WO2015102342A1 - Film de découpage en dés et film de fixation de matrice de découpage en dés - Google Patents

Film de découpage en dés et film de fixation de matrice de découpage en dés Download PDF

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Publication number
WO2015102342A1
WO2015102342A1 PCT/KR2014/012981 KR2014012981W WO2015102342A1 WO 2015102342 A1 WO2015102342 A1 WO 2015102342A1 KR 2014012981 W KR2014012981 W KR 2014012981W WO 2015102342 A1 WO2015102342 A1 WO 2015102342A1
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WIPO (PCT)
Prior art keywords
film
dicing
adhesive layer
resin
weight
Prior art date
Application number
PCT/KR2014/012981
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English (en)
Korean (ko)
Inventor
김세라
조정호
김영국
김희정
이광주
김정학
남승희
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140190448A external-priority patent/KR101722137B1/ko
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to US14/781,537 priority Critical patent/US9761476B2/en
Priority to CN201480031647.9A priority patent/CN105264033B/zh
Priority to JP2016562716A priority patent/JP6348986B2/ja
Publication of WO2015102342A1 publication Critical patent/WO2015102342A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to a dicing film and a dicing die-bonding film, and more particularly, a dicing film and dicing capable of improving pick-up property and preventing damage to a thinned semiconductor chip during a dicing process of a semiconductor packaging process.
  • Dicing die film containing a film and a dicing method of a semiconductor wafer using the said dicing die bonding film.
  • the manufacturing process of the semiconductor chip includes a process of forming a fine pattern on the wafer and a process of polishing and packaging the wafer to meet the specifications of the final device.
  • the packaging process includes a wafer inspection process for inspecting a defect of a semiconductor chip; A dicing step of cutting the wafer into separate chips; A die bonding process of attaching the separated chip to a circuit film (ci rcui t f i lm) or a mounting plate of a lead frame; A wire bonding process of connecting the chip pad provided on the semiconductor chip and the circuit pattern of the circuit film or the lead frame with electrical connection means such as wire; A molding process of wrapping the outside with an encapsulant to protect the internal circuit and other components of the semiconductor chip; Trim process for cutting the dam bar connecting the lead and the lead; Forming process of bending leads into desired shapes; And a finished product inspection process for inspecting defects of the finished package.
  • a dicing process is a process of manufacturing a plurality of individual chips separated from each other by grinding the back surface of the semiconductor wafer and cutting the semiconductor wafer along a dicing line between the chips.
  • MCP mul ti L chip package
  • the thinned chip may be damaged. There was a problem that the pickup properties are lowered.
  • the present invention uses a dicing film and a dicing die-bonding film including the dicing film and the dicing film that can improve the pickup properties in the dicing process of the semiconductor packaging process and prevent damage to the thinned semiconductor wafer It is for providing a dicing method of a semiconductor wafer.
  • a base film comprises a pressure-sensitive adhesive layer
  • the storage modulus of the pressure-sensitive adhesive layer is 3.0 * 10 5 to 4.0 * 10 6 Pa at 30 ° C
  • the cross-linking density of the pressure-sensitive adhesive is provided with a dicing film of 80% to 99%.
  • the storage modulus of the adhesive layer 1.0 eseo 80 ° C * 10 5 Pa may be more than, or 1.0 * 10 5 Pa to 4.0 * 10 5 Pa.
  • the adhesive layer may include an adhesive resin, a photoinitiator, and a crosslinking agent.
  • the adhesive resin has a glass transition temperature of 28 ° C to -58 ° C
  • (Meth) acrylate type resin can be included.
  • (meth) acrylate is meant to include both acrylate and (meth) acrylate.
  • the crosslinking agent may include at least one compound selected from the group consisting of an isocyanate compound, an aziridine compound, an epoxy compound, and a metal chelate compound.
  • the adhesive layer may include 0.1 to 20 parts by weight of the photoinitiator and 0.1 to 40 parts by weight of the crosslinking agent with respect to 100 parts by weight of the adhesive resin.
  • the base film may be a polyolefin film, polyester film, polycarbonate film, polyvinyl chloride film, polytetrafluoroethylene film, polybutene film, polybutadiene film, vinyl chloride copolymer film, ethylene-vinyl acetate copolymer film , An ethylene-propylene copolymer film, and an ethylene-alkyl acrylate copolymer film.
