WO2014202291A1

WO2014202291A1 - Optoelectronic arrangement

Info

Publication number: WO2014202291A1
Application number: PCT/EP2014/059968
Authority: WO
Inventors: Konrad Wagner; Jürgen Holz
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2013-06-20
Filing date: 2014-05-15
Publication date: 2014-12-24
Also published as: US20160111803A1; JP2016524331A; JP6318241B2; DE102013211640A1; TWI594468B; CN105284194B; KR102180735B1; KR20160022346A; US9991621B2; TW201511365A; CN105284194A

Abstract

An optoelectronic arrangement comprises a first printed circuit board and a second printed circuit board. An optoelectronic semiconductor chip is arranged on the first printed circuit board. A first electrical contact surface and a second electrical contact surface are formed on a surface of the first printed circuit board. A first opposing contact surface and a second opposing contact surface are formed on a surface of the second printed circuit board. The first printed circuit board and the second printed circuit board are provided for connection to one another such that the surface of the first printed circuit board faces the surface of the second printed circuit board, the first opposing contact surface is electrically conductively connected to the first contact surface, and the second opposing contact surface is electrically conductively connected to the second contact surface.

Description

description

Optoelectronic arrangement The present invention relates to an optoelectronic An ^¬ order according to Claim. 1

This patent application claims the priority of German Patent Application 10 2013 211 640.3, the disclosure of which is hereby incorporated by reference.

Optoelectronic arrangements which have an optoelectronic semiconductor chip arranged on a printed circuit board are known from the prior art. The optoelectronic semiconductor chip may, for example, be a light-emitting diode chip (LED chip). For electrical contacting of such optoelectronic arrangements electrical conductors can be soldered directly to arranged on the circuit board solder contacts. Alternatively, the printed circuit board can be provided with an electrical connector, for example a SMD-type connector.

The electrical connector can be arranged on the printed circuit board before or after the optoelectronic semiconductor chip. If the electrical connector is arranged in front of the op ^¬ toelektronischen semiconductor chip on the circuit board, it may interfere with subsequent process steps. Is the electrical connector disposed by the optoelectronic semiconductor chip on the circuit board, this must be on at this point already been separated component he ^¬ follow, which is associated with a high expenditure.

It is known to provide optoelectronic arrangements for various ^¬ ne applications with different electrical connectors. Incidentally, optoelectronic arrangements provided with different connectors can otherwise be of the same design. The necessity, otherwise identical optoe ^¬ lektronische arrangements with different electrical To equip connectors increases the costs required to manufacture the optoelectronic devices.

An object of the present invention is to provide an optoelectronic device. This object is achieved by an optoelectronic device having the features of claim 1. In the dependent claims various developments are given. An optoelectronic arrangement comprises a first conductor ^¬ plate and a second circuit board. In this case, an optoelectronic semiconductor chip is arranged on the first printed circuit board. On a surface of the first circuit board, a first electrical contact surface and a second electrical contact surface are formed. On a surface of the second circuit board, a first mating contact surface and a second mating contact surface are formed. To be the first circuit board and the second circuit board are provided to so mitein ^¬ other connected such that the surface of the first circuit board of the surface of the second printed circuit board supplied ^¬ Wandt, the first mating contact surface electrically conductively connected to the first contact face and the second opposing contact surface electrically conductively connected to the second contact surface is connected. The optoelectronic semiconductor chip arranged on the first printed circuit board of the optoelectronic device can be, for example, a light-emitting diode chip (LED chip). The second printed circuit board of this optoelectronic device can advantageously be used for electrically contacting the first printed circuit board with the optoelectronic semiconductor chip arranged thereon. For this purpose, the first printed circuit board and the second printed circuit board of the optoelectronic device can be connected to one another in such a way that there are electrically conductive contacts between the contact surfaces of the first printed circuit board and the mating contact surfaces of the second printed circuit board. Advantageously, the first printed ^¬ te of the optoelectronic assembly can form a core component, which can be combined with differently designed second circuit boards. This allows the first one PCB with different electrical interfaces to provide. Thus, the optoelectronic assembly can be advantageously ge for various applications ^¬ uses. A further advantage is that the first printed circuit board of the optoelectronic device does not have to be provided with an electrical connector, as a result of which it can not interfere with the production of the first printed circuit board. This advantageously simplifies the production of the first printed circuit board.

In one embodiment of the optoelectronic device, the second circuit board has an electrical connector. In this case an electrical terminal of the electrical ^¬ rule connector electrically connected to the first clock Gegenkon- surface is connected. Advantageously, the electrical connector of the second printed circuit board can be used for electrical contacting of the optoelectronic device. If the first printed circuit board and the second printed circuit board of the opto ^¬ lektronischen arrangement connected to each other, so there is an electrically conductive connection between the electrical connection element of the electrical connector and the opto ^¬ lectronic semiconductor chip on the first mating contact surface of the second circuit board and the first contact surface of the first circuit board.

In one embodiment of the optoelectronic device, the electrical connector is designed as a plug connector, as an insulation displacement terminal, as a screw-type contact or as a soldering post. Advantageously, the electrical connector of the second printed circuit board of the optoelectronic device can thereby be optimized for a specific application.

In one embodiment of the optoelectronic arrangement, the second printed circuit board has a first solder contact surface, which is electrically conductively connected to the first mating contact surface. In this case, the second circuit board also has a second solder contact surface, which is electrically conductively connected to the second mating contact surface. The first soldering contact surface and the second solder pad of the second circuit board can serve for electrical contacting of the optoelectronic device. For example, electrical conductors to be soldered to the first solder pad and to the second solder pad of the second circuit board of the optoe ^¬ lektronischen arrangement. As a result, no electrical connector for making electrical contact with the optoelectronic device is required. This offers the advantage that the optoelectronic arrangement can be made particularly compact and inexpensive.

In one embodiment of the optoelectronic arrangement, the first printed circuit board and the second printed circuit board are provided to be connected to each other by means of a resilient mounting means. Advantageously, a reliable electrical connection between the first opposing contact surface of the second circuit board and the first Kon ^¬ tact surface of the first circuit board and between the second counter-contact surface of the second circuit board and the second contact surface of the first printed circuit board can be ensured by the resilient fastening means. The resilient mounting means can thereby compensate before ^¬ geous enough, thermal expansions of the first circuit board and the second circuit board of the optoelectronic device. Thereby advantageously reliable electrical connections between the Gegenkon- are clock surfaces of the second circuit board and the contact surfaces of the first circuit board via a plurality of heating and cooling cycles ^¬ ensured.

In one embodiment of the optoelectronic arrangement, the first printed circuit board and the second printed circuit board are intended to be connected to one another by means of a screw connection. Advantageously provides a screw connection, a simple and inexpensive to produce possible ^¬ ness, long-term reliability to connect the first circuit board and the second board of the optoelectronic arrangement. The screw can be an or include several screws. The screws of the screw connection may have a coefficient of thermal expansion which is adapted to thermal expansion coefficients of the first printed circuit board and the second printed circuit board to a reliable connection between the first printed circuit board and the second printed circuit board, in particular a reliable electrical connection between the mating contact surfaces of the second printed circuit board and the Contact surfaces of the first circuit board, even when heating or cooling of the printed circuit boards of the optoelectronic device to ensure.

