WO2015068651A1 - 電気伝導素子、電子装置及び電気伝導素子の動作方法 - Google Patents
電気伝導素子、電子装置及び電気伝導素子の動作方法 Download PDFInfo
- Publication number
- WO2015068651A1 WO2015068651A1 PCT/JP2014/079047 JP2014079047W WO2015068651A1 WO 2015068651 A1 WO2015068651 A1 WO 2015068651A1 JP 2014079047 W JP2014079047 W JP 2014079047W WO 2015068651 A1 WO2015068651 A1 WO 2015068651A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- graphene
- oxide
- element according
- material layer
- band gap
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 193
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 190
- 239000000463 material Substances 0.000 claims abstract description 59
- 239000010416 ion conductor Substances 0.000 claims abstract description 53
- 239000001301 oxygen Substances 0.000 claims abstract description 52
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 52
- 239000001257 hydrogen Substances 0.000 claims abstract description 32
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 32
- -1 hydrogen ions Chemical class 0.000 claims description 60
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 39
- 230000008859 change Effects 0.000 claims description 25
- 238000003487 electrochemical reaction Methods 0.000 claims description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 12
- 229910044991 metal oxide Inorganic materials 0.000 claims description 12
- 150000004706 metal oxides Chemical class 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 229910002076 stabilized zirconia Inorganic materials 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 3
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 3
- 229910021526 gadolinium-doped ceria Inorganic materials 0.000 claims description 3
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 3
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 3
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- UQSQSQZYBQSBJZ-UHFFFAOYSA-N fluorosulfonic acid Chemical compound OS(F)(=O)=O UQSQSQZYBQSBJZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 2
- 239000003014 ion exchange membrane Substances 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 23
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 54
- 238000005259 measurement Methods 0.000 description 13
- 230000003247 decreasing effect Effects 0.000 description 9
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 7
- 238000004549 pulsed laser deposition Methods 0.000 description 7
- 229910052720 vanadium Inorganic materials 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920000557 Nafion® Polymers 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 239000002322 conducting polymer Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000002847 impedance measurement Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 230000005355 Hall effect Effects 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 230000001443 photoexcitation Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 239000011240 wet gel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1606—Graphene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78684—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/50—Bistable switching devices
Definitions
- the present invention relates to electrical conduction that operates by controlling the band gap and electrical resistance of graphene and graphene oxide (GO) by causing an electrochemical reaction by movement of hydrogen ions or oxygen ions in a solid.
- the present invention relates to an element, an electronic device using such an electrically conductive element, and a method for operating such an electrically conductive element.
- Graphene-based materials such as graphene and its derivative graphene oxide are expected to realize new functions and performance that cannot be obtained by conventional semiconductor materials typified by silicon.
- Graphene refers to one layer of graphite having a layered structure of carbon atoms, and a derivative in which an oxygen atom is bonded to graphene is referred to as graphene oxide. Since this graphene-based material is ultimately a thin two-dimensional material, it becomes possible to construct a switching device of an ultrathin conduction channel that cannot be obtained by a conventional silicon semiconductor transistor.
- graphene-based materials are attracting attention as various electronic device materials such as high-frequency transistors and quantum devices because they exhibit unique characteristics such as very high electron mobility and quantum Hall effect.
- Non-Patent Documents 1, 2, 3, 4 A method using graphene has been proposed (Non-Patent Documents 1, 2, 3, 4).
- An object of the present invention is to use graphene and graphene oxide electrons by using an ion conductor material in which hydrogen ions (H + : also referred to as protons) or oxygen ions (O ⁇ 2 : also referred to as oxide ions) move in a solid. It is possible to change the electric resistance by controlling the band gap which is a state, and to provide an all-solid-state element in which the control of the band gap and the change in electric resistance are nonvolatile.
- an ion conductor material layer having an ion conductor capable of conducting hydrogen ions or oxygen ions, a gate electrode layer sandwiching the ion conductor material layer, and an insulator substrate are stacked.
- an electrically conductive element provided with a graphene oxide layer or a graphene-based material layer having graphene, and a drain electrode layer and a source electrode layer provided on the surface of the graphene-based material layer, an interlayer thereof, or the insulator substrate .
- a buffer layer may be provided between the drain electrode layer and the source electrode layer and the ion conductor material layer.
- a means for applying a voltage between the gate electrode layer and the source electrode layer or the drain electrode layer, and the application of a voltage by the means causes hydrogen ions or oxygen ions in the ion conductor material layer.
- the band gap which is the electronic state of the graphene-based material layer, changes due to the separation and application of oxygen atoms accompanying the electrochemical reaction, and accordingly the conductivity between the drain electrode and the source electrode changes. May be configured to be provided.
- the ion conductor material may include a metal oxide or polymer compound having hydrogen ions.
- the metal oxide includes yttrium-added stabilized zirconia (Zr 1-x Y x O 2-x / 2 (0 ⁇ x ⁇ 0.2)) and BaZr 0.8 Y 0.2 O 3-x (0 ⁇ X ⁇ 0.2) may be selected.
- the polymer compound may be a proton-conducting polymer compound, particularly Nafion (registered trademark).
- the ion conductor material may contain oxygen ions.
- the metal oxide includes gadolinium-doped ceria having oxygen ions (Ce 1-x Gd x O 2 ⁇ x / 2 (0 ⁇ x ⁇ 0.5)), stabilized zirconia, stabilized bismuth oxide, tungsten oxide And at least one selected from the group consisting of zinc oxide and tin oxide.
- the gate electrode, the source electrode and the drain electrode may include at least one selected from the group consisting of platinum, palladium, rhodium and ruthenium.
- the buffer layer may include at least one selected from the group consisting of tantalum oxide, aluminum oxide, hafnium oxide, and zirconia oxide.
- the insulator or semiconductor material may include at least one selected from the group consisting of metal oxides such as strontium titanate, silicon oxide, and aluminum oxide.
- an electronic device including any one of the above-described electric conductive elements.