  • the base film may have a thickness of 10 kPa to 200, and the adhesive layer may have a thickness of 5 ⁇ to 100 kPa.
  • the dicing film ; And an adhesive layer formed on at least one surface of the dicing film.
  • the adhesive layer may include a thermoplastic resin, an epoxy resin, and a curing agent.
  • the thermoplastic resin may be polyimide, polyether imide, polyester imide, polyamide, polyether sulfone, polyether ketone, polyolefin, polyvinyl chloride, phenoxy, reactive butadiene acrylonitrile copolymer rubber and (meth) acrylate It may include one or more polymer resins selected from the group consisting of resins.
  • the curing agent may include at least one compound selected from the group consisting of a phenolic resin, an amine curing agent, and an acid anhydride curing agent.
  • the adhesive layer may include 10 to 1,000 parts by weight of the thermoplastic resin and 10 to 700 parts by weight of the curing agent relative to 100 parts by weight of the epoxy resin.
  • the adhesive layer may further include at least one curing catalyst selected from the group consisting of phosphorus compounds, boron compounds, phosphorus-boron compounds and imidazole compounds.
  • the adhesive layer may have a thickness of 1 to 300.
  • a dicing die-bonding film ; And a wafer stacked on at least one surface of the dicing die 3 ⁇ 4 film; a preprocessing step of partially or partially dividing the semiconductor wafer;
  • a method of dicing a semiconductor wafer comprising: irradiating ultraviolet rays to the base film of the preprocessed semiconductor wafer and picking up individual chips separated by the division of the semiconductor wafer.
  • a dicing die bonding film and the dicing die bonding film including the dicing film and the dicing film capable of improving pick-up property and preventing damage to a thinned semiconductor wafer during the dicing process of the semiconductor packaging process A dicing method of a semiconductor wafer using may be provided.
  • the thinned chip When excessive force is applied when the adhesive layer and the adhesive layer are separated according to the thinning of the semiconductor wafer, the thinned chip may be damaged and the pickup property may be degraded. There was a problem, according to the dicing method of the dicing film, dicing die-bonding film and semiconductor wafer, improve the pick-up property to enable a smooth pick-up process and to prevent damage to the thinned semiconductor chip.
  • a dicing film, a dicing die bonding film, and a dicing method of a semiconductor wafer of a specific embodiment of the present invention will be described in detail.
  • a base film; And a pressure-sensitive adhesive layer, wherein the storage modulus of the pressure-sensitive adhesive layer is 3 * 10 5 to 4 * 10 6 Pa at 30 ° C., and the crosslinking density of the pressure-sensitive adhesive layer is 80% to 99%. can be.
  • the present inventors have conducted research on a method for improving pickup performance and preventing damage to a thinned semiconductor chip, and using a dicing film containing an adhesive layer having a specific storage modulus and crosslinking density, The experiment confirmed that the pick-up property can be improved and the damage of the thinned semiconductor chip can be prevented through the experiment.
  • the storage modulus of the adhesive layer may be 3 * 10 5 to 4 * 10 6 Pa at 30 ° C.
  • the storage modulus of the adhesive layer is less than 3 * 10 5 Pa at 30 ° C.
  • a large force is required when separating the adhesive layer from the adhesive layer, and may cause damage to the thinned semiconductor chip during the dicing process.
  • the storage elasticity of the adhesive layer is greater than 4 * 10 6 Pa at 30 ° C, the strength of the adhesive layer is increased, the pick-up property can be reduced $ 1.
  • the crosslinking density of the adhesive layer may be 80% to 99%, or 85% to 98 ) .
  • the degree of crosslinking of the adhesive layer is less than 80%, the anchoring action between the adhesive and the adhesive is increased to increase the force required to separate them, thereby lowering the pickup property of the semiconductor wafer.
  • the degree of crosslinking of the pressure-sensitive adhesive layer is greater than 99%, the adhesion of the pressure-sensitive adhesive layer is greatly reduced, resulting in chip flying during the dicing process. And so on.
  • the storage modulus of the adhesive layer is 3 * 10 5 to 4 * 10 6 Pa at 30 ° C
  • the storage modulus of the adhesive layer is 1 at 80 ° C. . may be O10 5 Pa or more, or 1.0 * 10 5 Pa to 4.0 * 10 6 Pa.