In one embodiment of the optoelectronic arrangement, the first printed circuit board and the second printed circuit board are intended to be connected to one another by means of a clamping connection. Advantageously, a clamping connection is an easy-to-install and cost-producible way to connect the first circuit board and the second Lei ^¬ terplatte the optoelectronic device with each other. The clamping connection can advantageously be formed resiliently.

In one embodiment of the optoelectronic arrangement, the first electrical mating contact surface is pressed against the first electrical contact surface and pressed the second electrical mating contact surface against the second electrical contact surface when the second circuit board and the first conductor ^¬ plate are connected together. Advantageously, this results in a direct electrically conductive connection between the first mating contact surface and the first contact surface and between the second mating contact surface and the second contact surface. Advantageously, the opto ^¬ lectronic arrangement thereby have a particularly low height. In an embodiment of the optoelectronic arrangement environmentally summarizes these, an electrically conductive member which is provided to see ^¬, between the first counter-contact surface and the first contact surface and / or between the second Gegenkon- _r

contact surface and the second contact surface to be arranged when the second circuit board and the first circuit board are connected to ^¬ each other. Advantageously, the elekt ^¬ driven conductive member may see expansions resulted in changes in length of the first circuit board and the second circuit board of the optoelectronic assembly compensated by different degrees of thermal. As a result, reliable electrical connections between the mating contact surfaces of the second printed circuit board and the contact surfaces of the first printed circuit board of the optoelectronic device are ensured even when the printed circuit boards of the optoelectronic device are heated and cooled.

In one embodiment of the optoelectronic arrangement, the first contact surface, the second contact surface, the first mating contact surface and / or the second mating contact surface ^comprise a ductile material. Advantageously, the ductile material may be any differences in height of the first Kon ^¬ clock face, the second contact surface, the first counter-contact surface and / or the second opposing contact surface ausglei ^¬ chen. As a result, reliable electrical ^¬ cal contacts between the mating contact surfaces of the second circuit board and the contact surfaces of the first circuit board of the optoelectronic device are advantageously ensured even in the presence of such possible height differences.

In one embodiment of the optoelectronic device, the first printed circuit board has a slot arranged between the first contact surface and the second contact surface. Alternatively or additionally, the second printed circuit board has a slot arranged between the first mating contact surface and the second mating contact surface. Advantageously, the slots arranged in the first printed circuit board and / or the second printed circuit board can compensate for changes in the length of the first printed circuit board and the second printed circuit board caused by thermal expansions of the first printed circuit board and the second printed circuit board, whereby the printed circuit boards of the optoelectronic components are also heated and cooled Arrangement reliable electrical connections between the mating contact surfaces of the second circuit board and the contact ^¬ surfaces of the first circuit board of the optoelectronic device can be ensured.

In an embodiment of the optoelectronic arrangement, the first circuit board to a third electrical contact ^¬ surface. In this case, the second circuit board has a third electrical mating contact surface. The first printed circuit board and the second printed circuit board are intended to be so mitein ^¬ other connected, that the third mating contact surface is electrically connected to the third contact surface. Advantageously, a third electrical connection of the optoelectronic assembly can be provided on the third electrical con tact ^¬ surface and the third electrical counter-contact surface.

In one embodiment of the optoelectronic device, the first printed circuit board is designed as a metal-core printed circuit board. Advantageously, the first circuit board of the op ^¬ toelektronischen arrangement characterized in a high thermal conductivity. This enables the first printed circuit board of the optoelectronic device to effectively dissipate waste heat produced by the optoelectronic semiconductor chip. As a result, overheating of the optoelectronic semiconductor chip is prevented.

In one embodiment of the optoelectronic arrangement, the second printed circuit board is designed as an FR4 printed circuit board. Advantageously, the second printed circuit board can be produced thereby a ^¬ times and inexpensively.

In one embodiment of the optoelectronic arrangement, a further element is arranged on the first printed circuit board. The further element is used as a thermocouple, as NTC

Resistor, designed as an element for measuring brightness, as a coding element or as another optoelectronic semiconductor chip. Another optoelectronic semiconductor chip can advantageously serve to increase the optical output power from ^¬ the optoelectronic device. A coding may advantageously serve a bort to encode a brightness, a spectral distribution or a temperature response of the optoelectronic semiconductor chip of the optoelectronic assembly Far ^¬. An element for measuring brightness can be used to measure a brightness of an electromagnetic radiation emitted by the optoelectronic semiconductor chip. An NTC resistor can be used to determine a temperature at the location of the first printed circuit board of the optoelectronic device. A thermocouple can also be used to determine a temperature.

In one embodiment of the optoelectronic device, the third electrical contact surface is electrically conductively connected to the further element. Advantageously, the further element of the first circuit board of the optoelectronic assembly ^¬ rule then the third electrical Kontaktflä ^¬ surface and the third electrical counter-contact area can be electrically contacted.

In one embodiment of the optoelectronic arrangement, the first electrical contact area and the second electrical contact area are electrically conductively connected to the optoelectronic semiconductor chip. As a result, the optoelectronic semiconductor chip of the optoelectronic device can advantageously be electrically contacted from the outside via the first electrical contact surface and the second electrical contact surface as well as the first electrical contact surface and the second electrical contact surface.

In one embodiment of the optoelectronic arrangement, a further element is arranged on the second printed circuit board, which serves as control electronics for driving the optoelectronic semiconductor chip, as protection circuit for protecting the optoelectronic semiconductor chip, as monitoring circuit for electrical or thermal monitoring of the optoelectronic semiconductor chip, as monitor circuit for - draw a history of the optoelectronic semiconductor chip and / or is designed as a coding element. The coding ^¬ element can, for example, encode a color coordinates, a Hellig ^¬ ness, a spectral distribution or a temperature response of the optoelectronic semiconductor chip of the optoelectronic assembly.

The above-described characteristics, features, and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more clearly understood in connection with the following description of the embodiments, which will be described in detail in conjunction with the drawings. Shown schematically in each case:

1 is a plan view of a first component circuit board of a first optoelectronic device;

FIG. 2 shows a plan view of a first connection printed circuit board of the first optoelectronic arrangement; FIG.

Figure 3 is a plan view of the first optoelectronic Anord ^¬ voltage to the first component circuit board and the first connector board.

