WO2015034287A1

WO2015034287A1 - Silver alloy bonding wire and method for manufacturing same

Info

Publication number: WO2015034287A1
Application number: PCT/KR2014/008323
Authority: WO
Inventors: 김상엽; 허영일; 이종철; 김승현; 문정탁
Original assignee: 엠케이전자 주식회사
Priority date: 2013-09-04
Filing date: 2014-09-04
Publication date: 2015-03-12
Also published as: CN105745339A; PH12016500401A1; KR101535412B1; KR20150027626A

Abstract

The present invention relates to a silver alloy bonding wire containing silver (Ag) as a main component, palladium (Pd), and gold (Au), and, more specifically, to an alloy bonding wire in which the palladium (Pd) content is 0.1 to 0.4 wt% and the weight content ratio of gold (Au) to palladium (Pd) is 0.25 to 1.0. The use of the silver alloy bonding wire of the present invention can improve the ball shape uniformity and the bonding ball shape of a ball which is formed on the tip of a wire and provide excellent reliability, loop linearity, and binding strength.

Description

Silver Alloy Bonding Wire And Method Of Manufacturing The Same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silver alloy bonding wire and a method of manufacturing the same. More specifically, a silver alloy bonding wire having improved ball shape uniformity and bonding ball shape and excellent reliability, loop straightness, and bond strength formed at the tip of the wire. And a method for producing the same.

Various structures exist in a package for mounting a semiconductor device, and bonding wires are still widely used to connect the substrate and the semiconductor device or to connect the semiconductor devices. As a bonding wire, gold bonding wires have been used a lot, but they are expensive and there is a demand for bonding wires that can replace them since the price has risen recently.

In the case of copper wire, which has been spotlighted as an alternative to Au, the pad crack phenomenon occurs frequently during ball bonding due to the inherent high hardness of copper, and SOB (stitch-on) required for highly integrated packages Bump bonding is not solved due to the high hardness and strong oxidative properties of copper.

As an alternative, research on bonding wires based on low-cost silver (Ag) has been actively conducted. Efforts have been made to develop bonding wires of good properties by alloying silver with other metal elements, but there is still much room for improvement.

Korean Patent Publication No. 2007-0031998

The first technical problem to be achieved by the present invention is to provide a silver alloy bonding wire with improved ball shape uniformity and bonding ball shape at the tip of the wire and excellent in reliability, loop straightness, and bonding strength.

The second technical problem to be achieved by the present invention is to provide a method for producing a silver alloy bonding wire having improved ball shape uniformity and bonding ball shape and excellent reliability, loop straightness, and bonding strength of the ball formed at the wire tip.

In order to achieve the first technical problem, the first aspect of the present invention provides a silver alloy bonding wire containing silver (Ag) as a main component and containing palladium (Pd) and gold (Au). The silver alloy bonding wire may have a content of palladium (Pd) of about 0.1 to about 4.0 wt%, and a weight-based content ratio of gold (Au) to palladium (Pd) of about 0.25 to about 1.0. In particular, the weight-based content ratio of gold (Au) to palladium (Pd) is more preferably about 0.4 to about 0.7.

In addition, the ratio of twin boundaries of the grains of the silver alloy bonding wire may be about 2% to about 10%. At this time, the content of the palladium (Pd) is preferably about 1.5% by weight to about 3.5% by weight.

In addition, the silver alloy bonding wire is iridium (Ir), titanium (Ti), platinum (Pt), beryllium (Be), calcium (Ca), lanthanum (La), yttrium (Y), cerium (Ce), bismuth ( At least one component selected from the group consisting of Bi), cobalt (Co), and magnesium (Mg) may be further included as a performance control component. For example, the content of the performance control component may be about 3 ppm by weight to about 5000 ppm by weight. In particular, the performance control component may include platinum (Pt), the content of the platinum (Pt) may be about 500 ppm by weight to about 5000 ppm by weight.

Optionally, the performance control component may be iridium (Ir) or titanium (Ti).

Another aspect for achieving the first technical problem of the present invention is a silver alloy bonding wire containing silver (Ag) as a main component, and containing palladium (Pd) and gold (Au), the content of palladium (Pd) is 0.1 to 4.0 weight percent and a silver alloy bonding wire having a ratio of twin boundaries of grains from about 2% to about 10%.

