WO2014206016A1 - 像素界定层及其制作方法、显示基板及显示装置 - Google Patents

像素界定层及其制作方法、显示基板及显示装置 Download PDF

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Publication number
WO2014206016A1
WO2014206016A1 PCT/CN2013/088832 CN2013088832W WO2014206016A1 WO 2014206016 A1 WO2014206016 A1 WO 2014206016A1 CN 2013088832 W CN2013088832 W CN 2013088832W WO 2014206016 A1 WO2014206016 A1 WO 2014206016A1
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Prior art keywords
substrate
pixel
pixel area
monolayer
surface treatment
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English (en)
French (fr)
Inventor
侯文军
刘则
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to US14/345,622 priority Critical patent/US10333066B2/en
Publication of WO2014206016A1 publication Critical patent/WO2014206016A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks

Definitions

  • Embodiments of the present invention relate to a pixel defining layer, a method of fabricating the same, a display substrate, and a display device. Background technique
  • Inkjet printing technology is one of the main technologies used in modern office printing.
  • researchers have begun to experiment with the application of inkjet printing technology to the preparation of planar functional materials, such as the preparation of polymer conductive films, the preparation of color organic light-emitting diodes, and the fabrication of thin-film semiconductor devices.
  • a pixel defining layer is generally provided, the pixel defining layer comprising a pixel dividing wall at a non-pixel region between the pixel regions to form a plurality of spaces surrounding the pixel region, The inkjet printed ink is sprayed in the enclosed space by inkjet printing.
  • the pixel defining layer is fabricated in the manner described below. First, a film of an organic insulating material is formed on the substrate, and then a solvent is ink-jet printed on the film of the organic insulating material, and a pixel separation wall is prepared by using the "coffee ring" effect. In the above method, the organic insulating material film is first prepared by spin coating or scraping, and then the organic insulating material is migrated to form a pixel dividing wall by inkjet printing solvent.
  • the above method has the following disadvantages: On the one hand, a film of an organic insulating material is prepared by spin coating or scraping, and the utilization rate of the organic insulating material is low; on the other hand, organic solvent is used to migrate the organic insulating material to form a pixel dividing wall; The material may not migrate completely, and further plasma etching and other processes are required, the processing process is complicated, and the production line efficiency is low. Summary of the invention
  • Embodiments of the present invention provide a method for fabricating a pixel defining layer, including:
  • the pixel defining layer including pixel separation Wall.
  • the substrate includes a pixel area and a non-pixel area, and the surface treatment of the substrate is such that the surface energy of the pixel area is different from the surface energy of the non-pixel area; and the pixel separation wall is formed in the non-pixel area.
  • the contact angle of the ink-jet printed droplets in the pixel area of the substrate and the contact angle of the ink-jet-printed droplets in the non-pixel area of the substrate differ by 30. the above.
  • the surface treatment of the substrate such that the surface energy of the pixel region on the substrate is different from the surface energy of the non-pixel region comprises: performing self-assembly monolayer surface treatment on the substrate, and forming a monolayer in the pixel region of the substrate.
  • performing self-assembly monolayer surface treatment on the substrate, forming a monomolecular layer in the pixel region of the substrate comprises: performing self-assembly monolayer surface treatment on the substrate, forming a monomolecular layer on the surface of the substrate; and removing the non-pixel region Monolayer.
  • performing self-assembled monolayer surface treatment on the substrate, forming a monomolecular layer in the pixel region of the substrate includes: shielding a non-pixel region by using a mask, performing self-assembly monolayer surface treatment on the substrate, forming a single molecule on the surface of the substrate Floor.
  • the self-assembled monolayer surface treatment of the substrate, forming a monolayer in the pixel region of the substrate comprises: processing the substrate with a fluorinated silane in an inert gas environment, forming a fluorinated silane on the surface of the substrate Molecular layer; the non-pixel region on the substrate is irradiated with ultraviolet light by a mask to remove the fluorinated silane monolayer of the non-pixel region.
  • the method further includes: removing a monomolecular layer of the pixel region.
  • the method further includes: removing the fluorinated silane of the pixel region.
  • the removing the fluorinated silane of the pixel region includes: irradiating at least the pixel region with ultraviolet light.
  • the forming the pixel defining layer on the substrate by inkjet printing comprises: printing the ink forming the pixel dividing wall in the non-pixel area by the method of inkjet printing; and curing the ink printed in the non-pixel area.
  • the ink forming the pixel dividing wall is a solution formed by mixing an organic insulating material solute and an organic solvent.
  • the curing treatment is an annealing or drying treatment.
  • non-pixel regions are located between adjacent pixel regions.
  • the embodiment of the present invention provides a pixel defining layer, and the pixel defining layer is prepared by using any of the manufacturing methods provided by the embodiments of the present invention.