4 is a side view of the first opto-electronic device comprising the first component and the printed circuit board ers ^¬ th connector board. 5 shows a plan view of a second connection printed circuit board of a second optoelectronic arrangement;

Figure 6 is a plan view of the second optoelectronic Anord ^¬ voltage to the first component circuit board and the second connector board. 7 shows a side view of the second optoelectronic arrangement with the first component printed circuit board and the two ^¬ th terminal printed circuit board. 8 shows a plan view of a second component printed circuit board of a third optoelectronic device;

9 shows a plan view of a third connection printed circuit board of the third optoelectronic arrangement;

10 shows a side view of a fourth optoelectronic arrangement with a second fastening means;

11 shows a side view of a fifth optoelectronic arrangement with a third fastening means;

Fig. 12 is a side view of a sixth optoelectronic device with a fourth attachment means; and FIG. 13 shows a plan view of a fourth connection printed circuit board of a seventh optoelectronic device.

FIGS. 1 to 4 show components of a first optoelectronic device 10. The first optoelectronic device 10 may be, for example, a light-emitting diode device.

Fig. 1 shows a schematic plan view of a first compo ^¬-component circuit board 100 of the first optoelectronic Anord ^¬ voltage 10. The first component circuit board 100 may also include as a circuit board or PCB (Printed Circuit Board) referred ^¬ the. The first component circuit board 100 may ^¬ example, be formed as metal core printed circuit board having provided in its interior metallization. In this case, the first component circuit board 100 advantageously has a high thermal conductivity.

On a surface 101 of the first component printed circuit board 100 are a first electrical contact surface 110 and a second electrical contact surface 120 is formed. The first electrical contact surface 110 and the second electrical con ^¬ tact surface 120 are each formed as a planar metallizations. The first electrical contact surface 110 may be ge for example, by disposed at the surface 101 of the first component circuit board 100 ^¬ metallization forms. The first electrical contact surface 110 is then electrically insulated against a possible metal core of the first component printed circuit board 100. The second electrical contact surface 120 may also be formed by means disposed on the surface 101 of the first component circuit board 100 Me ^¬ metallization. In this case, the second electrical contact surface 120 is electrically insulated from a ^¬ even tual metal core of the first component circuit board 100th However, the second electrical contact surface 120 may also be formed by an exposed portion of a metal core of the first component printed circuit board 100, if this is formed as a metal core printed circuit board. In this case, the second electrical contact area 120 of the first component circuit board 100 is electrically conductively connected to the metal ^¬ core of the first component circuit board 100th

In the illustrated in Fig. 1, the first component circuit board 100, the first electrical contact surface 110 and the second electrical contact area 120 both close to the same ^¬ outer edge of the first component circuit board 100 at ^¬ sorted. The first electrical contact surface 110 is arranged in egg ^¬ nem first corner region of the rectangular-shaped first component circuit board 100. The second electrical contact surface 120 is arranged in a second corner region of the first component printed circuit board 100.

On the surface 101 of the first component circuit board 100, an optoelectronic semiconductor chip 130 is arranged. The optoelectronic semiconductor chip 130 is designed to emit electromagnetic radiation, for example visible light. The optoelectronic semiconductor chip 130 may, for example, be a light-emitting diode chip (LED chip). Of the However, optoelectronic semiconductor chip 130 can also be a laser chip or another optoelectronic semiconductor chip. The optoelectronic semiconductor chip 130 is electrically lei ^¬ tend connected to the first electrical contact surface 110 and the second electrical contact area 120th This makes it possible to apply an electrical voltage to the optoelectronic semiconductor chip 130 between the first electrical contact surface 110 and the second electrical contact surface 120 in order to operate the optoelectronic semiconductor chip 130. The electrically conductive connection between the optoelectronic semiconductor chip 130 and the first electrical contact surface 110 may, for example, comprise a bonding wire. The electrically conductive connection between the optoelectronic semiconductor chip 130 and the second electrical contact surface 120 may for example via a ner to ei ^¬ underside of the optoelectronic semiconductor chip 130 be ^¬ standing electrically conductive connection between the optoelectronic semiconductor chip 130 and a metal core of the first component circuit board 100 be formed, if the first component circuit board 100 is formed as a metal core printed circuit board. But the optoelectronic semiconducting ^¬ terchip 130 may be connected 120 via a bonding wire or a particular arrival electrically conductive connection with the second electrical contact surface.

The first component circuit board 100 has a first Boh ^¬ tion 140 and a second bore 150th The first bore 140 and the second bore 150 form perpendicular to Oberflä ^¬ che 101 of the first component circuit board 100 oriented through holes extending through the first component circuit board 100. The first hole 140 is arranged in the shown in FIG. 1, the first component circuit board 100 in the first corner portion of the first component circuit board 100 and pierces the first electrical contact ^¬ surface 110. The second bore 150 is on the second corner region of the first component Printed circuit board 100 arranged and durch- abuts the second electrical contact surface 120. It would, depending ^¬ but also possible to arrange the first bore 140 and second bore 150 on other positions of the first circuit board component 100th The first component circuit board 100 could also have only the first bore 140 or more than two bores 140, 150.

Fig. 2 shows a schematic plan view of a first on ^¬ circuit board 200 of the first opto-electronic arrangement of 10. The first connector board 200 can also be referred to as a circuit board or PCB. The first terminal board 200 may include a common and inexpensive board substrate, such as an FR4 substrate.

Are a first mating contact surface 210 and a second counter formed ^¬ contact surface 220 on a surface 201 of the first connector board 200th The first mating contact surface 210 and the second mating contact surface 220 are each formed by planar metallizations. Im shown in Fig. 2

As an example of the first connection printed circuit board 200, the first mating contact surface 210 and the second mating contact surface 220 are arranged near a common outer edge of the first connection printed circuit board 200. The first mating contact surface 210 is arranged in a first corner region of the first connection printed circuit board 200. The second mating contact surface 220 is arranged in a second corner region of the first connection printed circuit board 200. On the surface 201 of the first connection board 200, an electrical connector 230 is disposed. The electrical connector 230 is provided to provide electrically conductive connections to the first opposing contact surface 210 and two ^¬ th counter-contact surface 220 of the first connector board 200th For this purpose, first electrical connecting elements ^¬ 231 of the electrical connector 230 are electrically lei ^¬ tend connected to the first counter-contact surface 210th Second electrical connection elements 232 of the electrical connector 230 are electrically conductively connected to the second mating ^contact surface 220 of the first connection printed circuit board 200. The first electrical connection elements 231 and the second electrical connection elements 232 of the electrical connector 230 can be connected to the mating contact surfaces 210, 220 of the first connection circuit board 200, for example via solder connections.

At a connection side 233 of the electrical connector 230 provides the electrical connector 230 electrically conductive Ver ^¬ compounds ready for the first electrical connection elements 231 and the second electrical connection elements 232 and thus to the first opposing contact surface 210 and the second opposing contact surface 220th In the example shown in FIG. 2, the first connector board 200 of the electrical Verbin ^¬ is the 230 formed as a connector. The connecting side 233 of the electrical connector 230 is formed by a Stecksei ^¬ te of the formed as a plug connector electrical connector 230 which is adapted to be plugged together with a passen- the connector-counterpart, are electrically conductive connections between the electrical connection elements 231, 232 of the electrical connector 230 and corresponding terminal elements of the connector counterpart.

