WO2015041335A1

WO2015041335A1 - Projection optical system, method for adjusting projection optical system, exposure apparatus, exposure method, and device production method

Info

Publication number: WO2015041335A1
Application number: PCT/JP2014/074896
Authority: WO
Inventors: 陽介柘植; 拓郎小野; 大村　泰弘; 吉晴湯淺; 啓佑長谷川
Original assignee: 株式会社ニコン
Priority date: 2013-09-19
Filing date: 2014-09-19
Publication date: 2015-03-26
Also published as: TW201514541A

Abstract

Provided is a projection optical system in which, for example, wave aberration caused by light irradiation can be adjusted. This projection optical system forms an image of a first surface on a second surface. The projection optical system comprises: a first image-forming optical unit that is arranged in an optical path between the first surface and the second surface, and that includes a first concave-surface reflection mirror having a deformable reflection surface; and a second image-forming optical unit that is arranged in an optical path between the first image-forming optical unit and the second surface, and that includes a second concave-surface reflection mirror having a deformable reflection surface.

Description

Projection optical system, projection optical system adjustment method, exposure apparatus, exposure method, and device manufacturing method

The present invention relates to a projection optical system, a projection optical system adjustment method, an exposure apparatus, an exposure method, and a device manufacturing method.

In a photolithography process for manufacturing a device such as a semiconductor element, an exposure apparatus that projects and exposes a mask (reticle) pattern onto a photosensitive substrate (a wafer coated with a photoresist) via a projection optical system Is used. In the exposure apparatus, as the mask pattern becomes finer, the resolution (resolution) required for the projection optical system is increasing. In order to satisfy the requirement for the resolution of the projection optical system, it is necessary to shorten the wavelength λ of the illumination light (exposure light) and increase the image-side numerical aperture NA of the projection optical system.

Therefore, there is known an immersion technique for increasing the image-side numerical aperture by filling a medium such as a liquid having a high refractive index in the optical path between the projection optical system and the photosensitive substrate. In general, in a projection optical system having a large image-side numerical aperture, the use of a catadioptric optical system is desirable from the viewpoint of obtaining the flatness of the image by satisfying the Petzval condition even in a dry system without being limited to an immersion system. . Conventionally, various catadioptric optical systems suitable for a projection optical system of an exposure apparatus have been proposed (see, for example, Patent Document 1).

US Pat. No. 7,301,605

In the projection optical system mounted on the exposure apparatus, the optical characteristics fluctuate due to the influence of irradiation energy of light passing through the optical system during exposure. Specifically, the optical surface of the lens changes or the refractive index distribution of the lens changes due to light irradiation. In addition, the lens interval changes due to deformation of the lens barrel due to light irradiation, or the density distribution (refractive index distribution) of the atmosphere changes due to light irradiation. The fluctuation of the optical characteristics deteriorates the wavefront aberration of the projection optical system, and consequently the imaging performance such as the resolving power of the projection optical system.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a projection optical system having high imaging performance, for example. It is another object of the present invention to provide an exposure apparatus that can project and expose a fine pattern onto a photosensitive substrate with high accuracy using a projection optical system having high imaging performance.

In order to solve the above problem, in the first embodiment, in the projection optical system that forms the image of the first surface on the second surface,
A first imaging optical portion disposed in an optical path between the first surface and the second surface and including a first concave reflecting mirror to form an intermediate image of the first surface;
A second imaging optical part that is arranged in an optical path between the first imaging optical part and the second surface, includes a second concave reflecting mirror, and forms an image of the intermediate image;
At least one of the first concave reflecting mirror and the second concave reflecting mirror has a deformable reflecting surface, and a projection optical system is provided.
In the second embodiment, in the projection optical system that forms the image of the first surface on the second surface,
A first imaging optical unit including a first concave reflecting mirror disposed in an optical path between the first surface and the second surface and having a deformable reflecting surface;
A second imaging optical unit including a second concave reflecting mirror disposed in an optical path between the first imaging optical unit and the second surface and having a deformable reflecting surface. A characteristic projection optical system is provided.
In the third embodiment, in the projection optical system that forms the image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. The first concave reflecting mirror is disposed on the first surface side from a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. Arranged,
The second concave reflecting mirror is disposed on the second surface side from a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. A projection optical system is provided.
In the fourth embodiment, in the projection optical system that forms the image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. The first concave reflecting mirror is disposed on the second surface side from a first pupil position optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. Arranged,
The second concave reflecting mirror is disposed on the first surface side from a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. A projection optical system is provided.
In the fifth embodiment, in the projection optical system that forms the image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. The first concave reflecting mirror is disposed at a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit,
The second concave reflecting mirror is located on the first surface side or the second surface from a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Provided is a projection optical system characterized in that the projection optical system is arranged on the side.
In the sixth aspect, in the projection optical system that forms the image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. And
The first concave reflecting mirror is located on the first surface side or the second surface from a first pupil position optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. Placed on the side
The second concave reflecting mirror is disposed at a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. An optical system is provided.
In the seventh embodiment, in a projection optical system that forms an image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. The first concave reflecting mirror is disposed at a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit,
The second concave reflecting mirror is disposed at a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. An optical system is provided.

In the eighth embodiment, in the projection optical system that forms the image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The second imaging optical system includes a plurality of positive lenses disposed in an optical path between the first intermediate image and the first concave reflecting mirror,
The third image-forming optical system includes a plurality of positive lenses arranged in an optical path between the second intermediate image and the second concave reflecting mirror. .
In the ninth embodiment, in the projection optical system that forms the image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The fourth imaging optical system is provided with a projection optical system including a positive lens that is disposed closest to the third intermediate image and has a convex surface facing the second surface.
In a tenth aspect, in a projection optical system that forms an image of a first surface on a second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The second imaging optical system includes a positive meniscus lens that is disposed closest to the first intermediate image side and has a convex surface facing the first intermediate image side. .
In the eleventh aspect, in the projection optical system for forming the image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The second imaging optical system is provided with a lens that is disposed closest to the first intermediate image side and that is disposed adjacent to the first concave reflecting mirror. To do.
In a twelfth aspect, in a projection optical system that forms an image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The second imaging optical system includes a positive meniscus lens that is disposed closest to the first intermediate image side and has a convex surface facing the first intermediate image side. .
In the thirteenth aspect, in a projection optical system that forms an image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The second imaging optical system is provided with a lens that is disposed closest to the first intermediate image side and that is disposed adjacent to the first concave reflecting mirror. To do.
In the fourteenth aspect, in a projection optical system that forms an image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
A first deflecting mirror disposed in an optical path between the first imaging optical system and the second imaging optical system;
A projection optical system comprising a second deflecting mirror disposed between the third imaging optical system and the fourth imaging optical system is provided.

In the fifteenth aspect, in the adjustment method of the projection optical system of any one of the first to seventh aspects,
Adjusting the wavefront aberration of the projection optical system by applying deformation according to the same function display to the reflecting surface of the first concave reflecting mirror and the reflecting surface of the second concave reflecting mirror. An adjustment method characterized by the above is provided.

In a sixteenth aspect, the first to fourteenth aspects for projecting the predetermined pattern onto a substrate set on the second surface based on light from the predetermined pattern set on the first surface. An exposure apparatus comprising any one of the projection optical systems is provided.

In a seventeenth aspect, guiding light from a predetermined pattern set on the first surface to a projection optical system and projecting the predetermined pattern onto a substrate set on the second surface;
And adjusting the projection optical system using the adjustment method according to the fifteenth aspect.

In an eighteenth aspect, using the exposure apparatus of the sixteenth form or the exposure method of the seventeenth form, exposing the predetermined pattern to the substrate;
Developing the substrate to which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on the surface of the substrate;
And processing the surface of the substrate through the mask layer. A device manufacturing method is provided.

It is a figure which shows schematically the structure of the projection optical system concerning embodiment of this invention. It is a figure which shows roughly the effective image formation area in the image surface of a projection optical system. It is a figure which shows roughly the effective visual field area | region in the object surface of a projection optical system. It is a figure which shows schematically the active deformation | transformation part provided with the some actuator provided in the back side of the concave reflecting mirror. It is a figure which shows roughly distribution of the action point of a some actuator. It is a figure explaining the definition of the parameter | index G showing the positional relationship of an optical surface and a pupil position. It is a 1st figure explaining adjustment of the wavefront aberration in the projection optical system concerning this embodiment. It is a 2nd figure explaining adjustment of the wavefront aberration in the projection optical system concerning this embodiment. Is a diagram showing an appropriate range of index G when the applied deformation according to the function FZ _17. Is a diagram showing an appropriate range of index G when the applied deformation according to the function FZ _28. It is a figure which shows schematically the structure of the exposure apparatus concerning this embodiment. It is a figure which shows typically the structure between the boundary lens and wafer in each Example of this embodiment. It is a figure which shows the lens structure of the projection optical system concerning the 1st Example of this embodiment. (A) shows aberration components generated when the first concave reflecting mirror CM1 is deformed according to the function FZ ₁₇ in the first embodiment, and (b) shows the second concave reflecting mirror CM2 in the first embodiment. An aberration component generated when the same deformation as that of the first concave reflecting mirror CM1 is given is shown. (A) shows a state in which the 0th-order aberration component is mainly generated in the first embodiment, and (b) shows a state in which the first-order aberration component is mainly generated in the first embodiment. It is a figure which shows the lens structure of the projection optical system concerning 2nd Example of this embodiment. It is a figure which shows the lens structure of the projection optical system concerning 3rd Example of this embodiment. It is a figure which shows the lens structure of the projection optical system concerning 4th Example of this embodiment. It is a flowchart which shows the manufacturing process of a semiconductor device. It is a flowchart which shows the manufacturing process of liquid crystal devices, such as a liquid crystal display element.

Hereinafter, embodiments will be described with reference to the accompanying drawings. FIG. 1 is a diagram schematically showing a configuration of a projection optical system according to an embodiment of the present invention. In the present embodiment, as an example of a projection optical system mounted on the exposure apparatus, a four-fold imaging type catadioptric optical system PL comprising four imaging optical units K1, K2, K3, and K4 as shown in FIG. Is assumed. In FIG. 1, the Z-axis is along the normal direction of the transfer surface (exposure surface) of the wafer W, which is a photosensitive substrate, and the Y-axis is in the direction parallel to the paper surface of FIG. In the W transfer surface, the X axis is set in a direction perpendicular to the paper surface of FIG.

When applied to an exposure apparatus, the projection optical system PL of the present embodiment has an image surface (second surface) on which the exposure surface of the wafer W is installed from the object surface (first surface) OB on which the pattern surface of the mask M is installed. Surface) a catadioptric optical system including a first imaging optical unit K1 serving as a refractive optical system, a first planar reflecting mirror FM1 serving as a deflecting mirror for bending an optical path, and a first concave reflecting mirror CM1 in the order of incidence of light on IM. A second imaging optical unit K2 as a system, a third imaging optical unit K3 as a catadioptric optical system including a second concave reflecting mirror CM2, a second planar reflecting mirror FM2 as a deflecting mirror for bending the optical path, And a fourth imaging optical unit K4 as a refractive optical system. In each example of the present embodiment, the first flat reflecting mirror FM1 and the second flat reflecting mirror FM2 are formed as an integrated optical member. Note that the first planar reflecting mirror FM1 and the second planar reflecting mirror FM2 may be separate optical members. In the present embodiment, the imaging optical unit can be an imaging optical system that forms an image of a predetermined surface on the imaging surface. In the present embodiment, the imaging optical unit can be an imaging optical system in which different predetermined surfaces are in an optically conjugate relationship. In the present embodiment, the first imaging optical unit K1 and the second imaging optical unit K2 can be regarded as a first imaging optical part that forms an intermediate image of the object plane (first surface) OB. The third imaging optical unit K3 and the fourth imaging optical unit K4 can be regarded as a second imaging optical portion that forms an intermediate image on the image plane (second surface).

In this case, as shown in FIG. 2, the effective imaging region ER on the image plane IM of the projection optical system PL is a region away from the optical axis AX of the projection optical system PL. Specifically, the effective imaging region ER is a rectangular region separated from the optical axis AX by a distance Ra along the Y direction in the image field IF having a radius Rb centered on the optical axis AX, that is, in the X direction. A rectangular region having a long side (dimension LX) along the Y direction and a short side (dimension LY) along the Y direction. Therefore, as shown in FIG. 3, the effective field area FR on the object plane OB of the projection optical system PL is a rectangular area separated from the optical axis AX of the projection optical system PL in the Y direction. The effective imaging region ER may be a region where light from the object plane OB is guided on the image plane IM of the projection optical system PL and the aberration is substantially corrected. The effective imaging region ER may be a region where light from the object plane OB is guided on the image plane IM of the projection optical system PL.

In the present embodiment, the reflecting surface of the first concave reflecting mirror CM1 and the reflecting surface of the second concave reflecting mirror CM2 are configured to be deformable, and the first active deforming portion actively activates the reflecting surface of the first concave reflecting mirror CM1. The second active deformation portion actively deforms the reflecting surface of the second concave reflecting mirror CM2. As an example, as shown in FIG. 4, an active deformation portion AD including a plurality of actuators AC provided on the back side of the concave reflecting mirror CM1 (CM2) can be used. As shown in FIG. 5, for example, the plurality of actuators AC are arranged such that their action points ACa are distributed radially. A plurality of actuators AC may be arranged such that their action points ACa are distributed in a two-dimensional matrix.

The active deformation unit AD deforms the reflecting surface CM1a (CM2a) into a desired surface shape by a plurality of actuators AC pushing and pulling the reflecting surface CM1a (CM2a) of the concave reflecting mirror CM1 (CM2) from the back side. US Pat. No. 6,842,277 can be referred to for a specific configuration and action of the active deformation portion AD. For the arrangement of the action points ACa of the plurality of actuators AC in the active deformation portion AD, reference can be made to US Pat. No. 6,842,277. Moreover, as an active deformation part, U.S. Pat. Nos. 5,115,351, 6,398,373, 6,411,426, 6,803,994, 6,880,942, and U.S. Pat. A deformation mechanism disclosed in Japanese Patent Publication No. 2010 / 0033704A1 can also be used. Further, at least one of the reflecting surfaces CM1a (CM2a) of the concave reflecting mirror CM1 (CM2) may be deformable.

In the first example of the present embodiment, as will be described later, the first concave reflecting mirror CM1 is optically Fourier-transformed with the position of the object plane OB in the optical path of the second imaging optical unit K2. It is arranged on the image plane IM side with respect to one pupil position. The second concave reflecting mirror CM2 is disposed on the object plane OB side with respect to the second pupil position that is optically Fourier-transformed with the position of the object plane OB in the optical path of the third imaging optical unit K3. ing.

In the second embodiment, the first concave reflecting mirror CM1 is disposed on the object plane OB side with respect to the first pupil position, and the second concave reflecting mirror CM2 is disposed on the image plane IM side with respect to the second pupil position. Yes. In the third embodiment, the first concave reflecting mirror CM1 is arranged on the image plane IM side with respect to the first pupil position, and the second concave reflecting mirror CM2 is arranged at a position substantially coincident with the second pupil position. In the fourth embodiment, the first concave reflecting mirror CM1 is arranged at a position substantially coincident with the first pupil position, and the second concave reflecting mirror CM2 is arranged at a position almost coincident with the second pupil position.
In the present embodiment and examples, the pupil position can be a position that is optically Fourier-transformed with the position of the object plane OB or the position of the image plane IM.
In the present embodiment and examples, the pupil position is optically conjugate with the entrance pupil of the catadioptric optical system PL that can be regarded as a projection optical system and the exit pupil of the catadioptric optical system PL. It can be at least one of the conjugate positions.

In the present embodiment, an index G representing the positional relationship between an arbitrary optical surface (for example, the reflecting surfaces CM1a and CM2a of the concave reflecting mirrors CM1 and CM2) and the pupil position closest to the arbitrary optical surface is defined. Specifically, the index G is defined by the following equation (a).
G = A / Re (a)

In Expression (a), Re is a partial spot occupied by an arbitrary optical surface when the light beam from each point in the effective field area FR on the object plane OB reaches the arbitrary optical surface as shown in FIG. The radius of the circle PG circumscribing the set of Here, the partial spot means a region occupied by an arbitrary optical surface when a light beam emitted from each point in the effective visual field region FR reaches an arbitrary optical surface with an opening angle corresponding to the maximum numerical aperture. is doing.

As shown in FIG. 6, A circumscribes a partial spot PSa occupied by an arbitrary optical surface when a light beam from the center point FRa (see FIG. 3) of the effective visual field region FR reaches the arbitrary optical surface. A light beam from a center position RCac of a rectangle RCa that is rectangular and has one side in a direction corresponding to one side of the effective visual field region FR, and a point FRb (see FIG. 3) of the maximum object height in the effective visual field region FR Arbitrary optical surface with the center position RCbc of a rectangle RCb that is a rectangle circumscribing the partial spot PSb that occupies the arbitrary optical surface when it reaches the optical surface and has one side in a direction corresponding to one side of the effective visual field region FR The distance at. The center point FRa of the effective visual field region FR can be the center of gravity of the effective visual field region FR.

Therefore, if the index G1 related to the reflecting surface CM1a of the first concave reflecting mirror CM1, that is, the index G1 indicating the positional relationship between the reflecting surface CM1a and the first pupil position in the optical path of the second imaging optical unit K2 is 0, reflection is performed. The surface CM1a is at the first pupil position, and the distance of the reflection surface CM1a from the first pupil position increases as the index G1 increases. Similarly, if the index G2 related to the reflecting surface CM2a of the second concave reflecting mirror CM2, that is, the index G2 representing the positional relationship between the reflecting surface CM2a and the second pupil position in the optical path of the third imaging optical unit K3 is 0. The reflection surface CM2a is at the second pupil position, and the distance of the reflection surface CM2a from the second pupil position increases as the index G2 increases.