  • Embodiments of the present invention provide a display substrate including a pixel defining layer provided by an embodiment of the present invention.
  • the embodiment of the invention provides a display device, which comprises a display substrate provided by an embodiment of the invention.
  • FIG. 1 is a schematic structural view of an OLED device
  • FIG. 2 is a schematic top plan view of a substrate according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional structural diagram of a pixel defining layer according to an embodiment of the present disclosure
  • FIG. 4 is a schematic view showing a contact angle of a droplet formed on a substrate with a substrate
  • Figure 5 is a schematic view showing the formation of a fluorinated silane monolayer on the surface of the substrate
  • FIG. 6 is a schematic view showing ultraviolet irradiation treatment of a substrate on which a fluorinated silane monolayer is formed using a mask
  • FIG. 7 is a schematic diagram of forming a pixel dividing wall on a non-pixel area on a substrate. detailed description
  • Embodiments of the present invention provide a pixel defining layer, a manufacturing method thereof, a display substrate, and a display device.
  • the pixel defining layer includes a pixel dividing wall, and the pixel defining layer is provided by the embodiment of the present invention.
  • the method is formed.
  • the display substrate includes a pixel defining layer formed by the method provided by the embodiments of the present invention.
  • the display device includes the display substrate provided by the embodiment of the present invention. It should be noted that the display device may be a display device such as a liquid crystal display, an electronic paper, an OLED display, a PLED (Polymer Light-Emitting Diode) display, or a television, a digital camera, or a mobile phone including the display device. Any product or component that has a display function, such as a tablet.
  • the pixel defining layer may be a film formed by, for example, inkjet printing, which includes a pixel dividing wall pattern.
  • inkjet printing is required in a specified area, but due to the fluidity of inkjet inkjet printing, inkjet ink may overflow to other adjacent areas, so inkjet printing is required.
  • a pixel dividing wall is formed around the area to prevent inkjet ink from flowing.
  • the OLED generally includes: an anode electrode layer 12, a light-emitting function layer 13, and a cathode electrode layer 14 which are sequentially disposed on the substrate substrate 11.
  • the display device includes a pixel area 31 and a non-pixel area 32, as shown in FIG.
  • the light-emitting function layer can be formed on the anode electrode layer in the pixel region 31 by the method of ink-jet printing.
  • the ink-jet-printed ink has a certain fluidity, so that the ink to be printed may overflow to the adjacent pixel region. As shown in FIG.
  • the pixel defining layer includes a pixel dividing wall 15 located between the pixel regions 31 (ie, located in the non-pixel region 32) to form a plurality of surrounding spaces, and the inkjet printing is illuminated.
  • the functional layer ink is sprayed in the enclosed space by inkjet printing. Due to the blocking effect of the pixel dividing wall, the ink of the ink-jet printing function layer does not overflow to the adjacent pixel area.
  • the light-emitting function layer may include: a hole injection layer, a hole transport layer, an electroluminescence layer, and the like, and each layer may be formed by inkjet printing. Display device and other structures.
  • the pixel defining layer is formed on the substrate before the color filter layer is formed, and the surrounding space formed by the pixel dividing wall of the pixel defining layer is sprayed.
  • Ink printing forms color filters of different colors such as red, green, and blue, respectively, to ensure the purity of each color.
  • the structure formed by the pixel defining layer is not specifically limited in the embodiment of the present invention.
  • Embodiments of the present invention provide a method for fabricating a pixel defining layer.
  • the method includes: Step S101: Perform surface treatment on the substrate.
  • the substrate includes a pixel area 31 and a non-pixel area 32.
  • pixel areas 31 There are a plurality of pixel areas 31.
  • one pixel area 31 corresponds to a pixel unit of one color, such as a pixel unit of red, green or blue.
  • the non-pixel area 32 is located between adjacent pixel areas 31.
  • the substrate is surface-treated such that the surface energy of the pixel region on the substrate is different from the surface energy of the non-pixel region.
  • the substrate in the embodiment of the present invention is a substrate before forming a pixel defining layer, and may be a substrate or a structure obtained by forming a plurality of thin films or layers on a substrate.
  • the substrate substrate may be glass, silicon wafer, quartz or the like.
  • the substrate includes a substrate substrate 11 and an anode electrode layer 12 formed on the substrate 11 .
  • the substrate including the substrate substrate 11 and the anode electrode layer 12 formed on the substrate substrate 11 will be described as an example.
  • Step S102 forming a pixel defining layer on the substrate by inkjet printing, the pixel defining layer comprising a pixel dividing wall.
  • the pixel dividing wall is formed in a non-pixel area. Since the surface energy of the pixel region is different from the surface energy of the non-pixel region, the pixel dividing wall is formed in the non-pixel region without being formed in the pixel region.
