WO2015098635A1 - Method for manufacturing resistor - Google Patents
Method for manufacturing resistor Download PDFInfo
- Publication number
- WO2015098635A1 WO2015098635A1 PCT/JP2014/083343 JP2014083343W WO2015098635A1 WO 2015098635 A1 WO2015098635 A1 WO 2015098635A1 JP 2014083343 W JP2014083343 W JP 2014083343W WO 2015098635 A1 WO2015098635 A1 WO 2015098635A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resistor
- electrode
- individual
- resistance
- plate material
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
Definitions
- the present invention relates to a method for manufacturing a resistor, and more particularly to a method for manufacturing a shunt resistor using a resistance material made of a metal material as a resistor.
- the present invention has been made based on the above-described circumstances, and an object of the present invention is to provide a method for manufacturing a shunt resistor made of a metal material that is small and has excellent mass productivity.
- the resistor is constituted by a resistor plate made of a resistor material, so that the thickness of the resistor plate is the length of the resistor in the current direction. And since the electrode material used as an electrode is joined to the upper surface and the lower surface of the resistor, it becomes possible to manufacture a miniaturized shunt resistor having a very short resistor length between both electrodes.
- a plain sheet such as a resistor plate material and an electrode plate material is patterned, and a multi-cavity pattern is formed by drilling, and a plurality of resistors made of a laminate are collectively pressed.
- the cross-sectional shape of the resistor can be set by patterning, so that it is possible to design resistors having various shapes and to manufacture with high productivity.
- FIG. 2A shows an example of pattern formation of a resistance plate material.
- a resistance plate material (sheet) 20a is prepared. As an example, the dimensions are about 100 mm ⁇ 100 mm and the thickness is about 0.7 mm.
- the sheet is then drilled by patterning to form a carrier portion (frame portion) 21, a plurality of individual resistors 22, and a connecting portion 23 a that connects the carrier portion and the individual resistors.
- the other part is a through hole.
- the carrier part (frame part) 21 is provided with positioning holes H at its four corners.
- ⁇ Punching by patterning can be performed using press punching, etching, laser beam processing, or the like.
- the individual resistor 22 has a disk shape, but the resistor 10c shown in FIG. 1C forms an annular individual resistor 22a, and the resistor 10d shown in FIG. The individual resistor 22b is formed. Thus, it can be processed into an arbitrary shape and size by patterning.
- the connecting portion 23a serves to connect and fix a large number of individual resistors 22 to the carrier portion 21, and is formed thinner than the thickness of the plate material to facilitate subsequent cutting.
- a metal film 25 is formed on the upper and lower surfaces of the resistance plate member 20a to be prepared.
- the metal film 25 is a film made of a metal material such as Sn, Ni, or Cu, and is formed by electrolytic plating or the like. Alternatively, Cu nano paste may be screen-printed and heated and cured.
- the individual resistor 22b becomes the square resistor 11A
- the individual electrode material 24b becomes the square electrode 12
- the individual intermediate electrode material 25b having the protrusion 25c protrudes.
- a square intermediate electrode 12 ⁇ / b> A having the portion 14 is formed.
- the protrusion 14 is for use as a voltage detection terminal, and can detect the voltage generated at both ends of the resistor 11A at the nearest position.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
Abstract
Provided is a method for manufacturing a small metal shunt resistor that is exceptionally suited to mass production.
This invention comprises: a step for readying a resistive plate (20a) comprising a metal material made of a resistive material, said plate having an upper surface and a lower surface; a step for drilling the resistive plate and forming a carrier part (21), a plurality of individual resistors (22), and linking parts (23a) for linking the carrier part and the individual resistors; a step for causing electrode materials (24) to be used as electrodes to be joined onto the upper surface and the lower surface of the individual resistors; and a step for cutting the linking parts (23a). It is preferred to drill a plurality of electrode plate materials (20b) comprising a metal material and having an upper surface and a lower surface; form a carrier part (21), a plurality of individual electrode materials (24), and linking parts (23b) for linking the carrier part and the individual resistors; and join the electrode plate materials (20b) onto the upper surface and the lower surface of a resistive plate material (20a).
Description
本発明は、抵抗器の製造方法に係り、特に抵抗体として金属材からなる抵抗材料を用いたシャント抵抗器の製造方法に関する。
The present invention relates to a method for manufacturing a resistor, and more particularly to a method for manufacturing a shunt resistor using a resistance material made of a metal material as a resistor.
電池の充放電電流を監視し、電池の充放電電流を制御する等の目的でシャント抵抗器が使用される。シャント抵抗器は、監視対象電流の経路に挿入され、該電流によってシャント抵抗器の抵抗体両端に生じる電圧を検出し、既知の抵抗値から電流を検出する。係るシャント抵抗器の構造として、円形または角形の金属抵抗体の両端面に円形または角形の金属電極を接合したものが提案されている（例えば国際公開ＷＯ２０１３／００５８２４号公報参照）。
∙ Shunt resistors are used for the purpose of monitoring the charge / discharge current of the battery and controlling the charge / discharge current of the battery. The shunt resistor is inserted into the current path to be monitored, detects a voltage generated across the resistor of the shunt resistor by the current, and detects the current from a known resistance value. As a structure of such a shunt resistor, one in which a circular or square metal electrode is joined to both end faces of a circular or square metal resistor has been proposed (see, for example, International Publication WO2013 / 005824).
しかしながら、上記抵抗器は、その製造に当たり、まず抵抗体および電極を金属部材として製作し、次にそれらの端面同士を接触させ、圧接、溶接、ろう接等により接合して製作している。このため、抵抗器を個々の金属部材から単体で製造することになり、量産が難しいという問題がある。また、抵抗体および電極は電流が流れる方向にある程度の長さがないと、接合工程でそれらを保持できず、小型化に限界があるという問題がある。さらに、例えば線材を切断して抵抗体または電極とする場合、接合面の平坦性が得られ難く、接合面が平坦でないと十分な接合強度が得られ難いという問題がある。
However, when the resistor is manufactured, the resistor and the electrode are first manufactured as a metal member, and then the end surfaces thereof are brought into contact with each other and bonded by pressure welding, welding, brazing, or the like. For this reason, a resistor will be manufactured from an individual metal member alone, and there is a problem that mass production is difficult. In addition, if the resistor and the electrode do not have a certain length in the direction in which the current flows, there is a problem in that they cannot be held in the joining process and there is a limit to downsizing. Further, for example, when a wire is cut to form a resistor or an electrode, there is a problem that flatness of the bonding surface is difficult to obtain, and sufficient bonding strength is difficult to obtain unless the bonding surface is flat.