The silver alloy bonding wire is iridium (Ir), titanium (Ti), platinum (Pt), beryllium (Be), calcium (Ca), lanthanum (La), yttrium (Y), cerium (Ce), bismuth (Bi) , Cobalt (Co), and magnesium (Mg) may further comprise one or more components selected from the group consisting of performance control components, the content of the performance control component is about 3 ppm by weight to about 5000 ppm by weight Can be.

In order to achieve the second technical problem, the present invention includes silver (Ag) as a main component, and includes palladium (Pd) and gold (Au), and the content of palladium (Pd) is 0.1 to 4.0 wt%, and palladium ( Preparing an alloy piece having a weight-based content ratio of gold (Au) to 0.25 to 1.0; And it provides a method for producing a silver alloy bonding wire comprising the step of drawing and heat-treating the alloy piece. In particular, the drawing and heat treatment of the alloy piece may include performing a first heat treatment when the diameter of the thin wire obtained by drawing the alloy piece is 0.5 mm to 5 mm. The first heat treatment may be performed at 550 ℃ to 700 ℃ for 0.5 seconds to 5 seconds.

In this case, the drawing and heat treatment may be configured such that the ratio of the twin boundary of the grains of the silver alloy bonding wire is about 2% to about 10%.

In particular, the first heat treatment may be performed at about 600 ℃ to about 650 ℃ for about 2 seconds to about 4 seconds.

The drawing and heat treatment may further include performing a second heat treatment when the diameter of the thin wire obtained by drawing the alloy piece is 0.05 mm to 0.4 mm. At this time, the secondary heat treatment may be performed at about 550 ℃ to about 700 ℃ for about 0.5 seconds to about 5 seconds.

In particular, the secondary heat treatment may be performed at about 600 ° C to about 650 ° C for about 2 seconds to about 4 seconds.

By using the silver alloy bonding wire of the present invention, the ball shape uniformity and the bonding ball shape of the ball formed at the tip of the wire are improved, and the reliability, loop straightness, and bonding strength are excellent.

1 is a block diagram showing a method of manufacturing a silver alloy bonding wire according to an embodiment of the present invention.

2A and 2B show the results of misorientation analysis and twin boundary image analysis of Example 1. FIG.

3A and 3B show the results of misorientation analysis and twin boundary image analysis of Comparative Example 1. FIG.

FIG. 4 is a conceptual side view illustrating a first bonding side and a second bonding side test method, respectively, for testing bonding characteristics of manufactured silver alloy bonding wires.

Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings. However, embodiments of the inventive concept may be modified in many different forms and should not be construed as limiting the scope of the inventive concept to the embodiments described below. Embodiments of the inventive concept are preferably interpreted as being provided to those skilled in the art to more fully describe the inventive concept. Like numbers refer to like elements all the time. Furthermore, various elements and regions in the drawings are schematically drawn. Accordingly, the inventive concept is not limited by the relative size or spacing drawn in the accompanying drawings.

Terms such as first and second may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the inventive concept, the first component may be referred to as the second component, and vice versa, the second component may be referred to as the first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the inventive concepts. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the expression “comprises” or “having” is intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, operations, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art, including technical terms and scientific terms. Also, as used in the prior art, terms as defined in advance should be construed to have a meaning consistent with what they mean in the context of the technology concerned, and in an overly formal sense unless explicitly defined herein. It will be understood that it should not be interpreted.

The concept of the present invention discloses a silver alloy bonding wire containing silver (Ag) as a main component and containing palladium (Pd) and gold (Au). Here, the main component means that the concentration of the corresponding element with respect to the total component exceeds 50%. That is, having silver (Ag) as the main component means that the concentration of silver in the total amount of silver and other elements exceeds 50%. Here, the concentration refers to the concentration based on the number of moles of atoms.

The content of the palladium (Pd) may be about 0.1% by weight to about 4% by weight. If the content of palladium (Pd) is too small, the acid resistance may deteriorate so that it may be easily corroded or short-circuited by nitric acid or sulfuric acid. In particular, if palladium is not contained, oxidation resistance of the silver alloy bonding wire may be weak. On the contrary, when the content of palladium is excessively high, the hardness of the ball formed at the end of the wire during wire bonding may excessively increase, thereby damaging the bonding pad and / or the substrate below.

