WO2015083527A1 - Light-emitting element mounting substrate and light-emitting device using same - Google Patents

Light-emitting element mounting substrate and light-emitting device using same Download PDF

Info

Publication number
WO2015083527A1
WO2015083527A1 PCT/JP2014/080314 JP2014080314W WO2015083527A1 WO 2015083527 A1 WO2015083527 A1 WO 2015083527A1 JP 2014080314 W JP2014080314 W JP 2014080314W WO 2015083527 A1 WO2015083527 A1 WO 2015083527A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
wiring
emitting element
element mounting
arrangement surface
Prior art date
Application number
PCT/JP2014/080314
Other languages
French (fr)
Japanese (ja)
Inventor
茂裕 河浦
寛 小路
悠史 三田
Original Assignee
日本カーバイド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本カーバイド工業株式会社 filed Critical 日本カーバイド工業株式会社
Priority to JP2015551447A priority Critical patent/JP6002858B2/en
Publication of WO2015083527A1 publication Critical patent/WO2015083527A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting

Definitions

  • the present invention relates to a light emitting element mounting substrate on which wiring can be easily formed, and a light emitting device using the same.
  • a light emitting device in which a light emitting element such as a light emitting diode is mounted on a light emitting element mounting substrate has been put into practical use.
  • a general light-emitting element mounting substrate of such a light-emitting device has a cavity in which the light-emitting element is accommodated and wiring extending from the outside to the inside of the cavity. The ends of the wiring are used as bonding terminals. And the terminal of the light emitting element mounted in the cavity and the bonding terminal are connected by a bonding wire. Furthermore, from the viewpoint of protecting the light emitting element and the bonding wire, the cavity is generally sealed by being filled with a transparent sealing resin.
  • Patent Document 1 describes a light emitting diode module which is such a light emitting device.
  • the cavity of the circuit board as the light emitting element mounting board is formed in two levels of depth. Specifically, a frame-shaped first recess is formed on the circuit board, and a region surrounded by the first recess is a second recess recessed from the first recess.
  • wiring extending from the outside of the first recess of the circuit board is arranged, and the terminal of the light emitting diode mounted in the second recess is connected to the wiring on the first recess by a bonding wire. Is done.
  • Patent Document 1 describes that the side surface of the first recess is not formed perpendicular to the surface of the circuit board, but is inclined from the viewpoint of facilitating the formation of wiring.
  • the terminal provided on the light emitting element mounting substrate on which the light emitting element is mounted in the cavity is generally provided in the vicinity of the inner side surface in the cavity for the purpose of securing a space for mounting the light emitting element.
  • wiring extending from the terminal to the outside of the cavity is usually provided along the inner surface in the vicinity of the inner surface in the cavity.
  • the wirings and terminals may be formed by screen printing. However, if screen printing is performed in the vicinity of the inner surface of the cavity, a phenomenon in which the screen does not flex easily follows the step between the outside of the cavity and the position where the wiring is provided. In this case, the wiring cannot be printed properly, causing disconnection or the like.
  • the side surface of the recess in which a part of the wiring is formed is an inclined surface from the viewpoint of printing the wiring appropriately.
  • an object of the present invention is to provide a light emitting element mounting substrate on which wiring can be easily formed using screen printing, and a light emitting device using the same.
  • a substrate for mounting a light emitting element includes a flat base portion having an element mounting portion on which a light emitting element is mounted on the main surface, and the main surface in a state of surrounding the element mounting portion.
  • the opening edge of each of the squares is rounded, and the straight part corresponding to the sides of the square and the corners of the square are formed.
  • the existing portion is located between the opening surface of the frame body portion and the main surface of the base portion, and a terminal arrangement surface on which terminals are arranged, and the curved portion and the terminal arrangement surface are connected and wiring is connected Wiring arrangement surface to be arranged, the wiring arrangement surface is It is characterized in that it has a sloped region that inclines from the curve part to be connected to the wiring arrangement plane in a direction toward the element mounting part.
  • the wiring arrangement surface has an inclined region that is inclined in a direction from the curved portion toward the element mounting portion.
  • the wiring placement surface is inclined in the direction from the opening surface of the frame body portion toward the element mounting portion as it advances toward the terminal placement surface along the direction in which the extending portion extends, and the wiring placement surface.
  • an inclined region that inclines in the direction from the opening surface of the frame body portion toward the element mounting portion as it proceeds perpendicularly to the direction in which the extending portion extends from the curved portion connected to the.
  • the center of the opening is most likely to enter the cavity. Therefore, by having such an inclined region, the screen is deformed in a more natural state during screen printing, and the surface followability to the wiring arrangement surface of the screen is made better. For this reason, wiring can be formed easily.
  • the wiring arrangement surface is convex.
  • the light emitting element mounting substrate includes a pair of the extending portions, and one of the extending portions is provided in contact with one of the inner surfaces facing each other, and the other extending portion. Is preferably provided in contact with the other part of the inner surfaces facing each other.
  • a signal line and a ground line that are electrically connected to the light emitting element can be arranged separately on each extending portion. Accordingly, the wiring can be formed more easily.
  • the one extending portion and the other extending portion have directions opposite to each other from the wiring arrangement surface toward the terminal arrangement surface.
  • each extending portion can be made close to point symmetry with reference to the center of the cavity formed by the frame body portion. Therefore, it is possible to suppress the optical axis of light emitted from the arranged light emitting element from being inclined from the vertical direction of the light emitting element mounting substrate.
  • the one extending portion and the other extending portion have the same direction from the wiring arrangement surface toward the terminal arrangement surface.
  • the light-emitting element mounting substrate By configuring the light-emitting element mounting substrate in this way, when the wiring is formed by screen printing, printing is performed in the direction in which the extending portion extends, thereby forming on the wiring arrangement surface of each extending portion. Can be formed under substantially the same conditions. Therefore, it can suppress that the property of the wiring formed on the wiring arrangement
  • the light emitting element mounting substrate further includes the wiring extending from the outside of the opening through the inclined region to the terminal arrangement surface, and the wiring on the terminal arrangement surface serves as the terminal.
  • the light emitting element can be mounted.
  • the light emitting element mounting substrate in such a state and the light emitting element are provided, and the terminal of the light emitting element and the terminal of the light emitting element mounting substrate are electrically connected to form a light emitting device. . Since the light emitting element mounting substrate used in this light emitting device can easily form wiring using screen printing as described above, the light emitting device can reduce the defect rate due to disconnection.
  • FIG. 1 is a perspective view of a light emitting device according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the light-emitting element mounting substrate of FIG.
  • FIG. 2 is a cross-sectional view of the light-emitting element mounting substrate of FIG. It is a perspective view of the light-emitting device concerning 2nd Embodiment of this invention.
  • FIG. 5 is a cross-sectional view of the light emitting element mounting substrate of FIG. 4 on a plane passing through a line CC.
  • FIG. 1 is a perspective view of a light emitting device according to a first embodiment of the present invention.
  • the light emitting device 100 of this embodiment includes a light emitting element mounting substrate 1 and a light emitting element 50 mounted on the light emitting element mounting substrate 1 as main components.
  • the light emitting device 100 includes a sealing resin for sealing the light emitting element 50 as another configuration, but the sealing resin is omitted in FIG. 1 for easy understanding.
  • the light emitting element mounting substrate 1 includes a substrate body 5 and a wiring conductor 40 formed on the surface of the substrate body 5.
  • the substrate body 5 includes a base body portion 10, a frame body portion 20 formed on the base body portion 10, and a pair of extending portions 30 disposed in a space surrounded by the base body portion 10 and the frame body portion 20.
  • the base portion 10, the frame portion 20, and the extending portions 30 are made of an integral ceramic sintered body.
  • a ceramic sintered body mainly composed of alumina As the ceramic sintered body constituting the substrate body 5, a ceramic sintered body mainly composed of alumina, a ceramic sintered body mainly composed of aluminum nitride, a ceramic sintered body mainly composed of mullite, A glass-ceramic sintered body which is a kind of low-temperature firing can be mentioned, and a ceramic sintered body containing alumina as a main component and barium element as an additional component is more preferable from the viewpoint of excellent light reflection efficiency.
  • FIG. 2 is a cross-sectional view of the light-emitting element mounting substrate in FIG. 1 along the plane AA
  • FIG. 3 is a cross-sectional view of the light-emitting element mounting substrate in FIG. is there.
  • the base body portion 10 is a flat plate portion.
  • a substantially center of the main surface 11 which is a surface of the base body portion 10 on the frame body portion 20 side is an element mounting portion on which the light emitting element 50 is disposed.
  • the element mounting portion is not particularly limited as long as it is an area where the light emitting element 50 can be mounted, and may be an area that is not particularly distinguished from the surrounding area, so that the light emitting element 50 can be easily mounted. It may be a typical shape.
  • the region other than the element mounting portion in the region surrounded by the frame body portion 20 is in a state where the ceramic sintered body constituting the base portion 10 is exposed, and the light emitting element 50. Is a reflecting surface that reflects light emitted.
  • the size of the base portion 10 is not particularly limited because it varies depending on the size of the light emitting element 50 and the like, but is, for example, 3.5 mm (vertical width) ⁇ 3.5 mm (horizontal width) ⁇ 0.5 mm (thickness).
  • a pair of grooves 15 for providing a pair of connection wirings 44 that are a part of the wiring conductor 40 is provided on each of the pair of side surfaces facing each other of the base portion 10.
  • the groove 15 extends in the thickness direction of the substrate body 5 and has a substantially semicircular shape in cross section perpendicular to the thickness direction.
  • the frame part 20 is an annular part formed on the main surface 11 of the base part 10 so as to surround the element mounting part.
  • the upper surface 21 which is the surface opposite to the base body portion 10 of the frame body portion 20 is planar.
  • the shape of the side surface on the outer peripheral side of the frame body portion 20 is the same as the shape of the side surface of the base portion 10, and the groove 15 extending from the base portion 10 is formed on the side surface on the outer peripheral side. . That is, the groove 15 is formed from the bottom surface of the base portion 10 to the upper surface 21 of the frame body portion 20 as shown in FIG.
  • the frame part 20 is an annular part as described above, a through-hole is formed in the frame part 20 in the thickness direction. Since the frame body portion 20 is formed on the base body portion 10, when viewed as the substrate body 5, the frame body portion 20 is open on the side opposite to the base body portion 10.
  • the opening edge 22 of the frame body portion 20 that forms the opening has a shape in which each corner of the square is rounded and chamfered. Therefore, the opening edge 22 can be decomposed into four straight line portions 22a corresponding to the sides of the square and four curved line portions 22b connecting the straight line portions 22a and corresponding to the corners of the square.
  • the opening edge 22 has a shape in which each corner of a square is chamfered in a curved shape with a rounded shape.
  • the inner side surface 23 in contact with the opening edge 22 is an inclined surface that spreads outward in the opening direction of the frame body portion 20 (the direction from the base body portion 10 toward the frame body portion 20).
  • a portion of the opening edge 22 in contact with each straight portion 22 a is a flat planar portion 23 a
  • a portion of each opening edge 22 in contact with the curved portion 22 b is a curved curved portion 23 b. Therefore, the inner side surface 23 can be decomposed into four planar portions 23a and four curved surface portions 23b respectively connecting the planar portions 23a.
  • a part of the inner side surface 23 is in a state where it cannot be seen by the extending portion 30.
  • the size of the frame body portion 20 is not particularly limited, but is, for example, 3.5 mm (vertical width) ⁇ 3.5 mm (horizontal width) ⁇ 0.4 mm (thickness) and is an area surrounded by the frame body portion 20.
  • substrate part 10 exposed is not specifically limited, For example, it shall be 110 degrees.
  • the pair of extending portions 30 have the same shape.
  • One extension portion 30 is formed to extend in a certain direction along a specific plane portion 23a when viewed from the opening space H, and the other extension portion 30 is one extension portion. It is formed so as to extend along the flat surface portion 23a of the inner side surface 23 opposite to the flat surface portion 23a of the inner side surface 23 with which 30 contacts.