  • the surface energy of the substrate is the sum of the dispersion component and the polar component of the substrate surface.
  • the size and polarity of the surface energy of the substrate can be obtained by measuring the contact angle by a measuring instrument.
  • the contact angle refers to gas, liquid,
  • the tangent to the gas-liquid interface at the solid three-phase intersection passes through the angle between the liquid and the solid-liquid boundary.
  • the liquid droplet 16 is printed on the substrate substrate 11, and its contact angle is ⁇ . If 6 ⁇ 90°, the solid surface is lyophilic, that is, the liquid is relatively easy to wet the solid, and the smaller the contact angle, the better the wettability; if ⁇ > 90.
  • ⁇ 90°, which is the boundary line of wetness or not.
  • the lyophobicity and lyophilicity are relative.
  • a lyophile is relatively lyophobic.
  • the contact angle of the inkjet printed droplets in the pixel area of the substrate and the inkjet printing The contact angle of the droplets in the non-pixel regions of the substrate differs by about 30. the above.
  • the difference in contact angle is not specifically limited in the embodiment of the present invention, as long as the difference in contact angle (ie, the difference in surface energy) is sufficient for the pixel separation wall to be formed in the non-pixel region without forming The pixel area is OK.
  • the droplets generally used in the measurement of the contact angle are water, and of course, other solutions.
  • the droplets may be inkjet printed inks, that is, inkjet printed pixels. A solution that defines the layer.
  • the substrate may be surface treated by various methods such as self-assembled monolayer surface treatment, ultraviolet ozone cleaning, self-assembled multi-layer surface treatment, surface deposited film, and the like. Self-assembly Monolayer surface treatment. When the substrate is processed, the corresponding method can be adopted according to actual requirements.
  • the fabrication of the flexible substrate requires strict processing temperature, and the manufacturing method provided by the embodiment of the present invention does not require too high temperature, and thus can be used to fabricate a flexible substrate.
  • the flexible substrate may be PET (polyethylene terephthalate), PI (polyimide), or the like.
  • surface treatment of the substrate such that the surface energy of the pixel region on the substrate differs from the surface energy of the non-pixel region includes: performing self-assembled monolayer surface treatment on the substrate to form a monolayer in the pixel region of the substrate.
  • the self-assembled monolayer surface treatment of the substrate, and the formation of the monolayer in the pixel region of the substrate may be to form a monomolecular layer only in the pixel region of the substrate.
  • a non-pixel area on the substrate may be blocked by another device (e.g., a mask) to form a single-layer layer only in the pixel region.
  • performing self-assembly monolayer surface treatment on the substrate, and forming a monomolecular layer in the pixel region of the substrate may be: performing self-assembly monolayer surface treatment on the substrate, forming a monomolecular layer on the surface of the substrate; and removing non-pixels The monolayer of the region.
  • the substrate is subjected to a self-assembled monolayer surface treatment to form a monomolecular layer in a pixel region of the substrate
  • the pixel is defined
  • the method of fabricating the layer may further include: removing the monolayer of the pixel region. Since the monomolecular layer in the pixel region is disadvantageous for subsequently spreading the desired material (for example, the light emitting layer material) in the space surrounded by the pixel dividing wall, it is preferable to remove the pixel region after forming the pixel defining layer including the pixel dividing wall.
  • Monolayer Since the monomolecular layer in the pixel region is disadvantageous for subsequently spreading the desired material (for example, the light emitting layer material) in the space surrounded by the pixel dividing wall, it is preferable to remove the pixel region after forming the pixel defining layer including the pixel dividing wall.
  • a method for fabricating a pixel defining layer according to an embodiment of the present invention includes:
  • Step S201 The substrate is treated with a fluorinated silane in an inert gas atmosphere to form a monomolecular layer of a fluorinated silane on the surface of the substrate.
  • a fluorinated silane monolayer is formed on the surface of the substrate, and the substrate includes a substrate substrate 11 and an anode electrode layer 12 provided on the substrate substrate 11.
  • a fluorinated silane vapor is formed on the surface of the substrate to treat the substrate, and a fluorinated silane monolayer is formed on the surface of the substrate.
  • the formation of a fluorinated silane monolayer on the surface of the substrate may also be performed by a wet liquid phase self-assembled monolayer surface treatment, for example, the substrate may be immersed in a liquid of a fluorinated silane to form a fluorinated silane single molecule on the surface of the substrate.
  • Step S202 irradiating the non-pixel region on the substrate with ultraviolet light by using a mask to remove the fluorinated silane monolayer in the non-pixel region.
  • the mask 22 includes a light transmitting region and an opaque region.
  • the opaque region of the mask covers the pixel region on the substrate, and the ultraviolet light is irradiated onto the substrate through the light transmitting region to remove the non-pixel region.
  • Fluorinated silane monolayer It should be noted that the irradiation with ultraviolet light is generally performed by an ultraviolet ozone cleaning machine. The light energy of the ultraviolet light during the irradiation process can decompose the oxygen in the air to form ozone, and the ozone also fluorinates on the substrate.
  • the silane monolayer has a certain effect.
  • the mask is placed close to the substrate, thereby ensuring that only the fluorinated silane monolayer of the non-pixel region is removed by ultraviolet light irradiation, and the pixel region is not affected.
  • Step S203 forming a pixel dividing wall in a non-pixel area of the substrate by a method of inkjet printing.
  • a pixel dividing wall 15 is formed in a non-pixel area of the substrate by a method of inkjet printing.
  • Step S204 removing the fluorinated silane monolayer of the pixel region.
  • At least the pixel region is irradiated with ultraviolet light to remove the fluorinated silane monolayer of the pixel region to obtain a structure as shown in FIG.
  • the mask region can be used to irradiate only the pixel region with ultraviolet light to remove the fluorinated silane monolayer in the pixel region.
  • the ultraviolet light irradiation has no other influence on the formed pixel partition wall and other film or layer structures on the substrate, the entire substrate may be irradiated with ultraviolet light to remove the fluorinated silane monolayer in the pixel region.
  • step S102 or step S203 forming a pixel including the pixel on the substrate by inkjet printing
  • the pixel defining layer of the dividing wall includes:
  • Step S1021. The ink forming the pixel dividing wall is printed in a non-pixel area by a method of inkjet printing.
  • the ink forming the pixel dividing wall may be a solution of an organic insulating material, which may be a solution formed by mixing an organic insulating material solute and an organic solvent.
  • the organic insulating material includes: polyhexafluoropropylene, fluorinated parylene, fluorinated polysilyl ether, fluorinated polyimide, fluorinated polyamide, polyimide, polysiloxane, Polymethyl methacrylate, polybutyl methacrylate, polycyclohexyl methacrylate, polystyrene, and the like.
  • the organic solvent includes: tetralin, perfluoroalkane, and the like.
  • Step S1022 Perform curing processing on the ink printed in the non-pixel area.
  • the curing treatment of the ink for inkjet printing can be carried out by a different method depending on the composition of the ink for inkjet printing.
  • the ink for inkjet printing is a solution of an organic insulating material
  • the solution of the organic insulating material is annealed or dried to remove the solvent in the organic insulating material to cure the organic insulating material.
  • the organic insulating material is a polymer material
  • the solvent is a small molecule solvent
  • the two forming solutions form a pixel defining layer including a pixel dividing wall on the substrate by inkjet printing. .
  • the solution of the organic insulating material is annealed to remove the small molecule solvent in the organic insulating material solution, and the pixel defining layer including the pixel dividing wall formed on the substrate is a polymer organic insulating material.

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Abstract

一种像素界定层及其制作方法、显示基板及显示装置。该像素界定层的制作方法包括：对基板进行表面处理；利用喷墨打印在基板上形成像素界定层，所述像素界定层包括像素分隔墙。

Description

像素界定层及其制作方法、 显示基板及显示装置 技术领域
本发明的实施例涉及一种像素界定层及其制作方法、 显示基板及显示装 置。 背景技术
喷墨打印技术是现代办公印刷中采用的主要技术之一。 近年来， 研究人 员开始尝试把喷墨打印技术应用于平面功能材料的制备， 如制备聚合物导电 膜、 制备彩色有机发光二极管、 制备薄膜半导体器件等。
然而， 当将喷墨打印技术应用于诸如液晶显示装置或 OLED ( Organic Light Emitting Diode, 有机发光二极管）显示装置等显示装置时， 由于墨水 的流动性， 喷墨打印的墨水会流溢到相邻的像素区域。 为了减少喷墨打印的 墨水流溢到相邻的像素区域， 一般设置像素界定层， 该像素界定层包括位于 像素区域之间的非像素区域处的像素分隔墙以形成多个包围像素区域的空 间， 喷墨打印的墨水通过喷墨打印的方式喷涂在所述包围空间内。
通常， 像素界定层以如下所述的方法制作。 首先在基板上形成有机绝缘 材料薄膜， 然后在有机绝缘材料薄膜上喷墨打印溶剂， 利用 "咖啡环" 效应 制备像素分隔墙。 在上述方法中， 主要是先通过旋涂、 刮涂的方式先制备有 机绝缘材料薄膜,再通过喷墨打印溶剂使有机绝缘材料迁移形成像素分隔墙。 然而， 上述方法有以下缺点： 一方面采用旋涂、 刮涂的方式制备有机绝缘材 料薄膜， 有机绝缘材料的利用率低； 另一方面， 利用溶剂使得有机绝缘材料 迁移形成像素分隔墙时有机绝缘材料可能迁移不完全， 从而还需要进一步的 等离子刻蚀等工艺， 加工工艺复杂， 产线效率低。 发明内容
本发明实施例提供了一种像素界定层的制作方法， 包括：
对基板进行表面处理；
利用喷墨打印在基板上形成像素界定层， 所述像素界定层包括像素分隔 墙。
例如， 所述基板包括像素区域与非像素区域， 对基板进行表面处理使像 素区域的表面能与非像素区域的表面能不同； 并且在非像素区域形成所述像 素分隔墙。
例如， 喷墨打印的液滴在所述基板像素区域的接触角和喷墨打印的液滴 在所述基板非像素区域的接触角相差 30。 以上。
例如， 所述对基板进行表面处理使得基板上像素区域的表面能与非像素 区域的表面能大小不同包括： 对基板进行自组装单分子层表面处理， 在基板 像素区域形成单分子层。
