WO2015096520A1 - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
WO2015096520A1
WO2015096520A1 PCT/CN2014/086725 CN2014086725W WO2015096520A1 WO 2015096520 A1 WO2015096520 A1 WO 2015096520A1 CN 2014086725 W CN2014086725 W CN 2014086725W WO 2015096520 A1 WO2015096520 A1 WO 2015096520A1
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Prior art keywords
electrode
width
light emitting
blocking layer
current blocking
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PCT/CN2014/086725
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French (fr)
Chinese (zh)
Inventor
杨力勋
蔡培崧
徐宸科
林素慧
赵志伟
黄少华
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厦门市三安光电科技有限公司
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Publication of WO2015096520A1 publication Critical patent/WO2015096520A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • H01L33/145Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape

Definitions

  • the invention relates to a semiconductor light emitting device and belongs to the technical field of semiconductor device manufacturing.
  • the core basic structure of a light emitting diode includes a p-type semiconductor layer (p region), an active layer (light emitting layer or light emitting portion), and an n-type semiconductor layer (n region).
  • p region p-type semiconductor layer
  • n region n-type semiconductor layer
  • the holes in the p region move toward the n region
  • the electrons in the n region move toward the p region
  • the electrons and holes recombine in the active layer.
  • most of the energy released by the recombination of electrons and holes is released in the form of light (radiation transition). Because LED has the advantages of low energy consumption, environmental protection, miniaturization and long life, it has broad market development prospects.
  • the present invention discloses a light emitting device structure in which at least one electrode structure and a current blocking layer for use with the electrode structure are included.
  • the light emitting device specifically comprising: a light emitting epitaxial stack, comprising at least: a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active layer sandwiched therebetween; the first electrode Located above the surface of the first semiconductor layer, including a pad and an extension electrode, the extension electrode is extended outward from the pad; a current blocking layer is located under the extension electrode, and an edge thereof and the extension electrode The edges are non-parallel, and the current tends to bypass rather than diffuse through the current blocking layer from the electrode to the device.
  • the light emitting device comprises at least a stacked semiconductor structure and an electrode structure and a current blocking layer.
  • the electrode structure includes at least one pad and one extension electrode, wherein the pad can be used to power the external circuit Connections, extension electrodes are used to facilitate the diffusion of current across the device.
  • the portion connected to the pad has the largest width in the direction orthogonal to the extending direction of the extension electrode, and the width of the extension electrode in the direction orthogonal to the extending direction thereof is from the position of the adjacent pad toward The ends of the extension electrodes are reduced such that the current densities across the cross-section of the entire extension electrode orthogonal to the direction of extension are approximately equal.
  • the current blocking layer at least below the extension electrode, and the current tends to bypass rather than diffuse from the electrode to the device through the current blocking layer.
  • the extending direction of the current blocking layer coincides with the extension electrode, and the width of the current blocking layer in a direction orthogonal to the extending direction thereof decreases from the position of the adjacent pad to the end of the extension electrode.
  • the light emitting device includes at least a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the two types of semiconductor layers. At least above the first semiconductor layer is an electrode that is in direct contact with the first semiconductor layer.
  • the light emitting device includes at least a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the two types of semiconductor layers. There is at least one electrode above the first semiconductor layer, and at least one transparent conductive material is present between the electrode and the first semiconductor layer.
  • the width of the current blocking layer in a direction orthogonal to the extending direction thereof is greater than the width of the extended electrode at the corresponding position, and the width difference between the two is reduced from the position of the adjacent pad to the end of the extended electrode. small.
  • the width of the current blocking layer in a direction orthogonal to the extending direction thereof is smaller than the width of the extended electrode at the corresponding position, and the width difference between the two increases from the position of the adjacent pad to the end of the extended electrode. Big.
  • the extension electrode includes a number of branches that are not directly connected to the pads.
  • the width of the branch in a direction orthogonal to the direction in which it extends is reduced from the starting end to the end.
  • there is a current blocking layer and the current tends to bypass and not diffuse from the electrode to the device through the current blocking layer, the extending direction of the current blocking layer is consistent with the main electrode of the electrode, and the current blocking layer is The width in the direction orthogonal to the direction of extension decreases from the position of the adjacent pad to the end of the extension electrode.
  • a current blocking layer is also present under the extension electrode branch, and a width of the current blocking layer in a direction orthogonal to the extending direction thereof decreases from a position of the branch start end to an end of the branch, The width of the current blocking layer in an orthogonal direction to the direction in which it extends may be greater or smaller than the width of the extended electrode branch at the corresponding position.
  • Fig. 1 is a structural view of a known light emitting device.
  • Figure 2 is a cross-sectional view taken along line AA' of Figure 1.
  • Fig. 3 is a structural view of another known light emitting device.
  • Figure 4 is a cross-sectional view taken along line BB' of Figure 3.
  • Figure 5 is a structural diagram of a light emitting device in accordance with an embodiment of the present invention.
  • Figure 6 is a cross-sectional view taken along line CC' of Figure 5.
  • Figure 7 is a cross-sectional view taken along line DD' of Figure 5.
  • Figure 8 is a structural diagram of a light emitting device in accordance with another embodiment of the present invention.
  • Figure 9 is a structural view of a light emitting device in accordance with still another embodiment of the present invention.
  • Figure 10 is a cross-sectional view taken along line EE' of Figure 9.