本発明は、上述の事情に基づいてなされたもので、小型で且つ量産性に優れた金属材からなるシャント抵抗器の製造方法を提供することを目的とする。
The present invention has been made based on the above-described circumstances, and an object of the present invention is to provide a method for manufacturing a shunt resistor made of a metal material that is small and has excellent mass productivity.
本発明の抵抗器の製造方法は、抵抗材料からなる金属材からなり、上面と下面を有する抵抗板材を準備する工程と、該抵抗板材に穴あけ加工をして、キャリア部と、複数の個別抵抗体と、キャリア部と個別抵抗体を連結する連結部を形成する工程と、前記個別抵抗体における上面と下面に、電極として用いる電極材を接合する工程と、前記連結部を切断する工程と、からなることを特徴とする。
The method of manufacturing a resistor according to the present invention includes a step of preparing a resistance plate material made of a metal material made of a resistance material and having an upper surface and a lower surface, drilling the resistance plate material, a carrier portion, and a plurality of individual resistors. A step of forming a body, a connecting portion for connecting the carrier portion and the individual resistor, a step of bonding an electrode material used as an electrode to the upper surface and the lower surface of the individual resistor, and a step of cutting the connecting portion; It is characterized by comprising.
本発明によれば、抵抗板材により抵抗体を構成するので、抵抗板材の厚みが抵抗体の電流方向長さとなる。そして、抵抗板材の上面と下面に、電極材を接合するので、両電極間の抵抗体が極めて薄い小型化したシャント抵抗器の製作が可能となる。抵抗板材は厚みの寸法精度を高く制御でき、抵抗体や電極の断面形状もプレス打ち抜き等のパターン加工により形成できるので、量産においても抵抗体の寸法精度が容易に確保でき、抵抗値精度の高い抵抗器が得られる。そして、多数の抵抗体や電極をパターン加工した金属板材を接合し、連結部を除去して個々の抵抗器を形成するので、様々な設計が可能となり、且つ高い量産性での製作が可能となる。
According to the present invention, since the resistor is constituted by the resistor plate material, the thickness of the resistor plate material becomes the length of the resistor in the current direction. And since an electrode material is joined to the upper surface and lower surface of a resistance board material, manufacture of the shunt resistor which miniaturized the resistance body between both electrodes very thinly is attained. Resistive plate material can be controlled with high dimensional accuracy, and the cross-sectional shape of the resistor and electrode can be formed by patterning such as press punching, so the dimensional accuracy of the resistor can be easily secured even in mass production, and the resistance value accuracy is high. A resistor is obtained. And, by joining the metal plate material patterned with a large number of resistors and electrodes, and removing the connecting parts to form individual resistors, various designs are possible, and production with high mass productivity is possible Become.
さらに、パターン加工した抵抗板材と電極板材を重ねて接合することで、個々の抵抗体と電極との接合位置精度を容易に確保できる。そして、抵抗板材と電極板材を圧接（固相接合）により接合できるので、レーザーや電子ビームによる溶接に比べて接合が安定する。特に、レーザーや電子ビームによる溶接では、接合する界面で両金属が混在することになり、その界面は所定の幅で形成されるため、抵抗体の電流方向長さが小さい場合、抵抗体に電極材が溶け込んでしまい、本来の抵抗体の特性が得られないという問題があるが、圧接によれば均質な接合面が容易に得られ、本来の特性が容易に得られる。
Furthermore, the bonding position accuracy of each resistor and electrode can be easily ensured by overlapping and joining the patterned resistance plate material and the electrode plate material. And since a resistance board material and an electrode board material can be joined by press-contact (solid phase joining), compared with the welding by a laser or an electron beam, joining is stabilized. In particular, in welding by laser or electron beam, both metals are mixed at the interface to be joined, and the interface is formed with a predetermined width. Therefore, when the current direction length of the resistor is small, the electrode is connected to the resistor. Although the material melts and the characteristic of the original resistor cannot be obtained, the uniform bonding surface can be easily obtained by pressure welding, and the original characteristic can be easily obtained.
以下、本発明の実施形態について、図１乃至図９を参照して説明する。なお、各図中、同一または相当する部材または要素には、同一の符号を付して説明する。
Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 9. In addition, in each figure, the same code | symbol is attached | subjected and demonstrated to the same or equivalent member or element.
図１（ａ）－（ｄ）は本発明の製造方法で製作したシャント抵抗器の構造例を示す。図１（ａ）に示す抵抗器１０ａは、円柱状（または円板状）の抵抗体１１の両端面に角形の電極１２，１２を固定した例である。抵抗体１１は、Ｃｕ－Ｍｎ－Ｎｉ系、Ｃｕ－Ｎｉ系、Ｎｉ－Ｃｒ系、Ｆｅ－Ｃｒ系等の抵抗材料からなる金属材からなり、上面と下面を有する上記抵抗材料からなる抵抗板材を切り出して製作したものである。電極１２も同様に、抵抗材料よりも電気導電性の良いＣｕ等の金属材からなり、上面と下面を有する上記金属材料からなる電極板材を切り出して製作したものである。
1A to 1D show structural examples of shunt resistors manufactured by the manufacturing method of the present invention. A resistor 10 a shown in FIG. 1A is an example in which square electrodes 12, 12 are fixed to both end faces of a columnar (or disc-shaped) resistor 11. The resistor 11 is made of a metal material made of a resistance material such as Cu—Mn—Ni, Cu—Ni, Ni—Cr, or Fe—Cr, and a resistor plate made of the above resistance material having an upper surface and a lower surface. It was cut out and produced. Similarly, the electrode 12 is made of a metal material such as Cu having better electrical conductivity than the resistance material, and is produced by cutting out an electrode plate material made of the above metal material having an upper surface and a lower surface.
図１（ｂ）に示す抵抗器は、図１（ａ）に示す抵抗器に比べて、抵抗体１１の径を細くし、且つ電圧検出端子として用いるための突部１４を電極１２の端面に立設した構造である。突部１４を電極１２の抵抗体側端面に設けることで、抵抗体１１の両端に形成される電圧を直近位置で検出することができ、電圧検出配線の接続も容易となる。図１（ｃ）に示す抵抗器は、さらに、抵抗体１１と電極１２の間に、金属膜１３を介在させた構造である。後述するが、金属膜１３を介在させることで、抵抗体１１と電極１２の界面に製造工程において酸化膜の付着を防止し、良好な接合性が得られる。
The resistor shown in FIG. 1B is smaller in the diameter of the resistor 11 than the resistor shown in FIG. 1A, and a protrusion 14 for use as a voltage detection terminal is provided on the end face of the electrode 12. It is a standing structure. By providing the protrusion 14 on the resistor-side end surface of the electrode 12, the voltage formed at both ends of the resistor 11 can be detected at the nearest position, and the connection of the voltage detection wiring is facilitated. The resistor shown in FIG. 1C has a structure in which a metal film 13 is further interposed between the resistor 11 and the electrode 12. As will be described later, by interposing the metal film 13, it is possible to prevent the oxide film from adhering to the interface between the resistor 11 and the electrode 12 in the manufacturing process and to obtain good bondability.