  • the specific composition of the adhesive layer is not particularly limited, and for example, the adhesive layer may include an adhesive resin, a photoinitiator, and a crosslinking agent.
  • the crosslinking agent may include at least one compound selected from the group consisting of an isocyanate compound, an aziridine compound, an epoxy compound, and a metal chelate compound.
  • the pressure-sensitive adhesive layer may include 0.1 to 40 parts by weight of a crosslinking agent relative to 100 parts by weight of the pressure-sensitive adhesive resin. If the content of the crosslinking agent is too small, the cohesive force of the adhesive layer may be insufficient. If the content of the crosslinking agent is too high, the adhesive layer may not sufficiently secure the adhesive force before photocuring and chip scattering may occur.
  • the photoinitiator are not limited, and commonly known photoinitiators may be used.
  • the adhesive layer may include 0.01 to 20 parts by weight of the photoinitiator relative to 100 parts by weight of the adhesive resin.
  • the specific kind of the base film is not particularly limited as long as it is a commonly used base film, for example, a polyolefin film, a polyester film, a polycarbonate film, a polyvinyl chloride film, a polytetrafluoroethylene film, a polybutene film, poly It may be one polymer film selected from the group consisting of butadiene film, vinyl chloride copolymer film, ethylene-vinyl acetate copolymer film, ethylene propylene copolymer film, and ethylene ⁇ alkyl acrylate copolymer film.
  • the base film may have a thickness of 10 to 200, and the adhesive layer may have a thickness of 5!
  • the adhesive resin may include a (meth) acrylate-based resin having a glass transition temperature of -28 ° C to -58 ° C, or ⁇ 30 ° C to-55 ° C.
  • (meth) acrylate is meant to include both acryl'ate and (meth) acrylate.
  • the (meth) acrylate resin may be, for example, a copolymer of a (meth) acrylic acid ester monomer and a crosslinkable functional group-containing monomer.
  • examples of the (meth) acrylic acid ester monomer include alkyl (meth) acrylate, and more specifically, monomers having an alkyl group having 1 to 12 carbon atoms, such as pentyl (meth) acrylate and 11-butyl (meth).
  • crosslinkable functional group-containing monomer examples include one or more kinds of hydroxy group-containing monomers, carboxyl group-containing monomers, or nitrogen-containing monomers.
  • hydroxyl group-containing compound examples include 2—hydroxyethyl (meth) acrylate,. 2'Hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxynuclear (meth) acrylate, 8- hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (Meth) acrylate, or 2-hydroxypropylene glycol (meth) acrylate, etc. are mentioned.
  • carboxyl group-containing compound examples include (meth) acrylic acid, 2- (meth) acryloyloxyacetic acid, 3- (meth) acryloyloxypropyl acid, 4- (meth) acryloyloxybutyl acid, acrylic acid double Sieve, itaconic acid, maleic acid, or maleic acid ⁇ ⁇ ⁇ dode number
  • nitrogen-containing monomers include (meth) acrylonitrile, ⁇ -vinyl pyridone or ⁇ -vinyl caprolactam.
  • the (meth) acrylate resin may further include vinyl acetate, styrene or acrylonitrile, etc., in view of improving other functionalities such as compatibility.
  • the adhesive layer may further include an ultraviolet curable compound.
  • the type of the ultraviolet curable compound is not particularly limited, and for example, a polyfunctional compound having a weight average molecular weight of about 500 to 300, 000 (ex. Polyfunctional urethane acrylate, polyfunctional acrylate monomer or oligomer, etc.). )of Can be used.
  • the average person skilled in the art can easily select the appropriate compound according to the intended use.
  • the content of the ultraviolet curable compound may be 1 part by weight to 400 parts by weight, preferably 5 parts by weight to 200 parts by weight, based on 100 parts by weight of the above-mentioned adhesive resin. If the content of the ultraviolet curable compound is less than 1 part by weight, there is a risk that the lowering of the adhesive strength after curing is not sufficient, and the pick-up property may be degraded. If the content of the ultraviolet curable compound exceeds 400 parts by weight, the cohesive force of the adhesive may be insufficient before peeling off the ultraviolet ray, There is a possibility that it may not be easily performed. .
