WO2015089933A1 - Pecvd处理装置及在基板上进行pecvd处理的方法 - Google Patents

Pecvd处理装置及在基板上进行pecvd处理的方法 Download PDF

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Publication number
WO2015089933A1
WO2015089933A1 PCT/CN2014/071174 CN2014071174W WO2015089933A1 WO 2015089933 A1 WO2015089933 A1 WO 2015089933A1 CN 2014071174 W CN2014071174 W CN 2014071174W WO 2015089933 A1 WO2015089933 A1 WO 2015089933A1
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Prior art keywords
electrode
screw
adjusting
pecvd
angle
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English (en)
French (fr)
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刘凤举
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/345,954 priority Critical patent/US20160005574A1/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096—Flat-bed apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/327—Arrangements for generating the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3322—Problems associated with coating
    • H01J2237/3323—Problems associated with coating uniformity

Definitions

  • the present invention relates to the field of manufacturing liquid crystal display devices, and more particularly to a PECVD processing apparatus and a method of performing PECVD processing on a substrate.
  • PECVD Plasma Vapor Deposition
  • PC Chemical Vapor Deposition Processing Chamber
  • TFT-LCD Thin Film Transistor Display Panel
  • the thickness difference of different regions should not be too large, otherwise the TFT Device (thin film transistor device) electrical difference is too large, which will cause different performance of different regions of the TFT-LCD display, such as causing a difference in color in the same region, resulting in a display
  • the quality of the display device is degraded.
  • uneven film thickness may occur, which may affect the quality of the display device.
  • a conventional PECVD processing apparatus in which a Pump Port (160) and a Valve (Valve 150) are disposed on the same side, so that the airflow is biased toward the side of the valve 150, and the front end of the valve 150 is shown.
  • the open area 151 also causes the plasma gas to be biased toward the side of the valve 150.
  • the film thickness of the deposited material on the glass substrate 180 near the valve 150 side is thick.
  • the plasma distribution between the electrode plates is changed by adjusting the position of the RF power source 130 at the first electrode 140 to change the uniformity of the film thickness in different regions (hereinafter referred to as U%), but the method needs to be cooled and the device needs to be Disassembly of the chamber lid is time consuming and laborious, and may require repeated adjustments to be successful, resulting in low utilization of the machine.
  • the technical problem to be solved by the present invention is to provide a PECVD processing apparatus with high efficiency and uniformity and a method of performing PECVD processing on a substrate.
  • a PECVD processing apparatus comprising: a deposition chamber, a processing chamber is provided, an inlet and an outlet are respectively disposed on the first sidewall and the second sidewall of the deposition box, and a valve is disposed on the third sidewall of the deposition box, the outlet is disposed Adjacent to the third side wall on a side of the second side wall;
  • a first electrode connected to the power source, one end of which corresponds to the position of the valve and is adjacent to the outlet;
  • an electrode adjusting device configured to adjust a relative angle between the first electrode and the second electrode to make a plasma gas flow between the first electrode and the second electrode uniform.
  • the electrode adjusting device comprises a support rod directly supporting the second electrode and an adjustment mechanism for adjusting the angle of the support rod. Since the second electrode is not directly connected to the power supply pipe or the like, adjustment of the second electrode minimizes the adjustment mechanism.
  • the adjusting mechanism includes an adjusting rod fixed on the support rod, and two ends of the adjusting rod are respectively provided with a first screw, a second screw and a second screw for locking the first screw and the second screw
  • the first screw and the second screw are respectively pressed against the wall surface of the deposition box; the angle of the adjustment rod can be adjusted by adjusting the first screw and the second screw to adjust the support rod angle.
  • the support rod is directly adjusted by the first and second screws, and the structure is relatively simple, the adjustment is convenient, and the precision is high.
  • the electrode adjusting device includes a first screw, a second screw, and a nut for locking the first screw and the second screw, which are respectively disposed at both ends of the second electrode for direct support.
  • the electrode adjusting device is further provided with a scale.
  • the quantization of the adjustment is achieved by the scale, and the corresponding angle adjustment can be performed for different film thicknesses after implementation, so that it is not necessary to perform adjustment every time.
  • a method of performing a PECVD process on a substrate comprising the steps of:
  • adjusting the relative angle between the first electrode and the second electrode is by the angle to the second electrode
  • the adjustment is implemented, and an electrode adjusting device is disposed on the second electrode to adjust an angle of the second electrode.
  • the electrode adjusting device comprises a support rod directly supporting the second electrode and an adjustment mechanism for adjusting the angle of the support rod.
  • the adjusting mechanism includes an adjusting rod fixed on the support rod, and two ends of the adjusting rod are respectively provided with a first screw, a second screw and a second screw for locking the first screw and the second screw
  • the first screw and the second screw are respectively pressed against the wall surface of the deposition box; the angle of the adjustment rod can be adjusted by adjusting the first screw and the second screw to adjust the support rod angle.
  • the electrode adjusting device includes a first screw, a second screw, and a nut for locking the first screw and the second screw, which are respectively disposed at both ends of the second electrode for direct support.
  • an electrode adjusting device is disposed on the PECVD processing device for adjusting the relative angle between the first electrode and the second electrode, so that the plasma gas flow between the two electrodes tends to be homogenized to some extent.
  • the thickness of the film deposited on the glass substrate is made to have a good uniformity, and the problem of thickness unevenness caused by the deviation of the airflow due to the arrangement of the valve and the air outlet is eliminated.
  • FIG. 1 is a schematic structural view of a conventional PECVD processing apparatus
  • FIG. 2 is a schematic structural view of a PECVD processing apparatus according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram showing the principle of a PECVD processing apparatus according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a PECVD processing apparatus according to a second embodiment of the present invention.
  • Fig. 5 is a view showing the steps of carrying out a PECVD process in accordance with the present invention.
  • an improved PECVD processing apparatus includes: a deposition cartridge 100 And a first electrode 140 and a second electrode 170 disposed in the deposition box 100.
  • the deposition chamber 100 is internally provided with a processing chamber 110, an inlet 120 and an outlet 160 are respectively disposed at the first side wall 101 and the second side wall 102 of the deposition box 100, and the valve 150 is disposed at the deposition box 100.
  • the third side wall 103 is disposed on the side of the second side wall 102 adjacent to the third side wall 103, so that the plasma gas flows smoothly in the processing chamber 110;
  • a first electrode 140 is disposed inside, and the first electrode 140 is connected to the RF power source 130, one end of which corresponds to the position of the valve 150 and adjacent to the outlet 160, and the front end region of the valve 150 is an open area 151 which is open.
  • a second electrode 170 is disposed on the opposite surface of the first electrode 140, and a material deposition is required to form a thin film. When a SiNx and ASi thin film is required to be formed, the glass substrate 180 may be placed on the second electrode 170, and then a plasma gas is introduced.
  • the second electrode 170 is provided with an electrode adjusting device 190 for adjusting the relative angle between the first electrode 140 and the second electrode 170 to make the first electrode 140 and the second electrode 17
  • the plasma flow between 0 is uniform, eliminating the problem of thickness non-uniformity caused by the displacement of the airflow due to the arrangement of the valve 150 and the outlet 160.
  • the angle of the second electrode 170 is changed, the airflow is shifted to a certain extent, which promotes the uniformity of the thickness of the deposited film layer.
  • the electrode adjusting device 190 includes a support rod 195 that directly supports the second electrode 170 and an adjustment mechanism 190a for adjusting the angle of the support rod 195. Since the second electrode 170 is not directly connected to the power supply pipe or the like, the embodiment in which the electrode adjusting device 190 is disposed on the second electrode can simplify the adjusting mechanism 190a to the utmost extent. Of course, the control of the plasma gas flow can also be achieved by providing an adjustment device on the first electrode 140.
  • the adjusting mechanism 190a includes an adjusting rod 194 fixed on the support rod 195.
  • the two ends of the adjusting rod 194 are respectively provided with a first screw 191, a second screw 192, and a locking mechanism.
  • a first screw 191, a nut 193 of the second screw 192, the first screw 191 and the second screw 192 are respectively pressed against the wall surface of the deposition box 100; by adjusting the first screw 191 and the second screw 192 can adjust the angle of the adjustment rod 194 to adjust the angle of the support rod 195, and the second electrode 170 also changes in angle.
  • the rod 195 is adjusted, the structure is relatively simple, the adjustment is convenient, and the precision is high.
  • a scale can be set on the motor adjusting device 190 to achieve quantitative adjustment, which is more accurate and convenient.
  • the electrode adjusting device 190 adopts different structural forms.
  • the electrode adjusting device 190 includes The first screw 191, the second screw 192, and the nut 193 for locking the first screw 191 and the second screw 192 are directly supported at both ends of the second electrode 170. This structure is directly supported by a twin screw and is adjustable with high precision.
  • the invention also provides a method for performing a PECVD process on a substrate, as shown in FIG. 5, which includes the step S1: adjusting the relative angles of the first electrode and the second electrode in the deposition box to make the first electrode and the second electrode The plasma gas flow is uniform; S2: PECVD is performed on the glass substrate after adjustment.
  • adjusting the relative angle between the first electrode and the second electrode is achieved by adjusting an angle of the second electrode, wherein the second electrode is provided with an electrode adjusting device for the second electrode

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

一种PECVD处理装置，包括：沉积盒（100）以及设置在沉积盒（100）内的第一电极（140）、第二电极（170）；所述沉积盒（100）内部为处理腔（110），一进口（120）以及一出口（160）分别设置在所述沉积盒（100）的第一侧壁（101）以及第二侧壁（102），一阀门（150）设置在所述沉积盒（100）的第三侧壁（103）上，所述出口（160）设置在所述第二侧壁（102）一侧与所述第三侧壁（103）相邻；在处理腔（110）内部设置有第一电极（140），第一电极（140）与RF电源（130）连接，其一端与所述阀门（150）的位置相对应且与所述出口（160）相邻；还设置有一电极调节装置（190），该电极调节装置（190）用于调节所述第一电极（140）与所述第二电极（170）之间的相对角度以使第一电极（140）与第二电极（170）之间的等离子体气流均匀，消除因阀门（150）和出口（160）的设置使气流偏移引起的厚度不均匀问题。

Description

PECVD处理装置及在基板上进行 PECVD处理的方法
【技术领域】
本发明涉及液晶显示装置制造领域， 更具体的说， 涉及一种 PECVD处理装 置及在基板上进行 PECVD处理的方法。
【背景技术】
PECVD ( Plasma Enhanced Chemical Vapor Deposition ) Process Chamber (化 学气相沉积法处理腔， 以下简称 PC )在进行玻璃基板上 TFT-LCD (薄膜晶体管 显示面板）的 SiNx和 ASi薄膜时， 玻璃基板上沉积获得的薄膜的不同区域厚度 差异不能太大， 否则 TFT Device (薄膜晶体管器件） 电性差异过大， 会造成 TFT-LCD显示器不同区域的性能出现差异， 如造成同一区域内颜色具有差异的 情况， 从而造成显示器的品质下降， 当然， 在沉积其它材料薄膜时， 也存在膜 厚不均的情况， 也有可能会影响到显示装置的品质。
如图 1所示为现有一种现有 PECVD处理装置， 其 Pump Port (泵出口 160 ) 和 Valve (阀门 150 )设置在同一侧， 这样， 造成了气流偏向阀门 150—侧， 另 外， 阀门 150前端的敞开区域 151也会造成等离子气体偏向阀门 150—侧， 由 于以上原因， 造成了玻璃基板 180上靠近阀门 150—侧的沉积材料的膜厚偏厚 的现象。 目前也有通过调整 RF电源 130在第一电极 140的位置来改变电极板间 的等离子体分布， 以改变不同区域膜厚的均匀性（以下简称 U% ), 但该方式需 要降温而且需要把装置的腔盖（chamber lid )拆解， 这样费时费力， 而且可能需 要进行反复调整才能成功， 造成机台的利用率低下。
【发明内容】
本发明所要解决的技术问题是提供一种效率高，均匀性好的 PECVD处理装 置及在基板上进行 PECVD处理的方法。
本发明的目的是通过以下技术方案来实现的：一种 PECVD处理装置，包括： 沉积盒， 设置有一处理腔， 一进口以及一出口分别设置在所述沉积盒的第 一侧壁以及第二侧壁， 一阀门设置在所述沉积盒的第三侧壁上， 所述出口设置 在所述第二侧壁一侧与所述第三侧壁相邻；
第一电极， 与电源连接， 其一端与所述阀门的位置相对应且与所述出口相 邻；
第二电极， 与所述第一电极对置；
电极调节装置， 用于调节所述第一电极与所述第二电极之间的相对角度以 使第一电极与第二电极之间的等离子体气流均匀。
优选的， 所述电极调节装置包括一直接支撑所述第二电极的支撑杆以及用 于调节所述支撑杆角度的调节机构。 第二电极由于并未直接连接电源管道等结 构， 因而对第二电极进行调整可最大限度的简化调节机构。
优选的， 所述调节机构包括一固定在所述支撑杆上的调节杆， 所述调节杆 的两端分别设置有第一螺杆、 第二螺杆以及用于锁定所述第一螺杆、 第二螺杆 的螺母， 所述第一螺杆、 第二螺杆分别顶压在所述沉积盒的壁面上； 通过调节 所述第一螺杆、 第二螺杆可调节所述调节杆的角度进而调整所述支撑杆的角度。 通过第一及第二螺杆直接对支撑杆调整， 这种结构相对比较简单， 调节也比较 方便， 并且精度较高。
优选的， 所述电极调节装置包括分别设置在所述第二电极两端用于直接支 撑的第一螺杆、 第二螺杆以及用于锁定所述第一螺杆、 第二螺杆的螺母。 这是 另一种可行的实施例， 通过双螺杆直接支撑， 并且可调节， 精度比较高。
优选的， 所述电极调节装置还设置有刻度。 通过刻度实现调节的量化， 通 过实施后可对不同膜厚进行对应的角度调节， 从而不需要每次进行调整。
一种在基板上进行 PECVD处理的方法， 其中包括步骤：
S: 调节沉积盒中第一电极与第二电极的相对角度， 使第一电极与第二电极 之间的等离子体气流实现均匀。
优选的， 调节第一电极与第二电极的相对角度是通过对所述第二电极的角 度进行调整实现， 所述第二电极上设置一电极调节装置对所述第二电极的角度 进行调节。
优选的， 所述电极调节装置包括一直接支撑所述第二电极的支撑杆以及用 于调节所述支撑杆角度的调节机构。
优选的， 所述调节机构包括一固定在所述支撑杆上的调节杆， 所述调节杆 的两端分别设置有第一螺杆、 第二螺杆以及用于锁定所述第一螺杆、 第二螺杆 的螺母， 所述第一螺杆、 第二螺杆分别顶压在所述沉积盒的壁面上； 通过调节 所述第一螺杆、 第二螺杆可调节所述调节杆的角度进而调整所述支撑杆的角度。
优选的， 所述电极调节装置包括分别设置在所述第二电极两端用于直接支 撑的第一螺杆、 第二螺杆以及用于锁定所述第一螺杆、 第二螺杆的螺母。
本发明由于在 PECVD 处理装置上设置了电极调节装置用以调节第一电极 以及第二电极之间的相对角度， 使得两个电极之间的等离子体气流在一定程度 上趋于均勾化， 从而使得沉积在玻璃基板上的薄膜厚度达到良好的均勾性， 消 除了因为阀门以及出气口的设置使气流偏移引起的厚度不均匀问题。
【附图说明】
图 1是现有一种 PECVD处理装置的结构简图，
图 2是本发明实施例一 PECVD处理装置的结构简图，
图 3是本发明实施例一 PECVD处理装置原理示意图，
图 4是本发明实施例二 PECVD处理装置的结构简图，
图 5是本发明实施进行 PECVD处理的步骤示意图。
【具体实施方式】
下面结合附图和较佳的实施例对本发明作进一步说明。
实施例一
如图 2-3所示， 提供了一种改进的 PECVD处理装置， 其包括： 沉积盒 100 以及设置在沉积盒 100内的第一电极 140、 第二电极 170。 所述沉积盒 100内部 为处理腔 110,—进口 120以及一出口 160分别设置在所述沉积盒 100的第一侧 壁 101以及第二侧壁 102,—阀门 150设置在所述沉积盒 100的第三侧壁 103上， 所述出口 160设置在所述第二侧壁 102—侧与所述第三侧壁 103相邻， 这样以 便于等离子气体在处理腔 110 内流动顺畅； 在处理腔 110 内部设置有第一电极 140, 第一电极 140与 RF电源 130连接， 其一端与所述阀门 150的位置相对应 且与所述出口 160相邻， 阀门 150的前端区域为敞开设置的敞开区域 151 ; 在第 一电极 140的对立面设置有第二电极 170,需要进行材料沉积形成薄膜如需要形 成 SiNx和 ASi薄膜时， 可将玻璃基板 180放置在第二电极 170上， 然后通入等 离子气体， 进行 PECVD流程； 第二电极 170设置有一电极调节装置 190, 该电 极调节装置用于调节所述第一电极 140与所述第二电极 170之间的相对角度以 使第一电极 140与第二电极 170之间的等离子体气流均匀， 消除因阀门 150和 出口 160的设置使气流偏移引起的厚度不均匀问题。 如图 3所示， 由于第二电 极 170 的角度发生了变化， 使得气流产生了一定的偏移， 这样可对沉积膜层的 厚度均匀性起到促进的左右。
电极调节装置 190包括一直接支撑所述第二电极 170的支撑杆 195以及用于 调节所述支撑杆 195角度的调节机构 190a。 第二电极 170由于并未直接连接电 源管道等结构， 本实施例将电极调节装置 190设置在第二电极上可最大限度的 简化调节机构 190a。 当然， 也可以通过在第一电极 140上设置调节装置来实现 对等离子气流的控制。
本实施例中， 所述调节机构 190a包括一固定在所述支撑杆 195上的调节杆 194, 所述调节杆 194的两端分别设置有第一螺杆 191、 第二螺杆 192以及用于 锁定所述第一螺杆 191、 第二螺杆 192的螺母 193 , 所述第一螺杆 191、 第二螺 杆 192分别顶压在所述沉积盒 100的壁面上； 通过调节所述第一螺杆 191、 第二 螺杆 192可调节所述调节杆 194的角度进而调整所述支撑杆 195的角度， 而第 二电极 170也会发生角度变化。 通过第一螺杆 191及第二螺杆 192直接对支撑 杆 195调整， 这种结构相对比较简单， 调节也比较方便， 并且精度较高。
为了达到较高的精确度， 也为了对不同膜厚要求的工艺进行调整， 可在电机 调节装置 190上设置刻度， 以实现量化调节， 更加准确方便。
实施例二
如图 4所示为本发明提供的另一种实施例， 与实施例一不同在于， 电极调节 装置 190釆用了不同的结构形式， 在本实施例中， 电极调节装置 190包括分别 设置在所述第二电极 170两端用于直接支撑的第一螺杆 191、第二螺杆 192以及 用于锁定所述第一螺杆 191、 第二螺杆 192的螺母 193。 这种结构通过双螺杆直 接支撑， 并且可调节， 精度比较高。
本发明同时提供一种在基板上进行 PECVD处理的方法， 如图 5所示， 其中 包括步骤 S1 : 调节沉积盒中第一电极与第二电极的相对角度， 使第一电极与第 二电极之间的等离子体气流实现均匀； S2:在调整好之后对玻璃基板进行 PECVD 处理。 在该方法中， 调节第一电极与第二电极的相对角度是通过对所述第二电 极的角度进行调整实现， 所述第二电极上设置一电极调节装置对所述第二电极 以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不能 认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通技 术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干简单推演或替换， 都应当视为属于本发明的保护范围。

Claims

权利要求
1、 一种 PECVD处理装置， 包括：
沉积盒（100), 设置有一处理腔（ 110), —进口 （120) 以及一出口 （160) 分别设置在所述沉积盒（100) 的第一侧壁 （101 ) 以及第二侧壁 （102), —阀 门 （ 150 )设置在所述沉积盒（ 100 ) 的第三侧壁 （ 103 )上， 所述出口 （ 160 ) 设置在所述第二侧壁 （102)—侧与所述第三侧壁 （103)相邻；
第一电极（140), 与电源 （130) 连接， 其一端与所述阀门 （150) 的位置 相对应且与所述出口 （160)相邻；
第二电极（170), 与所述第一电极（ 140)对置；
电极调节装置（ 190),用于调节所述第一电极（ 140)与所述第二电极（ 170) 之间的相对角度以使第一电极（140) 与第二电极（170)之间的等离子体气流 均匀。
2、如权利要求 1所述的 PECVD处理装置，其中， 所述电极调节装置 ( 190 ) 包括一直接支撑所述第二电极（170) 的支撑杆（195) 以及用于调节所述支撑 杆 ( 195 ) 角度的调节机构 ( 190a )。
3、 如权利要求 2所述的 PECVD处理装置， 其中， 所述调节机构 （190a) 包括一固定在所述支撑杆（195)上的调节杆 ( 194), 所述调节杆（194) 的两 端分别设置有第一螺杆（191)、 第二螺杆（192) 以及用于锁定所述第一螺杆
( 191 )、 第二螺杆（ 192 )的螺母（ 193 ), 所述第一螺杆（ 191 )、 第二螺杆（ 192 ) 分别顶压在所述沉积盒（ 100) 的壁面上； 通过调节所述第一螺杆（191)、 第二 螺杆 ( 192)可调节所述调节杆 (194)的角度进而调整所述支撑杆 ( 195)的角度。
4、如权利要求 1所述的 PECVD处理装置，其中， 所述电极调节装置 ( 190 ) 包括分别设置在所述第二电极（170) 两端用于直接支撑的第一螺杆（191)、 第 二螺杆（ 192 )以及用于锁定所述第一螺杆（ 191 )、第二螺杆（ 192 )的螺母（ 193 )。
5、 如权利要求 3所述的 PECVD处理装置， 其中， 所述电极调节装置还设 置有刻度。
6、 一种在基板上进行 PECVD处理的方法， 其中包括步骤：
S: 调节沉积盒（100) 中第一电极（ 140)与第二电极（ 170) 的相对角度， 使第一电极（140) 与第二电极（170)之间的等离子体气流实现均匀。
7、 如权利要求 6所述的在基板上进行 PECVD处理的方法， 其中， 调节第 一电极（ 140)与第二电极（ 170) 的相对角度是通过对所述第二电极（ 170) 的 角度进行调整实现， 所述第二电极（170)上设置一电极调节装置 （190)对所 述第二电极（170) 的角度进行调节。
8、 如权利要求 7所述的在基板上进行 PECVD处理的方法， 其中， 所述电 极调节装置（ 190) 包括一直接支撑所述第二电极（ 170) 的支撑杆（ 195) 以及 用于调节所述支撑杆（195) 角度的调节机构 （190a)。
9、 如权利要求 8所述的在基板上进行 PECVD处理的方法， 其中， 所述调 节机构 （190a) 包括一固定在所述支撑杆（195)上的调节杆 ( 194), 所述调节 杆（194) 的两端分别设置有第一螺杆（191)、 第二螺杆（192) 以及用于锁定 所述第一螺杆 ( 191 )、 第二螺杆 ( 192) 的螺母 ( 193 ), 所述第一螺杆 ( 191 )、 第二螺杆（192)分别顶压在所述沉积盒（100) 的壁面上； 通过调节所述第一 螺杆 ( 191 )、 第二螺杆 ( 192)可调节所述调节杆 (194)的角度进而调整所述支撑 杆（195) 的角度。
10、 如权利要求 7所述的在基板上进行 PECVD处理的方法， 其中， 所述电 极调节装置 （190) 包括分别设置在所述第二电极（170) 两端用于直接支撑的 第一螺杆（ 191 )、 第二螺杆（ 192) 以及用于锁定所述第一螺杆（ 191 )、 第二螺 杆（192) 的螺母（193)。
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