The content ratio of gold (Au) to the palladium (Pd), that is, the ratio of [gold (Au) content] / [palladium (Pd) content] may be about 0.25 to about 1.0 based on weight. The content ratio of gold (Au) to the palladium (Pd) is more preferably about 0.4 to about 0.7.

If the content ratio of gold (Au) to the palladium (Pd) is too low, the shape of the ball formed at the end of the bonding wire is out of the spherical (眞球) may have a poor bonding properties. In addition, there is a problem that the surface of the bonding wire is easily oxidized and discolored.

On the contrary, if the content ratio is too high, the true structure of the balls formed at the ends of the bonding wires becomes worse. In addition, there is a fear that the hardness of the ball formed at the end of the bonding wire rises excessively, thereby damaging the bonding pad and / or the substrate below.

In addition, when the total content of palladium (Pd) and gold (Au) is excessively large, there is a problem that the electrical resistance is increased and the electrical conductivity is deteriorated.

In consideration of this point, the content of palladium (Pd) may be about 0.1% to about 4.0% by weight. In addition, the content of the palladium is more preferably about 1.5% to about 3.5% by weight. At this time, the content of the gold (Au) may be determined based on the content ratio between the gold (Au) and palladium (Pd).

The twin boundary (일종) is a kind of boundary formed by the grains and has a lattice structure forming a mirror image. More specifically, the boundary where the arrangement of atoms on one side and the arrangement of atoms on the other side are mirror images of each other around the boundary (boundary) is called a twin boundary.

If the ratio corresponding to the twin boundary is high among the boundary formed by the whole grains, the shape of the ball may be out of the spherical sphere when the ball is formed, which is not preferable. More specifically, the ratio corresponding to the twin boundary among the boundaries formed by the whole grains may be about 10% or less. Preferably, the ratio corresponding to the twin boundary among the boundaries formed by the whole grains is preferably about 2% to about 10%.

The ratio of the twin boundary means the ratio of the boundary that meets the definition of the above twin boundary among the boundaries of the grains formed by the grains of the bonding wire cross-section, and the ratio of the twin boundary is, for example, electron backscatter diffraction. Can be measured relatively easily using equipment such as EBSD).

The inventors of the present invention found that the ball formation of the bonding wire is closely related to the ratio of the twin boundary, and when the ratio of the twin boundary exceeds about 10%, the true structure of the ball formed at the end of the bonding wire is deteriorated, and Problems have been found that the planar shape of the first bonding side may be out of the garden form or have a flower shape. In other words, by managing the ratio of the twin boundary in the cross-sectional crystal structure of the bonding wire to about 10% or less, the true structure of the ball formed at the end of the bonding wire is improved, and the planar shape of the primary bonding side also has the effect of having a garden shape. Found.

The manufacturing cost may increase when manufacturing the twin boundary to be less than or equal to 2%.

The silver alloy bonding wire is iridium (Ir), titanium (Ti), platinum (Pt), beryllium (Be), calcium (Ca), lanthanum (La), yttrium (Y), cerium (Ce), bismuth (Bi) It may further comprise one or more components selected from the group consisting of, cobalt (Co), and magnesium (Mg) as a performance control component. These performance control components can be added to improve performance such as high temperature reliability, high humidity reliability, bonding properties, elongation standard deviation, and the like.

The content of the performance control component may be about 3 ppm by weight to about 5000 ppm by weight. If the content of the performance control component is too low, the desired performance improvement may not be manifested. In addition, if the content of the performance control component is too high, the electrical resistance increases and is economically disadvantageous.

In particular, according to an embodiment of the present invention, the performance control component may be platinum (Pt). The content of platinum (Pt) may be about 500 ppm by weight to about 5000 ppm by weight.

Optionally, according to another embodiment of the present invention, the performance control component may be iridium (Ir) and / or titanium (Ti). The content of iridium (Ir) and / or titanium (Ti) may be about 500 ppm by weight to about 5000 ppm by weight.

Optionally, according to another embodiment of the present invention, the performance control component essentially includes platinum (Pt) and may further include iridium (Ir) and / or titanium (Ti). In this case, the sum of the content of platinum (Pt) and the content of the iridium (Ir) and / or titanium (Ti) may be about 500 ppm by weight to about 5000 ppm by weight.

Hereinafter will be described a method of manufacturing a silver alloy bonding wire according to an embodiment of the present invention. 1 is a block diagram sequentially illustrating a manufacturing method according to an embodiment of the present invention.