  • each extending portion 30 is formed so as to connect mutually facing portions of the inner side surface 23 in the direction in which the extending portion 30 extends.
  • the extending portion 30 is formed from the curved surface portion 23 b of the specific inner side surface 23 to the specific curved surface portion 23 b and the flat surface. It extends to the adjacent curved surface part 23b through the part 23a.
  • Each extending portion 30 has a terminal arrangement surface 31 on which a terminal 41 described later is formed, and a wiring arrangement surface 32 on which an inner wiring 42 described later is formed.
  • the direction from the wiring arrangement surface 32 toward the terminal arrangement surface 31 of the one extending portion 30 and the other extending portion 30 is opposite to each other.
  • the extending part 30 is formed point-symmetrically with respect to the center of the space surrounded by the frame body part 20.
  • the direction in which the extending part 30 extends is a direction from the wiring arrangement surface 32 toward the terminal arrangement surface 31.
  • the terminal arrangement surface 31 is a surface on which terminals are arranged as will be described later, and is located between the opening edge 22 and the element mounting portion (the main surface 11 of the base body portion 10), and is formed on the plane portion 23a of the inner side surface 23. Touching.
  • the terminal arrangement surface 31 is a surface parallel to the main surface 11 and has a step difference from the main surface.
  • the wiring arrangement surface 32 is a surface on which wiring is arranged as described later, and connects the curved portion 22b of the opening edge 22 and the terminal arrangement surface 31.
  • the wiring arrangement surface 32 is an inclined surface that fills this step, and is inclined in a direction from the curved portion 22b connected to the wiring arrangement surface 32 toward the element mounting portion. Specifically, as shown in FIGS. 1 and 2, the wiring arrangement surface 32 is connected to the terminal arrangement surface 31 along the direction in which the extending portion 30 extends from the curved portion 22 b connected to the wiring arrangement surface 32.
  • the wiring arrangement surface 32 opens to the frame body portion 20 as it proceeds vertically from the curved portion 22 b connected to the wiring arrangement surface 32 in the direction in which the extension portion 30 extends. It inclines in the direction from the surface toward the element mounting portion.
  • the wiring arrangement surface 32 has an inclined region inclined in this way. In the present embodiment, the inclination of the wiring arrangement surface 32 in both the direction in which the extending portion 30 extends and the direction orthogonal to this direction is the frame portion in the portion in contact with the curved portion 22b.
  • the wiring arrangement surface 32 is convex.
  • each extending portion 30 is an inclined surface that spreads outward as it proceeds in the opening direction of the frame body portion 20 in the same manner as the inner side surface 23 of the frame body portion 20.
  • the wiring conductor 40 is provided on the surface of the substrate body 5 as described above.
  • the wiring conductor 40 is composed of a layer of a conductor such as a metal, and the upper surface wiring 43 provided on the upper surface 21 of the frame body portion 20 in the substrate body 5 and the side surface of the substrate body 5 from the bottom surface of the substrate body 5. It has a connection wiring 44 formed over and an internal wiring 42 connected to the upper surface wiring 43 and provided on the extended portion 30.
  • connection wiring 44 is a wiring for electrically connecting the light emitting device 100 to an external terminal.
  • the connection wirings 44 are formed on the side surfaces facing each other where the grooves 15 are formed, and the pair of connection wirings 44 are formed on the bottom surface of the substrate body 5 from the region including the edges facing each other. They are formed on the side surfaces and connected to the upper surface wiring 43.
  • the connection wiring 44 on the side surface of the substrate body 5 is formed on the inner peripheral surface of each groove 15 and on a part of the side surface where these grooves 15 are formed.
  • the upper surface wiring 43 is formed on the upper surface 21 of the frame body portion 20 along the edge between the upper surface 21 and the side surface on which the groove 15 is formed. As described above, since the grooves 15 are formed in pairs on the side surfaces of the base body portion 10 and the frame body portion 20 facing each other, the upper surface wiring 43 is formed on the upper surface 21 of the frame body portion 20. A pair is formed along a pair of oppositely formed edges, and each upper surface wiring 43 is connected to a connection wiring 44 formed on a side surface facing each other. Furthermore, the upper surface wiring 43 has a branching portion that branches vertically from a portion formed along the edge of the frame body portion 20, and this branching portion extends toward the extending portion 30. The branch portion is connected to the internal wiring 42 on the extending portion 30. Of the pair of upper surface wirings 43, a branch portion of one upper surface wiring 43 is connected to the internal wiring 42 on one extension portion 30, and a branch portion of the other upper surface wiring 43 is an inner portion on the other extension portion 30. It is connected to the wiring 42.
  • the internal wiring 42 extends from the wiring arrangement surface 32 of the extending portion 30 to the terminal arrangement surface 31, and the end portion of the internal wiring 42 positioned on the wiring arrangement surface 32 serves as the terminal 41.
  • the internal wiring 42 and the top wiring 43 are formed together in the same process by screen printing.
  • the connection wiring 44 is formed by plating. Further, a portion of the upper surface wiring 43 that is connected to the connection wiring 44, that is, a portion in the vicinity of the edge where the groove 15 is formed on the upper surface 21 of the frame body portion 20 is formed together with the connection wiring 44 by plating. . Therefore, in the upper surface wiring 43, a portion near the edge where the groove 15 is formed is obtained by laminating a plated conductor on a conductor formed by screen printing. Thus, disconnection of the upper surface wiring 43 and the connection wiring 44 is prevented.
  • the light emitting element 50 includes a semiconductor layer and a plurality of electrodes, and is configured to emit light of a single or a plurality of wavelength bands.
  • the light emitting element 50 is disposed on an element mounting portion surrounded by the frame body portion 20, and is fixed by an adhesive (not shown).
  • the terminal 41 on one extension part 30 and one terminal of the light emitting element 50 are electrically connected by the bonding wire 51, and the terminal 41 on the other extension part 30 and the other terminal of the light emitting element 50 are connected.
  • the sealing resin is a light transmissive resin that can transmit light emitted from the light emitting element 50.
  • the resin used for the sealing resin is not particularly limited as long as it is a resin that transmits light emitted from the light emitting element 50, and examples thereof include an epoxy resin and a silicone resin, which improve the durability of the light emitting device 100. From the viewpoint, a silicone resin is more preferable.
  • the sealing resin may contain a phosphor, and such a phosphor may be any one that can receive light emitted from the light emitting element and emit light of other wavelengths.
  • Such a light emitting device 100 is used by connecting the connection wiring 44 formed on the bottom surface or the side surface of the substrate body 5 to a terminal of an external electric circuit substrate.
  • a voltage applied to the connection wiring 44 is applied to the light emitting element 50 via the internal wiring 42, the bonding wire 51, and the like, and the light emitting element 50 emits light by this voltage.
  • the light emitted from the light emitting element 50 passes through the sealing resin and is directly emitted to the outside of the light emitting device 100, or an exposed portion of the region surrounded by the frame body portion 20 of the base body portion 10 or a frame body.
  • the light is reflected from the exposed portion of the inner side surface 23 of the portion 20 and the exposed portion of the side surface of the extending portion 30, and is emitted to the outside of the light emitting device 100.
  • the inner side surface 23 of the frame body part 20 and the side surface of the extension part 30 face outward in the opening direction of the frame body part 20. It is assumed to be an inclined surface that spreads. For this reason, the light reflected from the exposed portion of the inner side surface 23 of the frame body portion 20 and the light reflected from the exposed portion of the side surface of the extension portion 30 are traveling in the opening direction of the frame body portion 20. It is corrected to approach the direction.
  • the opening edge 22 of the frame body portion 20 is formed into a shape with rounded square corners.
  • the wiring arrangement surface 32 is connected to the curved portion 22b. Therefore, when the internal wiring 42 is formed by screen printing as described above, surface followability to the printing surface of the screen is improved.
  • the wiring placement surface 32 extends in a direction from the opening surface of the frame body portion 20 toward the element mounting portion as it proceeds along the direction in which the extension portion 30 extends from the curved portion 22b of the opening edge 22 of the frame body portion 20. In addition to inclining, it has a region that inclines in the direction from the opening surface of the frame body portion 20 toward the element mounting portion as it proceeds perpendicularly to the direction in which the extending portion 30 extends from the curved portion 22b of the opening edge 22. Therefore, during screen printing, the screen is deformed in a more natural state, and the surface followability to the wiring arrangement surface 32 of the screen is made better. For this reason, in the light emitting element mounting substrate 1 of the present embodiment, the wiring can be easily formed. For this reason, in the light emitting element mounting substrate 1 of this embodiment, disconnection is suppressed.
  • the light emitting device 100 can reduce the defect rate due to the disconnection.
  • the one extending portion 30 and the other extending portion 30 are opposite to each other in the direction from the wiring arrangement surface 32 to the terminal arrangement surface 31.
  • the extending portions 30 are point-symmetric with respect to the center of the space surrounded by the frame body portion 20. Therefore, the optical axis of the light emitted from the light emitting element 50 can be prevented from being tilted from the vertical direction of the light emitting element mounting substrate 1.
  • FIG. 4 is a diagram showing a light emitting device according to a second embodiment of the present invention in the same manner as FIG. 1, and FIG. 5 is a cross-sectional view of the light emitting device 200 of FIG. is there.
  • the light-emitting element mounting substrate 2 used in the light-emitting device 200 of the present embodiment has the light-emitting element mounting of the first embodiment in that the pair of extending portions 30 face each other in the same direction. Different from the substrate 1 for use. That is, in the light emitting element mounting substrate 2 of the present embodiment, the direction from the wiring arrangement surface 32 to the terminal arrangement surface 31 in the one extending portion 30 and the other extending portion 30 is the same direction.
  • positioning surface 32 in each extension part 30 inclines is mutually opposite in the direction perpendicular
  • the upper surface wiring 43 on the side to which 32 is connected is divided into two. Therefore, the connection wiring 44 is also divided into two parts so that the divided upper surface wirings 43 are not short-circuited.
  • a fixing wiring 45 that is used to fix the light emitting device 200 and is not particularly electrically connected is formed on the side surface opposite to the side surface on which the connection wiring 44 divided into two is formed. ing.
  • Each wiring is formed by the same method as each wiring in the first embodiment.
  • the internal wiring 42 when the internal wiring 42 is formed by screen printing, printing is performed in the extending direction of the extending portion 30, thereby The wiring 42 can be formed under substantially the same conditions. Therefore, the properties of the internal wirings 42 can be made the same.
  • the substrate main body 5 is formed of an integral ceramic, but the base body portion 10, the frame body portion 20, and the extending portion 30 may be individually formed and bonded. Furthermore, the substrate body 5 may not be made of ceramic, and may be made of resin, for example.
  • the wiring arrangement surface 32 proceeds toward the terminal arrangement surface 31 along the direction in which the extending portion 30 extends from the curved portion 22b of the opening edge 22 connected to the wiring arrangement surface 32. As it is inclined in the direction from the opening surface of the frame body portion 20 toward the element mounting portion, it proceeds vertically from the curved portion 22b of the opening edge 22 connected to the wiring arrangement surface 32 in the direction in which the extending portion 30 extends. It has a region inclined in the direction from the opening surface of the frame body portion 20 toward the element mounting portion. As long as the wiring arrangement surface 32 has such a configuration, the region does not have to be convex like the light emitting element mounting substrates 1 and 2 of the above embodiment, and the region is inclined as described above. It may be planar. However, when the wiring arrangement surface 32 is convex, the screen deforms more naturally during screen printing than when the wiring arrangement surface 32 is flat, and the surface of the screen with respect to the wiring arrangement surface 32 follows. It is preferable because the properties are further improved.
  • the terminal arrangement surface 31 is parallel to the main surface 11, but the terminal arrangement surface 31 may not be parallel to the main surface 11. However, from the viewpoint of satisfactorily bonding the bonding wire with an automatic machine, it is preferable that the terminal arrangement surface 31 is parallel to the main surface 11 as in the above embodiment.
  • a light-emitting element mounting substrate on which wiring can be easily formed using screen printing, and a light-emitting device using the same are provided, and expected to be used in the lighting field and the like. Is done.