In the example of the first connection printed circuit board 200 shown in FIG. 2, only one electrical connector 230 is provided, which provides electrically conductive connections both to the first mating contact surface 210 and to the second mating contact surface 220. However, it would also be possible to provide two separate electrical connectors for contacting the first mating contact surface 210 and the second mating contact surface 220. The electrical connector 230 or the plurality of electrical connectors can be designed as plug-in connectors, for example, as insulation displacement contacts (friction cutting contacts), as screw contacts (luster terminals) or as soldering posts (solepins). The first connection board 200 has a first bore 240 and a second bore 250. The first bore 240 and the second bore 250 extend as openings perpendicular to the surface 201 of the first connection board 200, each through the first connection board 200. The first hole 240 is in the first corner area of the first connection board 200 arranged and breaks through the first mating contact surface 210. The second bore 250 is disposed in the second corner region of the first connection board 200 and breaks through the second counter ^¬ contact surface 220th Die Diameter of the first bore 240 and the second bore 250 of the first terminal board 200 correspond preferably about the diameter of the first bore 140 and second bore 150 of the first component circuit board 100. the distance between the holes 240, 250 of the first connector board 200 corresponds approximately to the Ab ^¬ stand between the first bore 140 and second bore 150 the first component circuit board 100. The first component n-circuit board 100 of the first opto ^¬ lektronischen arrangement 10 and the first connection board 200 of the first optoelectronic device 10 are intended to be so interconnected that the surface 101 of the first component circuit board 100 of the surface 201 of the first connection Printed circuit board 200 faces, the first mating contact surface 210 of the first connection board 200 is electrically connected to the first contact surface 110 of the first component circuit board 100 and the second mating contact surface 220 of the first connection board 200 electrically conductive with the second electrical contact surface 120 of the first component circuit board 100 is connected. Fig. 3 shows a schematic ^¬ schematic plan view of the interconnected circuit boards 100, 200 of the first opto-electronic device 10. Fig. 4 shows a schematic side view of the verbun together ^¬ which printed circuit boards 100, 200 of the first optoelectronic assembly 10. The first component circuit board 100 and the first check circuit board 200 of the first optoelectronic Anord ^¬ voltage 10 are connected with a first fastening means 300 mitein ^¬ other. The first fastening means 300 is designed as a screw connection and comprises in the example shown in FIGS. 3 and 4 a first screw 310 and a second screw 320. However, a different number of screws would also be possible. The first screw 310 extends through the first bore 140 of the first component printed circuit board 100 and the first bore 240 of the first connector printed circuit board 200. The second screw 320 extends through the second bore 150 of the first component printed circuit board 100 and second bore 250 of the first connection circuit board 200. The first screw 310 and the second screw 320 of the first fastening means 300 can each be secured with a nut, which is not shown in FIGS. 3 and 4, however.

The first mating contact surface 210 of the first connection printed circuit board 200 is electrically conductively connected to the first electrical contact surface 110 in the connected state of the first connection printed circuit board 200 and ers ^¬ ter component circuit board 100 shown in Figures 3 and 4. As a result, there is an electrically conductive connection between the electrical connector 230 of the first connection printed circuit board 200 and the optoelectronic semiconductor chip 130 of the first component printed circuit board 100. The second mating contact surface 220 of the first connection printed circuit board 200 is pressed against the second electrical contact surface 120 in this manner in that an electrically conductive connection exists between the second mating contact surface 220 and the second electrical contact surface 120. Characterized there is also an electrically conductive Ver ^¬ bond between the electrical connector 230 of the first connector board 200 and the opto-electronic semi-conductor chip 130 of the first component circuit board 100th

The first electrical contact surface 110 of the first component ^¬ th circuit board 100, the second electrical contact surface 120 of the first component printed circuit board 100, the first counter ^¬ contact surface 210 of the first terminal board 200 and / or the second mating contact surface 220 of the first An ^¬ circuit board 200 may have a ductile material, the squeezing the mating contact surfaces 210 , 220 and the electrical contact surfaces 110, 120 deformed to compensate for possible height differences. The ductile material may include, for example, a tin solder. FIGS. 5 to 7 show components of a second optoelectronic arrangement 20. The second optoelectronic arrangement 20 has correspondences with the first optoelectronic arrangement 10 of FIGS. 1 to 4. Components of the second optoelectronic arrangement 20 which correspond to components present in the first optoelectronic arrangement 10 are provided with the same reference symbols in FIGS. 5 to 7 as in FIGS. 1 to 4 and will not be described again in detail below. Only the differences between the second optoelectronic device 20 and the first optoelectronic device 10 will be explained.

Fig. 5 shows a schematic plan view of a second on ^¬ circuit board 1200, the second opto-electronic device 20. The second connector board 1200 replaces the first connector board 200 of the first opto-electro ^¬ African arrangement 10 comprises, instead of the electrical connector 230, the second terminal board 1200 has a first solder pad 1210 and a second solder pad 1220. The first solder contact surface 1210 is electrically conductively connected to the first mating contact surface 210. In Darge ^¬ presented example, the first solder pad 1210 and the first counter-contact surface 210 go area contiguous in ^¬ above the other. The second solder pad 1220 elekt ^¬ driven conductively connected to the second counter-contact surface 220 of the connectedness. In the illustrated example, the second solder contact ^¬ surface 1220 and the second mating contact surface 220 will be extensively ^¬ coherently into one another. The first solder pad 1210 and the second Lötkontaktflä ^¬ surface 1220, the second connector board 1200 are respectively provided for soldering electrical conductors. In FIG. 5, by way of example, a first conductor 1215 is soldered to the first solder contact area 1210. At the second solder contact surface

1220, in the exemplary illustration, a second conductor 1225 is soldered.

The second optoelectronic arrangement 20 comprises, in addition to the second connection printed circuit board 1200, the first component printed circuit board 100 of FIG. 1.

Fig. 6 shows a schematic plan view of the second optoe ^¬ lectronic assembly 20 in a state in which the first component mounting board 100 is ver ^¬ ^¬ connected by means of the first means 300 with the second connector board 1200th Fig. 7 shows a schematic side view of the second optoelectronic assembly 20 with the connected to the first component circuit board 100 second check circuit board 1200. The surface 201 of the second to ^¬ circuit board 1200, the second optoelectronic device 20 is the surface 101 the first component printed circuit board 100 of the second optoelectronic device 20 facing. The first mating contact surface 210 of the second connection printed circuit board 1200 is against the first electrical

Contact surface 110 of the first component printed circuit board 100 is pressed, so that an electrically conductive connection between the first mating contact surface 210 and the first electrical contact surface 110 is made. The second mating contact surface 220 of the second connection printed circuit board 1200 is pressed against the second electrical contact surface 120 of the first component printed circuit board 100, so that there is an electrically conductive connection between the second mating contact surface 220 and the second electrical contact surface 120. Thereby, in the second optoelectronic assembly 20 of the components on the first circuit board 100 arranged optoe ^¬ lectronic semiconductor chip 130 via the second terminal connected to the circuit board 1200 first conductor 1215 and the second conductor 1225 connected to the second connection board 1200 are contacted.

