WO2015078632A1 - Trageinrichtung für eine optische vorrichtung, optische vorrichtung und lithographieanlage - Google Patents
Trageinrichtung für eine optische vorrichtung, optische vorrichtung und lithographieanlage Download PDFInfo
- Publication number
- WO2015078632A1 WO2015078632A1 PCT/EP2014/072021 EP2014072021W WO2015078632A1 WO 2015078632 A1 WO2015078632 A1 WO 2015078632A1 EP 2014072021 W EP2014072021 W EP 2014072021W WO 2015078632 A1 WO2015078632 A1 WO 2015078632A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solid
- state
- carrying device
- spring elements
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Definitions
- the invention relates to a support device for an optical device, an optical device and a lithography system.
- lithography equipment is used in the fabrication of integrated circuits (ICs) to image a mask pattern in a mask onto a substrate, such as a silicon wafer.
- a signal generated by an optical system light beam is directed ge ⁇ through the mask onto the substrate.
- EUV lithography systems are currently being developed which use light with a wavelength in the range from 5 nm to 30 nm, in particular 13.5 nm.
- EUV stands for "Extreme Ultra Violet ".
- In such lithography systems must because of the high Absorp ⁇ tion of most materials of light of this wavelength reflective Opti ⁇ ken, meaning mirror, instead of - as before - breaking optics, ie lenses are used.
- the mirror in the form of so-called mirror fields provide that can accommodate a few hundred thousand to mirror ⁇ .
- the mirrors can each be tilted about one or two mutually perpendicular axes in order to direct the light in a suitable way towards the substrate to be exposed.
- the one on each mirror on ⁇ light incident requires a heat input into this. This heat input can lead to impairment or damage to the corresponding mirror.
- a corresponding ⁇ the mirror by means of thermally conductive elements to a heat sink to bind ⁇ ver.
- the thermally conductive elements contribute here not or only slightly to the storage of the mirror.
- the thermally conductive elements are formed as leaf springs.
- an actuator for tilting the corresponding mirror must work against the rigidity of these Blattfe ⁇ countries. According much electrical energy has to be supplied to the actuator ⁇ . The resulting power loss of the actuator is delivered in the form of heat, which must be compensated by appropriate cooling.
- One object of the present invention is to provide an improved tra ⁇ g adopted for an optical device, which in particular allows the adjustment of an optical element with a lower force and correspondingly lower power loss.
- a support device for an optical device which has a first and second support element and a first and second solid-state joint.
- the first and second solid-state joints each connect the first and second support elements to one another in a thermally conductive manner.
- the first and second solid-state articulations keep the first support element movable relative to the second support element in at least one first direction. In ei ⁇ ner movement of the first support member relative to the second support member in the first direction, spring forces generated by the first and second solid-body articulation partially or completely cancel each other.
- solid-body joint spring means to verste ⁇ hen which or- a relative movement between the first and second Tragele ⁇ ment by bending is presentsammlungr- permitted by elastic deformation.
- the elastic deformation of the solid-body joint so moves with the Relativbewe ⁇ supply accompanied.
- first and / or more second solid joints It can be provided a plurality of first and / or more second solid joints. In one embodiment, two first solid joints and one second solid joint are provided.
- the first and second support element are preferably each designed as a rigid body ⁇ forms.
- the first solid-body joint has a positive spring stiffness and the second solid-state joint has a negative spring stiffness.
- the spring stiffness c is defined as
- the spring elements of the first and / or second solid-state joint are biased in the second direction.
- the positive and / or negative spring stiffness can be influenced appropriately Wei ⁇ se or achieved.
- the spring elements of the first solid-body joint extend straight in the second direction. Additionally or alter natively ⁇ the spring elements of the second solid-body joint have a ent ⁇ oriented in or opposite to the first direction buckling. This measure also allows the positive and negative spring stiffness to be suitably adjusted.
- the spring elements of the first solid-state joint are in tension and the spring elements of the second solid-state element body joint on pressure loaded. Also by this measure, the positive and negative spring stiffness can be adjusted appropriately.
- two first Fest stresses- are at least joints and provided at least a second solid-state articulation, wherein the second solid-state articulation between the at least two first solid-body joints ⁇ is arranged to ⁇ minimum.
- the solid-state joints are arranged one behind the other in the first direction, so that the following order results in the first direction: first solid-state joint, second solid-state joint, first solid-state joint.
- the first and second solid-state articulated joints are each designed as equal-force springs.
- the spring forces generated by the first and second Festissonge ⁇ steering raise over a part of the movement of the first support member relative to the second support member completely.
- at least a portion of the first support element is arranged between a first and a second portion of the second support element.
- the at least one portion of the first Tragele ⁇ ment is supported on one side by means of the first solid-body joint of the ers ⁇ th segment and the other side by the second solid-state articulation on the second section.
- the first and second portions of the second Tragele ⁇ ment need not necessarily be connected to each other.
- One or more third solid-state joints can be provided, which guide the movement of the first support element in the first direction.
- This or their spring elements may extend in a second direction transverse to the first direction.
- the spring elements of the first and / or second solid-state joint extend in the first direction.
- this is meant that at least a beginning and an end of a respective Federele ⁇ ments lie on a line extending in the first direction stretch.
- At least two spring elements of the first and / or second solid-state joint are arranged symmetrically relative to one another.
- the axes of symmetry of the first and second solid-state joints may be arranged coaxially.
- Two spring elements of the first and / or second solid-state joint can be provided with a zueinan ⁇ the symmetrical buckling.
- the movement of the first Tragele ⁇ ment relative to the second support element is a linear movement.
- the movement of the first support element relative to the second support element is a rotary movement or a rotary and linear movement.
- the spring elements of the first and / or solid-body joint each have a ratio of thickness to length and Prei ⁇ te or thickness and width to length of at least 1 ⁇ 10.
- the ratio is at least 1:50 or at least 1: 100. Due to the Thickness such spring elements have only a small surface inertia ⁇ moment, which is why a force for actuation of the first support member can be seen low ⁇ before.
- the thickness is very small in relation to the length and the width.
- both the thickness and the width are very small in relation to the length.
- the spring elements are rod, wire or foil-shaped. Such spring elements have a low FLAE ⁇ chenträgheitsmoment.
- the spring elements are arranged spaced from each other. That is, between the spring elements is a gap, in particular an air gap.
- a gap in particular an air gap.
- the effect is that the sti ⁇ stiffness CEin Swissig a one-piece spring element is significantly greater than The slope stiffness cvieizahi one of a plurality n individual spring elements constructed Fe ⁇ derelements with the same total height h:
- the first, second and / or third solid-body joint are adapted in the supporting means by means of the gela ⁇ siege optical element to supply heat introduced to a heat sink.
- the first and / or second solid-state articulation ⁇ metal in particular copper, silver and / or gold, on. This achieves a high conductivity of the solid-state joints.
- an optical device comprises an optical element and at least one support device, as described above.
- the first support element is coupled to the optical element, and the second support element is provided fixed to the frame.
- the second support element thus forms a base.
- the second support element forms a heat sink into which the heat is conducted from the optical element via the first and second solid-state joint.
- a lithography system particularly an EUV lithography apparatus, comprising at least one support means, as described above, or at least one optical device, as above beschrie ⁇ ben provided.
- the carrying device can have a plurality of first and second supporting elements or a plurality of first and second solid-state articulations.
- FIG. 1 shows a sectional view of a supporting device according to an exporting ⁇ approximately example
- FIG. 2 is a perspective view of a film stack for use in a carrying device of FIG. 1;
- FIG. 2 is a perspective view of a film stack for use in a carrying device of FIG. 1;
- Fig. 3 shows a force-displacement diagram for the support device of Fig. L;
- FIG. 4 shows a sectional view of a carrying device according to a further exemplary embodiment
- Fig. 5 shows a force-displacement diagram for the carrying device of Fig. 4;
- FIG. 6 shows a sectional view of an optical device in a lithographic system according to an embodiment
- FIG. 7 shows a lithography system according to an exemplary embodiment.
- Fig. 1 shows a supporting device 100 as well as parts of an optical shown in FIG. 6, see device 600.
- the optical device 600 can be used at a ge ⁇ shown in Fig. 7 EUV lithography installation 700.
- the carrying device 100 comprises a first carrier element 102 and a second carrier element 104.
- the first carrier element 102 is opposite the second trapezoidal element 102. provided 104 in a first direction x movably provided.