- a first step of applying a voltage to the gate electrode layer to change a band gap of the graphene-based material layer in a non-volatile manner, and then the gate electrode A second step of performing a volatile operation by applying a voltage having a magnitude in a range that does not change the band gap to the gate electrode layer, and operating any one of the above-described electrically conductive elements, A method of operating an electrically conductive element is provided.
- a third step of applying a voltage to the gate electrode layer to change the band gap of the graphene-based material layer in a non-volatile manner again may be included.
- the separation or addition of oxygen atoms occurs in graphene oxide or graphene by applying a voltage to the gate electrode, and the effect thereof changes the band gap of the electronic state of graphene oxide or graphene, and the surface of graphene oxide or graphene It is possible to change the electrical resistance between the drain electrode and the source electrode constructed above. Since the separation and application of oxygen in graphene oxide or graphene hardly proceed when no voltage is applied, the element of the present invention can be operated in a nonvolatile manner without a special structure. In addition, an all-solid-type structure that can be easily mixed with conventional electronic elements, and an element with excellent durability can be realized. Further, since no electrolyte solution is used, there are no problems such as freezing, evaporation or boiling of the electrolyte solution at low or high temperatures, which is advantageous when operating in a wide temperature range.
- FIG. 6 shows a crystal structure of graphene oxide.
- FIG. 6 is a graph showing the relationship between the ionic conductivity and temperature of yttrium-doped zirconia produced under various conditions in the device of the example of the present invention.
- the figure which shows the switching current which flows After a voltage of 2.3 V is applied to the gate electrode of the device according to the embodiment of the present invention, a voltage of 0.5 V and ⁇ 0.5 V is alternately applied to the gate electrode, so that the voltage between the source electrode and the drain electrode is increased. The figure which shows the switching current which flows. After a voltage of ⁇ 1.0 V is applied to the gate electrode of the device of the embodiment of the present invention, a voltage of 0.5 V and ⁇ 0.5 V is alternately applied to the gate electrode, thereby causing a gap between the source electrode and the drain electrode. The figure which shows the switching current which flows in.
- the element of this embodiment has a three-terminal electrode structure.
- this element includes an ion conductor material layer having an ion conductor 5 to which hydrogen ions or oxygen ions 8 can move, and this ion conductor material layer (ion conductor 5) as a gate. It has a stacked structure sandwiched between an electrode 1 and a graphene oxide or graphene-based material layer having graphene oxide or graphene 6 coated on an insulator substrate 7.
- a drain electrode 2 and a source electrode 3 are formed on the surface of a graphene-based material layer (graphene oxide or graphene 6) to which oxygen atoms 9 are bonded, and further, between the drain electrode 2 and the source electrode 3 and the ion conductor 5 Then, the buffer layer 4 is formed.
- graphene oxide as shown in FIG. 1B, there are an Sp 2 bonding region where oxygen atoms are not bonded and an Sp 3 bonding region where oxygen atoms are bonded.
- the Sp 2 bonding region shows metallic electrical conductivity
- the Sp 3 bonding region shows semiconductor or insulating electrical conductivity.
- FIG. 1A and the subsequent conceptual diagrams conceptually show the structure of the three-terminal element according to this embodiment or the structure of the element created for examining the characteristics thereof, the actual structure is shown in these drawings. It is not necessary to be completely similar to the structure shown, and elements not explicitly shown in these figures can be added or replaced with other equivalent elements.
- the gap between the gate electrode 1 and the drain electrode 2 is shown to be equal to the gap between the gate electrode 1 and the source electrode 3, but the gaps are configured to be different as necessary.
- the drain electrode 2 and the source electrode 3 are provided on the surface of graphene oxide or graphene 6, they can be formed between the graphene oxide or graphene 6 and the insulator substrate 7 as necessary. In the case where multilayer graphene oxide or graphene 6 is used, the drain electrode 2 and the source electrode 3 can also be formed between the multilayer graphene oxide or graphene 6 layers.
- the ion conductor 5 having hydrogen ion conductivity compounds capable of conducting various hydrogen ions can be used.
- yttrium-added stabilized zirconia Zr 1-x Y x O 2-x / 2 (0 ⁇ x ⁇ 0.2)
- This Zr 1-x Y x O 2 ⁇ x / 2 is known that hydrogen ions (protons) move in the range from about 475 K to about room temperature in the solid (Non-patent Document 5).
- the thickness of the ion conductor 5 is preferably about 5 nm to 1000 nm, and particularly preferably in the range of 10 to 100 nm.
- BaZr 0.8 Y 0.2 O 3-x (0 ⁇ x ⁇ 0.2)
- a polymer ion having a complex containing perfluorosulfonic acid in a vinyl fluoride polymer for example, BaZr 0.8 Y 0.2 O 3-x (0 ⁇ x ⁇ 0.2), and further, a polymer ion having a complex containing perfluorosulfonic acid in a vinyl fluoride polymer.
- An exchange membrane in particular, a proton-conductive polymer compound such as Nafion (registered trademark of EI DuPont de Nemours and Company) can also be used.
- Proton-conducting polymer compounds such as Nafion are substances that should be called polymer compounds that incorporate a large amount of water molecules into the structure, as is well known, but can cause liquid leakage such as electrolytes and wet gels. There is no problem because it is considered as a solid.
- the material of the ion conductor 5 having oxygen ion conductivity compounds capable of conducting various oxygen ions can be used.
- oxygen ion conductive gadolinium-doped ceria (Ce 1-x Gd x O 2-x / 2 (0 ⁇ x ⁇ 0.5)) can be used.
- the thickness of the ion conductor 5 is preferably about 5 nm to 1000 nm, and particularly preferably in the range of 10 to 100 nm.
- the material of the ion conductor other than Ce 1-x Gd x O 2 -x / 2 can be used, specifically, stabilized zirconia, stabilized bismuth oxide, tungsten oxide having oxygen defects, Metal oxides such as zinc oxide or tin oxide can be used.
- various additives can be added to the ionic conductor. For example, gadolinium-added ceria can be considered to be obtained by adding gadonium to ceria having a small amount of oxygen defects in order to increase oxygen defects.
- the thickness of the electrode is preferably about 10 nm to 100 nm, and particularly preferably in the range of 10 to 30 nm.
- the gate electrode 1, the drain electrode 2, or the source electrode 3 can be selected in addition to Pt. Specifically, it is a noble metal with high chemical stability selected from platinum, gold, palladium, rhodium, ruthenium, and some of their alloys.
- the buffer layer 4 for example, tantalum oxide (Ta 2 O 5 ) can be used.
- the thickness of the buffer layer is preferably about 0.1 nm to 10 nm, and particularly preferably in the range of 1 to 5 nm.
- the buffer layer can be selected other than tantalum oxide. Specifically, aluminum oxide, hafnium oxide, zirconia oxide, or the like can be used.
- graphene oxide or graphene 6 included in the graphene-based material layer not only a single layer of graphene oxide or graphene but also a stacked layer of at least one of them can be used.
- the oxygen content in the graphene oxide (expressed as an atomic ratio (%) of oxygen / (oxygen + carbon)) is 0 to 50% with respect to 100% of the atomic ratio of the entire graphene oxide, and is 5 to 50%. A range of degree is desirable.
- graphene oxide may include a Sp 2 bonding region in which oxygen atoms are not bonded and a Sp 3 bonding region in which oxygen atoms are bonded. It may be bonded to any atom.
- the “graphene-based material layer” and “graphene” of the element of this embodiment include not only graphene that is not bonded to other elements but also graphene oxide or a material having a lower or lower oxygen content.
- “Graphene oxide or graphene” means that, when looking at the configuration of the specific device according to the present embodiment, only one of graphene oxide and graphene is used, or it has a specific fixed oxygen content. Note that this does not mean that. For example, even if graphene is used at the time of manufacturing this device, graphene oxide can be obtained if oxygen atoms are given to graphene by operating the device, and vice versa.
- graphene oxide or graphene in the present application may be either “graphene oxide” or “graphene”, and may change dynamically between the two and / or is called graphene oxide It should be noted that even in the same respect, it means a substance whose oxygen content can change dynamically.
- the material of the insulator substrate 7 is preferably a metal compound such as a metal oxide, specifically, strontium titanate, silicon oxide, or aluminum oxide.
- FIG. 2 shows a state in which transition is possible by applying voltages between the gate electrode 1 and the source electrode 3 and between the drain electrode 2 and the source electrode 3 in the three-terminal element shown in FIG. 1A. Show.
- V gs when a positive polarity V gs is applied, in the case of hydrogen ions having a positive polarity, it approaches the graphene oxide or graphene side interface, and in the case of oxygen ions having a negative polarity, graphene oxide or graphene Move away from the side interface.
- This V gs varies depending on the ionic conductivity of hydrogen ions or oxygen ions in the solid electrolyte, but considering practicality, it is preferably about 0.5 to 10 V, more preferably about 2 to 3 V, and particularly preferably about 3 V.
- the application time is preferably about 100 nanoseconds to 100 seconds.
- the movement of the hydrogen ions or oxygen ions 8 in the ion conductor 5 causes the oxygen atoms 9 bonded to the graphene oxide or graphene 6 to be detached or imparted, whereby the graphene oxide or graphene 6 Controls the band gap and electrical resistance of the electronic state.
- a voltage is applied to the gate electrode 1 to change the band gap of the graphene-based material layer in a non-volatile manner (first step).
- the non-volatile (non-volatile) change refers to a change in which the change in the band gap due to the application of the voltage is not erased even when the application of the external voltage is stopped.
- a voltage having a magnitude that does not change the band gap is applied to the gate electrode 1 (second step).
- a volatile operation is performed on the electrically conductive element.
- a volatile operation (volatile operation) refers to an operation in which the influence of voltage application is eliminated when voltage application is stopped.
- the operation method of the electroconductive element of the present embodiment may include a step of applying a voltage to the gate electrode 1 to change the band gap of the graphene-based material layer again in a non-volatile manner after the first step.
- Good third step.
- These first to third steps may be performed a plurality of times or may be combined in a different order.
- a three-terminal element whose structure is conceptually shown in FIG. 1A was produced, and the change in electrical conductivity between the drain electrode 2 and the source electrode 3 when a voltage was applied to the gate electrode 1 was measured.
- the source electrode 3 was grounded.
- This element uses Pt as the gate electrode 1, drain electrode 2 and source electrode 3, and yttrium-doped zirconia (Zr 1-x Y x O 2-x / 2 (0 ⁇ x ⁇ 0.2)) was used.
- a tantalum oxide (Ta 2 O 5 ) layer was sandwiched as the buffer layer 4 in order to block the electron conduction between the drain electrode 2 and the source electrode 3 and the ion conductor 5.
- the well-known RF sputtering method, pulsed laser deposition (PLD) method, and spin coating method are used to form the three-terminal element structure shown in FIG. 1A on a silicon oxide (SiO 2 ) substrate with graphene oxide / Pt / Ta 2 O 5.
- This element was fabricated by stacking in the order of / Zr 1-x Y x O 2 ⁇ x / 2 / Pt.
- the oxygen content (oxygen / (oxygen + carbon)) of graphene oxide was 21%.
- FIG 3 shows a transmission electron micrograph of the vicinity of the interface with Zr 1-x Y x O 2 ⁇ x / 2 / graphene oxide / SiO 2 in the fabricated device.
- Zr 1-x Y x O 2-x / 2 (YSZ in the figure) film, graphene oxide (GO in the figure) film and each interface have a dense structure with no pores and high mechanical strength It was something.
- the thickness of graphene oxide is about 4 nm, which is a structure in which about 10 to 13 layers of single-layer graphene oxide are stacked. From the results of electron diffraction in the figure, the layer spacing of this graphene oxide was estimated to be about 3.84 mm.