FIGS. 8 and 9 show schematic representations of components of a third optoelectronic device 30. The third optoelectronic device 30 has correspondences with the first optoelectronic device 10 of FIGS. 1 to 4. Components of the third optoelectronic device 30 which correspond to components present in the first optoelectronic device 10 are given the same reference numerals in FIGS. 8 and 9 as in FIGS. 1 to 4 and will not be explained again in detail below. Only the differences between the third optoelectronic device 30 and the first optoelectronic device 10 will be described.

8 shows a plan view of a second component printed circuit board 2100 of the third optoelectronic assembly 30. The second component printed circuit board 2100 replaces the first component printed circuit board 100. The second component printed circuit board 2100 has, in addition to the first electrical contact surface 110 and second electrical contact surface 120, a third electrical contact surface 2130 and a four ^¬ te electrical contact surface 2140 on. The third electrical contact surface 2130 and the fourth electrical contact surface 2140, like the first electrical contact surface 110 and the second electrical contact surface 120, are formed on the surface 101 of the second component circuit board 2100. The first electrical contact surface 110, the second electrical see contact surface 120, the third electrical contact area 2130, and the fourth electrical contact area 2140 two ^¬ th components of circuit board 2100 are electrically ge each ^¬ against each other isolated. The second component circuit board 2100, in addition to the optoelectronic semiconductor chip 130 has yet another element 2160 which is disposed on the surface 101 of the second com ponents ^¬ board 2100th The further Ele- ment 2160 is electrically conductively connected to the third electrical contact surface 2130 and the fourth electrical contact surface 2140, so that the further element 2160 can be acted upon by the third electrical contact surface 2130 and the fourth electrical contact surface 2140 with current and voltage. It is also possible to use the optoelectronic semiconductor chip 130 and the further element 2160 of the second component circuit board 2100 so with the electrical Kon ^¬ clock surfaces 110, 120, 2130, to connect 2140 to the second component circuit board 2100 that the optoelectronic semiconductor chip 130 and the further element 2160 of the second component circuit board 2100 share a common Mas ^¬ sekontakt. In this case, one of the electrical contact surfaces 110, 120, 2130, 2140 of the second component printed circuit board 2100 can be omitted or used for other purposes.

The further element 2160 of the second component printed circuit board 2100 may, for example, be a further optoelectronic semiconductor chip. The further element 2160 may also be a thermocouple or an NTC resistor. In this case, the further element 2160 can be used to monitor a temperature at the location of the second component circuit board 2100, for example, a temperature of the optoelectronic semiconductors chips 130. The other element 2160 of the second compo ^¬ nents circuit board 2100 can also be a element to be Hellig ^¬ velocity measurement. In this case, the further element 2160 may serve to measure a brightness of a light emitted by the optoe ^¬ lektronischen semiconductor chip 130 of the second component circuit board 2100 electromagnetic radiation. The further element 2160 of the second component circuit board 2100 may also be a coding element ^¬ game as used in the coding of a color location, a brightness, a spectral distribution or a temperature response of the optoelectronic semiconductor chip 130 of the second component circuit board 2100th The coding element forming the further element 2160 can be formed, for example, as a counter ^¬ stood network. The further element 2160 of the second component circuit board 2100 of the third optoe ^¬ lectronic arrangement 30 may also be another active or passive device. The second component circuit board 2100 has a slit 2150 extending from an outer edge of the second component circuit board 2100 into the second component circuit board 2100. The slit 2150 is disposed on the outer edge of the second component circuit board 2100 adjacent to the electrical contact surfaces 110, 120, 2130, 2140 of the second component circuit board 2100. The first electrical contact surface 110 and the third electrical con tact ^¬ surface 2130 of the second component circuit board 2100 disposed in example of FIG. 8 on one side of the slot 2150th The second electrical Kontaktflä ^¬ space 120 and the fourth electrical contact surface 2140 are in example of Fig. 8 on the other side of the

Slot 2150 arranged. The slit 2150 of the second Kom ^¬ components board 2100 allows a certain deformation of the second component circuit board 2100. In particular, it ^¬ 2150 enables the slot has a variation of the distance Zvi ^¬ rule of the first electrical contact surface 110 and the second electrical contact surface 120 of the second component Circuit board 2100, a variation of the distance between the third electrical contact surface 2130 and the fourth electrical contact surface 2140 of the second component circuit board 2100 and a variation of the distance between the first bore 140 and the second bore 150 of the second component circuit board 2100. Thereby, the slot 2150 of the second component circuit board 2100 enables compensation of thermal length changes.

9 shows a plan view of a third connection printed circuit board 2200 of the third optoelectronic device 30. The third connection printed circuit board 2200 replaces the first connection printed circuit board 200. The third connection printed circuit board 2200 has, in addition to the first mating contact surface 210 and the second mating contact surface 220 a third mating contact surface 2230 and a fourth mating contact surface 2240. The individual counter-contact surfaces 210, 220, 2230, 2240 of the third connector board 2200 are electrically ge each ^¬ against each other isolated. Third electrical connection elements 2230 of the electrical connector 230 of the third connection printed circuit board 2200 are electrically conductively connected to the third Ge ^¬ gene contact surface 2230, for example via Lötver ^¬ bonds. Fourth electrical connecting elements 2234 of the electrical connector 230 of the third connecting printed circuit board 2200 are electrically conductively connected to the fourth Ge ^¬ gene contact surface 2240, for example, soldered to the four ^¬ ten mating contact surface 2240. Thus, the electrical connector 230 of the third connector board ready 2200 electrically conductive connections to the first opposing contact surface 210, to the second counter-contact surface 220, to drit ^¬ th counter-contact surface 2230 and the fourth Gegenkontaktflä ^¬ surface 2240 of the third connector board 2200th

The third terminal board 2200 has a slot 2250 extending from an outer edge of the third terminal board 2200 into the third terminal board 2200. The slot 2250 to 2200 ^¬ sorted at that outer edge of the third terminal board, which are the mating contact surfaces 210, 220, 2230, 2240 of the third connector board 2200 adjacent. The slot 2250 extends between the first opposing contact surface 210 and the second opposing contact surface 220, so ^¬ as between the third counter-contact surface 2230 and the fourth counter-contact surface 2240. The slot 2250 allows a certain deformation of the third connector board 2200. As a result, a variation of the Distance between the first mating contact surface 210 and the third mating contact surface 2230 on one side and the second mating contact surface 220 and the fourth mating contact surface 2240 of the third connection circuit board 2200 on the other side made ^¬ light. In addition, the slot 2250 allows a variation of the distance between the first bore 240 and the second Bore 250 of the third terminal board 2200. This he ^¬ allows a compensation of a thermal change in length.

