet 5, thereby effectively preventing the semiconductor refrigerating sheet 5 from being excessively pressurized.
  • the risk of fracturing, in addition, the arrangement of the structure also enables the components to be closely fitted and effectively integrated, which effectively ensures the reliability of the connection between the components of the semiconductor heat sink.
  • the heat sink member 7 is a heat sink provided with a vent hole and a ventilation groove at the bottom. This structure setting increases the heat dissipation area of the heat sink itself and the heat dissipation air flow, improving the heat dissipation performance of the heat sink.
  • the heat sink member can also be provided as a fanless heat sink with a heat pipe, which can further improve the heat dissipation efficiency without causing noise.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种半导体体散热器，包括：在硬质绝缘隔热基板（1）上的通孔的上下两端面分别设置的中空隔热台（2）和下导热连接基座（3），下导热连接基座上设置有贯穿通孔且与中空隔热台的腔体相配合的凸台，凸台的顶面与设置在中空隔热台顶部的半导体制冷片（5）的底面相贴合，半导体制冷片的顶面上贴有上导热连接基座（6）。具有防尘和集中散热的效果，并提升了散热效率。

Description

一种半导体散热器 本专利申请要求于 2014年 02月 15 日提交的、 申请号为 201410051343.0、 申请人为谷静一、发明名称为 "一种半导体散热器" 的中国专利申请的优先权， 该申请的全文以引用的方式并入本申请中。 技术领域
本发明涉及散热技术领域， 尤其涉及一种半导体散热器。
背景技术
现在流行的半导体散热器， 因为其结构和设计原理， 都存在不同程度的冷 热端隔热不好、 不利于隔尘、 不易于安装使用的缺陷。 在很多电子设备中， 由 于使用了多风扇等散热器件， 使得设备内部随着散热风而进入了大量的灰尘， 如不及时进行清理， 容易导致设备出现风道堵塞、 温度升高、 电路短路等等问 题， 进而导致高故障率， 造成或烧毁设备或突然停机等多种故障或事故， 而事 实上， 风扇等附属器件本身也可以视为故障源之一， 并且这些装有风扇的电子 设备在散热的同时还发出较大的噪音， 对许多需要无噪音的工作、 影音等等环 境造成不良影响。
发明内容
本发明的目的在于提供一种结构简单， 防尘， 无噪音， 散热稳定可靠， 易 于安装的半导体散热器。
为达此目的， 本发明釆用以下技术方案：
一种半导体散热器， 包括硬质绝缘隔热基板， 所述硬质绝缘隔热基板上设 置有通孔， 所述通孔的上下两端面上分别对应设置有中空隔热台和下导热连接 基座， 所述下导热连接基座上设置有贯穿所述通孔且与所述中空隔热台的腔体 相配合的凸台， 所述凸台的顶面与设置在所述中空隔热台顶部的半导体制冷片 的底面相贴合， 所述半导体制冷片的顶面贴合有上导热连接基座， 所述上导热 连接基座的上表面和所述下导热连接基座的下底面上分别紧固有若干个散热器 件。
其中， 所述中空隔热台的上端开口处还设置有用于固定所述半导体制冷片 的固定组件， 所述半导体制冷片的外侧壁与所述中空隔热台的上端开口处的内 侧壁相配合。
其中， 所述半导体制冷片四周的外侧壁上设置有用于和所述固定组件相卡 接的卡槽。
其中， 所述固定组件包括固定件和活动件， 所述固定件呈 U形且内侧壁设 置有与所述卡槽相卡接的凸起， 所述活动件与所述半导体制冷片的电源线一侧 的卡槽相卡接且与所述中空隔热台的端面紧固。
其中， 所述下导热连接基座包括基座和设置于所述基座顶部的凸台， 所述 凸台的侧壁与所述通孔和中空隔热台的内侧壁过盈配合。
还包括用于压紧上导热连接基座和下导热连接基座的压紧组件、 用于防止 所述半导体制冷片压裂的支撑组件。
其中， 所述压紧组件包括 U形螺栓和与所述 U形螺栓相配合的压板， 所述 压板的底部设置有弹性压片。
其中， 所述支撑组件包括若干个设置于所述硬质绝缘隔热基板与上导热连 接基座和下导热连接基座之间的定位支撑限压螺杆和与所述定位支撑限压螺杆 两端螺纹配合的螺帽， 所述螺帽包括用于起支撑作用的第一螺帽和 /或用于起锁 紧作用的第二螺帽。
其中， 所述散热器件为底部设置有通风孔和通风槽的散热片。
