WO2015118972A1 - Imprint apparatus, imprint method, and article manufacturing method - Google Patents

Imprint apparatus, imprint method, and article manufacturing method Download PDF

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Publication number
WO2015118972A1
WO2015118972A1 PCT/JP2015/051947 JP2015051947W WO2015118972A1 WO 2015118972 A1 WO2015118972 A1 WO 2015118972A1 JP 2015051947 W JP2015051947 W JP 2015051947W WO 2015118972 A1 WO2015118972 A1 WO 2015118972A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
substrate
stage
imprint
imprint material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/051947
Other languages
English (en)
French (fr)
Inventor
Tosiya Asano
Noriyasu Hasegawa
Yosuke Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to US15/106,900 priority Critical patent/US20160320697A1/en
Priority to KR1020167023508A priority patent/KR101855606B1/ko
Publication of WO2015118972A1 publication Critical patent/WO2015118972A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Definitions

  • the present invention relates to an imprint apparatus, an imprint method, and an article
  • a gap between a mold and a substrate at the time of imprinting is 1 ⁇ or less.
  • a resin which fills this gap has
  • Fig. 3 is a graph for explaining the characteristic of a force acting on a portion between the mold and the substrate of the imprint apparatus according to a conventional technique
  • Fig. 4 is a graph for explaining the characteristic of a force acting on a portion between the mold and the substrate of an imprint apparatus according to the second embodiment
  • Fig. 5 is a side view in the vicinity of a mold of an imprint apparatus according to the third embodiment.
  • Fig. 6 is a view showing the mold of the imprint apparatus according to the third embodiment viewed from the lower side.
  • Fig. 1 shows the overview of an imprint apparatus according to the first embodiment
  • a main body 1 of the imprint apparatus is arranged on floor through an anti-vibration mechanism 2 with three or four legs each using an air spring or the like.
  • a substrate (wafer) 3 is held on a substrate stage (wafer stage) 4 by a wafer chuck (not shown) .
  • the wafer stage 4 has a stroke in an X direction and a Y direction enough to be able to perform an imprint process on the entire surface of the wafer 3 and move the wafer 3 to an exchange position where loading/unloading is
  • manufacturing method can include, instead of the etching step, another processing step of processing the substrate onto which the pattern has been transferred.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Mechanical Engineering (AREA)
  • Multimedia (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PCT/JP2015/051947 2014-02-04 2015-01-20 Imprint apparatus, imprint method, and article manufacturing method Ceased WO2015118972A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/106,900 US20160320697A1 (en) 2014-02-04 2015-01-20 Imprint apparatus, imprint method, and article manufacturing method
KR1020167023508A KR101855606B1 (ko) 2014-02-04 2015-01-20 임프린트 장치, 임프린트 방법 및 물품의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014019767A JP6294686B2 (ja) 2014-02-04 2014-02-04 インプリント装置、インプリント方法及び物品の製造方法
JP2014-019767 2014-02-04

Publications (1)

Publication Number Publication Date
WO2015118972A1 true WO2015118972A1 (en) 2015-08-13

Family

ID=53777779

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/051947 Ceased WO2015118972A1 (en) 2014-02-04 2015-01-20 Imprint apparatus, imprint method, and article manufacturing method

Country Status (4)

Country Link
US (1) US20160320697A1 (enExample)
JP (1) JP6294686B2 (enExample)
KR (1) KR101855606B1 (enExample)
WO (1) WO2015118972A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9851645B2 (en) * 2013-12-06 2017-12-26 Ev Group E. Thallner Gmbh Device and method for aligning substrates
JP6955344B2 (ja) 2017-02-20 2021-10-27 キヤノン株式会社 インプリント装置、および物品製造方法
US20180253000A1 (en) * 2017-03-06 2018-09-06 Canon Kabushiki Kaisha Pattern forming method, imprint apparatus, manufacturing method and mixing method
JP6882103B2 (ja) * 2017-07-04 2021-06-02 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7060961B2 (ja) * 2018-01-05 2022-04-27 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7134717B2 (ja) * 2018-05-31 2022-09-12 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
CN109164676A (zh) * 2018-10-31 2019-01-08 京东方科技集团股份有限公司 压印模板和压印方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288811A (ja) * 2003-03-20 2004-10-14 Hitachi Ltd ナノプリント装置、及び微細構造転写方法
US20060243761A1 (en) * 2005-04-28 2006-11-02 Toshiba Kikai Kabushiki Kaisha Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus
WO2007116469A1 (ja) * 2006-03-31 2007-10-18 Fujitsu Limited パターン転写方法およびパターン転写装置
US20080093339A1 (en) * 2006-06-09 2008-04-24 Kazuyuki Kasumi Processing apparatus and device manufacturing method
JP2010076300A (ja) * 2008-09-26 2010-04-08 Canon Inc 加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050270516A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. System for magnification and distortion correction during nano-scale manufacturing
US7630067B2 (en) * 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
JP4732801B2 (ja) * 2005-05-25 2011-07-27 東芝機械株式会社 ジンバル機構を備えた転写装置及び同装置を用いた転写方法
JP2007081070A (ja) 2005-09-14 2007-03-29 Canon Inc 加工装置及び方法
JP5072247B2 (ja) 2006-03-27 2012-11-14 キヤノン株式会社 リソグラフィ装置及び方法、並びに、デバイス製造方法
JP5371349B2 (ja) * 2008-09-19 2013-12-18 キヤノン株式会社 インプリント装置、および物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288811A (ja) * 2003-03-20 2004-10-14 Hitachi Ltd ナノプリント装置、及び微細構造転写方法
US20060243761A1 (en) * 2005-04-28 2006-11-02 Toshiba Kikai Kabushiki Kaisha Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus
WO2007116469A1 (ja) * 2006-03-31 2007-10-18 Fujitsu Limited パターン転写方法およびパターン転写装置
US20080093339A1 (en) * 2006-06-09 2008-04-24 Kazuyuki Kasumi Processing apparatus and device manufacturing method
JP2010076300A (ja) * 2008-09-26 2010-04-08 Canon Inc 加工装置

Also Published As

Publication number Publication date
JP2015149315A (ja) 2015-08-20
KR20160113689A (ko) 2016-09-30
US20160320697A1 (en) 2016-11-03
JP6294686B2 (ja) 2018-03-14
KR101855606B1 (ko) 2018-05-04

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