WO2015090903A1 - Dispositif thermoélectrique et procédé de fabrication d'un dispositif thermoélectrique - Google Patents

Dispositif thermoélectrique et procédé de fabrication d'un dispositif thermoélectrique Download PDF

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Publication number
WO2015090903A1
WO2015090903A1 PCT/EP2014/075894 EP2014075894W WO2015090903A1 WO 2015090903 A1 WO2015090903 A1 WO 2015090903A1 EP 2014075894 W EP2014075894 W EP 2014075894W WO 2015090903 A1 WO2015090903 A1 WO 2015090903A1
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WO
WIPO (PCT)
Prior art keywords
carrier
thermoelectric device
thermoelectric
plate
elastic material
Prior art date
Application number
PCT/EP2014/075894
Other languages
German (de)
English (en)
Inventor
Tobias ZOLLER
Ricardo Ehrenpfordt
Holger Rank
Frederik ANTE
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2015090903A1 publication Critical patent/WO2015090903A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Definitions

  • the present invention relates to a thermoelectric device and a method of manufacturing a thermoelectric device.
  • the Internet of Things is considered to be one of the most important future developments in information technology, which means that not only people have access to the internet and are connected through it, but also devices
  • One area of the "Internet of Things” is in the direction of production and home automation, eg. B. in the temperature measurement.
  • suitable sensors are already available, for.
  • the costs are very high at around 100 euros per sensor. Many are currently trying
  • TEG thermoelectric generators
  • thermoelektnschen device and a method for producing a thermoelektnschen device according to the main claims presented.
  • thermoelectric generator The energy obtained using a thermoelectric generator is directly related to the temperature gradient applied to the thermoelectric generator. To bring the temperature gradient to the thermoelektnschen generator can with the help of the construction and
  • thermoelectric generator a heat path within a housing or support of the thermoelectric generator are produced. This heat path should ideally have a low thermal resistance.
  • thermoelektnschen device or generator between two carriers or carrier substrates of a thermoelektnschen
  • thermoelectric generator using standard packaging processes mechanically largely decoupled and thermally largely low-loss in a construction and connection technology of an autonomous
  • thermoelektnschen device a good mechanical decoupling of a thermoelektnschen device or in a simple manner
  • thermoelektnschen device Manufacture of the two carrier planes is possible, ie a bottom formed by a first carrier and an upper side formed by a second carrier of the thermoelektnschen device can be made completely independent of each other with standard printed circuit board processes.
  • the construction and connection technology of the lower carrier adapted to the thermoelectric device can be carried out by thermal and mechanical stresses are kept as low as possible. Irrespective of this, the cost-effective standard construction and connection technology can be used for the upper support, where higher loads are possible.
  • thermoelectric device Possibility of high integration by passing the thermoelectric device through Officer, z. B. a circuit with other components, can be housed, so it can be dispensed with an insert of a metal lid. According to a continuation of the concept presented here can by the
  • thermoelectric device connection of the thermoelectric device by means of an elastic material also the problem of mechanical stress by z. B.
  • thermoelectric generators avoided or at least reduced.
  • thermoelectric device has the following features: a first carrier; a second carrier; a carrier connector disposed between the first carrier and the second carrier to form a predefined one
  • thermoelectric device composed of a first plate, a second plate, and an intermediate region having a plurality of thermoelectric electrodes extending between the first plate and the second plate
  • thermoelectric device is disposed in the predefined gap and connected to the first carrier and the second carrier.
  • the thermoelectric device can be used for example to generate an electrical voltage by utilizing a temperature difference.
  • a possible location of use of the thermoelectric device is thus, for example, a radiator.
  • the first carrier, the carrier connecting member and the second carrier may be stacked on each other in this order.
  • Each of the first and second supports may be rectangular plates having different thicknesses can have.
  • the carriers may be printed circuit boards.