  • the ultraviolet curable pressure sensitive adhesive may be used in a form in which carbon-carbon double bonds are bonded to side chains or main chain ends of the acrylic copolymer, as well as the additive type ultraviolet curable compound. That is, the (meth) acrylic co-polymer may further include an ultraviolet curable compound bonded to the side chain of the main chain including the (meth) acrylic acid ester monomer and the crosslinkable functional group-containing monomer.
  • the type of the ultraviolet curable compound includes 1 to 5, preferably 1 or 2, photocurable functional groups (ex. Ultraviolet polymerizable carbon-carbon double bonds) per molecule, and is also included in the main chain. and a functional group capable of banung ⁇ does not specifically limit having a functional group.
  • examples of the crosslinkable functional group and the functional group that can be reacted include an isocyanate group or an epoxy group, but are not limited thereto.
  • UV-curable compound examples include a functional group capable of reacting with a hydroxyl group included in the main chain, (meth) acryloyloxy isocyanate, (meth) acryloyloxy methyl isocyanate, 2- (meth) acrylic Loyloxy ethyl isocyanate, 3- (meth) acryloyloxy propyl isocyanate, 4- (meth) acryloyloxy butyl isocyanate, m-propenyl- ⁇ , ⁇ -dimethyl .
  • One kind or fish species such as glycidyl (meth) acrylate or allyl glycidyl ether may be mentioned, but is not limited thereto.
  • the ultraviolet curable compound may be included in the side chain of the base resin by substituting 5 mol% to 90 mol% of the crosslinkable functional groups included in the main chain.
  • the adhesive layer may suitably include a tackifier such as rosin resin, terpene resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin or aliphatic aromatic copolymerized petroleum resin.
  • a method of forming the adhesive layer on the base film does not i being particularly limited, for example, once the pressure-sensitive adhesive composition on a substrate by coating a pressure-sensitive adhesive composition of the present invention directly on the film method of forming a pressure-sensitive adhesive layer or a releasable base
  • the pressure-sensitive adhesive layer may be coated to prepare an pressure-sensitive adhesive layer, and a method of transferring the pressure-sensitive adhesive layer onto a base film using the peelable base material may be used.
  • the method of applying and drying the pressure-sensitive adhesive composition is not particularly limited, and for example, a composition including each of the above components may be used as it is, or diluted in a suitable organic solvent, such as a comma coater, gravure coater, die coater or reverse coater. After application by means of 6 (rc to 2 (xrc), a method of drying the solvent for 10 seconds to 30 minutes at a temperature of xrc may be used.
  • a dicing die-bonding film including a dicing film and an adhesive layer formed on at least one surface of the dicing film may be provided.
  • the adhesive layer may include a thermoplastic resin, an epoxy resin, and a curing agent.
  • the thermoplastic resin may be polyimide, polyether imide, polyester imide, polyamide, polyether sulfone, polyether ketone, polyolefin, polyvinyl chloride, phenoxy, semi-butadiene acrylonitrile copolymer rubber and (meth) acrylic
  • One or more polymers selected from the group consisting of rate-based resins Resin may be included.
  • the epoxy resin may include an epoxy resin for general adhesives known in the art, and for example, an epoxy resin containing two or more epoxy groups in a molecule and having a weight average molecular weight of 100 to 2,000 may be used. .
  • the epoxy resin may form a hard crosslinked structure through a curing process, and may exhibit excellent adhesion, heat resistance, and mechanical strength. More specifically, it is preferable that the epoxy resin uses an epoxy resin having an average epoxy equivalent of 100 to 1,000. When the epoxy equivalent of the said epoxy resin is less than 100, a crosslinking density may become high too much, and there exists a possibility that an adhesive film may show a hard property as a whole, and when it exceeds ⁇ and ⁇ , heat resistance may fall.
  • epoxy resin examples include bifunctional epoxy resins such as bisphenol A epoxy resin or bisphenol F epoxy resin; Or cresol novolac epoxy resin, phenol novolac sepoxy resin, tetrafunctional epoxy resin, biphenyl type epoxy resin, triphenol methane type epoxy resin, alkyl modified triphenol methane type epoxy resin, naphthalene type epoxy resin, dicyclopenta
  • bifunctional epoxy resins such as bisphenol A epoxy resin or bisphenol F epoxy resin
  • cresol novolac epoxy resin phenol novolac sepoxy resin
  • tetrafunctional epoxy resin biphenyl type epoxy resin, triphenol methane type epoxy resin, alkyl modified triphenol methane type epoxy resin, naphthalene type epoxy resin, dicyclopenta
  • polyfunctional epoxy resins having three or more functional groups such as a diene type epoxy resin or a dicyclopentadiene-modified phenol type epoxy resin, are not limited thereto.