また、図１（ｄ）に示す抵抗器は、角形（または角板状）の抵抗体１１Ａと電極１２との間に、抵抗体の抵抗材料よりも電気導電性の良い金属材からなる中間電極１２Ａを介在させ、該中間電極１２Ａには該中間電極から突出する電圧検出端子として用いるための突部１４が一体として設けられている。中間電極１２Ａは、抵抗体１１Ａおよび電極１２と同一断面形状で、薄い角板状の電極で、抵抗体１１Ａと電極１２の端面に接合して固定されている。これにより、抵抗体１１の両端に形成される電圧を直近位置で検出することができ、電圧検出配線の接続も容易となることは上記実施例と同様である。
In addition, the resistor shown in FIG. 1D is an intermediate electrode made of a metal material having better electrical conductivity than the resistance material of the resistor, between the rectangular (or square plate) resistor 11A and the electrode 12. The intermediate electrode 12A is integrally provided with a protrusion 14 for use as a voltage detection terminal protruding from the intermediate electrode. The intermediate electrode 12A is a thin square plate electrode having the same cross-sectional shape as the resistor 11A and the electrode 12, and is bonded and fixed to the end surfaces of the resistor 11A and the electrode 12. As a result, the voltage formed at both ends of the resistor 11 can be detected at the nearest position, and the connection of the voltage detection wiring is facilitated as in the above embodiment.
これらの抵抗器は、抵抗材料からなる抵抗板材により抵抗体を構成するので、抵抗板材の厚みが抵抗体の電流方向長さとなる。そして、抵抗体における上面と下面に、電極として用いる電極材を接合するので、両電極間の抵抗体長さが極めて短い小型化したシャント抵抗器の製作が可能となる。
In these resistors, the resistor is constituted by a resistor plate made of a resistor material, so that the thickness of the resistor plate is the length of the resistor in the current direction. And since the electrode material used as an electrode is joined to the upper surface and the lower surface of the resistor, it becomes possible to manufacture a miniaturized shunt resistor having a very short resistor length between both electrodes.
一例として、厚みが０．７ｍｍの抵抗板材を用いることで、電流の流れる方向の長さが０．７ｍｍの抵抗体を実現でき、抵抗体１１の直径を２ｍｍとすると、概略０．１ｍΩの抵抗値を有する小型のシャント抵抗器を実現できる。なお、電極の長さは任意であるが、例えば２ｍｍから５ｍｍとすることで、抵抗器全体の長さが５ｍｍから１０ｍｍ程度の小型化したシャント抵抗器の製作が可能である。
As an example, by using a resistance plate material having a thickness of 0.7 mm, a resistor having a length of 0.7 mm in the direction of current flow can be realized. When the diameter of the resistor 11 is 2 mm, the resistance is approximately 0.1 mΩ. A small shunt resistor having a value can be realized. Although the length of the electrode is arbitrary, for example, by setting the length to 2 mm to 5 mm, it is possible to manufacture a shunt resistor that is downsized so that the entire length of the resistor is about 5 mm to 10 mm.
そして、本発明では、抵抗板材および電極板材等の無地のシートをパターニングして、穴あけ加工により多数個取りのパターンを形成し、これを圧接し、積層体からなる多数の抵抗器を一括して製造し、連結部を切断して個々の抵抗器にする。従って、抵抗器の断面形状をパターニングで設定でき、様々な形状の抵抗器の設計が可能となり、且つ高い量産性での製作が可能となる。
And, in the present invention, a plain sheet such as a resistor plate material and an electrode plate material is patterned, and a multi-cavity pattern is formed by drilling, and a plurality of resistors made of a laminate are collectively pressed. Manufacture and cut connections to individual resistors. Therefore, the cross-sectional shape of the resistor can be set by patterning, so that it is possible to design resistors having various shapes and to manufacture with high productivity.
ここで、抵抗板材は厚みの寸法精度を高く制御でき、断面形状もパターニングにより寸法精度を高く制御できるので、量産においても抵抗体の寸法精度が容易に確保でき、抵抗値精度の高い抵抗器が得られる。そして、抵抗板材と電極板材を圧接（固相接合）により接合できるので、レーザーや電子ビームによる溶接に比べて接合が安定し、電気的にも機械的にも安定した抵抗特性が得られる。
Here, the resistance plate material can be controlled with high dimensional accuracy and the cross-sectional shape can be controlled with high dimensional accuracy by patterning, so that the dimensional accuracy of the resistor can be easily secured even in mass production, and a resistor with high resistance value accuracy can be obtained. can get. Since the resistance plate material and the electrode plate material can be joined by pressure welding (solid phase joining), the joining is stable as compared with welding by laser or electron beam, and resistance characteristics that are electrically and mechanically stable can be obtained.
次に、シャント抵抗器１０ａ（図１（ａ）参照）に係る本発明の第１実施例の製造工程について説明する。図２Ａは抵抗板材のパターン形成例を示す。まず、抵抗板材（シート）２０ａを準備する。この寸法は、一例として、大きさが１００ｍｍ×１００ｍｍ程度で、厚さが０．７ｍｍ程度である。そして、シートにパターニングにより穴あけ加工をして、キャリア部（枠部）２１と、複数の個別抵抗体２２と、キャリア部と個別抵抗体を連結する連結部２３ａを形成する。それ以外の部分は貫通孔になっている。なお、キャリア部（枠部）２１には位置決め孔Ｈをその四隅に設ける。
Next, the manufacturing process of the first embodiment of the present invention relating to the shunt resistor 10a (see FIG. 1A) will be described. FIG. 2A shows an example of pattern formation of a resistance plate material. First, a resistance plate material (sheet) 20a is prepared. As an example, the dimensions are about 100 mm × 100 mm and the thickness is about 0.7 mm. The sheet is then drilled by patterning to form a carrier portion (frame portion) 21, a plurality of individual resistors 22, and a connecting portion 23 a that connects the carrier portion and the individual resistors. The other part is a through hole. The carrier part (frame part) 21 is provided with positioning holes H at its four corners.
パターニングによる穴あけ加工は、プレス打ち抜き、エッチング、レーザービーム加工等を用いて行うことができる。図示の例では、個別抵抗体２２は円板状であるが、図１（ｃ）に示す抵抗器１０ｃでは環状の個別抵抗体２２ａを形成し、図１（ｄ）に示す抵抗器１０ｄでは角状の個別抵抗体２２ｂを形成する。このように、パターニングにより任意の形状・寸法に加工が可能である。連結部２３ａは多数の個別抵抗体２２をキャリア部２１に接続して固定する役割を果たし、後の切断を容易にするため、板材の厚みよりも薄く形成している。
穴 Punching by patterning can be performed using press punching, etching, laser beam processing, or the like. In the illustrated example, the individual resistor 22 has a disk shape, but the resistor 10c shown in FIG. 1C forms an annular individual resistor 22a, and the resistor 10d shown in FIG. The individual resistor 22b is formed. Thus, it can be processed into an arbitrary shape and size by patterning. The connecting portion 23a serves to connect and fix a large number of individual resistors 22 to the carrier portion 21, and is formed thinner than the thickness of the plate material to facilitate subsequent cutting.
図２Ｂは電極板材のパターン形成例を示す。まずＣｕ材等からなる電極板材（シート）２０ｂを準備し、シート２０ｂにパターニングにより穴あけ加工をして、キャリア部２１と、複数の角形の個別電極材２４と、キャリア部と個別電極材を連結する連結部２３ｂを形成する。シートの厚みは任意であるが、抵抗体の厚みを０．７ｍｍ程度とすると、例えば２ｍｍから５ｍｍ程度が適当である。
FIG. 2B shows an example of pattern formation of the electrode plate material. First, an electrode plate material (sheet) 20b made of a Cu material or the like is prepared, a hole is formed by patterning in the sheet 20b, and the carrier portion 21, a plurality of rectangular individual electrode materials 24, and the carrier portion and the individual electrode material are connected. The connecting portion 23b to be formed is formed. The thickness of the sheet is arbitrary, but if the thickness of the resistor is about 0.7 mm, for example, about 2 mm to 5 mm is appropriate.
パターニングによる穴あけ加工は、上記と同様に行うことができ、連結部を薄く形成することも同様であり、個別電極２４を任意の形状・寸法に形成できることも同様である。また、キャリア部２１の四隅に位置決め孔Ｈを設けることも同様である。ここで、板材２０ｂにおける個別電極材２４の配置は板材２０ａにおける個別抵抗体２２の配置と一致するように形成する。
The drilling process by patterning can be performed in the same manner as described above, and the connection portion can be formed thin, and the individual electrode 24 can be formed in an arbitrary shape and size. Similarly, the positioning holes H are provided at the four corners of the carrier portion 21. Here, the arrangement of the individual electrode material 24 in the plate material 20b is formed to coincide with the arrangement of the individual resistor 22 in the plate material 20a.
板材２０ａおよび板材２０ｂはパターン形成後に、機械研磨または化学研磨により表面仕上げを施すことが好ましい。これにより、抵抗体と電極の接合面となる面から酸化膜や異物が除去され、良好な接合が得られる。また、上記板材はシート状であるので、上記仕上げ加工が容易である。
The plate material 20a and the plate material 20b are preferably subjected to surface finishing by mechanical polishing or chemical polishing after pattern formation. Thereby, an oxide film and a foreign material are removed from the surface which becomes the bonding surface between the resistor and the electrode, and good bonding is obtained. Moreover, since the said board | plate material is a sheet form, the said finishing process is easy.
図３は、本発明の第１実施例の抵抗器の製造工程を示す。図２Ａに示すパターンを形成した抵抗板材２０ａの上下両面に、図２Ｂに示すパターンを形成した電極板材２０ｂを重ねて接合する（図３（ａ）参照）。この際、位置決め孔Ｈにピンを用いて位置合わせすることで、図２（ｃ）に示すように、個別抵抗体２２と個別電極材２４の位置を合わせて固定することができる。
FIG. 3 shows a manufacturing process of the resistor according to the first embodiment of the present invention. The electrode plate material 20b formed with the pattern shown in FIG. 2B is overlapped and joined to the upper and lower surfaces of the resistance plate material 20a formed with the pattern shown in FIG. 2A (see FIG. 3A). At this time, by aligning the positioning holes H with pins, the positions of the individual resistor 22 and the individual electrode material 24 can be aligned and fixed as shown in FIG.
接合は、真空雰囲気（１０－４Ｐａ程度）下で、４００℃から１０００℃に加熱し、１ｋＮから１０ｋＮに加圧することで、圧接により拡散接合を形成することが好ましい。これにより、抵抗板材２０ａの個別抵抗体２２と電極板材２０ｂの個別電極材２４を固相接合により全面を均質に接合できるので、レーザーや電子ビームによる溶接に比べて、機械的にも電気的にも接合が安定する。特に、抵抗体の電流方向長さが小さいものを接合する場合、レーザー等による溶接では、抵抗体が電極に溶け込んでしまい、本来の特性が得られない場合があるが、圧接によれば均質な接合面が容易に得られる。これにより、図３（ｂ）（ｃ）に示す積層体が得られる。
The bonding is preferably performed by pressure welding by heating from 400 ° C. to 1000 ° C. and pressurizing from 1 kN to 10 kN in a vacuum atmosphere (about 10 −4 Pa). As a result, the individual resistors 22 of the resistance plate material 20a and the individual electrode material 24 of the electrode plate material 20b can be uniformly bonded to each other by solid phase bonding, so mechanically and electrically compared to laser or electron beam welding. Will be stable. In particular, when joining resistors with a small length in the current direction, welding with a laser or the like may cause the resistor to melt into the electrode, and the original characteristics may not be obtained. A joining surface can be easily obtained. Thereby, the laminated body shown to FIG.3 (b) (c) is obtained.
次に、抵抗板材２０ａの連結部２３ａおよび電極板材２０ｂの連結部２３ｂをプレス等により切断して除去することで個々の抵抗器を形成する。従って、図１（ａ）に示す円柱状（円板状）抵抗体１１の両端面に角柱状（角板状）電極１２，１２を備えた抵抗器１０ａが得られる。
Next, each resistor is formed by cutting and removing the connecting portion 23a of the resistor plate member 20a and the connecting portion 23b of the electrode plate member 20b with a press or the like. Therefore, the resistor 10a provided with the prismatic (square plate-like) electrodes 12 and 12 on both end faces of the cylindrical (disc-like) resistor 11 shown in FIG.
