JP6388015B2 - Coil parts and coil equipment - Google Patents

Description

  The present invention relates to a coil device used as an inductor, for example, and a coil component disposed inside the coil device.

  Various electronic devices are equipped with many coil devices used as inductors. As an example of such a coil device, for example, a coil device shown in Patent Document 1 has been developed. In the coil device shown in Patent Document 1, a pair of spiral conductive metal pieces are laminated, and the inner ends of the metal pieces are welded to each other and connected.

  However, in the conventional coil apparatus, since each metal piece is thin and flat, it is difficult to ensure sufficient bending strength of the coil component in which the inner ends of each metal piece are connected. When the coil component has insufficient bending strength, when the coil component is transported, or when the coil component is placed inside the mold and a granule containing magnetic powder is compressed to form a powder magnetic core. In addition, a load is applied to the coil component, and each metal piece is displaced or deformed.

JP 2004-327622 A

  This invention is made | formed in view of such an actual condition, The objective is to provide the coil component which has sufficient bending strength, and the coil apparatus which has the coil component.

In order to achieve the above object, the coil component according to the first aspect of the present invention provides:
A wide region that is wide and a narrow region that is narrow are formed along the longitudinal direction of the pattern groove, and a conductive plate piece having a two-dimensional predetermined pattern;
And an insulator for connecting the pattern edges facing each other across the narrow region.

  In the first aspect of the present invention, the conductive plate piece is formed with a wide region and a narrow region along the longitudinal direction of the pattern groove. Therefore, when an insulating coating is applied to the conductive plate piece, an insulator is formed at each pattern edge facing the narrow region. When the thickness of the insulator with respect to the width of the narrow region increases, the inside of the narrow region is filled with the insulator, and the pattern edges facing each other across the narrow region are connected via the insulator.

  As described above, since the insulator that connects the pattern edges facing each other across the narrow region is provided, the pattern edges are integrated via the insulator along the longitudinal direction of the pattern groove. Therefore, the mechanical strength (for example, bending strength) of the conductive plate piece is increased. Then, by configuring the coil component with the conductive plate piece having increased mechanical strength, the coil component has sufficient mechanical strength.

  Further, since the narrow region is narrower than the wide region, the thickness of the insulator that connects the pattern edges facing each other across the narrow region does not have to be so thick. Therefore, the film formation time for forming the thickness of the insulator that connects the pattern edges facing each other across the narrow region can be shortened. Moreover, when resin is used as a material constituting the insulator, for example, bubbles in the resin are easily removed. Thereby, the adhesive strength between each pattern edge and the insulator is increased, and the insulator is difficult to peel from each pattern edge.

  In addition, since the wide region is wider than the narrow region, the material for forming the insulator smoothly enters through the wide region. Therefore, when an insulating coating is applied to the conductive plate piece, a smooth insulating coating through the wide region is realized inside the pattern groove.

  Further, when using a resin as a material constituting the insulator, by curing the resin, the pattern edges facing each other across the narrow region can be connected with a high bonding force through the cured resin. it can. Therefore, the strength of the coil component can be made sufficient. In addition, it is possible to effectively prevent the conductive plate piece from being peeled off from a compression molded body (core) such as a magnetic powder filled in the coil device.

  Further, by increasing the strength of the coil component, when the coil component is transported, or when the coil component is placed inside the mold, a granule containing magnetic powder or the like is compression molded to form a dust core. At this time, even if a load is applied to the coil component, it is difficult for the conductive plate pieces to be displaced or deformed, and the conductive plate pieces are kept horizontal to each other. For this reason, the dispersion | variation in the characteristic (inductance characteristic etc.) of a coil apparatus can be suppressed.

  Preferably, the wide area and the narrow area are alternately arranged along the longitudinal direction of the predetermined pattern. By setting it as such a structure, since the pattern edges which oppose on both sides of a narrow area | region are connected via an insulator with a fixed pitch, the intensity | strength of a coil component can further be improved.

  Preferably, a ratio (G2 / G1) of the width (G2) of the narrow region to the width (G1) of the wide region is 0.1 to 0.9. With such a configuration, the conductive plate pieces are formed with a wide area and a narrow area having an appropriate width, and the narrow area is formed while smoothly covering the inside of the pattern groove through the wide area. It is possible to form an insulator that firmly connects the pattern edges opposed to each other.

In order to achieve the above object, the coil component according to the second aspect of the present invention includes:
A conductive plate piece having a two-dimensional predetermined pattern in which a wide part to be wide and a narrow part to be narrow are formed along the longitudinal direction;
And an insulator that connects the pattern edges of the conductive plate pieces facing each other across the pattern groove.

  In the coil component according to the second aspect of the present invention, the wide portion and the narrow portion are formed in the predetermined pattern along the longitudinal direction of the pattern. Therefore, the pattern edges of the wide part face each other across the pattern groove, and the pattern edges of the narrow part face each other, and the pattern edge of the wide part and the pattern of the narrow part sandwich the pattern groove. There are cases where the edges face each other and intermediate cases between them.

  When the pattern edges of the wide part face each other and the pattern edges of the narrow part face each other across the pattern groove, the pattern groove has a wide area and a narrow area in the longitudinal direction of the pattern groove. Formed along. In this case, similarly to the coil component according to the first aspect, the pattern edges of the conductive plate pieces (more precisely, the wide portions) facing each other with the pattern groove interposed therebetween are connected via the insulator. That is, the pattern edges are integrated via an insulator along the longitudinal direction of the pattern groove. Therefore, the strength of the conductive plate piece is increased. And a coil part is comprised with sufficient intensity | strength by comprising a coil part with the electroconductive board piece by which this intensity | strength was raised.

  On the other hand, when the pattern edge of the wide portion and the pattern edge of the narrow portion face each other across the pattern groove, a region having a substantially constant width is formed along the longitudinal direction of the pattern groove. The That is, the wide region and the narrow region are not formed in the pattern groove along the longitudinal direction of the pattern groove. Even in such a case, the pattern groove is formed to be bent, and the pattern edges are connected to each other via an insulator, so that the coil component has sufficient strength.

  Moreover, since the wide part and the narrow part are formed in the predetermined pattern along the longitudinal direction of the pattern, the shape of the pattern edge of the conductive plate piece is uneven. Therefore, the surface area per unit length in the longitudinal direction of the pattern edge is larger than when the shape of the pattern edge is a linear shape or a winding curve shape, and more insulators are formed on the pattern edge. As a result, the bonding area between the insulator and the pattern edge increases, and the insulator becomes difficult to peel off from the pattern edge.

In order to achieve the above object, the coil component according to the third aspect of the present invention includes:
A conductive plate piece in which a two-dimensional predetermined pattern is formed along the longitudinal direction;
An insulator for connecting the pattern edges of the conductive plate pieces facing each other across the pattern groove; and
At least one of the pattern edges of the conductive plate pieces facing each other with the pattern groove interposed therebetween is formed with repeated irregularities at a predetermined pitch.

  In the coil component according to the third aspect of the present invention, wide regions and narrow regions can be alternately formed along the longitudinal direction of the pattern groove. Therefore, it can have the same effect as the coil component according to the first aspect.

  Further, in the coil component according to the third aspect of the present invention, the concave and convex portions are repeatedly formed at a predetermined pitch on both of the pattern edges of the conductive plate pieces facing each other across the pattern groove. By aligning the positions, a pattern groove having a substantially constant width can be formed along the longitudinal direction of the pattern groove. Even in such a case, the pattern groove is formed to be bent, and the pattern edges are connected to each other via an insulator, so that the coil component has sufficient strength.

  Preferably, the predetermined pattern is a spiral pattern. With this configuration, the number of turns of the coil component can be increased.

  In the coil component according to the present invention, at least two or more conductive plate pieces are arranged in the stacking direction, and the two adjacent conductive plate pieces each have an inner end, and one of the conductive plate pieces. An inner convex portion that protrudes in the stacking direction from the two-dimensional plane of the predetermined pattern is formed on the inner end portion of the predetermined pattern, and the inner convex portion is electrically connected to the inner end portion of the other conductive plate piece. It is.

  In this way, the number of turns of the coil component can be further increased by configuring the coil component with at least two conductive plate pieces. Further, the inner end of one conductive plate piece of two adjacent conductive plate pieces and the inner convex portion of the other conductive plate piece are three-dimensionally connected between predetermined patterns of the respective conductive plate pieces. Is done. Therefore, a gap is formed between each predetermined pattern, and it is possible to prevent occurrence of a short circuit between the conductive plate pieces. In addition, it can prevent effectively that a short defect arises between each electroconductive board piece by interposing an insulating sheet in the said clearance gap.

  At least a part of the insulator filled in the pattern groove may be formed with a hole for communicating the front plate surface and the back plate surface of the conductive plate piece. As described above, since the pattern edges facing each other across the narrow region are connected by the insulator, the inside of the narrow region is closed by the insulator. On the other hand, the pattern edges facing each other across the wide region do not necessarily need to be connected by an insulator. Therefore, the wide area | region may be provided with the hole which connects the board surface of the front side of a conductive board piece, and the board surface of a back side. In the case of such a configuration, the magnetic powder is filled into the pores when the core portion is formed by compression molding or injection molding of granules containing magnetic powder or the like. As a result, the amount of magnetic powder filled in total increases, and the magnetic characteristics (for example, inductance value) of the coil device can be improved.

  A coil device according to the present invention includes the coil component according to any one of the above and a sealing portion that covers a main part of the coil component. The sealing portion may be made of a magnetic substance-containing resin. The coil component of the present invention can be easily embedded in the sealing portion.

FIG. 1A is a schematic perspective view of a coil device according to an embodiment of the present invention. FIG. 1B is a schematic plan view of a part of the first predetermined pattern of the coil device shown in FIG. 1A. 1C is a schematic plan view of a part of a modification of the first predetermined pattern of the coil device shown in FIG. 1A. FIG. 2 is a schematic cross-sectional view taken along line II-II of the coil device shown in FIG. FIG. 3A is a perspective view showing a process of manufacturing a coil component of the coil device shown in FIG. FIG. 3B is a perspective view showing a step subsequent to FIG. 3A. FIG. 3C (A) is a perspective view showing a continuation process of FIG. 3B, and FIG. 3C (B) is a partial schematic plan view showing the relationship between the pattern groove and the resin layer shown in FIG. 3C (A). FIG. 3D (A) is a perspective view showing a continuation process of FIG. 3C (A), and FIG. 3D (B) is a partial schematic plan view showing the relationship between the pattern groove and the resin layer shown in FIG. 3D (A). 3E is a schematic cross-sectional view taken along line IIIE-IIIE of the coil device shown in FIG. 3D. FIG. 4A is a schematic perspective view of a coil device according to another embodiment of the present invention. 4B is a schematic cross-sectional view taken along line IVB-IVB of the coil device shown in FIG. 4A. FIG. 5 is an exploded perspective view of a coil component of the coil device shown in FIG. 4A.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings.

First Embodiment As shown in FIG. 1A, an inductor element 2 as a coil device according to an embodiment of the present invention includes a core part (sealing part) 4 as a compression molded body, and a coil inside the core part 4. And a coil component 6 to be configured. The main part of the coil component 6 is covered by the core part 4. The main part of the coil component 6 is a part excluding the lead parts 17 a and 17 b exposed from the core part 4.

  As shown in FIG. 2, the coil component 6 includes a plurality of conductive plate pieces 6a and 6b stacked in the Z-axis direction (stacking direction). In the following embodiments, two first and second conductive plate pieces 6a and 6b are described as being laminated in the Z-axis direction to constitute the coil component 6, but the present invention is not limited to this.

  As shown in FIG. 3B, the first conductive plate piece 6a has a spiral-shaped (spiral) first predetermined pattern 5a on a two-dimensional plane including the X axis and the Y axis. The first predetermined pattern 5a is formed by forming a spiral first predetermined pattern groove 7a in the first conductive plate piece 6a. In the present embodiment, the first predetermined pattern groove 7a constitutes a spiral groove. Although the Z-axis direction plate | board thickness of the 1st electroconductive board piece 6a is not specifically limited, For example, it is 0.1-0.6 mm.

  More specifically, as shown in FIG. 1B, the first conductive plate piece 6a includes a wide region 7a1 widened in a direction substantially perpendicular to the longitudinal direction L of the first predetermined pattern groove 7a, and the longitudinal direction. Narrow regions 7a2 narrow in the direction substantially perpendicular to the direction L are alternately formed along the longitudinal direction L. In the example shown in FIG. 1B, the longitudinal direction L corresponds to the X-axis direction or the Y-axis direction. However, when the first predetermined pattern groove 7a is a curve along the winding, the longitudinal direction L is The direction is along the curve.

  The pattern groove 7a composed of the first wide region 7a1 and the first narrow region 7a2 is, for example, a first conductive plate piece using a cutting tool having a blade having a wide portion and a narrow portion formed on the blade surface. It is formed by punching 6a. Alternatively, the pattern groove 7a may be formed by, for example, laser processing, wire cutting, water cutting, etching processing, or the like.

  Generally, when a punching process is performed on a metal plate, the blade cannot be made excessively thin with respect to the thickness of the metal plate in order to prevent the cutting tool blade from being broken. For example, conventionally, it has been considered that a pattern groove having a width smaller than the thickness of the metal plate cannot be formed in the metal plate. In the present embodiment, wide regions 7a1 and narrow regions 7a2 are alternately formed along the longitudinal direction of the pattern groove 7a.

  In order to design the blade of the cutting tool according to the pattern groove 7a, in this embodiment, the strength of the blade of the cutting tool can be increased, and the thickness of the first conductive plate piece 6a made of a metal plate can be increased. Thus, the narrow region 7a2 can be formed with a width G2 that is narrower than that of the conventional one. That is, the width G2 can be made, for example, about 30% smaller than the plate thickness of the first conductive plate piece 6a made of a metal plate. The width G1 of the wide region 7a1 may be equal to or larger than the plate thickness of the first conductive plate piece 6a, preferably 5 to 40% or more.

  For example, when the plate thickness of the first conductive plate piece 6a is 0.1 to 0.6 mm, the width G1 is preferably 0.1 to 0.6 mm, and the width G2 is preferably 0.05 to 0.6 mm. 0.1 mm. That is, the ratio G2 / G1 of the width G2 to the width G1 is preferably 0.1 to 0.9, and more preferably 0.2 to 0.5.

  The pitch P between the adjacent first wide regions 7a1 or the pitch P between the adjacent first narrow regions 7a2 is preferably 0.01 to 0.2 mm. The pitch P is preferably constant along the longitudinal direction L of the pattern groove 7a, but may vary. However, the pitch P is preferably in a range having the following relationship with respect to the width G1 of the wide region 7a1. That is, P / G1 is preferably 1 to 1/20. That is, the pitch P is preferably a sufficiently small size, preferably about 1/5 or less, more preferably about 1/10 or less, compared to the length of one round of the spiral pattern groove 7a.

  Thus, in this embodiment, the first wide regions 7a1 and the first narrow regions 7a2 are alternately formed in the first conductive plate pieces 6a along the longitudinal direction of the first predetermined pattern grooves 7a. . In the present embodiment, the spiral first predetermined pattern groove 7a is formed on the first conductive plate piece 6a so that the spiral first predetermined pattern 5a remains as a whole. In the present embodiment, the first predetermined pattern 5a includes a first wide portion 5a1 that is wide in a direction perpendicular to the longitudinal direction of the first predetermined pattern 5a (in this embodiment, the X-axis direction or the Y-axis direction), A first narrow portion 5a2 that becomes narrower in the same direction is formed along the longitudinal direction.

  That is, in the present embodiment, the wide portion 5a1 of the first predetermined pattern 5a located inside the spiral and the wide portion 5a1 of the first predetermined pattern 5a located outside the spiral are at substantially the same position in the circumferential direction. A first predetermined pattern groove 7a is formed so as to be positioned. Similarly, in this embodiment, the narrow portion 5a2 of the first predetermined pattern 5a located inside the spiral and the narrow portion 5a2 of the first predetermined pattern 5a located outside the spiral are in the circumferential direction. A first predetermined pattern groove 7a is formed so as to be located at substantially the same position. That is, the first wide portion 5a1 and the first narrow portion 5a2 are opposed to each other with the first wide portion 5a1 across the first wide region 7a1, and between the first narrow portions 5a2 across the first narrow region 7a2. Are positioned so as to face each other.

  The width W1 of the first wide portion 5a1 of the first conductive plate piece 6a in the direction substantially perpendicular to the longitudinal direction is preferably 0.05 to 2 mm. The width W2 of the first narrow portion 5a2 in the direction substantially perpendicular to the longitudinal direction is preferably 0.03 to 1.8 mm. The ratio W2 / W1 of the width W2 to the width W1 is preferably 0.3 to 0.9. The width W1 is preferably larger than the width G1, and W1 / G1 is preferably 1 to 4.

  As described above, the first conductive plate pieces 6a of the first predetermined pattern 5a have the first wide portions 5a1 and the first narrow portions 5a2 alternately along the longitudinal direction of the pattern 5a. When the first predetermined pattern 5a is viewed from the Z-axis direction, the shape of the ridge line connecting the pattern edges of the first wide portion 5a1 and the first narrow portion 5a2 is substantially sinusoidal. The shape of the ridge line connecting the pattern edges is not limited to this, and may be, for example, a rectangular wave shape, a sawtooth wave shape, a wave shape, or a repetitive shape of other irregularities.

  Further, the ridge line connecting the pattern edges may include a linear shape portion having a predetermined length or a curved shape portion along the winding direction between the repetition of the uneven shape and the repetition of the uneven shape. . Furthermore, in this embodiment, the uneven ridge line is formed on both sides in the width direction of the first conductive plate piece 6a, but the uneven ridge line is formed only on one side in the width direction of the first conductive plate piece 6a. May be formed.

  The number of turns of the spiral first predetermined pattern 5a is not particularly limited, but is preferably greater than 1 turn and within 10 turns, more preferably 1.5 to 5 turns. As shown in FIG. 3B, a first inner end 8a is formed at the inner end of the spiral first predetermined pattern 5a, and a first outer end is formed at the outer end of the spiral first predetermined pattern 5a. An end 10a is formed. The first outer end portion 10a is a portion located at the outer end of the spiral first predetermined pattern 5a.

  A first predetermined pattern groove 7a extends in a spiral shape from the first outer end portion 10a toward the first inner end portion 8a. “Helix” is not only a square (including rectangle) spiral as seen from the Z-axis direction shown in the figure, but also a circular helix, elliptical helix, other curved shape, or other polygonal helix. including.

  In the present embodiment, a first lead portion 17a is formed integrally with the first outer end portion 10a. The first lead portion 17a protrudes from the first outer end portion 10a in the outer radial direction of the spiral (in this embodiment, the X-axis direction). The first lead portion 17a is formed integrally with the lead frame 14a, and the lead frame 14a is removed in a later process.

  In the present embodiment, the first inner end portion 8a is a portion having a width wider than the pattern width of the spiral pattern 7a, and has a substantially rectangular shape. Since the first predetermined pattern groove 7a extends from the peripheral edge of the first inner end portion 8a, the shape of the pattern edge of the first inner end portion 8a is also an uneven shape as shown in FIG. 1B. The first inner end 8a is integrally formed with a first inner protrusion 9a that protrudes in the stacking direction (Z-axis direction) from the two-dimensional plane of the spiral pattern.

  As shown in FIG. 3D, the second conductive plate piece 6b has a second predetermined pattern 5b that is spiral in a two-dimensional plane including the X axis and the Y axis. The second predetermined pattern 5b is formed by forming a spiral second predetermined pattern groove 7b in the second conductive plate piece 6b. More specifically, as shown in FIG. 1B, the second conductive plate piece 6b includes a second wide region 7b1 and a second narrow region 7b2, as in the first conductive plate piece 6a. It is formed along the longitudinal direction of the predetermined pattern groove 7b. The second wide region 7b1 and the second narrow region 7b2 are the same as the first wide region 7a1 and the first narrow region 7a2. In the present embodiment, the second predetermined pattern groove 7b constitutes a spiral groove.

  The spiral second predetermined pattern 5b is the same as the spiral first predetermined pattern 5a except that the spiral predetermined pattern 5a is a reverse spiral pattern from the inside to the outside. That is, as shown in FIG. 3C, the first predetermined pattern 5a has a left-handed spiral shape, and as shown in FIG. 3D, the second predetermined pattern 5b has a right-handed spiral shape. In the second predetermined pattern 5b, as shown in FIG. 1B, a second wide portion 5b1 and a second narrow portion 5b2 are formed along the longitudinal direction of the second predetermined pattern 5b. The second wide portion 5b1 and the second narrow portion 5b2 are the same as the first wide portion 5a1 and the first narrow portion 5a2.

  A second inner end portion 8b is formed at the inner end of the spiral second predetermined pattern 5b, and a second outer end portion 10b is formed at the outer end of the spiral pattern 7b. A spiral second predetermined pattern groove 7a extends from the second outer end portion 10b toward the second inner end portion 8b. Further, since the second predetermined pattern groove 7a extends from the periphery of the second inner end portion 8b, the shape of the pattern edge of the second inner end portion 8a is also an uneven shape as shown in FIG. 1B.

  As shown in FIG. 3D, a lead portion 17b is formed integrally with the second outer end portion 10b. The lead portion 17b is formed opposite to the lead portion 17a in the X-axis direction, and is connected to a lead frame 14b to be removed in a later process.

  As shown in FIG. 2, the second inner end portion 8b is the same as the first inner end portion 8a except that a convex portion corresponding to the first inner convex portion 9a is not integrally formed. . Therefore, in the second inner end portion 8b, the plate surface on the side where the first conductive plate pieces 6a are arranged has a flat shape. The gap in the Z-axis direction between the first conductive plate piece 6a and the second conductive plate piece 6b is preferably 10 to 100 μm, more preferably 10 to 50 μm. In addition, the said clearance gap can be controlled by adjusting the height of the Z-axis direction of the 1st inner side convex part 9a, or the thickness of the insulating layer (insulator) 16. FIG.

  As shown in FIGS. 2 and 3D, the first conductive plate piece 6a and the second conductive plate piece 6b are provided with an insulating coating, and each conductive plate piece 6a and 6b is covered with an insulating layer 16. ing. In addition to the upper and lower surfaces of the first conductive plate piece 6a, the insulating layer 16 is also formed on the pattern edges of the first predetermined pattern 5a facing each other across the first predetermined pattern groove 7a. Similarly, the insulating layer 16 is formed not only on the upper and lower surfaces of the second conductive plate piece 6b but also on the pattern edge of the second predetermined pattern 5b facing each other across the second predetermined pattern groove 7b.

  However, as shown in FIG. 2, it is preferable not to form the insulating layer 16 near the center of the upper surface of the first inner end 8a and near the center of the lower surface of the second inner end 8b. This is to make it easier to form the joint 9ab between the first conductive plate piece 6a and the second conductive plate piece 6b after the insulating layer 16 is formed. Thus, by forming the insulating layer 16 on the first conductive plate piece 6a and the second inner end portion 8b, the conductive paths 15 of the conductive plate pieces 6a and 6b constituting the coil component 6 can be connected to each other. Can be insulated. In the present embodiment, the cross-sectional shape of the conductive path 15 is a rectangle.

  From the viewpoint of easily forming the insulating layer 16 between the first conductive plate piece 6a and the second conductive plate piece 6b, the insulating layer 16 is formed before the bonding portion 9ab is formed. It is preferable to form separately on the surface of the piece 6a and the 2nd electroconductive board piece 6b. However, in the present embodiment, after forming the joint portion 9ab between the first conductive plate piece 6a and the second conductive plate piece 6b, the first conductive plate piece 6a and the second conductive plate other than the joint portion 9ab are formed. An insulating layer 16 may be formed on the surface of the piece 6b. This is because the insulating material constituting the insulating layer 16 easily enters the gap between the first conductive plate piece 6a and the second conductive plate piece 6b from the wide regions 7a1 and 7b1 of the pattern grooves 7a and 7b.

  As shown in FIG. 2, when the joint portion 9ab is formed, the second wide region 7b1 of the second conductive plate piece 6b is necessarily overlapped with the first wide region 7a1 of the first conductive plate piece 6a. Thus, it is not necessary to arrange each conductive plate piece 6a and 6b. Similarly, the conductive plate pieces 6a and 6b are not necessarily placed so that the second narrow region 7b2 of the second conductive plate piece 6b is superimposed on the first narrow region 7a2 of the first conductive plate piece 6a. There is no need to place them. As shown in FIG. 2, the second narrow region 7b2 may be overlaid on the first wide region 7a1, and the second wide region 7b1 may be overlaid on the first narrow region 7a2.

  As shown in FIG. 3C (A) and FIG. 3C (B), the inside of the first narrow region 7a2 of the first conductive plate piece 6a provided with the insulating coating is filled with the insulating layer 16, and this insulating layer The pattern edges facing each other across the first narrow region 7a2 via 16 are connected to each other. On the other hand, an insulating layer 16 is formed with a constant thickness on each pattern edge facing the first wide region 7a1, and the insulating layers 16 formed on each pattern edge are separated from each other. Therefore, a hole 18 is formed in the first wide region 7a1 to communicate the front plate surface and the back plate surface of the first conductive plate piece 6a.

  Similarly, as shown in FIG. 3D (A) and FIG. 3D (B), the inside of the second conductive plate piece 6b and the second narrow region 7b2 to which the insulating coating is applied is filled with the insulating layer 16, Pattern edges that face each other across the second narrow region 7b2 through the insulating layer 16 are connected to each other. On the other hand, an insulating layer 16 is formed with a constant thickness on each pattern edge facing the second wide region 7b1, and the insulating layers 16 formed on each pattern edge are separated from each other. Therefore, a hole 18 is formed in the second wide region 7b1 to connect the front plate surface and the back plate surface of the second conductive plate piece 6b.

  The insulating layer 16 is made of a metal oxide or resin. Although it does not specifically limit as a metal oxide which comprises the insulating layer 16, A titanium oxide, an alumite, etc. are illustrated. Although it does not specifically limit as resin which comprises the insulating layer 16, Thermosetting resins, such as an epoxy resin, a urethane-type resin, or a polyimide resin, Thermosetting resins, such as a melamine resin and a phenol resin, UV curing, such as an epoxy Resins are exemplified. The method for applying the insulating coating or the oxide film is not particularly limited, and examples thereof include an electrodeposition method, a vapor deposition method, and a sputtering method.

  Although it does not specifically limit as a material of each electroconductive board piece 6a and 6b, For example, Cu, Al, Fe, Ag, Au, those alloys, etc. are illustrated.

  In the present embodiment, as shown in FIG. 2, the first inner convex portion 9a is electrically connected to the second inner end portion 8b to form a joint portion 9ab. The joint 9ab is formed near the center of the spiral patterns 7a and 7b. Since the insulating layer 16 is not formed or removed in the portions corresponding to the first inner end 8a and the second inner end 8b, the first inner protrusion 9a and the second inner end 8b The electrical connection is not hindered by the insulating layer 16. The joint portion 9ab can be formed by overlapping the first inner convex portion 9a and the second inner end portion 8b in the stacking direction and irradiating the portion with laser.

  In the present embodiment, as shown in FIG. 3D (A), the joining is performed in a state where the lead frames 14a and 14b are attached to the conductive plate pieces 6a and 6b, respectively. The core part 4 shown may be formed, and then the lead frames 14a and 14b may be removed by cutting or the like. Alternatively, the lead frames 14a and 14b may be removed by cutting or the like before the core portion 4 is formed. As shown in FIG. 2, in the present embodiment, the core portion 4 is configured to integrally cover the inner peripheral portion, the outer peripheral portion, and both ends of the winding shaft of the coil component 6.

  The core part 4 is formed by compression molding or injection molding a granule containing magnetic powder and a binder. Although it does not specifically limit as magnetic powder, Sendust (Fe-Si-Al; Iron-silicon-aluminum), Fe-Si-Cr (iron-silicon-chromium), permalloy (Fe-Ni), carbonyl iron system, Metallic magnetic powders such as carbonyl Ni-based, amorphous powder, and nanocrystal powder are preferably used.

  The particle size of the magnetic powder is preferably 0.5 to 50 μm. In the present embodiment, the magnetic powder is a metal magnetic particle, and the outer periphery of the particle is preferably coated with an insulating film. Examples of the insulating film include a metal oxide film, a resin film, and a chemical film such as phosphorus or zinc.

  However, the magnetic powder may be a ferrite magnetic powder such as Mn—Zn and Ni—Cu—Zn. The binder resin is not particularly limited, and examples thereof include epoxy resins, phenol resins, acrylic resins, polyester resins, polyimides, polyamideimides, silicon resins, and combinations thereof.

  In the present embodiment, the lower surface 4B of the core portion 4 shown in FIG. 1A is a mounting-side outer surface connected to a circuit board or the like, and is formed substantially parallel to a plane passing through the X axis and Y axis perpendicular to each other. The winding axis of the coil component 6 is substantially parallel to the Z axis perpendicular to the plane passing through the X axis and the Y axis. In the present embodiment, the upper surface 4A of the core portion 4 is a non-mounting side outer surface that is substantially parallel to the lower surface 4B, and the four side surfaces 4C are substantially perpendicular to the upper surface and the lower surface. However, the shape of the core portion 4 is not particularly limited, and is not limited to a hexahedron, and may be a cylindrical shape, an elliptical column, a polygonal column, or the like.

  The size of the inductor element 2 of the present embodiment is not particularly limited. For example, the X-axis direction width X0 is 1.0 to 20 mm, the Y-axis direction width Y0 is 1.0 to 20 mm, and the height Z0 is 1.0 to 10 mm. It is. The inductor element 2 includes, for example, a transformer, a balun, a common mode filter (common mode choke), a circuit element such as a DC / DC converter, a choke coil in a power supply line, a decoupling element, an element for impedance matching, and a filter constituent element. It can be used as an antenna element.

  Next, a method for manufacturing the inductor element 2 shown in FIGS. 1 and 2 will be described. First, a conductive plate piece such as a metal plate (for example, Sn plating material) is punched into a shape as shown in FIG. 3A (stamping step). As shown in FIG. 3A, a plurality of conductive plate pieces 6a connected to the lead frame 14a via lead portions 17a are formed on the conductive plate pieces after punching. Each first conductive plate piece 6a is integrally formed with a first inner convex portion 9a. Although the 1st inner side convex part 9a may be formed simultaneously at the time of a punching process, you may shape | mold in a process different from a punching process.

  Next, the first conductive plate pieces 6a shown in FIG. 3A are punched to form spiral first predetermined pattern grooves 7a as shown in FIG. 3B, and the first conductive plate pieces 6a are formed in the first conductive plate pieces 6a. A spiral first predetermined pattern 5a is formed (pattern forming step). At that time, by punching the first conductive plate piece 6a using a cutting tool having a blade having a wide portion and a narrow portion formed on the blade surface, the first conductive plate piece 6a, A first predetermined pattern groove 7a having a first wide region 7a1 and a first narrow region 7a2 is formed. Thereby, each 1st electroconductive board piece 6a will have the spiral 1st predetermined pattern 5a, and the 1st wide part 5a1 and the 1st narrow part 5a2 are alternated in the 1st predetermined pattern 5a. Will be formed.

  A spiral first predetermined pattern groove 7a is formed in each first conductive plate piece 6a shown in FIG. 3A so that each first conductive plate piece 6a has a first inner end 8a and a first outer side. The end 10a is formed at the same time. The spiral first predetermined pattern groove 7a may be formed simultaneously with the punching process shown in FIG. 3A.

  Further, in the vicinity of the first outer end portion 10a, a width expanding portion 13 is formed in the middle of the first predetermined pattern 5a. By forming the width expanding portion 13, as shown in FIG. 3D (A), it is possible to make the outer peripheral shape of the first conductive plate piece 6a and the outer peripheral shape of the second conductive plate piece 6b the same. Thus, when the first conductive plate piece 6a and the second conductive plate piece 6b are laminated to form the coil component 6, the strength of the coil component 6 can be improved.

  In the above-described process, the method for forming the first predetermined pattern 5a on the first conductive plate piece 6a has been described. However, the method for forming the second predetermined pattern 5b on the second conductive plate piece 6b is the same. Description is omitted. However, in order to form the second predetermined pattern 5b on the second conductive plate piece 6b, the same conductive plate piece as shown in FIG. 3D (A) is used except that the first inner convex portion 9a shown in FIG. 3A is not provided. Such a second predetermined pattern groove 7b may be formed.

  Next, an insulation coating is applied to the first conductive plate piece 6a and the second conductive plate piece 6b (insulation coating step). In this step, an insulating resin layer is formed on the surfaces of the first conductive plate piece 6a and the second conductive plate piece 6b by electrodeposition, and is dried and heat-treated as necessary. An insulating layer 16 covering the surfaces of the pieces 6a and 6b is formed. Examples of the polymer used in the electrodeposition liquid for electrodepositing the insulating layer 16 include various anionic or cationic synthetic polymer resins having electrodeposition properties. In addition, in order to impart tackiness to the above polymer resin, it is possible to add tackifying resins such as rosin, terpene, and petroleum resins as necessary.

  In particular, the insulating layer 16 is preferably a polyimide resin in terms of insulation, strength, and chemical stability. For example, it is formed by electrodeposition from an electrodeposition coating composition comprising a polyimide resin containing an ionic group, an organic solvent capable of dissolving the polyimide resin, water, and an ionic compound having a polarity different from that of the ionic group, and dried. And an insulating resin layer that has been heat-treated. The insulating layer 16 may be formed by heating and melting the resin, applying the melted resin to each of the conductive plate pieces 6a and 6b, and then finally curing the resin. Moreover, you may implement an insulation coating process prior to a pattern formation process.

  Next, as shown in FIG. 3E, the first conductive plate piece 6a and the second conductive plate piece 6b so that the first inner convex portion 9a abuts against the lower surface in the Z-axis direction of the second inner end portion 8b. Are laminated (lamination process). Next, laser welding is performed on the joint portion between the first inner convex portion 9a and the second inner end portion 8b with the second inner end portion 8b butted against the first inner convex portion 9a (laser welding process). Thereby, the joint part 9ab is formed in the said part.

  The method for forming the joint portion 9ab is not limited to laser welding, and other examples include resistance welding, arc welding, ultrasonic joining, solder joining, and joining with a conductive paste. . At the time of joining, the lead frames 14a and 14b are preferably attached to the conductive plate pieces 6a and 6b, respectively, but may be after being removed.

  Next, the main part of the coil component 6 is inserted into the mold, the lead parts 17a and 17b are exposed from the mold, and the core part 4 is formed by compression molding in the mold (molding process). At the time of compression molding, an inductor element 2 shown in FIG. 1A is obtained by filling a mixture of magnetic powder and binder resin into a cavity of a mold and heating and compressing the whole.

  The heating temperature at the time of heat compression is preferably 50 to 300 ° C., and the compression pressure is preferably 1 to 400 Pa. As a method for compression molding, a mold may be used, or hydraulic pressure or water pressure may be used. At the time of compression molding, instead of the above-described mixture, only the resin may be filled in the cavity. Further, the molding process may be omitted, and the main part of the coil component 6 may be simply put in the exterior body (sealing part) and fixed.

  The lead frames 14a and 14b shown in FIG. 3D (A) may be removed by cutting with a cutting tool after the core part 4 is molded by compression molding, or may be removed before the core part 4 is molded. Although not shown, the lead portions 17a and 17b protruding from the core portion 4 are bent from the side surface 4C to the lower surface 4B of the core portion 4 along the outer surface of the core portion 4 shown in FIG. 1A. (Cut and forming process). As a result, the leading end portions of the lead portions 17a and 17b are arranged on the lower surface 4B of the core portion 4 and the leading end portion functions as an external terminal piece, so that it is not necessary to connect the external terminal piece separately. In the present embodiment, the lower surface 4B of the core portion 4 is a mounting surface, and the upper surface 4A of the core portion 4 is an anti-mounting surface.

  In the coil component 6 according to the present embodiment, wide regions 7a1, 7b1 and narrow regions 7a2, 7b2 are formed in the conductive plate pieces 6a, 6b along the longitudinal direction of the pattern grooves 7a, 7b. . Further, in the coil component 6 according to the present embodiment, the wide patterns 5a1 and 5b1 and the narrow parts 5a2 and 5b2 are alternately formed in the predetermined patterns 5a and 5b along the longitudinal direction of the pattern. Moreover, in the present embodiment, the predetermined pattern 5a is formed so that the pattern edges of the wide portions 5a1 and 5b1 face each other and the pattern edges of the narrow portions 5a2 and 5b2 face each other with the predetermined pattern grooves 7a and 7b interposed therebetween. , 5b are formed.

  For this reason, when an insulating coating is applied to the conductive plate pieces 6a and 6b, the insulating layer 16 is also formed on each pattern edge facing each other across the narrow regions 7a2 and 7b2. When the thickness of the insulating layer 16 increases with respect to the width of the narrow regions 7a2 and 7b2, the inside of the narrow regions 7a2 and 7b2 is filled with the insulating layer 16, and the pattern edges facing each other across the narrow regions 7a2 and 7b2 are insulated. Connected through layer 16.

  As described above, since the insulating layer 16 that connects the pattern edges facing each other across the narrow regions 7a2 and 7b2 is provided, the pattern edges connect the insulating layer 16 along the longitudinal direction of the pattern grooves 7a and 7b. To integrate. Therefore, the bending strength of the conductive plate pieces 6a and 6b is increased. And the coil component 6 is comprised with sufficient bending strength by comprising the coil component 6 with the electroconductive board pieces 6a and 6b in which this bending strength was raised.

  Further, since the narrow regions 7a2 and 7b2 are narrower than the wide regions 7a1 and 7b1, the thickness of the insulating layer 16 that connects the pattern edges facing each other across the narrow regions 7a2 and 7b2 is not so thick. However, the pattern edges can be connected to each other. Therefore, it is possible to shorten the film formation time for forming the thickness of the insulating layer 16 that connects the pattern edges facing each other across the narrow regions 7a2 and 7b2. Further, when a resin is used as a material constituting the insulating layer 16, for example, bubbles in the resin are easily removed. Thereby, the adhesive strength between the pattern edges and the insulating layer 16 is increased, and the insulating layer 16 is hardly peeled off from the pattern edges.

  Further, since the wide regions 7a1 and 7b1 are wider than the narrow regions 7a2 and 7b2, the material for forming the insulating layer 16 smoothly enters through the wide regions 7a2 and 7b2. For this reason, when insulating coating is applied to the conductive plate pieces 6a and 6b, smooth insulating coating through the wide regions 7a1 and 7b1 is realized inside the predetermined pattern grooves 7a and 7b.

  Further, when using a resin as a material constituting the insulating layer 16, by curing the resin, the pattern edges facing each other across the narrow regions 7a2 and 7b2 can be bonded with high bonding force through the cured resin. Can be connected. Therefore, the bending strength of the coil component 6 can be made sufficient. In addition, it is possible to effectively prevent the conductive plate pieces 6a and 6b from being peeled off from a compression molded body (core) such as a magnetic powder filled in the coil device 2.

  Further, since the bending strength of the coil component 6 is increased, when the coil component 6 is transported, or the coil component 6 is disposed inside the mold, a granule containing magnetic powder or the like is compression-molded and compressed. When forming the magnetic core, the conductive plate pieces 6a and 6b are less likely to be displaced and deformed, and the conductive plate pieces 6a and 6b are kept horizontal to each other. For this reason, it is possible to prevent the inductance value of the inductance element 2 and the variation of the DC superimposition characteristics, the insulation failure, and the like from occurring.

Second Embodiment As shown in FIG. 1C, the inductor element according to this embodiment is the same as the inductor element 2 according to the first embodiment except that the configuration of the pattern grooves 7a and 7b is different. Hereinafter, a different part from 1st Embodiment is demonstrated in detail, and description of a common part is abbreviate | omitted. Further, in the members shown in the drawings, common members are denoted by common reference numerals, and description thereof is partially omitted.