Abstract

A light-emitting element mounting substrate (1) is provided with a substrate portion (10), a frame portion (20), and an extending portion (30). The extending portion (30) has a terminal arrangement surface (31) located between an opening surface of the frame (20) and a main surface (11) of the substrate portion (10), and a wiring arrangement surface (32) for connecting a curved part (22b) and the terminal arrangement surface (31). The wiring arrangement surface (32) has a region inclined in a direction towards an element mounting portion from the curved part (22b) connected to the wiring arrangement surface (32).

Description

発光素子搭載用基板、及び、それを用いた発光装置Light-emitting element mounting substrate and light-emitting device using the same
　本発明は、配線を容易に形成することができる発光素子搭載用基板、及び、それを用いた発光装置に関する。 The present invention relates to a light emitting element mounting substrate on which wiring can be easily formed, and a light emitting device using the same.
　発光ダイオード等の発光素子が発光素子搭載用基板に搭載された発光装置が実用化されている。このような発光装置の一般的な発光素子搭載用基板には、発光素子が収められるキャビティーが形成されると共に、当該キャビティーの外側から内側に延在する配線が設けられ、キャビティー内の配線の端部がボンディング用端子とされる。そして、キャビティー内に搭載された発光素子の端子とボンディング用端子とがボンディングワイヤにより接続される。さらに、発光素子やボンディングワイヤを保護する観点から、一般的に、キャビティーは透明な封止樹脂が充填されることで封止される。 A light emitting device in which a light emitting element such as a light emitting diode is mounted on a light emitting element mounting substrate has been put into practical use. A general light-emitting element mounting substrate of such a light-emitting device has a cavity in which the light-emitting element is accommodated and wiring extending from the outside to the inside of the cavity. The ends of the wiring are used as bonding terminals. And the terminal of the light emitting element mounted in the cavity and the bonding terminal are connected by a bonding wire. Furthermore, from the viewpoint of protecting the light emitting element and the bonding wire, the cavity is generally sealed by being filled with a transparent sealing resin.
　特許文献１には、このような発光装置である発光ダイオードモジュールが記載されている。この発光ダイオードモジュールでは、上記発光素子搭載用基板としての回路基板のキャビティーが２段階の深さで形成されている。具体的には、回路基板には、枠状の第１凹部が形成され、この第１凹部で囲まれる領域は第１凹部よりも凹んだ第２凹部とされている。そして、第１凹部には、回路基板の第１凹部の外側から延在する配線が配置され、第２凹部内に搭載された発光ダイオードの端子と第１凹部上の配線とがボンディングワイヤによって接続される。 Patent Document 1 describes a light emitting diode module which is such a light emitting device. In this light emitting diode module, the cavity of the circuit board as the light emitting element mounting board is formed in two levels of depth. Specifically, a frame-shaped first recess is formed on the circuit board, and a region surrounded by the first recess is a second recess recessed from the first recess. In the first recess, wiring extending from the outside of the first recess of the circuit board is arranged, and the terminal of the light emitting diode mounted in the second recess is connected to the wiring on the first recess by a bonding wire. Is done.
　ところで、特許文献１には、第１凹部の側面は、回路基板の表面に対して垂直には形成されず、配線の形成を容易にする観点から傾斜面とされる旨記載されている。 Incidentally, Patent Document 1 describes that the side surface of the first recess is not formed perpendicular to the surface of the circuit board, but is inclined from the viewpoint of facilitating the formation of wiring.
特開２０１２－　８９７６１号公報JP 2012-87761 A
　キャビティー内に発光素子が搭載される発光素子搭載用基板に設けられる端子は、発光素子を搭載するスペースを確保する都合上、一般的にキャビティー内の内側面の近傍に設けられる。このため、当該端子からキャビティーの外に延在する配線もキャビティー内の内側面の近傍において当該内側面に沿って設けられるのが通常である。また、この配線や端子を容易に設ける観点から、配線や端子はスクリーン印刷により形成される場合がある。しかし、キャビティーの内側面の付近にスクリーン印刷を行おうとすると、キャビティーの外側と配線が設けられる位置との段差にスクリーンの撓みが追従できない現象が生じ易い。この場合、配線を適切に印刷できず、断線等の原因となる。確かに特許文献１に記載のように、配線の一部が形成される凹部の側面が傾斜面とされることが、配線を適切に印刷する観点から好ましい。しかし、上記現象は、特許文献１の記載のように、単にキャビティーの側面を傾斜する場合であっても生じることが、本発明者等らの鋭意検討により明らかとなった。 The terminal provided on the light emitting element mounting substrate on which the light emitting element is mounted in the cavity is generally provided in the vicinity of the inner side surface in the cavity for the purpose of securing a space for mounting the light emitting element. For this reason, wiring extending from the terminal to the outside of the cavity is usually provided along the inner surface in the vicinity of the inner surface in the cavity. In addition, from the viewpoint of easily providing the wirings and terminals, the wirings and terminals may be formed by screen printing. However, if screen printing is performed in the vicinity of the inner surface of the cavity, a phenomenon in which the screen does not flex easily follows the step between the outside of the cavity and the position where the wiring is provided. In this case, the wiring cannot be printed properly, causing disconnection or the like. Certainly, as described in Patent Document 1, it is preferable that the side surface of the recess in which a part of the wiring is formed is an inclined surface from the viewpoint of printing the wiring appropriately. However, as described in Patent Document 1, it has been clarified by the present inventors that the above phenomenon occurs even when the side surface of the cavity is simply inclined.
　そこで、本発明は、スクリーン印刷を用いて配線を容易に形成することができる発光素子搭載用基板、及び、それを用いた発光装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a light emitting element mounting substrate on which wiring can be easily formed using screen printing, and a light emitting device using the same.
　上記課題を達成するため、本発明の発光素子搭載用基板は、発光素子が搭載される素子搭載部を主面に有する平板状の基体部と、前記素子搭載部を囲んだ状態で前記主面に設けられ、前記基体部と反対側が開口する環状の部材であって、開口縁が四角形のそれぞれの角が丸みを帯びる形状をなし、当該四角形の辺に相当する直線部位と当該四角形の角に相当する曲線部位とを有する枠体部と、前記直線部位と接する前記枠体部の内側面に沿って当該直線部位と隣接する前記曲線部位から延在する延在部と、を備え、前記延在部は、前記枠体部の開口面と前記基体部の前記主面との間に位置すると共に端子が配置される端子配置面と、前記曲線部位と前記端子配置面を接続すると共に配線が配置される配線配置面とを有し、前記配線配置面は、前記配線配置面と接続される前記曲線部位から前記素子搭載部に向かう方向に傾斜する傾斜領域を有することを特徴とするものである。 In order to achieve the above object, a substrate for mounting a light emitting element according to the present invention includes a flat base portion having an element mounting portion on which a light emitting element is mounted on the main surface, and the main surface in a state of surrounding the element mounting portion. Provided on the opposite side of the base portion, the opening edge of each of the squares is rounded, and the straight part corresponding to the sides of the square and the corners of the square are formed. A frame part having a corresponding curved part, and an extending part extending from the curved part adjacent to the straight part along the inner surface of the frame part in contact with the straight part, The existing portion is located between the opening surface of the frame body portion and the main surface of the base portion, and a terminal arrangement surface on which terminals are arranged, and the curved portion and the terminal arrangement surface are connected and wiring is connected Wiring arrangement surface to be arranged, the wiring arrangement surface is It is characterized in that it has a sloped region that inclines from the curve part to be connected to the wiring arrangement plane in a direction toward the element mounting part.
　特許文献１のように角に丸みを帯びない矩形状の枠体部の内側面の近傍において当該内側面に沿って配線配置面が設けられる場合、枠体部の角付近における内側面等に配線を形成しようとしても、スクリーン印刷時において、スクリーンの印刷面に対する表面追随性が良好とはいえない。そこで、上記発光素子搭載用基板においては、枠体部の開口縁を四角形の角が丸みを帯びた形状とし、この丸みを帯びた曲線部位に配線配置面を接続することで、スクリーン印刷時において、スクリーンやスキージの印刷面に対する表面追随性を改善している。しかも、配線配置面は、曲線部位から素子搭載部に向かう方向に傾斜する傾斜領域を有する。別言すれば、配線配置面は、延在部が延在する方向に沿って端子配置面に向かって進むにつれ枠体部の開口面から素子搭載部に向かう方向に傾斜するとともに、配線配置面と接続される曲線部位から延在部が延在する方向に垂直に進むにつれ枠体部の開口面から素子搭載部に向かう方向に傾斜する傾斜領域を有する。一般的にスクリーンを枠体上に配置して、スクリーンの一部が枠体により形成されるキャビティー内に入り込むようにスクリーンを撓ませる場合、開口の中心が最もキャビティー内に入り込みやすい。従って、このような傾斜領域を有することで、スクリーン印刷時において、スクリーンがより自然な状態で変形して、スクリーンの配線配置面に対する表面追随性がより良好とされる。このため、配線を容易に形成することができる。 When a wiring arrangement surface is provided along the inner side surface in the vicinity of the inner side surface of the rectangular frame body that does not have rounded corners as in Patent Document 1, wiring is performed on the inner side surface in the vicinity of the corner of the frame body portion. Even if it is going to form, the surface followability with respect to the printing surface of the screen is not good at the time of screen printing. Therefore, in the light emitting element mounting substrate, the opening edge of the frame portion is formed in a shape with a rounded square corner, and the wiring arrangement surface is connected to the rounded curved portion, so that at the time of screen printing. The surface followability of the screen and squeegee printing surface has been improved. Moreover, the wiring arrangement surface has an inclined region that is inclined in a direction from the curved portion toward the element mounting portion. In other words, the wiring placement surface is inclined in the direction from the opening surface of the frame body portion toward the element mounting portion as it advances toward the terminal placement surface along the direction in which the extending portion extends, and the wiring placement surface. And an inclined region that inclines in the direction from the opening surface of the frame body portion toward the element mounting portion as it proceeds perpendicularly to the direction in which the extending portion extends from the curved portion connected to the. In general, when the screen is arranged on the frame and the screen is bent so that a part of the screen enters the cavity formed by the frame, the center of the opening is most likely to enter the cavity. Therefore, by having such an inclined region, the screen is deformed in a more natural state during screen printing, and the surface followability to the wiring arrangement surface of the screen is made better. For this reason, wiring can be formed easily.
　また、前記傾斜領域において、前記配線配置面は凸面状とされることが好ましい。配線配置面が凸面状とされることで、配線配置面が平面状とされる場合よりも、より自然にスクリーンが変形し、スクリーンの配線配置面に対する表面追随性がより向上する。 In the inclined region, it is preferable that the wiring arrangement surface is convex. By making the wiring arrangement surface convex, the screen is more naturally deformed than when the wiring arrangement surface is flat, and the surface followability of the screen with respect to the wiring arrangement surface is further improved.
　また、上記の発光素子搭載用基板において、前記延在部を一対備え、一方の前記延在部は、互いに対向する前記内側面の一部の一方に接して設けられ、他方の前記延在部は、互いに対向する前記内側面の一部の他方に接して設けられることが好ましい。 The light emitting element mounting substrate includes a pair of the extending portions, and one of the extending portions is provided in contact with one of the inner surfaces facing each other, and the other extending portion. Is preferably provided in contact with the other part of the inner surfaces facing each other.
　一対の延在部が形成されることで、発光素子に電気的に接続される信号ラインとグランドラインとをそれぞれの延在部上に分けて配置することができる。従って、より容易に配線を形成することができる。 By forming a pair of extending portions, a signal line and a ground line that are electrically connected to the light emitting element can be arranged separately on each extending portion. Accordingly, the wiring can be formed more easily.
　この場合、一方の前記延在部と他方の前記延在部とは、前記配線配置面から前記端子配置面に向かう方向が互いに逆方向とされることが好ましい。 In this case, it is preferable that the one extending portion and the other extending portion have directions opposite to each other from the wiring arrangement surface toward the terminal arrangement surface.
　発光素子搭載用基板をこのように構成することで、枠体部によって形成されるキャビティーの中心を基準として、それぞれの延在部を点対称に近づけることができる。従って、配置される発光素子から出射する光の光軸が、発光素子搭載用基板の垂直な方向から傾くことを抑制することができる。 By constructing the light emitting element mounting substrate in this way, each extending portion can be made close to point symmetry with reference to the center of the cavity formed by the frame body portion. Therefore, it is possible to suppress the optical axis of light emitted from the arranged light emitting element from being inclined from the vertical direction of the light emitting element mounting substrate.
　また、一方の前記延在部と他方の前記延在部とは、前記配線配置面から前記端子配置面に向かう方向が互いに同じ方向とされることも好ましい。 Further, it is also preferable that the one extending portion and the other extending portion have the same direction from the wiring arrangement surface toward the terminal arrangement surface.
　発光素子搭載用基板をこのように構成することで、スクリーン印刷で配線を形成する際に延在部が延在する方向に印刷を行うことで、それぞれの延在部の配線配置面上に形成される配線を略同じ条件で形成することができる。従って、それぞれの延在部の配線配置面上に形成される配線の性質が異なることを抑制することができる。 By configuring the light-emitting element mounting substrate in this way, when the wiring is formed by screen printing, printing is performed in the direction in which the extending portion extends, thereby forming on the wiring arrangement surface of each extending portion. Can be formed under substantially the same conditions. Therefore, it can suppress that the property of the wiring formed on the wiring arrangement | positioning surface of each extension part differs.