Next, adjustment of wavefront aberration in the projection optical system PL according to the present embodiment will be described with reference to FIG. The imaging optical system shown in FIG. 7 is similar to (modeled) the projection optical system according to the present embodiment as a simple imaging optical system. For the sake of simplicity, the adjustment of wavefront aberration in the modeled imaging optical system shown in FIG. 7 will be described below.
The modeled imaging optical system shown in FIG. 7 is a one-time imaging type refractive optical system that optically conjugates the object plane OB and the image plane IM, and the object plane OB at the pupil position PP. An optical surface correction mechanism MD1 is arranged on the side, and an optical surface correction mechanism MD2 is arranged on the image plane IM side of the pupil position PP. The operations of the correction mechanisms MD1 and MD2 correspond to the operations of the concave reflecting mirrors CM1 and CM2 when the reflecting surfaces CM1a and CM2a are deformed in the projection optical system PL of the present embodiment. In other words, the correction mechanisms MD1 and MD2 have a function of giving a given wavefront aberration component to the light beams passing through the respective optical surfaces.

In the present embodiment, deformations according to the same function display are applied to the reflecting surface CM1a of the first concave reflecting mirror CM1 and the reflecting surface CM2a of the second concave reflecting mirror CM2. Hereinafter, as an example, a case will be considered in which a deformation according to the function FZ ₁₇ : ρ ⁴ cos4θ according to the seventeenth term in a Zernike polynomial using a polar coordinate system is given. Here, ρ is a normalized half-range when the radius of the circular effective reflection region of the reflection surfaces CM1a and CM2a is normalized to 1, and θ is a radial angle of polar coordinates.

First, the operation of one correction mechanism MD1 will be considered. The action of the correction mechanism MD1 corresponds to the action of the concave reflecting mirror CM1 when the deformation according to the function FZ ₁₇ is given to the reflecting surface CM1a. In this case, as the wavefront aberration related to the center position of the effective image forming region ER ERa (see Figure 2), aberration components Z17 of 4 rotational symmetry that are displayed according to the function _{FZ 17} is generated. This can be easily understood from the fact that when the light beam reaching the center position ERa of the effective imaging region ER passes through the correction mechanism MD1, it passes through the region centered on the optical axis.

By the action of the correcting mechanism MD1, as the wavefront aberration related to the first peripheral position ERb along from the central position ERa effective image forming region ER in the + X direction (see FIG. 2), as shown in FIG. 8, according to the function _{FZ 17} The displayed four-fold rotationally symmetric aberration component Z17 and the three-fold rotationally symmetric aberration component Z10 (+) displayed according to the function FZ ₁₀ : ρ ³ cos3θ according to the tenth term are generated. This is because when the light beam reaching the first peripheral position ERb of the effective imaging region ER passes through the correction mechanism MD1, it passes through a region decentered in the −X direction from the optical axis.

By the action of the correcting mechanism MD1, as the wavefront aberration related to the second peripheral position ERc along the -X direction from the center position ERa effective image forming region ER (see FIG. 2), as shown in FIG. 8, the function _{FZ 17} Therefore the aberration component Z17 of 4 rotational symmetry displayed, aberration components of 3-fold rotational symmetry, which is displayed according to the function FZ ₁₀ according to Section 10 Z10 (-) and is generated. This is because when the light beam reaching the second peripheral position ERc of the effective imaging region ER passes through the correction mechanism MD1, it passes through a region decentered in the + X direction from the optical axis.

Here, the sign of the coefficient of the function FZ ₁₇ representing the aberration component Z17 is the same without depending on the position in the X direction in the effective image formation region ER, and the magnitude of the coefficient is the position in the X direction in the effective image formation region ER. It is almost constant without dependence. On the other hand, the sign of the coefficient of the function FZ ₁₀ representing the aberration component Z10 is opposite between the first peripheral position ERb and the second peripheral position ERc, and the magnitude of the coefficient depends on the position in the X direction in the effective imaging region ER. It is almost constant without.

In order to understand the cooperative action of the pair of correction mechanisms MD1 and MD2, as a simplest example, the imaging optical system shown in FIG. 7 is configured symmetrically with respect to the pupil position PP, and the correction mechanisms MD1 and MD2 Are arranged symmetrically with respect to the pupil position PP. Furthermore, the effect of the correction mechanism MD1, MD2, the reflective surface CM 1, corresponds to the action of the concave reflecting mirror CM1, CM2 when only each other the same amount deformation according to the function _{FZ 17} granted to CM2a having the same surface shape as each other It shall be.

In this case, as described above, the wavefront aberration generated by the action of the correction mechanism MD1 at each point on the straight line extending in the X direction through the center position ERa of the effective imaging region ER is displayed according to the function FZ ₁₇ 4. the aberration component Z17 times rotational symmetry, aberration components Z10 (1) of the 3-fold rotational symmetry, which is displayed according to the function _{FZ 10} and is generated. Similarly, as the wavefront aberration produced by the action of the correcting mechanism MD2 for each point on a straight line extending as X-direction central position ERa effective image forming region ER, the aberration of the 4-fold rotational symmetry, which is displayed according to the function FZ ₁₇ a component Z17, aberration component Z10 (2) of the 3-fold rotational symmetry, which is displayed according to the function _{FZ 10} and is generated.

When correction mechanisms MD1 and MD2 are arranged symmetrically with respect to pupil position PP, and the actions of correction mechanisms MD1 and MD2 correspond to the actions of concave reflecting mirrors CM1 and CM2 when the same amount of deformation is applied to each other , sign and magnitude of the coefficients of the function _{FZ 17} representing the aberration component Z17 is the same to each other in the correction mechanism MD1 and MD2, sign and magnitude of the coefficients of the function _{FZ 10} representing the aberration component Z10 is a correction mechanism MD1 MD2 And reverse. The sign and magnitude of the coefficients of the function FZ ₁₀ representing the aberration component Z10 is inverted by the correction mechanism MD1 and MD2, the region where the light flux reaching the point of the effective imaging region ER passes the correction mechanism MD1 and correction mechanism It can be easily understood from the fact that the region passing through MD2 is eccentric to the opposite side with respect to the optical axis.

Accordingly, the correction mechanisms MD1 and MD2 are arranged symmetrically with respect to the pupil position PP, and the action of the correction mechanisms MD1 and MD2 corresponds to the action of the concave reflecting mirrors CM1 and CM2 when the same sign and size are applied. In this case, the aberration component Z10 is canceled by the cooperative action of the correction mechanisms MD1 and MD2, and only the doubled aberration component Z17 is generated as a wavefront aberration. In other words, by the cooperative action of the correction mechanisms MD1 and MD2, generating a zero-order aberration component that is a uniform aberration component for each point along the X direction in the effective imaging region ER on the image plane IM; As a result, the zero-order aberration component of the wavefront aberration can be adjusted.

On the other hand, the correction mechanisms MD1 and MD2 are arranged symmetrically with respect to the pupil position PP, and the actions of the concave reflecting mirrors CM1 and CM2 when the actions of the correction mechanisms MD1 and MD2 are given different deformations and the same size. , The aberration component Z17 is canceled by the cooperative action of the correction mechanisms MD1 and MD2, and only the doubled aberration component Z17 is generated as a wavefront aberration. This is because the aberration components Z17 and Z10 are also reversed when the sign of the applied deformation is reversed. In other words, by the cooperative action of the correction mechanisms MD1 and MD2, a primary aberration component that is an aberration component that linearly changes for each point along the X direction in the effective imaging region ER is generated, and thus the wavefront. The primary aberration component of the aberration can be adjusted.

This means that if the correction mechanisms MD1 and MD2 are not arranged symmetrically with respect to the pupil position PP, the function FZ ₁₇ expressing the deformation to be applied to the correction mechanisms MD1 and MD2 if the correction mechanisms MD1 and MD2 are arranged across the pupil position PP. If the sign and the magnitude of the coefficient are appropriately set (or changed), the zero-order aberration component and the first-order aberration component are independently generated for each point along the X direction in the effective imaging region ER. This means that the zero-order aberration component and the first-order aberration component of the wavefront aberration can be adjusted independently.

Further, when the correction mechanism MD1 is arranged at a required distance from the pupil position PP and the correction mechanism MD2 is arranged at the position of the pupil position PP, the aberration component Z17 and the aberration component Z10 are generated by the action of the correction mechanism MD1. Only the aberration component Z17 is generated by the action of the correction mechanism MD2. This is because when one of the correction mechanisms is arranged at a required distance from the pupil position PP and the other correction mechanism is arranged at or near the pupil position PP, the deformation applied to the correction mechanisms MD1 and MD2. The coefficient sign and the magnitude of the function FZ ₁₇ expressing the value are appropriately set (or changed), and the zero-order aberration component and the first-order aberration component for each point along the X direction in the effective imaging region ER are set. This means that it is generated to some extent independently, and that the 0th-order aberration component and the first-order aberration component of the wavefront aberration can be independently adjusted to some extent.

When both the correction mechanisms MD1 and MD2 are arranged at or near the pupil position PP, only the aberration component Z17 is generated by the action of the correction mechanism MD1, and only the aberration component Z17 is generated by the action of the correction mechanism MD2. Will do. This means that when both correction mechanisms are arranged at or near the pupil position PP, the sign and size of the coefficient of the function FZ ₁₇ expressing the deformation to be applied to the correction mechanisms MD1 and MD2 are set appropriately. (Or changing) to generate only a required amount of the zero-order aberration component for each point along the X direction in the effective imaging region ER, and to adjust only the zero-order aberration component of the wavefront aberration. Means you can.

Based on the above consideration, in the first and second examples of the present embodiment, the index G1 related to the reflecting surface CM1a of the first concave reflecting mirror CM1 and the index G2 related to the reflecting surface CM2a of the second concave reflecting mirror CM2 are the following. The first concave reflecting mirror CM1 from the pupil position (first pupil position) in the optical path of the second imaging optical unit K2 to the image plane IM side (or object) so that the conditional expressions (1) and (2) are satisfied The second concave reflecting mirror CM2 is disposed at a position on the surface OB side, and the position on the object plane OB side (or image plane IM side) from the pupil position (second pupil position) in the optical path of the third imaging optical unit K3. Is arranged.
0.02 <G1 <0.07 (1)
0.02 <G2 <0.07 (2)

In this configuration, as in the case where the correction mechanisms MD1 and MD2 are arranged with the pupil position PP interposed therebetween in FIG. 7, the reflecting surface CM1a of the first concave reflecting mirror CM1 and the reflecting surface CM2a of the second concave reflecting mirror CM2 are arranged. By appropriately setting (or changing) the sign and size of the coefficient of the function FZ ₁₇ expressing the deformation to be applied to the zero-order aberration component and 1 for each point along the X direction in the effective imaging region ER. The second-order aberration component can be generated independently, and the zero-order aberration component and the first-order aberration component of the wavefront aberration of the projection optical system PL can be adjusted independently.

If the lower limit value of the conditional expressions (1) and (2) is not reached, the concave reflecting mirrors CM1 and CM2 are too close to the pupil position, so that the generation of the aberration component Z10 is reduced, and consequently the first-order wavefront aberration of the projection optical system PL. Adjustment of the aberration component becomes difficult. When the upper limit value of conditional expressions (1) and (2) is exceeded, the concave reflecting mirrors CM1 and CM2 are too far from the pupil position, and not only the generation of the aberration component Z17 is reduced, but also unnecessary aberrations that cannot be controlled. The generation of components will increase. In order to exhibit the effect of the embodiment more satisfactorily, the lower limit value of conditional expressions (1) and (2) can be set to 0.03. Moreover, in order to exhibit the effect of embodiment more satisfactorily, the upper limit of conditional expressions (1) and (2) can be set to 0.05.

Specifically, when the deformation according to the function FZ ₁₇ is applied to the reflecting surface CM1a of the first concave reflecting mirror CM1 (or the reflecting surface CM2a of the second concave reflecting mirror CM2), the peripheral position ERb in the effective imaging region ER, Focusing on the wavefront aberration related to ERc (see FIG. 2), aberration components Z05, Z10, and Z17 are generated as shown in FIG. 9 in accordance with the change of the index G1 related to the reflective surface CM1a (or the index G2 related to the reflective surface CM2a). . In FIG. 9, the horizontal axis indicates the value of the index G1 (G2), and the vertical axis indicates the amount of each aberration component generated (normalized aberration generation amount when the maximum value of the aberration component Z17 is normalized to 1). ing.

The aberration component Z05 is a two-fold rotationally symmetric aberration component displayed according to the function FZ ₅ : ρ ² cos2θ according to the fifth term, and is an unnecessary aberration component that cannot be controlled, that is, an aberration that is not intended to be generated. It is an ingredient. Referring to FIG. 9, it can be seen that when the value of the index G1 (G2) is equal to or greater than 0.07, the generation of unnecessary aberration component Z05 increases. It can also be seen that when the value of the index G1 (G2) is 0.02 or less, the aberration component Z10 necessary for adjusting the first-order aberration component of the wavefront aberration is not sufficiently large.

FIG. 9 illustrates a case where the deformation according to the function FZ ₁₇ according to the seventeenth term is applied. However, in the case of applying a deformation according to another appropriate function, for example, the function FZ ₂₈ : (6ρ ⁶ −5ρ ⁴ ) cos 4θ according to the 28th term, as shown in FIG. 10, the appropriate index G 1 (G 2) The same can be said about the range. That is, FIG. 10 shows a change in the index G1 (G2) when the deformation according to the function FZ ₂₈ is applied to the reflecting surface CM1a of the first concave reflecting mirror CM1 (or the reflecting surface CM2a of the second concave reflecting mirror CM2). Correspondingly, how the aberration components Z10, Z12, Z17, Z26, and Z28 of the wavefront aberration relating to the peripheral positions ERb and ERc in the effective imaging region ER are generated is shown. 10, the horizontal axis indicates the value of the index G1 (G2), and the vertical axis indicates the generation amount of each aberration component (normalized aberration generation amount when the maximum value of the aberration component Z28 is normalized to 1). ing.

The aberration component Z12 is a two-fold rotationally symmetric aberration component displayed according to the function FZ ₁₂ : (4ρ ² −3) ρ ² cos 2θ according to the twelfth term. The aberration component Z26 is a five-fold rotationally symmetric aberration component displayed according to the function FZ ₂₆ : ρ ⁵ cos5θ according to the 26th term. Aberration component Z28 is an aberration component of 4-fold rotational symmetry, which is displayed according to the function FZ ₂₈ according to paragraph 28. Referring to FIG. 10, it can be seen that when the value of the index G1 (G2) is 0.07 or more, generation of unnecessary aberration components Z10 and Z12 that cannot be controlled increases. It can also be seen that when the value of the index G1 (G2) is 0.02 or less, the aberration components Z17 and Z26 necessary for adjusting the first-order aberration component of the wavefront aberration are not sufficiently large.

In the third example of the present embodiment, the index G1 related to the reflecting surface CM1a of the first concave reflecting mirror CM1 and the index G2 related to the reflecting surface CM2a of the second concave reflecting mirror CM2 are expressed by the following conditional expressions (1) and (3). To be satisfied, the first concave reflecting mirror CM1 is arranged at a position on the image plane IM side from the first pupil position, and the second concave reflecting mirror CM2 is arranged at a position substantially coincident with the second pupil position.
0.02 <G1 <0.07 (1)
0 <G2 <0.02 (3)

In this configuration, in the same manner as in the case where one correction mechanism is arranged at a required distance from the pupil position PP and the other correction mechanism is arranged at or near the pupil position PP in FIG. By appropriately setting (or changing) the sign and size of the coefficient of the function FZ ₁₇ representing the deformation applied to the reflecting surface CM1a of the reflecting mirror CM1 and the reflecting surface CM2a of the second concave reflecting mirror CM2, the effective image formation is performed. A zero-order aberration component and a first-order aberration component are independently generated to some extent for each point along the X direction in the region ER, and consequently the zero-order aberration component and the first-order aberration component of the wavefront aberration of the projection optical system PL are somewhat independent. Can be adjusted.

In the third embodiment, the first concave reflecting mirror CM1 is disposed on the image plane IM side from the first pupil position. However, the first concave reflecting mirror CM1 is disposed on the object plane OB side from the first pupil position. Even in this case, the same effect as in the third embodiment can be obtained. Although detailed explanation is omitted, the index G1 related to the reflecting surface CM1a of the first concave reflecting mirror CM1 and the index G2 related to the reflecting surface CM2a of the second concave reflecting mirror CM2 are expressed by the following conditional expressions (4) and (2). In order to satisfy, the first concave reflecting mirror CM1 is arranged at a position substantially coinciding with the first pupil position, and the second concave reflecting mirror CM2 is positioned on the image plane IM side (or object plane OB side) from the second pupil position. You may arrange in. In this case, the same effect as in the third embodiment can be obtained.
0 <G1 <0.02 (4)
0.02 <G2 <0.07 (2)

In the fourth example of the present embodiment, the index G1 related to the reflecting surface CM1a of the first concave reflecting mirror CM1 and the index G2 related to the reflecting surface CM2a of the second concave reflecting mirror CM2 are expressed by the following conditional expressions (4) and (3). To be satisfied, the first concave reflecting mirror CM1 is disposed at a position substantially matching the first pupil position, and the second concave reflecting mirror CM2 is disposed at a position approximately matching the second pupil position.
0 <G1 <0.02 (4)
0 <G2 <0.02 (3)

In this configuration, in the same manner as in the case where both the correction mechanisms in FIG. 7 are arranged at or near the pupil position PP, the reflection surfaces CM1a and CM2 of the first concave reflecting mirror CM1 are reflected. By appropriately setting (or changing) the sign and size of the coefficient of the function FZ ₁₇ expressing the deformation to be applied to the surface CM2a, the required amount of 0 for each point along the X direction in the effective imaging region ER is set. Only the second-order aberration component can be generated, and thus only the zero-order aberration component of the wavefront aberration of the projection optical system PL can be adjusted.

In each example of the present embodiment, the pupil position (position where the aperture stop AS is disposed) and the image that are optically Fourier-transformed with the position of the image plane IM in the optical path of the fourth imaging optical unit K4. The power Pw (unit: mm ⁻¹ ) of the partial optical system including a plurality of optical elements disposed between the surface IM satisfies the following conditional expression (5). When calculating the power Pw of the partial optical system, if the pupil position exists inside the optical element, the optical element is included in the partial optical system.
Pw ≧ 0.0100 (5)

If the lower limit of conditional expression (5) is not reached, the lens diameter necessary to ensure the required image-side numerical aperture will be too large, and the projection optical system PL will be enlarged in the radial direction. In order to exhibit the effect of the embodiment more satisfactorily, the lower limit value of the conditional expression (5) can be set to 0.011.

In each example of the present embodiment, the following conditional expression (6) is satisfied. In conditional expression (6), Rb is the maximum image height (see FIG. 2) of the effective imaging region ER on the image plane IM, and Rm is the maximum lens effective radius in the fourth imaging optical unit K4.
Rm / Rb ≧ 9.0 (6)

If the lower limit value of conditional expression (6) is not reached, the lens power burden becomes too great, and the design of the projection optical system PL becomes difficult. In order to exhibit the effect of the embodiment more satisfactorily, the lower limit value of conditional expression (6) can be set to 10.0.

FIG. 11 is a view schematically showing a configuration of an exposure apparatus according to the present embodiment. Also in FIG. 11, as in FIG. 1, the Z-axis is parallel to the normal direction of the transfer surface (exposure surface) of the wafer W, which is a photosensitive substrate, and parallel to the paper surface of FIG. The Y-axis is set in one direction and the X-axis is set in the direction perpendicular to the paper surface of FIG.

As shown in FIG. 11, the exposure apparatus of this embodiment includes an illumination optical system 1 including, for example, an optical integrator (homogenizer), a field stop, a condenser lens, and the like. Exposure light (exposure beam) IL made up of ultraviolet pulsed light having a wavelength of 193 nm emitted from an ArF excimer laser light source that is an exposure light source passes through the illumination optical system 1 and illuminates a mask (reticle) M. A pattern to be transferred is formed on the mask M, and a rectangular (slit-like) pattern region having a long side along the X direction and a short side along the Y direction is illuminated in the entire pattern region. Is done.

The light that has passed through the mask M forms a mask pattern at a predetermined projection magnification on an exposure area on a wafer (photosensitive substrate) W coated with a photoresist via an immersion type catadioptric projection optical system PL. Form. That is, a rectangular still exposure having a long side along the X direction and a short side along the Y direction on the wafer W so as to optically correspond to the rectangular illumination area on the mask M. A pattern image is formed in an area (effective exposure area; effective imaging area).

The mask M is held parallel to the XY plane on the mask stage MST, and a mechanism for finely moving the mask M in the X direction, the Y direction, and the rotation direction is incorporated in the mask stage MST. In the mask stage MST, positions in the X direction, the Y direction, and the rotational direction are measured and controlled in real time by a mask laser interferometer 13m using a moving mirror 12m provided on the mask stage MST. The wafer W is fixed in parallel to the XY plane on the Z stage 9 via the wafer holder WH.

The Z stage 9 is fixed on an XY stage 10 that moves along an XY plane substantially parallel to the image plane of the projection optical system PL, and the focus position (position in the Z direction) and tilt of the wafer W are fixed. Control the corners. The Z stage 9 is measured and controlled in real time in the X direction, the Y direction, and the rotational direction by a wafer laser interferometer 13 w using a moving mirror 12 w provided on the Z stage 9. The XY stage 10 is placed on the base 11 and controls the X direction, Y direction, and rotation direction of the wafer W.

On the other hand, the main control system 14 provided in the exposure apparatus of the present embodiment adjusts the position of the mask M in the X direction, the Y direction, and the rotation direction based on the measurement values measured by the mask laser interferometer 13m. That is, the main control system 14 adjusts the position of the mask M by transmitting a control signal to a mechanism incorporated in the mask stage MST and finely moving the mask stage MST. The main control system 14 adjusts the focus position (position in the Z direction) and the tilt angle of the wafer W in order to adjust the surface on the wafer W to the image plane of the projection optical system PL by the auto focus method and the auto leveling method. I do.

That is, the main control system 14 transmits a control signal to the wafer stage drive system 15 and drives the Z stage 9 by the wafer stage drive system 15 to adjust the focus position and tilt angle of the wafer W. Further, the main control system 14 adjusts the position of the wafer W in the X direction, the Y direction, and the rotation direction based on the measurement values measured by the wafer laser interferometer 13w. That is, the main control system 14 transmits a control signal to the wafer stage drive system 15 and drives the XY stage 10 by the wafer stage drive system 15 to adjust the position of the wafer W in the X direction, the Y direction, and the rotation direction. .

At the time of exposure, the main control system 14 transmits a control signal to a mechanism incorporated in the mask stage MST, and also transmits a control signal to the wafer stage drive system 15, and a speed ratio corresponding to the projection magnification of the projection optical system PL. Then, the mask stage MST and the XY stage 10 are driven to project and expose the pattern image of the mask M into a predetermined shot area on the wafer W. Thereafter, the main control system 14 transmits a control signal to the wafer stage drive system 15, and drives the XY stage 10 by the wafer stage drive system 15, thereby stepping another shot area on the wafer W to the exposure position.

Thus, the operation of scanning and exposing the pattern image of the mask M on the wafer W by the step-and-scan method is repeated. That is, in this embodiment, the position of the mask M and the wafer W is controlled using the wafer stage drive system 15 and the wafer laser interferometer 13w, etc., and the short side direction of the rectangular stationary exposure region and the stationary illumination region, that is, the Y direction. By moving (scanning) the mask stage MST and the XY stage 10 along with the mask M and the wafer W synchronously, the wafer W has a width equal to the long side LX of the static exposure region. In addition, the mask pattern is scanned and exposed on a region having a length corresponding to the scanning amount (movement amount) of the wafer W.

FIG. 12 is a diagram schematically showing a configuration between the boundary lens and the wafer in each example of the present embodiment. In the present embodiment, as shown in FIG. 12, the optical path between the boundary lens Lb and the wafer W is filled with the liquid Lm having a refractive index larger than 1.5 with respect to the exposure light. The boundary lens Lb is a positive lens having a convex surface facing the mask M and a flat surface facing the wafer W. In the present embodiment, as shown in FIG. 11, the liquid Lm is circulated in the optical path between the boundary lens Lb and the wafer W using the water supply / drainage mechanism 21.

In a step-and-scan type exposure apparatus that performs scanning exposure while moving the wafer W relative to the projection optical system PL, between the boundary lens Lb of the projection optical system PL and the wafer W from the start to the end of the scanning exposure. In order to continue to fill the liquid Lm in the optical path of, for example, the technology disclosed in US Patent Application Publication No. 2007/242247, etc., JP-A-10-303114, US Pat. No. 6,191,429, etc. Can be used. In the technique disclosed in US Patent Application Publication No. 2007/242247, an optical path between a boundary lens Lb and a wafer W is supplied from a liquid supply device to a liquid adjusted to a predetermined temperature via a supply pipe and a discharge nozzle. Then, the liquid is recovered from the wafer W via the recovery pipe and the inflow nozzle by the liquid supply device.

On the other hand, in the techniques disclosed in Japanese Patent Application Laid-Open No. 10-303114 and US Pat. No. 6,191,429, the wafer holder table is configured in a container shape so that liquid can be stored, At the center (in the liquid), the wafer W is positioned and held by vacuum suction. Further, the lens barrel tip of the projection optical system PL reaches the liquid, and the optical surface on the wafer side of the boundary lens Lb reaches the liquid. In this way, by circulating the liquid as the immersion liquid at a minute flow rate, it is possible to prevent the liquid from being altered by the effects of antiseptic and mildewproofing. In addition, it is possible to prevent aberration fluctuations due to heat absorption of exposure light. Here, US Patent Application Publication No. 2007/242247, US Pat. No. 6,191,429 and Japanese Patent Laid-Open No. 10-303114 are incorporated by reference.

In each example of the present embodiment, the aspherical surface is along the optical axis from the tangential plane at the apex of the aspherical surface to the position on the aspherical surface at the height y, where y is the height in the direction perpendicular to the optical axis. distance (sag amount) is z, a vertex radius of curvature is r, a conical coefficient is kappa, when the n-th order aspherical coefficient was C _n, is expressed by the following equation (a). In Tables (1) to (4) to be described later, a lens surface formed in an aspherical shape is marked with an asterisk (*) on the right side of the surface number.

z = (y ² / r) / [1+ {1- (1 + κ) · y ² / r ² } ^1/2 ] + C ₄ · y ⁴
+ C ₆ · y ⁶ + C ₈ · y ⁸ + C ₁₀ · y ¹⁰ + C ₁₂ · y ¹² + C ₁₄ · y ¹⁴
+ C ₁₆ · y ¹⁶ + C ₁₈ · y ¹⁸ + C ₂₀ · y ²⁰ (a)

In the projection optical system PL of each embodiment, the light from the mask M passes through the first imaging optical system K1, and the first intermediate pattern of the mask pattern is away from the optical axis in the vicinity of the first planar reflecting mirror FM1. Form an image. The light from the first intermediate image forms a second intermediate image of the mask pattern at a position away from the optical axis via the second imaging optical system K2. The light from the second intermediate image forms a third intermediate image of the mask pattern at a position away from the optical axis in the vicinity of the second plane reflecting mirror FM2 via the third imaging optical system K3. The light from the third intermediate image forms a final image of the mask pattern on the wafer W at a position away from the optical axis via the fourth imaging optical system K4. In each embodiment, the position where the intermediate image of the mask pattern is formed can be referred to as an object plane or a conjugate position optically conjugate with the image plane. In each embodiment, the first flat reflecting mirror M1 and the second flat reflecting mirror M2 are integrally configured as one optical member. In each embodiment, the optical axis of the first imaging optical system K1 and the optical axis of the fourth imaging optical system K4 are parallel to each other, and the Y direction of the first planar reflecting mirror M1 and the second planar reflecting mirror M2 It is eccentric by the interval of. Here, the first planar reflecting mirror as the first deflecting mirror that deflects the light from the first imaging optical system K1 and directs it to the second imaging optical system K2 is the first planar reflecting surface along the first plane. The second planar reflecting mirror as the second deflecting mirror that deflects the light from the third imaging optical system K3 and directs it toward the fourth imaging optical system K4 is a second planar reflection along the second plane. Has a surface. The first plane and the second plane are parallel to each other. The optical axis of the first imaging optical system K1 and the optical axis of the second imaging optical system K2 intersect on the first plane, and the optical axis of the third imaging optical system K3 and the fourth imaging optical system. The optical axis of K4 intersects on the second plane. The optical axis of the second imaging optical system K2 and the optical axis of the third imaging optical system K3 are coaxial with each other. In other words, the second imaging optical system K2 and the third imaging optical system K3 have a common optical axis. In each embodiment, the projection optical system PL is substantially telecentric on both the object side and the image side.

[First embodiment]
FIG. 13 is a diagram showing a lens configuration of the projection optical system according to the first example of the present embodiment. In the projection optical system PL according to the first example, the first imaging optical system K1 is composed of a plane parallel plate P1 and eleven lenses L11 to L111 in this order from the mask side. An aperture stop AS1 (not shown) is disposed in the optical path between the lens L15 and the lens L16 of the first imaging optical system K1. The second imaging optical system K2 includes three lenses L21 to L23 and a concave reflecting mirror CM1 with a concave surface facing the light incident side in order from the light incident side along the light traveling path. .

The third imaging optical system K3 is composed of, in order from the light incident side, three lenses L31 to L33 and a concave reflecting mirror CM2 having a concave surface facing the light incident side. The fourth imaging optical system K4 includes, in order from the light incident side, thirteen lenses L41 to L413 and a plano-convex lens L414 (boundary lens Lb) having a plane facing the wafer side. In the fourth imaging optical system K4, an aperture stop AS is disposed in the optical path between the lens L410 and the lens L411. In the first to third imaging optical systems K1 to K3, a position optically conjugate with the position where the aperture stop AS is disposed can be referred to as a pupil position of each imaging optical system.

In each embodiment, the optical path between the boundary lens Lb and the wafer W has a refractive index of 1.435876 with respect to ArF excimer laser light (center wavelength λ = 193.306 nm) that is used light (exposure light). A liquid (for example, water) Lm is filled. All the light transmitting members including the plane parallel plate P1 and the boundary lens Lb are formed of an optical material (for example, quartz glass (SiO ₂ )) having a refractive index of 1.5603261 with respect to the center wavelength of the used light.

The following table (1) lists the values of the specifications of the projection optical system PL according to the first example. In the column of main specifications in Table (1), λ is the center wavelength of the exposure light, β is the magnitude (absolute value) of the projection magnification (imaging magnification of the entire system), and NA is the image side (wafer side). The numerical aperture, Rb is the radius of the image circle IF on the wafer W, that is, the maximum image height of the effective imaging region ER on the image plane IM, Ra is the off-axis amount of the static exposure region ER, and LX is the static exposure region. ER represents the dimension along the X direction (long side dimension), and LY represents the dimension along the Y direction of the static exposure region ER (short side dimension).

Further, in the column of the optical member specifications in Table (1), the surface number is along the path along which the light beam travels from the mask surface that is the object surface (first surface) to the wafer surface that is the image surface (second surface). The order of the surfaces from the mask side, r is the radius of curvature of each surface (vertical curvature radius: mm in the case of an aspherical surface), d is the on-axis spacing of each surface, that is, the surface spacing (mm), n is The refractive index with respect to the center wavelength is shown. The sign of the surface interval d changes every time light is reflected. That is, the sign of the surface interval d is negative in the optical path from the first flat reflecting mirror FM1 to the first concave reflecting mirror CM1 and in the optical path from the second concave reflecting mirror CM2 to the second flat reflecting mirror FM2. Positive in the light path.

In the first imaging optical system K1, the curvature radius of the convex surface toward the mask side (light incident side) is positive, and the curvature radius of the concave surface toward the mask side is negative. In the second imaging optical system K2, the radius of curvature of the convex surface is negative toward the light incident side along the light traveling path, and the radius of curvature of the concave surface is positive toward the light incident side. In the third imaging optical system K3, the radius of curvature of the concave surface is negative toward the light incident side along the light traveling path, and the radius of curvature of the convex surface is positive toward the light incident side. In the fourth imaging optical system K4, the radius of curvature of the convex surface is positive toward the light incident side, and the radius of curvature of the concave surface is negative toward the light incident side. The notation in Table (1) is the same in the following Table (2), Table (3), and Table (4).

Table (1)
(Main specifications)
λ = 193.306 nm
β = 1/4
NA = 1.35
Ra = 2.8mm
Rb = 15.1605 mm
LX = 26mm
LY = 5.0mm

(Optical member specifications)
Surface number r dn optical member (mask surface) 97.27184
1 ∞ 8.00000 1.5603261 (P1)
2 ∞ 12.85115
3 -434.75533 25.49306 1.5603261 (L11)
4 -202.73027 3.47319
5 469.48493 28.19249 1.5603261 (L12)
6 -1049.92264 22.90024
7 160.14353 31.39060 1.5603261 (L13)
8 284.15835 90.22676
9 * 241.53725 9.66171 1.5603261 (L14)
10 259.25920 1.00000
11 114.42331 38.22670 1.5603261 (L15)
12 1505.12165 7.52866
13 ∞ 50.72828 (AS1)
14 -137.02156 9.50000 1.5603261 (L16)
15 -212.31460 69.52956
16 -81.76909 32.13169 1.5603261 (L17)
17 -123.79874 1.00000
18 * -682.90735 36.68825 1.5603261 (L18)
19 -163.91183 1.00000
20 574.78234 12.66783 1.5603261 (L19)
21 857.04903 3.93362
22 1407.42652 36.73341 1.5603261 (L110)
23 * -212.50197 1.00000
24 494.62795 11.13228 1.5603261 (L111)
25 574.55635 130.00000
26 ∞ -90.00000 (FM1)
27 * -187.78662 -30.00000 1.5603261 (L21)
28 -783.67715 -1.00000
29 -477.46048 -30.00000 1.5603261 (L22)
30 1235.32235 -182.08815
31 110.13738 -15.00000 1.5603261 (L23)
32 661.10511 -23.61426
33 178.34839 23.61426 (CM1)
34 661.10511 15.00000 1.5603261 (L23)
35 110.13738 182.08815
36 1235.32235 30.00000 1.5603261 (L22)
37 -477.46048 1.00000
38 -783.67715 30.00000 1.5603261 (L21)
39 * -187.78662 140.00000
40 * -1505.02206 30.00000 1.5603261 (L31)
41 -334.02065 1.00000
42 242.39535 30.00000 1.5603261 (L32)
43 -528.97001 169.69888
44 -128.22274 15.00000 1.5603261 (L33)
45 -402.68946 29.70842
46 -208.14226 -29.70842 (CM2)
47 -402.68946 -15.00000 1.5603261 (L33)
48 -128.22274 -169.69888
49 -528.97001 -30.00000 1.5603261 (L32)
50 242.39535 -1.00000
51 -334.02065 -30.00000 1.5603261 (L31)
52 * -1505.02206 -30.00000
53 ∞ 139.88582 (FM2)
54 -10093.75878 29.76813 1.5603261 (L41)
55 -227.44275 2.00000
56 145.32871 42.97588 1.5603261 (L42)
57 386.55071 70.28324
58 -184.11011 9.50000 1.5603261 (L43)
59 456.14921 22.82659
60 -280.31603 9.50000 1.5603261 (L44)
61 * 169.17808 23.78759
62 976.17142 28.50782 1.5603261 (L45)
63 -381.45785 1.40346
64 1329.52429 9.50016 1.5603261 (L46)
65 * 329.32932 22.85117
66 2376.76330 51.33302 1.5603261 (L47)
67 -232.83333 1.00000
68 6905.90436 32.24128 1.5603261 (L48)
69 * -386.37040 11.37994
70 * -2999.63821 52.92628 1.5603261 (L49)
71 -413.73977 22.34031
72 3704.28195 25.71578 1.5603261 (L410)
73 -1091.50366 0.00000
74 ∞ 1.00000 (AS)
75 402.10696 56.39639 1.5603261 (L411)
76 -991.08114 1.00000
77 152.00500 65.34836 1.5603261 (L412)
78 * 320.02147 1.00000
79 127.63375 36.10400 1.5603261 (L413)
80 * 319.22224 1.00000
81 58.95212 53.16345 1.5603261 (L414: Lb)
82 ∞ 3.00000 1.435876 (Lm)
(Wafer surface)

(Aspheric data)
9 faces κ = 0
C ₄ = −1.051820 × 10 ⁻⁷ C ₆ = 1.383360 × 10 ⁻¹²
C ₈ = −3.4454 140 × 10 ⁻¹⁶ C ₁₀ = 3.2290040 × 10 ⁻²⁰
C ₁₂ = 8.1811200 × 10 ⁻²⁴ C ₁₄ = −3.6601 700 × 10 ⁻²⁷
C ₁₆ = 6.029620 × 10 ⁻³¹ C ₁₈ = −4.885840 × 10 ⁻³⁵
C ₂₀ = 1.569310 × 10 ⁻³⁹

18 faces κ = 0
C ₄ = -3.179420 × 10 ⁻⁸ C ₆ = 2.407830 × 10 ⁻¹²
C ₈ = -2.980550 × 10 ⁻¹⁷ C ₁₀ = 1.185000 × 10 ⁻²¹
C ₁₂ = −3.93850 × 10 ⁻²⁵ C ₁₄ = 3.1108170 × 10 ⁻²⁹
C ₁₆ = -3.405840 × 10 ⁻³³ C ₁₈ = 2.771630 × 10 ⁻³⁷
C ₂₀ = −8.9920070 × 10 ⁻⁴²

23 κ = 0
C ₄ = 1.573950 × 10 ⁻⁸ C ₆ = 8.692700 × 10 ⁻¹³
C ₈ = −1.353270 × 10 ⁻¹⁸ C ₁₀ = 9.432250 × 10 ⁻²¹
C ₁₂ = −2.493950 × 10 ⁻²⁴ C ₁₄ = 3.918600 × 10 ⁻²⁸
C ₁₆ = −3.705310 × 10 ⁻³² C ₁₈ = 1.936620 × 10 ⁻³⁶
C ₂₀ = -4.329220 × ^{10 -41}

27 faces κ = 0
C ₄ = 2.782310 × 10 ⁻⁸ C ₆ = −1.310730 × 10 ⁻¹²
C ₈ = 6.972800 × 10 ⁻¹⁷ C ₁₀ = −4.072700 × 10 ⁻²¹
C ₁₂ = 2.239490 × 10 ⁻²⁵ C ₁₄ = −5.838320 × 10 ⁻³⁰
C ₁₆ = 1.210420 × 10 ⁻³⁶ C ₁₈ = 0 C ₂₀ = 0

39 surfaces κ = 0
C ₄ = 2.782310 × 10 ⁻⁸ C ₆ = −1.310730 × 10 ⁻¹²
C ₈ = 6.972800 × 10 ⁻¹⁷ C ₁₀ = −4.072700 × 10 ⁻²¹
C ₁₂ = 2.239490 × 10 ⁻²⁵ C ₁₄ = −5.838320 × 10 ⁻³⁰
C ₁₆ = 1.210420 × 10 ⁻³⁶ C ₁₈ = 0 C ₂₀ = 0

40 faces κ = 0
C ₄ = −3.040570 × 10 ⁻⁸ C ₆ = −1.053060 × 10 ⁻¹²
C ₈ = 4.809690 × 10 ⁻¹⁷ C ₁₀ = −1.8443550 × 10 ⁻²¹
C ₁₂ = −4.1111650 × 10 ⁻²⁵ C ₁₄ = 5.300 240 × 10 ⁻²⁹
C ₁₆ = −2.167260 × 10 ⁻³³ C ₁₈ = 0 C ₂₀ = 0

52 planes κ = 0
C ₄ = −3.040570 × 10 ⁻⁸ C ₆ = −1.053060 × 10 ⁻¹²
C ₈ = 4.809690 × 10 ⁻¹⁷ C ₁₀ = −1.8443550 × 10 ⁻²¹
C ₁₂ = −4.1111650 × 10 ⁻²⁵ C ₁₄ = 5.300 240 × 10 ⁻²⁹
C ₁₆ = −2.167260 × 10 ⁻³³ C ₁₈ = 0 C ₂₀ = 0

61 plane κ = 0
C ₄ = −3.195030 × 10 ⁻⁸ C ₆ = −2.394070 × 10 ⁻¹²
C ₈ = 2.611840 × 10 ⁻¹⁷ C ₁₀ = 6.646270 × 10 ⁻²¹
C ₁₂ = −7.4437340 × 10 ⁻²⁵ C ₁₄ = 2.593180 × 10 ⁻²⁹
C ₁₆ = 0 C ₁₈ = 0 C ₂₀ = 0

65 faces κ = 0
C ₄ = 2.519990 × 10 ⁻⁸ C ₆ = −1.378580 × 10 ⁻¹²
C ₈ = −2.496630 × 10 ⁻¹⁷ C ₁₀ = 3.999440 × 10 ⁻²¹
C ₁₂ = -2.773840 × 10 ⁻²⁵ C ₁₄ = 1.226960 × 10 ⁻²⁹
C ₁₆ = −2.403220 × 10 ⁻³⁴ C ₁₈ = 0 C ₂₀ = 0

69 faces κ = 0
C ₄ = 1.586260 × 10 ⁻⁸ C ₆ = −5.011570 × 10 ⁻¹³
C ₈ = 3.055860 × 10 ⁻¹⁷ C ₁₀ = −1.237770 × 10 ⁻²¹
C ₁₂ = 8.022510 × 10 ⁻²⁶ C ₁₄ = −2.972310 × 10 ⁻³⁰
C ₁₆ = 9.126420 × 10 ⁻³⁵ C ₁₈ = −1.286290 × 10 ⁻³⁹
C ₂₀ = 3.989430 × 10 ⁻⁴⁵

70 faces κ = 0
C ₄ = 3.869480 × 10 ⁻⁹ C ₆ = −4.278380 × 10 ⁻¹³
C ₈ = 3.009980 × 10 ⁻¹⁷ C ₁₀ = −1.415790 × 10 ⁻²¹
C ₁₂ = 8.583190 × 10 ⁻²⁶ C ₁₄ = −3.7737 700 × 10 ⁻³⁰
C ₁₆ = 1.211520 × 10 ⁻³⁴ C ₁₈ = −2.461020 × 10 ⁻³⁹
C ₂₀ = 2.061880 × 10 ⁻⁴⁴

78 faces κ = 0
C ₄ = −5.142260 × 10 ⁻⁸ C ₆ = 2.773500 × 10 ⁻¹²
C ₈ = -2.131510 × 10 ⁻¹⁶ C ₁₀ = 1.104720 × 10 ⁻²⁰
C ₁₂ = −5.220970 × 10 ⁻²⁶ C ₁₄ = −2.444 130 × 10 ⁻²⁹
C ₁₆ = 1.3070090 × 10 ⁻³³ C ₁₈ = −2.9293440 × 10 ⁻³⁸
C ₂₀ = 2.674890 × 10 ⁻⁴³

80 faces κ = 0
C ₄ = 5.568340 × 10 ⁻⁸ C ₆ = 3.724930 × 10 ⁻¹²
C ₈ = 1.264720 × 10 ⁻¹⁶ C ₁₀ = 1.738370 × 10 ⁻²⁰
C ₁₂ = −7.177830 × 10 ⁻²⁴ C ₁₄ = 1.778980 × 10 ⁻²⁷
C ₁₆ = −2.024570 × 10 ⁻³¹ C ₁₈ = 1.240 100 × 10 ⁻³⁵
C ₂₀ = −2.372920 × 10 ⁻⁴⁰

(Conditional value)
A = 2.89mm (reflective surface CM1a)
Re = 82.27mm (reflective surface CM1a)
A = 3.13 mm (reflective surface CM2a)
Re = 78.64mm (reflection surface CM2a)
Rm = 165.0mm
(1) G1 = 0.035
(2) G2 = 0.040
(5) Pw = 0.115
(6) Rm / Rb = 10.884

FIG. 14 (a) shows the aberration component Z17 and Z10 occurs when imparted with deformed according to the function _{FZ 17} to the reflecting surface CM1a the first concave reflector CM1 in the first embodiment. FIG. 14B shows aberration components Z17 and Z10 generated when the same deformation as that of the first concave reflecting mirror CM1 is applied to the reflecting surface CM2a of the second concave reflecting mirror CM2 in the first embodiment.

FIG. 15A shows the first embodiment of the first concave reflecting mirror CM1 and the second concave reflecting mirror CM2 in cooperation, that is, the reflecting surface CM1a and the second concave reflecting mirror CM2 of the first concave reflecting mirror CM1. by setting the coefficients of the function FZ ₁₇ representing the deformation to be imparted to the reflecting surface CM2a sign and magnitude appropriate shows a state that caused mainly 0-order aberration component (Z17). FIG. 15B shows a state in which the primary aberration component (Z10) is mainly generated by the cooperative action of the first concave reflecting mirror CM1 and the second concave reflecting mirror CM2 in the first embodiment.
The projection optical system of the first embodiment is disposed in the optical path between the first surface and the second surface, includes a first concave reflecting mirror, and makes different surfaces optically conjugate with each other. A first imaging optical unit, and a second concave reflecting mirror disposed in an optical path between the first imaging optical unit and the second surface, wherein different surfaces are optically conjugate with each other. A second imaging optical unit, wherein the first concave reflecting mirror is second from the first pupil position optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. The second concave reflecting mirror is disposed on the first surface side from the second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Therefore, good imaging performance can be achieved.

14 and 15, the horizontal axis indicates the X-direction position along the straight line connecting the positions ERa, ERb, and ERc (see FIG. 2) of the effective imaging region ER, and the vertical axis indicates the Zernike coefficient (unit: aberration component). : The center wavelength λ of the exposure light. That is, in FIG. 14 and FIG. 15, attention is paid to each aberration component of the wavefront aberration relating to the position in the X direction along the middle region of Y = 5.3 mm (= Ra + LY / 2) in the effective imaging region ER.

[Second Embodiment]
FIG. 16 is a diagram showing a lens configuration of the projection optical system according to the second example of the present embodiment. In the projection optical system PL according to the second example, the first imaging optical system K1 is composed of a plane parallel plate P1 and twelve lenses L11 to L112 in this order from the mask side. The second imaging optical system K2 includes two lenses L21 and L22 and a concave reflecting mirror CM1 having a concave surface facing the light incident side in order from the light incident side along the light traveling path. .

The third imaging optical system K3 is composed of two lenses L31 and L32 in order from the light incident side, and a concave reflecting mirror CM2 having a concave surface directed to the light incident side. The fourth imaging optical system K4 includes, in order from the light incident side, thirteen lenses L41 to L413 and a plano-convex lens L414 (boundary lens Lb) having a plane facing the wafer side. In the fourth imaging optical system K4, an aperture stop AS is disposed in the optical path between the lens L410 and the lens L411. The following table (2) lists the values of the specifications of the projection optical system PL according to the second example.

Table (2)
(Main specifications)
λ = 193.306 nm
β = 1/4
NA = 1.35
Ra = 2.8mm
Rb = 15.1605 mm
LX = 26mm
LY = 5.0mm

(Optical member specifications)
Surface number r dn Optical member (mask surface) 50.00000
1 ∞ 8.00000 1.5603261 (P1)
2 ∞ 52.67655
3 956.99593 10.00000 1.5603261 (L11)
4 268.34560 24.08960
5 * 3371.13689 43.12377 1.5603261 (L12)
6 -210.74353 1.00000
7 401.22496 74.01758 1.5603261 (L13)
8 -237.15092 1.00000
9 * 110.11998 73.97631 1.5603261 (L14)
10 77.95672 50.55064
11 * 271.64665 10.58591 1.5603261 (L15)
12 141.05587 28.14848
13 -184.98082 49.70695 1.5603261 (L16)
14 -112.43194 21.89084
15 -86.15110 18.84987 1.5603261 (L17)
16 -94.00391 33.87664
17 -237.21530 49.87494 1.5603261 (L18)
18 -137.91605 1.00000
19 * -402.00103 10.00000 1.5603261 (L19)
20 -338.32398 1.00000
21 621.22405 34.41434 1.5603261 (L110)
22 -717.65446 27.23038
23 * -243.70615 23.70706 1.5603261 (L111)
24 -191.12984 1.00000
25 -293.95763 19.17688 1.5603261 (L112)
26 -226.97432 155.00000
27 ∞ -120.00003 (FM1)
28 -153.74064 -49.89941 1.5603261 (L21)
29 * -374.13392 -178.09846
30 114.31886 -27.72354 1.5603261 (L22)
31 402.84940 -31.07941
32 223.52103 31.07941 (CM1)
33 402.84940 27.72354 1.5603261 (L22)
34 114.31886 178.09846
35 * -374.13392 49.89941 1.5603261 (L21)
36 -153.74064 170.00003
37 * 216.03195 39.98157 1.5603261 (L31)
38 -279.87249 333.35481
39 -144.22676 10.00000 1.5603261 (L32)
40 -328.06971 14.07809
41 -232.73749 -14.07809 (CM2)
42 -328.06971 -10.00000 1.5603261 (L32)
43 -144.22676 -333.35481
44 -279.87249 -39.98157 1.5603261 (L31)
45 * 216.03195 -30.00000
46 ∞ 99.99834 (FM2)
47 734.62279 26.94164 1.5603261 (L41)
48 -354.86614 1.00000
49 270.78272 14.63772 1.5603261 (L42)
50 122.69492 27.65512
51 523.27593 17.99743 1.5603261 (L43)
52 * -917.96153 22.41541
53 -173.82539 10.00000 1.5603261 (L44)
54 * 263.66488 4.67438
55 232.32415 24.78492 1.5603261 (L45)
56 * 341.71467 25.03872
57 425.48686 42.27646 1.5603261 (L46)
58 -925.88925 3.43669
59 * -868.19313 24.39020 1.5603261 (L47)
60 -390.63210 10.95541
61 1112.84746 24.59098 1.5603261 (L48)
62 * -3794.30734 36.47679
63 * -523.57036 38.47006 1.5603261 (L49)
64 -254.24434 3.48871
65 * -12003.67904 22.89268 1.5603261 (L410)
66 -635.56833 1.00000
67 ∞ 1.00000 (AS)
68 285.29843 56.33918 1.5603261 (L411)
69 * 3166.39262 1.00000
70 172.35136 70.86784 1.5603261 (L412)
71 * 455.55044 1.00000
72 102.58247 57.63623 1.5603261 (L413)
73 * 265.61659 1.00000
74 65.97964 51.13833 1.5603261 (L414: Lb)
75 ∞ 3.00000 1.435876 (Lm)
(Wafer surface)

(Aspheric data)
5 sides κ = 0
C ₄ = −6.5518220 × 10 ⁻⁹ C ₆ = −6.5515560 × 10 ⁻¹³
C ₈ = 4.213030 × 10 ⁻¹⁷ C ₁₀ = 9.924030 × 10 ⁻²²
C ₁₂ = -1.3396870 × 10 ⁻²⁵ C ₁₄ = −2.493070 × 10 ⁻²⁹
C ₁₆ = 5.579320 × 10 ⁻³³ C ₁₈ = −3.997550 × 10 ⁻³⁷
C ₂₀ = 1.060880 × 10 ⁻⁴¹

9 faces κ = 0
C ₄ = −1.467370 × 10 ⁻⁸ C ₆ = −5.704230 × 10 ⁻¹³
C ₈ = −1.973500 × 10 ⁻¹⁷ C ₁₀ = −1.490 700 × 10 ⁻²⁰
C ₁₂ = 3.604830 × 10 ⁻²⁴ C ₁₄ = −6.775660 × 10 ⁻²⁸
C ₁₆ = 7.099540 × 10 ⁻³² C ₁₈ = −4.35.8560 × 10 ⁻³⁶
C ₂₀ = 1.057430 × 10 ⁻⁴⁰

11 surfaces κ = 0
C ₄ = 9.528090 × 10 ⁻⁸ C ₆ = −6.336320 × 10 ⁻¹²
C ₈ = 6.997930 × 10 ⁻¹⁶ C ₁₀ = −5.524910 × 10 ⁻¹⁸
C ₁₂ = 9.075970 × 10 ⁻²² C ₁₄ = −4.318990 × 10 ⁻²⁵
C ₁₆ = 1.99930 × 10 ⁻²⁸ C ₁₈ = −7.9333570 × 10 ⁻³²
C ₂₀ = 1.199210 × 10 ⁻³⁵

19 faces κ = 0
C ₄ = −4.881590 × 10 ⁻⁸ C ₆ = −4.182940 × 10 ⁻¹³
C ₈ = −3.769370 × 10 ⁻¹⁷ C ₁₀ = 8.732130 × 10 ⁻²²
C ₁₂ = −4.612570 × 10 ⁻²⁶ C ₁₄ = −2.739800 × 10 ⁻³⁰
C ₁₆ = 1.886310 × 10 ⁻³⁴ C ₁₈ = 4.445000 × 10 ⁻³⁹
C ₂₀ = −3.827040 × 10 ⁻⁴³

23 κ = 0
C ₄ = 7.258110 × 10 ⁻⁹ C ₆ = −5.4686990 × 10 ⁻¹³
C ₈ = 1.699680 × 10 ⁻¹⁷ C ₁₀ = −2.155620 × 10 ⁻²¹
C ₁₂ = 1.651010 × 10 ⁻²⁵ C ₁₄ = −9.6667780 × 10 ⁻³⁰
C ₁₆ = 3.2282730 × 10 ⁻³⁴ C ₁₈ = −5.022870 × 10 ⁻³⁹
C ₂₀ = 8.075080 × 10 ⁻⁴⁵

29 faces κ = 0
C ₄ = −1.191430 × 10 ⁻⁸ C ₆ = −1.105 180 × 10 ⁻¹²
C ₈ = 2.0899990 × 10 ⁻¹⁶ C ₁₀ = −3.974060 × 10 ⁻²⁰
C ₁₂ = 5.977430 × 10 ⁻²⁴ C ₁₄ = −6.124130 × 10 ⁻²⁸
C ₁₆ = 4.024790 × 10 ⁻³² C ₁₈ = −1.503840 × 10 ⁻³⁶
C ₂₀ = 2.419470 × 10 ⁻⁴¹

35 faces κ = 0
C ₄ = −1.191430 × 10 ⁻⁸ C ₆ = −1.105 180 × 10 ⁻¹²
C ₈ = 2.0899990 × 10 ⁻¹⁶ C ₁₀ = −3.974060 × 10 ⁻²⁰
C ₁₂ = 5.977430 × 10 ⁻²⁴ C ₁₄ = −6.124130 × 10 ⁻²⁸
C ₁₆ = 4.024790 × 10 ⁻³² C ₁₈ = −1.503840 × 10 ⁻³⁶
C ₂₀ = 2.419470 × 10 ⁻⁴¹

37 faces κ = 0
C ₄ = −3.986850 × 10 ⁻⁸ C ₆ = 6.056580 × 10 ⁻¹³
C ₈ = −6.255530 × 10 ⁻¹⁶ C ₁₀ = 3.106950 × 10 ⁻¹⁹
C ₁₂ = −9.712950 × 10 ⁻²³ C ₁₄ = 1.910830 × 10 ⁻²⁶
C ₁₆ = −2.294720 × 10 ⁻³⁰ C ₁₈ = 1.536250 × 10 ⁻³⁴
C ₂₀ = -4.394870 × 10 ⁻³⁹

45 faces κ = 0
C ₄ = −3.986850 × 10 ⁻⁸ C ₆ = 6.056580 × 10 ⁻¹³
C ₈ = −6.255530 × 10 ⁻¹⁶ C ₁₀ = 3.106950 × 10 ⁻¹⁹
C ₁₂ = −9.712950 × 10 ⁻²³ C ₁₄ = 1.910830 × 10 ⁻²⁶
C ₁₆ = −2.294720 × 10 ⁻³⁰ C ₁₈ = 1.536250 × 10 ⁻³⁴
C ₂₀ = -4.394870 × 10 ⁻³⁹

52 planes κ = 0
C ₄ = −5.207570 × 10 ⁻⁹ C ₆ = 4.543270 × 10 ⁻¹²
C ₈ = 2.311140 × 10 ⁻¹⁶ C ₁₀ = −4.562410 × 10 ⁻²¹
C ₁₂ = 3.405830 × 10 ⁻²⁴ C ₁₄ = −1.286090 × 10 ⁻²⁷
C ₁₆ = 3.178270 × 10 ⁻³¹ C ₁₈ = −3.777280 × 10 ⁻³⁵
C ₂₀ = 1.8870650 × 10 ⁻³⁹

54 faces κ = 0
C ₄ = 6.3323080 × 10 ⁻⁸ C ₆ = −1.150910 × 10 ⁻¹¹
C ₈ = 4.372410 × 10 ⁻¹⁶ C ₁₀ = 2.992970 × 10 ⁻²¹
C ₁₂ = −3.6696000 × 10 ⁻²⁴ C ₁₄ = 6.158830 × 10 ⁻²⁸
C ₁₆ = −6.274200 × 10 ⁻³² C ₁₈ = 3.484140 × 10 ⁻³⁶
C ₂₀ = −8.632930 × 10 ⁻⁴¹

56 faces κ = 0
C ₄ = −1.248210 × 10 ⁻⁸ C ₆ = 6.630910 × 10 ⁻¹²
C ₈ = −6.575720 × 10 ⁻¹⁶ C ₁₀ = 5.253970 × 10 ⁻²⁰
C ₁₂ = -3.143330 × 10 ⁻²⁴ C ₁₄ = 1.162190 × 10 ⁻²⁸
C ₁₆ = -1.785520 × 10 ⁻³³ C ₁₈ = −1.868420 × 10 ⁻³⁸
C ₂₀ = 8.043030 × 10 ⁻⁴³

59 surfaces κ = 0
C ₄ = −6.091640 × 10 ⁻⁹ C ₆ = 3.445820 × 10 ⁻¹²
C ₈ = -3.115830 × 10 ⁻¹⁶ C ₁₀ = 9.799420 × 10 ⁻²¹
C ₁₂ = −9.250,000 × 10 ⁻²⁷ C ₁₄ = −1.126360 × 10 ⁻²⁹
C ₁₆ = 2.959360 × 10 ⁻³⁴ C ₁₈ = 3.087090 × 10 ⁻³⁹
C ₂₀ = −1.87777470 × 10 ⁻⁴³

62 plane κ = 0
C ₄ = −1.385640 × 10 ⁻⁸ C ₆ = 3.625280 × 10 ⁻¹²
C ₈ = -2.485970 × 10 ⁻¹⁶ C ₁₀ = 1.126710 × 10 ⁻²⁰
C ₁₂ = −5.685270 × 10 ⁻²⁵ C ₁₄ = 2.88730 × 10 ⁻²⁹
C ₁₆ = −1.007360 × 10 ⁻³³ C ₁₈ = 2.128850 × 10 ⁻³⁸
C ₂₀ = −1.988890 × 10 ⁻⁴³

63 plane κ = 0
C ₄ = −3.333690 × 10 ⁻⁸ C ₆ = 2.382600 × 10 ⁻¹²
C ₈ = −1.477920 × 10 ⁻¹⁶ C ₁₀ = 6.4451690 × 10 ⁻²¹
C ₁₂ = -3.245000 × 10 ⁻²⁵ C ₁₄ = 1.601990 × 10 ⁻²⁹
C ₁₆ = −5.278100 × 10 ⁻³⁴ C ₁₈ = 1.073760 × 10 ⁻³⁸
C ₂₀ = −8.923070 × 10 ⁻⁴⁴

65 faces κ = 0
C ₄ = −8.507040 × 10 ⁻⁹ C ₆ = −4.691460 × 10 ⁻¹³
C ₈ = 3.802050 × 10 ⁻¹⁷ C ₁₀ = −1.912410 × 10 ⁻²¹
C ₁₂ = 1.096940 × 10 ⁻²⁵ C ₁₄ = −5.228850 × 10 ⁻³⁰
C ₁₆ = 1.432580 × 10 ⁻³⁴ C ₁₈ = −1.911870 × 10 ⁻³⁹
C ₂₀ = 8.301610 × 10 ⁻⁴⁵

69 faces κ = 0
C ₄ = 3.296010 × 10 ⁻⁹ C ₆ = 1.017380 × 10 ⁻¹³
C ₈ = −3.125050 × 10 ⁻¹⁷ C ₁₀ = 1.249490 × 10 ⁻²¹
C ₁₂ = 3.367610 × 10 ⁻²⁶ C ₁₄ = −3.989680 × 10 ⁻³⁰
C ₁₆ = 1.368530 × 10 ⁻³⁴ C ₁₈ = −2.3351360 × 10 ⁻³⁹
C ₂₀ = 1.710970 × 10 ⁻⁴⁴

71 surface κ = 0
C ₄ = −3.248440 × 10 ⁻⁸ C ₆ = 2.002660 × 10 ⁻¹²
C ₈ = -4.269190 × 10 ⁻¹⁸ C ₁₀ = −8.5593550 × 10 ⁻²¹
C ₁₂ = 3.665260 × 10 ⁻²⁵ C ₁₄ = 1.038290 × 10 ⁻²⁹
C ₁₆ = −1.207970 × 10 ⁻³³ C ₁₈ = 3.491290 × 10 ⁻³⁸
C ₂₀ = −3.561350 × 10 ⁻⁴³

73 surface κ = 0
C ₄ = 9.781470 × 10 ⁻⁸ C ₆ = −7.174220 × 10 ⁻¹³
C ₈ = 1.593300 × 10 ⁻¹⁶ C ₁₀ = 1.903480 × 10 ⁻¹⁹
C ₁₂ = -4.264660 × 10 ⁻²³ C ₁₄ = 5.364590 × 10 ⁻²⁷
C ₁₆ = -3.173790 × 10 ⁻³¹ C ₁₈ = 3.927300 × 10 ⁻³⁶
C ₂₀ = 4.771630 × 10 ⁻⁴⁰

(Conditional value)
A = 7.54mm (reflective surface CM1a)
Re = 124.06 mm (reflection surface CM1a)
A = 6.83mm (reflective surface CM2a)
Re = 124.05mm (reflective surface CM2a)
Rm = 164.5mm
(1) G1 = 0.055
(2) G2 = 0.061
(5) Pw = 0.0104
(6) Rm / Rb = 10.851

The projection optical system of the second embodiment is disposed in the optical path between the first surface and the second surface, includes a first concave reflecting mirror, and makes different surfaces optically conjugate with each other. A first imaging optical unit, and a second concave reflecting mirror disposed in an optical path between the first imaging optical unit and the second surface, wherein different surfaces are optically conjugate with each other. A first imaging optical unit, wherein the first concave reflecting mirror is first from a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. The second concave reflecting mirror is disposed on the surface side, and is disposed on the second surface side from the second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Therefore, good imaging performance can be achieved.
[Third embodiment]
FIG. 17 is a diagram showing a lens configuration of the projection optical system according to the third example of the present embodiment. In the projection optical system PL according to the third example, the first imaging optical system K1 is composed of a plane parallel plate P1 and 14 lenses L11 to L114 in this order from the mask side. The second imaging optical system K2 is composed of one lens L21 and a concave reflecting mirror CM1 having a concave surface facing the light incident side in order from the light incident side along the light traveling path.

The third imaging optical system K3 is composed of, in order from the light incident side, three lenses L31 to L33 and a concave reflecting mirror CM2 having a concave surface facing the light incident side. The fourth imaging optical system K4 includes, in order from the light incident side, fifteen lenses L41 to L415 and a plano-convex lens L416 (boundary lens Lb) having a plane facing the wafer side. In the fourth imaging optical system K4, an aperture stop AS is disposed in the optical path between the lens L412 and the lens L413. The following table (3) lists the values of the specifications of the projection optical system PL according to the third example.

Table (3)
(Main specifications)
λ = 193.306 nm
β = 1/4
NA = 1.35
Ra = 2.0mm
Rb = 14.764823 mm
LX = 26mm
LY = 5.0mm

(Optical member specifications)
Surface number r dn Optical member (mask surface) 50.00000
1 ∞ 8.00000 1.5603261 (P1)
2 ∞ 29.78058
3 -127.30813 16.90000 1.5603261 (L11)
4 -213.96768 37.85278
5 -309.91658 34.00000 1.5603261 (L12)
6 -174.10735 1.00000
7 423.27805 54.75193 1.5603261 (L13)
8 -420.51673 1.00000
9 181.34518 39.99158 1.5603261 (L14)
10 * 487.74740 35.52077
11 -970.15493 26.12991 1.5603261 (L15)
12 -310.86528 3.90431
13 131.85096 45.59478 1.5603261 (L16)
14 * 137.13107 1.00000
15 122.58147 15.00000 1.5603261 (L17)
16 88.57951 14.61568
17 * 140.17973 19.15803 1.5603261 (L18)
18 149.74240 15.18498
19 2429.92876 9.50000 1.5603261 (L19)
20 343.16306 32.41193
21 -62.82630 15.00000 1.5603261 (L110)
22 -113.37041 8.69329
23 -89.35211 43.32928 1.5603261 (L111)
24 -129.75751 1.00000
25 -917.79601 48.65198 1.5603261 (L112)
26 -160.05029 1.00000
27 * -1173.45002 49.27040 1.5603261 (L113)
28 -178.14331 1.00000
29 * 281.86879 28.00000 1.5603261 (L114)
30 -59596.79538 120.00000
31 ∞ -85.00000 (FM1)
32 -724.84397 -20.46255 1.5603261 (L21)
33 649.49668 -344.53745
34 468.64454 344.53745 (CM1)
35 649.49668 20.46255 1.5603261 (L21)
36 -724.84397 138.15321
37 * 632.72916 30.00000 1.5603261 (L31)
38 -222.37826 305.73229
39 -184.09838 9.00000 1.5603261 (L32)
40 -766.51612 37.54052
41 -154.11471 9.50000 1.5603261 (L33)
42 -345.44195 25.16160
43 -190.63911 -25.16160 (CM2)
44 -345.44195 -9.50000 1.5603261 (L33)
45 -154.11471 -37.54052
46 -766.51612 -9.00000 1.5603261 (L32)
47 -184.09838 -305.73229
48 -222.37826 -30.00000 1.5603261 (L31)
49 * 632.72916 -33.15321
50 ∞ 115.00000 (FM2)
51 201.51548 30.30016 1.5603261 (L41)
52 2271.81180 1.00000
53 212.87188 23.22810 1.5603261 (L42)
54 572.60417 1.00000
55 165.91358 13.00000 1.5603261 (L43)
56 160.64905 1.00000
57 156.53846 14.70000 1.5603261 (L44)
58 * 140.12592 46.60665
59 -147.23563 13.50000 1.5603261 (L45)
60 * 131.18894 28.26845
61 -1739.86221 15.00000 1.5603261 (L46)
62 -1640.79832 7.51927
63 457.82425 20.00000 1.5603261 (L47)
64 * 5000.00000 0.91196
65 415.77430 33.09535 1.5603261 (L48)
66 * 5000.00000 2.00598
67 * -2038.60809 33.27546 1.5603261 (L49)
68 -386.84098 1.00000
69 -1289.38962 27.50000 1.5603261 (L410)
70 * 5000.00000 34.68163
71 * -759.04836 45.48136 1.5603261 (L411)
72 -206.49818 1.00000
73 -405.89317 43.53270 1.5603261 (L412)
74 -241.31258 0.00000
75 ∞ 1.00000 (AS)
76 264.21319 57.06367 1.5603261 (L413)
77 1334.84026 1.00000
78 167.67206 71.61148 1.5603261 (L414)
79 * 369.23456 1.00000
80 118.51305 50.34182 1.5603261 (L415)
81 * 464.07401 1.00000
82 64.24813 54.13376 1.5603261 (L416: Lb)
83 ∞ 3.00000 1.435876 (Lm)
(Wafer surface)

(Aspheric data)
10 faces κ = 0
C ₄ = 3.019330 × 10 ⁻⁸ C ₆ = 1.049600 × 10 ⁻¹²
C ₈ = 6.915770 × 10 ⁻¹⁷ C ₁₀ = −6.7701530 × 10 ⁻²¹
C ₁₂ = 9.993780 × 10 ⁻²⁵ C ₁₄ = −8.762510 × 10 ⁻²⁹
C ₁₆ = 5.421430 × 10 ⁻³³ C ₁₈ = −1.969010 × 10 ⁻³⁷
C ₂₀ = 3.385670 × 10 ⁻⁴²

14 faces κ = 0
C ₄ = 1.219590 × 10 ⁻⁷ C ₆ = −7.888030 × 10 ⁻¹²
C ₈ = −9.373120 × 10 ⁻¹⁶ C ₁₀ = −5.507030 × 10 ⁻¹⁹
C ₁₂ = 1.666500 × 10 ⁻²² C ₁₄ = −4.130870 × 10 ⁻²⁶
C ₁₆ = 8.251130 × 10 ⁻³⁰ C ₁₈ = −1.010770 × 10 ⁻³³
C ₂₀ = 5.1131270 × 10 ⁻³⁸

17 faces κ = 0
C ₄ = 4.608230 × 10 ⁻⁷ C ₆ = 1.108570 × 10 ⁻¹²
C ₈ = 1.084550 × 10 ⁻¹⁴ C ₁₀ = −3.140760 × 10 ⁻¹⁸
C ₁₂ = −2.206940 × 10 ⁻²¹ C ₁₄ = 2.914130 × 10 ⁻²⁴
C ₁₆ = −1.100090 × 10 ⁻²⁷ C ₁₈ = 1.896490 × 10 ⁻³¹
C ₂₀ = −1.363840 × 10 ⁻³⁵

27 faces κ = 0
C ₄ = 9.3379590 × 10 ⁻⁹ C ₆ = −2.2292750 × 10 ⁻¹²
C ₈ = 1.502470 × 10 ⁻¹⁶ C ₁₀ = −1.082960 × 10 ⁻²⁰
C ₁₂ = 7.255310 × 10 ⁻²⁵ C ₁₄ = −3.984510 × 10 ⁻²⁹
C ₁₆ = 1.576910 × 10 ⁻³³ C ₁₈ = −3.902520 × 10 ⁻³⁸
C ₂₀ = 4.456900 × 10 ⁻⁴³

29 faces κ = 0
C ₄ = −3.260560 × 10 ⁻⁸ C ₆ = 5.821880 × 10 ⁻¹³
C ₈ = −3.640 500 × 10 ⁻¹⁷ C ₁₀ = 1.680610 × 10 ⁻²¹
C ₁₂ = −1.651660 × 10 ⁻²⁶ C ₁₄ = −8.260310 × 10 ⁻³⁰
C ₁₆ = 9.116710 × 10 ⁻³⁴ C ₁₈ = −4.512790 × 10 ⁻³⁸
C ₂₀ = 9.108300 × 10 ⁻⁴³

37 faces κ = 0
C ₄ = -2.975120 × 10 ⁻⁸ C ₆ = 3.753260 × 10 ⁻¹³
C ₈ = −6.868640 × 10 ⁻¹⁷ C ₁₀ = 2.865830 × 10 ⁻²⁰
C ₁₂ = −8.581360 × 10 ⁻²⁴ C ₁₄ = 1.617960 × 10 ⁻²⁷
C ₁₆ = −1.833450 × 10 ⁻³¹ C ₁₈ = 1.137730 × 10 ⁻³⁵
C ₂₀ = -2.951840 × 10 ⁻⁴⁰

49 faces κ = 0
C ₄ = -2.975120 × 10 ⁻⁸ C ₆ = 3.753260 × 10 ⁻¹³
C ₈ = −6.868640 × 10 ⁻¹⁷ C ₁₀ = 2.865830 × 10 ⁻²⁰
C ₁₂ = −8.581360 × 10 ⁻²⁴ C ₁₄ = 1.617960 × 10 ⁻²⁷
C ₁₆ = −1.833450 × 10 ⁻³¹ C ₁₈ = 1.137730 × 10 ⁻³⁵
C ₂₀ = -2.951840 × 10 ⁻⁴⁰

58 surfaces κ = 0
C ₄ = 5.9294020 × 10 ⁻⁸ C ₆ = 1.104620 × 10 ⁻¹²
C ₈ = −7.161690 × 10 ⁻¹⁷ C ₁₀ = −2.406760 × 10 ⁻²⁰
C ₁₂ = 3.333 170 × 10 ⁻²³ C ₁₄ = −1.365200 × 10 ⁻²⁶
C ₁₆ = 3.139860 × 10 ⁻³⁰ C ₁₈ = −3.829270 × 10 ⁻³⁴
C ₂₀ = 2.047710 × 10 ⁻³⁸

60 faces κ = 0
C ₄ = −1.431410 × 10 ⁻⁷ C ₆ = 1.386900 × 10 ⁻¹¹
C ₈ = −1.299750 × 10 ⁻¹⁵ C ₁₀ = 8.024180 × 10 ⁻²⁰
C ₁₂ = −2.551080 × 10 ⁻²³ C ₁₄ = 1.836510 × 10 ⁻²⁷
C ₁₆ = 1.494420 × 10 ⁻³¹ C ₁₈ = −2.4486280 × 10 ⁻³⁵
C ₂₀ = 9.829660 × 10 ⁻⁴⁰

64 faces κ = 0
C ₄ = 1.422310 × 10 ⁻⁷ C ₆ = −2.984300 × 10 ⁻¹²
C ₈ = −3.666850 × 10 ⁻¹⁷ C ₁₀ = −2.643720 × 10 ⁻²⁰
C ₁₂ = −4.961130 × 10 ⁻²⁵ C ₁₄ = 5.796880 × 10 ⁻²⁸
C ₁₆ = −5.5560440 × 10 ⁻³² C ₁₈ = 2.250480 × 10 ⁻³⁶
C ₂₀ = −3.534380 × 10 ⁻⁴¹

66 faces κ = 0
C ₄ = −9.926070 × 10 ⁻⁸ C ₆ = 1.429390 × 10 ⁻¹¹
C ₈ = −1.239860 × 10 ⁻¹⁵ C ₁₀ = 5.030440 × 10 ⁻²⁰
C ₁₂ = 3.413440 × 10 ⁻²⁴ C ₁₄ = −6.289230 × 10 ⁻²⁸
C ₁₆ = 3.994740 × 10 ⁻³² C ₁₈ = −1.243360 × 10 ⁻³⁶
C ₂₀ = 1.751830 × 10 ⁻⁴¹

67 faces κ = 0
C ₄ = -3.701360 × 10 ⁻⁸ C ₆ = 1.3396870 × 10 ⁻¹¹
C ₈ = −1.265210 × 10 ⁻¹⁵ C ₁₀ = 2.072650 × 10 ⁻²⁰
C ₁₂ = 7.369620 × 10 ⁻²⁴ C ₁₄ = −9.83640 × 10 ⁻²⁸
C ₁₆ = 6.230660 × 10 ⁻³² C ₁₈ = −2.092270 × 10 ⁻³⁶
C ₂₀ = 3.025230 × 10 ⁻⁴¹

70 faces κ = 0
C ₄ = −2.633090 × 10 ⁻⁸ C ₆ = 4.422090 × 10 ⁻¹²
C ₈ = −3.914150 × 10 ⁻¹⁶ C ₁₀ = 2.4492550 × 10 ⁻²⁰
C ₁₂ = −1.513830 × 10 ⁻²⁴ C ₁₄ = 7.407980 × 10 ⁻²⁹
C ₁₆ = −2.4480660 × 10 ⁻³³ C ₁₈ = 5.058 120 × 10 ⁻³⁸
C ₂₀ = −4.559480 × 10 ⁻⁴³

71 surface κ = 0
C ₄ = −6.291750 × 10 ⁻⁸ C ₆ = 2.200910 × 10 ⁻¹²
C ₈ = −1.099060 × 10 ⁻¹⁶ C ₁₀ = 4.8821050 × 10 ⁻²¹
C ₁₂ = −2.594680 × 10 ⁻²⁵ C ₁₄ = 1.110100 × 10 ⁻²⁹
C ₁₆ = −2.885920 × 10 ⁻³⁴ C ₁₈ = 2.330820 × 10 ⁻³⁹
C ₂₀ = 9.1181990 × 10 ⁻⁴⁴

79 faces κ = 0
C ₄ = −4.569880 × 10 ⁻⁸ C ₆ = 3.271870 × 10 ⁻¹²
C ₈ = −2.091690 × 10 ⁻¹⁶ C ₁₀ = 3.464120 × 10 ⁻²¹
C ₁₂ = 7.013050 × 10 ⁻²⁵ C ₁₄ = −6.3351130 × 10 ⁻²⁹
C ₁₆ = 2.520380 × 10 ⁻³³ C ₁₈ = −5.108610 × 10 ⁻³⁸
C ₂₀ = 4.3334 700 × 10 ⁻⁴³

81 surface κ = 0
C ₄ = 8.576300 × 10 ⁻⁸ C ₆ = −7.163000 × 10 ⁻¹³
C ₈ = 1.237390 × 10 ⁻¹⁵ C ₁₀ = −2.684410 × 10 ⁻¹⁹
C ₁₂ = 4.386080 × 10 ⁻²³ C ₁₄ = −5.042610 × 10 ⁻²⁷
C ₁₆ = 4.152850 × 10 ⁻³¹ C ₁₈ = −2.138250 × 10 ⁻³⁵
C ₂₀ = 5.505480 × 10 ⁻⁴⁰

(Conditional value)
A = 8.53 mm (reflection surface CM1a)
Re = 123.70 mm (reflection surface CM1a)
A = 0.93mm (reflective surface CM2a)
Re = 124.02 mm (reflection surface CM2a)
Rm = 164.5mm
(1) G1 = 0.069
(3) G2 = 0.008
(5) Pw = 0.0105
(6) Rm / Rb = 11.141

The projection optical system of the third embodiment is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and makes different surfaces optically conjugate with each other. A first imaging optical unit, and a second concave reflecting mirror disposed in an optical path between the first imaging optical unit and the second surface, wherein different surfaces are optically conjugate with each other. A first imaging optical unit, wherein the first concave reflecting mirror is first from a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. The second concave reflecting mirror is disposed on the surface side or the second surface side, and is disposed at the second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Therefore, good imaging performance can be achieved.
[Fourth embodiment]
FIG. 18 is a diagram showing a lens configuration of the projection optical system according to the fourth example of the present embodiment. In the projection optical system PL according to the fourth example, the first imaging optical system K1 is composed of a plane parallel plate P1 and ten lenses L11 to L110 in this order from the mask side. The second imaging optical system K2 includes two lenses L21 and L22 and a concave reflecting mirror CM1 having a concave surface facing the light incident side in order from the light incident side along the light traveling path. .

The third imaging optical system K3 is composed of two lenses L31 and L32 in order from the light incident side, and a concave reflecting mirror CM2 having a concave surface directed to the light incident side. The fourth imaging optical system K4 includes, in order from the light incident side, twelve lenses L41 to L412 and a plano-convex lens L413 (boundary lens Lb) having a plane directed to the wafer side. In the fourth imaging optical system K4, an aperture stop AS is disposed in the optical path between the lens L410 and the lens L411. The following table (4) lists the values of the specifications of the projection optical system PL according to the fourth example.

Table (4)
(Main specifications)
λ = 193.306 nm
β = 1/4
NA = 1.35
Ra = 2.8mm
Rb = 15.1605 mm
LX = 26mm
LY = 5.0mm

(Optical member specifications)
Surface number r dn optical member (mask surface) 87.87079
1 ∞ 8.00000 1.5603261 (P1)
2 ∞ 6.00000
3 204.07445 52.84870 1.5603261 (L11)
4 -454.99806 1.00000
5 * 471.88525 24.40695 1.5603261 (L12)
6 -425.52398 51.81117
7 209.78133 8.00000 1.5603261 (L13)
8 118.82226 61.73032
9 140.21318 37.84553 1.5603261 (L14)
10 -382.45670 39.26178
11 -132.06484 8.00000 1.5603261 (L15)
12 -202.28516 1.00000
13 1303.15296 20.25464 1.5603261 (L16)
14 -374.15619 6.95493
15 -333.97453 20.00626 1.5603261 (L17)
16 -167.20691 29.67942
17 * -187.92043 8.00000 1.5603261 (L18)
18 -671.24776 103.14358
19 -336.78775 37.10379 1.5603261 (L19)
20 -153.09684 1.00000
21 -1481.98166 27.07318 1.5603261 (L110)
22 * -244.36031 119.98802
23 ∞ -79.99998 (FM1)
24 -354.52959 -43.17145 1.5603261 (L21)
25 637.49146 -338.81868
26 * 129.95396 -8.00000 1.5603261 (L22)
27 1618.22540 -79.43153
28 254.58653 79.43153 (CM1)
29 1618.22540 8.00000 1.5603261 (L22)
30 * 129.95396 338.81868
31 637.49146 43.17145 1.5603261 (L21)
32 -354.52959 221.86624
33 339.43885 54.07128 1.5603261 (L31)
34 -813.62746 307.56083
35 * -127.52040 8.00000 1.5603261 (L32)
36 -2375.21500 80.57247
37 -254.59885 -80.57247 (CM2)
38 -2375.21500 -8.00000 1.5603261 (L32)
39 * -127.52040 -307.56083
40 -813.62746 -54.07128 1.5603261 (L31)
41 339.43885 -121.86625
42 ∞ 109.99991 (FM2)
43 * 251.17013 25.55009 1.5603261 (L41)
44 866.23983 1.00000
45 179.04527 40.08817 1.5603261 (L42)
46 683.89622 143.65934
47 * -245.93502 8.00000 1.5603261 (L43)
48 137.36695 40.74584
49 -207.19447 16.00000 1.5603261 (L44)
50 1757.98466 3.40928
51 1005.06285 26.00000 1.5603261 (L45)
52 * -228.13914 1.00000
53 -636.70227 36.00000 1.5603261 (L46)
54 -264.85022 1.00000
55 6746598.99230 24.92899 1.5603261 (L47)
56 * -662.29653 20.23738
57 -302.28751 46.11780 1.5603261 (L48)
58 -205.58670 17.55117
59 * -493.82767 37.39789 1.5603261 (L49)
60 -252.64751 1.00000
61 266.23062 67.54569 1.5603261 (L410)
62 * -1682.19133 0.50000
63 ∞ 0.50000 (AS)
64 186.30720 55.98724 1.5603261 (L411)
65 * 605.67386 1.00000
66 147.77173 52.45431 1.5603261 (L412)
67 * 449.51431 1.00000
68 64.09846 57.34783 1.5603261 (L413: Lb)
69 ∞ 3.00000 1.435876 (Lm)
(Wafer surface)

(Aspheric data)
5 sides κ = 0
C ₄ = −6.982550 × 10 ⁻⁸ C ₆ = −9.4437780 × 10 ⁻¹³
C ₈ = −1.037460 × 10 ⁻¹⁷ C ₁₀ = 1.326310 × 10 ⁻²¹
C ₁₂ = −8.053 140 × 10 ⁻²⁶ C ₁₄ = 1.257480 × 10 ⁻²⁹
C ₁₆ = 1.340910 × 10 ⁻³⁴ C ₁₈ = −6.438950 × 10 ⁻³⁸
C ₂₀ = 2.041070 × 10 ⁻⁴²

17 faces κ = 0
C ₄ = −2.660830 × 10 ⁻⁷ C ₆ = 1.092420 × 10 ⁻¹²
C ₈ = -1.254900 × 10 ⁻¹⁵ C ₁₀ = 1.304490 × 10 ⁻¹⁹
C ₁₂ = −9.052670 × 10 ⁻²³ C ₁₄ = 2.664230 × 10 ⁻²⁶
C ₁₆ = −5.883680 × 10 ⁻³⁰ C ₁₈ = 6.959530 × 10 ⁻³⁴
C ₂₀ = −4.013330 × 10 ⁻³⁸

22 planes κ = 0
C ₄ = 1.545150 × 10 ⁻⁸ C ₆ = 3.951400 × 10 ⁻¹³
C ₈ = −3.021100 × 10 ⁻¹⁹ C ₁₀ = 1.191630 × 10 ⁻²¹
C ₁₂ = −9.42770 × 10 ⁻²⁶ C ₁₄ = 8.031000 × 10 ⁻³⁰
C ₁₆ = −4.068030 × 10 ⁻³⁴ C ₁₈ = 1.073160 × 10 ⁻³⁸
C ₂₀ = 0

26 surfaces κ = 0
C ₄ = −2.6645370 × 10 ⁻⁸ C ₆ = −1.268 140 × 10 ⁻¹²
C ₈ = -4.940530 × 10 ⁻¹⁷ C ₁₀ = −3.813450 × 10 ⁻²¹
C ₁₂ = 9.791780 × 10 ⁻²⁶ C ₁₄ = −1.257850 × 10 ⁻²⁹
C ₁₆ = −7.1111880 × 10 ⁻³⁴ C ₁₈ = 0 C ₂₀ = 0

30 planes κ = 0
C ₄ = −2.6645370 × 10 ⁻⁸ C ₆ = −1.268 140 × 10 ⁻¹²
C ₈ = -4.940530 × 10 ⁻¹⁷ C ₁₀ = −3.813450 × 10 ⁻²¹
C ₁₂ = 9.791780 × 10 ⁻²⁶ C ₁₄ = −1.257850 × 10 ⁻²⁹
C ₁₆ = −7.1111880 × 10 ⁻³⁴ C ₁₈ = 0 C ₂₀ = 0

35 faces κ = 0
C ₄ = 2.638530 × 10 ⁻⁸ C ₆ = 1.516730 × 10 ⁻¹²
C ₈ = 8.019360 × 10 ⁻¹⁷ C ₁₀ = 3.072480 × 10 ⁻²²
C ₁₂ = 6.891090 × 10 ⁻²⁵ C ₁₄ = −5.154990 × 10 ⁻²⁹
C ₁₆ = 3.477200 × 10 ⁻³³ C ₁₈ = 0 C ₂₀ = 0

39 surfaces κ = 0
C ₄ = 2.638530 × 10 ⁻⁸ C ₆ = 1.516730 × 10 ⁻¹²
C ₈ = 8.019360 × 10 ⁻¹⁷ C ₁₀ = 3.072480 × 10 ⁻²²
C ₁₂ = 6.891090 × 10 ⁻²⁵ C ₁₄ = −5.154990 × 10 ⁻²⁹
C ₁₆ = 3.477200 × 10 ⁻³³ C ₁₈ = 0 C ₂₀ = 0

43 planes κ = 0
C ₄ = −1.184550 × 10 ⁻⁸ C ₆ = −1.852890 × 10 ⁻¹³
C ₈ = 3.338330 × 10 ⁻¹⁸ C ₁₀ = −2.4498590 × 10 ⁻²²
C ₁₂ = 1.583360 × 10 ⁻²⁷ C ₁₄ = −3.62270 × 10 ⁻³¹
C ₁₆ = 1.080160 × 10 ⁻³⁵ C ₁₈ = 0 C ₂₀ = 0

47 faces κ = 0
C ₄ = −1.350520 × 10 ⁻⁷ C ₆ = 1.261890 × 10 ⁻¹¹
C ₈ = 4.695110 × 10 ⁻¹⁶ C ₁₀ = −6.865110 × 10 ⁻²⁰
C ₁₂ = −2.598210 × 10 ⁻²⁴ C ₁₄ = 1.164180 × 10 ⁻²⁷
C ₁₆ = −2.500690 × 10 ⁻³¹ C ₁₈ = 2.883920 × 10 ⁻³⁵
C ₂₀ = −1.229890 × 10 ⁻³⁹

52 planes κ = 0
C ₄ = 6.552650 × 10 ⁻⁸ C ₆ = 2.872130 × 10 ⁻¹²
C ₈ = 1.224350 × 10 ⁻¹⁶ C ₁₀ = −4.3386550 × 10 ⁻²¹
C ₁₂ = 1.599090 × 10 ⁻²⁴ C ₁₄ = −2.042260 × 10 ⁻²⁸
C ₁₆ = 2.007870 × 10 ⁻³² C ₁₈ = −9.332240 × 10 ⁻³⁷
C ₂₀ = 1.5550770 × 10 ⁻⁴¹

56 faces κ = 0
C ₄ = −1.973270 × 10 ⁻⁸ C ₆ = 1.033850 × 10 ⁻¹²
C ₈ = 1.949840 × 10 ⁻¹⁷ C ₁₀ = 4.721580 × 10 ⁻²²
C ₁₂ = −2.771440 × 10 ⁻²⁵ C ₁₄ = 2.5559470 × 10 ⁻²⁹
C ₁₆ = −1.644 160 × 10 ⁻³³ C ₁₈ = 5.636830 × 10 ⁻³⁸
C ₂₀ = −7.3322780 × 10 ⁻⁴³

59 surfaces κ = 0
C ₄ = −3.4480820 × 10 ⁻⁸ C ₆ = 1.114220 × 10 ⁻¹²
C ₈ = 9.108670 × 10 ⁻¹⁸ C ₁₀ = −3.761100 × 10 ⁻²²
C ₁₂ = −4.473880 × 10 ⁻²⁶ C ₁₄ = 4.222360 × 10 ⁻³⁰
C ₁₆ = -1.937540 × 10 ⁻³⁴ C ₁₈ = 4.6656380 × 10 ⁻³⁹
C ₂₀ = −4.444510 × 10 ⁻⁴⁴

62 plane κ = 0
C ₄ = 1.062800 × 10 ⁻⁸ C ₆ = 2.605200 × 10 ⁻¹³
C ₈ = 8.727980 × 10 ⁻¹⁸ C ₁₀ = −3.8852360 × 10 ⁻²¹
C ₁₂ = 2.847260 × 10 ⁻²⁵ C ₁₄ = −1.189480 × 10 ⁻²⁹
C ₁₆ = 3.118810 × 10 ⁻³⁴ C ₁₈ = −4.7707590 × 10 ⁻³⁹
C ₂₀ = 3.128370 × 10 ⁻⁴⁴

65 faces κ = 0
C ₄ = −6.717180 × 10 ⁻⁸ C ₆ = 9.390 120 × 10 ⁻¹²
C ₈ = −7.232490 × 10 ⁻¹⁶ C ₁₀ = 5.263440 × 10 ⁻²⁰
C ₁₂ = -3.371860 × 10 ⁻²⁴ C ₁₄ = 1.774260 × 10 ⁻²⁸
C ₁₆ = −6.778730 × 10 ⁻³³ C ₁₈ = 1.646310 × 10 ⁻³⁷
C ₂₀ = −1.898590 × 10 ⁻⁴²

67 faces κ = 0
C ₄ = −7.7756760 × 10 ⁻⁸ C ₆ = 8.881670 × 10 ⁻¹²
C ₈ = -4.918780 × 10 ⁻¹⁶ C ₁₀ = −1.392350 × 10 ⁻²⁰
C ₁₂ = 5.830500 × 10 ⁻²⁴ C ₁₄ = −6.305730 × 10 ⁻²⁸
C ₁₆ = 3.950710 × 10 ⁻³² C ₁₈ = −1.397770 × 10 ⁻³⁶
C ₂₀ = 2.192930 × 10 ⁻⁴¹

(Conditional value)
A = 1.01mm (reflective surface CM1a)
Re = 124.77 mm (reflection surface CM1a)
A = 1.67mm (reflective surface CM2a)
Re = 124.59 mm (reflection surface CM2a)
Rm = 164.5mm
(4) G1 = 0.008
(3) G2 = 0.013
(5) Pw = 0.0107
(6) Rm / Rb = 10.851

The projection optical system of the fourth embodiment is disposed in the optical path between the first surface and the second surface, includes the first concave reflecting mirror, and makes different surfaces optically conjugate with each other. A first imaging optical unit, and a second concave reflecting mirror disposed in an optical path between the first imaging optical unit and the second surface, wherein different surfaces are optically conjugate with each other. A second imaging optical unit, and the first concave reflecting mirror is disposed at a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. The second concave reflecting mirror is disposed on the first surface side or the second surface side from the second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Therefore, good imaging performance can be achieved.
In the projection optical system PL of each embodiment, since the required conditional expression is satisfied, a function that expresses deformation applied to the reflecting surface CM1a of the first concave reflecting mirror CM1 and the reflecting surface CM2a of the second concave reflecting mirror CM2. By appropriately setting (or changing) the sign and size of the coefficient of FZ ₁₇ , it is possible to adjust at least one of the zero-order aberration component and the first-order aberration component of the wavefront aberration of the projection optical system PL. In general, the present invention is not limited to the specific function FZ ₁₇ , and the deformation according to the same function display is applied to the reflecting surface CM1a of the first concave reflecting mirror CM1 and the reflecting surface CM2a of the second concave reflecting mirror CM2. By applying, the wavefront aberration of the projection optical system PL can be adjusted.
In the above-described embodiments and examples, the deformation represented by the Zernike polynomial is applied to the reflection surface CM1a of the first concave reflection mirror CM1 and the reflection surface CM2a of the second concave reflection mirror CM2. The function to be displayed is not limited to the Zernike polynomial, and may be a polynomial such as a power series, for example. In the above-described embodiment and examples, both the reflecting surface CM1a of the first concave reflecting mirror CM1 and the reflecting surface CM2a of the second concave reflecting mirror CM2 are deformed, but the other reflecting surface with respect to one reflecting surface shape. Since the wavefront aberration of the projection optical system PL can be adjusted by adjusting the shape, it is sufficient that at least one of the reflecting surface CM1a of the first concave reflecting mirror CM1 and the reflecting surface CM2a of the second concave reflecting mirror CM2 can be deformed. .

That is, in the projection optical system PL of the present embodiment, for example, wavefront aberration caused due to light irradiation can be actively adjusted. As a result, in the exposure apparatus of the present embodiment, the fine pattern of the mask M can be projected and exposed to the wafer W with high accuracy by using the projection optical system PL capable of actively adjusting the wavefront aberration, and thus a good device. Can be manufactured.

In each of the above-described embodiments, the projection optical system PL is configured as a four-fold imaging type optical system including four imaging optical units K1, K2, K3, and K4. However, the present invention is not limited to this. A projection optical system including a first imaging optical unit including a first concave reflecting mirror and a second imaging optical unit including a second concave reflecting mirror, for example, U.S. Pat. 812, 028, No. 5,668,673, No. 7,030,965, etc., the present invention can be applied.

Further, in each of the above-described embodiments, the effective image formation region ER and the effective visual field region FR are set as rectangular regions separated from the optical axis AX of the projection optical system PL. However, the present invention is not limited to this, and various forms are possible for the positional relationship between the effective imaging region and effective field region and the optical axis of the projection optical system, and the shape of the effective imaging region and effective field region. . For example, the effective imaging region ER and the effective visual field region FR may have a polygonal shape such as an arc shape, a parallelogram shape, a trapezoidal shape, or a hexagonal shape.

In each of the above-described embodiments, the optical axis of the first imaging optical system K1 or the optical axis of the fourth imaging optical system K4 and the optical axes of the second and third imaging optical systems K2 and K3 are orthogonal to each other. However, it is not limited to this arrangement. For example, the optical axes of the second and third imaging optical systems K2 and K3 may be inclined by a predetermined angle with respect to the Y axis.

In each of the above-described embodiments, the reflection surface CM1a of the first concave reflecting mirror CM1 and the reflecting surface CM2a of the second concave reflecting mirror CM2 are deformed to control the aberration of the projection optical system. You may provide the aberration control mechanism which gives required temperature distribution to the light transmissive member which comprises an optical system. As an aberration control mechanism for giving a required temperature distribution to such a light transmitting member, US Pat. No. 6,198,579, US Pat. No. 6,781,668, 7,817,249, Reference may be made to US Patent Publication No. 2008/123066. In addition, an aberration control mechanism for controlling the aberration of the projection optical system by changing the position and posture of the optical member constituting the projection optical system may be provided.

In the above-described embodiment, a variable pattern forming apparatus that forms a predetermined pattern based on predetermined electronic data can be used instead of a mask. As the variable pattern forming apparatus, for example, a spatial light modulation element including a plurality of reflection elements driven based on predetermined electronic data can be used. An exposure apparatus using a spatial light modulator is disclosed, for example, in US Patent Publication No. 2007/0296936. In addition to the non-light-emitting reflective spatial light modulator as described above, a transmissive spatial light modulator may be used, or a self-luminous image display element may be used.

The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus may be manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

Next, a device manufacturing method using the exposure apparatus according to the above-described embodiment will be described. FIG. 19 is a flowchart showing a manufacturing process of a semiconductor device. As shown in FIG. 19, in the semiconductor device manufacturing process, a metal film is vapor-deposited on a wafer W to be a semiconductor device substrate (step S40), and a photoresist, which is a photosensitive material, is applied on the vapor-deposited metal film. (Step S42). Subsequently, using the exposure apparatus of the above-described embodiment, the pattern formed on the mask (reticle) M is transferred to each shot area on the wafer W (step S44: exposure process), and the transfer of the wafer W after the transfer is completed. Development, that is, development of the photoresist to which the pattern has been transferred is performed (step S46: development process).

Thereafter, using the resist pattern generated on the surface of the wafer W in step S46 as a mask, processing such as etching is performed on the surface of the wafer W (step S48: processing step). Here, the resist pattern is a photoresist layer in which unevenness having a shape corresponding to the pattern transferred by the exposure apparatus of the above-described embodiment is generated, and the recess penetrates the photoresist layer. is there. In step S48, the surface of the wafer W is processed through this resist pattern. The processing performed in step S48 includes, for example, at least one of etching of the surface of the wafer W or film formation of a metal film or the like. In step S44, the exposure apparatus of the above-described embodiment performs pattern transfer using the wafer W coated with the photoresist as a photosensitive substrate.

FIG. 20 is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element. As shown in FIG. 20, in the liquid crystal device manufacturing process, a pattern forming process (step S50), a color filter forming process (step S52), a cell assembling process (step S54), and a module assembling process (step S56) are sequentially performed. In the pattern forming process of step S50, a predetermined pattern such as a circuit pattern and an electrode pattern is formed on the glass substrate coated with a photoresist as the plate P using the exposure apparatus of the above-described embodiment. In this pattern formation process, an exposure process for transferring the pattern to the photoresist layer using the exposure apparatus of the above-described embodiment and development of the plate P to which the pattern is transferred, that is, development of the photoresist layer on the glass substrate are performed. And a developing step for generating a photoresist layer having a shape corresponding to the pattern, and a processing step for processing the surface of the glass substrate through the developed photoresist layer.

In the color filter forming process in step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning direction. In the cell assembly process in step S54, a liquid crystal panel (liquid crystal cell) is assembled using the glass substrate on which the predetermined pattern is formed in step S50 and the color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter. In the module assembling process in step S56, various components such as an electric circuit and a backlight for performing the display operation of the liquid crystal panel are attached to the liquid crystal panel assembled in step S54.

In addition, the present invention is not limited to application to an exposure apparatus for manufacturing a semiconductor device, for example, an exposure apparatus for a display device such as a liquid crystal display element formed on a square glass plate or a plasma display, It can also be widely applied to an exposure apparatus for manufacturing various devices such as an image sensor (CCD or the like), a micromachine, a thin film magnetic head, and a DNA chip. Furthermore, the present invention can also be applied to an exposure process (exposure apparatus) when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.

In the above-described embodiment, the ArF excimer laser light source is used. However, the present invention is not limited to this, and other suitable light sources, for example, a KrF excimer laser light source for supplying laser light with a wavelength of 248 nm, a laser with a wavelength of 157 nm An F ₂ laser light source that supplies light, a Kr ₂ laser light source that supplies laser light with a wavelength of 146 nm, an Ar ₂ laser light source that supplies laser light with a wavelength of 126 nm, or the like can be used. It is also possible to use a CW (Continuous Wave) light source such as an ultrahigh pressure mercury lamp that emits bright lines such as g-line (wavelength 436 nm) and i-line (wavelength 365 nm). A harmonic generator of a YAG laser or the like can also be used. In addition, as disclosed in, for example, US Pat. No. 7,023,610, a single wavelength laser beam in an infrared region or a visible region oscillated from a DFB semiconductor laser or a fiber laser is used as vacuum ultraviolet light. For example, a harmonic that is amplified by a fiber amplifier doped with erbium (or both erbium and ytterbium) and wavelength-converted into ultraviolet light using a nonlinear optical crystal may be used.

In the above-described embodiment, the present invention is applied to the scanning exposure apparatus. However, the present invention is not limited to this, and the mask and wafer (photosensitive substrate) are stationary with respect to the projection optical system. The present invention can also be applied to a batch exposure type exposure apparatus that performs projection exposure in the above-described state.

In the above-described embodiment, the present invention is applied to an immersion type projection optical system mounted on the exposure apparatus. However, the present invention is not limited to the immersion system and can be similarly applied to a dry projection optical system. In general, the present invention can be applied to an imaging optical system that forms an image of a first surface on a second surface.

M mask MST mask stage PL projection optical system K1, K2, K3, K4 imaging optical unit CM1, CM2 concave reflecting mirror FM1, FM2 planar reflecting mirror Lb boundary lens Lm liquid W wafer 1 illumination optical system 9 Z stage 10 XY stage 14 Main control system 21 Water supply / drainage mechanism

Claims

In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical portion disposed in an optical path between the first surface and the second surface and including a first concave reflecting mirror to form an intermediate image of the first surface;
A second imaging optical part that is arranged in an optical path between the first imaging optical part and the second surface, includes a second concave reflecting mirror, and forms an image of the intermediate image;
A projection optical system, wherein at least one of the first concave reflecting mirror and the second concave reflecting mirror has a deformable reflecting surface.
The projection optical system according to claim 1, wherein each of the first concave reflecting mirror and the second concave reflecting mirror has a deformable reflecting surface.
The first imaging optical part includes a first imaging optical unit that includes the first concave reflecting mirror and that makes different surfaces optically conjugate with each other.
The second imaging optical portion includes the second reflecting mirror, and includes a second imaging optical unit that makes different surfaces optically conjugate with each other. 3. The projection optical system according to 2.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical unit including a first concave reflecting mirror disposed in an optical path between the first surface and the second surface and having a deformable reflecting surface;
A second imaging optical unit including a second concave reflecting mirror disposed in an optical path between the first imaging optical unit and the second surface and having a deformable reflecting surface. Characteristic projection optical system.
5. The projection optical system according to claim 3, wherein the projection optical system is a four-time imaging type optical system including four imaging optical units.
A front-side refractive imaging optical unit disposed in the optical path between the first surface and the first imaging optical unit; and an optical path between the second imaging optical unit and the second surface. 6. The projection optical system according to claim 3, further comprising a rear-side refractive imaging optical unit.
The projection optical system according to any one of claims 3 to 6, wherein the effective image formation area on the second surface is an area away from the optical axis of the projection optical system.
The first concave reflecting mirror is located on the first surface side or the second surface from a first pupil position optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. Placed on the side
The second concave reflecting mirror is located on the second surface side or the first surface from a second pupil position optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. The projection optical system according to claim 3, wherein the projection optical system is disposed on a side of the projection optical system.
The first concave reflecting mirror is disposed on the first surface side from the first pupil position, and the second concave reflecting mirror is disposed on the second surface side from the second pupil position. The projection optical system according to claim 8.
The first concave reflecting mirror is disposed on the second surface side from the first pupil position, and the second concave reflecting mirror is disposed on the first surface side from the second pupil position. The projection optical system according to claim 8.
A radius of a circle circumscribing a set of partial spots occupied by a light beam from each point in the effective field area on the first surface on an arbitrary optical surface is Re, and a light beam from the center point of the effective field area is the arbitrary beam The center position of a rectangle that circumscribes a partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the light flux from the point of the maximum object height in the effective visual field region is the arbitrary The distance on the arbitrary optical surface to the center position of a rectangle that is a rectangle circumscribing the partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the arbitrary optical surface When an index G representing the positional relationship between the pupil position closest to the optical surface and the arbitrary optical surface is defined by G = A / Re,
The index G1 related to the reflecting surface of the first concave reflecting mirror and the index G2 related to the reflecting surface of the second concave reflecting mirror are:
0.02 <G1 <0.07
0.02 <G2 <0.07
The projection optical system according to claim 8, wherein the following condition is satisfied.
The first concave reflecting mirror is disposed at a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit;
The second concave reflecting mirror is located on the first surface side or the second surface from a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. The projection optical system according to claim 3, wherein the projection optical system is disposed on a side of the projection optical system.
A radius of a circle circumscribing a set of partial spots occupied by a light beam from each point in the effective field area on the first surface on an arbitrary optical surface is Re, and a light beam from the center point of the effective field area is the arbitrary beam The center position of a rectangle that circumscribes a partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the light flux from the point of the maximum object height in the effective visual field region is the arbitrary The distance on the arbitrary optical surface to the center position of a rectangle that is a rectangle circumscribing the partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the arbitrary optical surface When an index G representing the positional relationship between the pupil position closest to the optical surface and the arbitrary optical surface is defined by G = A / Re,
The index G1 related to the reflecting surface of the first concave reflecting mirror and the index G2 related to the reflecting surface of the second concave reflecting mirror are:
0 <G1 <0.02
0.02 <G2 <0.07
The projection optical system according to claim 12, wherein the following condition is satisfied.
The first concave reflecting mirror is located on the first surface side or the second surface from a first pupil position optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. Placed on the side
The second concave reflecting mirror is disposed at a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Item 8. The projection optical system according to any one of Items 3 to 7.
A radius of a circle circumscribing a set of partial spots occupied by a light beam from each point in the effective field area on the first surface on an arbitrary optical surface is Re, and a light beam from the center point of the effective field area is the arbitrary beam The center position of a rectangle that circumscribes a partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the light flux from the point of the maximum object height in the effective visual field region is the arbitrary The distance on the arbitrary optical surface to the center position of a rectangle that is a rectangle circumscribing the partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the arbitrary optical surface When an index G representing the positional relationship between the pupil position closest to the optical surface and the arbitrary optical surface is defined by G = A / Re,
The index G1 related to the reflecting surface of the first concave reflecting mirror and the index G2 related to the reflecting surface of the second concave reflecting mirror are:
0.02 <G1 <0.07
0 <G2 <0.02
The projection optical system according to claim 14, wherein the following condition is satisfied.
The first concave reflecting mirror is disposed at a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit;
The second concave reflecting mirror is disposed at a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Item 8. The projection optical system according to any one of Items 3 to 7.
A radius of a circle circumscribing a set of partial spots occupied by a light beam from each point in the effective field area on the first surface on an arbitrary optical surface is Re, and a light beam from the center point of the effective field area is the arbitrary beam The center position of a rectangle that circumscribes a partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the light flux from the point of the maximum object height in the effective visual field region is the arbitrary The distance on the arbitrary optical surface to the center position of a rectangle that is a rectangle circumscribing the partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the arbitrary optical surface When an index G representing the positional relationship between the pupil position closest to the optical surface and the arbitrary optical surface is defined by G = A / Re,
The index G1 related to the reflecting surface of the first concave reflecting mirror and the index G2 related to the reflecting surface of the second concave reflecting mirror are:
0 <G1 <0.02
0 <G2 <0.02
The projection optical system according to claim 16, wherein the following condition is satisfied.
A plurality of optical elements arranged between the fourth pupil position and the second surface that are optically Fourier-transformed with the position of the second surface in the optical path of the rear refractive imaging optical unit; The projection optical system according to any one of claims 6 to 17, wherein the power of the partial optical system is 0.0100 (mm -1 ) or more.
However, when the fourth pupil position is present inside the optical element, the optical element is included in the partial optical system.
When the maximum image height of the effective imaging region on the second surface is Rb, and the maximum lens effective radius in the rear refractive imaging optical unit is Rm,
Rm / Rb ≧ 9.0
The projection optical system according to claim 6, wherein the following condition is satisfied.
The projection optical system according to any one of claims 8 to 19, wherein an effective visual field area on the first surface is rectangular.
A first active deforming portion that actively deforms the reflecting surface of the first concave reflecting mirror; and a second active deforming portion that actively deforms the reflecting surface of the second concave reflecting mirror. The projection optical system according to claim 2, wherein the projection optical system is a projection optical system.
The first active deforming portion and the second active deforming portion apply deformations according to the same function display to the reflecting surface of the first concave reflecting mirror and the reflecting surface of the second concave reflecting mirror. The projection optical system according to claim 21, wherein wavefront aberration of the projection optical system is adjusted.
The first active deformation portion and the second active deformation portion are each a zero-order aberration component that is uniform for each point along a predetermined direction in the effective imaging region on the second surface, and each of the points along the predetermined direction. 23. The projection optical system according to claim 22, wherein at least one of primary aberration components that change linearly with respect to a point is adjusted.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. And
The first concave reflecting mirror is disposed on the first surface side from a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit;
The second concave reflecting mirror is disposed on the second surface side from a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. A projection optical system characterized by that.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. And
The first concave reflecting mirror is disposed on the second surface side from the first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit,
The second concave reflecting mirror is disposed on the first surface side from a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. A projection optical system characterized by that.
A radius of a circle circumscribing a set of partial spots occupied by a light beam from each point in the effective field area on the first surface on an arbitrary optical surface is Re, and a light beam from the center point of the effective field area is the arbitrary beam The center position of a rectangle that circumscribes a partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the light flux from the point of the maximum object height in the effective visual field region is the arbitrary The distance on the arbitrary optical surface to the center position of a rectangle that is a rectangle circumscribing the partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the arbitrary optical surface When an index G representing the positional relationship between the pupil position closest to the optical surface and the arbitrary optical surface is defined by G = A / Re,
The index G1 related to the reflecting surface of the first concave reflecting mirror and the index G2 related to the reflecting surface of the second concave reflecting mirror are:
0.02 <G1 <0.07
0.02 <G2 <0.07
The projection optical system according to claim 24, wherein the following condition is satisfied.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. And
The first concave reflecting mirror is disposed at a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit;
The second concave reflecting mirror is located on the first surface side or the second surface from a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. A projection optical system characterized by being arranged on the side.
A radius of a circle circumscribing a set of partial spots occupied by a light beam from each point in the effective field area on the first surface on an arbitrary optical surface is Re, and a light beam from the center point of the effective field area is the arbitrary beam The center position of a rectangle that circumscribes a partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the light flux from the point of the maximum object height in the effective visual field region is the arbitrary The distance on the arbitrary optical surface to the center position of a rectangle that is a rectangle circumscribing the partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the arbitrary optical surface When an index G representing the positional relationship between the pupil position closest to the optical surface and the arbitrary optical surface is defined by G = A / Re,
The index G1 related to the reflecting surface of the first concave reflecting mirror and the index G2 related to the reflecting surface of the second concave reflecting mirror are:
0 <G1 <0.02
0.02 <G2 <0.07
The projection optical system according to claim 27, wherein the following condition is satisfied.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. And
The first concave reflecting mirror is located on the first surface side or the second surface from a first pupil position optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit. Placed on the side
The second concave reflecting mirror is disposed at a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Optical system.
A radius of a circle circumscribing a set of partial spots occupied by a light beam from each point in the effective field area on the first surface on an arbitrary optical surface is Re, and a light beam from the center point of the effective field area is the arbitrary beam The center position of a rectangle that circumscribes a partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the light flux from the point of the maximum object height in the effective visual field region is the arbitrary The distance on the arbitrary optical surface to the center position of a rectangle that is a rectangle circumscribing the partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the arbitrary optical surface When an index G representing the positional relationship between the pupil position closest to the optical surface and the arbitrary optical surface is defined by G = A / Re,
The index G1 related to the reflecting surface of the first concave reflecting mirror and the index G2 related to the reflecting surface of the second concave reflecting mirror are:
0.02 <G1 <0.07
0 <G2 <0.02
The projection optical system according to claim 29, wherein the following condition is satisfied.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical unit that is disposed in an optical path between the first surface and the second surface, includes a first concave reflecting mirror, and optically conjugates different surfaces to each other;
A second imaging optical unit that is disposed in the optical path between the first imaging optical unit and the second surface, includes a second concave reflecting mirror, and makes different surfaces optically conjugate with each other. And
The first concave reflecting mirror is disposed at a first pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the first imaging optical unit;
The second concave reflecting mirror is disposed at a second pupil position that is optically Fourier-transformed with the position of the first surface in the optical path of the second imaging optical unit. Optical system.
A radius of a circle circumscribing a set of partial spots occupied by a light beam from each point in the effective field area on the first surface on an arbitrary optical surface is Re, and a light beam from the center point of the effective field area is the arbitrary beam The center position of a rectangle that circumscribes a partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the light flux from the point of the maximum object height in the effective visual field region is the arbitrary The distance on the arbitrary optical surface to the center position of a rectangle that is a rectangle circumscribing the partial spot that occupies the optical surface and has one side in a direction corresponding to one side of the effective visual field region, and the arbitrary optical surface When an index G representing the positional relationship between the pupil position closest to the optical surface and the arbitrary optical surface is defined by G = A / Re,
The index G1 related to the reflecting surface of the first concave reflecting mirror and the index G2 related to the reflecting surface of the second concave reflecting mirror are:
0 <G1 <0.02
0 <G2 <0.02
32. The projection optical system according to claim 31, wherein the following condition is satisfied.
A front-side refractive imaging optical unit disposed in the optical path between the first surface and the first imaging optical unit; and an optical path between the second imaging optical unit and the second surface. 33. The projection optical system according to claim 24, further comprising a rear-side refractive imaging optical unit.
A plurality of optical elements arranged between the fourth pupil position and the second surface that are optically Fourier-transformed with the position of the second surface in the optical path of the rear refractive imaging optical unit; The projection optical system according to claim 33, wherein the power of the partial optical system is 0.0100 (mm -1 ) or more.
However, when the fourth pupil position is present inside the optical element, the optical element is included in the partial optical system.
When the maximum image height of the effective imaging region on the second surface is Rb, and the maximum lens effective radius in the rear refractive imaging optical unit is Rm,
Rm / Rb ≧ 9.0
The projection optical system according to claim 33 or 34, wherein the following condition is satisfied.
36. The projection optical system according to claim 24, wherein the effective image formation area on the second surface is an area away from the optical axis of the projection optical system.
37. The projection optical system according to claim 24, wherein the effective field area on the first surface is rectangular.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The second imaging optical system includes a plurality of positive lenses disposed in an optical path between the first intermediate image and the first concave reflecting mirror,
The third imaging optical system includes a plurality of positive lenses arranged in an optical path between the second intermediate image and the second concave reflecting mirror.
The plurality of positive lenses of the third imaging optical system includes positive meniscus lenses that are disposed closest to the second intermediate image and have a concave surface facing the second intermediate image. The projection optical system described.
The projection according to claim 38 or 39, wherein the fourth imaging optical system includes a positive lens disposed closest to the third intermediate image and having a convex surface facing the second surface. Optical system.
The fourth imaging optical system includes a positive lens that is disposed adjacent to the second surface side of the positive lens of the fourth imaging optical system and has a convex surface facing the third intermediate image side. 41. The projection optical system according to claim 40.
The fourth imaging optical system is disposed adjacent to the second surface side of the positive lens having a convex surface directed to the third intermediate image side, and a negative lens having a concave surface directed to the third intermediate image side. 42. The projection optical system according to claim 41, comprising: a projection optical system.
The fourth imaging optical system is disposed adjacent to the second surface side of the positive lens with the convex surface facing the third intermediate image side, and has a plurality of negative surfaces with the concave surface facing the third intermediate image side. 42. The projection optical system according to claim 41, comprising a lens.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The projection optical system, wherein the fourth imaging optical system includes a positive lens that is disposed closest to the third intermediate image and has a convex surface facing the second surface.
The fourth imaging optical system includes a positive lens that is disposed adjacent to the second surface side of the positive lens of the fourth imaging optical system and has a convex surface facing the third intermediate image side. 45. The projection optical system according to claim 44.
The fourth imaging optical system is disposed adjacent to the second surface side of the positive lens having a convex surface directed to the third intermediate image side, and a negative lens having a concave surface directed to the third intermediate image side. 46. The projection optical system according to claim 45, comprising: a projection optical system.
The fourth imaging optical system is disposed adjacent to the second surface side of the positive lens with the convex surface facing the third intermediate image side, and has a plurality of negative surfaces with the concave surface facing the third intermediate image side. 46. The projection optical system according to claim 45, comprising a lens.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The projection optical system, wherein the second imaging optical system includes a positive meniscus lens disposed closest to the first intermediate image side and having a convex surface directed toward the first intermediate image side.
The second imaging optical system is disposed between the positive meniscus lens having a convex surface directed to the first intermediate image side and the first concave reflecting mirror, and has a convex surface directed to the first intermediate image side. 49. The projection optical system according to claim 48, further comprising a negative meniscus lens having a concave surface facing the positive meniscus lens side.
The projection optical system according to claim 49, wherein the first concave reflecting mirror and the negative meniscus lens are disposed adjacent to each other.
51. The projection optical system according to claim 50, wherein the negative meniscus lens and the positive meniscus lens are disposed adjacent to each other.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
The projection optical system, wherein the second imaging optical system includes a lens disposed closest to the first intermediate image side and adjacent to the first concave reflecting mirror.
In the projection optical system for forming an image of the first surface on the second surface,
A first imaging optical system disposed in an optical path between the first surface and the second surface and forming a first intermediate image of the first surface;
A second imaging that is disposed in an optical path between the first imaging optical system and the second surface, includes a first concave reflecting mirror, and forms a second intermediate image that is an image of the first intermediate image. Optical system,
A third imaging that is disposed in an optical path between the second imaging optical system and the second surface, includes a second concave reflecting mirror, and forms a third intermediate image that is an image of the second intermediate image. Optical system,
A fourth imaging optical system disposed in an optical path between the third imaging optical system and the second surface, and forming an image of the third intermediate image on the second surface;
A first deflecting mirror disposed in an optical path between the first imaging optical system and the second imaging optical system;
A projection optical system, comprising: a second deflecting mirror disposed between the third imaging optical system and the fourth imaging optical system.
54. The projection optical system according to claim 53, wherein the second imaging optical system and the third imaging optical system are coaxial with each other.
55. The projection optical system according to claim 53, wherein an optical axis of the first imaging optical system and an optical axis of the fourth imaging optical system are parallel to each other.
The first deflecting mirror has a first plane reflecting surface along a first plane,
The second deflecting mirror has a second plane reflecting surface along the second plane,
The projection optical system according to any one of claims 53 to 55, wherein the first and second planes are parallel to each other.
The first deflecting mirror has a first plane reflecting surface along a first plane,
The second deflecting mirror has a second plane reflecting surface along the second plane,
The optical axis of the first imaging optical system and the optical axis of the second imaging optical system intersect on the first plane,
57. The projection according to claim 53, wherein an optical axis of the third imaging optical system and an optical axis of the fourth imaging optical system intersect on the second plane. Optical system.
The method for adjusting a projection optical system according to any one of claims 2 to 21,
Adjusting the wavefront aberration of the projection optical system by applying deformation according to the same function display to the reflecting surface of the first concave reflecting mirror and the reflecting surface of the second concave reflecting mirror. An adjustment method characterized by.
Adjusting the wavefront aberration is a uniform zero-order aberration component for each point along a predetermined direction in the effective imaging region on the second surface, and a linear change for each point along the predetermined direction. 59. The adjustment method according to claim 58, comprising adjusting at least one of the first-order aberration components.
In the adjustment method of the projection optical system for forming the image of the first surface on the second surface,
Deforming a first concave reflecting mirror in a first imaging optical unit disposed in an optical path between the first surface and the second surface;
Deforming a second concave reflecting mirror in a second imaging optical unit disposed in an optical path between the first imaging optical unit and the second surface;
Including
The wavefront aberration of the projection optical system is adjusted by applying deformation according to the same function display to the reflecting surface of the first concave reflecting mirror and the reflecting surface of the second concave reflecting mirror. How to adjust.
At least one of a zero-order aberration component that is uniform for each point along a predetermined direction in the effective imaging region on the second surface and a first-order aberration component that varies linearly for each point along the predetermined direction. The adjustment method according to claim 60, wherein the wavefront aberration is adjusted by adjusting one side.
58. The method according to claim 1, for projecting the predetermined pattern onto a substrate set on the second surface based on light from the predetermined pattern set on the first surface. An exposure apparatus comprising the projection optical system.
Guiding light from a predetermined pattern set on the first surface to a projection optical system to project the predetermined pattern onto a substrate set on the second surface;
62. An exposure method comprising adjusting the projection optical system using the adjustment method according to any one of claims 58 to 61.
The exposure apparatus according to claim 62, exposing the predetermined pattern to the substrate;
Developing the substrate to which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on the surface of the substrate;
Processing the surface of the substrate through the mask layer. A device manufacturing method comprising:
Using the exposure method of claim 63 to expose the predetermined pattern to the substrate;
Developing the substrate to which the predetermined pattern is transferred, and forming a mask layer having a shape corresponding to the predetermined pattern on the surface of the substrate;
Processing the surface of the substrate through the mask layer. A device manufacturing method comprising: