WO2014208785A1 - 터치 패널용 패드 및 제조 방법 - Google Patents

터치 패널용 패드 및 제조 방법 Download PDF

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Publication number
WO2014208785A1
WO2014208785A1 PCT/KR2013/005626 KR2013005626W WO2014208785A1 WO 2014208785 A1 WO2014208785 A1 WO 2014208785A1 KR 2013005626 W KR2013005626 W KR 2013005626W WO 2014208785 A1 WO2014208785 A1 WO 2014208785A1
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WO
WIPO (PCT)
Prior art keywords
touch panel
pad
pattern
touch
conductive layer
Prior art date
Application number
PCT/KR2013/005626
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
박준영
정주현
송영진
배상모
이성림
김진주
Original Assignee
주식회사 티모스
주식회사 티메이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 티모스, 주식회사 티메이 filed Critical 주식회사 티모스
Priority to CN201380003932.5A priority Critical patent/CN104508607A/zh
Priority to PCT/KR2013/005626 priority patent/WO2014208785A1/ko
Publication of WO2014208785A1 publication Critical patent/WO2014208785A1/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Definitions

  • the present invention relates to a method of manufacturing a touch panel, and more particularly, to a touch panel pad and a manufacturing method using a metal having a translucent property.
  • the touch panel is an input device that can be easily used by anyone by touching a button with a finger to interactively and intuitively operate a computer.
  • the touch panel is integrated with a display, the touch panel is used as a touch screen.
  • the input device to perform.
  • a resistive method, a capacitive method, an infrared method, an ultrasonic method, and the like are used according to a method of sensing a touch, and in the future, the use of a capacitive method that is advantageous for durability and light and simple characteristics will be increased.
  • Such a capacitive touch panel particularly a touch screen, has an indium tin oxide (ITO) made of a transparent conductor on a transparent insulator film such as polyethylene terephthalate (PET) or glass, and an edge of the ITO.
  • ITO indium tin oxide
  • PET polyethylene terephthalate
  • a pad made of lead wire such as silver paste is laminated up and down by adding an adhesive layer or an insulator layer.
  • ITO films are known to be transparent up to about 92% (single layer) but have a relatively high resistance and are very fragile. Relatively high proportions of films are damaged during production and require expensive and time consuming test steps.
  • ITO film has very few suppliers capable of manufacturing the film, which causes logistic problems for users of the film.
  • TCO transparent conducting oxide
  • the manufacturing method of the touch panel pad using the metal mesh method according to the prior art simultaneously forms the transparent electrode pattern and the wiring electrode pattern as one metal layer layer.
  • the transparent electrode portion When the transparent electrode portion is formed in a mesh form, the surface area of the metal 10 becomes very small, so that the surface resistance value and the circuit resistance value increase.
  • the metal 10 should be coated with a thickness of 1000 A ° or more, which inevitably increases the opacity of the metal 10 and causes a problem that the circuit visibility of the window portion is lowered.
  • the circuit width In order to improve the circuit visibility of the window portion, the circuit width must be formed narrower, and the circuit width must be implemented to 5 ⁇ m or less.
  • the transparent electrode pattern and the wiring electrode pattern are simultaneously formed with one metal layer layer, when the circuit width of the window portion is narrowed to improve circuit visibility, the circuit resistance value is increased and the circuit width is increased. If not narrowed, the circuit visibility becomes low.
  • the conventional metal mesh method has a problem in that it is difficult to simultaneously satisfy two requirements for reducing circuit resistance while improving circuit visibility in the transparent electrode pattern and the wiring electrode pattern.
  • an object of the present invention is to provide a method for manufacturing a pad for a touch panel using a two-layer structure of a metal having a translucent property and a metal for low resistance wiring.
  • An object of the present invention is to provide a touch panel pad for forming a wiring electrode pattern of a touch panel with a metal coating layer and a lower layer of a semi-transparent conductive layer, and forming a semi-transparent electrode pattern with a fine metal mesh structure of the semi-transparent conductive layer. There is this.
  • a method for manufacturing a touch panel pad comprises a laminated structure including a metal coating layer on the upper surface of the semi-transparent conductive layer and the semi-transparent conductive layer of a conductive material of a semi-transparent material on the upper surface of the insulator.
  • the touch pattern portion corresponding to the window area (the area where the screen is displayed) of the touch panel in the stacked structure is connected to the translucent electrode patterns of the plurality of electrostatic electrodes and the wiring electrode pattern representing the bus electrode connected to the edge region of the translucent electrode pattern.
  • the touch panel pad according to the embodiment of the present invention is a touch pattern region corresponding to a window region (a region where a screen is displayed) of the touch panel, and includes a plurality of electrostatic layers including a semi-transparent conductive layer of a conductive material of a translucent material on the upper surface of the insulator. Translucent electrode pattern of the electrode; And a wiring electrode pattern connected to an edge region of each electrostatic electrode and formed of a translucent conductive layer on an upper surface of the insulator as a lead wire pattern region of the bus electrode and a metal coating layer thereon.
  • the present invention can improve the circuit visibility by configuring the window area (the area on which the screen is displayed) of the touch panel with a metal having translucent characteristics, thereby solving the circuit visibility problem of the metal mesh method.
  • the metal circuit of the edge region excluding the window region of the touch panel is made of low-resistance metal, thereby having low resistance and easy signal transmission.
  • the present invention has the effect of reducing the process of depositing ITO, cost reduction and easy quality control.
  • the present invention has the effect that a selective application of 5-300 ⁇ m is possible without reducing the circuit width to 5 ⁇ m or less according to the visible characteristics of the translucent metal.
  • FIG. 1 is a view illustrating a manufacturing method of a pad for a touch panel in which a wiring electrode pattern and a transparent electrode pattern are formed using a metal mesh method according to the related art.
  • FIGS. 2A and 2B are views illustrating a method of manufacturing a pad for a touch panel in which a wiring electrode pattern and a transparent electrode pattern are formed using a metal mesh method according to an exemplary embodiment of the present invention.
  • FIG. 3 is a diagram illustrating a form in which a top pattern and a bottom pattern are laminated in a capacitive touch panel according to an exemplary embodiment of the present invention.
  • FIGS. 4A and 4B are views illustrating a method of manufacturing a pad for a touch panel in which a wiring electrode pattern and a transparent electrode pattern are formed using a metal mesh method according to another exemplary embodiment of the present invention.
  • FIGS. 2A and 2B are views illustrating a method of manufacturing a pad for a touch panel in which a wire electrode pattern and a transparent electrode pattern are formed using a metal mesh method according to an embodiment of the present invention
  • FIG. 3 is a blackout according to an embodiment of the present invention. The top pattern and the bottom pattern of the capacitive touch panel are illustrated together.
  • the low-resistance metal coating layer on the upper surface of the translucent conductive layer 120 ( 130) (a1 and (a2) of Figure 2a).
  • the semi-transparent conductive layer 120 is a term distinguished from transparent conductive oxide having high transmittance such as ITO and ZnO, but has a color, but the opposite side of the light transmitting direction has the property of transmitting light. Conductive material.
  • the translucent conductive layer 120 serves to improve circuit visibility than when an opaque metal is used in forming a circuit.
  • the optical insulator 110 represents an insulator without or under coating if necessary, the insulator is formed of an organic insulator or an inorganic insulator of a transparent material, the organic insulator is a polyimide or polyethylene terephthalate (PET) ), Polycarbonate (PC), and the inorganic insulator is made of glass.
  • the organic insulator is a polyimide or polyethylene terephthalate (PET) ), Polycarbonate (PC), and the inorganic insulator is made of glass.
  • the above-described undercoating is a coating for treating the presence or absence of ITO after the ITO pattern, that is, the optical treatment is performed on the ITO base layer so that the presence or absence of ITO is not detected by the eye during capacitive ITO film production.
  • the undercoat may in some cases raising such SiO 2, TiO 2 Ceo 2, Nb 2 O 5 as a dry method (vapor deposition), there is also a case that a chemical treatment by a wet method.
  • the semi-transparent conductive layer 120 is a carbon nanotube (CNT), graphene (Graphene), chromium (Cr), an alloy of nickel (Ni) and chromium (Cr), nickel (Ni) and gold (
  • a conductive material of a semi-transparent material such as an alloy of Au), Ag Nano Wire (AGNW).
  • Metals such as nickel, chromium, gold and the like may be laminated by a deposition process or coated in a wet manner.
  • the low resistance metal coating layer 130 is made of metal such as silver (Ag), copper (Cu), gold (Au), aluminum (Al), palladium (Pd), platinum (Pt), zinc (Zn), tin (Sn), and the like. Represents a low resistance metal material having a sheet resistance of 0.1-150 Ohm ( ⁇ ).
  • the low-resistance metal coating layer 130 is a conductive material having a color, but the opposite side of the light transmission direction has a characteristic that is not visible through the light transmission.
  • the semi-transparent electrode pattern 121 made of the translucent conductive layer 120 and the wiring electrode pattern 131 made of the low resistance metal coating layer 130 are formed (FIG. (B1), (b2) and (b3) of 2a).
  • the semi-transparent electrode pattern 121 is a metal circuit of a portion corresponding to the window area (the area where the screen is displayed) of the touch panel, and represents the user's touch pattern area.
  • the wiring electrode pattern 131 is connected to one end of the translucent electrode pattern 121 representing the window region of the touch panel and is a metal circuit of the edge region of the touch panel except for the window region, and the semitransparent electrode pattern 121 and the printed circuit.
  • the bus electrode is connected to the substrate to sense and control a user's touch pattern.
  • the low-resistance metal coating layer 130 and the semi-transparent conductive layer 120 of the portion not corresponding to the translucent electrode pattern 121 and the wiring electrode pattern 131 are simultaneously formed using the first mask 140.
  • the process of primary photolithography is performed by the low resistance metal coating layer 130 and the semi-transparent conductive layer 120.
  • Secondary metal etching process That is, the process of primary photolithography performs dry film laminating, primary exposure, primary development, metal etching (metal having translucent property and metal having low resistance property), and peeling process.
  • the semi-transparent electrode pattern 121 and the wiring electrode pattern 131 subjected to the first photolithography process are formed of the upper layer as the low resistance metal coating layer 130 and the lower layer as the semitransparent conductive layer 120.
  • the semi-transparent electrode pattern 121 includes a plurality of second linear electrode portions intersecting with the plurality of first linear electrode portions 122 and the plurality of first linear electrode portions 122. Through 124 to form a fine pattern mesh structure.
  • the mesh structure of the fine pattern directly removes the low resistance metal coating layer 130 and the semi-transparent conductive layer 120 simultaneously.
  • There may be various embodiments such as patterning the structure or depositing a low resistance metal coating layer on the upper surface of the translucent conductive layer 120 and forming the mesh structure using a laser etching method. Can be.
  • the low-resistance metal coating layer 130 of the portion corresponding to the window area (the area where the screen is displayed) of the touch panel is removed using the second mask 141. It is a secondary metal etching process of the coating layer 130, (c1), (c2) and (c3) of Figure 2b).
  • the secondary photolithography may be performed by dry film laminating, secondary exposure, secondary development, metal etching (metal having low resistance characteristics), or peeling process.
  • the wiring electrode pattern 131 including the upper layer (low resistance metal coating layer 130) and the lower layer (translucent conductive layer 120) and the semi-transparent electrode pattern 121 including the translucent conductive layer 120 are formed on the optical insulating layer. Pads for touch panels are formed.
  • the top pattern of the sensing unit Receive and Rx and the bottom of the driving unit may be used. Bottom) pattern is laminated using an optical clear adhesive (OCA) to complete the final touch panel pad as shown in FIG. 3.
  • OCA optical clear adhesive
  • the sensing units (Receive, Rx) is a pattern for detecting whether the touch panel touches and the touch position as a change in the voltage value
  • the driver is a pattern to which the driving voltage of the touch panel is applied.