When the second component circuit board 2100 and the third connection circuit board 2200 of the third optoelectronic device 30 are connected to each other, the surface 110 of the second component circuit board 2100 faces the surface 201 of the third connection circuit board 2200. The first mating contact surface 210 of the third connection printed circuit board 2200 is pressed against the first electrical contact surface 110 of the second component circuit board 2100, so that there is an electrically conductive connection between the first mating contact surface 210 and the first electrical contact surface 110. Correspondingly, the second counter-contact surface 220 against the second electrical contact surface 120 that drit ^¬ te counter-contact surface 2230 against the third electric Kon ^¬ clock area 2130, and the fourth contact-receiving surfaces 2240 are pressed against the fourth electrical contact surface 2140, so that electrically conductive connections between the second counter-contact surface 220 and the second electrical contact surface 120, between the third mating contact surface 2230 and the third electrical contact surface 2130 and between the fourth mating contact surface 2240 and the fourth electrical contact surface 2140 exist. Again, the electrical contact surfaces 110, 120, 2130, 2140 and / or the clock Gegenkon- surfaces 210, 220, 2230, 2240 have a ductile material ^¬ which allows through deformation compensation of certain height differences. If one of the electrical contact surfaces 110, 120, 2130, 2140 of the second component printed circuit board 2100 of the third optoelectronic device 30 is omitted, then the corresponding mating contact surface 210, 220, 2230, 2240 of the third connecting printed circuit board 2200 of the third optoelectronic device 30 omitted. It is also possible to form the second component circuit board 2100 more than four elekt ^¬ step contact surfaces 110, 120, 2130, 2140th In this case should also be the third connection board 2200 have a correspondingly larger number of mating contact surfaces 210, 220, 2230, 2240.

The second component circuit board 2100 and the third connection circuit board 2200 of the third optoelectronic device 300 may have mutually different thermal expansion coefficients. In this case, the second component circuit board 2100 and the third connection circuit board 2200 expand differently in the case of heating in a lateral direction. The differential thermal expansion of the second component circuit board 2100 and the third connection circuit board 2200 can be compensated for by the slot 2150 arranged in the second component circuit board 2100 and / or the slot 2250 arranged in the third connection circuit board 2200. Characterized different levels of thermal expansion of the second component circuit board 2100 and the third connector board 2200 120, 2130, a reli ^¬ transmitting electrical connection between the electrical contact surfaces 110 in the event, 2140 second component circuit board 2100 and the mating contact surfaces 210, 220, 2230, 2240 of the third terminal board 2200 and prevents damage to the second component board 2100 and the third terminal board 2200 prevented. One of the slots 2150, 2250 can also be omitted. Instead of the slots 2150, 2250, the second component circuit board 2100 and the third connection board 2200 of the third optoelectronic device 30 may also have elongated holes that are not opened to the outer edges of the second component board 2100 and the third board 2200 are. Even such slots allow ge ^¬ certain deformation of the circuit boards 2100, 2200th

When heated, the second component board 2100 and the third terminal board 2200 of the third opto-electronic device 30 also extend in a direction perpendicular to the planes of the second component board 2100 and the third board 2200. The first screw 310 and the second screw 320 of the first Befestigungsmit ^¬ 300 of the third optoelectronic device 30 may be formed of a material having a coefficient of thermal expansion, which is adapted to the thermal expansion coefficients of the second component board 2100 and the third terminal board 2200 , for example, between the thermal Ausdehnungskoef ^¬ coefficient of the second component circuit board 2100 and the coefficient of thermal expansion of the third connecting board 2200th As a result, the screws 310, 320 of the first fastening means 300 also experience a change in length in the event of heating, by which the thermal expansion of the printed circuit boards 2100, 2200 of the third optoelectronic device 30 is compensated or taken into account.

10 shows a schematic side view of a fourth optoelectronic device 40. The fourth optoelectronic device 40 has correspondences with the first optoelectronic device 10 of FIGS. 1 to 4. Components of the fourth optoelectronic arrangement which correspond to components present in the first optoelectronic arrangement 10 are provided with the same reference symbols in FIG. 10 as in FIGS. 1 to 4 and will not be described again in detail below. Only the differences between the fourth optoelectrochemical ^¬ African assembly 40 and the first optoelectronic assembly 10 are explained below.

The fourth optoelectronic assembly 40 has a second attachment means 4300 which replaces the first attachment means 300. The second fixing means 4300 is used to secure the first component circuit board 100 and the first on ^¬ circuit board 200 of the fourth optoelectronic assembly 40 together. The second fastening means 4300 has, like the first fastening means 300, a first screw 310 and a second screw 320. In addition, the second fastener 4300 per screw 310, 320 has a first resilient element 4310 and a second one resilient element 4320. The resilient elements 4310, 4320 comprise an electrically compliant material. Preferably, the resilient members 4310, 4320 also comprise a elekt ^¬ driven insulating material. The resilient elements 4310, 4320 are each annular. The first screw 310 and the second screw 320 extend respectively through the associated therewith first resilient member 4310 and the ih ^¬ NEN associated second resilient member 4320. The first Kom ^¬ components wiring board 100 and the first connecting printed circuit board 200 of the fourth optoelectronic assembly 40 are arranged between the two first resilient members 4310 and the two second resilient members 4320 of the second fastening means 4300. The elastically yielding resilient elements 4310, 4320 serve to compensate for a thermal change in length of the first component printed circuit board 100 and the first connection printed circuit board 200 of the fourth opto ^¬ lektronischen arrangement 40. In a simplified variant of the second fastening means 4300, either the first resilient elements 4310 or the second resilient elements 4320 can be dispensed with.

Of course, the second fastening means 4300 could also be used in the second optoelectronic device 20 or the third optoelectronic device 30.

FIG. 11 shows a schematic side view of a fifth optoelectronic device 50. The fifth optoelectronic device 50 has correspondences with the first optoelectronic device 10 of FIGS. 1 to 4. Components of the fifth optoelectronic device 50 which correspond to components present in the first optoelectronic device 10 are given the same reference numerals in FIG. 11 as in FIGS. 1 to 4 and will not be described again in detail below. In the following, only the differences between the fifth optoelectronic device 50 and the first optoelectronic device 10 will be explained. The fifth optoelectronic assembly 50 has a third attachment means 5300 which replaces the first attachment means 300 of the first optoelectronic assembly 10. The third fastening means 5300, like the first fastening means 300, comprises a first screw 310 and a second screw 320, which serve to connect the first component printed circuit board 100 and the first connecting printed circuit board 200 of the fifth optoelectronic device 50. In addition, the third securing means 5300 comprising an electrically conductive element 5310. The conductive element 5310 101 of the first component circuit board 100 and the surface 201 is disposed the ers ^¬ th connector board 200 between the surface and serves to thermal changes in length, in particular thermal Thickness changes, the first component circuit board 100 and the first terminal board 200 of the fifth optoelectronic device 50 compensate. For this purpose, the electrically conductive element 5310 is elastically yielding. The electrically conductive element 5310 has openings through which the first screw 310 and the second screw 320 of the third attachment means 5300 extend.

