WO2015090470A1 - Procédé permettant d'assembler un écran de protection contre les interférences électromagnétiques à une carte de circuit imprimé - Google Patents

Procédé permettant d'assembler un écran de protection contre les interférences électromagnétiques à une carte de circuit imprimé Download PDF

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Publication number
WO2015090470A1
WO2015090470A1 PCT/EP2013/077809 EP2013077809W WO2015090470A1 WO 2015090470 A1 WO2015090470 A1 WO 2015090470A1 EP 2013077809 W EP2013077809 W EP 2013077809W WO 2015090470 A1 WO2015090470 A1 WO 2015090470A1
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WO
WIPO (PCT)
Prior art keywords
shield
pcb
side extensions
pins
flat part
Prior art date
Application number
PCT/EP2013/077809
Other languages
English (en)
Inventor
Emrah Mustafa HOSCOSKUN
Original Assignee
Arcelik Anonim Sirketi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arcelik Anonim Sirketi filed Critical Arcelik Anonim Sirketi
Priority to PCT/EP2013/077809 priority Critical patent/WO2015090470A1/fr
Priority to EP13811978.9A priority patent/EP3085214A1/fr
Publication of WO2015090470A1 publication Critical patent/WO2015090470A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips

Definitions

  • the present invention relates to a method for assembling an electromagnetic interference (EMI) shield to a printed circuit board (PCB) prior to the wave soldering process.
  • EMI electromagnetic interference
  • Wave soldering is a soldering process by which electronic components are soldered much faster than manual soldering.
  • An electronic assembly is accordingly obtainable by way of applying molten solder to a printed circuit board in a tank.
  • the latter is passed across a wave of solder, in response to which the exposed metallic areas that are not protected with a coating (mask) become wet such that a mechanical and electrical connection is established.
  • electromagnetic interference electromagnetic interference
  • RFID radio frequency interference
  • WO2009105379 A1 defines a shielding apparatus on a substrate, comprising a first wall having laterally spaced-apart detent protrusions, a second wall having an edge portion disposed relative to the first wall such that an interface between the edge portion of the second wall and the first wall is substantially sealed against the ingress and/or egress of electromagnetic interference.
  • the present invention provides a method for soldering a shield to a PCB by which only the shield pins are soldered first and the shield is subsequently mountable in a more practical manner and in most cases, without requiring an operator. This substantially eliminates problems associated with the manufacturing cycle efficiency that would persist if the shield were to be manually soldered by an operator.
  • the present invention therefore provides a method for soldering a shield to a PCB subsequent to a soldering process as defined in Claim 1.
  • the invention further provides an EMI shield as defined in Claim 3.
  • Primary object of the present invention is to provide a soldering process by which a protective shield is fixable on a PCB subsequent to the soldering process.
  • the present invention proposes a method for soldering a shield to a PCB in which four shield pins are placed into a PCB and the same is provided with solder, preferably by wave soldering.
  • solder preferably by wave soldering.
  • a planar sheet’s four corners are cut and square cut-outs are removed at the corners.
  • Four edges are then bent to obtain a one-side open box-like form.
  • Two planar integrally connected retaining surfaces of a shield pin face and press against inner surfaces of two neighbouring side extensions at a corner of the shield. Said retaining surfaces are separated by a substantially right-angled folding line and coincides with an open line in between two adjacent lateral edges of two neighbouring side extensions.
  • Fig. 1 demonstrates a general perspective view of the components of the shield together with the PCB in an unassembled manner according to the present invention.
  • Fig. 2 demonstrates a general perspective view of the components of the shield together with the PCB in an assembled manner according to the present invention.
  • Fig. 3a and 3b respectively demonstrate inner and outer perspective views of the shield pin according to the present invention.
  • the present invention proposes a method for soldering a shield (1) in the form of a metal body having a flat part (4) and four downwardly extending side extensions (5).
  • the side extensions (5) are typically formed by conventional cutting tools such that a planar sheet’s four corners are cut out to obtain a sheet with removed square cut-outs at the corners.
  • the side extensions (5) are then bent in one direction such that the flat part (4) is enclosed by substantially right-angled side extensions (5).
  • the resulting structure is placed on the PCB (1) so as to be covering electronic components within the region defined by the flat part (4) and the four side extensions (5).
  • a given side extension (5) is not attached to any of the two neighbouring side extensions (5) so that although a lateral edge (6) of a first side extension (5) is substantially aligned with an adjacent lateral edge (6) of the neighbouring second side extension (5), the two lateral edges (6) are not fixed to each other.
  • the present invention proposes a method for soldering a shield (2) to a PCB (1), the method of soldering comprising the steps of a) inserting four shield pins (3) into a PCB (1), b) providing the PCB (1) with solder, c) cutting a planar rectangular sheet’s four corners to obtain a flat sheet with removed square cut-outs at the corners, d) forming four side extensions (5) by bending four edges of the flat part (4) in one direction such that the flat part (4) is surrounded by substantially right-angled side extensions (5) in the form of a shield (2) and e) attaching said shield (2) to said PCB (1) by the four shield pins (3) after the termination of the soldering process.
  • said step of attaching said shield (2) to the PCB (1) at the four shield pins (3) after the termination of the soldering process further comprises the step of fixing the shield (2) such that two planar integrally connected retaining surfaces (8) of a shield pin (3) confront and lean against the inner surfaces of two neighbouring side extensions (5) at a given corner of the shield (2).
  • the method of the invention provides that the four shield pins (3) are inserted into a PCB (1) and the PCB (1) is then provided with solder.
  • the shield (2) is fixed to the PCB (1) at the four shield pins (3) only after the soldering process has taken place.
  • the soldering process can preferably be performed by way of wave soldering by which all electronic components according to the required PCB layout, including the shield pins (3) are placed in the PCB (1) and accordingly soldered. In this process, a certain amount of molten solder flows downwards into intimate contact with the desired areas of the PCB (1), including the through-hole joints (7) into which the shield pins (3) are inserted.
  • the present invention proposes a PCB (1) having a conductive electro-magnetic radiation shield (2) fixable to the PCB (1) to cover electronic components of the same, the shield (2) being fixable by means of four shield pins (3) insertable into the PCB (1), the shield (2) having a flat part (4) and four side extensions (5) formed by removing four square cut-outs at the corners of the flat part (4) and bending four edges of the flat part (4) in one direction such that the flat part (4) is enclosed by substantially right-angled side extensions (5).
  • the shield pins (3) are structured to have two planar integrally connected retaining surfaces (8) separated by a folding line (9) such that said two retaining surfaces (8) have a retaining surface contact with the inner surfaces of two neighbouring side extensions (5) at a corner of the shield (2), where the folding line (9) coincides with an open line in between two adjacent lateral edges (6) of two neighbouring side extension (5).
  • the structure of the shield pins (3) according to the invention are shaped such that they have an enhanced surface contact with the side extensions (5) of the shield (2) so as to retain the same in a reliable manner.
  • the shield pins (3) are structured to have two planar integrally connected retaining surfaces (8) separated by a folding line (9). When the shield (2) is assembled, the two retaining surfaces (8) lean against the inner surfaces of two neighbouring side extensions (5) at a given corner of the shield (2). It is to be noted that the soldering process may cause a certain amount of deformation in the structure of the shield pins (3). To this end, since the two adjacent lateral edges (6) of two neighbouring side extensions (5) are not attached to each other, this advantageously offers a certain amount of flexibility when assembling the shield (2).
  • the shield pins (3) have a stem (10) and a connection end (11), the connection end (11) having a reduced longitudinal cross-section compared to the stem (10) portion’s longitudinal cross-section, providing that the molten solder fill around the connection ends (11) of the shield pins (3) inserted into through-hole joints (7) in the PCB (1).
  • the invention therefore provides that a shield (2) is soldered to a PCB (1) by which the shield pins (3) are soldered first and the shield (2) is subsequently mountable in a more practical manner without requiring an operator. This enhances the manufacturing cycle efficiency since no manual soldering operation is effectable.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente invention se rapporte à un procédé permettant de braser un écran de protection (2) à une carte de circuit imprimé (1), le procédé de brasage comprenant les étapes consistant à insérer quatre broches d'écran de protection (3) dans une carte de circuit imprimé (1), à fournir un métal d'apport à la carte de circuit imprimé (1), à couper les quatre coins d'une feuille plane pour obtenir une feuille plate comportant des découpes carrées réalisées au niveau des coins et à former quatre extensions latérales (5) par pliage de quatre bords de la partie plate (4) dans une direction de telle sorte que la partie plate (4) soit entourée par les extensions latérales sensiblement à angle droit (5) sous la forme d'un écran de protection (2).
PCT/EP2013/077809 2013-12-20 2013-12-20 Procédé permettant d'assembler un écran de protection contre les interférences électromagnétiques à une carte de circuit imprimé WO2015090470A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2013/077809 WO2015090470A1 (fr) 2013-12-20 2013-12-20 Procédé permettant d'assembler un écran de protection contre les interférences électromagnétiques à une carte de circuit imprimé
EP13811978.9A EP3085214A1 (fr) 2013-12-20 2013-12-20 Procédé permettant d'assembler un écran de protection contre les interférences électromagnétiques à une carte de circuit imprimé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/077809 WO2015090470A1 (fr) 2013-12-20 2013-12-20 Procédé permettant d'assembler un écran de protection contre les interférences électromagnétiques à une carte de circuit imprimé

Publications (1)

Publication Number Publication Date
WO2015090470A1 true WO2015090470A1 (fr) 2015-06-25

Family

ID=49880798

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/077809 WO2015090470A1 (fr) 2013-12-20 2013-12-20 Procédé permettant d'assembler un écran de protection contre les interférences électromagnétiques à une carte de circuit imprimé

Country Status (2)

Country Link
EP (1) EP3085214A1 (fr)
WO (1) WO2015090470A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552111U (fr) * 1978-06-21 1980-01-09
FR2838914A1 (fr) * 2002-04-18 2003-10-24 Siemens Vdo Automotive Dispositif de protection de composants electroniques
DE102005031238A1 (de) * 2005-07-01 2007-01-04 Conti Temic Microelectronic Gmbh Vorrichtung zur Abschirmung einer elektrischen Einheit vor/von EMV-Strahlung
WO2007034754A1 (fr) * 2005-09-20 2007-03-29 Murata Manufacturing Co., Ltd. Structure de protection
WO2009105379A1 (fr) 2008-02-22 2009-08-27 Laird Technologies, Inc. Appareil de blindage contre les interférences électromagnétiques (emi) et procédés associés
WO2012046965A2 (fr) * 2010-10-06 2012-04-12 주식회사 케이티엑스 Clip de fixation pour boîtier de blindage servant à bloquer les ondes électromagnétiques

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552111U (fr) * 1978-06-21 1980-01-09
FR2838914A1 (fr) * 2002-04-18 2003-10-24 Siemens Vdo Automotive Dispositif de protection de composants electroniques
DE102005031238A1 (de) * 2005-07-01 2007-01-04 Conti Temic Microelectronic Gmbh Vorrichtung zur Abschirmung einer elektrischen Einheit vor/von EMV-Strahlung
WO2007034754A1 (fr) * 2005-09-20 2007-03-29 Murata Manufacturing Co., Ltd. Structure de protection
WO2009105379A1 (fr) 2008-02-22 2009-08-27 Laird Technologies, Inc. Appareil de blindage contre les interférences électromagnétiques (emi) et procédés associés
WO2012046965A2 (fr) * 2010-10-06 2012-04-12 주식회사 케이티엑스 Clip de fixation pour boîtier de blindage servant à bloquer les ondes électromagnétiques

Also Published As

Publication number Publication date
EP3085214A1 (fr) 2016-10-26

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