WO2015116123A2 - Surface treatments of metal substrates - Google Patents
Surface treatments of metal substrates Download PDFInfo
- Publication number
- WO2015116123A2 WO2015116123A2 PCT/US2014/013982 US2014013982W WO2015116123A2 WO 2015116123 A2 WO2015116123 A2 WO 2015116123A2 US 2014013982 W US2014013982 W US 2014013982W WO 2015116123 A2 WO2015116123 A2 WO 2015116123A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- metal layer
- casing
- spraying
- substrate
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 70
- 239000002184 metal Substances 0.000 title claims abstract description 70
- 239000000758 substrate Substances 0.000 title claims abstract description 40
- 238000004381 surface treatment Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 54
- 239000007921 spray Substances 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 13
- 229910052749 magnesium Inorganic materials 0.000 claims description 13
- 239000011777 magnesium Substances 0.000 claims description 13
- 238000011282 treatment Methods 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 239000002923 metal particle Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 238000010284 wire arc spraying Methods 0.000 claims description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 238000007743 anodising Methods 0.000 claims description 4
- 238000001652 electrophoretic deposition Methods 0.000 claims description 4
- 238000007749 high velocity oxygen fuel spraying Methods 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 238000007745 plasma electrolytic oxidation reaction Methods 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 238000010283 detonation spraying Methods 0.000 claims description 3
- 238000010285 flame spraying Methods 0.000 claims description 3
- 238000007750 plasma spraying Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 150000002739 metals Chemical class 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229910000861 Mg alloy Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010288 cold spraying Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000003380 propellant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010119 thixomolding Methods 0.000 description 1
- 238000010287 warm spraying Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/126—Detonation spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/129—Flame spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/131—Wire arc spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/18—After-treatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/026—Anodisation with spark discharge
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/20—Pretreatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
Definitions
- Devices such as mobile phones, tablets and portable (e. laptop or palm) computers are generally provided with a casing.
- This casing typically provides a number of functions features, for example protecting the device from damage.
- Figure 1 is a flow diagram illustrating an example of a method of treating a metal substrate
- Figure 2 is a flow diagram illustrating another example of a method of treating a metal substrate
- Figure 3 is a sectional side view of an example of applying a metal layer on a metal substrate using wire arc spraying
- Figure 4 is a sectional side view of an example of a metal substrate following the thermal spray process of Figure 1 or Figure 2
- Figure 5 is a sectional side view of a metal substrate following the electrochemical treatment of Figure 1 or Figure 2
- Figure 6 is a partially cut away perspective view of a casing after the thermal spray process of Figure 1 or Figure 2
- Figure 7 is a perspective view of the casing of Figure 6 after electrochemical treatment
- the present disclosure describes a method of treating- the surface of a metal substrate, for example the metal surface of a casing for a device.
- the method comprises forming a metal layer on the substrate using a thermal spray process followed by an electrochemical treatment to the metal la er to provide desired physical and aesthetic properties.
- thermal spray processes to apply a metal layer on the surface of the metal substrate can enhance the adhesion of the metal layer to the metal substrate when compared to application of metal oxides by thermal spray processes due to the relative smaller size of the metal to its oxide, therefore better filling- of the pores of the metal substrate.
- This in turn can result in a more visually appealing product for highly porous metal substrates such as magnesium and its alloys, where multiple surface coatings can be required, resulting surfaces that are aesthetically undesirable, for example the coating looking cheap and "painted on” ,
- Figures 1 and 2 illustrate examples of methods of surface treating a metal substrate.
- a metal substrate is provided ( 110 ⁇ .
- the metal substrate may be in the form of a casing for a device ( 1 80 ) as shown, for example, in Figure 6 .
- the casing ( 180 ) can be formed using methods such as stamping, moulding, die-casting, thixo-molding or rolling into the desired shape of the finished, product.
- the casing is formed of, for example, aluminium, magnesium, titanium, niobium, lithium, zinc or alloys thereof.
- the metal substrate ( 1 50 ) may be magnesium or its alloys.
- Use of magnesium in industry is typically limited due to a number of undesirable properties such as its high reactivity, tendency towards being corroded, high- temperature creep properties and flarnmability .
- Certain magnesium alloys can also provide further undesirable
- magnesium alloys including iron, nickel, copper and./or cobalt increase tendency for the
- magnesium is a strong, light weight and low- density metal. These are particularly desirable properties for casings of electronic devices. Furthermore, although magnesium can be significantly more expensive than other light metals, casting and other formation processes are easier, more economical a.nd faster with, magnesium t.ha.n for other light metals, for example aluminium. [0018] Although, as noted above, certain magnesium alloys produce undesirable properties, the addition of small amounts of aluminium, zinc and/or manganese can positively alter the physical properties of magnesium. For example, the addition of manganese can increase corrosion resistance, while the addition of aluminium and. zinc promote precipitation
- the metal substrate (150) is then treated using a thermal spray process (120) to form a metal layer (160) on the substrate (150) such as that shown in the cross- sect ion of Figure 4.
- Thermal spray processes are processes in which melted or heated materials are sprayed onto a surface.
- the feedstock may be heated by electrical (plasma or arc) or chemical (combustion flame) means.
- Thermal spray processes can provide thick layers of the feedstock over a large area, at high deposition rates as compared to other processes such as electroplating, physical and chemical vapour deposition.
- the feedstock materials are fed in powder or wire form, heated to a molten or semi-molten state and. accelerated towards the substrate in the form of particles, the particles typically sized from 3-200nm .
- a propelling fluid source such as compressed air for delivering a propelling fluid to an arc point, propelling molten metal particle created at the arc point of the two wires on to the substrate.
- the arc point is the location at. which the wires come into contact an electrically arc based on their opposing electrical currents.
- the molten metal particle are created at the arc point which is then transmitted to the surface by the propelling gas.
- a directional nozzle may also be included to more accurately direct the molten metal onto the metal substrate.
- wire arc spraying an example of which is shown in Figure 3.
- two consumable metal wires 200 ⁇ are fed through respective wire guides (210) .
- These wires 200, 205) are oppositely charged and. at. the point the wires come into contact, the arc point (220), producing an electrical arc based on their opposing electrical currents.
- a propellant for example a gas stream (240) provided by a compressed gas source.
- directional nozzle (250) may also be used to more accurately direct the molten metal particles (230) on to the metal substrate (150) .
- feedstocks currently used for providing a metal finish to a substrate are typically metal oxides in order to provide certain physical and aesthetic properties to the substrate being treated.
- metal oxides have a significantly higher melting point when compared to their pure metals, for example aluminium has a melting point of around 660 °C whereas aluminium oxide (AI 2 O 3 ) has a melting point of 2, 072°C.
- AI 2 O 3 aluminium oxide
- significantly lower energy requirements are needed to produce molten metal required for thermal spray processes as compared to the energy requirements for metal oxides .
- spray coating- techniques using metals can be suitable for more reactive light metals such as magnesium which present a fire hazard and. may burn when exposed to high temperatures .
- the resulting metal layer applied by thermal spray processes better adheres to the porous metal substrate when compared to metal oxides .applied by the same process due to the metal particles being smaller and therefore providing increased surface area of contact betv/een the metal .applied by the thermal spray process and the porous metal substrate.
- treatments include anodizing, micro-arc oxidation and
- Properties of the electrochemically formed second layer or coating (170) such as porosity, hardness, colour, conductivity, wear resistance, corrosion resistance, thickness and adherence can be varied by varying the parameters of the electrochemical treatment.
- parameters include: the type of process used (e.g. anodizing, micro-arc oxidation or electrophoretic deposition) ; the chemical solution in which the treatment occurs (e.g. temperature and composition); the potential (e.g. pulse or continuous, direct current or
- the treated substrate may undergo a baking process (140) to set the layer formed by the electrochemical treatment
- This baking process is typically undertaken in an oven at a temperature of not less than 120 °C, not exceeding 180°C and, more particu.1a.r1y, at about 170 °C .
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Coating By Spraying Or Casting (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
A method is provided for treating a metal substrate. The method comprises applying a metal layer to the substrate using a thermal spray process and electrochemically treating the metal layer to form a coating.
Description
SURFACE TREATMENTS OF METAL SUBSTRATES
Background
[0001 ] Devices such as mobile phones, tablets and portable (e. laptop or palm) computers are generally provided with a casing. This casing typically provides a number of functions features, for example protecting the device from damage.
[0002] Increasingly, consumers are also interested in the aesthetic properties of the casing. Furthermore, as devices such as mobile phones, tablets and portable computers are typically designed for hand held functionality, consumers als consider the weight of the device.
[0003] By way of non-limiting examples, device casings and processes of manufacturing such casings according to the present disclosure will be described with reference to the following drawings in which
[0004] Figure 1 is a flow diagram illustrating an example of a method of treating a metal substrate
[0005] Figure 2 is a flow diagram illustrating another example of a method of treating a metal substrate
[0006] Figure 3 is a sectional side view of an example of applying a metal layer on a metal substrate using wire arc spraying
[0007] Figure 4 is a sectional side view of an example of a metal substrate following the thermal spray process of Figure 1 or Figure 2
[0008] Figure 5 is a sectional side view of a metal substrate following the electrochemical treatment of Figure 1 or Figure 2
[0009] Figure 6 is a partially cut away perspective view of a casing after the thermal spray process of Figure 1 or Figure 2
[0010] Figure 7 is a perspective view of the casing of Figure 6 after electrochemical treatment
Detailed Descri ion
[0011] The present disclosure describes a method of treating- the surface of a metal substrate, for example the metal surface of a casing for a device. The method comprises forming a metal layer on the substrate using a thermal spray process followed by an electrochemical treatment to the metal la er to provide desired physical and aesthetic properties.
[0012] The use of thermal spray processes to apply a metal layer on the surface of the metal substrate can enhance the adhesion of the metal layer to the metal substrate when compared to application of metal oxides by thermal spray processes due to the relative smaller size of the metal to its oxide, therefore better filling- of the pores of the metal substrate. This in turn can result in a more visually appealing product for highly porous metal substrates such as magnesium and its alloys, where multiple surface coatings can be required, resulting surfaces that are aesthetically undesirable, for example the coating looking cheap and "painted on" ,
[0013] Furthermore, due to the substantially lower melting point of metals as compared to their oxides, energy requirements to perform the thermal spray process can be greatly reduced. The relatively lower melting point also makes thermal spray
processes possible for highly reactive, light metals that can burn when exposed to high temperatures.
[0014] Figures 1 and 2 illustrate examples of methods of surface treating a metal substrate.
[0015] Referring to Figure 1 , a metal substrate is provided ( 110 } . The metal substrate may be in the form of a casing for a device ( 1 80 ) as shown, for example, in Figure 6 . The casing ( 180 ) can be formed using methods such as stamping, moulding, die-casting, thixo-molding or rolling into the desired shape of the finished, product. In one example, the casing is formed of, for example, aluminium, magnesium, titanium, niobium, lithium, zinc or alloys thereof.
[0016] For example, the metal substrate ( 1 50 ) may be magnesium or its alloys. Use of magnesium in industry is typically limited due to a number of undesirable properties such as its high reactivity, tendency towards being corroded, high- temperature creep properties and flarnmability . Certain magnesium alloys can also provide further undesirable
properties, for example magnesium alloys including iron, nickel, copper and./or cobalt increase tendency for the
corrosion of the magnesium in the alloy.
[0017] However, magnesium is a strong, light weight and low- density metal. These are particularly desirable properties for casings of electronic devices. Furthermore, although magnesium can be significantly more expensive than other light metals, casting and other formation processes are easier, more economical a.nd faster with, magnesium t.ha.n for other light metals, for example aluminium.
[0018] Although, as noted above, certain magnesium alloys produce undesirable properties, the addition of small amounts of aluminium, zinc and/or manganese can positively alter the physical properties of magnesium. For example, the addition of manganese can increase corrosion resistance, while the addition of aluminium and. zinc promote precipitation
hardening, resulting- in an alloy with a strength-to-weight ratio comparable to those of certain aluminium alloys and alloy steels. However, as discussed above, working and shaping the magnesium alloy is easier, more economical and faster than these alloys of comparable strength-to-weight ratio .
[0019] As seen in Figures 1 and 2, following the provision (110} of the metal substrate (150), the metal substrate (150) is then treated using a thermal spray process (120) to form a metal layer (160) on the substrate (150) such as that shown in the cross- sect ion of Figure 4.
[0020] Thermal spray processes (120) are processes in which melted or heated materials are sprayed onto a surface. The feedstock may be heated by electrical (plasma or arc) or chemical (combustion flame) means.
[0021] Thermal spray processes can provide thick layers of the feedstock over a large area, at high deposition rates as compared to other processes such as electroplating, physical and chemical vapour deposition. In thermal spray processes, the feedstock materials are fed in powder or wire form, heated to a molten or semi-molten state and. accelerated towards the substrate in the form of particles, the particles typically sized from 3-200nm .
[0022] A propelling fluid source such as compressed air for delivering a propelling fluid to an arc point, propelling molten metal particle created at the arc point of the two wires on to the substrate. The arc point is the location at. which the wires come into contact an electrically arc based on their opposing electrical currents. The molten metal particle are created at the arc point which is then transmitted to the surface by the propelling gas. A directional nozzle may also be included to more accurately direct the molten metal onto the metal substrate.
[0023] One example of a thermal spray process is wire arc spraying, an example of which is shown in Figure 3. In wire arc spraying, two consumable metal wires (200} are fed through respective wire guides (210) . These wires (200, 205) are oppositely charged and. at. the point the wires come into contact, the arc point (220), producing an electrical arc based on their opposing electrical currents. The heat
generated by this arc melts the incoming wires (200, 205), forming molten metal particles (230) .
[0024] In order to transmit the molten metal particles (230) onto the substrate, a propellant is used, for example a gas stream (240) provided by a compressed gas source. A
directional nozzle (250) may also be used to more accurately direct the molten metal particles (230) on to the metal substrate (150) .
[0025] Other methods of thermal spray processes that may be used include plasma spraying, detonation spraying, flame spraying, high velocity oxy-fuel coating spraying (HVOF) , warm spraying and cold spraying. The thickness of the metal layer formed by the thermal spray process may be in the order of l-1000'am, and in particular 5-50μιη.
[0026] Feedstocks currently used for providing a metal finish to a substrate are typically metal oxides in order to provide certain physical and aesthetic properties to the substrate being treated. However, metal oxides have a significantly higher melting point when compared to their pure metals, for example aluminium has a melting point of around 660 °C whereas aluminium oxide (AI2O3) has a melting point of 2, 072°C. As a result, significantly lower energy requirements are needed to produce molten metal required for thermal spray processes as compared to the energy requirements for metal oxides .
[0027] In addition, as a result of the lower temperatures of molten metals as compared to molten metal oxides, spray coating- techniques using metals can be suitable for more reactive light metals such as magnesium which present a fire hazard and. may burn when exposed to high temperatures .
[0028] Furthermore, the resulting metal layer applied by thermal spray processes better adheres to the porous metal substrate when compared to metal oxides .applied by the same process due to the metal particles being smaller and therefore providing increased surface area of contact betv/een the metal .applied by the thermal spray process and the porous metal substrate.
[0029] As shown in Figures 1 and 2, following the application of a metal layer on the substrate by a thermal spray process (120), the metal layer (160) undergoes an electrochemical treatment to form a. second layer or coating (170), as shown in Figures 5 and 8. Examples of possible electrochemical
treatments include anodizing, micro-arc oxidation and
electrophoretic deposition .
[0030] Properties of the electrochemically formed second layer or coating (170) such as porosity, hardness, colour,
conductivity, wear resistance, corrosion resistance, thickness and adherence can be varied by varying the parameters of the electrochemical treatment. Such parameters include: the type of process used (e.g. anodizing, micro-arc oxidation or electrophoretic deposition) ; the chemical solution in which the treatment occurs (e.g. temperature and composition); the potential (e.g. pulse or continuous, direct current or
alternating current, frequency, duration and voltage) and the processing time.
[0031] As shown in Figure 2, following electrochemical treatment (130) the treated substrate may undergo a baking process (140) to set the layer formed by the electrochemical treatment
(150) . This baking process is typically undertaken in an oven at a temperature of not less than 120 °C, not exceeding 180°C and, more particu.1a.r1y, at about 170 °C .
[0032] It. will be appreciated that numerous variations and/or modif cations may be made to the above-described embodiments, without departing from the broad general scope of the present- disclosure. The present embodiments are, therefore, to be considered in all respects as illustrative and not
restrictive .
Claims
1. A method of treating a metal substrate to form, a coating, the method comprising
applying a metal layer on the substrate, the metal layer applied by a thermal spray process, and
electrochemica11y treating the meta1 1ayer.
2. A method according to claim 1, wherein the metal substrate comprises aluminium, magnesium, titanium, niobium, lithium, zinc or alloys thereof,
3. A method according to claim 1, wherein the thermal spray process comprises one of plasma spraying, detonation spraying, wire arc spraying, flame spraying or high velocity oxy-fuel coating spraying .
4. A method according to claim 1, wherein after
electrochemically treating the metal layer, baking the substrate .
5. A method according to claim 1, wherein electrochemically treating the metal layer comprises anodizing, micro-arc oxidation or electrophoretic deposition.
6. A method of applying a. coating to a casing for a device, the method comprising
heating a metal feedstock to form molten metal particles, accelerating the molten metal particles towards the casing to form a metal layer on the casing, and
electrochem.ica.lly treating the metal layer.
7. A method according to claim 6 wherein the metal feedstock is in powder or wire form.
8 , A method according to claim 6 wherein heating the metal feedstock is achieved by electrical or chemical means.
9. A method according to claim. 6, wherein the metal casing is formed of aluminium, magnesium, titanium, niobium, lithium, zinc or alloys thereof.
10. A method according to claim 6, wherein the metal layer has a thickness of 5-50p.m.
11. A method according to claim. 6, wherein the molten metal particles have a diameter of 3-200nm.
12. A casing for a device having a coating, the casing comprising
a metal substrate,
a first metal layer on the metal substrate, the first metal layer applied by a thermal spray process, and
a second layer formed by electrochemical treatment of the first metal layer.
13. A casing according to claim 11, wherein the metal
substrate comprises aluminium, magnesium, titanium, niobium, lithium, zinc or alloys thereof.
14. A casing according to claim 11, wherein the thermal spray process comprises one of plasma spraying, detonation spraying, wire arc spraying, flame spraying or high velocity oxy-fuel coating spraying.
15. A casing according to claim 1, wherein electrochemically treating the metal layer comprises anodizing, electrophoretic deposition or micro-arc oxidation.
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PCT/US2014/013982 WO2015116123A2 (en) | 2014-01-31 | 2014-01-31 | Surface treatments of metal substrates |
US15/105,416 US20160326624A1 (en) | 2014-01-31 | 2014-01-31 | Surface Treatments of Metal Substrates |
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CN106086987A (en) * | 2016-06-01 | 2016-11-09 | 努比亚技术有限公司 | The processing method of terminal aluminium shell |
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CN112609145A (en) * | 2019-09-19 | 2021-04-06 | 浙江苏泊尔股份有限公司 | Cookware and manufacturing method thereof |
CN114182193B (en) * | 2021-10-30 | 2023-08-11 | 贵州通用航空有限责任公司 | Protective layer for light aircraft propeller and manufacturing method thereof |
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TW197475B (en) * | 1990-12-26 | 1993-01-01 | Eltech Systems Corp | |
US6469741B2 (en) * | 1993-07-26 | 2002-10-22 | Pixel Instruments Corp. | Apparatus and method for processing television signals |
US5609922A (en) * | 1994-12-05 | 1997-03-11 | Mcdonald; Robert R. | Method of manufacturing molds, dies or forming tools having a cavity formed by thermal spraying |
US5814451A (en) * | 1997-01-17 | 1998-09-29 | Incyte Pharmaceuticals, Inc. | Subunits of NADH dehydrogenase |
JP2003258442A (en) * | 2002-01-23 | 2003-09-12 | Hon Hai Precision Industry Co Ltd | Electronic device housing and its processing method |
JP2004315873A (en) * | 2003-04-15 | 2004-11-11 | Penta Ocean Constr Co Ltd | Steel product made corrosion preventive and corrosion prevention method |
US6905777B2 (en) * | 2003-04-18 | 2005-06-14 | Shannon D. Near | Laminate material |
KR101322549B1 (en) * | 2005-06-17 | 2013-10-25 | 고쿠리츠다이가쿠호진 도호쿠다이가쿠 | Protective film structure of metal member, metal component employing protective film structure, and equipment for producing semiconductor or flat-plate display employing protective film structure |
US20110020665A1 (en) * | 2007-06-13 | 2011-01-27 | Alcoa Inc. | Coated metal article and method of manufacturing same |
CN201067329Y (en) * | 2007-06-28 | 2008-06-04 | 厦门灿坤实业股份有限公司 | Coffee making machine |
JP2011014201A (en) * | 2009-07-02 | 2011-01-20 | Toshiba Storage Device Corp | Actuator arm and disk recording device |
-
2014
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CN106086987A (en) * | 2016-06-01 | 2016-11-09 | 努比亚技术有限公司 | The processing method of terminal aluminium shell |
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US20160326624A1 (en) | 2016-11-10 |
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