The electrically conductive element 5310 has two electrically mutually insulated sections. The two sections of the electrically conductive element 5310 may also be physically separated. The first portion of the electrically conductive element 5310 is arranged between the first electrical contact surface 110 of the first component printed circuit board 100 and the first mating contact surface 210 of the first connection printed circuit board 200. The second portion of elekt ^¬ driven conductive member 5310 is disposed between the second electrical contact surface 120 of the first component circuit board 100 and the second opposing contact surface 220 of the first check circuit board 200th In this case, the sections of the electrically conductive element 5310 each have electrically conductive connections between the electrical contact surfaces 110, 120 of the first component printed circuit board 100 and the associated mating contact surfaces 210, 220 of the first connection printed circuit board 200 ago.

It is also possible not to form the electrically conductive element 5310 with two separate sections. In this case, the electrically conductive member 5310 is integrally formed. The electrically conductive element 5310 then has an isotropic electrical conductivity, which ensures that, despite the integrally connected electrically conductive element 5310, electrically conductive connections only in each case between the first electrical contact surface 110 and the first mating contact surface 210 and the second electrical contact surface 120 and the second mating contact surface 220 exist. For this purpose, the electrically conductive element 5310 may have, for example, vertical conductive elements (vias) of metal or other conductive material such as carbon or graphite embedded in a soft plastic material. The third attachment means 5300 of the fifth optoelectronic ^¬ rule assembly 50 may be used 30 also in the second optoelectronic assembly 20 or the third opto-electronic arrangement. FIG. 12 shows a schematic side view of a sixth optoelectronic arrangement 60. The sixth optoelectronic arrangement 60 has correspondences with the first optoelectronic arrangement 10 of FIGS. 1 to 4. Components of the sixth optoelectronic device 60 which correspond to components present in the first optoelectronic device 10 are given the same reference numerals in FIG. 12 as in FIGS. 1 to 4 and will not be described again in detail below. In the following, only the differences between the sixth optoelectronic see arrangement 60 and the first optoelectronic device 10 will be explained. The sixth optoelectronic device 60 has a fourth attachment means 6300 which replaces the first attachment means 300 and is intended to connect the first component circuit board 100 to the first connection board 200 of the sixth optoelectronic device 60. The fourth fastening means 6300 is designed as a clamping connection and comprises a first clamping jaw 6310 and a second clamping jaw 6320. The first component printed circuit board 100 and the first connecting printed circuit board 200 of the sixth optoelectronic device 60 are interposed between the first

Jaw 6310 and the second jaw 6320 of the fourth fastening means 6300 held and pressed against each other by the jaws 6310, 6320. The first component circuit board 100 and the first connection are preferably printed circuit board resiliently aneinanderge- pushes 200 by the jaws 6310, 6320 of the fourth fastening means 6300, so that thermal changes in thickness of the first compo ^¬-component circuit board 100 and the first connector board 200 balanced can be.

The first bore 140 and the second bore 150 of the first component printed circuit board 100 as well as the first bore 240 and the second bore 250 of the first connection printed circuit board 200 may be omitted in the sixth optoelectronic device 60.

The fourth attachment means 6300 of the sixth optoelectrochemical ^¬ African assembly 60 may be used 30 also in the second optoelectronic assembly 20 and in the third opto-electronic purchase order.

Instead of the fourth attachment means 6300, the first component circuit board 100 and the first connection board 200 of the sixth optoelectronic device 60 could also be replaced by another attachment means or another

Attachment method be interconnected. Beispielswei ^¬ se could be the first component circuit board 100 and the first connector board 200 by low-temperature soldering, be bonded together by gluing, by silver sintering, by shrinking a shrink tube, by riveting, by caulking, by crimping, by eutectic bonding, by Ummolden with a plastic or by means of a plug-in socket. A corresponding fastening means or a corresponding fastening method can also be used in the second optoelectronic device 20 and in the third optoelectronic device 30. FIG. 13 shows a schematic plan view of a fourth connection printed circuit board 3200 of a seventh optoelectronic device 70. The seventh optoelectronic device 70 has correspondences with the first optoelectronic device 10. Components of the seventh optoelectronic device 70 which correspond to components present in the first optoelectronic device 10 are given the same reference numerals in FIG. 13 as in FIGS. 1 to 4 and will not be described again in detail below. In the following ^¬ only the differences between the seventh optoelectronic device 70 and the first optoelectronic device 10 are shown.

The fourth connection printed circuit board 3200 of the seventh opto ^¬ lektronischen arrangement 70 replaces the first connection board 200 of the first optoelectronic device 10. In addition to the existing also in the first connection board 200 before ^¬ components is on the surface 201 of the fourth connection board 3200 a further element 3210 ange ^¬ assigns. The further element 3210 is connected to the third electrical connection elements 3233 of the electrical connector 230 of the fourth connector board 3200 and can there be contacted via the electrical connector 230 electrically ^¬ through. The further element 3210 of the fourth connection printed circuit board

3200 may be used as control electronics for driving the optoelectronic semiconductor chip 130 of the first component printed circuit board 100 of the seventh optoelectronic device 70, as a protection circuit for protecting the optoelectronic semiconductor chip 130 of the first component printed circuit board 100 of the seventh optoelectronic device 70, as monitoring circuit for electrical or thermal monitoring of the optoelectronic semiconductor chip 30 of the first component printed circuit board 100 of the seventh optoelectronic device 70, as a monitor circuit for recording a history of Optoelectronic semiconductor chip 130 or as Kodierelement for coding, for example, a color locus, a brightness, a spectral distribution or a temperature response of the optoelectronic semiconductor chip 130 of the first Kompo ^¬ nenten printed circuit board 100 of the seventh optoelectronic Anord ^¬ tion 70 may be formed. If the further element 3210 of the fourth connection printed circuit board 3200 is designed as a monitor circuit, then the further element 3210 can serve for example for recording an operating hours number of the optoelectronic semiconductor chip 130 or for recording a temperature variation. The second connection printed circuit board 1200 of FIG. 5 and the third connection printed circuit board 2200 of FIG. 9, like the fourth connection printed circuit board 3200, can also be equipped with a further element 3210. The invention has been further illustrated and described with reference to the preferred Ausführungsbei ^¬ games. However, the invention is not limited to the disclosed examples. Rather, other variations may be deduced therefrom by those skilled in the art without departing from the scope of the invention. Reference sign list