　また、上記発光素子搭載用基板は、前記開口の外側から前記傾斜領域を通り前記端子配置面上まで延在する前記配線を更に備え、前記端子配置面上の前記配線が前記端子とされることにより、発光素子を搭載できる状態となる。 The light emitting element mounting substrate further includes the wiring extending from the outside of the opening through the inclined region to the terminal arrangement surface, and the wiring on the terminal arrangement surface serves as the terminal. Thus, the light emitting element can be mounted.
　そして、このような状態の発光素子搭載用基板と、発光素子と、を備え、前記発光素子の端子と前記発光素子搭載用基板の前記端子とが電気的に接続されて、発光装置とされる。この発光装置に用いられる発光素子搭載用基板は、上記のようにスクリーン印刷を用いて容易に配線を形成することができるため、発光装置は、断線による不良率を低減することができる。 The light emitting element mounting substrate in such a state and the light emitting element are provided, and the terminal of the light emitting element and the terminal of the light emitting element mounting substrate are electrically connected to form a light emitting device. . Since the light emitting element mounting substrate used in this light emitting device can easily form wiring using screen printing as described above, the light emitting device can reduce the defect rate due to disconnection.
本発明の第１実施形態にかかる発光装置の斜視図である。1 is a perspective view of a light emitting device according to a first embodiment of the present invention. 図１の発光素子搭載用基板のＡ－Ａ線を通る面における断面図である。FIG. 2 is a cross-sectional view of the light-emitting element mounting substrate of FIG. 図１の発光素子搭載用基板のＢ－Ｂ線を通る面における断面図である。FIG. 2 is a cross-sectional view of the light-emitting element mounting substrate of FIG. 本発明の第２実施形態にかかる発光装置の斜視図である。It is a perspective view of the light-emitting device concerning 2nd Embodiment of this invention. 図４の発光素子搭載用基板のＣ－Ｃ線を通る面における断面図である。FIG. 5 is a cross-sectional view of the light emitting element mounting substrate of FIG. 4 on a plane passing through a line CC.
　以下、本発明にかかる発光素子搭載用基板、及び、これを用いた発光装置の好適な実施形態について図面を参照しながら詳細に説明する。なお、理解の容易のため、それぞれの図のスケールと、以下の説明に記載のスケールとが異なる場合がある。 Hereinafter, preferred embodiments of a light-emitting element mounting substrate and a light-emitting device using the same according to the present invention will be described in detail with reference to the drawings. For ease of understanding, the scale of each figure may be different from the scale described in the following description.
　（第１実施形態）
　図１は、本発明の第１実施形態に係る発光装置の斜視図である。図１に示すように、本実施形態の発光装置１００は、発光素子搭載用基板１と、発光素子搭載用基板１に搭載される発光素子５０とを主な構成として備える。発光装置１００は発光素子５０を封止する封止樹脂をその他の構成として備えるが、図１では理解の容易のため封止樹脂が省略されている。 (First embodiment)
FIG. 1 is a perspective view of a light emitting device according to a first embodiment of the present invention. As shown in FIG. 1, the light emitting device 100 of this embodiment includes a light emitting element mounting substrate 1 and a light emitting element 50 mounted on the light emitting element mounting substrate 1 as main components. The light emitting device 100 includes a sealing resin for sealing the light emitting element 50 as another configuration, but the sealing resin is omitted in FIG. 1 for easy understanding.
　発光素子搭載用基板１は、基板本体５と、基板本体５の表面に形成される配線導体４０と、を備えている。 The light emitting element mounting substrate 1 includes a substrate body 5 and a wiring conductor 40 formed on the surface of the substrate body 5.
　基板本体５は、基体部１０と、基体部１０上に形成される枠体部２０と、基体部１０と枠体部２０とで囲まれる空間内に配置される一対の延在部３０とから成る。なお、本実施形態では、基体部１０と枠体部２０とそれぞれの延在部３０とは、一体のセラミック焼結体から成る。 The substrate body 5 includes a base body portion 10, a frame body portion 20 formed on the base body portion 10, and a pair of extending portions 30 disposed in a space surrounded by the base body portion 10 and the frame body portion 20. Become. In the present embodiment, the base portion 10, the frame portion 20, and the extending portions 30 are made of an integral ceramic sintered body.
　基板本体５を構成するセラミック焼結体としては、アルミナを主成分とするセラミック焼結体や、窒化アルミニウムを主成分とするセラミック焼結体や、ムライトを主成分とするセラミック焼結体や、低温焼成の一種であるガラス－セラミック焼結体等を挙げることができ、主成分としてアルミナを含み、添加成分としてバリウム元素を含むセラミック焼結体が、光の反射効率が優れる観点からより好ましい。 As the ceramic sintered body constituting the substrate body 5, a ceramic sintered body mainly composed of alumina, a ceramic sintered body mainly composed of aluminum nitride, a ceramic sintered body mainly composed of mullite, A glass-ceramic sintered body which is a kind of low-temperature firing can be mentioned, and a ceramic sintered body containing alumina as a main component and barium element as an additional component is more preferable from the viewpoint of excellent light reflection efficiency.
　図２は、図１の発光素子搭載用基板のＡ－Ａ線を通る面における断面図であり、図３は、図１の発光素子搭載用基板のＢ－Ｂ線を通る面における断面図である。図２、図３において破線で示すように、仮に基体部１０と枠体部２０と延在部３０とを分解する場合、基体部１０は平板状の部位とされる。この基体部１０の枠体部２０側の面である主面１１における略中心は、発光素子５０が配置される素子搭載部とされる。この素子搭載部は、発光素子５０を搭載することができる領域である限りにおいて特に制限が無く、その周りの領域と特に区別されない領域とされても良く、発光素子５０が搭載され易いように立体的な形状とされていても良い。そして、基体部１０の主面１１の内、枠体部２０で囲まれる領域における少なくとも素子搭載部以外の領域は、基体部１０を構成するセラミック焼結体が露出した状態とされ、発光素子５０が発光する光を反射する反射面とされている。 2 is a cross-sectional view of the light-emitting element mounting substrate in FIG. 1 along the plane AA, and FIG. 3 is a cross-sectional view of the light-emitting element mounting substrate in FIG. is there. As shown by broken lines in FIGS. 2 and 3, if the base body portion 10, the frame body portion 20, and the extending portion 30 are to be disassembled, the base body portion 10 is a flat plate portion. A substantially center of the main surface 11 which is a surface of the base body portion 10 on the frame body portion 20 side is an element mounting portion on which the light emitting element 50 is disposed. The element mounting portion is not particularly limited as long as it is an area where the light emitting element 50 can be mounted, and may be an area that is not particularly distinguished from the surrounding area, so that the light emitting element 50 can be easily mounted. It may be a typical shape. In the main surface 11 of the base portion 10, at least the region other than the element mounting portion in the region surrounded by the frame body portion 20 is in a state where the ceramic sintered body constituting the base portion 10 is exposed, and the light emitting element 50. Is a reflecting surface that reflects light emitted.
　なお、基体部１０の大きさは、発光素子５０の大きさ等により変わるため特に限定されないが、例えば、３．５ｍｍ（縦幅）×３．５ｍｍ（横幅）×０．５ｍｍ（厚み）とされる。 The size of the base portion 10 is not particularly limited because it varies depending on the size of the light emitting element 50 and the like, but is, for example, 3.5 mm (vertical width) × 3.5 mm (horizontal width) × 0.5 mm (thickness). The
　また、基体部１０の互いに対向する一対の側面のそれぞれには、配線導体４０の一部である一対の接続用配線４４を設けるための一対の溝１５が設けられている。この溝１５は、基板本体５の厚み方向に延在しており、厚み方向に垂直な断面の形状が略半円形とされている。 Further, a pair of grooves 15 for providing a pair of connection wirings 44 that are a part of the wiring conductor 40 is provided on each of the pair of side surfaces facing each other of the base portion 10. The groove 15 extends in the thickness direction of the substrate body 5 and has a substantially semicircular shape in cross section perpendicular to the thickness direction.
　枠体部２０は、基体部１０の主面１１上において、素子搭載部を取り囲むように形成される環状の部位である。枠体部２０の基体部１０と反対側の面である上面２１は平面状とされる。また、枠体部２０の外周側の側面の形状は、基体部１０の側面の形状と同様とされており、外周側の側面には、基体部１０から延在する溝１５が形成されている。つまり、溝１５は、図１に示すように、基体部１０の底面から枠体部２０の上面２１にかけて形成されている。 The frame part 20 is an annular part formed on the main surface 11 of the base part 10 so as to surround the element mounting part. The upper surface 21 which is the surface opposite to the base body portion 10 of the frame body portion 20 is planar. Further, the shape of the side surface on the outer peripheral side of the frame body portion 20 is the same as the shape of the side surface of the base portion 10, and the groove 15 extending from the base portion 10 is formed on the side surface on the outer peripheral side. . That is, the groove 15 is formed from the bottom surface of the base portion 10 to the upper surface 21 of the frame body portion 20 as shown in FIG.
　また、枠体部２０は、上述のように環状の部位であるため、枠体部２０には、厚み方向に貫通孔が形成されている。枠体部２０は、基体部１０上に形成されているため、基板本体５としてみると、枠体部２０は、基体部１０と反対側が開口していることになる。この開口を形成する枠体部２０の開口縁２２は、四角形のそれぞれの角が丸みを帯びて面取りされた形状とされている。従って、開口縁２２は、当該四角形の辺に相当する４つの直線部位２２ａと、直線部位２２ａをそれぞれ連結し当該四角形の角に相当する４つの曲線部位２２ｂとに分解することができる。本実施形態では、開口縁２２は、正方形の各角が丸みを帯びた曲線状に面取りされた形状とされている。開口縁２２と接する内側面２３は、枠体部２０の開口方向（基体部１０から枠体部２０に向かう方向）において、外側に向かって広がる傾斜面とされている。内側面２３のうち開口縁２２のそれぞれの直線部位２２ａに接する部位は平面状の平面部位２３ａとされ、開口縁２２それぞれの曲線部位２２ｂと接する部位は曲面状の曲面部位２３ｂとされる。従って、内側面２３は、４つの平面部位２３ａと、平面部位２３ａをそれぞれ連結する４つの曲面部位２３ｂとに分解することができる。ただし、図１より明らかなように内側面２３のうち一部は、延在部３０により目視できない状態とされる。 Moreover, since the frame part 20 is an annular part as described above, a through-hole is formed in the frame part 20 in the thickness direction. Since the frame body portion 20 is formed on the base body portion 10, when viewed as the substrate body 5, the frame body portion 20 is open on the side opposite to the base body portion 10. The opening edge 22 of the frame body portion 20 that forms the opening has a shape in which each corner of the square is rounded and chamfered. Therefore, the opening edge 22 can be decomposed into four straight line portions 22a corresponding to the sides of the square and four curved line portions 22b connecting the straight line portions 22a and corresponding to the corners of the square. In the present embodiment, the opening edge 22 has a shape in which each corner of a square is chamfered in a curved shape with a rounded shape. The inner side surface 23 in contact with the opening edge 22 is an inclined surface that spreads outward in the opening direction of the frame body portion 20 (the direction from the base body portion 10 toward the frame body portion 20). Of the inner side surface 23, a portion of the opening edge 22 in contact with each straight portion 22 a is a flat planar portion 23 a, and a portion of each opening edge 22 in contact with the curved portion 22 b is a curved curved portion 23 b. Therefore, the inner side surface 23 can be decomposed into four planar portions 23a and four curved surface portions 23b respectively connecting the planar portions 23a. However, as is clear from FIG. 1, a part of the inner side surface 23 is in a state where it cannot be seen by the extending portion 30.
　なお、枠体部２０のサイズは、特に限定されないが、例えば３．５ｍｍ（縦幅）×３．５ｍｍ（横幅）×０．４ｍｍ（厚み）とされ、枠体部２０で囲まれた領域で露出している基体部１０の主面１１に対する内側面２３の角度は、特に限定されないが、例えば１１０°とされる。 The size of the frame body portion 20 is not particularly limited, but is, for example, 3.5 mm (vertical width) × 3.5 mm (horizontal width) × 0.4 mm (thickness) and is an area surrounded by the frame body portion 20. Although the angle of the inner side surface 23 with respect to the main surface 11 of the base | substrate part 10 exposed is not specifically limited, For example, it shall be 110 degrees.
　一対の延在部３０は互いに同じ形状とされる。一方の延在部３０は、開口空間Ｈから見る場合に特定の平面部位２３ａに沿った一定の方向に延在するように形成されており、他方の延在部３０は、一方の延在部３０が接する内側面２３の平面部位２３ａと対向する内側面２３の平面部位２３ａに沿って延在するように形成されている。また、それぞれの延在部３０は、延在部３０が延在する方向において、内側面２３の互いに対向する部位同士を接続するように形成されている。すなわち、仮に基体部１０と枠体部２０と延在部３０とを分解可能であるとすると、延在部３０は、特定の内側面２３の曲面部位２３ｂから、当該特定の曲面部位２３ｂと平面部位２３ａ介して隣り合う曲面部位２３ｂまで延在している。それぞれの延在部３０は、後述する端子４１が形成される端子配置面３１と、後述する内部配線４２が形成される配線配置面３２とを有する。また、一方の延在部３０と他方の延在部３０とは、配線配置面３２から端子配置面３１に向かう方向が互いに逆方向とされる。このため、枠体部２０で囲まれる空間の中心を基準として、延在部３０は点対称に形成されることになる。また、延在部３０が延在する方向とは、配線配置面３２から端子配置面３１に向かう方向のことである。 The pair of extending portions 30 have the same shape. One extension portion 30 is formed to extend in a certain direction along a specific plane portion 23a when viewed from the opening space H, and the other extension portion 30 is one extension portion. It is formed so as to extend along the flat surface portion 23a of the inner side surface 23 opposite to the flat surface portion 23a of the inner side surface 23 with which 30 contacts. In addition, each extending portion 30 is formed so as to connect mutually facing portions of the inner side surface 23 in the direction in which the extending portion 30 extends. That is, if it is possible to disassemble the base portion 10, the frame body portion 20, and the extending portion 30, the extending portion 30 is formed from the curved surface portion 23 b of the specific inner side surface 23 to the specific curved surface portion 23 b and the flat surface. It extends to the adjacent curved surface part 23b through the part 23a. Each extending portion 30 has a terminal arrangement surface 31 on which a terminal 41 described later is formed, and a wiring arrangement surface 32 on which an inner wiring 42 described later is formed. In addition, the direction from the wiring arrangement surface 32 toward the terminal arrangement surface 31 of the one extending portion 30 and the other extending portion 30 is opposite to each other. For this reason, the extending part 30 is formed point-symmetrically with respect to the center of the space surrounded by the frame body part 20. In addition, the direction in which the extending part 30 extends is a direction from the wiring arrangement surface 32 toward the terminal arrangement surface 31.
　端子配置面３１は、後述のように端子が配置される面であり、開口縁２２と素子搭載部（基体部１０の主面１１）との間に位置し、内側面２３の平面部位２３ａに接している。そして、本実施形態では、端子配置面３１は、主面１１と平行な面とされ、主面と段差が生じている。 The terminal arrangement surface 31 is a surface on which terminals are arranged as will be described later, and is located between the opening edge 22 and the element mounting portion (the main surface 11 of the base body portion 10), and is formed on the plane portion 23a of the inner side surface 23. Touching. In the present embodiment, the terminal arrangement surface 31 is a surface parallel to the main surface 11 and has a step difference from the main surface.
　配線配置面３２は、後述のように配線が配置される面であり、開口縁２２の曲線部位２２ｂと端子配置面３１とを接続する。上記のように端子配置面３１は、開口縁２２と素子搭載部との間に位置するため、開口縁２２と端子配置面３１との間には段差が生じる。このため配線配置面３２は、この段差をうめる傾斜面とされ、配線配置面３２と接続される曲線部位２２ｂから素子搭載部に向かう方向に傾斜する。具体的には、図１、図２に示すように、配線配置面３２は、配線配置面３２と接続される曲線部位２２ｂから延在部３０が延在する方向に沿って端子配置面３１に向かって進むにつれ、枠体部２０の開口面から素子搭載部に向かう方向に傾斜している。さらに、図１、図３に示すように、配線配置面３２は、配線配置面３２と接続される曲線部位２２ｂから延在部３０が延在する方向に垂直に進むにつれ枠体部２０の開口面から素子搭載部に向かう方向に傾斜する。配線配置面３２は、このように傾斜する傾斜領域を有するのである。そして、本実施形態では、延在部３０が延在する方向、及び、この方向に直交する方向のどちらにおいても、配線配置面３２の傾斜は、曲線部位２２ｂと接する部分においては、枠体部２０の上面２１と略面一とされるが、曲線部位２２ｂから開口空間Ｈの中心に向かうにつれて傾斜がきつくなる。すなわち、配線配置面３２が接する曲線部位２２ｂから離れるにつれて、延在部３０が延在する方向、及び、この方向に直交する方向に進む単位長さ当たりの開口面から素子搭載部に向かう大きさが大きくなる。こうして、上記領域では、配線配置面３２は、凸面状とされるのである。 The wiring arrangement surface 32 is a surface on which wiring is arranged as described later, and connects the curved portion 22b of the opening edge 22 and the terminal arrangement surface 31. As described above, since the terminal arrangement surface 31 is located between the opening edge 22 and the element mounting portion, a step is generated between the opening edge 22 and the terminal arrangement surface 31. Therefore, the wiring arrangement surface 32 is an inclined surface that fills this step, and is inclined in a direction from the curved portion 22b connected to the wiring arrangement surface 32 toward the element mounting portion. Specifically, as shown in FIGS. 1 and 2, the wiring arrangement surface 32 is connected to the terminal arrangement surface 31 along the direction in which the extending portion 30 extends from the curved portion 22 b connected to the wiring arrangement surface 32. As it progresses, it inclines in the direction from the opening surface of the frame part 20 toward the element mounting part. Further, as shown in FIGS. 1 and 3, the wiring arrangement surface 32 opens to the frame body portion 20 as it proceeds vertically from the curved portion 22 b connected to the wiring arrangement surface 32 in the direction in which the extension portion 30 extends. It inclines in the direction from the surface toward the element mounting portion. The wiring arrangement surface 32 has an inclined region inclined in this way. In the present embodiment, the inclination of the wiring arrangement surface 32 in both the direction in which the extending portion 30 extends and the direction orthogonal to this direction is the frame portion in the portion in contact with the curved portion 22b. 20 is substantially flush with the upper surface 21, but the slope becomes tighter from the curved portion 22 b toward the center of the opening space H. That is, as the distance from the curved portion 22b with which the wiring arrangement surface 32 is in contact, the direction from the opening surface per unit length that advances in the direction in which the extending portion 30 extends and in the direction orthogonal to this direction to the element mounting portion. Becomes larger. Thus, in the above region, the wiring arrangement surface 32 is convex.
　また、それぞれの延在部３０の露出する側面は、枠体部２０の内側面２３と同様にして、枠体部２０の開口方向に進むにつれて外側に向かって広がる傾斜面とされている。 Also, the exposed side surface of each extending portion 30 is an inclined surface that spreads outward as it proceeds in the opening direction of the frame body portion 20 in the same manner as the inner side surface 23 of the frame body portion 20.
　基板本体５の表面には、上述のように配線導体４０が設けられている。この配線導体４０は、金属等の導体の層で構成されており、基板本体５における枠体部２０の上面２１上に設けられる上面配線４３と、基板本体５の底面上から基板本体５の側面上わたって形成される接続用配線４４と、上面配線４３と接続され延在部３０上に設けられる内部配線４２とを有する。 The wiring conductor 40 is provided on the surface of the substrate body 5 as described above. The wiring conductor 40 is composed of a layer of a conductor such as a metal, and the upper surface wiring 43 provided on the upper surface 21 of the frame body portion 20 in the substrate body 5 and the side surface of the substrate body 5 from the bottom surface of the substrate body 5. It has a connection wiring 44 formed over and an internal wiring 42 connected to the upper surface wiring 43 and provided on the extended portion 30.
　接続用配線４４は、発光装置１００が外部の端子と電気的に接続されるための配線である。接続用配線４４は、溝１５が形成される互いに対向するそれぞれの側面上に形成され、一対の接続用配線４４は、基板本体５の底面上の互いに対向する縁を含む領域から基板本体５の側面上にわたってそれぞれ形成され、上面配線４３に接続されている。なお、基板本体５の側面上の接続用配線４４は、それぞれの溝１５の内周面上、及び、これらの溝１５が形成される側面の一部に形成されている。 The connection wiring 44 is a wiring for electrically connecting the light emitting device 100 to an external terminal. The connection wirings 44 are formed on the side surfaces facing each other where the grooves 15 are formed, and the pair of connection wirings 44 are formed on the bottom surface of the substrate body 5 from the region including the edges facing each other. They are formed on the side surfaces and connected to the upper surface wiring 43. The connection wiring 44 on the side surface of the substrate body 5 is formed on the inner peripheral surface of each groove 15 and on a part of the side surface where these grooves 15 are formed.
　上面配線４３は、枠体部２０の上面２１において、上面２１と溝１５が形成されている側面との縁に沿って形成される。上述のように溝１５は、基体部１０及び枠体部２０の互いに対向する側面のそれぞれに一対ずつ形成されているため、上面配線４３は、枠体部２０の上面２１上において、溝１５が形成されている互いに対向する一対の縁に沿って一対形成されており、それぞれの上面配線４３は、互いに対向する側面上に形成される接続用配線４４とそれぞれ接続されている。さらに、上面配線４３は、枠体部２０の縁に沿って形成される部分から垂直に分岐する分岐部分を有しており、この分岐部分が延在部３０に向かって延在している。そして、この分岐部分が延在部３０上の内部配線４２に接続されている。一対の上面配線４３のうち、一方の上面配線４３の分岐部分が一方の延在部３０上の内部配線４２に接続され、他方の上面配線４３の分岐部分が他方の延在部３０上の内部配線４２に接続されている。 The upper surface wiring 43 is formed on the upper surface 21 of the frame body portion 20 along the edge between the upper surface 21 and the side surface on which the groove 15 is formed. As described above, since the grooves 15 are formed in pairs on the side surfaces of the base body portion 10 and the frame body portion 20 facing each other, the upper surface wiring 43 is formed on the upper surface 21 of the frame body portion 20. A pair is formed along a pair of oppositely formed edges, and each upper surface wiring 43 is connected to a connection wiring 44 formed on a side surface facing each other. Furthermore, the upper surface wiring 43 has a branching portion that branches vertically from a portion formed along the edge of the frame body portion 20, and this branching portion extends toward the extending portion 30. The branch portion is connected to the internal wiring 42 on the extending portion 30. Of the pair of upper surface wirings 43, a branch portion of one upper surface wiring 43 is connected to the internal wiring 42 on one extension portion 30, and a branch portion of the other upper surface wiring 43 is an inner portion on the other extension portion 30. It is connected to the wiring 42.
　内部配線４２は、延在部３０の配線配置面３２から端子配置面３１まで延在しており、配線配置面３２上に位置する内部配線４２の端部が端子４１とされる。 The internal wiring 42 extends from the wiring arrangement surface 32 of the extending portion 30 to the terminal arrangement surface 31, and the end portion of the internal wiring 42 positioned on the wiring arrangement surface 32 serves as the terminal 41.
　配線導体４０のうち、内部配線４２と上面配線４３とは、スクリーン印刷によって同じ工程内で共に形成される。接続用配線４４はめっき加工により形成される。また、上面配線４３のうち接続用配線４４と接続される部位、すなわち枠体部２０の上面２１における溝１５が形成される縁の近傍の部位は、接続用配線４４と共にめっき加工により形成される。従って、上面配線４３のうち、溝１５が形成される縁の近傍の部位は、スクリーン印刷により形成された導体上にめっき加工された導体が積層されるのである。こうして、上面配線４３と接続用配線４４とが断線することが防止されている。 Among the wiring conductors 40, the internal wiring 42 and the top wiring 43 are formed together in the same process by screen printing. The connection wiring 44 is formed by plating. Further, a portion of the upper surface wiring 43 that is connected to the connection wiring 44, that is, a portion in the vicinity of the edge where the groove 15 is formed on the upper surface 21 of the frame body portion 20 is formed together with the connection wiring 44 by plating. . Therefore, in the upper surface wiring 43, a portion near the edge where the groove 15 is formed is obtained by laminating a plated conductor on a conductor formed by screen printing. Thus, disconnection of the upper surface wiring 43 and the connection wiring 44 is prevented.
　発光素子５０は、特に図示しないが、半導体の層や複数の電極を有して成り、単一或いは複数の波長帯域の光を出射することができるように構成され、信号入力用の端子とグランド接続用の端子とが設けられている。この発光素子５０は、枠体部２０で囲まれる素子搭載部上に配置され、図示しない接着剤により固定されている。そして、一方の延在部３０上の端子４１と発光素子５０の一方の端子とがボンディングワイヤ５１により電気的に接続され、他方の延在部３０上の端子４１と発光素子５０の他方の端子とがボンディングワイヤ５１により電気的に接続される。本実施形態の発光素子搭載用基板１は、一対の延在部３０が形成されているため、信号ライン用の配線とグランドライン用の配線とをそれぞれの延在部３０上に分けて配置することができる。 Although not particularly illustrated, the light emitting element 50 includes a semiconductor layer and a plurality of electrodes, and is configured to emit light of a single or a plurality of wavelength bands. A signal input terminal and a ground And a connection terminal. The light emitting element 50 is disposed on an element mounting portion surrounded by the frame body portion 20, and is fixed by an adhesive (not shown). And the terminal 41 on one extension part 30 and one terminal of the light emitting element 50 are electrically connected by the bonding wire 51, and the terminal 41 on the other extension part 30 and the other terminal of the light emitting element 50 are connected. Are electrically connected by a bonding wire 51. Since the light emitting element mounting substrate 1 of the present embodiment has a pair of extending portions 30, the signal line wiring and the ground line wiring are arranged separately on each extending portion 30. be able to.
　さらに発光素子５０の各端子と端子４１とがボンディングワイヤ５１を介して電気的に接続された状態で、枠体部２０で囲まれる空間内には、少なくとも発光素子５０及びボンディングワイヤ５１を覆うように図示せぬ封止樹脂が充填される。この封止樹脂は、発光素子５０が発光する光を透過可能な光透過性の樹脂とされる。封止樹脂に用いる樹脂としては、発光素子５０が発光する光を透過する樹脂である限りにおいて、特に限定されないが、エポキシ樹脂やシリコーン樹脂を挙げることができ、発光装置１００の耐久性を向上させる観点からシリコーン樹脂がより好ましい。また、封止樹脂には蛍光体が含有されても良く、このような蛍光体としては、発光素子から出射する光を受けて、他の波長の光を発光可能なものであれば良い。 Further, in a state where each terminal of the light emitting element 50 and the terminal 41 are electrically connected via the bonding wire 51, at least the light emitting element 50 and the bonding wire 51 are covered in the space surrounded by the frame body portion 20. Is filled with a sealing resin (not shown). The sealing resin is a light transmissive resin that can transmit light emitted from the light emitting element 50. The resin used for the sealing resin is not particularly limited as long as it is a resin that transmits light emitted from the light emitting element 50, and examples thereof include an epoxy resin and a silicone resin, which improve the durability of the light emitting device 100. From the viewpoint, a silicone resin is more preferable. In addition, the sealing resin may contain a phosphor, and such a phosphor may be any one that can receive light emitted from the light emitting element and emit light of other wavelengths.