  • the carrier connection element may be formed as a structure that connects the first and the second carrier only selectively, so that the predefined intermediate space can be understood as a sufficiently large air space for accommodating the thermoelectric component.
  • Carrier connection element may consist of a plastic material.
  • the thermoelectric device may be a thermoelectric generator for generating electrical energy from a temperature difference between the first and second plates.
  • the thermoelectric device may be constructed in the form of a Peltier element, wherein the first
  • the plates may for example be made of ceramic and
  • thermoelectric elements forming the intermediate region may comprise a semiconductor material.
  • the thermoelectric elements may be in the form of the first one spaced from the second plate
  • legss formed and be connected at their respective two ends fixed to the first and the second plate
  • Coupling of the thermoelectric device to the thermoelectric device may consist of connecting the first plate to the first carrier and connecting the second plate to the second carrier. These connections can be designed to be stress-decoupling.
  • the carrier connecting element may be frame-shaped and the
  • thermoelectric device can be arranged in a light of the carrier connecting element.
  • the frame shape can be round or angular.
  • Embodiment has the advantage that the thermoelectric device can be readily protected laterally from harmful effects.
  • the frame-shaped carrier connecting element can have a passage opening between an outer wall of the
  • Carrier connector sit, be created.
  • the Media access can also be defined by an interruption or structuring, a multi-part design of the carrier connection element. It can be created in this way, several media access.
  • the carrier connecting element may have at least one plated-through hole for electrically contacting the first carrier with the second carrier.
  • thermoelectric component can be connected to the first carrier by means of a first elastic material which is arranged between the first carrier and the first plate of the thermoelectric component.
  • a region of the first carrier, on which the thermoelektnsche element is applied may consist of a rigid material or an elastic carrier material such as polyimide or a bar or membrane-like structured rigid support material to store the thermal element stress-decoupling.
  • the thermoelectric component can be connected to the second carrier by means of a second elastic material which is arranged between the second carrier and the second plate of the thermoelectric component.
  • the elastic material may be structured or, for example, annular. Clearances in the structuring of the elastic material can during the building process with a rigid material, eg.
  • thermoelectric device As a sacrificial polymer, filled to lock the thermoelektnsche element on the first carrier. This can be advantageous for certain AVT processes such as wire bonding.
  • the sacrificial material can be taken as a final process step thermally or wet or dry chemical.
  • the first and second elastic materials may each be a plastic material. The materials may be identical and arranged as a layer between the thermoelectric device and the first and second carrier, respectively. Depending on the specification, the layers can be the same or different thicknesses. Alternatively, the first and second elastic materials may also differ, e.g. B. in terms of specific thermal conductivity or elasticity. About the elastic materials the thermoelectric device can advantageously be connected to the carrier stress-decoupling.
  • the first and / or the second elastic material may have a filler for increasing a thermal conductivity between the first carrier and the first plate or the second plate of the thermoelectric component.
  • the filler may be the first carrier with the first plate and / or the second carrier with the second plate of the thermoelectric device connecting structures -.
  • metallic spacers (balls) - act which are suitable, a plurality of
  • thermoelectric device Provide heat corridors between the support and the hot side or cold side of the thermoelectric device.
  • the heat gradient can thus be directed to the hot side or cold side in a particularly controlled and directional manner. Losses due to scattered heat can be minimized or completely eliminated.
  • the first and / or the second elastic material may have a metal layer on a side facing the first and / or the second plate of the thermoelectric device.
  • the metal layer may completely or partially cover the first and / or second elastic material and be formed, for example, from copper.
  • Conductivity or thermal contact resistances of the cold side and / or the hot side of the thermoelectric device can be improved in a simple manner.
  • the first carrier can have a depression which at least partially accommodates the thermoelectric component.
  • the recess may be at least partially covered by the first elastic material.
  • the depression can be trough-shaped and to
  • thermoelectric device Have dimensions as the thermoelectric device.