Referring to FIG. 1, an alloy liquid of a metal raw material may be manufactured by melting and casting a metal raw material including silver (Ag), gold (Au), and palladium (Pd) in a melting furnace to have a desired composition (S1). At this time, performance control components other than silver (Ag), gold (Au), and palladium (Pd) can be added.

Then, the alloy liquid of the metal raw material is cooled and solidified, and an alloy piece can be obtained by forging, rolling, or the like (S2). Subsequently, the alloy piece may be first thinned to have a diameter of about 6 mm to about 9 mm (S3).

The primary thin wire thinned to have a diameter of about 6 mm to about 9 mm is drawn and heat-treated (S4). The drawing and heat treatment may include a step of gradually thinning and heat treating the primary thin wire. In order to thin the primary thin wire, the cross section of the thin wire may be reduced while passing through a multi-stage die.

In particular, in order to manage the ratio of the twin boundary to about 10% or less, this embodiment may include performing a first heat treatment when the diameter of the fine wire is about 0.5 mm to about 5 mm. The primary heat treatment may be performed, for example, at about 550 ° C. to about 700 ° C. for about 0.5 seconds to about 5 seconds. More preferably, the first heat treatment may be performed at about 600 ℃ to about 650 ℃ for about 2 seconds to about 4 seconds.

Optionally, in order to manage the ratio of the twin boundary within about 10%, the present embodiment may further comprise performing a second heat treatment when the diameter of the fine wire is about 0.05 mm to about 0.4 mm . The secondary heat treatment may be performed, for example, at about 550 ° C. to about 700 ° C. for about 0.5 seconds to about 5 seconds. More preferably, the secondary heat treatment may be performed at about 600 ° C. to about 650 ° C. for about 2 seconds to about 4 seconds.

Those skilled in the art will appreciate that the thin wire decreases in diameter as it sequentially passes through a number of dice. In other words, the thin wire decreases in diameter as it sequentially passes through a plurality of dice arranged to gradually decrease the size of the hole.

The above heat treatments may be performed between any dice and dice when the diameter of the fine wire falls within the corresponding range. In other words, the primary heat treatment may be performed between any two dice when the diameter of the fine wire is about 0.5 mm to about 5 mm. The secondary heat treatment may be performed between any two dice when the diameter of the thin wire is about 0.1 mm to about 0.5 mm.

Subsequently, the cross section of the wire is reduced by drawing the fine wire until a bonding wire having a desired diameter is manufactured through drawing. At this time, the cross-sectional reduction rate of the bonding wires before and after the die can be adjusted to about 7% to about 15%. That is, when the wire in the wire passes through one die, the process can be configured such that the cross-sectional area after passage decreases by about 7% to about 15% compared to the cross-sectional area before passage. In particular, the reduction rate of the cross section of the bonding wire in the process of drawing a diameter in the range of 50 μm or less is preferably adjusted to about 7% to about 15%.

If the cross sectional reduction rate of the bonding wire is too high, the dispersion of grains in the bonding wire may be excessively large. In addition, if the cross sectional reduction rate of the bonding wire is too low, the number of drawing operations required to obtain the bonding wire of the desired diameter is too large, which may be economically disadvantageous.

Optionally, additional annealing may be performed after the drawing is completed to adjust elongation (S5). Annealing conditions for adjusting the elongation may vary depending on the composition of the thin wire, the reduction rate, the heat treatment conditions, etc., but may be performed for about 1 second to about 20 minutes at a temperature of about 400 ° C to 600 ° C, Those skilled in the art will be able to select specific annealing conditions appropriately.

If the annealing temperature is too low, the ductility and malleability necessary for bonding bonding may not be secured. On the contrary, if the annealing temperature is too high, the grain size may be excessively large. The same failure may occur and is undesirable.

In addition, when the annealing time is too short, ductility and malleability necessary for processing may not be secured. On the contrary, when the annealing time is too long, the grain size may be excessively large and economically disadvantageous, which is not preferable.

The above annealing process can be performed, for example, by passing the bonding wire through the furnace at a suitable speed. Also, the rate at which the bonding wire passes through the furnace can be determined from the annealing time and the size of the furnace.

Hereinafter, the structure and effects of the present invention will be described in more detail with specific examples and comparative examples, but these examples are only intended to more clearly understand the present invention and are not intended to limit the scope of the present invention. In Examples and Comparative Examples, physical properties were evaluated in the following manner.