本发明的有益效果： 本发明包括硬质绝缘隔热基板， 所述硬质绝缘隔热基 板上设置有通孔， 所述通孔的上下两端面上分别对应设置有中空隔热台和下导 热连接基座， 所述下导热连接基座上设置有贯穿所述通孔且与所述中空隔热台 的腔体相配合的凸台， 所述凸台的顶面与设置在所述中空隔热台顶部的半导体 制冷片的底面相贴合， 所述半导体制冷片的顶面贴合有上导热连接基座， 所述 上导热连接基座的上表面和所述下导热连接基座的下底面上分别紧固有若干个 散热器件。 中空隔热台和下导热连接基座上的凸台的设置， 使得热源散出的热 量集中通过设置在中空隔热台上的半导体制冷片及其散热器件导出， 起到了的 有效的防尘和集中散热的效果， 硬质绝缘隔热基板的设置， 便于散热器的安装 且有效的将半导体制冷片的冷面和热面隔开， 进而有效提升了散热效率。 本发 明结构简单， 防尘， 无噪音， 散热稳定可靠， 易于安装。
附图说明
图 1是本发明一种半导体散热器的结构示意图。
图 2是图 1中半导体制冷片组件的结构示意图。
图 3是图 2中 AA截面的剖视图。
图中： 1. 硬质绝缘隔热基板、 2. 中空隔热台、 3. 下导热连接基座、 4. 半 导体制冷片组件、 5. 半导体制冷片、 6. 上导热连接基座、 7. 散热器件、 8. 固 定件、 9. 活动件、 1 0. U形螺栓、 1 1. 压板、 12. 弹性压片、 1 3. 定位支撑限 压螺杆、 14. 第一螺帽、 1 5. 第二螺帽。
具体实施方式
下面结合附图 1至附图 3并通过具体实施方式来进一步说明本发明的技术 方案。
一种半导体散热器， 包括硬质绝缘隔热基板 1 , 所述硬质绝缘隔热基板 1上 设置有通孔， 所述通孔的上下两端面上分别对应设置有中空隔热台 2 和下导热 连接基座 3, 所述下导热连接基座 3上设置有贯穿所述通孔且与所述中空隔热台 2的腔体相配合的凸台， 所述凸台的顶面与设置在所述中空隔热台 2顶部的半导 体制冷片 5的底面相贴合， 所述半导体制冷片 5的顶面贴合有上导热连接基座 6 , 所述上导热连接基座 6的上表面和所述下导热连接基座 3的下底面上分别紧 固有若干个散热器件 7。 中空隔热台和下导热连接基座上的凸台的设置， 使得凸 台贯穿通孔与中空隔热台的内侧壁贴合， 同时将通孔四周的缝隙用导热胶封 严， 进而有效避免灰尘的落入， 同时， 中空隔热台的设置， 也使得凸台底部热 源的热量集中通过设置在中空隔热台上的半导体制冷片及其散热器件导出， 因 而， 起到了的有效的防尘和集中散热的效果， 硬质绝缘隔热基板的设置， 便于 散热器的安装且有效的将半导体制冷片的冷面和热面隔开， 进而有效提升了散 热效率。 本发明结构简单， 防尘， 无噪音， 散热稳定可靠， 易于安装。
所述中空隔热台 2的上端开口处还设置有用于固定所述半导体制冷片 5的 固定组件， 所述半导体制冷片 5的外侧壁与所述中空隔热台 2的上端开口处的 内侧壁相配合。 为保证热量的有效传导， 半导体制冷片 5 的外侧壁与所述中空 隔热台 2 的内壁过盈配合， 进而也有效的防止灰尘的进入， 同时固定组件的设 置， 对半导体制冷片 5 也起到一定的保护和固定作用， 也可以直接将半导体制 冷片 5直接嵌入到中空隔热台 2的上端开口处。
所述半导体制冷片 5 四周的外侧壁上设置有用于和所述固定组件相卡接的 卡槽。
所述固定组件包括固定件 8和活动件 9, 所述固定件 8呈 U形且内侧壁设置 有与所述卡槽相卡接的凸起， 所述活动件 9与所述半导体制冷片 5的电源线一 侧的卡槽相卡接且与所述中空隔热台 2的端面紧固。 活动件 9可以用沉头自攻 螺丝和耐高温强力胶紧固在中空隔热台 2上， 从而有效的将半导体制冷片 5牢 牢的固定。 为保证良好的防尘和隔热效果， 有效的将热量进行传导， 需用耐高 温强力胶将固定组件与隔热台之间的缝隙封严， 使得对半导体制冷片 5 的冷热 面进行彻底的隔离， 同时由于半导体制冷片 5的热面瓷片突出固定件 8的上平 面， 对保持半导体制冷片与散热部件的紧密结合十分有利。
所述下导热连接基座 3 包括基座和设置于所述基座顶部的凸台， 所述凸台 的侧壁与所述通孔和中空隔热台 2 的内侧壁过盈配合。 凸台贯穿通孔且顶面与 所述半导体制冷片 5的底面相贴合， 通过下导热连接基座 3有效的与底部热源 进行传导， 同时， 与热面充分隔离， 极大的提高了散热效率。
还包括用于压紧上导热连接基座 6和下导热连接基座 3的压紧组件、 用于 防止所述半导体制冷片 5压裂的支撑组件。
所述压紧组件包括 U形螺栓 10和与所述 U形螺栓 10相配合的压板 11 , 所 述压板 11的底部设置有弹性压片 12。弹性压片的设置能够有效调节各散热件之 间的压紧力， 且有效避免压紧力过大而造成半导体制冷片压裂。
所述支撑组件包括若干个设置于所述硬质绝缘隔热基板 1 与上导热连接基 座 6和下导热连接基座 3之间的定位支撑限压螺杆 1 3和与所述定位支撑限压螺 杆 1 3两端螺纹配合的螺帽， 所述螺帽包括用于起支撑作用的第一螺帽 14和 /或 用于起锁紧作用的第二螺帽 15。 用于起支撑作用的第一螺帽 14的设置， 能够有 效调整上导热连接基座 6和下导热连接基座 3对半导体制冷片 5的压力， 从而 有效的避免半导体制冷片 5 因压力过大而压裂的风险， 此外， 此结构的设置， 也使得各部件之间紧密贴合且有效形成一体， 有效的保证了半导体散热器各部 件之间的连接的可靠性。
所述散热器件 7 为底部设置有通风孔和通风槽的散热片。 此结构设置， 增 加了散热片本身的散热面积和散热空气流量， 改善了散热片的散热性能。 所述 散热器件也可以设置为带有热管的无风扇散热器， 能够进一步的提升散热效 率， 且不会带来噪音。
以上结合具体实施例描述了本发明的技术原理。 这些描述只是为了解释本 发明的原理， 而不能以任何方式解释为对本发明保护范围的限制。 基于此处的 解释， 本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具 体实施方式， 这些方式都将落入本发明的保护范围之内。

Claims

权 利 要 求 书
1.一种半导体散热器， 其特征在于， 包括硬质绝缘隔热基板（1) , 所述硬质 绝缘隔热基板（1)上设置有通孔， 所述通孔的上下两端面上分别对应设置有中空 隔热台（2)和下导热连接基座（3) , 所述下导热连接基座（3)上设置有贯穿所述通 孔且与所述中空隔热台 （2 ) 的腔体相配合的凸台， 所述凸台的顶面与设置在所 述中空隔热台（2)顶部的半导体制冷片（5)的底面相贴合， 所述半导体制冷片（5) 的顶面贴合有上导热连接基座（6) , 所述上导热连接基座（6)的上表面和所述下 导热连接基座（3)的下底面上分别紧固有若干个散热器件（7) 。
2.根据权利要求 1 所述的一种半导体散热器， 其特征在于， 所述中空隔热 台（2)的上端开口处还设置有用于固定所述半导体制冷片 （ 5 ) 的固定组件， 所 述半导体制冷片（5)的外侧壁与所述中空隔热台（2)的上端开口处的内侧壁相配 合。
3.根据权利要求 2 所述的一种半导体散热器， 其特征在于， 所述半导体制 冷片（5)四周的外侧壁上设置有用于和所述固定组件相卡接的卡槽。
4.根据权利要求 3 所述的一种半导体散热器， 其特征在于， 所述固定组件 包括固定件 （8 ) 和活动件 （9 ), 所述固定件（8 ) 呈 U形且内侧壁设置有与所 述卡槽相卡接的凸起， 所述活动件 （9 ) 与所述半导体制冷片（5)的电源线一侧 的卡槽相卡接且与所述中空隔热台（2)的端面紧固。
5.根据权利要求 1 所述的一种半导体散热器， 其特征在于， 所述下导热连 接基座（3)包括基座和设置于所述基座顶部的凸台， 所述凸台的侧壁与所述通孔 和中空隔热台 （ 2 ) 的内侧壁过盈配合。
6.根据权利要求 1 所述的一种半导体散热器， 其特征在于， 还包括用于压 紧上导热连接基座（6)和下导热连接基座（3)的压紧组件、 用于防止所述半导体 制冷片（5)压裂的支撑组件。
7.根据权利要求 6 所述的一种半导体散热器， 其特征在于， 所述压紧组件 包括 U形螺栓（ 10 )和与所述 U形螺栓（ 1 0 )相配合的压板（1 1 )，所述压板（11 ) 的底部设置有弹性压片 （12 )。
8.根据权利要求 Ί 所述的一种半导体散热器， 其特征在于， 所述支撑组件 包括若干个设置于所述硬质绝缘隔热基板（1)与上导热连接基座（6)和下导热连 接基座（3)之间的定位支撑限压螺杆（13)和与所述定位支撑限压螺杆（13) 两 端螺纹配合的螺帽， 所述螺帽包括用于起支撑作用的第一螺帽（14)和 /或用于 起锁紧作用的第二螺帽 （15)。
9.根据权利要求 1 所述的一种半导体散热器， 其特征在于， 所述散热器件 (7)为底部设置有通风孔和通风槽的散热片。
PCT/CN2014/076369 2014-02-15 2014-04-28 一种半导体散热器 WO2015120664A1 (zh)

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CN102086994A (zh) * 2010-09-29 2011-06-08 邓树兴 采用半导体致冷装置的led路灯

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