- the second Tra ⁇ gelement 104 is provided fixed to the frame and therefore forms a stationary base.
- the first support element 102 is coupled to an optical element 106, for example, by means of a dashed line mechanism 105.
- opti ⁇ rule element 106 may, for example, be a mirror for reflec ⁇ ren light 108th
- the optical element 106 may be an integral part of the first support element 102 in another embodiment .
- the support means 100 further comprises two first solid-body joints 110 and a second flexure hinge 112.
- the second solid-state articulation 112 is ge ⁇ Gurss the embodiment between the first solid-body joints 110 at ⁇ ordered, although here there are other possibilities for the arrangement.
- the solid-state joints 110, 112 respectively connecting the first support member 102 thermally conductively connected to the second support member 104.
- the heat first flows through the mechanism 105 into the first support element 102 and is guided from there by means of the solid state joints 110, 112 into the second support element 104, which acts as a heat sink.
- Fig. 2 shows this, a section A of FIG. 1.
- the first solid-body joint 110 has a multiplicity of spring elements 200, which are each in the form of a foil. That is, a thickness D of each spring element 200 is much smaller than its length L and width B. For example, the ratio of the thickness D to the length L and width B 1 ; 10 or more.
- Such very thin films can be made for example of steel, silicon, copper, silver or gold, ie materials with egg ⁇ ner high specific thermal conductivity.
- the thermal resistance of a single spring element 200 is nevertheless high due to the small cross-section with a large length. Used by the plurality of Federelemen- th 200 for example at least 2, at least 10 or at least 20 in a stack, however, results for the first solid-body joint 110 overall clotting ⁇ ger thermal resistance. At the same time, such a stack has a low bending stiffness, as explained in more detail above.
- the spring elements 200 each extend in a second direction y perpendicular ⁇ right to the first direction x.
- the spring elements 200 are arranged parallel to one another on ⁇ , ie they are perpendicular to their respective planar extension vonei ⁇ spaced apart, and therefore each form a gap 202 with each other.
- the gap 202 prevails in operation of the support device 100, for example, a high vacuum.
- the spring elements 200 can connect via a soldering point 204 to the second Tragele ⁇ ment 104. Soldering or brazing in particular comes into question here.
- the attachment of the spring elements 200 may be provided on the second Tra ⁇ ge element 104 via a crimping.
- the opposite end of the solid state joint 110 may be secured to the first support member 102 by means of solder (or crimping).
- An actuator 114 is adapted to be adjusted in response to a not shown control device 102 in the first support member and opposite to the first direction X ⁇ Rich.
- the actuator 114 may be formed as an electromechanical or piezoelectric actuator.
- the actuator 114 brings an operating force FB on the Tragele ⁇ element 102 in the (positive) first direction x on. This acts on a Actu ⁇ supply of the support member 102 from the initial position shown in Fig. 1 (also referred to as rest position) against a reaction force FR. This results from the sum of the reaction forces of the solid-state joints 110, 112. This is illustrated by the following example ⁇ reference to FIG. 3, which shows a force-distance diagram.
- the first direction x is plotted on the ordinate As can be seen, the force F in Fig. 1, the positive direction of the force F x is opposite to the po ⁇ sitiven adjustment path oriented.
- the spring elements 200 of the first solid-body joints 110 extend in ih ⁇ rem undeflected state just in a second direction y perpendicular to the first direction x.
- the first two solid-body joints 110 perform the adjusted outside ⁇ movement of the first support member 102 and are provided with a positive Federsteifig- ness Cpos. That is, the reaction force of the first Fno Festkör ⁇ pergelenke 110 to tend to a position xi in the positive direction of the push back first support member 102 in the starting position.
- the Federele ⁇ elements 200 act as leaf springs.
- the second solid-body joint 112 generates a reaction force F112, which acts in the negative direction of the force F and, for this purpose, has a negative spring stiffness Cneg when the first support element 102 is moved to the position xi.
- the second solid-state articulation 112 x supports an off ⁇ steering the first support member 102 in the positive direction of the actuation by the actuator 114.
- the force generated by the second solid-state articulation 112 F112 acts in the same direction as the actuating force FB.
- the spring elements 200 of the second solid-body joint 112 may lie in their unluckled state with their opposite ends 118 on a straight line in the second direction y, but in an intermediate region a buckling 120 against the (positive ) first direction x.