  • the bottom region of the depression may consist of a rigid material or of an elastic carrier material such as, for example, polyimide or a bar or membrane-like structured rigid carrier material in order to store the thermal element stress-decoupling.
  • an elastic carrier material such as, for example, polyimide or a bar or membrane-like structured rigid carrier material in order to store the thermal element stress-decoupling.
  • the thermoelectric device may further be configured such that a portion of the first carrier opposite the first plate of the thermoelectric component is formed as a metallic insert in the first carrier and / or a portion of the second carrier opposite the second plate of the thermoelectric component is metallic Insert is formed in the second carrier.
  • the first or second carrier can have an opening or passage opening into which the metallic insert can be inserted in the manufacturing process of the thermoelectric device.
  • the metallic insert can be glued, soldered or pressed in the manufacturing process of the carrier. It may be in the metal used for the use of a metal with particularly good thermal conductivity such. B. copper act.
  • the use of such inserts makes it possible that an efficiency of the hot side formed by the first plate and the cold side of the thermoelectric formed by the second plate
  • Component can be easily increased.
  • the described sections can be formed integrally with the carriers and each have at least one metallic through-connection.
  • a side of the first carrier facing away from the thermoelectric component may have a further metal layer.
  • the further metal layer may completely or partially cover a surface of the carrier side and, like the metal layer, may be formed on the second elastic material made of copper.
  • a side of the second carrier facing away from the thermoelectric component may have a cover.
  • This can be an area of Cover be attached by means of an adhesive on the side remote from the thermoelektnschen device side of the second carrier.
  • the lid can advantageously simultaneously act as a heat sink for the thermoelectric device.
  • an elastic connection of the lid can be realized with the second carrier.
  • a heat sink can also be arranged above the thermoelektnschen device on the second carrier.
  • thermoelective component may be encased in a molding compound or molding compound which may be disposed on a side of the second substrate facing away from the thermoelective component.
  • a molding compound or molding compound which may be disposed on a side of the second substrate facing away from the thermoelective component.
  • Thermoelektnschen device may be exempted from the molding compound to this z. B. to contact with a heat sink or to lead a fluid along.
  • Thermoelektnschen device opposite passage opening of the second carrier may be arranged. This brings space advantages and can improve the efficiency of the thermoelektnschen device when the lid acts as a heat sink.
  • the first carrier and / or the second carrier may comprise a thermosetting material.
  • thermosetting material In addition to a thereby advantageously increased thermo-mechanical strength of the carrier material is obtained as a further advantage a reduced specific gravity.
  • thermoelectric device A method of manufacturing a thermoelectric device comprising the steps of:
  • thermoelectric device composed of a first plate, a second plate and an intermediate region having a plurality of thermoelectric elements extending between the first plate and the second plate
  • thermoelectric device Arranging a carrier connector between the first carrier and the second carrier to connect the first carrier to the second carrier to form a predefined gap between the first carrier and the second carrier such that the thermoelectric device is disposed in the predefined gap.
  • thermoelectric device A method of manufacturing a thermoelectric device comprises the following steps:
  • thermoelectric device composed of a first plate, a second plate, and an intermediate region having a plurality of thermoelectric elements extending between the first plate and the second plate;
  • thermoelectric device Arranging a carrier connector between the first carrier and the second carrier to connect the first carrier to the second carrier to form a predefined gap between the first carrier and the second carrier such that the thermoelectric device is disposed in the predefined gap.
  • the method can be of a process-controlled
  • thermoelectric devices manufactured in a short time.
  • Thermoelectric device can be arranged on a second carrier facing the side of the first carrier and connected by means of a first elastic material to the first carrier. In the step of arranging, a material connection of the carrier connecting element to the first carrier and the second carrier can be produced.
  • thermoelectric device 1 is a sectional view of a thermoelectric device according to an embodiment of the present invention.
  • FIG. 2 is a sectional view of a thermoelectric device having a recess in the first carrier, according to an embodiment of the present invention
  • thermoelectric device 3 is a sectional view of a thermoelectric device having a heat sink, according to an embodiment of the present invention.