  • FIG. 3 illustrates a state in which a top pattern and a bottom pattern are laminated using OCA.
  • the top pattern and the bottom pattern may include the wiring electrode pattern 131 of the translucent conductive layer 120 and the low resistance metal coating layer 130.
  • the translucent electrode pattern 121 is formed in a one-layer structure of the translucent conductive layer 120 which is a fine pattern of the metal mesh structure.
  • the portion corresponding to the window area (the area where the screen is displayed) of the touch panel has a property of having excellent translucent metallurgy circuit visibility.
  • a circuit width of 5 ⁇ m or less should be implemented to improve visibility of the window part. In this way, when the circuit width of the window portion is narrowed, visibility may be improved, but the surface resistance value and the circuit resistance value become too high.
  • a portion corresponding to the window area (the area where the screen is displayed) of the touch panel is formed of a semi-transparent conductive layer 120, and has a circuit width of 5-300 ⁇ m thicker than a conventional circuit construction method using a transparent electrode.
  • the circuit resistance value can be made low.
  • the wiring electrode pattern 131 uses a semi-transparent conductive layer 120 for signal transmission, a low resistance metal is additionally formed and used as a trace for wiring.
  • the existing metal mesh method forms a touch pattern region and a wiring electrode region at the same time only with metal, without using TCO (ITO, ZnO and other transparent oxide electrodes), so that the visibility and the circuit suitable for each function of the touch pattern region and the wiring electrode region are appropriate. There was a problem that it is difficult to implement a resistance value.
  • the present invention has the effect of increasing the visibility by implementing the window region of the touch panel as the translucent conductive layer 120 and lowering the circuit resistance value by implementing the wiring electrode region as the low resistance metal coating layer 130.
  • the pad for a touch panel of the present invention is a face-up layer in which an optical insulator 110, a translucent conductive layer 120, and a low resistance metal coating layer 130 are sequentially stacked. Has a structure.
  • the pad for a touch panel according to the present invention may include a face-down layer structure and an optical insulator in which the low resistance metal coating layer 130, the semi-transparent conductive layer 120, and the optical insulator 110 are sequentially stacked.
  • the sensing unit or the driving unit in which the semi-transparent conductive layer 120 and the low-resistance metal coating layer 130 are sequentially stacked the low-resistance metal coating layer 130, the semi-transparent conductive layer 120, and the optical insulator 110.
  • the touch panel pad of the present invention may be applied to a layer structure that implements a sensing unit or a driving unit of the translucent conductive layer 120 and the low resistance metal coating layer 130 under the cover glass.
  • the positions of the sensing unit and the driving unit may vary.
  • FIGS. 4A and 4B are views illustrating a method of manufacturing a pad for a touch panel in which a wiring electrode pattern and a transparent electrode pattern are formed using a metal mesh method according to another exemplary embodiment of the present invention.
  • FIG. 4A illustrates a side layer structure of a pad for a touch panel according to another embodiment of the present invention
  • FIG. 4B illustrates a plan view of the pad for a touch panel according to another embodiment of the present invention.
  • the bottom pattern which is the X-axis electrode pattern according to another embodiment of the present invention, uses the wiring electrode pattern 131 as the semi-transparent conductive layer 120 and the low resistance metal coating layer 130.
  • the semi-transparent electrode pattern 121 is formed in a single layer structure of the semi-transparent conductive layer 120 which is a fine pattern of the metal mesh structure.
  • the method of manufacturing the bottom pattern, which is the X-axis electrode pattern is the same as that described with reference to FIGS. 2A and 2B, and thus a detailed description thereof will be omitted.
  • the top pattern which is the Y-axis electrode pattern of another embodiment of the present invention, after the insulating layer 200 is formed on the connecting portions 121a between the X-axis electrodes 120 by one of printing, deposition, and coating methods.
  • the connection portion 210a of the Y-axis electrode 210 is formed on the insulating layer 200.
  • the insulating layer 200 prevents the connection portion 121a of the X-axis electrode 120 and the connection portion 210a of the Y-axis electrode 210 from being electrically contacted.