- FIG. 4 shows the relationship between the temperature measured by the AC impedance method and the oxygen ion conductivity of a Zr 1-x Y x O 2-x / 2 film produced by the PLD method.
- the vertical axis represents oxygen ion conductivity as “electrical conductivity”.
- the Zr 1-x Y x O 2 ⁇ x / 2 film was prepared under two conditions of room temperature and 673K, and the impedance measurement was performed under two conditions in the air and in the vacuum at a temperature range of 298K (room temperature) to 523K. I went there.
- the production temperature of the film is shown in the vicinity of the graph line in FIG.
- the ionic conductivity shows the largest value when the film produced at room temperature is measured in the atmosphere near room temperature (298K), and the smallest value is obtained when the film produced at 673K is measured in vacuum near room temperature. Indicated.
- FIG. 5 shows the Zr 1-x Y x O 2-x / 2 film prepared at room temperature by the PLD method, and the light absorption spectrum of Fourier transform infrared spectroscopy after heat-treating the film at 693 K in vacuum. Show. In the absorption spectrum before heat treatment, the hydroxyl group (OH—) indicated by a, the nitrogen bond (N ⁇ O) indicated by b, the carbonyl group indicated by c, and water (H 2 O) indicated by d were absorbed. A peak was observed. These peaks were significantly reduced by heat treatment at 693 K in vacuum.
- the film exhibiting the highest hydrogen ion conduction was a film formed at room temperature by PLD and in a room temperature state in the atmosphere. It has also been found that holding the film in a vacuum or at a high temperature results in the growth of crystal grains and the detachment of hydrogen ions present at the grain boundaries, thereby reducing hydrogen ion conduction.
- another measurement revealed that the ion conduction species in the Zr 1-x Y x O 2 ⁇ x / 2 film changed from hydrogen ions to oxygen ions in a high temperature region of 523 K or higher. Based on these results, in this example, a Zr 1-x Y x O 2-x / 2 film prepared at room temperature by the PLD method was used as an ion conductor material for hydrogen ions of a three-terminal element.
- the current (i gs ) is shown in the upper and lower graphs in FIG. 6A, respectively.
- a voltage of V ds 0.5 V was applied between the drain electrode 2 and the source electrode 3, and the measurement temperature was room temperature.
- V gs is swept from 0 V to 3 V, 3 V to ⁇ 2 V, and ⁇ 2 V to 0 V
- i ds and i gs change with a small current of picoampere order. There was no.
- V gs when measured in the atmosphere, when V gs was increased from 0 V, i ds was a minute current of picoampere order up to around 2 V, and showed a decreasing tendency within this range. Meanwhile i gs had the following minute current picoamperes. V gs is increased from i ds rapidly picoAmps over to 3V from the vicinity of 2.1V to the order of micro-amps, i gs also increased picoAmps from below in the order of micro amps. Next, when V gs was decreased from 3 V to ⁇ 0.5 V, i ds was increased by about an order of magnitude, while i gs decreased from microampere to the order of picoampere or less.
- V gs decreases rapidly from micro pair to the order of nano-amps
- i gs is increased to the order of nano amperes or less picoamps.
- V gs is increased to 0V from -2 V
- i ds is further decreased from nanoamperes to the order of picoamperes
- i gs also decreased from nanoamperes to the following order picoamps.
- Non-Patent Document 4 Non-Patent Document 4
- the band gap of graphene oxide is reduced and the electric conductivity is increased. Therefore , i ds increases significantly. Also, the increase in igs is the Faraday current associated with this electrochemical reaction. This region is indicated by (I) in FIGS. 6A and 6B.
- V gs is in accordance reduced to -2 V, reduced from i ds sharply micro pair to the order of nano-amps, i gs is increased to the order of nano amperes or less picoamps.
- an electrochemical reaction (2H + + O 2 ⁇ ⁇ H 2 O) of water contained in the ionic conductor 5 occurs at the graphene oxide side interface, and the generated negative polarity oxygen ions in the graphene oxide 6 Is granted.
- positive polarity hydrogen ions are separated from the graphene oxide side interface.
- the application of oxygen atoms increases the band gap of graphene oxide, resulting in a semiconductor property that hardly conducts electricity, so i ds is significantly reduced.
- the increase in igs is the Faraday current associated with this electrochemical reaction (oxidation reaction of graphene oxide). This region is indicated by (III) in FIGS. 6A and 6B.
- i ds is further decreased from nanoamperes to the order of picoamperes, i gs also decreased from nanoamperes to the following order picoamps.
- This is caused by a change in carrier concentration due to the electric double layer generated along with the movement of the hydrogen ions 8 in the ion conductor 5 at the graphene oxide side interface.
- i ds and i gs hardly changed in the measurement in vacuum no matter how much V gs was changed. This is because, in vacuum, hydrogen ions and water in the ion conductor are separated, so that hydrogen ion conduction does not occur, and therefore a redox reaction relating to oxygen atoms in graphene oxide does not occur.
- FIG. 7 shows an optical measurement method for estimating the band gap from the diffuse reflection spectrum of graphene oxide.
- the measurement sample is an indium tin oxide (ITO) film as a transparent electrode 10 (ITO) with excellent electrical conductivity on a transparent silicon oxide substrate 7, graphene oxide (GO) 6, and an ion conductor of hydrogen ions.
- ITO indium tin oxide
- GO graphene oxide
- ion conductor of hydrogen ions Some yttrium-added stabilized zirconia (Zr 1-x Y x O 2 ⁇ x / 2 ) and the gate electrode 1 laminated in this order were used. At this time, the value of x of stabilized zirconia was 0.1, and the oxygen content of graphene oxide was 21%.
- a diffuse reflection spectrum was measured using a UV-visible-light infrared spectrophotometer while entering light of a wide range of wavelengths from the bottom surface of the silicon oxide substrate of this sample.