  • thermoelectric device 4 is a sectional view of a thermoelectric device with filler and metallization, according to an embodiment of the present invention
  • Fig. 5 is a sectional view of a thermoelectric device with
  • Fig. 6 is a sectional view of a thermoelectric device with
  • thermoelectric device according to an embodiment of the present invention.
  • thermoelectric device 100 shows a sectional view of a thermoelectric device 100 according to an embodiment of the present invention. Shown is a first carrier 102 and a second carrier 104, which are interconnected by a carrier connecting element 106 arranged between them. In a space 108 formed by the carrier connection element 106 between the first carrier 102 and the second carrier 104, a thermoelectric component 110 is arranged.
  • the first carrier 102 and the second carrier 104 are each a printed circuit board.
  • the printed circuit boards 102, 104 are stacked with the carrier connecting member 106 positioned therebetween.
  • the second carrier 104 has a smaller thickness than the first carrier 102 and is equipped with additional components in the form of a component 1 12 and a sensor 1 14, which are covered by a molding compound 1 16.
  • the carrier connecting element 106 is designed here annular and has an electrical feedthrough 1 18 for the electrical connection of
  • the carrier connector 106 is formed of a polymer. According to alternative embodiments, the carrier connection element 106 may consist of a metal or be realized in the form of an adhesive or a solder. The carrier connector 106 may also be used as another circuit board, e.g. As a prepreg, executed and contacted by gluing, soldering or welding to the first carrier 102 and the second carrier 104. Of the
  • Gap 108 is defined by a light of the annular
  • Carrier connection element 106 is formed and is sufficiently large for receiving the thermoelectric device 1 10 dimensioned. As shown in FIG. 1, in the completed thermoelectric device 100, a free air space remains between the thermoelectric device 110 and an inner wall of the carrier connection member 106.
  • the carrier connection member 106 may have any frame shape and be, for example, rectangular.
  • the carrier connection element 106 can also be realized in several parts in the form of arbitrarily formed spacers between the first carrier 102 and the second carrier 104.
  • the carrier connection element 106 has at least in one area a passage opening to the gap 108 between the first carrier 102 and the second carrier 104, which serves as media access for in the gap 108 on the carrier 102 applied media sensors.
  • An electrical connection of the thermoelectric device 1 10 to the first carrier 102 is realized via wire bonds or wire bonds 120.
  • the thermoelectric device 110 is shown in FIG. 1,
  • thermoelectric device 100 Embodiment of the thermoelectric device 100 as a
  • thermoelectric generator or TEG and consists of a bottom or first plate 122, a top or second plate 124 and a disposed between the first plate 122 and the second plate 124 - not shown in the illustration in FIG. 1 - Intermediate area 126 together.
  • the first plate 122 here forms the hot side of the thermoelectric generator 110 facing the first carrier 102 and the second plate 124 forms the cold side of the second carrier 104 facing the first carrier 102
  • thermoelectric generator 1 10 The intermediate region 126 is formed by a plurality of thermoelectric elements not shown here, which in the form of "legs" here formed by the first plate 122 hot side and here formed by the second plate 124 cold side of the thermoelectric generator 1 10th connect.
  • thermoelectric device 1 10 by means of a first elastic material 128, the layered between the first carrier 102 and the first plate 122 of the thermoelectric
  • thermoelectric Device 1 10 is arranged, connected to the first carrier 102.
  • a second elastic material 130 which is sandwiched between the second carrier 104 and the second plate 124 of the thermoelectric device 1 10, the thermoelectric device 1 10 is connected to the second carrier 104.
  • the first elastic material 128 and the second elastic material 130 are identical here, wherein the layer of the first elastic material 128 is thicker than the layer of the second elastic material
  • the elastic material layers 128, 130 enable a stress-decoupling connection of the thermoelectric component 110 to the carriers 102, 104. For better heat conduction, one below the
  • thermoelectric element 1 10 lying portion of the first carrier 102 as a metallic insert 132 in the first carrier 102 is formed.