　このような発光装置１００は、基板本体５の底面や側面に形成された接続用配線４４が、外部の電気回路基板の端子に接続されて使用される。発光装置１００の使用状態においては、接続用配線４４に印加される電圧が、内部配線４２やボンディングワイヤ５１等を介して、発光素子５０へ印加され、この電圧により発光素子５０が発光する。発光素子５０が発光する光は、封止樹脂を透過して直接発光装置１００の外部に出射したり、基体部１０の枠体部２０で囲まれる領域のうち露出している部分や、枠体部２０の内側面２３のうち露出している部分や、延在部３０の側面のうち露出している部分で反射して、発光装置１００の外部に出射する。 Such a light emitting device 100 is used by connecting the connection wiring 44 formed on the bottom surface or the side surface of the substrate body 5 to a terminal of an external electric circuit substrate. When the light emitting device 100 is in use, a voltage applied to the connection wiring 44 is applied to the light emitting element 50 via the internal wiring 42, the bonding wire 51, and the like, and the light emitting element 50 emits light by this voltage. The light emitted from the light emitting element 50 passes through the sealing resin and is directly emitted to the outside of the light emitting device 100, or an exposed portion of the region surrounded by the frame body portion 20 of the base body portion 10 or a frame body. The light is reflected from the exposed portion of the inner side surface 23 of the portion 20 and the exposed portion of the side surface of the extending portion 30, and is emitted to the outside of the light emitting device 100.
　また、本実施形態の発光素子搭載用基板１においては、上述のように、枠体部２０の内側面２３や延在部３０の側面が、枠体部２０の開口方向において、外側に向かって広がる傾斜面とされる。このため、枠体部２０の内側面２３のうち露出する部分で反射する光や、延在部３０の側面のうち露出している部分で反射する光は、進行方向が枠体部２０の開口方向に近づくように補正される。 Further, in the light emitting element mounting substrate 1 of the present embodiment, as described above, the inner side surface 23 of the frame body part 20 and the side surface of the extension part 30 face outward in the opening direction of the frame body part 20. It is assumed to be an inclined surface that spreads. For this reason, the light reflected from the exposed portion of the inner side surface 23 of the frame body portion 20 and the light reflected from the exposed portion of the side surface of the extension portion 30 are traveling in the opening direction of the frame body portion 20. It is corrected to approach the direction.
　以上説明したように、本実施形態の発光素子搭載用基板１によれば、基板本体５において、枠体部２０の開口縁２２を四角形の角が丸みを帯びた形状とし、この丸みを帯びた曲線部位２２ｂに配線配置面３２を接続している。従って、上記のようにスクリーン印刷で内部配線４２を形成する際に、スクリーンの印刷面に対する表面追随性が改善される。 As described above, according to the light emitting element mounting substrate 1 of the present embodiment, in the substrate body 5, the opening edge 22 of the frame body portion 20 is formed into a shape with rounded square corners. The wiring arrangement surface 32 is connected to the curved portion 22b. Therefore, when the internal wiring 42 is formed by screen printing as described above, surface followability to the printing surface of the screen is improved.
　しかも、配線配置面３２は、枠体部２０の開口縁２２の曲線部位２２ｂから延在部３０が延在する方向に沿って進むにつれ枠体部２０の開口面から素子搭載部に向かう方向に傾斜するのみならず、開口縁２２の曲線部位２２ｂから延在部３０が延在する方向に垂直に進むにつれ枠体部２０の開口面から素子搭載部に向かう方向に傾斜する領域を有する。従って、スクリーン印刷時において、スクリーンがより自然な状態で変形して、スクリーンの配線配置面３２に対する表面追随性がより良好とされる。このため、本実施形態の発光素子搭載用基板１では配線を容易に形成することができるのである。このため、本実施形態の発光素子搭載用基板１では断線が抑制される。 In addition, the wiring placement surface 32 extends in a direction from the opening surface of the frame body portion 20 toward the element mounting portion as it proceeds along the direction in which the extension portion 30 extends from the curved portion 22b of the opening edge 22 of the frame body portion 20. In addition to inclining, it has a region that inclines in the direction from the opening surface of the frame body portion 20 toward the element mounting portion as it proceeds perpendicularly to the direction in which the extending portion 30 extends from the curved portion 22b of the opening edge 22. Therefore, during screen printing, the screen is deformed in a more natural state, and the surface followability to the wiring arrangement surface 32 of the screen is made better. For this reason, in the light emitting element mounting substrate 1 of the present embodiment, the wiring can be easily formed. For this reason, in the light emitting element mounting substrate 1 of this embodiment, disconnection is suppressed.
　このように発光素子搭載用基板１の断線が抑制されるため、発光装置１００は断線による不良率を低減することができる。 Since the disconnection of the light emitting element mounting substrate 1 is suppressed in this way, the light emitting device 100 can reduce the defect rate due to the disconnection.
　また、本実施形態の発光素子搭載用基板１では、一方の延在部３０と他方の延在部３０とは、配線配置面３２から端子配置面３１に向かう方向が互いに逆方向とされており、枠体部２０に囲まれる空間の中心を基準としてそれぞれの延在部３０が点対称とされている。従って、発光素子５０から出射する光の光軸が、発光素子搭載用基板１の垂直な方向から傾くことを抑制することができる。 Further, in the light emitting element mounting substrate 1 of the present embodiment, the one extending portion 30 and the other extending portion 30 are opposite to each other in the direction from the wiring arrangement surface 32 to the terminal arrangement surface 31. The extending portions 30 are point-symmetric with respect to the center of the space surrounded by the frame body portion 20. Therefore, the optical axis of the light emitted from the light emitting element 50 can be prevented from being tilted from the vertical direction of the light emitting element mounting substrate 1.
　（第２実施形態）
　次に、本発明の第２実施形態について図４、図５を参照して詳細に説明する。なお、第１実施形態と同一又は同等の構成要素については、特に説明する場合を除き、同一の参照符号を付して重複する説明は省略する。 (Second Embodiment)
Next, a second embodiment of the present invention will be described in detail with reference to FIGS. In addition, about the component which is the same as that of 1st Embodiment, or equivalent, except the case where it demonstrates especially, the same referential mark is attached | subjected and the overlapping description is abbreviate | omitted.
　図４は、本発明の第２実施形態にかかる発光装置を図１と同様にして示す図であり、図５は、図４の発光装置２００のＣ－Ｃ線を通る面での断面図である。 4 is a diagram showing a light emitting device according to a second embodiment of the present invention in the same manner as FIG. 1, and FIG. 5 is a cross-sectional view of the light emitting device 200 of FIG. is there.
　図４に示すように、本実施形態の発光装置２００に用いられる発光素子搭載用基板２は、一対の延在部３０が、互いに互いに同じ方向を向く点において、第１実施形態の発光素子搭載用基板１と異なる。つまり、本実施形態の発光素子搭載用基板２では、一方の延在部３０と他方の延在部３０における配線配置面３２から端子配置面３１に向かう方向が互いに同じ方向とされるのである。 As shown in FIG. 4, the light-emitting element mounting substrate 2 used in the light-emitting device 200 of the present embodiment has the light-emitting element mounting of the first embodiment in that the pair of extending portions 30 face each other in the same direction. Different from the substrate 1 for use. That is, in the light emitting element mounting substrate 2 of the present embodiment, the direction from the wiring arrangement surface 32 to the terminal arrangement surface 31 in the one extending portion 30 and the other extending portion 30 is the same direction.
　そして、図５に示すように、それぞれの延在部３０における配線配置面３２の傾斜している領域は、延在部３０が延在する方向に垂直な方向において、互いに逆向きとされる。 And as shown in FIG. 5, the area | region where the wiring arrangement | positioning surface 32 in each extension part 30 inclines is mutually opposite in the direction perpendicular | vertical to the direction where the extension part 30 extends.
　また、一対の延在部３０の向きが同一をされるため、図４に示すように、溝１５が形成されている上面２１の縁に沿って形成される上面配線４３のうち、配線配置面３２が接続される側の上面配線４３は、二つに分割されている。このため分割されたそれぞれの上面配線４３同士がショートしない様に、接続用配線４４も２つに分割されている。一方、２つに分割された接続用配線４４が形成される側面と対向する側面には、発光装置２００を固定するために用いられ、特に電気的な接続がなされない固定用配線４５が形成されている。 Further, since the directions of the pair of extending portions 30 are the same, as shown in FIG. 4, the wiring arrangement surface in the upper surface wiring 43 formed along the edge of the upper surface 21 in which the groove 15 is formed. The upper surface wiring 43 on the side to which 32 is connected is divided into two. Therefore, the connection wiring 44 is also divided into two parts so that the divided upper surface wirings 43 are not short-circuited. On the other hand, a fixing wiring 45 that is used to fix the light emitting device 200 and is not particularly electrically connected is formed on the side surface opposite to the side surface on which the connection wiring 44 divided into two is formed. ing.
　なお、それぞれの配線は、第１実施形態におけるそれぞれの配線と同様の方法により形成される。 Each wiring is formed by the same method as each wiring in the first embodiment.
　以上、本実施形態の発光装置２００に用いられる発光素子搭載用基板２では、スクリーン印刷で内部配線４２を形成する際に延在部３０が延在する方向に印刷を行うことで、それぞれの内部配線４２を略同じ条件で形成することができる。従って、それぞれの内部配線４２の性質が同じとなるようにすることができる。 As described above, in the light emitting element mounting substrate 2 used in the light emitting device 200 of the present embodiment, when the internal wiring 42 is formed by screen printing, printing is performed in the extending direction of the extending portion 30, thereby The wiring 42 can be formed under substantially the same conditions. Therefore, the properties of the internal wirings 42 can be made the same.
　以上、本発明について、第１、第２実施形態を例に説明したが、本発明はこれらに限定されるものではない。 The present invention has been described above by taking the first and second embodiments as examples. However, the present invention is not limited to these.
　例えば、上記実施形態では、基板本体５が一体のセラミックにより形成されるとしたが、基体部１０と枠体部２０と延在部３０とを個別に形成して接着しても良い。さらに、基板本体５は、セラミックで構成されなくても良く、例えば、樹脂により構成されても良い。 For example, in the above embodiment, the substrate main body 5 is formed of an integral ceramic, but the base body portion 10, the frame body portion 20, and the extending portion 30 may be individually formed and bonded. Furthermore, the substrate body 5 may not be made of ceramic, and may be made of resin, for example.
　また、上記のように、配線配置面３２は、配線配置面３２と接続される開口縁２２の曲線部位２２ｂから延在部３０が延在する方向に沿って前記端子配置面３１に向かって進むにつれ枠体部２０の開口面から素子搭載部に向かう方向に傾斜するとともに、配線配置面３２と接続される開口縁２２の曲線部位２２ｂから延在部３０が延在する方向に垂直に進むにつれ枠体部２０の開口面から素子搭載部に向かう方向に傾斜する領域を有する。配線配置面３２は、このような構成を有する限りにおいて、当該領域が上記実施形態の発光素子搭載用基板１，２ように凸面状とされなくても良く、当該領域が上記のように傾斜する平面状とされても良い。ただし、配線配置面３２が凸面状とされる方が、配線配置面３２が平面状とされる場合よりも、スクリーン印刷時においてスクリーンがより自然に変形し、スクリーンの配線配置面３２に対する表面追随性がより向上するため好ましい。 Further, as described above, the wiring arrangement surface 32 proceeds toward the terminal arrangement surface 31 along the direction in which the extending portion 30 extends from the curved portion 22b of the opening edge 22 connected to the wiring arrangement surface 32. As it is inclined in the direction from the opening surface of the frame body portion 20 toward the element mounting portion, it proceeds vertically from the curved portion 22b of the opening edge 22 connected to the wiring arrangement surface 32 in the direction in which the extending portion 30 extends. It has a region inclined in the direction from the opening surface of the frame body portion 20 toward the element mounting portion. As long as the wiring arrangement surface 32 has such a configuration, the region does not have to be convex like the light emitting element mounting substrates 1 and 2 of the above embodiment, and the region is inclined as described above. It may be planar. However, when the wiring arrangement surface 32 is convex, the screen deforms more naturally during screen printing than when the wiring arrangement surface 32 is flat, and the surface of the screen with respect to the wiring arrangement surface 32 follows. It is preferable because the properties are further improved.
　また、上記実施形態では、端子配置面３１は主面１１と平行とされたが、端子配置面３１は主面１１と平行とされなくても良い。しかし、ボンディングワイヤのボンディングを自動機で良好に行う観点から、上記実施形態のように端子配置面３１は主面１１と平行とされることが好ましい。 In the above embodiment, the terminal arrangement surface 31 is parallel to the main surface 11, but the terminal arrangement surface 31 may not be parallel to the main surface 11. However, from the viewpoint of satisfactorily bonding the bonding wire with an automatic machine, it is preferable that the terminal arrangement surface 31 is parallel to the main surface 11 as in the above embodiment.
　以上説明したように、本発明によれば、スクリーン印刷を用いて配線を容易に形成し得る発光素子搭載用基板、及び、それを用いた発光装置が提供され、照明分野等への利用が期待される。 As described above, according to the present invention, a light-emitting element mounting substrate on which wiring can be easily formed using screen printing, and a light-emitting device using the same are provided, and expected to be used in the lighting field and the like. Is done.
　１，２・・・発光素子搭載用基板
　５・・・基板本体
　１０・・・基体部
　１１・・・主面
　１５・・・溝
　２０・・・枠体部
　２１・・・上面
　２２・・・開口縁
　２２ａ・・・直線部位
　２２ｂ・・・曲線部位
　２３・・・内側面
　２３ａ・・・内側面の平面部位
　２３ｂ・・・内側面の曲面部位
　３０・・・延在部
　３１・・・端子配置面
　３２・・・配線配置面
　４０・・・配線導体
　４１・・・端子
　４２・・・内部配線
　４３・・・上面配線
　４４・・・接続用配線
　４５・・・固定用配線
　５０・・・発光素子
　５１・・・ボンディングワイヤ
　１００，２００・・・発光装置 DESCRIPTION OF SYMBOLS 1, 2 ... Light emitting element mounting substrate 5 ... Substrate main body 10 ... Base part 11 ... Main surface 15 ... Groove 20 ... Frame body part 21 ... Upper surface 22 ... Opening edge 22a ... Linear part 22b ... Curve part 23 ... Inner side surface 23a ... Plane part on inner side 23b ... Curve part on inner side 30 ... Extension part 31 ... Terminal Arrangement surface 32 ... Wiring arrangement surface 40 ... Wiring conductor 41 ... Terminal 42 ... Internal wiring 43 ... Upper surface wiring 44 ... Connection wiring 45 ... Fixing wiring 50 ... Light emitting element 51... Bonding wire 100, 200.