なお、図１（ｂ）に示す抵抗器１０ｂは上記工程を変更することで得られる。すなわち、電極板材２０ｂは図２Ｂに示す構造のとおり、電極板材２０ｂの一方の面と同一平面を構成するように連結部材２３ｂを形成する。図３（ａ）から（ｃ）に示す積層工程のとおり、抵抗板材２０ａの上下それぞれの面に、連結部材２３ｂが形成された平面が接するように、電極板材２０ｂを接合する。そして、連結部材２３ａは完全に除去し、連結部材２３ｂは個別抵抗体２２を挟んで一対となる部分を残して切断除去する。これにより、電極１２の抵抗体側の端面から上方に突出する電圧検出端子である突部１４を備えた抵抗器１０ｂが得られる。なお、抵抗器１０ｂは、図２Ａの抵抗部材２０ａにおいて個別抵抗体２２の直径を小さくするのであるが、これは任意である。
In addition, the resistor 10b shown in FIG.1 (b) is obtained by changing the said process. That is, the electrode plate member 20b forms the connecting member 23b so as to form the same plane as one surface of the electrode plate member 20b as shown in the structure shown in FIG. 2B. 3A to 3C, the electrode plate member 20b is joined so that the upper and lower surfaces of the resistance plate member 20a are in contact with the plane on which the connecting member 23b is formed. Then, the connecting member 23a is completely removed, and the connecting member 23b is cut and removed while leaving a pair of parts with the individual resistor 22 interposed therebetween. Thereby, the resistor 10b provided with the protrusion 14 which is a voltage detection terminal protruding upward from the end surface of the electrode 12 on the resistor side is obtained. In addition, although the resistor 10b makes the diameter of the individual resistor 22 small in the resistance member 20a of FIG. 2A, this is arbitrary.
次に、シャント抵抗器１０ｃ（図１（ｃ）参照）に係る本発明の第２実施例の製造工程について説明する。まず、準備する抵抗板材２０ａに、図４Ａに示すように、その上面および下面に、金属膜２５を形成する。金属膜２５は、Ｓｎ，Ｎｉ，Ｃｕ等の金属材料からなる膜であり、電解メッキ等により形成する。なお、Ｃｕのナノペーストをスクリーン印刷し、これを加温硬化することで形成してもよい。
Next, the manufacturing process of the second embodiment of the present invention relating to the shunt resistor 10c (see FIG. 1C) will be described. First, as shown in FIG. 4A, a metal film 25 is formed on the upper and lower surfaces of the resistance plate member 20a to be prepared. The metal film 25 is a film made of a metal material such as Sn, Ni, or Cu, and is formed by electrolytic plating or the like. Alternatively, Cu nano paste may be screen-printed and heated and cured.
そして、図４Ｂに示すように、板材２０ａにパターニングにより穴あけ加工をして、キャリア部（枠部）２１と、複数の個別抵抗体２２ａと、キャリア部と個別抵抗体を連結する連結部２３ａを形成する。従って、個別抵抗体２２ａの上下の両表面には金属膜２５が形成されている。ここで、個別抵抗体２２ａは、抵抗体内部に貫通孔を有する筒状体として形成している。
Then, as shown in FIG. 4B, the plate member 20a is drilled by patterning to form a carrier portion (frame portion) 21, a plurality of individual resistors 22a, and a connecting portion 23a for connecting the carrier portion and the individual resistors. Form. Therefore, the metal film 25 is formed on both upper and lower surfaces of the individual resistor 22a. Here, the individual resistor 22a is formed as a cylindrical body having a through hole inside the resistor.
次に、上記板材２０ａを用い、図３に示した積層・圧着工程により、パターン形成した板材２０ａの上下両面に、パターン形成した電極板材２０ｂ（図２Ｂ参照）を重ねて、位置決め孔Ｈをピンにより位置合わせして、圧力および熱を加えて圧接により接合する。そして、板材２０ａの連結部２３ａおよび板材２０ｂの連結部２３ｂを切断して除去することで、図１（ｃ）に示す個々の抵抗器１０ｃを形成する。
Next, using the plate material 20a, the patterned electrode plate material 20b (see FIG. 2B) is overlapped on the upper and lower surfaces of the patterned plate material 20a by the laminating / crimping process shown in FIG. And then joining by pressure welding while applying pressure and heat. And the connection part 23a of the board | plate material 20a and the connection part 23b of the board | plate material 20b are cut | disconnected and removed, and each resistor 10c shown in FIG.1 (c) is formed.
抵抗器１０ｃは、環状の抵抗体１１を備え、その両側に金属膜１３を備える。環状の抵抗体１１は高周波電流が流れた時に表皮効果（skin effect）による電流経路の変動幅が小さく、従って、高周波電流の検出に好適なシャント抵抗器１０ｃが得られる。
The resistor 10c includes an annular resistor 11 and includes metal films 13 on both sides thereof. The annular resistor 11 has a small fluctuation range of the current path due to the skin effect when a high-frequency current flows, and thus a shunt resistor 10c suitable for detecting a high-frequency current can be obtained.
積層・圧着工程において、抵抗板材として特にＣｕ－Ｍｎ－Ｎｉ系の抵抗材料を用いた場合、電極との接合面が酸化していると、十分な接合強度が得られない場合がある。金属膜２５を予め個別抵抗体２２ａの上下面に設けておくことで、Ｃｕ－Ｍｎ－Ｎｉ系の抵抗材料を用いた場合にもその表面の酸化を防止でき、個別電極材２４の接合面に対して良好な接合性が得られ、上記不良品の発生を防止できる。
In the lamination / crimping process, when a resistance material such as Cu—Mn—Ni is used as the resistance plate material, if the bonding surface with the electrode is oxidized, sufficient bonding strength may not be obtained. By providing the metal film 25 on the upper and lower surfaces of the individual resistor 22a in advance, even when a Cu—Mn—Ni-based resistor material is used, the oxidation of the surface can be prevented, and the bonding surface of the individual electrode material 24 can be prevented. On the other hand, good bondability can be obtained, and the occurrence of the defective product can be prevented.
次に、シャント抵抗器１０ｄ（図１（ｄ）参照）に係る本発明の第３実施例の製造工程について説明する。抵抗器１０ｄは角形の抵抗体１１Ａと角形の中間電極１２Ａと角形の電極１２を備え、該中間電極１２Ａから突出し、電圧検出端子として用いるための突部１４を備えている。
Next, the manufacturing process of the third embodiment of the present invention relating to the shunt resistor 10d (see FIG. 1D) will be described. The resistor 10d includes a rectangular resistor 11A, a rectangular intermediate electrode 12A, and a rectangular electrode 12, and includes a protrusion 14 that protrudes from the intermediate electrode 12A and is used as a voltage detection terminal.