10 first optoelectronic arrangement

20 second optoelectronic arrangement

30 third optoelectronic arrangement

40 fourth optoelectronic arrangement

50 fifth optoelectronic arrangement

60 sixth optoelectronic arrangement

70 seventh optoelectronic arrangement

100 first component circuit board

101 surface

110 first electrical contact surface

120 second electrical contact surface 130 optoelectronic semiconductor chip

140 first bore

150 second bore

200 first connection board

201 surface

210 first mating contact surface

220 second mating contact surface

230 electrical connector

231 first electrical connection element 232 second electrical connection element

233 connection side

240 first hole

250 second bore 300 first fastener

310 first screw

320 second screw

1200 second connection board

1210 first solder contact surface

1215 first conductor

1220 second solder contact surface

1225 second conductor 2100 second component circuit board

2130 third electrical contact surface

2140 fourth electrical contact surface

2150 slot

2160 further element

2200 third connection printed circuit board

2230 third mating contact surface

2233 third electrical connection element

2234 fourth electrical connection element 2240 fourth counter contact surface

2250 slot

3200 fourth connection board

3210 additional element

3233 third electrical connection element

4300 second fastener

4310 first resilient element

4320 second resilient element

5300 third fastener

5310 electrically conductive element

6300 fourth fastener

6310 first jaw

6320 second jaw

Claims

claims

An optoelectronic device (10, 20, 30, 40, 50, 60, 70) with a first circuit board (100, 2100) and a ^two-¬ th printed circuit board (200, 1200, 2200, 3200),

wherein on the first circuit board (100, 2100) an opto ^¬ lektronischer semiconductor chip (130) is arranged, wherein on a surface (101) of the first circuit board (100, 2100) has a first electrical contact surface (110) and a second electrical contact surface (120 ) are ^{ausgebil ¬} det,

wherein on a surface (201) of the second printed circuit board (200, 1200, 2200, 3200) a first mating contact surface (210) and a second mating contact surface (220) are ^{ausgebil ¬} det,

the first printed circuit board (100, 2100) and the second printed circuit board (200, 1200, 2200, 3200) being intended to be connected together in such a way that

in that the surface (101) of the first printed circuit board (100, 2100) faces the surface (201) of the second printed circuit board (200, 1200, 2200, 3200),

the first mating contact surface (210) with the first contact surface (110) and the second counter-contact surface (220) is electrically conductive, electrically conductive with the second Kon ^¬ clock face (120).

Optoelectronic arrangement (10, 30, 40, 50, 60, 70) according to claim 1,

wherein the second circuit board (200, 2200, 3200) has an electrical connector (230),

wherein an electrical connection element (231) of the electrical connector (230) is electrically conductively connected to the first counter contact surface (210). 3. Optoelectronic arrangement (10, 30, 40, 50, 60, 70) ge ^¬ claim 2,

wherein the electrical connector (230) as a connector, is designed as a cutting terminal, as a screw or soldering post.

An optoelectronic device (20) according to claim 1, wherein the second circuit board (1200) having a first Lötkon ^¬ clock-face (1210) which are electrically conductively connected to the first counter-contact surface (210) is connected, and a second solder pad (1220), which e - Is electrically conductively connected to the second mating contact surface (220).

Optoelectronic arrangement (40, 50, 60) according to one of the preceding claims,

wherein the first circuit board (100) and the second conductor ^¬ plate (200) are provided to be connected by means of a resilient mounting means (4300, 5300, 6300) with ^¬ each other.

An optoelectronic device (10, 20, 30, 40, 50, 70) ge ^¬ Mäss one of the preceding claims,

wherein the first circuit board (100, 2100) and the second circuit board (200, 1200, 2200, 3200) are provided to be connected to each other by means of a screw connection (300, 4300, 5300).

An optoelectronic device (60) according to any one of Ansprü ^¬ che 1 to 5,

wherein the first circuit board (100) and the second conductor ^¬ plate (200) are provided to be connected to each other by means of a clamping ^¬ connection (6300).

An optoelectronic device (10, 20, 30, 40, 60, 70) ge ^¬ Mäss one of the preceding claims,

wherein the first opposing electrical contact surface (210) ge ^¬ gene, the first electrical contact surface (110) is pressed and the second electrical counter-contact surface (220) is pressed against the second electrical contact surface (120) when the second printed circuit board (200, 1200, 2200, 3200) and the first circuit board (100, 2100) are interconnected.

9. Optoelectronic arrangement (50) according to one of Ansprü ^¬ che 1 to 7,

wherein the optoelectronic device (50) comprises an electrically conductive element (5310) which is provided between the first mating contact surface (210) and the first contact surface (110) and / or between the second mating contact surface (220) and the second contact surface ( 120) arranged to be when the second printed circuit board (200) and the first circuit board (100) are connected to each other ^¬ ver.

10.Optoelektronische arrangement (10, 20, 30, 40, 50, 60, 70) according to one of the preceding claims,

wherein the first contact surface (110), the second contact ^¬ surface (120), the first counter-contact surface (210) and / or the second counter-contact surface (220) comprises a ductile material.

11. An optoelectronic device (30) according to one of the preceding claims ^¬,

wherein the first circuit board (2100) has a slot (2150) disposed between the first contact surface (110) and the second contact surface (120)

the second circuit board (2200) are arranged and / or between the first mating contact surface (210) and the second Ge ^¬ genkontaktfläche (220) slot (2250) has ^¬.

12. An optoelectronic device (30) according to one of the preceding claims ^¬,

wherein the first circuit board (2100) having a third electrical ^¬ specific contact surface (2130),

wherein the second printed circuit board (2200) having a third electrical ^¬ specific counter-contact surface (2230),

wherein the first circuit board (2100) and the second circuit board terplatte (2200) are provided to be connected to each other, that the third mating contact surface (2230) is electrically connected to the third contact surface (2130).

13. Optoelectronic arrangement (10, 20, 30, 40, 50, 60, 70) according to one of the preceding claims,

wherein the first circuit board (100, 2100) is formed as a metal core printed circuit board.

14.Optoelektronische arrangement (10, 20, 30, 40, 50, 60, 70) according to one of the preceding claims,

wherein the second circuit board (200, 1200, 2200, 3200) is formed as a FR4 circuit board.

15. An optoelectronic device (30) according to one of the preceding claims ^¬,

wherein on the first circuit board (2100) a further element (2160) is arranged, which as a thermocouple, as an NTC resistor, as an element for measuring brightness, as

Coding element or is designed as a further optoelectronic semiconductor chip.

16. Optoelectronic arrangement (30) according to claims 12 and 15,

wherein the third electrical contact pad (2130) is driven elekt ^¬ conductively connected to the other element (2160). 17.Optoelektronische arrangement (10, 20, 30, 40, 50, 60, 70) according to one of the preceding claims,

wherein the first electrical contact surface (110) and the second electrical contact surface (120) are electrically conductively connected to the optoelectronic semiconductor chip (130).

18. An optoelectronic device (70) according to one of the preceding claims ^¬, wherein on the second printed circuit board (3200), a further element (3210) is arranged, which as control elec- tronics for driving the optoelectronic semiconductor chip (130), as a protection circuit for protecting the optoelectronic semiconductor chip (130), as a monitoring ^¬ circuit for electrical or thermal monitoring of the optoelectronic semiconductor chip (130), as Moni ^¬ gate circuit for recording a history of the optoelectronic semiconductor chip (130) and / or is designed as a coding element.