例如， 对所述基板进行自组装单分子层表面处理， 在基板像素区域形成 单分子层包括： 对基板进行自组装单分子层表面处理， 在基板表面形成单分 子层； 并且去除非像素区域的单分子层。
例如， 对所述基板进行自组装单分子层表面处理， 在基板像素区域形成 单分子层包括： 利用掩模板遮挡非像素区域， 对基板进行自组装单分子层表 面处理， 在基板表面形成单分子层。
例如， 所述对基板进行自组装单分子层表面处理， 在基板像素区域形成 单分子层包括： 在惰性气体的环境中， 利用氟化硅烷对基板进行处理， 在基 板表面形成氟化硅烷的单分子层； 利用掩膜板对基板上的非像素区域进行紫 外光照射去除非像素区域的氟化硅烷单分子层。
例如， 通过喷墨打印的方法在非像素区域形成像素分隔墙之后， 所述方 法还包括： 去除像素区域的单分子层。
例如，在采用喷墨打印的方法在基板的非像素区域形成像素分隔墙之后， 所述方法还包括： 去除像素区域的氟化硅烷。
例如， 所述去除像素区域的氟化硅烷包括： 至少对像素区域进行紫外光 照射。
例如， 所述利用喷墨打印在基板上形成像素界定层包括： 通过喷墨打印 的方法在非像素区域打印形成像素分隔墙的墨水； 对非像素区域打印的墨水 进行固化处理。
例如， 形成像素分隔墙的墨水是有机绝缘材料溶质和有机溶剂混合形成 的溶液。 例如， 所述固化处理为退火或干燥处理。
例如， 非像素区域位于相邻的像素区域之间。
本发明实施例提供了一种像素界定层， 所述像素界定层采用本发明实施 例提供的任一制作方法制备。
本发明实施例提供了一种显示基板， 所述显示基板包括本发明实施例提 供的像素界定层。
本发明实施例提供了一种显示装置， 所述显示装置包括本发明实施例提 供的显示基板。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为 OLED器件的结构示意图；
图 2为本发明实施例提供的基板的俯视结构示意图；
图 3为本发明实施例提供的像素界定层的剖视结构示意图；
图 4为液滴在基板上与基板形成的接触角示意图；
图 5为在基板表面形成氟化硅烷单分子层示意图；
图 6为利用掩膜板对形成有氟化硅烷单分子层的基板进行紫外光照射处 理的示意图； 以及
图 7为在基板上的非像素区域形成像素分隔墙的示意图。 具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合附图， 对本发明实施例的技术方案进行清楚、 完整地描述。 显然， 所描述的实施例 是本发明的一部分实施例， 而不是全部的实施例。 基于所描述的本发明的实 施例， 本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实 施例， 都属于本发明保护的范围。
本发明实施例提供了一种像素界定层及其制作方法、 显示基板和显示装 置。 像素界定层包括像素分隔墙， 所述像素界定层通过本发明实施例提供的 方法形成。 所述显示基板包括通过本发明实施例提供的方法形成的像素界定 层。 所述显示装置包括本发明实施例提供的显示基板。 需要说明的是， 所述 显示装置可以为液晶显示器、 电子纸、 OLED 显示器、 PLED ( Polymer Light-Emitting Diode,高分子发光二极管）显示器等显示器件以及包括这些显 示器件的电视、 数码相机、 手机、 平板电脑等任何具有显示功能的产品或者 部件。
需要说明的是， 在本发明所有实施例中， "层" 是指利用某一种材料在 基板上利用沉积或其他工艺制作出的一层薄膜， 其包括 "图案" 。 例如， 本 发明实施例中， 所述像素界定层可以是通过例如喷墨打印形成的一层薄膜， 其包括像素分隔墙图案。 在喷墨打印的过程中， 需要在指定的区域进行喷墨 打印， 但由于喷墨打印的墨水的流动性， 喷墨打印的墨水可能会流溢到相邻 的其他区域， 故需要在喷墨打印的区域周围形成像素分隔墙， 以防止喷墨打 印的墨水的流溢。 所示， OLED通常包括： 依次设置在村底基板 11上的阳极电极层 12、 发光 功能层 13、 阴极电极层 14。 显示装置包括像素区域 31和非像素区域 32, 如 图 2所示。可以利用喷墨打印的方法于像素区域 31内在阳极电极层上形成发 光功能层， 然而喷墨打印的墨水具有一定的流动性， 因此喷印的墨水可能会 流溢到相邻的像素区域。 如图 3所示， 根据本发明实施例的像素界定层包括 位于像素区域 31之间 （即， 位于非像素区域 32 ) 的像素分隔墙 15, 用以形 成多个包围空间， 喷墨打印的发光功能层墨水通过喷墨打印的方式喷涂在所 述包围空间内。 由于像素分隔墙的阻挡作用， 喷墨打印的发光功能层墨水不 会流溢到相邻的像素区域。 需要说明的是， 所述发光功能层可以包括： 空穴 注入层、 空穴传输层、 电致发光层等， 且每一层均可以采用喷墨打印的方法 形成。 示装置以及其他结构。 例如， 也可以是形成液晶显示装置的滤色层时， 在形 成所述滤色层之前， 在基板上形成上述像素界定层， 再在所述像素界定层的 像素分隔墙形成的包围空间通过喷墨打印分别形成如红、 绿、 蓝的不同颜色 的滤色层， 以保证每一种颜色的纯净度。 对于显示装置的类型以及利用所述 像素界定层所形成的结构， 本发明实施例不作具体限定。
下面， 将结合附图对根据本发明实施例的像素界定层的制作方法进行详 细的说明。