Claims (7)

  1. 　発光素子が搭載される素子搭載部を主面に有する平板状の基体部と、
    　前記素子搭載部を囲んだ状態で前記主面に設けられ、前記基体部と反対側が開口する環状の部材であって、開口縁が四角形のそれぞれの角が丸みを帯びる形状をなし、当該四角形の辺に相当する直線部位と当該四角形の角に相当する曲線部位とを有する枠体部と、
    　前記直線部位と接する前記枠体部の内側面に沿って当該直線部位と隣接する前記曲線部位から延在する延在部と、
    を備え、
    　前記延在部は、前記枠体部の開口面と前記基体部の前記主面との間に位置すると共に端子が配置される端子配置面と、前記曲線部位と前記端子配置面を接続すると共に配線が配置される配線配置面とを有し、
    　前記配線配置面は、前記配線配置面と接続される前記曲線部位から前記素子搭載部に向かう方向に傾斜する傾斜領域を有する
    ことを特徴とする発光素子搭載用基板。     A flat base portion having an element mounting portion on which a light emitting element is mounted on the main surface;
    An annular member that is provided on the main surface in a state of surrounding the element mounting portion and that opens on the opposite side to the base portion, and has an opening edge having a shape in which each corner of the quadrangle is rounded. A frame part having a straight line part corresponding to the side and a curved part corresponding to the corner of the rectangle;
    An extending part extending from the curved part adjacent to the linear part along the inner surface of the frame part in contact with the linear part;
    With
    The extension portion is located between the opening surface of the frame body portion and the main surface of the base portion, and connects a terminal arrangement surface on which terminals are arranged, and the curved portion and the terminal arrangement surface. A wiring arrangement surface on which wiring is arranged,
    The light emitting element mounting substrate, wherein the wiring arrangement surface has an inclined region inclined in a direction from the curved portion connected to the wiring arrangement surface toward the element mounting portion.
  2. 　前記傾斜領域において、前記配線配置面は凸面状とされる
    ことを特徴とする請求項１に記載の発光素子搭載用基板。     2. The light emitting element mounting substrate according to claim 1, wherein the wiring arrangement surface is convex in the inclined region.
  3. 　前記延在部を一対備え、
    　一方の前記延在部は、互いに対向する前記内側面の一部の一方に接して設けられ、
    　他方の前記延在部は、互いに対向する前記内側面の一部の他方に接して設けられる
    ことを特徴とする請求項１または２に記載の発光素子搭載用基板。     A pair of the extending portions,
    One of the extending portions is provided in contact with one of a part of the inner surfaces facing each other,
    3. The light emitting element mounting substrate according to claim 1, wherein the other extension part is provided in contact with the other of the part of the inner side surfaces facing each other.
  4. 　一方の前記延在部と他方の前記延在部とは、前記配線配置面から前記端子配置面に向かう方向が互いに逆方向とされる
    ことを特徴とする請求項３に記載の発光素子搭載用基板。     4. The light emitting element mounting device according to claim 3, wherein the one extending portion and the other extending portion have directions opposite to each other from the wiring arrangement surface toward the terminal arrangement surface. substrate.
  5. 　一方の前記延在部と他方の前記延在部とは、前記配線配置面から前記端子配置面に向かう方向が互いに同じ方向とされる
    ことを特徴とする請求項３に記載の発光素子搭載用基板。     4. The light emitting element mounting device according to claim 3, wherein the one extending portion and the other extending portion have the same direction from the wiring arrangement surface to the terminal arrangement surface. substrate.
  6. 　前記開口の外側から前記傾斜領域を通り前記端子配置面上まで延在する前記配線を更に備え、
    　前記端子配置面上の前記配線が前記端子とされる
    ことを特徴とする請求項１～５のいずれか１項に記載の発光素子搭載用基板。     The wiring further extending from the outside of the opening to the terminal arrangement surface through the inclined region,
    6. The light-emitting element mounting substrate according to claim 1, wherein the wiring on the terminal arrangement surface is used as the terminal.
  7. 　請求項６に記載の発光素子搭載用基板と、
    　前記素子搭載部に搭載される発光素子と、
    を備え、
    　前記発光素子の端子と前記発光素子搭載用基板の前記端子とが電気的に接続される
    ことを特徴とする発光装置。     The light emitting element mounting substrate according to claim 6;
    A light emitting element mounted on the element mounting portion;
    With
    A light emitting device, wherein a terminal of the light emitting element and the terminal of the light emitting element mounting substrate are electrically connected.
PCT/JP2014/080314 2013-12-03 2014-11-17 Light-emitting element mounting substrate and light-emitting device using same WO2015083527A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015551447A JP6002858B2 (en) 2013-12-03 2014-11-17 Light-emitting element mounting substrate and light-emitting device using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013250396 2013-12-03
JP2013-250396 2013-12-03

Publications (1)

Publication Number Publication Date
WO2015083527A1 true WO2015083527A1 (en) 2015-06-11

Family

ID=53273294

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/080314 WO2015083527A1 (en) 2013-12-03 2014-11-17 Light-emitting element mounting substrate and light-emitting device using same

Country Status (3)

Country Link
JP (1) JP6002858B2 (en)
TW (1) TW201532208A (en)
WO (1) WO2015083527A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108933185A (en) * 2017-05-26 2018-12-04 黄国益 Support construction uses its light emitting device and its processing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114244A (en) * 2009-11-28 2011-06-09 Kyocera Corp Element mounting body and light emitting body
JP2012089761A (en) * 2010-10-21 2012-05-10 Mitsubishi Chemicals Corp Light-emitting diode module and lighting device provided with the same
JP2013222931A (en) * 2012-04-19 2013-10-28 Shinko Electric Ind Co Ltd Package and method for manufacturing the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009059870A (en) * 2007-08-31 2009-03-19 Sanyo Electric Co Ltd Light emission module, and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114244A (en) * 2009-11-28 2011-06-09 Kyocera Corp Element mounting body and light emitting body
JP2012089761A (en) * 2010-10-21 2012-05-10 Mitsubishi Chemicals Corp Light-emitting diode module and lighting device provided with the same
JP2013222931A (en) * 2012-04-19 2013-10-28 Shinko Electric Ind Co Ltd Package and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108933185A (en) * 2017-05-26 2018-12-04 黄国益 Support construction uses its light emitting device and its processing method
CN108933185B (en) * 2017-05-26 2021-01-05 黄国益 Support structure, light emitting device using the same, and method of processing the same

Also Published As

Publication number Publication date
JPWO2015083527A1 (en) 2017-03-16
TW201532208A (en) 2015-08-16
JP6002858B2 (en) 2016-10-05

Similar Documents

Publication Publication Date Title
US10950759B2 (en) LED module
KR102449952B1 (en) Packages for mounting electrical components, array-type packages, and electrical devices
US8089092B2 (en) Semiconductor light emitting device
JP5748496B2 (en) LED module
KR20140108172A (en) Light emitting module
JP4863193B2 (en) Semiconductor light emitting device
JP6747799B2 (en) Optical element mounting package, optical element mounting mother board, and electronic device
US20100103651A1 (en) Led module and backlight unit having the same
JP6501564B2 (en) Light emitting device
TW201617662A (en) Electronic module
JP2013115116A (en) Led module
WO2013077199A1 (en) Package for housing electronic component, and electronic apparatus
US11393962B2 (en) Optoelectronic semiconductor component and assembly having an optoelectronic semiconductor component
JP2004288937A (en) Package for accommodating light emitting element and light emitting device
JP2005191111A (en) Package for storing light emitting element, and light emitting device
JP6149727B2 (en) Light emitting device and manufacturing method thereof
JP6002858B2 (en) Light-emitting element mounting substrate and light-emitting device using the same
JP4945416B2 (en) Light emitting module and manufacturing method thereof
JP2010067902A (en) Light-emitting device
JP2006156643A (en) Surface-mounted light-emitting diode
JP6611795B2 (en) LED package, light emitting device, and manufacturing method of LED package
JP2014146846A (en) Chip type light emitting element
JP6028443B2 (en) Light emitting device
WO2023162846A1 (en) Optical waveguide substrate, optical waveguide package, and light source module
JP4954664B2 (en) Light emitting element mounting substrate, light emitting element mounting package, and surface light source device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14867927

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2015551447

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14867927

Country of ref document: EP

Kind code of ref document: A1