- the buckling 120 results from the fact that the second solid-state joint 112 or its spring elements 200 are biased to pressure. Accordingly, the first solid-state joints 110 and their spring elements 200 are biased to train.
- the forces Fno and F112 the solid-state joints 110 ⁇ lift 112 partially, so that a resultant reaction force FR at a displacement xi is less than the force Fno.
- the energy released from the bias of the second solid state joint 112 is used to deform the first solid state joints 110.
- the actuating force FB is smaller for the deformation of the latter.
- the reaction force FR may for example be slightly positive, so that it tends to réellezustel ⁇ the first support member 102 in the initial position, that acts in the positive direction.
- a supporting device 100 is subsequently illustrated in accordance with a white ⁇ direct embodiment.
- the first support element 102 comprises a section 400 which extends between two sections 402, 404 of the second support element 104.
- the section 400 is supported on its one side 406 via the first Festkör ⁇ pergelenk 110 on the portion 402 and its other side 408 on the second solid-body joint 112 at the second section 404 from.
- the Fe ⁇ countries 200 of the solid-state joints 110, 112 lie in the first direction x, so that in particular ⁇ sondere endpoints 118 of a respective spring element 200 on a straight line in the first direction x extending.
- the solid state joints 110, 112 may miteinan ⁇ the coaxial axes of symmetry 410 have.
- the spring elements 200 can each bend outward from the axis of symmetry 410 and for this purpose have a corresponding buckling 412. Two spring elements 200 can be seen with respect to the symmetry axis 410 symmetrical buckles 412, 412 'before ⁇ .
- the solid-state joints 110, 112 are formed as equal force springs according to the embodiment of FIG. 4 so that cancel of these forces generated in Re ⁇ action on a display of the first support member 102 from its output ⁇ position by means of the actuator 114 to each other. This is illustrated below with reference to FIG. 5.
- the forces Fno and F112 are the same size and thus cancel each other out.
- the operating force FB of the actuator 114 acts upon adjustment of the first support member 102 in the first direction x no of the deformation of the solid-state joints 110, 112 resulting counter-force counter ⁇ from its initial position.
- the starting position is selected, for example, as position xi.
- the actuator 114 has a lower power consumption and a lower heat dissipation. Also, the actuator 114 can be made smaller.
- third solid-state joints 414, 416 can be provided, which guide the adjustment movement of the first support element 102 relative to the second support element 104.
- ver ⁇ binds the third solid-body joint 414, the support member 102 with the portion 402, and the third solid-body joint 416 connects the first supporting member 102 to the second portion 404.
- the solid-state joints 414, 416 each include ⁇ wells a plurality of spring elements 200, which in their undeflected state extend straight in the second direction y.
- the solid-state joints 414, 416 are designed to transport as much heat as possible from the first support element 102 to the second support element 104. With regard to their spring elements 200 and the film stack formed by these, this applies in connection with FIGS. 1 and 2.
- FIG. 6 now shows a possible application of the carrying devices 100 explained in FIGS. 1 to 5.
- two of the carrying devices 100 are used in the optical device 600 to pivot an optical element 106.
- the optical device 600 may be for example a mirror array, the illustrated optical element 106 forms a mirror of this Spie ⁇ gel array.
- the optical element 106 is mounted relative to the second support element 104 by means of the bearing 601, which is designed, for example, as a rotary joint, in particular a ball joint.
- a pivot point is preferably as near as possible to the optical ⁇ rule element 106 or within the same.
- the first support members 102 of a respective supporting device 100 are connected via ei ⁇ NEN mechanism 105 with the optical element 106th
- a respective mechanism 105 comprises a joint 602 and a third support element 604.
- the joint 602 connects the first support element 102 to the third support element 604, which in turn is connected in an articulated manner in a manner not shown to the optical element 106.
- the joints 602 are formed, for example, as hinges.
- the joints 602 may be designed as solid-state joints in ⁇ particular with a low thermal resistance.
- the Ge ⁇ joints 602 may have for this purpose metal.
- a tilting movement of the opti ⁇ rule element 106 can be achieved, wherein the linear movements of the first Tra ⁇ giata 102 are converted in the first direction x in a rotational movement of the optical element 106 about the z-direction.