本发明实施例提供了一种像素界定层的制作方法。 该方法包括： 步骤 S101、 对基板进行表面处理。
如图 2所示， 所述基板包括像素区域 31和非像素区域 32。 像素区域 31 为多个。 例如， 一个像素区域 31对应于一种颜色的像素单元， 如红、 绿或蓝 的像素单元。 非像素区域 32位于相邻的像素区域 31之间。
对所述基板进行表面处理， 使得基板上的像素区域的表面能与非像素区 域的表面能大小不同。
本发明实施例中的所述基板是在形成像素界定层之前的基板， 其可以是 村底基板也可以是在村底基板上形成多个薄膜或层而得到的结构。 所述村底 基板可以是玻璃、 硅片、 石英等。 例如， 如图 3所示， 所述基板包括村底基 板 11及形成在村底基板 11上的阳极电极层 12。 作为示例， 在下面的描述中 均以基板包括村底基板 11及形成在村底基板 11上的阳极电极层 12为例进行 说明。
步骤 S102、 利用喷墨打印在基板上形成像素界定层， 所述像素界定层包 括像素分隔墙。
所述像素分隔墙形成在非像素区域。 由于像素区域的表面能与非像素区 域的表面能不同， 因此像素分隔墙形成在非像素区域而不形成在像素区域。
需要说明的是， 基板的表面能的大小是基板表面的色散分量和极性分量 之和， 可以通过测量仪测量接触角获得基板表面能的大小和极性， 接触角是 指在气、 液、 固三相交点处气 -液界面的切线穿过液体与固-液交界线之间的 夹角。 如图 4所示， 在村底基板 11上打印液滴 16, 其接触角为 θ。 若6 < 90° , 则固体表面是亲液性的， 即液体较易湿润固体， 且接触角越小， 湿润 性越好； 若 θ > 90。 ， 则固体表面是疏液性的， 即液体不易湿润固体， 容易 在表面上移动； θ =90° , 其为湿润与否的分界线。 需要说明的是， 疏液性 和亲液性是相对的， 当基板上的表面能不同时， 则相对而言， 一个亲液一个 疏液。 基板上的不同区域的接触角相差越大， 则表面能相差越大。 例如， 本 发明实施例中， 喷墨打印的液滴在所述基板像素区域的接触角和喷墨打印的 液滴在所述基板非像素区域的接触角相差约 30。 以上。然而，需要说明的是， 本发明实施例中对接触角的差值不作具体限定， 只要接触角的差值（即， 表 面能的差值）足以使像素分隔墙形成在非像素区域而不形成在像素区域即可。 需要说明的是， 在接触角测量时一般采用的液滴为水， 当然也可以是其他溶 液， 本发明实施例中， 所述液滴可以采用喷墨打印的墨水， 即喷墨打印的形 成像素界定层的溶液。
可以采用多种方法对所述基板进行表面处理， 例如自组装单分子层表面 处理、 紫外臭氧清洗、 自组装多分子层表面处理、 表面沉积薄膜等。 自组装 单分子层表面处理。 在对基板进行处理时， 可以根据实际的要求， 采用相应 的方法。
需要说明的是， 柔性基板的制作对加工的工艺温度要求严格， 本发明实 施例提供的制作方法， 无需太高的温度， 因此可用于制作柔性基板。 例如， 柔性基板可以是 PET (聚对苯二甲酸乙二酯） 、 PI (聚酰亚胺）等。
例如， 对基板进行表面处理， 使得基板上的像素区域的表面能与非像素 区域的表面能大小不同包括： 对基板进行自组装单分子层表面处理， 在基板 的像素区域形成单分子层。
例如， 对基板进行自组装单分子层表面处理， 在基板的像素区域形成单 分子层可以是仅仅在基板的像素区域形成单分子层。 例如可以是利用其他设 备（例如， 掩膜板）将基板上非像素区域进行遮挡， 仅在像素区域形成单分 子层。 或者， 对所述基板进行自组装单分子层表面处理， 在基板的像素区域 形成单分子层可以为： 对基板进行自组装单分子层表面处理， 在基板表面形 成单分子层； 并去除非像素区域的单分子层。
在对基板进行自组装单分子层表面处理以在基板的像素区域形成单分子 层的情形下， 在利用喷墨打印的方法在基板上形成包括像素分隔墙的像素界 定层之后， 所述像素界定层的制作方法还可以进一步包括： 去除像素区域的 单分子层。 由于像素区域内的单分子层不利于后续在像素分隔墙所包围的空 间内铺展所需的材料（例如， 发光层材料） ， 因此在形成包括像素分隔墙的 像素界定层之后优选去除像素区域的单分子层。
下面以利用自组装氟化硅烷单分子层表面处理为例对根据本发明实施例 的像素界定层的制作方法进行进一步详细的说明。 例如， 根据本发明实施例 的像素界定层的制作方法包括：
步骤 S201、 在惰性气体的环境中， 利用氟化硅烷对基板进行处理， 在基 板表面形成氟化硅烷的单分子层。
如图 5所示， 在基板的表面形成氟化硅烷单分子层， 所述基板包括村底 基板 11以及设置在村底基板 11的阳极电极层 12。在基板表面形成氟化硅烷 烷蒸汽对基板进行处理， 在基板表面形成氟化硅烷单分子层。 另外， 在基板 表面形成氟化硅烷单分子层也可以是采用湿法液相自组装单分子层表面处 理， 例如可以将基板浸泡在氟化硅烷的液体中， 在基板表面形成氟化硅烷单 分子层。
步骤 S202、 利用掩膜板对基板上的非像素区域进行紫外光照射， 去除非 像素区域的氟化硅烷单分子层。
如图 6所示，掩膜板 22包括透光区和不透光区，掩膜板的不透光区覆盖 基板上像素区域， 紫外光通过透光区照射到基板上， 去除非像素区域的氟化 硅烷单分子层。 需要说明的是， 利用紫外光进行照射， 一般是利用紫外臭氧 清洗机进行的， 紫外光在照射的过程中的光能量能将空气中的氧气分解形成 臭氧， 臭氧也会对基板上的氟化硅烷单分子层产生一定的影响。 在对基板进 行紫外光照射时， 优选使得掩膜板贴近所述基板， 进而保证通过紫外光照射 仅去除非像素区域的氟化硅烷单分子层而像素区域不受影响。