- FIG. 8 is a diffuse reflection spectrum measured while applying a voltage of 0 V ⁇ 5 V ⁇ 0 V ⁇ ⁇ 5 V ⁇ 0 V between the transparent electrode 10 and the gate electrode 1 in the sample. At this time, the gate electrode 1 was grounded. For comparison, the absorption spectrum of only the ITO film was also measured. In this measurement range, the light absorption of the silicon oxide 7 substrate was negligible, so it was ignored. From this spectrum result, it was found that the reflectivity of graphene oxide changed with voltage application. However, in this spectral display, the absorption edge of graphene oxide near 200 nm overlaps with the absorption edge of the ITO film and is unclear, so it is difficult to estimate the band gap.
- FIG. 9 shows the vicinity of the absorption edge in a Tauc plot.
- F (R ⁇ ) an amount proportional to the light absorption coefficient
- h Planck's constant
- ⁇ frequency
- E g band gap
- A proportionality constant.
- the band gap of ITO can be estimated from the result of FIG.
- the band gap of graphene oxide was estimated from the detailed fitting of the absorption edge as shown in FIG.
- the vertical axis is set to (F (R ⁇ ) h ⁇ ) 1/2 .
- the value of the band gap also changed from 0.75V to 0.30V.
- analysis results of graphene oxide (GO) manufactured at room temperature using PLD and graphene (rGO) manufactured by removing oxygen atoms by heat-treating this graphene oxide in a reducing atmosphere are also shown as a small graph in the figure. did.
- the band gap of graphene oxide (GO) is 0.72 V, which is in good agreement with the value in the state before applying voltage between the transparent electrode 10 and the gate electrode 1 (0 V).
- the graphene (rGO) obtained by reducing graphene oxide has a band gap of 0 or less, which indicates the properties of graphene having no band gap.
- FIG. 11 shows the magnitude of the band gap of graphene oxide that changes when a voltage of 0 V ⁇ 5 V ⁇ 0 V ⁇ ⁇ 5 V ⁇ 0 V is applied between the indium tin oxide film 10 and the gate electrode 1.
- the band gap gradually decreases as the voltage increases from around 2V. This is because an electrochemical reaction (2H + + O 2- > H 2 O) occurs between the hydrogen ions 8 in the ionic conductor 5 and the oxygen atoms 9 attached to the graphene oxide 6 at the graphene oxide side interface. Thus, the oxygen atoms 9 are detached from the graphene oxide 6.
- the band gap is reduced from 0.75 eV to 0.30 eV by the detachment of oxygen atoms.
- no electrochemical reaction occurs, and the band gap does not change because the oxygen content in graphene oxide does not change.
- an electrochemical reaction (2H + + O 2 ⁇ ⁇ H 2 O) occurs, and oxygen atoms 9 are imparted to the graphene oxide 6.
- the band gap increases from 0.30 eV to 0.75 eV as the oxygen content in the graphene oxide increases.
- the size of the band gap can also be reversibly controlled. Further, since oxygen atoms contained in graphene oxide exist stably, the size of the controlled band gap is stable and nonvolatile.
- the drain The switching current flowing between the electrode and the source electrode was investigated.
- the above-mentioned band gap was formed by sweeping V gs from 0V to 2.3V. Considering the result of the optical measurement in FIG. 11, the band gap at this time was estimated to be about 0.6 eV.
- the switching current appeared when a voltage of 0.5V and -0.5V is V gs alternately in i ds (Fig. 12A). Furthermore, the application of a V gs to -1.0V from 2.5V negative polarity voltage. The band gap at this time was estimated to be about 0.7 eV. Similarly, when a voltage of 0.5 V and ⁇ 0.5 V, which is V gs , was applied alternately, a switching current appeared at i ds (FIG. 12C). Good switching characteristics were obtained under all the voltage conditions (FIGS. 12A, 12B, and 12C) of the gate electrode to be applied.
- the magnitude of the current flowing at the time of switching depends on the magnitude of the voltage between the gate electrode and the source electrode applied in advance, that is, the magnitude of the formed band gap.
- the alternate application of 0.5 g and ⁇ 0.5 V V gs described above is shown in light lines in FIG. 12A.
- the same V gs was alternately applied in the measurements shown in the graphs of FIGS. 12B and 12C, but the V gs plot was omitted in these graphs.
- the band gap of the element of the present embodiment in this circuit maintains the value set immediately before, but the influence of V gs at the time of power-off and the influence of other applied voltages remain.
- the element of the present embodiment can be operated in a volatile manner in a state where the band gap is set in a nonvolatile manner.
- dynamic operating condition control that resets the band gap by applying V gs in a range that changes the band gap and causes the volatile operation to be performed under conditions different from those before resetting. It is.
- the device of this embodiment can also perform device operations such as switching in a volatile manner after dynamically and nonvolatilely setting the band gap of the graphene oxide or graphene to be used.