まず、図５Ａに示すように、抵抗板材２０ｃにパターニングにより穴あけ加工をして、キャリア部（枠部）２１と、複数の四角形状の個別抵抗体２２ｂと、キャリア部と個別抵抗体を連結する連結部２３ｃを形成する。同様に、図５Ｂに示すように、中間電極板材２０ｄにパターニングにより穴あけ加工をして、キャリア部（枠部）２１と、複数の個別中間電極２５ｂと、キャリア部と個別中間電極を連結する連結部２３ｅを形成する。個別中間電極２５ｂは個別抵抗体２２ｂと同一パターン形状の角形をなし、個別中間電極２５ｂから突出した電圧検出端子として用いるための突部２５ｃを備える。
First, as shown in FIG. 5A, the resistance plate material 20c is drilled by patterning to connect the carrier portion (frame portion) 21, a plurality of rectangular individual resistors 22b, and the carrier portion and the individual resistors. A connecting portion 23c is formed. Similarly, as shown in FIG. 5B, the intermediate electrode plate 20d is drilled by patterning to connect the carrier portion (frame portion) 21, the plurality of individual intermediate electrodes 25b, and the carrier portion and the individual intermediate electrodes. A portion 23e is formed. The individual intermediate electrode 25b has a rectangular shape with the same pattern as the individual resistor 22b, and includes a protrusion 25c for use as a voltage detection terminal protruding from the individual intermediate electrode 25b.
さらに、図５Ｃに示すように、電極板材２０ｅにパターニングにより穴あけ加工をして、キャリア部（枠部）２１と、複数の個別電極材２４ｂと、キャリア部と個別抵抗体を連結する連結部２３ｄを形成する。個別電極材２４ｂも個別中間電極材２５ｂも個別抵抗体２２ｂと同一の四角形状のパターン形状をなしているが、板材の材料および厚さが異なっている。なお、中間電極板材２０ｄは後に電極１２の一部となるため、電極板材２０ｅと同一金属材にすることが好ましい。
Further, as shown in FIG. 5C, the electrode plate member 20e is drilled by patterning to connect the carrier portion (frame portion) 21, the plurality of individual electrode materials 24b, and the carrier portion and the individual resistor 23d. Form. Both the individual electrode material 24b and the individual intermediate electrode material 25b have the same rectangular pattern shape as the individual resistor 22b, but the material and thickness of the plate material are different. Since the intermediate electrode plate 20d will be part of the electrode 12 later, it is preferable to use the same metal material as the electrode plate 20e.
そして、図６（ａ）（ｂ）（ｃ）に示すように、パターン形成した抵抗板材２０ｃの上下両面に、パターン形成した中間電極板材２０ｄを介在させ、パターン形成した電極板材２０ｅを重ね、位置決め孔をピンにより位置合わせして積層し、圧力および熱を加えて圧接により接合する。そして、抵抗板材２０ｃの連結部２３ｃ、中間電極板材２０ｄの連結部２３ｅ、および電極板材２０ｅの連結部２３ｄを切断して除去することで、図１（ｄ）に示す個々の抵抗器１０ｄを形成する。
Then, as shown in FIGS. 6A, 6B, and 6C, the patterned intermediate electrode plate material 20d is interposed between the upper and lower surfaces of the patterned resistance plate material 20c, and the patterned electrode plate material 20e is overlaid and positioned. The holes are aligned by pins and laminated, and pressure and heat are applied to join the holes by pressure welding. Then, the individual resistor 10d shown in FIG. 1 (d) is formed by cutting and removing the connecting portion 23c of the resistance plate member 20c, the connecting portion 23e of the intermediate electrode plate member 20d, and the connecting portion 23d of the electrode plate member 20e. To do.
従って、連結部２３ｃ、２３ｄ、２３ｅの切断除去により、個別抵抗体２２ｂが角形の抵抗体１１Ａとなり、個別電極材２４ｂが角形の電極１２となり、突部２５ｃを備えた個別中間電極材２５ｂが突部１４を備えた角形の中間電極１２Ａとなる。突部１４は電圧検出端子として用いるためのもので、抵抗体１１Ａの両端に生じる電圧を直近位置で検出することができる。
Therefore, by cutting and removing the connecting portions 23c, 23d, and 23e, the individual resistor 22b becomes the square resistor 11A, the individual electrode material 24b becomes the square electrode 12, and the individual intermediate electrode material 25b having the protrusion 25c protrudes. A square intermediate electrode 12 </ b> A having the portion 14 is formed. The protrusion 14 is for use as a voltage detection terminal, and can detect the voltage generated at both ends of the resistor 11A at the nearest position.
次に、図７Ａから７Ｃに係る本発明の第４実施例の製造工程について説明する。まず、図７Ａに示すように、抵抗板材２０ｆを準備し、これをパターニングすることで、長い貫通孔Ｅを形成する。従って、抵抗板材２０ｆの外周に枠部（キャリア部）２１が形成され、長い貫通孔Ｅによって仕切られた長い角板状の抵抗体２２Ｓが形成される。そして、図７Ｂに示すように、電極板材２０ｇを準備し、これをパターニングすることで、抵抗板材２０ｆと同じ位置に長い貫通孔Ｅを形成する。従って、電極板材２０ｇの外周に枠部（キャリア部）２１が形成され、長い貫通孔Ｅによって仕切られた長い角柱状の電極材２４Ｓが形成される。
Next, the manufacturing process of the fourth embodiment of the present invention according to FIGS. 7A to 7C will be described. First, as shown to FIG. 7A, the resistance plate material 20f is prepared and this is patterned, The long through-hole E is formed. Therefore, a frame portion (carrier portion) 21 is formed on the outer periphery of the resistance plate material 20f, and a long square plate-shaped resistor 22S partitioned by the long through holes E is formed. Then, as shown in FIG. 7B, an electrode plate material 20g is prepared and patterned to form a long through hole E at the same position as the resistance plate material 20f. Therefore, the frame part (carrier part) 21 is formed on the outer periphery of the electrode plate material 20g, and the long prismatic electrode material 24S partitioned by the long through holes E is formed.
次に、図７Ｃ（ａ）（ｂ）（ｃ）に示すように、抵抗板材２０ｆの上下両面に電極板材２０ｇを位置合わせして積層し、圧力および熱を加えて圧接により接合する。これにより、長い貫通孔Ｅによって仕切られた長い角板状の抵抗体２２Ｓとその両側に接合した長い角柱状の電極材２４Ｓからなる積層体が形成される。そして、この積層体を切断線Ｃ（図７Ｃ（ｂ）参照）に沿ってダイシング等で切断することで、図７Ｃ（ｄ）に示す抵抗器１０ｅが得られる。抵抗器１０ｅは、角形の抵抗体１１Ａとその両側に配置した角形の電極１２，１２からなる。この実施例において連結部は部位として明確に区別されないが、ダイシング等で切断される部位が連結部として理解され、また枠部２１と接する部位が連結部として理解される。
Next, as shown in FIGS. 7C (a), (b), and (c), the electrode plate material 20g is aligned and laminated on the upper and lower surfaces of the resistance plate material 20f, and pressure and heat are applied to join them by pressure welding. As a result, a laminate composed of the long rectangular plate-like resistor 22S partitioned by the long through-hole E and the long prismatic electrode material 24S bonded to both sides thereof is formed. And this resistor 10e shown to FIG. 7C (d) is obtained by cut | disconnecting this laminated body by a dicing etc. along the cutting line C (refer FIG. 7C (b)). The resistor 10e includes a square resistor 11A and square electrodes 12 and 12 disposed on both sides thereof. In this embodiment, the connecting part is not clearly distinguished as a part, but a part cut by dicing or the like is understood as the connecting part, and a part in contact with the frame part 21 is understood as the connecting part.
次に、図８に係る本発明の第５実施例の製造工程について説明する。この製造工程は前述した第１実施例の変形例であり、抵抗板材２０ａの個別抵抗体２２の上下両面に、断面四角形状の角形電極材２４ｄを個別に（パターン形成した板材を用いることなく）、圧接等により接合するものである。
Next, the manufacturing process of the fifth embodiment according to the present invention shown in FIG. 8 will be described. This manufacturing process is a modification of the first embodiment described above, and square electrode members 24d having a square cross section are individually provided on both the upper and lower surfaces of the individual resistor 22 of the resistor plate member 20a (without using a plate member on which a pattern is formed). Bonding by pressure welding or the like.
すなわち、前述したように、抵抗板材２０ａは、キャリア部２１と、複数の個別抵抗体２２と、キャリア部と個別抵抗体を連結する連結部２３ａを備える。そして、個別抵抗体２２の上面と下面に、単体の電極材２４ｄを圧接等により接合し、連結部２３ａを切断する工程により、抵抗器１０ａが完成する。従って、個別電極材２４と単体の電極材２４ｄを同一とすることで、抵抗器１０ａ（図１（ａ）参照）は第１実施例により製作されたものと同一のものが得られる。
That is, as described above, the resistance plate member 20a includes a carrier portion 21, a plurality of individual resistors 22, and a connecting portion 23a that connects the carrier portion and the individual resistors. And the resistor 10a is completed by the process of joining the single-piece | electrode electrode material 24d to the upper surface and lower surface of the separate resistor 22 by pressure welding etc., and cut | disconnecting the connection part 23a. Accordingly, by making the individual electrode material 24 and the single electrode material 24d the same, the resistor 10a (see FIG. 1A) is the same as that manufactured by the first embodiment.
次に、図９に係る本発明の第６実施例の製造工程について説明する。第１から第５実施例では、１枚の抵抗板材を準備し、これに穴あけ加工をして、キャリア部と、複数の個別抵抗体と、キャリア部と個別抵抗体を連結する連結部を形成し、２枚の電極材を準備し、これを抵抗板材の個別抵抗体の上面と下面に、それぞれ接合していた。しかしながら、抵抗板材および電極板材は厚くなるに従い、パターニングによる穴あけ加工が難しくなるという問題がある。
Next, the manufacturing process of the sixth embodiment of the present invention according to FIG. 9 will be described. In the first to fifth embodiments, a single resistor plate material is prepared and drilled to form a carrier portion, a plurality of individual resistors, and a connecting portion for connecting the carrier portion and the individual resistors. Then, two electrode materials were prepared, and these were joined to the upper surface and the lower surface of the individual resistor of the resistance plate material, respectively. However, as the resistance plate material and the electrode plate material become thicker, there is a problem that drilling by patterning becomes difficult.
そこで、本実施例では、抵抗板材および電極板材を何層にも分けて積層した積層抵抗板材および積層電極板材を用いている。何層にも分けて積層することで、一層当たりの板材厚さを薄くでき、これによりパターニングが容易になるというメリットが生じる。特に、連結部は後で切断除去し易い厚さに制御する必要があるが、層数を分けることで、この制御が不要となる。また、抵抗板材の層数によって抵抗特性の調整が可能となるメリットも生じる。
Therefore, in this embodiment, a laminated resistor plate material and a laminated electrode plate material are used in which a resistive plate material and an electrode plate material are laminated in several layers. By laminating the layers into several layers, the thickness of the plate material per layer can be reduced, and this has the advantage of facilitating patterning. In particular, the connecting portion needs to be controlled to a thickness that can be easily cut and removed later, but this control becomes unnecessary by dividing the number of layers. In addition, there is a merit that the resistance characteristic can be adjusted by the number of layers of the resistance plate material.
これまで本発明の一実施形態について説明したが、本発明は上述の実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。
Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.
本発明は、抵抗体として金属材からなる抵抗材料を用いたシャント抵抗器の製造に好適に利用可能である。
The present invention can be suitably used for manufacturing a shunt resistor using a resistance material made of a metal material as a resistor.
