WO2015014739A1

WO2015014739A1 - Assembly of optoelectronic components and method for producing an assembly of optoelectronic components

Info

Publication number: WO2015014739A1
Application number: PCT/EP2014/066020
Authority: WO
Inventors: Erwin Lang; Simon SCHICKTANZ; Philipp SCHWAMB
Original assignee: Osram Oled Gmbh
Priority date: 2013-07-30
Filing date: 2014-07-25
Publication date: 2015-02-05
Also published as: DE102013108134A1

Abstract

The invention relates, in various embodiments, to an assembly of optoelectronic components (100), which can have a substrate (203), a plurality of optoelectronic components, which can be arranged on the substrate (100), wherein each optoelectronic component can be arranged on a respective optoelectronic component substrate region, and at least one activation circuit (153), which can be arranged on an optoelectronic component substrate region and can be configured to activate at least one optoelectronic component of the plurality of optoelectronic components (100), wherein the substrate (203) can have at least one target separation structure (101).

Description

description

Arrangement of optoelectronic components and method for producing an arrangement of optoelectronic components

The invention relates to an arrangement of optoelectronic components and to a method for producing an arrangement of optoelectronic components.

In the context of this description, an electronic component can be understood as a component which controls, controls or amplifies an electrical component

Stromes concerns, for example by using

Semiconductor devices.

In the context of this description can under a

Optoelectronic component an embodiment of a

electronic component can be understood, wherein the optoelectronic component has an optically active region. The optically active region can absorb electromagnetic radiation and form a photocurrent therefrom or emit electromagnetic radiation by means of an applied voltage to the optically active region.

In the context of this description may be an electrical

Contacting an electrical component or an electrical region of the electrical component, for example an electronic component,

for example, an optoelectronic component, for example as an integration of the optoelectronic component

Component can be understood in an electrical circuit, wherein the circuit can be electrically closed, for example by means of the electrical contacting of the electronic component. In the context of this description can be an electric

contacted, electronic component to be understood as an embodiment of an electrical component. In the context of this description, an organic,

Electronic component in various configurations, as an organic light emitting diode (OLED), an organic photovoltaic system, such as an organic solar cell, an organic sensor, an organic field effect transistor (OFET) and / or organic electronics

be educated. The organic field effect transistor may be an all-OFET in which all

Layers are organic. An organic, electronic component may have an organic functional layer system, which is synonymously also referred to as an organic functional layer structure. The organic

Functional layer structure may include or be formed from an organic substance or mixture of organic substances, for example, to provide electromagnetic radiation from a supplied electric current or to provide an electric current from a provided electromagnetic energy

Radiation is set up.

An organic light-emitting diode is usually characterized by a mechanical flexibility and moderate

Conditions of production. Compared with a component made of inorganic materials, an organic

LED due to the possibility of larger area

Manufacturing methods (for example roll-to-roll

Manufacturing process) can be manufactured potentially inexpensive. OLEDs are therefore becoming increasingly popular and can be used for the illumination of surfaces. A Surface can be understood, for example, as a table, a wall or a floor.

An OLED can have an anode and a cathode with one

having organic functional layer or an organic functional layer stack therebetween. The organic functional layer stack may include one or more emitter layers in which

electromagnetic radiation is generated, one or more charge carrier pair generation layer structure of each two or more carrier pair generation layers

("Charge generating layer", CGL)

Charge carrier pair generation, and one or more

Electron block layers, also referred to as

Hole transport layer (HT), and one or more hole block layers, also referred to as electron transport layer (s) (ETL), for directing the flow of current. An OLED requires, for lighting applications, to achieve a certain luminous flux (e.g., -1200 lm as a replacement for a 10 ohm light bulb) at a given or desired one

Luminance a correspondingly large luminous area. So far, such necessary sizes of

Luminous surface not using single OLED devices

realize, or the yield in the production is very limited. On the manufacturer's side, large-area OLED luminous surfaces are produced by means of so-called "on-substrate tilings" or a serial interconnection of OLED components by means of

Downstream back-end processes or external

Series connection to Leuchtidodenanordnungen.

In existing hybrid lights, the organic and

inorganic light emitting diodes (LEDs) combine, such as the Products Piroled and Airabesc, is usually only on

Luminaire level, the integration of the OLED components or the LED components realized by means of external wiring and external control units. This requires a large external effort, which affects time and cost technology on the production.

In the German patent application "Organic

Light-emitting diode module and method for its production "(DE 10 2012 214 216.9) describes the invention of an integrated OLED module on the same carrier

describes the integration of electronic components, e.g. for a constant current driver, in combination with e.g. top emitting OLED on the same substrate. This allows a simplified production of OLED modules.

Furthermore, inorganic light emitting diode arrangements are with

Constant current drivers on flexible carriers known for example from the OSRAM PL Flex product range.

Even an adaptation of an OLED to an irregularly shaped surface to be provided with a luminous area can be realized with current OLEDs only in that the user arranges individual small OLEDs as desired and interconnects them externally or drives them through one or more external electronic components.

Concepts for the realization of organic

Light emitting diode arrangements or arrangements

Optoelectronic components on flexible substrates with integrated circuit are not known.

There is therefore a need for an integrated arrangement of optoelectronic components which the user can flexibly adapt to his needs with regard to the area to be covered,

Can adjust luminous flux and / or three-dimensional shape. The present invention describes in various

Embodiments the (integrated) series connection of optoelectronic components on a common

Substrate.

In various embodiments, the substrate of the invention may be flexible. Electronic components (e.g., for constant current operation) or current spreading structures may be integrated on the substrate.

In various embodiments, desired separation structures for later individual singulation are smaller

Arranged arrangements of optoelectronic components or individual optoelectronic components. Thus, in the case of light emitting diodes, individual light strips or

Generate illuminated areas of a certain size and e.g. Realize OLED wallpaper or flexible OLED tapes.

In various embodiments, methods for

Producing such an arrangement optoelectronic

Components described.

In various embodiments, an arrangement of optoelectronic components is provided, which allows optoelectronic in smaller arrangements

Components to be singled, wherein at least one of the isolated arrangements is designed so that, apart from a power supply, without adding or providing additional electronic components, can be operated. In various embodiments, at least two of the smaller or isolated arrays of optoelectronic devices may be in a new or old arrangement electrically and possibly mechanically connected, the isolated arrangements optoelectronic

Components are designed so that the connected

Segments, apart from a power supply, without

Add or deploy additional electronic components can be operated.

In other words, it is for operating an array of optoelectronic devices according to various

Embodiments sufficient, they in the original

Arrangement or to connect in a new arrangement after an electrically conductive connection of smaller nominal separations separated arrangements of optoelectronic components to a power supply.

Various embodiments make it possible to produce very flat and very compact arrangements

Optoelectronic devices, which later

can be separated according to the requirements of the customer as needed and used in different applications. Due to the increased integration of optoelectronic components (for example OLEDs, optionally additionally LEDs) and electronic components on a substrate, there are also some back-end processes, ie processes which would occur during the isolation and packaging of the optoelectronic components, and materials required therefor , This makes it possible to produce more favorable arrangements of optoelectronic components, for example OLED or OLED / LED hybrids

Emitting diode arrangements.

An integration of the electronic components before the

Applying the optoelectronic components allows the use of interconnected technologies with increased

Temperature budget (such as soldering, etc.), which in back-end processes to damage the optoelectronic

Could lead to components. Various embodiments of the present invention make possible the realization of large-area arrangement of optoelectronic components, a simple integration of different optoelectronic components, for example of OLED and LED, in hybrid arrangements of optoelectronic components, a simple separation towards a smaller arrangement of optoelectronic components, as well as a

two-dimensional filling of a surface by an arrangement of optoelectronic components, which can optionally be separated into smaller segments of optoelectronic components.

In various embodiments, an arrangement of optoelectronic components is provided, which may comprise a substrate, as well as a plurality of

optoelectronic devices on the substrate

can be arranged, each optoelectronic

Component can be arranged on a respective optoelectronic component substrate region, and

at least one drive circuit on one

Optoelectronic component substrate region may be arranged and may be arranged for driving at least one optoelectronic component of the plurality of optoelectronic components, wherein the substrate may have at least one desired separation structure.

In one embodiment, the at least one desired separation structure may be arranged in the substrate such that, when the substrate is separated along the desired separation structure, at least one optoelectronic component of the plurality of optoelectronic components and the

Drive circuit remain together on the substrate. In one embodiment, the at least one

optoelectronic component of the plurality of

optoelectronic components on a first side of the Substrate may be arranged, wherein the drive circuit may be arranged on a second side of the substrate, which faces the first side of the substrate, and wherein the substrate has at least one via, by means of which the at least one optoelectronic device may be electrically conductively connected to the drive circuit.

In one embodiment, the arrangement of optoelectronic components can be set up as a transparent or translucent arrangement of optoelectronic components.

In one embodiment, the at least one

Optoelectronic component having at least one organic functional layer stack and an encapsulation of the organic functional layer stack.

In one embodiment, the encapsulation may be between the substrate and the organic functional

Layer stacks extend.

In yet another embodiment, the arrangement

Optoelectronic devices further comprise a protective layer, wherein the protective layer is disposed over the encapsulation.

In one embodiment, the desired separation structure next to the organic functional layer stack in the

Encapsulation extend.

In yet another embodiment, the encapsulation can be so

be embodied that on or above the encapsulation extending between the substrate and the organic functional layer stack and on or above the

functional layer stack, a further encapsulation or a further part of the encapsulation may be arranged, wherein at least one desired separation structure in a region or may be arranged in areas in which / which the encapsulation and the further encapsulation are in contact with each other. In one embodiment, the plurality of

optoelectronic components at least three

have optoelectronic components which are electrically coupled together. In one embodiment, at least three

Optoelectronic components along one direction

be arranged.

In one embodiment, at least three

Optoelectronic components may be arranged along two directions.

In one embodiment, the arrangement of optoelectronic components may further comprise a marking which marks the course of the desired separation structure.

In one embodiment, the mark may be printed.

In one embodiment, at least part of the desired separation structure may be formed by a perforation.

In one embodiment, the drive circuit may comprise a constant current source. In yet another embodiment, the arrangement

Optoelectronic devices further comprise at least one further drive circuit, wherein the

Drive circuits are arranged on different optoelectronic component substrate areas.

In yet another embodiment, the arrangement

Optoelectronic devices further comprises a plurality of Have drive circuits, wherein the

Control circuits are arranged so that each

Optoelectronic component substrate region has at least one drive circuit.

In one embodiment, the arrangement of optoelectronic components may further comprise at least one inorganic light emitting diode. In yet another embodiment, the at least one

inorganic light emitting diode be electrically coupled in parallel to the optoelectronic components.

In yet another embodiment, the at least one

organic light emitting diode in series with the optoelectronic devices to be electrically coupled.

In one embodiment, the at least one inorganic light-emitting diode can be arranged on the first side of the substrate.

In another embodiment, the at least one inorganic light-emitting diode can be arranged on the second side of the substrate.

In one embodiment, the plurality of

optoelectronic components at least three

Have optoelectronic components which are electrically coupled together in series.

In one embodiment, the plurality of

optoelectronic components at least three

Having optoelectronic components which are electrically coupled together in parallel.

In various embodiments, a method of fabricating an array of opto-electronic devices may be used Arranging a plurality of optoelectronic components on a substrate, wherein each optoelectronic component can be arranged on a respective optoelectronic component substrate region, and arranging at least one drive circuit for driving at least one optoelectronic component of the plurality of optoelectronic components on one

Optoelectronic device substrate region, and forming at least one desired separation structure in the substrate.

opto-electronic devices that may be disposed on the substrate, each optoelectronic

Component can be arranged on a respective optoelectronic component substrate region and wherein at least one optoelectronic component of the plurality of optoelectronic components can have at least one organic functional layer stack and an encapsulation of the organic functional layer stack, and at least one drive circuit, which on a

In various embodiments, a method of fabricating an array of opto-electronic devices may include locating a plurality of opto-electronic devices on a substrate, wherein each opto-electronic device may be disposed on a respective opto-electronic device substrate region, wherein at least one opto-electronic device of the plurality of opto-electronic devices at least one organic functional layer stack and an encapsulation of the an organic functional layer stack may have, and an arranging at least one drive circuit for driving at least one optoelectronic component of the plurality of optoelectronic components on a

The term "transparent" or "transparent layer" can be understood in various embodiments that a layer is transparent to light

(For example, at least in a portion of the

Wavelength range from 380 nm to 780 nm), wherein light coupled into a structure (for example a layer) is coupled out of the structure (for example layer) substantially without scattering or light conversion.

The term "translucent" or "translucent layer" can be understood in various embodiments that a layer is permeable to light,

for example, for the light generated or to be absorbed by the optoelectronic component, for example one or more wavelength ranges, for example light visible in a wavelength range

(For example, at least in a portion of the

Wavelength range from 380 nm to 780 nm). By way of example, the term "translucent layer" in various exemplary embodiments is to be understood to mean that substantially the entire amount of light coupled into a structure (for example a layer) also originates from the structure

(For example, layer) is decoupled.

In various embodiments, under the

For example, "encapsulation" or "encapsulation" is understood to mean that a barrier or encapsulation layer is provided against moisture and / or oxygen, so that the organic functional layer structure can not be penetrated by these substances. Embodiments of the invention are illustrated in the figures and are explained in more detail below.

Show it

FIGS. 1 a and 1 b show a plan view (FIG. 1 a) and a view from below (FIG. 1 b) of an arrangement of optoelectronic components according to various embodiments of the present invention;

Figure 2 is a cross-sectional view of an organic arrangement

Light emitting diodes and an enlarged view of layers of organic light emitting according to various embodiments of the present invention

Invention;

Figures 3a and 3b is a plan view (Figure 3a) and an Ans

from below (Fig.3b) an arrangement of organic

Light-emitting diodes m Combination with inorganic light-emitting diodes according to various

Embodiments of the present invention

Figure 4 is a plan view of an organic arrangement

Light-emitting diodes in combination with inorganic light-emitting diodes according to various

Embodiments of the present invention;

Figure 5 is a plan view of an organic arrangement

Embodiments of the present invention;

Figures 6a and 6b are cross-sectional views of arrangements

opto-electronic components according to various embodiments of the present invention; FIGS. 7a and 7b are cross-sectional views of arrangements of optoelectronic devices according to various embodiments of the present invention; Figures 8a and 8b are cross-sectional views of arrangements

organic light emitting diodes in combination with inorganic light emitting diodes according to various

Embodiments of the present invention; Figure 9 is a cross-sectional view of an organic arrangement

Embodiments of the present invention; FIGS. 10a and 10b show a cross-sectional view along the

Line I-I of the arrangement optoelectronic

Components of Figure 4 with a perforation and a perspective view of the perforation in the area II-II of Figure 4 according to various

Embodiments of the present invention;

Figures IIa, IIb, 11c and IId a top view of a

Arrangement of optoelectronic devices, a cross section along the line III-III and two

Perspective views of two different possible embodiments of a perforation area IV-IV according to various embodiments of the present invention. 12a, 12b, 12c, 12d, 12e, 12f and 12g show a top view of an arrangement of optoelectronic components according to various embodiments of the present invention and cross-sectional views along the line VV (FIG. 12b) and along the line VI-VI (FIG , Fig.l2d, Fig.l2e, Fig.l2f,

Fig.12g). FIGS. 13a and 13b show a plan view of an arrangement of optoelectronic components according to various exemplary embodiments of the present invention and a cross-sectional view along the line VII-VII.

FIG. 14 is a flow chart showing a method for

Producing an arrangement of optoelectronic components according to various embodiments, and

15a, 15b, 15c, 15d, 15e, 15f and 15g flowcharts for creating a perforation region in a desired separation structure of an array of optoelectronic devices according to various embodiments of the present invention.

In the following detailed description, reference is made to the accompanying drawings, which are part of this

In the description, specific embodiments are shown in which the invention may be practiced. In this regard will

Directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. used with reference to the orientation of the described figure (s). There

Components of embodiments in number

different orientations can be positioned, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various exemplary embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be construed in a limiting sense, and the

Scope of the present invention is achieved by the defined in the appended claims. Same or similar

Elements are provided in the figures with identical reference numerals, as appropriate. FIG. 1 shows a top view and a bottom view of an arrangement of optoelectronic components 100 according to FIG

various embodiments of the present

Invention, and Figure 2 shows a cross-sectional view of an array of organic light-emitting diodes and an enlarged

View of layers of organic light-emitting diodes according to various embodiments of the present invention

Invention;

In various exemplary embodiments, the arrangement of optoelectronic components 100 may be a substrate 203

exhibit. The substrate 203 may, for example, as a

Carrier element for electronic elements or layers, such as optoelectronic elements serve. For example, when the substrate serves as a support member for an organic light emitting diode, a material which uses it

enables patterned conductive traces 152 to be deposited on a second side 151 of the substrate 203, and bonding between the second side of the substrate 151 and an opposite first side 102 of the substrate 203

manufacture. The substrate 203 may include various materials. The substrate 203 may comprise a printed circuit board, it may for example be designed as a rigid printed circuit board having, for example, FR4 or a liquid-crystalline plastic (LCP). In other embodiments, the circuit board may be a flexible circuit board, which may in particular comprise a polyimide such as Kapton. Such a flexible printed circuit board is also referred to as flex PCB. Alternatively, however, other materials for the substrate 203 are suitable. The requirements for the material of the substrate 203 are that it is a deposition of conductor tracks 152 allows and has sufficient heat resistance to temperatures typically encountered in

Manufacturing process of the arrangement optoelectronic

Components 100, in particular in a coating and in an encapsulation, occur.

In various embodiments, a substrate 203 may be used which is neither transparent nor translucent. This may be for a so-called top-emitting

(Direction of radiation away from the substrate, as through the

Direction of the arrows 211 indicated) arrangement

optoelectronic devices 100 may be suitable.

In other embodiments, the substrate 203 may be translucent, transparent, partially translucent or

be made partially transparent. This may be suitable for an arrangement of optoelectronic components which top- and bottom-emitting (bottom-emitting:

Direction of radiation to the substrate to, or through the substrate therethrough).

In various embodiments, a plurality of organic light-emitting diodes may be arranged on or above the substrate 203, each organic light-emitting diode being arranged on or above a respective optoelectronic component.

Substrate area is arranged. In this case, the plurality of organic light-emitting diodes may be arranged on or above the first side 102 of the substrate 203, for example over a planarized surface of the first side 102 of the substrate.

The plurality of organic light emitting diodes may include functional layer stacks 217. The functional

Layer stack 217 can be understood as the region of the arrangement of optoelectronic components 100 in which an electric current for the operation of the organic

LED is flowing. In various embodiments For example, the functional layer stack 217 may be a first

Electrode 205, a second electrode 207 and a

have organic functional layer stack 216, as will be explained in more detail below.

Thus, in various embodiments, on or above the substrate 203 may be on or above an associated one

Optoelectronic device substrate area the first

Electrode 205 (for example in the form of a first

Electrode layer 205) may be applied. The first electrode 205 may be formed of or be made of an electrically conductive material, such as a metal or a conductive conductive oxide (TCO) or a layer stack of multiple layers of the same metal or different metals and / or TCO or different TCOs , Transparent conductive oxides are transparent, conductive substances, for example metal oxides, such as, for example, zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide, or indium tin oxide (ITO). In addition to binary metal oxygen compounds, such as ZnO, SnO 2, or Ιη 2θ 3 also include ternary metal oxygen compounds, such as AlZnO, Zn 2 Sn 0, CdSnOß, ZnSnOß, Mgln20, GalnOß, Ζη2ΐη2θ5 or

In Sn30i2 or mixtures of different transparent conductive oxides to the group of TCOs and can be used in various embodiments.

Furthermore, the TCOs do not necessarily correspond to one

stoichiometric composition and may also be p-doped or n-doped.

In various embodiments, the first

Electrode 205 comprises a metal; For example, Ag, Pt, Au, Mg, Al, Ba, In, Ag, Au, Mg, Ca, Sm or Li, and

Compounds, combinations or alloys of these substances. Three examples are AgMg, AgGe and a combination of Ge and Ag. In various embodiments, the first

Electrode 205 may be formed by a stack of layers of a combination of a layer of a metal on a layer of a TCO, or vice versa, or a layer stack of ITO and metal, for example ITO metal ITO. Examples are a silver layer deposited on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO

Multilayers. In various embodiments, the first

Electrode 205 one or more of the following substances

alternatively or additionally to the abovementioned substances: networks of metallic nanowires and particles, for example of Ag; Networks of carbon nanotubes; Graphene particles and layers; Networks of semiconducting nanowires.

Furthermore, the first electrode 205 may comprise electrically conductive polymers or transition metal oxides or electrically conductive transparent oxides.

In the case where the first electrode 205 comprises or is formed of a metal, the first electrode 205 may have, for example, a layer thickness of less than or equal to approximately 25 nm, for example a layer thickness of less than or equal to approximately 20 nm, for example one

Layer thickness of less than or equal to about 18 nm.

Furthermore, the first electrode 205 may have, for example, a layer thickness of greater than or equal to approximately 10 nm, for example a layer thickness of greater than or equal to approximately 15 nm. In various embodiments, the first electrode 205 may have a layer thickness in a range of approximately 10 nm to approximately 25 nm, for example, a layer thickness in a range of about 10 nm to about 18 nm, for example, a layer thickness in a range of about 15 nm to about 18 nm. Further, in the case where the first electrode 205 has or is formed of a conductive transparent oxide (TCO), the first electrode 205 may have a layer thickness in a range of about 50 nm to about 500 nm, for example, a layer thickness in a range from about 75 nm to about 250 nm, for example, a layer thickness in a range of

Furthermore, in the case where the first electrode 205 is made of, for example, a network of metallic nanowires, for example of Ag, those with conductive polymers

may be combined, a network of carbon nanotubes, which may be combined with conductive polymers, or formed of graphene layers and composites, the first electrode 205, for example a

Layer thickness in a range of about 1 nm to about 500 nm, for example, a layer thickness in a range of about 10 nm to about 400 nm,

For example, a layer thickness in a range of

about 40 nm to about 250 nm.

The first electrode 205 can be used as the anode, ie as

hole-injecting electrode may be formed or as

Cathode, that is as an electron-injecting electrode.

Additionally, the organic functional layer stack 216 may include one or more emitter layers 213, such as with fluorescent and / or phosphorescent emitters, disposed on or above the electrode 205, and one or more

Charge carrier transport layers 211, 215

(Electron conduction layers ETL, derived from the English term "electron transport layer" 215 or

Lochleitungsschichten HTL, derived from the English term "Hole Transport Layer" 211), and one or more Electron blocking layers 212 (EBL) and / or hole blocking layers 214 (HBL).

Examples of emitter materials which may be employed in the organic light emitting diode according to various emitter layer (s) 213 embodiments include organic or organometallic compounds such as derivatives of polyfluorene, polythiophene, and polyphenylene (eg, 2- or 2, 5-substituted poly-p -phenylenevinylene) as well

Metal complexes, for example iridium complexes such as blue phosphorescent FIrPic (bis (3,5-difluoro-2- (2-pyridyl) phenyl- (2-carboxypyridyl) iridium III), green

phosphorescing Ir (ppy) 3 (tris (2-phenylpyridine) iridium III), red phosphorescent Ru (dtb-bpy) 3 * 2 (PFg)

(Tris [4,4'-di-tert-butyl- (2,2 ') - bipyridine] ruthenium (III) complex) and blue fluorescent DPAVBi (4, 4-bis [4- (di-p-tolylamino) styryl ] biphenyl), green fluorescent TTPA (9, 10-bis [N, -di- (p-tolyl) -amino] anthracene) and red fluorescent DCM2 (4-dicyanomethylene) -2-methyl-6-ylolidolidyl-9- enyl-4H-pyran) as a non-polymeric emitter. Such non-polymeric emitters can be deposited by means of thermal evaporation, for example. Furthermore, it is possible to use polymer emitters, which can be used in particular by means of wet-chemical processes, such as

For example, spin coating, are separable.

The emitter materials may be suitably embedded in a matrix material. The emitter materials of the emitter layer (s) 213 of the organic light-emitting diode can be selected, for example, such that the organic light-emitting diode emits white light. The emitter layer (s) 213 may have multiple

have emitter materials emitting different colors (for example blue and yellow or blue, green and red),

Alternatively, the emitter layer (s) 213 may be constructed of multiple sublayers, such as a blue one fluorescent emitter layer 213 or blue

phosphorescent emitter layer, one green

phosphorescent emitter layer and a red

phosphorescent emitter layer. By mixing the different colors, the emission of light can result in a white color impression. Alternatively, too

be provided to arrange a converter material in the beam path of the primary emission generated by these layers, which at least partially absorbs the primary radiation and emits a secondary radiation of larger wavelength, so that from a (not yet white) primary radiation by the combination of primary and secondary radiation, a white color impression results. In various embodiments, the

Hole transport layer 211 applied to or over the electrode 205, for example, deposited, be, and the

Emitter layer 213 may be on or above the

Hole transport layer 211 applied, for example

isolated, be.

The organic light-emitting diode may generally have further organic functional layers which serve to provide the

Functionality and thus the efficiency of the organic

LED continues to improve.

In various embodiments, the organic functional layer stack 216 may have a layer thickness of at most about 1.5 μm, for example a layer thickness of at most about 1.2 μm, for example a layer thickness of at most about 1 μm, for example a layer thickness of at most about 800 nm, for example a layer thickness of at most approximately 500 nm, for example a layer thickness of at most approximately 400 nm, for example a layer thickness of approximately approximately 300 nm. For example, in various embodiments, the organic functional layer stack 216 may be a stack of multiple directly stacked OLEDs

For example, each OLED may have a layer thickness of at most approximately 1.5 μm, for example a layer thickness of at most approximately 1.2 μm, for example a layer thickness of at most approximately 1 μm, for example a layer thickness of approximately approximately 800 nm, for example a layer thickness of a maximum of approximately 500 nm, for example a layer thickness of at most approximately 400 nm, for example a layer thickness of approximately approximately 300 nm.

For example, in various embodiments, the organic functional layer stack 216 may comprise a stack of three or four directly stacked OLEDs, in which case, for example, the organic functional layer stack may have a layer thickness of at most about 6 ym. In various embodiments, the second

Electrode 207 comprising the transparent substances from the group of substances, which may include the first electrode 205, or be formed therefrom. The can

Layer thicknesses are in the areas which are mentioned above as suitable for the first electrode 205 in view of the substance from which it is formed.

In various embodiments, the arrangement of optoelectronic components 100 can be at least one

Drive circuit 153, which on a

Optoelectronic component substrate region is arranged and is arranged for driving at least one organic light-emitting diode of the plurality of organic light-emitting diodes. For electrical contacting, on or above the surface of the second side 151 of the substrate 203

Conductor tracks 152 may be arranged. The conductor tracks 152 are patterned to be arranged on or above the second side 151 of the substrate 203

Control circuit 153 to supply power and, if necessary, interconnect them.

The drive circuits 153 are soldered to the tracks 152, for example. For equipping the second side 151 of the substrate 203 with the drive circuits 153, in particular a reflow soldering process can be used.

In particular, the loading of the second side 151 of the substrate 203 with the drive circuits 153 in the

Production of the arrangement of optoelectronic components 100 takes place before the functional layer stack 217 is applied on or above the opposite first side 102 of the substrate 203. This has the advantage that the

functional layer stack 217 is not exposed to the high temperatures of the soldering process.

In various embodiments, the

electrical connections 154 for connecting the arrangement of optoelectronic components 100 to an external one

Voltage source on the second side 151 of the substrate 203 may be arranged. In other embodiments, they may be disposed on the first side 102 of the substrate 203.

In various embodiments, to connect the drive circuits 153 to the electrode layers 205, 207 of the functional layer stack 217, and in the case of electrical terminals 154 formed on the second side also to these, vias 204 may be formed in the substrate 203, which may be electrically conductive

Establish connection between the second side 151 and the first side 102. The plated-through holes 204 may, for example, be through-holes which extend from the second side 151 to the first side 102 and are filled with an electrically conductive material, in particular a metal. By means of the vias 204 may an electrically conductive connection between the interconnects 152 on the second side 151 and the

Electrode layers 205, 207 of the functional

Layer stack 217 be realized. In various embodiments, the drive circuits 153 may include, for example, constant current sources. Through the via 204, the functional layer stack 217 can be supplied, for example, with power from a constant current source arranged on the second side 151. To increase the current carrying capacity or to improve the current distribution of the electrically conductive connection,

for example, to achieve a homogeneous

Flächenbestromung, the electrode layers 205, 207 may each be connected to a plurality of plated-through holes 204.

In various embodiments, the

Conductor tracks 152, for example, be arranged so that a plurality of on the first side 102 of the substrate 203 of the

Arrangement of optoelectronic components 100 arranged organic light-emitting diodes structured both in series and in parallel can be electrically coupled. The

Constant current source can with the help of electrical

Standard components be realized. In various embodiments, the

Control circuit 153 operate individual organic light emitting diodes.

In other embodiments, the drive circuit 153 may drive a plurality of organic light emitting diodes, which

for example, can be arranged on different optoelectronic component substrate areas. In this case, the drive circuit 153 on different

Optoelectronic device substrate regions arranged organic light-emitting diodes by means of tracks 152 which pass through an unseparated desired separation structure 101 therethrough. In other embodiments, the drive circuit 153 may comprise organic light emitting diodes disposed on different optoelectronic device substrate regions

drive. The arrangement became optoelectronic

Components 100 along one or more desired separation structures 101 separated and arranged on different gentrennte optoelectronic component substrate regions organic light-emitting diodes by means of

electrical connections 154 electrically connected.

In this case, 101 separate individual parts of the array of optoelectronic devices may be arranged in a different than the original arrangement along the target separation structures.

In various exemplary embodiments, the parts of the arrangement of optoelectronic components can be supplemented by parts of another arrangement of optoelectronic components to form a common arrangement of optoelectronic components.

In various exemplary embodiments, the organic light-emitting diodes of the arrangement of optoelectronic components can be electrically coupled, for example, in series.

In various exemplary embodiments, the organic light-emitting diodes of the arrangement of optoelectronic components can, for example, be electrically coupled in parallel. In the case of parallel coupling of the organic light-emitting diodes, the luminance of the individual organic light-emitting diodes can be controlled or regulated by further control circuits, which can be arranged on or above the second side 151 of the substrate 203. In various embodiments, the organic functional layer stack 216 may include an encapsulant which is particularly useful for protecting the organic functional layer Layer stack 216 against environmental influences, especially against moisture and oxidation, is used. The encapsulation may be embodied as an encapsulation layer 208. Furthermore, the electrode layers 205, 207, the substrate 203, the interconnects 152 and / or the electronic components 153 may be provided with an encapsulation layer 208, wherein the encapsulation layer 208 further protects the

Electrode layers 205, 207, the printed conductors 152 and the electronic components 153 from environmental influences, especially against moisture and oxidation, can serve.

The encapsulant layer 208 may be arranged to be conclusive such that it seals the organic functional layer stack 216, for example, by conclusive contact with the organic functional layer stack 216

Surface of the first side 102 of the substrate 203, opposite the environment.

The encapsulation layer 208 may be one or more

have transparent oxide layers, in particular

Metal oxide layers, such as alumina,

Zinc oxide, zirconium oxide, titanium oxide, hafnium oxide or

Tantalum oxide. Furthermore, silicon oxide layers or silicon nitride layers and nanolaminates are particularly suitable. The encapsulation layer 208 may be made up of multiple layers

be composed, with the individual layers

each advantageously have a thickness between an atomic layer and about 1 ym. For example, the encapsulant layer 208 may have a total thickness of less than 10 ym, less than 1 ym, or even less than 100 nm.

The one or more layers of the encapsulant layer 208 may be deposited by atomic layer deposition (ALD).

Alternatively or in addition to thin layers produced by ALD, the encapsulation layer 208 can at least one or a plurality of further layers, thus in particular barrier layers and / or passivation layers,

have by thermal vapor deposition or by means of a plasma-assisted process, such as sputtering or

plasma-enhanced chemical vapor deposition (PECVD), suitable materials for this may be the aforementioned materials as well as silicon nitride, silicon oxide,

Silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide, aluminum oxide and mixtures and

Alloys of the materials mentioned. For example, the one or more further layers may each have a thickness in a range of about 1 nm to about 10 μm, for example, a thickness in a range of about 1 nm to about 1 μm, for example, a thickness in a range of about 1 nm to about 400 nm.

In various embodiments, a

Protective layer 210 for the protection of the functional

Layer stack 217 from mechanical damage on the side facing away from the substrate 203 side of the functional

Layer stack 217 may be applied. The protective layer 210 protects the functional layer stack 217 in particular from scratching. The protective layer 210 may in particular be a glass layer, a plastic layer, a silicone layer, a laminated film or a

Lacquer layer act. The protective layer 210 may

For example, be laminated or glued to the side facing away from the substrate 203 side of the previously applied encapsulation layer 208. For this purpose, between the protective layer 210 and the underlying layers a

Connecting layer 619 (see Figure 6b), in particular an adhesive layer may be arranged.

In various embodiments, an outcoupling layer 209 may be provided on or above the encapsulation layer 208 be arranged, which serves to couple out light from the substrate in radiated light. Such

The outcoupling layer 209 can be, for example, a film with scattering particles or a surface structuring,

for example, microlenses.

In various embodiments, at the

Arrangement of optoelectronic components 100 one or more desired separation structures 101 may be provided. It is

provided that the arrangement of optoelectronic components 100 along one or more of the desired separation structures 101 can be separated. In other words, the arrangement of optoelectronic components 100 can take place in the longitudinal direction of the desired separating structures 101 and extending within the desired separating structures 101

Separation operations are severed so that at least two smaller arrangements of optoelectronic devices

present, each of the smaller arrangements

Optoelectronic components having at least one organic light emitting diode.

The desired separating structures 101 can be arranged on the arrangement of optoelectronic components 100 in such a way that, after the separation, each organic light-emitting diode can be operated by the plurality of organic light-emittingodes by means of the conductor tracks 152 or by means of the electrical connections 154.

In various embodiments, in the desired separation structures 101 only such traces of the

Conductor tracks 152 may be arranged, which serve for an electrical connection of the organic light-emitting diodes.

In various embodiments, the arrangement

Optoelectronic devices 100 have a mark that marks the course of the target separation structure 101. In other words, the arrangement of optoelectronic components 100 may be marked such that the course of the desired separation structure 101 is recognizable or the recognizability of the course of the desired separation structure 101 is improved. For example, the desired separating structure 101 may be marked by means of an imprint on the first side and / or by means of an imprint on the second side.

3 a and 3 b show a top view (FIG. 3 a) and a bottom view (FIG. 3 b) of an arrangement of optoelectronic components 300, in particular an arrangement of organic light emitting diodes in combination with inorganic light emitting diodes according to various embodiments of the present invention.

In various embodiments, on one

Furthermore, one or more inorganic light-emitting diodes 318 may be arranged on or above the first side 102 of the substrate 203.

In various embodiments, the

inorganic light-emitting diodes 318 in edge regions of

be arranged organic light-emitting diodes. In other

Embodiments, the inorganic light emitting diodes 318 may be disposed in a region of the first side 102, which is surrounded by an organic light emitting diode. In other embodiments, the inorganic light emitting diodes 318 on the first side 102 may be interposed between the organic ones

Be arranged light emitting diodes. The different

Arrangement possibilities can in further

Be combined embodiments.

The number of organic light emitting diodes may correspond to the number of inorganic light emitting diodes. In other

Embodiments, the numbers may be different. The requirement for the arrangement of the inorganic light-emitting diodes 318 is that they are to be arranged such that they are opto-electronic after the arrangement has been severed

Components 300 along the desired separation structure 101 still like intended to be used, that is, that

if necessary, such interconnects are severed, which serve the connection of adjacent organic light-emitting diodes. In various embodiments, the

inorganic light emitting diodes 318 are integrated on the substrate 203 in back-end processes.

In various embodiments, the

inorganic light emitting diodes 318 by means of separate

Drive circuits 355 are controlled. In this case, the separate drive circuits 355 may be arranged on the second side 151 of the substrate 203. In other

Embodiments, the inorganic light emitting diodes 318 may be driven together with the organic light-emitting diodes. For example, they may be electrically coupled in series or in parallel.

In various embodiments, can be achieved by integration of further simple logic circuits

For example, modulations of the luminance along the arrangement of optoelectronic components 300 (in this case an arrangement 300, which organic light-emitting diodes and

inorganic light emitting diodes combined) realize.

By integrating inorganic light-emitting diodes 318 into the arrangement of optoelectronic components 300, glare-free backlighting (diffuse or quasi-indirect) can be combined by the organic light emitting diode (s) with a directed light of the inorganic light emitting diode (s) 318 for direct illumination (eg, a work surface) become.

4 shows a plan view of an arrangement

optoelectronic components 300, in particular a

Arrangement of organic light-emitting diodes in combination with inorganic light emitting diodes 318 according to various

Embodiments of the present invention.

In various embodiments, the organic light-emitting diodes on the arrangement optoelectronic

Components 300 may be arranged so that they extend in the direction parallel to the first side 102 so that in two mutually perpendicular directions organic light emitting diodes are arranged side by side. In different

According to exemplary embodiments, the desired separation structures 101 can run between the organic functional layer stacks 216 of the organic light-emitting diodes 101 such that smaller ones are formed after the separation of the desired separation structures 101

Arrange arrangements of optoelectronic components, on which several adjacent organic light-emitting diodes extend only along one direction, along the direction perpendicular thereto, the smaller arrangement of optoelectronic components only an organic light-emitting diode. In other words, by cutting through the arrangement of optoelectronic components along the desired separating structures 101, organic light-emitting diode bands are produced. The individual light-emitting diode bands can, for example, with adjoining or adjacent end sides

be arranged and by electrically connecting the individual light-emitting diode bands by means of the electrical

Connections 154 are combined to longer light emitting diode bands.

5 shows a plan view of an arrangement

optoelectronic components 300, in particular a

Arrangement of organic light emitting diodes in combination with inorganic light emitting diodes 318 according to various

Embodiments of the present invention. The exemplary embodiments illustrated in FIG. 5 essentially correspond to those shown in FIG Embodiments, with the difference that the target separation structures 101 are arranged differently.

In various embodiments, the desired separation structures 101 may extend between the organic functional layer stacks 216 such that after the

Cutting the desired separation structures 101 smaller

Arrangements of optoelectronic components result on which extend a plurality of adjacent organic light-emitting diodes along the two directions explained above. In other words, by cutting through the arrangement of optoelectronic components 300 along the desired separating structures 101, two-dimensional arrangements of

organic light emitting diodes, so compared to the original arrangement of optoelectronic devices 300 reduced two-dimensional arrangements of organic light-emitting diodes. These smaller arrangements of optoelectronic components can, for example, along their longitudinal or their

End faces are arranged adjacent and through

electrically connecting the smaller assemblies

optoelectronic components by means of the electrical

Connections 154 to another, especially also

irregular, shaped arrangement optoelectronic

Components are combined.

In various embodiments, individual

Arrangements of optoelectronic components or smaller arrangements of optoelectronic components to surfaces of a certain size, for example to luminous surfaces of a certain size, for example to "OLED wallpapers",

be combined.

In various exemplary embodiments, the organic light-emitting diodes and the desired isolating structures may be curved on the arrangement of optoelectronic components (not illustrated). 6a and 6b show cross-sectional views of

Arrangements of optoelectronic devices 100 according to

various embodiments of the present

Invention.

In various embodiments, the

Encapsulation layer 208, as shown in Figure 6a encapsulate the arrangement of optoelectronic devices 100 and enclose. In other words, encapsulation layer 208 may be arranged to accommodate the arrangement

optoelectronic devices 100 completely covered, with the exception of locations, which for a performance

electrical contacts 154 are exposed. In various embodiments, the desired separation structure 101 is in a next to the organic

functional layer stack 216 in which the encapsulation layer 208 on the first side 102 of the substrate 203 is in contact with the substrate 203. In other embodiments, the target isolation structure 101 may be disposed in a region in which the encapsulation layer 208 is in contact with the topmost layer disposed on the plurality of optoelectronic device substrate regions. In this case, the uppermost layer arranged on the plurality of optoelectronic component substrate regions may be used

For example, it may be a planarization layer or an encapsulation layer 208. By this arrangement, the target separation structure 101 can also after the separation of the

Arrangement of optoelectronic components along the desired separation structure 101 moisture does not penetrate into the organic functional layer stack 216.

An opening of the encapsulation layer 208 for a

electrical contacting of the electrical connections 154 can take place, for example, by means of a laser, which encapsulates the encapsulation layer 208 only in the region of the electrical connection Ports 154 opens, so that no path for penetrating moisture can arise. Alternatively, when applying the encapsulation layer 208, areas for the electrical

Terminals 154 are kept free.

In various exemplary embodiments, as shown in FIG. 6b, a protective layer 656 for protection against mechanical damage may be arranged on the side of the control circuits 153 facing away from the substrate 203. The

Protective layer 656 may be applied in particular to those previously

applied encapsulation layer 208, which serves in particular for protection against moisture and oxidation, be applied. The protective layer 656 may in particular a

Be silicone layer. Alternatively, others can

Plastics or a lacquer layer may be provided as a protective layer 656.

In various exemplary embodiments, furthermore, a protective layer 210 may be arranged on or above the encapsulation layer 208, as was explained in connection with FIG.

FIGS. 7a and 7b show cross-sectional views of FIG

Arrangements of optoelectronic components 400 according to

various embodiments of the present

Invention.

In various embodiments, the

Encapsulation layer 208 between the surface of the first side 102 of the substrate 203 and the functional

Layer stack 217 may be arranged. A

Encapsulation layer 208 between the substrate 203 and the functional layer stack 217 may prevent ingress of water through the substrate 203. For one

electrical contacting of the electrodes 205, 207 of the functional layer stack 217 with the

Vias 204 may openings of the Encapsulation layer 208 may be provided. An opening of the encapsulation layer 208 for an electrical contacting of the functional layer stack 217 can take place, for example, by means of a laser, which comprises the

Encapsulation layer 208 only in the area of

Through-holes 204 opens, so that no path for penetrating moisture can arise. Alternatively, when the encapsulation layer 208 is applied, there may be areas for electrical contact between the electrodes

Vias 204 and the electrodes 205, 207 of the functional layer stack are kept free.

In various embodiments, the encapsulation may be designed so that on or above the

Encapsulation layer 208 and on or above the functional layer stack 217, a further encapsulation layer 720 may be arranged. In this case, in the desired separating structures 101, the encapsulation layers 208 and 720 may be in contact with one another. The two can

Encapsulation layers come to rest on one another so that no moisture can penetrate into the organic light-emitting diode or into the organic functional layer stacks 216 even after the separation along the desired separation structures 101.

In various embodiments, the

Encapsulation layer 208 and / or the others

Encapsulation layer 720 may be formed so that it encapsulates the entire (up to this processing step) arrangement of optoelectronic devices.

In various exemplary embodiments, as shown in FIG. 7b, a protective layer 656 for protection against mechanical damage may be arranged on the side of the control circuits 153 facing away from the substrate 203. The

Protective layer 656 may in particular be a silicone layer. Alternatively, other plastics or a

Paint layer may be provided as a protective layer 656.

In various exemplary embodiments, furthermore, a protective layer 210 may be arranged on or above the further encapsulation layer 720, as has been explained in connection with FIG.

FIGS. 8a and 8b show cross-sectional views of FIG

Arrangements of optoelectronic components 300, in particular of organic light emitting diode arrangements, in combination with inorganic light emitting diodes 318 according to various

Embodiments of the present invention. As explained in connection with FIG. 3, in

various exemplary embodiments on an arrangement of optoelectronic components 300, in particular on an organic light emitting diode array, one or more LEDs 318 on or above the first side 102 of the substrate 203

be arranged.

In various embodiments, drive circuits 355 for operating the LEDs may be arranged on the second side 151 of the substrate 203.

In different in Fig. 8a shown

Embodiments, the mounting of the inorganic light emitting diode 318 and the drive circuit 355 may be carried out prior to encapsulation with the encapsulation layer 208 or before encapsulation with the encapsulation layer 720. In this case, the deposition of the encapsulation layer 208 or 720 of the OLED can be used at the same time for encapsulating the LEDs 318. This allows the LEDs by means of

Encapsulation layer 208 and 720 are protected from environmental influences. If the encapsulation layer 208 or 720 applied by methods such as ALD, both volume emitter LEDs, as well as so-called thin film Chips with top contact and two backs

Contacts can be encapsulated.

In other exemplary embodiments illustrated in FIG. 8 b, the assembly of the LED 318 after the deposition of the

Encapsulation layer 208 take place. It can to

electrical contacting of the LED 318 with the

Vias 204 contact areas are exposed by laser. In other embodiments, the encapsulation layer can be applied so that in the

Contact areas no encapsulation layer 208 is applied.

In various exemplary embodiments, as shown in FIG. 8b, a protective layer 656 for protection against mechanical damage may be arranged on the side of the drive circuits 153, 355 facing away from the substrate 203. The protective layer 656 can be applied in particular to the previously

Be silicone layer. Alternatively, others can

Plastics or a lacquer layer may be provided as a protective layer 656.

Fig. 9 shows cross-sectional views of arrangements

optoelectronic components 500, in particular of

organic light emitting diode arrays, in combination with LEDs 318 according to various embodiments of the

present invention. In various exemplary embodiments, the arrangements illustrated in FIG. 9 differ optoelectronically

Components 500 of the illustrated in Figure 8 arrangements of optoelectronic devices 300 in that the LED or the LEDs can not be arranged on the first side 102, but on the second side 151.

In various embodiments, the LEDs may be disposed on both the first side 102 and the second side 151.

10a shows a cross-sectional view along the line I-I of the arrangement of optoelectronic components from FIG. 4 according to various embodiments of the present invention

Invention with a perforation, and Fig.10b shows a perspective view of the perforation in the area II-II of Figure 4 according to various embodiments of the

present invention. In some illustrations of Figs. 10, 11, 12 and 13 are for the sake of simplicity and a better one

Understanding the properties of the perforation parts of the

Arrangement of optoelectronic components omitted,

For example, the drive circuits, the organic light-emitting diodes, etc. It should be understood that the arrangements shown in the aforementioned figures

Optoelectronic components nevertheless have at least the features of at least one main claim. In various exemplary embodiments, a part of a desired separating structure 101 may be formed by a perforation or may be a desired separating structure 101 of an arrangement

optoelectronic components at least partially a

Have perforation.

In various exemplary embodiments, the arrangement of optoelectronic components from FIG. 10 a has a substrate 203 with vias 204 on, as well as an encapsulation 208, a pair of electrodes 205, 207, an organic functional layer stack 216 and another

Encapsulation 720 on the first side 102 of the arrangement of optoelectronic components and interconnects 152,

Control circuits 153 and electrical connections 154 on a second side 151. The along at least a portion of the desired separation structure 101 of the array of optoelectronic devices arranged perforation has at least one region 1022, in which the arrangement

Optoelectronic components is completely severed in the direction perpendicular to the first and second sides. The completely severed regions 1022 are interrupted by webs 1021, which the desired separation structure 101

adjacent areas of the arrangement optoelectronic

Connect components together. The webs 1021 can hold the arrangement of optoelectronic components in the form.

In other words, the webs can prevent the arrangement of optoelectronic components on the desired separating structures 101 in smaller arrangements

optoelectronic components is falling apart.

In various exemplary embodiments, the webs 1021 may be formed from at least one layer and / or at least one part of a layer of the arrangement of optoelectronic components. For example, the webs 1021 of FIGS. 10a and 10b are formed by parts of the substrate 203 and the further encapsulation layer 720. The perforation can be an arrangement

Optoelectronic components easily in smaller arrangements of optoelectronic devices or in individual

isolate optoelectronic components or light-emitting diodes. In the perspective view of FIG. 10b, the first side 102 of the arrangement of optoelectronic components facing the viewer, the second side 151 away from the viewer, the not shown part of the arrangement of optoelectronic devices would extend upwards or downwards.

Fig. IIa shows a plan view of an arrangement

Optoelectronic devices according to various

Embodiments of the present invention, Fig. IIb shows a cross section through the arrangement

optoelectronic components along the in Fig. IIa

11C and 11C show two perspective views of two different possible embodiments of a perforation, which is formed in the area IV-IV shown in Fig. IIa.

In various embodiments, the perforation can be designed so that at each point of the perforation adjacent areas of the array optoelectronic

Components are connected together. In other words, in various embodiments in the

Perforation no areas are present in which the

Arrangement of optoelectronic components completely in

Direction perpendicular to the first and to the second side along the desired separation structure is severed. It can the

Perforation should be carried out so that the perforation

represents a mechanically weakened region relative to a non-perforated region of the arrangement of optoelectronic components. The mechanically weakened areas may be interrupted by webs 1021 or to the

webs 121 may be adjacent to the mechanically weakened area, and adjacent areas of the arrangement of optoelectronic components adjacent to the desired separating structure 101 may be additionally adjoined

connect with each other.

The exemplary arrangement of optoelectronic components from Fig. IIa has, as in Fig. IIb in a

Cross-sectional view taken along a line III-III of Fig. IIa, a carrier 1123, on which by means of an adhesive 1122, the substrate 203 of the arrangement optoelectronic components is attached. In this case, the perforation is embodied such that along the desired separating structure the layers arranged on the first side 102 of the arrangement of optoelectronic components within the desired separating structure 101, for example an encapsulation 208 or 720 or a protective layer 210, the substrate 203 and the adhesive layer 1122 are severed or partially severed, whereas the carrier 1123 in the target separation structure 101 is not severed.

In Fig.11c and Fig.lld are perspective views of

Perforation in the desired separation structure 101 along the line IV-IV of Fig. IIa shown according to various embodiments. Areas where the arrangement

optoelectronic components in the desired separation structure 101 is severed except for the continuously obtained carrier 1123, alternate with areas in which webs 1021 connect the perforation adjacent areas of the array of optoelectronic devices.

In FIG. 11c, the webs 1023 are formed from the adhesive and parts of the substrate, in FIG. 11d the webs are formed only from the adhesive. Fig. 12a shows a plan view of an arrangement

Optoelectronic devices according to various

Embodiments of the present invention. Fig. 12b shows a cross-sectional view of the arrangement

optoelectronic components of Figure 12a along a line V-V of Figure 12a. In contrast to FIG. 10 a, the arrangement of optoelectronic components above the substrate 204 has a planarization layer or an electrical

Insulating layer 1225 on. 12c, Fig. 12d, Fig. 12e, Fig. 12f and Fig. 12g show

Cross-sectional views along the line VI-VI of Figure 12a, which differ in each case therein, as the perforation along the target separation structure 101 is executed. Common to the embodiments that the perforation is designed so that in particular the organic functional layer stack 216 is encapsulated and also in a

Cutting the desired separation structure 101 is not exposed by severing the perforation, so that the organic functional layer stack 216 remains protected from atmospheric moisture and harmful environmental influences. For generating the various embodiments of

Perforations are used various methods, which will be referred to in connection with Fig.15.

The arrangement of optoelectronic components shown in FIG. 12c has a planarization layer 1225 deposited over a substrate 203. The perforation was after deposition of the planarization, for example by means of laser structuring, punching, by means of a

Perforation knife or a circular knife with

Perforating blade o.a. generated. The order

Optoelectronic components further comprises an encapsulation layer or an encapsulation layer 208 between the

Planarisierungsschicht and the electrode 205, an organic functional layer stack 216, an electrode 207, a further encapsulation or encapsulation layer 720 and a protective layer, for example a

Scratch protective layer, 210. These further layers were sequentially deposited after the production of the perforation, for example, in a structured manner, for example after one

Method according to Fig.l5e. Along the perforation

exposed edges of the optoelectronic array

Components have the scratch-resistant layer 210, the

Encapsulation 720 and the substrate 203 on. The arrangement shown in Fig.l2d optoelectronic components has a perforation, which by means of

Laser structuring, punching, by means of a Perforation knife or a circular knife with

Perforating blade o.a. was generated in the substrate 203. The arrangement of optoelectronic components further comprises an encapsulation layer or encapsulation layer 208 between the planarization layer arranged above the substrate and the electrode 205, an organic functional one

Layer stack 216, one electrode 207, another

Encapsulation or encapsulation layer 720 and a

Protective layer, for example a scratch-resistant layer, 210. These further layers were after the production of the

Perforation deposited in succession, the

Planarisierungsschicht 1225, the electrodes 205, 207, the organic functional layer stack 216 and the

Protective layer 210, for example, were deposited structured and the encapsulation 208, 720 was deposited over the entire surface, so that even within the perforation

Encapsulation 208, 720 is present, for example, according to a method according to Fig.l5e. Along the perforation

exposed edges of the optoelectronic array

Components have the scratch-resistant layer 210 and the

Encapsulation 720 on. A severing of the arrangement

Optoelectronic components along the desired separation structure 101 would further expose the encapsulation 208 and the substrate 203. For making the arrangement

optoelectronic components of Fig. 12d would be

For example, a method according to Fig.l5d or Fig.l5e suitable.

The arrangement of optoelectronic components shown in FIG. 12e differs from that in FIG. 12d

shown arrangement of optoelectronic devices essentially in that along the perforation

exposed edges of the optoelectronic array

Components have the scratch protection layer 210, the encapsulation 720, the encapsulation 208 and the substrate 203. This can be achieved, for example, by a

Method according to Fig.l5d the encapsulation 208, 720 not be deposited over the entire surface, but structured, or by the perforation after the full-surface deposition of the encapsulation 208, 720 is performed. The arrangement shown in Fig.l2f optoelectronic devices differs from that in Fig.l2e

shown arrangement of optoelectronic components essentially in that the perforation is not after a full-surface deposition of the encapsulation 208, 720th

can be performed, but a structured

Depositing at least the encapsulant 720 and the

Protective layer 210 is required.

The arrangement of optoelectronic components shown in FIG. 12g differs from that in FIG

exposed edges of the optoelectronic array

Components have the scratch-resistant layer 210, the encapsulation 720, 208, the planarization 1225 and the substrate 203. To create a perforation according to Fig.12g would be

For example, a method according to Fig. 15c is suitable, wherein both the planarization layer 1225 and the

Encapsulation 208 are deposited over the entire surface and the electrodes 205, 207, the organic functional

Layer stack 216, the encapsulation 720 and the

Protective layer 210 are deposited in a structured manner and lastly the perforation is carried out. Fig. 13a shows a plan view of an arrangement

Optoelectronic devices according to various

Embodiments of the present invention, and Fig. 13b shows a cross-sectional view along the line VII-VII of Fig. 13a.

The arrangement of optoelectronic components shown in FIG. 13 b has a layer deposited over a substrate 203 Planarization layer 1225. The perforation was before or after the deposition of the planarization, for example by means of laser structuring, punching, by means of a

Perforation knife or a circular knife with

Perforating blade o.a. generated. The order

Scratch protective layer, 210. The encapsulation 208 was after the creation of the perforation and after the deposition of the

Planarisierungsschicht 1225 deposited over the entire surface, the other layers were after deposition of the

Encapsulation 208, for example, structured sequentially deposited, for example, according to a method according to

Fig.l5e or Fig.l5d. Along the perforation

exposed edges of the optoelectronic array

Components have the scratch-resistant layer 210, the

Encapsulation 720, the electrodes 205, 207 and the

Encapsulation 208 on. A severing of the arrangement

Optoelectronic devices along the desired separation structure 101 by means of the perforation would further edges of the

Expose substrate 203.

FIG. 14 shows a flowchart which represents a method for producing an arrangement of optoelectronic components, in particular an arrangement of organic light emitting diodes, according to various exemplary embodiments.

In various embodiments, a plurality of organic light emitting diodes may be disposed on a substrate in step S1000, wherein each organic light emitting diode is disposed on a respective optoelectronic component substrate region. In step S1001, at least one driving circuit for driving at least one organic light emitting diode may be provided

Plurality of organic light emitting diodes on one

Optoelectronic component substrate area can be arranged.

In step S1002, at least one target separation structure may be formed in the substrate. In various exemplary embodiments, the application of the functional layer stack to the first side of the substrate can advantageously take place only after the second side has been equipped with the at least one drive circuit. This has the advantage that the at least one

Drive circuit can be mounted by means of a soldering on one of the tracks, in which comparatively high temperatures can be used. In particular, the one or more drive circuits may be mounted on the second side of the substrate by reflow soldering (also referred to as reflow soldering). By equipping the second side with the at least one drive circuit prior to the application of the functional layer stack, damage to the functional layer stack is prevented by high temperatures during the soldering process.

In a further step (not illustrated), an organic functional layer stack of the organic light-emitting diode can be provided with an encapsulation.

In various embodiments, in particular, the substrate, the functional layer stack and the at least one drive circuit may be provided simultaneously with the encapsulation layer. In this way, the substrate, the functional layer stack and the

Control circuit from environmental influences, in particular against the ingress of moisture, to be protected. The The encapsulation layer can be applied, for example, by means of atomic layer deposition or by means of plasma-assisted chemical vapor deposition. In a further step (not shown), at least one desired separation structure can be marked, along which the arrangement of optoelectronic components is separable such that at least one organic light-emitting diode of the plurality of organic light-emitting diodes and the drive circuit

remain together on the substrate.

In various embodiments, a further encapsulation layer can also be applied over the encapsulation layer. In this case, the application of the further encapsulation layer can take place after the application of the organic functional layer stack, so that the

organic functional layer stack between the

Encapsulation layer and the further encapsulation layer is encapsulated.

In various embodiments, furthermore, at least one LED can be attached. In this case, the LEDs on a first side of the substrate, on which the organic light-emitting diodes are arranged, or on a

opposite second side of the substrate, or be mounted on both sides. The attachment of the LEDs may be before or after the application of the encapsulation layer

respectively . Further advantageous embodiments of the method according to FIG. 14 result from the description of the arrangement of optoelectronic components and vice versa.

FIGS. 15a, 15b, 15c, 15d, 15e, 15f and 15f

Fig. 15g show flowcharts for generating a

Perforation area in a target separation structure 101 of an array of optoelectronic devices according to various Embodiments of the present invention. Examples of methods according to FIGS. 15c, 15d and 15e have already been explained in connection with FIGS. 12 and 13. In a method for creating a perforation area in a desired separation structure 101 of an arrangement

Optoelectronic devices according to various

Embodiments of FIG. 15a, an encapsulation 208 is initially deposited over a substrate 203 (S2001), followed by perforation by means of laser structuring, punching, by means of a perforation knife or a perforation

Round knife with perforation blade or similar generates (S2002), then the organic light emitting diode deposited (S2003). Subsequently, the deposition of a further encapsulation 720 takes place

(S2004), depositing a protective layer 210 (S2005), and re-cutting along the perforation (S2006).

In a method for creating a perforation area in a desired separation structure 101 of an arrangement

Optoelectronic devices according to various

15B, a planarization layer 1225 is deposited in a structured manner over a substrate 203 (S2011), then the organic light-emitting diode is deposited (S2012), then an encapsulation 720 is deposited (S2013), then a protective layer 210 is deposited (S2014) and finally a perforation by laser structuring, punching, by means of a perforation knife or a

Round knife with perforation blade or similar generated (S2015). In a method for creating a perforation area in a desired separation structure 101 of an arrangement

Optoelectronic devices according to various

In accordance with exemplary embodiments of FIG. 15 f, first of all a planarization layer 1225 is deposited over a substrate 203 (S2051), followed by an encapsulation 208

(52052), then deposited an organic light emitting diode

(52053). Subsequently, another encapsulation 720 deposited (S2054), then a protective layer 210 (S2055). Then, the substrate 203 of the array of optoelectronic devices is laminated by means of an adhesive 1122 on a support 1123 and finally a perforation by means of laser structuring, punching, by means of a

Perforation knife or a circular knife with

Perforation blade or similar generated (S2015).

Optoelectronic devices according to various

Embodiments of Fig. 15g combines one of the

Method according to FIGS. 15a to 15f with a lamination of the substrate 203 of the arrangement of optoelectronic components on a support 1122 by means of an adhesive 1123 (S2061).

Further advantageous embodiments of the method according to FIGS. 15a to 15g result from the description of the arrangement of optoelectronic components and vice versa.

Claims

claims

1. Arrangement of optoelectronic components, comprising:

A substrate;

A plurality of optoelectronic components arranged on the substrate, wherein each optoelectronic component is arranged on a respective optoelectronic component substrate region, and wherein at least one

optoelectronic component of the plurality of optoelectronic components having at least one organic functional layer stack and an encapsulation of the organic functional layer stack;

At least one drive circuit which is arranged on an optoelectronic component substrate region and is set up to drive at least one optoelectronic component of the plurality of optoelectronic components; and

• wherein the substrate has at least one desired separation structure.

Arrangement of optoelectronic components according to claim 1,

wherein the at least one desired separation structure is arranged in the substrate such that, when the substrate is separated along the desired separation structure, at least one optoelectronic component of the plurality of optoelectronic components and the

Drive circuit together on the substrate

remain.

3. Arrangement of optoelectronic components according to claim 1 or 2, Wherein at least one optoelectronic component of the plurality of optoelectronic components is arranged on a first side of the substrate;

• wherein the drive circuit on a second

Side of the substrate, which is opposite to the first side of the substrate;

• wherein the substrate at least one

Has through-hole, by means of which the at least one optoelectronic component is electrically conductively connected to the drive circuit.

4. Arrangement of optoelectronic components according to one of claims 1 to 3,

set up as transparent or translucent

Arrangement of optoelectronic components.

5. Arrangement of optoelectronic components according to claim 4,

wherein the desired separation structure extends adjacent to the organic functional layer stack in the encapsulant.

Arrangement of optoelectronic components according to one of claims 1 to 5,

wherein the plurality of optoelectronic components has at least three optoelectronic components which are electrically coupled to one another.

Arrangement of optoelectronic components according to Anspru 6,

wherein at least three optoelectronic components are arranged along one direction.

Arrangement of optoelectronic components according to claim wherein at least three optoelectronic components are arranged along two directions.

Arrangement of optoelectronic components according to one of claims 1 to 8, further comprising:

a mark that marks the course of the desired separation structure.

Arrangement of optoelectronic components according to claim 9,

where the mark is printed.

Arrangement of optoelectronic components according to one of Claims 1 to 10,

wherein at least a part of the desired separation structure is formed by a perforation.

Arrangement of optoelectronic components according to one of claims 1 to 11,

wherein the drive circuit comprises a constant current source.

13. Arrangement of optoelectronic components according to one of claims 1 to 12, further comprising

at least one inorganic light emitting diode.

Arrangement of optoelectronic components according to claim 13,

wherein the at least one inorganic light-emitting diode is arranged on the first side of the substrate.

Arrangement of optoelectronic components according to one of claims 1 to 14,

wherein the plurality of optoelectronic components comprises at least three optoelectronic components, which are electrically coupled together in series.

16. Arrangement of optoelectronic components according to one of claims 1 to 14,

wherein the plurality of optoelectronic components has at least three optoelectronic components which are electrically coupled to one another in parallel.

17. Method for producing an arrangement

optoelectronic devices, the process

comprising:

• Arranging a plurality of optoelectronic

Components on a substrate, wherein each optoelectronic component is arranged on a respective optoelectronic component substrate region (S1000), wherein at least one optoelectronic component of the plurality of optoelectronic components has at least one organic functional layer stack and an encapsulation of the organic functional layer stack;

Arranging at least one drive circuit for driving at least one optoelectronic component of the plurality of optoelectronic components on an optoelectronic component substrate region (S1001); and

• forming at least one target separation structure in the substrate (S1002).