- the content of oxygen atoms in graphene oxide or graphene is controlled by causing an electrochemical reaction on the surface of graphene oxide or graphene by utilizing local movement of hydrogen ions or oxygen ions. It becomes possible to do. Furthermore, by controlling the oxygen content, it is possible to provide an electric element capable of changing the band gap and electric resistance of graphene oxide or graphene. Since this variable electric conduction element can be applied as a switch element, a memory element, etc., it is expected to be used greatly in the industry.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thin Film Transistor (AREA)
- Carbon And Carbon Compounds (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
本願は、2013年11月11日に、日本に出願された特願2013-233226号に基づき優先権を主張し、その内容をここに援用する。
ここで、前記ドレイン電極層および前記ソース電極層と前記イオン伝導体材料層との間にバッファー層を設けてよい。
また、前記ゲート電極層と前記ソース電極層または前記ドレイン電極層との間に電圧を印加する手段を有し、前記手段による電圧の印加によって、前記イオン伝導体材料層内の水素イオンまたは酸素イオンが移動して、前記グラフェン系材料層と前記イオン伝導体材料層との界面において電気化学反応が生じて、前記グラフェン系材料層から酸素原子が離脱、または前記グラフェン系材料層に酸素原子が付与されるよう構成されてなるものでもよい。
また、前記電気化学反応に伴う酸素原子の離脱および付与によって前記グラフェン系材料層の電子状態であるバンドギャップの大きさが変化して、それにともなって前記ドレイン電極とソース電極間の導電性に変化が与えられるよう構成されてなるものでもよい。
また、前記イオン伝導体材料は水素イオンを有する金属酸化物または高分子化合物を含んでよい。
また、前記金属酸化物がイットリウム添加安定化ジルコニア(Zr1-xYxO2-x/2(0<x≦0.2))およびBaZr0.8Y0.2O3-x(0<x≦0.2)からなる群から選択されてよい。
また、前記高分子化合物はプロトン伝導性の高分子化合物であってもよく、特にナフィオン(登録商標)であってよい。
また、前記イオン伝導体材料は酸素イオンを有してよい。
また、前記金属酸化物は酸素イオンを有するガドリニウム添加セリア(Ce1-xGdxO2-x/2(0<x≦0.5))、安定化ジルコニア、安定化ビスマス酸化物、タングステン酸化物、亜鉛酸化物およびスズ酸化物からなる群から選択される少なくとも一つを含むものであってよい。
また、前記ゲート電極、ソース電極およびドレイン電極はそれぞれ白金、パラジウム、ロジウムおよびルテニウムからなる群から選択される少なくとも一つを含むものであってよい。
また、前記バッファー層は酸化タンタル、酸化アルミニウム、酸化ハフニウム、および酸化ジルコニアからなる群から選択される少なくとも一つを含むものであってよい。
また、前記絶縁体または半導体の材料が、チタン酸ストロンチウム、酸化シリコン、酸化アルミニウムなどの金属酸化物からなる群から選択される少なくとも一つを含むものであってよい。
本発明の実施態様の他の側面によれば、上記何れかの電気伝導素子を備えてなる電子装置が与えられる。
本発明の実施態様の更に他の側面によれば、前記ゲート電極層に電圧を印加して前記グラフェン系材料層のバンドギャップを不揮発的に変化させる第1のステップと、次に、前記ゲート電極層に前記バンドギャップを変化させない範囲の大きさの電圧を前記ゲート電極層に印加して揮発的な動作を行わせる第2のステップと、を含む、上記何れかの電気伝導素子を動作させる、電気伝導素子の動作方法が与えられる。
ここで、前記第1のステップの後に、前記ゲート電極層に電圧を印加して前記グラフェン系材料層のバンドギャップを不揮発的に再度変化させる第3のステップを含むものであってもよい。
本発明の一実施形態によれば、本実施形態の素子は3端子の電極構造を有する。図1Aに概念図で示すように、本素子は水素イオンまたは酸素イオン8が移動できるイオン伝導体5を有するイオン伝導体材料層と、このイオン伝導体材料層(イオン伝導体5)を、ゲート電極1と絶縁体基板7上にコートした酸化グラフェンまたはグラフェン6を有する酸化グラフェンまたはグラフェン系材料層で挟んだ積層構造を有する。酸素原子9が結合しているグラフェン系材料層(酸化グラフェンまたはグラフェン6)の表面上にドレイン電極2およびソース電極3を形成し、更にドレイン電極2およびソース電極3とイオン伝導体5との間にバッファー層4を形成する。酸化グラフェンには、図1Bに示す様に、酸素原子が結合していないSp2結合領域と酸素原子が結合しているSp3結合領域が存在している。Sp2結合領域は金属的な電気伝導性、Sp3結合領域は半導体または絶縁体的な電気伝導性をそれぞれ示す。
図2を参照しながら、水素イオンまたは酸素イオン伝導性のイオン伝導体を使用した、本実施形態の動的に設定可能な電気伝導素子の動作を説明する。図2には、図1Aに示す3端子素子において、ゲート電極1とソース電極3との間、および、ドレイン電極2とソース電極3との間にそれぞれ電圧を印加することにより遷移可能な状態を示す。
2 ドレイン電極
3 ソース電極
4 バッファー層
5 水素イオンまたは酸素イオン伝導体
6 酸化グラフェンまたはグラフェン
7 絶縁体基板
8 水素イオンまたは酸素イオン
9 酸化グラフェンに含有する酸素原子
10 透明電極
11 入射光および反射光
Claims (15)
- 水素イオンまたは酸素イオンが伝導できるイオン伝導体を有するイオン伝導体材料層と、前記イオン伝導体材料層を挟むゲート電極層および絶縁体基板上に積層した酸化グラフェンまたはグラフェンを有するグラフェン系材料層と、前記グラフェン系材料層の表面上もしくはその層間または前記絶縁体基板上に設けられたドレイン電極層およびソース電極層を設けた電気伝導素子。
- 前記ドレイン電極層および前記ソース電極層と前記イオン伝導体材料層との間にバッファー層を設けた、請求項1に記載の電気伝導素子。
- 前記ゲート電極層と前記ソース電極層または前記ドレイン電極層との間に電圧を印加する手段を有し、前記手段による電圧の印加によって前記イオン伝導体材料層内の水素イオンまたは酸素イオンが移動して、前記グラフェン系材料層と前記イオン伝導体材料層との界面において電気化学反応が生じて、前記グラフェン系材料層から酸素原子が離脱、または前記グラフェン系材料層に酸素原子が付与されるよう構成されてなる請求項1または2に記載の電気伝導素子。
- 前記電気化学反応に伴う酸素原子の離脱および付与によって前記グラフェン系材料層の電子状態であるバンドギャップの大きさが変化して、それにともなって前記ドレイン電極とソース電極間の導電性に変化が与えられるよう構成されてなる、請求項3に記載の電気伝導素子。
- 前記イオン伝導体材料は水素イオンを有する金属酸化物または高分子化合物を含む、請求項1から4の何れかに記載の電気伝導素子。
- 前記金属酸化物がイットリウム添加安定化ジルコニア(Zr1-xYxO2-x/2(0<x≦0.2))およびBaZr0.8Y0.2O3-x(0<x≦0.2)からなる群から選択される少なくとも一つである、請求項5に記載の電気伝導素子。
- 前記高分子化合物はフッ化ビニル系高分子にパーフルオロスルフォン酸を含む錯体のついた高分子イオン交換膜である、請求項5に記載の電気伝導素子。
- 前記イオン伝導体材料は酸素イオンを有する金属酸化物を含む、請求項1から4の何れかに記載の電気伝導素子。
- 前記金属酸化物は酸素イオンを有するガドリニウム添加セリア(Ce1-xGdxO2-x/2(0<x≦0.5))、安定化ジルコニア、安定化ビスマス酸化物、タングステン酸化物、亜鉛酸化物およびスズ酸化物からなる群から選択される少なくとも一つである、請求項7に記載の電気伝導素子。
- 前記ゲート電極、ソース電極およびドレイン電極はそれぞれ白金、パラジウム、ロジウムおよびルテニウムからなる群から選択される少なくとも一つを含む、請求項1から9の何れかに記載の電気伝導素子。
- 前記バッファー層は酸化タンタル、酸化アルミニウム、酸化ハフニウム、および酸化ジルコニアからなる群から選択される少なくとも一つを含む、請求項2から10の何れかに記載の電気伝導素子。
- 前記絶縁体または半導体の材料が、チタン酸ストロンチウム、酸化シリコン、酸化アルミニウムなどの金属酸化物からなる群から選択される少なくとも一つを含む、請求項1から11の何れかに記載の電気伝導素子。
- 前記請求項1から12の何れかに記載の電気伝導素子を備えてなる電子装置。
