WO2015058338A1 - 一种发光体 - Google Patents
一种发光体 Download PDFInfo
- Publication number
- WO2015058338A1 WO2015058338A1 PCT/CN2013/085601 CN2013085601W WO2015058338A1 WO 2015058338 A1 WO2015058338 A1 WO 2015058338A1 CN 2013085601 W CN2013085601 W CN 2013085601W WO 2015058338 A1 WO2015058338 A1 WO 2015058338A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- light source
- substrate
- optical component
- area
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 230000003287 optical effect Effects 0.000 claims description 79
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 15
- 238000001746 injection moulding Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000012778 molding material Substances 0.000 description 3
- 238000010137 moulding (plastic) Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000009021 linear effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to the field of illumination, and in particular to an illuminant. Background technique
- the illuminant is a product that arranges the light sources together according to certain rules and is packaged together with some waterproof treatment. It is mainly used to display the nighttime effect of advertising fonts and logos. It is installed on the top or wall of the building by text or logo. Face, can not only show the daytime effect, but also show another effect at night, and with the application control system, you can dynamically control the text or logo.
- the outer casing of the illuminant is injection molded, and the light source and the substrate are assembled into the outer casing. Since the outer casing and the light source and the substrate need to be assembled, a sealing seal is required to ensure waterproof and dustproof performance, so the structure leads to complicated assembly process, and it is inevitable that there is a deviation in assembly, which may affect waterproof and dustproof performance; The deviation between the assembly and the substrate may cause the gap to be insufficiently tight. The contact is not tight enough to affect the fixing of the substrate and the heat transfer performance between the two. The heat transfer performance of the heat transfer from the substrate to the outer casing may affect the heat dissipation effect. The heat dissipation effect is poor and easy to damage, which affects the life of the product. Summary of the invention
- the invention provides an illuminant, which can improve the waterproof and dustproof ability of the illuminant, enhance the heat dissipation performance, and is favorable for processing and preparation.
- the invention provides an illuminant, comprising a light source assembly and an outer casing;
- the outer casing is wrapped outside the light source assembly
- the light source assembly includes a substrate and at least one light source; the light source is fixed to the substrate, the outer casing encloses the substrate, and a connection line electrically connected to the light source is connected to the substrate, and the connection line extends to Outside the outer casing.
- the substrate is provided with a positioning hole, and an inner wall of the outer casing extends into the positioning hole to form a positioning portion.
- the outer wall of the outer casing extends outwardly along the connecting line to form a reinforcing portion for wrapping a portion of the connecting line.
- the light source assembly further includes a light distribution device for illuminating the light source
- a light distribution device for illuminating the light source
- An optical component is coupled to the substrate, the light source is fixed to the substrate, and the light source is located between the optical component and the substrate;
- An optical outlet is disposed on the outer casing, and the optical component is located in the light exit opening.
- the optical component includes a light-expanding area
- a center of an exit surface of the light-expanding region is recessed toward the light source to form a concave lens portion, the concave lens portion is located on an optical axis of the light source; and an exit surface edge of the light-expanding region is a convex curved surface;
- the incident surface of the region is a concave curved surface whose center is recessed toward the exit surface.
- the optical component further includes a concentrating area for collecting light, where the concentrating area is located in the light-expanding area and the light source
- the optical component further includes a common light transmission area that is coupled to the light exit port, and the common light transmission area An annular shape disposed along an edge of the light-expanding region and integrally formed with the light-expanding region; the inner space of the ordinary light-transmitting region forms a receiving cavity for receiving the light source.
- the optical component is provided with a post
- the substrate is provided with a card hole that cooperates with the post, and the post is engaged in the card hole.
- a circumferential surface of the optical component is provided with a flange, and the flange is located in the outer casing.
- an end of the flange that is away from the optical component extends away from the substrate to form a card edge, and the card edge embeds The eve of the shell.
- the outer casing is wrapped around the light source assembly, and the substrate is wrapped, and the outer casing can be in close contact with the substrate through the outer casing to ensure long-term waterproof sealing performance, and the outer casing and the substrate are tightly connected to enhance heat conduction between the two.
- the ability to diffuse the heat generated by the light source to the outside of the light-emitting body; the connection between the light source and the external power source can be realized by using a connecting wire extending outside the outer casing, and the connecting wire can also facilitate the processing and preparation of the outer casing, so that the substrate is located at a predetermined position in the outer casing;
- the outer casing can also strengthen the connection strength between the substrate and the connecting wire. Attached sleep instructions
- FIG. 1 is a schematic view of an illuminant provided by a preferred embodiment of the present invention.
- Figure 2 is an exploded perspective view of the illuminator of Figure 1;
- Figure 3 is a schematic view of the light-emitting side of the illuminator of Figure 1;
- Figure 4 is a schematic view of one side of the backlight of the illuminator of Figure 1;
- Figure 5 is a cross-sectional view taken along line A-A of the illuminator of Figure 3;
- Figure 6 is a cross-sectional view of the light source assembly of Figure 5;
- Figure 7 is a cross-sectional view taken along line B-B of the illuminator of Figure 3;
- Figure 8 is a light distribution diagram of the light source assembly of Figure 5;
- Figure 9 is a schematic view of an optical component provided by another embodiment of the illuminator of the present invention.
- Fig. 10 is a schematic view showing an optical component according to still another embodiment of the illuminator of the present invention.
- a preferred embodiment of the present invention provides an illuminator 100 comprising a light source assembly 1 and a housing 2.
- the outer casing 2 is wrapped around the light source assembly 1.
- the light source unit 1 includes a substrate 11, at least one light source 12, and an optical member 13 for distributing light to the light source 12.
- the light source 12 is fixed to the substrate.
- the light source 12 is an LED.
- the outer casing 2 wraps the substrate 11 such that the outer casing 2 is tightly coupled to the substrate 11.
- the substrate 11 may be a wiring board, a circuit board, a PCB board, a flexible circuit board (FPC), or the like.
- a connection line 3 electrically connected to the light source 12 is connected to the substrate 11, and the connection line 3 extends outside the casing 2.
- the optical component 13 is snapped onto the substrate 11 and the light source 12 is located between the optical component 13 and the substrate 11.
- the outer casing 1 is provided with a matching with the optical component 13
- the optical port 20 and the optical component 13 are located in the light exit opening 20 to emit light.
- the optical component 13 When processing the illuminator 100, the optical component 13 is snapped onto the substrate 11, and the assembled light source assembly 1 with the connecting wire 3 is placed on the plastic molding machine, and the plastic is used to wrap the entire light source component 1 to make the outer casing. 2 is wrapped around the light source assembly 1 and wraps the entire substrate 11 , and the optical component 13 is exposed only through the light exit opening 20 , and the outer casing 1 can be in close contact with the substrate 11 to ensure long-term waterproof sealing performance, and the outer casing 2 and the substrate 11 can be closely connected.
- the heat transfer capability between the two is enhanced to diffuse the heat generated by the light source 12 to the illuminant 100.
- the outer casing 2 is wrapped around the light source assembly 1 by means of a plastic molding machine by means of a plastic molding machine.
- the outer casing 2 may be wrapped around the light source assembly 1 by other means such as encapsulation, casting or the like.
- the light source 12 can be connected to an external power source by using a connecting wire 3 extending outside the outer casing 2.
- the processing of the outer casing 2 can be facilitated by the connecting wire 3, so that the substrate 11 is located at a predetermined position in the outer casing 2, for example, a fixed connection.
- the wire 3 can fix the light source assembly 1 to a predetermined position of the molding machine, maintain the positioning of the entire light source assembly 1, and ensure that the outer casing 2 is plasticized outside the substrate 11, that is, the substrate 11 is placed at a predetermined position in the outer casing 2.
- the outer casing 1 can also strengthen the connection strength between the substrate 11 and the connecting wire 3, thereby avoiding the influence of the power supply of the light source 12 during the pulling process.
- the light source 12 is located between the substrate 11 and the optical component 13 to avoid thermal shock of the outer casing 2 in a high-temperature molten state during the high-pressure injection molding of the outer casing 2, thereby improving the yield of the illuminant 100 and improving the waterproofness of the light source 12. Dust ability.
- both the light source 12 and the optical member 13 are two, and the two are matched one-to-one.
- the substrate 11 has opposite first and second plates, and the light source 12 and the optical member 13 are disposed on the first plate.
- the substrate 11 has an elongated shape as a whole, and the outer casing 1 is wrapped around the light source unit 1 and has a shape that matches the shape of the substrate 11, and is elongated and flat.
- the two light sources 12 are arranged along the length of the substrate 11. In order to facilitate the processing and assembly, the light source 12 is directly soldered to the substrate 11.
- the optical component 13 provided in this embodiment can distribute light to the light source 12 to achieve a preset light distribution effect, thereby improving light utilization efficiency and improving the display effect on the advertisement font and the logo; and simultaneously using the optical component 13 to the light source 12 To protection.
- the optical component 13 includes a light-expanding region 13a, a light-collecting region 13b, and a common light-transmitting region 13c.
- the center of the exit surface of the light-expanding region 13a is recessed toward the light source to form a concave lens portion, and the concave lens portion is located on the optical axis of the light source;
- the exit surface edge of the light-expanding region 13a is a convex curved surface;
- the incident portion of the light-expanding region 13a The surface is a concave curved surface whose center is concave toward the exit surface.
- the light-expanding area 13a can be used to enlarge the light-emitting angle and achieve uniform light emission, and a good wide-angle effect can be achieved. As shown in the light distribution graph of Fig. 8, the average beam angle of the light source 12 after secondary light distribution by the optical member 13 can reach 153.2.
- the concentrating area 13b is for collecting light, and the condensing area 13b is located between the light-expanding area 13a and the light source 12.
- the exit surface of the condensing area 13b is disposed opposite to the incident surface of the light-expanding area 13a.
- the light of the light source 12 is collected by the condensing area 13b and incident on the incident surface of the light-expanding area 13a to make full use of the light energy of the light source 12.
- the exit surface of the concentrating area 13b may coincide with the shape of the incident surface of the light-expanding area 13a and be disposed, or the incident surface of the concentrating area 13b and the incident surface of the light-enlarged area 13a may be slightly There is a gap.
- the concentrating area 13b may be integrally formed with the light-expanding area 13a to facilitate positioning of the concentrating area 13b to collect light to a predetermined position, that is, an incident surface of the light-expanding area 13a; the concentrating area 13b may also be installed as a separate component. In the groove formed in the incident surface of the light-expanding region 13a.
