WO2015050260A3 - Polishing agent composition, polishing agent composition for silicon wafer, and method for manufacturing silicon wafer product - Google Patents

Polishing agent composition, polishing agent composition for silicon wafer, and method for manufacturing silicon wafer product Download PDF

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Publication number
WO2015050260A3
WO2015050260A3 PCT/JP2014/076631 JP2014076631W WO2015050260A3 WO 2015050260 A3 WO2015050260 A3 WO 2015050260A3 JP 2014076631 W JP2014076631 W JP 2014076631W WO 2015050260 A3 WO2015050260 A3 WO 2015050260A3
Authority
WO
WIPO (PCT)
Prior art keywords
agent composition
polishing agent
silicon wafer
group
water
Prior art date
Application number
PCT/JP2014/076631
Other languages
French (fr)
Japanese (ja)
Other versions
WO2015050260A2 (en
Inventor
竜一 谷本
古屋田　栄
孝一 福井
Original Assignee
株式会社Sumco
Ａｔシリカ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Sumco, Ａｔシリカ株式会社 filed Critical 株式会社Sumco
Priority to JP2015540576A priority Critical patent/JP6373273B2/en
Priority to KR1020157036384A priority patent/KR101785450B1/en
Publication of WO2015050260A2 publication Critical patent/WO2015050260A2/en
Publication of WO2015050260A3 publication Critical patent/WO2015050260A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Provided are: a polishing agent composition that contains silica particles, an alkali substance, a water-soluble synthetic polymer, and water, and that is characterized by the water-soluble synthetic polymer having structural unit (1), the structural unit (1) having an oxygen-containing group and a carbonyl group, the oxygen-containing group being an alcoholic hydroxyl group or a substituted or unsubstituted alkoxy group, and the carbonyl group being a keto group or forming part of an ester bond or an amide bond; a polishing agent composition for silicon wafers that uses said polishing agent composition; and a method for manufacturing a silicon wafer product.
PCT/JP2014/076631 2013-10-04 2014-10-03 Polishing agent composition, polishing agent composition for silicon wafer, and method for manufacturing silicon wafer product WO2015050260A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015540576A JP6373273B2 (en) 2013-10-04 2014-10-03 Abrasive composition, abrasive composition for silicon wafer, and method for producing silicon wafer product
KR1020157036384A KR101785450B1 (en) 2013-10-04 2014-10-03 Polishing agent composition, polishing agent composition for silicon wafer, and method for manufacturing silicon wafer product

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013209171 2013-10-04
JP2013-209171 2013-10-04

Publications (2)

Publication Number Publication Date
WO2015050260A2 WO2015050260A2 (en) 2015-04-09
WO2015050260A3 true WO2015050260A3 (en) 2015-06-04

Family

ID=52779247

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/076631 WO2015050260A2 (en) 2013-10-04 2014-10-03 Polishing agent composition, polishing agent composition for silicon wafer, and method for manufacturing silicon wafer product

Country Status (4)

Country Link
JP (1) JP6373273B2 (en)
KR (1) KR101785450B1 (en)
TW (1) TWI553049B (en)
WO (1) WO2015050260A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6169938B2 (en) * 2013-10-04 2017-07-26 花王株式会社 Polishing liquid composition for silicon wafer
JP6678076B2 (en) * 2016-06-30 2020-04-08 花王株式会社 Polishing liquid composition for silicon wafer
KR102305256B1 (en) * 2016-09-21 2021-09-29 가부시키가이샤 후지미인코퍼레이티드 surface treatment composition
JP6916039B2 (en) * 2017-06-05 2021-08-11 Ａｔシリカ株式会社 Polishing composition
JP7519865B2 (en) 2020-10-09 2024-07-22 花王株式会社 Polishing Method
CN112876377A (en) * 2021-01-15 2021-06-01 南京红宝丽醇胺化学有限公司 Preparation method of hydroxypropyl acrylamide

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053415A (en) * 2006-08-24 2008-03-06 Fujimi Inc Polishing composition and polishing method
JP2011171689A (en) * 2009-07-07 2011-09-01 Kao Corp Polishing liquid composition for silicon wafer
JP2012015462A (en) * 2010-07-05 2012-01-19 Kao Corp Polishing liquid composition for silicon wafer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822356B2 (en) * 2012-04-17 2015-11-24 花王株式会社 Polishing liquid composition for silicon wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053415A (en) * 2006-08-24 2008-03-06 Fujimi Inc Polishing composition and polishing method
JP2011171689A (en) * 2009-07-07 2011-09-01 Kao Corp Polishing liquid composition for silicon wafer
JP2012015462A (en) * 2010-07-05 2012-01-19 Kao Corp Polishing liquid composition for silicon wafer

Also Published As

Publication number Publication date
TWI553049B (en) 2016-10-11
JPWO2015050260A1 (en) 2017-03-09
WO2015050260A2 (en) 2015-04-09
KR101785450B1 (en) 2017-10-16
KR20160013971A (en) 2016-02-05
TW201529670A (en) 2015-08-01
JP6373273B2 (en) 2018-08-15

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