[Ball shape uniformity]

After capturing the image of the bonding wire having a diameter of 20 μm, using a 5% H ₂ + N ₂ gas as a shielding gas to make a bonding ball of 2WD (diameter twice the diameter of the wire), the image is captured. The degree of deviation was measured. The degree of deviating from the garden was quantified by expressing the difference between the ratio of the short axis to the long axis of the ball and the difference as a percentage.

When the above quantified value is less than 2%,?, 2% or more, and less than 5%, ○, 5% or more and △, 8% or more, x was evaluated.

[Bonding ball shape]

The tip of the 20 µm diameter bonding wire is bonded to the pad using 5% H ₂ + N ₂ gas as a shielding gas to form a bonding ball of 2WD (diameter twice the diameter of the wire), and then the horizontal and vertical directions By measuring the ratio of the length of the specimen, it was observed whether it was close to 1, whether the bonding wire was located at the center of the ball, whether the edge was smooth in a round shape, or whether there was a petal-shaped bend.

When the ratio of the length of the bonded ball in the transverse direction and the longitudinal direction is not less than 0.99, the bonding wire is located at the center of the ball, and the edge is determined to be round without a petal shape, the length of the bonded ball in the horizontal and vertical directions When the ratio of is 0.96 or more and less than 0.99 and the bonding wire is located at the center of the ball, and the edge is determined to be round without petal shape, the ratio of the length of the bonded ball in the horizontal axis direction and the vertical axis direction is 0.9 or more, and the edge is shaped like a petal. There was no, and if it did not correspond to ◎ or ○ above, △, otherwise, evaluated as ×.

[High temperature reliability]

After the wire bonding, the package sealed with the epoxy molding resin was heated to the temperature of 175 degreeC, the time which the short circuit generate | occur | produces in the joint surface was measured, and the high temperature reliability was evaluated. (Circle) if a short circuit in a joining surface is 500 hours or more, (circle) and 384 hours or more and less than 500 hours, it evaluated as (circle), 192 or more and less than 384 hours, (triangle | delta), and it evaluated as x for less than 192 hours.

High Humidity Reliability

After the wire bonding, the package sealed with epoxy molding resin was left under 121 degreeC and 85% humidity, the time which the short circuit generate | occur | produces in the joint surface was measured, and the high humidity reliability was evaluated. When the time which a short circuit generate | occur | produces in a joining surface is 192 hours or more, (circle), 168 hours or more and less than 192 hours, (circle), 96 hours or more and less than 168 hours, it evaluated as (triangle | delta) and less than 96 hours.

Thermal Shock Reliability

Thermal shock reliability was used commercially available thermal cycling test (TCT) equipment. After wire bonding, it is sealed with epoxy molding resin (EMC), and thermal shock is repeatedly applied under severe conditions (-45 ° C / 30 minutes to + 125 ° C / 30 minutes), and then the bonding wire is broken by shrinkage / expansion. The number of losing wires was measured. ◎ if there are no wires broken out of 6000 wires, ○ if there are more than 1 or less than 5 wires broken, △ if 5 or more and less than 20 wires are broken, △ .

[Loop straightness]

Bumps were formed by ball bonding to one of two rows of bonding pads arranged at intervals of 120 μm, and ball bonding was performed on the opposite side, and stitch bonding was performed on the bumps while forming loops.

Then, the gap was measured at the point where the gap between the loops was the narrowest, and this was determined as a value representing the gap between each loop. The intervals between the loops thus determined were 111 μm to 125 μm, 이면, 105 μm or more and less than 111 μm, and Δ if they were less than 105 μm.

[Bond pull test (BPT) and stitch pull test (SPT)]

As shown in FIG. 4, the primary bonding side bonding pad 10 and the secondary bonding side bonding pad 20 are bonded using the manufactured silver alloy bonding wire. That is, the ball is formed on the tip of the silver alloy bonding wire 100 to perform ball bonding on the primary bonding side bonding pad 10, and then stitch bonding is performed on the secondary bonding side bonding pad 20.

Then, the part near the primary bonding side is pulled vertically upward along arrow A to evaluate the load when the primary bond falls (BPT), and the part near the secondary bonding side is pulled vertically upward along arrow B to secondary bonding. The load when it fell was evaluated (SPT).

2000 samples were prepared for each Example and Comparative Example to perform BPT for 1000 samples and SPT for the remaining 1000 samples. The average value of the measured rod was determined and determined as shown in Table 1 below.

Table 1

Judgment	BPT rod (g)	SPT load (g)
◎	7.5g or more	6.5g or more
○	7.0g or more and less than 7.5g	6.0g or more and less than 6.5g
△	6.0 g or more and less than 7.0 g	5.0 g or more but less than 6.0 g
×	Less than 6.0g	Less than 5.0g

[Ball shear test (BST)]

As shown in FIG. 4, the primary bonding side bonding pad 10 and the secondary bonding side bonding pad 20 are bonded using the manufactured silver alloy bonding wire.

Then, the shear force was applied laterally to the primary bonded portion to evaluate the load when the primary bonding fell.

1000 samples were prepared for each Example and Comparative Example to perform a BST, and the average value of the measured load was obtained to determine as shown in Table 2 below.

TABLE 2

Judgment	BST load (g)
◎	More than 26g
○	21 g or more but less than 26 g
△	15 g or more but less than 21 g
×	Less than 15g

First, after preparing an ingot having a composition as shown in Table 3, a bonding wire having a diameter of 20 μm was prepared by performing a first heat treatment and a second heat treatment together with the fresh wire. The first heat treatment temperature and the second heat treatment temperature are as shown in Table 3 below, respectively, and were performed for 3 seconds at the time points of 0.5 mm and 0.08 mm, respectively.

Comparative Example 1

After preparing an ingot having a composition as shown in Table 3 below, the first and second heat treatments were performed together with the fresh wire to prepare a bonding wire having a diameter of 20 μm. The primary heat treatment temperature and the secondary heat treatment temperature were as shown in Table 3, respectively, and were performed for 3 seconds at the time points of 8 mm and 0.08 mm, respectively.

Twin boundary analysis was performed on the samples of Examples 1 to 4 and Comparative Example 1 prepared above. The twin boundary analysis was performed using a JEOL JSM-6500 device equipped with an electron backscatter diffraction (EBSD) device and HKL CHANNEL 5 software. At this time, the tilt angle was 70 degrees and the grain boundary reference was an area having a crystal orientation difference of 15 degrees or more. The measurement step was 0.05 µm for the surface and 0.2 µm for the longitudinal section.

2A and 2B show the results of misorientation analysis and twin boundary image analysis of Example 1, and FIGS. 3A and 3B show the results of misorientation analysis and twin boundary image analysis of Comparative Example 1. It was.

TABLE 3

As shown in the table above, when the ratio of the twin boundary exceeds 10%, the ball shape uniformity and the shape of the bonding ball were found to be somewhat worse. In addition, it can be seen that the high temperature reliability is also relatively deteriorated, which may be due to the deterioration of the shape of the bonding ball.

As shown in Table 4, bonding wires were prepared while varying the composition of palladium (Pd) and gold (Au). In the same manner as in Example 1-4 and Comparative Example 1 above was measured the ratio and other physical properties of the twin boundary, Table 5 summarizes the results.

Table 4

Table 5

As shown in Table 4 and Table 5 above, it was found that when the twin boundary ratio is 10% or less, relatively excellent ball shape uniformity and bonding ball shape were shown. In addition, when the content of palladium (Pd) is more than 4% by weight or the content ratio of gold (Au) / palladium (Pd) is more than 1, it is not impossible for the twin boundary ratio to be 10% or less (Comparative Example 3). , Comparative Example 4) It was found that physical properties such as ball uniformity and thermal shock reliability were poor.

As shown in Table 5, the composition of palladium (Pd) and gold (Au) was changed, and the performance control component was added, and the bonding wire was manufactured. In the same manner as in Example 1-4 and Comparative Example 1 above was measured the ratio and other physical properties of the twin boundary, Table 7 summarizes the results.

Table 6

TABLE 7

As shown in Table 7, when the ratio of the twin boundary exceeds 10%, it was found that the ball shape uniformity and the bonding ball shape were generally inferior compared to the case where the ratio of the twin boundary was 10% or less. In addition, high temperature reliability, high humidity reliability, and thermal shock reliability were also generally inferior, which is presumed to be due to inferior ball shape uniformity and / or bonding ball shape.

In addition, the loop straightness is also poor overall, such as BPT, SPT, BST, which was not found to heal even with the addition of performance control components. On the other hand, in Examples 11, 12, and 14-16, it was analyzed that the performance of thermal shock reliability, loop straightness, and / or BPT was improved by the addition of a performance control component of about 500 ppm by weight to about 5000 ppm by weight.

Although described in detail with respect to embodiments of the present invention as described above, those of ordinary skill in the art, without departing from the spirit and scope of the invention as defined in the appended claims Various modifications may be made to the invention. Therefore, changes in the future embodiments of the present invention will not be able to escape the technology of the present invention.

The present invention can be usefully used in the semiconductor industry.

Claims

A silver alloy bonding wire containing silver (Ag) as a main component and containing palladium (Pd) and gold (Au),

The content of palladium (Pd) is 0.1 to 4.0% by weight,

Silver alloy bonding wire, characterized in that the weight-based content ratio of gold (Au) to palladium (Pd) is 0.25 to 1.0.
The method of claim 1,

A silver alloy bonding wire, characterized in that the ratio of twin boundaries of grains is 2% to 10%.
The method of claim 1,

Silver alloy bonding wire, characterized in that the weight-based content ratio of gold (Au) to palladium (Pd) is 0.4 to 0.7.
The method of claim 3, wherein

Silver alloy bonding wire, characterized in that the content of the palladium (Pd) is 1.5% by weight to 3.5% by weight.
The method of claim 1,

Iridium (Ir), titanium (Ti), platinum (Pt), beryllium (Be), calcium (Ca), lanthanum (La), yttrium (Y), cerium (Ce), bismuth (Bi), cobalt (Co), And at least one component selected from the group consisting of magnesium (Mg) as a performance control component,

The content of the performance control component is a silver alloy bonding wire, characterized in that 3 to 5000 ppm by weight.
The method of claim 5,

The performance control component comprises platinum (Pt),

Silver alloy bonding wire, characterized in that the content of platinum (Pt) is 500 ppm by weight to 5000 ppm by weight.
The method of claim 5,

The silver alloy bonding wire, characterized in that the performance control component is iridium (Ir) or titanium (Ti).
A silver alloy bonding wire containing silver (Ag) as a main component and containing palladium (Pd) and gold (Au),

The content of palladium (Pd) is 0.1 to 4.0% by weight,

A silver alloy bonding wire, characterized in that the ratio of twin boundaries of grains is from about 2% to about 10%.
The method of claim 8,

Iridium (Ir), titanium (Ti), platinum (Pt), beryllium (Be), calcium (Ca), lanthanum (La), yttrium (Y), cerium (Ce), bismuth (Bi), cobalt (Co), And at least one component selected from the group consisting of magnesium (Mg) as a performance control component,

The content of the performance control component is a silver alloy bonding wire, characterized in that 3 to 5000 ppm by weight.
It is based on silver (Ag), contains palladium (Pd) and gold (Au), the content of palladium (Pd) is 0.1 to 4.0% by weight, the weight-based content of gold (Au) to palladium (Pd) Preparing an alloy piece having a ratio of 0.25 to 1.0; And

Drawing and heat treating the alloy piece;

Including,

The drawing and heat treatment of the alloy piece,

Performing a first heat treatment when the diameter of the fine wire obtained by drawing the alloy piece is 0.5 mm to 5 mm;

The method of claim 1, wherein the first heat treatment is performed at 550 ° C to 700 ° C for 0.5 seconds to 5 seconds.
The method of claim 10,

Wherein said drawing and heat treatment are configured such that the ratio of twin boundaries of crystal grains of said silver alloy bonding wire is from about 2% to about 10%.
The method of claim 10,

The first heat treatment is carried out at 600 ℃ to 650 ℃ for 2 seconds to 4 seconds, characterized in that the manufacturing method of the silver alloy bonding wire.
The method of claim 10,

The freshness and heat treatment

Performing a second heat treatment when the diameter of the fine wire obtained by drawing the alloy piece is 0.05 mm to 0.4 mm;

Further comprising, wherein the secondary heat treatment is a method of producing a silver alloy bonding wire, characterized in that performed at 550 ℃ to 700 ℃ for 0.5 seconds to 5 seconds.
The method of claim 13,

The secondary heat treatment is a method for producing a silver alloy bonding wire, characterized in that performed for 2 to 4 seconds at 600 ℃ to 650 ℃.