WO2015089775A1 - 一种led灯具散热结构 - Google Patents

一种led灯具散热结构 Download PDF

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Publication number
WO2015089775A1
WO2015089775A1 PCT/CN2013/089889 CN2013089889W WO2015089775A1 WO 2015089775 A1 WO2015089775 A1 WO 2015089775A1 CN 2013089889 W CN2013089889 W CN 2013089889W WO 2015089775 A1 WO2015089775 A1 WO 2015089775A1
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Prior art keywords
heat dissipation
led lamp
heat
fins
bottom plate
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PCT/CN2013/089889
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English (en)
French (fr)
Inventor
邵小冬
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邵小冬
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Priority to PCT/CN2013/089889 priority Critical patent/WO2015089775A1/zh
Publication of WO2015089775A1 publication Critical patent/WO2015089775A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/777—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the application relates to a heat dissipation structure, in particular to a heat dissipation structure for an LED lamp, and belongs to the technical field of LED illumination.
  • LED is the abbreviation of LED, which is a kind of solid luminescent material that can convert electric energy into light energy. Due to its energy saving and environmental protection advantages, LED is gradually replacing traditional light source. Like conventional light sources, semiconductor light-emitting diodes (LEDs) also generate heat during operation, depending on the overall luminous efficiency. In general, whether the LED lamp works stably, the quality is good or bad, and the heat dissipation of the lamp body itself is very important. The heat dissipation of the high-brightness LED lamp on the market often uses natural heat dissipation, and the effect is not satisfactory.
  • the LED light source is composed of LED, heat dissipation structure, driver and lens. Heat dissipation is also an important part. If the LED does not dissipate heat well, its life will be affected.
  • the heat sink fins of the heat sink are integrally formed, which is complicated in processing and high in cost, and it is difficult to install LEDs in such a structure.
  • the bottom plate of the lamp bead is large, which causes the heat dissipation effect of the heat sink to be unsatisfactory, and the heat sink body usually reaches a higher temperature, which affects the service life of the LED lamp.
  • the present application is directed to the above-mentioned deficiencies in the current heat dissipation components of LED lamps, and provides a novel heat dissipation structure for LED lamps.
  • the structure is composed of a plurality of independently formed heat dissipation fins, and the side edges of each heat dissipation fins are installed.
  • the column is detachably tightly fitted, and the bottom of each heat dissipation fin is fixed on the bottom plate.
  • the heat dissipation structure is easy to process, low in manufacturing cost, easy to install, and has good heat dissipation effect.
  • the heat dissipation structure of the LED lamp of the present application comprises a mounting post, a bottom plate and a plurality of structurally independent heat dissipating fins disposed around the mounting post, and the side edges of each of the heat dissipating fins have a longitudinal insertion portion for mounting
  • the column has the same longitudinal groove as the number of the heat dissipation fins, and the insertion portion is inserted into the groove, and the bottom edge of each of the heat dissipation fins has a horizontally extending fixing portion, and the fixing portion is fixedly connected with the bottom plate.
  • the insertion portion is tightly engaged with the groove. This is to make the connection tighter and increase the heat dissipation effect.
  • fixing portion and the bottom plate are connected to each other by screws, welding, fastening or riveting.
  • the heat dissipation fin has a heat dissipation member that enhances a heat dissipation effect.
  • the heat dissipating member is a plurality of heat dissipating holes, which increases the heat dissipating area and air convection, and accelerates heat dissipation.
  • the heat dissipation structure of the LED lamp described in the present application is easy to manufacture and manufacture, and is easy to install, and has good heat dissipation effect; at the same time, the bottom plate of the fixed LED lamp bead can be made larger, so that the LED light effect is better.
  • FIG. 1 is a schematic view of a single heat sink fin of an embodiment of the present application.
  • FIG. 2 is a schematic view showing the installation of a bottom plate and a heat dissipation fin according to an embodiment of the present application
  • Figure 3 is an enlarged schematic view of a portion A of Figure 2;
  • Figure 4 is a cross-sectional view of an embodiment of the present application.
  • 1 is a heat sink fin
  • 11 is a fixed portion
  • 12 is an insertion portion
  • 13 is a heat dissipation hole
  • 2 is a fixed column
  • 20 is a groove
  • 3 is a bottom plate
  • 4 is a lens.
  • the heat dissipation structure of the LED lamp of the present application includes a plurality of structurally independent heat dissipation fins 1 , a mounting post 2 and a bottom plate 3 disposed around the mounting post, as shown in FIG. 1 , each of the heat dissipation fins
  • the side edge of 1 has a longitudinal insertion portion 12
  • the mounting post 2 has a longitudinal groove 20 of the same number as the heat dissipation fins, and the insertion portion 12 is inserted into the groove 20, and the bottom of each heat dissipation fin 1
  • the side has a fixing portion 11 extending horizontally, and the fixing portion 11 is fixedly connected to the bottom plate 3.
  • the insertion portion 12 is tightly engaged with the groove 20, so that the connection portion 11 and the bottom plate 3 are connected to each other by screws, welding, fastening or riveting, and the heat dissipation fins are tightly coupled.
  • the heat dissipating member has a plurality of heat dissipating holes 13 to increase the heat dissipating area and air convection, and accelerate heat dissipation.
  • the heat dissipation structure of the LED lamp described in the present application is easy to manufacture and manufacture, and is easy to install, and has good heat dissipation effect; at the same time, the bottom plate of the fixed LED lamp bead can be made larger, so that the LED light effect is better.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种LED灯具散热结构，包括安装柱（2）、底板（3）和多个围绕安装柱（2）设置的结构独立的散热鰭片（1），每个散热鰭片（1）的侧棱具有一纵向的插入部（12），安装柱（2）上分别有与散热鰭片（1）数目相同的纵向的凹槽（20），插入部（12）插入凹槽（20）内，每个散热鰭片（1）的底边具有一水平延伸出的固定部（11），固定部（11）与底板（3）固定连接，插入部（12）与凹槽（20）紧配合。该LED灯具散热结构加工容易且便于安装，散热效果好。

Description

一种LED灯具散热结构 技术领域
本申请涉及一种散热结构，特别是一种用于LED灯具的散热结构，属于LED照明技术领域。
背景技术
LED是发光二极管的简称，是一种能够将电能转换为光能的固体发光物质，由于其节能环保的优势，目前正在逐渐取代传统光源。与传统光源一样，半导体发光二极体（LED）在工作期间也会产生热量，其多少取决于整体的发光效率。一般来说，LED灯工作是否稳定，品质好坏，与灯体本身散热至关重要，市场上的高亮度LED灯的散热，常常采用自然散热，效果并不理想。LED光源打造的LED灯具，由LED、散热结构、驱动器、透镜组成，散热也是一个重要的部分，如果LED不能很好散热、它的寿命也会受影响。
现有的LED大多采用带翅片的铝材作为散热器，这种散热器的各个散热鳍片为一体成型结构，加工制造复杂，成本较高，并且这种结构的散热器很难将安装LED灯珠的底板做大，造成该散热器的散热效果不理想，散热体通常会达到较高的温度，影响LED灯具的使用寿命。
 技术问题
本申请即是针对目前LED灯具散热元件中存在的上述不足之处，提供一种新型LED灯具散热结构，该结构由多个独立成型的散热鳍片构成，每个散热鳍片的侧边与安装柱可拆卸式的紧配合，而每个散热鳍片的底部固定在底板上，该种散热结构加工容易，制造成本低，安装容易且具有良好的散热效果。
技术解决方案
具体来说，本申请所述的LED灯具散热结构，包括安装柱、底板和多个围绕安装柱设置的结构独立的散热鳍片，每个散热鳍片的侧棱具有一纵向的插入部，安装柱上分别有与散热鳍片数目相同的纵向的凹槽，所述插入部插入凹槽内，每个散热鳍片的底边具有一水平延伸出的固定部，所述固定部与底板固定连接。
进一步的，所述插入部与凹槽紧配合。这是为了连接更紧密并增加散热效果。
进一步的，所述固定部与底板通过螺丝、焊接、扣接或铆合相互连接。
进一步的，所述散热鳍片上具有增强散热效果的散热件。
更进一步的，所述散热件为多个散热孔，增大了散热面积与空气对流，加速散热。
 有益效果
本申请所述的LED灯具散热结构，加工制造容易，且便于安装，散热效果好；同时能够将固定LED灯珠的底板做大，使得LED光效更佳。
 附图说明
图1 是本申请实施例的单个散热鳍片的示意图；
图2 是本申请实施例底板与散热鳍片的安装示意图；
图3是图2中局部A的放大结构示意图；
图4是本申请实施例的剖视图；
其中，1为散热鳍片、11为固定部、12为插入部、13为散热孔、2为固定柱、20为凹槽、3为底板、4为透镜。
 本发明的最佳实施方式
下面结合附图对本申请所述的技术方案作进一步说明，目的是为了公众更好地理解所述技术内容，而并非对所述技术内容的限制。
如图1-4所示，本申请所述的LED灯具散热结构，包括多个围绕安装柱设置的结构独立的散热鳍片1、安装柱2和底板3，如图1，每个散热鳍片1的侧棱具有一纵向的插入部12，安装柱2上分别有与散热鳍片数目相同的纵向的凹槽20，所述插入部12插入凹槽20内，每个散热鳍片1的底边具有一水平延伸出的固定部11，所述固定部11与底板3固定连接。进一步的，所述插入部12与凹槽20紧配合，这是为了连接更紧密并增加散热效果，固定部11与底板3通过螺丝、焊接、扣接或铆合相互连接，所述散热鳍片1上具有增强散热效果的散热件，在本实施例中，所述散热件为多个散热孔13，增大了散热面积与空气对流，加速散热。
本申请所述的LED灯具散热结构，加工制造容易，且便于安装，散热效果好；同时能够将固定LED灯珠的底板做大，使得LED光效更佳。
应该明确的是，上述的实施例包括文字和附图，仅是所述技术方案的一个具体实施例，事实上，凡以相同或近似原理对所述技术方案进行的改进和变换，包括各部分结构的形状、尺寸、所用材质的变化，以及功能相近似元件的等同替换，都在本申请所要求保护的技术方案之内。

Claims (5)

  1. 一种LED灯具散热结构，其特征在于：包括安装柱、底板和多个围绕安装柱设置的结构独立的散热鳍片，每个散热鳍片的侧棱具有一纵向的插入部，安装柱上分别有与散热鳍片数目相同的纵向的凹槽，所述插入部插入凹槽内，每个散热鳍片的底边具有一水平延伸出的固定部，所述固定部与底板固定连接。
  2. 根据权利要求1所述的LED灯具散热结构，其特征在于：所述插入部与凹槽紧配合。
  3. 根据权利要求1或2所述的LED灯具散热结构，其特征在于：所述固定部与底板通过螺丝、焊接、扣接或铆合相互连接。
  4. 根据权利要求1或2所述的LED灯具散热结构，其特征在于：所述散热鳍片上具有增强散热效果的散热件。
  5. 据权利要求4所述的LED灯具散热结构，其特征在于：所述散热件为多个散热孔，也可以是其它的散热结构，例如半孔，增大了散热面积与空气对流，加速散热。
PCT/CN2013/089889 2013-12-18 2013-12-18 一种led灯具散热结构 WO2015089775A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111867285A (zh) * 2020-06-04 2020-10-30 嵊州市三吉电子有限公司 一种直流电机控制器用散热结构及其安装方法

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CN101377292A (zh) * 2007-08-27 2009-03-04 宏齐科技股份有限公司 具有高效率散热功能的发光二极管灯具结构及系统
CN101514808A (zh) * 2008-02-18 2009-08-26 浩然科技股份有限公司 Led灯与散热鳍片的连接装置
CN201582592U (zh) * 2009-11-24 2010-09-15 陈荣生 一种led照明灯
CN202091864U (zh) * 2011-06-09 2011-12-28 陈世明 二极管灯具的结构
CN202419239U (zh) * 2011-12-31 2012-09-05 深圳市百特明光电科技有限公司 具有散热装置的led灯
CN202719416U (zh) * 2012-07-10 2013-02-06 中山市远誉电子有限公司 一种有鳍片式散热器的led筒灯
CN203249217U (zh) * 2013-05-30 2013-10-23 曾国代 Led散热结构

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101377292A (zh) * 2007-08-27 2009-03-04 宏齐科技股份有限公司 具有高效率散热功能的发光二极管灯具结构及系统
CN101514808A (zh) * 2008-02-18 2009-08-26 浩然科技股份有限公司 Led灯与散热鳍片的连接装置
CN201582592U (zh) * 2009-11-24 2010-09-15 陈荣生 一种led照明灯
CN202091864U (zh) * 2011-06-09 2011-12-28 陈世明 二极管灯具的结构
CN202419239U (zh) * 2011-12-31 2012-09-05 深圳市百特明光电科技有限公司 具有散热装置的led灯
CN202719416U (zh) * 2012-07-10 2013-02-06 中山市远誉电子有限公司 一种有鳍片式散热器的led筒灯
CN203249217U (zh) * 2013-05-30 2013-10-23 曾国代 Led散热结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111867285A (zh) * 2020-06-04 2020-10-30 嵊州市三吉电子有限公司 一种直流电机控制器用散热结构及其安装方法
CN111867285B (zh) * 2020-06-04 2023-05-30 嵊州市三吉电子有限公司 一种直流电机控制器用散热结构及其安装方法

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