Claims (6)
- 抵抗材料からなる金属材からなり、上面と下面を有する抵抗板材を準備する工程と、
該抵抗板材に穴あけ加工をして、キャリア部と、複数の個別抵抗体と、キャリア部と個別抵抗体を連結する連結部を形成する工程と、
前記個別抵抗体における上面と下面に、電極として用いる電極材を接合する工程と、
前記連結部を切断する工程と、からなることを特徴とする抵抗器の製造方法。 A step of preparing a resistance plate material made of a metal material made of a resistance material and having an upper surface and a lower surface;
Drilling the resistance plate material to form a carrier portion, a plurality of individual resistors, and a connecting portion for connecting the carrier portion and the individual resistors;
Bonding an electrode material used as an electrode to the upper and lower surfaces of the individual resistor;
And a step of cutting the connecting portion. A method of manufacturing a resistor. - 前記抵抗材料よりも電気導電性のよい金属材からなり、上面と下面を有する複数の電極板材を準備する工程と、
該電極板材に穴あけ加工をして、キャリア部と、複数の個別電極材と、キャリア部と個別電極材を連結する連結部を形成する工程とを備え、
前記電極材を接合する工程は、前記抵抗板材の上面と下面に、前記電極板材を接合する工程であることを特徴とする請求項１に記載の抵抗器の製造方法。 A step of preparing a plurality of electrode plate members made of a metal material having better electrical conductivity than the resistance material and having an upper surface and a lower surface;
Drilling the electrode plate material, and forming a carrier portion, a plurality of individual electrode materials, and a connecting portion for connecting the carrier portion and the individual electrode material,
The method of manufacturing a resistor according to claim 1, wherein the step of bonding the electrode material is a step of bonding the electrode plate material to an upper surface and a lower surface of the resistance plate material. - 前記電極板材には、前記個別電極材から突出し、電圧検出端子として用いるための突部が形成されていることを特徴とする請求項２に記載の抵抗器の製造方法。 3. The method of manufacturing a resistor according to claim 2, wherein the electrode plate material is formed with a protrusion protruding from the individual electrode material and used as a voltage detection terminal.
- 前記抵抗板材の上面および下面には、予め金属膜が形成されていることを特徴とする請求項１乃至３のいずれかに記載の抵抗器の製造方法。 4. The method of manufacturing a resistor according to claim 1, wherein a metal film is formed in advance on an upper surface and a lower surface of the resistance plate member.
- 前記抵抗板材と前記電極材または前記個別電極材の間に、前記抵抗材料よりも電気導電性のよい金属材を介在させることを特徴とする請求項１または２に記載の抵抗器の製造方法。 3. The method of manufacturing a resistor according to claim 1, wherein a metal material having better electrical conductivity than the resistance material is interposed between the resistance plate material and the electrode material or the individual electrode material.
- 前記抵抗板材と前記電極板材は、圧接により接合されることを特徴とする請求項２に記載の抵抗器の製造方法。 3. The method of manufacturing a resistor according to claim 2, wherein the resistance plate member and the electrode plate member are joined by pressure welding.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-273081 | 2013-12-27 | ||
| JP2013273081A JP6294073B2 (en) | 2013-12-27 | 2013-12-27 | Resistor manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015098635A1 true WO2015098635A1 (en) | 2015-07-02 |
Family
ID=53478499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2014/083343 WO2015098635A1 (en) | 2013-12-27 | 2014-12-17 | Method for manufacturing resistor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6294073B2 (en) |
| WO (1) | WO2015098635A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6983527B2 (en) * | 2017-03-30 | 2021-12-17 | Koa株式会社 | Current detection resistor |
| JP2019036571A (en) * | 2017-08-10 | 2019-03-07 | Koa株式会社 | Manufacturing method of resistor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001118701A (en) * | 1999-10-19 | 2001-04-27 | Koa Corp | Low-resistance resistor for detecting current and its manufacturing method |
| JP2004327906A (en) * | 2003-04-28 | 2004-11-18 | Rohm Co Ltd | Chip resistor and its manufacturing method |
| JP2009216620A (en) * | 2008-03-12 | 2009-09-24 | Koa Corp | Shunt resistor device |
| JP2011003694A (en) * | 2009-06-18 | 2011-01-06 | Koa Corp | Shunt resistor, and method of manufacturing the same |
| JP2011114038A (en) * | 2009-11-24 | 2011-06-09 | Koa Corp | Method of adjusting resistance value of resistor |
-
2013
- 2013-12-27 JP JP2013273081A patent/JP6294073B2/en active Active
-
2014
- 2014-12-17 WO PCT/JP2014/083343 patent/WO2015098635A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001118701A (en) * | 1999-10-19 | 2001-04-27 | Koa Corp | Low-resistance resistor for detecting current and its manufacturing method |
| JP2004327906A (en) * | 2003-04-28 | 2004-11-18 | Rohm Co Ltd | Chip resistor and its manufacturing method |
| JP2009216620A (en) * | 2008-03-12 | 2009-09-24 | Koa Corp | Shunt resistor device |
| JP2011003694A (en) * | 2009-06-18 | 2011-01-06 | Koa Corp | Shunt resistor, and method of manufacturing the same |
| JP2011114038A (en) * | 2009-11-24 | 2011-06-09 | Koa Corp | Method of adjusting resistance value of resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015128104A (en) | 2015-07-09 |
| JP6294073B2 (en) | 2018-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10553368B2 (en) | Galvanic pellicle removable attachment tool | |
| WO2014038372A1 (en) | Current detection resistor | |
| JP6028729B2 (en) | Shunt resistor and manufacturing method thereof | |
| JP5915821B2 (en) | Electromagnet manufacturing method and electromagnet | |
| WO2011068205A1 (en) | Shunt resistor and method for producing same | |
| WO2015186328A1 (en) | Thermoelectric conversion element sheet, method for manufacturing same, and method for manufacturing thermoelectric conversion device | |
| JP6388015B2 (en) | Coil parts and coil equipment | |
| WO2018159333A1 (en) | Coiled electronic component, coil component, coil component manufacturing method, inductance element, t-type filter, oscillating circuit, and inductance element manufacturing method | |
| JP2004319787A (en) | Chip resistor and its manufacturing method | |
| JP6294073B2 (en) | Resistor manufacturing method | |
| WO1999003113A1 (en) | Ptc thermistor chip and method for manufacturing the same | |
| WO2004040592A1 (en) | Chip resistor, process for producing the same, and frame for use therein | |
| JP4725432B2 (en) | Multilayer piezoelectric element and piezoelectric device | |
| US20180211775A1 (en) | Multi-layer electromagnet structure and manufacturing process | |
| WO2015194413A1 (en) | Current detection resistor | |
| JP2000124003A (en) | Chip-type ptc thermistor and its manufacture | |
| JP6145664B2 (en) | Method for manufacturing thermoelectric conversion module | |
| JP2014165194A (en) | Chip resistor and method of manufacturing chip resistor | |
| JP6354220B2 (en) | Multilayer electronic components | |
| JP4690033B2 (en) | Multilayer type magnetic element | |
| JP5860639B2 (en) | Low resistance metal fixed resistor manufacturing method | |
| JP2014078642A (en) | Laminated coil and manufacturing method of the same | |
| WO2015054949A1 (en) | Power capacitor and manufacturing method thereof | |
| JP6011967B2 (en) | Multilayer coil and method of manufacturing the same | |
| JPH10223401A (en) | Resistor and production thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14875663 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 14875663 Country of ref document: EP Kind code of ref document: A1 |