  • the top pattern which is a Y-axis electrode pattern, is a conductive conductive layer of a fine pattern metal mesh structure.
  • the top pattern of the metal circuit corresponding to the window area of the touch panel (the area where the screen is displayed) and the window area of the touch panel are To form a metal circuit of the edge region except.
  • one conductive conductive layer of the top pattern represents one of a low resistance metal coating layer 130 of an opaque conductive material, a transparent electrode such as ITO, and a translucent conductive layer 120.
  • the translucent electrode pattern 121 forms a plurality of X-axis electrostatic electrodes, which are driving units (Transfer, Tx) to which the driving voltage of the touch panel is applied, and the conductive conductive layer changes the touch value and the touch position by changing the voltage value.
  • the pad for the touch panel forms an insulating layer 200 on the connecting portion 121a between the respective X-axis electrostatic electrodes, and then laminates the connecting portion 210a between the respective Y-axis electrostatic electrodes on the insulating layer 200.
  • the method of forming the metal mesh structure of one conductive conductive layer is well known in the art and will not be described in detail.
  • the method of electrically connecting the Y-axis electrode 210 may be variously configured by a known technique such as a method of forming a conductive bridge, and thus a detailed description thereof will be omitted.
  • the present invention can improve the circuit visibility by configuring the window area (the area on which the screen is displayed) of the touch panel with a metal having translucent characteristics, thereby solving the circuit visibility problem of the metal mesh method.
  • a low resistance metal is composed of a metal circuit in the edge region except for the window region of the touch panel, thereby having low resistance and easy signal transmission.
  • the present invention has the effect of reducing the process of depositing ITO, cost reduction and easy quality control.
  • the present invention has the effect that a selective application of 5-300 ⁇ m is possible without reducing the circuit width to 5 ⁇ m or less according to the visible characteristics of the translucent metal.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
PCT/KR2013/005626 2013-06-26 2013-06-26 터치 패널용 패드 및 제조 방법 WO2014208785A1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380003932.5A CN104508607A (zh) 2013-06-26 2013-06-26 触摸板用面板及制造方法
PCT/KR2013/005626 WO2014208785A1 (ko) 2013-06-26 2013-06-26 터치 패널용 패드 및 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2013/005626 WO2014208785A1 (ko) 2013-06-26 2013-06-26 터치 패널용 패드 및 제조 방법

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Publication number Priority date Publication date Assignee Title
JP6344498B1 (ja) * 2017-03-31 2018-06-20 Smk株式会社 タッチパネルおよび配線エリア形成方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100649913B1 (ko) * 2005-06-27 2006-11-27 아이티엠 주식회사 패터닝에 의하여 저항을 조절하는 도전성 기판 구조물 및그 제조 방법
JP2008044332A (ja) * 2006-08-16 2008-02-28 Yasuo Namita シート材料及び該シートを使用した製品
US20110205168A1 (en) * 2010-02-22 2011-08-25 Samsung Mobile Display Co., Ltd. Touch screen panel and fabricating method thereof
JP2012088836A (ja) * 2010-10-18 2012-05-10 Toppan Printing Co Ltd タッチパネル基板及びその製造方法
KR20130011267A (ko) * 2011-07-21 2013-01-30 희성전자 주식회사 터치 스크린 패널 및 그 전극 형성방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100649913B1 (ko) * 2005-06-27 2006-11-27 아이티엠 주식회사 패터닝에 의하여 저항을 조절하는 도전성 기판 구조물 및그 제조 방법
JP2008044332A (ja) * 2006-08-16 2008-02-28 Yasuo Namita シート材料及び該シートを使用した製品
US20110205168A1 (en) * 2010-02-22 2011-08-25 Samsung Mobile Display Co., Ltd. Touch screen panel and fabricating method thereof
JP2012088836A (ja) * 2010-10-18 2012-05-10 Toppan Printing Co Ltd タッチパネル基板及びその製造方法
KR20130011267A (ko) * 2011-07-21 2013-01-30 희성전자 주식회사 터치 스크린 패널 및 그 전극 형성방법

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