- the ordinary light-transmitting region 13c is an annular shape provided along the edge of the light-expanding region 13a, and is integrally formed with the light-expanding region 13a.
- the ordinary light-transmissive area 13c is coupled with the light-emitting port of the outer casing, so that the light-expanding area 13a can be prevented from coming into contact with the outer casing to affect the light-expanding effect.
- the inner space of the ordinary light transmitting portion 13c forms a receiving cavity 130 for accommodating the light source, so that the entire optical member 13 forms a cover to protect the light source.
- the ordinary light-transmissive area 13c can transmit the light of the light source 12, and has no light distribution effect, which can reduce the processing difficulty.
- the common light-transmissive region 13 c can be bonded to the first surface of the substrate 11 to form a sealed space in the accommodating groove 130 , so that the light source 12 can be encapsulated in the receiving groove of the optical component 13 .
- the thermal shock to the light source 12 during the injection molding of the outer casing 2 is further effectively avoided, the yield of the illuminant 100 is ensured, and the waterproof performance of the light source 12 is ensured.
- the optical component 13 is snapped onto the substrate 11. During the processing and preparation of the illuminant 100, the assembly connection between the optical component 13 and the substrate 11 can be facilitated, and the components of the light source component 1 can be connected as a whole, thereby facilitating the light source component. 1
- the outer casing 2 is wrapped to facilitate the processing and preparation of the illuminant.
- the optical member 13 is provided with a post 131.
- the post 131 is disposed on the common light transmissive area 13c.
- the substrate 11 is provided with a card hole 113 matched with the post 131, and the post 131 is engaged in the card hole 113, thereby facilitating the assembly connection of the optical component 13 with the substrate 11.
- the post 131 is formed by extending the bonding surface of the common light-transmissive region 13c and the substrate 11 to ensure the structural strength of the post 131.
- Two optical posts 131 are symmetrically disposed on each optical component 13 to ensure Optical component 13 The strength of connection to the substrate 11.
- the two optical components 13 may be integrally formed, and may be connected by a connecting strip therebetween.
- a flange 132 is disposed on the circumferential surface of the optical member 13, and the flange 132 is located in the outer casing 2.
- the reliability of the connection of the optical member 13 to the substrate 11 can be ensured by the flange 132, and the optical member 13 is prevented from the substrate. Pull out on 11.
- the flange 132 is provided on the outer periphery of the ordinary light transmitting portion 13c.
- the flange 132 may be arcuately disposed along the circumferential surface of the optical member 13, and the flanges 132 are two or more, and are disposed at evenly spaced intervals along the circumferential direction of the optical member 13 at the light incident end of the optical member 13.
- the number of the flanges 132 is four, and the optical member 13 and the outer casing 2 can be fixed and fixed from four orientations. Due to the spacing between the flanges 132, the injection molding material of the outer casing 1 can be injected into the gap between the adjacent flanges 132 to prevent the optical member 13 from rotating circumferentially.
- the flange 132 may be one and an annular shape provided along the circumferential direction of the optical member 13.
- the end of the flange 132 away from the optical component 13 extends toward the light exit end of the optical component 13 to form a card edge 133.
- the card edge 133 can be embedded in the outer casing 2 to further enable the optical component 13 and the outer casing. 1
- the connection is firm and reliable.
- a first positioning hole 1101 is defined in the substrate 11, and an inner wall of the outer casing 2 extends into the first positioning hole 1101 to form a first positioning portion (not shown). Since the first positioning hole 1101 is disposed on the substrate 11, during the injection molding process of the outer casing 2, the injection molding material can enter the first positioning hole 1101 to form a first positioning portion, thereby further ensuring the tightness of the connection between the outer casing 2 and the substrate 11.
- the substrate 11 is firmly embedded in the outer casing 1.
- the first positioning holes 1101 are two and are respectively located at two ends in the longitudinal direction of the substrate 11 to fix both ends of the substrate 11 firmly.
- the substrate 11 is provided with a second positioning hole 1102.
- the inner wall of the outer casing 2 extends into the positioning hole to form a second positioning portion 11, and the second positioning portion 11 is provided with a through hole. 220, the through hole 220 is the same as the axial direction of the positioning hole, and the inner diameter of the through hole 220 is smaller than the inner diameter of the positioning hole.
- the injection molding material in the injection molded casing 2 can encapsulate the hole wall of the second positioning hole 1102 to ensure the sealing of the substrate 11. Performance and its connection reliability to the housing 2.
- the second positioning hole 1102 is located at an intermediate position of the substrate 11 between the two light sources 12 so as to be firmly connected to the outer casing 2 from the intermediate position of the substrate 11.
- the through hole 220 penetrates through the outer casing 2.
- the through hole 220 communicates with the light emitting side of the outer casing 2 and the backlight side.
- the use of the through hole 220 can facilitate the entire illuminator 100 to pass through fasteners such as screws and rivets. Fixed to attachments. Since the second positioning hole 1102 is located at an intermediate position of the substrate 11, the through hole 220 can be positioned at an intermediate position of the entire illuminator 100, and the illuminant 100 can be securely mounted to the attached object after being fixed by the fastener.