  In the present embodiment, the wide portions 5a1, 5b1 and the narrow portions 5a2, 5b2 respectively formed in the patterns 5a, 5b of the first conductive plate piece 6a and the second conductive plate piece 6b are the first embodiment. The pattern grooves 7a ′ and 7b ′ formed between them are different from the pattern grooves 7a and 7b of the first embodiment. In this embodiment, as shown in FIG. 1C, the conductive plate pieces 6a and 6b have a substantially constant width along the longitudinal direction so that the wide portions 5a1 and 5b1 and the narrow portions 5a2 and 5b2 face each other. Pattern grooves 7a 'and 7b' are formed.

  In the present embodiment, the pattern grooves 7a ′ and 7b ′ are configured to be bent along the longitudinal direction, and the pattern edges are connected to each other via the insulating layer, so that sufficient bending strength is provided to the coil component. Is provided. Further, since the wide portions 5a1 and 5b1 and the narrow portions 5a2 and 5b2 are formed in the predetermined pattern along the longitudinal direction of the patterns 5a and 5b, the shape of the pattern edges of the conductive plate pieces 6a and 6b is formed. Becomes an uneven shape. Therefore, the surface area per unit length in the longitudinal direction of the pattern edge is larger than when the shape of the pattern edge is a linear shape or a winding curve shape, and more insulating layers are formed on the pattern edge. Thereby, the junction area of an insulating layer and a pattern edge increases, and it becomes difficult for an insulating layer to peel from a pattern edge.

  In FIG. 1C, the pattern grooves 7a 'and 7b' and the conductive plate pieces 6a and 6b may be reversed. That is, the pattern of the conductive plate pieces may be configured by the pattern of the pattern grooves 7a 'and 7b', and the pattern groove may be formed by the pattern of the conductive plate pieces 6a and 6b. In that case, a pattern in which wide portions and narrow portions appear alternately only in the pattern grooves. However, the pattern width of the pattern groove is preferably narrower than the pattern width of the conductive plate piece.

  In the coil component 6 according to the present embodiment, as shown in FIGS. 3C and 3D, the predetermined patterns 5a and 5b are both spiral patterns. Moreover, the first conductive plate pieces 6a and the first conductive plate pieces 6b are arranged in the stacking direction. With this configuration, the number of turns of the coil component 6 can be increased.

  Further, as shown in FIG. 2, the first inner convex portion 9a of the first conductive plate piece 6a and the first inner end portion 8b of the second conductive plate piece 6b are connected to each of the conductive plate pieces 6a and 6b. A three-dimensional connection is made between the predetermined patterns 5a and 5b. Therefore, a gap is formed between each of the predetermined patterns 5a and 5b, and it is possible to prevent a short circuit failure between the conductive plate pieces 6a and 6b. An insulating sheet may be interposed in the gap. In that case, it is possible to more effectively prevent a short circuit failure between the conductive plate pieces 6a and 6b.

  In this embodiment, as shown in FIGS. 3C (A) and 3D (A), the wide regions 7a1 and 7b1 are provided with holes 18 that allow the front and back surfaces of the conductive plate pieces 6a and 6b to communicate with each other. It is formed. Due to such a configuration, when the core portion 4 is formed by compression molding or injection molding of a granule containing magnetic powder or the like, the magnetic powder is filled into the pores 18. Therefore, the magnetic characteristics (for example, inductance value) of the inductance element 2 can be improved.

  In the embodiment described above, the first lead portion 17a may be retrofitted to the first outer end portion 10a by welding or the like. Further, the shape of the first outer end portion 10a is not limited to the example shown in FIG. 3B, and may be changed as appropriate, such as a circular shape. The second lead portion 17b and the second outer end portion 10b are the same as the first lead portion 17a and the first outer end portion 10a.

  Further, the shape of the first inner end portion 8a is not limited to the example shown in FIG. 3B, and may be changed as appropriate, such as a circular shape. Moreover, you may change a shape suitably also about the 1st inner side convex part 9a. Moreover, you may change suitably the position of the 1st inner side convex part 9a within the area | region of the 1st inner side edge part 8a. Further, the first inner convex portion 9a may be configured to be retrofitted to the first inner end portion 8a. The second inner end portion 8b is the same as the first inner end portion 8a.

  In the embodiment described above, the method for processing the metal plate (including the metal foil) constituting the conductive plate piece 6a (including 6b) shown in FIG. 3A is not limited to the punching process, but an etching process, Examples include wire cutting, laser processing, electric discharge processing, and drill processing. Further, the processing method for forming the predetermined pattern grooves 7a and 7b is not limited to punching processing, and laser processing, etching processing, wire cutting, electric discharge processing, drill processing, and the like are exemplified.

  In the example shown in FIG. 1B, the predetermined patterns 5a and 5b include portions having two types of widths of the wide portions 5a1 and 5b1 and the narrow portions 5a2 and 5b2. May be included. That is, a portion having an intermediate width between the wide portions 5a1, 5b1 and the narrow portions 5a2, 5b2, a portion having a larger width than the wide portions 5a1, 5b1, or a portion having a smaller width than the narrow portions 5a2, 5b2. May further be included. In that case, the wide portions 5a1 and 5b1 and the narrow portions 5a2 and 5b2 do not need to be alternately arranged along the longitudinal direction L as shown in FIG. 1B, and can be appropriately changed.

  In the example shown in FIG. 1B, when the predetermined patterns 5a and 5b are viewed from the Z-axis direction, the shape of the ridge line connecting the pattern edges of the wide portions 5a1 and 5b1 and the narrow portions 5a2 and 5b2 is sinusoidal. However, the predetermined patterns 5a and 5b may be formed so as to include a ridge line having a repeated uneven shape such as a wavy curve shape or a sawtooth shape.

  In the example shown in FIG. 1B, the wide portions 5a1 and 5b1 and the narrow portions 5a2 and 5b2 are formed in the respective portions in the longitudinal direction of the predetermined patterns 5a and 5b, but are formed only on a part of the predetermined patterns 5a and 5b. May be. Furthermore, in the example shown in FIG. 1B, unevenness is repeatedly formed along the longitudinal direction L on both side pattern edges in the width direction of the conductive plate pieces 6a and 6b located on both sides of the pattern grooves 7a and 7b. An uneven shape may be repeatedly formed only on the pattern edge.

Third Embodiment As shown in FIGS. 4A, 4B, and 5, the inductor element 102 according to the present embodiment is related to the first embodiment or the second embodiment described above except that the configuration of the coil component 106 is different. It is the same as the inductor element. In the coil component 106 of the present embodiment, the positions of the first inner end portion 108a and the second inner end portion 108b respectively formed on the first conductive plate piece 106a and the second conductive plate piece 106b are the first implementation. It differs from the position of the 1st inner side edge part 8a and the 2nd inner side edge part 8b of a form.