  • thermoelectric element 1 10 lying portion of the second carrier 104 is formed.
  • a thickness of the metal inserts or inserts 132, 134 is adapted to the respective thickness of the associated printed circuit boards 102, 104, so that the insert 132 is thicker than the insert 134.
  • the metal used for the inserts 132, 134 is copper. According to others
  • thermoelectric device 100 shown in FIG. 1 may be used as a
  • Sensor module or sensor system are used, in addition to the
  • thermoelectric generator 1 10 as already explained, the first carrier 102, the stacked second carrier 104 and possibly further carrier and also has the mechanical connection region between the carriers 102, 104 forming the carrier connecting member 106.
  • the sensor system 100 is characterized in that the thermoelectric generator 110 is introduced into the vertical spacing or stand-off formed by the carrier connection element 106 between the carrier substrates 102, 104 in such a way that via the elastic material layers 128, 130 a mechanical connection from an upper side of the first and / or lower carrier 102 to a lower side of the second or upper carrier 104.
  • the sensor node 100 shown in FIG. 1 comprises a typical sensor system in the upper portion of the arrangement shown including the second carrier 104 and an additional power supply portion represented by the lower portion of the assembly including the first carrier 102.
  • the two areas are using the circuit board ring 106, the electrical
  • Through contacts 1 18 contains, connected.
  • the circuit board ring 106 z As a possible variation, instead of the circuit board ring 106 z.
  • adhesive, solder or a seal can be used together with a screw or clamp connection.
  • the two printed circuit boards 102, 104 show the elastic materials 128, 130 in defined regions in order to couple the thermoelectric generator 110.
  • the elastic material used for both areas 128, 130 is characterized in that it forms a mechanical damper and a direct Power transmission to the thermoelectric generator 1 10 prevents.
  • the defined regions 128, 130 are likewise distinguished by the fact that the thermal coupling with respect to the normal printed circuit board material is optimized by the use of the Cu inserts 132, 134.
  • the upper circuit board 104 includes in the embodiment shown in Fig. 1, the component 1 12 and the sensor 1 14, which are covered with the molding compound 1 16. The illustrated Kupferinsert 134 on the top was released by a special tool during the molding process to a subsequent contact from above
  • the elastic materials 128, 130 which are at least partially pronounced in the region between the first substrate 102 and the thermoelectric generator 110 and in the region between the second substrate 104 and the thermoelectric generator 110, increase the elastic materials 128, 130 according to exemplary embodiments
  • the elastic materials 128, 130 may contain structures or fillers to increase the heat transfer. According to further embodiments, in the first carrier 102 and / or in the second carrier 104 in the region of
  • thermoelectric generator 1 10 embedded structures which serve to increase the heat transfer.
  • the structures may be at least one metallic insert or one metallic via.
  • the first carrier 102 may further electronic components z. B. in the light of the carrier connection element 106, which are embedded on the carriers 102, 104 in the potting compound or molding compound 1 16.
  • the second carrier 104 in the region of the thermally conductive structure 134 and the thermoelectric generator 1 10 of the molding compound 1 16 exempted.
  • a cooler is thermally conductive applied in the released area.
  • the components 1 12, 1 14 on the second carrier 104 are at least partially spanned by a cover having a thermally conductive connection to the structure 134 of increased thermal conductivity in the second carrier 104 in the region of the thermoelectric generator 1 10 or at least a part of this Structure 134 represents.
  • the lid can act as a cooler.
  • FIG. 2 shows a sectional view of a further exemplary embodiment of the thermoelectric device 100.
  • the thermoelectric device 100 the thermoelectric
  • Device 100 as a sensor node with thermoelectric generator 1 10 and other components or sensors 1 12, 1 14 executed.