  • Figure 11 is a structural view of a light emitting device according to still another embodiment of the present invention.
  • the light-emitting diode can convert the externally injected current into a specific wavelength of light. Therefore, optimizing the current injection mode through proper electrode design is of great significance for improving the energy utilization efficiency and long-term operational stability of the device.
  • the light emitting device includes a first semiconductor layer 141, a light emitting portion 142, a second semiconductor layer 143, and an electrode in direct contact with the first semiconductor layer 141.
  • the electrode includes a pad 121 and an extension electrode 122. The pad may be connected to the external circuit through a wire or other conductor, and the extension electrode promotes diffusion of the current injected by the external circuit on the first semiconductor layer 141.
  • Figure 2 is a cross-sectional view taken along line AA' of Figure 1.
  • the device 101 When the device 101 is turned on with the external circuit, current is diffused to the first semiconductor layer 141 via the pad 121 and the extension electrode 122, and then injected into the light emitting portion 142 from the first semiconductor layer 141, which converts part of the electrical energy into light energy. And emitted, the final current flows into the second semiconductor layer 143 (143 can be directly connected to the external circuit), thus forming a complete loop.
  • the extension electrode 121 is a strip-like structure having a uniform width, so that as the current is diffused onto the first semiconductor layer 141, the current density of the extension electrode in a cross section orthogonal to the extending direction thereof is from the adjacent pad position toward The end of the extension electrode will continue to decrease.
  • the current density of the extended electrode especially the end position of the extended electrode
  • the current density of the region adjacent to the extended electrode and the pad Too large it is easy to cause material loss due to current overload, resulting in shortened device life.
  • the current tends to flow back to the external circuit from the semiconductor stacked structure directly under the electrode because such a current path is the shortest.
  • the current is too small at a position away from the electrode, and the utilization efficiency for the light-emitting portion is too low; on the other hand, the light-emitting portion directly under the electrode generates more light, and when the light is emitted outward It is easier to be blocked by the electrodes, resulting in light loss.
  • Fig. 3 and 4 are another known light emitting device structure 102, and Fig. 4 is a cross-sectional view taken along line BB' of Fig. 3.
  • a current blocking layer 232 exists below the extension electrode 222.
  • the current blocking layer 231 is also present under the electrode pad 221.
  • the current blocking layer can better prevent current from directly injecting into the semiconductor stacked structure directly under the electrode, so that the current of the electrode is better diffused throughout the first semiconductor layer.
  • the edges of the extension electrode 222 and the current blocking layer 232 are parallel to each other.
  • the electrode density at the electrode position adjacent to the pad has a maximum current density, and the current density on the extension electrode decreases from the adjacent pad position toward the end, so that the current density diffused from the extension electrode 222 to the first semiconductor 241 is from The adjacent pad also decreases toward the [z1] end. Therefore, the device 102 still exists.
  • the current density of the extended electrode especially the end position of the extended electrode
  • the extended electrode is adjacent to the pad.
  • the current density of the area is too large, which is easy to cause material loss due to current overload, resulting in a shortened service life of the device.
  • the light emitting device includes at least a first semiconductor layer 341, a light emitting portion 342, a second semiconductor layer 344, and an electrode structure directly thereon.
  • the electrode structure includes a pad 321 and an extension electrode 322.
  • At least a current blocking layer 332 is present under the extension electrode 322.
  • a current blocking layer 331 is also present under the pads.
  • the current blocking layer 332 extends in the same direction as the extension electrode 322, but the current blocking layer edge 332a is non-parallel to the edge 331a of the extension electrode.
  • the width of the extension electrode 322 in the direction orthogonal to the extending direction thereof remains unchanged, and the current blocking layer 332 has the largest width at the position adjacent to the pad (ie, the starting end a) and is reduced in the extending direction (ie, the end b). Amplitude. With this design, although the extension electrode 322 has a higher potential at a portion adjacent to the pad, the resistance caused by the current blocking layer 332 is correspondingly increased, thereby increasing the diffusion of the entire extension electrode 322 toward the first semiconductor layer 341. Uniformity of current.
  • FIG. 8 is a block diagram showing another embodiment 104 in accordance with the present invention.
  • the difference between the device 104 and the device 103 is that at the position adjacent to the pad 421, the extension electrode 422 has the largest width and the width is along with the solder. The disk distance increases as the distance increases.
  • the width of the extension electrode 422 can be matched as closely as possible with the current intensity at the corresponding position, so that the current density across the cross section of the extension electrode 422 in the direction orthogonal to the extension direction remains substantially the same, thereby improving the electrode material. Utilize efficiency and increase the overall stability of the device.
  • FIG. 8 is a block diagram showing another embodiment 104 in accordance with the present invention.
  • the device 104 and the device 103 is that at the position adjacent to the pad 421, the extension electrode 422 has the largest width and the width is along with the solder. The disk distance increases as the distance increases.
  • the width of the extension electrode 422 can be matched as closely as possible with the current intensity at the corresponding position, so that
  • the width of the current blocking layer 432 in the direction orthogonal to the extending direction thereof is smaller than the width of the corresponding extended electrode from the position of the adjacent pad to the end of the extending direction. That is, at the position a, the difference between the expanded electrode width and the current blocking layer width is smaller than the difference between the expanded electrode width and the current blocking layer width at the position a.
  • FIG. 9 and 10 are schematic views showing the structure of a current blocking layer 532 of the device 105, which is larger than the extension electrode 522, in accordance with still another embodiment of the present invention.
  • the extension electrode 522 and the current blocking layer 532 have the largest width, and the width decreases as the distance from the pad increases, but the reduction range of the current blocking layer 532 It is larger than the corresponding expansion electrode. That is, at the position a, the difference between the expanded electrode width and the current blocking layer width is greater than the difference between the expanded electrode width and the current blocking layer width at the position a.
  • a transparent conductive layer 551 is further present between the current blocking layer 532 and the extension electrode 522, and 551 is present over the entire first semiconductor layer 541.
  • Figure 11 is a schematic view showing the structure of still another embodiment of the present invention.
  • the extension electrode 622 also includes a plurality of branches 623.
  • the starting end a of the branch 623 has the largest width and decreases toward the end b.
  • a current blocking layer 633 may be disposed under the branch extension electrode, and a width of the current blocking layer in a direction orthogonal to the extending direction thereof decreases from a position adjacent to the main extension electrode 632 toward a tip end of the branch.

Abstract

A photoelectric device (105). The photoelectric device (105) at least comprises: a light-emitting epitaxial lamination layer which at least comprises a first semiconductor layer (541) of a first conduction type, a second semiconductor layer (543) of a second conduction type and an active layer (542) which is sandwiched therebetween; a first electrode which is located above a surface of the first semiconductor layer (541) and comprises a bonding pad (521) and an extended electrode (522), wherein the extended electrode (522) is formed by extending the bonding pad (521) outwards; and a current barrier layer (532) which is located below the extended electrode (522), wherein the extension direction thereof is consistent with that of the extended electrode (522), but the edge thereof is not arranged in parallel with the edge of the extended electrode (522), so that a current is inclined to bypass but not to penetrate the current barrier layer (532) to be spread from the electrode to the device (105).

Description

发光器件Light emitting device
本申请要求于2013年12月23日提交中国专利局、申请号为201310716962.2、发明名称为“发光器件”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。The present application claims priority to Chinese Patent Application No. 201310716962.2, the entire disclosure of which is hereby incorporated herein in
技术领域Technical field
本发明涉及一种半导体发光器件,属于半导体器件制造技术领域。The invention relates to a semiconductor light emitting device and belongs to the technical field of semiconductor device manufacturing.
背景技术Background technique
发光二极管(LED)的核心基本结构包括p型半导体层(p区)、有源层(发光层或发光部)和n型半导体层(n区)。当LED受到正向偏压的作用时,p区中的空穴向n区移动,n区中的电子向p区移动,电子和空穴在有源层复合。从理论上讲,电子和空穴复合释放出的能量绝大部分以光(辐射跃迁)的形式释放出来。由于LED具有低能耗、环保、小型化、寿命长等优点,其具有广阔的市场发展前景。The core basic structure of a light emitting diode (LED) includes a p-type semiconductor layer (p region), an active layer (light emitting layer or light emitting portion), and an n-type semiconductor layer (n region). When the LED is subjected to a forward bias, the holes in the p region move toward the n region, the electrons in the n region move toward the p region, and the electrons and holes recombine in the active layer. In theory, most of the energy released by the recombination of electrons and holes is released in the form of light (radiation transition). Because LED has the advantages of low energy consumption, environmental protection, miniaturization and long life, it has broad market development prospects.
发明内容Summary of the invention
本发明公开了一种发光器件结构,在这种结构中至少包括一个电极结构和与该电极结构配合使用的电流阻挡层。所述发光器件,具体包括:发光外延叠层,至少包括:第一导电类型的第一半导体层、第二导电类型的第二半导体层及夹在两者之间的有源层;第一电极,位于第一半导体层表面上方,包括焊盘和扩展电极,所述扩展电极由所述焊盘向外延伸而成;电流阻挡层,位于所述扩展电极的下方,其边缘与所述扩展电极的边缘非平行排列,电流倾向于绕过而非穿过电流阻挡层从电极向器件扩散。The present invention discloses a light emitting device structure in which at least one electrode structure and a current blocking layer for use with the electrode structure are included. The light emitting device, specifically comprising: a light emitting epitaxial stack, comprising at least: a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active layer sandwiched therebetween; the first electrode Located above the surface of the first semiconductor layer, including a pad and an extension electrode, the extension electrode is extended outward from the pad; a current blocking layer is located under the extension electrode, and an edge thereof and the extension electrode The edges are non-parallel, and the current tends to bypass rather than diffuse through the current blocking layer from the electrode to the device.
在一些实施例中,所述发光器件至少包括层叠的半导体结构以及电极结构和电流阻挡层。电极结构至少包括一个焊盘和一个扩展电极,其中焊盘可以用来与外电路做电 连接,扩展电极用来促进电流在器件上的扩散。同时,在整个扩展电极上,与焊盘相连的部分在与扩展电极延伸方向正交方向上拥有最大的宽度,且扩展电极在与其延伸方向正交的方向上的宽度从邻近焊盘的位置向扩展电极的末端减小,使得在整个扩展电极的与延伸方向正交的横截面上的电流密度近似相等。同时,至少在扩展电极的下方存在电流阻挡层,电流倾向于绕过而非穿过电流阻挡层从电极向器件扩散。电流阻挡层的延伸方向与扩展电极一致,并且电流阻挡层在与其延伸方向正交方向上的宽度从邻近焊盘的位置向扩展电极的末端减小。In some embodiments, the light emitting device comprises at least a stacked semiconductor structure and an electrode structure and a current blocking layer. The electrode structure includes at least one pad and one extension electrode, wherein the pad can be used to power the external circuit Connections, extension electrodes are used to facilitate the diffusion of current across the device. Meanwhile, on the entire extension electrode, the portion connected to the pad has the largest width in the direction orthogonal to the extending direction of the extension electrode, and the width of the extension electrode in the direction orthogonal to the extending direction thereof is from the position of the adjacent pad toward The ends of the extension electrodes are reduced such that the current densities across the cross-section of the entire extension electrode orthogonal to the direction of extension are approximately equal. At the same time, there is a current blocking layer at least below the extension electrode, and the current tends to bypass rather than diffuse from the electrode to the device through the current blocking layer. The extending direction of the current blocking layer coincides with the extension electrode, and the width of the current blocking layer in a direction orthogonal to the extending direction thereof decreases from the position of the adjacent pad to the end of the extension electrode.
在一些实施例中,所述发光器件至少包括第一导电类型的第一半导体层、第二导电类型的第二半导体层以及位于两类半导体层之间的发光层。至少在第一半导体层上方有一电极,该电极与第一半导体层直接接触。In some embodiments, the light emitting device includes at least a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the two types of semiconductor layers. At least above the first semiconductor layer is an electrode that is in direct contact with the first semiconductor layer.
在一些实施例中,所述发光器件至少包括第一导电类型的第一半导体层、第二导电类型的第二半导体层以及位于两类半导体层之间的发光层。至少在第一半导体层上方有一电极,该电极与第一半导体层之间至少还存在一种透明导电材料。In some embodiments, the light emitting device includes at least a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the two types of semiconductor layers. There is at least one electrode above the first semiconductor layer, and at least one transparent conductive material is present between the electrode and the first semiconductor layer.
在一些实施例中,所述电流阻挡层在与其延伸方向正交的方向上的宽度,大于相应位置的扩展电极的宽度,并且两者的宽度差距从邻近焊盘的位置向扩展电极的末端减小。In some embodiments, the width of the current blocking layer in a direction orthogonal to the extending direction thereof is greater than the width of the extended electrode at the corresponding position, and the width difference between the two is reduced from the position of the adjacent pad to the end of the extended electrode. small.
在一些实施例中,所述电流阻挡层在与其延伸方向正交的方向上的宽度,小于相应位置上扩展电极的宽度,并且两者的宽度差距从邻近焊盘的位置向扩展电极的末端增大。In some embodiments, the width of the current blocking layer in a direction orthogonal to the extending direction thereof is smaller than the width of the extended electrode at the corresponding position, and the width difference between the two increases from the position of the adjacent pad to the end of the extended electrode. Big.
在一些实施例中,所述扩展电极包括若干分支,其不与焊盘直接相连接。所述分支在与其延伸方向正交的方向上的宽度从起始端向末端减小。并且,至少在主扩展电极的下方存在电流阻挡层,电流倾向于绕过而非穿过电流阻挡层从电极向器件扩散,电流阻挡层的延伸方向与电极主扩展电极一致,并且电流阻挡层在与其延伸方向正交方向上的宽度从邻近焊盘的位置向扩展电极的末端减小。 In some embodiments, the extension electrode includes a number of branches that are not directly connected to the pads. The width of the branch in a direction orthogonal to the direction in which it extends is reduced from the starting end to the end. And, at least under the main extension electrode, there is a current blocking layer, and the current tends to bypass and not diffuse from the electrode to the device through the current blocking layer, the extending direction of the current blocking layer is consistent with the main electrode of the electrode, and the current blocking layer is The width in the direction orthogonal to the direction of extension decreases from the position of the adjacent pad to the end of the extension electrode.
更优的,在扩展电极分支的下方也存在电流阻挡层,且电流阻挡层在与其延伸方向正交的方向上的宽度从所述分支起始端的位置向所述分支的末端减小,所述电流阻挡层在与其延伸方向的正交方向上的宽度可以大于或小于相应位置上的所述扩展电极分支的宽度。More preferably, a current blocking layer is also present under the extension electrode branch, and a width of the current blocking layer in a direction orthogonal to the extending direction thereof decreases from a position of the branch start end to an end of the branch, The width of the current blocking layer in an orthogonal direction to the direction in which it extends may be greater or smaller than the width of the extended electrode branch at the corresponding position.
附图说明DRAWINGS
图1是一种公知的发光器件结构图。Fig. 1 is a structural view of a known light emitting device.
图2是图1沿AA’线的剖面图。Figure 2 is a cross-sectional view taken along line AA' of Figure 1.
图3是另一种公知的发光器件结构图。Fig. 3 is a structural view of another known light emitting device.
图4是图3沿BB’的剖面图。Figure 4 is a cross-sectional view taken along line BB' of Figure 3.
图5是依据本发明的一实施例的发光器件的结构图。Figure 5 is a structural diagram of a light emitting device in accordance with an embodiment of the present invention.
图6是图5沿CC’线的剖面图。Figure 6 is a cross-sectional view taken along line CC' of Figure 5.
图7是图5沿DD’线的剖面图。Figure 7 is a cross-sectional view taken along line DD' of Figure 5.
图8是依据本发明的另一实施例的发光器件的结构图。Figure 8 is a structural diagram of a light emitting device in accordance with another embodiment of the present invention.