  Hereinafter, a different part from 1st Embodiment or 2nd Embodiment is demonstrated in detail, and description of a common part is abbreviate | omitted. Further, in the members shown in the drawings, common members are denoted by common reference numerals, and description thereof is partially omitted.

  In the present embodiment, as shown in FIG. 5, the first inner end portion 108 a is disposed at a position away from the center of the spiral first predetermined pattern 107 a radially outward. Further, the second inner end portion 108b is disposed at a position away from the center of the spiral second predetermined pattern 107b radially outward. Therefore, no pattern is formed near the center of the first predetermined pattern 107a and the second predetermined pattern 107b. The first predetermined pattern 105a is formed by forming the first predetermined pattern groove 107a in the first conductive plate piece 106a. In the present embodiment, the first predetermined pattern groove 107a constitutes a spiral groove of the spiral pattern 105a. The first predetermined pattern groove 107a is the same as the first predetermined pattern groove 7a except that its length in the longitudinal direction is different.

  The second predetermined pattern 105b is formed by forming a second predetermined pattern groove 107b in the second conductive plate piece 106b. In the present embodiment, the second predetermined pattern groove 107b constitutes a spiral groove of the spiral pattern 105b. The second predetermined pattern groove 107b is the same as the second predetermined pattern groove 7b except that its length in the longitudinal direction is different. The joint 109ab shown in FIG. 4B is formed by performing laser welding or the like by abutting the first inner convex portion 109a and the second inner end portion 108b formed on the first inner end portion 108a.

  The coil component 106 according to the present embodiment also has the same effects as the coil component 6 of the first embodiment. In addition, with the above configuration, when the first conductive plate piece 106a and the second conductive plate piece 106b are stacked, the coil component 106 has a hollow portion as shown in FIGS. 4A and 4B. It is formed and the core part 4 can be arrange | positioned in this hollow part. Therefore, the inductance of the inductance element 102 can be increased, and the saturation current characteristic can be improved (the saturation current is increased). In addition, you may use the coil component 106 as an air-core coil, without arrange | positioning the core part 4 in a hollow part. As a core part, not only what was compacted with the coil component 106 but the toroidal type | mold core, EI type | mold core etc. which were shape | molded separately from the coil component 106 can be illustrated.

  In addition, you may make the protrusion width | variety to the winding-axis center direction of the 1st inner side edge part 108a and the 2nd inner side edge part 108b smaller than the example shown in FIG. With such a configuration, a hollow portion larger than the example shown in FIG. 5 is formed near the center of the first predetermined pattern 105a and the second predetermined pattern 105b. Therefore, when the first conductive plate piece 106a and the second conductive plate piece 106b are stacked, the coil component 106 is formed with a hollow portion larger than the example shown in FIG. 4A, and the hollow portion has a larger diameter. A core part can be arranged.

  The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

  For example, in each of the above embodiments, the first conductive plate piece 6a and the second conductive plate piece 6b are stacked in the Z-axis direction to form the coil component 6, but the second conductive property shown in FIG. 3D is used. The third to fourth conductive plate pieces or more conductive plate pieces may be laminated on the plate piece 6b.

  2 and 3D, the insulating layer 16 is formed so as to cover the entire surface of the first conductive plate piece 6a and the second conductive plate piece 6b, but at least the first wide portion. What is necessary is just to form in the pattern edge of 5a1 and the pattern edge of 2nd wide part 5b1. That is, if the insulating layer 16 is at least formed so as to connect the opposing pattern edges across the first narrow region 7a1 or connect the opposing pattern edges across the second narrow region 7b2. Good.

2,102 ... Inductor element (coil device)
4 ... Core part (sealing part)
4A ... Upper surface 4B ... Lower surface 4C ... Side surfaces 5a, 105a ... First predetermined pattern 5a1 ... First wide portion 5a2 ... First narrow portion 5b, 105b ... Second predetermined pattern 5b1 ... Second wide portion 5b2 ... Second narrow portion Part 6, 106 ... Coil parts 6a, 106a ... First conductive plate piece 6b, 106b ... Second conductive plate piece 7a ... First predetermined pattern groove 7a1 ... First wide region 7a2 ... First narrow region 7b ... First 2 Predetermined pattern grooves 7b1 ... 2nd wide region 7b2 ... 2nd narrow region 8a, 108a ... 1st inner side edge part 8b, 108b ... 2nd inner side edge part 9a, 109a ... 1st inner side convex part 9ab, 109ab ... Joint part 10a ... 1st outer side edge part 10b ... 2nd outer side edge part 13 ... Width expansion part 14a, 14b ... Lead frame 15 ... Conductive path 16 ... Insulating layer (insulator)
17a, 17b ... lead part 18 ... hole

Claims (9)

A wide region that is wide and a narrow region that is narrow are formed along the longitudinal direction of the pattern groove, and a conductive plate piece having a two-dimensional predetermined pattern;
Have a, and an insulating layer for connecting the pattern edges facing each other across the narrow region,
The coil component in which the wide region and the narrow region are alternately arranged along a longitudinal direction of the predetermined pattern .   The coil component according to claim 1, wherein a ratio (G2 / G1) of a width (G2) of the narrow region to a width (G1) of the wide region is 0.1 to 0.9. A conductive plate piece having a two-dimensional predetermined pattern in which a wide part to be wide and a narrow part to be narrow are repeatedly formed along the longitudinal direction;
A coil component comprising: an insulating layer that connects pattern edges of the conductive plate pieces facing each other across a pattern groove. A conductive plate piece in which a two-dimensional predetermined pattern is formed along the longitudinal direction;
An insulating layer connecting the pattern edges of the conductive plate pieces facing each other across the pattern groove;
A coil component in which at least one of pattern edges of the conductive plate pieces opposed to each other with a pattern groove interposed therebetween is formed with repeated irregularities at a predetermined pitch.   The coil component according to claim 1, wherein the predetermined pattern is a spiral pattern. At least two or more conductive plate pieces are arranged in the stacking direction, and two adjacent conductive plate pieces each have an inner end,
An inner convex portion that protrudes in the stacking direction from the two-dimensional plane of the predetermined pattern is formed at the inner end portion of one of the conductive plate pieces, and the inner end portion of the other conductive plate piece is at the inner end portion. The coil component according to any one of claims 1 to 5, wherein the convex portions are electrically connected. The hole which connects the board surface of the front side of the said electroconductive board piece and the board surface of a back side is formed in at least one part of the insulating layer with which the said pattern groove | channel is filled. The coil component according to crab. The coil component according to any one of claims 1 to 7,
And a sealing unit that covers a main part of the coil component.   The coil device according to claim 8, wherein the sealing portion is made of a magnetic substance-containing resin.

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