  • thermoelectric generator 1 10 is fitted between the two circuit boards 102, 104 and thermally contacted via the copper inserts 132, 134.
  • thermoelectric device 100 The peculiarity of this illustrated in Fig. 2 embodiment of the thermoelectric device 100 is that here the
  • thermoelectric generator 1 10 recessed in the lower or first carrier 102 inserted and thus partially surrounded by this. More specifically, the thermoelectric generator 110 is disposed in a recess 200 machined out of a surface 202 of the carrier 102. Thus, the thermoelectric element 110 is more securely fastened to the first carrier 102. In addition, a thickness or height of the carrier connecting element 106 can be reduced in a space-saving manner, as is the case with that shown in FIG.
  • the depression 200 is completely lined with the elastic material 128, so that the thermoelectric component 110 is bordered by the elastic material 128 as far as the intermediate region 126 and is stress-decoupled via this to the carrier or carrier substrate 102.
  • the depression 200 may be filled with the elastic material 128 only partially or up to a certain height.
  • FIG. 3 shows, on the basis of a further sectional view, the sensor node 100 from FIG. 2 with an additional element of a heat sink 300, which is connected to the
  • thermoelectric device 100 is attached to the second circuit board 104 in a suitable form.
  • the contacting of the cooler 300 may by different methods such. B. Gluing, soldering, welding, etc. done. In that shown in Fig. 3
  • the heat sink 300 is attached via a connecting element 302 to the copper insert 134 of the upper and second printed circuit board 104.
  • 4 again shows a further sectional view
  • thermoelectric device 100 Embodiment of the thermoelectric device 100. For better visibility of details of the sensor node 100 is here and in the
  • the first elastic material 128 has a filler 400 for increasing a thermal conductivity between the first carrier 102 and the first plate 122 of the thermoelectric component 110.
  • the second elastic material 130 has a metal layer 402 on a side facing the second plate 124 of the thermoelectric component 110.
  • the filler 400 is here below the thermoelectric generator 1 10 inserted in the form of a plurality of spacers, which are designed here as a copper spacer.
  • these spacers are made of copper or a material of similar good
  • Thermal conductivity is the thermal performance of the thermoelectric
  • thermoelectric generator 10 shows a sectional illustration of a further exemplary variation of the thermoelectric device 100 from FIG. 4.
  • this embodiment of the sensor node 100 has another
  • the further metal layer 500 is applied over the entire surface to a further surface 504 of the first carrier 102 facing away from the thermoelectric component 110.
  • the further metal layer 500 may be the further surface 504 of the circuit board 102 only partially cover.
  • the further metallization 500 is designed to increase the thermal contact area and improve the thermal path for the thermoelectric
  • the lid 502 is here formed of metal and on one of the
  • thermoelectric device 1 10 facing away side 506 of the second
  • thermoelectric device 100 Printed circuit board 104 of the thermoelectric device 100.
  • cover 502 in addition to the copper insert 134 arranged above the thermoelectric generator 110, also spans the cover
  • Embodiment of the metallic cover 502 is used as a heat sink with cooling fins, not shown).
  • This heat sink 502 is on the one hand coupled to the upper thermal path of the thermoelectric generator 1 10 and additionally enables the heat dissipation of the component 1 12.
  • the contacting of the lid 502 on the sides or on an edge region 508 is effected here by an adhesive or an adhesive 510 Alternatively, soldering to the printed circuit board 104 is also conceivable.
  • a layer of the adhesive material 510 is also arranged between the metallic insert 134 and an inner side of the cover 502.
  • Fig. 6 shows again in a sectional view a variant of
  • a passage opening 600 has been made in the upper or second printed circuit board 104 above the
  • thermoelectric generator 1 10 introduced.
  • the lid 502 is suitably shaped by a centrally lowered portion 602 to directly contact the thermoelectric generator 110 through the opening 600.
  • the thermoelectric generator 110 is mechanically decoupled in addition to the elastic material 130 with good thermal connection.
  • the inserted lid 502 acts in this
  • FIG. 7 shows a flow chart of an embodiment of a method 700 for producing a thermoelectric device.
  • a sensor module with stacked substrate planes and integrated thermoelectric generator as illustrated in Figures 1 to 6 by means of embodiments in large numbers
  • a first carrier of the thermoelectric device is provided.
  • the first carrier may be provided with or without a thermoelectric device already mounted thereon.
  • a second carrier of the thermoelectric device is provided. Steps 702 and 704 may be performed in any order or simultaneously.
  • a step 706 a first carrier of the thermoelectric device is provided.
  • the first carrier may be provided with or without a thermoelectric device already mounted thereon.
  • a second carrier of the thermoelectric device is provided. Steps 702 and 704 may be performed in any order or simultaneously.
  • Carrier connection element arranged between the first carrier and the second carrier, that between the first carrier and the second carrier, a gap for accommodating the thermoelectric device is formed. If the first carrier was in step 702 without the
  • thermoelectric device the thermoelectric device before the connection of the first and second carrier with the
  • Carrier connector to be suitably positioned on the first carrier.
  • the invention presented herein can be easily detected on the product by optical inspection.
  • Substrate layers and integrated thermoelectric devices will become necessary in the near future for (partially) autonomous sensors from the field of "Internet of Things" with a focus on cost reduction and the production of large quantities.
  • an exemplary embodiment comprises a "and / or" link between a first feature and a second feature, this is to be read such that the Embodiment according to an embodiment, both the first feature and the second feature and according to another embodiment, either only the first feature or only the second feature.

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Abstract

L'invention concerne un dispositif thermoélectrique (100). Le dispositif thermoélectrique (100) comprend un premier support (102), un deuxième support (104), un élément de liaison des supports (106) disposé entre le premier support (102) et le deuxième support (104) afin de relier le premier support (102) au deuxième support (104) en formant un espace intermédiaire (108) prédéfini entre le premier support (102) et le deuxième support (104), et un composant thermoélectrique (110), composé d'une première plaque (122), d'une deuxième plaque (124) et d'une zone intermédiaire (126), qui comprend une pluralité d'éléments thermoélectriques qui s'étendent entre la première plaque (122) et la deuxième plaque (124). Le composant thermoélectrique (110) est disposé dans l'espace intermédiaire (108) prédéfini et il est relié au premier support (102) et au deuxième support (104).
PCT/EP2014/075894 2013-12-19 2014-11-28 Dispositif thermoélectrique et procédé de fabrication d'un dispositif thermoélectrique WO2015090903A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013226617.0A DE102013226617A1 (de) 2013-12-19 2013-12-19 Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
DE102013226617.0 2013-12-19

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WO2015090903A1 true WO2015090903A1 (fr) 2015-06-25

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015110977A1 (de) * 2015-07-07 2017-01-12 Elringklinger Ag Sensorvorrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142739A (ja) * 2001-11-02 2003-05-16 Yamaha Corp 熱電装置
DE10205223A1 (de) * 2002-02-08 2003-08-28 Audi Ag Fahrzeugaggregat
EP2381498A1 (fr) * 2010-04-20 2011-10-26 Mondragon Componentes, S. Coop. Procédé de fabrication d'un module thermoélectrique, et module thermoélectrique
DE102011075661A1 (de) * 2011-03-29 2012-10-04 Micropelt Gmbh Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142739A (ja) * 2001-11-02 2003-05-16 Yamaha Corp 熱電装置
DE10205223A1 (de) * 2002-02-08 2003-08-28 Audi Ag Fahrzeugaggregat
EP2381498A1 (fr) * 2010-04-20 2011-10-26 Mondragon Componentes, S. Coop. Procédé de fabrication d'un module thermoélectrique, et module thermoélectrique
DE102011075661A1 (de) * 2011-03-29 2012-10-04 Micropelt Gmbh Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung

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