图9是依据本发明的再一实施例的发光器件结构图。Figure 9 is a structural view of a light emitting device in accordance with still another embodiment of the present invention.
图10是图9沿EE’线的剖面图。Figure 10 is a cross-sectional view taken along line EE' of Figure 9.
图11是依据本发明的又一实施例的发光器件结构图。Figure 11 is a structural view of a light emitting device according to still another embodiment of the present invention.
符号说明:Symbol Description:
第一半导体层141、241、341、441、541、641; First semiconductor layers 141, 241, 341, 441, 541, 641;
焊盘121、221、321、421、521、621; Pads 121, 221, 321, 421, 521, 621;
扩展电极122、222、322、422、522、622、623; Expansion electrodes 122, 222, 322, 422, 522, 622, 623;
发光部142、242、342、542;Light emitting portions 142, 242, 342, 542;
第二半导体层143、243、343、543; Second semiconductor layer 143, 243, 343, 543;
电流阻挡层231、232、331、332、431、432、531、532、631、632、633; Current blocking layers 231, 232, 331, 332, 431, 432, 531, 532, 631, 632, 633;
透明导电层551。Transparent conductive layer 551.
具体实施方式detailed description
发光二极管可以将外部注入的电流转换成特定波长的光发射出来。因此,通过合适的电极设计来优化电流注入的方式,对于提高器件的能量利用效率和长期工作稳定性具有重要的意义。The light-emitting diode can convert the externally injected current into a specific wavelength of light. Therefore, optimizing the current injection mode through proper electrode design is of great significance for improving the energy utilization efficiency and long-term operational stability of the device.
图1是一种公知的发光器件结构101的俯视图。该发光器件包含第一半导体层141、发光部142、第二半导体层143以及与第一半导体层141直接接触的电极。该电极包括焊盘121和扩展电极122。其中焊盘可以通过导线或者其他导体与外电路相连接,扩展电极促进外电路注入的电流在第一半导体层141上的扩散。1 is a top plan view of a known light emitting device structure 101. The light emitting device includes a first semiconductor layer 141, a light emitting portion 142, a second semiconductor layer 143, and an electrode in direct contact with the first semiconductor layer 141. The electrode includes a pad 121 and an extension electrode 122. The pad may be connected to the external circuit through a wire or other conductor, and the extension electrode promotes diffusion of the current injected by the external circuit on the first semiconductor layer 141.
图2是图1沿AA’线的剖面图。当器件101与外电路接通时,电流经由焊盘121、扩展电极122扩散到第一半导体层141,然后从第一半导体层141注入发光部142,该发光部142将部分电能转换成光能并发射出去,最终电流流入第二半导体层143中(143可以直接与外电路接通),这样就形成了一完整回路。Figure 2 is a cross-sectional view taken along line AA' of Figure 1. When the device 101 is turned on with the external circuit, current is diffused to the first semiconductor layer 141 via the pad 121 and the extension electrode 122, and then injected into the light emitting portion 142 from the first semiconductor layer 141, which converts part of the electrical energy into light energy. And emitted, the final current flows into the second semiconductor layer 143 (143 can be directly connected to the external circuit), thus forming a complete loop.
在器件101中,扩展电极121为宽度均一的条状结构,因此随着电流扩散到第一半导体层141上,扩展电极在与其延伸方向正交的横截面上的电流密度从邻近焊盘位置向扩展电极的末端会不断的减小。如此,当操作电流较小时该扩展电极(特别是扩展电极的末端位置)电流密度很低,导致电极的利用效率很低;当操作电流较大时,扩展电极与焊盘相邻的区域电流密度过大,容易由于电流过载导致材料损耗,导致器件的使用寿命缩短。进一步地,如图2中虚线箭头所示,电流倾向于从电极正下方的半导体层叠结构中流回外电路,因为这样的电流路径最短。在这种情况下,一方面,在远离电极的位置电流过小,对于发光部的利用效率过低;另一方面,电极正下方的发光部会产生较多的光,而这些光向外发射时较容易被电极所遮挡,导致光损失。In the device 101, the extension electrode 121 is a strip-like structure having a uniform width, so that as the current is diffused onto the first semiconductor layer 141, the current density of the extension electrode in a cross section orthogonal to the extending direction thereof is from the adjacent pad position toward The end of the extension electrode will continue to decrease. Thus, when the operating current is small, the current density of the extended electrode (especially the end position of the extended electrode) is low, resulting in low utilization efficiency of the electrode; when the operating current is large, the current density of the region adjacent to the extended electrode and the pad Too large, it is easy to cause material loss due to current overload, resulting in shortened device life. Further, as indicated by the dashed arrow in Fig. 2, the current tends to flow back to the external circuit from the semiconductor stacked structure directly under the electrode because such a current path is the shortest. In this case, on the one hand, the current is too small at a position away from the electrode, and the utilization efficiency for the light-emitting portion is too low; on the other hand, the light-emitting portion directly under the electrode generates more light, and when the light is emitted outward It is easier to be blocked by the electrodes, resulting in light loss.
图3和图4是另一种公知的发光器件结构102,且图4是沿图3沿BB’的剖面图。 与图1不同的是,至少在扩展电极222的下方存在一电流阻挡层232。较优的,在电极焊盘221的下方也存在电流阻挡层231。3 and 4 are another known light emitting device structure 102, and Fig. 4 is a cross-sectional view taken along line BB' of Fig. 3. Different from FIG. 1, at least a current blocking layer 232 exists below the extension electrode 222. Preferably, the current blocking layer 231 is also present under the electrode pad 221.
由于电流倾向于绕过而非穿过电流阻挡层,因此电流阻挡层可以更好地避免电流直接注入电极正下方的半导体层叠结构,使得电极的电流更好的扩散到整个第一半导体层上。Since the current tends to bypass rather than pass through the current blocking layer, the current blocking layer can better prevent current from directly injecting into the semiconductor stacked structure directly under the electrode, so that the current of the electrode is better diffused throughout the first semiconductor layer.
在图3中,可以看出,扩展电极222和电流阻挡层232的边沿互相平行。当电流注入时,在邻近焊盘的电极位置具有最大的电流密度,扩展电极上的电流密度从邻近焊盘位置向末端不断减小,使得从扩展电极222扩散到第一半导体241的电流密度从邻近焊盘向[z1]末端也不断减小。因此,器件102依然存在当操作电流较小时,扩展电极(特别是扩展电极的末端位置)电流密度很低,导致电极的利用效率很低;当操作电流较大时,扩展电极与焊盘相邻的区域电流密度过大,容易因为电流过载导致材料损耗,导致器件的使用寿命缩短的问题。In FIG. 3, it can be seen that the edges of the extension electrode 222 and the current blocking layer 232 are parallel to each other. When current is injected, the electrode density at the electrode position adjacent to the pad has a maximum current density, and the current density on the extension electrode decreases from the adjacent pad position toward the end, so that the current density diffused from the extension electrode 222 to the first semiconductor 241 is from The adjacent pad also decreases toward the [z1] end. Therefore, the device 102 still exists. When the operating current is small, the current density of the extended electrode (especially the end position of the extended electrode) is low, resulting in low utilization efficiency of the electrode; when the operating current is large, the extended electrode is adjacent to the pad. The current density of the area is too large, which is easy to cause material loss due to current overload, resulting in a shortened service life of the device.
图5、图6和图7是依据本发明的一实施例103的结构示意图。该发光器件至少包括:第一半导体层341、发光部342、第二半导体层344及直接位于其上的电极结构。其中电极结构包括焊盘321和扩展电极322。至少在扩展电极322的下方存在一电流阻挡层332。较佳的,在焊盘的下方同样存在电流阻挡层331。在本实施例中,电流阻挡层332的延伸方向与扩展电极322一致,但电流阻挡层边缘332a与扩展电极的边缘331a非平行排列。扩展电极322在与其延伸方向正交的方向上的宽度保持不变,而电流阻挡层332在邻近焊盘的位置(即起始端a)的宽度最大,并向延伸方向(即未端b)缩小幅度。通过此种设计,尽管扩展电极322在邻近焊垫的部分具有较高的电势,但是电流阻挡层332所引起的阻值也相应地升高,从而提高整个扩展电极322向第一半导体层341扩散电流的均匀性。5, 6, and 7 are schematic views of the structure of an embodiment 103 in accordance with the present invention. The light emitting device includes at least a first semiconductor layer 341, a light emitting portion 342, a second semiconductor layer 344, and an electrode structure directly thereon. The electrode structure includes a pad 321 and an extension electrode 322. At least a current blocking layer 332 is present under the extension electrode 322. Preferably, a current blocking layer 331 is also present under the pads. In the present embodiment, the current blocking layer 332 extends in the same direction as the extension electrode 322, but the current blocking layer edge 332a is non-parallel to the edge 331a of the extension electrode. The width of the extension electrode 322 in the direction orthogonal to the extending direction thereof remains unchanged, and the current blocking layer 332 has the largest width at the position adjacent to the pad (ie, the starting end a) and is reduced in the extending direction (ie, the end b). Amplitude. With this design, although the extension electrode 322 has a higher potential at a portion adjacent to the pad, the resistance caused by the current blocking layer 332 is correspondingly increased, thereby increasing the diffusion of the entire extension electrode 322 toward the first semiconductor layer 341. Uniformity of current.
图8是依据本发明的另一实施例104的结构示意图。器件104与器件103不同的地方在于,在邻近焊盘421的位置,扩展电极422具有最大的宽度,并且宽度随着与焊 盘距离的增大而减小。通过这种设计,可以使得扩展电极422的宽度与相应位置处的电流强度尽量匹配,使得在整个扩展电极422与延伸方向正交方向的横截面上的电流密度保持基本一致,从而提高电极材料的利用效率并且提高器件的整体稳定性。在图8中,电流阻挡层432在与其延伸方向正交的方向上的宽度,从邻近焊盘的位置向延伸方向的末端的缩小幅度大于相对应的扩展电极的宽度的缩小幅度。即,在位置a处,扩展电极宽度与电流阻挡层宽度的差值,小于在位置b处,扩展电极宽度与电流阻挡层宽度的差值。FIG. 8 is a block diagram showing another embodiment 104 in accordance with the present invention. The difference between the device 104 and the device 103 is that at the position adjacent to the pad 421, the extension electrode 422 has the largest width and the width is along with the solder. The disk distance increases as the distance increases. With this design, the width of the extension electrode 422 can be matched as closely as possible with the current intensity at the corresponding position, so that the current density across the cross section of the extension electrode 422 in the direction orthogonal to the extension direction remains substantially the same, thereby improving the electrode material. Utilize efficiency and increase the overall stability of the device. In FIG. 8, the width of the current blocking layer 432 in the direction orthogonal to the extending direction thereof is smaller than the width of the corresponding extended electrode from the position of the adjacent pad to the end of the extending direction. That is, at the position a, the difference between the expanded electrode width and the current blocking layer width is smaller than the difference between the expanded electrode width and the current blocking layer width at the position a.
图9和图10是依据本发明的再一实施例的结构示意图,器件105的电流阻挡层532的面积大于扩展电极522。如图9所示,在邻近焊盘521的位置,扩展电极522和电流阻挡层532具有最大的宽度,并且宽度随着与焊盘距离的增大而减小,但是电流阻挡层532的缩小幅度大于相对应的扩展电极的缩小幅度。即在位置a处,扩展电极宽度与电流阻挡层宽度的差值,大于在位置b处,扩展电极宽度与电流阻挡层宽度的差值。如图10所示,电流阻挡层532与扩展电极522之间还存在一透明导电层551,551存在于整个第一半导体层541上方。9 and 10 are schematic views showing the structure of a current blocking layer 532 of the device 105, which is larger than the extension electrode 522, in accordance with still another embodiment of the present invention. As shown in FIG. 9, at the position adjacent to the pad 521, the extension electrode 522 and the current blocking layer 532 have the largest width, and the width decreases as the distance from the pad increases, but the reduction range of the current blocking layer 532 It is larger than the corresponding expansion electrode. That is, at the position a, the difference between the expanded electrode width and the current blocking layer width is greater than the difference between the expanded electrode width and the current blocking layer width at the position a. As shown in FIG. 10, a transparent conductive layer 551 is further present between the current blocking layer 532 and the extension electrode 522, and 551 is present over the entire first semiconductor layer 541.
图11是依据本发明的又一实施例的结构示意图。器件106与104的区别在于:扩展电极622还包括若干个分支623。分支623的起始端a具有最大的宽度,并向末端b减小。进一步地,可在分支扩展电极的下方设置电流阻挡层633,且电流阻挡层在与其延伸方向正交方向上的宽度从邻近主扩展电极632的位置向分支的末端减小。Figure 11 is a schematic view showing the structure of still another embodiment of the present invention. The difference between devices 106 and 104 is that the extension electrode 622 also includes a plurality of branches 623. The starting end a of the branch 623 has the largest width and decreases toward the end b. Further, a current blocking layer 633 may be disposed under the branch extension electrode, and a width of the current blocking layer in a direction orthogonal to the extending direction thereof decreases from a position adjacent to the main extension electrode 632 toward a tip end of the branch.
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。 The above description is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. These improvements and retouchings should also be considered. It is the scope of protection of the present invention.

Claims (10)

  1. 一种发光器件,包括:A light emitting device comprising:
    发光外延叠层,至少包括:第一导电类型的第一半导体层、第二导电类型的第二半导体层及夹在两者之间的有源层;The light emitting epitaxial laminate comprises at least: a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active layer sandwiched therebetween;
    第一电极,位于第一半导体层表面上方,包括焊盘和扩展电极,所述扩展电极由所述焊盘向外延伸而成;a first electrode, located above the surface of the first semiconductor layer, including a pad and an extension electrode, the extension electrode being extended outward from the pad;
    电流阻挡层,位于所述扩展电极的下方,其延伸方向与所述扩展电极一致,但边缘与所述扩展电极的边缘非平行排列,使得电流倾向于绕过而非穿过电流阻挡层从电极向器件扩散。a current blocking layer, located below the extension electrode, extending in a direction consistent with the extension electrode, but the edge is non-parallel to the edge of the extension electrode such that current tends to bypass rather than pass through the current blocking layer from the electrode Spread to the device.
  2. 根据权利要求1所述的一种发光器件,其特征在于:所述电流阻挡层在邻近焊盘的位置具有最大的宽度,并且宽度随着与焊盘距离的增大而减小。A light emitting device according to claim 1, wherein said current blocking layer has a maximum width at a position adjacent to the pad, and a width decreases as the distance from the pad increases.
  3. 根据权利要求1所述的一种发光器件,其特征在于:在邻近焊盘的位置,所述扩展电极和电流阻挡层具有最大的宽度,并且宽度随着与焊盘距离的增大而减小,但是所述电流阻挡层的缩小幅度大于相对应的扩展电极的缩小幅度。A light emitting device according to claim 1, wherein said spread electrode and current blocking layer have a maximum width at a position adjacent to the pad, and the width decreases as the distance from the pad increases However, the current blocking layer has a smaller reduction width than the corresponding expansion electrode.
  4. 根据权利要求1所述的一种发光器件,其特征在于:所述电流阻挡层在与其延伸方向正交的方向上的宽度,大于相应位置上扩展电极在与其延伸方向正交方向上的宽度,二者的宽度差距从邻近焊盘的位置向扩展电极的末端减小。A light emitting device according to claim 1, wherein a width of said current blocking layer in a direction orthogonal to the extending direction thereof is larger than a width of said expanding electrode in a direction orthogonal to the extending direction thereof at the corresponding position, The width difference between the two decreases from the position of the adjacent pad to the end of the extension electrode.
  5. 根据权利要求1所述的一种发光器件,其特征在于:所述电流阻挡层在与其延伸方向正交的方向上的宽度,小于相应位置上扩展电极在与其延伸方向正交方向上的宽度,二者的宽度差距从邻近焊盘的位置向扩展电极的末端增大。A light emitting device according to claim 1, wherein a width of said current blocking layer in a direction orthogonal to an extending direction thereof is smaller than a width of said expanding electrode in a direction orthogonal to a direction in which said extending electrode is located at a corresponding position, The width difference between the two increases from the position of the adjacent pad to the end of the extension electrode.
  6. 根据权利要求1所述的一种发光器件,其特征在于:所述扩展电极包括若干分支,其不与所述焊盘直接相连接。 A light emitting device according to claim 1, wherein said extension electrode comprises a plurality of branches which are not directly connected to said pads.
  7. 根据权利要求6所述的一种发光器件,其特征在于:所述分支在其延伸方向上的宽度从起始端向末端减小。A light emitting device according to claim 6, wherein a width of said branch in a direction in which it extends is decreased from a start end to a tip end.
  8. 根据权利要求6所述的一种发光器件,其特征在于:在所述分支下方存在电流阻挡层,在与其延伸方向的正交方向上的宽度小于相应位置上的所述扩展电极分支的宽度。A light emitting device according to claim 6, wherein a current blocking layer is present under said branch, and a width in an orthogonal direction to a direction in which it extends is smaller than a width of said extended electrode branch at a corresponding position.
  9. 根据权利要求6所述的一种发光器件,其特征在于:在所述分支下方存在电流阻挡层,在与其延伸方向的正交方向上的宽度大于相应位置上的所述扩展电极分支的宽度。A light emitting device according to claim 6, wherein a current blocking layer is present under said branch, and a width in a direction orthogonal to the extending direction thereof is larger than a width of said extended electrode branch at the corresponding position.
  10. 根据权利要求8或9所述的一种发光器件,其特征在于:所述电流阻挡层在与其延伸方向正交的方向上的宽度从所述分支起始端的位置向所述分支的末端减小。 A light emitting device according to claim 8 or 9, wherein a width of said current blocking layer in a direction orthogonal to the extending direction thereof decreases from a position of said branch start end to an end of said branch .
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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103700744A (en) * 2013-12-23 2014-04-02 安徽三安光电有限公司 Light-emitting device
JP2016134439A (en) * 2015-01-16 2016-07-25 株式会社東芝 Semiconductor light emitting element
CN104766911A (en) * 2015-04-09 2015-07-08 聚灿光电科技股份有限公司 Led chip and manufacturing method thereof
CN106935687A (en) * 2017-04-25 2017-07-07 聚灿光电科技股份有限公司 Led chip and preparation method thereof
CN109473527A (en) * 2018-11-13 2019-03-15 厦门乾照光电股份有限公司 The semiconductor chip and current expansion method of light emitting diode
CN114678458A (en) * 2020-01-03 2022-06-28 厦门三安光电有限公司 Semiconductor light-emitting element
CN113097355B (en) * 2020-01-08 2022-08-30 安徽三安光电有限公司 Light emitting diode and manufacturing method thereof
CN112117358B (en) * 2020-09-22 2021-07-16 宁波天炬光电科技有限公司 Single-chip high-power LED chip structure
CN113707779A (en) * 2021-08-30 2021-11-26 安徽三安光电有限公司 Light emitting diode and light emitting device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5309001A (en) * 1991-11-25 1994-05-03 Sharp Kabushiki Kaisha Light-emitting diode having a surface electrode of a tree-like form
CN102194953A (en) * 2010-03-08 2011-09-21 株式会社东芝 Semiconductor light emitting device
KR20110125363A (en) * 2010-05-13 2011-11-21 주식회사 에피밸리 Iii-nitride semiconductor light emitting device
CN102437263A (en) * 2011-12-16 2012-05-02 映瑞光电科技(上海)有限公司 Light-emitting diode (LED) and manufacturing method thereof
CN102447029A (en) * 2010-10-11 2012-05-09 Lg伊诺特有限公司 Light emitting device and lighting instrument including the same
CN103165781A (en) * 2011-12-09 2013-06-19 奇力光电科技股份有限公司 Light emitting diode element
CN103700744A (en) * 2013-12-23 2014-04-02 安徽三安光电有限公司 Light-emitting device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101014155B1 (en) * 2010-03-10 2011-02-10 엘지이노텍 주식회사 Light emitting device, method for fabricating the light emitting device and light emitting device package
CN102903819B (en) * 2012-10-30 2015-12-16 安徽三安光电有限公司 There is the light-emitting diode of expansion electrode

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5309001A (en) * 1991-11-25 1994-05-03 Sharp Kabushiki Kaisha Light-emitting diode having a surface electrode of a tree-like form
CN102194953A (en) * 2010-03-08 2011-09-21 株式会社东芝 Semiconductor light emitting device
KR20110125363A (en) * 2010-05-13 2011-11-21 주식회사 에피밸리 Iii-nitride semiconductor light emitting device
CN102447029A (en) * 2010-10-11 2012-05-09 Lg伊诺特有限公司 Light emitting device and lighting instrument including the same
CN103165781A (en) * 2011-12-09 2013-06-19 奇力光电科技股份有限公司 Light emitting diode element
CN102437263A (en) * 2011-12-16 2012-05-02 映瑞光电科技(上海)有限公司 Light-emitting diode (LED) and manufacturing method thereof
CN103700744A (en) * 2013-12-23 2014-04-02 安徽三安光电有限公司 Light-emitting device

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