- the third support elements 604 may extend obliquely in the xz plane, so that in addition a rotational ⁇ movement of the optical element 106 is achieved about the y-direction.
- FIG. 7 shows a lithography system 700, in particular an EUV lithography system, in which one or more of the carrying devices 100 according to FIGS. 1 to 5 or one or more of the optical devices 600 according to FIG. 6 can be used.
- the Trageinrich ⁇ processing 100 and / or the optical device 600 could also be used in other lighting ⁇ or projection applications.
- the lithography system 700 includes a light shaping unit 702, an illumination system 704 and a projec ⁇ onsêtiv 706.
- the light (work light) from the light shaping unit 702, wel ⁇ ches in Fig. 7 are partially represented as beam path, for example, in illumination system 704 are directed to mirrors of a mirror array 708 which reflect the light onto mirrors of a mirror array 710.
- a reticle 712 is illuminated.
- the light is thereafter directed in projek ⁇ tion objective 706 onto a substrate 714 so that the structure contained in the reticle 712 is imaged on the substrate decreases 714th
- the support means 100 and / or the optical device 600 can now find ⁇ play, in the mirror arrays 708, 710 application to movable, particularly tiltable store individual mirrors.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016534645A JP6596419B2 (ja) | 2013-11-27 | 2014-10-14 | 光学装置用支持装置、光学装置及びリソグラフィーシステム |
| US15/156,602 US9846370B2 (en) | 2013-11-27 | 2016-05-17 | Support apparatus for an optical device, optical device and lithography system |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013224292.1 | 2013-11-27 | ||
| DE102013224292.1A DE102013224292A1 (de) | 2013-11-27 | 2013-11-27 | Trageinrichtung für eine optische Vorrichtung, optische Vorrichtung und Lithographieanlage |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US15/156,602 Continuation US9846370B2 (en) | 2013-11-27 | 2016-05-17 | Support apparatus for an optical device, optical device and lithography system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015078632A1 true WO2015078632A1 (de) | 2015-06-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2014/072021 Ceased WO2015078632A1 (de) | 2013-11-27 | 2014-10-14 | Trageinrichtung für eine optische vorrichtung, optische vorrichtung und lithographieanlage |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9846370B2 (de) |
| JP (1) | JP6596419B2 (de) |
| DE (1) | DE102013224292A1 (de) |
| WO (1) | WO2015078632A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016217735A1 (de) * | 2016-09-16 | 2018-03-22 | Carl Zeiss Smt Gmbh | Komponente für eine Spiegelanordnung für die EUV-Lithographie |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008049556A1 (de) * | 2008-09-30 | 2010-04-01 | Carl Zeiss Smt Ag | Mikrolithographische Projektionsbelichtungsanlage |
| WO2010089526A2 (en) * | 2009-02-09 | 2010-08-12 | Cambridge Mechatronics Limited | Shape memory alloy actuation apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6064505A (en) * | 1998-11-16 | 2000-05-16 | Eastman Kodak Company | Method and apparatus for movably supporting a reflecting member of a focusing apparatus |
| JP2005275270A (ja) * | 2004-03-26 | 2005-10-06 | Toshiba Corp | レンズ鏡筒および撮像装置 |
| JP4596249B2 (ja) * | 2005-02-15 | 2010-12-08 | ソニー株式会社 | レンズユニット及び撮像装置 |
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2013
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2014
- 2014-10-14 JP JP2016534645A patent/JP6596419B2/ja active Active
- 2014-10-14 WO PCT/EP2014/072021 patent/WO2015078632A1/de not_active Ceased
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2016
- 2016-05-17 US US15/156,602 patent/US9846370B2/en active Active
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| DE102008049556A1 (de) * | 2008-09-30 | 2010-04-01 | Carl Zeiss Smt Ag | Mikrolithographische Projektionsbelichtungsanlage |
| US20110181852A1 (en) | 2008-09-30 | 2011-07-28 | Carl Zeiss Smt Gmbh | Microlithographic projection exposure apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2016540247A (ja) | 2016-12-22 |
| US9846370B2 (en) | 2017-12-19 |
| DE102013224292A1 (de) | 2015-05-28 |
| US20160259249A1 (en) | 2016-09-08 |
| JP6596419B2 (ja) | 2019-10-23 |
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