- first positioning hole 1101 and the second positioning hole 1102 are two embodiments of the positioning hole according to the present invention, and the first positioning portion and the second positioning portion 22 are the positioning portions of the present invention. Two embodiments.
- the outer casing 1 is provided with a communication hole 202 which communicates with the outer wall of the outer casing 1 and the second plate surface of the substrate 11.
- the communication hole 202 is formed by a protrusion in the injection mold.
- the light source assembly 1 can be placed on the protrusion in the mold, and the second plate surface of the substrate 11 abuts on the protrusion, thereby facilitating the light source assembly 1
- the positioning in the mold facilitates the injection molding of the outer casing 1 to ensure the thickness of the outer casing 2 at the second plate surface of the substrate 11.
- the communication hole 202 can facilitate the direct heat dissipation of the substrate 11 and the outside, and the printed circuit on the substrate 11 is misaligned with the communication hole 202, that is, the printed circuit does not pass through the communication hole 202 to ensure the sealing performance of the printed circuit.
- the printed circuit can be directly printed on the first board surface on the substrate 11 to avoid direct communication between the printed circuit and the outside world.
- the back side of the outer casing 2 that is, the side of the outer casing 2 opposite to the light exit opening 201, is provided with a double-sided tape 4 for pre-fixing the entire illuminator 100 to the attachment for further fixing by the fastener.
- the connecting line 3 is a double-row line to connect the positive and negative poles of the driving power source.
- Two connecting wires 3 are connected to the substrate 11 to realize serial connection between the plurality of illuminants.
- the two connecting wires 3 are respectively connected to both ends in the longitudinal direction of the substrate 11.
- the outer wall of the outer casing 2 extends outward along the connecting line 3 to form a reinforcing portion for wrapping a part of the connecting line 3.
- the reinforcing portion 23 can be used to strengthen the connection strength between the connecting wire 3 and the outer casing 2, and to ensure the sealing performance between the two.
- the reinforcing portion 23 is provided with a through hole 230.
- the through hole 230 penetrates the light emitting side of the outer casing 2 and the backlight side.
- the through hole 230 exposes a part of the connecting line 3.
- the water on the light side of the outer casing 2 can penetrate from the through hole to the backlight side, so that the outer casing 2 emits light. No water is produced, so as to avoid affecting the luminous effect.
- the illuminant 100 having two light sources 12 and an optical component 13 is specifically described as an example.
- the illuminant 100 has two light sources 12 and two optical components 13 , which can ensure a single illuminant 100 .
- the light intensity, at the same time, assembly and overmolding are less difficult to process, and it is easy to be molded into a light strip by one injection molding of the outer casing 2; in addition, the single illuminant 100 can be prevented from generating a large amount of heat, which is advantageous for heat dissipation.
- the illuminant 100 may have a light source 12 and an optical component 13 or There are three or more light sources 12 and optical components 13 .
- the light source 12 can be arranged in different shapes according to the application of the light-emitting body 100, and the overall shape of the substrate 11 and the light-emitting body 100 can be grown. Strips, triangles, squares, circles or other geometric shapes.
- the second positioning hole 1102 and the through hole 220 may be located between two adjacent light sources 12 .
- the optical component can realize a wide-angle and uniform light distribution effect, so that the illuminant is applied to a medium such as a billboard or a logo, and the shape structure of the optical component is not limited to the above embodiment, and is additionally implemented.
- the optical component 13 is columnar, and its axial direction coincides with the optical axis, and the opposite ends of the optical axis are respectively the light incident end and the light exit end, and the light incident end cooperates with the substrate 11 to engage the card machine.
- the light-incident end is provided with a recess for accommodating the light source 12, and the end surface of the light-emitting end is a flat surface, and the light-expanding effect can also be realized.
- the optical component 13 can also be a concentrating lens, which can realize the light distribution effect of collecting light, so that the light of the illuminator has a linear effect and can travel farther.
- the optical component is used to realize the light-distributing effect of the predetermined light-expanding, and the light-emitting hole is disposed on the outer casing for the assembly of the optical component.
- the optical component may not be provided, but only applicable.
- the ordinary light-transmissive cover can cover the light source, or the outer cover is made of a transparent material, and it is not necessary to use an optical component or a transparent cover.
- the outer casing envelops the substrate and the light source, and the light of the light source directly passes through the outer casing.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
一种发光体(100)包括光源组件(1)及外壳(2)。光源组件(1)包括基板(11)及至少一固定于基板(11)上的光源(12)。基板(11)上连接有与光源(12)电连接且延伸至外壳(1)外的连接线(3)。外壳(2)包裹在光源组件(1)和基板(11)外。通过外壳(1)的包裹增强了防水密封性能和热传导能力。连接线(3)的使用便于外壳(1)的加工,使基板(11)位于外壳(1)中的预定位置。外壳(1)加强基板(1)与连接线(3)的连接强度。
Description
一种发光体
技^!城
本发明涉及照明领域, 尤其涉及一种发光体。 背景技术
发光体是将光源按一定规则排列在一起再封装起来,加上一些防水处理组 成的产品,主要用于展示广告字体和标识的夜间效果,它以文字或标识为媒介, 安装在楼宇顶部或墙面, 既能表现标识白天效果,又能在夜间表现出另外一种 效果, 再配以应用控制系统, 就可以对文字或标识进行动态视频控制。
现有技术中,发光体的外壳是先注塑成型,再将光源及基板装配到外壳中。 由于外壳与光源、基板之间需进行装配, 为保证防水防尘性能还需设置密封件 密封, 故该结构导致产品装配过程复杂, 且在装配中难免有偏差, 会影响防水 防尘性能; 外壳与基板之间装配的偏差会产生间隙导致接触不够紧密,接触不 够紧密将会影响基板的固定及二者之间的热传递性能,基板的热量传递到外壳 的热传递性能会影响散热效果, 光源的散热效果差易损坏, 影响产品的寿命。 发明内容
本发明提供一种发光体,可以提高发光体的防水防尘能力,增强散热性能, 利于加工制备。
本发明提供了一种发光体, 包括光源组件及外壳;
所述外壳包裹在所述光源组件外;
所述光源组件包括基板及至少一个光源; 所述光源固定于所述基板, 所述 外壳包裹所述基板, 所述基板上连接有与所述光源电连接的连接线, 所述连接 线延伸至所述外壳外。
在第一种可能的实现方式中, 所述基板上设有定位孔, 所述外壳的内壁向 所述定位孔内延伸形成有定位部。
在第二种可能的实现方式中,所述外壳的外壁沿所述连接线向外延伸形成 用于包裹部分所述连接线的加强部。
在第三种可能的实现方式中,所述光源组件还包括用于对光源进行配光的
光学部件; 所述光学部件卡接于所述基板, 所述光源固定于所述基板, 且所述 光源位于所述光学部件与所述基板之间;
所述外壳上设有出光口, 所述光学部件位于所述出光口中。
结合第三种可能的实现方式, 在第四种可能的实现方式中, 所述光学部件 包括扩光区,
所述扩光区的出射面的中心朝向所述光源凹陷形成凹透镜部,所述凹透镜 部位于所述光源的光轴上; 所述扩光区的出射面边沿为凸弧面; 所述扩光区的 入射面为中心向所述出射面凹陷的凹弧面。
结合第四种可能的实现方式, 在第五种可能的实现方式中, 所述光学部件 还包括用于聚集光线的聚光区, 所述聚光区位于所述扩光区与所述光源之间; 结合第四种或第五种可能的实现方式,在第六种可能的实现方式中, 所述 光学部件还包括与所述出光口配合连接的普通透光区,所述普通透光区为沿所 述扩光区边缘设置的环状, 且与所述扩光区一体成型; 所述普通透光区的环内 空间形成用于收容所述光源的容置腔。
在第七种可能的实现方式中, 所述光学部件上设有卡柱, 所述基板上设有 与所述卡柱相配合的卡孔, 所述卡柱卡接于所述卡孔中。
在第八种可能的实现方式中, 所述光学部件的周面上设有凸缘, 所述凸缘 位于所述外壳内。
结合第八种可能的实现方式, 在第七种可能的实现方式中, 所述凸缘上远 离所述光学部件的端部向远离所述基板的方向延伸形成卡缘,所述卡缘嵌入所 述夕卜壳。
根据本发明提供的发光体, 外壳包裹在光源组件外, 且包裹基板, 通过包 裹外壳可与基板紧密接触,保证长时间的防水密封性能, 同时外壳与基板紧密 连接可增强二者之间的热传导能力, 以便将光源产生的热量扩散到发光体外; 利用延伸至外壳外的连接线可实现光源与外部电源连接,同时利用连接线亦可 便于外壳的加工制备,使基板位于外壳中的预定位置; 外壳亦可加强基板与连 接线的连接强度。
附困说明
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所 需要使用的附图作筒单地介绍,显而易见地, 下面描述中的附图仅仅是本发明 的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下, 还可以根据这些附图获得其他的附图。
图 1是本发明优选实施例提供的发光体的示意图;
图 2是图 1中发光体的分解示意图;
图 3是图 1中发光体出光一面的示意图;
图 4是图 1中发光体背光一面的示意图;
图 5是图 3中发光体的 A-A处剖面图;
图 6是图 5中光源组件处的剖面图;
图 7是图 3中发光体的 B-B处剖面图;
图 8是图 5中光源组件的配光曲线图;
图 9是本发明的发光体另一实施方式提供的光学部件的示意图;
图 10是本发明的发光体再一实施方式提供的光学部件的示意图。
^»实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清 楚、 完整地描述, 显然, 所描述的实施例仅仅是本发明一部分实施例, 而不是 全部的实施例。基于本发明中的实施例, 本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例, 都属于本发明保护的范围。
参见图 1至图 6本发明优选实施例提供了一种发光体 100, 包括光源组件 1及外壳 2。 外壳 2包裹在光源组件 1外。
光源组件 1 包括基板 11、 至少一个光源 12及用于对光源 12进行配光的 光学部件 13。 光源 12 固定于基板, 本实施例中, 光源 12采用 LED。 外壳 2 包裹基板 11 , 以使得外壳 2与基板 11紧密连接。 基板 11可以为线路板、 电 路板、 PCB板、 柔性电路板 ( FPC )等。 基板 11上连接有与光源 12电连接的 连接线 3 , 连接线 3延伸至外壳 2外。 光学部件 13卡接于基板 11 , 光源 12 位于光学部件 13与基板 11之间。 外壳 1上开设有与光学部件 13相配合的出
光口 20, 光学部件 13位于出光口 20中, 以便出光。
在加工制备发光体 100时, 将光学部件 13卡接于基板 11 , 再将装配好的 带连接线 3的光源组件 1置于包塑机上, 让塑胶将整个光源组件 1包塑起来, 使外壳 2包裹在光源组件 1外并包裹整个基板 11 , 仅通过出光口 20将光学部 件 13露出, 外壳 1可与基板 11紧密接触, 保证长时间的防水密封性能, 同时 外壳 2与基板 11紧密连接可增强二者之间的热传导能力,以便将光源 12产生 的热量扩散到发光体 100 夕卜。 本实施例中利用包塑机通过包塑方式使外壳 2 包裹在光源组件 1外, 当然, 在其他的实施方式中亦可通过包胶、 浇注等其他 方式使外壳 2包裹在光源组件 1外。
利用延伸至外壳 2外的连接线 3可实现光源 12与外部电源连接, 同时利 用连接线 3亦可便于外壳 2的加工制备,使基板 11位于外壳 2中的预定位置, 例如, 夹持固定连接线 3即可将光源组件 1固定于包塑机的预定位置,保持整 个光源组件 1 的定位, 确保外壳 2 包塑在基板 11外的厚度, 即使得基板 11 位于外壳 2中的预定位置。 另外, 外壳 1亦可加强基板 11与连接线 3的连接 强度, 避免在拉拽过程中影响光源 12的供电。
光源 12位于基板 11与光学部件 13之间, 在高压注塑外壳 2的过程中可 避免高温熔融状态的外壳 2的热沖击,从而提高发光体 100的良品率, 同时可 提高光源 12的防水防尘能力。
本实施例中, 如图 1至图 3所示, 光源 12与光学部件 13均为两个, 且二 者一对一配合。基板 11具有相对的第一板面和第二板面, 光源 12及光学部件 13均设置在第一板面上。 基板 11整体呈长条状, 外壳 1包裹在光源组件 1外 后其形状与基板 11形状相配合, 为长条形扁状。 两光源 12沿基板 11的长度 方向排布设置。 为了便于加工装配, 光源 12直接焊接于基板 11上。
本实施例提供的光学部件 13可对光源 12进行配光,使其达到预设配光效 果, 从而提高光线利用率, 提高对广告字体和标识展示效果; 同时利用光学部 件 13可对光源 12起到保护作用。
如图 5、 图 6所示, 所述光学部件 13包括扩光区 13a、 聚光区 13b及普通 透光区 13c。 扩光区 13a的出射面的中心朝向光源凹陷形成凹透镜部, 凹透镜 部位于光源的光轴上; 扩光区 13a的出射面边沿为凸弧面; 扩光区 13a的入射
面为中心向出射面凹陷的凹弧面。利用扩光区 13a可以扩大发光角度及实现均 匀发光, 可实现较好的广角效果。 如图 8所示配光曲线图, 利用光学部件 13 对光源 12进行二次配光后其平均光束角可达到 153.2° 。
如图 6所示, 聚光区 13b用于聚集光线, 聚光区 13b位于扩光区 13a与光 源 12之间。 聚光区 13b的出射面与所述扩光区 13a的入射面相对设置。 利用 聚光区 13b可将光源 12的光线进行聚集, 并射入到扩光区 13a的入射面上, 以充分利用光源 12的光能。 具体实施过程中, 聚光区 13b的出射面可与扩光 区 13a 的入射面形状相吻合并贴合设置, 或者聚光区 13b的出射面与扩光区 13a的入射面之间亦可略有间隙。 聚光区 13b可以与扩光区 13a为一体成型, 便于聚光区 13b的定位以将光线聚集到预设位置即扩光区 13a的入射面上;聚 光区 13b亦可作为单独的部件安装于扩光区 13a的入射面形成的槽中。
普通透光区 13c为沿所述扩光区 13a边缘设置的环状, 且与所述扩光区 13a—体成型。 普通透光区 13c与外壳的出光口配合连接, 从而可避免扩光区 13a与外壳接触而影响扩光效果。 普通透光区 13c的环内空间形成用于收容所 述光源的容置腔 130, 以便使整个光学部件 13形成一个罩体以对光源起到保 护作用。 普通透光区 13c可使光源 12的光线透过即可, 没有配光效果, 可降 低加工难度。
光学部件 13与基板 11装配连接后, 普通透光区 13c可与基板 11的第一 板面贴合, 在容置槽 130中形成密闭空间, 可使得光源 12封装于光学部件 13 的容置槽 130中, 进一步有效避免注塑外壳 2过程中对光源 12的热沖击, 保 证发光体 100的良品率, 同时保证光源 12的防水性能。
光学部件 13卡接于基板 11, 在发光体 100加工制备过程中, 可利于光学 部件 13与基板 11之间的装配连接,可使得光源组件 1的各部件连为一个整体, 从而便于在光源组件 1外包裹外壳 2, 利于发光体的加工制备。 具体地, 结合 图 2及图 5所示, 光学部件 13上设有卡柱 131, 本实施例中卡柱 131设置在 普通透光区 13c上。 基板 11上设有与卡柱 131相配合的卡孔 113, 卡柱 131 卡接于卡孔 113中,从而便于光学部件 13与基板 11的装配连接。本实施例中, 卡柱 131由普通透光区 13c上与基板 11的贴合面延伸形成, 以保证卡柱 131 的结构强度; 各光学部件 13上对称设有两个卡柱 131, 以保证光学部件 13
与基板 11的连接强度。 为了便于光学部件 13的装配, 两光学部件 13之间可 为一体成型, 二者之间可通过连接条连接。
如图 2所示, 光学部件 13的周面上设有凸缘 132, 凸缘 132位于外壳 2 内, 利用凸缘 132可保证光学部件 13与基板 11连接的可靠性,避免光学部件 13从基板 11上拔出。 本实施例中, 凸缘 132设置在普通透光区 13c的外周缘 上。 凸缘 132可以为沿光学部件 13的周面设置的弧状, 凸缘 132为两个或两 个以上, 沿光学部件 13的周向均匀间隔排布设置于光学部件 13的入光端处。 本实施例中, 凸缘 132为四个, 可从四个方位使光学部件 13与外壳 2固定牢 固。 由于凸缘 132之间间隔设置, 外壳 1 的注塑材料可注入到相邻凸缘 132 之间的间隙时, 可防止光学部件 13周向转动。 此处, 作为另外的实施方式, 凸缘 132也可以为一个, 且为沿光学部件 13周向设置的环状。
进一步,凸缘 132上远离光学部件 13的端部向光学部件 13的出光端方向 延伸形成卡缘 133, 在包裹外壳 2时, 卡缘 133可嵌入外壳 2中, 以进一步使 光学部件 13与外壳 1连接牢固可靠。
如图 2所示, 基板 11上设有第一定位孔 1101, 外壳 2的内壁向第一定位 孔 1101内延伸形成有第一定位部(图中未示出)。 由于基板 11上设有第一定 位孔 1101, 在外壳 2注塑过程中, 注塑材料可进入到第一定位孔 1101中形成 第一定位部,从而进一步保证外壳 2与基板 11连接的紧密性,将基板 11牢固 的嵌在外壳 1 中。 本实施例中, 第一定位孔 1101 为两个, 分别位于基板 11 长度方向上的两端, 以将基板 11的两端均固定牢固。
如图 2、 图 5及图 6所示, 基板 11上设有第二定位孔 1102, 外壳 2的内 壁向定位孔内延伸形成有第二定位部 11, 第二定位部 11上设有贯穿孔 220, 贯穿孔 220与定位孔的轴向相同, 且贯穿孔 220的内径小于定位孔的内径, 注 塑外壳 2中注塑材料可将第二定位孔 1102的孔壁包塑封装,保证基板 11的密 封性能及其与外壳 2连接可靠性。 在本实施例中, 第二定位孔 1102位于基板 11的中间位置, 位于两个光源 12之间, 从而可从基板 11的中间位置 板 11与外壳 2连接牢固。
贯穿孔 220贯穿外壳 2, 本实施例中, 贯穿孔 220连通外壳 2出光一面及 背光一面。 利用贯穿孔 220可利于将发光体 100整体通过螺钉、铆钉等紧固件
固定于附着物。 由于第二定位孔 1102位于基板 11的中间位置, 可使得贯穿孔 220位于整个发光体 100的中间位置, 利用紧固件固定后可保证发光体 100牢 固地安装于附着物。
此处需要说明的是,以上第一定位孔 1101及第二定位孔 1102为本发明所 述的定位孔的两个实施方式, 第一定位部及第二定位部 22为本发明的定位部 的两个实施方式。
如图 1及图 5所示, 外壳 1上开设有连通孔 202 , 连通孔 202连通外壳 1 的外壁及基板 11的第二板面。 连通孔 202由注塑模具中的凸起形成, 注塑外 壳 2时, 可将光源组件 1放置模具中的凸起上, 基板 1 1的第二板面抵接于凸 起, 从而利于光源组件 1在模具中的定位, 便于外壳 1的注塑成型, 保证位于 基板 11 的第二板面处的外壳 2厚度。 同时, 利用连通孔 202可便于基板 11 与外界的直接散热, 基板 11上的印刷电路与连通孔 202错位配合, 即印刷电 路不经过连通孔 202 , 以保证印刷电路的密封性, 在具体实施过程中, 印刷电 路可以直接印刷在基板 11上的第一板面,以避免印刷电路与外界的直接连通。
外壳 2的背面即外壳 2上相对背离出光口 201的一面设有双面胶 4 , 便于 将整个发光体 1 00预固定到附着物上, 以利于进一步通过紧固件固定。
如图 2所示, 本实施例中, 连接线 3为双排线, 以连接驱动电源的正负两 极。 基板 11连接有两条连接线 3 , 以实现多个发光体之间的串接。 本实施例 中, 两条连接线 3分别连在基板 11长度方向上的两端。
外壳 2的外壁沿连接线 3向外延伸形成用于包裹部分连接线 3的加强部
23 , 利用加强部 23可加强连接线 3与外壳 2的连接强度, 并保证二者之间的 密封性能。 加强部 23上设有穿孔 230 , 穿孔 230贯穿外壳 2的出光一面及背 光一面, 穿孔 230处露出部分连接线 3 , 外壳 2出光一面的水可以从穿孔向背 光一面渗透, 以使外壳 2出光一面不产生积水, 从而避免影响发光效果。
在本实施例,以具有两个光源 12及光学部件 1 3的发光体 100为例进行了 具体描述, 发光体 100具有两个光源 12及两个光学部件 1 3 , 其可保证单个发 光体 100的光照强度, 同时装配、 包塑的加工难度较小, 易于外壳 2的一次注 塑成型,便于加工成灯带;另外还可避免单个发光体 100发热量大,利于散热。 作为另外的实施例, 发光体 1 00可以具有一个光源 12及光学部件 1 3 , 或者具
有三个或以上光源 12及光学部件 1 3。 当光源 12及光学部件 1 3的配合为三个 或以上时, 根据发光体 1 00的应用场合不同可将光源 12排列成不同形状, 同 时, 基板 1 1及发光体 100的整体形状可以做成长条形、 三角形、 正方形、 圓 形或其他几何形状。 第二定位孔 1102及贯穿孔 220可位于相邻两个光源 12 之间。
在上述实施例中, 光学部件可实现广角及均光的配光效果, 以便将发光体 应用至广告牌、标识等媒介上,光学部件的形状结构并不局限于上述实施方式, 在另外的实施方式中, 如图 9所述, 光学部件 1 3为柱状, 其轴向与光轴重合, 其轴向相对的两端分别为入光端和出光端, 入光端与基板 11配合卡机, 入光 端设有用于容置光源 12的凹槽, 出光端端面为平面, 亦可实现扩光效果。 作 为再一种实施方式, 如图 10所示, 光学部件 1 3还可以为聚光透镜, 可以实现 聚集光线的配光效果, 使发光体的光线为直线效果, 且可传播的更远。
在上述实施例中, 采用光学部件以实现预定扩光的配光效果,且在外壳上 设置有出光孔以便光学部件的装配设置,作为另外的实施方式, 亦可不设置该 光学部件, 而仅适用普通透光罩体将光源罩住即可, 或者, 外壳是采用透明材 质, 不必使用光学部件或透光罩, 外壳将基板及光源整体包裹, 光源的光线直 接透过外壳出射。
最后应说明的是: 以上实施例仅用以说明本发明的技术方案, 而非对其限 制; 尽管参照前述实施例对本发明进行了详细的说明, 本领域的普通技术人员 应当理解: 其依然可以对前述各实施例所记载的技术方案进行修改, 或者对其 中部分技术特征进行等同替换; 而这些修改或者替换, 并不使相应技术方案的 本质脱离本发明各实施例技术方案的精神和范围。
Claims
1、 一种发光体, 其特征在于, 包括光源组件及外壳;
所述外壳包裹在所述光源组件外;
所述光源组件包括基板及至少一个光源; 所述光源固定于所述基板, 所述 外壳包裹所述基板, 所述基板上连接有与所述光源电连接的连接线, 所述连接 线延伸至所述外壳外。
2、 根据权利要求 1所述的发光体, 其特征在于, 所述基板上设有定位孔, 所述外壳的内壁向所述定位孔内延伸形成有定位部。
3、 根据权利要求 1所述的发光体, 其特征在于, 所述外壳的外壁沿所述 连接线向外延伸形成用于包裹部分所述连接线的加强部。
4、 根据权利要求 1所述的发光体, 其特征在于, 所述光源组件还包括用 于对光源进行配光的光学部件; 所述光学部件卡接于所述基板, 所述光源固定 于所述基板, 且所述光源位于所述光学部件与所述基板之间;
所述外壳上设有出光口, 所述光学部件位于所述出光口中。
5、 根据权利要求 4所述的发光体, 其特征在于, 所述光学部件包括扩光 区,
所述扩光区的出射面的中心朝向所述光源凹陷形成凹透镜部,所述凹透镜 部位于所述光源的光轴上; 所述扩光区的出射面边沿为凸弧面; 所述扩光区的 入射面为中心向所述出射面凹陷的凹弧面。
6、 根据权利要求 5所述的发光体, 其特征在于, 所述光学部件还包括用 于聚集光线的聚光区, 所述聚光区位于所述扩光区与所述光源之间; 所述聚光 区的出射面与所述扩光区的入射面相对设置。
7、 根据权利要求 5或 6所述的发光体, 其特征在于, 所述光学部件还包 括与所述出光口配合连接的普通透光区,所述普通透光区为沿所述扩光区边缘 设置的环状, 且与所述扩光区一体成型; 所述普通透光区的环内空间形成用于 收容所述光源的容置腔。
8、 根据权利要求 1所述的发光体, 其特征在于, 所述光学部件上设有卡
柱, 所述基板上设有与所述卡柱相配合的卡孔, 所述卡柱卡接于所述卡孔中。
9、 根据权利要求 1所述的发光体, 其特征在于, 所述光学部件的周面上 设有凸缘, 所述凸缘位于所述外壳内。
10、 根据权利要求 9所述的发光体, 其特征在于, 所述凸缘上远离所述光 学部件的端部向远离所述基板的方向延伸形成卡缘, 所述卡缘嵌入所述外壳。
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