  • Multifunctional epoxy resin means an epoxy resin having three or more functional groups. That is, in general, bifunctional epoxy resins are excellent in flexibility and flowability at high temperatures, but are poor in heat resistance and curing rate, whereas polyfunctional epoxy resins having three or more functional groups are fast in curing rate and excellent in high crosslinking density. Heat resistance, but flexibility and flowability is poor. Therefore, by appropriately mixing and using the above two kinds of resins, it is possible to suppress the scattering of chips and the generation of burrs during the dicing process while controlling the elastic modulus and tack characteristics of the adhesive layer.
  • the curing agent included in the adhesive layer is not particularly limited as long as it can react with the epoxy resin and / or thermoplastic resin to form a crosslinked structure.
  • the curing agent is a phenolic resin, an amine curing agent, and an acid anhydride type.
  • hardener It may include one or more compounds selected from the group consisting of.
  • the adhesive layer may include 10 to 1,000 parts by weight of the thermoplastic resin and 10 to 700 parts by weight of the curing agent relative to 100 parts by weight of the epoxy resin.
  • the curing catalyst plays a role of promoting the action of the curing agent and curing of the resin composition for semiconductor bonding, and a curing catalyst known to be used in the manufacture of a semiconductor adhesive film or the like can be used without great limitation.
  • the curing catalyst may be one or more selected from the group consisting of phosphorus compounds, boron compounds, phosphorus-boron compounds and imidazole compounds.
  • the amount of the curing catalyst may be appropriately selected in consideration of physical properties of the adhesive film to be finally prepared, for example, 0.5 to 10 weight based on a total of 100 parts by weight of the epoxy resin, the (meth) acrylate resin, and the phenol resin. Can be used as a wealth.
  • the dicing die-bonding film may further include a release film formed on the adhesive layer.
  • the release film include one or more kinds of polyethylene terephthalate film, pletetrafluoroethylene film, polyethylene film, polypropylene film, polybutene film, polybutadiene film, vinyl chloride copolymer film or polyimide film and the like.
  • the surface of the release film as described above may be released by one or more kinds of alkylide, silicone, fluorine, unsaturated ester, polyolefin, or wax or the like, and among these, alkyd, silicone, or fluorine based, particularly having heat resistance. Mold release agents, such as these, are preferable.
  • the release film is usually 5 to 500 ⁇ m, preferably may be formed in a thickness of about 10 to 200, but is not limited thereto.
  • the method for producing the above-mentioned dicing die-bonding film is not particularly limited, and for example, a method of sequentially forming an adhesive part, an adhesive part and a release film on a base film, or a dicing film (base film + adhesive part) And separately preparing a release film having a die-bonding film or an adhesive part formed thereon .
  • a method of laminating it may be used.
  • Lamination method in the above is not particularly limited, hot lamination or lamination press method can be used in terms of double continuous process possibility and efficiency
  • the hot roll lamination method is preferable.
  • Hot lamination method is at icrc to loo ° c
  • the dicing die bonding film On the other hand, according to another embodiment of the invention, the dicing die bonding film; And a wafer stacked on at least one surface of the dicing die-bonding film; a pre-processing step of partially or partially dividing the semiconductor wafer. Irradiating ultraviolet rays to the base film of the pre-processed semiconductor wafer, and picking up the individual chips separated by the division of the semiconductor wafer, a dicing method of a semiconductor wafer can be provided.
  • n_DDM which is a chain transfer agent (CTA) and 100 parts by weight of ethyl acetate (EAc) as a solvent. 3, in rc while injecting nitrogen to remove oxygen into the reactor
  • the mixture was mixed well for 30 minutes or more. Thereafter, the temperature was maintained at 62 ° C., and a concentration of 300 ppm of the initiator V-60 (Azob isi sobut y 1 on itri 1 e) was added thereto, and the reaction was initiated.
  • V-60 Azob isi sobut y 1 on itri 1 e
  • a (meth) acrylate polymer resin was prepared in the same manner as in Preparation Example 1, except for the composition shown in Table 1.
  • a pressure-sensitive adhesive composition was prepared by mixing 7 g of TE) I-based isocyanate curing agent and 3 g of photoinitiator (Irgacure 184) with 100 g of the (meth) acrylate polymer resin of Preparation Example 1.
  • the pressure-sensitive adhesive composition was applied to a release-treated thickness 38um PET, and dried at 110 ° C for 3 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 ⁇ .
  • the formed pressure-sensitive adhesive layer was laminated on a 100% polyolefin base film and then subjected to aging to prepare a dicing film.
  • the pressure-sensitive adhesive layer formed on the release-treated thickness 38um PET was the same release treatment. After lamination to PET, it was used to measure the storage modulus of the adhesive after aging.
  • a dicing die bonding film was prepared after transferring the die bonding film circularly cut into the prepared dicing film through paper under a condition of 5 kgf / cm 2 .
  • Examples 2-5 and Comparative Examples 1-4 were prepared after transferring the die bonding film circularly cut into the prepared dicing film through paper under a condition of 5 kgf / cm 2 .
  • the prepared measurement sample of thickness 1mm was cut into a rectangular shape having a length of 17mm and a width of 5 ⁇ . And then DMA (Dynami c Mechani cal Analys is, TA instrument) using a frequency of 1Hz, pre-load force 0.01 N, heating rate
  • the storage modulus of 15 CTC was measured at -30 ° C at 10 ° C / min.
  • Table 3 shows the storage modulus (Pa) of the pressure sensitive adhesive at 3 (C and 80 ° C ) .
  • Crosslinking density (%) [(weight of adhesive and wire mesh after drying b-weight of wire mesh c) I (initial weight a)] X 100
  • the prepared sample was measured at a temperature of 180 degrees at room temperature at a speed of 300 kV / s, and the force (gf / 25 i ⁇ ) of peeling the die-bonding film in dicing was measured, and the results are shown in Table 3 below.
  • the die-bonding surface was mounted on a mirror wafer (8 inches, thickness 80uni) at a temperature of 60 ° C and the chip size was 10 ⁇ X 10 Dicing was performed on the following conditions so that it might become kPa.
  • the picked-up measurement sample was prepared by irradiating an ultraviolet-ray with a light quantity of 300 mJ / cm 2 (roughness 70 mW / cm 2 ) to the diced sample on the substrate surface of the dicing film.
  • Table 3 shows the results of measuring the success rate by using the SPA-400 (SHINKAWA) to prepare the sample under the following conditions.
  • Cutting blade height (cut depth) 80 ⁇
  • Needle iunge up height 0.2 ⁇
  • Needle piunge up speed 10mm / s
  • the adhesive layer of Examples 1 to 5 has a storage modulus of 3.0 * 10 5 to 2: O10 6 at 30 ° C and a storage modulus of 80 ° C or higher at 1.O10 5 Pa and 80% at 80 ° C. It has a cross-linking density of 99% to 99.
  • the adhesive layer and the adhesive layer are separated, it is confirmed that damage to the thinned chip does not occur and the pickup property can be improved.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention porte sur un film de découpage en dés qui comprend un film de base et une couche adhésive, le module élastique de conservation de la couche adhésive étant de 3×105 à 4×106 Pa à 30 °C et la densité de réticulation de la couche adhésive étant de 80 % à 99 % ; sur un film de fixation de matrice de découpage en dés comprenant le film de découpage en dés ; et sur un procédé pour le découpage en dés d'une tranche de semi-conducteur utilisant le film de fixation de matrice de découpage en dés.
PCT/KR2014/012981 2014-01-03 2014-12-29 Film de découpage en dés et film de fixation de matrice de découpage en dés WO2015102342A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/781,537 US9761476B2 (en) 2014-01-03 2014-12-29 Dicing film and dicing die-bonding film
CN201480031647.9A CN105264033B (zh) 2014-01-03 2014-12-29 切割膜和切割晶片粘合膜
JP2016562716A JP6348986B2 (ja) 2014-01-03 2014-12-29 ダイシングフィルムおよびダイシングダイボンディングフィルム

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2014-0000912 2014-01-03
KR20140000912 2014-01-03
KR10-2014-0190448 2014-12-26
KR1020140190448A KR101722137B1 (ko) 2014-01-03 2014-12-26 다이싱 필름 및 다이싱 다이본딩 필름

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WO2015102342A1 true WO2015102342A1 (fr) 2015-07-09

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