步骤 S203、通过喷墨打印的方法，在基板的非像素区域形成像素分隔墙。 如图 7所示， 通过喷墨打印的方法， 在基板的非像素区域形成像素分隔 墙 15。
步骤 S204、 去除像素区域的氟化硅烷单分子层。
至少对像素区域进行紫外光照射， 去除像素区域的氟化硅烷单分子层， 以得到如图 3所示的结构。 例如， 可以利用掩膜板仅对像素区域进行紫外光 照射， 去除像素区域的氟化硅烷单分子层。 当然， 若紫外光照射对形成的像 素分隔墙以及基板上的其他薄膜或层结构没有其他影响， 也可以对整个基板 进行紫外光照射， 进而去除像素区域的氟化硅烷单分子层。
在上述步骤 S102或步骤 S203中， 利用喷墨打印在基板上形成包括像素 分隔墙的像素界定层包括：
步骤 S1021、 通过喷墨打印的方法在非像素区域打印形成像素分隔墙的 墨水。
形成像素分隔墙的墨水可以为有机绝缘材料的溶液， 其可以是有机绝缘 材料溶质和有机溶剂混合形成的溶液。 例如， 所述有机绝缘材料包括： 聚六 氟丙烯、 氟化聚对二甲苯、 氟化聚硅基醚、 氟化聚酰亚胺、 氟化聚酰胺、 聚 酰亚胺、 聚硅氧烷、 聚甲基丙烯酸甲酯、 聚甲基丙烯酸丁酯、 聚甲基丙烯酸 环己酯、 聚苯乙烯等。 例如， 有机溶剂包括： 四氢化萘、 全氟烷烃等。
步骤 S1022、 对非像素区域打印的墨水进行固化处理。
需要说明的是， 对喷墨打印的墨水进行固化处理可以根据喷墨打印的墨 水的组成选择不同的方法进行固化。 在喷墨打印的墨水为有机绝缘材料的溶 液的情形下， 对有机绝缘材料的溶液进行退火或干燥处理， 去除有机绝缘材 料中的溶剂， 固化有机绝缘材料。 需要说明的是， 本发明实施例中， 所述有 机绝缘材料是高分子材料， 而溶剂是小分子溶剂， 两者形成溶液通过喷墨打 印的方式在基板上形成包括像素分隔墙的像素界定层。 本发明实施例中对所 述有机绝缘材料的溶液采用退火处理， 去除有机绝缘材料溶液中的小分子溶 剂，在基板上形成的包括像素分隔墙的像素界定层为高分子的有机绝缘材料。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1、 一种像素界定层的制作方法， 包括：
对基板进行表面处理；
利用喷墨打印在基板上形成像素界定层， 所述像素界定层包括像素分隔 墙。
2、 根据权利要求 1所述的制作方法， 其中
所述基板包括像素区域与非像素区域， 对基板进行表面处理使像素区域 的表面能与非像素区域的表面能不同； 并且
在非像素区域形成所述像素分隔墙。
3、根据权利要求 2所述的制作方法，其中喷墨打印的液滴在所述基板像 素区域的接触角和喷墨打印的液滴在所述基板非像素区域的接触角相差 30。 以上。
4、根据权利要求 2或 3所述的制作方法，其中所述对基板进行表面处理 使得基板上像素区域的表面能与非像素区域的表面能大小不同包括为： 对基板进行自组装单分子层表面处理， 在基板像素区域形成单分子层。
5、根据权利要求 4所述的制作方法，其中对所述基板进行自组装单分子 层表面处理， 在基板像素区域形成单分子层包括：
对基板进行自组装单分子层表面处理， 在基板表面形成单分子层； 并且 去除非像素区域的单分子层。
6、根据权利要求 4所述的制作方法，其中对所述基板进行自组装单分子 层表面处理， 在基板像素区域形成单分子层包括：
利用掩模板遮挡非像素区域， 对基板进行自组装单分子层表面处理， 在 基板表面形成单分子层。
7、根据权利要求 5所述的制作方法，其中所述对基板进行自组装单分子 层表面处理， 在基板像素区域形成单分子层包括：
在惰性气体的环境中， 利用氟化硅烷对基板进行处理， 在基板表面形成 氟化硅烷的单分子层；
利用掩膜板对基板上的非像素区域进行紫外光照射去除非像素区域的氟 化硅烷单分子层。
8、根据权利要求 4-7任一项所述的制作方法， 其中通过喷墨打印的方法 在非像素区域形成像素分隔墙之后， 所述方法还包括：
去除像素区域的单分子层。
9、根据权利要求 7所述的制作方法，其中在采用喷墨打印的方法在基板 的非像素区域形成像素分隔墙之后， 所述方法还包括：
去除像素区域的氟化硅烷。
10、 根据权利要求 9所述的制作方法， 其中所述去除像素区域的氟化硅 烷包括：
至少对像素区域进行紫外光照射。
11、根据权利要求 1-10中任一项所述的制作方法， 其中所述利用喷墨打 印在基板上形成像素界定层包括：
通过喷墨打印的方法在非像素区域打印形成像素分隔墙的墨水； 对非像素区域打印的墨水进行固化处理。
12、根据权利要求 11所述的制作方法，其中形成像素分隔墙的墨水是有 机绝缘材料溶质和有机溶剂混合形成的溶液。
13、 根据权利要求 11或 12所述的制作方法， 其中所述固化处理为退火 或干燥处理。
14、根据权利要求 1-13任一项所述的制作方法， 其中非像素区域位于相 邻的像素区域之间。
15、一种像素界定层， 其中所述像素界定层采用根据权利要求 1-14任一 项的制作方法制备。
16、一种显示基板，其中所述显示基板包括权利要求 15所述的像素界定 层。
17、一种显示装置，其中所述显示装置包括权利要求 16所述的显示基板。
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