- 請求項1から12の何れかに記載の電気伝導素子を動作させる、電気伝導素子の動作方法であって、
前記ゲート電極層に電圧を印加して前記グラフェン系材料層のバンドギャップを不揮発的に変化させる第1のステップと、
次に、前記ゲート電極層に前記バンドギャップを変化させない範囲の大きさの電圧を前記ゲート電極層に印加して揮発的な動作を行わせる第2のステップと、
を含む電気伝導素子の動作方法。 - 前記第1のステップの後に、前記ゲート電極層に電圧を印加して前記グラフェン系材料層のバンドギャップを不揮発的に再度変化させる第3のステップを含む、請求項14に記載の電気伝導素子の動作方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/034,204 US9627499B2 (en) | 2013-11-11 | 2014-10-31 | Electrical conduction element, electronic device, and method for operating electrical conduction element |
EP14859936.8A EP3057148B1 (en) | 2013-11-11 | 2014-10-31 | Electrical conduction element, electronic device, and method for operating electrical conduction element |
JP2015546624A JP6108420B2 (ja) | 2013-11-11 | 2014-10-31 | 電気伝導素子、電子装置及び電気伝導素子の動作方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013233226 | 2013-11-11 | ||
JP2013-233226 | 2013-11-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015068651A1 true WO2015068651A1 (ja) | 2015-05-14 |
Family
ID=53041428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/079047 WO2015068651A1 (ja) | 2013-11-11 | 2014-10-31 | 電気伝導素子、電子装置及び電気伝導素子の動作方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9627499B2 (ja) |
EP (1) | EP3057148B1 (ja) |
JP (1) | JP6108420B2 (ja) |
WO (1) | WO2015068651A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020087937A (ja) * | 2018-11-14 | 2020-06-04 | 富士通株式会社 | 電子デバイス、及び、集積回路 |
JP2020088251A (ja) * | 2018-11-28 | 2020-06-04 | 富士通株式会社 | 電子デバイス、及び、集積回路 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111739803B (zh) * | 2020-07-03 | 2021-11-12 | 清华大学 | 石墨烯场效应管及其制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012069612A (ja) * | 2010-09-22 | 2012-04-05 | National Institute For Materials Science | 電気化学トランジスタ |
JP2012119665A (ja) * | 2010-11-30 | 2012-06-21 | Samsung Electronics Co Ltd | グラフェン電子素子 |
JP2012138451A (ja) * | 2010-12-27 | 2012-07-19 | Hitachi Ltd | グラフェン膜と金属電極とが電気的接合した回路装置 |
US20120205606A1 (en) * | 2011-02-14 | 2012-08-16 | Dongguk University Industry-Academic Cooperation Foundation | Nonvolatile Memory Device Using The Resistive Switching of Graphene Oxide And The Fabrication Method Thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5356066B2 (ja) | 2009-02-24 | 2013-12-04 | 株式会社東芝 | スイッチング素子及び不揮発性記憶装置 |
US8492747B2 (en) * | 2009-10-26 | 2013-07-23 | Samsung Electronics Co., Ltd. | Transistor and flat panel display including thin film transistor |
US8617941B2 (en) * | 2011-01-16 | 2013-12-31 | International Business Machines Corporation | High-speed graphene transistor and method of fabrication by patternable hard mask materials |
JP2013084845A (ja) | 2011-10-12 | 2013-05-09 | Sony Corp | 有機薄膜トランジスタ、有機薄膜トランジスタの製造方法および表示装置 |
-
2014
- 2014-10-31 US US15/034,204 patent/US9627499B2/en active Active
- 2014-10-31 JP JP2015546624A patent/JP6108420B2/ja active Active
- 2014-10-31 EP EP14859936.8A patent/EP3057148B1/en not_active Not-in-force
- 2014-10-31 WO PCT/JP2014/079047 patent/WO2015068651A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012069612A (ja) * | 2010-09-22 | 2012-04-05 | National Institute For Materials Science | 電気化学トランジスタ |
JP2012119665A (ja) * | 2010-11-30 | 2012-06-21 | Samsung Electronics Co Ltd | グラフェン電子素子 |
JP2012138451A (ja) * | 2010-12-27 | 2012-07-19 | Hitachi Ltd | グラフェン膜と金属電極とが電気的接合した回路装置 |
US20120205606A1 (en) * | 2011-02-14 | 2012-08-16 | Dongguk University Industry-Academic Cooperation Foundation | Nonvolatile Memory Device Using The Resistive Switching of Graphene Oxide And The Fabrication Method Thereof |
Non-Patent Citations (9)
Title |
---|
"Shimadzu application news", SHIMADZU ANALYSIS AND MEASUREMENT DEPARTMENT, 2010 |
B. SCHERRER; M. SCHLUPP; D. STENDER; J. MARTYNCZUK; J. GROLIG; H. MA; P. KOCHER; T. LIPPERT; M. PRESTAT; L. GAUCKLER, ADVANCED FUNCTIONAL MATERIALS, vol. 23, 2013, pages 1957 - 1964 |
H. MIN; B. R. SAHU; S. BANERJEE; A. H. MACDONALD, PHYS. REV. B, vol. 75, 2007, pages 155115 |
INSUNG KIM ET AL.: "Low temperature solution- processed graphene oxide/Pr0.7Ca0.3MnO3 based resistive-memory device", APPLIED PHYSICS LETTERS, vol. 99, 25 July 2011 (2011-07-25), pages 042101 - 1, XP012141554 * |
MATHKAR, A; TOZIER, D.; COX, P.; ONG, P.; GALANDE, C.; BALAKRISHNAN, K.; REDDY, A. L. M.; AJAYAN, P. M., J. PHYS. CHEM. LETT., vol. 3, 2012, pages 986 - 991 |
R. BALOG; B. JORGENSEN; L. NILSSON; M. ANDERSEN; E. RIENKS; M. BIANCHI; M. FANETTI; E. LAGSGAARD; A. BARALDI; S. LIZZIT, NATURE MATER., vol. 9, 2010, pages 315 |
See also references of EP3057148A4 |
Y. W. SON; M. L. COHEN; S. G. LOUIE, PHYS. REV. LETT., vol. 97, 2006, pages 216803 |
YASUMICHI MATSUMOTO, GS YUASA TECHNICAL REPORT, vol. 9, 2012, pages 1 - 6 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020087937A (ja) * | 2018-11-14 | 2020-06-04 | 富士通株式会社 | 電子デバイス、及び、集積回路 |
JP2020088251A (ja) * | 2018-11-28 | 2020-06-04 | 富士通株式会社 | 電子デバイス、及び、集積回路 |
Also Published As
Publication number | Publication date |
---|---|
EP3057148A1 (en) | 2016-08-17 |
EP3057148B1 (en) | 2018-08-08 |
EP3057148A4 (en) | 2017-06-28 |
US9627499B2 (en) | 2017-04-18 |
US20160276453A1 (en) | 2016-09-22 |
JP6108420B2 (ja) | 2017-04-05 |
JPWO2015068651A1 (ja) | 2017-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Schmitt et al. | Design of oxygen vacancy configuration for memristive systems | |
Ismail et al. | Improved endurance and resistive switching stability in ceria thin films due to charge transfer ability of Al dopant | |
Han et al. | Low-temperature, high-performance, solution-processed indium oxide thin-film transistors | |
Ye et al. | Liquid-gated interface superconductivity on an atomically flat film | |
Shirpour et al. | Evidence for space charge effects in Y-doped BaZrO3 from reduction experiments | |
Tsuchiya et al. | Effect of ionic conductivity on response speed of SrTiO3-based all-solid-state electric-double-layer transistor | |
Sun et al. | Influence of carrier concentration on the resistive switching characteristics of a ZnO-based memristor | |
Rehman et al. | Tuning of ionic mobility to improve the resistive switching behavior of Zn-doped CeO2 | |
JP6191986B2 (ja) | 全固体電気二重層を利用した可変電気伝導素子およびそれを用いた電子装置 | |
JP6108420B2 (ja) | 電気伝導素子、電子装置及び電気伝導素子の動作方法 | |
Cultrera et al. | Band-gap states in unfilled mesoporous nc-TiO2: measurement protocol for electrical characterization | |
Xie et al. | Light-controlled resistive switching and voltage-controlled photoresponse characteristics in the Pt/CeO2/Nb: SrTiO3 heterostructure | |
Kalhori et al. | Oxygen vacancy in WO3 film-based FET with ionic liquid gating | |
Conti et al. | Printed transistors made of 2D material-based inks | |
Sabah et al. | Sensitivity of CuS and CuS/ITO EGFETs implemented as pH sensors | |
Tian et al. | Resistance switching characteristics of Ag/ZnO/graphene resistive random access memory | |
Tsuchiya et al. | Direct observation of redox state modulation at carbon/amorphous tantalum oxide thin film hetero-interface probed by means of in situ hard X-ray photoemission spectroscopy | |
Zhang et al. | Insight into interface behavior and microscopic switching mechanism for flexible HfO2 RRAM | |
Qin et al. | Memristive behavior of Al 2 O 3 film with bottom electrode surface modified by Ag nanoparticles | |
Rana et al. | Thickness effect on the bipolar switching mechanism for nonvolatile resistive memory devices based on CeO2 thin films | |
Cho et al. | Influence of lithium doping on the electrical properties and ageing effect of ZnSnO thin film transistors | |
Cai et al. | Present status of electric-double-layer thin-film transistors and their applications | |
Kalaev et al. | Negative differential resistance and hysteresis in Au/MoO 3− δ/Au devices | |
Milano et al. | Metal–insulator transition in single crystalline ZnO nanowires | |
Awate et al. | Impact of Large Gate Voltages and Ultrathin Polymer Electrolytes on Carrier Density in Electric-Double-Layer-Gated Two-Dimensional Crystal Transistors |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14859936 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2015546624 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15034204 Country of ref document: US |
|
REEP | Request for entry into the european phase |
Ref document number: 2014859936 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2014859936 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |